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WO2023184396A1 - 显示面板及其制造方法、驱动组件、显示装置 - Google Patents

显示面板及其制造方法、驱动组件、显示装置 Download PDF

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Publication number
WO2023184396A1
WO2023184396A1 PCT/CN2022/084555 CN2022084555W WO2023184396A1 WO 2023184396 A1 WO2023184396 A1 WO 2023184396A1 CN 2022084555 W CN2022084555 W CN 2022084555W WO 2023184396 A1 WO2023184396 A1 WO 2023184396A1
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WO
WIPO (PCT)
Prior art keywords
pads
pad
width
display area
area
Prior art date
Application number
PCT/CN2022/084555
Other languages
English (en)
French (fr)
Inventor
李少鹏
舒建华
张卫本
王鹏
范荣坤
Original Assignee
京东方科技集团股份有限公司
成都京东方光电科技有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 京东方科技集团股份有限公司, 成都京东方光电科技有限公司 filed Critical 京东方科技集团股份有限公司
Priority to US18/022,514 priority Critical patent/US20240292680A1/en
Priority to PCT/CN2022/084555 priority patent/WO2023184396A1/zh
Priority to CN202280000654.7A priority patent/CN117178364A/zh
Publication of WO2023184396A1 publication Critical patent/WO2023184396A1/zh

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/131—Interconnections, e.g. wiring lines or terminals

Definitions

  • the present application relates to the field of display technology, and in particular to a display panel and a manufacturing method thereof, a driving component, and a display device.
  • display devices are used more and more widely.
  • Commonly used display devices include smartphones, tablets, televisions, and monitors.
  • the display device may generally include a display panel and a flexible circuit board.
  • the display panel has a display area and a non-display area.
  • the display panel may include: a plurality of light-emitting devices located in the display area, and a plurality of first bonding pads located in the non-display area.
  • the plurality of first bonding pads may be electrically connected to the light-emitting devices through signal lines.
  • the flexible circuit board has a plurality of second pads, and after the flexible circuit board can be bound in the non-display area of the display panel, the plurality of second pads of the flexible circuit board can correspond electrically to the plurality of first pads one by one. connect.
  • the flexible circuit board is usually bound and connected to the display panel through anisotropic conductive film (English: anisotropic conductive adhesive film, referred to as: ACF).
  • anisotropic conductive film English: anisotropic conductive adhesive film, referred to as: ACF.
  • the flexible circuit board can control the light-emitting device in the display area of the display panel to emit light, so that the display panel can display a corresponding picture.
  • the electrical connection effect between the plurality of first pads of the display panel and the plurality of second pads of the flexible circuit board through ACF is poor. , resulting in poor display effect of the display panel.
  • Embodiments of the present application provide a display panel, a manufacturing method thereof, a driving component, and a display device.
  • the problem of poor display effect of the display panel in the prior art can be solved.
  • the technical solution is as follows:
  • a display panel has a display area and a non-display area located at the periphery of the display area.
  • the display panel includes:
  • a plurality of light-emitting devices located in the display area
  • a plurality of first bonding pads located in the non-display area the plurality of first bonding pads are used to electrically connect with the plurality of light emitting devices and with a driving component, and the plurality of first bonding pads are
  • the disk array is arranged in multiple rows, and the first pads in the multiple rows are sequentially distributed in a direction away from the display area;
  • the area of the orthographic projection of the first pads in each row on the first substrate gradually decreases in a direction approaching the display area.
  • the plurality of first pads are arrayed in multiple rows along the first direction, and arranged in multiple columns along the second direction;
  • the width of each first pad in the same column in the first direction and/or the width in the second direction gradually decreases in a direction approaching the display area.
  • the widths of the first pads in different rows in the first direction are equal, and the distances between the adjacent first pads in every two rows are equal;
  • each first pad in the same column in the second direction gradually decreases in the direction approaching the display area; and every two first pads in each row
  • the distance between adjacent first pads gradually increases in a direction approaching the display area.
  • the widths of the first pads in different rows in the second direction are equal, and the distance between every two adjacent first pads in the first pads in each row is equal;
  • each first pad in the same column in the first direction gradually decreases in the direction approaching the display area; and the width of the first pads in two adjacent rows is The distance between them gradually increases in the direction approaching the display area.
  • the width of each first pad in the same column in the first direction and the width in the second direction gradually decreases in the direction approaching the display area;
  • the distance between every two adjacent first pads in each row of the first pads gradually increases in the direction approaching the display area; and the distance between the two adjacent rows of the first pads The distance gradually increases in the direction approaching the display area.
  • the widths of the first pads in different rows in the second direction are equal, the distances between every two adjacent first pads in each row are equal, and every two first pads are The distance between adjacent first pads in rows is equal;
  • each first pad in the first pad in the same column in the first direction gradually decreases in the direction approaching the display area.
  • the distance between each two adjacent rows of the first pads is equal;
  • each first pad in the first pad in the same column in the first direction and the width in the second direction gradually decreases in the direction approaching the display area; and the width of each row is The distance between every two adjacent first pads in the first pad gradually increases in a direction approaching the display area.
  • the width of the first pad closer to the display area in the first direction is wider than that of the other first pad.
  • the width of the disk in said first direction is 5% to 10% smaller.
  • the width of the first pad closer to the display area in the second direction is wider than that of the other first pad.
  • the width of the disk in said second direction is 5% to 10% smaller.
  • the first bonding pad has multiple corners, and the corners include at least one of fillets and chamfers.
  • the radius range of the rounded corner is: 10% to 50% of the width of the first pad in the first direction.
  • the angle range between the bevel of the chamfer and the second direction is: 15° to 45°, and the chamfer is in the second direction.
  • the width in the direction ranges from 10% to 20% of the width of the first pad in the second direction.
  • the angle range between the bevel of the chamfer and the second direction is: 15° to 45°, and the chamfer
  • the width of the corner in the second direction ranges from 10% to 20% of the width of the first pad in the second direction;
  • the radius range of the fillet is: 10% to 50% of the target width, the target width is the width of the first pad in the second direction and the two chamfers in the second direction The difference in width.
  • the plurality of first pad arrays are arranged in at least 4 rows.
  • the orthographic projection area of each first pad in the same row on the first substrate is the same, and every two adjacent first pads in the same row are The distance between the first pads is the same.
  • the driving component has a device area and a connection area located on one side of the device area.
  • the driving component includes:
  • a plurality of second bonding pads located in the connection area are used to electrically connect with the driver chip and the display panel, and the plurality of second bonding pads
  • the array is arranged in multiple rows, and the second pads in the multiple rows are sequentially distributed in a direction away from the device area;
  • the area of the orthographic projection of the second pads in each row on the second substrate gradually decreases in the direction away from the device area.
  • a display device including: any one of the above display panels and a driving component, a plurality of first pads in the display panel corresponding to a plurality of second pads in the driving component. Electrical connection.
  • a display panel includes: a substrate, a light-emitting device and a first pad.
  • the area of the orthographic projection of each row of first pads on the first substrate gradually decreases in the direction closer to the display area, so that the closer to the display area, the closer the area of any two adjacent first pads in a row of first pads. The distance between them is larger, and/or the distance between the first pads in the row closest to the display area and the first pads in the row farthest from the display area is small.
  • the excess colloid in the ACF between the second pad and the first pad is squeezed out, the excess colloid can be moved closer to the display area. direction of flow.
  • soldering pads are in close contact, thereby making the electrical connection between the second soldering pad and the first soldering pad better, effectively improving the display effect of the display panel.
  • Figure 1 is a top view of a display device provided by the related art
  • Figure 2 is a schematic cross-sectional view of the display device at A-A' shown in Figure 1;
  • Figure 3 is a schematic diagram of the arrangement of the first pads in the non-display area provided by the related art
  • Figure 4 is a schematic three-dimensional structural diagram of a display panel provided by an embodiment of the present application.
  • Figure 5 is a schematic cross-sectional view of the binding of a display panel and a driving component provided by an embodiment of the present application
  • Figure 6 is a schematic diagram of the arrangement of first pads provided by an embodiment of the present application.
  • Figure 7 is a schematic diagram of the arrangement of another first pad provided by an embodiment of the present application.
  • Figure 8 is a schematic diagram of the arrangement of the first first pads provided by the embodiment of the present application.
  • Figure 9 is a schematic cross-sectional view of multiple rows of first pads bound to corresponding second pads shown in Figure 8;
  • Figure 10 is a schematic diagram of the arrangement of the second first pad provided by the embodiment of the present application.
  • Figure 11 is a schematic diagram of the arrangement of the third first pad provided by the embodiment of the present application.
  • Figure 12 is a schematic diagram of the arrangement of the fourth first pad provided by the embodiment of the present application.
  • Figure 13 is a schematic diagram of the arrangement of the fifth first pad provided by the embodiment of the present application.
  • Figure 14 is a schematic diagram of a first bonding pad and a second bonding pad provided by an embodiment of the present application
  • Figure 15 is a top view of a first pad provided by an embodiment of the present application.
  • Figure 16 is a top view of yet another first pad provided by an embodiment of the present application.
  • Figure 17 is a top view of yet another first pad provided by an embodiment of the present application.
  • Figure 18 is a top view of a display panel provided by an embodiment of the present application.
  • Figure 19 is a top view of a driving assembly provided by an embodiment of the present application.
  • Figure 20 is a schematic diagram of a display device provided by an embodiment of the present application.
  • Figure 1 is a top view of a display device provided by the related art
  • Figure 2 is a schematic cross-sectional view of the display device at A-A' shown in Figure 1.
  • the display device 00 may generally include a display panel 10, a flexible circuit board 20, and an ACF 30 located between the display panel 10 and the flexible circuit board 20.
  • the display panel 10 has a display area 1a and a non-display area 1b located at the periphery of the display area 1a.
  • the flexible circuit board 20 can be bound in the non-display area 1b of the display panel 00 through the ACF 30.
  • the orthographic projection area of the ACF 30 on the display panel 10 is usually a binding area.
  • the display panel 10 may include: a plurality of light-emitting devices (not shown in the figure) located in the display area, and a plurality of first bonding pads 11 located in the non-display area 1b.
  • the plurality of first bonding pads 11 may pass through signal lines. electrically connected to the light-emitting device.
  • the plurality of first pads 11 may be distributed in the bonding area of the non-display area 1b.
  • the flexible circuit board 20 has a plurality of second soldering pads 21 , and the plurality of second soldering pads 21 of the flexible circuit board 20 can be electrically connected to the plurality of first soldering pads 11 in a one-to-one correspondence. In this way, the flexible circuit board 20 can apply electrical signals to the display panel 10 through the electrically connected second pad 21 and the first pad 11 to control the light-emitting device in the display panel 10 to emit light, thereby enabling the display panel 10 to display the corresponding picture.
  • the second pad of the flexible circuit board 20 and the corresponding first pad 11 of the display panel 10 can be electrically connected through the ACF 30.
  • a pressing force needs to be applied to the flexible circuit board 20 so that the colloid located between the second pad 21 and the first pad 11 in the ACF 30 can is extruded, so that the second pad 21 and the first pad 11 can be electrically connected through the conductive particles F in the ACF.
  • heating is usually required so that the excess colloid in the ACF 30 in the binding area can overflow through the area between the two adjacent first pads 11, thereby ensuring that the second pads 21 and The effect of electrical connection between the first pad 11 and the conductive particles F is better.
  • a plurality of power connection pads 12 are usually provided in the non-display area 1 b of the display panel 10 .
  • the plurality of power-connecting pads 12 are arranged in a direction away from the display area 1a of the plurality of first pads 11 .
  • the plurality of power pads 12 can also be electrically connected to the flexible circuit board 20 through the ACF 30, so that the multiple power pads 12 can pass through the flexible circuit board.
  • the circuit board 20 is electrically connected to the power supply component.
  • the colloid mainly flows in a direction away from the plurality of power pads 12 (that is, in a direction close to the display area 1a) to overflow from the binding area.
  • each signal line is electrically connected to a first pad 11 .
  • the number of first pads 11 arranged in the non-display area of the display panel 10 will increase.
  • FIG. 3 is a schematic diagram of the arrangement of the first pads in the non-display area provided by the related art.
  • the number of rows of first pads 11 distributed in the non-display area needs to be increased, and the number of first pads 11 arranged in each row of first pads 11 also needs to be increased. In this way, the number of rows of first pads 11 distributed in the non-display area is larger, and the number of first pads 11 arranged in each row of first pads 11 is also larger.
  • the channel length T2 used to allow colloid to overflow from the binding area is larger.
  • the channel used to allow the colloid to overflow from the binding area refers to the area between the two columns of first pads 11 .
  • the longer the channel length T2 used to allow colloids to overflow from the binding area the less likely it is that excess colloids in ACF 30 will overflow from this channel.
  • the pads 11 are electrically connected by the conductive particles F within the ACF.
  • the width of any two adjacent first pads 11 is smaller, which is used to allow the colloid to overflow from the binding area. Width T1 is smaller. And because the smaller the channel width T1 used to allow colloids to overflow from the binding area, the excess colloid in ACF 30 is less likely to overflow from this channel. Therefore, when the number of first pads 11 arranged in each row of first pads 11 is large, it will be more difficult to discharge the colloid between the second pads 21 and the first pads 11 , further affecting the The second pad 21 and the first pad 11 are electrically connected through the conductive particles F in the ACF.
  • the temperature of the ACF 03 will decrease to solidify the ACF 03 colloid located between the flexible circuit board 20 and the display panel 10.
  • the excess colloid between the second pad 21 and the first pad 11 will solidify.
  • the solidified colloid between the second pad 21 and the first pad 11 will cause the conductive particles F between the second pad 21 and the first pad 11 to be unable to interact with the second pad 21 and the first pad 11 .
  • 11 are in close contact, resulting in poor connection effect between the second pad 21 and the first pad 11 .
  • FIG. 4 is a schematic three-dimensional structural diagram of a display panel provided by an embodiment of the present application.
  • the display panel 000 has a display area 00a and a non-display area 00b located at the periphery of the display area 00a.
  • the display panel 000 may include: a first substrate 100, a light-emitting device (not shown in the figure) located in the display area 00a, and a non-display area 00b located outside the display area 00a.
  • the plurality of first bonding pads 200 are used to electrically connect to a plurality of light-emitting devices and to the driving components.
  • the plurality of first bonding pads 200 are arranged in multiple rows.
  • the multiple rows of first pads 200 are arranged along the edges away from the display area.
  • the direction of 00a is distributed in sequence.
  • the driving component can be a flexible circuit board or a separate driving chip.
  • the driving chip can be integrated in the flexible circuit board.
  • the driving component has a plurality of second bonding pads that correspond one-to-one to the plurality of first bonding pads 200. After the driving component is bound to the display panel 000, the plurality of second bonding pads can be connected to the plurality of first bonding pads.
  • the disks 200 are electrically connected in one-to-one correspondence. It should be noted that the embodiment of the present application only takes the case where the driving component is a flexible circuit board as an example for schematic explanation.
  • FIG. 5 is a schematic cross-sectional view of a binding of a display panel and a driving component according to an embodiment of the present application.
  • the second pad 011 in the driving component 111 may be electrically connected to the first pad 200 in the display panel 000 through the ACF 222.
  • a pressing force can be applied to the driving component 111, so that the excess in the ACF 222 between each second pad 011 and the corresponding first pad 200 is The colloid is extruded, so that the second pad 011 and the first pad 200 can be electrically connected through the conductive particles E in the ACF.
  • the driving component 111 can control the light-emitting devices in the display panel 000 to emit light through the one-to-one electrical connection between the plurality of second pads 011 and the plurality of first pads 200, thereby enabling the display panel 000 to display corresponding images.
  • the area where the driving component 111 is bound to the display panel 000 is usually a binding area, and this binding area is located in the non-display area 00b of the display panel 000 .
  • the display panel 000 may further include: a plurality of power connection pads 300 located in the non-display area 00b, and the plurality of power connection pads 300 are located on a side of the plurality of first pads 200 away from the display area 00a.
  • a plurality of power pads 300 may be arranged in a row, and the power pads 300 are used to supply power to the driving component 111 electrically connected thereto.
  • the multiple power pads 300 also need to be electrically connected to the driving component 111 through the ACF 222, so that the multiple power pads 300 can pass through the driving component.
  • 111 is electrically connected to the power supply component.
  • Figure 6 is a schematic diagram of the arrangement of the first pads provided by an embodiment of the present application
  • Figure 7 is an implementation diagram of the present application.
  • the example provides another schematic diagram of the arrangement of the first pad.
  • the area of the orthographic projection of each row of first pads 200 on the first substrate 100 gradually decreases in the direction approaching the display area 00a.
  • the area of the orthographic projection of each first pad 200 in the same row of first pads 200 on the first substrate 100 is the same, and every two adjacent first pads 200 in the same row are The distance between the disks 200 is the same.
  • the area of the orthographic projection of each first pad 200 in a row of first pads 200 arranged closer to the display area 00a on the first substrate 100 is smaller, and The greater the distance between any two adjacent first pads 200 in this row of first pads 200 .
  • the excess colloid in the ACF 222 between the second pad 011 and the first pad 200 is squeezed out. , the excess colloid can flow toward the direction close to the display area 00a.
  • the distance between the first pads 200 in the row closest to the display area 00a and the first pads 200 in the row farthest from the display area 00a is small.
  • the excess colloid in the ACF 222 between the second pad 011 and the first pad 200 is squeezed out. , the excess colloid can flow toward the direction close to the display area 00a.
  • the first pad 200 and the second pad 200 in the ACF 222 in the ACF 222
  • the excess colloid extruded between 011 flows a smaller distance in the direction closer to the display area 00a, so that the excess colloid can overflow the binding area faster.
  • excess colloid between the second bonding pad 011 and the first bonding pad 200 will not accumulate in the binding area, so that the conductive particles E between the second bonding pad 011 and the first bonding pad 200 can interact with the second bonding pad 011 and the first bonding pad 200 respectively.
  • the bonding pad 011 and the first bonding pad 200 are in close contact, thereby making the electrical connection effect between the second bonding pad 011 and the first bonding pad 200 better.
  • the display panel provided by the embodiment of the present application includes: a substrate, a light-emitting device and a first bonding pad.
  • the area of the orthographic projection of each row of first pads on the first substrate gradually decreases in the direction closer to the display area, so that the closer to the display area, the closer the area of any two adjacent first pads in a row of first pads. The distance between them is larger, and/or the distance between the first pads in the row closest to the display area and the first pads in the row farthest from the display area is small.
  • the excess colloid in the ACF between the second pad and the first pad is squeezed out, the excess colloid can be moved closer to the display area.
  • soldering pads are in close contact, thereby making the electrical connection between the second soldering pad and the first soldering pad better, effectively improving the display effect of the display panel.
  • a plurality of first pads 200 are arrayed in multiple rows along the first direction D1 and arranged in multiple columns along the second direction D2.
  • the first direction D1 and the second direction D2 may be two directions perpendicular to each other.
  • each first pad 200 in the same column of first pads 200 in the first direction D1 and/or the width in the second direction D2 gradually decreases in the direction approaching the display area 00a.
  • the area of the orthographic projection of the first pads 200 in the same column that is closer to the display area 00a on the first substrate 100 is smaller.
  • the first pads 200 in each row of first pads 200 are arranged at equal intervals, so that the central axes of each first pad 200 in a column of first pads 200 coincide.
  • the width of the first pad 200 in the first direction D1 is expressed as K1; in the first direction The distance between adjacent first bonding pads 200 on D1 is represented by K2; the width of the first bonding pad 200 in the second direction D2 is represented by K3; the distance between adjacent first bonding pads 200 in the second direction D2 is represented by K3. The distance between is expressed as K4.
  • Figure 8 is a schematic diagram of the arrangement of the first first pads provided by an embodiment of the present application.
  • the first pads 200 in different rows are in the first direction D1.
  • the widths K1 are equal, and the distance K2 between every two rows of adjacent first pads 200 is equal.
  • each first pad 200 in the same column of first pads 200 in the second direction D2 gradually decreases in the direction approaching the display area 00a.
  • the distance K4 between every two adjacent first pads 200 in each row of first pads 200 gradually increases in the direction approaching the display area 00a, so that the distance K4 between two adjacent columns of first pads 200 It gradually increases in the direction closer to the display area 00a. In this way, it can be ensured that the area of the orthographic projection of the first pad 200 on the first substrate 100 is smaller the closer it is to the display area 00a.
  • the excess colloid between the second bonding pad 011 and the first bonding pad 200 mainly flows in the area between two adjacent rows of the first bonding pads 200 in a direction close to the display area 00a.
  • the area between the two rows of first pads 200 can be a channel for excess colloid to overflow from the bonding area.
  • FIG. 9 is a schematic cross-sectional view of multiple rows of first pads bound to corresponding second pads shown in FIG. 8 .
  • the plurality of first pads 200 in FIG. 8 are arranged into 5 rows of first pads 200, and the first pad in the row farthest from the display area 00a is the first pad in row 1, which is farthest from the display area.
  • the first pad in the row closest to 00a is the first pad in row 5.
  • the distance between every two adjacent first pads in the first pad in row 1 is K4 1
  • the distance between every two adjacent first pads in the first pad in row 2 is K4 1
  • the distance between every two adjacent first pads in the first pad in row 3 is K4 3
  • the distance between every two adjacent first pads in the first pad in row 4 is K4 3
  • the distance between the pads is K4 4
  • the distance between every two adjacent first pads in the first pad in row 5 is K4 5 .
  • the values of K4 1 , K4 2 , K4 3 , K4 4 and K4 5 gradually increase, so that the closer to the display area 00a, the wider the channel width for colloids to overflow from the binding area.
  • FIG. 9 is a schematic illustration using the case where the arrangement and size of the plurality of second pads 011 in the driving component 111 are the same as the arrangement and size of the first pad 200 as an example. of. In other possible implementations, the size of each second pad 011 in the driving component 111 may be the same, which is not limited in the embodiment of the present application.
  • the width K3 of the first pad 200 closer to the display area 00a in the second direction D2 is wider than the width K3 of the other one.
  • the width K3 of the first pad 200 in the second direction D2 is 5% to 10% smaller.
  • the width of each first pad in the first pad 200 in the first row in the first direction D1 is K1 1
  • the width of each first pad in the Nth row in the first direction D1 is K1 1
  • the width is K1 N .
  • the distance between the first pad in row 1 and the first pad in row 2 is K2 1
  • the distance between the first pad in row N-1 and the first pad in row N is K2 N-1 .
  • each first pad in the first row of first pads in the second direction D2 is K3 1
  • the width of each of the first pads in the Nth row in the second direction D2 is K3 N
  • the distance between every two adjacent first pads in the first pad in row 1 is K4 1
  • the distance between every two adjacent first pads in the first pad in row N is K4 N.
  • Figure 10 is a schematic diagram of the arrangement of the second first pad provided by an embodiment of the present application.
  • the widths K3 of the first bonding pads 200 in different rows in the second direction D2 are equal, and the distance K4 between every two adjacent first bonding pads 200 in each row of the first bonding pads 200 is equal.
  • each first pad 200 in the same column of first pads 200 in the first direction D1 gradually decreases in the direction approaching the display area 00a.
  • the distance K2 between two adjacent rows of first pads 200 gradually increases in the direction approaching the display area 00a. In this way, it can be ensured that the area of the orthographic projection of the first pad 200 on the first substrate 100 is smaller the closer it is to the display area 00a. In this way, the excess colloid between the second bonding pad 011 and the first bonding pad 200 mainly flows in the second direction D2 in the area between the two adjacent rows of the first bonding pad 200 .
  • the area between the two rows of first pads 200 can be a channel for excess colloid to overflow from the bonding area.
  • the excess colloid in the ACF 222 between the second pad 011 and the first pad 200 will be squeezed out. Out to the area between two adjacent rows of first pads 200 . Moreover, since the area between two adjacent rows of first pads 200 is wider closer to the display area 00a, that is, the channel width for allowing colloid to overflow from the binding area is larger. Therefore, the excess colloid that is extruded between two adjacent rows of first pads 200 flows out of the binding area faster in the second direction D2.
  • the width K1 of the first pad 200 closer to the display area 00a in the first direction D1 is wider than that of the other one.
  • the width K1 of the first pad 200 in the first direction D1 is 5% to 10% smaller.
  • the width of each first pad in the first pad 200 in the first row in the first direction D1 is K1 1
  • the width of each first pad in the Nth row in the first direction D1 is K1 1
  • the width is K1 N .
  • the distance between the first pad in row 1 and the first pad in row 2 is K2 1
  • the distance between the first pad in row N-1 and the first pad in row N is K2 N-1 .
  • each first pad in the first row of first pads in the second direction D2 is K3 1
  • the width of each of the first pads in the Nth row in the second direction D2 is K3 N
  • the distance between every two adjacent first pads in the first pad in row 1 is K4 1
  • the distance between every two adjacent first pads in the first pad in row N is K4 N.
  • Figure 11 is a schematic diagram of the arrangement of the third first pad provided by an embodiment of the present application.
  • the width K1 in the first direction D1 and the width K3 in the second direction D2 of each first pad 200 in the same column of first pads 200 gradually decrease in the direction approaching the display area 00a.
  • the distance K4 between every two adjacent first pads 200 in each row of first pads 200 gradually increases in the direction approaching the display area 00a, so that the distance K4 between two adjacent columns of first pads 200 It gradually increases in the direction closer to the display area 00a.
  • the distance K2 between two adjacent rows of first pads 200 gradually increases in the direction approaching the display area 00a.
  • each first pad 200 on the first substrate 100 is smaller as it is closer to the display area 00a.
  • the excess colloid between the second pad 011 and the first pad 200 can be in the area between two adjacent rows of first pads 200 and the area between two adjacent columns of first pads 200, And these excess colloids can flow in the second direction D2 or in a direction close to the display area 00a.
  • the area between the two rows of first pads 200 can be a channel for excess colloid to overflow from the binding area, and the area between the two columns of first pads 200 can also be a channel for excess colloid to overflow from the binding area. channel.
  • the distance between pads 200 is also larger, that is, the width of the channel for the colloid to escape from the bonding area is larger.
  • part of the excess colloid flows from the second direction D2 to overflow the binding area, and these excess colloids Another part of the flow overflows the binding area from the direction closer to the display area 00a.
  • the width K1 of the first pad 200 closer to the display area 00a in the first direction D1 is wider than that of the other one.
  • the width K1 of the first pad 200 in the first direction D1 is 5% to 10% smaller.
  • the width K3 of the first pad 200 closer to the display area 00a in the second direction D2 is larger than that of the other first pad 200.
  • the width K3 in the second direction D2 is 5% to 10% smaller.
  • the width of each first pad in the first pad 200 in the first row in the first direction D1 is K1 1
  • the width of each first pad in the Nth row in the first direction D1 is K1 1
  • the width is K1 N .
  • the distance between the first pad in row 1 and the first pad in row 2 is K2 1
  • the distance between the first pad in row N-1 and the first pad in row N is K2 N-1 .
  • each first pad in the first row of first pads in the second direction D2 is K3 1
  • the width of each of the first pads in the Nth row in the second direction D2 is K3 N
  • the distance between every two adjacent first pads in the first pad in row 1 is K4 1
  • the distance between every two adjacent first pads in the first pad in row N is K4 N.
  • any two adjacent first pads 200 in a column of first pads 200 close to the display area 00a are closely arranged, then the first pad in the Nth row of the row closest to the display area 00a and the distance from the display area
  • the distance between the first pads in row 1 of the farthest row of 00a is smaller, which reduces the channel length for colloid to overflow from the binding area.
  • the excess colloid in the area between two adjacent rows of first pads 200 and the area between two adjacent columns of first pads 200 can more easily be removed from the area between two adjacent columns of first pads 200 .
  • the channel flows toward the display area 00a and overflows the binding area.
  • Figure 12 is a schematic diagram of the arrangement of the fourth first pad provided by an embodiment of the present application.
  • the width K3 of the first pads 200 in different rows in the second direction D2 is equal, the distance K4 between every two adjacent first pads 200 in each row of the first pads 200 is equal, and every two rows are equal.
  • the distance K2 between adjacent first pads 200 is equal.
  • each first pad 200 in the same column of first pads 200 in the first direction D1 gradually decreases in the direction approaching the display area 00a.
  • the distance between the first pads 200 in the row closest to the display area 00a in the binding area and the first pads 200 in the row farthest from the display area 00a is small, that is, the first pads 200 in the two adjacent columns are
  • the shorter the length of the area between the discs 200 the shorter the length of the channel for colloid to escape from the binding zone.
  • the excess colloid between the second bonding pad 011 and the first bonding pad 200 mainly flows in the area between two adjacent rows of the first bonding pads 200 in a direction close to the display area 00a.
  • the area between the two rows of first pads 200 can be a channel for excess colloid to overflow from the bonding area.
  • the excess colloid in the ACF 222 between the second pad 011 and the first pad 200 is squeezed out to In the area between two adjacent columns of first pads 200 .
  • the length of the channel in the binding zone for allowing colloids to escape from the binding zone is short. Therefore, the excess colloid that is squeezed out between the two adjacent rows of first pads 200 has a shorter flow distance in the direction closer to the display area 00a, making it easier for the excess colloid to escape from the two adjacent rows.
  • the channel between the first pads 200 overflows the bonding area toward the display area 00a.
  • the width K1 of the first pad 200 closer to the display area 00a in the first direction D1 is wider than that of the other one.
  • the width K1 of the first pad 200 in the first direction D1 is 5% to 10% smaller.
  • the width of each first pad in the first pad 200 in the first row in the first direction D1 is K1 1
  • the width of each first pad in the Nth row in the first direction D1 is K1 1
  • the width is K1 N .
  • the distance between the first pad in row 1 and the first pad in row 2 is K2 1
  • the distance between the first pad in row N-1 and the first pad in row N is K2 N-1 .
  • each first pad in the first row of first pads in the second direction D2 is K3 1
  • the width of each of the first pads in the Nth row in the second direction D2 is K3 N
  • the distance between every two adjacent first pads in the first pad in row 1 is K4 1
  • the distance between every two adjacent first pads in the first pad in row N is K4 N.
  • Figure 13 is a schematic diagram of the arrangement of the fifth first pad provided by an embodiment of the present application.
  • the distance K2 between adjacent first pads 200 in every two rows is equal.
  • each first pad 200 in the same column of first pads 200 gradually decrease in the direction approaching the display area 00a, and the first pads 200 in each row gradually decrease.
  • the distance K4 between every two adjacent first pads 200 in the pad 200 gradually increases in the direction approaching the display area 00a.
  • the orthographic projection area of each first pad 200 close to the display area 00a on the first substrate 100 gradually decreases, and the distance between two adjacent columns of first pads 200 gradually increases.
  • the length of the area between two adjacent columns of first pads 200 is shorter.
  • the excess colloid between the second bonding pad and the first bonding pad 200 mainly flows in the area between two adjacent rows of the first bonding pad 200 in a direction close to the display area 00a.
  • the area between the two rows of first pads 200 can be a channel for excess colloid to overflow from the bonding area.
  • the width K1 of the first pad 200 closer to the display area 00a in the first direction D1 is wider than that of the other one.
  • the width K1 of the first pad 200 in the first direction D1 is 5% to 10% smaller.
  • the width K3 of the first pad 200 closer to the display area 00a in the second direction D2 is larger than that of the other first pad 200.
  • the width K3 in the second direction D2 is 5% to 10% smaller.
  • the width of each first pad in the first pad 200 in the first row in the first direction D1 is K1 1
  • the width of each first pad in the Nth row in the first direction D1 is K1 1
  • the width is K1 N .
  • the distance between the first pad in row 1 and the first pad in row 2 is K2 1
  • the distance between the first pad in row N-1 and the first pad in row N is K2 N-1 .
  • each first pad in the first row of first pads in the second direction D2 is K3 1
  • the width of each of the first pads in the Nth row in the second direction D2 is K3 N
  • the distance between every two adjacent first pads in the first pad in row 1 is K4 1
  • the distance between every two adjacent first pads in the first pad in row N is K4 N.
  • FIG. 14 is a schematic diagram of a first bonding pad and a second bonding pad provided in an embodiment of the application.
  • the orthographic projection area of the first bonding pad 200 on the first substrate 100 is too small, the effect of the electrical connection between the second bonding pad and the first bonding pad 200 is poor.
  • the orthographic projection area of each first pad 200 in the row of first pads 200 closest to the display area 00a on the flexible substrate 100 needs to be greater than or equal to the preset area threshold.
  • This preset area threshold is: the minimum area where the orthographic projection of the second pad 011 on the flexible substrate 100 overlaps with the orthographic projection of the first pad 200 on the flexible substrate 100 . In this way, it can be ensured that the electrical connection area between the second pad 011 and the first pad 200 is larger, thereby making the electrical connection effect between the second pad 011 and the first pad 200 better. It should be noted that this preset area threshold is also related to the area size that ACF 222 can achieve effective bonding. Different types of ACF 222 have different preset area thresholds.
  • FIG. 15 is a top view of a first bonding pad provided in the embodiment of the present application.
  • the first pad 200 has a plurality of corner portions 201, and the corner portions 201 may include at least one of rounded corners and chamfers.
  • the shape of the orthographic projection of the first bonding pad 200 on the substrate 100 is a rectangle
  • the number of corners 201 in the first bonding pad 200 is four
  • the four corners 201 are respectively distributed on the first bonding pad. 200 at the four top corners.
  • the corners 201 of the four first pads 200 are rounded. At least one of the chamfering and the chamfering can make it easier for the excess colloid between the two first pads 200 to be guided into a channel for the excess colloid to flow.
  • the corner 201 of the first bonding pad 200 may include at least one of a fillet and a chamfer, the embodiment of the present application will be described in the following three situations.
  • the radius R of the rounded corner ranges from 10% to 50% of the width K1 of the first pad 200 in the first direction D1.
  • FIG. 16 is a top view of another first pad provided by an embodiment of the present application.
  • the angle ⁇ between the chamfered inclined surface 201a and the second direction D2 ranges from 15° to 45°
  • the width K5 of the chamfer in the second direction D2 ranges from: first 10% to 20% of the width K3 of the pad 200 in the second direction D2.
  • FIG. 17 is a top view of yet another first pad provided by an embodiment of the present application.
  • the corner 201 may include: rounding and chamfering
  • the angle ⁇ between the chamfered inclined surface 201a and the second direction D2 ranges from 15° to 45°
  • the width K5 of the chamfering in the second direction D2 is The range is: 10% to 20% of the width K3 of the first pad 200 in the second direction D2.
  • the radius R of the fillet ranges from 10% to 50% of the target width.
  • the target width may be the width K3 of the first pad 200 in the second direction D2 and the width K5 of the two chamfers 201a in the second direction D2. difference.
  • the radius R of the fillet of each first pad 200 in the first pad in the first row is 10% of the width K1 of the first pad 200 in the first direction D1; the first pad in the second row
  • the radius R of the fillet of each first pad 200 in the first pad 200 in the fourth row is the first pad 200 40% of the width K1 in the first direction D1;
  • the radius R of the fillet of each first pad 200 in the first pad 200 in the fifth row is 40% of the width K1 of the first pad 200 in the first direction D1 50%.
  • the radius R of the rounded corners of the first pad 200 is related to the width K1 of the first pad 200 in the first direction D1. Therefore, the radius R of the rounded corner of the first pad 200 may gradually decrease in a direction closer to the display area 00a.
  • the plurality of first pads 200 in the display panel 000 are arranged in an array of at least 4 rows.
  • the number of rows in which the plurality of first pads 200 are arranged can be determined according to the number of signal lines in the display panel 000 . The more signal lines there are in the display panel 000, the more rows the first pads 200 are arranged.
  • FIG. 18 is a top view of a display panel provided by the embodiment of the present application.
  • the display panel 000 may further include: a plurality of signal lines L1 located in the display area 00a, and a plurality of fan-out leads L2 located in the non-display area 00b.
  • multiple light-emitting devices are arranged in multiple columns, one column of light-emitting devices is electrically connected to the same signal line L1, the multiple signal lines L1 are electrically connected to the multiple fan-out leads L2 in a one-to-one correspondence, and the multiple fan-out leads L2 are electrically connected to The plurality of first pads 200 are electrically connected in one-to-one correspondence.
  • the signal lines L1 can apply electrical signals to the plurality of light-emitting devices in the display panel 000, so that the light-emitting devices emit light.
  • One end of the fan-out lead L2 is electrically connected to the signal line L1, and the other end of the fan-out lead L2 can be electrically connected to the driving component 111 through the first pad 200.
  • the electrical signal in the driving component 111 can apply electrical signals to the multiple light-emitting devices in the display panel 000 through the fan-out lead L2 and the signal line L1, so that the display panel 000 can display images.
  • one first bonding pad 200 may also correspond to at least two fan-out leads L2.
  • the first pad 200 electrically connected to the plurality of two fan-out leads L2 needs to be electrically connected to the multiplexer.
  • the display panel 000 can time-share the two fan-out leads L2 electrically connected to the first pad 200 through the multiplexer, so that the light-emitting devices in the display panel 000 emit light.
  • the display panel provided by the embodiment of the present application includes: a substrate, a light-emitting device and a first bonding pad.
  • the area of the orthographic projection of each row of first pads on the first substrate gradually decreases in the direction closer to the display area, so that the closer to the display area, the closer the area of any two adjacent first pads in a row of first pads. The distance between them is larger, and/or the distance between the first pads in the row closest to the display area and the first pads in the row farthest from the display area is small.
  • the excess colloid in the ACF between the second pad and the first pad is squeezed out, the excess colloid can be moved closer to the display area. direction of flow.
  • soldering pads are in close contact, thereby making the electrical connection between the second soldering pad and the first soldering pad better, effectively improving the display effect of the display panel.
  • FIG. 19 is a top view of a driving assembly provided by an embodiment of the present application.
  • the driving component 111 has a device area 11a and a connection area 11b located on one side of the device area 11a.
  • the driving component 111 may include: a second substrate 010, a driving chip 013 located in the device area 11a, and a connection area 11b located in the connection area 11a.
  • the plurality of second bonding pads 011 are used to electrically connect with the driver chip 013 and the display panel 000, and the plurality of second bonding pads 011 are arranged in multiple rows along the lines away from the device area.
  • the directions of 11a are distributed sequentially.
  • the driving chip 013 in the driving component 111 can apply an electrical signal to the fan-out lead L2 electrically connected to it through the second bonding pad 011, and then the fan-out lead L2 can apply the electrical signal to the display panel through the signal line L1.
  • Multiple light-emitting devices in 000 are used to electrically connect with the driver chip 013 and the display panel 000, and the plurality of second bonding pads 011 are arranged in multiple rows along the lines away from the device area.
  • the directions of 11a are distributed sequentially.
  • the driving chip 013 in the driving component 111 can apply an electrical signal to the fan-out lead L2 electrically connected to it through the second bonding pad 011, and then the fan-out lead L2 can apply the electrical signal to the display panel through
  • the area of the orthogonal projection of each row of second pads 011 on the second substrate 010 gradually decreases in the direction away from the device region 11a. In this way, when the driving component 111 and the display panel 000 are electrically connected through the ACF 222, the first pad 200 and the second pad 011 can be electrically connected in a one-to-one correspondence, and the first pad 200 and the second pad 011 are electrically connected. The effect is better.
  • the driving component 111 may also include: a third pad 012 located on the second substrate 010 that corresponds to the plurality of electrical connection pads 300 one-to-one.
  • the power-connecting pad 300 in the display panel 000 can also be electrically connected to the third pad 012 in the driving assembly 111 through the ACF 222, so that the devices in the driving assembly 111 can be powered.
  • the plurality of second bonding pads 011 are in one-to-one correspondence with the plurality of first bonding pads 200 . Therefore, the arrangement of the plurality of second bonding pads 011 in the driving component 111 and the location of each second bonding pad 200 are different.
  • the size of the disk 011 reference may be made to the corresponding parts in the embodiments described above regarding the structure of the display panel. The embodiments of the present application will not be described in detail here.
  • An embodiment of the present application also provides a manufacturing method of a display panel, which is used to manufacture the display panel shown in the above embodiment.
  • the manufacturing method of the display panel may include:
  • a plurality of light emitting devices and a plurality of first pads are formed on the first substrate.
  • the display panel has a display area and a non-display area located at the periphery of the display area, a plurality of light-emitting devices are distributed in the display area, and a plurality of first pads are distributed in the non-display area.
  • the plurality of first pads are used to be electrically connected to a plurality of light-emitting devices and to the driving components, and the plurality of first pad arrays are arranged in multiple rows, and the multiple rows of first pads are sequentially arranged in the direction away from the display area. distributed.
  • the area of the orthographic projection of the first pads of each row on the first substrate gradually decreases in the direction approaching the display area.
  • FIG. 20 is a schematic diagram of a display device provided by an embodiment of the present application.
  • the display device can be: a mobile phone, a tablet computer, a television, a monitor, a notebook computer, a digital photo frame, a navigator, or any other product or component with a display function.
  • the display device may include any of the above display panels 000 and a driving component.
  • the driving component may be a flexible circuit board or a separate driving chip.
  • the driving chip can be integrated in the flexible circuit board, and the plurality of first pads 200 in the display panel 000 and the plurality of second pads 011 in the flexible circuit board 111 correspond one to one. connect.
  • the driving component is a driving chip
  • the driving chip also has second pads 011 electrically connected to the plurality of first pads 200 in one-to-one correspondence.
  • the display device may further include: an ACF 222 located between the display panel 000 and the driving component 111.
  • the display panel 000 and the driving component 111 can be electrically connected through the ACF 222.
  • the display panel may be an OELD display panel or an active matrix organic light emitting diode (English: Active Matrix-Organic Light Emitting Diode; AM-OLED for short) display panel.
  • OELD Active Matrix-Organic Light Emitting Diode
  • AM-OLED Active Matrix-Organic Light Emitting Diode
  • first and second are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
  • plurality refers to two or more than two, unless expressly limited otherwise.

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Abstract

本申请公开了一种显示面板及其制造方法、驱动组件、显示装置，属于显示技术领域。该显示面板可以包括：衬底、发光器件和第一焊盘。各行第一焊盘在第一衬底上的正投影的面积，沿靠近显示区的方向逐渐减小，使得越靠近显示区的一行第一焊盘中任意两个相邻的第一焊盘之间的距离越大，和/或，距离显示区最近的一行第一焊盘和距离显示区最远的一行第一焊盘之间的距离较小。示例的，当越靠近显示区排布的一行第一焊盘中任意两个相邻的第一焊盘之间的距离越大时，从第一焊盘与第二焊盘之间挤出的多余胶体可以更快的向靠近显示区的方向流动，使得第二焊盘和第一焊盘电连接的效果较好，有效的提高了显示面板的显示效果。

Description

显示面板及其制造方法、驱动组件、显示装置 技术领域
本申请涉及显示技术领域，特别涉及一种显示面板及其制造方法、驱动组件、显示装置。
背景技术
随着显示技术的发展，显示装置的使用越来越广泛。常用的显示装置有智能手机、平板电脑、电视机和显示器等。
显示装置通常可以包括显示面板和柔性电路板。其中，显示面板具有显示区和非显示区。该显示面板可以包括：位于显示区域的多个发光器件，以及位于非显示区内的多个第一焊盘，多个第一焊盘可以通过信号线与发光器件电连接。柔性电路板具有多个第二焊盘，且柔性电路板能够绑定在显示面板的非显示区内后，柔性电路板的多个第二焊盘能够与多个第一焊盘一一对应电连接。这里，柔性电路板通常通过异方性导电胶(英文：anisotropic conductiveadhesive film，简称：ACF)与显示面板绑定连接。这样，柔性电路板能够控制显示面板的显示区内的发光器件发光，使显示面板能够显示出相应的画面。
但是，在将柔性电路板绑定在显示面板的非显区内后，显示面板的多个第一焊盘与柔性电路板的多个第二焊盘之间通过ACF进行电连接的效果较差，导致显示面板的显示效果较差。
发明内容
本申请实施例提供了一种显示面板及其制造方法、驱动组件、显示装置。可以解决现有技术的显示面板的显示效果较差的问题，所述技术方案如下：
一方面，提供了一种显示面板，所述显示面板具有显示区和位于所述显示区外围的非显示区，所述显示面板包括：
第一衬底；
位于所述显示区内的多个发光器件；
位于所述非显示区内的多个第一焊盘，所述多个第一焊盘用于与所述多个发光器件电连接，且与驱动组件电连接，且所述多个第一焊盘阵列排布为多行，多行所述第一焊盘沿背离所述显示区的方向依次分布；
其中，各行所述第一焊盘在所述第一衬底上的正投影的面积，沿靠近所述显示区的方向逐渐减小。
可选的，所述多个第一焊盘沿第一方向阵列排布为多行，且沿第二方向阵列排布为多列；
其中，同一列所述第一焊盘内的各个第一焊盘在所述第一方向上的宽度和/或第二方向上的宽度，沿靠近所述显示区的方向逐渐减小。
可选的，不同行中的第一焊盘在所述第一方向上的宽度相等，且每两行相邻的所述第一焊盘之间的距离相等；
同一列所述第一焊盘内的各个第一焊盘在所述第二方向上的宽度，沿靠近所述显示区的方向逐渐减小；且各行所述第一焊盘内的每两个相邻的第一焊盘之间的距离，沿靠近所述显示区的方向逐渐增大。
可选的，不同行中的第一焊盘在所述第二方向上的宽度相等，且各行所述第一焊盘中每两个相邻的第一焊盘之间的距离相等；
同一列所述第一焊盘内的各个第一焊盘在所述第一方向上的宽度，沿靠近所述显示区的方向逐渐减小；且两行相邻的所述第一焊盘之间的距离，沿靠近所述显示区的方向逐渐增大。
可选的，同一列所述第一焊盘内的各个第一焊盘在所述第一方向上的宽度和所述第二方向上的宽度，沿靠近所述显示区的方向逐渐减小；各行所述第一焊盘内的每两个相邻的第一焊盘之间的距离，沿靠近所述显示区的方向逐渐增大；且两行相邻的所述第一焊盘之间的距离，沿靠近所述显示区的方向逐渐增大。
可选的，不同行中的第一焊盘在所述第二方向上的宽度相等，各行所述第一焊盘中每两个相邻的第一焊盘之间的距离相等，且每两行相邻的所述第一焊盘之间的距离相等；
同一列所述第一焊盘内的各个第一焊盘在所述第一方向上的宽度，沿靠近所述显示区的方向逐渐减小。
可选的，每两行相邻的所述第一焊盘之间的距离相等；
同一列所述第一焊盘内的各个第一焊盘在所述第一方向上的宽度和所述第二方向上的宽度，沿靠近所述显示区的方向逐渐减小；且各行所述第一焊盘内的每两个相邻的第一焊盘之间的距离，沿靠近所述显示区的方向逐渐增大。
可选的，对于同一列所述第一焊盘内两个相邻的第一焊盘，更靠近所述显示区的第一焊盘在所述第一方向上的宽度比另一个第一焊盘在所述第一方向上的宽度小5％至10％。
可选的，对于同一列所述第一焊盘内两个相邻的第一焊盘，更靠近所述显示区的第一焊盘在所述第二方向上的宽度比另一个第一焊盘在所述第二方向上的宽度小5％至10％。
可选的，所述第一焊盘具有多个角部，所述角部包括：圆角和倒角中的至少一种。
可选的，当所述角部为所述圆角时，所述圆角的半径范围为：所述第一焊盘在所述第一方向上的宽度的10％至50％。
可选的，当所述角部为所述倒角时，所述倒角的斜面与所述第二方向的夹角范围为：15°至45°，且所述倒角在所述第二方向上的宽度的范围为：所述第一焊盘在所述第二方向上的宽度的10％至20％。
可选的，当所述角部包括：所述圆角和所述倒角时，所述倒角的斜面与所述第二方向的夹角范围为：15°至45°，且所述倒角在所述第二方向上的宽度的范围为：所述第一焊盘在所述第二方向上的宽度的10％至20％；
所述圆角的半径范围为：目标宽度的10％至50％，所述目标宽度为第一焊盘在所述第二方向上的宽度与两个所述倒角在所述第二方向上的宽度的差值。
可选的，所述多个第一焊盘阵列排布为至少4行。
可选的，同一行所述第一焊盘中的各个第一焊盘在所述第一衬底上的正投影的面积相同，且同一行所述第一焊盘中的每两个相邻的第一焊盘之间的距离相同。
另一方面，提供了一种驱动组件，所述驱动组件具有器件区，以及位于所述器件区一侧的连接区，所述驱动组件包括：
第二衬底；
位于所述器件区内的驱动芯片；
位于所述连接区内的多个第二焊盘，所述多个第二焊盘用于与所述驱动芯 片电连接，且与所述显示面板电连接，且所述多个第二焊盘阵列排布为多行，多行所述第二焊盘沿背离所述器件区的方向依次分布；
其中，各行所述第二焊盘在所述第二衬底上的正投影的面积，沿背离所述器件区的方向逐渐减小。
又一方面，提供了一种显示装置，包括：上述任一显示面板和驱动组件，所述显示面板中的多个第一焊盘与所述驱动组件中的多个第二焊盘一一对应电连接。
本申请实施例提供的技术方案带来的有益效果至少包括：
一种显示面板，包括：衬底、发光器件和第一焊盘。各行第一焊盘在第一衬底上的正投影的面积，沿靠近显示区的方向逐渐减小，使得越靠近显示区的一行第一焊盘中任意两个相邻的第一焊盘之间的距离越大，和/或，距离显示区最近的一行第一焊盘和距离显示区最远的一行第一焊盘之间的距离较小。并且，在将驱动组件通过ACF与显示面板绑定连接的过程中，在第二焊盘和第一焊盘之间的ACF中多余的胶体被挤出后，该多余的胶体可以朝向靠近显示区的方向流向。如此，当越靠近显示区排布的一行第一焊盘中任意两个相邻的第一焊盘之间的距离越大时，ACF中从第一焊盘与第二焊盘之间挤出的多余胶体可以更快的向靠近显示区的方向流动。同样的，当距离显示区最近的一行第一焊盘和距离显示区最远的一行第一焊盘之间的距离较小时，ACF中从第一焊盘与第二焊盘之间挤出的多余胶体向靠近显示区的方向流动的距离更小，以使该多余的胶体更快的溢出绑定区。这样，第二焊盘和第一焊盘之间多余的胶体不会堆积在绑定区内，使得第二焊盘和第一焊盘之间的导电粒子能够分别与第二焊盘及第一焊盘紧密接触，进而使得第二焊盘和第一焊盘电连接的效果较好，有效的提高了显示面板的显示效果。
附图说明
为了更清楚地说明本申请实施例中的技术方案，下面将对实施例描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本申请的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1是相关技术提供的一种显示装置的俯视图；
图2是图1示出的A-A’处的显示装置的截面示意图；
图3是相关技术提供的一种非显示区内的第一焊盘的排布方式示意图；
图4是本申请实施例提供的一种显示面板的立体结构示意图；
图5是本申请实施例提供的一种显示面板和驱动组件绑定的截面示意图；
图6是本申请实施例提供的一种第一焊盘的排布示意图；
图7是本申请实施例提供的另一种第一焊盘的排布示意图；
图8是本申请实施例提供的第一种第一焊盘的排布示意图；
图9是图8示出的多行第一焊盘与对应的第二焊盘绑定的截面示意图；
图10是本申请实施例提供的第二种第一焊盘的排布示意图；
图11是本申请实施例提供的第三种第一焊盘的排布示意图；
图12是本申请实施例提供的第四种第一焊盘的排布示意图；
图13是本申请实施例提供的第五种第一焊盘的排布示意图；
图14是本申请实施例提供的一种第一焊盘和第二焊盘的示意图；
图15是本申请实施例提供的一种第一焊盘的俯视图；
图16是本申请实施例提供的又一种第一焊盘的俯视图；
图17是本申请实施例提供的再一种第一焊盘的俯视图；
图18是本申请实施例提供的一种显示面板的俯视图；
图19是本申请实施例提供的一种驱动组件的俯视图；
图20是本申请实施例提供的一种显示装置的示意图。
具体实施方式
为使本申请的目的、技术方案和优点更加清楚，下面将结合附图对本申请实施方式作进一步地详细描述。
在相关技术中，请参考图1和图2，图1是相关技术提供的一种显示装置的俯视图，图2是图1示出的A-A’处的显示装置的截面示意图。显示装置00通常可以包括：显示面板10、柔性电路板20，以及位于显示面板10和柔性电路板20之间的ACF 30。其中，显示面板10具有显示区1a，以及位于显示区1a外围的非显示区1b。柔性电路板20可以通过ACF 30绑定在显示面板00的非显示区1b内。其中，ACF 30在显示面板10上的正投影的区域通常为绑定区域。
显示面板10可以包括：位于显示区内的多个发光器件(图中未示出)，以 及位于非显示区1b内的多个第一焊盘11，多个第一焊盘11可以通过信号线与发光器件电连接。多个第一焊盘11可以分布在非显示区1b的绑定区域内。
柔性电路板20具有多个第二焊盘21，且柔性电路板20的多个第二焊盘21能够与多个第一焊盘11一一对应电连接。这样，柔性电路板20可以通过电连接的第二焊盘21和第一焊盘11向显示面板10施加电信号，以控制显示面板10内的发光器件发光，进而使得显示面板10能够显示相应的画面。
柔性电路板20的第二焊盘与显示面板10的对应的第一焊盘11能够通过ACF 30进行电连接。在将柔性电路板通过ACF与显示面板10绑定连接的过程中，需要向柔性电路板20施加按压力，以使ACF 30内中位于第二焊盘21和第一焊盘11之间胶体可以被挤出，使得第二焊盘21和第一焊盘11之间可以通过ACF内的导电粒子F电连接。并且，在这个过程中，通常还需要加热，以使绑定区域内ACF 30中多余的胶体能够通过两个相邻的第一焊盘11之间的区域溢出，进而保证第二焊盘21和第一焊盘11通过导电粒子F电连接的效果较好。
如图1所示，显示面板10的非显示区1b内通常还设置有多个接电焊盘12。多个接电焊盘12排布在多个第一焊盘11背离显示区1a的方向。在将柔性电路板通过ACF 30绑定在显示面板10的非显示区1b后，多个接电焊盘12也可以通过ACF 30与柔性电路板20电连接，使得多个接电焊盘12能够通过柔性电路板20与供电组件电连接。这样，在将柔性电路板通过ACF与显示面板10绑定连接的过程中，ACF 30中多余的胶体被挤出至两个相邻的第一焊盘11之间的区域内后，这些多余的胶体主要向背离多个接电焊盘12的方向(也即靠近显示区1a的方向流动)流动，以从绑定区域内溢出。
然而，为了使得显示面板10能够实现高分辨率的功能，需要在显示面板10中设置更多的信号线，且每条信号线均与一个第一焊盘11电连接。这样，会导致显示面板10的非显示区内排布的第一焊盘11的数量增加。
在这种情况下，请参考图3，图3是相关技术提供的一种非显示区内的第一焊盘的排布方式示意图。非显示区内分布的第一焊盘11排布的行数需要增加，且每行第一焊盘11内排布的第一焊盘11的个数也需要增加。如此，非显示区内分布的第一焊盘11的行数较多，且每行第一焊盘11内排布的第一焊盘11的个数也较多。
由于在绑定过程中ACF 30中多余的胶体需要向靠近显示区1a的方向流动。 因此，当非显示区内分布的第一焊盘11的行数较多时，用于让胶体从绑定区域溢出的通道长度T2较大。这里，用于让胶体从绑定区域溢出的通道是指：位于两列第一焊盘11之间的区域。又由于用于让胶体从绑定区域溢出的通道长度T2越长，ACF 30中多余的胶体越不容易从此通道溢出。因此，当非显示区内分布的第一焊盘11的行数较多时，位于第二焊盘21和第一焊盘11之间胶体难以排出，进而严重影响了第二焊盘21和第一焊盘11通过ACF内的导电粒子F电连接的效果。
当每行第一焊盘11内排布的第一焊盘11的个数较多时，任意两个相邻的第一焊盘11的宽度较小，用于让胶体从绑定区域溢出的通道宽度T1较小。又由于用于让胶体从绑定区域溢出的通道宽度T1越小，ACF 30中多余的胶体越不容易从此通道溢出。因此，当每行第一焊盘11内排布的第一焊盘11的个数较多时，会加剧位于第二焊盘21和第一焊盘11之间胶体的排出难度，进一步的影响了第二焊盘21和第一焊盘11通过ACF内的导电粒子F电连接的效果。
此外，在向柔性电路板20施加按压力后，ACF 03的温度会降低，以使位于柔性电路板20和显示面板10之间的ACF 03胶体凝固。这样，由于位于第二焊盘21和第一焊盘11之间胶体没有从通道溢出，因此，第二焊盘21和第一焊盘11之间存在多余的胶体会凝固。如此，第二焊盘21和第一焊盘11之间凝固的胶体，会导致第二焊盘21和第一焊盘11之间的导电粒子F不能与第二焊盘21和第一焊盘11紧密接触，进而导致第二焊盘21和第一焊盘11的连接效果较差。
请参考图4，图4是本申请实施例提供的一种显示面板的立体结构示意图。显示面板000具有显示区00a和位于显示区00a外围的非显示区00b，该显示面板000可以包括：第一衬底100，位于显示区00a内的发光器件(图中未示出)，位于非显示区00b内的多个第一焊盘200。
多个第一焊盘200用于与多个发光器件电连接，且与驱动组件电连接，且多个第一焊盘200阵列排布为多行，多行第一焊盘200沿背离显示区00a的方向依次分布。这里，驱动组件可以为柔性电路板，也可以为单独的驱动芯片。当驱动组件可以为柔性电路板时，驱动芯片可以集成在柔性电路板内。示例的，驱动组件具有与多个第一焊盘200一一对应的多个第二焊盘，在驱动组件绑定 在显示面板000上后，多个第二焊盘能够与多个第一焊盘200一一对应电连接。需要说明的是，本申请实施例仅以驱动组件为柔性电路板的情况为例，进行示意性说明。
为了更清楚的看清驱动组件和显示面板000的电连接关系。请参考图5，图5是本申请实施例提供的一种显示面板和驱动组件绑定的截面示意图。驱动组件111中的第二焊盘011可以通过ACF 222与显示面板000中的第一焊盘200电连接。如此，在驱动组件111绑定在显示面板000上的过程中，可以向驱动组件111施加按压力，使得每个第二焊盘011和对应的第一焊盘200之间的ACF 222中多余的胶体被挤出，进而使得第二焊盘011和第一焊盘200可以通过ACF中的导电粒子E电连接。这样，驱动组件111可以通过多个第二焊盘011与多个第一焊盘200的一一对应电连接，控制显示面板000内的发光器件发光，进而使得显示面板000能够显示相应的画面。驱动组件111与显示面板000进行绑定的区域通常为绑定区，且这个绑定区位于显示面板000的非显示区00b内。
在本申请实施例中，显示面板000还可以包括：位于非显示区00b内的多个接电焊盘300，多个接电焊盘300位于多个第一焊盘200背离显示区00a的一侧。这里，多个接电焊盘300可以排布为一行，且接电焊盘300用于向与其电连接的驱动组件111供电。在将驱动组件111通过ACF 222绑定在显示面板000的非显示区00b后，多个接电焊盘300也需要通过ACF 222与驱动组件111电连接，使得多个接电焊盘300能够通过驱动组件111与供电组件电连接。这样，在将驱动组件111通过ACF 222与显示面板000绑定连接的过程中，ACF 222中多余的胶体被挤出至两个相邻的第一焊盘200之间的区域内后，这些多余的胶体主要向背离多个接电焊盘300的方向(也即靠近显示区00a的方向流动)流动，以从绑定区域内溢出。
为了更清楚的看清第一焊盘200的排布情况，请参考图6和图7，图6是本申请实施例提供的一种第一焊盘的排布示意图，图7是本申请实施例提供的另一种第一焊盘的排布示意图。各行第一焊盘200在第一衬底100上的正投影的面积，沿靠近显示区00a的方向逐渐减小。这里，同一行第一焊盘200中的各个第一焊盘200在第一衬底100上的正投影的面积相同，且同一行第一焊盘200中的每两个相邻的第一焊盘200之间的距离相同。
在一种情况下，如图6所示，越靠近显示区00a排布的一行第一焊盘200 中的各个第一焊盘200在第一衬底100上的正投影的面积越小，且这一行第一焊盘200中任意两个相邻的第一焊盘200之间的距离越大。在这种情况下，由于在将驱动组件111通过ACF 222与显示面板000绑定连接的过程中，第二焊盘011和第一焊盘200之间的ACF 222中多余的胶体被挤出后，该多余的胶体可以朝向靠近显示区00a的方向流向。因此，当越靠近显示区00a排布的一行第一焊盘200中任意两个相邻的第一焊盘200之间的距离越大时，ACF 222中从第一焊盘200与第二焊盘011之间挤出的多余胶体可以更快的向靠近显示区00a的方向流动。这样，第二焊盘011和第一焊盘200之间多余的胶体不会堆积在绑定区内，使得第二焊盘011和第一焊盘200之间的导电粒子E能够分别与第二焊盘011及第一焊盘200紧密接触，进而使得第二焊盘011和第一焊盘200电连接的效果较好。
在另一种情况下，如图7所示，越靠近显示区00a排布的一行第一焊盘200中的各个第一焊盘200在第一衬底100上的正投影的面积越小，且距离显示区00a最近的一行第一焊盘200和距离显示区00a最远的一行第一焊盘200之间的距离较小。在这种情况下，由于在将驱动组件111通过ACF 222与显示面板000绑定连接的过程中，第二焊盘011和第一焊盘200之间的ACF 222中多余的胶体被挤出后，该多余的胶体可以朝向靠近显示区00a的方向流向。因此，当距离显示区00a最近的一行第一焊盘200和距离显示区00a最远的一行第一焊盘200之间的距离较小时，ACF 222中从第一焊盘200与第二焊盘011之间挤出的多余胶体向靠近显示区00a的方向流动的距离更小，以使该多余的胶体更快的溢出绑定区。这样，第二焊盘011和第一焊盘200之间多余的胶体不会堆积在绑定区内，使得第二焊盘011和第一焊盘200之间的导电粒子E能够分别与第二焊盘011及第一焊盘200紧密接触，进而使得第二焊盘011和第一焊盘200电连接的效果较好。
如此，尽管非显示区00b内分布的第一焊盘200数量较多，也能够保证第二焊盘011和第一焊盘200之间被挤出的胶体能够更容易从显示面板000的绑定区溢出，不会影响第二焊盘011和第一焊盘200通过导电粒子E电连接的效果，使得显示面板000的显示效果较好。
综上所述，本申请实施例提供的显示面板，包括：衬底、发光器件和第一焊盘。各行第一焊盘在第一衬底上的正投影的面积，沿靠近显示区的方向逐渐 减小，使得越靠近显示区的一行第一焊盘中任意两个相邻的第一焊盘之间的距离越大，和/或，距离显示区最近的一行第一焊盘和距离显示区最远的一行第一焊盘之间的距离较小。并且，在将驱动组件通过ACF与显示面板绑定连接的过程中，在第二焊盘和第一焊盘之间的ACF中多余的胶体被挤出后，该多余的胶体可以朝向靠近显示区的方向流向。如此，当越靠近显示区排布的一行第一焊盘中任意两个相邻的第一焊盘之间的距离越大时，ACF中从第一焊盘与第二焊盘之间挤出的多余胶体可以更快的向靠近显示区的方向流动。同样的，当距离显示区最近的一行第一焊盘和距离显示区最远的一行第一焊盘之间的距离较小时，ACF中从第一焊盘与第二焊盘之间挤出的多余胶体向靠近显示区的方向流动的距离更小，以使该多余的胶体更快的溢出绑定区。这样，第二焊盘和第一焊盘之间多余的胶体不会堆积在绑定区内，使得第二焊盘和第一焊盘之间的导电粒子能够分别与第二焊盘及第一焊盘紧密接触，进而使得第二焊盘和第一焊盘电连接的效果较好，有效的提高了显示面板的显示效果。
在本申请实施例中，如图4所示，多个第一焊盘200沿第一方向D1阵列排布为多行，且沿第二方向D2阵列排布为多列。这里，第一方向D1和第二方向D2可以为相互垂直的两个方向。
其中，同一列第一焊盘200内的各个第一焊盘200在第一方向D1上的宽度和/或第二方向D2上的宽度，沿靠近显示区00a的方向逐渐减小。这样，同一列第一焊盘200中越靠近显示区00a的第一焊盘200在第一衬底100上的正投影的面积越小。需要说明的是，各行第一焊盘200中的各个第一焊盘200是等间距排布的，如此，一列第一焊盘200中的各个第一焊盘200的中轴线是重合的。
在本申请实施例中，由于同一列第一焊盘200在第一方向D1上的宽度和第二方向D2上的宽度有多种可选的组合方式。因此，在显示面板000中的多个第一焊盘200的排布方式有多种可选的实现方式，本申请实施例仅以以下五种为例，进行示意性说明。
需要说明的是，为了方便下述实施例对第一焊盘200的排布方式进行说明，本申请中，规定第一焊盘200在第一方向D1上的宽度表示为K1；在第一方向D1上相邻的第一焊盘200之间的距离表示为K2；第一焊盘200在第二方向D2上的宽度表示为K3；在第二方向D2上相邻的第一焊盘200之间的距离表示为 K4。
第一种可选的实现方式，请参考图8，图8是本申请实施例提供的第一种第一焊盘的排布示意图，不同行中的第一焊盘200在第一方向D1上的宽度K1相等，且每两行相邻的第一焊盘200之间的距离K2相等。
同一列第一焊盘200内的各个第一焊盘200在第二方向D2上的宽度K3，沿靠近显示区00a的方向逐渐减小。各行第一焊盘200内的每两个相邻的第一焊盘200之间的距离K4，沿靠近显示区00a的方向逐渐增大，使得相邻两列第一焊盘200之间的距离沿靠近显示区00a的方向逐渐增大。这样，可以保证越靠近显示区00a的第一焊盘200在第一衬底100上的正投影的面积越小。如此，第二焊盘011和第一焊盘200之间多余的胶体主要在相邻两列第一焊盘200之间的区域内，朝靠近显示区00a的方向流动。这里，两列第一焊盘200之间的区域可以为让多余的胶体从绑定区域溢出的通道。
在这种情况下，请参考图9，图9是图8示出的多行第一焊盘与对应的第二焊盘绑定的截面示意图。假设，图8中的多个第一焊盘200排布为了5行第一焊盘200，且距离显示区00a最远的这一行第一焊盘为第1行第一焊盘，距离显示区00a最近的这一行第一焊盘为第5行第一焊盘。则，第1行第一焊盘中的每两个相邻的第一焊盘之间的距离为K4 1，第2行第一焊盘中的每两个相邻的第一焊盘之间的距离为K4 2，第3行第一焊盘中的每两个相邻的第一焊盘之间的距离为K4 3，第4行第一焊盘中的每两个相邻的第一焊盘之间的距离为K4 4，第5行第一焊盘中的每两个相邻的第一焊盘之间的距离为K4 5。在这种情况下，K4 1、K4 2、K4 3、K4 4和K4 5的数值逐渐增大，使得越靠近显示区00a用于让胶体从绑定区溢出的通道宽度越大。如此，在将驱动组件111绑定在显示面板000的非显示区00b过程中，第二焊盘011和第一焊盘200之间的ACF 222中多余的胶体，会被挤出至相邻两列第一焊盘200之间的区域内。由于越靠近显示区00a用于让胶体从绑定区溢出的通道宽度越大。因此，被挤出至相邻两列第一焊盘200之间多余的胶体，可以朝靠近显示区00a方向更快的流出绑定区。需要说明的是，图9是以驱动组件111中的多个第二焊盘011的排布方式和尺寸大小与第一焊盘200的排布方式和尺寸大小相同的情况为例进行示意性说明的。在其他可能的实现方式中，驱动组件111中的各个第二焊盘011的尺寸大小均可以相同，本申请实施例对此不做限定。
在本申请实施例中，对于同一列第一焊盘200内两个相邻的第一焊盘200，更靠近显示区00a的第一焊盘200在第二方向D2上的宽度K3比另一个第一焊盘200在第二方向D2上的宽度K3小5％至10％。
示例的，假设距离显示区00a最远的这一行第一焊盘为第1行第一焊盘，距离显示区00a最近的这一行第一焊盘为第N行第一焊盘。且，第1行第一焊盘200中的各个第一焊盘在第一方向D1上的宽度为K1 1，第N行第一焊盘中的各个第一焊盘在第一方向D1上的宽度为K1 N。第1行第一焊盘与第2行第一焊盘之间的距离为K2 1，第N-1行第一焊盘与第N行第一焊盘之间的距离为K2 N-1。第1行第一焊盘中的各个第一焊盘在第二方向D2上的宽度为K3 1，第N行第一焊盘中的各个第一焊盘在第二方向D2上的宽度为K3 N。第1行第一焊盘中每两个相邻的第一焊盘之间的距离为K4 1，第N行第一焊盘中每两个相邻的第一焊盘之间的距离为K4 N。
则，在图8是示出的第一焊盘的排布方式中，各个第一焊盘的尺寸满足以下关系：
K1 1＝K1 2＝……＝K1 N；
K2 1＝K2 2＝……＝K2 N-1；
K3 2＝K3 1－K3 1(5％～10％)，……，K3 N＝K3 N-1－K3 N-1(5％～10％)；
K4 2＝K4 1+K3 1(5％～10％)，……，K4 N＝K4 N-1+K3 N-1(5％～10％)。
第二种可选的实现方式，请参考图10，图10是本申请实施例提供的第二种第一焊盘的排布示意图。不同行中的第一焊盘200在第二方向D2上的宽度K3相等，且各行第一焊盘200中每两个相邻的第一焊盘200之间的距离K4相等。
同一列第一焊盘200内的各个第一焊盘200在第一方向D1上的宽度K1，沿靠近显示区00a的方向逐渐减小。两行相邻的第一焊盘200之间的距离K2，沿靠近显示区00a的方向逐渐增大。这样，可以保证越靠近显示区00a的第一焊盘200在第一衬底100上的正投影的面积越小。如此，第二焊盘011和第一焊盘200之间多余的胶体主要在相邻两行第一焊盘200之间的区域内，在第二方向D2方向上流动。这里，两行第一焊盘200之间的区域可以为让多余的胶体从绑定区域溢出的通道。
在这种情况下，在将驱动组件111绑定在显示面板000的非显示区00b过程中，在第二焊盘011和第一焊盘200之间的ACF 222中多余的胶体，会被挤 出至相邻两行第一焊盘200之间的区域内。并且，由于越靠近显示区00a相邻两行第一焊盘200之间的区域宽度越大，也即是，用于让胶体从绑定区溢出的通道宽度越大。因此，被挤出至相邻两行第一焊盘200之间多余的胶体，在第二方向D2方向上的更快的流出绑定区。
在本申请实施例中，对于同一列第一焊盘200内两个相邻的第一焊盘200，更靠近显示区00a的第一焊盘200在第一方向D1上的宽度K1比另一个第一焊盘200在第一方向D1上的宽度K1小5％至10％。
示例的，假设距离显示区00a最远的这一行第一焊盘为第1行第一焊盘，距离显示区00a最近的这一行第一焊盘为第N行第一焊盘。且，第1行第一焊盘200中的各个第一焊盘在第一方向D1上的宽度为K1 1，第N行第一焊盘中的各个第一焊盘在第一方向D1上的宽度为K1 N。第1行第一焊盘与第2行第一焊盘之间的距离为K2 1，第N-1行第一焊盘与第N行第一焊盘之间的距离为K2 N-1。第1行第一焊盘中的各个第一焊盘在第二方向D2上的宽度为K3 1，第N行第一焊盘中的各个第一焊盘在第二方向D2上的宽度为K3 N。第1行第一焊盘中每两个相邻的第一焊盘之间的距离为K4 1，第N行第一焊盘中每两个相邻的第一焊盘之间的距离为K4 N。
则，在图10是示出的第一焊盘的排布方式中，各个第一焊盘的尺寸满足以下关系：
K1 2＝K1 1－K1 1(5％～10％)，……，K1 N＝K1 N-1－K1 N-1(5％～10％)；
K2 2＝K2 1+K1 1(5％～10％)，……，K2 N-1＝K2 N-2+K1 N-1(5％～10％)；
K3 1＝K3 2＝……＝K3 N；
K4 1＝K4 2＝……＝K4 N。
第三种可选的实现方式，请参考图11，图11是本申请实施例提供的第三种第一焊盘的排布示意图。同一列第一焊盘200内的各个第一焊盘200在第一方向D1上的宽度K1和第二方向D2上的宽度K3，沿靠近显示区00a的方向逐渐减小。各行第一焊盘200内的每两个相邻的第一焊盘200之间的距离K4，沿靠近显示区00a的方向逐渐增大，使得相邻两列第一焊盘200之间的距离沿靠近显示区00a的方向逐渐增大。且两行相邻的第一焊盘200之间的距离K2，沿靠近显示区00a的方向逐渐增大。这样，可以保证越靠近显示区00a的各个第一焊盘200的在第一衬底100上的正投影面积越小。如此，第二焊盘011和第一焊 盘200之间多余的胶体，可以在相邻两行第一焊盘200之间的区域和相邻两列第一焊盘200之间的区域内，且这些多余的胶体可以在第二方向D2方向上流动，也可以在朝靠近显示区00a的方向流动。这里，两行第一焊盘200之间的区域可以为让多余的胶体从绑定区域溢出的通道，两列第一焊盘200之间的区域也可以为让多余的胶体从绑定区域溢出的通道。
在这种情况下，越靠近显示区00a一行第一焊盘200中任意两个相邻的第一焊盘200之间的距离越大，一列第一焊盘200中任意两个相邻的第一焊盘200之间的距离也越大，也即是，用于让胶体从绑定区溢出的宽度通道越大。在将驱动组件111绑定在显示面板000的非显示区00b过程中，在第二焊盘011和第一焊盘200之间的ACF 222中多余的胶体，被挤出至相邻两行第一焊盘200之间的区域和相邻两列第一焊盘200之间的区域内，以使这些多余的胶体中的一部分从第二方向D2方向上流动溢出绑定区，这些多余的胶体中的另一部分从朝靠近显示区00a的方向流动溢出绑定区。
在本申请实施例中，对于同一列第一焊盘200内两个相邻的第一焊盘200，更靠近显示区00a的第一焊盘200在第一方向D1上的宽度K1比另一个第一焊盘200在第一方向D1上的宽度K1小5％至10％。并且，对于同一列第一焊盘200内两个相邻的第一焊盘200，更靠近显示区00a的第一焊盘200在第二方向D2上的宽度K3比另一个第一焊盘200在第二方向D2上的宽度K3小5％至10％。
示例的，假设距离显示区00a最远的这一行第一焊盘为第1行第一焊盘，距离显示区00a最近的这一行第一焊盘为第N行第一焊盘。且，第1行第一焊盘200中的各个第一焊盘在第一方向D1上的宽度为K1 1，第N行第一焊盘中的各个第一焊盘在第一方向D1上的宽度为K1 N。第1行第一焊盘与第2行第一焊盘之间的距离为K2 1，第N-1行第一焊盘与第N行第一焊盘之间的距离为K2 N-1。第1行第一焊盘中的各个第一焊盘在第二方向D2上的宽度为K3 1，第N行第一焊盘中的各个第一焊盘在第二方向D2上的宽度为K3 N。第1行第一焊盘中每两个相邻的第一焊盘之间的距离为K4 1，第N行第一焊盘中每两个相邻的第一焊盘之间的距离为K4 N。
则，在图11是示出的第一焊盘的排布方式中，各个第一焊盘的尺寸满足以下关系：
K1 2＝K1 1－K1 1(5％～10％)，……，K1 N＝K1 N-1－K1 N-1(5％～10％)；
K2 2＝K2 1+K1 1(5％～10％)，……，K2 N-1＝K2 N-2+K1 N-1(5％～10％)；
K3 2＝K3 1－K3 1(5％～10％)，……，K3 N＝K3 N-1－K3 N-1(5％～10％)；
K4 2＝K4 1+K3 1(5％～10％)，……，K4 N＝K4 N-1+K3 N-1(5％～10％)。
此外，若靠近显示区00a的一列第一焊盘200中任意两个相邻的第一焊盘200排布紧密，则距离显示区00a最近的这一行第N行第一焊盘和距离显示区00a最远的这一行第1行第一焊盘之间的距离较小，使得用于让胶体从绑定区溢出的通道长度减小。这样，相邻两行第一焊盘200之间的区域和相邻两列第一焊盘200之间的区域内这些多余的胶体，更容易从相邻两列第一焊盘200之间的通道朝靠近显示区00a的方向流动溢出绑定区。
第四种可选的实现方式，请参考图12，图12是本申请实施例提供的第四种第一焊盘的排布示意图。不同行中的第一焊盘200在第二方向D2上的宽度K3相等，各行第一焊盘200中每两个相邻的第一焊盘200之间的距离K4相等，且每两行相邻的第一焊盘200之间的距离K2相等。
同一列第一焊盘200内的各个第一焊盘200在第一方向D1上的宽度K1，沿靠近显示区00a的方向逐渐减小。这样，绑定区内距离显示区00a最近的一行第一焊盘200和距离显示区00a最远的一行第一焊盘200之间的距离较小，也即是，相邻两列第一焊盘200之间区域的长度较短，用于让胶体从绑定区溢出的通道长度较短。如此，第二焊盘011和第一焊盘200之间多余的胶体主要在相邻两列第一焊盘200之间的区域内，朝靠近显示区00a的方向流动。这里，两列第一焊盘200之间的区域可以为让多余的胶体从绑定区域溢出的通道。
在这种情况下，在将驱动组件111绑定在显示面板000的非显示区00b过程中，第二焊盘011和第一焊盘200之间的ACF 222中多余的胶体，被挤出至相邻两列第一焊盘200之间的区域内。并且，由于绑定区内用于让胶体从绑定区溢出的通道长度较短。因此，被挤出至相邻两列第一焊盘200之间多余的胶体，该多余的胶体向靠近显示区00a的方向流动的距离较短，使得该多余的胶体更容易从相邻两列第一焊盘200之间的通道朝靠近显示区00a的方向溢出绑定区。
在本申请实施例中，对于同一列第一焊盘200内两个相邻的第一焊盘200，更靠近显示区00a的第一焊盘200在第一方向D1上的宽度K1比另一个第一焊 盘200在第一方向D1上的宽度K1小5％至10％。
示例的，假设距离显示区00a最远的这一行第一焊盘为第1行第一焊盘，距离显示区00a最近的这一行第一焊盘为第N行第一焊盘。且，第1行第一焊盘200中的各个第一焊盘在第一方向D1上的宽度为K1 1，第N行第一焊盘中的各个第一焊盘在第一方向D1上的宽度为K1 N。第1行第一焊盘与第2行第一焊盘之间的距离为K2 1，第N-1行第一焊盘与第N行第一焊盘之间的距离为K2 N-1。第1行第一焊盘中的各个第一焊盘在第二方向D2上的宽度为K3 1，第N行第一焊盘中的各个第一焊盘在第二方向D2上的宽度为K3 N。第1行第一焊盘中每两个相邻的第一焊盘之间的距离为K4 1，第N行第一焊盘中每两个相邻的第一焊盘之间的距离为K4 N。
则，在图12是示出的第一焊盘的排布方式中，各个第一焊盘的尺寸满足以下关系：
K1 2＝K1 1－K1 1(5％～10％)，……，K1 N＝K1 N-1－K1 N-1(5％～10％)；
K2 1＝K2 2＝……＝K2 N-1；
K3 1＝K3 2＝……＝K3 N；
K4 1＝K4 2＝……＝K4 N。
第五种可选的实现方式，请参考图13，图13是本申请实施例提供的第五种第一焊盘的排布示意图。每两行相邻的第一焊盘200之间的距离K2相等。
同一列第一焊盘200内的各个第一焊盘200在第一方向D1上的宽度K1和第二方向D2上的宽度K3，沿靠近显示区00a的方向逐渐减小，且各行第一焊盘200内的每两个相邻的第一焊盘200之间的距离K4，沿靠近显示区00a的方向逐渐增大。这里，靠近显示区00a的各个第一焊盘200的在第一衬底100上的正投影面积逐渐减小，相邻两列第一焊盘200之间的距离逐渐增大，绑定区内相邻两列第一焊盘200之间区域的长度较短。如此，第二焊盘和第一焊盘200之间多余的胶体主要在相邻两列第一焊盘200之间的区域内，朝靠近显示区00a的方向流动。这里，两列第一焊盘200之间的区域可以为让多余的胶体从绑定区域溢出的通道。
在这种情况下，在将驱动组件111绑定在显示面板000的非显示区00b过程中，第二焊盘011和第一焊盘200之间的ACF 222中多余的胶体，被挤出至相邻两列第一焊盘200之间的区域内。并且，由于绑定区内相邻两列第一焊盘 200之间区域的长度较短和靠近显示区00a相邻两列第一焊盘200之间的距离较大，也即是，用于让胶体从绑定区溢出的通道长度较短，宽度较大。因此，被挤出至相邻两列第一焊盘200之间多余的胶体，可以更容易从朝靠近显示区00a方向流动，并且溢出绑定区的多余的胶体较多，有效提高了绑定区内的各个第二焊盘011和第一焊盘200的电连接效果。
在本申请实施例中，对于同一列第一焊盘200内两个相邻的第一焊盘200，更靠近显示区00a的第一焊盘200在第一方向D1上的宽度K1比另一个第一焊盘200在第一方向D1上的宽度K1小5％至10％。并且，对于同一列第一焊盘200内两个相邻的第一焊盘200，更靠近显示区00a的第一焊盘200在第二方向D2上的宽度K3比另一个第一焊盘200在第二方向D2上的宽度K3小5％至10％。
示例的，假设距离显示区00a最远的这一行第一焊盘为第1行第一焊盘，距离显示区00a最近的这一行第一焊盘为第N行第一焊盘。且，第1行第一焊盘200中的各个第一焊盘在第一方向D1上的宽度为K1 1，第N行第一焊盘中的各个第一焊盘在第一方向D1上的宽度为K1 N。第1行第一焊盘与第2行第一焊盘之间的距离为K2 1，第N-1行第一焊盘与第N行第一焊盘之间的距离为K2 N-1。第1行第一焊盘中的各个第一焊盘在第二方向D2上的宽度为K3 1，第N行第一焊盘中的各个第一焊盘在第二方向D2上的宽度为K3 N。第1行第一焊盘中每两个相邻的第一焊盘之间的距离为K4 1，第N行第一焊盘中每两个相邻的第一焊盘之间的距离为K4 N。
则，在图11是示出的第一焊盘的排布方式中，各个第一焊盘的尺寸满足以下关系：
K1 2＝K1 1－K1 1(5％～10％)，……，K1 N＝K1 N-1－K1 N-1(5％～10％)；
K2 1＝K2 2＝……＝K2 N-1；
K3 2＝K3 1－K3 1(5％～10％)，……，K3 N＝K3 N-1－K3 N-1(5％～10％)；
K4 2＝K4 1+K3 1(5％～10％)，……，K4 N＝K4 N-1+K3 N-1(5％～10％)。
在本申请中，针对上述几种可选的实现方式中，请参考图14，图14是本申请实施例提供的一种第一焊盘和第二焊盘的示意图。为了避免当第一焊盘200的在第一衬底100上的正投影面积过小时，导致第二焊盘和第一焊盘200电连接的效果较差的情况。本申请，需要保证靠近显示区00a的各个第一焊盘200 在第一衬底100上的正投影的面积不能过小。示例的，最靠近显示区00a的一行第一焊盘200中的每个第一焊盘200在柔性衬底100上正投影的面积需要大于或等于预设面积阈值。这个预设面积阈值为：第二焊盘011在柔性衬底100上的正投影和第一焊盘200在柔性衬底100上的正投影交叠的最小面积。如此，可以保证第二焊盘和第一焊盘200之间的电连接面积较大，进而使得第二焊盘011和第一焊盘200之间的电连接效果较好。需要说明的是，这个预设面积阈值还与ACF 222能够实现有效粘接的面积大小相关。不同类型的ACF 222对应的预设面积阈值不同。
在本申请实施例中，请参考图15，图15是本申请实施例提供的一种第一焊盘的俯视图。第一焊盘200具有多个角部201，角部201可以包括：圆角和倒角中的至少一种。示例的，第一焊盘200在衬底100上的正投影的形状为矩形，第一焊盘200中的角部201的个数为四个，四个角部201分别分布在第一焊盘200的四个顶角处。
在这种情况下，对于多个第一焊盘200中呈两行和两列排布的四个第一焊盘200，通过将这四个第一焊盘200的角部201设置为圆角和倒角中的至少一种，可以使两个第一焊盘200之间的多余胶体更容易的导向用于让多余的胶体流动的通道中。
由于第一焊盘200的角部201可以包括：圆角和倒角中的至少一种，因此本申请实施例将以以下三种情况进行说明。
第一种情况，如图15所示，当角部202为圆角时，圆角的半径R范围为：第一焊盘200在第一方向D1上的宽度K1的10％至50％。
第二种情况，请参考图16，图16是本申请实施例提供的又一种第一焊盘的俯视图。当角部201为倒角时，倒角的斜面201a与第二方向D2的夹角α范围为：15°至45°，且倒角在第二方向D2上的宽度K5的范围为：第一焊盘200在第二方向D2上的宽度K3的10％至20％。
第三种情况，请参考图17，图17是本申请实施例提供的再一种第一焊盘的俯视图。当角部201可以包括：圆角和倒角时，倒角的斜面201a与第二方向D2的夹角α范围为：15°至45°，且倒角在第二方向D2上的宽度K5的范围为：第一焊盘200在第二方向D2上的宽度K3的10％至20％。
圆角的半径R范围为：目标宽度的10％至50％，目标宽度可以为第一焊盘 200在第二方向D2上的宽度K3与两个倒角201a在第二方向D2上的宽度K5的差值。
需要说明的是，对于上述第一种可选的实现方式，如图8和图9所示，当不同行中的第一焊盘200在第一方向D1上的宽度K1相等，且第一焊盘200的角部具有圆角时，第一焊盘200的圆角的半径R可以沿靠近显示区00a的方向逐渐减小。示例的，第1行第一焊盘中的各个第一焊盘200的圆角的半径R为第一焊盘200在第一方向D1上的宽度K1的10％；第2行第一焊盘中的各个第一焊盘200的圆角的半径R为第一焊盘200在第一方向D1上的宽度K1的20％；第3行第一焊盘中的各个第一焊盘200的圆角的半径R为第一焊盘200在第一方向D1上的宽度K1的30％；第4行第一焊盘中的各个第一焊盘200的圆角的半径R为第一焊盘200在第一方向D1上的宽度K1的40％；第5行第一焊盘中的各个第一焊盘200的圆角的半径R为第一焊盘200在第一方向D1上的宽度K1的50％。这样，越靠近显示区00a两个第一焊盘200之间的多余胶体更容易的导向用于让多余的胶体流动的通道中。
对于上述第二种可选的实现方式至第五种可选的实现方式，由于同一列第一焊盘200内的各个第一焊盘200在第一方向D1上的宽度K1，沿靠近显示区00a的方向逐渐减小。且当第一焊盘200的角部具有圆角时，第一焊盘200的圆角的半径R与第一焊盘200在第一方向D1上的宽度K1相关。因此，第一焊盘200的圆角的半径R可以沿靠近显示区00a的方向逐渐减小。
在本申请实施例中，显示面板000中的多个第一焊盘200阵列排布为至少4行。这里，多个第一焊盘200排布的行数可以根据显示面板000中的信号线个数决定。显示面板000中的信号线越多，第一焊盘200排布的行数越多。
在本申请实施例中，请参考图18，图18是本申请实施例提供的一种显示面板的俯视图。显示面板000还可以包括：位于显示区00a内的多条信号线L1，以及位于非显示区00b内的多条扇出引线L2。
其中，多个发光器件排布为多列，一列发光器件与同一条信号线L1电连接，多条信号线L1与多条扇出引线L2一一对应电连接，且多条扇出引线L2与多个第一焊盘200一一对应电连接。这样，条信号线L1可以向显示面板000中的多个发光器件施加电信号，以使发光器件发光。扇出引线L2的一端与信号线L1电连接，扇出引线L2的另一端可以通过第一焊盘200与驱动组件111电连接。 如此，驱动组件111中的电信号可以通过扇出引线L2和条信号线L1向显示面板000中的多个发光器件施加电信号，以使显示面板000能够显示画面。
需要说明的是，在其他可能的实现方式中，一个第一焊盘200也可以对应至少两条扇出引线L2。在这种情况下，与多条两条扇出引线L2电连接的第一焊盘200需要与多路复用器电连接。这样，显示面板000通过多路复用器可以对与第一焊盘200电连接的多条两条扇出引线L2进行分时驱动，以使显示面板000中的发光器件发光。
本申请实施例提供的显示面板，包括：衬底、发光器件和第一焊盘。各行第一焊盘在第一衬底上的正投影的面积，沿靠近显示区的方向逐渐减小，使得越靠近显示区的一行第一焊盘中任意两个相邻的第一焊盘之间的距离越大，和/或，距离显示区最近的一行第一焊盘和距离显示区最远的一行第一焊盘之间的距离较小。并且，在将驱动组件通过ACF与显示面板绑定连接的过程中，在第二焊盘和第一焊盘之间的ACF中多余的胶体被挤出后，该多余的胶体可以朝向靠近显示区的方向流向。如此，当越靠近显示区排布的一行第一焊盘中任意两个相邻的第一焊盘之间的距离越大时，ACF中从第一焊盘与第二焊盘之间挤出的多余胶体可以更快的向靠近显示区的方向流动。同样的，当距离显示区最近的一行第一焊盘和距离显示区最远的一行第一焊盘之间的距离较小时，ACF中从第一焊盘与第二焊盘之间挤出的多余胶体向靠近显示区的方向流动的距离更小，以使该多余的胶体更快的溢出绑定区。这样，第二焊盘和第一焊盘之间多余的胶体不会堆积在绑定区内，使得第二焊盘和第一焊盘之间的导电粒子能够分别与第二焊盘及第一焊盘紧密接触，进而使得第二焊盘和第一焊盘电连接的效果较好，有效的提高了显示面板的显示效果。
本申请实施例还提供了一种驱动组件，请参考图19，图19是本申请实施例提供的一种驱动组件的俯视图。驱动组件111具有器件区11a，以及位于器件区11a一侧的连接区11b，该驱动组件111可以包括：第二衬底010，位于器件区11a内的驱动芯片013，以及位于连接区11b内的多个第二焊盘011。
多个第二焊盘011用于与驱动芯片013电连接，且与显示面板000电连接，且多个第二焊盘011阵列排布为多行，多行第二焊盘011沿背离器件区11a的方向依次分布。这样，驱动组件111中的驱动芯片013可以通过第二焊盘011向与 其电连接的扇出引线L2施加电信号，之后，扇出引线L2可以将该电信号通过条信号线L1施加向显示面板000中的多个发光器件。
其中，各行第二焊盘011在第二衬底010上的正投影的面积，沿背离器件区11a的方向逐渐减小。这样，当驱动组件111和显示面板000通过ACF 222电连接时，第一焊盘200与第二焊盘011能够一一对应电连接，且第一焊盘200与第二焊盘011的电连接效果较好。
在本申请实施例中，驱动组件111还可以包括：位于第二衬底010上与多个接电焊盘300一一对应的第三焊盘012。这样，显示面板000中的接电焊盘300也可以通过ACF 222与驱动组件111中的第三焊盘012电连接，以使驱动组件111中的器件可以接电。
需要说明的是，多个第二焊盘011与多个第一焊盘200是一一对应的，因此，对于驱动组件111中的多个第二焊盘011的排布方式以及各个第二焊盘011的尺寸，可以参考上述关于显示面板的结构描述的实施例中的对应部分。本申请实施例在此不再赘述。
本申请实施例还提供了一种显示面板的制造方法，该显示面板的制造方法用于制造上述实施例示出的显示面板。该显示面板的制造方法可以包括：
在第一衬底上形成多个发光器件和多个第一焊盘。
其中，显示面板具有显示区和位于显示区外围的非显示区，多个发光器件分布在显示区内，多个第一焊盘分布在非显示区内。
多个第一焊盘用于与多个发光器件电连接，且与驱动组件电连接，且多个第一焊盘阵列排布为多行，多行第一焊盘沿背离显示区的方向依次分布。
其中，各行第一焊盘在第一衬底上的正投影的面积，沿靠近显示区的方向逐渐减小。
所属领域的技术人员可以清楚地了解到，为描述的方便和简洁，上述描述的显示面板具体原理，可以参考前述显示面板结构的实施例中的对应内容，在此不再赘述。
本申请实施例还提供了一种显示装置。请参考图20，图20是本申请实施例提供的一种显示装置的示意图。该显示装置可以为：手机、平板电脑、电视机、 显示器、笔记本电脑、数码相框、导航仪等任何具有显示功能的产品或部件。该显示装置可以包括：上述任一的显示面板000和驱动组件，驱动组件可以为柔性电路板，也可以为单独的驱动芯片。当驱动组件为柔性电路板时，驱动芯片可以集成在柔性电路板内，且显示面板000中的多个第一焊盘200与柔性电路板111中的多个第二焊盘011一一对应电连接。当驱动组件为驱动芯片时，驱动芯片也具有与多个第一焊盘200一一对应电连接的第二焊盘011。
在本申请实施例中，该显示装置还可以包括：位于显示面板000和驱动组件111之间的ACF 222。通过ACF 222可以使得显示面板000与驱动组件111电连接。
在本申请中，显示面板可以为OELD显示面板或者有源矩阵有机发光二极体(英文：Active Matrix-Organic Light Emitting Diode；简称：AM-OLED)显示面板。
需要指出的是，在附图中，为了图示的清晰可能夸大了层和区域的尺寸。而且可以理解，当元件或层被称为在另一元件或层“上”时，它可以直接在其他元件上，或者可以存在中间的层。另外，可以理解，当元件或层被称为在另一元件或层“下”时，它可以直接在其他元件下，或者可以存在一个以上的中间的层或元件。另外，还可以理解，当层或元件被称为在两层或两个元件“之间”时，它可以为两层或两个元件之间唯一的层，或还可以存在一个以上的中间层或元件。通篇相似的参考标记指示相似的元件。
在本申请中，术语“第一”和“第二”仅用于描述目的，而不能理解为指示或暗示相对重要性。术语“多个”指两个或两个以上，除非另有明确的限定。
本领域普通技术人员可以理解实现上述实施例的全部或部分步骤可以通过硬件来完成，也可以通过程序来指令相关的硬件完成，所述的程序可以存储于一种计算机可读存储介质中，上述提到的存储介质可以是只读存储器，磁盘或光盘等。
以上所述仅为本申请的可选的实施例，并不用以限制本申请，凡在本申请的精神和原则之内，所作的任何修改、等同替换、改进等，均应包含在本申请的保护范围之内。

Claims (17)

  1. 一种显示面板，其特征在于，所述显示面板具有显示区和位于所述显示区外围的非显示区，所述显示面板包括：
    第一衬底；
    位于所述显示区内的多个发光器件；
    位于所述非显示区内的多个第一焊盘，所述多个第一焊盘用于与所述多个发光器件电连接，且与驱动组件电连接，且所述多个第一焊盘阵列排布为多行，多行所述第一焊盘沿背离所述显示区的方向依次分布；
    其中，各行所述第一焊盘在所述第一衬底上的正投影的面积，沿靠近所述显示区的方向逐渐减小。
  2. 根据权利要求1所述的显示面板，其特征在于，所述多个第一焊盘沿第一方向阵列排布为多行，且沿第二方向阵列排布为多列；
    其中，同一列所述第一焊盘内的各个第一焊盘在所述第一方向上的宽度和/或第二方向上的宽度，沿靠近所述显示区的方向逐渐减小。
  3. 根据权利要求2所述的显示面板，其特征在于，不同行中的第一焊盘在所述第一方向上的宽度相等，且每两行相邻的所述第一焊盘之间的距离相等；
    同一列所述第一焊盘内的各个第一焊盘在所述第二方向上的宽度，沿靠近所述显示区的方向逐渐减小；且各行所述第一焊盘内的每两个相邻的第一焊盘之间的距离，沿靠近所述显示区的方向逐渐增大。
  4. 根据权利要求2所述的显示面板，其特征在于，不同行中的第一焊盘在所述第二方向上的宽度相等，且各行所述第一焊盘中每两个相邻的第一焊盘之间的距离相等；
    同一列所述第一焊盘内的各个第一焊盘在所述第一方向上的宽度，沿靠近所述显示区的方向逐渐减小；且两行相邻的所述第一焊盘之间的距离，沿靠近所述显示区的方向逐渐增大。
  5. 根据权利要求2所述的显示面板，其特征在于，同一列所述第一焊盘内的各个第一焊盘在所述第一方向上的宽度和所述第二方向上的宽度，沿靠近所述显示区的方向逐渐减小；各行所述第一焊盘内的每两个相邻的第一焊盘之间的距离，沿靠近所述显示区的方向逐渐增大；且两行相邻的所述第一焊盘之间的距离，沿靠近所述显示区的方向逐渐增大。
  6. 根据权利要求2所述的显示面板，其特征在于，不同行中的第一焊盘在所述第二方向上的宽度相等，各行所述第一焊盘中每两个相邻的第一焊盘之间的距离相等，且每两行相邻的所述第一焊盘之间的距离相等；
    同一列所述第一焊盘内的各个第一焊盘在所述第一方向上的宽度，沿靠近所述显示区的方向逐渐减小。
  7. 根据权利要求2所述的显示面板，其特征在于，每两行相邻的所述第一焊盘之间的距离相等；
    同一列所述第一焊盘内的各个第一焊盘在所述第一方向上的宽度和所述第二方向上的宽度，沿靠近所述显示区的方向逐渐减小；且各行所述第一焊盘内的每两个相邻的第一焊盘之间的距离，沿靠近所述显示区的方向逐渐增大。
  8. 根据权利要求4-7任一所述的显示面板，其特征在于，对于同一列所述第一焊盘内两个相邻的第一焊盘，更靠近所述显示区的第一焊盘在所述第一方向上的宽度比另一个第一焊盘在所述第一方向上的宽度小5％至10％。
  9. 根据权利要求3、5或7所述的显示面板，其特征在于，对于同一列所述第一焊盘内两个相邻的第一焊盘，更靠近所述显示区的第一焊盘在所述第二方向上的宽度比另一个第一焊盘在所述第二方向上的宽度小5％至10％。
  10. 根据权利要求2-7任一所述的显示面板，其特征在于，所述第一焊盘具有多个角部，所述角部包括：圆角和倒角中的至少一种。
  11. 根据权利要求10所述的显示面板，其特征在于，当所述角部为所述圆角 时，所述圆角的半径范围为：所述第一焊盘在所述第一方向上的宽度的10％至50％。
  12. 根据权利要求10所述的显示面板，其特征在于，当所述角部为所述倒角时，所述倒角的斜面与所述第二方向的夹角范围为：15°至45°，且所述倒角在所述第二方向上的宽度的范围为：所述第一焊盘在所述第二方向上的宽度的10％至20％。
  13. 根据权利要求10所述的显示面板，其特征在于，当所述角部包括：所述圆角和所述倒角时，所述倒角的斜面与所述第二方向的夹角范围为：15°至45°，且所述倒角在所述第二方向上的宽度的范围为：所述第一焊盘在所述第二方向上的宽度的10％至20％；
    所述圆角的半径范围为：目标宽度的10％至50％，所述目标宽度为第一焊盘在所述第二方向上的宽度与两个所述倒角在所述第二方向上的宽度的差值。
  14. 根据权利要求1-7任一所述的显示面板，其特征在于，所述多个第一焊盘阵列排布为至少4行。
  15. 根据权利要求1-7任一所述的显示面板，其特征在于，同一行所述第一焊盘中的各个第一焊盘在所述第一衬底上的正投影的面积相同，且同一行所述第一焊盘中的每两个相邻的第一焊盘之间的距离相同。
  16. 一种驱动组件，其特征在于，所述驱动组件具有器件区，以及位于所述器件区一侧的连接区，所述驱动组件包括：
    第二衬底；
    位于所述器件区内的驱动芯片；
    位于所述连接区内的多个第二焊盘，所述多个第二焊盘用于与所述驱动芯片电连接，且与所述显示面板电连接，且所述多个第二焊盘阵列排布为多行，多行所述第二焊盘沿背离所述器件区的方向依次分布；
    其中，各行所述第二焊盘在所述第二衬底上的正投影的面积，沿背离所述 器件区的方向逐渐减小。
  17. 一种显示装置，其特征在于，包括：权利要求1-15任一显示面板和驱动组件，所述显示面板中的多个第一焊盘与所述驱动组件中的多个第二焊盘一一对应电连接。
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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN205376002U (zh) * 2016-02-04 2016-07-06 京东方科技集团股份有限公司 一种显示装置
CN109523912A (zh) * 2018-12-13 2019-03-26 厦门天马微电子有限公司 显示面板和显示装置
CN113299218A (zh) * 2021-06-01 2021-08-24 厦门天马微电子有限公司 一种显示面板和显示装置
CN113421494A (zh) * 2021-06-22 2021-09-21 合肥维信诺科技有限公司 覆晶薄膜、显示面板及显示装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN205376002U (zh) * 2016-02-04 2016-07-06 京东方科技集团股份有限公司 一种显示装置
CN109523912A (zh) * 2018-12-13 2019-03-26 厦门天马微电子有限公司 显示面板和显示装置
CN113299218A (zh) * 2021-06-01 2021-08-24 厦门天马微电子有限公司 一种显示面板和显示装置
CN113421494A (zh) * 2021-06-22 2021-09-21 合肥维信诺科技有限公司 覆晶薄膜、显示面板及显示装置

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