CP-3535SMDUVC-275

CONTENTS

1. Features

2. Applications

3. Electro-Optical Characteristics

4. Absolute Maximum Ratings

5. Outline Dimensions：
6. Typical Characteristic Curves

7. Packaging and Labeling of Products

8. Reflow Soldering

9. Cautions on Use

10. Disclaimers

3535UV

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1. Features:
◆ High Light Output Power;
◆ Long Operation Life and Low Light Decay;
◆ Environmental Protection, Energy Saving and High Reliability;
◆ Durable, Shock-proof, Easy to design and Easy to Apply in Different Fields or Different Occasions;

2. Applications：
◆ Disinfection;
◆ Air and Water Purification;
◆ UV Detection and Communication Technology;
◆ Food Processing and Preservation, Food and Beverage Packaging, Fresh Storage, etc.;
◆ Health Care, Dermatological Treatment, etc.;

3. Electro-Optical Characteristics @Tc=22℃

Items Symbol Condition Min. Typ.l Max. Unit
Vf1 If =40mA 5 — 8 V
Forward Voltage
Vf3 If=10uA 3 — — V
Reverse Current Ir Vr =-5V — — 1.0 μA
Reverse Voltage Vr Ir=-10μA 10 — — V
Radiated Power Φe 40mA 2 — 6 mW
Peak Wavelength WLP 40mA 265 — 315 nm
Spectrum Half Width HW -- 8 -- 14 nm

1) These values are measured by the LXR-CP optical spectrum analyzer within the following tolerances.
--Forward Voltage (Vf): ±0.2V; peak wavelength (λp):±3nm; Radiant Flux (Φe):±10%
2) Although all LEDs are tested by LXR-CP Semiconductor’s equipment. Some values may vary
slightly depending on the conditions of the test equipment.
3) UV LEDs are static-sensitive products. Please pay attention to static electricity during transportation and use;

4. Absolute Maximum Ratings

Items Symbol Condition Rating Unit

Forward Current If Ta = 22˚C ≤100 mA

Reverse Voltage Vr Ta=22˚C ≤10 V
Working Temperature T — -30-60 ℃
Storage Temperature Tstg Sealed Package -10-40 ℃
Welding Maximum ℃
T Reflow Soldering 170-180
Temperature
1) Operating the LED beyond the listed maximum ratings may affect device reliability and cause permanent damage;
2) The light attenuation of the LED lamp will increase and the operation life will be shortened as the injection current increases
and the temperature rises;
3) The LEDs are not designed to be driven in reverse bias.

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5. Outline Dimensions：

① ② ③

Front Side Back

1) ①Cathode Pad ② Heat Sink ③Anode Pad;
2) The tolerance unless mentioned is ±0.20mm.unit=mm;
3) A Zener diode (not shown in the figure) is soldered inside the lamp to provide the ESD protection;
4) Internal Circuit diagram:

UV LED

Zener Diode
◆ More information:
Support Material AlN Ceramic
Support Size 3.5*3.5*1.4 mm
Chip Size 20W UV LED*1
Chip Soldering Method Reflow soldering
Zener Diode *1
Lens Material Quartz or Sapphire
Lens Size 2.42*2.42*0.3 mm

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6. Typical Characteristic Curves(Ta=25℃)

Fig.4 Relative Flux (@100mA）vs. Duration

1.2

1.0

0.8
Relative Flux

0.6

0.4

0.2

0.0 0 240 480 720 960 1200 1440

Duration(h)

◆ Radiation Characteristics(Ta=25℃,If=40mA)
90

100

120 60
80

60
150 30
40

20

180 0

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7. Packaging and Labeling of Products
7.1 Taping Outline Dimensions：
7.1.1 Tape:

cathode

7.1.2 Reel:12mm tape with 1000 pcs. On Φ180mm reel：

Packing Materials:
-Reel: Conductive PS(Black)
-Embossed Carrier Tape: conductive PS (Black)
-Cover Tape: Conductive PET Base

Note: The tolerance unless mentioned is ±0.1，unit=mm 。

7.2 Labeling of Products

Reeled products packed in a sealed-off and moisture-proof aluminum bag with desiccants(Silica Gel):

Taping Reel Aluminum moisture proof bag Vacuum Packing

(1Bag:1Reel+1 Silica Gel)

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 7.3 Label

◆ <Label 1>—size:30*60mm:

◆ <Label 2 >– size:55*75mm:

1) Lot No: Production batch;

2) Tape No: Models and parameters of the code;
3) WLP: peak wavelength; Po: Luminous Power ; Vf: Forward voltage; Qty:Quantity;
4)Provide the bar code and qr code;

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 8. Reflow Soldering
8.1 Pb-free solder temperature profile：

1~5℃/Sec.

60Sec. Max.
Pre-heating
Above 180℃
90~150℃

1~5℃/Sec.

1) Temperature Profile should be the scene of the solder paste used type, proportion, reflow soldering equipment to change and
adjust accordingly；
2) Inappropriate reflux temperature, reflux time may cause the LEDs welding failure. Suggest to do more testing before mass
production, to ensure optimum technological parameters；
3) Reflow soldering should not be done more than two times;
4) When soldering, do not put stress on the LEDs during heating;
5) After soldering, do not warp the circuit board.

◆ Repair should not be done after the LEDs have been soldered.When repairing is unavoidable, a
double-head soldering iron should be used . It should be confirmed beforehand whether the
characteristics of the LEDs will or will not be damaged by repairing.

9. Cautions on Use
9.1. Moisture-Proof Package
The moisture in the SMD package may vaporize and expand during soldering. The moisture can damage the
optical characteristics of the LEDs due to the encapsulation.

9.2 During Storage

Conditions Temperature Humidity Time

＜50%RH Within 1 Year from the

Before Opening Aluminum Bag 5℃~30℃
Storage Delivery Date
After Opening Aluminum Bag 5℃~30℃ ＜60%RH ≤672hours

Baking ＜10%RH 10~24hours

65±5℃

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9.3 During Usage
◆ The LED should avoid direct contact with hazardous materials such as sulfur , chlorine, phthalate, HF,etc.
◆ The metal parts on the LED can rust when exposed to corrosive gases. Therefore, exposure to corrosive
gases must be avoided during operation and storage;
◆ Extreme environments such as sudden ambient temperature changes or high humidity that can cause
condensation must be avoided.

9.4. Cleaning
◆ Do not use brushes for cleaning or organic solvents for washing as avoid residue of organic solvent;
◆ IPA is the recommended solvent for cleaning the LEDs under the following conditions;
◆ Ultrasonic cleaning is not recommended;
◆ Pretests should be conducted with the actual cleaning process to validate that the process will notdamage
the LEDs.

9.5. Thermal Management

◆ The thermal design of the end product must be seriously considered, particularly at the beginning of the
system design process;
◆ The generation of heat is greatly impacted by the input power, the thermal resistance of the circuitboards
and the density of the LED array combined with other components.

9.6. Static Electricity

◆ Wristbands and anti-electrostatic gloves are strongly recommended and all devices, equipment and
machinery must be properly grounded when handling the LEDs, which are sensitive against static electricity
and surge;
◆ Precautions are to be taken against surge voltage to the equipment that mounts the LEDs;
◆ Unusual characteristics such as significant increase of current leakage, decrease of turn-on voltage,or
non-operation at a low current can occur when the LED is damaged.

9.7. Electrostatic Discharge (ESD)

◆ The LEDs are sensitive to static electricity or surge voltage and current.The electrostatic Discharge can
damage a LED Chip.Also, It can be affect a reliability belong to the life time of LED package.When handling
LEDs, the following measures against ESD are actively recommended:
1) Please wear a wrist strap, anti-static clothes, foot wear and gloves;
2) Please set up a grounded or anti-static paint floors, a grounded or the ability to surge protection-workstation
equipment and tools;
3) ESD protection-worktable/bench, mat made of a conductive materials.

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◆ An appropriate grounding is required for all devices, equipment, and machinery used in product assembly.
Please apply surge protection after review when designing of commercial products (Curing Module,etc.);
◆ If tools or equipment contain insulating materials such as glass or plastics, the following measuresagainst
ESD are strongly recommended;
1) Dissipating static charge with conductive materials;
2) Preventing charge generation with moisture;
3) Plug in the ionizing blowers (ionizer) for neutralizing the charge.
◆ The customer is advised to check if the LEDs are damaged by ESD when performing the characteristics
inspection of the LEDs in the application.
◆ ESD damaged LEDs may have a current flow at a low voltage:
*Failure criteria: Vf =-5.0V at If＞1uA.

9.8 Recommended Circuit

◆ The current through each LED must not exceed the absolute maximum rating when designing the circuits;
◆ In general, there can be various forward voltages for LEDs. Different forward voltages in parallel via a
single resistor can result in different forward currents to each LED, which also can output different luminous
flux values. In the worst case, the currents can exceed the absolute maximum ratings which can stress the LEDs.
Matrix circuit with a single resistor for each LED is recommended to avoid the luminous flux fluctuations.

◆ The driving circuits must be designed to operate the LEDs by forward bias only.
◆ Reverse voltages can damage the zener diode, which can cause the LED to fail.
◆ A constant current LED driver is recommended to power the LEDs.

9.9. Eye Safety Guidelines

◆ Do not directly look at the light when the LEDs are on;
◆ Proceed with caution to avoid the risk of damage to the eyes when examining the LEDs with optical
instruments.

9.10. Manual handling

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\
◆ Use Teflon-type tweezers to grab the base of the LED and do not apply mechanical pressure on the surface
of the encapsulant.

10. Disclaimers
◆ LXR-CPs not responsible for any damages ar accidents caused if the operating or storage conditions exceed
the absolute maximum ratings recommended in this document;
◆ The LEDs described in this document are intended to be operated by ordinary electronic equipment;
◆ It is recommended to consult with LXR-CP when the environment or the LED operation is non-standard in
order to avoid any possible malfunctions or damage to product or risk of life or health;
◆ Disassembly of the LED products for the purpose of reverse engineering is prohibited without prior written
consent from LXR-CP. All defected LEDs must be reported to LXR-CP and are not to be disassembled or
analyzed.
◆ The product information can be modified and upgraded without prior notice;
◆ Any other matters not mentioned in this specification, please contact our consulting our sales department。

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