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ATE341836T1 - Misfet - Google Patents

Misfet

Info

Publication number
ATE341836T1
ATE341836T1 AT00976351T AT00976351T ATE341836T1 AT E341836 T1 ATE341836 T1 AT E341836T1 AT 00976351 T AT00976351 T AT 00976351T AT 00976351 T AT00976351 T AT 00976351T AT E341836 T1 ATE341836 T1 AT E341836T1
Authority
AT
Austria
Prior art keywords
active region
insulating film
type
gate insulating
increases
Prior art date
Application number
AT00976351T
Other languages
English (en)
Inventor
Toshiya Yokogawa
Makoto Kitabatake
Osamu Kusumoto
Kunimasa Takahashi
Takeshi Uenoyama
Original Assignee
Matsushita Electric Ind Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Ind Co Ltd filed Critical Matsushita Electric Ind Co Ltd
Application granted granted Critical
Publication of ATE341836T1 publication Critical patent/ATE341836T1/de

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00Field-effect transistors [FET]
    • H10D30/60Insulated-gate field-effect transistors [IGFET]
    • H10D30/63Vertical IGFETs
    • H10D30/635Vertical IGFETs having no inversion channels, e.g. vertical accumulation channel FETs [ACCUFET] or normally-on vertical IGFETs
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D12/00Bipolar devices controlled by the field effect, e.g. insulated-gate bipolar transistors [IGBT]
    • H10D12/01Manufacture or treatment
    • H10D12/031Manufacture or treatment of IGBTs
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00Field-effect transistors [FET]
    • H10D30/60Insulated-gate field-effect transistors [IGFET]
    • H10D30/637Lateral IGFETs having no inversion channels, e.g. buried channel lateral IGFETs, normally-on lateral IGFETs or depletion-mode lateral IGFETs
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00Field-effect transistors [FET]
    • H10D30/60Insulated-gate field-effect transistors [IGFET]
    • H10D30/64Double-diffused metal-oxide semiconductor [DMOS] FETs
    • H10D30/66Vertical DMOS [VDMOS] FETs
    • H10D30/668Vertical DMOS [VDMOS] FETs having trench gate electrodes, e.g. UMOS transistors
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/10Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
    • H10D62/17Semiconductor regions connected to electrodes not carrying current to be rectified, amplified or switched, e.g. channel regions
    • H10D62/213Channel regions of field-effect devices
    • H10D62/221Channel regions of field-effect devices of FETs
    • H10D62/228Channel regions of field-effect devices of FETs having delta-doped channels
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/10Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
    • H10D62/17Semiconductor regions connected to electrodes not carrying current to be rectified, amplified or switched, e.g. channel regions
    • H10D62/213Channel regions of field-effect devices
    • H10D62/221Channel regions of field-effect devices of FETs
    • H10D62/235Channel regions of field-effect devices of FETs of IGFETs
    • H10D62/314Channel regions of field-effect devices of FETs of IGFETs having vertical doping variations 
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/60Impurity distributions or concentrations
    • H10D62/605Planar doped, e.g. atomic-plane doped or delta-doped
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/80Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials
    • H10D62/83Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials being Group IV materials, e.g. B-doped Si or undoped Ge
    • H10D62/832Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials being Group IV materials, e.g. B-doped Si or undoped Ge being Group IV materials comprising two or more elements, e.g. SiGe
    • H10D62/8325Silicon carbide
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/0445Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising crystalline silicon carbide
    • H01L21/0455Making n or p doped regions or layers, e.g. using diffusion
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00Field-effect transistors [FET]
    • H10D30/60Insulated-gate field-effect transistors [IGFET]

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Insulated Gate Type Field-Effect Transistor (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Thin Film Transistor (AREA)
  • Junction Field-Effect Transistors (AREA)
AT00976351T 2000-05-31 2000-11-20 Misfet ATE341836T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000161598 2000-05-31

Publications (1)

Publication Number Publication Date
ATE341836T1 true ATE341836T1 (de) 2006-10-15

Family

ID=18665600

Family Applications (1)

Application Number Title Priority Date Filing Date
AT00976351T ATE341836T1 (de) 2000-05-31 2000-11-20 Misfet

Country Status (10)

Country Link
US (2) US6617653B1 (de)
EP (2) EP1286398B1 (de)
JP (1) JP3527503B2 (de)
KR (1) KR100708028B1 (de)
CN (1) CN100345306C (de)
AT (1) ATE341836T1 (de)
AU (1) AU1416701A (de)
DE (1) DE60031173T2 (de)
TW (1) TW475268B (de)
WO (1) WO2001093339A1 (de)

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CN1254026C (zh) * 2000-11-21 2006-04-26 松下电器产业株式会社 通信系统用仪器
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US6852602B2 (en) * 2001-01-31 2005-02-08 Matsushita Electric Industrial Co., Ltd. Semiconductor crystal film and method for preparation thereof
JP3811624B2 (ja) * 2001-04-27 2006-08-23 松下電器産業株式会社 半導体装置
US6995397B2 (en) 2001-09-14 2006-02-07 Matsushita Electric Industrial Co., Ltd. Semiconductor device
JP4463482B2 (ja) * 2002-07-11 2010-05-19 パナソニック株式会社 Misfet及びその製造方法
JP2004134547A (ja) * 2002-10-10 2004-04-30 Hitachi Ltd 半導体装置
JP2005005580A (ja) * 2003-06-13 2005-01-06 Renesas Technology Corp 半導体装置
US7473929B2 (en) * 2003-07-02 2009-01-06 Panasonic Corporation Semiconductor device and method for fabricating the same
US7410846B2 (en) 2003-09-09 2008-08-12 International Business Machines Corporation Method for reduced N+ diffusion in strained Si on SiGe substrate
CN1307707C (zh) * 2003-09-19 2007-03-28 中国科学院上海微系统与信息技术研究所 一种含镁锌氧的金属-绝缘层-半导体结构及制备工艺
US7074657B2 (en) * 2003-11-14 2006-07-11 Advanced Micro Devices, Inc. Low-power multiple-channel fully depleted quantum well CMOSFETs
GB0403934D0 (en) * 2004-02-21 2004-03-24 Koninkl Philips Electronics Nv Trench-gate semiconductor devices and the manufacture thereof
US7282782B2 (en) * 2004-03-12 2007-10-16 Hewlett-Packard Development Company, L.P. Combined binary oxide semiconductor device
JP4537750B2 (ja) * 2004-04-02 2010-09-08 シャープ株式会社 固体撮像素子およびその製造方法
JP3945519B2 (ja) * 2004-06-21 2007-07-18 東京エレクトロン株式会社 被処理体の熱処理装置、熱処理方法及び記憶媒体
US7667264B2 (en) * 2004-09-27 2010-02-23 Alpha And Omega Semiconductor Limited Shallow source MOSFET
KR100613294B1 (ko) * 2004-12-30 2006-08-21 동부일렉트로닉스 주식회사 단채널 효과가 개선되는 모스 전계효과 트랜지스터 및 그제조 방법
US7365382B2 (en) 2005-02-28 2008-04-29 Infineon Technologies Ag Semiconductor memory having charge trapping memory cells and fabrication method thereof
JP5055771B2 (ja) * 2005-02-28 2012-10-24 富士通セミコンダクター株式会社 半導体装置およびその製造方法
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JP5033316B2 (ja) * 2005-07-05 2012-09-26 日産自動車株式会社 半導体装置の製造方法
US8183595B2 (en) 2005-07-29 2012-05-22 International Rectifier Corporation Normally off III-nitride semiconductor device having a programmable gate
US8482035B2 (en) * 2005-07-29 2013-07-09 International Rectifier Corporation Enhancement mode III-nitride transistors with single gate Dielectric structure
JP2007096263A (ja) * 2005-08-31 2007-04-12 Denso Corp 炭化珪素半導体装置およびその製造方法。
CN100593243C (zh) 2005-10-19 2010-03-03 三菱电机株式会社 Mosfet以及mosfet的制造方法
US8258632B1 (en) * 2005-10-24 2012-09-04 Lawrence Livermore National Security, Llc Optically-initiated silicon carbide high voltage switch with contoured-profile electrode interfaces
CN101390223B (zh) * 2005-10-24 2012-02-01 劳伦斯利弗莫尔国家安全有限公司 光激发碳化硅高压开关
JP2009530843A (ja) 2006-03-20 2009-08-27 エスティーマイクロエレクトロニクス エス.アール.エル. 半導体電界効果トランジスタ、メモリセル、およびメモリ素子
US8269262B2 (en) * 2006-05-02 2012-09-18 Ss Sc Ip Llc Vertical junction field effect transistor with mesa termination and method of making the same
JP2008108785A (ja) * 2006-10-23 2008-05-08 Nec Electronics Corp 半導体装置およびその製造方法
US7795691B2 (en) * 2008-01-25 2010-09-14 Cree, Inc. Semiconductor transistor with P type re-grown channel layer
WO2009104299A1 (ja) * 2008-02-22 2009-08-27 住友電気工業株式会社 半導体装置および半導体装置の製造方法
US8841682B2 (en) 2009-08-27 2014-09-23 Cree, Inc. Transistors with a gate insulation layer having a channel depleting interfacial charge and related fabrication methods
WO2011118104A1 (ja) * 2010-03-23 2011-09-29 住友電気工業株式会社 半導体装置およびその製造方法
WO2012017798A1 (ja) * 2010-08-03 2012-02-09 住友電気工業株式会社 半導体装置およびその製造方法
TW201240016A (en) * 2011-03-25 2012-10-01 Taiwan Semiconductor Co Ltd Manufacturing method of semiconductor substrate
JP5699878B2 (ja) 2011-09-14 2015-04-15 住友電気工業株式会社 炭化珪素半導体装置およびその製造方法
JP2013069964A (ja) 2011-09-26 2013-04-18 Sumitomo Electric Ind Ltd 炭化珪素半導体装置
JP5764046B2 (ja) 2011-11-21 2015-08-12 住友電気工業株式会社 炭化珪素半導体装置の製造方法
JP6239250B2 (ja) * 2013-03-22 2017-11-29 株式会社東芝 半導体装置およびその製造方法
KR20140122328A (ko) * 2013-04-09 2014-10-20 에스케이하이닉스 주식회사 반도체 기판 및 제조 방법과, 이를 이용한 반도체 장치 및 제조 방법
JP6168945B2 (ja) * 2013-09-20 2017-07-26 株式会社東芝 半導体装置およびその製造方法
TWI626746B (zh) * 2014-04-03 2018-06-11 財團法人工業技術研究院 半導體結構
JP6526528B2 (ja) * 2015-09-11 2019-06-05 株式会社東芝 半導体装置
CN105470288B (zh) * 2015-10-14 2018-10-19 西安电子科技大学宁波信息技术研究院 Delta沟道掺杂SiC垂直功率MOS器件制作方法
CN110663105B (zh) * 2017-05-31 2023-06-06 三菱电机株式会社 半导体装置的制造方法
JP6791083B2 (ja) * 2017-09-28 2020-11-25 豊田合成株式会社 半導体装置の製造方法
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Also Published As

Publication number Publication date
EP1286398A4 (de) 2003-02-26
CN100345306C (zh) 2007-10-24
JP3527503B2 (ja) 2004-05-17
EP1684359A9 (de) 2006-12-27
EP1286398B1 (de) 2006-10-04
TW475268B (en) 2002-02-01
EP1286398A1 (de) 2003-02-26
EP1684359A2 (de) 2006-07-26
WO2001093339A1 (en) 2001-12-06
KR100708028B1 (ko) 2007-04-16
KR20020020949A (ko) 2002-03-16
US20030227061A1 (en) 2003-12-11
AU1416701A (en) 2001-12-11
DE60031173T2 (de) 2007-01-18
DE60031173D1 (de) 2006-11-16
US6617653B1 (en) 2003-09-09
US6864507B2 (en) 2005-03-08
CN1367937A (zh) 2002-09-04
EP1684359A3 (de) 2006-10-25

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