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CN105652543A - 阵列基板及其制作方法、显示器件 - Google Patents

阵列基板及其制作方法、显示器件 Download PDF

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Publication number
CN105652543A
CN105652543A CN201610197197.1A CN201610197197A CN105652543A CN 105652543 A CN105652543 A CN 105652543A CN 201610197197 A CN201610197197 A CN 201610197197A CN 105652543 A CN105652543 A CN 105652543A
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pixel
array base
base palte
pixel electrode
electrode
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汪锐
邱海军
尚飞
金在光
李少茹
许卓
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BOE Technology Group Co Ltd
Chongqing BOE Optoelectronics Technology Co Ltd
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BOE Technology Group Co Ltd
Chongqing BOE Optoelectronics Technology Co Ltd
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Priority to CN201610197197.1A priority Critical patent/CN105652543A/zh
Publication of CN105652543A publication Critical patent/CN105652543A/zh
Priority to PCT/CN2016/104910 priority patent/WO2017166817A1/en
Priority to US15/529,495 priority patent/US10424604B2/en
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    • HELECTRICITY
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    • H01L27/02Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/12Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
    • H01L27/1214Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
    • H01L27/124Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition, shape or layout of the wiring layers specially adapted to the circuit arrangement, e.g. scanning lines in LCD pixel circuits
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    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/136Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
    • G02F1/1362Active matrix addressed cells
    • G02F1/136213Storage capacitors associated with the pixel electrode
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    • G02F1/133Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/136Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
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    • H01L27/12Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
    • H01L27/1214Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
    • H01L27/124Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition, shape or layout of the wiring layers specially adapted to the circuit arrangement, e.g. scanning lines in LCD pixel circuits
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
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    • H01L27/12Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
    • H01L27/1214Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
    • H01L27/1259Multistep manufacturing methods
    • H01L27/1262Multistep manufacturing methods with a particular formation, treatment or coating of the substrate
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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    • H01L27/02Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/12Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
    • H01L27/1214Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
    • H01L27/1259Multistep manufacturing methods
    • H01L27/127Multistep manufacturing methods with a particular formation, treatment or patterning of the active layer specially adapted to the circuit arrangement
    • GPHYSICS
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    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
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    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/136Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
    • G02F1/1362Active matrix addressed cells
    • G02F1/136286Wiring, e.g. gate line, drain line
    • G02F1/136295Materials; Compositions; Manufacture processes
    • GPHYSICS
    • G02OPTICS
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    • G02F2201/00Constructional arrangements not provided for in groups G02F1/00 - G02F7/00
    • G02F2201/12Constructional arrangements not provided for in groups G02F1/00 - G02F7/00 electrode
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Abstract

本发明涉及显示技术领域,公开了一种阵列基板及其制作方法、显示器件。所述阵列基板的数据线在基底上的投影与像素电极在基底上的投影存在交叠区域,能够有效防止像素区域漏光,提高显示器件的显示品质。相对于现有技术,还能够增加像素的开口率。

Description

阵列基板及其制作方法、显示器件
技术领域
本发明涉及显示技术领域,特别是涉及一种阵列基板及其制作方法、显示器件。
背景技术
在薄膜晶体管液晶显示器件中,双栅显示技术因其具有低功耗、低成本,而得到广泛应用。
如图1所示,双栅显示技术具体为:在阵列基板上,相邻两行像素区域之间具有两条栅线20,相邻两条数据线10之间具有两列像素区域。同一行像素区域,奇数像素的薄膜晶体管30的栅电极与同一栅线20连接,偶数像素的薄膜晶体管30的栅电极与另一栅线20连接,相邻两列像素区域的薄膜晶体管30的源电极与同一数据线10连接。相对于单栅显示技术(如图2所示),双栅显示技术栅线的数量加倍,数据线的数量减半。传统的显示面板容易有漏光现象,影响显示品质。
发明内容
本发明提供一种阵列基板及其制作方法、显示器件,用以解决显示器件受到撞击时,像素区域的周边容易出现漏光的问题。
为解决上述技术问题,本发明实施例中提供一种阵列基板,包括设置在一基底上的栅线和数据线,所述栅线和数据线限定出多个像素区域,所述阵列基板还包括位于所述像素区域的像素电极,每一像素区域中,所述数据线在所述基底上的投影与所述像素电极在所述基底上的投影存在交叠区域。
本发明实施例中还提供一种显示器件,包括如上所述的阵列基板。
本发明实施例中还提供一种如上所述的阵列基板的制作方法,包括:
在一基底上形成栅线和数据线,限定多个像素区域;
在所述像素区域形成像素电极,每一像素区域中,所述数据线在所述基底上的投影与所述像素电极在所述基底上的投影存在交叠区域。
本发明的上述技术方案的有益效果如下:
上述技术方案中,设置数据线在基底上的投影与像素电极在基底上的投影存在交叠区域,能够有效防止像素区域与数据线对应的周边漏光,提高显示器件的显示品质。相对于现有技术,还能够增加像素的开口率。
附图说明
为了更清楚地说明本发明实施例或现有技术中的技术方案,下面将对实施例或现有技术描述中所需要使用的附图作简单地介绍,显而易见地,下面描述中的附图仅仅是本发明的一些实施例,对于本领域普通技术人员来讲,在不付出创造性劳动性的前提下,还可以根据这些附图获得其他的附图。
图1表示双栅结构的阵列基板的结构示意图;
图2表示单栅结构的阵列基板的结构示意图;
图3表示本发明实施例中单栅结构的阵列基板的局部结构示意图;
图4表示图3沿A-A的剖视图;
图5表示图3沿B-B的剖视图。
图6表示本发明实施例中双栅结构的阵列基板的局部结构示意图;
图7表示图6沿A-A的剖视图;
图8表示图6沿B-B的剖视图。
具体实施方式
下面将结合附图和实施例,对本发明的具体实施方式作进一步详细描述。以下实施例用于说明本发明,但不用来限制本发明的范围。
实施例一
结合图2、图3-图5所示,本实施例中的阵列基板为单栅结构,包括设置在一基底101上的栅线20和数据线10,栅线20和数据线10限定出多个像素区域。所述阵列基板还包括位于所述像素区域的像素电极1。每一像素区域中,数据线10在基底101上的投影与像素电极1在基底101上的投影存在交叠区域,能够有效防止像素区域周边漏光。同时,还克服了现有技术中阵列基板与彩膜基板存在对位偏差,需要增加彩膜基板上黑矩阵的面积的问题,能够增加像素的开口率。
本发明的工作原理为:在像素区域的周边,像素电极1与数据线10之间具有一定间隙,为了防止漏光,会增加彩膜基板上的黑矩阵面积。但是当显示器件受到撞击时,彩膜基板与阵列基板之间会发生错位,导致像素电极1与数据线10之间的间隙不与黑矩阵对应,发生漏光。本发明的技术方案通过增加数据线10的宽度,使其与像素电极1在基底101上的投影交叠,从而即使彩膜基板与阵列基板之间发生错位,也不会出现像素区域与数据线10对应的周边漏光的问题。
当显示器件采用上述的阵列基板时,能够提高产品的显示品质。
本实施例中,数据线10在基底101上的投影与像素电极1在基底101上的投影形成交叠区域,其宽度d为2~3.5um,如图5所示。
薄膜晶体管因其功耗低、体积小、工艺成熟等特点,被广泛应用于显示器件中。当所述阵列基板为薄膜晶体管阵列基板时,所述阵列基板还包括位于所述像素区域的薄膜晶体管,所述薄膜晶体管作为开关器件,用于控制显示过程。
为了便于描述,设定栅线20沿行方向延伸,数据线10沿列方向延伸。
所述单栅结构的薄膜晶体管阵列基板上,相邻两行像素区域之间具有一条栅线20,相邻两数据线10之间具有一列像素区域。每一行像素区域的薄膜晶体管30的栅电极3与同一栅线20电性连接,每一列像素区域的薄膜晶体管30的源电极4与同一数据线10电性连接。薄膜晶体管30的漏电极5与像素电极1电性连接。具体的,栅电极3与栅线20由同一栅金属层制得,并与对应的栅线20为一体结构。源电极4与数据线10由同一源漏金属层制得,并与对应的数据线10为一体结构。漏电极5与像素电极1通过位于两者之间的绝缘层中的过孔6电性接触。
具体的显示过程为:通过栅线扫描信号逐行打开每行的薄膜晶体管,然后通过数据线10向像素电极1传输数据信号,像素电极1与公共电极之间形成驱动液晶分子偏转的电场,实现显示。所述公共电极上施加公共电压信号。
根据驱动液晶电场的方向,薄膜晶体管液晶显示器件分为垂直电场型和水平电场型。其中,垂直电场型包括扭曲向列型(TN型)。水平电场型包括高级超维场转换型(ADS型),平面切换型(IPS型)。
对于TN型薄膜晶体管液晶显示器件,其公共电极形成在彩膜基板上。为了增加存储电容,阵列基板的每一像素区域中,在像素电极1与栅线20位置对应的周边设置导电图形11,导电图形11上施加公共电压,与像素电极1之间形成存储电容,保证在一帧画面显示时间内,维持像素电极1上的数据电压,提高显示品质。
需要说明的是,本发明中“每一像素区域中,像素电极的周边”是指位于像素电极1与数据线10,以及像素电极1与栅线20之间的区域,即,每一像素区域中,位于像素电极1外围的区域。
为了简化工艺,降低成本,所有像素区域中的导电图形11由同一金属膜层制得。具体的,导电图形11与栅电极3、栅线20由同一栅金属层形成。所述栅金属层的材料为Cu,Al,Ag,Mo,Cr,Nd,Ni,Mn,Ti,Ta,W等金属以及这些金属的合金,可以为单层结构或者多层结构,多层结构比如Cu\Mo,Ti\Cu\Ti,Mo\Al\Mo等。
由于导电图形11上加载公共电压,为了减小寄生电容,如图4所示,设置数据线10与导电图形11之间的第二绝缘层102为有机膜层(以下内容中,当绝缘层为有机膜层时,命名该绝缘层为有机绝缘层)。当导电图形11与栅线20由同一栅金属层制得时,第二绝缘层102也填充在栅线20与导电层图形11之间。由于有机绝缘层较无机绝缘层的厚度要厚很多,能够减小栅线20和数据线10的寄生电容,减小负载,降低功耗。
进一步地,如图4所示,还可以设置薄膜晶体管的漏电极5和像素电极1之间的第一绝缘层103为有机膜层,漏电极5和像素电极1通过第一绝缘层103中的过孔6电性连接,漏电极5对应过孔6所在区域的部分与导电图形11正对,由于有机绝缘层的厚度较大,形成的过孔6尺寸较大,因此,漏电极5与导电图形11正对面积较大,两者之间形成的电容(源漏金属-绝缘层-栅金属)能够有效增加像素的存储电容。
以底栅型薄膜晶体管阵列基板为例,结合图2、图3-图5所示,本实施例中的阵列基板具体包括:
101基底,为透明基底,如玻璃基底、石英基底、有机树脂基底;
设置在基底101上的栅线20和数据线10,限定多个像素区域,相邻两行像素区域之间具有一条栅线20,相邻两数据线10之间具有一列像素区域;
每一像素区域包括:
薄膜晶体管30的栅电极3、导电图形11,栅电极3与栅线20电性连接,栅电极3、导电图形与11和栅线20由同一栅金属层制得,导电图形11位于像素区域与栅线20对应的周边,能够防止像素区域的周边漏光;
覆盖栅电极3、导电图形与11和栅线20的栅绝缘层102,为有机绝缘层;
设置在栅绝缘层102上的薄膜晶体管30的有源层(图中未示出),由硅半导体或金属氧化物半导体制得;
搭接在所述有源层两端的源电极4和漏电极5,源电极4与数据线10电性连接,源电极4、漏电极5与数据线10由同一源漏金属层制得;
覆盖薄膜晶体管30的钝化层103,为有机绝缘层,钝化层103中具有过孔6,露出薄膜晶体管30的漏电极5;
像素电极1,数据线10在基底101上的投影与像素电极1在基底101上的投影存在交叠区域,有效防止像素区域的周边漏光。像素电极1通过钝化层103中的过孔6与漏电极5电性接触,漏电极5对应过孔6所在区域的部分与导电图形11正对,形成第一存储电容,像素电极1与导电图形11形成第二存储电容,增加了像素的存储电容,提高了显示品质。像素电极1的材料可以选择透明金属氧化物,如:HIZO、ZnO、TiO2、CdSnO、MgZnO、IGO、IZO、ITO或IGZO。
上述薄膜晶体管阵列基板的绝缘层(包括栅绝缘层102和钝化层103)为有机绝缘层,能够有效减小数据线10和栅线20的寄生电容,减小负载,降低功耗。
需要说明的是,本发明的技术方案不仅适用于底栅型薄膜晶体管阵列基板,还适用于其他类型的薄膜晶体管阵列基板,如:顶栅型薄膜晶体管阵列基板、共面型薄膜晶体管阵列基板。
实施例二
结合图1、图6-图8所示,本实施例中的阵列基板为双栅结构,因其具有低功耗、低成本,而得到广泛应用。
为了便于描述,设定栅线20沿行方向延伸,数据线10沿列方向延伸;
当所述阵列基板为薄膜晶体管阵列基板时,相邻两行像素区域之间具有两条栅线20,相邻两数据线10之间具有两列像素区域,每一行像素区域中,奇数像素区域的薄膜晶体管30的栅电极3与同一栅线20电性连接,偶数像素区域的薄膜晶体管30的栅电极3与另一栅线20电性连接,相邻两列像素区域的薄膜晶体管30的源电极4与同一数据线连接,实现双栅结构,相对于单栅结构,双栅结构的栅线20数量加倍,数据线10减少一倍。
本实施例中,每一像素区域的仅一侧具有数据线10,并设置数据线10在基底101上的投影与像素电极1在基底101上的投影存在交叠区域,能够有效防止像素区域与数据线10对应的周边漏光。相对于现有技术,还能够增加像素的开口率。具体的工作原理已在实施例一中描述,在此不再赘述。同时,通过增加数据线10的宽度来防止像素区域漏光的方式,能够减小对应数据线10的相邻像素电极1之间的间距和不对应数据线10的相邻像素电极1之间的间距的差异,防止两个间距差异过大出现模糊线等不良的问题。
当显示器件采用上述阵列基板时,能够提高产品的显示品质。
可选的,数据线10在基底101上的投影与像素电极1在基底101上的投影形成交叠区域,其宽度d为2~3.5um,如图8所示。
由于双栅结构中,每一像素区域的仅一侧具有数据线10,为了防止像素电极1不与数据线10对应的周边漏光,每一像素区域中在像素电极1与栅线20对应的周边设置遮光图形2,并在相邻两列数据线10之间的两个像素电极1之间也设置遮光图形2,用于防止像素区域漏光。其中,每一像素区域中,像素电极1的周边是指每一像素区域中,位于像素电极1外围的区域。
优选地,设置遮光图形2由金属材料制得,能够与像素电极1之间形成像素的存储电容,尤其适用于TN型的液晶显示器件。进一步地,如图7所示,薄膜晶体管30的漏电极5和像素电极1之间的第一绝缘层103为有机膜层,像素电极1通过第一绝缘层103中的过孔6与漏电极5电性连接。漏电极5对应过孔6的区域与遮光图形2正对,由于有机绝缘层的厚度较大,形成的过孔6尺寸较大,因此,漏电极5与遮光图形2正对面积较大,两者之间形成的电容(源漏金属-绝缘层-栅金属)能够有效增加像素的存储电容。其中,遮光图形2上加载公共电压。
为了简化工艺,降低成本,所有像素区域中的金属遮光图形2由同一金属膜层制得。具体的,金属遮光图形2与栅电极3、栅线20由同一栅金属层形成。所述栅金属层的材料为Cu,Al,Ag,Mo,Cr,Nd,Ni,Mn,Ti,Ta,W等金属以及这些金属的合金,可以为单层结构或者多层结构,多层结构比如Cu\Mo,Ti\Cu\Ti,Mo\Al\Mo等。
当金属遮光图形2上加载公共电压时,为了减小寄生电容,如图7所示,设置数据线10与遮光图形2之间的第二绝缘层102为有机膜层(以下内容中,当绝缘层为有机膜层时,命名该绝缘层为有机绝缘层)。当遮光图形2与栅线20由同一栅金属层制得时,第二绝缘层102也填充在栅线20与遮光图形2之间。由于有机绝缘层较无机绝缘层的厚度要厚很多,能够减小栅线20和数据线10的寄生电容,减小负载,降低功耗。
以底栅型薄膜晶体管阵列基板为例,结合图1、图6-图8所示,本实施例中的阵列基板具体包括:
基底101,为透明基底,如:玻璃基底、石英基底、有机树脂基底;
设置在基底101上的栅线20和数据线10,限定多个像素区域,相邻两行像素区域之间具有两条栅线20,相邻两数据线10之间具有两列像素区域;
每一像素区域包括:
薄膜晶体管30的栅电极3、金属遮光图形2,栅电极4与栅线20电性连接,栅电极3、金属遮光图形2与栅线20由同一栅金属层制得,金属遮光图形2位于像素电极1与栅线位置对应的周边,以及位于相邻两列数据线10之间的两个像素电极1之间,用于防止像素区域的周边漏光;
覆盖栅电极3、金属遮光图形2和栅线20的栅绝缘层102,为有机绝缘层;
设置在栅绝缘层102上的薄膜晶体管30的有源层(图中未示出),由硅半导体或金属氧化物半导体制得;
搭接在所述有源层两端的源电极4和漏电极5,源电极4与数据线10电性连接,源电极、漏电极5与数据线由同一源漏金属层制得;
覆盖薄膜晶体管30的钝化层103,为有机绝缘层,钝化层103中具有过孔6,露出薄膜晶体管30的漏电极5;
像素电极1,数据线10在基底101上的投影与像素电极1在基底101上的投影存在交叠区域,用于防止像素区域的周边漏光。像素电极1通过钝化层103中的过孔6与漏电极5电性接触,漏电极5对应过孔6所在区域的部分与金属遮光图形2正对,形成第一存储电容,像素电极1与金属遮光图形2形成第二存储电容,增加了像素的存储电容,提高了显示品质。像素电极1的材料可以选择透明金属氧化物,如:HIZO、ZnO、TiO2、CdSnO、MgZnO、IGO、IZO、ITO或IGZO。
上述薄膜晶体管阵列基板的绝缘层(包括栅绝缘层102和钝化层103)为有机绝缘层,能够有效减小数据线10和栅线20的寄生电容,减小负载,降低功耗。
需要说明的是,本发明的技术方案不仅适用于底栅型薄膜晶体管阵列基板,还适用于其他类型的薄膜晶体管阵列基板,如:顶栅型薄膜晶体管阵列基板、共面型薄膜晶体管阵列基板。
实施例三
基于同一发明构思,本实施例中提供一种实施例一中的阵列基板的制作方法,包括:
在一基底上形成栅线和数据线,限定多个像素区域,相邻两行像素区域之间具有一条栅线,相邻两数据线之间具有一列像素区域;
在所述像素区域形成像素电极,每一像素区域中,所述数据线在所述基底上的投影与所述像素电极在所述基底上的投影存在交叠区域,用于防止像素区域漏光。相对于现有技术,还能够增加像素的开口率。
对于TN型薄膜晶体管液晶显示器件,其公共电极形成在彩膜基板上,为了增加存储电容,所述阵列基板的制作方法还包括:
在所述像素区域形成薄膜晶体管;
在薄膜晶体管的漏电极和像素电极之间形成第一绝缘层,所述第一绝缘层为有机膜层,在所述第一绝缘层中形成过孔,像素电极通过所述过孔与漏电极电性接触;
每一像素区域中,在像素电极与栅线位置对应的周边形成导电图形,所述导电图形上施加公共电压,漏电极对应所述过孔所在区域的部分与所述导电图形正对,由于有机膜层的厚度较大,形成的过孔尺寸较大,因此,漏电极与所述导电图形正对面积较大,两者之间形成像素的存储电容。
优选地,通过对同一金属膜层的构图工艺形成所有像素区域中的导电图形。具体的,通过对同一栅金属层的构图工艺形成栅线,以及所有像素区域中的导电图形。
对于阵列基板上其他结构的制作方法可以参加现有技术,在此不再详述。
实施例四
基于同一发明构思,本实施例中提供一种实施例二中的阵列基板的制作方法,包括:
在一基底上形成栅线和数据线,限定多个像素区域,相邻两行像素区域之间具有两条栅线,相邻两数据线之间具有两列像素区域;
在所述像素区域形成像素电极,每一像素区域中,所述数据线在所述基底上的投影与所述像素电极在所述基底上的投影存在交叠区域,用于防止像素区域漏光。相对于现有技术,还能够增加像素的开口率。同时,通过增加数据线的宽度来防止像素区域的周边漏光的方式,能够减小对应数据线的相邻像素电极之间的间距和不对应数据线的相邻像素电极之间的间距的差异,防止两个间距差异过大出现模糊线等不良的问题。
由于每一像素区域的仅一侧具有数据线,为了防止不与数据线对应的像素区域的周边漏光,所述阵列基板的制作方法还包括:
每一像素区域中,在像素电极与栅线位置对应的周边形成遮光图形。
对于TN型薄膜晶体管液晶显示器件,其公共电极形成在彩膜基板上,为了增加存储电容,所述阵列基板的制作方法还包括:
在所述像素区域形成薄膜晶体管;
在薄膜晶体管的漏电极和像素电极之间形成第一绝缘层,所述第一绝缘层为有机膜层,在所述第一绝缘层中形成过孔,像素电极通过所述过孔与漏电极电性接触;
对一金属膜层进行构图工艺形成所述遮光图形,所述遮光图形上施加公共电压,漏电极对应所述过孔所在区域的部分与遮光图形正对,由于有机膜层的厚度较大,形成的过孔尺寸较大,因此,漏电极与所述遮光图形正对面积较大,两者之间形成像素的存储电容。
优选地,通过对同一金属膜层的构图工艺形成所有像素区域中的遮光图形。具体可以通过对同一栅金属层的构图工艺形成栅线,以及所有像素区域中的遮光图形。
对于阵列基板上其他结构的制作方法可以参加现有技术,在此不再详述。
以上所述仅是本发明的优选实施方式,应当指出,对于本技术领域的普通技术人员来说,在不脱离本发明技术原理的前提下,还可以做出若干改进和替换,这些改进和替换也应视为本发明的保护范围。

Claims (11)

1.一种阵列基板,包括设置在一基底上的栅线和数据线,所述栅线与数据线限定出多个像素区域,所述阵列基板还包括位于所述像素区域的像素电极,其特征在于,每一像素区域中,所述数据线在所述基底上的投影与所述像素电极在所述基底上的投影存在交叠区域。
2.根据权利要求1所述的阵列基板,其特征在于,每一像素区域中,所述像素电极与栅线位置对应的周边设置有遮光图形。
3.根据权利要求2所述的阵列基板,其特征在于,所述阵列基板还包括:
位于所述像素区域的薄膜晶体管;
位于所述薄膜晶体管的漏电极和像素电极之间的第一绝缘层,所述第一绝缘层为有机膜层,所述像素电极通过所述第一绝缘层中的过孔与所述漏电极电性连接;
所述遮光图形由金属材料制得,所述漏电极对应所述过孔的区域与所述遮光图形正对,用于形成存储电容。
4.根据权利要求3所述的阵列基板,其特征在于,所有像素区域中,像素电极与栅线位置对应的周边设置的遮光图形由同一金属膜层制得。
5.根据权利要求4所述的阵列基板,其特征在于,所述遮光金属图形由栅金属材料制得。
6.根据权利要求1所述的阵列基板,其特征在于,所述交叠区域的宽度为2~3.5um。
7.一种显示器件,其特征在于,包括权利要求1-6任一项所述的阵列基板。
8.一种权利要求1-6任一项所述的阵列基板的制作方法,包括:
在一基底上形成栅线和数据线,限定多个像素区域;
在所述像素区域形成像素电极,其特征在于,每一像素区域中,所述数据线在所述基底上的投影与所述像素电极在所述基底上的投影存在交叠区域。
9.根据权利要求8所述的制作方法,其特征在于,所述制作方法还包括:
每一像素区域中,在像素电极与栅线位置对应的周边形成遮光图形。
10.根据权利要求9所述的制作方法,其特征在于,所述制作方法还包括:
在所述像素区域形成薄膜晶体管;
在所述薄膜晶体管的漏电极和像素电极之间形成第一绝缘层,所述第一绝缘层为有机膜层,并在所述第一绝缘层中形成过孔,所述像素电极通过所述过孔与所述漏电极电性连接;
所述遮光图形由金属材料制得,所述漏电极对应所述过孔的区域与所述遮光图形正对,用于形成存储电容。
11.根据权利要求10所述的制作方法,其特征在于,所有像素区域的像素电极与栅线位置对应的周边设置的遮光图形通过对同一金属膜层的构图工艺形成。
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