Nothing Special   »   [go: up one dir, main page]

BR0314472A - Módulo eletrônico compreendendo um elemento visível em sua face e método de fabricação do mesmo - Google Patents

Módulo eletrônico compreendendo um elemento visível em sua face e método de fabricação do mesmo

Info

Publication number
BR0314472A
BR0314472A BR0314472-0A BR0314472A BR0314472A BR 0314472 A BR0314472 A BR 0314472A BR 0314472 A BR0314472 A BR 0314472A BR 0314472 A BR0314472 A BR 0314472A
Authority
BR
Brazil
Prior art keywords
switching
gear
switching process
manufacture
face
Prior art date
Application number
BR0314472-0A
Other languages
English (en)
Inventor
Francois Droz
Original Assignee
Nagraid Sa
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=32075147&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=BR0314472(A) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Nagraid Sa filed Critical Nagraid Sa
Publication of BR0314472A publication Critical patent/BR0314472A/pt

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/072—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips the record carrier comprising a plurality of integrated circuit chips
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/0007—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding involving treatment or provisions in order to avoid deformation or air inclusion, e.g. to improve surface quality
    • B32B37/0023—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding involving treatment or provisions in order to avoid deformation or air inclusion, e.g. to improve surface quality around holes, apertures or channels present in at least one layer
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07743—External electrical contacts
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2305/00—Condition, form or state of the layers or laminate
    • B32B2305/34—Inserts
    • B32B2305/342—Chips
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2425/00—Cards, e.g. identity cards, credit cards
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2519/00—Labels, badges
    • B32B2519/02—RFID tags
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/14—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
    • B32B37/16—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with all layers existing as coherent layers before laminating
    • B32B37/18—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with all layers existing as coherent layers before laminating involving the assembly of discrete sheets or panels only
    • B32B37/182—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with all layers existing as coherent layers before laminating involving the assembly of discrete sheets or panels only one or more of the layers being plastic
    • B32B37/185—Laminating sheets, panels or inserts between two discrete plastic layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49126—Assembling bases
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Quality & Reliability (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Credit Cards Or The Like (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Casings For Electric Apparatus (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Details Of Resistors (AREA)
  • Structure Of Transmissions (AREA)
  • Battery Mounting, Suspending (AREA)

Abstract

"PROCESSO DE COMUTAçãO E ARRANJO DE COMUTAçãO PARA UMA ENGRENAGEM". A presente invenção refere-se a um processo de comutação para uma engrenagem com dois graus de liberdade e um arranjo de comutação para executar o processo de comutação. A comutação em engrenagens comutáveis é normalmente executada através de atuadores que são freqüentemente dimensionados de maneira excessiva em termos energéticos e funcionais. A nova solução deve ser capaz de efetuar a comutação com pouca energia e de forma confiável. Na solução de acordo com a presente invenção é usado um membro de comutação passivo com o qual seja possível comutar, através do estado de ceder ou de bloquear do membro de comutação, pelo menos duas curvas de movimento, respectivamente, em posições para elementos de saída da engrenagem. Com o membro de comutação passivo, o processo de comutação poderá ser reduzido para a simples comutação, eliminando movimentos desnecessários de elementos atuadores. Dessa forma é garantida uma comutação confiável e com pouca energia. A invenção poderá ser usada para todos os tipos de engrenagens que executam trabalhos de guia, de transmissão e de acoplamento.
BR0314472-0A 2002-10-11 2003-10-10 Módulo eletrônico compreendendo um elemento visível em sua face e método de fabricação do mesmo BR0314472A (pt)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CH16902002 2002-10-11
PCT/IB2003/004481 WO2004034320A1 (fr) 2002-10-11 2003-10-10 Module électronique comportant un élément apparent sur une face et procédé de fabrication d'un tel module

Publications (1)

Publication Number Publication Date
BR0314472A true BR0314472A (pt) 2005-07-26

Family

ID=32075147

Family Applications (1)

Application Number Title Priority Date Filing Date
BR0314472-0A BR0314472A (pt) 2002-10-11 2003-10-10 Módulo eletrônico compreendendo um elemento visível em sua face e método de fabricação do mesmo

Country Status (19)

Country Link
US (1) US7710732B2 (pt)
EP (1) EP1559068B1 (pt)
JP (1) JP4347218B2 (pt)
KR (1) KR100988971B1 (pt)
CN (1) CN100481121C (pt)
AR (1) AR041581A1 (pt)
AT (1) ATE397255T1 (pt)
AU (1) AU2003264824B2 (pt)
BR (1) BR0314472A (pt)
CA (1) CA2501777C (pt)
DE (1) DE60321373D1 (pt)
ES (1) ES2308033T3 (pt)
MX (1) MXPA05003717A (pt)
MY (1) MY130783A (pt)
PA (1) PA8584401A1 (pt)
PT (1) PT1559068E (pt)
RU (1) RU2316817C2 (pt)
TW (1) TWI326844B (pt)
WO (1) WO2004034320A1 (pt)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4860436B2 (ja) 2006-11-07 2012-01-25 トッパン・フォームズ株式会社 Ｉｃカードおよびその製造方法
US7967214B2 (en) 2006-12-29 2011-06-28 Solicore, Inc. Card configured to receive separate battery
US8181879B2 (en) 2006-12-29 2012-05-22 Solicore, Inc. Mailing apparatus for powered cards
DE102008019571A1 (de) * 2008-04-18 2009-10-22 Giesecke & Devrient Gmbh Chipkarte und Verfahren zu deren Herstellung
DE102008053368A1 (de) * 2008-10-27 2010-04-29 Giesecke & Devrient Gmbh Verfahren zur Herstellung eines tragbaren Datenträgers und tragbarer Datenträger
ES2405981T3 (es) * 2009-12-28 2013-06-04 Nagraid S.A. Procedimiento de fabricación de tarjetas electrónicas
DE102010011517A1 (de) * 2010-03-15 2011-09-15 Smartrac Ip B.V. Laminataufbau für eine Chipkarte und Verfahren zu dessen Herstellung
EP2390824A1 (fr) * 2010-05-27 2011-11-30 Gemalto SA Procédé de réalisation d'un module multifonctionnel et dispositif le comprenant
US8717186B2 (en) * 2012-06-28 2014-05-06 Xunwei Zhou Detection of swelling in batteries
PL3037248T3 (pl) 2014-12-22 2018-10-31 Magna Steyr Fahrzeugtechnik Ag & Co Kg Sposób wytwarzania przekładkowego elementu konstrukcyjnego
MX2017010502A (es) * 2015-02-20 2018-03-14 Nid Sa Proceso de fabricacion de un dispositivo que incluye al menos un elemento electronico asociado a un substrato y a una antena.
US10984304B2 (en) 2017-02-02 2021-04-20 Jonny B. Vu Methods for placing an EMV chip onto a metal card
FR3063555B1 (fr) * 2017-03-03 2021-07-09 Linxens Holding Carte a puce et procede de fabrication d’une carte a puce
SE1750836A1 (en) * 2017-06-28 2018-12-29 Fingerprint Cards Ab Fingerprint sensor module comprising antenna and method for manufacturing a fingerprint sensor module
USD956760S1 (en) * 2018-07-30 2022-07-05 Lion Credit Card Inc. Multi EMV chip card

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3338597A1 (de) * 1983-10-24 1985-05-02 GAO Gesellschaft für Automation und Organisation mbH, 8000 München Datentraeger mit integriertem schaltkreis und verfahren zur herstellung desselben
JPS62290593A (ja) 1986-06-11 1987-12-17 大日本印刷株式会社 Ｉｃカード
JPH0696357B2 (ja) 1986-12-11 1994-11-30 三菱電機株式会社 Ｉｃカードの製造方法
JPH03114788A (ja) 1989-09-29 1991-05-15 Citizen Watch Co Ltd Ｉｃカード構造
DE4122049A1 (de) 1991-07-03 1993-01-07 Gao Ges Automation Org Verfahren zum einbau eines traegerelements
US5581065A (en) * 1993-08-02 1996-12-03 Dai Nippon Printing Co., Ltd. Sheet-framed IC carrier, method for producing the same, and IC carrier case
GB2309933B (en) * 1996-02-12 2000-02-23 Plessey Telecomm Contact card
FR2760113B1 (fr) * 1997-02-24 1999-06-04 Gemplus Card Int Procede de fabrication de carte sans contact a antenne bobinee
JPH1114494A (ja) 1997-06-23 1999-01-22 Nikka Densoku Kk 密封容器の密封不良検出方法および装置
JP2001084347A (ja) * 1999-09-16 2001-03-30 Toshiba Corp カード型記憶装置及びその製造方法
TW200300990A (en) * 2001-12-11 2003-06-16 Nagra Id S A Low cost electronic module and method for manufacturing such module

Also Published As

Publication number Publication date
RU2316817C2 (ru) 2008-02-10
DE60321373D1 (de) 2008-07-10
ES2308033T3 (es) 2008-12-01
CA2501777A1 (en) 2004-04-22
ATE397255T1 (de) 2008-06-15
CA2501777C (en) 2011-11-29
EP1559068B1 (fr) 2008-05-28
US20060124350A1 (en) 2006-06-15
KR100988971B1 (ko) 2010-10-20
EP1559068A1 (fr) 2005-08-03
AU2003264824A1 (en) 2004-05-04
TWI326844B (en) 2010-07-01
US7710732B2 (en) 2010-05-04
CN100481121C (zh) 2009-04-22
JP2006503424A (ja) 2006-01-26
AR041581A1 (es) 2005-05-18
CN1703718A (zh) 2005-11-30
MXPA05003717A (es) 2005-06-17
TW200409039A (en) 2004-06-01
RU2005110187A (ru) 2006-03-27
WO2004034320A1 (fr) 2004-04-22
AU2003264824B2 (en) 2009-06-11
MY130783A (en) 2007-07-31
KR20050067173A (ko) 2005-06-30
PT1559068E (pt) 2008-08-06
JP4347218B2 (ja) 2009-10-21
PA8584401A1 (es) 2005-02-04

Similar Documents

Publication Publication Date Title
BR0314472A (pt) Módulo eletrônico compreendendo um elemento visível em sua face e método de fabricação do mesmo
WO2001095133A3 (en) A method of modelling a maintenance system
WO2003073472A3 (en) Electronic component design, procurement and manufacturing collaboration
BR0309377A (pt) Processo e dispositivo para curar um revestimento
WO2002095506A3 (de) Prozessautomatisierungssystem und prozessgerät für ein prozessautomatisierungssystem
WO2007025061A3 (en) Coherent multichip rfid tag and method and appartus for creating such coherence
BRPI0600041A (pt) processo de fabricação de um dispositivo antivibratório e dispositivo antivibratório podendo ser obtido por este processo
BRPI0401498A (pt) Processo para o brunimento de furos
BR0006053A (pt) Circuitos de força inteligente configuráveis por máscara-aplicações e dispositivos gs-nmos
BRPI0500255A (pt) Dispositivo de ativação para um câmbio
DE602004026479D1 (de) Stromversorgung für roboteranwendungen
ES2189060T3 (es) Modulo de entrada/salida electronico.
ATE306344T1 (de) Ein metall oder eine legierung sowie eine formgedächtnislegierung umfassender verbundwerkstoff
BR0115334A (pt) elemento de recheio, e método para produzir o mesmo
ATE97842T1 (de) Feile oder raspel.
BR0116734A (pt) Caixa de mudanças
BR0201624A (pt) Processo para a conformação de uma seção de um dente de uma denteação, por meio de deformação plástica
BRPI0407259A (pt) Sistema e processo para aplicação auto-sustentáveis
BR0215508A (pt) Processo e disposição para o acionamento de um corpo de empuxo através de um acionamento por ìmã bidirecional linear
DE50210397D1 (de) Synchronisationsverfahren für ein hochverfügbares Automatisierungssystem
BRPI0408401A (pt) caixa coletora, trocador de calor e processo para a fabricação de uma caixa coletora
BR0301158A (pt) Equipamento que pode ser usado por um robÈ industrial para fixar peças de funcionamento ou montagens que estão sendo processadas ou montadas e têm uma estrutura modular separável, com uma geometria definida e repetìvel
BR0318234A (pt) lente composta monofocal e molde
DE59812466D1 (de) Funktionsbaugruppe mit Hinweisschild bei einer speicherprogrammierbaren Steuerung
RU2303283C1 (ru) Логический модуль

Legal Events

Date Code Title Description
B25A Requested transfer of rights approved

Owner name: NAGRAVISION SA (CH)

B09A Decision: intention to grant [chapter 9.1 patent gazette]
B15K Others concerning applications: alteration of classification

Free format text: A CLASSIFICACAO ANTERIOR ERA: G06K 19/077

Ipc: B32B 37/00 (2006.01), G06K 19/077 (2006.01)

B11D Dismissal acc. art. 38, par 2 of ipl - failure to pay fee after grant in time