MY125628A - Ic testing apparatus - Google Patents
Ic testing apparatusInfo
- Publication number
- MY125628A MY125628A MYPI99001250A MYPI9901250A MY125628A MY 125628 A MY125628 A MY 125628A MY PI99001250 A MYPI99001250 A MY PI99001250A MY PI9901250 A MYPI9901250 A MY PI9901250A MY 125628 A MY125628 A MY 125628A
- Authority
- MY
- Malaysia
- Prior art keywords
- contact section
- testing apparatus
- semiconductor devices
- test
- ejecting
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/26—Testing of individual semiconductor devices
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
- G01R31/2887—Features relating to contacting the IC under test, e.g. probe heads; chucks involving moving the probe head or the IC under test; docking stations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Power Engineering (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
- Discharge Of Articles From Conveyors (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Abstract
AN IC TESTING APPARATUS PROVIDED WITH A FIRST SUCTION HEAD 304C FOR TRANSFERRING SEMICONDUCTOR DEVICES CONVEYED TO A FIRST POSITION CR5 IN A TEST PORTION TO A CONTACT SECTION 302A OF A TEST HEAD 302 FOR A TEST, THEN EJECTING THE SEMICONDUCTOR DEVICES FROM THE CONTACT SECTION 302A AND A SECOND SUCTION HEAD 304C FOR TRANSFERRING SEMICONDUCTOR DEVICES COVEYED TO A SECOND POSITION CR5 IN THE TEST PORTION TO THE CONTACT SECTION 302A, THEN EJECTING THE SEMICONDUCTORDEVICES FROM THE CONTACT SECTION 302A.(FIG.2)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10106913A JPH11287843A (en) | 1998-04-02 | 1998-04-02 | Ic-tester |
Publications (1)
Publication Number | Publication Date |
---|---|
MY125628A true MY125628A (en) | 2006-08-30 |
Family
ID=14445680
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
MYPI99001250A MY125628A (en) | 1998-04-02 | 1999-04-01 | Ic testing apparatus |
Country Status (7)
Country | Link |
---|---|
JP (1) | JPH11287843A (en) |
KR (1) | KR100722644B1 (en) |
CN (1) | CN1232184A (en) |
DE (1) | DE19914776A1 (en) |
MY (1) | MY125628A (en) |
SG (1) | SG81269A1 (en) |
TW (1) | TW429315B (en) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4566482B2 (en) * | 2001-09-07 | 2010-10-20 | ヤマハ発動機株式会社 | Parts testing equipment |
KR100440780B1 (en) * | 2002-01-23 | 2004-07-19 | 삼성테크윈 주식회사 | Apparatus placing electronic part on tray |
KR100679155B1 (en) * | 2005-01-25 | 2007-02-05 | (주)테크윙 | Test handler |
KR100714106B1 (en) | 2005-12-15 | 2007-05-02 | (주)테크윙 | Test handler and operation method of test handler |
CN101339204B (en) * | 2007-07-05 | 2010-10-27 | 京元电子股份有限公司 | Disc conveyer device |
KR101149334B1 (en) | 2007-10-31 | 2012-06-01 | 가부시키가이샤 아드반테스트 | An abnormality detecting apparatus for detecting abnormarlity at interface portion of contact arm, An electronic device testing apparatus and An electronic device testing system with the same, and An abnormality detecting method |
JP6069831B2 (en) * | 2011-12-16 | 2017-02-01 | 富士電機株式会社 | Semiconductor test equipment |
KR101428655B1 (en) * | 2013-02-08 | 2014-08-13 | 바이옵트로 주식회사 | Apparatus for testing |
CN109911541B (en) * | 2019-01-29 | 2021-06-25 | 迈克医疗电子有限公司 | Assembly line system |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4869636A (en) * | 1987-06-24 | 1989-09-26 | Reid-Ashman Manufacturing, Inc. | Handler for IC packages |
KR960007507B1 (en) * | 1990-10-08 | 1996-06-05 | 가부시끼가이샤 아드반테스트 | Ic test equipment |
US5307011A (en) * | 1991-12-04 | 1994-04-26 | Advantest Corporation | Loader and unloader for test handler |
JP3316075B2 (en) * | 1994-02-03 | 2002-08-19 | 株式会社アドバンテスト | Auto handler for IC test equipment |
US5588797A (en) * | 1994-07-18 | 1996-12-31 | Advantek, Inc. | IC tray handling apparatus and method |
JPH08170976A (en) * | 1994-09-06 | 1996-07-02 | Advantest Corp | Handler mechanism for semiconductor tester |
JP3412114B2 (en) * | 1995-07-26 | 2003-06-03 | 株式会社アドバンテスト | IC test equipment |
JPH09113581A (en) * | 1995-10-20 | 1997-05-02 | Advantest Corp | Ic testing device |
-
1998
- 1998-04-02 JP JP10106913A patent/JPH11287843A/en active Pending
-
1999
- 1999-03-23 TW TW088104556A patent/TW429315B/en not_active IP Right Cessation
- 1999-03-31 SG SG9901610A patent/SG81269A1/en unknown
- 1999-03-31 DE DE19914776A patent/DE19914776A1/en not_active Withdrawn
- 1999-04-01 MY MYPI99001250A patent/MY125628A/en unknown
- 1999-04-02 CN CN99104796A patent/CN1232184A/en active Pending
- 1999-04-02 KR KR1019990011643A patent/KR100722644B1/en not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
SG81269A1 (en) | 2001-06-19 |
CN1232184A (en) | 1999-10-20 |
KR19990082894A (en) | 1999-11-25 |
JPH11287843A (en) | 1999-10-19 |
DE19914776A1 (en) | 1999-11-25 |
TW429315B (en) | 2001-04-11 |
KR100722644B1 (en) | 2007-05-28 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CA2404183A1 (en) | Non-contact tester for integrated circuits | |
TW358997B (en) | Method and apparatus for performing operative testing on an IC | |
EP0699912A3 (en) | An apparatus, method, and wafer used for testing integrated circuits formed on a product wafer | |
GB9810225D0 (en) | Integrated circuit device tester | |
EP1045438B8 (en) | Probe card for testing semiconductor device, and semiconductor device test method | |
EP0841571A3 (en) | Wafer level burn-in base unit substrate and assembly | |
WO2005065258A3 (en) | Active wafer probe | |
ZA200003614B (en) | Two way field tester for EOT device. | |
GB2331408B (en) | Probe card for testing integrated circuit chips | |
EP0810655A3 (en) | A package for a semiconductor device | |
CH694831A5 (en) | Testing apparatus of prepackage singulated semiconductor die, has test unit in movable communication with electrical contact pad to make electrical contact with contact pad during testing of die | |
MY125628A (en) | Ic testing apparatus | |
WO2002095587A3 (en) | Method and apparatus for fault tolerant and flexible test signature generator | |
MY114471A (en) | Ic testing method and apparatus | |
TW338164B (en) | Integrated circuit wiring | |
SG79979A1 (en) | Semiconductor integrated circuit testing apparatus | |
TW345685B (en) | Semiconductor device with wafer burn-in and method therefor | |
DE50015164D1 (en) | connecting device | |
MY123345A (en) | Semiconductor device, its fabrication method and electronic device | |
EP0802418A3 (en) | Method for high-speed testing a semiconductor device | |
AU2002229555A1 (en) | Data carrier designed for contactless communication and having detection means for detecting a temperature prevailing in the data carrier | |
AU2018292A (en) | Process and device for testing and locating electrical short circuits for lines, especially for electric railway catenaries | |
TWI256122B (en) | Integrated circuit and associated packaged integrated circuit | |
TW344876B (en) | Carrier having interchangeable substrate used for testing of semiconductor dies | |
TW359019B (en) | Semiconductor device |