The surface modification of synthesized nano-BaTiO 3 particles was carried out using γ-
aminopropyl trimethoxy silane (γ-APS) in an ethanol/water solution. The modified particles …

SiO 2 nanoparticles are attractive components for formulating highly filled underfill
adhesives in the electronic packaging field. However, achieving uniform dispersion of …

Epoxy-based anisotropic conductive adhesive film (ACF) joints have been used in a number
of interconnect applications, including direct chip attachment, ie, chip on glass, chip on …

One of the key materials used in flip chip packaging is the underfill encapsulant, which
enhances the reliability of the flip chip device by more than an order of magnitude. This …

This paper presents the challenges of a packaged MEMS-based multi sensor system that
allow for direct exposure of the sensing part to sea water. The system is part of a data …

Underfill materials are employed in flip-chip assemblies to enhance solder joint reliability
performance. We have studied the adhesion strength of two underfill samples with tin/lead …

In order to enhance the reliability of a flip chip on organic board package, underfill is usually
used to redistribute the thermomechanical stress created by the Coefficient of Thermal …

An underfill is used to fill the gap between the integrated circuit chip and substrate to
improve the solder joint fatigue life in flip-chip packaging. The influence of aging in an …

Plasma processing technology was introduced in flip chip to improve the interfacial
adhesion strength of silicon chip and underfill. The plasma treatment time was controlled to …

Individual microsystems and devices are made by, broadly speaking, lithographic
techniques with inorganic materials such as silicon, and techniques such as embossing and …