Catalog en 20140924 ALQ00198

Semiconductor Catalog Sep.
2014
Photocouplers and Photorelays
SEMICONDUCTOR & STORAGE PRODUCTS

h t t p : / / t o s h i b a . s e m i c o n - s t o r a g e . c o m /
Photocouplers are widely used in various electronic devices to isolate high-speed
LED Photo detector
signals from noise-sensitive circuits. Toshiba’s photocouplers consist of a
high-intensity infrared light-emitting diode (LED) optically coupled to a photodetector
fabricated using the latest process. The LED-photodetector couple is encapsulated
in an electrically insulating resin with high transparency. Features of Toshiba’s
photocouplers include certification to many international safety standards, high
isolation and low power consumption. They are suitable for applications requiring a
high level of safety.
Product Lineup
Both photocouplers and photorelays consist of a light-emitting element and a light-receiving element in the same package. Their input
and output signals are optically coupled with each other to provide electrical isolation. Photocouplers and photorelays are available with
many output types to meet various interface needs.
Transistor-Output Page 10 IC-Output
Page 16
Vcc
GND
AC input DC input Darlington
High-Speed Communications
VCC
Triac Output Page 44 GND
IPM Drive
Photocoupler
ZC Product Lineup
Zero Cross Non Zero Cross
IGBT/MOSFET Drive
Thyristor Output Photovoltaic-Output Page 49 Photorelays page 30
Page 48
General-Purpose With discharge 1-Form-A 1-Form-B

resistor
New Products Digest Page 6 Board Assembly Page 66
Part Naming Conventions Page 50 Device Degradation Page 68
Package Information Page 51 Safety Standard Approvals Page 74
Packing Information Page 61
2
Features of Toshiba Photocouplers
Benefits for System Applications
Enhanced safety
Operating temperature (Topr) of up to 125°C, isolation voltage of 5 kVrms,
Toshiba’s and guaranteed common-mode rejection (CMR) of 40 kV/+s
technologies Low power consumption

1 mA input current and 3 mW output power consumption
sHigh-power infrared LEDs
s0.13 μm process
sHigh noise immunity
Small and thin packages
SO6 with guaranteed clearance and creepage distances of 5 mm,
sHigh isolation performance
ultra-small surface-mount USOP
sInternational safety standard
certification
Extensive products
Various output configurations: Transistor-, IC- and triac-output photocouplers,
photorelays, etc.
Photocoupler Product Tree
Package
DIP4 DIP6 O
General-purpose packages
DIP8 DIP16 O
Lead-forming options for surface mounting
DIP4 DIP6
O
*7-mm clearance/creepage; * 0.4-mm isolation thickness
SDIP6 O
6-pin SMD package (1.27-mm lead pitch)
SDIP6
O
* 5-mm clearance/creepage; * 0.4-mm isolation thickness
DIP8 DIP16
SO6 O
5-pin SMD package (1.27-mm lead pitch); low-profile
SO6
SO6L O
SO6L
SO8 O
SO8
SOP4 SO4 O
SOP16 SO16
O
SO4 SOP4 SO16 SOP16
O
SO16L O
SO16L
MFSOP6 O
SMD package (1.27-mm lead pitch)
MFSOP6
O
SMD package
2.54SOP4 2.54SOP6 2.54SOP8
(2.54-mm lead pitch)
2.54SOP4 2.54SOP6 2.54SOP8
SSOP4 SSOP4 O
Ultra-small; SMD package (1.27-mm lead pitch)
USOP4 USOP4 O
Ultra-small; SMD package (1.27-mm lead pitch)
VSON4 VSON4 O
Very Small Outline Non-leaded; SMD package
Internal Structure of Toshiba’s Photocouplers (Representative example)
Single Molded (White Package) Double Molded (Black Package)
3
1 Product Index
Part Number Package Output Page Part Number Package Output Page
TLP104 SO6 IC 24 TLP2348 SO6 IC 21
TLP109(IGM) SO6 IC 24 TLP2358 SO6 IC 19
TLP116A SO6 IC 22 TLP2361 SO6 IC 22
TLP117 MFSOP6 IC 24 TLP2362 SO6 IC 21
TLP124 MFSOP6 Transistor 12 TLP2367 SO6 IC 24
TLP127 MFSOP6 Darlington transistor 15 TLP2391 SO6 IC 21
TLP148G MFSOP6 Thyristor 48 TLP2404 SO8 IC 24
TLP151A SO6 IC 26 TLP2405 SO8 IC 19
TLP155E SO6 IC 26 TLP240A DIP4 MOSFET (Photorelay) 38
TLP160G MFSOP6 Triac 44 TLP240AF DIP4 MOSFET (Photorelay) 38
TLP160J MFSOP6 Triac 44 TLP240D DIP4 MOSFET (Photorelay) 38
TLP161G MFSOP6 Triac 44 TLP240DF DIP4 MOSFET (Photorelay) 38
TLP161J MFSOP6 Triac 44 TLP240G DIP4 MOSFET (Photorelay) 38
TLP163J MFSOP6 Triac 44 TLP240GA DIP4 MOSFET (Photorelay) 39
TLP165J MFSOP6 Triac 44 TLP240GAF DIP4 MOSFET (Photorelay) 39
TLP166J MFSOP6 Triac 44 TLP240GF DIP4 MOSFET (Photorelay) 38
TLP168J MFSOP6 Triac 44 TLP240J DIP4 MOSFET (Photorelay) 39
TLP170A 2.54SOP4 MOSFET (Photorelay) 34 TLP240JF DIP4 MOSFET (Photorelay) 39
TLP170D 2.54SOP4 MOSFET (Photorelay) 34 TLP2418 SO8 IC 22
TLP170G 2.54SOP4 MOSFET (Photorelay) 35 TLP241A DIP4 MOSFET (Photorelay) 38
TLP170J 2.54SOP4 MOSFET (Photorelay) 35 TLP241AF DIP4 MOSFET (Photorelay) 38
TLP171A 2.54SOP4 MOSFET (Photorelay) 34 TLP2451A SO8 IC 26
TLP171D 2.54SOP4 MOSFET (Photorelay) 35 TLP2466 SO8 IC 22
TLP171GA 2.54SOP4 MOSFET (Photorelay) 35 TLP2468 SO8 IC 22
TLP171J 2.54SOP4 MOSFET (Photorelay) 35 TLP250H DIP8 IC 28
TLP172A 2.54SOP4 MOSFET (Photorelay) 34 TLP250HF DIP8 IC 28
TLP172G 2.54SOP4 MOSFET (Photorelay) 35 TLP2530 DIP8 IC 18
TLP174GA 2.54SOP4 MOSFET (Photorelay) 35 TLP2601 DIP8 IC 21
TLP175A SO6 MOSFET (Photorelay) 33 TLP2630 DIP8 IC 21
TLP176A 2.54SOP4 MOSFET (Photorelay) 34 TLP2631 DIP8 IC 21
TLP176D 2.54SOP4 MOSFET (Photorelay) 35 TLP265J SO6 Triac 44
TLP176GA 2.54SOP4 MOSFET (Photorelay) 35 TLP2662F DIP8 IC 21
TLP179D 2.54SOP4 MOSFET (Photorelay) 34 TLP266J SO6 Triac 45
TLP182 SO6 Transistor 11 TLP267J SO6 Triac 45
TLP183 SO6 Transistor 11 TLP268J SO6 Triac 45
TLP184 (SE SO6 Transistor 11 TLP2703 SO6L IC 17
TLP185 (SE SO6 Transistor 11 TLP2766 SDIP6 IC 23
TLP187 SO6 Darlington transistor 15 TLP2766F SDIP6 IC 23
TLP188 SO6 Transistor 11 TLP2767 SDIP6 IC 24
TLP190B MFSOP6 Photovoltaic 49 TLP2767F SDIP6 IC 24
TLP191B MFSOP6 Photovoltaic 49 TLP2768 SDIP6 IC 23
TLP192A 2.54SOP6 MOSFET (Photorelay) 36 TLP2768F SDIP6 IC 23
TLP192G 2.54SOP6 MOSFET (Photorelay) 36 TLP280-4 SOP16 Transistor 14
TLP197A 2.54SOP6 MOSFET (Photorelay) 36 TLP281-4 SOP16 Transistor 12
TLP197D 2.54SOP6 MOSFET (Photorelay) 36 TLP290 (SE SO4 Transistor 11
TLP197G 2.54SOP6 MOSFET (Photorelay) 36 TLP290-4 SO16 Transistor 14
TLP197GA 2.54SOP6 MOSFET (Photorelay) 36 TLP291 (SE SO4 Transistor 11
TLP199D 2.54SOP6 MOSFET (Photorelay) 36 TLP291-4 SO16 Transistor 12
TLP200D 2.54SOP8 MOSFET (Photorelay) 37 TLP292 SO4 Transistor 11
TLP202A 2.54SOP8 MOSFET (Photorelay) 37 TLP292-4 SO16 Transistor 14
TLP202G 2.54SOP8 MOSFET (Photorelay) 37 TLP293 SO4 Transistor 11
TLP2066 MFSOP6 IC 22 TLP293-4 SO16 Transistor 12
TLP206A 2.54SOP8 MOSFET (Photorelay) 37 TLP2955 DIP8 IC 20
TLP206G 2.54SOP8 MOSFET (Photorelay) 37 TLP2955F DIP8 IC 20
TLP206GA 2.54SOP8 MOSFET (Photorelay) 37 TLP2958 DIP8 IC 20
TLP2095 MFSOP6 IC 19 TLP2958F DIP8 IC 20
TLP2098 MFSOP6 IC 19 TLP2962 DIP8 IC 21
TLP209D 2.54SOP8 MOSFET (Photorelay) 37 TLP2962F DIP8 IC 21
TLP2105 SO8 IC 19 TLP3022(S) DIP6 Triac 46
TLP2108 SO8 IC 19 TLP3022F(S) DIP6 Triac 46
TLP2118E SO8 IC 23 TLP3023F(S) DIP6 Triac 46
TLP2166A SO8 IC 22 TLP3043(S) DIP6 Triac 46
TLP2200 DIP8 IC 20 TLP3052F(S) DIP6 Triac 47
TLP221A DIP4 MOSFET (Photorelay) 38 TLP3062(S) DIP6 Triac 47
TLP221AF DIP4 MOSFET (Photorelay) 38 TLP3062F(S) DIP6 Triac 47
TLP222A DIP4 MOSFET (Photorelay) 38 TLP3063(S) DIP6 Triac 47
TLP222A-2 DIP8 MOSFET (Photorelay) 41 TLP3063F(S) DIP6 Triac 47
TLP222D DIP4 MOSFET (Photorelay) 38 TLP3064(S) DIP6 Triac 47
TLP222G DIP4 MOSFET (Photorelay) 39 TLP3064F(S) DIP6 Triac 47
TLP222G-2 DIP8 MOSFET (Photorelay) 41 TLP3082(S) DIP6 Triac 47
TLP224G DIP4 MOSFET (Photorelay) 39 TLP3082F(S) DIP6 Triac 47
TLP224G-2 DIP8 MOSFET (Photorelay) 41 TLP3100 2.54SOP6 MOSFET (Photorelay) 36
TLP224GA DIP4 MOSFET (Photorelay) 39 TLP3102 2.54SOP6 MOSFET (Photorelay) 36
TLP224GA-2 DIP8 MOSFET (Photorelay) 41 TLP3103 2.54SOP6 MOSFET (Photorelay) 36
TLP225A DIP4 MOSFET (Photorelay) 38 TLP3105 2.54SOP6 MOSFET (Photorelay) 36
TLP227A DIP4 MOSFET (Photorelay) 38 TLP3107 2.54SOP6 MOSFET (Photorelay) 36
TLP227A-2 DIP8 MOSFET (Photorelay) 41 TLP3111 2.54SOP4 MOSFET (Photorelay) 34
TLP227G DIP4 MOSFET (Photorelay) 39 TLP3114 2.54SOP4 MOSFET (Photorelay) 34
TLP227GA DIP4 MOSFET (Photorelay) 39 TLP3116 2.54SOP4 MOSFET (Photorelay) 34
TLP227GA-2 DIP8 MOSFET (Photorelay) 41 TLP3118 2.54SOP4 MOSFET (Photorelay) 34
TLP228G DIP4 MOSFET (Photorelay) 38 TLP3119 2.54SOP4 MOSFET (Photorelay) 34
TLP2301 SO6 IC 16 TLP3121 2.54SOP4 MOSFET (Photorelay) 34
4
Part Number Package Output Page Part Number Package Output Page
TLP3131 2.54SOP4 MOSFET (Photorelay) 34 TLP550 DIP8 IC 17
TLP3203 SSOP4 MOSFET (Photorelay) 33 TLP551 DIP8 IC 18
TLP3231 SSOP4 MOSFET (Photorelay) 33 TLP559(IGM) DIP8 IC 24
TLP3240 SSOP4 MOSFET (Photorelay) 33 TLP560G DIP6 Triac 46
TLP3241 SSOP4 MOSFET (Photorelay) 33 TLP560J DIP6 Triac 47
TLP3250 SSOP4 MOSFET (Photorelay) 33 TLP561G DIP6 Triac 46
TLP3275 SSOP4 MOSFET (Photorelay) 33 TLP561J DIP6 Triac 47
TLP3303 USOP4 MOSFET (Photorelay) 32 TLP570 DIP6 Darlington transistor 15
TLP3306 USOP4 MOSFET (Photorelay) 32 TLP5701 SO6L IC 26
TLP331 DIP6 Transistor 12 TLP5702 SO6L IC 27
TLP332 DIP6 Transistor 12 TLP590B DIP6 Photovoltaic 49
TLP3320 USOP4 MOSFET (Photorelay) 32 TLP591B DIP6 Photovoltaic 49
TLP3330 USOP4 MOSFET (Photorelay) 32 TLP592A DIP6 MOSFET (Photorelay) 40
TLP3331 USOP4 MOSFET (Photorelay) 32 TLP592G DIP6 MOSFET (Photorelay) 40
TLP3340 USOP4 MOSFET (Photorelay) 32 TLP597A DIP6 MOSFET (Photorelay) 40
TLP3341 USOP4 MOSFET (Photorelay) 32 TLP597G DIP6 MOSFET (Photorelay) 40
TLP3342 USOP4 MOSFET (Photorelay) 32 TLP597GA DIP6 MOSFET (Photorelay) 40
TLP3350 USOP4 MOSFET (Photorelay) 32 TLP598AA DIP6 MOSFET (Photorelay) 40
TLP3351 USOP4 MOSFET (Photorelay) 32 TLP598GA DIP6 MOSFET (Photorelay) 40
TLP3375 USOP4 MOSFET (Photorelay) 32 TLP620 DIP4 Transistor 14
TLP3403 VSON4 MOSFET (Photorelay) 31 TLP620F DIP4 Transistor 14
TLP3412 VSON4 MOSFET (Photorelay) 31 TLP624 DIP4 Transistor 12
TLP3420 VSON4 MOSFET (Photorelay) 31 TLP627 DIP4 Darlington transistor 15
TLP350 DIP8 IC 28 TLP631 DIP6 Transistor 13
TLP350F DIP8 IC 28 TLP632 DIP6 Transistor 13
TLP350H DIP8 IC 29 TLP651 DIP8 IC 18
TLP350HF DIP8 IC 29 TLP700 SDIP6 IC 28
TLP351 DIP8 IC 28 TLP700A SDIP6 IC 28
TLP351A DIP8 IC 28 TLP700AF SDIP6 IC 28
TLP351AF DIP8 IC 28 TLP700F SDIP6 IC 28
TLP351F DIP8 IC 28 TLP700H SDIP6 IC 28
TLP351H DIP8 IC 28 TLP700HF SDIP6 IC 28
TLP351HF DIP8 IC 28 TLP701 SDIP6 IC 27
TLP352 DIP8 IC 29 TLP701A SDIP6 IC 27
TLP352F DIP8 IC 29 TLP701AF SDIP6 IC 27
TLP3542 DIP6 MOSFET (Photorelay) 40 TLP701F SDIP6 IC 27
TLP3543 DIP6 MOSFET (Photorelay) 40 TLP701H SDIP6 IC 27
TLP3544 DIP6 MOSFET (Photorelay) 40 TLP701HF SDIP6 IC 27
TLP3545 DIP6 MOSFET (Photorelay) 40 TLP705A SDIP6 IC 27
TLP3546 DIP6 MOSFET (Photorelay) 40 TLP705AF SDIP6 IC 27
TLP3553 DIP4 MOSFET (Photorelay) 38 TLP708 SDIP6 IC 23
TLP3555 DIP4 MOSFET (Photorelay) 38 TLP714 SDIP6 IC 24
TLP358 DIP8 IC 29 TLP715 SDIP6 IC 19
TLP358F DIP8 IC 29 TLP715F SDIP6 IC 19
TLP358H DIP8 IC 29 TLP716 SDIP6 IC 23
TLP358HF DIP8 IC 29 TLP716F SDIP6 IC 23
TLP360J DIP4 Triac 45 TLP718 SDIP6 IC 20
TLP360JF DIP4 Triac 45 TLP718F SDIP6 IC 20
TLP361J DIP4 Triac 45 TLP719 SDIP6 IC 17
TLP361JF DIP4 Triac 45 TLP719F SDIP6 IC 17
TLP363J DIP4 Triac 45 TLP731 DIP6 Transistor 13
TLP363JF DIP4 Triac 45 TLP732 DIP6 Transistor 13
TLP371 DIP6 Darlington transistor 15 TLP733 DIP6 Transistor 13
TLP372 DIP6 Darlington transistor 15 TLP733F DIP6 Transistor 13
TLP373 DIP6 Darlington transistor 15 TLP734 DIP6 Transistor 13
TLP3762(S) DIP6 Triac 47 TLP734F DIP6 Transistor 13
TLP3762F(S) DIP6 Triac 47 TLP748J DIP6 Thyristor 48
TLP3782(S) DIP6 Triac 47 TLP748JF DIP6 Thyristor 48
TLP3782F(S) DIP6 Triac 47 TLP750 DIP8 IC 18
TLP3783(S) DIP6 Triac 47 TLP750F DIP8 IC 18
TLP3783F(S) DIP6 Triac 47 TLP751 DIP8 IC 18
TLP385 SO6L Transistor 12 TLP751F DIP8 IC 18
TLP3902 MFSOP6 Photovoltaic 49 TLP754 DIP8 IC 25
TLP3904 SSOP4 Photovoltaic 49 TLP754F DIP8 IC 25
TLP3905 SO6 Photovoltaic 49 TLP759 DIP8 IC 18
TLP3906 SO6 Photovoltaic 49 TLP759(IGM) DIP8 IC 25
TLP3914 SSOP4 Photovoltaic 49 TLP759F DIP8 IC 18
TLP3924 SSOP4 Photovoltaic 49 TLP759F(IGM) DIP8 IC 25
TLP4006G DIP8 MOSFET (Photorelay) 43 TLP762J DIP6 Triac 47
TLP4026G 2.54SOP8 MOSFET (Photorelay) 43 TLP762JF DIP6 Triac 47
TLP4176G 2.54SOP4 MOSFET (Photorelay) 42 TLP763J DIP6 Triac 47
TLP4197G 2.54SOP6 MOSFET (Photorelay) 42 TLP763JF DIP6 Triac 47
TLP4206G 2.54SOP8 MOSFET (Photorelay) 43 TLP785 DIP4 Transistor 13
TLP4227G DIP4 MOSFET (Photorelay) 42 TLP785F DIP4 Transistor 13
TLP4227G-2 DIP8 MOSFET (Photorelay) 43 TLP797GA DIP6 MOSFET (Photorelay) 40
TLP4597G DIP6 MOSFET (Photorelay) 42 TLP797GAF DIP6 MOSFET (Photorelay) 40
TLP512 DIP6 IC 17 TLP797J DIP6 MOSFET (Photorelay) 40
TLP513 DIP6 IC 21 TLP797JF DIP6 MOSFET (Photorelay) 40
TLP5214 SO16L IC 27 TLP798GA DIP6 MOSFET (Photorelay) 40
TLP523 DIP4 Darlington transistor 15 TLPN137 DIP8 IC 21
TLP525G DIP4 Triac 46 6N135 DIP8 IC 25
TLP531 DIP6 Transistor 12 6N136 DIP8 IC 25
TLP532 DIP6 Transistor 12 6N137 DIP8 IC 25
TLP548J DIP6 Thyristor 48 6N138 DIP8 IC 25
TLP549J DIP8 Thyristor 48 6N139 DIP8 IC 25
5
2 New Products Digest
Low-PWD, IC-Output Photocouplers for IPM Drives:

IC Output
TLP2345, TLP2348
The TLP2345 and TLP2348 photocouplers are specifically designed to drive intelligent power
modules (IPMs). These photocouplers feature high speed, high-temperature operation and low
power consumption. They offer a wide supply voltage range (VCC = 4.5 to 30 V) in a compact
package. As such, they are suited not only to IPM drives, but also to a wide range of industrial and
other applications, including communication interfaces (RS232, RS433, and RS485, etc.), and
solutions for data transmission between circuits with different voltages.
QFeatures
O Wide operating temperature range: Topr = –40 to 110°C
O Allows direct driving by a microcontroller
Supply current: 3 mA (max)
Threshold input current: 1.6 mA (max)
O High noise immunity between the input and the output Common-mode transient immunity:
"CMH", "CML" * 30 kV/+s Vcc
QKey Specifications
GND
TLP2345 TLP2348 SHIELD
Characteristics
Buffer logic Inverter logic
Supply voltage Vcc 4.5 to 30 V

QPackage: 5-pin SO6
Propagation delay time tpHL/tpLH (max) 120 ns
QApplications
Pulse width distortion "tpHL-tpLH" (max) 40 ns
O FA (for IPM drive)
Propagation delay skew tpsk 70 ns O High-speed digital interface for
measurement or control devices
Isolation voltage BVs (min) 3750 Vrms
O Programmable logic controllers
High-Speed IC-Output Photocoupler That Supports Both

IC Output
Positive and Negative Input Excursions: TLP2391
The TLP2391 photocoupler allows high-speed communications, making it suitable for servo motor
and programmable logic controller (PLC) applications. It supports both positive and negative
excursions of the input. While PLCs in Japan primarily use sink logic to provide an input to the
photocoupler, those outside of Japan mainly use source logic for this purpose. The TLP2391 has two
anti-parallel LEDs to allow both sink and source logic inputs, eliminating the need for an external
bridge circuit.
The TLP2391 supports a data rate of up to 10 Mbps, making it suitable for high-speed communication
interface applications (RS232, RS422, RS485, etc.) in industrial equipment.
QFeatures
O Operating temperature: Topr = –40 to 125°C
O Supply voltage: VCC = 2.7 to 5.5 V
O Supply current: ICC = 1 mA
O Threshold input current: IFHL = 2.3 mA (VCC = 3.3 V)

Vcc
IFHL = 2.5 mA (VCC = 5.0 V)
O Propagation delay time: tpHL /tpLH = 100 ns (max)
O Pulse width distortion: "tpHL-tpLH" = 30 ns (max) GND

O Propagation delay skew: tpsk = 40 ns (max)
SHIELD
QApplications
O Programmable logic controllers (PLC) QPackage: 5-pin SO6
O Servo motors
O General-purpose inverters
O Industrial automation equipment
6
High-Current Photorelays with Reinforced Insulation:
Photorelay
TLP241A, TLP241AF
The TLP241A/AF is the new addition to the TLP240 series of low-cost photorelays with reinforced
insulation. With a guaranteed maximum on-state current of 2 A, it is particularly well suited for use in
factory automation (FA), which requires the control of high current.
Housed in the double-mold DIP4 package, it offers an isolation voltage of 5000 Vrms (AC, 1 minute)
for reinforced insulation.
With the release of the TLP241A/AF, the TLP240 series now offers an even wider off-state output
terminal voltage range of 40 to 600 V. It is suitable for a wide range of applications such as FA,
smart meters and security equipment.
QFeatures
O ON-state current: ION = 2 A (max)
O OFF-state output terminal voltage: VOFF = 40 V (min)
O Isolation voltage: BVS = 5000 Vrms (min)
O Two devices with different clearance and creepage distances
TLP241A: 7 mm (min)
TLP241AF: 8 mm (min)
QApplications
O Replace mechanical relays
O Security systems
O Measurement control systems, factory automation (FA) control systems
QPackage: DIP4
O Watt-hour meters, gas meters and water meters
O Watt-hour meters, gas meters and water meters
O Smart meters
O Medical equipment
15-Mbps Low-Power-Consumption IC-Output

Photocoupler TLP2361, TLP2161 IC Output
The TLP2361 and TLP2161 photocouplers feature low power consumption and a
transfer rate of 15 Mbps. Thanks to the use of Toshiba’s proprietary high-reliability,
high-output infrared LED, low threshold input current has been realized. This means
these photocouplers can be driven directly by a microprocessor without requiring a
buffer, which contributes to lower power consumption of the system in where they are
used.
Because the new LED is stable even at high ambient temperatures, operation is
guaranteed up to a temperature rating of 125°C. The BiCMOS process makes it
possible to keep the supply current to 1 mA or less per channel. In order to
TLP2361 TLP2161
accommodate the trend towards lower power voltages, the receiver IC characteristics
are guaranteed over a power voltage range from 2.7 to 5.5 V.
QFeatures
O Low-voltage operation Vcc Vcc
Guaranteed supply voltage range: VCC = 2.7 to 5.5 V
O Data transfer rate: 15 Mbps (typ.) (NRZ)
O Low supply current thanks to the BiCMOS process GND

Supply current: TLP2361 = 1.0 mA (max) SHIELD
GND
TLP2161 = 2.0 mA (max) TLP2361 SHIELD
O Low threshold input current
TLP2161
1.3 mA (max) (at Ta = 105°C)
1.6 mA (max) (at Ta = 125°C)
O High noise immunity between the input and the output
Common-mode transient immunity: "CMH", "CML" * 20 kV/+s QPackage: 5-pin SO6 (TLP2361)
O Guaranteed operation at high temperatures
SO8 (TLP2161)
Operating temperature range: Topr = –40 to 125°C
QApplications
O FA networks
O I/O interface boards
O High-speed digital interfaces in PLCs, controllers, etc.
7
2 New Products Digest
Low-Input-Current Transistor-Output Photocouplers:

TLP182, TLP183, TLP292, TLP293 Transistor Output
The TLP182 and TLP183 are low-input-current-type transistor-output photocoupler
utilizing the SO6 package.
By employing Toshiba’s original high-output LED, these products guarantee not only a
high current transfer ratio at the conventional input current of 5 mA, but also the same
current transfer ratio at the low LED current of 0.5 mA.
Especially when utilizing LED current at 100 VAC and other high voltages, these
products significantly contribute to a reduction in power consumption by reducing the
LED current of the photocoupler. The TLP182 and TLP183 also support operation at
up to an ambient temperature of 125°C, allowing for reliable use in industrial devices,
compact power supplies and other devices used in environments of severe heat. 4-pin SO6 SO4
We have also released the TLP292 and TLP293, which utilize the smaller SO4
package.
QFeatures AC input type DC input type

O Smaller and thinner package produced in high efficiency production lines
(SO6 and SO4)
O Guaranteed high current transfer ratio (CTR) at low input current of 0.5 mA
O Guaranteed proper operation at ambient temperatures up to 125°C
O Produced overseas (Thailand)
TLP182 TLP183
QApplications TLP292 TLP293
O Switching power supplies
O Industrial devices (PLCs, inverters)
O AC line detection for household appliances
QPackage: 4-pin SO6 (TLP182 / TLP183)
SO4 (TLP292 / TLP293)
Triac-Output Photocouplers with Reinforced

Insulation Supporting Low Input Current Control
TLP267J, TLP268J Triac Output
Toshiba has released 600-V triac-output photocouplers and added to its lineup:
TLP267J, a NZC (Non Zero Cross) type, and TLP268J, a ZC (Zero Cross) type. They
support LED trigger current (max) of 3 mA for standard products or even 2 mA for
selected products, allowing output-side control by low input current. This contributes to
energy saving in the apparatus that use these products. In addition, by using the
double-mold SO6 package, they feature reinforced insulation with 3750 Vrms (AC, 1
minute) isolation voltage between the input and the output.
In addition to guaranteed creepage distance/clearance of 5 mm (min), these products
will be certified for UL / cUL / VDE standards. In addition, the use of long-lifetime LEDs
enhances design flexibility. These products also support JEDEC-standard reflow
mounting, allowing more convenient handling.
QFeatures
O Reinforced insulation: Isolation voltage, BVs = 3750 Vrms (AC, 1 minute) NZC type ZC type
O Support of mounting in accordance with the JEDEC standard
O Support of LED trigger current (IFT) rank
No rank: 3 mA (max)
(IFT2): 2 mA (max)
O UL, cUL and VDE approvals ZC
TLP267J TLP268J
QApplications
O Triac drivers
O Programmable controllers
O AC output modules
QPackage: 4-pin SO6
O Solid-state relays
8
Photorelays in Industry’s Smallest Package:
TLP3403, TLP3412 Photorelay
Toshiba has released the TLP3403 and TLP3412 photorelays in the industry’s smallest [1] VSON
(Very Small Outline Non-leaded) package in production quantities. Compared to equivalent Toshiba
products in a USOP package, the new photorelays reduce the assembly area by 50% and volume by
60%. This can contribute to the development of smaller and thinner systems and also makes it
possible to increase the number of photorelays on a circuit board to 1.3 times to 1.5 times that of
conventional products.
Also, by using a new internal structure, a chip-on-chip structure [2], the new products, while retaining
the same electrical characteristics as conventional USOP package products, secure improved
high-frequency characteristics, which are necessary for signal transmission. The new photocouplers
are suitable for various tester applications, especially for use in power-line switching and
measuring-line switching. QPackage: VSON
QKey Specifications
Part Number TLP3403 TLP3412
VSON package
Package Dimension
Area: 1.5 mm x 2.5 mm (max), Height: 1.3 mm (max)
On-state Current ION 1 A (max) 0.4 A (max)
On-state Resistance RON 0.18 1 (typ.) / 0.22 1 (max) 1 1 (typ.) / 1.5 1 (max)
Off-state Voltage VOFF 20 V (min) 60 V (min)
Off-state Capacitance (Photo side) COFF 40 pF (typ.) 20 pF (typ.)
Trigger LED Current IFT 3 mA (max)
Equivalent Rise Time (Pass Characteristic) 40 ps (typ.)
Isolation Voltage BVs 300 Vrms (min)
Note1: For photocoupler products, as of January 31, 2014. Toshiba survey.
Note2: Chip-on-chip structure: A structure that mounts an LED chip on top of a detector chip, with insulation material in between.
Gate-Drive Photocouplers in the Thin SO6L Package IC Output for

TLP5701, TLP5702 IGBT/MOSFET Drive
Toshiba has released low-height SO6L package gate-drive photocouplers for use in driving small- to
medium-power IGBTs and power MOSFETs. The TLP5701 for driving small-power
IGBTs/MOSFETs and the TLP5702 for driving middle-power IGBTs/MOSFETs are the first Toshiba
photocouplers to use the low-height SO6L package. At only 54% of Toshiba products that use the
SDIP6 package, the new devices will contribute to development of thinner systems. In spite of their
low height, the devices guarantee a creepage distance of 8 mm, making them suitable for
applications requiring higher isolation specs.
The TLP5701 and TLP5702 achieve low supply current of 2.0 mA (max) and low power consumption
by utilizing BiCMOS process technology. Combined with an original high-power, high-reliability
infrared LED, they can be used in a wide range of applications, including those that require high
thermo-stability, such as factory automation and home photovoltaic power systems, digital home
appliances and control equipment. Maximum propagation delay time and propagation delay skew are QPackage: SO6L
guaranteed within the defined operation temperature range (up to 110 degrees Centigrade), making
it possible to reduce dead time in the inverter circuit, which can secure higher operating efficiency.
QKey Specifications
Part Number TLP5701 TLP5702
Peak Output Current IOP ±0.6 A (max) ±2.5 A (max)
Peak Output Current VCC 10 V to 30 V 15 V to 30 V
Supply Current ICC 2.0 mA (max) 3.0 mA (max)
Threshold Input Current IFLH 5 mA (max)
Propagation Delay Time tpLH/tpHL 500 ns (max) 200 ns (max)
Propagation Delay Skew tpsk – 80 to 80 ns
Creepage Distance 8 mm (min)
Isolation Voltage BVS 5000 Vrms (min)
Operation Temperature Range Topr – 40°C to 110°C
For driving small-size power IGBTs (up to 20 A class) and For driving middle-size power IGBTs (up to 80 A class) and
power MOSFETs. power MOSFETs.
Applications
s FA Inverter s Power Supply (UPS) s AC Servo s FA Inverter s Photovoltaic Inverter
s Air Conditioner Inverters s Home Appliances s Power Supply (UPS) s AC Servo s Induction Cooking
9
3 Selection Guide
1 Transistor-Output and Darlington-Transistor-Output Photocouplers
Package
Features
SO4 SOP16 SO16 SO6 SO6L MFSOP6 DIP6 DIP4
Isolation
Voltage Single Quad Quad Single Single Single Single Single
TLP281-4 TLP291-4 TLP531

2500 Vrms
TLP532
TLP291(SE* TLP185(SE* TLP131

3750 Vrms
General-
purpose TLP731
TLP732
4000 Vrms
TLP733
TLP734
TLP385* TLP631 TLP785

5000 Vrms
TLP632
TLP293* TLP293-4* TLP183* TLP124

3750 Vrms
TLP137
Low IF
TLP331 TLP624
5000 Vrms
TLP332
3750 Vrms TLP188*

High VCEO
5000 Vrms TLP628
TLP280-4 TLP290-4
2500 Vrms
AC input TLP290(SE* TLP184(SE* TLP130

3750 Vrms
5000 Vrms TLP630 TLP620
3750 Vrms TLP292* TLP292-4* TLP182* TLP126

Low IF
5000 Vrms TLP626
TLP570 TLP523
Darlington 2500 Vrms TLP571
TLP572
2500 Vrms TLP127
3750 Vrms TLP187

High VCEO TLP371 TLP627
5000 Vrms TLP372
TLP373
*: New product
10
Reinforced Insulation in a Small, Surface-Mount SOP Package
(≥ 5-mm Clearance/Creepage and ≥ 0.4-mm Internal Isolation Thickness)
CTR BVs Safety Standards (1)
VCEO
Part Number Pin Configuration Features Min Max @IF / VCE 1 Minute
Rank (V) UL c-UL TÜV VDE BSI CQC
(%) (%) (mA) (V) (Vrms)
6 4 ̶ 50 600
Y 50 150
SO6 (reinforced insulation)
TLP182 * AC input GR 100 300 ±0.5/5 80 3750 ¡ ¡ ¨ ¡
Low input drive current
BL 200 600
1 3
GB 100 600
̶ 50 600
GB 100 600
6 4 Y 50 150
GR 100 300
TLP183 * BL 200 600 0.5/5 80 3750 ¡ ¡ ¨ ¡
YH 75 150
1 3
GRL 100 200
GRH 150 300
BLL 200 400
6 4
̶ 50 600
Y 50 150
TLP184 (SE * GR 100 300 ±5/5 80 3750 ¡ ¡ r ¨ ¡ r
AC input
BL 200
1 3
600
GB 100
̶ 50
600
GB 100
Y 50 150
GR 100 300
6 4 SO6 (reinforced insulation)
TLP185 (SE * BL 200 600 5/5 80 3750 ¡ ¡ r ¨ ¡ r
General-purpose
BLL 200 400
YH 75 150
1 3 GRL 100 200
GRH 150 300
SO6 (reinforced insulation) ̶ 50
TLP188 * High VCEO 600 5/5 350 3750 ¡ ¡ ¨ r ¡
VCEO ＝ 350 V GB 100
4 3 ̶ 50 600
SO4 Y 50 150
(reinforced insulation)
TLP290 (SE * GR 100 300 ±5/5 80 3750 ¡ ¡ r ¨ ¡ r
AC input
Lead pitch: 1.27 mm BL 200
1 2 600
GB 100
̶ 50
600
GB 100
4 3
Y 50 150
SO4 GR 100 300
TLP291 (SE * (reinforced insulation) 5/5 80 3750 ¡ ¡ r ¨ ¡ r
Lead pitch: 1.27 mm BLL 200 400
1 2 YH 75 150
GRL 100 200
GRH 150 300
4 3 ̶ 50 600
SO4 Y 50 150
TLP292 * GR 100 300 ±0.5/5 80 3750 ¡ ¡ ¨ r
AC input
Low input drive current BL 200 600
1 2
GB 100 600
̶ 50 600
GB 100 600
4 3
Y 50 150
GR 100 300
SO4
TLP293 * (reinforced insulation) BL 200 600 0.5/5 80 3750 ¡ ¡ ¨ r
YH 75 150
1 2 GRL 100 200
GRH 150 300
BLL 200 400
Note (1): Please refer to page 48. *: New product
11
3 Selection Guide
General-Purpose, Transistor-Output Photocouplers

VCEO
(%) (%) (mA) (V) (Vrms)
6 4
̶ 100
Mini-flat
TLP124 MFSOP6 1200 1/0.5 80 3750 ¡ ¡
BV 200
1 3
Mini-flat ̶ 50
6 5 4 MFSOP6
TLP131 600 5/5 80 3750 ¡ ¡
General-purpose
Internal base connection GB 100
Mini-flat ̶ 100
MFSOP6
TLP137 1 3 1200 1/0.5 80 3750 ¡ ¡
Internal base connection BV 200
16 15 14 13 12 11 10 9
SOP16 ̶ 50
4-channel version
TLP281-4 600 5/5 80 2500 ¡ ¡ r ¡ 7
Lead pitch: 1.27 mm
SEMKO-approved GB 100
1 2 3 4 5 6 7 8
16 15 14 13 12 11 10 9
SO16 ̶ 50 400
4-channel version
TLP291-4 5/5 80 2500 ¡ ¡ r ¡ r
equivalent of the TLP291
Lead pitch: 1.27 mm GB 100 400
1 2 3 4 5 6 7 8
16 15 14 13 12 11 10 9
SO16 ̶ 50
4-channel version
TLP293-4 * equivalent of the TLP293 600 0.5/5 80 3750 ¡ ¡ ¨ r
Lead pitch: 1.27 mm
Low input drive current GB 100
1 2 3 4 5 6 7 8
6 5 4
DIP6 ̶ 100
TLP331 1/0.5 55 5000 ¡ ¡
Internal base
connection BV 200
1 2 3
1200
6 5 4
DIP6 ̶ 100
TLP332 1/0.5 55 5000 ¡ ¡
No internal base
connection BV 200
1 2 3
̶ 50
600
GB 100
Y 50 150
6 4
SO6L GR 100 300
Long creepage and
TLP385 * BL 200 600 5/5 80 5000 ¡ ¡ ¨ r
clearance distance
≥ 8.0 mm (min) YH 75 150
1 3
GRL 100 200
GRH 150 300
BLL 200 400
̶ 50
6 5 4
DIP6 GB 100 600
General-purpose
TLP531 (2) BL 200 5/5 55 2500 ¡ ¡
Internal base
connection GR 100 300
1 2 3
Y 50 150
̶ 50
6 5 4
DIP6 GB 100 600
General-purpose
TLP532 (2) High EMI immunity BL 200 5/5 55 2500 ¡ ¡
No internal base
connection GR 100 300
1 2 3
Y 50 150
4 3
̶ 100 1200
DIP4
TLP624 1/0.5 55 5000 ¡ ¡ r ¡ 7
BV 200
1 2
Note (1),(2): Please refer to page 48. *: New product
12
General-Purpose, Transistor-Output Photocouplers (Continued)
VCEO
(%) (%) (mA) (V) (Vrms)
4 3
̶ 50
DIP4
TLP628 High VCEO 600 5/5 350 5000 ¡ ¡ r ¡ r
VCEO = 350 V
GB 100
1 2
6 5 4 ̶ 50
DIP6 600
General-purpose
TLP631 GB 100 5/5 55 5000 ¡ ¡
Internal base
connection
1 2 3 GR 100 300
6 5 4 ̶ 50
DIP6
General-purpose 600
TLP632 High EMI immunity GB 100 5/5 55 5000 ¡ ¡
No internal base
connection
1 2 3 GR 100 300
6 5 4 ̶ 50
DIP6 600
SEMKO-approved
TLP731 GB 100 5/5 55 4000 ¡ ¡ r ¡ 7
Internal base
connection
1 2 3 GR 100 300
6 5 4 ̶ 50
DIP6 600
SEMKO-approved
TLP732 GB 100 5/5 55 4000 ¡ ¡ r ¡ 7
No internal base
connection
1 2 3 GR 100 300
6 5 4 ̶ 50
DIP6 600
TLP733 SEMKO-approved
GB 100 5/5 55 4000 ¡ ¡ r ¡ 7
TLP733F Internal base
connection
1 2 3 GR 100 300
6 5 4 ̶ 50
DIP6 600
TLP734 SEMKO-approved
GB 100 5/5 55 4000 ¡ ¡ r ¡ 7
TLP734F No internal base
connection
1 2 3 GR 100 300
̶ 50 600
Y 50 150
4 3
GR 100 300
DIP4 BL 200
TLP785 (3) 600
High isolation voltage
GB 100 5/5 80 5000 ¡ ¡ r ¡ 7 ¡
TLP785F (3) UL-approved
(double protection) YH 75 150
1 2
GRL 100 200
GRH 150 300
BLL 200 400
Note (1),(3): Please refer to page 48.
13
3 Selection Guide
AC-Input, Transistor-Output Photocouplers

VCEO
(%) (%) (mA) (V) (Vrms)
6 4
Mini-flat
MFSOP6
TLP126 ̶ 100 1200 ±1/0.5 80 3750 ¡ ¡
AC input
1 3
6 5 4
Mini-flat ̶ 50
MFSOP6
TLP130 600 ±5/5 80 3750 ¡ ¡
AC input
Internal base connection GB 100
1 3
16 15 14 13 12 11 10 9
SOP16 ̶ 50
4-channel version
TLP280-4 Lead pitch: 1.27 mm 600 ±5/5 80 2500 ¡ ¡ r ¡ 7
AC input
SEMKO-approved GB 100
1 2 3 4 5 6 7 8
16 15 14 13 12 11 10 9
SO16 ̶ 50
4-channel version
TLP290-4 equivalent of the TLP290 400 ±5/5 80 2500 ¡ ¡ r ¡ r
Lead pitch: 1.27 mm
AC input GB 100
1 2 3 4 5 6 7 8
16 15 14 13 12 11 10 9 SO16
4-channel version ̶ 50
equivalent of the TLP292
TLP292-4 * 600 ±0.5/5 80 3750 ¡ ¡ ¨ r
Lead pitch: 1.27 mm
Low input drive current GB 100
1 2 3 4 5 6 7 8 AC input
4 3
̶ 50
TLP620 DIP4
AC input 600 ±5/5 55 5000 ¡ ¡ r ¡ 7
TLP620F SEMKO-approved
GB 100
1 2
4 3
̶ 100
DIP4
TLP626 Low input drive current 1200 ±1/0.5 55 5000 ¡ ¡ r ¡ 7
AC input
BV 200
1 2
6 5 4
̶ 50
DIP6
TLP630 AC input 600 ±5/5 55 5000 ¡
High isolation voltage
GB 100
1 2 3
14
Darlington-Transistor-Output Photocouplers
CTR VCE(sat) BVs Safety Standards (1)
VCEO
Part Number Pin Configuration Features Min @IF / VCE Max @IC / IF 1 Minute
(V) UL c-UL TÜV VDE BSI CQC
(%) (mA) (V) (V) (mA) (Vrms)
6 4
Mini-flat
TLP127 MFSOP6 1000 1/1 1.2 100/10 300 2500 ¡ ¡ ¡ ¡ 7
High VCEO
1 3
6 4
SO6
TLP187 (reinforced insulation) 1000 1/1 1.2 100/10 300 3750 ¡ ¡ ¨ r r
High VCEO
1 3
6 5 4
DIP6
TLP371 High VCEO 1000 1/1 1.2 100/10 300 5000 ¡ ¡ ¡
SEMKO-approved
1 2 3
6 5 4
DIP6
High VCEO
TLP372 1000 1/1 1.2 100/10 300 5000 ¡ ¡
No internal base
connection
1 2 3
6 4
DIP6
High VCEO
TLP373 1000 1/1 1.2 100/10 300 5000 ¡ ¡
Long emitter-collector
distance
1 2 3
4 3
DIP4
TLP523 500 1/1 1.0 50/10 55 2500 ¡ ¡
General-purpose
1 2
6 5 4
DIP6
TLP570 General-purpose 1000 1/1 1.2 100/10 35 2500 ¡ ¡
High EMI immunity
1 2 3
6 5 4
DIP6
General-purpose
TLP571 1000 1/1 1.2 100/10 35 2500 ¡
Internal base
connection
1 2 3
6 5 4
DIP6
TLP572 General-purpose 1000 1/1.2 1.2 100/10 55 2500 ¡
Built-in RBE
1 2 3
4 3
DIP4
TLP627 High VCEO 1000 1/1 1.2 100/10 300 5000 ¡ ¡ r ¡ 7
SEMKO-approved
1 2
Note (1): Please refer to page 48.
15
3 Selection Guide
2 Photocouplers for Logic Signal Transmission
Package
Features
Data Rate SO8 DIP8

(Typ.) Output MFSOP6 SO6 SO6L SDIP6 JEDEC
1ch 2ch 1ch 2ch
20 kbit/s Open-collector TLP2301
0.1 to 0.3 Open-collector TLP2303 TLP2403 TLP2703 TLP553 6N138
Mbit/s (Darlington) 6N139
TLP109 TLP2409 TLP719 TLP550 TLP2530 6N135
TLP2309 TLP551 TLP2531 6N136
TLP559
Open-collector TLP651
1 Mbit/s TLP750
TLP751
TLP759
TLP109(IGM) TLP559(IGM)
IPM
TLP759(IGM)
drive
TLP104 TLP2404 TLP714 TLP754
TLP2355 TLP2405 TLP2105 TLP715 TLP2955
Totem-pole TLP2358 TLP2408 TLP2108 TLP718 TLP2958
TLP2310**
AC TLP2095 TLP2395*
5 Mbit/s input TLP2098 TLP2398*
TLP555
3-state TLP558
TLP2200
TLP2345*
Totem-pole
TLP2348*
AC
input TLP2391*
10 Mbit/s TLP2362 TLP552 TLP2630 6N137

TLP554 TLP2631
Open-collector TLP2601 TLP2662
TLP2962
TLPN137
5V TLP116A TLP2116 TLP716
Totem- 3.3 V TLP2066 TLP2166A
pole TLP2361* TLP2466 TLP2160 TLP2766
15 to 20 3.3/5 V
Mbit/s TLP2366 TLP2161*
Open- 5V TLP118 TLP2418 TLP2118E TLP708
collector 3.3/5 V TLP2368 TLP2468 TLP2168 TLP2768A** TLP2768
Totem-
40 Mbit/s 3.3/5 V TLP2367** TLP2167** TLP2767**
pole
Totem-
50 Mbit/s 5V TLP117
pole
*: New product **: Under development
Photocouplers for Logic Signal Transmission at 20 kbit/s (Typ.)

BVs Safety Standards (1)
Data Rate
Part Number Pin Configuration Features Output/CTR @IF(IN) 1 Minute
(Typ. @NRZ) UL c-UL TÜV VDE BSI CQC
(mA) (Vrms)
5 4
SO6 (4 pin)
TLP2301 (reinforced insulation) 20k bit/s 50% Min 1 3750 ¡ ¡ ¨ ¡
1 3
16
Photocouplers for Logic Signal Transmission at 0.1 to 0.3 Mbit/s (Typ.)
Data Rate
(mA) (Vrms)
SO6
TLP2303 (reinforced insulation) 100k bit/s 900% Min 0.5 3750 ¡ ¡ ¨ r
6 5 4 Low input drive current
1 3
SO6L
TLP2703 * (reinforced insulation) 100k bit/s 900% Min 0.5 5000 r r r r
8 7 6 5
SO8
TLP2403 300k bit/s 400% Min 0.5 3750 ¡ ¡ ¡
SO8 version of the
TLP553
1 2 3 4
8 7 6 5
DIP8
TLP553 300k bit/s 400% Min 0.5 2500 ¡
1 2 3 4
Photocouplers for Logic Signal Transmission at 1 Mbit/s (Typ.)

Data Rate
(mA) (Vrms)
6 5 4
SHIELD
SO6
TLP109 1M bit/s 20% Min 16 3750 ¡ ¡ r ¨ r
1 3
6 5 4
SO6
SHIELD
TLP2309 3.3-V/5-V power supplies 1M bit/s 15% Min 10 3750 ¡ ¡ ¨ r

Topr (max) 110℃
1 Mbps standard
1 3
8 7 6 5
SO8
SHIELD
Topr (max) 125℃

TLP2409 1M bit/s 20% Min 16 3750 ¡ ¡ ¡
SO8 version of the
TLP109
1 2 3 4
6 5 4
SHIELD
TLP719 SDIP6
1M bit/s 20% Min 16 5000 ¡ ¡ ¡ ¡
TLP719F High CMR
1 2 3
6 5 4
DIP6
TLP512 6-pin package version of 1M bit/s 20% Min 16 2500 ¡
the TLP550
1 2 3
8 7 6 5
DIP8
No internal base 10% min
TLP550 1M bit/s 16 2500 ¡ ¡
connection (19% (min) for rank O)
High CMR
1 2 3 4
17
3 Selection Guide
Photocouplers for Logic Signal Transmission at 1 Mbit/s (Typ.) (Continued)

Data Rate
(mA) (Vrms)
8 7 6 5
DIP8 10% min

TLP551 1M bit/s 16 2500 ¡ ¡
Internal base connection (19% (min) for rank O)
1 2 3 4
8 7 6 5
DIP8
High CMR version of the
SHIELD
TLP559 TLP550 1M bit/s 20% Min 16 2500 ¡ ¡

No internal base
connection
1 2 3 4
8 7 6 5
DIP8
10% min
TLP651 High isolation voltage 1M bit/s 16 5000 ¡ ¡
(19% (min) for rank O)
Internal base connection
1 2 3 4
8 7 6 5
TLP750 DIP8
10% min
High isolation voltage 1M bit/s 16 5000 ¡ ¡ r ¡ 7
TLP750F (19% (min) for rank O)
SEMKO-approved
1 2 3 4
8 7 6 5
DIP8
TLP751 High isolation voltage
1M bit/s 10% Min 16 5000 ¡ ¡ r ¡ 7
TLP751F Internal base connection
SEMKO-approved
1 2 3 4
8 7 6 5
DIP8
SHIELD
TLP759 IEC950 design standard

1M bit/s 20% Min 16 5000 ¡ ¡ ¡ ¡ 7
TLP759F version of the TLP559
SEMKO-approved
1 2 3 4
DIP8
Dual channel version
TLP2530 1M bit/s 7% Min 16 2500 ¡ ¡
of the 6N135 and the
8 7 6 5
TLP550
1 2 3 4 DIP8
TLP2531 1M bit/s 19% Min 16 2500 ¡ ¡
of the 6N136 and the
TLP550
18
Data Rate
(mA) (Vrms)
6 5 4
GND
Vcc
Mini-flat
SHIELD
Totempole output IFLH = 3

TLP2095 MFSOP6 5M bit/s 3750 ¡ ¡ ¡
(Buffer logic) (max)
VCC = 3.0 to 20 V
1 3
6 5 4
GND
Vcc
Mini-flat
SHIELD
Totempole output IFHL = 3

TLP2098 MFSOP6 5M bit/s 3750 ¡ ¡ ¡
(Inverter logic) (max)
VCC = 3.0 to 20 V
1 3
6 5 4
GND
SO6
Vcc
SHIELD
(reinforced insulation) Totempole output IFLH = 1.6

TLP2355 5M bit/s 3750 ¡ ¡ ¨ r
VCC = 3.0 to 20 V (Buffer logic) (max)
Direct drive of an IPM
1 3
6 5 4
GND
SO6
Vcc
SHIELD
(reinforced insulation) Totempole output IFHL = 1.6

TLP2358 5M bit/s 3750 ¡ ¡ ¨ r
VCC = 3.0 to 20 V (Inverter logic) (max)
1 3
6 5 4
GND
Vcc
SO6
SHIELD
Totempole output IFLH = 1.0

TLP2310 ** (reinforced insulation) 5M bit/s 3750 r r r r
Ultra low consumption
1 3
6 5 4
GND
SO6
Vcc
SHIELD
AC input version of the Totempole output IFHL = 2.3

TLP2395 * 5M bit/s 3750 ¡ ¡ ¨ r
TLP2355 (Buffer logic) (max)
VCC = 3.0 to 20 V
1 3
6 5 4
SO6
GND
Vcc
SHIELD
AC input version of the Totempole output IFHL = 2.3

TLP2398 * 5M bit/s 3750 ¡ ¡ ¨ r
TLP2358 (Inverter logic) (max)
VCC = 3.0 to 20 V
1 3
8 7 6 5
SO8
VCC
GND
Low input current

SHIELD

TLP2405 SO8 version of the 5M bit/s 3750 ¡ ¡ ¡
TLP105
1 2 3 4
8 7 6 5
SO8
VCC
GND
Low input current

SHIELD
Totempole output IFHL = 1.6

TLP2408 SO8 version of the 5M bit/s 3750 ¡ ¡ ¡
TLP108
1 2 3 4
8 7 6 5
GND
VCC
SO8
SHIELD

TLP2105 Dual channel version of 5M bit/s 2500 ¡ ¡ r ¡
the TLP105
1 2 3 4
8 7 6 5
GND
VCC
SO8
SHIELD

TLP2108 Dual channel version of 5M bit/s 2500 ¡ ¡ r ¡
the TLP108
1 2 3 4
6 5 4
Vcc
GND
Propagation
SHIELD
TLP715 SDIP6
delay time Totempole output IFLH = 3
High CMR 5000 ¡ ¡ ¡ ¡
TLP715F 250 ns (Buffer logic) (max)
(max)
1 2 3
Note (1): Please refer to page 48. *: New product **: Under development
19
3 Selection Guide
Photocouplers for Logic Signal Transmission at 5 Mbit/s (Typ.) (Continued)

Data Rate
(mA) (Vrms)
6 5 4
Propagation
Vcc
GND
SDIP6
SHIELD
TLP718 delay time Totempole output IFHL = 3

High CMR 5000 ¡ ¡ ¡ ¡
TLP718F 250 ns (Inverter logic) (max)
(max)
1 2 3
8 7 6 5
DIP8
VCC
GND
Topr (max) 125℃

SHIELD
TLP2955 Totempole output IFLH = 1.6

Low input current 5M bit/s 5000 r r ¨
TLP2955F (Buffer logic) (max)
VCC = 3.0 to 20 V
1 2 3 4
8 7 6 5
DIP8
VCC
GND
Topr (max) 125℃

SHIELD
TLP2958 Totempole output IFHL = 1.6

Low input current 5M bit/s 5000 r r ¨
TLP2958F (Inverter logic) (max)
VCC = 3.0 to 20 V
1 2 3 4
8 7 6 5
VCC
GND
DIP8
SHIELD
3-state output IFLH = 1.6

TLP555 Low input current 5M bit/s 2500 ¡ ¡
High VCC operation
1 2 3 4
8 7 6 5
VCC
GND
DIP8
SHIELD
3-state output IFHL = 1.6

TLP558 Inverted logic version of 5M bit/s 2500 ¡ ¡
the TLP555
1 2 3 4
8 7 6 5
DIP8
VCC
GND
SHIELD
Low input current 3-state output IFLH = 1.6

TLP2200 5M bit/s 2500 ¡ ¡
High-speed (Buffer logic) (max)
High VCC operation
1 2 3 4
20
Data Rate
(mA) (Vrms)
6 5 4
GND
SO6
Vcc
SHIELD
(reinforced insulation) Totempole output IFLH = 1.6

TLP2345 * 10M bit/s 3750 r r ¨
High-speed (Buffer logic) (max)
1 3
6 5 4
GND
SO6
Vcc
SHIELD

TLP2348 * 10M bit/s 3750 r r ¨
High-speed (Inverter logic) (max)
1 3
6 5 4
SO6
GND
Vcc
SHIELD

TLP2391 * 3.3-V/5-V power supplies 10M bit/s 3750 ¡ ¡ ¨
AC input version of the
TLP2361
1 3
6 5 4
VCC
GND
SO6
SHIELD
(reinforced insulation) Open-collector output IFHL = 5

TLP2362 10M bit/s 3750 ¡ ¡ ¨ r
Topr (max) 125℃ (Inverter logic) (max)
10 Mbps standard
1 3
6 5 4
VCC
GND
DIP6
Open-collector output IFHL = 5
TLP513 6-pin package version of 10M bit/s 2500 ¡
the TLP552
1 2 3
8 7 6 5
VCC
GND
DIP8 Open-collector output IFHL = 5

TLP552 10M bit/s 2500 ¡
1 2 3 4
8 7 6 5
DIP8
VCC
GND
SHIELD
High-speed Open-collector IFHL = 5

TLP554 10M bit/s 2500 ¡ ¡ ¡
High CMR version of the (Inverter logic) (max)
TLP552
1 2 3 4
8 7 6 5
VCC
GND
DIP8
SHIELD

TLP2601 High CMR 10M bit/s 2500 ¡ ¡
High-speed
1 2 3 4
8 7 6 5
VCC
GND
DIP8
SHIELD
TLP2962 Open-collector output IFHL = 5

3.3-V/5-V power supplies 10M bit/s 5000 ¡ ¡ ¨
Topr (max) 125℃
1 2 3 4
8 7 6 5
VCC
GND
SHIELD
DIP8 Open-collector output IFHL = 5

TLPN137 10M bit/s 5000 ¡ ¡ ¨ r
1 2 3 4
8 7 6 5
DIP8
GND
VCC
Dual channel version Open-collector output IFHL = 5

TLP2630 10M bit/s 2500 ¡ ¡
of the 6N137 and the (Inverter logic) (max)
TLP552
1 2 3 4
8 7 6 5
DIP8
GND
VCC
SHIELD
High CMR Open-collector output IFHL = 5

TLP2631 10M bit/s 2500 ¡ ¡
Dual channel version of (Inverter logic) (max)
the TLP554
1 2 3 4
8 7 6 5
DIP8
GND
VCC
3.3-V/5-V power supplies

SHIELD

Topr (max) 125℃ 10M bit/s 5000 r r ¨
Dual channel version of
the TLP2962
1 2 3 4
21
3 Selection Guide
Photocouplers for Logic Signal Transmission at 15 to 20 Mbit/s (Typ.)

Data Rate
(mA) (Vrms)
6 5 4
GND
Vcc
SHIELD
Mini-flat
TLP2066 MFSOP6 20M bit/s 3750 ¡ ¡ ¡ ¡
3.3-V power supply
1 3
6 5 4
GND
Vcc
SO6
SHIELD

TLP116A (reinforced insulation) 20M bit/s 3750 ¡ ¡ r ¡ ¡
Ultra-high-speed
1 3
6 5 4 SO6
GND
Vcc
SHIELD
3.3-V/5-V power supplies Totempole output IFHL = 1.6

TLP2361 * 15M bit/s 3750 ¡ ¡ ¨ r
Low input current
1 3 Low power consumption
6 5 4
GND
SO6
Vcc
SHIELD

TLP2366 20M bit/s 3750 ¡ ¡ ¨ r
3.3-V/5-V power supplies (Inverter logic) (max)
Topr (max) 125℃
1 3
6 5 4
VCC
GND
SO6
SHIELD

TLP118 20M bit/s 3750 ¡ ¡ ¨ r
Ultra-high-speed
1 3
6 5 4
SO6
VCC
GND
SHIELD

TLP2368 Topr (max) 125℃ 20M bit/s 3750 ¡ ¡ ¨ r
Ultra-high-speed
20 Mbps standard
1 3
8 7 6 5
VCC
GND
SO8
SHIELD

TLP2466 3.3-V/5-V power supplies 20M bit/s 3750 ¡ ¡ ¡
Topr (max) 125℃
1 2 3 4
8 7 6 5
SO8
VCC
GND
Topr (max) 125℃

SHIELD

TLP2418 High-speed 20M bit/s 3750 ¡ ¡ ¡
SO8 version of the
TLP118
1 2 3 4
8 7 6 5
VCC
GND
SO8
SHIELD

Topr (max) 125℃
1 2 3 4
8 7 6 5
GND
VCC
SO8
SHIELD

TLP2116 Dual channel version 15M bit/s 2500 ¡ ¡ ¡ ¡
equivalent of the TLP116A
1 2 3 4
8 7 6 5
SO8
GND
VCC
3.3-V power supply

SHIELD

TLP2166A Dual channel 15M bit/s 2500 ¡ ¡ r ¡
version equivalent for the
TLP2366
1 2 3 4
8 7 6 5
GND
VCC
2 channels in SO8
SHIELD

Topr (max) 125℃
1 2 3 4
22
Photocouplers for Logic Signal Transmission at 15 to 20 Mbit/s (Typ.) (Continued)
Data Rate
(mA) (Vrms)
8 7 6 5
2 channels in SO8
GND
VCC
3.3-V/5-V power supplies

SHIELD

TLP2161 * Topr (max) 125℃ 15M bit/s 2500 ¡ ¡ ¡
Low input current
Low power consumption
1 2 3 4
8 7 6 5
GND
VCC
SO8
SHIELD

TLP2118E Dual channel version 15M bit/s 2500 ¡ ¡ ¡
equivalent for the TLP118
1 2 3 4
8 7 6 5
GND
VCC
SO8
SHIELD

Topr (max) 125℃
1 2 3 4
6 5 4
Vcc
GND
SDIP6
SHIELD
TLP716 High-speed Totempole output IFHL = 6.5

15M bit/s 5000 ¡ ¡ ¡ ¡
TLP716F SDIP version of the (Inverter logic) (max)
TLP116A
1 2 3
6 5 4
Vcc
GND
SDIP6
SHIELD
TLP2766 Totempole output IFHL = 3.5

3.3-V/5-V power supplies 20M bit/s 5000 ¡ ¡ ¡
Topr (max) 125℃
1 2 3
6 5 4
SDIP6
VCC
GND
SHIELD
TLP708 Topr (max) 125℃

High-speed 15M bit/s 5000 ¡ ¡ ¡
SDIP version of the
TLP118
1 2 3
6 5 4
VCC
GND
SDIP6
SHIELD

3.3-V/5-V power supplies 20M bit/s 5000 ¡ ¡ ¡
Topr (max) 125℃
1 2 3
23
3 Selection Guide

Data Rate
(mA) (Vrms)
6 5 4
GND
SO6
Vcc
SHIELD
(reinforced insulation) Totempole output IFHL = 5

TLP2367 ** 40M bit/s 3750 r r r
3.3-V/5-V power supplies (Inverter logic) (max)
Topr (max) 125℃
1 3
8 7 6 5
GND
VCC
SO8
SHIELD

TLP2167 ** 3.3-V/5-V power supplies 40M bit/s 2500 r r r
Topr (max) 125℃
1 2 3 4
6 5 4
Vcc
GND
SDIP6
SHIELD
TLP2767 ** Totempole output IFHL = 5

3.3-V/5-V power supplies 40M bit/s 5000 r r r
TLP2767F ** (Inverter logic) (max)
Topr (max) 125℃
1 2 3
Note (1): Please refer to page 48. **: Under development

Data Rate
(mA) (Vrms)
6 5 4
GND
Vcc
Mini-flat
SHIELD

TLP117 MFSOP6 50M bit/s 3750 ¡ ¡ ¡ ¡
Ultra-high-speed
1 3
IPM-Drive Photocouplers
Data Rate
(mA) (Vrms)
6 5 4
Propagation
SO6
SHIELD
delay time
TLP109(IGM) (reinforced insulation) 25% Min 10 3750 ¡ ¡ r ¨ r
0.8 μs
(max)
1 3
6 5 4
SO6
Propagation
SHIELD

TLP104 delay time 3750 ¡ ¡ ¨ r
550 ns (max)
1 3
8 7 6 5
SO8
Propagation
Topr (max) 125℃
SHIELD
delay time Open-collector output IFHL = 5

TLP2404 SO8 version of the 3750 ¡ ¡ ¡
550 ns (Inverter logic) (max)
TLP104
(max)
1 2 3 4
6 5 4
SDIP6 Propagation
SHIELD
TLP714 SDIP version of the delay time Open-collector output IFHL = 5

5000 ¡ ¡ ¡
TLP714F TLP104 550 ns (Inverter logic) (max）
Direct drive of an IPM (max)
1 2 3
8 7 6 5
DIP8
Propagation
High CMR version of the
SHIELD
delay time
TLP559(IGM) TLP550 25% Min 10 2500 ¡ ¡
0.8 μs
No internal base
(max)
connection
1 2 3 4
24
IPM-Drive Photocouplers (Continued)
Data Rate
(mA) (Vrms)
8 7 6 5
DIP8
Propagation
IEC950 design standard
SHIELD
TLP759(IGM) delay time

version of the TLP559 25% Min 10 5000 ¡ ¡ ¡ ¡ 7
TLP759F(IGM) 0.8 μs
SEMKO-approved
(max)
1 2 3 4
8 7 6 5
DIP8 Propagation
SHIELD
TLP754 DIP8 version of the delay time Open-collector output IFHL = 5

5000 ¡ ¡ ¨
TLP754F TLP104 550 ns (Inverter logic) (max)
Direct drive of an IPM (max)
1 2 3 4
JEDEC-Compliant Photocouplers
Data Rate
(mA) (Vrms)
8 7 6 5
6N138 300% Min 1.6 2500 ¡
DIP8
JEDEC-compliant 300k bit/s
High CTR
6N139 400% Min 0.5 2500 ¡
1 2 3 4
8 7 6 5
6N135 7% Min 16 2500 ¡
DIP8
1M bit/s
JEDEC-compliant
6N136 19% Min 16 2500 ¡ ¡
1 2 3 4
8 7 6 5
GND
VCC
DIP8
6N137 JEDEC-compliant 10M bit/s 700% Typ. 5 2500 ¡
High-speed
1 2 3 4
25
3 Selection Guide
3 Photocouplers for IGBT/MOSFET Gate Drive

Package
Output
Peak
Current
SO6 SO8 SO6L SO16L SDIP6 DIP8
±0.3 A (max) TLP557
±0.45 A (max)
TLP151A, TLP155 TLP701, TLP701A TLP351, TLP351A

±0.6 A (max) TLP2451A TLP5701
TLP155E TLP701H, TLP705A TLP351H
±1.0 A (max) TLP5751*
±2.0 A (max) TLP700
TLP5702 TLP700A TLP250H, TLP350

±2.5 A (max) TLP152*
TLP5752* TLP700H TLP350H, TLP352
±4.0 A (max) TLP5754* TLP5214*
TLP358
±6.0 A (max)
TLP358H
*: New product
Photocouplers for IGBT/MOSFET Gate Drive

Data Rate
(mA) (Vrms)
SO6
(reinforced insulation) Propagation
Topr (max) 110℃ delay time Peak output current: IFLH = 5
TLP151A 3750 ¡ ¡ ¨
Direct drive of a small- 0.5 μs ±0.6 A (max) (max)
power (max)
IGBT/MOSFET
6 5 4 SO6
TLP155 Topr (max) 100℃ delay time Peak output current: IFLH = 7.5
3750 ¡ ¡ ¨
TLP155E Direct drive of a small- 0.2 μs ±0.6 A (max) (max)
power (max)
IGBT/MOSFET r
1 3
SO6
Topr (max) 100℃ delay time Peak output current: IFLH = 7.5
TLP152 3750 ¡ ¡ ¨ r
Direct drive of a medium- 0.19 μs ±2.5 A (max) (max)
power (max)
IGBT/MOSFET
8 7 6 5 SO8
Direct drive of a small-
Propagation
power IGBT/MOSFET
delay time Peak output current: IFLH = 5
TLP2451A Low power dissipation 3750 ¡ ¡ ¡
0.5 μs ±0.6 A (max) (max)
Topr (max) 125℃
(max)
SO8 version of the
1 2 3 4
TLP351A
6 5 4 SO6L
Direct drive of a medium- Propagation
power IGBT/MOSFET delay time Peak output current: IFLH = 5
TLP5701 5000 ¡ ¡ r r
Topr (max) 110℃ 0.5 μs ±0.6 A (max)
SO6L version of the (max)
1 2 3 TLP351A
26
Photocouplers for IGBT/MOSFET Gate Drive (Continued)
Data Rate
(mA) (Vrms)
6 5 4
SO6L
Propagation
Direct drive of a medium-
TLP5751 * power IGBT/MOSFET 5000 ¡ ¡ ¨ ¡
0.15 μs ±1.0 A (max)
Topr (max) 110℃
(max)
Rail to Rail output
1 2 3
6 5 4 SO6L
Propagation
power IGBT/MOSFET
TLP5702 Low power dissipation 5000 ¡ ¡ ¨ ¡
0.2 μs ±2.5 A (max)
Topr (max) 110℃
(max)
SO6L version of the
1 2 3
TLP352
SO6L
Propagation
0.15 μs ±2.5 A (max)
Topr (max) 110℃
6 5 4 (max)
Rail to Rail output
1 2 3 SO6L
Propagation
0.15 μs ±4.0 A (max)
Topr (max) 110℃
(max)
Rail to Rail output
1 VS VE 16
2 VCC1 VLED 15 SO16L

Smart gate drive
3 FAULT DESAT 14 photocoupler
Overcurrent protection Propagation
4 VS VCC2 13
Soft shutdown delay time Peak output current: IFLH = 6
TLP5214 * 5000 r r r r
5 CATHODE VEE 12 Direct drive of a medium- 0.15 μs ±4.0 A (max)
power IGBT/MOSFET (max)
6 ANODE VOUT 11 Topr (max) 110℃
7 ANODE VCLAMP 10
Rail to Rail output
Active miller clamp
8 CATHODE VEE 9
SDIP6
Direct drive of a small- Propagation
TLP701 power IGBT/MOSFET delay time Peak output current: IFLH = 5
5000 ¡ ¡ ¡ ¡
TLP701F Low power dissipation 0.7 μs ±0.6 A (max) (max)
SDIP version of the (max)
TLP351
SDIP6
TLP701A power IGBT/MOSFET delay time Peak output current: IFLH = 5
5000 ¡ ¡ ¡
TLP701AF Low power dissipation 0.5 μs ±0.6 A (max) (max)
6 5 4 SDIP version of the (max)
TLP351A
SDIP6
1 2 3 Direct drive of a small-
Propagation
TLP701H power IGBT/MOSFET
Low power dissipation 5000 ¡ ¡ ¡
TLP701HF 0.7 μs ±0.6 A (max) (max)
Topr (max) 125℃
(max)
SDIP version of the
TLP351H
SDIP6
Propagation
TLP705A Direct drive of a small-
delay time Peak output current: IFLH = 7.5
power IGBT/MOSFET 5000 ¡ ¡ ¡
TLP705AF 0.2 μs ±0.6 A (max) (max)
High-speed
(max)
Low power dissipation
27
3 Selection Guide

Data Rate
(mA) (Vrms)
SDIP6
TLP700 power IGBT/MOSFET delay time Peak output current: IFLH = 5
5000 ¡ ¡ ¡ ¡
TLP700F Low power dissipation 0.5 μs ±2.0 A (max) (max)
SDIP version of the (max)
TLP350
6 5 4
SDIP6
Propagation
TLP700A Direct drive of a medium-
power IGBT/MOSFET 5000 ¡ ¡ ¡ r
SDIP version of the
(max)
1 2 3
TLP352
SDIP6
Propagation
TLP700H power IGBT/MOSFET
Low power dissipation 5000 ¡ ¡ ¡
TLP700HF 0.5 μs ±2.5 A (max) (max)
Topr (max) 125℃
(max)
SDIP version of the
TLP350H
8 7 6 5
Propagation
DIP8
delay time Constant current IFLH = 5
TLP557 Direct drive of a power 2500 ¡ ¡
5 μs output: 0.25 A (max)
transistor
(max)
1 2 3 4
DIP8
Propagation
TLP351 Direct drive of a small-
power 3750 ¡ ¡ ¡ ¡
TLP351F 0.7 μs ±0.6 A (max) (max)
IGBT/MOSFET
(max)
8 7 6 5
DIP8
Propagation
TLP351A Direct drive of a small-
power 3750 ¡ ¡ ¡ r
IGBT/MOSFET
(max)
1 2 3 4
DIP8
TLP351H power delay time Peak output current: IFLH = 5
3750 ¡ ¡ ¨ r
TLP351HF IGBT/MOSFET 0.7 μs ±0.6 A (max) (max)
Low power dissipation (max)
Topr (max) 125℃
DIP8
3750 ¡ ¡ ¨
8 7 6 5 Wide VCC 10 to 30 V (max)
Topr (max) 125℃
DIP8 ¡
1 2 3 4 Propagation
TLP350 Direct drive of a medium-
power 3750 ¡ ¡ ¡ ¡
TLP350F 0.5 μs ±2.5 A (max) (max)
IGBT/MOSFET
(max)
28
Data Rate
(mA) (Vrms)
DIP8
3750 ¡ ¡ ¨ r
8 7 6 5 Low power dissipation (max)
Topr (max) 125℃
DIP8
1 2 3 4 Direct drive of a medium- Propagation
TLP352 power delay time Peak output current: IFLH = 5
3750 ¡ ¡ ¨ r
TLP352F IGBT/MOSFET 0.2 μs ±2.5 A (max) (max)
Topr (max) 125℃
DIP8
Propagation
TLP358 Direct drive of a medium-
power 3750 ¡ ¡ ¡ ¨
TLP358F 0.5 μs ±6 A (max) (max)
IGBT/MOSFET
8 7 6 5 (max)
DIP8
1 2 3 4 Direct drive of a medium- Propagation
3750 ¡ ¡ ¡ ¨ r
TLP358HF IGBT/MOSFET 0.5 μs ±6 A (max) (max)
Topr (max) 125℃
29
3 Selection Guide
4 Photorelays (1-Form-A and 2-Form-A)

Package
Features
Off-State On-State On-State

Voltage Resistance Current VSON4 USOP4 SSOP4 SO6 2.54SOP4 2.54SOP6 2.54SOP8 DIP4 DIP6 DIP8
(max) (V) (max) (1) (max) (A)
8 0.16 TLP3330* TLP3230 TLP3130
5 0.2 TLP3350 TLP3250
1.2 0.3 TLP3131
1.2 0.45 TLP3331* TLP3231
20 0.9 TLP3303 TLP3203
0.22
1 TLP3403*
0.08 3 TLP3553
0.05 2.5 TLP3100
0.05 4 TLP3543
20 0.1 TLP3342
15 0.12 TLP3316* TLP3216 TLP3116
14 0.12 TLP3440* TLP3340 TLP3240
10 0.14 TLP3341 TLP3241
3 0.25 TLP3214 TLP3114
1.5 0.3 TLP3315* TLP3215 TLP3115
40
0.13 1 TLP3123
TLP221A
0.15 2
TLP241A*
0.15 2.5 TLP3554
0.06 2.5 TLP3102
0.06 3.5 TLP3544
50 1.5 0.3 TLP3475* TLP3375 TLP3275
50 0.1 TLP175A*
15 0.12 TLP3351
TLP170A
TLP171A
2 0.4
TLP172A TLP192A TLP202AX
TLP176A TLP197A TLP206AX
TLP598AA
TLP222A TLP592A TLP222A-2X
2 0.5
TLP227A TLP597A TLP227A-2X
TLP240A*
60
1.5 0.4 TLP3412* TLP3212
1.1 0.5 TLP225A
1.5 0.4 TLP3312
0.7 1 TLP3122
0.2 1.5
0.17 2 TLP3555
0.1 2.5 TLP3542
0.07 2.3 TLP3103
0.07 3 TLP3545
0.06 3.3 TLP3107*
75 2 0.4 TLP3306
25 0.04 TLP3318 TLP3118
20 0.1 TLP3111
12 0.12 TLP3417* TLP3317* TLP3217
80
8 0.2 TLP3319* TLP3119
1.2 0.35 TLP3121
0.15 1.25 TLP3120
0.08 TLP3320* TLP3220
14
0.1 TLP3420*
100 0.67 1 TLP3556
0.2 1.4 TLP3105
0.2 2 TLP3546
X
*: New product : Dual-channel
30
4 Photorelays (1-Form-A and 2-Form-A) (continued)
Package
Features

Voltage Resistance Current VSON4 USOP4 SSOP4 SO6 2.54SOP4 2.54SOP6 2.54SOP8 DIP4 DIP6 DIP8
(max) (V) (max) (1) (max) (A)
50 0.05 TLP179D TLP199D TLP209DX
TLP170D
8 0.2 TLP171D
200
TLP176D TLP197D TLP200DX
8 0.25 TLP240D*
8 0.3 TLP222D*
50 0.1 TLP170G TLP240G*
50 0.12 TLP228G TLP228G-2X
35 0.11 TLP172G TLP192G TLP202GX
350
TLP222G TLP592G TLP222G-2X
35 0.12 TLP174G TLP224G TLP224G-2X
TLP176G TLP197G TLP206GX TLP227G TLP597G TLP227G-2X
TLP171GA TLP197GA TLP206GAX TLP227GA TLP597GA TLP227GA-2X
35 0.12
TLP176GA TLP240GA* TLP797GA
400 TLP598GA
12 0.15
TLP798GA
35 0.12 TLP174GA TLP224GA TLP224GA-2X
4 0.2 TLP3125
35 0.1 TLP797J
600 TLP171J TLP240J*
60 0.09
TLP170J
X
*: New product : Dual-channel
MOSFET-Output Photorelays, 1-Form-A in a VSON4 Package

Trigger LED RON Safety Standards (1)
ION BVs
Current, IFT
Part Number Pin Configuration Features Max VOFF (V) 1 Minute
Max Max @IF
(A) (Vrms) UL c-UL TÜV VDE BSI CQC
(mA) ( Ω) (mA)
VSON4
TLP3403 * Lower RON 3 0.22 5 ±1 20 300
high current
VSON4
TLP3440 * Ultra-low CR: 5 pF · Ω 3 14 5 ±0.12 40 300
COFF: 0.45 pF (typ.)
VSON4
TLP3475 * 4 3 COFF: 12 pF (typ.) 3 1.5 5 ±0.3 50 300
Short insertion delay
VSON4
TLP3412 * 1 2 Low RON 3 1.5 5 ±0.4 60 300
60-V VFF
VSON4
TLP3417 * Low CR 3 12 5 ±0.12 80 300
COFF: 5 pF (typ.)
VSON4
TLP3420 * 100-V VOFF
3 14 10 ±0.1 100 300
31
3 Selection Guide
MOSFET-Output Photorelays, 1-Form-A in a USOP4 Package

ION BVs
Current, IFT
Max Max @IF
(mA) ( Ω) (mA)
USOP4
TLP3330 * Ultra-low CR: 5 pF · Ω 4 8 5 ±0.16 20 500 ¡
COFF: 1 pF (typ.)
USOP4
TLP3350 Ultra-low CR: 2.5 pF · Ω 3 5 5 ±0.2 20 500 ¡
COFF: 0.8 pF (typ.)
USOP4
TLP3331 * Ultra-low CR: 5 pF · Ω 4 1.2 5 ±0.45 20 500 ¡
COFF: 5 pF (typ.)
USOP4
Ultra-low On-resistance
TLP3303 R 0.18 Ω (typ.) 3 0.22 5 ±0.9 20 500 ¡
High output current
ION: 0.9 A (max)
USOP4
TLP3342 Ultra-low COFF: 3 20 5 ±0.1 40 500 ¡
0.3 pF (typ.)
USOP4
TLP3316 * Ultra-low CR: 10 pF · Ω 4 15 5 ±0.12 40 500 ¡
COFF: 1 pF (typ.)
USOP4
TLP3340 Ultra-low CR: 5 pF · Ω 3 14 5 ±0.12 40 500 ¡
4 3
USOP4
COFF: 0.7 pF (typ.)
1 2 USOP4
TLP3315 * Ultra-low CR: 10 pF · Ω 4 1.5 5 ±0.3 40 500 ¡
COFF: 10 pF (typ.)
USOP4
TLP3375 COFF: 12 pF (typ.) 3 1.5 5 ±0.3 50 500 ¡
USOP4
TLP3351 Ultra-low COFF: 3 15 5 ±0.12 60 500 ¡
0.7 pF (typ.)
USOP4
TLP3312 3 1.5 5 ±0.4 60 500 ¡
COFF: 20 pF (Typ.)
USOP4
TLP3306 3 2 5 ±0.4 75 500 ¡
75-V VOFF
USOP4
TLP3317 * Low CR: 35 pF · Ω 5 12 5 ±0.12 80 500 ¡
COFF: 5 pF (typ.)
USOP4
Low CR: 30 pF · Ω
TLP3319 * 3 8 5 ±0.2 80 500 ¡
COFF: 6.5 pF (typ.)
11 pF (max)
USOP4
TLP3320 * 5 14 10 ±0.1 100 500 ¡
100-V VOFF
32
MOSFET-Output Photorelays, 1-Form-A in a SSOP4 Package
ION BVs
Current, IFT
Max Max @IF
(mA) (Ω) (mA)
SSOP4
COFF: 1 pF (typ.)
SSOP4
TLP3250 Ultra-low CR: 2.5 pF · Ω 3 5 5 ±0.2 20 1500 ¡
COFF: 0.8 pF (typ.)
SSOP4
TLP3231 Ultra-low CR: 5 pF · Ω 4 1.2 5 ±0.45 20 1500 ¡
COFF: 5 pF (typ.)
SSOP4
Ultra-low On-resistance
TLP3203 R 0.18 Ω (typ.) 3 0.22 5 ±0.9 20 1500 ¡
High output current
ION: 0.9 A (max)
SSOP4
COFF: 1 pF (typ.)
SSOP4
4 3
SSOP4
COFF: 0.7 pF (typ.)
1 2
SSOP4
COFF: 5 pF (typ.)
SSOP4
TLP3215 Ultra-low CR: 10 pF · Ω 4 1.5 5 ±0.3 40 1500 ¡
COFF: 10 pF (typ.)
SSOP4
TLP3275 COFF 12 pF (typ.) 3 1.5 5 ±0.3 50 1500 ¡
SSOP4
TLP3212 Low CR: 20 pF · Ω 5 1.5 5 ±0.4 60 1500 ¡
COFF: 20 pF (typ.)
SSOP4
TLP3217 Low CR 5 12 5 ±0.12 80 1500 ¡
COFF: 5 pF (typ.)
SSOP4
TLP3220 5 14 10 ±0.08 100 1500 ¡
100-V VOFF
MOSFET-Output Photorelays, 1-Form-A in a SO6 Package

ION BVs
Current, IFT
Max Max @IF
(mA) (Ω) (mA)
6 4
SO6
TLP175A General-purpose 1 50 2 ±0.1 60 3750 ¡ ¡ ¨ ¡
Low trigger current
1 3
33
3 Selection Guide
MOSFET-Output Photorelays, 1-Form-A in a 2.54SOP4 Package

ION BVs
Current, IFT
Max Max @IF
(mA) ( Ω) (mA)
2.54SOP4
Lead pitch: 2.54 mm
TLP3130 4 8 5 ±0.16 20 1500 ¡ ¡
Ultra-low CR: 5 pF · Ω
COFF: 1 pF (typ.)
2.54SOP4
Lead pitch: 2.54 mm
TLP3131 4 1.2 5 ±0.3 20 1500 ¡ ¡
COFF: 5 pF (typ.)
2.54SOP4
Lead pitch: 2.54 mm
TLP3116 4 15 5 ±0.12 40 1500 ¡ ¡ r
COFF: 1 pF (typ.)
2.54SOP4
Lead pitch: 2.54 mm
TLP3114 4 3 5 ±0.25 40 1500 ¡ ¡ r
COFF: 5 pF (typ.)
2.54SOP4
Lead pitch: 2.54 mm
TLP3115 4 1.5 5 ±0.3 40 1500 ¡ ¡ r
COFF: 10 pF (typ.)
2.54SOP4
Lead pitch: 2.54 mm
TLP3123 High output current 3 0.13 5 ±1 40 1500 ¡ ¡ r
ION: 1 A (max)
@Ta: up to 50℃
2.54SOP4
Lead pitch: 2.54 mm
TLP170A 1 2 2 ±0.4 60 1500 ¡ ¡ r
Low trigger current
General-purpose
2.54SOP4
TLP171A Lead pitch: 2.54 mm 0.2 2 0.5 ±0.4 60 1500 ¡ ¡ r
Ultra-low trigger current
4 3 2.54SOP4
Lead pitch: 2.54 mm
TLP172A 3 2 5 ±0.4 60 1500 ¡ ¡ r
High output current
General-purpose
1 2
2.54SOP4
TLP176A Lead pitch: 2.54 mm 3 2 5 ±0.4 60 1500 ¡ ¡ r ¡
High output current
2.54SOP4
Lead pitch: 2.54 mm
TLP3122 High output current 3 0.7 5 ±1 60 1500 ¡ ¡ r
ION: 1 A (max)
@Ta: up to 50℃
2.54SOP4
Lead pitch: 2.54 mm
TLP3118 Low CR: 40 pF · Ω 3 25 5 ±0.04 80 1500 ¡ ¡ r
COFF: 2.5 pF (typ.)
3.5 pF (max)
2.54SOP4
Lead pitch: 2.54 mm
TLP3111 4 20 5 ±0.1 80 1500 ¡
Low CR
COFF: 11 pF (typ.)
2.54SOP4
Lead pitch: 2.54 mm
TLP3119 Low CR: 30 pF · Ω 3 8 5 ±0.2 80 1500 ¡ ¡ r
COFF: 6.5 pF (typ.)
11 pF (max)
2.54SOP4
TLP3121 Lead pitch: 2.54 mm 4 1.2 5 ±0.35 80 1500 ¡ ¡ r
Low CR: 30 pF · Ω
2.54SOP4
TLP179D Lead pitch: 2.54 mm 3 50 5 ±0.05 200 1500 ¡ ¡
COFF 15 pF (typ.)
2.54SOP4
Lead pitch: 2.54 mm
TLP170D 1 8 2 ±0.2 200 1500 ¡ ¡ r
Low trigger current
General-purpose
34
MOSFET-Output Photorelays, 1-Form-A in a 2.54SOP4 Package (Continued)
ION BVs
Current, IFT
Max Max @IF
(mA) ( Ω) (mA)
2.54SOP4
TLP171D Lead pitch: 2.54 mm 0.2 8 0.5 ±0.2 200 1500 ¡ ¡ r
2.54SOP4
TLP176D Lead pitch: 2.54 mm 3 8 5 ±0.2 200 1500 ¡ ¡ r ¡
Low On-resistance
2.54SOP4
Lead pitch: 2.54 mm
TLP170G 1 50 2 ±0.1 350 1500 ¡ ¡ r
Low trigger current
General-purpose
2.54SOP4
TLP172G Lead pitch: 2.54 mm 3 50 5 ±0.11 350 1500 ¡ ¡ r
General-purpose
2.54SOP4
Lead pitch: 2.54 mm
TLP174G Current-limiting function 3 35 5 ±0.12 350 1500 ¡ ¡
4 3
Limit current:
150 to 300 mA
2.54SOP4
Lead pitch: 2.54 mm
TLP176G 1 2 3 35 5 ±0.12 350 1500 ¡ ¡ r ¡ ¡
General-purpose
SEMKO-approved
2.54SOP4
TLP171GA Lead pitch: 2.54 mm 0.2 35 0.5 ±0.1 400 1500 ¡ ¡ r
2.54SOP4
TLP176GA Lead pitch: 2.54 mm 3 35 5 ±0.12 400 1500 ¡ r ¡
General-purpose
2.54SOP4
Lead pitch: 2.54 mm
TLP174GA Current-limiting function 3 35 5 ±0.12 400 1500 ¡
Limit current:
150 to 300 mA
2.54SOP4
TLP171J Lead pitch: 2.54 mm 0.2 60 0.5 ±0.07 600 1500 ¡ ¡ r
2.54SOP4
Lead pitch: 2.54 mm
TLP170J 1 60 2 ±0.09 600 1500 ¡ ¡ r
Low trigger current
General-purpose
35
3 Selection Guide
MOSFET-Output Photorelays, 1-Form-A in a 2.54SOP6 Package

ION BVs
Current, IFT
Max Max @IF
(mA) ( Ω) (mA)
2.54SOP6
Lead pitch: 2.54 mm
Low On-resistance
TLP3100 3 0.05 5 ±2.5 20 1500 ¡ ¡
High output current:
6 5 4 ION = 2.5 A (max)
@Ta: up to 50°C
2.54SOP6
General-purpose
1 2 3
TLP3102 ION = 2.5 A (max) 3 0.06 5 ±2.5 40 1500 ¡ ¡
@Ta: up to 50℃
C-connection:
ION (DC) = 5.0 A (max)
2.54SOP6
TLP192A 6 5 4 Lead pitch: 2.54 mm 3 2 5 ±0.4 60 1500 ¡ ¡
High output current
2.54SOP6
TLP197A 1 2 3 Lead pitch: 2.54 mm 3 2 5 ±0.4 60 1500 ¡ ¡
High output current
2.54SOP6
General-purpose
TLP3103 ION = 2.3 A (max) 3 0.07 5 ±2.3 60 1500 ¡ ¡
@Ta: up to 50℃
C-connection:
2.54SOP6
General-purpose
TLP3107 * 3 0.06 5 ±3.3 60 1500 ¡ ¡
ION = 3.3 A (max)
6 5 4 C-connection:
ION (DC) = 6.6 A
1 2 3 2.54SOP6
Lead pitch: 2.54 mm
TLP3120 5 0.15 5 ±1.25 80 1500 ¡ ¡
High output current
ION: 1.25 A (max)
2.54SOP6
General-purpose
TLP3105 ION = 1.4 A (max) 3 0.2 5 ±1.4 100 1500 ¡ ¡
@Ta: up to 50℃
C-connection:
2.54SOP6
COFF 15 pF (typ.)
2.54SOP6
Low On-resistance
6 5 4
2.54SOP6
TLP192G 3 50 5 ±0.11 350 1500 ¡ ¡
Lead pitch: 2.54 mm
1 2 3
2.54SOP6
TLP197G Lead pitch: 2.54 mm 3 35 5 ±0.12 350 1500 ¡ ¡ r ¡ ¡
SEMKO-approved
2.54SOP6
TLP197GA 3 35 5 ±0.12 400 1500 ¡ ¡
Lead pitch: 2.54 mm
36
MOSFET-Output Photorelays, 2-Form-A and 1-Form-A in a 2.54SOP8 Package
ION BVs
Current, IFT
Max Max @IF
(mA) ( Ω) (mA)
2.54SOP8
Lead pitch: 2.54 mm
TLP202A 3 2 5 ±0.4 60 1500 ¡
the TLP172A
2.54SOP8
Lead pitch: 2.54 mm
TLP206A 3 2 5 ±0.4 60 1500 ¡
the TLP176A
2.54SOP8
Lead pitch: 2.54 mm
TLP209D 3 50 5 ±0.05 200 1500 ¡
the TLP179D
8 7 6 5
2.54SOP8
Lead pitch: 2.54 mm
TLP200D 3 8 5 ±0.2 200 1500 ¡
the TLP176D
1 2 3 4
2.54SOP8
Lead pitch: 2.54 mm
TLP202G 3 50 5 ±0.11 350 1500 ¡ r
the TLP172G
2.54SOP8
Lead pitch: 2.54 mm
TLP206G 3 35 5 ±0.12 350 1500 ¡ r ¡ ¡
the TLP176G
2.54SOP8
Lead pitch: 2.54 mm
TLP206GA 3 35 5 ±0.12 400 1500 ¡ r ¡ r
the TLP176GA
8 7 6 5
2.54SOP8
TLP3125 Lead pitch: 2.54 mm 3 4 5 ±0.2 400 1500 ¡ ¡
Low On-resistance
1 2 3 4
37
3 Selection Guide
MOSFET-Output Photorelays, 1-Form-A in a DIP4 Package

ION BVs
Current, IFT
Max Max @IF
(mA) ( Ω) (mA)
DIP4
TLP3553 3 0.08 5 ±3 20 2500 ¡ ¡
ION = 3 A (max)
@Ta = 25℃
TLP221A DIP4
General-purpose 2 0.15 5 ±2.0 40 5000 ¡ ¡ ¡ ¡ r
TLP221AF Reinforced insulation (5)
TLP241A * DIP4
General-purpose 3 0.2 5 ±2.0 40 5000 ¡ ¡ ¡ r r
TLP241AF * Reinforced insulation
4 3
DIP4
TLP3554 3 0.15 5 ±2.5 40 2500 ¡ ¡
ION = 2.5 A (max)
@Ta = 25℃
1 2
DIP4
TLP222A High output current 3 2 5 ±0.5 60 2500 ¡ ¡
General-purpose
DIP4
TLP227A General-purpose 3 2 5 ±0.5 60 2500 ¡ ¡
SEMKO-approved
TLP240A * DIP4
General-purpose 3 2 5 ±0.5 60 5000 ¡ ¡ ¡ r r
TLP240AF * Reinforced insulation
4 3
DIP4
TLP225A 5 1.1 10 0.5 60 2500 ¡ ¡
For DC use only
1 2
DIP4
TLP3555 3 0.20 5 ±2 60 2500 ¡ ¡
ION = 2 A (max)
@Ta = 25℃
DIP4
TLP3556 3 0.70 5 ±1 100 2500 ¡ ¡
ION = 1 A (max)
@Ta = 25℃
DIP4
TLP222D * High output current 3 8 5 ±0.3 200 2500 ¡ ¡
4 3
General-purpose
TLP240D * 1 2 DIP4
TLP240DF * Reinforced insulation
TLP240G * DIP4
TLP240GF * Reinforced insulation
DIP4
General-purpose
TLP228G 3 50 5 ±0.12 350 2500 ¡ ¡ ¡
SEMKO-approved
High EMI immunity
38
MOSFET-Output Photorelays, 1-Form-A in a DIP4 Package (Continued)
ION BVs
Current, IFT
Max Max @IF
(mA) ( Ω) (mA)
DIP4
TLP222G General-purpose 3 50 5 ±0.12 350 2500 ¡ ¡ ¡
SEMKO-approved
DIP4
Current-limiting function
TLP224G Limit current: 3 35 5 ±0.12 350 2500 ¡ ¡ ¡
150 to 300 mA
SEMKO-approved
DIP4
TLP227G General-purpose 3 35 5 ±0.12 350 2500 ¡ ¡ r ¡ ¡
SEMKO-approved
4 3
DIP4
TLP227GA General-purpose 3 35 5 ±0.12 400 2500 ¡
SEMKO-approved
1 2
TLP240GA * DIP4
TLP240GAF * Reinforced insulation
DIP4
For modems
TLP224GA Current-limiting function 3 35 5 ±0.12 400 2500
Limit current:
150 to 300 mA
TLP240J * DIP4
TLP240JF * Reinforced insulation
39
3 Selection Guide

ION BVs
Current, IFT
Max Max @IF
(mA) (Ω) (mA)
DIP6
TLP3543 3 0.05 5 ±4 20 2500 ¡ ¡
ION = 4 A (max)
@Ta = 25℃
DIP6
TLP3544 3 0.06 5 ±3.5 40 2500 ¡ ¡
ION = 3.5 A (max)
@Ta = 25℃
DIP6
TLP598AA 3 2 5 ±0.5 60 2500 ¡
High output current
DIP6
TLP592A 3 2 5 ±0.5 60 2500 ¡
High output current
DIP6
TLP597A High output current 3 2 5 ±0.5 60 2500 ¡
SEMKO-approved
DIP6
Low On-resistance
TLP3542 3 0.1 10 ±2.5 60 2500 ¡ ¡
ION = 2.5 A (max)
DIP6
TLP3545 3 0.07 5 ±3 60 2500 ¡ ¡
6 5 4 ION = 3 A (max)
@Ta = 25℃
DIP6
TLP3546 1 2 3 3 0.2 5 ±2 100 2500 ¡ ¡
ION = 2 A (max)
@Ta = 25℃
DIP6
TLP592G 3 50 5 ±0.12 350 2500 ¡
General-purpose
DIP6
TLP597G General-purpose 3 35 5 ±0.12 350 2500 ¡ ¡ ¡ 7
SEMKO-approved
DIP6
TLP597GA General-purpose 3 35 5 ±0.12 400 2500 ¡
SEMKO-approved
TLP797GA DIP6
3 35 5 ±0.12 400 5000 ¡ ¡ r ¡ r
TLP797GAF High isolation voltage
DIP6
TLP598GA 3 12 5 ±0.15 400 2500 ¡
Low On-resistance
DIP6
TLP798GA 3 12 5 ±0.15 400 5000 ¡ ¡ r r
Low On-resistance
TLP797J DIP6
5 45 10 ±0.1 600 5000 ¡ ¡ r ¡ r
TLP797JF High isolation voltage
40
ION BVs
Current, IFT
Max Max @IF
(mA) ( Ω) (mA)
DIP8
TLP222A-2 Dual channel version of 3 2 5 ±0.5 60 2500 ¡ ¡
the TLP222A
DIP8
TLP227A-2 3 2 5 ±0.5 60 2500 ¡ ¡
the TLP227A
SEMKO-approved
DIP8
TLP228G-2 the TLP228G 3 50 5 ±0.12 350 2500 ¡ ¡ ¡
SEMKO-approved
High EMI immunity
DIP8
TLP222G-2 3 50 5 ±0.12 350 2500 ¡ ¡ ¡
the TLP222G
8 7 6 5
SEMKO-approved
DIP8
1 2 3 4
TLP224G-2 3 35 5 ±0.12 350 2500 ¡ ¡ ¡
the TLP224G
SEMKO-approved
DIP8
TLP227G-2 3 35 5 ±0.12 350 2500 ¡ ¡ r ¡ ¡
the TLP227G
SEMKO-approved
DIP8
TLP227GA-2 3 35 5 ±0.12 400 2500 ¡
the TLP227GA
SEMKO-approved
DIP8
the TLP224GA
TLP224GA-2 Current-limiting function
3 35 5 ±0.12 400 2500
Limit current:
150 to 300 mA
41
3 Selection Guide
5 Photorelays (1-Form-B, 2-Form-B and 1-Form-A/1-Form-B)
Package
Features

Voltage Resistance Current 2.54SOP4 2.54SOP6 2.54SOP8 DIP4 DIP6 DIP8
(max) (max) (max)
(V) (1) (A)
1-Form-B, 25 0.12 TLP4176G TLP4197G TLP4206G X
350
2-Form-B 25 0.15 TLP4227G TLP4597G TLP4227G-2 X
1-Form-A/
1-Form-B
350 25 0.12 TLP4026G X TLP4006G X
X
: Dual-channel
MOSFET-Output Photorelays, 1-Form-B

ION BVs
Current, IFT
Max Max @IF
(mA) ( Ω) (mA)
4 3
2.54SOP4
Lead pitch: 2.54 mm
TLP4176G 3 25 0 ±0.12 350 1500 ¡
General-purpose
1-Form-B
1 2
6 5 4
2.54SOP6
Lead pitch: 2.54 mm
TLP4197G 3 25 0 ±0.12 350 1500 ¡
General-purpose
1-Form-B
1 2 3
4 3
DIP4
General-purpose
TLP4227G 3 25 0 ±0.15 350 2500 ¡
1-Form-B
SEMKO-approved
1 2
6 5 4
DIP6
General-purpose
TLP4597G 3 25 0 ±0.15 350 2500 ¡
1-Form-B
SEMKO-approved
1 2 3
42
MOSFET-Output Photorelays, 2-Form-B
ION BVs
Current, IFT
Max Max @IF
(mA) ( Ω) (mA)
8 7 6 5
2.54SOP8
Lead pitch: 2.54 mm
TLP4206G Dual channel version 3 25 0 ±0.12 350 1500 ¡
of the TLP4176G
2-Form-B
1 2 3 4
8 7 6 5
DIP8
TLP4227G-2 of the TLP4227G 3 25 0 ±0.15 350 2500 ¡
SEMKO-approved
2-Form-B
1 2 3 4
MOSFET-Output Photorelays, 1-Form-A/1-Form-B

ION BVs
Current, IFT
Max Max @IF
(mA) ( Ω) (mA)
2.54SOP8 1-Form-A
Lead pitch: 2.54 mm 5
TLP4026G 3 25 ±0.12 350 1500 ¡
8 7 6 5 General-purpose 1-Form-B
1-Form-A/1-Form-B 0
1 2 3 4 1-Form-A
1-form-b 1-form-a DIP8
5
TLP4006G General-purpose 3 25
1-Form-B
±0.12 350 2500
1-Form-A/1-Form-B
0
43
3 Selection Guide
6 Triac-Output Photocouplers
Package
Features
MFSOP6 SO6 DIP4 DIP6

Isolation
VDRM NZC ZC NZC ZC NZC ZC NZC ZC
voltage
2500 Vrms TLP160G TLP161G TLP525G TLP560G TLP561G
400 V TLP3022(S) TLP3042(S)
5000 Vrms
TLP3023(S) TLP3043(S)
TLP160J TLP161J TLP560J TLP561J
TLP165J TLP163J
2500 Vrms
TLP166J
TLP168J
TLP265J* TLP266J*
3750 Vrms
600 V TLP267J* TLP268J*
4000 Vrms TLP762J TLP763J
TLP360J TLP361J TLP3052(S) TLP3062(S)
TLP363J TLP3063(S)
5000 Vrms
TLP3064(S)
TLP3762(S)
TLP3082(S)
800 V 5000 Vrms TLP3782(S)
TLP3783(S)
NZC: Non-zero cross *: New product
ZC: Zero cross
Triac-Output Photocouplers for Solid State Relays (SSRs)

Trigger LED Off-State
Peak On-State
Output BVs Safety Standards (1)
Current, IFT Voltage, VTM
Part Number Pin Configuration Features Terminal 1 Minute
Rank Max (mA) Max (V) @ITM (mA) Voltage (Vrms) UL c-UL TÜV VDE BSI CQC
VDRM (V)
̶ 10
TLP160G 6 4 IFT7 7 2.8 70 400 2500 ¡ ¡ r ¡
Mini-flat IFT5 5
MFSOP6
Non-zero cross ̶ 10
TLP165J
1 3 2.8 70 600 2500 ¡ ¡ r ¡
TLP160J IFT7 7
̶ 10
TLP161G IFT7 7 2.8 70 400 2500 ¡ ¡ r ¡
Mini-flat IFT5 5
MFSOP6
Zero cross ̶ 10
TLP166J
2.8 70 600 2500 ¡ ¡ r ¡
TLP161J 6 4 IFT7 7
ZC Mini-flat
MFSOP6
Zero cross
TLP163J ̶ 10 2.8 100 600 2500 ¡ ¡ r r
1 3 High impulse noise
immunity
VN = 2000 V (typ.)
Mini-flat
TLP168J MFSOP6 ̶ 3 2.8 70 600 2500 ¡ ¡ ¡
Zero cross
6 4
̶ 10
SO6 (reinforced
TLP265J * insulation) 2.8 70 600 3750 ¡ ¡ r ¨ ¡
Non-zero cross
IFT7 7
1 3
44
Triac-Output Photocouplers for Solid State Relays (SSRs) (Continued)
Trigger LED Peak On-State Off-State
VDRM (V)
6 4
̶ 10
SO6 (reinforced
ZC
TLP266J * insulation) 2.8 70 600 3750 ¡ ¡ r ¨ ¡
Zero cross
IFT7 7
1 3
6 4
SO6 (reinforced ̶ 3
insulation)
TLP267J * Non-zero cross 2.8 70 600 3750 ¡ ¡ ¨ ¡
Low trigger LED
current IFT2 2
1 3
6 4
SO6 (reinforced ̶ 3
insulation)
ZC
TLP268J * Zero cross 2.8 70 600 3750 ¡ ¡ ¨ ¡
Low trigger LED
current IFT2 2
1 3
Triac-Output Photocouplers for Office Equipment

VDRM (V)
4 3
̶ 10
TLP360J DIP4
3.0 100 600 5000 ¡ ¡ ¡ ¡ r
TLP360JF Non-zero cross
IFT7 7
1 2
̶ 10
TLP361J DIP4
TLP361JF 4 3 Zero cross
IFT7 7
ZC
3.0 100 600 5000 ¡ ¡ ¡ ¡ r
DIP4
TLP363J 1 2
Zero cross
High impulse noise ̶ 10
TLP363JF immunity
VN = 2000 V (typ.)
45
3 Selection Guide
Triac-Output Photocouplers for AC 100 to 120 V Lines

VDRM (V)
4 3
DIP4
TLP525G ̶ 10 3.0 100 400 2500 ¡ ¡
Non-zero cross
1 2
6 4 ̶ 10
DIP6
TLP560G General-purpose IFT7 7 3.0 100 400 2500 ¡ ¡ ¡
Non zero cross
1 2 3 IFT5 5
6 4 ̶ 10
DIP6
TLP561G ZC
General-purpose IFT7 7 3.0 100 400 2500 ¡ ¡ ¡
Zero cross
1 2 3 IFT5 5
TLP3022(S) DIP6
SEMKO-approved ̶ 10 3.0 100 400 5000 ¡ ¡ r ¡ 7
TLP3022F(S) 6 4 Non-zero cross
1 2 3
TLP3023(S) DIP6
SEMKO-approved ̶ 5 3.0 100 400 5000 ¡ ¡ r ¡ 7
TLP3023F(S) Non-zero cross
TLP3042(S) DIP6
SEMKO-approved ̶ 10 3.0 100 400 5000 ¡ ¡ r ¡ 7
TLP3042F(S) Zero cross
6 4
ZC
1 2 3
TLP3043(S) DIP6
SEMKO-approved ̶ 5 3.0 100 400 5000 ¡ ¡ r ¡ 7
46
Triac-Output Photocouplers for AC 200 to 240 V Line

Voltage (Vrms)
Rank Max (mA) Max (V) @ITM (mA) VDRM (V) UL c-UL TÜV VDE BSI CQC
6 4
̶ 10
DIP6
TLP560J General-purpose 3.0 100 600 2500 ¡ ¡ ¡
Non zero cross
IFT7 7
1 2 3
6 4
̶ 10
DIP6
TLP561J ZC
General-purpose 3.0 100 600 2500 ¡ ¡ ¡
Zero cross
IFT7 7
1 2 3
6 4
TLP762J DIP6
SEMKO-approved ̶ 10 3.0 100 600 4000 ¡ ¡ r ¡ 7
TLP762JF Non zero cross
1 2 3
6 4
TLP763J DIP6
ZC
SEMKO-approved ̶ 10 3.0 100 600 4000 ¡ ¡ r ¡ 7
TLP763JF Zero cross
1 2 3
6 4
DIP6
TLP3052(S) High VDRM
̶ 10 3.0 100 600 5000 ¡ ¡ r ¡ 7 ¡
TLP3052F(S) SEMKO-approved
Non-zero cross
1 2 3
TLP3062(S)
̶ 10 3.0 100 600 5000 ¡ ¡ r ¡ 7 ¡
TLP3062F(S)
DIP6
SEMKO-approved
High VDRM
Zero cross
TLP3063(S)
̶ 5 3.0 100 600 5000 ¡ ¡ r ¡ 7 ¡
TLP3063F(S)
TLP3064(S) DIP6
SEMKO-approved ̶ 3 3.0 100 600 5000 ¡ ¡ r ¡ 7
6 4
TLP3082(S) DIP6
ZC ̶ 10 3.0 100 800 5000 ¡ ¡ r ¡ 7
1 2 3
DIP6
TLP3762(S) Zero cross
High impulse noise ̶ 10 3.0 100 600 5000 ¡ ¡ r ¡ 7
TLP3762F(S) immunity
VN = 2000 V (typ.)
TLP3782(S)
̶ 10 3.0 100 800 5000 ¡ ¡ r ¡
TLP3782F(S)
DIP6
High impulse noise
immunity
VN = 1500 V (typ.)
TLP3783(S)
̶ 5 3.0 100 800 5000 ¡ ¡ r ¡
TLP3783F(S)
47
3 Selection Guide
7 Thyristor-Output Photocouplers
Package
Features
Isolation
VDRM
voltage
MFSOP6 DIP6 DIP8
400 V 2500 Vrms TLP148G

2500 Vrms TLP548J TLP549J
600 V
4000 Vrms TLP748J

Max (mA) Max (V) @ITM (mA) Voltage (Vrms) UL c-UL TÜV VDE BSI CQC
VDRM (V)
6 5 4
Mini-flat
TLP148G MFSOP6 10 1.45 100 400 2500 ¡ ¡
General-purpose
1 3
6 5 4
DIP6
TLP548J General-purpose 7 1.45 100 600 2500 ¡ r
Low trigger current
1 2 3
8 6 5
DIP8
TLP549J Long anode-cathode 7 1.45 100 600 2500 ¡ r
distance (SCR)
1 2 3 4
6 5 4
TLP748J DIP6
10 1.45 100 600 4000 ¡ ¡ r ¡ 7
TLP748JF SEMKO-approved
1 2 3
Reference
Note (1): Certified to safety standards. For details on certification status, contact your Toshiba sales representative.
UL/c-UL/IEC/CQC: : Approved U: Approval pending as of August 2014
BSI and IEC: : Approved (supplementary or basic insulation) 7: Approved (reinforced insulation) U: Design which meets safety standard/
approval pending as of August 2014 BSI: EN 60065 / EN 60950-1, IEC: IEC 60065 / IEC 60950-1
TÜV and VDE: : Approved : Approved with option of EN 60950-1 / EN 60065
U: Design which meets safety standard/approval pending as of August 2014
EN 60747-5-5-approved with option V4 or D4
UL: Underwriters Laboratories (UL) is a safety consulting and certification company.
c-UL: c-UL Mark is the UL Mark for Canada.
TÜV: Technischer Überwachungsverein
VDE: VERBAND DEUTSCHER ELECTROTECHNISCHER e.V.
BSI: British Standards Institution
IEC: International Electrotechnical Commission
CQC: China Quality Certification center
(2): The products with the ranks Y and BL are limited in production. For details, please contact your local Toshiba sales representative.
(3): For details of the devices, please contact your local Toshiba sales representative.
48
8 Photovoltaic-Output photocouplers
Package
Features
Short-Circuit Open SSOP4 SO6 MFSOP6 DIP6

Current Voltage 1500 Vrms 3750 Vrms 2500 Vrms
4 +A 30 V TLP3924
5 +A 7V TLP3904 TLP3902
TLP3905* TLP190B TLP590B
12 +A 7V
TLP3906* †
20 +A 7V TLP3914
24 +A 7V TLP191B †† TLP591B ††
†
: Built-in Discharging Circuit *: New product
††
: Built-in shunt resistor
Short-Circuit Current (μA) Open Voltage VOC (V) BVs Safety Standards (1)
Part Number Pin Configuration Features 1 Minute
@IF
Rank Min Min @IF (mA) (Vrms) UL c-UL TÜV VDE BSI CQC
(mA)
6 4
̶ 12
Mini-flat
TLP190B 10 7 10 2500 ¡ ¡
MFSOP6
C20 20
1 3
6 4
Mini-flat
MFSOP6
TLP191B ̶ 24 20 7 20 2500 ¡ ¡
Built-in shunt
resistor
1 3
6 4
̶ 12
DIP6
TLP590B 10 7 10 2500 ¡
General-purpose
C20 20
1 2 3
6 4
DIP6
TLP591B Built-in shunt ̶ 24 20 7 20 2500 ¡
resistor
1 2 3
6 4
Mini-flat
TLP3902 MFSOP6 ̶ 5 10 7 10 2500 ¡ ¡
General-purpose
1 3
4 3
SSOP4
TLP3904 ̶ 5 10 7 10 1500 ¡
General-purpose
1 2
6 4
̶ 12
SO6
TLP3905 * General-purpose 10 7 10 3750 ¡ ¡ ¨
Topr (max) 125℃
C20 20
1 3
6 4
Discharging Circuit
SO6 ̶ 12
General-purpose
TLP3906 * Topr (max) 125℃ 10 7 10 3750 ¡ ¡ ¨
Built-in Discharging
Circuit C20 20
1 3
4 3
SSOP4
TLP3914 ̶ 20 10 7 10 1500 ¡
High output
1 2
4 3
SSOP4
TLP3924 High open-circuit ̶ 4 10 30 10 1500 ¡
voltage
1 2
49
4 Part Naming Conventions
1. Transistor-Output, Darlington-Transistor-Output and IC-Output Photocouplers
TLP F (
Country of origin
Part number (O: Japan (T: Thailand (C: China
) or null: Japan
Lead forming with
long clearance distance [[G]]/RoHS COMPATIBLE*, ",F" or ",E"
Null: No lead forming Revision code
Safety standard option The revision code may be added to identify a
revision of a device. For details, contact your
CTR rank nearest Toshiba sales representative.
See respective datasheets.
Taping: Example 1: TLP785(D4-GB-TP6,F(C Example 2: TLP785F(GR,F(C
For tape specifications, see page 63 to 65. TLP785(D4GB-T6,F(C [F] : Wide-spaced leads
Lead forming (only for DIP packages): (Abbreviated due to the limit to the number of characters.) [GR] : CTR rank
For standard lead forming, see page 51 to 55. [D4] : EN60747-5-5 option [GB] : CTR rank [,F] : RoHS COMPATIBLE*
[TP6] : LF6 lead form [C] : Country of origin: China
Tape-and-reel packing
[,F] : RoHS COMPATIBLE* [C] : Country of origin: China
2. Triac-Output and Thyristor-Output Photocouplers
TLP F (
Country of origin
Part number (O: Japan (T: Thailand
) or null: Japan
VDRM
G: 400 V J: 600 V L: 800 V [[G]]/RoHS COMPATIBLE*, ",F" or ",E"
Revision code
The revision code may be added to identify a
Lead forming with revision of a device. For details, contact your
long clearance distance nearest Toshiba sales representative.
Null: No lead forming
Safety standard option Example 3: TLP665J(D4-IFT7-TP1,S,F)
TLP665J(D4T7TP1S,F
IFT rank (Abbreviated due to the limit to the number of characters.)
No character: No IFT rank specified [J] : VDRM: 600 V
IFTx: For example, IFT5 denotes the 5-mA rank. [D4] : EN60747-5-5 option
See individual technical datasheets. [IFT7][T7] : LED trigger current: 7 mA (max)
[TP1] : LF1 lead form
Taping:
Tape-and-reel packing
For tape specifications, see page 63 to 65.
[,S] : Revision code
Lead forming (only for DIP packages): [,F] : RoHS COMPATIBLE*
For standard lead forming, see page 51 to 55.
3. Photorelays
TLP F (
Country of origin
Part number (O: Japan (T: Thailand
VOFF ) or null: Japan
A: 60 V D: 200 V G: 350 V [[G]]/RoHS COMPATIBLE*, ",F" or ",E"
GA: 400 V J: 600 V
Some photorelays do not have a V OFF code Revision code
in their names. See respective datasheets. The revision code may be added to identify a
revision of a device. For details, contact your
Lead forming with long clearance distance nearest Toshiba sales representative.
Null: No lead forming
Safety standard option Example 4: TLP227A(TP1,F) Example 5: TLP3123(TP,F)
[A] : VOFF: 60 V [TP] : Tape-and-reel packing
Taping: [TP1] : LF1 lead form [,F] : RoHS COMPATIBLE*
For tape specifications, see page 63 to 65. Tape-and-reel packing
Lead forming (only for DIP packages): [,F] : RoHS COMPATIBLE*
For standard lead forming, see page 51 to 55.
*: “F” identifies the indication of product Labels with “ [[G]]/RoHS COMPATIBLE ”.

Please contact your TOSHIBA sales representative for details as to environmental matters such as the RoHS compatibility of Product.
The RoHS is the Directive 2002/95/EC of the European Parliament and of the Council of 27 January 2003 on the restriction of the use of certain hazardous substances in
electrical and electronic equipment.
Note: The length of part names is limited to 18 characters. Longer names are abbreviated by omitting the “-“ character and/or using shorthand symbols. However, be sure to give
full part names when you have any inquiries. For details, please contact your nearest Toshiba sales representative.
50
5 Package Information
1 Lead Form Options for DIP Packages

The DIP4, DIP6, DIP8 and DIP16 packages offer three surface-mount lead form options and a wide-spaced lead form option.
The electrical characteristics are identical, regardless of these options.
Lead Form Surface-Mount Wide-Spaced
Appearance
Lead Form Code (LF1) (LF4), (LF7)** (LF5), (LF6)** (LF2), TLPXXXF
Carrier Tape Code (TP1) (TP4), (TP7)** (TP5), (TP6)** Not available*
4-pin DIP 8-pin DIP

4 3 8 5
10.16
A
1 2 1 4
6-pin DIP 16-pin DIP B

6 5 4 16 9
C 10 to 12
1 2 3 1 8
Package Outlines
Dimensions Unit: mm
Version (LF1) (LF4) (LF5)
Dimension Min Max Min Max Min Max
A – 10.0 – 12.0 – 10.0
B (0.35 typ.) (0.25 typ.) – 0.2
C 6.4 – 8.0 – 6.4 –
All other package dimensions are the same as for each standard package
specification.
* Tape-and-reel packing is not available with (LF2).

Example 1: Standard part: TLP620(F)
Surface-mount option: TLP620(LF1,F): Packed in stick magazines.
Surface-mount and tape-and-reel options: TLP620(TP1,F): Packed in tape-and-reel.
Q Standard part names should be used when applying for safety standard approval.
** The package dimensions and lead form options of the TLP785 differ from those shown above.
See the TLP785 datasheet.
51
*All dimensions are for reference only unless tolerance is given.
2 Package Dimensions (4-Pin DIP)

Standard DIP4 DIP4 (LF1) / (TP1)
Unit: mm Unit: mm
4 3
4 3
6.4 ( 0.25
6.4 ( 0.25
1 2
3.65 +0.15
-0.25
1 2
4.58 ( 0.25 7.62 ( 0.25
4.58 ( 0.25 7.62 ( 0.25

0.8 ( 0.25
3.65 +0.15
-0.25
+0.25
4.0 -0.20
+0.1
1.2 ( 0.15 0.25 -0.05
0.5 ( 0.1 1.2 ( 0.15 1.0 min

2.5 min
2.54 ( 0.25 7.85 to 8.80 2.54 ( 0.25 10.0 max
DIP4 (LF2), TLPXXXF DIP4 (LF4) / (TP4), (LF7) / (TP7)

4 3 Unit: mm Unit: mm
4 3
6.4 ( 0.25
6.4 ( 0.25
+0.15
1 2
3.65 -0.25
10.16 ( 0.25 1 2
4.58 ( 0.25 7.62 ( 0.25
3.9 +0.25
-0.20
4.58 ( 0.25 7.62 ( 0.25
3.65 +0.15
-0.25
0.25 min
1.2 ( 0.15
+0.1
0.25 -0.05 1.2 ( 0.15 0.75 ( 0.25
0.25 -0.05
+0.1
0.5 ( 0.1
2.5 min
10 to 12 2.54 ( 0.25 12.0 max

2.54 ( 0.25
DIP4 (LF5) / (TP5), (LF6) / (TP6)

Unit: mm
4 3
6.4 ( 0.25
1 2
+0.15
+0.25
3.65 -0.25
3.85 -0.20
4.58 ( 0.25 7.62 ( 0.25

0.25 -0.05
+0.1
0.2 max
1.2 ( 0.15 1.0 min

2.54 ( 0.25 10.0 max
52

Unit: mm Unit: mm
6 5 4
6 5 4
6.4 ( 0.25
6.4 ( 0.25
1 2 3
+0.15
3.65 -0.25
1 2 3
+0.15
+0.25
3.65 -0.25
4.0 -0.20
7.12 ( 0.25 7.62 ( 0.25
7.12 ( 0.25 7.62 ( 0.25
0.8 ( 0.25
+0.1
0.25 -0.05
1.0 min
2.54 ( 0.25 1.2 ( 0.15
2.5 min
0.5 ( 0.1 1.2 ( 0.15 7.85 to 8.80

10.0 max
2.54 ( 0.25
DIP6 (LF2) DIP6 (LF4) / (TP4)

Unit: mm Unit: mm
6 5 4
6 5 4
6.4 ( 0.25
6.4 ( 0.25
1 2 3 1 2 3
+0.15
3.65 -0.25
10.16 ( 0.25
+0.15
3.65 -0.25
+0.25
3.9 -0.20
7.12 ( 0.25 7.62 ( 0.25
7.12 ( 0.25 7.62 ( 0.25
0.25 -0.05
+0.1
0.25 min
+0.1
0.25 -0.05 0.75 ( 0.25
1.2 ( 0.15
2.5 min
0.5 ( 0.1 1.2 ( 0.15 10 to 12 2.54 ( 0.25 12.0 max

2.54 ( 0.25
DIP6 (LF5) / (TP5)

Unit: mm
6 5 4
6.4 ( 0.25
1 2 3
+0.25
+0.15
3.85 -0.20
3.65 -0.25
7.12 ( 0.25 7.62 ( 0.25

0.25 -0.05
+0.1
0.2 max
1.0 min
2.54 ( 0.25 1.2 ( 0.15
10.0 max
53

Unit: mm Unit: mm
8 7 6 5
6.4 ( 0.25 8 7 6 5
6.4 ( 0.25
1 2 3 4
1 2 3 4
+0.15
-0.25
9.66 ( 0.25 7.62 ( 0.25
+0.15
-0.25
4.0 +0.25
3.65
-0.20
9.66 ( 0.25 7.62 ( 0.25
3.65
2.5 min 0.8 ( 0.25
1.2 ( 0.15 +0.1

0.25 -0.05
1.0 min
0.5 ( 0.1
2.54 ( 0.25 1.2 ( 0.15 10.0 max
2.54 ( 0.25 7.85 to 8.80
DIP8 (LF2) DIP8 (LF4) / (TP4)

Unit: mm Unit: mm
8 7 6 5
8 7 6 5
6.4 ( 0.25
6.4 ( 0.25
1 2 3 4 1 2 3 4
+0.15
-0.25
10.16 ( 0.25
+0.15
-0.25
+0.25
3.9 -0.20
9.66 ( 0.25 7.62 ( 0.25 9.66 ( 0.25 7.62 ( 0.25
3.65
3.65
0.25 -0.05
+0.1
2.5 min 0.25 min
0.75 ( 0.25
+0.1
0.5 ( 0.1 0.25 -0.05 12.0 max
1.2 ( 0.15
2.54 ( 0.25 10 to 12
2.54 ( 0.25
1.2 ( 0.15
DIP8 (LF5) / (TP5)

Unit: mm
8 7 6 5
6.4 ( 0.25
1 2 3 4
+0.15
3.65 -0.25
3.85 +0.25
-0.20
9.66 ( 0.25 7.62 ( 0.25

0.25 -0.05
+0.1
0.2 max
1.0 min
2.54 ( 0.25 1.2 ( 0.15 10.0 max
54
2 Package Dimensions (Other DIP Packages)

5-pin DIP6 5-pin DIP6 (LF2)
Unit: mm 3 2 1 Unit: mm
3 2 1
6.4 ( 0.25
6.4 ( 0.25
4 6
+0.15
3.65 -0.25
7.12 ( 0.25 7.62 ( 0.25 4 6

10.16 ( 0.25
+0.15
3.65 -0.25
7.12 ( 0.25 7.62 ( 0.25
0.8 ( 0.25
0.25 min
+0.1
0.25 -0.05
+0.1
0.25 -0.05
2.5 min
0.5 ( 0.1 1.2 ( 0.15 7.85 to 8.80
2.5 min
0.5 ( 0.1 1.2 ( 0.15
10 to 12
2.54 ( 0.25 2.54 ( 0.25
5-pin DIP6 (Cut) DIP16

Unit: mm Unit: mm
3 2 1 16 15 14 13 12 11 10 9
6.4 ( 0.25
6.4 ( 0.25
1 2 3 4 5 6 7 8
4 6
+0.15
3.65 -0.25
+0.15
7.12 ( 0.25 7.62 ( 0.25
3.65 -0.25
19.82 ( 0.25 7.62 ( 0.25
0.8 ( 0.25
2.5 min 0.8 ( 0.25
+0.1 +0.1
0.25 -0.05 0.25 -0.05
0.5 ( 0.1 1.2 ( 0.15

2.5 min
0.5 ( 0.1 1.2 ( 0.15 7.85 to 8.80

7.85 to 8.80
2.54 ( 0.25 2.54 ( 0.25
55
2 Package Dimensions (Surface Mount)

5-pin SO6 SO8
8 7 6 5
6 5 4 Unit: mm Unit: mm
3.95 ( 0.25
4.55 + 0.25
− 0.15
1 2 3 4
1 3
+ 0.25 5.1 ( 0.2 6.0 ( 0.2
3.7 − 0.15 7.0 ( 0.4
0.1 2.1 ( 0.1
2.5 ( 0.2
0.15
0.4
0.5 min
0.1 ( 0.1
1.27 0.305 min
2.54
1.27 ( 0.15
0.38
SO4 SO16
+ 0.25 Unit: mm
0.25 Unit: mm
2.6 − 0.15 10.3
A – 0.15
A
4 3 16 15 14 13 12 11 10 9
4.55 + 0.25
− 0.15
+ 0.25
− 0.15
4.55
2.1 ( 0.1
1 2 3 4 5 6 7 8
1 2 7.0 ( 0.4
7.0 ( 0.4
2.1 ( 0.1
(0.15)
(0.15)
(0.1)
1.27
0.5 min 1.27 0.4 ( 0.1 0.5 min ( 0.1)
0.38 ( 0.1 0.15 M A
0.15 M A
4-pin SO6 SDIP6

Unit: mm 4.58 ( 0.25 Unit: mm
6 4
6 5 4
4.55 + 0.25
− 0.15
6.8 ( 0.25
+0.15
-0.25
4.0 +0.25
-0.20
1 3 1 2 3
+ 0.25 7.0 ( 0.4
3.65
3.7 − 0.15 7.62 ( 0.25

+0.10
0.25 -0.05
2.1 ( 0.1
(0.15)
(0.4)
(0.1)
0.5 min
2.54 ( 0.25 1.27 ( 0.2 1.25 ( 0.25
0.4 ( 0.1 9.7 ( 0.3
56
2 Package Dimensions (Surface Mount)(Continued)

SDIP6 (F type) 4-pin MFSOP6
Unit: mm Unit: mm
4.58 ( 0.25 6 4
6 5 4
6.8 ( 0.25
4.4
+0.15
-0.25
1 3
3.9 +0.25
-0.20
1 2 3 3.6 ( 0.2 7.0 ( 0.4
3.65
7.62 ( 0.2
+0.10
0.25 -0.05
0.1 2.5 ( 0.2
0.15
0.4 0.5 min
1.27 ( 0.2 0.75 ( 0.25
0.4 ( 0.1 11.7 ( 0.3 2.54
5-pin MFSOP6 4-pin MFSOP6 (No.5Cut)

Unit: mm Unit: mm
6 5 4 3 1
4.4
4.4
1 3 4 6
3.6 ( 0.2 7.0 ( 0.4 3.6 ( 0.2 7.0 ( 0.4
0.1 2.5 ( 0.2
0.1 2.5 ( 0.2

0.15
0.15
0.4 0.5 min 0.4 0.5 min

1.27 1.27
2.54 2.54
SOP4 2.54SOP4
Unit: mm Unit: mm
4 3
4 3
4.4 ( 0.25
4.4 ( 0.25
1 2
2.1 max
1 2
2.6 ( 0.25 7.0 ( 0.4 3.9 ( 0.25 7.0 ( 0.4

0.15
2.1 max
0.15
1.9
0.1 ( 0.1
0.4 ( 0.1 0.6 ( 0.3

0.1 ( 0.1
0.4 ( 0.1 0.6 ( 0.3

1.27 ( 0.2 2.54 ( 0.25
57
2 Package Dimensions (Surface Mount)(Continued)

2.54SOP6 2.54SOP8
6 5 4 Unit: mm 8 7 6 5 Unit: mm
4.4 ( 0.25
4.4 ( 0.25
1 2 3 1 2 3 4
2.1 max
2.1 max
6.3 ( 0.25 7.0 ( 0.4 9.4 ( 0.25 7.0 ( 0.4
0.15
0.15
0.1 ( 0.1
0.6 ( 0.3 0.6 ( 0.3
0.1 ( 0.1
2.54 ( 0.25
2.54 ( 0.25
0.4 ( 0.1 0.4 ( 0.1
SOP16 SSOP4
16 15 14 13 12 11 10 9 Unit: mm 4.2 ( 0.1 Unit: mm
q1.4
1 4
4.4 ( 0.25
2 3
1.9 ( 0.1 3.65 ( 0.1
1.8 ( 0.1
0.15
1 2 3 4 5 6 7 8
(0.3)
10.3 ( 0.25 0.2 3.8 ( 0.1 0.2
7.0 ( 0.4 1.27
2.1 max
2.04 ( 0.1
0.15
1.9
(0.46)
0.1 ( 0.1
1.27 ( 0.2 0.4 ( 0.1 0.6 ( 0.3

BOTTOM VIEW
USOP4 SO6L
3.25 ( 0.2 Unit: mm 3.84 ( 0.2 Unit: mm
q1.2
6 5 4
3 2
10 ( 0.2
4 1
2.05 ( 0.2
10 ( 0.2
7.5 ( 0.2
1.65 ( 0.2
0.65 ( 0.15
0.1
0.2 ( 0.2 0.2 ( 0.2 0.4 ( 0.2

1.27 ( 0.2
1 2 3 0.38 ( 0.1
2.2 ( 0.2 1.27 ( 0.15
4 1
0.35 ( 0.2
2.1 ( 0.1
3 2
BOTTOM VIEW
SO16L VSON4
10.3 ( 0.2 Unit: mm Unit: mm
16 15 14 13 12 11 10 9
0.225 ( 0.1
10 ( 0.2
0.45 ( 0.1
0.85 ( 0.1 0.85 ( 0.1

(0.1)
10 ( 0.2
7.5 ( 0.2
+ 0.05
1.45 – 0.1
2 3
0.65 ( 0.15
0.1
1
4
0.8 ( 0.1
0.45 ( 0.1
1 2 3 4 5 6 7 8 + 0.05
(0.1)
0.38 ( 0.1 2.45 – 0.1 1.3 ( 0.1

1.27 ( 0.15
2.1 ( 0.1
BOTTOM VIEW
58
3 Rank Marking
Transistor-output photocouplers are ranked according to their CTR ranges, whereas thyristor-output and triac-output photocouplers
are ranked according to their maximum I FT value. The following gives the rank classifications and rank marks printed on packages.
Note that the rank classifications differ from product to product. For details, please refer to the relevant technical datasheets.
1. CTR Rank Name and Rank Marking

Available CTR Rank Selection ( O: Available, V: Contact Toshiba)
Rank Name
Part Number
None BV Y GR GB BL YH GRL GRH BLL
TLP124
TLP126
TLP130
TLP131
TLP182
TLP183
TLP184(SE
TLP185(SE
TLP188
TLP280-4
TLP281-4
TLP290(SE
TLP290-4
TLP291(SE
TLP291-4
TLP292
TLP292-4
TLP293
TLP293-4
TLP331
TLP332
TLP385
TLP531
TLP532
TLP620
TLP624
TLP626
TLP628
TLP630
TLP631
TLP632
TLP731
TLP732
TLP785
Part Number Rank Name CTR CTR Rank Part Number Rank Name CTR CTR Rank
None 50 to 600% Blank, YE, GR, GB, BL, Y+, G, G+, B TLP531 None 50 to 600% Blank, YE, GR, GB, BL
Y 50 to 150% YE TLP532
TLP620 Y 50 to 150% YE
TLP183 GR 100 to 300% GR
TLP185(SE TLP630
GB 100 to 600% GB GR 100 to 300% GR
TLP291(SE TLP631
BL 200 to 600% BL TLP632 GB 100 to 600% GB
TLP293
TLP385 YH 75 to 150% Y+ TLP731
TLP732 BL 200 to 600% BL
TLP785 GRL 100 to 200% G
GRH 150 to 300% G+
BLL 200 to 400% B Part Number Rank Name CTR CTR Rank
None 50 to 600% Blank, YE, GR, GB
Part Number Rank Name CTR CTR Rank Y 50 to 150% YE
TLP131
None 50 to 600% Blank, YE, GR, GB, BL GR 100 to 300% GR
Y 50 to 150% YE GB 100 to 600% GB
TLP182
GR 100 to 300% GR
TLP292 Part Number Rank Name CTR CTR Rank
GB 100 to 600% GB
BL 200 to 600% BL TLP124
TLP331 None 100 to 1200% Blank, BV
TLP332
Part Number Rank Name CTR CTR Rank TLP624 BV 200 to 1200% BV
None 50 to 600% Blank, YE, GR, GB, Y+, G, G+, B TLP626
Y 50 to 150% YE
TLP184(SE
TLP290(SE
GR 100 to 300% GR Part Number Rank Name CTR CTR Rank
GB 100 to 600% GB TLP130
TLP280-4 None 50 to 600% Blank, GB
BL 200 to 600% BL
TLP281-4
TLP620-2 GB 100 to 600% GB
Part Number Rank Name CTR CTR Rank TLP620-4
TLP290-4 None 50 to 400% Blank
TLP291-4 GB 100 to 400% GB Part Number Rank Name CTR CTR Rank
TLP126 None 50 to 1200% Blank
Part Number Rank Name CTR CTR Rank
TLP188 None 50 to 600% Blank Part Number Rank Name CTR CTR Rank
TLP292-4
TLP293-4 GB 100 to 600% GB None 50 to 600% Blank,Y,YQ,YE,G,GQ,GR,B,BQ,BL,GB
TLP628
GB 100 to 600% GB
59
2. LED Trigger Current (IFT) Ranking and Marking

Rank Name I FT IFT Rank Marking
None I FT max Blank, T7, T5
I FT7 7 mA max T7, T5
I FT5 5 mA max T5
I FT2 2 mA max T2
3. Marking Examples
(a) 4-pin DIP, 5-pin SO6, SO8, mini-flat (1 ch)
Lot No.
P Part number minus "TL"
CTR or IFT rank marking
Pin No. 1
(b) 4-pin SO6, SO6L

Pin No. 1
Lot No.
P185 Part number
In-house management no.
CTR rank marking
(c) SO4
Pin No. 1
Lot No.
In-house management no.
P291
CTR rank marking
Part number (P290 or P291 or P292 or P293)
(d) Others
Lot No.
TLP Part number
CTR or IFT rank marking
Pin No. 1
Note: When ordering a standard photocoupler, add a CTR or IFT rank in parentheses to the standard part number.
Examples: TLP185(GB) TLP785(GR)
Use the standard part number when applying for safety standard approval.
Example Part number Use this part number

TLP291(GB) TLP291
60
6 Packing Information
1 Photocoupler Magazine Packing Specifications

Magazine Dimensions* Device Quantities per Magazine Packing Dimensions*
Unit: mm
Number of Dimensions Label

4.5 4.3
Magazines (A x B x C) Position
Standard DIP
10.3
9.3
Package Pin Count 4 6 8 16 4 50 × 12 × 531 Y
5.5 Quantity (pcs) 100 50 50 25 20 67 × 51 × 559 Y

10.3
11.3 60 123 × 76 × 568 X
Length = 525
Thickness = 0.5
Unit: mm
DIPs with LF1, LF2, LF4 and LF5
6.7
1.4

Lead Forming
4.4 2.7
9.5
Package Pin Count 4 6 8 16

4 60 × 13 × 531 Y
5.5 Quantity (pcs) 100 50 50 25
14 40 135 × 58 × 568 X
Length = 525
Thickness = 0.5
Unit: mm
10.5
0.8 4.3
1.4
2.9
4 Number of Dimensions Label

6.2
5.2
Package Pin Count (SO4) Magazines (A x B x C) Position

SO4
4.7 Quantity (pcs) 175 X

40 71 × 32 × 584
9.5
Length = 555
Thickness = 0.5
Unit: mm
10.5
4.8
4 or 5 Number of Dimensions Label
Package Pin Count
3.4
(SO6) Magazines (A x B x C) Position

SO6
1.7
6.2
Quantity (pcs) 125 40 70 × 55 × 585 X

4.7
Length = 555
Thickness = 0.5
Unit: mm
13
7.5

Package Pin Count
SO6L
2.9
(SO6L) Magazines (A x B x C) Position

1.6
6.2
Quantity (pcs) 125 20 70 × 55 × 585 X

8
Length = 555
Thickness = 0.5
*All dimensions are typical values.
61
Magazine Dimensions* Device Quantities per Magazine Packing Dimensions*

Unit: mm
10.5
4.4
3.4
Package Pin Count (SO8) Magazines (A x B x C) Position

SO8
1.8
6.2
Quantity (pcs) 100 24 75 × 29 × 579 X

4.3
Length = 555
Thickness = 0.5
Unit: mm
10.5
4.8
Package Pin Count
2.3 2.9
SO16
(SO16) Magazines (A x B x C) Position

1.7
6.2
Quantity (pcs) 50 40 61 × 56 × 586 X

4.7
Length = 555
Thickness = 0.5
Unit: mm
10.5
4.9
MFSOP6
3.4
4 29 × 13 × 563 Y
1.3
6.2
4 or 5
Package Pin Count (MFSOP6)
24 77 × 31 × 586 Y
4.7
Quantity (pcs) 150
40 67 × 55 × 586 X
Length = 555
Thickness = 0.5
Unit: mm
0.8 4.2 Package 4 16 Number of Dimensions Label

SOP Photocoupler
Pin Count (SOP4) (SOP16) Magazines (A x B x C) Position

Quantity
2.8 3.4
150 50
1.6
6.2
(pcs) 4 29 × 13 × 563 Y
Package 4 6 8 24 77 × 31 × 586 Y
5.2 Pin Count (2.54SOP4) (2.54SOP6) (2.54SOP8)
10.5
Quantity 40 67 × 55 × 586 X
100 75 50
(pcs)
Length = 555
Thickness = 0.5
*All dimensions are typical values.
[Packing]
B X
C
62
2 Tape-and-Reel Specifications
1. Embossed Tape Specifications for Surface-Mount Lead Form Options
Photocoupler Package Types Tape Option Symbol Typical Devices
VSON4 (TP) TLP3403, TLP3412, TLP3417, TLP3420, TLP3440, TLP3475
MFSOP6 (TPL) or (TPR) TLP165J, TLP190B, TLP127
SO6 (TPL) or (TPR) TLP185(SE, TLP2301, TLP2309, TLP265J, TLP175A
SO6L (TP) TLP5701, TLP5702, TLP5751, TLP5752, TLP5754
SO16L (TP) TLP5214
SO4 (TP) TLP290(SE, TLP291(SE, TLP292, TLP293
SOP16 (TP) TLP280-4, TLP281-4
SO16 (TP) TLP290-4, TLP291-4, TLP292-4, TLP293-4
2.54SOP4 (TP) TLP176G, TLP176A, TLP176D, TLP171A
2.54SOP6 (TP) TLP197G
2.54SOP8 (TP) TLP200D, TLP206A, TLP206G
SSOP4 (TP15) TLP3212, TLP3214 to TLP3217, TLP3230 to TLP3250
SDIP6 (TP) TLP701, TLP705A, TLP719, TLP2766
DIP(LF1, LF5) (TP1) or (TP5) TLP550, TLP560G, TLP351A, TLP352, TLP240A
DIP(LF4) (TP4) TLP560G, TLP351A, TLP352, TLP240A
SO8 (TP) TLP2168, TLP2468
2. Tape Dimensions
2.0 ( 0.1 Unit: mm
t J F G
E
D
C
B
KO A
K
Unit: mm
Photocoupler
Package VSON4 MFSOP6 SDIP6 DIP
SO6 SO6L SO16L SO8 SOP4 SO4 SOP16 SO16 2.54SOP4 2.54SOP6 2.54SOP8 SSOP4 SDIP6 F type (LF1, LF5) DIP(LF4)
Type
(TPL), (TPL), (TP1),
Tape Option (TP) (TP) (TP) (TP) (TP) (TP) (TP) (TP) (TP) (TP) (TP) (TP15) (TP) (TP) (TP4)
(TPR) (TPR) (TP5)
A 1.6 ( 0.1 4.2 ( 0.1 4.0 ( 0.1 10.4 ( 0.1 10.4 ( 0.1 6.5 ( 0.1 3.1 ( 0.1 7.5 ( 0.1 4.3 ( 0.1 7.5 ( 0.1 2.35 ( 0.2 10.4 ( 0.1 12.3 ( 0.1 10.4 ( 0.1 12.3 ( 0.1
B 3.0 ( 0.1 7.6 ( 0.1 4.24 ( 0.1 10.7 ( 0.1 5.6 ( 0.1 7.5 ( 0.1 10.5 ( 0.1 7.5 ( 0.1 6.7 ( 0.1 10.5 ( 0.1 4.5 ( 0.1 5.1 ( 0.1 @1 @1
C 8.0 ( 0.3 12.0 ( 0.3 16.0 ( 0.3 16.0 ( 0.3 12.0 ( 0.3 16.0 ( 0.3 12.0 ( 0.3 16.0 ( 0.3 12.0 ( 0.3 16.0 ( 0.3
Symbol (See figure above)
D 3.5 ( 0.1 5.5 ( 0.1 7.5 ( 0.1 7.5 ( 0.1 5.5 ( 0.1 7.5 ( 0.1 5.5 ( 0.1 7.5 ( 0.1 5.5 ( 0.1 7.5 ( 0.1
Dimensions
E 1.75 ( 0.1
F 4.0 ( 0.1 8.0 ( 0.1 12.0 ( 0.1 12.0 ( 0.1 8.0 ( 0.1 12.0 ( 0.1 8.0 ( 0.1 12.0 ( 0.1 4.0 ( 0.1 12.0 ( 0.1 16.0 ( 0.1 12.0 ( 0.1 16.0 ( 0.1
G 4.0 ( 0.1
+ 0.1
J 1.5 – 0
K (1.8 ( 0.1) 3.15 ( 0.2 2.9 ( 0.2 (2.7 ± 0.1) (2.7 ± 0.1) 3.4 ( 0.2 2.5 ( 0.2 3.15 ( 0.2 2.4 ( 0.2 2.6 ( 0.2 2.6 ( 0.2 2.5 ( 0.2 2.4 ( 0.2 2.4 ( 0.2 4.55 ( 0.2
K0 1.5 ( 0.1 2.8 ( 0.1 2.6 ( 0.1 2.4 ± 0.1 2.4 ± 0.1 3.1 ( 0.1 2.3 ( 0.1 2.2 ( 0.1 2.4 ( 0.1 2.3 ( 0.1 2.2 ( 0.1 2.1 ( 0.1 4.1 ( 0.1
t 0.2 ( 0.05 0.3 ( 0.05 0.4 ( 0.05
@1: Typical devices

DIP4 TLP620, TLP627, TLP240A 5.1 ± 0.1
DIP6 (short package) TLP560G, TLP590B, TLP748J 7.6 ( 0.1
DIP8 TLP351A, TLP754 10.1 ± 0.1 (TP4) is not available
63
3. Reel Dimensions
W1
W2
B
C
C
U
B
A
E
W1
W2
ø380 mm ø330 mm ø180 mm
Unit: mm
Photocoupler MFSOP, SO6L, SOP16 SO16 SO8 2.54SOP4 2.54SOP6 2.54SOP8 SSOP4 SDIP6 DIP DIP
Package Type SO6
SOP4 SO4 VSON4 SDIP6 F type (LF1, LF5) (LF4)
SO16L
(TPL), (TP1),
Tape Option (TP) (TP) (TP) (TP) (TP) (TP) (TP) (TP) (TP) (TP15) (TP) (TP) (TP) (TP4)
(TPR) (TP5)
A ø380 ( 2 ø330 ( 2 +0 ø180 ( 3 ø380 ( 2
180 – 4
Symbol (See figure above)
B ø80 ( 1 ø100 ( 1 ø80 ( 1 ø60 ø60 ( 1 ø80 ( 1

Dimensions
C ø13 ( 0.5 ø13 ø13 ( 0.5
E 2.0 ( 0.5 2 ( 0.5 2.0 ( 0.5
U 4.0 ( 0.5
W1 13.5 ( 0.5 17.4 ( 1.0 17.5 ( 0.5 13.5 ( 0.5 17.5 ( 0.5 13 ( 0.3 9.0 ( 0.3 17.5 ( 0.5
W2 17.5 ( 1.0 21.4 ( 1.0 21.5 ( 1.0 17.5 ( 1.0 21.5 ( 1.0 15.4 ( 1.0 11.4 ( 1.0 21.5 ( 1.0
Some products are provided in black reels.
64
4. Other Packing Information
a) Device orientation on tape
Photocouplers are oriented in cavity, as shown below.
User direction of feed

Photocoupler Package Type Tape Option
A)
MFSOP6, SO6, SO6L TPR
A)

MFSOP6, SO6 TPL
B)
SO4, SOP4, 2.54SOP4, VSON4 TP
B)
SSOP4 TP15

SO16, SOP16, SO8, SO6L, SO16L TP
2.54SOP6/8 TP
C)
SDIP6, SDIP(F type) TP C)
DIP(LF1, LF5) TP1, TP5
DIP(LF4), DIP(F type) TP4
b) Tape Specifications
Q Quantities Per Reel
Photocoupler MFSOP6, SO6, SO6L, SO4, SOP4, SOP16 SO16 2.54SOP4/6/8 SSOP4 SDIP6 SDIP6 F type DIP(LF1, LF5) DIP(LF4)
Package Type VSON4 SO16L SO8
Quantity (pcs) 3000 1500 2500 2500 2000 2500 1500 1500 1000 1500 1000
Q Empty Cavities
Item Specification Note
Consecutive empty cavities Zero Any 40-mm portion of tape except leader and trailer.
Non-consecutive empty cavities 0.2% max/reel @2 Except leader and trailer.
@2: 6 pcs max/reel for DIP and SDIP packages
c) Packing boxes
One or five reels per box
d) Label
The reel label includes the following information:
1. Part number 2. Tape type 3. Quantity 4. Lot number
65
7 Board Assembly
1 Example Land Patterns

Unit: mm
SO6 (4-pin)
SO6 (5-pin) SOP4
MFSOP6 (4-pin) SSOP4 VSON4
MFSOP6 (5-pin) SO4
2.54SOP4
0.8 0.8 0.8
0.55
0.8
1.2
1.2
1.2
0.95
1.0
1.27 1.27
1.75
6.3
6.3
6.3
3.73
1.27
0.8
2.54 2.54 1.27
Unit: mm
SOP16
SO16L SO6L SO8
SO16
0.8 0.8 0.8

0.8
1.3
1.3
1.2
1.2
9.5
5.5
6.3
9.5
1.27 1.27 1.27 1.27 1.27 1.27 1.27 1.27 1.27 1.27 1.27 1.27
1.27
Unit: mm
DIP package* DIP package*

SDIP6 SDIP6 (F type)
(LF1), (LF5) (LF4), (F type)
0.8 0.8 1.5

1.5
1.6
1.6
1.7
1.6
10.4
8.8
8.7
10.4
1.27 1.27 2.54 2.54

1.27 1.27 2.54 2.54
Example: DIP 6pin Example: DIP 6pin
*: For the example land patterns for the TLP781 and TLP785, see their respective datasheets.
66
2 Board Assembly Considerations
1. Soldering 2. Flux Cleaning
The profile below shows only the typical temperature profile and O When cleaning circuit boards to remove flux, make sure that
conditions, which might not apply to all Toshiba photocouplers. no residual reactive ions such as sodium(Na+) or chloride(Cl–)
Temperature profiles and conditions may differ from product to ions remain. Note that organic solvents react with water to
product. Refer to the relevant technical datasheets and databooks generate hydrogen chloride and other corrosive gases, which
when mounting a device. can degrade device performance.
When using a soldering iron or medium infrared ray/hot air reflow, O Washing devices with water will not cause any problems.
avoid a rise in device temperature as much as possible by However, make sure that no reactive ions such as
observing the following conditions. sodium(Na+) or chloride(Cl–) ions are left as residue. Also, be
sure to dry devices sufficiently after washing.
1.1) Using a soldering iron O Do not rub device markings with a brush or with your hand
a. Solder once within 10 seconds for a lead temperature of during cleaning or while the devices are still wet from the
up to 260°C. cleaning agent. Doing so can rub off the markings.
b. Solder once within 3 seconds for a lead temperature of up O Dip cleaning, shower cleaning and steam cleaning processes
to 350°C. all involve the chemical action of a solvent. Use only
recommended solvents for these cleaning methods. When
1.2) Using medium infrared ray/hot air reflow immersing devices in a solvent or steam bath, make sure
a. Complete the infrared ray/hot air reflow process at once that the temperature of the liquid is 50$C or below and that
within 30 seconds at a package surface temperature the circuit board is removed from the bath within one minute.
between 210$C and 240$C. O If a device package allows ultrasonic cleaning, keep the
b. Example of temperature profile of lead (Pb)-free solder duration of ultrasonic cleaning as short as possible, since
long hours of ultrasonic cleaning degrade the adhesion
($C) between the mold resin and the frame material.
260
230 Q The following ultrasonic cleaning conditions
Package surface
temperature
are recommended.
190
180 Frequency: 27 kHz to 29 kHz
Ultrasonic output power: 300 W or less (0.25 W/cm 2 or less)
Cleaning time: 30 seconds or less
60 to 120 30 to 50
seconds seconds
Suspend the circuit board in the solvent bath during ultrasonic
Time (s) cleaning in such a way that the ultrasonic vibrator does not come
Example of temperature profile of lead (Pb)-free solder into direct contact with the circuit board or the device.
Conventional cleaning solvents that contain freon are not
recommended due to its adverse effects on the earth’s ozone
c. Temperature Profile of JEDEC Pb-Free Solder
layer. Alternative freon-free products are available on the market.
(For Reference Only)
Some of these alternative cleaning agents are listed in the table
($C)
below.
Contact Toshiba or a Toshiba distributor regarding cleaning
260
255 conditions and other relevant information for each product type.
Package surface
temperature TC
217
200
150 30 (Max)
60 to 120 60 to 150
seconds seconds
Time (s)
d. Precautions for heating

Keeping packages at high temperature for a long period
of time can degrade the quality and reliability of devices.
Soldering time has to be kept as short as possible to
avoid a rise in package temperature.
When using a halogen lamp or infrared heater, avoid
direct irradiation of packages, since this may cause a rise
in package temperature.
1.3) Dip soldering (flow soldering)
The thermal shock of dip soldering increases thermal stress
on devices. To avoid stress, the use of a soldering iron or
medium infrared ray/hot air reflow is recommended. If you
want to use dip soldering, contact your nearest Toshiba
sales representative.
67
8 Device Degradation
1 Projected Operating Life Based on LED Light Output Degradation

Toshiba photocouplers use one of four types of LEDs and a projection of the operating life has been made for each LED. The table
on page 69 shows the types of LED used in photocouplers and the figures on pages 70 to 72 show projections of long-term light output
performance and operating life. Note that these operating life data are estimates extrapolated from long-term light output degradation
over a single wafer lot and are shown as reference only.
Projected Operating Life

Ta = 40$C, IF = 20 mA, failure criteria:
degradation rate 6 PO < –50% Photocouplers
F50% operating life F0.1% operating life
Mainly for phototransistor output devices

1 GaAs LED 1,300,000 h 260,000 h
and phototriac output devices
2 GaA As(SH) LED 540,000 h 100,000 h Mainly for photo-IC couplers
Mainly for photorelays (MOSFET output),

3 GaA As(DH) LED 1,000,000 h 200,000 h
photovoltaic couplers and photo-IC couplers
4 GaA As(MQW) LED Ask your local Toshiba sales representative. Mainly for photo-IC couplers
F50% (cumulative failure rate 50%) operating life: Time period until the projected long-term light output degradation curve of
the average light output change ( X ) shown on pages 70 to 72 reaches the
failure criteria.
F0.1% (cumulative failure rate 0.1%) operating life: Time period until the projected long-term light output degradation curve of
X - 3mshown on pages 70 to 72 reaches the failure criteria.
The relationship between LED light output degradation and optical coupling characteristics is shown below.
(1) The relationship between LED light output degradation

and current transfer ratio (CTR)/short circuit current (ISC) is 1:1.
CTR (t) Po (t)
=
CTR (o) Po (o)
(2) The relationship between a reciprocal value of LED light output degradation
and I FT/I FLH/I FHL/I FH change is 1:1.
I FT (t) Po (t) -1
I FT (o)
= ( Po (o)
)
68
2
LEDs Used in Photocouplers

LED: 1 GaAs 2 GaA As (SH) 3 GaA As (DH) 4 GaA As (MQW)
Photocouplers LED Photocouplers LED Photocouplers LED Photocouplers LED Photocouplers LED
TLP104 4 TLP224G Series 1 TLP555 2 TLP759 Series 2 TLP2766 4

TLP105 4 TLP225A 1 TLP557 2 TLP762J 1 TLP2767 +
TLP108 4 TLP227 Series 1 TLP558 2 TLP763J 1 TLP2768 4
TLP109 Series 4 TLP228 Series 1 TLP559 Series 2 TLP785 1 TLP2955 4
TLP116A 4 TLP240 Series 4 TLP560 Series 1 TLP797 Series 1 TLP2958 4
TLP117 4 TLP241A 4 TLP561 Series 1 TLP798GA 3 TLP2962 4
TLP118 4 TLP250H 4 TLP570 1 TLP2066 3 TLP3022(S) 1
TLP124 1 TLP265J 4 TLP571 1 TLP2095 4 TLP3023(S) 1
TLP126 1 TLP266J 4 TLP572 1 TLP2098 4 TLP3042(S) 1
TLP127 1 TLP267J 4 TLP590B 3 TLP2105 2 TLP3043 1
TLP130 1 TLP268J 4 TLP591B 3 TLP2108 2 TLP3052 1
TLP131 1 TLP280-4 1 TLP592 Series 1 TLP2116 2 TLP3062 1
TLP137 1 TLP281-4 1 TLP597 Series 1 TLP2118E 4 TLP3063(S) 1
TLP148G 1 TLP290-4 1 TLP598 Series 3 TLP2160 4 TLP3064 3
TLP151A 4 TLP290(SE 1 TLP620 Series 1 TLP2161 4 TLP3082 1
TLP152 4 TLP291-4 1 TLP624 Series 1 TLP2166A 2 TLP31xx Series 1
TLP155 Series 4 TLP291(SE 1 TLP626 Series 1 TLP2167 + TLP3203 1
TLP160 Series 1 TLP292 Series 4 TLP627 Series 1 TLP2168 4 TLP321x Series 1
TLP161 Series 1 TLP293 Series 4 TLP628 Series 1 TLP2200 2 TLP3220 1
TLP163J 1 TLP331 1 TLP630 1 TLP2301 4 TLP3230 1
TLP165J 1 TLP332 1 TLP631 1 TLP2309 4 TLP3231 1
TLP166J 1 TLP350 2 TLP632 1 TLP2310 + TLP3240 3
TLP168J 3 TLP350H 4 TLP651 2 TLP2345 + TLP3241 3
TLP170 Series 1 TLP351 2 TLP663J 1 TLP2348 + TLP3250 3
TLP171 Series 4 TLP351A 4 TLP665 Series 1 TLP2355 4 TLP3275 1
TLP172 Series 1 TLP351H 4 TLP666 Series 1 TLP2358 4 TLP33xx Series 1
TLP173A 1 TLP352 4 TLP668J 3 TLP2361 4 TLP34xx Series 4
TLP174G Series 1 TLP358 4 TLP669L 4 TLP2362 4 TLP35xx Series 3
TLP175A 4 TLP358H 4 TLP700 4 TLP2366 4 TLP3762(S) 1
TLP176 Series 1 TLP360J 1 TLP700A 4 TLP2367 + TLP3782 4
TLP179D 1 TLP361J 1 TLP700H 4 TLP2368 4 TLP3783 4
TLP182 4 TLP363J 1 TLP701 2 TLP2395 4 TLP3902 1
TLP183 4 TLP371 1 TLP701A 4 TLP2398 4 TLP3904 1
TLP184(SE 1 TLP372 1 TLP701H 4 TLP2403 4 TLP3905 4
TLP185(SE 1 TLP373 1 TLP705A 4 TLP2404 4 TLP3906 4
TLP187 4 TLP385 + TLP708 4 TLP2405 4 TLP3914 3
TLP188 4 TLP512 2 TLP714 4 TLP2408 4 TLP3924 3
TLP190B 3 TLP513 2 TLP715 2 TLP2409 4 TLP4xxx Series 1
TLP191B 3 TLP523 Series 1 TLP716 2 TLP2418 4 TLP5701 4
TLP192 Series 1 TLP525G Series 1 TLP718 2 TLP2451A 4 TLP5702 4
TLP197 Series 1 TLP531 1 TLP719 2 TLP2466 4 TLP5751 4
TLP199D 1 TLP532 1 TLP731 1 TLP2468 4 TLP5752 4
TLP200D 1 TLP548J 1 TLP732 1 TLP2530 2 TLP5754 4
TLP202 Series 1 TLP549J 1 TLP733 1 TLP2531 2 TLPN137 4
TLP206 Series 1 TLP550 2 TLP734 1 TLP2601 2 6N135 2
TLP209D 1 TLP551 2 TLP748J 1 TLP2630 2 6N136 2
TLP221A 4 TLP553 2 TLP751 2 TLP2662 4 6N138 2
+: Under development
69
1 GaAs LED Projected Light Output Degradation Data
Test conditions: I F = 50 mA, Ta = 40$C Test conditions: I F = 20 mA, Ta = 40$C
Light output (PO) relative change (%)

140 140
120 120
X
100 100
X
80 80
60 60 X-3m
40 40
X-3m
20 20
0 0
1 10 100 1000 10000 100000 1 10 100 1000 10000 100000
Test time (h) Test time (h)
Test conditions: I F = 10 mA, Ta = 40$C

140
120
X
100
80
X-3m
60
40
20
0
1 10 100 1000 10000 100000
Test time (h)
1 GaAs LED Projected Operating Life Data
Failure criteria light output degradation 6 PO < –50% Failure criteria light output degradation 6 PO < –30%
10000000 IF = 10 mA 10000000
IF = 10 mA
IF = 20 mA
IF = 10 mA
1000000 IF = 30 mA 1000000 IF = 20 mA
Projected operating life (h)
IF = 40 mA IF = 10 mA IF = 30 mA
IF = 20 mA IF = 50 mA
IF = 40 mA
IF = 30 mA
100000 100000 IF = 20 mA IF = 50 mA
IF = 40 mA
IF = 30 mA
IF = 50 mA
IF = 40 mA
10000 10000 IF = 50 mA
Projected F50% Projected F50%

1000 operating life 1000 operating life
Projected F0.1% Projected F0.1%
operating life operating life
100 100
2.0 3.0 4.0 5.0 2.0 3.0 4.0 5.0
1 / K (x10-3) 1 / K (x10-3)
227 150 100 85 60 25 0 –30 –50 –73 227 150 100 85 60 25 0 –30 –50 –73
Ambient Temperature (°C) Ambient Temperature (°C)
The above operating life data are estimates extrapolated from long-term light output degradation over a single wafer lot and are shown as
reference only. Operating conditions exceeding the maximum ratings are not guaranteed.
70
2 GaA As (SH) LED Projected Light Output Degradation Data
Test conditions: I F = 50 mA, Ta = 40$C Test conditions: I F = 20 mA, Ta = 40$C


140 140
120 120
X
100 100
80 80
X
60 60 X-3m
40 40
X-3m
20 20
0 0
1 10 100 1000 10000 100000 1 10 100 1000 10000 100000
Test conditions: I F = 10 mA, Ta = 40$C

140
120
X
100
80
X-3m
60
40
20
0
1 10 100 1000 10000 100000
Test time (h)
2 GaA As (SH) LED Projected Operating Life Data
10000000 IF = 10 mA 10000000
IF = 10 mA
IF = 20 mA
1000000 1000000
IF = 10 mA IF = 30 mA IF = 20 mA
IF = 40 mA IF = 10 mA IF = 30 mA
100000 IF = 20 mA IF = 50 mA 100000 IF = 40 mA
IF = 30 mA IF = 20 mA IF = 50 mA
IF = 40 mA IF = 30 mA
10000 IF = 50 mA 10000 IF = 40 mA
IF = 50 mA

1000 operating life 1000
operating life
100 100
2.0 3.0 4.0 5.0 2.0 3.0 4.0 5.0
1 / K (x10-3) 1 / K (x10-3)
227 150 100 85 60 25 0 –30 –50 –73 227 150 100 85 60 25 0 –30 –50 –73
The above operating life data are estimates extrapolated from long-term light output degradation over a single wafer lot and are
shown as reference only. Operating conditions exceeding the maximum ratings are not guaranteed.
71
3 GaA As (DH) LED Projected Light Output Degradation Data
Test conditions: I F = 50 mA, Ta = 40 $C Test conditions: I F = 20 mA, Ta = 40 $C


140 140
120 120
X
100 100
X
80 80
60 60 X-3m
40 40
X-3m
20 20
0 0
1 10 100 1000 10000 100000 1 10 100 1000 10000 100000
Test conditions: I F = 10 mA, Ta = 40 $C

140
120
X
100
80
X-3m
60
40
20
0
1 10 100 1000 10000 100000
Test time (h)
3 GaA As (DH) LED Projected Operating Life Data
10000000 IF = 10 mA 10000000
IF = 10 mA
IF = 20 mA
1000000 IF = 10 mA 1000000 IF = 20 mA
IF = 30 mA
IF = 40 mA IF = 10 mA IF = 30 mA
IF = 20 mA IF = 50 mA IF = 40 mA
100000 IF = 30 mA 100000 IF = 20 mA IF = 50 mA
IF = 40 mA IF = 30 mA
IF = 50 mA IF = 40 mA
10000 10000 IF = 50 mA

1000 operating life 1000
operating life
100 100
2.0 3.0 4.0 5.0 2.0 3.0 4.0 5.0
1 / K(×10−3) 1 / K(×10−3)
227 150 100 85 60 25 0 –30 –50 –73 227 150 100 85 60 25 0 –30 –50 –73
The above operating life data are estimates extrapolated from long-term light output degradation over a single wafer lot and are
shown as reference only. Operating conditions exceeding the maximum ratings are not guaranteed.
4 GaA As (MQW) LED Projected Light Output Degradation and Operating Life Data
Toshiba is now preparing the light output degradation and operating life data for GaA As (MQW) LEDs.
These data are available for individual LEDs. Ask your local Toshiba sales representative.
72
Reading the Projected LED Operating Life Graph
For example, let’s calculate the operating life of the GaAs LED, based on the data shown on page 70.
Here is an example of how to read an operating life, assuming that the ambient temperature (Ta) is 40°C and that the failure
criterion is a 30% decrease in light output.
Suppose that the initial LED current, IF, is 20 mA. Since the horizontal axis of the failure criteria graph is the reciprocal of absolute
temperature, it is necessary to convert the ambient temperature (Ta) to the reciprocal of absolute temperature (T):
1 1
T= = 3.19 × 10ï
Ta + 273.15 40 + 273.15
The graph shows the projected lifetimes for F50% and F0.1% cumulative failure probabilities in solid and dashed lines respectively.
Normally, it is recommended to use F0.1% lines.
As X = 3.19, its intersection with the IF = 20 mA line for F0.1% is approximately 80,000 hours. (This figure is for reference only.)
Failure criteria for light output degradation 6 PO < –30%

10000000
IF = 10mA
1000000 IF = 20mA
IF = 30mA
IF = 10mA
IF = 40mA
100000 IF = 20mA IF = 50mA
80000
IF = 30mA
IF = 40mA
10000 IF = 50mA
Projected F50%
1000 operating life
Projected F0.1%
operating life
100
2.0 3.0 3.19 4.0 5.0
1/K(×10–3)
227 150 100 85 60 40 25 0 −20 −50 −73

Ambient Temperature (°C)
You can also estimate the projected operating life from the projected light output degradation data.
Test conditions: I F = 20 mA, Ta = 40 $C

140
120
100 X
–30%
80
70
60 X-3m
40
20
0
1 10 100 1000 10000 100000
80000
Test time (h)
73
9 Safety Standard Approvals
Toshiba offers a wide selection of photocouplers with a transistor output, IC output, thyristor output and triac output, as well as
photorelays certified to UL (USA), cUL (Canada), VDE (Germany), BSI (Britain), SEMKO (Sweden) and CQC (China).
Safety Standard Approvals for Photocouplers (DIN EN60747-5)

Reflective Photocouplers in
Mechanical Construction Transmissive Photocouplers in Single-Molded Packages
Single-Molded Packages
Coupling Medium (Window) Package Photo Detector Chip Coupling Medium (Window)
(Body)
Package
(Body)
Internal
Construction
Lead
Lead
LED Chip Photo Detector Chip LED Chip
Package SO8 2.54SOP DIP

SOP4/SOP16 MFSOP6 MFSOP6 (2 ch) 4/6/8 DIP (F type)
Isolation Creepage Path (mm) 4.0 5.0 4.0 4.0 4.2 4.0 6.4/7.0 8.0
Construction
Mechanical Isolation Clearance (mm) 4.0 5.0 4.0 4.0 4.2 4.0 6.4/7.0 8.0
Ratings Isolation Thickness (mm) 0.4 0.4 0.4 – – – (0.4) (0.4)
(min)
Internal Creepage Path (mm) – – – – – – – –
Max.
VDE/TÜV Working Insulation 565 Vpk 707 Vpk 565 Vpk 565 Vpk 565 Vpk 565 Vpk 630 Vpk 1140 Vpk
DIN Voltage (Viorm) /890 Vpk
EN
60747-5-5 Highest Allowable
Overvoltage (Viotm) 4000 Vpk 6000 Vpk 6000 Vpk 4000 Vpk 4000 Vpk 2500 Vpk 4000 Vpk 6000 Vpk
TLP2105 TLP350 TLP350F

TLP2108 TLP351 TLP351F
TLP2166A TLP559
TLP2116
TLP2118E
TLP2168
TLP2160
IC Output
TLP280-4 TLP127
TLP281-4
Transistor Output
TLP160G TLP560G
Certified TLP160J TLP560J
TLP161G TLP561G
Devices TLP161J TLP561J
TLP168J
Triac/Thyristor
Output
TLP176A TLP227G
TLP176D TLP227G-2
TLP176G TLP597G
TLP197G
TLP206G
Photorelay/Photovoltaic
74
The table above lists photocouplers and photorelays that have already been approved as of August 2014.
The information herein is subject to change. For the latest information, please contact your nearest Toshiba sales representative.
Transmissive Photocouplers with an Insulating Film in

Transmissive Photocouplers in Double-Molded Packages
Single-Molded Packages
Photo Detector Chip Coupling Medium (Window) Photo Detector Chip Coupling Medium (Window)
Package
Package
(Body)
(Body)
Lead
Lead
LED Chip Film LED Chip Die Coat
SO8 SDIP6 DIP DIP

(1 ch) SDIP6 (F type) DIP (F type) MFSOP6 SO4 SO6 SO6L SO16 DIP (F type)
4.0 7.0 8.0 6.4/7.0 8.0 4.0 5.0 5.0 8.0 5.0 6.5/7.0 8.0
4.0 7.0 8.0 6.4/7.0 8.0 4.0 5.0 5.0 8.0 5.0 6.5/7.0 8.0
– 0.4 0.4 0.4/0.5 0.4/0.5 – 0.4 0.4 0.4 – 0.4/0.5 0.4/0.5
– – – – – – – – – – 0.4/0.5 4.0
1140 Vpk 890 Vpk 890 Vpk
565 Vpk 890 Vpk 1140 Vpk 890 Vpk 1140 Vpk 565 Vpk 707 Vpk 707 Vpk 565 Vpk
/1230 Vpk /1130 Vpk /1130 Vpk
6000 Vpk 6000 Vpk 4000 Vpk 6000 Vpk 6000 Vpk
6000 Vpk 8000 Vpk 8000 Vpk /8000 Vpk /8000 Vpk /6000 Vpk 6000 Vpk 6000 Vpk 8000 Vpk 4000 Vpk /8000 Vpk /8000 Vpk
TLP2403 TLP700 TLP700F TLP750 TLP750F TLP117 TLP109 TLP2703

TLP2404 TLP700A TLP700AF TLP751 TLP751F TLP2066 TLP116A TLP2768A
TLP2405 TLP700H TLP700HF TLP759 TLP759F TLP2095 TLP104 TLP5701
TLP2408 TLP701 TLP701F TLP350H TLP350HF TLP2098 TLP118 TLP5702
TLP2409 TLP701A TLP701AF TLP351H TLP351HF TLP151A TLP5751
TLP2418 TLP701H TLP701HF TLP352 TLP352F TLP155 TLP5752
TLP2451A TLP705A TLP705AF TLP358 TLP358F TLP155E TLP5754
TLP2466 TLP708 TLP708F TLP358H TLP358HF TLP2309
TLP2468 TLP714 TLP714F TLPN137 TLP250HF TLP2345
TLP715 TLP715F TLP250H TLP351AF TLP2348
TLP716 TLP716F TLP351A TLP754F TLP2355
TLP718 TLP718F TLP754 TLP2662F TLP2358
TLP2962 TLP152
TLP2301
TLP2303
TLP2361
TLP2391
TLP2395
TLP2398
TLP620 TLP620F TLP290(SE TLP184(SE TLP385 TLP290-4 TLP733 TLP733F
TLP624 TLP291(SE TLP185(SE TLP291-4 TLP734 TLP734F
TLP626 TLP292 TLP182 TLP292-4 TLP785 TLP785F
TLP627 TLP293 TLP183 TLP293-4
TLP628 TLP187
TLP731 TLP188
TLP732
TLP360J TLP360JF TLP165J TLP265J TLP762J TLP762JF
TLP361J TLP361JF TLP166J TLP266J TLP763J TLP763JF
TLP363J TLP363JF TLP267J TLP748J TLP748JF
TLP3022(S) TLP3022F(S) TLP268J
TLP3023(S) TLP3023F(S)
TLP663J(S) TLP663JF(S)
TLP665G(S) TLP665GF(S)
TLP666G(S) TLP666GF(S)
TLP666L(S) TLP666LF(S)
TLP669L(S) TLP669LF(S)
TLP797GA TLP797GAF TLP175A TLP220A TLP220AF
TLP797J TLP797JF TLP3905 TLP220D TLP220DF
TLP3906 TLP220G TLP220GF
TLP220GA TLP220GAF
TLP220J TLP220JF
TLP221A TLP221AF
TLP240A TLP240AF
TLP240D TLP240DF
TLP240G TLP240GF
TLP240GA TLP240GAF
TLP240J TLP240JF
TLP241A TLP241AF
75
SUBSIDIARIES AND AFFILIATES (As of April 1, 2014)
Sep. 2014
Toshiba America Toshiba Electronics Europe GmbH Toshiba Electronics (China) Co., Ltd.
Electronic Components, Inc. s $àSSELDORF(EAD/FFICE
Tel: (0211)5296-0 Fax: (0211)5296-400
s Shanghai Head Office
Tel: (021)6139-3888 Fax: (021)6190-8288
"#%+
s )RVINE(EADQUARTERS
Tel: (949)462-7700 Fax: (949)462-2200 s &RANCE"RANCH s Beijing Branch
s "UFFALO'ROVE#HICAGO Tel: (1)47282181 Tel: (010)6590-8796 Fax: (010)6590-8791
Tel: (847)484-2400 Fax: (847)541-7287 s )TALY"RANCH s Chengdu Branch
s $ULUTH!TLANTA Tel: (039)68701 Fax: (039)6870205 Tel: (028)8675-1773 Fax: (028)8675-1065
Tel: (770)931-3363 Fax: (770)931-7602 s -UNICH/FFICE s Hangzhou Office
s %L0ASO Tel: (089)20302030 Fax: (089)203020310 Tel: (0571)8717-5004 Fax: (0571)8717-5013
Tel: (915)533-4242 s 3PAIN"RANCH s Nanjing Office
s -ARLBOROUGH Tel: (91)660-6798 Fax: (91)660-6799 Tel: (025)8689-0070 Fax: (025)8689-0125
Tel: (508)481-0034 Fax: (508)481-8828 s 3WEDEN"RANCH s Qingdao Branch
Photocouplers and Photorelays

s 0ARSIPPANY Tel: (08)704-0900 Fax: (08)80-8459 Tel: (532)8579-3328 Fax: (532)8579-3329
Tel: (973)541-4715 Fax: (973)541-4716 s 5+"RANCH s Shenzhen Branch
s 3AN*OSE Tel: (1932)841600 Tel: (0755)3686-0880 Fax: (0755)3686-0816
Tel: (408)526-2400 Fax: (408)526-2410 Toshiba Vietnam Consumer Products Co.,Ltd. s Dalian Branch
s 7IXOM$ETROIT Tel: (043)776-5950 Fax: (043)776-5956 Tel: (0411)8368-6882 Fax: (0411)8369-0822
Tel: (248)347-2607 Fax: (248)347-2602 Toshiba Electronics Asia (Singapore) Pte. Ltd. s Xiamen Branch
Toshiba Electronics do Brasil Ltda. Tel: (6278)5252 Fax: (6271)5155 Tel: (0592)226-1398 Fax: (0592)226-1399
Tel: (011)2936-6681 Fax: (011)2936-6675 Toshiba Electronics Service (Thailand) Co., Ltd. s Dongguan Branch
Toshiba India Private Ltd. Tel: (02)835-3491 Fax: (02)835-3490 Tel: (0769)8155-6858 Fax: (0769)8155-6368
s .EW$ELHI/FFICE Toshiba Electronics Trading (Malaysia)Sdn. Bhd. Toshiba Electronics Asia, Ltd.
Tel: (0124)499-6600 Fax: (0124)499-6611 s +UALA,UMPUR(EAD/FFICE Tel: 2375-6111 Fax: 2375-0969
s "ANGALORE/FFICE Tel: (03)5631-6311 Fax: (03)5631-6307 Toshiba Electronics Korea Corporation
Tel: (080)251-90800 Fax: (080)490-91945 s 0ENANG/FFICE Tel: (02)3484-4334 Fax: (02)3484-4302
Tel: (04)226-8523 Fax: (04)226-8515 Toshiba Electronics Taiwan Corporation
Tel: (02)2508-9988 Fax: (02)2508-9999
RESTRICTIONS ON PRODUCT USE

Toshiba Corporation, and its subsidiaries and affiliates (collectively “TOSHIBA”), reserve the right to make changes to the information in this document, and related hardware,
software and systems (collectively “Product”) without notice.
This document and any information herein may not be reproduced without prior written permission from TOSHIBA. Even with TOSHIBA’s written permission, reproduction is
permissible only if reproduction is without alteration/omission.
Though TOSHIBA works continually to improve Product's quality and reliability, Product can malfunction or fail. Customers are responsible for complying with safety standards and
for providing adequate designs and safeguards for their hardware, software and systems which minimize risk and avoid situations in which a malfunction or failure of Product could
cause loss of human life, bodily injury or damage to property, including data loss or corruption. Before customers use the Product, create designs including the Product, or
incorporate the Product into their own applications, customers must also refer to and comply with (a) the latest versions of all relevant TOSHIBA information, including without
limitation, this document, the specifications, the data sheets and application notes for Product and the precautions and conditions set forth in the "TOSHIBA Semiconductor
Reliability Handbook" and (b) the instructions for the application with which the Product will be used with or for. Customers are solely responsible for all aspects of their own product
design or applications, including but not limited to (a) determining the appropriateness of the use of this Product in such design or applications; (b) evaluating and determining the
applicability of any information contained in this document, or in charts, diagrams, programs, algorithms, sample application circuits, or any other referenced documents; and (c)
validating all operating parameters for such designs and applications. TOSHIBA ASSUMES NO LIABILITY FOR CUSTOMERS' PRODUCT DESIGN OR APPLICATIONS.
PRODUCT IS NEITHER INTENDED NOR WARRANTED FOR USE IN EQUIPMENTS OR SYSTEMS THAT REQUIRE EXTRAORDINARILY HIGH LEVELS OF QUALITY AND/OR
RELIABILITY, AND/OR A MALFUNCTION OR FAILURE OF WHICH MAY CAUSE LOSS OF HUMAN LIFE, BODILY INJURY, SERIOUS PROPERTY DAMAGE AND/OR
SERIOUS PUBLIC IMPACT ("UNINTENDED USE"). Except for specific applications as expressly stated in this document, Unintended Use includes, without limitation, equipment
used in nuclear facilities, equipment used in the aerospace industry, medical equipment, equipment used for automobiles, trains, ships and other transportation, traffic signaling
equipment, equipment used to control combustions or explosions, safety devices, elevators and escalators, devices related to electric power, and equipment used in finance-related
fields. IF YOU USE PRODUCT FOR UNINTENDED USE, TOSHIBA ASSUMES NO LIABILITY FOR PRODUCT. For details, please contact your TOSHIBA sales representative.
Do not disassemble, analyze, reverse-engineer, alter, modify, translate or copy Product, whether in whole or in part.
Product shall not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any applicable laws or regulations.
The information contained herein is presented only as guidance for Product use. No responsibility is assumed by TOSHIBA for any infringement of patents or any other intellectual
property rights of third parties that may result from the use of Product. No license to any intellectual property right is granted by this document, whether express or implied, by
estoppel or otherwise.
ABSENT A WRITTEN SIGNED AGREEMENT, EXCEPT AS PROVIDED IN THE RELEVANT TERMS AND CONDITIONS OF SALE FOR PRODUCT, AND TO THE MAXIMUM
EXTENT ALLOWABLE BY LAW, TOSHIBA (1) ASSUMES NO LIABILITY WHATSOEVER, INCLUDING WITHOUT LIMITATION, INDIRECT, CONSEQUENTIAL, SPECIAL, OR
INCIDENTAL DAMAGES OR LOSS, INCLUDING WITHOUT LIMITATION, LOSS OF PROFITS, LOSS OF OPPORTUNITIES, BUSINESS INTERRUPTION AND LOSS OF DATA,
AND (2) DISCLAIMS ANY AND ALL EXPRESS OR IMPLIED WARRANTIES AND CONDITIONS RELATED TO SALE, USE OF PRODUCT, OR INFORMATION, INCLUDING
WARRANTIES OR CONDITIONS OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE, ACCURACY OF INFORMATION, OR NONINFRINGEMENT.
GaAs (Gallium Arsenide) is used in Product. GaAs is harmful to humans if consumed or absorbed, whether in the form of dust or vapor. Handle with care and do not break, cut,
crush,grind, dissolve chemically or otherwise expose GaAs in Product.
Do not use or otherwise make available Product or related software or technology for any military purposes, including without limitation, for the design, development, use, stockpiling
or manufacturing of nuclear, chemical, or biological weapons or missile technology products (mass destruction weapons). Product and related software and technology may be
controlled under the applicable export laws and regulations including, without limitation, the Japanese Foreign Exchange and Foreign Trade Law and the U.S. Export Administration
Regulations. Export and re-export of Product or related software or technology are strictly prohibited except in compliance with all applicable export laws and regulations.
Please contact your TOSHIBA sales representative for details as to environmental matters such as the RoHS compatibility of Product. Please use Product in compliance with all
applicable laws and regulations that regulate the inclusion or use of controlled substances, including without limitation, the EU RoHS Directive. TOSHIBA ASSUMES NO
LIABILITY FOR DAMAGES OR LOSSES OCCURRING AS A RESULT OF NONCOMPLIANCE WITH APPLICABLE LAWS AND REGULATIONS.
2014
Previous edition: BCE0034J
Semiconductor & Storage Products Company
Website: http://toshiba.semicon-storage.com/

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Semiconductor Catalog Sep.

Photocouplers and Photorelays

SEMICONDUCTOR & STORAGE PRODUCTS

Transistor-Output Page 10 IC-Output

Triac Output Page 44 GND

Thyristor Output Photovoltaic-Output Page 49 Photorelays page 30

General-Purpose With discharge 1-Form-A 1-Form-B

New Products Digest Page 6 Board Assembly Page 66

Part Naming Conventions Page 50 Device Degradation Page 68

Package Information Page 51 Safety Standard Approvals Page 74

Packing Information Page 61

Toshiba’s and guaranteed common-mode rejection (CMR) of 40 kV/+s

technologies Low power consumption

Photocoupler Product Tree

Internal Structure of Toshiba’s Photocouplers (Representative example)

Single Molded (White Package) Double Molded (Black Package)

Low-PWD, IC-Output Photocouplers for IPM Drives:

"CMH", "CML" * 30 kV/+s Vcc

Supply voltage Vcc 4.5 to 30 V

High-Speed IC-Output Photocoupler That Supports Both

O Threshold input current: IFHL = 2.3 mA (VCC = 3.3 V)

O Pulse width distortion: "tpHL-tpLH" = 30 ns (max) GND

O Industrial automation equipment

O Two devices with different clearance and creepage distances

O Watt-hour meters, gas meters and water meters

15-Mbps Low-Power-Consumption IC-Output

O Low supply current thanks to the BiCMOS process GND

Low-Input-Current Transistor-Output Photocouplers:

QFeatures AC input type DC input type

O Guaranteed proper operation at ambient temperatures up to 125°C

O Produced overseas (Thailand)

Triac-Output Photocouplers with Reinforced

Gate-Drive Photocouplers in the Thin SO6L Package IC Output for

1 Transistor-Output and Darlington-Transistor-Output Photocouplers

TLP281-4 TLP291-4 TLP531

TLP291(SE* TLP185(SE* TLP131

TLP385* TLP631 TLP785

TLP293* TLP293-4* TLP183* TLP124

3750 Vrms TLP188*

AC input TLP290(SE* TLP184(SE* TLP130

5000 Vrms TLP630 TLP620

3750 Vrms TLP292* TLP292-4* TLP182* TLP126

2500 Vrms TLP127

3750 Vrms TLP187

General-Purpose, Transistor-Output Photocouplers

Note (1),(2): Please refer to page 48. *: New product

AC-Input, Transistor-Output Photocouplers

Note (1): Please refer to page 48. *: New product

Note (1): Please refer to page 48.

2 Photocouplers for Logic Signal Transmission

Data Rate SO8 DIP8

10 Mbit/s TLP2362 TLP552 TLP2630 6N137

Photocouplers for Logic Signal Transmission at 20 kbit/s (Typ.)

Note (1): Please refer to page 48.

Note (1): Please refer to page 48. *: New product

Photocouplers for Logic Signal Transmission at 1 Mbit/s (Typ.)

TLP2309 3.3-V/5-V power supplies 1M bit/s 15% Min 10 3750 ¡ ¡ ¨ r

Topr (max) 125℃