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Microelectronics Reliability, Volume 63
Volume 63, August 2016
- Bruna Cardoso Paz, Mikaël Cassé, Sylvain Barraud, Gilles Reimbold, Olivier Faynot, F. Avila-Herrera, Antonio Cerdeira, Marcelo Antonio Pavanello:
Drain current model for short-channel triple gate junctionless nanowire transistors. 1-10 - Kuo-Hsuan Meng, Zaichen Chen, Elyse Rosenbaum:
Compact distributed multi-finger MOSFET model for circuit-level ESD simulation. 11-21 - Li-Lung Lai, Xiaojing Wu:
Applications of the pulsed current-voltage (I-V) and capacitance-voltage (C-V) techniques for high-resistive gates in MOSFETs. 22-30 - Yow-Jon Lin, Yu-Ju Chu:
Temperature-dependent resistive switching characteristics for Au/n-type CuAlOx/heavily doped p-type Si devices. 31-36 - Ran Jiang
, Zuyin Han, Xianghao Du:
Reliability/Uniformity improvement induced by an ultrathin TiO2 insertion in Ti/HfO2/Pt resistive switching memories. 37-41 - M. S. Hadi, Nobuyuki Sugii
Resistive switching properties of a thin SiO2 layer with CeOx buffer layer on n+ and p+ Si bottom electrodes. 42-45 - Xiang Zheng
Identifying the spatial position and properties of traps in GaN HEMTs using current transient spectroscopy. 46-51 - J. Chen, Hitoshi Wakabayashi, Kazuo Tsutsui, Hiroshi Iwai, Kuniyuki Kakushima:
Poly-Si gate electrodes for AlGaN/GaN HEMT with high reliability and low gate leakage current. 52-55 - V. S. Pershenkov, Alexander S. Bakerenkov, V. A. Felitsyn, A. S. Rodin, V. A. Telets, V. V. Belyakov:
ELDRS in SiGe transistors for room and low-temperature irradiation. 56-59 - Faiz Rahman, Jason T. Wright:
Pump chip and phosphor reliability of broadband light-emitting diodes. 60-67 - Tzu-Hao Wang, Hsuan Lee, Chih-Ming Chen
Microstructural and thermal characterizations of light-emitting diode employing a low-temperature die-bonding material. 68-75 - Sung-Uk Zhang
Chip package interaction for LED packages. 76-81 - Mohammad Tariq Jan, Farooq Ahmad, Nor Hisham Hamid, Mohd Haris M. Khir, Muhammad Shoaib
Experimental investigation of temperature and relative humidity effects on resonance frequency and quality factor of CMOS-MEMS paddle resonator. 82-89 - Giacomo Garegnani
Wafer level measurements and numerical analysis of self-heating phenomena in nano-scale SOI MOSFETs. 90-96 - Muhammad Nawaz:
Evaluation of SiC MOSFET power modules under unclamped inductive switching test environment. 97-103 - David Berry
Thermal characterization of planar high temperature power module packages with sintered nanosilver interconnection. 104-110 - Meng-Kao Yeh, Chun-Lin Lu:
Reliability analysis of 3D heterogeneous microsystem module by simplified finite element model. 111-119 - Dae Up Kim, Kwang-Seok Kim
Effects of oxidation on reliability of screen-printed silver circuits for radio frequency applications. 120-124 - Seyed Amir Paknejad
Microstructural evolution of sintered silver at elevated temperatures. 125-133 - Kenny Mahan
Modified single cantilever adhesion test for EMC/PSR interface in thin semiconductor packages. 134-141 - Wei Feng, Tung Thanh Bui
Fabrication and stress analysis of annular-trench-isolated TSV. 142-147 - Xiang Liu, Hehe Hu, Ce Ning, Guangliang Shang, Wei Yang, Ke Wang, Xinhong Lu, Woobong Lee, Gang Wang, Jianshe Xue, Jung mok Jun, Shengdong Zhang
Investigation into sand mura effects of a-IGZO TFT LCDs. 148-151 - Masanori Usui
Degradation of a sintered Cu nanoparticle layer studied by synchrotron radiation computed laminography. 152-158 - Mohsen H. Al-Rashed
Investigation on the CPU nanofluid cooling. 159-165 - Angel Ochoa Brezmes, Cornelia Breitkopf:
Mechanical analysis of wafer testing with FEM simulations. 166-182 - Si Chen
Protrusion of electroplated copper filled in through silicon vias during annealing process. 183-193 - Se-Hoon Park, Jong Chul Park, Jae-Yong Park, Young-Ho Kim:
Drop-shock reliability improvement of embedded chip resistor packages through via structure modification. 194-200 - Michael J. Mutch, Thomas Pomorski, Brad C. Bittel, Corey J. Cochrane, Patrick M. Lenahan, Xin Liu, Robert J. Nemanich
Band diagram for low-k/Cu interconnects: The starting point for understanding back-end-of-line (BEOL) electrical reliability. 201-213 - Adeline B. Y. Lim, Chris B. Boothroyd, Oranna Yauw, Bob Chylak, Chee Lip Gan
Interfacial evolution and bond reliability in thermosonic Pd coated Cu wire bonding on aluminum metallization: Effect of palladium distribution. 214-223 - Bakhtiar Ali
Impact toughness, hardness and shear strength of Fe and Bi added Sn-1Ag-0.5Cu lead-free solders. 224-230 - Manodipan Sahoo
Modeling and analysis of crosstalk induced overshoot/undershoot effects in multilayer graphene nanoribbon interconnects and its impact on gate oxide reliability. 231-238 - Aibin Yan, Huaguo Liang, Zhengfeng Huang, Cuiyun Jiang, Yiming Ouyang, Xuejun Li:
An SEU resilient, SET filterable and cost effective latch in presence of PVT variations. 239-250 - Carlos Sánchez-Azqueta
High-resolution wide-band LC-VCO for reliable operation in phase-locked loops. 251-255 - Hossein Moradian, Jeong-A Lee, Adnan Hashmi:
Self-repairing radix-2 signed-digit adder with multiple error detection, correction, and fault localization. 256-266 - Bahareh J. Farahani
PVTA-aware approximate custom instruction extension technique: A cross-layer approach. 267-277 - Shanshan Liu, Liyi Xiao, Zhigang Mao:
Extend orthogonal Latin square codes for 32-bit data protection in memory applications. 278-283 - Yongwoo Kwon, Byoungnam Park, Heesun Yang, Jin-Ha Hwang, Dae-Hwan Kang, Hongsik Jeong, Yunheub Song:
Modeling of data retention statistics of phase-change memory with confined- and mushroom-type cells. 284-290 - Atin Mukherjee
Choice of granularity for reliable circuit design using dynamic reconfiguration. 291-303 - Zahra Shirmohammadi
On designing an efficient numerical-based forbidden pattern free crosstalk avoidance codec for reliable data transfer of NoCs. 304-313 - Pedro Reviriego, Mustafa Demirci, Jesús Tabero
DMR +: An efficient alternative to TMR to protect registers in Xilinx FPGAs. 314-318 - Chong Leong Gan
3D Stacked Chips: from Emerging Processes to Heterogeneous Systems. Springer (2016), ISBN: 978-3-319-20481-9. 319-320 - Michael G. Pecht, Tadahiro Shibutani, Myeongsu Kang, Melinda Hodkiewicz
A fusion prognostics-based qualification test methodology for microelectronic products. 320-324 - Antonio Cerdeira, Magali Estrada, Lluís F. Marsal, Josep Pallarès, Benjamín Iñíguez:
On the series resistance in staggered amorphous thin film transistors. 325-335 - Martin Schneider-Ramelow, Christian Ehrhardt:
The reliability of wire bonding using Ag and Al. 336-341 - Mika Maaspuro:
Piezoelectric oscillating cantilever fan for thermal management of electronics and LEDs - A review. 342-353
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