CN107526224A - 显示装置 - Google Patents
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- Publication number
- CN107526224A CN107526224A CN201710456884.5A CN201710456884A CN107526224A CN 107526224 A CN107526224 A CN 107526224A CN 201710456884 A CN201710456884 A CN 201710456884A CN 107526224 A CN107526224 A CN 107526224A
- Authority
- CN
- China
- Prior art keywords
- light blocking
- protective layer
- blocking regions
- display device
- black matrix
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 230000000903 blocking effect Effects 0.000 claims abstract description 88
- 239000011159 matrix material Substances 0.000 claims abstract description 58
- 239000000758 substrate Substances 0.000 claims abstract description 55
- 239000011241 protective layer Substances 0.000 claims abstract description 53
- 230000005540 biological transmission Effects 0.000 claims abstract description 26
- 239000010409 thin film Substances 0.000 claims abstract description 17
- 239000010410 layer Substances 0.000 claims description 58
- 125000006850 spacer group Chemical group 0.000 claims description 12
- 239000010408 film Substances 0.000 claims description 3
- 239000004744 fabric Substances 0.000 claims 1
- 239000000463 material Substances 0.000 description 33
- 238000000034 method Methods 0.000 description 26
- 230000004888 barrier function Effects 0.000 description 22
- 239000004065 semiconductor Substances 0.000 description 15
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 9
- 238000004519 manufacturing process Methods 0.000 description 8
- 229920002120 photoresistant polymer Polymers 0.000 description 6
- 239000004020 conductor Substances 0.000 description 5
- 238000010276 construction Methods 0.000 description 5
- 239000010949 copper Substances 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 5
- 239000011368 organic material Substances 0.000 description 5
- 238000002834 transmittance Methods 0.000 description 5
- 229910052581 Si3N4 Inorganic materials 0.000 description 4
- 239000004411 aluminium Substances 0.000 description 4
- 229910052782 aluminium Inorganic materials 0.000 description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 4
- 239000010953 base metal Substances 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 4
- 239000004973 liquid crystal related substance Substances 0.000 description 4
- 239000000377 silicon dioxide Substances 0.000 description 4
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 4
- 239000010936 titanium Substances 0.000 description 4
- YVTHLONGBIQYBO-UHFFFAOYSA-N zinc indium(3+) oxygen(2-) Chemical compound [O--].[Zn++].[In+3] YVTHLONGBIQYBO-UHFFFAOYSA-N 0.000 description 4
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 3
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 3
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 3
- 229910045601 alloy Inorganic materials 0.000 description 3
- 239000000956 alloy Substances 0.000 description 3
- 238000005229 chemical vapour deposition Methods 0.000 description 3
- 239000011651 chromium Substances 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 238000005530 etching Methods 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 229910052750 molybdenum Inorganic materials 0.000 description 3
- 239000011733 molybdenum Substances 0.000 description 3
- 239000000049 pigment Substances 0.000 description 3
- 239000004033 plastic Substances 0.000 description 3
- 229920003023 plastic Polymers 0.000 description 3
- 238000004528 spin coating Methods 0.000 description 3
- 238000004544 sputter deposition Methods 0.000 description 3
- 229910052719 titanium Inorganic materials 0.000 description 3
- 238000001771 vacuum deposition Methods 0.000 description 3
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- 239000004840 adhesive resin Substances 0.000 description 2
- 229920006223 adhesive resin Polymers 0.000 description 2
- 229910021417 amorphous silicon Inorganic materials 0.000 description 2
- 229910052804 chromium Inorganic materials 0.000 description 2
- JAONJTDQXUSBGG-UHFFFAOYSA-N dialuminum;dizinc;oxygen(2-) Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Al+3].[Al+3].[Zn+2].[Zn+2] JAONJTDQXUSBGG-UHFFFAOYSA-N 0.000 description 2
- 239000002270 dispersing agent Substances 0.000 description 2
- 229910052733 gallium Inorganic materials 0.000 description 2
- 229910052738 indium Inorganic materials 0.000 description 2
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 2
- MRNHPUHPBOKKQT-UHFFFAOYSA-N indium;tin;hydrate Chemical compound O.[In].[Sn] MRNHPUHPBOKKQT-UHFFFAOYSA-N 0.000 description 2
- 239000011810 insulating material Substances 0.000 description 2
- 238000003475 lamination Methods 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 239000000178 monomer Substances 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- -1 region or plate Substances 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 239000002356 single layer Substances 0.000 description 2
- 229910052715 tantalum Inorganic materials 0.000 description 2
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 2
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 2
- TYHJXGDMRRJCRY-UHFFFAOYSA-N zinc indium(3+) oxygen(2-) tin(4+) Chemical compound [O-2].[Zn+2].[Sn+4].[In+3] TYHJXGDMRRJCRY-UHFFFAOYSA-N 0.000 description 2
- 244000025254 Cannabis sativa Species 0.000 description 1
- 229910004205 SiNX Inorganic materials 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 230000003139 buffering effect Effects 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 239000013039 cover film Substances 0.000 description 1
- 229910021419 crystalline silicon Inorganic materials 0.000 description 1
- 230000003628 erosive effect Effects 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 229910003437 indium oxide Inorganic materials 0.000 description 1
- PJXISJQVUVHSOJ-UHFFFAOYSA-N indium(iii) oxide Chemical compound [O-2].[O-2].[O-2].[In+3].[In+3] PJXISJQVUVHSOJ-UHFFFAOYSA-N 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- NQBRDZOHGALQCB-UHFFFAOYSA-N oxoindium Chemical compound [O].[In] NQBRDZOHGALQCB-UHFFFAOYSA-N 0.000 description 1
- KYKLWYKWCAYAJY-UHFFFAOYSA-N oxotin;zinc Chemical compound [Zn].[Sn]=O KYKLWYKWCAYAJY-UHFFFAOYSA-N 0.000 description 1
- BPUBBGLMJRNUCC-UHFFFAOYSA-N oxygen(2-);tantalum(5+) Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Ta+5].[Ta+5] BPUBBGLMJRNUCC-UHFFFAOYSA-N 0.000 description 1
- RVTZCBVAJQQJTK-UHFFFAOYSA-N oxygen(2-);zirconium(4+) Chemical compound [O-2].[O-2].[Zr+4] RVTZCBVAJQQJTK-UHFFFAOYSA-N 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 229910001936 tantalum oxide Inorganic materials 0.000 description 1
- JBQYATWDVHIOAR-UHFFFAOYSA-N tellanylidenegermanium Chemical compound [Te]=[Ge] JBQYATWDVHIOAR-UHFFFAOYSA-N 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011787 zinc oxide Substances 0.000 description 1
- 229910001928 zirconium oxide Inorganic materials 0.000 description 1
Classifications
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
- G02F1/1362—Active matrix addressed cells
- G02F1/136209—Light shielding layers, e.g. black matrix, incorporated in the active matrix substrate, e.g. structurally associated with the switching element
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
- G02F1/133509—Filters, e.g. light shielding masks
- G02F1/133512—Light shielding layers, e.g. black matrix
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1339—Gaskets; Spacers; Sealing of cells
- G02F1/13394—Gaskets; Spacers; Sealing of cells spacers regularly patterned on the cell subtrate, e.g. walls, pillars
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
- G02F1/1362—Active matrix addressed cells
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
- G02F1/1362—Active matrix addressed cells
- G02F1/136227—Through-hole connection of the pixel electrode to the active element through an insulation layer
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
- G02F1/1362—Active matrix addressed cells
- G02F1/136286—Wiring, e.g. gate line, drain line
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
- G02F1/1362—Active matrix addressed cells
- G02F1/1368—Active matrix addressed cells in which the switching element is a three-electrode device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
- H01L27/124—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition, shape or layout of the wiring layers specially adapted to the circuit arrangement, e.g. scanning lines in LCD pixel circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
- H01L27/1259—Multistep manufacturing methods
- H01L27/1288—Multistep manufacturing methods employing particular masking sequences or specially adapted masks, e.g. half-tone mask
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/786—Thin film transistors, i.e. transistors with a channel being at least partly a thin film
- H01L29/78606—Thin film transistors, i.e. transistors with a channel being at least partly a thin film with supplementary region or layer in the thin film or in the insulated bulk substrate supporting it for controlling or increasing the safety of the device
- H01L29/78633—Thin film transistors, i.e. transistors with a channel being at least partly a thin film with supplementary region or layer in the thin film or in the insulated bulk substrate supporting it for controlling or increasing the safety of the device with a light shield
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/133354—Arrangements for aligning or assembling substrates
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
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Abstract
一种显示装置包括:基底基板,包括沿第一方向延伸的第一光阻挡区域、沿与第一方向交叉的第二方向延伸的第二光阻挡区域以及由第一光阻挡区域和第二光阻挡区域限定的透光区域;栅极线,位于第一光阻挡区域处的基底基板上;数据线,位于第二光阻挡区域处的基底基板上;薄膜晶体管,连接至栅极线和数据线;位于薄膜晶体管上的保护层;黑矩阵,位于第一光阻挡区域和第二光阻挡区域中的至少一个处的保护层上;以及像素电极,通过形成在保护层和黑矩阵中的接触孔连接至薄膜晶体管。
Description
相关申请的交叉引用
本申请要求2016年6月16日在韩国知识产权局(KIPO)提交的韩国专利申请第10-2016-0075121号的优先权,其公开内容通过引用整体合并于此。
技术领域
本发明构思的示例性实施例涉及一种显示装置和制造该显示装置的方法,更具体地,涉及一种可以简化制造工艺的显示装置和制造该显示装置的方法。
背景技术
显示装置可以基于其发光模式而分类为液晶显示(LCD)装置、有机发光二极管(OLED)显示装置、等离子体显示面板(PDP)装置、电泳显示装置等。
LCD装置包括其上形成有电极的显示基板、对基板以及布置在显示基板与对基板之间的液晶层。近年来,采用了阵列上滤色器(COA)结构,其中滤色器被布置在显示基板上以提高透射率。
此外,为了基本上防止在将其上布置有滤色器的显示基板与其上布置有光阻挡构件的对基板耦接的过程中的未对准,采用了阵列上黑矩阵(BOA)结构,其中滤色器和光阻挡构件被布置在显示基板上。
将理解的是,此背景技术部分意在提供用于理解技术的有用背景,并且如本文所公开的那样,技术背景部分可以包括不构成在本文所公开的主题的对应有效申请日之前相关领域的技术人员已经知晓或理解的部分的想法、构思或认识。
发明内容
本发明构思的示例性实施例可以涉及可以简化制造工艺的一种显示装置及其制造方法。
根据示例性实施例,一种显示装置包括:基底基板,包括沿第一方向延伸的第一光阻挡区域、沿与第一方向交叉的第二方向延伸的第二光阻挡区域以及由第一光阻挡区域和第二光阻挡区域限定的透光区域;栅极线,被布置在基底基板上、第一光阻挡区域处;数据线,被布置在基底基板上、第二光阻挡区域处;薄膜晶体管,连接至栅极线和数据线;保护层,被布置在薄膜晶体管上;黑矩阵,被布置在保护层上、第一光阻挡区域和第二光阻挡区域中的至少一个处;以及像素电极,被布置在黑矩阵上并且通过形成在保护层和黑矩阵中的接触孔连接至薄膜晶体管。
该显示装置可以进一步包括被布置在基底基板上、薄膜晶体管和像素电极的接触区域下方的光阻挡图案。
光阻挡图案可以与黑矩阵的至少一部分重叠。
光阻挡图案在平面图中可以与接触孔完全地重叠。
光阻挡图案可以与布置有栅极线的层布置在基本同一层中。
光阻挡图案可以具有岛形状。
光阻挡图案可以具有圆形或多边形形状。
保护层可以包括位于透光区域处的第一保护层以及位于第一光阻挡区域和第二光阻挡区域处的第二保护层。
第一保护层可以具有比第二保护层的高度小的高度。第一保护层和第二保护层在分界处可以具有台阶差。台阶差可以从约至约
显示装置可以进一步包括从黑矩阵突出的柱状间隔件。
根据另一示例性实施例,一种制造显示装置的方法包括:准备基底基板,基底基板包括沿第一方向延伸的第一光阻挡区域、沿与第一方向交叉的第二方向延伸的第二光阻挡区域以及由第一光阻挡区域和第二光阻挡区域限定的透光区域;在基底基板上、第一光阻挡区域处形成栅极线;在基底基板上、第二光阻挡区域处形成数据线;形成连接至栅极线和数据线的薄膜晶体管;在薄膜晶体管上形成保护层和黑矩阵;以及形成像素电极,像素电极通过形成在保护层和黑矩阵中的接触孔连接至薄膜晶体管。
形成保护层和黑矩阵可以包括:顺序地形成保护层形成材料和黑矩阵形成材料;布置包括透光部分、半透光部分和光阻挡部分的掩模;使用掩模曝光黑矩阵形成材料;以及显影黑矩阵形成材料。
该方法可以进一步包括在数据线上形成绝缘层,以及使用已显影的黑矩阵形成材料作为刻蚀掩模而刻蚀绝缘层,以暴露薄膜晶体管的漏电极。
该方法可以进一步包括部分地移除第一光阻挡区域和第二光阻挡区域上的已显影黑矩阵形成材料,以及完全地移除透光区域上的已显影黑矩阵形成材料。
该方法可以进一步包括部分地移除透光区域上的保护层。
保护层可以包括位于透光区域处的第一保护层以及位于第一光阻挡区域和第二光阻挡区域处的第二保护层,并且第一保护层可以具有比第二保护层的高度小的高度。
该方法可以进一步包括在基底基板上、薄膜晶体管和像素电极的接触区域下方形成光阻挡图案。
光阻挡图案可以在与形成栅极线的工艺基本相同的工艺中形成。
光阻挡图案在平面图中可以完全地覆盖薄膜晶体管的已暴露漏电极。
上述仅仅是例示性的,而不旨在以任何方式进行限制。除了上面描述的例示性的方面、示例性实施例和特征之外,通过参考各图和下面的详细描述,进一步的方面、示例性实施例和特征将变得显而易见。
附图说明
通过参考附图详细描述本发明构思的示例性实施例,将使得本发明构思的更完整理解变得更明显,其中:
图1是示出了根据示例性实施例的显示装置的示意性平面图;
图2是沿图1的线I-I’截取的剖视图;
图3A是示出了图1所示的像素的栅极布线的平面图;
图3B是示出了图1所示的像素的数据布线的平面图;
图3C是示出了图1所示的像素的像素电极的平面图;以及
图4A、图4B、图4C、图4D、图4E以及图4F是示出了根据示例性实施例的制造显示装置的方法的剖视图。
具体实施方式
现在将参照附图更充分地描述示例性实施例。尽管本发明构思可以以各种方式修改并且具有若干示例性实施例,在附图中示出并且在说明书中主要地描述了示例性实施例。然而,本发明构思的范围不限于示例性实施例并且应被解释为包括在本发明构思的精神和范围中所包括的所有改变、等价形式和替代物。
在图中,为了清楚和易于理解,以放大的方式图示了多个层和区域的厚度。当层、区域或板被称为在另一层、区域或板“上”时,其可直接在另一层、区域或板上,或者中间层、区域或板可存在于它们之间。相反地,当层、区域或板被称为“直接在”另一层、区域或板“上”时,它们之间可不存在中间层、区域或板。进一步,当层、区域或板被称为在另一层、区域或板“下”时,其可直接在另一层、区域或板下,或者中间层、区域或板可存在于它们之间。相反地,当层、区域或板被称为“直接在”另一层、区域或板“下”时,它们之间可不存在中间层、区域或板。
为了易于描述,在本文中可使用空间相对术语“在……下面”、“在……下方”、“下方的”、“在……上面”、“上方的”等来描述如图中所示的在一个元件或组件和另一元件或组件之间的关系。将理解的是,除了图中描绘的方位之外,空间相对术语意在包含设备在使用或操作中的不同方位。例如,在图中所示的设备被翻转的情况下,放置在另一设备“下面”或“下方”的设备可被放置在另一设备“上面”。因此,例示性术语“在……下面”可包括下方的位置和上方的位置两者。设备还可被定位在其他方向,并且因此空间相对术语根据方位可被不同地解释。
在整个说明书中,当一元件被提及为“连接”到另一元件时,该元件“直接连接”到另一元件,或者“电连接”到另一元件,在其间插入有一个或多个中间元件。将进一步理解,术语“包括”和/或“包含”及其变体在本说明书中使用时指明存在所列举的特征、整体、步骤、操作、元件和/或组件,但不排除一个或多个其它特征、整体、步骤、操作、元件、组件和/或其组合的存在或增加。
将理解,虽然本文中可以使用术语“第一”、“第二”、“第三”等来描述各种元件,但这些元件不应受这些术语限制。这些术语仅用于将一个元件与另一元件区分。因此,在不脱离本文教导的情况下,下面讨论的“第一元件”可称为“第二元件”或“第三元件”,并且“第二元件”和“第三元件”可被同样地称呼。
考虑到讨论中的测量以及与特定量的测量关联的误差(即测量系统的限制),本文中使用的“大约”或“近似”包括所列举的值,并且意味着在由本领域普通技术人员所确定的特定值的可接受偏差范围内。例如,“大约”可以意味着在一个或多个标准偏差内,或者在所列举的值的±30%、20%、10%、5%内。
除非另外限定,否则本文中使用的所有术语(包括技术术语和科学术语)具有与本发明构思所属领域的技术人员所通常理解的含义相同的含义。将进一步理解,诸如在常用字典中限定的术语之类的术语应该被解释为具有与它们在相关领域的上下文中的含义一致的含义,并且将不以理想的或过于正式的意义来解释,除非在本说明书中清楚地限定。
与描述不关联的一些部分可不被提供,以便具体描述本发明构思的示例性实施例,并且在整个说明书中,相同的附图标记指代相同的元件。
下文中,根据一个或多个示例性实施例的显示装置是以它们是液晶显示(LCD)装置为前提来描述的。然而,本发明构思的范围不限于LCD装置,本发明构思可以应用于例如有机发光二极管(OLED)显示装置。
图1是示出了根据示例性实施例的显示装置的示意性平面图,并且图2是沿图1的线I-I’截取的剖视图。
参照图1和图2,根据示例性实施例的显示装置10包括多个像素PX。下文中,为了便于描述说明,主要描述了一个像素PX。
像素PX的平面区域包括沿第一方向D1延伸的第一光阻挡区域BA1、沿与第一方向D1交叉的第二方向D2延伸的第二光阻挡区域BA2以及由第一光阻挡区域BA1和第二光阻挡区域BA2限定的透光区域TA。
第一光阻挡区域BA1和第二光阻挡区域BA2是阻挡从光源提供的光的区域,并且透光区域TA是选择性地透射从光源提供的光的区域。
栅极线GL可以布置在第一光阻挡区域BA1处,并且薄膜晶体管T、数据线DL等可以布置在第二光阻挡区域BA2处。然而,示例性实施例并不限于此,栅极线GL、数据线DL、薄膜晶体管T等可以以合适的方式布置在第一光阻挡区域BA1和第二光阻挡区域BA2处。
薄膜晶体管T包括从栅极线GL分支出的栅电极GE、被布置为与栅电极GE重叠的半导体层SM、从数据线DL分支出并且与半导体层SM的一端重叠的源电极SE以及与源电极SE间隔开并且与半导体层SM的另一端重叠的漏电极DE。
漏电极DE连接至像素电极PE。例如,漏电极DE朝向像素电极PE延伸并且通过接触孔CTH电连接至从像素电极PE分支出的连接电极CNE。
光阻挡图案BE可以提供在漏电极DE与连接电极CNE的接触区域下方。光阻挡图案BE在平面图中可以与接触孔CTH完全地重叠。光阻挡图案BE在平面图中可以具有圆形或多边形形状。光阻挡图案BE可以具有岛形状或者从存储布线(未示出)延伸的形状。光阻挡图案BE可以与其上布置有栅极线GL的层布置在基本相同的层上,并且可以通过与形成栅极线GL的工艺基本相同的工艺形成。
此外,光阻挡图案BE可以被布置为使得光阻挡图案BE的至少一部分与下面将描述的黑矩阵BM重叠。亦即,光阻挡图案BE可以基本上防止在黑矩阵BM被移除的区域中发生光泄漏。
像素电极PE包括十字形主干部分、从主干部分延伸的多个分支部分以及从十字形主干部分延伸的连接电极CNE。然而,示例性实施例不限于此,像素电极PE可以具有各种形状。
根据示例性实施例的像素电极PE被示为在第一方向D1上的长度比在第二方向D2上的长度长,但是示例性实施例不限于此。像素电极PE在第二方向D2上的长度可以比在第一方向D1上的长度长。
根据示例性实施例的LCD装置10包括显示基板100、对基板200以及布置在显示基板100与对基板200之间的液晶层300。
显示基板100可以包括基底基板110、栅极布线、第一绝缘层120、半导体层SM、数据布线、第二绝缘层、滤色器CF、保护层140、黑矩阵BM等。
基底基板110可以是具有透光特性和柔性特性的绝缘基板,例如塑料基板。然而,示例性实施例不限于此,基底基板110可以包括诸如玻璃基板的硬基板。
诸如栅极线GL、从栅极线GL分支出的栅电极GE以及光阻挡图案BE的栅极布线布置在基底基板110上。
栅极布线可以包括或者由铝(Al)或其合金、银(Ag)或其合金、铜(Cu)或其合金、钼(Mo)或其合金、铬(Cr)、钽(Ta)或钛(Ti)形成。
此外,栅极布线可以具有多层结构,该多层结构包括两个或更多个具有不同物理属性的导电层(未示出)。例如,多层结构的导电层可以包括或者由具有低电阻率以减小信号延迟或电压降的、例如铝(Al)基金属、银(Ag)基金属或铜(Cu)基金属的金属形成,并且多层结构的另一导电层可以包括被发现赋予与氧化铟锡(ITO)和氧化铟锌(IZO)具有优良接触属性的材料,例如钼基金属、铬、钛或钽。
多层结构的示例可以包括下方铬层和上方铝层、下方铝层和上方钼层以及下方钛层和上方铜层。然而,示例性实施例不限于此,栅极布线可以包括各种类型的金属和导体。栅极布线可以在基本相同的工艺中同时地形成。
第一绝缘层120布置在其上布置有栅极布线的基底基板110上。第一绝缘层120可以称作栅极绝缘层。第一绝缘层120可以包括氧化硅(SiOx)或氮化硅(SiNx)。此外,第一绝缘层120可以进一步包括氧化铝、氧化钛、氧化钽或氧化锆。
半导体层SM布置在第一绝缘层120上。半导体层SM可以包括非晶硅,或者可以包括包含镓(Ga)、铟(In)、锡(Sn)和锌(Zn)中的至少一种的氧化物半导体。例如,氧化物半导体可以包括选自由氧化锌(ZnO)、氧化锌锡(ZTO)、氧化锌铟(ZIO)、氧化铟(InO)、氧化钛(TiO)、氧化铟镓锌(IGZO)和氧化铟锌锡(IZTO)构成的组中的至少一种。尽管未示出,不过欧姆接触层可以布置在半导体层SM上。
根据示例性实施例,半导体层SM被示为与栅电极GE基本上重叠,但是示例性实施例不限于此。可以布置半导体层SM,以便与下面将描述的数据布线基本上重叠。
诸如数据线DL、源电极SE和漏电极DE的数据布线布置在其上布置有半导体层SM的基底基板110上。数据布线可以包括与前述栅极布线中所包括的材料基本相同的材料。数据布线可以在基本相同的工艺中同时地形成。
第二绝缘层130布置在其上布置有数据布线的基底基板110上。第二绝缘层130也称作绝缘夹层。第二绝缘层130可以具有包括例如氧化硅、氮化硅、光敏有机材料或者诸如a-Si:C:O或a-Si:O:F的低介电常数绝缘材料的单层结构或多层结构。
滤色器CF可以布置在第二绝缘层130上。滤色器CF可以具有红色、绿色、蓝色、青色、品红色、黄色和白色的颜色。红色、绿色和蓝色或青色、品红色和黄色的三原色可以限定用于表现颜色的基本像素组。
保护层140可以布置在其上布置有滤色器CF的基底基板110上。保护层140可以具有包括例如氧化硅、氮化硅、光敏有机材料或者硅基低介电常数绝缘材料的单层结构或多层结构。保护层140可以具有范围从约1.0μm至约2.5μm的厚度。
根据示例性实施例的保护层140包括位于透光区域TA处的第一保护层141以及位于第一光阻挡区域BA1和第二光阻挡区域BA2处的第二保护层142。第一保护层141可以具有比第二保护层142高度小的高度。例如,第一保护层141和第二保护层142在分界处可以具有台阶差h。台阶差h可以从约至约然而,示例性实施例不限于此,第一保护层141和第二保护层142可以具有基本相同的高度。
黑矩阵BM可以布置在第一光阻挡区域BA1和第二光阻挡区域BA2处的保护层140上。根据示例性实施例的黑矩阵BM是以黑矩阵BM布置在第一光阻挡区域BA1和第二光阻挡区域BA2两者处为前提来描述的,但示例性实施例不限于此。在示例性实施例中,黑矩阵BM可以仅布置在第一光阻挡区域BA1和第二光阻挡区域BA2中的一个处。例如,黑矩阵BM可以仅布置在第二光阻挡区域BA2处,而第一光阻挡区域BA1可以通过另一部件来屏蔽从光源提供的光。
黑矩阵BM可以与下面将描述的像素电极PE的边缘部分地重叠或者不重叠。黑矩阵BM基本上防止了从光源提供的光向外引导,并且防止外部的光照射至栅极线GL、数据线DL或者薄膜晶体管T。
黑矩阵BM可以包括或者由光敏组合物形成。光敏组合物的示例可以包括:粘合剂树脂、可聚合单体、可聚合低聚物、颜料、分散剂以及光引发剂。颜料可以使用黑色颜料、黑树脂等。
黑矩阵BM可以具有范围从约0.5μm至约2μm的厚度。例如,黑矩阵BM可以具有范围从约0.5μm至约1.5μm的厚度。
根据示例性实施例的显示装置10可以进一步包括从黑矩阵BM突出的柱状间隔件CS。柱状间隔件CS可以根据从黑矩阵BM突出的高度而划分为主柱状间隔件和子柱状间隔件。主柱状间隔件基本上支撑显示基板100和对基板200以确保例如盒厚的空间。当在外部向主柱状间隔件施加压力时,子柱状间隔件分散压力以提供缓冲效果。
像素电极PE可以布置在其上形成有黑矩阵BM的基底基板110上。像素电极PE可以布置在透光区域TA处,并且从像素电极PE分支出的连接电极CNE可以布置在第二光阻挡区域BA2处。
连接电极CNE可以通过接触孔CTH连接至漏电极DE,接触孔CTH通过黑矩阵BM、保护层140和第二绝缘层130而限定。
像素电极PE和连接电极CNE可以包括透明导电材料。例如,像素电极PE和连接电极CNE可以包括诸如氧化铟锡(ITO)、氧化铟锌(IZO)、氧化铟锡锌(ITZO)或氧化铝锌(AZO)的透明导电材料。
下方取向层(未示出)可以布置在像素电极PE和黑矩阵BM上。下方取向层可以是垂直取向层或包括光聚合性材料的光控取向层。
对基板200可以包括对基底基板210、公共电极CE等。
对基底基板210可以是具有透光特性和柔性特性的绝缘基板,例如塑料基板。然而,示例性实施例不限于此,对基底基板210可以包括诸如玻璃基板的硬基板。
公共电极CE可以是被形成为覆盖对基底基板210的整个表面并且包括诸如氧化铟锡(ITO)或氧化铟锌(IZO)的透明导体的平板电极。在可替代示例性实施例中,公共电极CE可以具有凹-凸部分以及用于限定多个域的至少一个狭缝。
上方取向层(未示出)可以布置在公共电极CE上。上方取向层(未示出)可以是垂直取向层或包括光聚合性材料的光控取向层。
图3A是示出了图1所示的像素的栅极布线的平面图,图3B是示出了图1所示的像素的数据布线的平面图,以及图3C是示出了图1所示的像素的像素电极的平面图。图4A、图4B、图4C、图4D、图4E以及图4F是示出了根据示例性实施例的制造显示装置的方法的剖视图。
参照图3A和图4A,包括栅极线GL、栅电极GE和光阻挡图案BE的栅极布线形成在包括透明玻璃或塑料的基底基板110上。栅极布线可以形成在基本相同的层中并且可以在基本相同的工艺中形成。
第一绝缘层120形成在其上形成有栅极布线的基底基板110上。第一绝缘层120可以通过化学气相沉积工艺、旋涂工艺、溅射工艺、真空沉积工艺、印刷工艺等而形成。
与栅电极GE的至少一部分重叠的半导体层SM形成在其上形成有第一绝缘层120的基底基板110上。
参照图3B和图4B,包括数据线DL、源电极SE和漏电极DE的数据布线形成在其上形成有半导体层SM的基底基板110上。源电极SE可以被形成为与半导体层SM的一端重叠,并且漏电极DE可以与源电极SE间隔开并且与半导体层SM的另一端重叠。
第二绝缘层130形成在其上形成有数据布线的基底基板110上。第二绝缘层130可以通过化学气相沉积工艺、旋涂工艺、溅射工艺、真空沉积工艺、印刷工艺等而形成。接着,可以在第二绝缘层130上形成滤色器CF。
参照图4C,保护层形成材料140a和黑矩阵形成材料150a顺序地形成在其上形成有滤色器CF的基底基板110上。
保护层形成材料140a和黑矩阵形成材料150a可以通过化学气相沉积工艺、旋涂工艺、溅射工艺、真空沉积工艺、印刷工艺等而形成。
保护层形成材料140a可以包括氧化硅、氮化硅、光敏有机材料、硅基低介电常数绝缘材料等。假设根据示例性实施例的保护层形成材料140a是正型光敏有机材料,其中已曝光部分被显影而未曝光部分保留。
黑矩阵形成材料150a可以包括诸如粘合剂树脂、可聚合单体、可聚合低聚物、颜料、分散剂、光引发剂等的光敏组合物。假设根据示例性实施例的黑矩阵形成材料150a是正型光敏有机材料,其中已曝光部分被显影而未曝光部分保留。
随后,掩模500与基底基板110间隔开地布置在基底基板110上。掩模500是4色调掩模,4色调掩模包括例如各自具有不同透光率的透光部分510、第一半透光部分520、第二半透光部分530以及光阻挡部分540。在可替代示例性实施例中,掩模500可以包括狭缝部分来替代半透光部分520和530。
透光部分510可以具有约95%或更大的透光率,并且光阻挡部分540可以具有约5%或更小的透光率。半透光部分520和530可以具有范围从约15%至约30%的透光率,并且第一半透光部分520可以具有比第二半透光部分530高的透光率。
透光部分510在平面图中可以位于光阻挡图案BE上方,第一半透光部分520在平面图中可以位于透光区域TA上方,第二半透光部分530在平面图中可以位于第一光阻挡区域BA1和第二光阻挡区域BA2上方,以及光阻挡部分540在平面图中可以位于柱状间隔件形成区域上方。在可替代示例性实施例中,当形成不同高度的两个柱状间隔件(例如主柱状间隔件和子柱状间隔件)时,可以使用5色调掩模。
随后,使用布置在基底基板110上方的掩模500照射光L,并且执行显影和固化工艺。
参照图4D,位于透光部分510下面的黑矩阵形成材料150a和保护层形成材料140a均被完全地显影,以暴露第二绝缘层130。位于第一半透光部分520、第二半透光部分530以及光阻挡部分540下面的黑矩阵形成材料150a保留,但是分别具有不同的厚度。位于第一半透光部分520下面的黑矩阵形成材料150a的厚度最小,而位于光阻挡部分540下面的黑矩阵形成材料150a的厚度最大。
参照图4E,可以使用剩余的黑矩阵形成材料150a作为刻蚀阻止层而共同地刻蚀基底基板110的整个表面。因此,移除了已暴露的第二绝缘层130,并且限定了暴露漏电极DE的一部分的接触孔CTH。进一步,部分地移除剩余的黑矩阵形成材料150a,以形成黑矩阵BM、柱状间隔件CS等。黑矩阵BM可以形成为范围从约0.5μm至约2μm的厚度,并且柱状间隔件CS可以形成为范围从约1.5μm至约4μm的高度。
在这样的示例性实施例中,因为透光区域TA中剩余的黑矩阵形成材料150a的厚度薄,因此透光区域TA的保护层形成材料140a可以与黑矩阵形成材料150a一起被部分地刻蚀。
因此,透光区域TA的第一保护层141可以具有比另一区域(例如第二光阻挡区域BA2)的第二保护层142的高度小的高度。在该工艺中,可以完全地移除透光区域TA上的黑矩阵形成材料150a。
参照图3C和图4F,像素电极PE形成在其上形成有黑矩阵BM的基底基板110上。像素电极PE形成在透光区域TA处,并且从像素电极PE分支出的连接电极CNE通过接触孔CTH而连接至漏电极DE。
如在上文中阐述的,在根据一个或多个示例性实施例的显示装置中,通过在形成黑矩阵之后形成像素电极,移除像素电极上剩余的黑矩阵的工艺可以不是必须的。
根据一个或多个示例性实施例,可以通过在单个工艺中形成保护层和黑矩阵而简化制造工艺。
尽管已经参照本发明构思的示例性实施例示出并描述了本发明构思,但对于本领域普通技术人员将明显的是,在不脱离本发明构思的精神和范围的情况下,可以对本发明构思做出各种形式和细节上的改变。
Claims (10)
1.一种显示装置,包括:
基底基板,包括沿第一方向延伸的第一光阻挡区域、沿与所述第一方向交叉的第二方向延伸的第二光阻挡区域以及由所述第一光阻挡区域和所述第二光阻挡区域限定的透光区域;
栅极线,被布置在所述基底基板上、所述第一光阻挡区域处;
数据线,被布置在所述基底基板上、所述第二光阻挡区域处;
薄膜晶体管,连接至所述栅极线和所述数据线;
保护层,被布置在所述薄膜晶体管上;
黑矩阵,被布置所述保护层上、所述第一光阻挡区域和所述第二光阻挡区域中的至少一个处;以及
像素电极,被布置在所述黑矩阵上并且通过在所述保护层和所述黑矩阵中限定的接触孔连接至所述薄膜晶体管。
2.根据权利要求1所述的显示装置,进一步包括被布置在所述基底基板上、所述薄膜晶体管与所述像素电极的接触区域下方的光阻挡图案。
3.根据权利要求2所述的显示装置,其中所述光阻挡图案与所述黑矩阵的至少一部分重叠。
4.根据权利要求3所述的显示装置,其中所述光阻挡图案在平面图中与所述接触孔完全地重叠。
5.根据权利要求2所述的显示装置,其中所述光阻挡图案与布置有所述栅极线的层布置在同一层中。
6.根据权利要求2所述的显示装置,其中所述光阻挡图案具有岛形状。
7.根据权利要求2所述的显示装置,其中所述光阻挡图案具有圆形或多边形形状。
8.根据权利要求1所述的显示装置,其中所述保护层包括位于所述透光区域处的第一保护层以及位于所述第一光阻挡区域和所述第二光阻挡区域处的第二保护层,并且
其中所述第一保护层具有比所述第二保护层的高度小的高度。
9.根据权利要求8所述的显示装置,其中所述第一保护层和所述第二保护层在分界处具有台阶差,所述台阶差从至
10.根据权利要求1所述的显示装置,进一步包括从所述黑矩阵突出的柱状间隔件。
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US20170363923A1 (en) | 2017-12-21 |
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