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A bounded 2D contour searching algorithm for floorplan design with arbitrarily shaped rectilinear and soft modules

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Tsu-chang LeeAuthors Info & Claims

DAC '93: Proceedings of the 30th international Design Automation Conference

Pages 525 - 530

https://doi.org/10.1145/157485.165014

Published: 01 July 1993 Publication History

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References

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Tsu-chang Lee, "Multiple-Layer Contour Searching Method and Apparatus for Circuit Building Block Placement", US patent pending.

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Cited By

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LaPaugh A(2010)VLSI layout algorithmsAlgorithms and theory of computation handbook10.5555/1882723.1882731(8-8)Online publication date: 1-Jan-2010
https://dl.acm.org/doi/10.5555/1882723.1882731
Chu CYoung E(2006)Nonrectangular shaping and sizing of soft modules for floorplan-design improvementIEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems10.1109/TCAD.2003.81989623:1(71-79)Online publication date: 1-Nov-2006
https://dl.acm.org/doi/10.1109/TCAD.2003.819896
Young FWong MYang H(2006)On extending slicing floorplan to handle L/T-shaped modules and abutment constraintsIEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems10.1109/43.92483320:6(800-807)Online publication date: 1-Nov-2006
https://dl.acm.org/doi/10.1109/43.924833
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Index Terms

A bounded 2D contour searching algorithm for floorplan design with arbitrarily shaped rectilinear and soft modules
1. Hardware
  1. Electronic design automation
    1. Physical design (EDA)
  2. Very large scale integration design
2. Mathematics of computing
  1. Probability and statistics
    1. Probabilistic algorithms
    2. Probabilistic reasoning algorithms
      1. Markov-chain Monte Carlo methods
      2. Sequential Monte Carlo methods

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On extending slicing floorplan to handle L/T-shaped modules and abutment constraints

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Published In

DAC '93: Proceedings of the 30th international Design Automation Conference

July 1993

768 pages

ISBN:0897915771

DOI:10.1145/157485

Chairman:
Alfred E. Dunlop
AT&T Bell Labs., Murray Hill, NJ

Permission to make digital or hard copies of all or part of this work for personal or classroom use is granted without fee provided that copies are not made or distributed for profit or commercial advantage and that copies bear this notice and the full citation on the first page. Copyrights for components of this work owned by others than ACM must be honored. Abstracting with credit is permitted. To copy otherwise, or republish, to post on servers or to redistribute to lists, requires prior specific permission and/or a fee. Request permissions from [email protected]

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Association for Computing Machinery

New York, NY, United States

Publication History

Published: 01 July 1993

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EDAC
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DAC93: The 30th ACM/IEEE Design Automation Conference

June 14 - 18, 1993

Texas, Dallas, USA

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Overall Acceptance Rate 1,770 of 5,499 submissions, 32%

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Cited By

View all

LaPaugh A(2010)VLSI layout algorithmsAlgorithms and theory of computation handbook10.5555/1882723.1882731(8-8)Online publication date: 1-Jan-2010
https://dl.acm.org/doi/10.5555/1882723.1882731
Chu CYoung E(2006)Nonrectangular shaping and sizing of soft modules for floorplan-design improvementIEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems10.1109/TCAD.2003.81989623:1(71-79)Online publication date: 1-Nov-2006
https://dl.acm.org/doi/10.1109/TCAD.2003.819896
Young FWong MYang H(2006)On extending slicing floorplan to handle L/T-shaped modules and abutment constraintsIEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems10.1109/43.92483320:6(800-807)Online publication date: 1-Nov-2006
https://dl.acm.org/doi/10.1109/43.924833
Xu JGuo PCheng C(2006)Sequence-pair approach for rectilinear module placementIEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems10.1109/43.75293118:4(484-493)Online publication date: 1-Nov-2006
https://dl.acm.org/doi/10.1109/43.752931
Nakatake SFujiyoshi KMurata HKajitani Y(2006)Module packing based on the BSG-structure and IC layout applicationsIEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems10.1109/43.70383217:6(519-530)Online publication date: 1-Nov-2006
https://dl.acm.org/doi/10.1109/43.703832
Wu GChang YChang Y(2003)Rectilinear block placement using B*-treesACM Transactions on Design Automation of Electronic Systems10.1145/762488.7624908:2(188-202)Online publication date: 1-Apr-2003
https://dl.acm.org/doi/10.1145/762488.762490
Lin JChen HChang Y(2002)Arbitrary Convex and Concave Rectilinear Module Packing Using TCGProceedings of the conference on Design, automation and test in Europe10.5555/882452.874389Online publication date: 4-Mar-2002
https://dl.acm.org/doi/10.5555/882452.874389
Lin JChen HChang Y(2002)Arbitrarily shaped rectilinear module placement using the transitive closure graph representationIEEE Transactions on Very Large Scale Integration (VLSI) Systems10.1109/TVLSI.2002.80843110:6(886-901)Online publication date: 1-Dec-2002
https://dl.acm.org/doi/10.1109/TVLSI.2002.808431
Jai-Ming Lin Hsin-Lung Chen Yao-Wen Chang (2002)Arbitrary convex and concave rectilinear module packing using TCGProceedings 2002 Design, Automation and Test in Europe Conference and Exhibition10.1109/DATE.2002.998251(69-75)Online publication date: 2002
https://doi.org/10.1109/DATE.2002.998251
Liao SLopez MMehta D(2001)Constrained polygon transformations for incremental floorplanningACM Transactions on Design Automation of Electronic Systems10.1145/383251.3832556:3(322-342)Online publication date: 1-Jul-2001
https://dl.acm.org/doi/10.1145/383251.383255
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Arbitrarily shaped rectilinear module placement using the transitive closure graph representation

On extending slicing floorplan to handle L/T-shaped modules and abutment constraints

Nonrectangular shaping and sizing of soft modules for floorplan-design improvement