Lee et al., 2004 - Google Patents
Low-cycle fatigue characteristics of Sn-based solder jointsLee et al., 2004
View PDF- Document ID
- 8056008607533492945
- Author
- Lee K
- Yu J
- Park T
- Lee S
- Publication year
- Publication venue
- Journal of Electronic Materials
External Links
Snippet
Low-cycle, lap-shear fatigue behavior of Sn-based, Pb-free solder alloys, Sn-3.5 Ag, Sn-3.5 Ag-Cu, Sn-3.5 Ag-Bi, and Sn-0.7 Cu, were studied at room temperature using specimens with printed circuit board (PCB)/solder/PCB structure under total displacement of±10 µm, 12 …
- 229910000679 solder 0 title abstract description 66
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
- B23K35/262—Sn as the principal constituent
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