Luo et al., 2001 - Google Patents
Influence of temperature and humidity on adhesion of underfills for flip chip packagingLuo et al., 2001
- Document ID
- 6802865992893025051
- Author
- Luo S
- Wong C
- Publication year
- Publication venue
- 2001 Proceedings. 51st Electronic Components and Technology Conference (Cat. No. 01CH37220)
External Links
Snippet
This paper systematically discusses the influence of temperature and humidity on the adhesion performance of underfill material (epoxy cured with acid anhydride), evaluated by die shear test after exposure to various conditions. The adhesion strength between the …
- 238000004806 packaging method and process 0 title description 7
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; MISCELLANEOUS COMPOSITIONS; MISCELLANEOUS APPLICATIONS OF MATERIALS
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J179/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups C09J161/00 - C09J177/00
- C09J179/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
- C09J179/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
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