Classifications

• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01Q—ANTENNAS, i.e. RADIO AERIALS
  • H01Q9/00—Electrically-short antennas having dimensions not more than twice the operating wavelength and consisting of conductive active radiating elements
  • H01Q9/04—Resonant antennas
  • H01Q9/06—Details
  • H01Q9/14—Length of element or elements adjustable
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01Q—ANTENNAS, i.e. RADIO AERIALS
  • H01Q5/00—Arrangements for simultaneous operation of antennas on two or more different wavebands, e.g. dual-band or multi-band arrangements
  • H01Q5/30—Arrangements for providing operation on different wavebands
  • H01Q5/307—Individual or coupled radiating elements, each element being fed in an unspecified way
  • H01Q5/314—Individual or coupled radiating elements, each element being fed in an unspecified way using frequency dependent circuits or components, e.g. trap circuits or capacitors
  • H01Q5/328—Individual or coupled radiating elements, each element being fed in an unspecified way using frequency dependent circuits or components, e.g. trap circuits or capacitors between a radiating element and ground
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01Q—ANTENNAS, i.e. RADIO AERIALS
  • H01Q9/00—Electrically-short antennas having dimensions not more than twice the operating wavelength and consisting of conductive active radiating elements
  • H01Q9/04—Resonant antennas
  • H01Q9/0407—Substantially flat resonant element parallel to ground plane, e.g. patch antenna
  • H01Q9/0421—Substantially flat resonant element parallel to ground plane, e.g. patch antenna with a shorting wall or a shorting pin at one end of the element
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01Q—ANTENNAS, i.e. RADIO AERIALS
  • H01Q9/00—Electrically-short antennas having dimensions not more than twice the operating wavelength and consisting of conductive active radiating elements
  • H01Q9/04—Resonant antennas
  • H01Q9/0407—Substantially flat resonant element parallel to ground plane, e.g. patch antenna
  • H01Q9/0442—Substantially flat resonant element parallel to ground plane, e.g. patch antenna with particular tuning means
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
  • H01L2223/58—Structural electrical arrangements for semiconductor devices not otherwise provided for
  • H01L2223/64—Impedance arrangements
  • H01L2223/66—High-frequency adaptations
  • H01L2223/6661—High-frequency adaptations for passive devices
  • H01L2223/6677—High-frequency adaptations for passive devices for antenna, e.g. antenna included within housing of semiconductor device
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
  • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
  • H01L2224/42—Wire connectors; Manufacturing methods related thereto
  • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
  • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
  • H01L2224/481—Disposition
  • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
  • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
  • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
  • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
  • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
  • H01L2924/151—Die mounting substrate
  • H01L2924/153—Connection portion
  • H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
  • H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
  • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
  • H01L2924/191—Disposition
  • H01L2924/19101—Disposition of discrete passive components
  • H01L2924/19105—Disposition of discrete passive components in a side-by-side arrangement on a common die mounting substrate

Landscapes

• Support Of Aerials (AREA)
• Variable-Direction Aerials And Aerial Arrays (AREA)
• Details Of Aerials (AREA)
• Transceivers (AREA)
• Telephone Set Structure (AREA)
• Mobile Radio Communication Systems (AREA)

Applications Claiming Priority (1)

Publications (1)

Family

ID=8179882

Family Applications (1)

Country Status (7)

Families Citing this family (56)

Family Cites Families (24)

• 2002
  • 2002-02-13 AT AT02710270T patent/ATE365985T1/de not_active IP Right Cessation
  • 2002-02-13 WO PCT/IB2002/000440 patent/WO2002067375A1/en active IP Right Grant
  • 2002-02-13 JP JP2002566592A patent/JP3982689B2/ja not_active Expired - Fee Related
  • 2002-02-13 US US10/467,739 patent/US6819293B2/en not_active Expired - Fee Related
  • 2002-02-13 EP EP02710270A patent/EP1362388B1/de not_active Expired - Lifetime
  • 2002-02-13 DE DE60220882T patent/DE60220882T2/de not_active Expired - Lifetime
  • 2002-03-27 TW TW091105994A patent/TW567639B/zh not_active IP Right Cessation

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