• case-insensitive prefix search: default
  e.g., sig matches "SIGIR" as well as "signal"
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  e.g., graph$ matches "graph", but not "graphics"
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Update May 7, 2017: Please note that we had to disable the phrase search operator (.) and the boolean not operator (-) due to technical problems. For the time being, phrase search queries will yield regular prefix search result, and search terms preceded by a minus will be interpreted as regular (positive) search terms.

found 45 matches

• 2016
• 
  Mohsen H. Al-Rashed, Grzegorz Dzido, Mateusz Korpys, Jacek Smolka, Janusz Wójcik:
  Investigation on the CPU nanofluid cooling. Microelectron. Reliab. 63: 159-165 (2016)
• 
  Bakhtiar Ali, Mohd Faizul Mohd Sabri, Iswadi Jauhari, Nazatul Liana Sukiman:
  Impact toughness, hardness and shear strength of Fe and Bi added Sn-1Ag-0.5Cu lead-free solders. Microelectron. Reliab. 63: 224-230 (2016)
• 
  David Berry, Adrian Townsend, Weikun He, Hanguang Zheng, Khai D. T. Ngo, Guo-Quan Lu:
  Thermal characterization of planar high temperature power module packages with sintered nanosilver interconnection. Microelectron. Reliab. 63: 104-110 (2016)
• 
  Angel Ochoa Brezmes, Cornelia Breitkopf:
  Mechanical analysis of wafer testing with FEM simulations. Microelectron. Reliab. 63: 166-182 (2016)
• 
  Antonio Cerdeira, Magali Estrada, Lluís F. Marsal, Josep Pallarès, Benjamín Iñíguez:
  On the series resistance in staggered amorphous thin film transistors. Microelectron. Reliab. 63: 325-335 (2016)
• 
  Si Chen, Fei Qin, Tong An, Pei Chen, Bin Xie, Xunqing Shi:
  Protrusion of electroplated copper filled in through silicon vias during annealing process. Microelectron. Reliab. 63: 183-193 (2016)
• 
  J. Chen, Hitoshi Wakabayashi, Kazuo Tsutsui, Hiroshi Iwai, Kuniyuki Kakushima:
  Poly-Si gate electrodes for AlGaN/GaN HEMT with high reliability and low gate leakage current. Microelectron. Reliab. 63: 52-55 (2016)
• 
  Bahareh J. Farahani, Saeed Safari, Nader Sehatbakhsh:
  PVTA-aware approximate custom instruction extension technique: A cross-layer approach. Microelectron. Reliab. 63: 267-277 (2016)
• 
  Wei Feng, Tung Thanh Bui, Naoya Watanabe, Haruo Shimamoto, Masahiro Aoyagi, Katsuya Kikuchi:
  Fabrication and stress analysis of annular-trench-isolated TSV. Microelectron. Reliab. 63: 142-147 (2016)
• 
  Chong Leong Gan, Uda Hashim:
  3D Stacked Chips: from Emerging Processes to Heterogeneous Systems. Springer (2016), ISBN: 978-3-319-20481-9. Microelectron. Reliab. 63: 319-320 (2016)
• 
  Giacomo Garegnani, Vincent Fiori, Gilles Gouget, Frederic Monsieur, Clément Tavernier:
  Wafer level measurements and numerical analysis of self-heating phenomena in nano-scale SOI MOSFETs. Microelectron. Reliab. 63: 90-96 (2016)
• 
  M. S. Hadi, Nobuyuki Sugii, Hitoshi Wakabayashi, Kazuo Tsutsui, Hiroshi Iwai, Kuniyuki Kakushima:
  Resistive switching properties of a thin SiO₂ layer with CeO_x buffer layer on n⁺ and p⁺ Si bottom electrodes. Microelectron. Reliab. 63: 42-45 (2016)
• 
  Mohammad Tariq Jan, Farooq Ahmad, Nor Hisham Hamid, Mohd Haris M. Khir, Muhammad Shoaib, Khalid Ashraf:
  Experimental investigation of temperature and relative humidity effects on resonance frequency and quality factor of CMOS-MEMS paddle resonator. Microelectron. Reliab. 63: 82-89 (2016)
• 
  Ran Jiang, Zuyin Han, Xianghao Du:
  Reliability/Uniformity improvement induced by an ultrathin TiO₂ insertion in Ti/HfO₂/Pt resistive switching memories. Microelectron. Reliab. 63: 37-41 (2016)
• 
  Dae Up Kim, Kwang-Seok Kim, Seung-Boo Jung:
  Effects of oxidation on reliability of screen-printed silver circuits for radio frequency applications. Microelectron. Reliab. 63: 120-124 (2016)
• 
  Yongwoo Kwon, Byoungnam Park, Heesun Yang, Jin-Ha Hwang, Dae-Hwan Kang, Hongsik Jeong, Yunheub Song:
  Modeling of data retention statistics of phase-change memory with confined- and mushroom-type cells. Microelectron. Reliab. 63: 284-290 (2016)
• 
  Li-Lung Lai, Xiaojing Wu:
  Applications of the pulsed current-voltage (I-V) and capacitance-voltage (C-V) techniques for high-resistive gates in MOSFETs. Microelectron. Reliab. 63: 22-30 (2016)
• 
  Adeline B. Y. Lim, Chris B. Boothroyd, Oranna Yauw, Bob Chylak, Chee Lip Gan, Zhong Chen:
  Interfacial evolution and bond reliability in thermosonic Pd coated Cu wire bonding on aluminum metallization: Effect of palladium distribution. Microelectron. Reliab. 63: 214-223 (2016)
• 
  Yow-Jon Lin, Yu-Ju Chu:
  Temperature-dependent resistive switching characteristics for Au/n-type CuAlO_x/heavily doped p-type Si devices. Microelectron. Reliab. 63: 31-36 (2016)
• 
  Xiang Liu, Hehe Hu, Ce Ning, Guangliang Shang, Wei Yang, Ke Wang, Xinhong Lu, Woobong Lee, Gang Wang, Jianshe Xue, Jung mok Jun, Shengdong Zhang:
  Investigation into sand mura effects of a-IGZO TFT LCDs. Microelectron. Reliab. 63: 148-151 (2016)
• 
  Shanshan Liu, Liyi Xiao, Zhigang Mao:
  Extend orthogonal Latin square codes for 32-bit data protection in memory applications. Microelectron. Reliab. 63: 278-283 (2016)
• 
  Mika Maaspuro:
  Piezoelectric oscillating cantilever fan for thermal management of electronics and LEDs - A review. Microelectron. Reliab. 63: 342-353 (2016)
• 
  Kenny Mahan, Byung Kim, Bulong Wu, Bongtae Han, Ilho Kim, Hojeong Moon, Young Nam Hwang:
  Modified single cantilever adhesion test for EMC/PSR interface in thin semiconductor packages. Microelectron. Reliab. 63: 134-141 (2016)
• 
  Kuo-Hsuan Meng, Zaichen Chen, Elyse Rosenbaum:
  Compact distributed multi-finger MOSFET model for circuit-level ESD simulation. Microelectron. Reliab. 63: 11-21 (2016)
• 
  Hossein Moradian, Jeong-A Lee, Adnan Hashmi:
  Self-repairing radix-2 signed-digit adder with multiple error detection, correction, and fault localization. Microelectron. Reliab. 63: 256-266 (2016)
• 
  Atin Mukherjee, Anindya Sundar Dhar:
  Choice of granularity for reliable circuit design using dynamic reconfiguration. Microelectron. Reliab. 63: 291-303 (2016)
• 
  Michael J. Mutch, Thomas Pomorski, Brad C. Bittel, Corey J. Cochrane, Patrick M. Lenahan, Xin Liu, Robert J. Nemanich, Justin Brockman, Marc French, Markus Kuhn, Benjamin French, Sean W. King:
  Band diagram for low-k/Cu interconnects: The starting point for understanding back-end-of-line (BEOL) electrical reliability. Microelectron. Reliab. 63: 201-213 (2016)
• 
  Muhammad Nawaz:
  Evaluation of SiC MOSFET power modules under unclamped inductive switching test environment. Microelectron. Reliab. 63: 97-103 (2016)
• 
  Seyed Amir Paknejad, Ali Mansourian, Julian Greenberg, Khalid Khtatba, Linde Van Parijs, Samjid H. Mannan:
  Microstructural evolution of sintered silver at elevated temperatures. Microelectron. Reliab. 63: 125-133 (2016)
• 
  Se-Hoon Park, Jong Chul Park, Jae-Yong Park, Young-Ho Kim:
  Drop-shock reliability improvement of embedded chip resistor packages through via structure modification. Microelectron. Reliab. 63: 194-200 (2016)

skipping 15 more matches