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Chowdhury et al., 2017 - Google Patents

Evolution of the Cyclic Stress-Strain Behavior of Doped SAC Solder Materials Subjected to Isothermal Aging

Chowdhury et al., 2017

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Document ID
16562293494638567425
Author
Chowdhury M
Fu N
Suhling J
Lall P
Publication year
Publication venue
2017 16th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)

External Links

Snippet

Solder joints in electronic packages are frequently exposed to thermal cycling. Such exposures can occur in real life applications as well as in accelerated thermal cycling tests used for the fatigue behavior characterization. Due to the CTE mismatches of the assembly …
Continue reading at www.researchgate.net (PDF) (other versions)

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/262—Sn as the principal constituent

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