SN54LS245, SN74LS245

OCTAL BUS TRANSCEIVERS

WITH 3-STATE OUTPUTS
SDLS146A – OCTOBER 1976 – REVISED FEBRUARY 2002

D 3-State Outputs Drive Bus Lines Directly SN54LS245 . . . J OR W PACKAGE

D PNP Inputs Reduce dc Loading on Bus

SN74LS245 . . . DB, DW, N, OR NS PACKAGE
(TOP VIEW)
Lines
D Hysteresis at Bus Inputs Improves Noise DIR 1 20 VCC
Margins A1 2 19 OE
D Typical Propagation Delay Times Port to A2 3 18 B1
Port, 8 ns A3 4 17 B2
A4 5 16 B3
IOL IOH A5 6 15 B4
TYPE (SINK (SOURCE A6 7 14 B5
CURRENT) CURRENT) A7 8 13 B6
SN54LS245 12 mA –12 mA A8 9 12 B7
SN74LS245 24 mA –15 mA GND 10 11 B8

description SN54LS245 . . . FK PACKAGE

(TOP VIEW)
These octal bus transceivers are designed for

VCC
DIR

OE
asynchronous two-way communication between

A2
A1
data buses. The control-function implementation
minimizes external timing requirements. 3 2 1 20 19
A3 4 18 B1
The devices allow data transmission from the A4 5 17 B2
A bus to the B bus or from the B bus to the A bus, A5 6 16 B3
depending on the logic level at the A6 7 15 B4
direction-control (DIR) input. The output-enable A7 8 14 B5
(OE) input can disable the device so that the 9 10 11 12 13
buses are effectively isolated.

A8

B8
B7
B6
ORDERING INFORMATION GND
ORDERABLE TOP-SIDE
TA PACKAGE†
PART NUMBER MARKING
PDIP – N Tube SN74LS245N SN74LS245N
Tube SN74LS245DW
SOIC – DW LS245
0°C to 70°C Tape and reel SN74LS245DWR
SOP – NS Tape and reel SN74LS245NSR 74LS245
SSOP – DB Tape and reel SN74LS245DBR LS245
Tube SN54LS245J SN54LS245J
CDIP – J
Tube SNJ54LS245J SNJ54LS245J
–55°C to 125°C
CFP – W Tube SNJ54LS245W SNJ54LS245W
LCCC – FK Tube SN54LS245FK
SN54LS245FK
† Package drawings, standard packing quantities, thermal data, symbolization, and PCB design
guidelines are available at www.ti.com/sc/package.

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

PRODUCTION DATA information is current as of publication date. Copyright  2002, Texas Instruments Incorporated
Products conform to specifications per the terms of Texas Instruments On products compliant to MIL-PRF-38535, all parameters are tested
standard warranty. Production processing does not necessarily include unless otherwise noted. On all other products, production
testing of all parameters. processing does not necessarily include testing of all parameters.

POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 1

SN54LS245, SN74LS245
OCTAL BUS TRANSCEIVERS
WITH 3-STATE OUTPUTS
SDLS146A – OCTOBER 1976 – REVISED FEBRUARY 2002

FUNCTION TABLE
INPUTS
OPERATION
OE DIR
L L B data to A bus
L H A data to B bus
H X Isolation

schematics of inputs and outputs

EQUIVALENT OF EACH INPUT TYPICAL OF ALL OUTPUTS

VCC VCC

9 kΩ NOM 50 Ω NOM

Input

Output

logic diagram (positive logic)

1
DIR

19
OE

2
A1

18
B1

To Seven Other Channels

2 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

 SN54LS245, SN74LS245
OCTAL BUS TRANSCEIVERS
WITH 3-STATE OUTPUTS
SDLS146A – OCTOBER 1976 – REVISED FEBRUARY 2002

absolute maximum ratings over operating free-air temperature range (unless otherwise noted)†
Supply voltage, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 V
Input voltage, VI (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 V
Package thermal impedance, qJA (see Note 2): DB package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70°C/W
DW package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58°C/W
N package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 69°C/W
NS package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60°C/W
Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –65°C to 150°C
† Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. All voltage values are with respect to GND.
2. The package thermal impedance is calculated in accordance with JESD 51-7.

recommended operating conditions

SN54LS245 SN74LS245
UNIT
MIN NOM MAX MIN NOM MAX
VCC Supply voltage 4.5 5 5.5 4.75 5 5.25 V
IOH High-level output current –12 –15 mA
IOL Low-level output current 12 24 mA
TA Operating free-air temperature –55 125 0 70 °C

POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 3

SN54LS245, SN74LS245
OCTAL BUS TRANSCEIVERS
WITH 3-STATE OUTPUTS
SDLS146A – OCTOBER 1976 – REVISED FEBRUARY 2002

electrical characteristics over recommended operating free-air temperature range (unless

otherwise noted)
SN54LS245 SN74LS245
PARAMETER TEST CONDITIONS† UNIT
MIN TYP‡ MAX MIN TYP‡ MAX
VIH High-level input voltage 2 2 V
VIL Low-level input voltage 0.7 0.8 V
VIK Input clamp voltage VCC = MIN, II = –18 mA –1.5 –1.5 V
Hysteresis (VT+ – VT–) A or B VCC = MIN 0.2 0.4 0.2 0.4 V
VCC = MIN, IOH = –3 mA 2.4 3.4 2.4 3.4
VOH High level output voltage
High-level VIH = 2 V
V, V
VIL = VIL(max) IOH = MAX 2 2

VCC = MIN, IOL = 12 mA 0.4 0.4

VOL Low level output voltage
Low-level VIH = 2 V
V, V
VIL = VIL(max) IOL = 24 mA 0.5
Off-state output current, VCC = MAX,
IOZH VO = 2.7 V 20 20 µA
high-level voltage applied OE at 2 V
Off-state output current, VCC = MAX,
IOZL VO = 0.4 V –200 –200 µA
low-level voltage applied OE at 2 V
Input current at A or B VI = 5.5 V 0.1 0.1
II maximum input VCC = MAX mA
voltage DIR or OE VI = 7 V 0.1 0.1
IIH High-level input current VCC = MAX, VIH = 2.7 V 20 20 µA
IIL Low-level input current VCC = MAX, VIL = 0.4 V –0.2 –0.2 mA
IOS Short-circuit output current§ VCC = MAX –40 –225 40 –225 mA
Total, outputs high 48 70 48 70
ICC Supply current Total, outputs low VCC = MAX Outputs open 62 90 62 90 mA
Outputs at high Z 64 95 64 95
† For conditions shown as MIN or MAX, use the appropriate values specified under recommended operating conditions.
‡ All typical values are at VCC = 5 V, TA = 25°C.
§ Not more than one output should be shorted at a time, and duration of the short circuit should not exceed one second.

switching characteristics, VCC = 5 V, TA = 25°C (see Figure 1)

PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
tPLH Propagation delay time, low- to high-level output 8 12
CL = 45 pF
pF, RL = 667 W ns
tPHL Propagation delay time
time, high
high- to low
low-level
level output 8 12
tPZL Output enable time to low level 27 40
CL = 45 pF,
pF RL = 667 W ns
tPZH Output enable time to high level 25 40
tPLZ Output disable time from low level 15 25
CL = 5 pF,
pF RL = 667 W ns
tPHZ Output disable time from high level 15 28

4 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

 SN54LS245, SN74LS245
OCTAL BUS TRANSCEIVERS
WITH 3-STATE OUTPUTS
SDLS146A – OCTOBER 1976 – REVISED FEBRUARY 2002

PARAMETER MEASUREMENT INFORMATION

SERIES 54LS/74LS DEVICES
VCC
Test RL
Test Point S1
Point VCC
From Output
VCC Under Test (see Note B)
RL CL
From Output RL (see Note A) 5 kΩ
Under Test (see Note B) From Output Test
CL Under Test Point
(see Note A) CL
(see Note A) S2

LOAD CIRCUIT LOAD CIRCUIT LOAD CIRCUIT

FOR 2-STATE TOTEM-POLE OUTPUTS FOR OPEN-COLLECTOR OUTPUTS FOR 3-STATE OUTPUTS

3V
High-Level Timing
Pulse 1.3 V 1.3 V Input 1.3 V
0V
tw th
tsu
3V
Low-Level Data
1.3 V 1.3 V 1.3 V 1.3 V
Pulse Input
0V
VOLTAGE WAVEFORMS VOLTAGE WAVEFORMS
PULSE DURATIONS SETUP AND HOLD TIMES

Output 3V
Control
(low-level 1.3 V 1.3 V
3V
Input enabling)
1.3 V 1.3 V 0V
0V tPZL tPLZ

tPLH tPHL

In-Phase
Waveform 1 ≈1.5 V
VOH (see Notes C 1.3 V
Output 1.3 V 1.3 V VOL + 0.5 V
and D)
(see Note D) VOL VOL
tPZH tPHZ
tPHL tPLH
VOH
Out-of-Phase Waveform 2 VOH – 0.5 V
VOH
(see Notes C 1.3 V
Output 1.3 V 1.3 V
and D) ≈1.5 V
(see Note D) VOL
VOLTAGE WAVEFORMS VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES ENABLE AND DISABLE TIMES, 3-STATE OUTPUTS
NOTES: A. CL includes probe and jig capacitance.
B. All diodes are 1N3064 or equivalent.
C. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control.
D. S1 and S2 are closed for tPLH, tPHL, tPHZ, and tPLZ; S1 is open and S2 is closed for tPZH; S1 is closed and S2 is open for tPZL.
E. Phase relationships between inputs and outputs have been chosen arbitrarily for these examples.
F. All input pulses are supplied by generators having the following characteristics: PRR ≤ 1 MHz, ZO ≈ 50 Ω, tr ≤ 1.5 ns, tf ≤ 2.6 ns.
G. The outputs are measured one at a time with one input transition per measurement.

Figure 1. Load Circuits and Voltage Waveforms

POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 5

 PACKAGE OPTION ADDENDUM

www.ti.com 24-Apr-2015

PACKAGING INFORMATION

Orderable Device Status Package Type Package Pins Package Eco Plan Lead/Ball Finish MSL Peak Temp Op Temp (°C) Device Marking Samples
(1) Drawing Qty (2) (6) (3) (4/5)

5962-8002101VRA ACTIVE CDIP J 20 20 TBD A42 N / A for Pkg Type -55 to 125 5962-8002101VR
A
SNV54LS245J
5962-8002101VSA ACTIVE CFP W 20 1 TBD A42 N / A for Pkg Type -55 to 125 5962-8002101VS
A
SNV54LS245W
80021012A ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 80021012A
SNJ54LS
245FK
8002101SA ACTIVE CFP W 20 1 TBD A42 N / A for Pkg Type -55 to 125 8002101SA
SNJ54LS245W
JM38510/32803B2A ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 JM38510/
32803B2A
JM38510/32803BRA ACTIVE CDIP J 20 1 TBD A42 N / A for Pkg Type -55 to 125 JM38510/
32803BRA
JM38510/32803BSA ACTIVE CFP W 20 1 TBD A42 N / A for Pkg Type -55 to 125 JM38510/
32803BSA
M38510/32803B2A ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 JM38510/
32803B2A
M38510/32803BRA ACTIVE CDIP J 20 1 TBD A42 N / A for Pkg Type -55 to 125 JM38510/
32803BRA
M38510/32803BSA ACTIVE CFP W 20 1 TBD A42 N / A for Pkg Type -55 to 125 JM38510/
32803BSA
SN54LS245J ACTIVE CDIP J 20 1 TBD A42 N / A for Pkg Type -55 to 125 SN54LS245J

SN74LS245DBR ACTIVE SSOP DB 20 2000 Green (RoHS CU NIPDAU Level-1-260C-UNLIM 0 to 70 LS245

& no Sb/Br)
SN74LS245DBRG4 ACTIVE SSOP DB 20 2000 Green (RoHS CU NIPDAU Level-1-260C-UNLIM 0 to 70 LS245
& no Sb/Br)
SN74LS245DW ACTIVE SOIC DW 20 25 Green (RoHS CU NIPDAU Level-1-260C-UNLIM 0 to 70 LS245
& no Sb/Br)
SN74LS245DWG4 ACTIVE SOIC DW 20 25 Green (RoHS CU NIPDAU Level-1-260C-UNLIM 0 to 70 LS245
& no Sb/Br)
SN74LS245DWR ACTIVE SOIC DW 20 2000 Green (RoHS CU NIPDAU Level-1-260C-UNLIM 0 to 70 LS245
& no Sb/Br)

Addendum-Page 1
 PACKAGE OPTION ADDENDUM

www.ti.com 24-Apr-2015

Orderable Device Status Package Type Package Pins Package Eco Plan Lead/Ball Finish MSL Peak Temp Op Temp (°C) Device Marking Samples
(1) Drawing Qty (2) (6) (3) (4/5)

SN74LS245DWRG4 ACTIVE SOIC DW 20 2000 Green (RoHS CU NIPDAU Level-1-260C-UNLIM 0 to 70 LS245

& no Sb/Br)
SN74LS245J OBSOLETE CDIP J 20 TBD Call TI Call TI 0 to 70
SN74LS245N ACTIVE PDIP N 20 20 Pb-Free CU NIPDAU N / A for Pkg Type 0 to 70 SN74LS245N
(RoHS)
SN74LS245N3 OBSOLETE PDIP N 20 TBD Call TI Call TI 0 to 70
SN74LS245NE4 ACTIVE PDIP N 20 20 Pb-Free CU NIPDAU N / A for Pkg Type 0 to 70 SN74LS245N
(RoHS)
SN74LS245NSR ACTIVE SO NS 20 2000 Green (RoHS CU NIPDAU Level-1-260C-UNLIM 0 to 70 74LS245
& no Sb/Br)
SN74LS245NSRE4 ACTIVE SO NS 20 2000 Green (RoHS CU NIPDAU Level-1-260C-UNLIM 0 to 70 74LS245
& no Sb/Br)
SNJ54LS245FK ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 80021012A
SNJ54LS
245FK
SNJ54LS245J ACTIVE CDIP J 20 1 TBD A42 N / A for Pkg Type -55 to 125 SNJ54LS245J

SNJ54LS245W ACTIVE CFP W 20 1 TBD A42 N / A for Pkg Type -55 to 125 8002101SA
SNJ54LS245W

(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.

(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)

(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.

Addendum-Page 2
 PACKAGE OPTION ADDENDUM

www.ti.com 24-Apr-2015

(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.

(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.

(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

OTHER QUALIFIED VERSIONS OF SN54LS245, SN54LS245-SP, SN74LS245 :

• Catalog: SN74LS245, SN54LS245

• Military: SN54LS245
• Space: SN54LS245-SP

NOTE: Qualified Version Definitions:

• Catalog - TI's standard catalog product

• Military - QML certified for Military and Defense Applications
• Space - Radiation tolerant, ceramic packaging and qualified for use in Space-based application

Addendum-Page 3
 PACKAGE MATERIALS INFORMATION

www.ti.com 27-Dec-2014

TAPE AND REEL INFORMATION

*All dimensions are nominal

Device Package Package Pins SPQ Reel Reel A0 B0 K0 P1 W Pin1
Type Drawing Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
SN74LS245DBR SSOP DB 20 2000 330.0 16.4 8.2 7.5 2.5 12.0 16.0 Q1
SN74LS245DWR SOIC DW 20 2000 330.0 24.4 10.8 13.3 2.7 12.0 24.0 Q1
SN74LS245NSR SO NS 20 2000 330.0 24.4 9.0 13.0 2.4 4.0 24.0 Q1

Pack Materials-Page 1
 PACKAGE MATERIALS INFORMATION

www.ti.com 27-Dec-2014

*All dimensions are nominal

Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
SN74LS245DBR SSOP DB 20 2000 367.0 367.0 38.0
SN74LS245DWR SOIC DW 20 2000 367.0 367.0 45.0
SN74LS245NSR SO NS 20 2000 367.0 367.0 45.0

Pack Materials-Page 2
 MECHANICAL DATA

MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001

DB (R-PDSO-G**) PLASTIC SMALL-OUTLINE

28 PINS SHOWN

0,38
0,65 0,15 M
0,22
28 15

0,25
0,09
5,60 8,20
5,00 7,40

Gage Plane

1 14 0,25

A 0°–ā8° 0,95
0,55

Seating Plane

2,00 MAX 0,05 MIN 0,10

PINS **
14 16 20 24 28 30 38
DIM

A MAX 6,50 6,50 7,50 8,50 10,50 10,50 12,90

A MIN 5,90 5,90 6,90 7,90 9,90 9,90 12,30

4040065 /E 12/01

NOTES: A. All linear dimensions are in millimeters.

B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.
D. Falls within JEDEC MO-150

POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

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