Luo et al., 2001 - Google Patents
Study on effect of coupling agents on underfill material in flip chip packagingLuo et al., 2001
- Document ID
- 10125811401885978595
- Author
- Luo S
- Wong C
- Publication year
- Publication venue
- IEEE Transactions on Components and Packaging Technologies
External Links
Snippet
Coupling agents are widely used in order to improve the adhesion property of underfill. In this study, three different silane coupling agents, two titanate coupling agents, and one zirconate coupling agent were added into an epoxy underfill material. Their effects on the …
- 239000007822 coupling agent 0 title abstract description 68
Classifications
-
- H—ELECTRICITY
- H01—BASIC ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/102—Material of the semiconductor or solid state bodies
- H01L2924/1025—Semiconducting materials
- H01L2924/10251—Elemental semiconductors, i.e. Group IV
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