1#

Product Family Data Sheet_ Horticulture Lighting Group_ Rev.2.0 19.08.22

Middle Power LED Series

3030

LM301B
CRI 80
For
Horticulture Lighting Group

Features & Benefits

 0.3 W class middle power LED
 Mold resin for high reliability
 Standard form factor for design flexibility (3.0 × 3.0 mm)
 2

Table of Contents

1. Characteristics ----------------------- 3

2. Product Code Information ----------------------- 5

3. Typical Characteristics Graphs ----------------------- 13

4. Outline Drawing & Dimension ----------------------- 16

5. Reliability Test Items & Conditions ----------------------- 17

6. Soldering Conditions ----------------------- 18

7. Tape & Reel ----------------------- 19

8. Label Structure ----------------------- 21

9. Packing Structure ----------------------- 22

10. Precautions in Handling & Use ----------------------- 25

 3

1. Characteristics

a) Absolute Maximum Rating

Item Symbol Rating Unit Condition

Ambient / Operating Temperature Ta -40 ~ +85 ℃ -

Storage Temperature Tstg -40 ~ +120 ℃ -

LED Junction Temperature Tj 110 ℃ -

Forward Current IF 200 mA -

Pulse Forward Current IFP 300 mA Duty 1/10, pulse width 10ms

260 ℃
Assembly Process Temperature - -
<10 s

ESD (HBM) - 5 kV -

b) Electro-optical Characteristics (IF = 65 mA, Ts = 25℃)

Item Unit Rank Bin Min. Typ. Max.

AY 2.6 - 2.7

Forward Voltage (VF) V XA AZ 2.7 - 2.8

A1 2.8 - 2.9

Reverse Voltage
V 0.7 - 1.2
(@ 5 mA)

Color Rendering Index (Ra) - 80 - -

Thermal Resistance
℃/W - 7.5 -
(junction to solder point)

Beam Angle ￮ - 120 -

Note:
Samsung maintains measurement tolerance of: forward voltage = ±0.1 V, luminous flux = ±5 %, CRI = ±3
 4

c) Electro-optical Characteristics (IF = 65 mA, Ts= 25℃)

SF SG SH SJ SK SL SM
Nominal
Item CRI Min. Max. Min. Max. Min. Max. Min. Max. Min. Max. Min. Max. Min. Max.
CCT (K)
28 30 30 32 32 34 34 36 36 38 38 40 40 42

2200

2700

3000

Luminous 3500
80
Flux (Φv) 4000

5000

5700

6500

Note:
Samsung maintains measurement tolerance of: forward voltage = ±0.1V, luminous flux = ±5 %, CRI = ±3
 5

2. Product Code Information

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18

S P M W H D 3 2 A M D 5 X A R 0 S 0

Digit PKG Information Code Specification

1 2 3 Samsung Package Middle Power SPM

4 5 Color WH White

6 Product Version D Dispensing

7 8 9 Form Factor 32A 3.0 x 3.0 x 0.7 mm; 2 pads;

10 Sorting Current (mA) M 65 mA

11 Chromaticity Coordinates D ANSI Standard, MacAdam 3 step ellipse bin, MacAdam 5 step ellipse bin

12 CRI 5 Min. 80

AY 2.6~2.7

Bin
13 14 Forward Voltage (V) XA 2.6~2.9 AZ 2.7~2.8
Code:

A1 2.8~2.9

Y● 2200 YA, YB, YC, YD, YE, YF, YG, YH, YJ, YK, YL, YM

W● 2700 WA, WB, WC, WD, WE, WF, WG, WH, WJ, WK, WL, WM

V● 3000 VA, VB, VC, VD, VE, VF, VG, VH, VJ, VK, VL, VM

U● 3500 UA, UB, UC, UD, UE, UF, UG, UH, UJ, UK, UL, UM
Bin
Code
15 16 Color bin T● 4000 TA, TB, TC, TD, TE, TF, TG, TH, TJ, TK, TL, TM

R● 5000 RA, RB, RC, RD, RE, RF, RG, RH, RJ, RK, RL, RM

Q● 5700 QA, QB, QC, QD, QE, QF, QG, QH, QJ, QK, QL, QM

P● 6500 PA, PB, PC, PD, PE, PF, PG, PH, PJ, PK, PL, PM

● : "0" (Whole bin) "3" (MacAdam 3-step ellipse bin) or "K” (K Kitting) or “S” (S Kitting)

S0 SF, SG, SH, SJ, SK, SL, SM

SF SF

SG SG

SH SH
Bin
17 18 Luminous Flux SJ Code:
SJ

SK SK

SL SL

SM SM

K2 SK+SL, SL+SL
 6

a) Luminous Flux Bins(IF = 65 mA, Ts= 25℃)

CRI (Ra) Nominal CCT Flux Range

Product Code Flux Bin
Min. (K) (Φv, lm)

SF 28.0~30.0
2200 SPMWHD32AMD5XAY●S0 SG 30.0~32.0

SH 32.0~34.0

SH 32.0~34.0

SPMWHD32AMD5XAW●S0 SJ 34.0 ~36.0

2700
SK 36.0 ~38.0

SPMWHD32AMD5XAW●SJ SJ 34.0 ~36.0

SJ 34.0 ~36.0

SPMWHD32AMD5XAV●S0 SK 36.0 ~38.0

3000
SL 38.0 ~ 40.0

SPMWHD32AMD5XAV●SK SK 36.0 ~38.0

SJ 34.0 ~36.0

SPMWHD32AMD5XAU●S0 SK 36.0 ~38.0

3500 SL 38.0 ~ 40.0

80 SK 36.0 ~38.0
SPMWHD32AMD5XAU0K2
SL 38.0 ~ 40.0

SK 36.0 ~38.0
SPMWHD32AMD5XAT●S0
4000 SL 38.0 ~ 40.0

SPMWHD32AMD5XAT●SL SL 38.0 ~ 40.0

SK 36.0 ~38.0

SPMWHD32AMD5XAR●S0 SL 38.0 ~ 40.0

5000
SM 40.0 ~ 42.0

SPMWHD32AMD5XAR●SL SL 38.0 ~ 40.0

SK 36.0 ~38.0
SPMWHD32AMD5XAQ●S0
5700 SL 38.0 ~ 40.0

SPMWHD32AMD5XAQ●SL SL 38.0 ~ 40.0

SK 36.0 ~38.0
SPMWHD32AMD5XAP●S0
6500 SL 38.0 ~ 40.0

SPMWHD32AMD5XAP●SL SL 38.0 ~ 40.0

Note:
"●" can be "0" (Whole bin), "3" (MacAdam 3-step ellipse bin), “S” (S Kitting) or "K" (K Kitting) of the color binning
 7

b) Kitting Rule
1) S Kitting Bin Concept
1. Under agreement between customer and SAMSUNG ELECTRONICS, SAMSUNG can supply kitting
bin (VF, Color, lm).
2. A forward voltage (VF) of kitting bin is combined by a pair of same VF rank such as (AY+AY), (AZ+AZ)
or (A1+A1)
3. A Chromaticity Coordinates of kitting bin is mixed by kitting procedure.(below kitting simulation)
4. A luminous flux(lm) of kitting bin is combined by a pair of IV rank such as (SH+SH), (SH+SJ), (SJ+SJ),
(SJ+SK), (SK+SK), (SK+SL), (SL+SL), (SL+SM) or (SM+SM)

[Binning Information]

Bin #1 Bin #2 Remark

AY AY

VF AZ AZ

A1 A1

A G

C E

D F

CIE B H

E G

F H

MacA. 3step(A, B, C, D) MacA. 3step(A, B, C, D)

SF SF

SF SG

SG SG

SG SH

SH SH

SH SJ

IV SJ SJ

SJ SK

SK SK

SK SL
K2
SL SL

SL SM

SM SM
 8

2) K Kitting Bin Concept

1. Under agreement between customer and SAMSUNG ELECTRONICS, SAMSUNG can supply
kitting bin (VF, Color, lm).
2. A forward voltage (VF) of kitting bin is combined by a pair of same VF rank such as (AY+AY),
(AY+AZ), (AZ+AZ), (AZ+A1) or (A1+A1)
3. A Chromaticity Coordinates of kitting bin is mixed by kitting procedure.(below kitting
simulation)
4. A luminous flux(lm) of kitting bin is combined by a pair of IV rank such as (SH+SH), (SH+SJ),
(SJ+SJ), (SJ+SK), (SK+SK), (SK+SL), (SL+SL), (SL+SM) or (SM+SM)

[Binning Information]

Bin #1 Bin #2 Remark

AY AY

AY AZ

VF AZ AZ

AZ A1

A1 A1

H K

F M

E L

CIE G J

E G

F H

MacA. 3step(A, B, C, D) MacA. 3step(A, B, C, D)

SF SF

SF SG

SG SG

SG SH

SH SH

SH SJ

IV SJ SJ

SJ SK

SK SK

SK SL
K2
SL SL

SL SM

SM SM
 9

c) Color Bins (IF = 65 mA, Ts= 25℃)

min. CRI Nominal CCT (K) Product Code Color Rank Chromaticity Bins
(Ra)
SPMWHD32AMD5XAY0S★ Y0 Whole bin YA, YB, YC, YD, YE, YF, YG, YH, YJ, YK, YL, YM

SPMWHD32AMD5XAY3S★ Y3 MacAdam 3-step ellipse bin YA, YB, YC, YD

2200
SPMWHD32AMD5XAYSS★ YS S Kitting YA, YB, YC, YD, YE, YF, YG, YH,

SPMWHD32AMD5XAYKS★ YK K Kitting YA, YB, YC, YD, YE, YF, YG, YH, YJ, YK, YL, YM

SPMWHD32AMD5XAW0S★ W0 Whole bin WA, WB, WC, WD, WE, WF, WG, WH, WJ, WK, WL, WM

SPMWHD32AMD5XAW3S★ W3 MacAdam 3-step ellipse bin WA, WB, WC, WD

2700
SPMWHD32AMD5XAWSS★ WS S Kitting WA, WB, WC, WD, WE, WF, WG, WH

SPMWHD32AMD5XAWKS★ WK K Kitting WA, WB, WC, WD, WE, WF, WG, WH, WJ, WK, WL, WM

SPMWHD32AMD5XAV0S★ V0 Whole bin VA, VB, VC, VD, VE, VF, VG, VH, VJ, VK, VL, VM

SPMWHD32AMD5XAV3S★ V3 MacAdam 3-step ellipse bin VA, VB, VC, VD

3000
SPMWHD32AMD5XAVSS★ VS S Kitting VA, VB, VC, VD, VE, VF, VG, VH

SPMWHD32AMD5XAVKS★ VK K Kitting VA, VB, VC, VD, VE, VF, VG, VH, VJ, VK, VL, VM

SPMWHD32AMD5XAU0S★
U0 Whole bin UA, UB, UC, UD, UE, UF, UG, UH, UJ, UK, UL, UM
SPMWHD32AMD5XAU0k2

3500 SPMWHD32AMD5XAU3S★ U3 MacAdam 3-step ellipse bin UA, UB, UC, UD

SPMWHD32AMD5XAUSS★ US S Kitting UA, UB, UC, UD, UE, UF, UG, UH

80 SPMWHD32AMD5XAUKS★ UK K Kitting UA, UB, UC, UD, UE, UF, UG, UH, UJ, UK, UL, UM

SPMWHD32AMD5XAT0S★ T0 Whole bin TA, TB, TC, TD, TE, TF, TG, TH, TJ, TK, TL, TM

SPMWHD32AMD5XAT3S★ T3 MacAdam 3-step ellipse bin TA, TB, TC, TD

4000
SPMWHD32AMD5XATSS★ TS S Kitting TA, TB, TC, TD, TE, TF, TG, TH

SPMWHD32AMD5XATKS★ TK K Kitting TA, TB, TC, TD, TE, TF, TG, TH, TJ, TK, TL, TM

SPMWHD32AMD5XAR0S★ R0 Whole bin RA, RB, RC, RD, RE, RF, RG, RH, RJ,RK,RL,RM

SPMWHD32AMD5XAR3S★ R3 MacAdam 3-step ellipse bin RA, RB, RC, RD

5000
SPMWHD32AMD5XARSS★ RS S Kitting RA, RB, RC, RD, RE, RF, RG, RH

SPMWHD32AMD5XARKS★ RK K Kitting RA, RB, RC, RD, RE, RF, RG, RH, RJ,RK,RL,RM

SPMWHD32AMD5XAQ0S★ Q0 Whole bin QA, QB, QC, QD, QE, QF, QG, QH, QJ,QK,QL,QM

SPMWHD32AMD5XAQ3S★ Q3 MacAdam 3-step ellipse bin QA, QB, QC, QD

5700
SPMWHD32AMD5XAQSS★ QS S Kitting QA, QB, QC, QD, QE, QF, QG, QH

SPMWHD32AMD5XAQKS★ QK K Kitting QA, QB, QC, QD, QE, QF, QG, QH, QJ,QK,QL,QM

SPMWHD32AMD5XAP0S★ P0 Whole bin PA, PB, PC, PD, PE, PF, PG, PH, PJ,PK,PL,PM

SPMWHD32AMD5XAP3S★ P3 MacAdam 3-step ellipse bin PA, PB, PC, PD

6500
SPMWHD32AMD5XAPSS★ PS S Kitting PA, PB, PC, PD, PE, PF, PG, PH

SPMWHD32AMD5XAPKS★ PK K Kitting PA, PB, PC, PD, PE, PF, PG, PH, PJ,PK,PL,PM

"★" can be "0", "F", "G", "H", "J", "K", "L", or "M" of the luminous flux
 10

d) Voltage Bins (IF = 65 mA, Ts = 25℃)

CRI (Ra) Nominal CCT Voltage Range

Product Code Voltage Rank Voltage Bin
Min. (K) (V)

AY 2.6 ~ 2.7

- - - XA AZ 2.7 ~ 2.8

A1 2.8 ~ 2.9
 11

e) Chromaticity Region & Coordinates (IF = 65 mA, Ts = 25℃)

 12

f) Chromaticity Region & Coordinates (IF = 65 mA, Ts = 25℃)

CIE x,y

MacAdam Ellipse (Y3, Y5) MacAdam Ellipse (W3, W5)

Step CIE x CIE y  a b Step Step CIE x CIE y  a b

3-step 0.5018 0.4153 -39.89 0.004 0.0072 3-step 0.4578 0.4101 53.70 0.0081 0.0042

5-step 0.5018 0.4153 -39.89 0.00667 0.01201 5-step 0.4578 0.4101 53.70 0.01350 0.00700

MacAdam Ellipse (V3, V5) MacAdam Ellipse (U3, U5)

Step CIE x CIE y  a b Step CIE x CIE y  a b

3-step 0.4338 0.4030 53.22 0.0083 0.0041 3-step 0.4073 0.3917 54.00 0.00927 0.00414

5-step 0.4338 0.4030 53.22 0.01390 0.00680 5-step 0.4073 0.3917 54.00 0.01545 0.00690

MacAdam Ellipse (T3, T5) MacAdam Ellipse (R3,R5)

Step CIE x CIE y  a b Step CIE x CIE y  a b

3-step 0.3818 0.3797 53.72 0.00939 0.00402 3-step 0.3447 0.3553 59.62 0.0082 0.0035

5-step 0.3818 0.3797 53.72 0.01565 0.00670 5-step 0.3447 0.3553 59.62 0.01370 0.00590

MacAdam Ellipse (Q3, Q5) MacAdam Ellipse (P3, P5)

Step CIE x CIE y  a b Step CIE x CIE y  a b

3-step 0.3287 0.3417 59.09 0.00746 0.00320 3-step 0.3123 0.3282 58.57 0.00669 0.00285

5-step 0.3287 0.3417 59.09 0.01243 0.00533 5-step 0.3123 0.3282 58.57 0.01115 0.00475

Note:
Samsung maintains measurement tolerance of: Cx, Cy = ±0.005
 13

3. Typical Characteristics Graphs

a) Spectrum Distribution (IF = 65 mA, Ts = 25℃)

CCT : 2200K (80 CRI) CCT : 3000K (80 CRI)

CCT : 3500K (80 CRI) CCT : 3500K (80 CRI)

CCT : 4000K (80 CRI) CCT : 5000K (80 CRI)

 14

CCT : 5700K (80 CRI) CCT : 6500K (80 CRI)

b) Forward Current Characteristics (Ts = 25℃)

c) Temperature Characteristics (IF = 65 mA)

 15

d) Color Shift Characteristics, Ts = 25℃, IF = 65 mA

e) Derating Curve f) Beam Angle Characteristics (Ts = 25℃, IF = 65 mA)

 16

4. Outline Drawing & Dimension

Notes:

1) This LED has built-in ESD protection device(s) connected in parallel to LED chip(s).

2) Ts point and measurement method:

① Measure one point at the cathode pad, if necessary remove PSR of PCB to reach Ts point.
② All pads must be soldered to the PCB to dissipate heat properly, otherwise the LED can be damaged.

Precautions:

1) Pressure on the LEDs will influence to the reliability of the LEDs. Precautions should be taken to avoid strong pressure on the LEDs. Do
not put stress on the LEDs during heating.

2) Re-soldering should not be done after the LEDs have been soldered. If re-soldering is unavoidable, LED`s characteristics should be
carefully checked before and after such repair.

3) Do not stack assembled PCBs together. Since materials of LEDs is soft, abrasion between two PCB assembled with LED might cause
catastrophic failure of the LEDs.
 17

5. Reliability Test Items & Conditions

a) Test Items

Test
Test Item Test Condition Sample No.
Hour / Cycle

Room Temperature
25℃, DC 200 mA 1000 h 22
Life Test

High Temperature
85℃, DC 200 mA 1000 h 22
Life Test

High Temperature
85℃, 85 % RH, DC 200 mA 1000 h 22
Humidity Life Test

Low Temperature
-40℃, DC 200 mA 1000 h 22
Life Test

Powered Temperature -40 ℃ ~ 85℃, each 10 min, On/Off 5min , 100 cycles 22
Cycle Test Temp. Change Time 20min, DC 200 mA

-45℃ / 15 min ↔ 125℃ / 15 min

Thermal Cycle 500 cycles 100
→ Hot plate 180℃

High Temperature
120℃ 1000 h 11
Storage

Low Temperature
-40℃ 1000 h 11
Storage

R1: 10 MΩ
R2: 1.5 kΩ
ESD (HBM) 5 times 30
C: 100 pF
V: ±5 kV

R1: 10 MΩ
R2: 0
ESD (MM) 5 times 30
C: 200 pF
V: ±0.5 kV
2
20~2000~20 Hz, 200 m/s , sweep 4 min
Vibration Test 4 cycles 11
X, Y, Z 3 direction, each 1 cycle

1500 g, 0.5 ms
Mechanical Shock Test 5 cycles 11
3 shocks each X-Y-Z axis

b) Criteria for Judging the Damage

Test Condition Limit

Item Symbol
(Ts = 25℃) Min Max

Forward Voltage VF IF = 65 mA Init. Value * 0.9 Init. Value * 1.1

Luminous Flux Φv IF = 65 mA Init. Value * 0.7 Init. Value * 1.1

 18

6. Soldering Conditions

a) Reflow Conditions (Pb free)

Reflow frequency: 2 times max.

b) Manual Soldering Conditions

Not more than 5 seconds @ max. 300℃, under soldering iron.

 19

7. Tape & Reel

a) Taping Dimension
(unit: mm)

Taping Direction

500 mm
500 mm
 20

b) Reel Dimension

(unit: mm)

Notes:
1) Quantity: The quantity/reel is 4,000 pcs
2) Cumulative Tolerance: Cumulative tolerance / 10 pitches is ±0.2 mm
3) Adhesion Strength of Cover Tape: Adhesion strength is 0.1-0.7 N when the cover tape is turned off from the carrier tape at 10° angle
to the carrier tape
4) Packaging: P/N, Manufacturing data code no. and quantity are indicated on the aluminum packing bag
 21

8. Label Structure

a) Label Structure

ⓐⓑⓒⓓⓔⓕ
AZRASL SPMWHD32AMD7XA★SS0
SPMWHD32AMD5XAR0S0 AZRASL 01
Bin Code IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII
IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII
GLAW94001 / 4,000 pcs QUANITY : 8,000
IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIII
GLAYC4001 / I001 / 4,000 pcs Product Code
IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII GLAW94002 / 4,000 pcs
IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII
Lot Number

Note: Denoted bin code and product code above is only an example (see description on page 5)

Bin Code:

ⓐⓑ: Forward Voltage bin (refer to page 3)

ⓒⓓ: Chromaticity bin (refer to page 9-12)

ⓔⓕ: Luminous Flux bin (refer to page 8)

b) Lot Number
The lot number is composed of the following characters:

AZRASL
SPMWHD32AMD5XAR0S0 AZRASL 01
IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII

①②③④⑤⑥⑦⑧⑨/1ⓐⓑⓒ/ 4,000 pcs

IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII

①②③③②③④⑤⑥⑦⑧⑨ / Iⓐⓑⓒ / 4,000 pcs

①② : Production site (GL: Tianjin, China, G4: Guangzhou, China, EH : Hanoi, Vietnam )

※ Sample product (SL: Kiheung, Korea)

③ : Product state (A: Normal, B: Bulk, C: First Production, R: Reproduction, S: Sample)
④ : Year (C : 2018, D : 2019, E : 2020 …)
⑤ : Month (1~9, A, B, C)
⑥ : Day (1~9, A, B~V)
⑦⑧⑨ : Serial number (001 ~ 999)
ⓐⓑⓒ : Product serial number (001 ~ 999)
 22

9. Packing Structure

a) Packing Process (The quantity of PKG on the Reel to be Max 4,000pcs)

Reel

AZRASL
SPMWHD32AMD5XAR0S0 AZRASL 00
IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII

GLAYC4001 / I001 / 4,000 pcs

IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII

Aluminum Vinyl Packing Bag

AZRASL
SPMWHD32AMD5XAR0S0 AZRASL 00
IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII

GLAYC4001 / I001 / 4,000 pcs

IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII

Outer Box

Material: Paper (SW3B(B))

Size (mm)
Type Note
L W H

7 inch L 245 ± 5 220 ± 5 182 ± 5 Up to 10 reels

7 inch S 245 ± 5 220 ± 5 86 ± 5 Up to 5 reels

① Side Label

AZRASL
SPMWHD32AMD5XAR0S0 AZRASL 00 ①
IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII
H
GLAYC4001 / I001 / 40,000 pcs LED
IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII
W

L
 23

b) Packing Process for kitting (The quantity of PKG on the Reel to be Max 4,000pcs)

Reel
Kitting ‘A’ Kitting ‘B’
Kitting ‘A’ Kitting ‘B’

AY★DSK AY★FSK
SPMWHD32AMD5XA★SS0 AY★DSK 00 SPMWHD32AMD5XA★SS0 AY★FSK 00
IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII

GLAW94001 / I001 / 4,000 pcs GLAW94002 / I001 / 4,000 pcs

IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII

Aluminum Vinyl Packing Bag

Kitting ‘A’ Kitting ‘B’

AY★DSK AY★FSK
SPMWHD32AMD5XA★SS0 AY★DSK 00 SPMWHD32AMD5XA★SS0 AY★FSK 00
IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII
IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII
GLAW94001 / I001 / 4,000 pcs GLAW94002 / I001 / 4,000 pcs
IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII
IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII

Kitting ‘B’ (back Side)

SPMWHD32AMD5XA★SS0
IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII
GLAW94001 / 4,000 pcs QUANITY : 8,000
IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIII Kitting ‘B’ (Back Side)
B
GLAW94002 / 4,000 pcs A B
IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII

Outer Box

Kitting ‘A’ Kitting ‘B’

AY★DSK AY★FSK
SPMWHD32AMD5XA★SS0 AY★DSK 00 SPMWHD32AMD5XA★SS0 AY★FSK 00
IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII

GLAW94001 / I001 / 20,000 pcs GLAW94001 / I001 / 20,000 pcs

IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII

[BOX Label] [BOX Label] A A A A A

B B B B B

Note: "★" can be Nominal CCT code.

Material: Paper (SW3B(B)) ①

Size (mm) H LED
Type Note

W
L W H

7 inch L 245 ± 5 220 ± 5 182 ± 5 Up to 10 reels

L
 24

c) Aluminum Vinyl Packing Bag

AZRASL
SPMWHD32AMD5XAR0S0 AZRASL 00
IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII

GLAYC4001 / I001 / 4,000 pcs

IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII

b) Silica Gel & Humidity Indicator Card inside Aluminum Vinyl Bag
(This image is for reference only. Silica gel and humidity indicator shapes may be different.)
 25

10. Precautions in Handling & Use

1) For over-current protection, users are recommended to apply resistors connected in series with the LEDs to mitigate sudden change
of the forward current caused by shift of forward voltage.

2) This device should not be used in any type of fluid such as water, oil, organic solvent, etc. When cleaning is required, IPA is
recommended as the cleaning agent. Some solvent-based cleaning agent may damage the silicone resins used in the device.

3) When the device is in operation, the forward current should be carefully determined considering the maximum ambient
temperature and corresponding junction temperature.

4) LEDs must be stored in a clean environment. If the LEDs are to be stored for three months or more after being shipped from
Samsung, they should be packed with a nitrogen-filled container (shelf life of sealed bags is 12 months at temperature 0~40 ºC,
0~90 % RH).

5) After storage bag is opened, device subjected to soldering, solder reflow, or other high temperature processes must be:
Note 1
a. Mounted within 672 hours (28 days) at an assembly line with a condition of no more than 30 ºC / 60 % RH* , or
Note 2
b. Mounted within 24 hours (1 day) at an assembly line with a condition of more than 30 ºC / 70 % RH* , or
c. Stored at <10 % RH.
*Note 1, 2: IPC/JEDEC J-STD-033A, Recommended Equivalent Total Floor Life Table

6) Repack unused devices with anti-moisture packing, fold to close any opening and then store in a dry place.
7) Devices require baking before mounting, if humidity card reading is >60 % at 23 ± 5 ºC.

8) Devices must be baked for 10~24 hours at 60 ± 5 ºC, if baking is required.

9) The LEDs are sensitive to the static electricity and surge current. It is recommended to use a wrist band or anti-electrostatic glove
when handling the LEDs. If voltage exceeding the absolute maximum rating is applied to LEDs, it may cause damage or even
destruction to LED devices. Damaged LEDs may show some unusual characteristics such as increase in leakage current, lowered
turn-on voltage, or abnormal lighting of LEDs at low current.

10) VOCs (Volatile Organic Compounds) can be generated from adhesives, flux, hardener or organic additives used in luminaires
(fixtures). Transparent LED silicone encapsulant is permeable to those chemicals and they may lead to a discoloration of
encapsulant when they exposed to heat or light. This phenomenon can cause a significant loss of light emitted (output) from the
luminaires. In order to prevent these problems, we recommend users to know the physical properties of materials used in
luminaires and they must be carefully selected.

11) Risk of sulfurization (or tarnishing)

The LED from Samsung uses a silver-plated lead frame and its surface color may change to black (or dark colored) when it is exposed
to sulfur (S), chlorine (Cl) or other halogen compound. Sulfurization of lead frame may cause intensity degradation, change of
chromaticity coordinates and, in extreme cases, open circuit. It requires caution. Due to possible sulfurization of lead frame, LED
should not be used and stored together with oxidizing substances made of materials such as rubber, plain paper, lead solder cream,
etc.
Legal and additional information.

About Samsung Electronics Co., Ltd.

Samsung inspires the world and shapes the future with transformative ideas and technologies.
The company is redefining the worlds of TVs, smartphones, wearable devices, tablets, digital
appliances, network systems, and memory, system LSI, foundry and LED solutions. For the latest
news, please visit the Samsung Newsroom at news.samsung.com.

Copyright © 2018 Samsung Electronics Co., Ltd. All rights reserved.

Samsung is a registered trademark of Samsung Electronics Co., Ltd.
Specifications and designs are subject to change without notice. Non-metric
weights and measurements are approximate. All data were deemed correct
at time of creation. Samsung is not liable for errors or omissions. All brand, product,
service names and logos are trademarks and/or registered trademarks of their
respective owners and are hereby recognized and acknowledged.

Samsung Electronics Co., Ltd.

95, Samsung 2-ro
Giheung-gu
Yongin-si, Gyeonggi-do, 446-711
KOREA

www.samsungled.com