ATE341836T1 - Misfet - Google Patents
MisfetInfo
- Publication number
- ATE341836T1 ATE341836T1 AT00976351T AT00976351T ATE341836T1 AT E341836 T1 ATE341836 T1 AT E341836T1 AT 00976351 T AT00976351 T AT 00976351T AT 00976351 T AT00976351 T AT 00976351T AT E341836 T1 ATE341836 T1 AT E341836T1
- Authority
- AT
- Austria
- Prior art keywords
- active region
- insulating film
- type
- gate insulating
- increases
- Prior art date
Links
- 239000000969 carrier Substances 0.000 abstract 1
- 230000015556 catabolic process Effects 0.000 abstract 1
- 239000012535 impurity Substances 0.000 abstract 1
- 150000002500 ions Chemical class 0.000 abstract 1
- 239000000758 substrate Substances 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/63—Vertical IGFETs
- H10D30/635—Vertical IGFETs having no inversion channels, e.g. vertical accumulation channel FETs [ACCUFET] or normally-on vertical IGFETs
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D12/00—Bipolar devices controlled by the field effect, e.g. insulated-gate bipolar transistors [IGBT]
- H10D12/01—Manufacture or treatment
- H10D12/031—Manufacture or treatment of IGBTs
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/637—Lateral IGFETs having no inversion channels, e.g. buried channel lateral IGFETs, normally-on lateral IGFETs or depletion-mode lateral IGFETs
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/64—Double-diffused metal-oxide semiconductor [DMOS] FETs
- H10D30/66—Vertical DMOS [VDMOS] FETs
- H10D30/668—Vertical DMOS [VDMOS] FETs having trench gate electrodes, e.g. UMOS transistors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
- H10D62/10—Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
- H10D62/17—Semiconductor regions connected to electrodes not carrying current to be rectified, amplified or switched, e.g. channel regions
- H10D62/213—Channel regions of field-effect devices
- H10D62/221—Channel regions of field-effect devices of FETs
- H10D62/228—Channel regions of field-effect devices of FETs having delta-doped channels
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
- H10D62/10—Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
- H10D62/17—Semiconductor regions connected to electrodes not carrying current to be rectified, amplified or switched, e.g. channel regions
- H10D62/213—Channel regions of field-effect devices
- H10D62/221—Channel regions of field-effect devices of FETs
- H10D62/235—Channel regions of field-effect devices of FETs of IGFETs
- H10D62/314—Channel regions of field-effect devices of FETs of IGFETs having vertical doping variations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
- H10D62/60—Impurity distributions or concentrations
- H10D62/605—Planar doped, e.g. atomic-plane doped or delta-doped
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
- H10D62/80—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials
- H10D62/83—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials being Group IV materials, e.g. B-doped Si or undoped Ge
- H10D62/832—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials being Group IV materials, e.g. B-doped Si or undoped Ge being Group IV materials comprising two or more elements, e.g. SiGe
- H10D62/8325—Silicon carbide
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/0445—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising crystalline silicon carbide
- H01L21/0455—Making n or p doped regions or layers, e.g. using diffusion
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Crystallography & Structural Chemistry (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Insulated Gate Type Field-Effect Transistor (AREA)
- Electrodes Of Semiconductors (AREA)
- Thin Film Transistor (AREA)
- Junction Field-Effect Transistors (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2000161598 | 2000-05-31 |
Publications (1)
Publication Number | Publication Date |
---|---|
ATE341836T1 true ATE341836T1 (de) | 2006-10-15 |
Family
ID=18665600
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AT00976351T ATE341836T1 (de) | 2000-05-31 | 2000-11-20 | Misfet |
Country Status (10)
Country | Link |
---|---|
US (2) | US6617653B1 (de) |
EP (2) | EP1286398B1 (de) |
JP (1) | JP3527503B2 (de) |
KR (1) | KR100708028B1 (de) |
CN (1) | CN100345306C (de) |
AT (1) | ATE341836T1 (de) |
AU (1) | AU1416701A (de) |
DE (1) | DE60031173T2 (de) |
TW (1) | TW475268B (de) |
WO (1) | WO2001093339A1 (de) |
Families Citing this family (57)
Publication number | Priority date | Publication date | Assignee | Title |
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WO2001067521A1 (en) * | 2000-03-03 | 2001-09-13 | Matsushita Electric Industrial Co., Ltd. | Semiconductor device |
US6580125B2 (en) * | 2000-11-21 | 2003-06-17 | Matsushita Electric Industrial Co., Ltd. | Semiconductor device and method for fabricating the same |
CN1254026C (zh) * | 2000-11-21 | 2006-04-26 | 松下电器产业株式会社 | 通信系统用仪器 |
JP3940560B2 (ja) * | 2001-01-25 | 2007-07-04 | 独立行政法人産業技術総合研究所 | 半導体装置の製造方法 |
US6852602B2 (en) * | 2001-01-31 | 2005-02-08 | Matsushita Electric Industrial Co., Ltd. | Semiconductor crystal film and method for preparation thereof |
JP3811624B2 (ja) * | 2001-04-27 | 2006-08-23 | 松下電器産業株式会社 | 半導体装置 |
US6995397B2 (en) | 2001-09-14 | 2006-02-07 | Matsushita Electric Industrial Co., Ltd. | Semiconductor device |
JP4463482B2 (ja) * | 2002-07-11 | 2010-05-19 | パナソニック株式会社 | Misfet及びその製造方法 |
JP2004134547A (ja) * | 2002-10-10 | 2004-04-30 | Hitachi Ltd | 半導体装置 |
JP2005005580A (ja) * | 2003-06-13 | 2005-01-06 | Renesas Technology Corp | 半導体装置 |
US7473929B2 (en) * | 2003-07-02 | 2009-01-06 | Panasonic Corporation | Semiconductor device and method for fabricating the same |
US7410846B2 (en) | 2003-09-09 | 2008-08-12 | International Business Machines Corporation | Method for reduced N+ diffusion in strained Si on SiGe substrate |
CN1307707C (zh) * | 2003-09-19 | 2007-03-28 | 中国科学院上海微系统与信息技术研究所 | 一种含镁锌氧的金属-绝缘层-半导体结构及制备工艺 |
US7074657B2 (en) * | 2003-11-14 | 2006-07-11 | Advanced Micro Devices, Inc. | Low-power multiple-channel fully depleted quantum well CMOSFETs |
GB0403934D0 (en) * | 2004-02-21 | 2004-03-24 | Koninkl Philips Electronics Nv | Trench-gate semiconductor devices and the manufacture thereof |
US7282782B2 (en) * | 2004-03-12 | 2007-10-16 | Hewlett-Packard Development Company, L.P. | Combined binary oxide semiconductor device |
JP4537750B2 (ja) * | 2004-04-02 | 2010-09-08 | シャープ株式会社 | 固体撮像素子およびその製造方法 |
JP3945519B2 (ja) * | 2004-06-21 | 2007-07-18 | 東京エレクトロン株式会社 | 被処理体の熱処理装置、熱処理方法及び記憶媒体 |
US7667264B2 (en) * | 2004-09-27 | 2010-02-23 | Alpha And Omega Semiconductor Limited | Shallow source MOSFET |
KR100613294B1 (ko) * | 2004-12-30 | 2006-08-21 | 동부일렉트로닉스 주식회사 | 단채널 효과가 개선되는 모스 전계효과 트랜지스터 및 그제조 방법 |
US7365382B2 (en) | 2005-02-28 | 2008-04-29 | Infineon Technologies Ag | Semiconductor memory having charge trapping memory cells and fabrication method thereof |
JP5055771B2 (ja) * | 2005-02-28 | 2012-10-24 | 富士通セミコンダクター株式会社 | 半導体装置およびその製造方法 |
US20060260956A1 (en) * | 2005-05-23 | 2006-11-23 | Bausch & Lomb Incorporated | Methods for preventing or reducing interaction between packaging materials and polymeric articles contained therein |
JP5033316B2 (ja) * | 2005-07-05 | 2012-09-26 | 日産自動車株式会社 | 半導体装置の製造方法 |
US8183595B2 (en) | 2005-07-29 | 2012-05-22 | International Rectifier Corporation | Normally off III-nitride semiconductor device having a programmable gate |
US8482035B2 (en) * | 2005-07-29 | 2013-07-09 | International Rectifier Corporation | Enhancement mode III-nitride transistors with single gate Dielectric structure |
JP2007096263A (ja) * | 2005-08-31 | 2007-04-12 | Denso Corp | 炭化珪素半導体装置およびその製造方法。 |
CN100593243C (zh) | 2005-10-19 | 2010-03-03 | 三菱电机株式会社 | Mosfet以及mosfet的制造方法 |
US8258632B1 (en) * | 2005-10-24 | 2012-09-04 | Lawrence Livermore National Security, Llc | Optically-initiated silicon carbide high voltage switch with contoured-profile electrode interfaces |
CN101390223B (zh) * | 2005-10-24 | 2012-02-01 | 劳伦斯利弗莫尔国家安全有限公司 | 光激发碳化硅高压开关 |
JP2009530843A (ja) | 2006-03-20 | 2009-08-27 | エスティーマイクロエレクトロニクス エス.アール.エル. | 半導体電界効果トランジスタ、メモリセル、およびメモリ素子 |
US8269262B2 (en) * | 2006-05-02 | 2012-09-18 | Ss Sc Ip Llc | Vertical junction field effect transistor with mesa termination and method of making the same |
JP2008108785A (ja) * | 2006-10-23 | 2008-05-08 | Nec Electronics Corp | 半導体装置およびその製造方法 |
US7795691B2 (en) * | 2008-01-25 | 2010-09-14 | Cree, Inc. | Semiconductor transistor with P type re-grown channel layer |
WO2009104299A1 (ja) * | 2008-02-22 | 2009-08-27 | 住友電気工業株式会社 | 半導体装置および半導体装置の製造方法 |
US8841682B2 (en) | 2009-08-27 | 2014-09-23 | Cree, Inc. | Transistors with a gate insulation layer having a channel depleting interfacial charge and related fabrication methods |
WO2011118104A1 (ja) * | 2010-03-23 | 2011-09-29 | 住友電気工業株式会社 | 半導体装置およびその製造方法 |
WO2012017798A1 (ja) * | 2010-08-03 | 2012-02-09 | 住友電気工業株式会社 | 半導体装置およびその製造方法 |
TW201240016A (en) * | 2011-03-25 | 2012-10-01 | Taiwan Semiconductor Co Ltd | Manufacturing method of semiconductor substrate |
JP5699878B2 (ja) | 2011-09-14 | 2015-04-15 | 住友電気工業株式会社 | 炭化珪素半導体装置およびその製造方法 |
JP2013069964A (ja) | 2011-09-26 | 2013-04-18 | Sumitomo Electric Ind Ltd | 炭化珪素半導体装置 |
JP5764046B2 (ja) | 2011-11-21 | 2015-08-12 | 住友電気工業株式会社 | 炭化珪素半導体装置の製造方法 |
JP6239250B2 (ja) * | 2013-03-22 | 2017-11-29 | 株式会社東芝 | 半導体装置およびその製造方法 |
KR20140122328A (ko) * | 2013-04-09 | 2014-10-20 | 에스케이하이닉스 주식회사 | 반도체 기판 및 제조 방법과, 이를 이용한 반도체 장치 및 제조 방법 |
JP6168945B2 (ja) * | 2013-09-20 | 2017-07-26 | 株式会社東芝 | 半導体装置およびその製造方法 |
TWI626746B (zh) * | 2014-04-03 | 2018-06-11 | 財團法人工業技術研究院 | 半導體結構 |
JP6526528B2 (ja) * | 2015-09-11 | 2019-06-05 | 株式会社東芝 | 半導体装置 |
CN105470288B (zh) * | 2015-10-14 | 2018-10-19 | 西安电子科技大学宁波信息技术研究院 | Delta沟道掺杂SiC垂直功率MOS器件制作方法 |
CN110663105B (zh) * | 2017-05-31 | 2023-06-06 | 三菱电机株式会社 | 半导体装置的制造方法 |
JP6791083B2 (ja) * | 2017-09-28 | 2020-11-25 | 豊田合成株式会社 | 半導体装置の製造方法 |
DE102018107568B4 (de) * | 2018-03-29 | 2021-01-07 | Infineon Technologies Ag | Leistungshalbleitertransistor, sowie Verfahren zur Verarbeitung eines Leistungshalbleitertransistors |
CN113707773B (zh) * | 2019-03-06 | 2022-04-15 | 博尔博公司 | 异质结构以及采用异质结构的发光器件 |
US11107951B2 (en) * | 2019-03-06 | 2021-08-31 | Bolb Inc. | Heterostructure for light emitting device or photodetector and light-emitting device employing the same |
US11145772B2 (en) | 2019-03-11 | 2021-10-12 | At&T Intellectual Property I, L.P. | Device for photo spectroscopy having an atomic-scale bilayer |
CN114303249A (zh) | 2019-09-12 | 2022-04-08 | 苏州晶湛半导体有限公司 | 垂直型器件的制作方法 |
US10909298B1 (en) * | 2020-04-15 | 2021-02-02 | Globalfoundries Dresden Module One Limited Liability Company & Co. Kg | Well contact cell with doped tap region separated from active region, and methods to form same |
US11798983B2 (en) * | 2021-07-19 | 2023-10-24 | United Semiconductor Japan Co., Ltd. | Semiconductor device with deeply depleted channel and manufacturing method thereof |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3626328A (en) | 1969-04-01 | 1971-12-07 | Ibm | Semiconductor bulk oscillator |
JPS5915388B2 (ja) * | 1977-02-02 | 1984-04-09 | 株式会社日立製作所 | 半導体装置 |
US4882609A (en) * | 1984-11-19 | 1989-11-21 | Max-Planck Gesellschaft Zur Forderung Der Wissenschafter E.V. | Semiconductor devices with at least one monoatomic layer of doping atoms |
JP2770340B2 (ja) * | 1988-09-06 | 1998-07-02 | ソニー株式会社 | 半導体装置、絶縁ゲート型電界効果トランジスタ及びショットキーゲート型電界効果トランジスタ |
US5212104A (en) | 1991-04-26 | 1993-05-18 | Siemens Aktiengesellschaft | Method for manufacturing an mos transistor |
JPH0513446A (ja) | 1991-07-08 | 1993-01-22 | Nippondenso Co Ltd | 化合物半導体装置 |
US5488237A (en) | 1992-02-14 | 1996-01-30 | Sumitomo Electric Industries, Ltd. | Semiconductor device with delta-doped layer in channel region |
JP2800675B2 (ja) * | 1994-03-24 | 1998-09-21 | 日本電気株式会社 | トンネルトランジスタ |
US6498376B1 (en) * | 1994-06-03 | 2002-12-24 | Seiko Instruments Inc | Semiconductor device and manufacturing method thereof |
JP3461274B2 (ja) * | 1996-10-16 | 2003-10-27 | 株式会社東芝 | 半導体装置 |
US6057558A (en) | 1997-03-05 | 2000-05-02 | Denson Corporation | Silicon carbide semiconductor device and manufacturing method thereof |
JPH11251592A (ja) | 1998-01-05 | 1999-09-17 | Denso Corp | 炭化珪素半導体装置 |
EP1231640A4 (de) * | 2000-06-27 | 2008-10-08 | Matsushita Electric Ind Co Ltd | Halbleiterbauelement |
-
2000
- 2000-11-20 DE DE60031173T patent/DE60031173T2/de not_active Expired - Fee Related
- 2000-11-20 AU AU14167/01A patent/AU1416701A/en not_active Abandoned
- 2000-11-20 JP JP2002500456A patent/JP3527503B2/ja not_active Expired - Lifetime
- 2000-11-20 EP EP00976351A patent/EP1286398B1/de not_active Expired - Lifetime
- 2000-11-20 WO PCT/JP2000/008156 patent/WO2001093339A1/ja active IP Right Grant
- 2000-11-20 US US10/048,344 patent/US6617653B1/en not_active Expired - Lifetime
- 2000-11-20 EP EP06008439A patent/EP1684359A3/de not_active Withdrawn
- 2000-11-20 KR KR1020027001356A patent/KR100708028B1/ko not_active IP Right Cessation
- 2000-11-20 TW TW089124536A patent/TW475268B/zh not_active IP Right Cessation
- 2000-11-20 AT AT00976351T patent/ATE341836T1/de not_active IP Right Cessation
- 2000-11-20 CN CNB008111928A patent/CN100345306C/zh not_active Expired - Fee Related
-
2003
- 2003-06-12 US US10/459,807 patent/US6864507B2/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
EP1286398A4 (de) | 2003-02-26 |
CN100345306C (zh) | 2007-10-24 |
JP3527503B2 (ja) | 2004-05-17 |
EP1684359A9 (de) | 2006-12-27 |
EP1286398B1 (de) | 2006-10-04 |
TW475268B (en) | 2002-02-01 |
EP1286398A1 (de) | 2003-02-26 |
EP1684359A2 (de) | 2006-07-26 |
WO2001093339A1 (en) | 2001-12-06 |
KR100708028B1 (ko) | 2007-04-16 |
KR20020020949A (ko) | 2002-03-16 |
US20030227061A1 (en) | 2003-12-11 |
AU1416701A (en) | 2001-12-11 |
DE60031173T2 (de) | 2007-01-18 |
DE60031173D1 (de) | 2006-11-16 |
US6617653B1 (en) | 2003-09-09 |
US6864507B2 (en) | 2005-03-08 |
CN1367937A (zh) | 2002-09-04 |
EP1684359A3 (de) | 2006-10-25 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
RER | Ceased as to paragraph 5 lit. 3 law introducing patent treaties |