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The Cmos Inverter: Slides Adapted From: N. Weste, D. Harris, CMOS VLSI Design,, 3/e, 2004

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The CMOS

Inverter
Slides adapted from:
N. Weste, D. Harris, CMOS VLSI Design,
Addison-Wesley, 3/e, 2004

Outline

Robustness of CMOS Inverter The Static Behavior

Performance of CMOS Inverter Dynamic Behavior

Switching threshold
Noise Margins
Propagation delay

Power Dissipation

Static dissipation
Dynamic dissipation
2

Q&A
1.
2.
3.
4.
5.
6.

If the width of a transistor increases, the current will


increase
decrease
not change
If the length of a transistor increases, the current will
increase
decrease
not change
If the supply voltage of a chip increases, the maximum transistor current will
increase
decrease
not change
If the width of a transistor increases, its gate capacitance will
increase
decrease
not change
If the length of a transistor decreases, its gate capacitance will
increase
decrease
not change
If the supply voltage of a chip increases, the gate capacitance of each
transistor will
increase
decrease
not change
3

Q&A
1.
2.
3.
4.
5.
6.

If the width of a transistor increases, the current will


increase
decrease
not change
If the length of a transistor increases, the current will
increase
decrease
not change
If the supply voltage of a chip increases, the maximum transistor current will
increase
decrease
not change
If the width of a transistor increases, its gate capacitance will
increase
decrease
not change
If the length of a transistor increases, its gate capacitance will
increase
decrease
not change
If the supply voltage of a chip increases, the gate capacitance of each
transistor will
increase
decrease
not change
4

CMOS Inverter Static Behavior:


DC Analysis

CMOS Inverter: DC Analysis

DC Response: Vout vs. Vin for a gate

Inverter

When Vin = 0

Vout = VDD

When Vin = VDD

Vout = 0

In between, Vout depends on transistor current

By KCL, must settle such that


Idsn = |Idsp|
We can solve equations
Graphical solution gives very good insight

Transistors operation regions

Current depends on transistors operation region


For what Vin and Vout are nMOS and pMOS in

Cutoff ?
Linear ?
Saturation ?

nMOS and pMOS operation

Vgsn = Vin

Vgsp = Vin - VDD

Vdsn = Vout

Vdsp = Vout - VDD

Graphical derivation of the inverter DC


response: I-V Characteristics

Make pMOS wider than nMOS such that n = p

For simplicity lets assume Vtn=Vtp

Graphical derivation of the inverter DC


response: current vs. Vout, Vin
Load Line Analysis:
For a given Vin:
Plot Idsn, Idsp vs. Vout
Vout must be where |currents| are equal

10

Graphical derivation of the inverter DC


response: Load Line Analysis

Vin = 0
Vin0

Idsn, |Idsp|

Vin0
Vout

VDD
11

Graphical derivation of the inverter DC


response: Load Line Analysis

Idsn, |Idsp|

Vin = 0.2 VDD

Vin1

Vin1
Vout

VDD
12

Graphical derivation of the inverter DC


response: Load Line Analysis

Vin = 0.4 VDD

Idsn, |Idsp|
Vin2
Vin2
Vout

VDD
13

Graphical derivation of the inverter DC


response: Load Line Analysis

Vin = 0.6 VDD

Idsn, |Idsp|
Vin3
Vin3
Vout

VDD
14

Graphical derivation of the inverter DC


response: Load Line Analysis

Vin = 0.8 VDD

Vin4

Idsn, |Idsp|

Vin4
Vout

VDD
15

Graphical derivation of the inverter DC


response: Load Line Analysis

Vin = VDD
Vin0

Idsn, |Idsp|

Vin5

Vin1
Vin2
Vin3
Vin4
Vout

VDD
16

DC Transfer Curve

Transcribe points onto Vin vs. Vout plot

17

DC transfer curve: operating regions

18

Beta Ratio

If p / n 1, switching point will move from VDD/2

Called skewed gate

19

Noise Margins

How much noise can a gate input see before it does not
recognize the input ?

20

Noise Margins

To maximize noise margins, select logic levels at unity gain


point of DC transfer characteristic

21

DC parameters

Input switching threshold: VTH


Minimum high output voltage: VOH
Maximum low output voltage: VOL
Minimum HIGH input voltage: VIH
Maximum LOW input voltage: VIL

22

CMOS Inverter Dynamic Behavior:


AC Analysis
DC analysis tells Vout if Vin is constant
AC analysis tells Vout(t) if Vin(t) changes
Requires solving differential equations
Input is usually considered to be a step
or ramp from 0 to VDD or vice versa

23

CMOS Inverter Dynamic Behavior:


AC Analysis

The switching characteristic (Vout(t) given Vin(t)) of a logic gate


tells the speed at which the gate can operate
The switching speed of a logic gate can be measured in terms of
the time required to charge and discharge a capacitive load
Critical paths
Timing Analyzers automatically finds the slowest paths in a logic
design
Critical paths can be affected at various levels:
Architecture/ Microarchitecture Level
Logic Level
Circuit Level
Layout level
24

Inverter Step Response

Find step response of inverter driving load cap

Vin (t ) u(t t0 )VDD

Vin(t)

Vout (t t0 ) VDD

Vout(t)
Cload

dVout (t )
I dsn (t )

dt
Cload

I dsn (t )

VDD V

Vin(t)

t t0

Idsn(t)

Vout VDD Vt

V (t )
VDD Vt out
Vout (t ) Vout VDD Vt
2

Vout(t)
t0

t
25

Delay Parameters

tr: rise time

tf: fall time

From input crossing VDD/2 to rising output crossing V DD/2

tpdf: falling propagation delay

From output crossing 0.8 VDD to 0.2 VDD

tpdr: rising propagation delay

From output crossing 0.2 VDD to 0.8 VDD

From input crossing VDD/2 to falling output crossing VDD/2

tpd: average propagation delay

tpd = (tpdr + tpdf)/2


26

Delay Parameters cont.

tr, tf

Tells how steep can be the waveform that the


logic gate is able to provide at its output

tpdr, tpdf

Input-to-output delay of the logic gate (time


needed for the output to respond to a change
in the input)

27

Factors affecting delay

CLOAD (= Cintrinsic + Cextrinsic)


intrinsic capacitance
(parasitic capacitance of the driving logic gate)
extrinsic capacitance
(interconnect capacitance + capacitance of the stage driven)

Slope of the input waveform


As the voltage on the gate terminal of a transistor change so
does its capacitance

28

Simulated Inverter Delay

Solving differential equations by hand is too hard


SPICE simulator solves the equations numerically
Uses more accurate I-V models too!
But simulations take time to write
It is important to develop back of the envelope techniques to rapidly
estimate delay, understand its origin, and figure out how it can be
reduced
2.0

1.5

1.0
(V)

Vin

tpdf = 66ps

tpdr = 83ps

Vout

0.5

0.0
0.0

200p

400p

600p
t(s)

800p

1n

29

Delay Estimation

We would like to be able to easily estimate delay


Not as accurate as simulation
But easier to ask What if ?
The step response usually looks like a 1 st order RC response
with a decaying exponential.
Use RC delay models to estimate delay
C = total capacitance on output node
Use effective resistance R
So that tpd = RC
Characterize transistors by finding their effective R
Depends on average current as gate switches
30

RC Delay Models

Use equivalent circuits for MOS transistors


Ideal switch + capacitance and ON resistance
Unit nMOS has resistance R, capacitance C
Unit pMOS has resistance 2R, capacitance C
Capacitance proportional to width
Resistance inversely proportional to width
d

d
k
s

s
kC

R/k
g

kC

kC
s

d
k
s

kC
2R/k

kC
kC
d
31

Power Dissipation

Static CMOS gates are very power-efficient because


they dissipate nearly zero power while idle

Instantaneous power:

P i DD (t) VDD
T

Energy consumed:

E i DD VDD dt
0

Average power:

Pavg

1
i DD VDD dt
T0

32

Power Dissipation

Power dissipation in CMOS circuits comes from two


components:

Static Dissipation
Subtreshold conduction
Tunneling current
Leakage through reverse biased diodes

Dynamic Dissipation
Charging and discharging (switching) of the load capacitance
Short-Circuit current while both pMOS and nMOS networks are
partially ON
33

Static Dissipation

Pstatic VDD I leakage

OFF transistors still conduct a small amount of current :


Sub threshold current
Current through reverse biased diodes
gate tunneling current

In 130 nm processes and beyond leakage is becoming


a major design issue and vendors now provide leakage
data (often in the form of nA/m of gate length)
34

Dynamic Dissipation
T

Pdynamic

1
VDD
Psw Psc i DD (t) VDD dt
i DD (t)dt

T0
T 0

Assuming a logic gate goes through one complete charge/discharge cycle


every clock cycle:
2
Psw C VDD
f clock

Because most gates do not switch every clock cycle, we introduce a corrective
activity factor :
2
Psw C VDD
f clock

A clock has =1 because it rises and fall every cycle, but most data have a
maximum activity factor =0.5 because they transition only once every cycle

35

Dynamic Dissipation

Because, input rise/fall time is greater than zero, both


nMOS and pMOS will be ON for a short period of time
(while the input is between Vtn and VDD-|Vtp|)
This results in a short-circuit current pulse from VDD
to GND
Typically this increases power dissipation by about
10%

36

Low Power Design

Power Dissipation is a major problem !!!

37

Dynamic Power Reduction

Decrease activity factor

Decrease switching capacitance

Small transistors
Careful floor planning to reduce interconnect

Decrease power supply

Selective clock gating


Drawback: if the system transitions rapidly from an idle
mode to a fully active mode a large di/dt spike will
occur

Adjust voltage depending on the operating mode

Decrease operating frequency


38

Static Power Reduction

Subthreshold current can be reduced by increasing Vt

Selective application of multiple threshold


(low-Vt transistors on critical paths, high Vt transistors
on other paths)
Control Vt through the body voltage

39

Static Power Reduction cont.

Turn off the power supply entirely.


MTCMOS circuits use low Vt
transistors for computation and
high Vt transistor as a switch to
disconnect the power supply
during idle mode

The leakage through two series


OFF transistor is much lower (1020x) than that of a single
transistor (stack effect)
40

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