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MY125922A - Ic testing apparatus - Google Patents

Ic testing apparatus

Info

Publication number
MY125922A
MY125922A MYPI99001249A MYPI9901249A MY125922A MY 125922 A MY125922 A MY 125922A MY PI99001249 A MYPI99001249 A MY PI99001249A MY PI9901249 A MYPI9901249 A MY PI9901249A MY 125922 A MY125922 A MY 125922A
Authority
MY
Malaysia
Prior art keywords
testing apparatus
test
semiconductor device
dut
insert
Prior art date
Application number
MYPI99001249A
Inventor
Hiroto Nakamura
Noboru Saito
Original Assignee
Advantest Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advantest Corp filed Critical Advantest Corp
Publication of MY125922A publication Critical patent/MY125922A/en

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26—Testing of individual semiconductor devices
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0433—Sockets for IC's or transistors
    • G01R1/0483—Sockets for un-leaded IC's having matrix type contact fields, e.g. BGA or PGA devices; Sockets for unpackaged, naked chips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/01—Subjecting similar articles in turn to test, e.g. "go/no-go" tests in mass production; Testing objects at points as they pass through a testing station
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2893—Handling, conveying or loading, e.g. belts, boats, vacuum fingers

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Power Engineering (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Discharge Of Articles From Conveyors (AREA)

Abstract

AN IC TESTING APPARATUS PERFORMING A TEST BY PUSHING INPUT-OUTPUT TERMINALS HB OF A SEMICONDUCTOR DEVICE AGAINST CONTACT PINS 51 OF A TEST HEAD, WHEREIN AN INSERT 19 OF A TEST TRAY OF THE SEMICONDUCTOR DEVICE IS PROVIDED WITH HOLES 23 WITH WHICH THE SOLDER BALLS HB OF THE DUT FIT.FIG 10
MYPI99001249A 1998-04-02 1999-04-01 Ic testing apparatus MY125922A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10106923A JPH11287842A (en) 1998-04-02 1998-04-02 Ic tester

Publications (1)

Publication Number Publication Date
MY125922A true MY125922A (en) 2006-08-30

Family

ID=14445949

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI99001249A MY125922A (en) 1998-04-02 1999-04-01 Ic testing apparatus

Country Status (7)

Country Link
JP (1) JPH11287842A (en)
KR (1) KR100722643B1 (en)
CN (1) CN1171093C (en)
DE (1) DE19914775A1 (en)
MY (1) MY125922A (en)
SG (1) SG81268A1 (en)
TW (1) TW429316B (en)

Families Citing this family (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2002067000A1 (en) * 2001-02-21 2002-08-29 Advantest Corporation Insert for electronic component test device
JP2003066104A (en) 2001-08-22 2003-03-05 Advantest Corp Insert and electronic component handling apparatus having the same
AU2002236231A1 (en) * 2002-03-06 2003-09-16 Advantest Corporation Insert and electronic component handler comprising it
JP4043339B2 (en) 2002-10-22 2008-02-06 川崎マイクロエレクトロニクス株式会社 Test method and test apparatus
KR100613168B1 (en) 2004-10-01 2006-08-17 삼성전자주식회사 Insert block for testing semiconductor device
JP2006292727A (en) * 2005-03-18 2006-10-26 Alps Electric Co Ltd Semiconductor transfer tray, burn-in board using the same, inspection apparatus for burn-in test, burn-in test method, and semiconductor manufacturing method
KR100659153B1 (en) 2006-01-26 2006-12-19 삼성전자주식회사 Insert for semiconductor package having supporting substrate
KR100647494B1 (en) * 2006-03-29 2006-11-23 주식회사 엠디플렉스 Measurement device for the electronic circuit and the method for measuring of the same
US7522401B2 (en) * 2006-05-26 2009-04-21 Intel Corporation Static dissipative layer system and method
JP4927493B2 (en) * 2006-10-13 2012-05-09 株式会社エンプラス Socket for electrical parts
KR101093044B1 (en) * 2007-04-04 2011-12-13 니혼 하츠쵸 가부시키가이샤 Conductive contact holder and conductive contact unit
WO2008125011A1 (en) * 2007-04-12 2008-10-23 Semiconductor Testing Advanced Research Lab Inc. Method and apparatus for testing system-in-package devices, micro sd devices
US7545158B2 (en) * 2007-04-12 2009-06-09 Chroma Ate Inc. Method for testing system-in-package devices
JP2012163550A (en) * 2011-01-18 2012-08-30 Unitechno Inc Semiconductor conveyance fixture
JP2013137286A (en) * 2011-12-28 2013-07-11 Advantest Corp Electronic component testing device
TWI470233B (en) * 2012-09-28 2015-01-21 Taiwan Elite Nano Technology Corp Probe structure and manufacture thereof
KR102010275B1 (en) * 2013-04-03 2019-08-13 (주)테크윙 Handler for testing semiconductor
CN103412251A (en) * 2013-07-24 2013-11-27 昆山迈致治具科技有限公司 PCB performance detection jig with stroke-limiting mechanism
KR102220334B1 (en) * 2014-10-16 2021-02-25 세메스 주식회사 Insert assembly for receiving electronic device
JP6404104B2 (en) * 2014-12-11 2018-10-10 株式会社エンプラス Socket for electrical parts
CN106290990A (en) * 2015-06-10 2017-01-04 鸿劲科技股份有限公司 Can the positioner of the most electronic units fixes and the implement of application thereof
CN105929321B (en) * 2016-06-12 2023-03-03 深圳市斯纳达科技有限公司 Integrated circuit test equipment
JP6842355B2 (en) * 2017-04-28 2021-03-17 株式会社アドバンテスト Carrier for electronic component testing equipment
CN110572954A (en) * 2019-09-11 2019-12-13 苏州汇川技术有限公司 pin assembly guide and circuit board assembly
TWI760230B (en) * 2020-06-09 2022-04-01 台灣愛司帝科技股份有限公司 Chip-detecting method, chip-detecting structure and chip-carrying structure
CN113884511B (en) * 2021-09-28 2023-09-29 北京环境特性研究所 Material transmissivity test support and test system

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04199531A (en) * 1990-11-28 1992-07-20 Mitsubishi Electric Corp Measuring device for semiconductor
JPH05326757A (en) * 1990-12-18 1993-12-10 Toshiba Corp Ic socket
JPH06102311A (en) * 1992-09-21 1994-04-15 Kawasaki Steel Corp Test method and apparatus for semiconductor package
JPH07122625A (en) * 1993-10-22 1995-05-12 Sony Corp Positioning method for semiconductor device
WO1995034825A1 (en) * 1994-06-15 1995-12-21 Advantest Corporation Carrier of ic handler
KR0146216B1 (en) * 1995-04-24 1998-11-02 정문술 Loading, unloading apparatus of semiconductor detector
JP3644553B2 (en) * 1995-11-20 2005-04-27 株式会社アドバンテスト IC socket
JPH1058367A (en) * 1996-08-23 1998-03-03 Advantest Corp Ic carrying device
US6097201A (en) * 1997-10-31 2000-08-01 Kinetrix, Inc. System to simultaneously test trays of integrated circuit packages

Also Published As

Publication number Publication date
TW429316B (en) 2001-04-11
KR19990082895A (en) 1999-11-25
SG81268A1 (en) 2001-06-19
CN1171093C (en) 2004-10-13
DE19914775A1 (en) 1999-11-11
JPH11287842A (en) 1999-10-19
KR100722643B1 (en) 2007-05-28
CN1230691A (en) 1999-10-06

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