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WO2022220430A1 - Élément de blindage accouplé à une carte de circuit imprimé et dispositif électrique le comprenant - Google Patents

Élément de blindage accouplé à une carte de circuit imprimé et dispositif électrique le comprenant Download PDF

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Publication number
WO2022220430A1
WO2022220430A1 PCT/KR2022/004069 KR2022004069W WO2022220430A1 WO 2022220430 A1 WO2022220430 A1 WO 2022220430A1 KR 2022004069 W KR2022004069 W KR 2022004069W WO 2022220430 A1 WO2022220430 A1 WO 2022220430A1
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WO
WIPO (PCT)
Prior art keywords
circuit board
disposed
shielding member
plate
electronic device
Prior art date
Application number
PCT/KR2022/004069
Other languages
English (en)
Korean (ko)
Inventor
이정근
선태원
양성광
양현모
윤종민
김승년
Original Assignee
삼성전자 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 삼성전자 주식회사 filed Critical 삼성전자 주식회사
Publication of WO2022220430A1 publication Critical patent/WO2022220430A1/fr

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    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
    • G02B27/01—Head-up displays
    • G02B27/017—Head mounted
    • G02B27/0176—Head mounted characterised by mechanical features
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
    • G02B27/01—Head-up displays
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/002—Casings with localised screening
    • H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
    • H05K9/0024—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
    • G02B27/01—Head-up displays
    • G02B27/017—Head mounted
    • G02B2027/0178—Eyeglass type

Definitions

  • Various embodiments of the present disclosure relate to a shielding member coupled to a circuit board, and an electronic device including the same.
  • An electronic device is a device that performs a specific function according to a loaded program, such as an electronic notebook, a portable multimedia player, a mobile communication terminal, a tablet PC, an image/audio device, a desktop/laptop computer, or a vehicle navigation device from a home appliance. It can mean a device. For example, these electronic devices may output stored information as sound or image. As the degree of integration of electronic devices increases and high-speed and large-capacity wireless communication becomes common, various functions may be mounted in one electronic device such as a mobile communication terminal in recent years. For example, as well as communication functions, entertainment functions such as games, multimedia functions such as music/video playback, communication and security functions for mobile banking, or schedule management or electronic wallet functions are integrated into one electronic device. will be. Such electronic devices are being miniaturized so that users can conveniently carry them.
  • a printed circuit board (PCB) and various electronic components may be disposed inside a housing.
  • the printed circuit board (PCB) may include an area for arranging electrical components and an area for being fixed and supported by the housing.
  • a fixing member and/or a supporting member such as a separate fixing hook, a fixing guide, or a fastening boss is formed inside the housing to fix the printed circuit board, and the fixing member and/or the supporting member may be fastened to the bonding region of the printed circuit board.
  • the mounting area may be decreased.
  • a shielding member coupled to a printed circuit board may be manufactured, and a fixing member and/or a supporting member for coupling to the housing may be coupled to the shielding member. Accordingly, it is possible to improve the mounting space of the electrical components disposed on the printed circuit board.
  • An electronic device includes a housing including a first plate facing a first direction and a second plate facing a second direction opposite to the first direction, wherein the first plate includes the second plate.
  • a housing including a first protruding portion protruding toward a plate, an optical output module disposed in the housing and configured to output an image, and at least one first electrical component disposed in the housing and facing the first plate a circuit board including a first surface disposed thereon, and disposed on the first surface of the circuit board in a state of accommodating the at least one first electrical component, and secured or supported by the first protruding portion It may include a formed first shielding member. The first surface of the circuit board may be spaced apart from the first protruding portion.
  • An electronic device includes a lens frame accommodating a display member, a wearing member extending from the lens frame, and a first case and a second case, wherein the first case is the second case A wearing member including a first protruding portion protruding toward the circuit board, the circuit board including a first surface disposed in the wearing member and on which at least one first electric component is disposed to face the first case, and the at least A first shielding member disposed on the first surface of the circuit board in a state of accommodating one first electrical component and formed to be fixed or supported by the first protruding portion may be included.
  • the first surface of the circuit board may be spaced apart from the first protruding portion.
  • the shielding member coupled to the circuit board is formed to surround an electrical component disposed on the circuit board, and is directly coupled to the housing to form a coupling region on the circuit board for coupling with the housing. can be excluded. Accordingly, it is possible to increase the space in which the printed circuit board electrical components are mounted.
  • the shielding member coupled to the circuit board may provide a flexible shielding sheet disposed in contact with an electrical component, thereby providing efficient shielding performance and heat dissipation performance.
  • the shielding member coupled to the circuit board may provide a member directly coupled to the electrical component and the housing, thereby providing efficient shielding performance and heat transfer function.
  • FIG. 1 is a block diagram of an electronic device in a network environment, according to various embodiments.
  • FIG. 2 is a perspective view of a wearable electronic device according to various embodiments of the present disclosure
  • FIG. 3 is a perspective view illustrating an internal configuration of an electronic device according to one of various embodiments of the present disclosure
  • FIG. 4 is a perspective view illustrating an internal configuration of an electronic device according to another one of various embodiments of the present disclosure.
  • FIG. 5 is an exploded perspective view of an electronic device according to various embodiments of the present disclosure.
  • FIG. 6 is a cross-sectional view illustrating a disposition relationship between a circuit board and a surrounding structure, according to one of various embodiments of the present disclosure.
  • FIG. 7 is a cross-sectional view illustrating a disposition relationship between a circuit board and a peripheral structure according to another one of various embodiments of the present disclosure.
  • FIG. 8 is a cross-sectional view illustrating a disposition relationship between a circuit board and a peripheral structure according to still another one of various embodiments of the present disclosure.
  • FIG. 9 is a projection view of an electronic device showing a shielding member coupled to a circuit board and protruding structures coupled to the shielding member, according to various embodiments of the present disclosure
  • FIG. 1 is a block diagram of an electronic device in a network environment, according to various embodiments of the present disclosure
  • the electronic device 101 communicates with the electronic device 102 through a first network 198 (eg, a short-range wireless communication network) or a second network 199 . It may communicate with the electronic device 104 or the server 108 through (eg, a long-distance wireless communication network). According to an embodiment, the electronic device 101 may communicate with the electronic device 104 through the server 108 .
  • a first network 198 eg, a short-range wireless communication network
  • a second network 199 e.g., a second network 199 . It may communicate with the electronic device 104 or the server 108 through (eg, a long-distance wireless communication network). According to an embodiment, the electronic device 101 may communicate with the electronic device 104 through the server 108 .
  • the electronic device 101 includes a processor 120 , a memory 130 , an input module 150 , a sound output module 155 , a display module 160 , an audio module 170 , and a sensor module ( 176), interface 177, connection terminal 178, haptic module 179, camera module 180, power management module 188, battery 189, communication module 190, subscriber identification module 196 , or an antenna module 197 .
  • at least one of these components eg, the connection terminal 178
  • some of these components are integrated into one component (eg, display module 160 ). can be
  • the processor 120 for example, executes software (eg, the program 140) to execute at least one other component (eg, a hardware or software component) of the electronic device 101 connected to the processor 120 . It can control and perform various data processing or operations. According to one embodiment, as at least part of data processing or operation, the processor 120 converts commands or data received from other components (eg, the sensor module 176 or the communication module 190 ) to the volatile memory 132 . may be stored in , process commands or data stored in the volatile memory 132 , and store the result data in the non-volatile memory 134 .
  • software eg, the program 140
  • the processor 120 converts commands or data received from other components (eg, the sensor module 176 or the communication module 190 ) to the volatile memory 132 .
  • the volatile memory 132 may be stored in , process commands or data stored in the volatile memory 132 , and store the result data in the non-volatile memory 134 .
  • the processor 120 is the main processor 121 (eg, a central processing unit or an application processor), or a secondary processor 123 (eg, a graphic processing unit, a neural network processing unit) that can be operated independently or together with the main processor 121 .
  • NPU neural processing unit
  • image signal processor sensor hub processor, or communication processor
  • the main processor 121 uses less power than the main processor 121 or is set to be specialized for a specified function.
  • the auxiliary processor 123 may be implemented separately from or as a part of the main processor 121 .
  • the secondary processor 123 may, for example, act on behalf of the main processor 121 while the main processor 121 is in an inactive (eg, sleep) state, or when the main processor 121 is active (eg, executing an application). ), together with the main processor 121, at least one of the components of the electronic device 101 (eg, the display module 160, the sensor module 176, or the communication module 190) It is possible to control at least some of the related functions or states.
  • the coprocessor 123 eg, an image signal processor or a communication processor
  • may be implemented as part of another functionally related component eg, the camera module 180 or the communication module 190. have.
  • the auxiliary processor 123 may include a hardware structure specialized for processing an artificial intelligence model.
  • Artificial intelligence models can be created through machine learning. Such learning may be performed, for example, in the electronic device 101 itself on which artificial intelligence is performed, or may be performed through a separate server (eg, the server 108).
  • the learning algorithm may include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but in the above example not limited
  • the artificial intelligence model may include a plurality of artificial neural network layers.
  • Artificial neural networks include deep neural networks (DNNs), convolutional neural networks (CNNs), recurrent neural networks (RNNs), restricted boltzmann machines (RBMs), deep belief networks (DBNs), bidirectional recurrent deep neural networks (BRDNNs), It may be one of deep Q-networks or a combination of two or more of the above, but is not limited to the above example.
  • the artificial intelligence model may include, in addition to, or alternatively, a software structure in addition to the hardware structure.
  • the memory 130 may store various data used by at least one component (eg, the processor 120 or the sensor module 176 ) of the electronic device 101 .
  • the data may include, for example, input data or output data for software (eg, the program 140 ) and instructions related thereto.
  • the memory 130 may include a volatile memory 132 or a non-volatile memory 134 .
  • the program 140 may be stored as software in the memory 130 , and may include, for example, an operating system 142 , middleware 144 , or an application 146 .
  • the input module 150 may receive a command or data to be used by a component (eg, the processor 120 ) of the electronic device 101 from the outside (eg, a user) of the electronic device 101 .
  • the input module 150 may include, for example, a microphone, a mouse, a keyboard, a key (eg, a button), or a digital pen (eg, a stylus pen).
  • the sound output module 155 may output a sound signal to the outside of the electronic device 101 .
  • the sound output module 155 may include, for example, a speaker or a receiver.
  • the speaker can be used for general purposes such as multimedia playback or recording playback.
  • the receiver can be used to receive incoming calls. According to one embodiment, the receiver may be implemented separately from or as part of the speaker.
  • the display module 160 may visually provide information to the outside (eg, a user) of the electronic device 101 .
  • the display module 160 may include, for example, a control circuit for controlling a display, a hologram device, or a projector and a corresponding device.
  • the display module 160 may include a touch sensor configured to sense a touch or a pressure sensor configured to measure the intensity of a force generated by the touch.
  • the audio module 170 may convert a sound into an electric signal or, conversely, convert an electric signal into a sound. According to an embodiment, the audio module 170 acquires a sound through the input module 150 or an external electronic device (eg, a sound output module 155 ) directly or wirelessly connected to the electronic device 101 .
  • the electronic device 102) eg, a speaker or headphones
  • the sensor module 176 detects an operating state (eg, power or temperature) of the electronic device 101 or an external environmental state (eg, a user state), and generates an electrical signal or data value corresponding to the sensed state. can do.
  • the sensor module 176 may include, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, It may include a temperature sensor, a humidity sensor, or an illuminance sensor.
  • the interface 177 may support one or more specified protocols that may be used by the electronic device 101 to directly or wirelessly connect with an external electronic device (eg, the electronic device 102 ).
  • the interface 177 may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.
  • the connection terminal 178 may include a connector through which the electronic device 101 can be physically connected to an external electronic device (eg, the electronic device 102 ).
  • the connection terminal 178 may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (eg, a headphone connector).
  • the haptic module 179 may convert an electrical signal into a mechanical stimulus (eg, vibration or movement) or an electrical stimulus that the user can perceive through tactile or kinesthetic sense.
  • the haptic module 179 may include, for example, a motor, a piezoelectric element, or an electrical stimulation device.
  • the camera module 180 may capture still images and moving images. According to an embodiment, the camera module 180 may include one or more lenses, image sensors, image signal processors, or flashes.
  • the power management module 188 may manage power supplied to the electronic device 101 .
  • the power management module 188 may be implemented as, for example, at least a part of a power management integrated circuit (PMIC).
  • PMIC power management integrated circuit
  • the battery 189 may supply power to at least one component of the electronic device 101 .
  • battery 189 may include, for example, a non-rechargeable primary cell, a rechargeable secondary cell, or a fuel cell.
  • the communication module 190 is a direct (eg, wired) communication channel or a wireless communication channel between the electronic device 101 and an external electronic device (eg, the electronic device 102, the electronic device 104, or the server 108). It can support establishment and communication performance through the established communication channel.
  • the communication module 190 may include one or more communication processors that operate independently of the processor 120 (eg, an application processor) and support direct (eg, wired) communication or wireless communication.
  • the communication module 190 is a wireless communication module 192 (eg, a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module 194 (eg, : It may include a local area network (LAN) communication module, or a power line communication module).
  • a wireless communication module 192 eg, a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module
  • GNSS global navigation satellite system
  • wired communication module 194 eg, : It may include a local area network (LAN) communication module, or a power line communication module.
  • a corresponding communication module among these communication modules is a first network 198 (eg, a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network 199 (eg, legacy It may communicate with an external electronic device through a cellular network, a 5G network, a next-generation communication network, the Internet, or a telecommunication network such as a computer network (eg, LAN or WAN).
  • a first network 198 eg, a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)
  • a second network 199 eg, legacy It may communicate with an external electronic device through a cellular network, a 5G network, a next-generation communication network, the Internet, or a telecommunication network such as a computer network (eg, LAN or WAN).
  • a telecommunication network such as a computer network (eg, LAN
  • the wireless communication module 192 uses subscriber information (eg, International Mobile Subscriber Identifier (IMSI)) stored in the subscriber identification module 196 within a communication network such as the first network 198 or the second network 199 .
  • subscriber information eg, International Mobile Subscriber Identifier (IMSI)
  • IMSI International Mobile Subscriber Identifier
  • the electronic device 101 may be identified or authenticated.
  • the wireless communication module 192 may support a 5G network after a 4G network and a next-generation communication technology, for example, a new radio access technology (NR).
  • NR access technology includes high-speed transmission of high-capacity data (eMBB (enhanced mobile broadband)), minimization of terminal power and access to multiple terminals (mMTC (massive machine type communications)), or high reliability and low latency (URLLC (ultra-reliable and low-latency) -latency communications)).
  • eMBB enhanced mobile broadband
  • mMTC massive machine type communications
  • URLLC ultra-reliable and low-latency
  • the wireless communication module 192 may support a high frequency band (eg, mmWave band) to achieve a high data rate, for example.
  • a high frequency band eg, mmWave band
  • the wireless communication module 192 uses various techniques for securing performance in a high-frequency band, for example, beamforming, massive multiple-input and multiple-output (MIMO), all-dimensional multiplexing. It may support technologies such as full dimensional MIMO (FD-MIMO), an array antenna, analog beam-forming, or a large scale antenna.
  • the wireless communication module 192 may support various requirements defined in the electronic device 101 , an external electronic device (eg, the electronic device 104 ), or a network system (eg, the second network 199 ).
  • the wireless communication module 192 may include a peak data rate (eg, 20 Gbps or more) for realizing eMBB, loss coverage (eg, 164 dB or less) for realizing mMTC, or U-plane latency for realizing URLLC ( Example: Downlink (DL) and uplink (UL) each 0.5 ms or less, or round trip 1 ms or less) can be supported.
  • a peak data rate eg, 20 Gbps or more
  • loss coverage eg, 164 dB or less
  • U-plane latency for realizing URLLC
  • the antenna module 197 may transmit or receive a signal or power to the outside (eg, an external electronic device).
  • the antenna module may include an antenna including a conductor formed on a substrate (eg, a PCB) or a radiator formed of a conductive pattern.
  • the antenna module 197 may include a plurality of antennas (eg, an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network such as the first network 198 or the second network 199 is connected from the plurality of antennas by, for example, the communication module 190 . can be selected. A signal or power may be transmitted or received between the communication module 190 and an external electronic device through the selected at least one antenna.
  • other components eg, a radio frequency integrated circuit (RFIC)
  • RFIC radio frequency integrated circuit
  • the antenna module 197 may form a mmWave antenna module.
  • the mmWave antenna module comprises a printed circuit board, an RFIC disposed on or adjacent to a first side (eg, bottom side) of the printed circuit board and capable of supporting a designated high frequency band (eg, mmWave band); and a plurality of antennas (eg, an array antenna) disposed on or adjacent to a second side (eg, top or side) of the printed circuit board and capable of transmitting or receiving signals of the designated high frequency band. can do.
  • peripheral devices eg, a bus, general purpose input and output (GPIO), serial peripheral interface (SPI), or mobile industry processor interface (MIPI)
  • GPIO general purpose input and output
  • SPI serial peripheral interface
  • MIPI mobile industry processor interface
  • the command or data may be transmitted or received between the electronic device 101 and the external electronic device 104 through the server 108 connected to the second network 199 .
  • Each of the external electronic devices 102 or 104 may be the same as or different from the electronic device 101 .
  • all or part of the operations executed in the electronic device 101 may be executed in one or more of the external electronic devices 102 , 104 , or 108 .
  • the electronic device 101 may perform the function or service itself instead of executing the function or service itself.
  • one or more external electronic devices may be requested to perform at least a part of the function or the service.
  • One or more external electronic devices that have received the request may execute at least a part of the requested function or service, or an additional function or service related to the request, and transmit a result of the execution to the electronic device 101 .
  • the electronic device 101 may process the result as it is or additionally and provide it as at least a part of a response to the request.
  • cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used.
  • the electronic device 101 may provide an ultra-low latency service using, for example, distributed computing or mobile edge computing.
  • the external electronic device 104 may include an Internet of things (IoT) device.
  • the server 108 may be an intelligent server using machine learning and/or neural networks.
  • the external electronic device 104 or the server 108 may be included in the second network 199 .
  • the electronic device 101 may be applied to an intelligent service (eg, smart home, smart city, smart car, or health care) based on 5G communication technology and IoT-related technology.
  • the electronic device may have various types of devices.
  • the electronic device may include, for example, a portable communication device (eg, a smart phone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a home appliance device.
  • a portable communication device eg, a smart phone
  • a computer device e.g., a smart phone
  • a portable multimedia device e.g., a portable medical device
  • a camera e.g., a portable medical device
  • a camera e.g., a portable medical device
  • a camera e.g., a portable medical device
  • a wearable device e.g., a smart bracelet
  • a home appliance device e.g., a home appliance
  • first”, “second”, or “first” or “second” may simply be used to distinguish the component from other such components, and refer to those components in other aspects (e.g., importance or order) is not limited. It is said that one (eg, first) component is “coupled” or “connected” to another (eg, second) component, with or without the terms “functionally” or “communicatively”. When referenced, it means that one component can be connected to the other component directly (eg by wire), wirelessly, or through a third component.
  • module used in various embodiments of this document may include a unit implemented in hardware, software, or firmware, and is interchangeable with terms such as, for example, logic, logic block, component, or circuit.
  • a module may be an integrally formed part or a minimum unit or a part of the part that performs one or more functions.
  • the module may be implemented in the form of an application-specific integrated circuit (ASIC).
  • ASIC application-specific integrated circuit
  • Various embodiments of the present document include one or more instructions stored in a storage medium (eg, internal memory 136 or external memory 138) readable by a machine (eg, electronic device 101).
  • a storage medium eg, internal memory 136 or external memory 138
  • the processor eg, the processor 120
  • the device eg, the electronic device 101
  • the one or more instructions may include code generated by a compiler or code executable by an interpreter.
  • the device-readable storage medium may be provided in the form of a non-transitory storage medium.
  • 'non-transitory' only means that the storage medium is a tangible device and does not contain a signal (eg, electromagnetic wave), and this term is different from the case where data is semi-permanently stored in the storage medium. It does not distinguish between temporary storage cases.
  • a signal eg, electromagnetic wave
  • the method according to various embodiments disclosed in this document may be provided in a computer program product (computer program product).
  • Computer program products may be traded between sellers and buyers as commodities.
  • the computer program product is distributed in the form of a machine-readable storage medium (eg compact disc read only memory (CD-ROM)), or via an application store (eg Play Store TM ) or on two user devices ( It can be distributed (eg downloaded or uploaded) directly or online between smartphones (eg: smartphones).
  • a portion of the computer program product may be temporarily stored or temporarily generated in a machine-readable storage medium such as a memory of a server of a manufacturer, a server of an application store, or a memory of a relay server.
  • each component eg, a module or a program of the above-described components may include a singular or a plurality of entities, and some of the plurality of entities may be separately disposed in other components. have.
  • one or more components or operations among the above-described corresponding components may be omitted, or one or more other components or operations may be added.
  • a plurality of components eg, a module or a program
  • the integrated component may perform one or more functions of each component of the plurality of components identically or similarly to those performed by the corresponding component among the plurality of components prior to the integration. .
  • operations performed by a module, program, or other component are executed sequentially, in parallel, repeatedly, or heuristically, or one or more of the operations are executed in a different order, or omitted. , or one or more other operations may be added.
  • FIG. 2 is a perspective view of a wearable electronic device according to various embodiments of the present disclosure
  • the electronic device 200 is a wearable electronic device in the form of glasses, and a user can visually recognize a surrounding object or environment while wearing the electronic device 200 .
  • the electronic device 200 may be a head mounting device (HMD) or smart glasses capable of providing an image directly in front of the user's eyes.
  • the configuration of the electronic device 200 of FIG. 2 may be the same in whole or part as the configuration of the electronic device 101 of FIG. 1 .
  • the electronic device 200 may include a housing 210 that forms an exterior of the electronic device 200 .
  • the housing 210 may provide a space in which components of the electronic device 200 may be disposed.
  • the housing 210 may include a lens frame 202 and at least one wearing member 203 .
  • the electronic device 200 may include at least one display member 201 capable of providing visual information to the user.
  • the display member 201 may include a module equipped with a lens, a display, a waveguide, and/or a touch circuit.
  • the display member 201 may be transparent or translucent.
  • the display member 201 may include a translucent glass or a window member whose transmittance of light can be adjusted as the color concentration is adjusted.
  • the display member 201 may be provided as a pair, and may be respectively disposed to correspond to the left eye and the right eye of the user while the electronic device 200 is worn on the user's body.
  • the lens frame 202 may accommodate at least a portion of the display member 201 .
  • the lens frame 202 may surround at least a portion of an edge of the display member 201 .
  • the lens frame 202 may position at least one of the display members 201 to correspond to the user's eyes.
  • the lens frame 202 may be a rim of a general eyeglass structure.
  • the lens frame 202 may include at least one closed curve surrounding the display member 201 .
  • the wearing member 203 may extend from the lens frame 202 .
  • the wearing member 203 may extend from an end of the lens frame 202 and may be supported or positioned on the user's body (eg, an ear) together with the lens frame 202 .
  • the wearing member 203 may be rotatably coupled to the lens frame 202 through the hinge structure 229 .
  • the wearing member 203 may include an inner side 231c configured to face the user's body and an outer side 231d opposite to the inner side.
  • the electronic device 200 may include a hinge structure 229 configured to fold the wearing member 203 with respect to the lens frame 202 .
  • the hinge structure 229 may be disposed between the lens frame 202 and the wearing member 203 .
  • the user may carry or store the wearing member 203 by folding the wearing member 203 to partially overlap with the lens frame 202 .
  • 3 is a perspective view illustrating an internal configuration of an electronic device according to one of various embodiments of the present disclosure
  • 4 is a perspective view illustrating an internal configuration of an electronic device according to another one of various embodiments of the present disclosure
  • 5 is an exploded perspective view of an electronic device according to various embodiments of the present disclosure
  • the electronic device 200 includes components accommodated in a housing 210 (eg, at least one circuit board 241 (eg, a printed circuit board (PCB), a printed board assembly (PBA)). , flexible PCB (FPCB) or rigid-flex PCB (RFPCB), at least one battery 243, at least one speaker module 245, at least one power transmission structure 246, and a camera module 250) may include
  • a housing 210 eg, at least one circuit board 241 (eg, a printed circuit board (PCB), a printed board assembly (PBA)
  • FPCB flexible PCB
  • RFPCB rigid-flex PCB
  • the configuration of the housing 210 of FIGS. 3 and 4 may be all or partly the same as the configuration of the display member 201, the lens frame 202, the wearing member 203, and the hinge structure 229 of FIG. 2 . have.
  • the electronic device 200 uses the camera module 250 (eg, the camera module 180 of FIG. 1 ) in a direction that the user looks at or the electronic device 200 is oriented in (eg, the camera module 180 of FIG. 1 ).
  • -Y direction acquires and/or recognizes a visual image of an object or environment
  • an external electronic device eg, the first network 198 or the second network 199 in FIG. 1
  • Information about an object or environment may be provided from the electronic devices 102 and 104 or the server 108 of FIG. 1 .
  • the electronic device 200 may provide the provided information about the object or environment to the user in an acoustic or visual form.
  • the electronic device 200 may provide the provided information about the object or environment to the user through the display member 201 in a visual form using a display module (eg, the display module 160 of FIG. 1 ).
  • the electronic device 200 may implement augmented reality by realizing information about an object or environment in a visual form and combining it with an actual image of a user's surrounding environment.
  • the display member 201 includes a first surface F1 facing a direction (eg, a -Y direction) to which external light is incident and a direction opposite to the first surface F1 (eg, + A second surface F2 facing the Y direction) may be included.
  • a direction eg, a -Y direction
  • a second surface F2 facing the Y direction may be included.
  • at least a portion of the light or image incident through the first surface F1 is a second portion of the display member 201 disposed to face the user's left and/or right eyes. It may be incident to the user's left eye and/or right eye through the surface F2.
  • the lens frame 202 may include at least two or more frames.
  • the lens frame 202 may include a first frame 202a and a second frame 202b.
  • the first frame 202a is a frame of a portion facing the user's face
  • the second frame 202b is attached to the first frame 202a. It may be a part of the lens frame 202 that is spaced apart in the user's gaze direction (eg, -Y direction).
  • the light output module 211 may provide an image and/or an image to a user.
  • the light output module 211 includes a display panel (not shown) capable of outputting an image, and a lens (not shown) corresponding to the user's eye and guiding the image to the display member 201 . can do.
  • the user may obtain an image output from the display panel of the light output module 211 through the lens of the light output module 211 .
  • the light output module 211 may include a device configured to display various information.
  • the light output module 211 may include a liquid crystal display (LCD), a digital mirror device (DMD), a liquid crystal on silicon (LCoS), or an organic light emitting diode.
  • LCD liquid crystal display
  • DMD digital mirror device
  • LCDoS liquid crystal on silicon
  • the electronic device 200 may display the light It may include a light source irradiating light to the display area of the output module 211 and/or the display member 201 .
  • the electronic device 200 does not include a separate light source and provides the user with a light source. A virtual image may be provided.
  • the light output module 211 may be disposed in the housing 210 .
  • the light output module 211 may be disposed on the wearing member 203 or the lens frame 202 to correspond to the user's right eye and left eye, respectively.
  • the light output module 211 may be connected to the display member 201 and provide an image to the user through the display member 201 .
  • an image output from the light output module 211 is incident on the display member 210 through an input optical member positioned at one end of the display member 201 , and is positioned on at least a portion of the display member 210 . It may be radiated toward the user's eye through a waveguide and an output optical member.
  • the waveguide may be made of glass, plastic, or polymer, and may include a nano-pattern formed on one surface inside or outside, for example, a polygonal or curved grating structure. have.
  • the waveguide may include at least one of at least one diffractive element (eg, a diffractive optical element (DOE), a holographic optical element (HOE)) or a reflective element (eg, a reflective mirror).
  • DOE diffractive optical element
  • HOE holographic optical element
  • a reflective element eg, a reflective mirror
  • the circuit board 241 may include components for driving the electronic device 200 .
  • circuit board 241 may include at least one integrated circuit chip, processor 120 , memory 130 , power management module 188 , or communication module of FIG. 1 .
  • At least one of 190 may be provided in the integrated circuit chip.
  • the circuit board 241 may be disposed in the wearing member 203 of the housing 210 .
  • the circuit board 241 may be electrically connected to the battery 243 through the power transmission structure 246 .
  • the circuit board 241 is connected to the flexible printed circuit board 205 and electronic components (eg, the optical output module 211) of the electronic device through the flexible printed circuit board 205; An electric signal may be transmitted to the camera module 250 and the light emitting unit (eg, the light emitting unit 330 of Fig. 5), according to an embodiment, the circuit board 241 may be an interposer substrate.
  • the flexible printed circuit board 205 may extend from the circuit board 241 across the hinge structure 229 into the interior of the lens frame 202 , and from the interior of the lens frame 202 . It may be disposed on at least a portion of the circumference of the display member 201 .
  • the battery 243 (eg, the battery 189 of FIG. 1 ) is a component of the electronic device 200 (eg, the optical output module 211 , the circuit board 241 , and the speaker module 245 ). ), the microphone module 247 , and/or the camera module 250 ) and may supply power to components of the electronic device 200 .
  • the battery 243 may be disposed on the wearing member 203 .
  • the battery 243 may be disposed adjacent to the ends 203a and 203b of the wearing member 203 .
  • the battery 243 may include a first battery 243a disposed at the first end 203a of the wearable member 203 and a second battery 243b disposed at the second end 203b of the wearable member 203 . have.
  • the speaker module 245 may convert an electrical signal into sound. At least a portion of the speaker module 245 may be disposed in the wearing member 203 of the housing 210 . According to an embodiment, the speaker module 245 may be located in the wearing member 203 to correspond to the user's ear. According to an embodiment (eg, FIG. 3 ), the speaker module 245 may be disposed on the circuit board 241 . For example, the speaker module 245 may be disposed between the circuit board 241 and the inner case (eg, the inner case 231 of FIG. 5 ). According to an embodiment (eg, FIG. 4 ), the speaker module 245 may be disposed next to the circuit board 241 . For example, the speaker module 245 may be disposed between the circuit board 241 and the battery 243 .
  • the electronic device 200 may include a speaker module 245 and a connection member 248 connected to the circuit board 241 .
  • the connection member 248 may transmit at least a portion of the sound and/or vibration generated by the speaker module 245 to the circuit board 241 .
  • the connection member 248 may be integrally formed with the speaker module 245 .
  • a portion extending from the speaker frame of the speaker module 245 may be interpreted as the connection member 248 .
  • the connecting member 248 may be omitted.
  • the connection member 248 may be omitted when the speaker module 245 is disposed on the circuit board 241 omitted.
  • the power transmission structure 246 may transmit power from the battery 243 to an electronic component (eg, the light output module 211 ) of the electronic device 200 .
  • the power transmission structure 246 is electrically connected to the battery 243 and/or the circuit board 241 , and the circuit board 241 transmits power received through the power transmission structure 246 to an optical output. may be transmitted to the module 211 .
  • the power delivery structure 246 may be a configuration capable of delivering power.
  • the power delivery structure 246 may include a flexible printed circuit board or wire.
  • the wire may include a plurality of cables (not shown).
  • the shape of the power transmission structure 246 may be variously modified in consideration of the number and/or type of cables.
  • the microphone module 247 may convert a sound into an electrical signal.
  • the microphone module 247 may be disposed on at least a portion of the lens frame 202 .
  • the at least one microphone module 247 may be disposed at a lower end (eg, in a direction toward the -X axis) and/or at an upper end (eg, in a direction toward the X axis) of the electronic device 200 .
  • the electronic device 200 may more clearly recognize the user's voice by using voice information (eg, sound) acquired from the at least one microphone module 247 .
  • the electronic device 200 may distinguish the voice information from the ambient noise based on the acquired voice information and/or additional information (eg, low-frequency vibration of the user's skin and bones). For example, the electronic device 200 may clearly recognize the user's voice and may perform a function of reducing ambient noise (eg, noise canceling).
  • additional information eg, low-frequency vibration of the user's skin and bones.
  • the electronic device 200 may clearly recognize the user's voice and may perform a function of reducing ambient noise (eg, noise canceling).
  • the camera module 250 may capture a still image and/or a video.
  • the camera module 250 may include at least one of a lens, at least one image sensor, an image signal processor, and a flash.
  • the camera module 250 may be disposed in the lens frame 202 and disposed around the display member 201 .
  • the camera module 250 may include at least one first camera module 251 .
  • the first camera module 251 may photograph the user's eye (eg, a pupil) or the trajectory of the gaze.
  • the first camera module 251 may photograph the reflection pattern of the light emitted by the light emitting unit (eg, the light emitting unit 330 of FIG. 5 ) to the user's eyes.
  • the light emitting unit 330 may emit light in an infrared band for tracking the trajectory of the gaze using the first camera module 251 .
  • the light emitting unit 330 may include an IR LED.
  • the processor eg, the processor 120 of FIG.
  • the first camera module 251 may include a global shutter (GS) type camera, and use a plurality of first camera modules 251 having the same standard and performance to protect the user's eyes or The trajectory of the gaze can be traced.
  • GS global shutter
  • the first camera module 251 periodically or aperiodically transmits information (eg, trajectory information) related to the trajectory of the user's eyes or gaze to the processor (eg, the processor 120 of FIG. 1 ). can be sent to According to another embodiment, when the first camera module 251 detects that the user's gaze has changed based on the trajectory information (eg, the eyes move more than a reference value while the head is not moving), the first camera module 251 processes the trajectory information can be sent to
  • the camera module 250 may include a second camera module 253 .
  • the second camera module 253 may capture an external image.
  • the second camera module 253 may be a global shutter type or a rolling shutter (RS) type camera.
  • the second camera module 253 may capture an external image through the second optical hole 223 formed in the second frame 202b.
  • the second camera module 253 may include a high-resolution color camera, and may be a high resolution (HR) or photo video (PV) camera.
  • the second camera module 253 may provide an auto focus (AF) function and an optical image stabilizer (OIS) function.
  • AF auto focus
  • OIS optical image stabilizer
  • the electronic device 200 may include a flash (not shown) positioned adjacent to the second camera module 253 .
  • a flash may provide light to increase brightness (eg, illuminance) around the electronic device 200 when an external image of the second camera module 253 is acquired, in a dark environment; It is possible to reduce the difficulty of acquiring an image due to the incorporation of various light sources, and/or the reflection of light.
  • the camera module 250 may include at least one third camera module 255 .
  • the third camera module 255 may photograph a user's motion through the first optical hole 221 formed in the lens frame 202 .
  • the third camera module 255 may photograph a user's gesture (eg, a hand gesture).
  • the third camera module 255 and/or the first optical hole 221 is formed at both side ends of the lens frame 202 (eg, the second frame 202b), for example, the lens frame 202 in the X direction. (eg, the second frame 202b) may be disposed at both ends.
  • the third camera module 255 may be a global shutter (GS) type camera.
  • GS global shutter
  • the third camera module 255 may provide 360-degree spatial (eg omnidirectional), positional, and/or movement recognition with a camera that supports 3DoF (degrees of freedom), or 6DoF.
  • the third camera module 255 uses a plurality of global shutter-type cameras of the same standard and performance as a stereo camera to perform simultaneous localization and mapping (SLAM) and user movement recognition. function can be performed.
  • the third camera module 255 may include an infrared (IR) camera (eg, a time of flight (TOF) camera, or a structured light camera).
  • the IR camera may be operated as at least a part of a sensor module (eg, the sensor module 176 of FIG. 1 ) for detecting a distance to the subject.
  • the first camera module 251 and the third camera module 255 may be replaced with a sensor module (eg, the sensor module 176 of FIG. 1 ).
  • the sensor module may include at least one of a vertical cavity surface emitting laser (VCSEL), an infrared sensor, and/or a photodiode.
  • the photodiode may include a positive intrinsic negative (PIN) photodiode or an avalanche photodiode (APD).
  • PIN positive intrinsic negative
  • APD avalanche photodiode
  • the photodiode may be referred to as a photo detector or a photo sensor.
  • At least one of the first camera module 251 , the second camera module 253 , and the third camera module 255 may include a plurality of camera modules (not shown).
  • the second camera module 253 includes a plurality of lenses (eg, wide-angle and telephoto lenses) and image sensors, and is disposed on one side (eg, a side facing the -Y axis) of the electronic device 200 .
  • the electronic device 200 may include a plurality of camera modules each having different attributes (eg, angle of view) or functions, and change the angle of view of the camera module based on a user's selection and/or trajectory information. can be controlled to do so.
  • at least one of the plurality of camera modules may be a wide-angle camera, and at least the other may be a telephoto camera.
  • the processor acquires using at least one of a gesture sensor, a gyro sensor, or an acceleration sensor of a sensor module (eg, the sensor module 176 of FIG. 1 ) Movement of the electronic device 200 using information on one electronic device 200 and a user's motion acquired using the third camera module 255 (eg, the user's body approaches to the electronic device 200) and/or the user's movement may be determined.
  • the electronic device 200 uses a magnetic (geomagnetic) sensor capable of measuring an orientation using a magnetic field and a magnetic force in addition to the described sensor, and/or a strength of a magnetic field to provide movement information (eg, movement). direction or movement distance) may be included.
  • the processor may determine the movement of the electronic device 200 and/or the movement of the user based on information obtained from the magnetic (geomagnetic) sensor and/or the Hall sensor.
  • the electronic device 200 may perform an input function (eg, a touch and/or a pressure sensing function) capable of interacting with a user.
  • a component configured to perform a touch and/or pressure sensing function eg, a touch sensor and/or a pressure sensor
  • the electronic device 200 may control the virtual image output through the display member 201 based on the information obtained through the component.
  • a sensor related to a touch and/or pressure sensing function may be a resistive type, a capacitive type, an electro-magnetic type (EM), or an optical type.
  • EM electro-magnetic type
  • the components configured to perform the touch and/or pressure sensing function may be all or partly the same as the configuration of the input module 150 of FIG. 1 .
  • the electronic device 200 may include the reinforcing member 260 disposed in the inner space of the lens frame 202 and formed to have a higher rigidity than that of the lens frame 202 .
  • the electronic device 200 may include a lens structure 270 .
  • the lens structure 270 may refract at least a portion of light.
  • the lens structure 270 may be a prescription lens with a specified refractive power.
  • the lens structure 270 may be disposed behind (eg, in the +Y direction) of the second window member (not shown) of the display member 201 .
  • the lens structure 270 may be positioned between the display member 201 and the user's eye.
  • the lens structure 270 may face one surface of the display member.
  • the housing 210 may include a hinge cover 227 that may conceal a portion of the hinge structure 229 . Another portion of the hinge structure 229 may be accommodated or concealed between the inner case 231 and the outer case 233 to be described later.
  • the wearing member 203 may include an inner case 231 and an outer case 233 .
  • the inner case 231 is, for example, a case configured to face the user's body or directly contact the user's body, and may be made of a material having low thermal conductivity, for example, a synthetic resin.
  • the inner case 231 may include an inner side (eg, the inner side 231c of FIG. 2 ) facing the user's body.
  • the outer case 233 may include, for example, a material (eg, a metal material) capable of at least partially transferring heat, and may be coupled to the inner case 231 to face the inner case 231 .
  • the outer case 233 may include an outer side opposite to the inner side 231c (eg, the outer side 231d of FIG. 2 ).
  • at least one of the circuit board 241 and the speaker module 245 may be accommodated in a space separated from the battery 243 in the wearing member 203 .
  • the inner case 231 includes a first case 231a including a circuit board 241 and/or a speaker module 245 and a second case 231b for accommodating the battery 243 .
  • the outer case 233 may include a third case 233a coupled to face the first case 231a, and a fourth case 233b coupled to face the second case 231b.
  • first case 231a and the third case 233a are coupled (hereinafter, 'first case parts 231a and 233a') to accommodate the circuit board 241 and/or the speaker module 245 .
  • the second case 231b and the fourth case 233b may be coupled (hereinafter, 'second case parts 231b and 233b') to accommodate the battery 243 .
  • the first case portions 231a and 233a are rotatably coupled to the lens frame 202 through the hinge structure 229 , and the second case portions 231b and 233b are connected to the connection structure 235 . It may be connected or mounted to the ends of the first case parts 231a and 233a through the .
  • a portion of the connection structure 235 in contact with the user's body may be made of a material having low thermal conductivity, for example, an elastic material such as silicone, polyurethane, or rubber.
  • the part that does not come into contact with the user's body may be made of a material with high thermal conductivity (eg, a metal material).
  • connection structure 235 blocks heat from being transferred to a portion in contact with the user's body, and heat is transferred through a portion that does not contact the user's body. It can be dispersed or released.
  • connection structure 235 configured to contact the user's body may be interpreted as a part of the inner case 231 , and a portion of the connection structure 235 that does not contact the user's body is an outer case ( 233) can be interpreted as part of the According to an embodiment (not shown), the first case 231a and the second case 231b are integrally configured without the connection structure 235 , and the third case 233a and the fourth case 233b are connected to each other. It may be integrally configured without the structure 235 . According to various embodiments, other components (eg, the antenna module 197 of FIG.
  • the network (eg, the first example of FIG. 1 ) may be included.
  • Information about a thing or environment may be provided from an external electronic device (eg, the electronic devices 102 and 104 or the server 108 of FIG. 1 ) through the first network 198 or the second network 199 ). .
  • the electronic device 200 is described using a wearable electronic device in the form of glasses as an example, but the present disclosure is not limited thereto.
  • the electronic device 200 may include a device that performs a specific function according to a loaded program, such as an electronic notebook, a portable multimedia player, a mobile communication terminal, a tablet PC, an image/sound device, a desktop/laptop computer, and a vehicle navigation system. may mean, and the present disclosure is applicable to all electronic devices on which a circuit board is mounted among these electronic devices.
  • FIG. 6 is a cross-sectional view illustrating a disposition relationship between a circuit board and a surrounding structure, according to one of various embodiments of the present disclosure.
  • the electronic device 200 includes a housing 210 , a light output module (eg, the light output module 211 of FIGS. 3 and 4 ), a circuit board 241 , and a first shielding member 410 .
  • a light output module eg, the light output module 211 of FIGS. 3 and 4
  • a circuit board 241 e.g. the circuit board 241 of FIGS. 3 and 4
  • a first shielding member 410 may include.
  • the configuration of the housing 210 , the light output module 211 , and the circuit board 241 of FIG. 6 includes the housing 210 , the light output module 211 , and the circuit board 241 of FIGS. 3 and 4 . Some or all of the composition may be the same.
  • the housing 210 is configured to form the exterior of the electronic device 200 and may provide a space in which components may be disposed.
  • the housing 210 includes a first plate 310 facing a first direction (+Z-axis direction), and a second plate facing a second direction (-Z-axis direction) opposite to the first direction (+Z-axis direction).
  • 320 may be included.
  • the first plate 310 may be a part of the inner case 231 of FIG. 5
  • the second plate 320 may be 5 may be a part of the outer case 233 .
  • the first plate 310 may be a part of the outer case 233 of FIG. 5
  • the second plate 320 may be 5 may be a part of the inner case 231 .
  • various structures may be formed on the inner surface of the housing 210 according to the arrangement of electronic components disposed inside the electronic device 200 or the bonding structure between the housing 210 and the internal electronic component.
  • a space for accommodating the circuit board 241 and/or electrical components (eg, integrated circuit chips) mounted on the circuit board 241 may be formed in the housing 210
  • the circuit board 241 and /or the space for accommodating the integrated circuit chips may be formed in a recessed shape or a structure such as a rib surrounding the integrated circuit chip.
  • the first plate 310 may include a plurality of first protruding portions 311 protruding toward the second plate 320 .
  • the plurality of first protruding parts 311 are various for fixing or guiding the circuit board 241 and/or the first electrical components 421 and 422 disposed between the first plate 310 and the second plate 320 . shape can be designed.
  • the second plate 320 may include a plurality of second protruding parts 321 protruding toward the first plate 310 .
  • the plurality of second protruding parts 321 are various for fixing or guiding the circuit board 241 and/or the second electrical components 423 disposed between the first plate 310 and the second plate 320 . shape can be designed.
  • the circuit board 241 coupled to the first shielding member 410 includes a plurality of first protruding portions 311 and a plurality of first protruding portions 311 and a plurality of portions between the first plate 310 and the second plate 320 . It is supported and fixed by the dog's second protruding parts 321 , so movement may be restricted.
  • at least one of the plurality of second protruding portions 321 is disposed in contact with the second surface 330b of the circuit board 241 (eg, a surface facing the second plate 320 ), and thus the circuit Movement of the substrate 241 in the direction of the second plate 320 may be restricted.
  • at least one of the first protruding portions 311 may include a first shielding member ( 410 , the circuit board 241 may limit movement in the direction of the first plate 310 .
  • At least one 1-1 protruding part 311a of the plurality of first protruding parts 311 faces the circuit board 241 and/or the 1-1 electrical component 421 . can be arranged to do so.
  • the 1-1 protruding portion 311a may have a flat end and may be disposed in contact with the outer surface of the first shielding member 410 shielding the 1-1 electrical component 421 .
  • the first surface 330a of the circuit board 241 and the first shielding member 410 are designed to be coupled by, for example, a soldering method or a conductive adhesive member, and at least one 1-1 protruding part ( 311a is disposed to press the first shielding member 410 in the second direction (-Z-axis direction), thereby limiting the movement of the circuit board 241 .
  • At least one 1-2 protruding part 311b of the plurality of first protruding parts 311 may be formed along the edge of the first shielding member 410 by the second plate 320 or It may be formed to protrude toward the circuit board 241 .
  • At least one 1-2 protrusion part 311b is disposed along a side surface of the first shielding member 410 coupled to the circuit board 241 , so that the first shielding member 410 and the circuit board 241 are separated from each other. Movement in a third direction perpendicular to the first direction (+Z-axis direction) and/or the second direction (-Z-axis direction) may be restricted.
  • At least one of the first 1-3 protruding parts 311c among the plurality of first protruding parts 311 is a guide part 3111 disposed along an edge of the first shielding member 410 . and a hook end 3112 protruding toward the first shielding member 410 .
  • the guide part 3111 is disposed along the outer surface of the first shielding member 410 coupled to the circuit board 241 , the first shielding member 410 moves in the first direction (+Z-axis direction) and/or the second Movement in a third direction perpendicular to the second direction (-Z-axis direction) may be restricted.
  • the hook end 3112 may be manufactured in a through hook shape so as to be inserted into a hole or groove-shaped recess formed on the outer surface of the first shielding member 410 , and thus, the first portion coupled to the circuit board 241 .
  • the shielding member 410 may be fixed so as not to deviate from a designated position.
  • the circuit board 241 may provide a space for mounting a plurality of electrical components (eg, an integrated circuit chip).
  • the circuit board 241 includes a first surface 330a facing the first plate 310 and a second surface 330b facing the second plate 320 , the first surface 330a and / Alternatively, a plurality of electrical components 421 , 422 , and 423 may be mounted on the second surface 330b.
  • the first surface 330a of the circuit board 241 may be spaced apart from the plurality of first protruding portions 311 of the first plate 310 .
  • the second surface 330b of the circuit board 241 may be disposed in contact with the plurality of second protruding portions 321 of the second plate 320 .
  • first electrical components 421 and 422 may be disposed on the first surface 330a of the circuit board 241 .
  • the first surface 330a of the circuit board 241 may include at least one 1-1 region S11 and at least one 1-2 region S12 adjacent to the 1-1 region S11. can When viewed from above the first plate 310 by projecting the internal structure, at least a portion of the 1-1 region S11 of the circuit board 241 is the 1-1 protrusion 311a of the first plate 310 . ) and overlapping regions.
  • the first shielding member 410 (eg, the first connection part 410a) is interposed therebetween, and the It may be a region facing the 1-1 protrusion 311a.
  • the 1-2 th region S12 of the circuit board 241 may be a region that does not overlap the 1-1 th protruding part 311a among the first protruding parts 311 of the first plate 310 . .
  • the height (eg, thickness) of the electrical components that can be mounted on the 1-1 region S11 of the circuit board 241 is the height (eg, thickness) of the electrical components mounted on the 1-2 th region S12 of the circuit board 241 . It may be smaller than the height of possible electrical components.
  • the 1-1 region S11 only electrical components (eg, the 1-1 electrical component 421) having a height of d1 or less may be mounted by the 1-1 protrusion part 311a.
  • the 1-2 region S12 there is no separate structure in the first direction (+Z-axis direction), so electrical components having a height of d2 or less (eg, 1-2 electric parts relatively larger than d1) are not present. component 422) may be mounted.
  • each component may have a different size (eg, height), so that the 1-2 first area S12 may be divided into two or more areas. have.
  • second electrical components 423 may be disposed on the second surface 330b of the circuit board 241 . As the second protruding parts 321 are disposed in contact with one region of the second surface 330b of the circuit board 241 , the second electrical components 423 are formed except for the region where the second protruding part 321 is located. can be placed in the area.
  • At least some of the first electrical components 421 and 422 and/or the second electrical components 423 are heat sources that generate heat, for example, a power management integrated circuit (PMIC), a PAM (power management integrated circuit) It may include at least one of a power amplifier), an application processor (AP), a communication processor (CP), a charger integrated circuit (IC), and a DC converter.
  • PMIC power management integrated circuit
  • PAM power management integrated circuit
  • It may include at least one of a power amplifier
  • AP application processor
  • CP communication processor
  • IC charger integrated circuit
  • DC converter DC converter
  • the first shielding member 410 is disposed on the first surface 330a of the circuit board 241 in a state of accommodating the first electrical components 421 and 422 of the circuit board 241, It may be formed to be fixed and/or supported by the first protruding parts 311 .
  • the first shielding member 410 provides a shielding function against electromagnetic waves that may be generated by the first electrical components 421 and 422 and generates heat that may be generated by the first electrical components 421 and 422 to the first electrical component ( 421,422) may provide a heat conduction function for transferring to the outside.
  • the first shielding member 410 may have a flexible structure and may be formed to entirely surround the first electrical components 421 and 422 .
  • the first shielding member 410 may have a flexible structure and may be formed to entirely surround the first electrical components 421 and 422 .
  • at least a portion may form an inclined surface and/or a curved surface.
  • the flexible structure of the first shielding member 410 includes a plurality of components (eg, 1-1) having different heights disposed on the first surface 330a of the circuit board 241 .
  • the electrical component 421 and the 1-2-th electrical component 422 may be entirely covered.
  • the first shielding member 410 performs pre-forming to cover parts having different heights using a silicone compression jig, and includes an inclined surface or a curved surface through the pre-forming. can provide
  • the first shielding member 410 has a three-dimensional shape (eg, conformal type) structure to encapsulate parts of various sizes and shapes disposed on the circuit board 241 into a single sheet paper. and can provide a shielding function through it.
  • the first shielding member 410 may be provided by designing at least one of stainless steel (SUS), nickel silver, graphite, copper, or electromagnetic interference (EMI) paint in the form of a sheet or plate advantageous for shielding.
  • the first shielding member 410 is a first protrusion of the housing 210 to support the circuit board 241 and/or the first electrical components 421 and 422 in the housing 210 . It may be directly connected and/or coupled to the portions 311 .
  • the first protruding portions 311 are disposed in direct contact with one region of the first shielding member 410 rather than the first surface 330a of the circuit board 241, and thus the circuit board 241 is attached to the housing ( 210) may be supported and/or secured within.
  • As the first protruding parts 311 are spaced apart from the circuit board 241 , a space in which the first electrical components 421 and 422 can be mounted on the circuit board 241 may be expanded.
  • the first shielding member 410 may include first connecting portions 410a connected to (eg, in contact with) the first protruding portions 311 .
  • the first connection parts 410a of the first shielding member 410 are at least one 1-1 connection part 411 spaced apart from the middle region of the circuit board 241 , and in the edge region of the circuit board 241 . It may include at least one 1-2 connection part 412 and a 1-3 th connection part 413 for fixing the circuit board 241 not to move.
  • the at least one 1-1 connection portion 411 of the first shielding member 410 is a portion connected to the 1-1 protrusion portion 311a, and is a portion connected to the middle region (eg, the circuit board 241 ).
  • the 1-1 connection part 411 of the shielding member 410 may be disposed in direct contact with the 1-1 protrusion part 311a to support the intermediate region of the circuit board 241 so as not to be bent.
  • at least one 1-2 connection portion 412 and a 1-3 connection portion 413 of the first shielding member 410 are disposed along an edge region of the circuit board 241 , It is in direct contact with the 1-2 protrusion part 311b and the 1-3 protrusion part 311c, and vibration of the circuit board 241 may be prevented.
  • one region of the 1-3 connection part 413 may include a recess in the shape of a groove or a hole in which the hook end 3112 of the 1-3 protrusion part 311c may be located.
  • the 1-3 connecting portion 413 includes a recess corresponding to the hook end 3112 so that the hook end 3112 of the 1-3 protruding portion 311c can be inserted and fixed, so that the circuit Side fixing of the first shielding member 410 coupled to the substrate 241 may be provided.
  • FIG. 7 is a cross-sectional view illustrating a disposition relationship between a circuit board and a peripheral structure according to another one of various embodiments of the present disclosure.
  • the electronic device 200 includes a housing 210 , a light output module (eg, the light output module 211 of FIGS. 3 and 4 ), a circuit board 241 , a first shielding member 410 , and a second shielding member 430 .
  • the configuration of the housing 210 and the circuit board 241 of FIG. 7 is the same as that of the housing 210 , the light output module 211 , and the circuit board 241 of FIGS. 2 to 5 in part or in whole can do.
  • the configuration of the first shielding member 410 of FIG. 7 may be partially or entirely the same as the configuration of the first shielding member 410 of FIG. 6 .
  • the housing 210 is configured to form the exterior of the electronic device 200 and may provide a space in which components may be mounted.
  • the housing 210 includes a first plate 310 facing a first direction (+Z-axis direction), and a second plate facing a second direction (-Z-axis direction) opposite to the first direction (+Z-axis direction). 320 may be included.
  • various structures may be formed on the inner surface of the housing 210 according to the arrangement of electronic components disposed inside the electronic device 200 or the bonding structure between the housing 210 and the internal electronic component.
  • the circuit board 241 coupled to the first shielding member 410 and the second shielding member 430 is disposed between the first plate 310 and the second plate 320 , and a plurality of first It is supported and fixed by the protruding parts 311 and the plurality of second protruding parts 321 , so that movement may be restricted.
  • the first plate 310 may include a plurality of first protruding portions 311 protruding toward the second plate 320 .
  • the plurality of first protruding parts 311 are various for fixing or guiding the circuit board 241 and/or the first electrical components 421 and 422 disposed between the first plate 310 and the second plate 320 . shape can be designed.
  • the configuration of the portion 311c includes at least one 1-1 protrusion part 311a, at least one 1-2 protrusion part 311b, and at least one 1-3 protrusion part 311c of FIG. 6 . configuration can be applied mutatis mutandis.
  • the second plate 320 may include a plurality of second protruding parts 321 protruding toward the first plate 310 .
  • the plurality of second protruding parts 321 are various for fixing or guiding the circuit board 241 and/or the second electrical components 423,424 disposed between the first plate 310 and the second plate 320 . shape can be designed.
  • At least one 2-1 protrusion part 321a of the plurality of second protrusion parts 321 faces the circuit board 241 and/or the 2-1 th electrical component 423 . can be arranged to do so.
  • the 2-1 protrusion portion 321a may have a flat end and may be disposed in contact with the outer surface of the second shielding member 430 shielding the 2-1 th electrical components 423 .
  • the second surface 330b of the circuit board 241 and the second shielding member 430 are designed to be coupled to each other, and at least one 2-1 protrusion portion 321a forms the second shielding member 430 . It is arranged to press in one direction (+Z-axis direction), so that movement of the circuit board 241 can be restricted.
  • At least one 2-2 protrusion part 321b of the plurality of second protrusion parts 321 may be formed along the edge of the second shielding member 430 by the first plate 310 or It may be formed to protrude toward the circuit board 241 .
  • At least one 2-2 protrusion part 321b is disposed along the outer surface of the second shielding member 430 coupled to the circuit board 241 , so that the second shielding member 430 moves in the first direction (+Z). axial direction) and/or movement in a third direction perpendicular to the second direction (-Z-axis direction) may be restricted.
  • At least one 2-3 protrusion part 321c of the plurality of second protrusion parts 321 includes a guide part and a second part disposed along an edge of the second shielding member 430 . It may include a hook end protruding toward the shielding member 430 .
  • the guide portion is disposed along the outer surface of the second shielding member 430 coupled to the circuit board 241, the second shielding member 430 moves in the first direction (+Z-axis direction) and/or in the second direction ( -Z-axis direction) and the third direction perpendicular to the movement can be restricted.
  • the hook end may be manufactured in a through hook shape to be inserted into a hole or groove-shaped recess formed on the outer surface of the second shielding member 430 , and thus the second shielding member coupled to the circuit board 241 ( 430) can be fixed so as not to deviate from the designated position.
  • the position of the 2-3 protruding portion 321c is not limited to one side of the second shielding member 430 as shown in FIG. 7 , and various design changes can be made to be disposed on the other side or both sides.
  • the circuit board 241 may provide a space in which a plurality of electrical components (eg, integrated circuit chips) may be disposed.
  • the circuit board 241 includes a first surface 330a facing the first plate 310 and a second surface 330b facing the second plate 320 , the first surface 330a and / Alternatively, a plurality of electrical components 421 , 422 , 423,424 may be mounted on the second surface 330b .
  • the first surface 330a of the circuit board 241 may be spaced apart from the plurality of first protruding portions 311 of the first plate 310 .
  • the second surface 330b of the circuit board 241 may be spaced apart from the plurality of second protruding portions 321 of the second plate 320 .
  • first electrical components 421 and 422 may be disposed on the first surface 330a of the circuit board 241 .
  • the relationship between the first electrical components 421 and 422 mounted on the first surface 330a of the circuit board 241 and the first protruding parts 311 of the first plate 310 applies the configuration of FIG. 6 mutatis mutandis. can do.
  • second electrical components 423,424 may be disposed on the second surface 330b of the circuit board 241 .
  • the second surface 330b of the circuit board 241 may include a 2-1 region S21 and at least one 2-2 region S22 adjacent to the 2-1 region S21.
  • the 2-1-th region S21 may be a region at least partially facing the 2-1-th protruding part 321a
  • the 2-2nd region S22 is a second protruding part ( 321) may be an area that does not face them. Accordingly, in the 2-1 region S21, electric components having a height (eg, thickness) of the mountable electrical components smaller than the height of the mountable electrical components in the 2-2 region S22 may be located.
  • the 2-1 region S21 only electrical components (eg, the 2-1 electrical component 423) having a height of d3 or less may be mounted by the 2-1 protrusion part 321a.
  • electrical components having a height of d4 or less eg, 2-2 electricity
  • component 424 may be mounted.
  • a first shielding member 410 formed to surround the first electrical components 421 and 422 is disposed on the first surface 330a of the circuit board 241 , and the second surface of the circuit board 241 .
  • a second shielding member 430 formed to surround the second electrical components 423 may be disposed on the 330b.
  • the first and second shielding members 410 and 430 provide a shielding function against electromagnetic waves that may be generated by the first and second electrical components 421,422, 423,424, and the first and second electrical components 421,422, 423,424. It is possible to provide a heat conduction function for transferring heat that may be generated by the first and second electrical components 421 , 422 , 423,424 to the outside.
  • the first and second shielding members 410 and 430 may have a flexible structure and may be formed to entirely surround the first and second electrical components 421 , 422 , 423,424 . For example, in order to be disposed in direct contact with the plurality of surfaces of the first and second electrical components 421 , 422 , 423,424 , at least a portion may form an inclined surface and/or a curved surface.
  • a configuration of the first shielding member 410 of FIG. 7 may be partially or entirely the same as that of the first shielding member 410 of FIG. 6 .
  • the second shielding member 430 not shown in FIG. 6 will be described.
  • the second shielding member 430 is a second protruding portion of the housing 210 ( 321) can be directly connected and/or combined with
  • the second protruding portions 321 are disposed in direct contact with one region of the second shielding member 430 rather than the second surface 330b of the circuit board 241, and thus the circuit board 241 is attached to the housing ( 210) may be supported and/or secured within.
  • As the second protruding parts 321 are spaced apart from the circuit board 241 , a space in which the second electrical components 423,424 can be mounted on the circuit board 241 may be expanded.
  • the second shielding member 430 may include second connecting portions 430a connected to the second protruding portions 321 .
  • the second connection portions 430a of the second shielding member 430 include at least one 2-1 connection portion 431 spaced apart from the middle region of the second surface 330b of the circuit board 241 , the circuit board. It is located in the edge region of the 241 and may include at least one 2-2 connection part 432 and a 2-3 connection part 433 for fixing the circuit board 241 not to move.
  • At least one 2-1 connecting portion 431 of the second shielding member 430 is a portion connected to the 2-1 protruding portion 321a, and the second surface ( 330b) may be designed at a position corresponding to the middle region (eg, the 2-1 region S21).
  • the 2-1 th connection part 431 may be disposed in direct contact with the 2-1 th protrusion part 321a to support the intermediate region of the circuit board 241 so as not to be bent.
  • At least one 2-2 connection portion 432 and a 2-3 connection portion 433 of the second shielding member 430 are disposed along an edge region of the circuit board 241 ,
  • the 2-2 protrusion part 321b and the 2-3rd protrusion part 321c are in direct contact with each other, and vibration of the circuit board 241 can be prevented.
  • one region of the 2-3 th connection part 433 may include a recess in the shape of a groove or a hole in which the hook end of the 2-3 th protruding part 321c may be located.
  • the 2-3 th connection portion 433 includes a recess corresponding to the hook end so that the hook end of the 2-3 th protruding portion 321c can be inserted and fixed, so that it is coupled to the circuit board 241 .
  • Side fixing of the second shielding member 430 may be provided.
  • FIG. 8 is a cross-sectional view illustrating a disposition relationship between a circuit board and a peripheral structure according to still another one of various embodiments of the present disclosure.
  • the electronic device 200 includes a housing 210 , a light output module (eg, the light output module 211 of FIGS. 2 to 5 ), a circuit board 241 , and a first shielding member (eg, a first shielding member).
  • the first shield can 510) and a second shielding member (eg, the second shield can 530) may be included.
  • the configuration of the housing 210 and the circuit board 241 of FIG. 7 is the same as that of the housing 210 , the light output module 211 , and the circuit board 241 of FIGS. 2 to 5 in part or in whole can do.
  • the first shielding member and the second shielding member of FIG. 8 may have different structures from the first shielding member 410 and the second shielding member 430 of FIGS. 6 and 7 .
  • the first shielding member of FIG. 8 is spaced apart from the first electrical components 420a by a specified distance, and a first direction (+Z-axis direction) and a first direction (+) toward the first plate 310 .
  • Z-axis direction and has a closed rectangular shape, and may be a first shield can 510 made of a stainless-based material such as SUS.
  • the second shielding member is spaced apart from the second electrical components 420b by a specified distance, and is perpendicular to the second direction (-Z-axis direction) and the second direction (-Z-axis direction) facing the second plate 320 . It may have a rectangular shape with one side closed, and may be a second shield can 530 made of a stainless-based material such as SUS.
  • various structures may be formed on the inner surface of the housing 210 according to the arrangement of electronic components disposed inside the electronic device 200 or the bonding structure between the housing 210 and the internal electronic component.
  • the circuit board 241 formed by being coupled to the first shield can 510 and the second shield can 530 is disposed between the first plate 310 and the second plate 320 , and a plurality of first It is supported and fixed by the protruding parts 315 and the plurality of second protruding parts 325 , so that movement may be restricted.
  • the first plate 310 may include a plurality of first protruding portions 315 protruding toward the second plate 320 .
  • the second plate 320 may include a plurality of second protruding portions 325 protruding toward the first plate 310 .
  • the plurality of first protruding portions 315 and second protruding portions 325 include a circuit board 241 and/or an electrical component 420a disposed between the first plate 310 and the second plate 320 ; 420b) can be designed in various forms for fixing or guiding.
  • the at least one first protruding portion 315 may be formed to protrude toward the second plate 320 or the circuit board 241 along the edge of the first shield can 510 .
  • the first protruding part 315 may include a 1-1 protruding part 315a and a 1-2 protruding part 315b, and the 1-1 protruding part 315a and the 1-th protruding part 315b.
  • the second protruding portion 315b is disposed along the outer surface of the first shield can 510 coupled to the circuit board 241 , so that the first shield can 510 moves in the first direction (+Z-axis direction) and/or Movement in a third direction perpendicular to the second direction (-Z-axis direction) may be restricted.
  • the first-first protruding portion 315a may have a hook end and be positioned in one area of the first shield can 510 .
  • the first shield can 510 may include a groove or a groove-shaped recess for the end of the hook, and the recess may have a minimum size for shielding performance.
  • the at least one second protruding portion 325 faces the first plate 310 or the circuit board 241 along the edge of the second shield can 530 . It may be formed to protrude to do so.
  • the second protrusion part 325 may include a 1-1 protrusion part 325a and a 1-2 protrusion part 325b, and a 1-1 protrusion part 325a and a 1-2 protrusion part ( 325b) is disposed along the outer surface of the second shield can 530 coupled to the circuit board 241, so that the second shield can 530 moves in the first direction (+Z-axis direction) and/or in the second direction ( -Z-axis direction) and the third direction perpendicular to the movement can be restricted.
  • the 2-1 protrusion part 325a may have a hook end formed therein, and may be positioned in an area of the second shield can 530 .
  • the second shield can 530 may include a groove or a groove-shaped recess for the end of the hook, and the recess may have a minimum size for shielding performance.
  • the first surface 330a of the circuit board 241 may be spaced apart from the plurality of first protruding portions 315 of the first plate 310 .
  • the second surface 330b of the circuit board 241 may be spaced apart from the plurality of second protruding portions 325 of the second plate 320 .
  • the first shield can 510 may be coupled to at least a portion of the first surface 330a of the circuit board 241 by a soldering method, and the second shield can 530 may be connected to the circuit board 241 . ) may be coupled to at least a portion of the second surface 330b by a soldering method.
  • the first shield can 510 provides a shielding function against electromagnetic waves that may be generated by the first electrical components 420a, and generates heat that may be generated by the first electrical components 420a to the first electrical component ( 420a) may provide a heat conduction function for transferring to the outside.
  • the second shield can 530 provides a shielding function against electromagnetic waves that may be generated by the second electrical components 420b and dissipates heat that may be generated by the second electrical components 420b to the second electrical component ( 420b) may provide a heat conduction function for transferring to the outside.
  • the first shield can 510 is provided with a first protruding portion ( 315) may be directly connected and/or combined.
  • the second shield can 530 is provided with a second protruding portion ( 325) may be directly connected and/or combined.
  • the first protruding parts 315 are disposed in direct contact with one area of the first shield can 510, not the first surface 330a of the circuit board 241, and thus the circuit board 241 is attached to the housing ( 210) may be supported and/or secured within.
  • the second protruding parts 325 are disposed in direct contact with one area of the second shield can 530, not the second surface 330b of the circuit board 241, and thus the circuit board 241 is attached to the housing ( 210) may be supported and/or secured within.
  • the first and second protruding parts 315 and 325 are spaced apart from the circuit board 241 so that electrical components (eg, the first and second electrical components 420a and 420b) can be mounted on the circuit board 241 . space can be expanded.
  • a heat transfer member (not shown) for easily diffusing heat may be further included between the first shield can 510 and the first electrical component 420a.
  • a heat transfer member (not shown) for easily diffusing heat may be further included between the second shield can 530 and the second electrical component 420b.
  • the heat transfer member may include various heat dissipating materials or members. For example, it may be configured to include a thermal interface material (TIM), a heat pipe, a vapor chamber, a heat dissipation sheet, or a heat dissipation paint.
  • TIM thermal interface material
  • the material of the heat dissipation sheet or the heat dissipation paint may include, for example, graphite, carbon nanotubes, a natural regenerated material, silicon, silicon, or a high heat conductivity material such as graphite.
  • the carbon fiber TIM carbon fiber TIM
  • the carbon fiber TIM may include at least one of a liquid phase thermal interface material (TIM) and/or a solid phase thermal interface material (TIM).
  • FIG. 9 is a projection view of an electronic device showing connection portions of a shielding member coupled to a circuit board and a shielding member coupled to a housing, according to various embodiments of the present disclosure
  • the electronic device 200 may include a housing 210 , a circuit board 241 , and a first shielding member 410 .
  • the configuration of the housing 210 , the circuit board 241 , and the first shielding member 410 of FIG. 9 is the configuration of the housing 210 , the circuit board 241 , and the first shielding member 410 of FIG. 6 . and some or all of it may be the same.
  • the housing 210 is configured to form the exterior of the electronic device 200 and may provide a space in which components may be mounted.
  • various structures may be formed on the inner surface of the housing 210 according to the arrangement of electronic components disposed inside the electronic device 200 or the bonding structure between the housing 210 and the internal electronic component. have.
  • a space for accommodating the circuit board 241 and/or electrical components (eg, integrated circuit chips) mounted on the circuit board 241 may be formed in the housing 210 , the circuit board 241 and /
  • the space for accommodating the integrated circuit chips may be formed in a recessed shape or a structure such as a rib surrounding the integrated circuit chip (eg, the first protruding portion 311 ).
  • first electrical components 421 and 422 may be disposed on the first surface 310a of the circuit board 241 .
  • the housing 310 may include a first protruding portion (eg, the first protruding portion 311 of FIG. 6 ) formed to face the side surface and the first surface 310a of the circuit board 241 .
  • the first shielding member 410 may include first connecting portions 410a connected to the first protruding portions 311 .
  • the first connection parts 410a of the first shielding member 410 are at least one 1-1 connection part 411 spaced apart from the middle region of the circuit board 241 , and in the edge region of the circuit board 241 . It may include at least one 1-2 connection part 412 and a 1-3 th connection part 413 for fixing the circuit board 241 not to move.
  • the 1-1 connection part 411 is disposed in direct contact with the 1-1 protrusion part (eg, the 1-1 protrusion part 311a of FIG. 6 ), so that the circuit board 241 is formed.
  • the middle region can be supported so that it does not bend.
  • the 1-2 connection part 412 and the 1-3 connection part 413 are disposed along the edge region of the circuit board 241 , and the 1-2 protrusion part (eg, 1-2 in FIG. 6 ).
  • the protrusion part 311b) and the 1-3 protrusion part eg, the 1-3 protrusion part 311c of FIG. 6 ) are in direct contact to prevent shaking of the circuit board 241 .
  • one region of the 1-3 connection part 413 may include a recess in the shape of a groove or a hole through which the hook end of the 1-3 protrusion part may pass.
  • the 1-3 connecting portion 413 includes a recess corresponding to the hook end so that the hook end of the 1-3 protruding portion can be inserted and fixed, so that the first connected portion 413 is coupled to the circuit board 241 .
  • Side fixing of the shielding member 410 may be provided.
  • the electronic device (eg, the electronic device 200 of FIGS. 2 to 5 ) according to various embodiments of the present disclosure includes a first plate (eg, the first plate 310 of FIG. 6 ) facing a first direction and the A housing including a second plate (eg, the second plate 320 of FIG. 6 ) facing a second direction opposite to the first direction, wherein the first plate has a first protrusion formed to protrude toward the second plate
  • a housing eg, the housing 210 of FIG. 6
  • an optical output module disposed in the housing and configured to output an image (eg, the optical output module of FIGS.
  • the circuit board comprising a first surface on which at least one first electrical component (eg, the first electrical component 421, 422 of FIG. 6) is disposed to face the first plate; (eg, the circuit board 241 of FIG. 6 ), and in a state for accommodating the at least one first electrical component, disposed on the first surface of the circuit board, and fixed by the first protruding portion or It may include a first shielding member (eg, the first shielding member 410 of FIG. 6 ) formed to be supported. The first surface of the circuit board may be spaced apart from the first protruding portion.
  • the circuit board may be disposed between the first plate and the second plate to be spaced apart from the first plate and the second plate.
  • the first shielding member may be disposed in contact with one surface of the first plate while being coupled to the first surface of the circuit board.
  • the first shielding member may provide a three-dimensional structure to encapsulate a plurality of electrical elements disposed on the circuit board into a single sheet paper.
  • the first protrusion part may include a 1-1 protrusion part (eg, the 1-1 protrusion part 311a of FIG. 6 ) disposed to face at least one of the first electrical components.
  • the first-first protrusion portion may be formed to press at least a portion of an outer surface of the first shielding member in the second direction to limit movement of the circuit board.
  • the circuit board includes a 1-1 region (eg, a 1-1 region S11 of FIG. 6 ) formed to face the 1-1 protrusion portion, and the 1-1 protrusion portion It does not face the 1-1 region and may include a 1-2 th region (eg, a 1-2 th region S12 of FIG. 6 ) formed adjacent to the 1-1 region.
  • a thickness of one of the first electrical components to be disposed in the 1-1 region may be smaller than a thickness of another one of the first electrical components to be disposed in the 1-2 th region.
  • the first protrusion part may include a 1-2 protrusion part (eg, a first protrusion part of FIG. 6 ) disposed to face the second plate or the circuit board along an edge of the first shielding member. -2 protruding portion 311b). As the 1-2 protrusion part is disposed along a side surface of the first shielding member coupled to the circuit board, movement of the circuit board in a third direction perpendicular to the first direction may be restricted.
  • a 1-2 protrusion part eg, a first protrusion part of FIG. 6
  • the 1-2 protrusion part is disposed along a side surface of the first shielding member coupled to the circuit board, movement of the circuit board in a third direction perpendicular to the first direction may be restricted.
  • the first protruding portion may include a guide portion disposed along an edge of the first shielding member (eg, the guide portion 3111 of FIG. 6 ) and a hook protruding toward the first shielding member. and a 1-3 th protruding portion (eg, a 1-3 th protruding portion 311c of FIG. 6 ) including an end (eg, the hook end 3112 of FIG. 6 ).
  • the hook end of the 1-3 protruding part may be inserted into a recess formed in a side surface of the first shielding member to fix the first shielding member coupled to the circuit board so as not to deviate from a designated position. .
  • the guide part of the 1-3 protrusion part is disposed along a side surface of the first shielding member coupled to the circuit board, so that the circuit board is a first direction perpendicular to the first direction. You can restrict movement in 3 directions.
  • the second plate includes a second protruding portion (eg, the second protruding portion 321 of FIG. 7 ) protruding toward the first plate, and the second protruding portion includes the circuit It may be disposed in contact with a second surface opposite to the first surface of the substrate to limit movement of the circuit board in the direction of the second plate.
  • a second protruding portion eg, the second protruding portion 321 of FIG. 7
  • the second protruding portion includes the circuit It may be disposed in contact with a second surface opposite to the first surface of the substrate to limit movement of the circuit board in the direction of the second plate.
  • the electronic device may further include a second shielding member (eg, the second shielding member 430 of FIG. 7 ) formed to face the first shielding member with the circuit board interposed therebetween.
  • the second plate may include a second protruding portion protruding toward the first plate
  • the circuit board may include a second surface on which at least one second electrical component is disposed to face the second plate. have.
  • the second shielding member may be disposed on the second surface of the circuit board in a state of accommodating the at least one second electrical component, and be fixed or supported by the second protruding portion.
  • the second surface of the circuit board may be spaced apart from the second protruding portion.
  • the second shielding member may provide a three-dimensional structure to encapsulate a plurality of electrical elements disposed on the circuit board into one sheet paper.
  • the second protrusion part may include a 2-1 protrusion part (eg, the 2-1 protrusion part 321a of FIG. 7 ) disposed to face at least one of the second electrical components. and wherein the 2-1 protrusion part is formed to press at least a portion of the outer surface of the second shielding member in the first direction to restrict movement of the circuit board in the first direction or the second direction.
  • a 2-1 protrusion part eg, the 2-1 protrusion part 321a of FIG. 7
  • the 2-1 protrusion part is formed to press at least a portion of the outer surface of the second shielding member in the first direction to restrict movement of the circuit board in the first direction or the second direction.
  • the second protrusion part may include a 2-2 protrusion part (eg, a second protrusion part of FIG. 7 ) disposed to face the first plate or the circuit board along an edge of the second shielding member. -1 protruding part 321b), wherein the 2-2 protruding part is disposed along a side surface of the second shielding member coupled to the circuit board, so that the circuit board is perpendicular to the first direction Movement in the third direction may be restricted.
  • a 2-2 protrusion part eg, a second protrusion part of FIG. 7
  • the 2-2 protruding part is disposed along a side surface of the second shielding member coupled to the circuit board, so that the circuit board is perpendicular to the first direction Movement in the third direction may be restricted.
  • the first shielding member is spaced apart from the first electrical components by a specified distance, and a first direction toward the first plate and one surface perpendicular to the first direction are closed in a rectangular shape.
  • the electronic device (eg, the electronic device 200 of FIGS. 2 to 5 ) according to various embodiments of the present disclosure includes a lens frame (eg, the lens frame 202 of FIGS. 2 to 5 ) for accommodating the display member; A wearing member extending from the lens frame and including a first case (eg, a first case 231a) and a second case (eg, a second case 231b), wherein the first case supports the second case A wearing member including a first protruding portion (eg, the first protruding portion 311 in FIG. 6 ) protruding toward the wearing member, disposed within the wearing member, and at least one first electric component disposed to face the first case a circuit board (eg, the circuit board 241 of FIG.
  • a circuit board eg, the circuit board 241 of FIG.
  • the first surface of the circuit board may include the first protrusion portion and may be spaced apart from each other.
  • the circuit board may be disposed to be spaced apart from the first case and the second case between the first case and the second case.
  • the first shielding member may be disposed in contact with the inner surface of the first case while being coupled to the first surface of the circuit board.
  • the first shielding member may provide a three-dimensional structure to encapsulate a plurality of electrical elements disposed on the circuit board into a single sheet paper.

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Telephone Function (AREA)

Abstract

Un dispositif électronique selon divers modes de réalisation de la présente divulgation peut comprendre : un logement comprenant une première plaque faisant face à une première direction et une seconde plaque faisant face à une seconde direction opposée à la première direction, la première plaque comprenant une première partie en saillie formée pour faire saillie vers la seconde plaque ; un module de sortie optique disposé dans le logement et conçu pour fournir une image ; une carte de circuit imprimé disposée dans le logement et comprenant une première surface au niveau de laquelle au moins un premier composant électrique est agencé pour faire face à la première plaque ; et un premier élément de blindage disposé sur la première surface de la carte de circuit imprimé avec le ou les premiers composants électriques logés en son sein, et formé pour être fixé ou supporté par la première partie en saillie. La première surface de la carte de circuit imprimé peut être disposée à distance de la première partie en saillie.
PCT/KR2022/004069 2021-04-14 2022-03-23 Élément de blindage accouplé à une carte de circuit imprimé et dispositif électrique le comprenant WO2022220430A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020210048770A KR20220142269A (ko) 2021-04-14 2021-04-14 회로 기판과 결합된 쉴딩 부재 및 이를 포함하는 전자 장치
KR10-2021-0048770 2021-04-14

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WO2022220430A1 true WO2022220430A1 (fr) 2022-10-20

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KR (1) KR20220142269A (fr)
WO (1) WO2022220430A1 (fr)

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KR20190063730A (ko) * 2017-11-30 2019-06-10 삼성전자주식회사 지문 센서를 구비한 웨어러블 전자 장치

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