ls245 PDF
ls245 PDF
ls245 PDF
VCC
DIR
OE
asynchronous two-way communication between
A2
A1
data buses. The control-function implementation
minimizes external timing requirements. 3 2 1 20 19
A3 4 18 B1
The devices allow data transmission from the A4 5 17 B2
A bus to the B bus or from the B bus to the A bus, A5 6 16 B3
depending on the logic level at the A6 7 15 B4
direction-control (DIR) input. The output-enable A7 8 14 B5
(OE) input can disable the device so that the 9 10 11 12 13
buses are effectively isolated.
A8
B8
B7
B6
ORDERING INFORMATION GND
ORDERABLE TOP-SIDE
TA PACKAGE†
PART NUMBER MARKING
PDIP – N Tube SN74LS245N SN74LS245N
Tube SN74LS245DW
SOIC – DW LS245
0°C to 70°C Tape and reel SN74LS245DWR
SOP – NS Tape and reel SN74LS245NSR 74LS245
SSOP – DB Tape and reel SN74LS245DBR LS245
Tube SN54LS245J SN54LS245J
CDIP – J
Tube SNJ54LS245J SNJ54LS245J
–55°C to 125°C
CFP – W Tube SNJ54LS245W SNJ54LS245W
LCCC – FK Tube SN54LS245FK
SN54LS245FK
† Package drawings, standard packing quantities, thermal data, symbolization, and PCB design
guidelines are available at www.ti.com/sc/package.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date. Copyright 2002, Texas Instruments Incorporated
Products conform to specifications per the terms of Texas Instruments On products compliant to MIL-PRF-38535, all parameters are tested
standard warranty. Production processing does not necessarily include unless otherwise noted. On all other products, production
testing of all parameters. processing does not necessarily include testing of all parameters.
FUNCTION TABLE
INPUTS
OPERATION
OE DIR
L L B data to A bus
L H A data to B bus
H X Isolation
VCC VCC
9 kΩ NOM 50 Ω NOM
Input
Output
1
DIR
19
OE
2
A1
18
B1
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)†
Supply voltage, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 V
Input voltage, VI (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 V
Package thermal impedance, qJA (see Note 2): DB package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70°C/W
DW package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58°C/W
N package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 69°C/W
NS package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60°C/W
Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –65°C to 150°C
† Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. All voltage values are with respect to GND.
2. The package thermal impedance is calculated in accordance with JESD 51-7.
3V
High-Level Timing
Pulse 1.3 V 1.3 V Input 1.3 V
0V
tw th
tsu
3V
Low-Level Data
1.3 V 1.3 V 1.3 V 1.3 V
Pulse Input
0V
VOLTAGE WAVEFORMS VOLTAGE WAVEFORMS
PULSE DURATIONS SETUP AND HOLD TIMES
Output 3V
Control
(low-level 1.3 V 1.3 V
3V
Input enabling)
1.3 V 1.3 V 0V
0V tPZL tPLZ
tPLH tPHL
In-Phase
Waveform 1 ≈1.5 V
VOH (see Notes C 1.3 V
Output 1.3 V 1.3 V VOL + 0.5 V
and D)
(see Note D) VOL VOL
tPZH tPHZ
tPHL tPLH
VOH
Out-of-Phase Waveform 2 VOH – 0.5 V
VOH
(see Notes C 1.3 V
Output 1.3 V 1.3 V
and D) ≈1.5 V
(see Note D) VOL
VOLTAGE WAVEFORMS VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES ENABLE AND DISABLE TIMES, 3-STATE OUTPUTS
NOTES: A. CL includes probe and jig capacitance.
B. All diodes are 1N3064 or equivalent.
C. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control.
D. S1 and S2 are closed for tPLH, tPHL, tPHZ, and tPLZ; S1 is open and S2 is closed for tPZH; S1 is closed and S2 is open for tPZL.
E. Phase relationships between inputs and outputs have been chosen arbitrarily for these examples.
F. All input pulses are supplied by generators having the following characteristics: PRR ≤ 1 MHz, ZO ≈ 50 Ω, tr ≤ 1.5 ns, tf ≤ 2.6 ns.
G. The outputs are measured one at a time with one input transition per measurement.
PACKAGING INFORMATION
Orderable Device Status (1) Package Package Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Type Drawing Qty
5962-8002101VRA ACTIVE CDIP J 20 1 TBD A42 SNPB N / A for Pkg Type
5962-8002101VSA ACTIVE CFP W 20 1 TBD A42 N / A for Pkg Type
80021012A ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type
8002101SA ACTIVE CFP W 20 1 TBD A42 N / A for Pkg Type
JM38510/32803B2A ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type
JM38510/32803BRA ACTIVE CDIP J 20 1 TBD A42 SNPB N / A for Pkg Type
JM38510/32803BSA ACTIVE CFP W 20 1 TBD A42 N / A for Pkg Type
SN54LS245J ACTIVE CDIP J 20 1 TBD A42 SNPB N / A for Pkg Type
SN74LS245DBR ACTIVE SSOP DB 20 2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74LS245DBRE4 ACTIVE SSOP DB 20 2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74LS245DW ACTIVE SOIC DW 20 25 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74LS245DWG4 ACTIVE SOIC DW 20 25 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74LS245DWR ACTIVE SOIC DW 20 2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74LS245DWRG4 ACTIVE SOIC DW 20 2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74LS245J OBSOLETE CDIP J 20 TBD Call TI Call TI
SN74LS245N ACTIVE PDIP N 20 20 Pb-Free CU NIPDAU N / A for Pkg Type
(RoHS)
SN74LS245N3 OBSOLETE PDIP N 20 TBD Call TI Call TI
SN74LS245NE4 ACTIVE PDIP N 20 20 Pb-Free CU NIPDAU N / A for Pkg Type
(RoHS)
SN74LS245NSR ACTIVE SO NS 20 2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74LS245NSRE4 ACTIVE SO NS 20 2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74LS245NSRG4 ACTIVE SO NS 20 2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SNJ54LS245FK ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type
SNJ54LS245J ACTIVE CDIP J 20 1 TBD A42 SNPB N / A for Pkg Type
SNJ54LS245W ACTIVE CFP W 20 1 TBD A42 N / A for Pkg Type
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com 6-Dec-2006
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com 30-Apr-2007
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com 30-Apr-2007
Device Package Pins Site Reel Reel A0 (mm) B0 (mm) K0 (mm) P1 W Pin1
Diameter Width (mm) (mm) Quadrant
(mm) (mm)
SN74LS245DBR DB 20 MLA 330 16 8.2 7.5 2.5 12 16 Q1
SN74LS245DWR DW 20 MLA 330 24 10.8 13.0 2.7 12 24 Q1
SN74LS245NSR NS 20 MLA 330 24 8.2 13.0 2.5 12 24 Q1
Device Package Pins Site Length (mm) Width (mm) Height (mm)
SN74LS245DBR DB 20 MLA 333.2 333.2 28.58
SN74LS245DWR DW 20 MLA 333.2 333.2 31.75
SN74LS245NSR NS 20 MLA 333.2 333.2 31.75
Pack Materials-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com 30-Apr-2007
Pack Materials-Page 3
MECHANICAL DATA
NO. OF A B
18 17 16 15 14 13 12
TERMINALS
** MIN MAX MIN MAX
0.020 (0,51)
0.010 (0,25)
0.055 (1,40)
0.045 (1,14)
0.045 (1,14)
0.035 (0,89)
4040140 / D 10/96
0,38
0,65 0,15 M
0,22
28 15
0,25
0,09
5,60 8,20
5,00 7,40
Gage Plane
1 14 0,25
A 0°–ā8° 0,95
0,55
Seating Plane
PINS **
14 16 20 24 28 30 38
DIM
4040065 /E 12/01
Products Applications
Amplifiers amplifier.ti.com Audio www.ti.com/audio
Data Converters dataconverter.ti.com Automotive www.ti.com/automotive
DSP dsp.ti.com Broadband www.ti.com/broadband
Interface interface.ti.com Digital Control www.ti.com/digitalcontrol
Logic logic.ti.com Military www.ti.com/military
Power Mgmt power.ti.com Optical Networking www.ti.com/opticalnetwork
Microcontrollers microcontroller.ti.com Security www.ti.com/security
Low Power www.ti.com/lpw Telephony www.ti.com/telephony
Wireless
Video & Imaging www.ti.com/video
Wireless www.ti.com/wireless
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2007, Texas Instruments Incorporated