WO2022220430A1

WO2022220430A1 - Shielding member coupled to circuit board and electronic device comprising same

Info

Publication number: WO2022220430A1
Application number: PCT/KR2022/004069
Authority: WO
Inventors: 이정근; 선태원; 양성광; 양현모; 윤종민; 김승년
Original assignee: 삼성전자 주식회사
Priority date: 2021-04-14
Filing date: 2022-03-23
Publication date: 2022-10-20
Also published as: KR20220142269A

Abstract

An electronic device according to various embodiments of the present disclosure may comprise: a housing including a first plate facing a first direction and a second plate facing a second direction opposite to the first direction, the first plate including a first protrusion portion formed to protrude toward the second plate; an optical output module disposed in the housing and configured to output an image; a circuit board disposed in the housing and including a first surface at which at least one first electrical component is arranged to face the first plate; and a first shielding member disposed on the first surface of the circuit board with the at least one first electrical component accommodated therein, and formed to be fixed or supported by the first protrusion portion. The first surface of the circuit board may be spaced apart from the first protrusion portion.

Description

Shielding member coupled to circuit board and electronic device including same

Various embodiments of the present disclosure relate to a shielding member coupled to a circuit board, and an electronic device including the same.

BACKGROUND ART With the remarkable development of information and communication technology and semiconductor technology, the dissemination and use of various electronic devices are rapidly increasing. In particular, recent electronic devices are being developed to be portable and to be able to communicate.

An electronic device is a device that performs a specific function according to a loaded program, such as an electronic notebook, a portable multimedia player, a mobile communication terminal, a tablet PC, an image/audio device, a desktop/laptop computer, or a vehicle navigation device from a home appliance. It can mean a device. For example, these electronic devices may output stored information as sound or image. As the degree of integration of electronic devices increases and high-speed and large-capacity wireless communication becomes common, various functions may be mounted in one electronic device such as a mobile communication terminal in recent years. For example, as well as communication functions, entertainment functions such as games, multimedia functions such as music/video playback, communication and security functions for mobile banking, or schedule management or electronic wallet functions are integrated into one electronic device. will be. Such electronic devices are being miniaturized so that users can conveniently carry them.

In general, in an electronic device, a printed circuit board (PCB) and various electronic components may be disposed inside a housing. The printed circuit board (PCB) may include an area for arranging electrical components and an area for being fixed and supported by the housing. For example, in the housing, a fixing member and/or a supporting member such as a separate fixing hook, a fixing guide, or a fastening boss is formed inside the housing to fix the printed circuit board, and the fixing member and/or the supporting member may be fastened to the bonding region of the printed circuit board. As the bonding area of the printed circuit board increases, the mounting area may be decreased.

According to various embodiments of the present disclosure, a shielding member coupled to a printed circuit board may be manufactured, and a fixing member and/or a supporting member for coupling to the housing may be coupled to the shielding member. Accordingly, it is possible to improve the mounting space of the electrical components disposed on the printed circuit board.

An electronic device according to various embodiments of the present disclosure includes a housing including a first plate facing a first direction and a second plate facing a second direction opposite to the first direction, wherein the first plate includes the second plate. A housing including a first protruding portion protruding toward a plate, an optical output module disposed in the housing and configured to output an image, and at least one first electrical component disposed in the housing and facing the first plate a circuit board including a first surface disposed thereon, and disposed on the first surface of the circuit board in a state of accommodating the at least one first electrical component, and secured or supported by the first protruding portion It may include a formed first shielding member. The first surface of the circuit board may be spaced apart from the first protruding portion.

An electronic device according to various embodiments of the present disclosure includes a lens frame accommodating a display member, a wearing member extending from the lens frame, and a first case and a second case, wherein the first case is the second case A wearing member including a first protruding portion protruding toward the circuit board, the circuit board including a first surface disposed in the wearing member and on which at least one first electric component is disposed to face the first case, and the at least A first shielding member disposed on the first surface of the circuit board in a state of accommodating one first electrical component and formed to be fixed or supported by the first protruding portion may be included. The first surface of the circuit board may be spaced apart from the first protruding portion.

The shielding member coupled to the circuit board according to various embodiments of the present disclosure is formed to surround an electrical component disposed on the circuit board, and is directly coupled to the housing to form a coupling region on the circuit board for coupling with the housing. can be excluded. Accordingly, it is possible to increase the space in which the printed circuit board electrical components are mounted.

The shielding member coupled to the circuit board according to various embodiments of the present disclosure may provide a flexible shielding sheet disposed in contact with an electrical component, thereby providing efficient shielding performance and heat dissipation performance.

The shielding member coupled to the circuit board according to various embodiments of the present disclosure may provide a member directly coupled to the electrical component and the housing, thereby providing efficient shielding performance and heat transfer function.

Effects obtainable in the present disclosure are not limited to the above-mentioned effects, and other effects not mentioned may be clearly understood by those of ordinary skill in the art to which the present disclosure belongs from the description below. will be.

1 is a block diagram of an electronic device in a network environment, according to various embodiments.

2 is a perspective view of a wearable electronic device according to various embodiments of the present disclosure;

3 is a perspective view illustrating an internal configuration of an electronic device according to one of various embodiments of the present disclosure;

4 is a perspective view illustrating an internal configuration of an electronic device according to another one of various embodiments of the present disclosure;

5 is an exploded perspective view of an electronic device according to various embodiments of the present disclosure;

6 is a cross-sectional view illustrating a disposition relationship between a circuit board and a surrounding structure, according to one of various embodiments of the present disclosure.

7 is a cross-sectional view illustrating a disposition relationship between a circuit board and a peripheral structure according to another one of various embodiments of the present disclosure.

8 is a cross-sectional view illustrating a disposition relationship between a circuit board and a peripheral structure according to still another one of various embodiments of the present disclosure.

9 is a projection view of an electronic device showing a shielding member coupled to a circuit board and protruding structures coupled to the shielding member, according to various embodiments of the present disclosure;

1 is a block diagram of an electronic device in a network environment, according to various embodiments of the present disclosure;

Referring to FIG. 1 , in a network environment 100 , the electronic device 101 communicates with the electronic device 102 through a first network 198 (eg, a short-range wireless communication network) or a second network 199 . It may communicate with the electronic device 104 or the server 108 through (eg, a long-distance wireless communication network). According to an embodiment, the electronic device 101 may communicate with the electronic device 104 through the server 108 . According to an embodiment, the electronic device 101 includes a processor 120 , a memory 130 , an input module 150 , a sound output module 155 , a display module 160 , an audio module 170 , and a sensor module ( 176), interface 177, connection terminal 178, haptic module 179, camera module 180, power management module 188, battery 189, communication module 190, subscriber identification module 196 , or an antenna module 197 . In some embodiments, at least one of these components (eg, the connection terminal 178 ) may be omitted or one or more other components may be added to the electronic device 101 . In some embodiments, some of these components (eg, sensor module 176 , camera module 180 , or antenna module 197 ) are integrated into one component (eg, display module 160 ). can be

The processor 120, for example, executes software (eg, the program 140) to execute at least one other component (eg, a hardware or software component) of the electronic device 101 connected to the processor 120 . It can control and perform various data processing or operations. According to one embodiment, as at least part of data processing or operation, the processor 120 converts commands or data received from other components (eg, the sensor module 176 or the communication module 190 ) to the volatile memory 132 . may be stored in , process commands or data stored in the volatile memory 132 , and store the result data in the non-volatile memory 134 . According to an embodiment, the processor 120 is the main processor 121 (eg, a central processing unit or an application processor), or a secondary processor 123 (eg, a graphic processing unit, a neural network processing unit) that can be operated independently or together with the main processor 121 . (NPU: neural processing unit), image signal processor, sensor hub processor, or communication processor). For example, when the electronic device 101 includes the main processor 121 and the sub-processor 123 , the sub-processor 123 uses less power than the main processor 121 or is set to be specialized for a specified function. can be The auxiliary processor 123 may be implemented separately from or as a part of the main processor 121 .

The secondary processor 123 may, for example, act on behalf of the main processor 121 while the main processor 121 is in an inactive (eg, sleep) state, or when the main processor 121 is active (eg, executing an application). ), together with the main processor 121, at least one of the components of the electronic device 101 (eg, the display module 160, the sensor module 176, or the communication module 190) It is possible to control at least some of the related functions or states. According to an embodiment, the coprocessor 123 (eg, an image signal processor or a communication processor) may be implemented as part of another functionally related component (eg, the camera module 180 or the communication module 190). have. According to an embodiment, the auxiliary processor 123 (eg, a neural network processing device) may include a hardware structure specialized for processing an artificial intelligence model. Artificial intelligence models can be created through machine learning. Such learning may be performed, for example, in the electronic device 101 itself on which artificial intelligence is performed, or may be performed through a separate server (eg, the server 108). The learning algorithm may include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but in the above example not limited The artificial intelligence model may include a plurality of artificial neural network layers. Artificial neural networks include deep neural networks (DNNs), convolutional neural networks (CNNs), recurrent neural networks (RNNs), restricted boltzmann machines (RBMs), deep belief networks (DBNs), bidirectional recurrent deep neural networks (BRDNNs), It may be one of deep Q-networks or a combination of two or more of the above, but is not limited to the above example. The artificial intelligence model may include, in addition to, or alternatively, a software structure in addition to the hardware structure.

The memory 130 may store various data used by at least one component (eg, the processor 120 or the sensor module 176 ) of the electronic device 101 . The data may include, for example, input data or output data for software (eg, the program 140 ) and instructions related thereto. The memory 130 may include a volatile memory 132 or a non-volatile memory 134 .

The program 140 may be stored as software in the memory 130 , and may include, for example, an operating system 142 , middleware 144 , or an application 146 .

The input module 150 may receive a command or data to be used by a component (eg, the processor 120 ) of the electronic device 101 from the outside (eg, a user) of the electronic device 101 . The input module 150 may include, for example, a microphone, a mouse, a keyboard, a key (eg, a button), or a digital pen (eg, a stylus pen).

The sound output module 155 may output a sound signal to the outside of the electronic device 101 . The sound output module 155 may include, for example, a speaker or a receiver. The speaker can be used for general purposes such as multimedia playback or recording playback. The receiver can be used to receive incoming calls. According to one embodiment, the receiver may be implemented separately from or as part of the speaker.

The display module 160 may visually provide information to the outside (eg, a user) of the electronic device 101 . The display module 160 may include, for example, a control circuit for controlling a display, a hologram device, or a projector and a corresponding device. According to an embodiment, the display module 160 may include a touch sensor configured to sense a touch or a pressure sensor configured to measure the intensity of a force generated by the touch.

The audio module 170 may convert a sound into an electric signal or, conversely, convert an electric signal into a sound. According to an embodiment, the audio module 170 acquires a sound through the input module 150 or an external electronic device (eg, a sound output module 155 ) directly or wirelessly connected to the electronic device 101 . The electronic device 102) (eg, a speaker or headphones) may output a sound.

The sensor module 176 detects an operating state (eg, power or temperature) of the electronic device 101 or an external environmental state (eg, a user state), and generates an electrical signal or data value corresponding to the sensed state. can do. According to an embodiment, the sensor module 176 may include, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, It may include a temperature sensor, a humidity sensor, or an illuminance sensor.

The interface 177 may support one or more specified protocols that may be used by the electronic device 101 to directly or wirelessly connect with an external electronic device (eg, the electronic device 102 ). According to an embodiment, the interface 177 may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

The connection terminal 178 may include a connector through which the electronic device 101 can be physically connected to an external electronic device (eg, the electronic device 102 ). According to an embodiment, the connection terminal 178 may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (eg, a headphone connector).

The haptic module 179 may convert an electrical signal into a mechanical stimulus (eg, vibration or movement) or an electrical stimulus that the user can perceive through tactile or kinesthetic sense. According to an embodiment, the haptic module 179 may include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

The camera module 180 may capture still images and moving images. According to an embodiment, the camera module 180 may include one or more lenses, image sensors, image signal processors, or flashes.

The power management module 188 may manage power supplied to the electronic device 101 . According to an embodiment, the power management module 188 may be implemented as, for example, at least a part of a power management integrated circuit (PMIC).

The battery 189 may supply power to at least one component of the electronic device 101 . According to one embodiment, battery 189 may include, for example, a non-rechargeable primary cell, a rechargeable secondary cell, or a fuel cell.

The communication module 190 is a direct (eg, wired) communication channel or a wireless communication channel between the electronic device 101 and an external electronic device (eg, the electronic device 102, the electronic device 104, or the server 108). It can support establishment and communication performance through the established communication channel. The communication module 190 may include one or more communication processors that operate independently of the processor 120 (eg, an application processor) and support direct (eg, wired) communication or wireless communication. According to one embodiment, the communication module 190 is a wireless communication module 192 (eg, a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module 194 (eg, : It may include a local area network (LAN) communication module, or a power line communication module). A corresponding communication module among these communication modules is a first network 198 (eg, a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network 199 (eg, legacy It may communicate with an external electronic device through a cellular network, a 5G network, a next-generation communication network, the Internet, or a telecommunication network such as a computer network (eg, LAN or WAN). These various types of communication modules may be integrated into one component (eg, a single chip) or may be implemented as a plurality of components (eg, multiple chips) separate from each other. The wireless communication module 192 uses subscriber information (eg, International Mobile Subscriber Identifier (IMSI)) stored in the subscriber identification module 196 within a communication network such as the first network 198 or the second network 199 . The electronic device 101 may be identified or authenticated.

The wireless communication module 192 may support a 5G network after a 4G network and a next-generation communication technology, for example, a new radio access technology (NR). NR access technology includes high-speed transmission of high-capacity data (eMBB (enhanced mobile broadband)), minimization of terminal power and access to multiple terminals (mMTC (massive machine type communications)), or high reliability and low latency (URLLC (ultra-reliable and low-latency) -latency communications)). The wireless communication module 192 may support a high frequency band (eg, mmWave band) to achieve a high data rate, for example. The wireless communication module 192 uses various techniques for securing performance in a high-frequency band, for example, beamforming, massive multiple-input and multiple-output (MIMO), all-dimensional multiplexing. It may support technologies such as full dimensional MIMO (FD-MIMO), an array antenna, analog beam-forming, or a large scale antenna. The wireless communication module 192 may support various requirements defined in the electronic device 101 , an external electronic device (eg, the electronic device 104 ), or a network system (eg, the second network 199 ). According to an embodiment, the wireless communication module 192 may include a peak data rate (eg, 20 Gbps or more) for realizing eMBB, loss coverage (eg, 164 dB or less) for realizing mMTC, or U-plane latency for realizing URLLC ( Example: Downlink (DL) and uplink (UL) each 0.5 ms or less, or round trip 1 ms or less) can be supported.

The antenna module 197 may transmit or receive a signal or power to the outside (eg, an external electronic device). According to an embodiment, the antenna module may include an antenna including a conductor formed on a substrate (eg, a PCB) or a radiator formed of a conductive pattern. According to an embodiment, the antenna module 197 may include a plurality of antennas (eg, an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network such as the first network 198 or the second network 199 is connected from the plurality of antennas by, for example, the communication module 190 . can be selected. A signal or power may be transmitted or received between the communication module 190 and an external electronic device through the selected at least one antenna. According to some embodiments, other components (eg, a radio frequency integrated circuit (RFIC)) other than the radiator may be additionally formed as a part of the antenna module 197 .

According to various embodiments, the antenna module 197 may form a mmWave antenna module. According to one embodiment, the mmWave antenna module comprises a printed circuit board, an RFIC disposed on or adjacent to a first side (eg, bottom side) of the printed circuit board and capable of supporting a designated high frequency band (eg, mmWave band); and a plurality of antennas (eg, an array antenna) disposed on or adjacent to a second side (eg, top or side) of the printed circuit board and capable of transmitting or receiving signals of the designated high frequency band. can do.

At least some of the components are connected to each other through a communication method between peripheral devices (eg, a bus, general purpose input and output (GPIO), serial peripheral interface (SPI), or mobile industry processor interface (MIPI)) and a signal ( e.g. commands or data) can be exchanged with each other.

According to an embodiment, the command or data may be transmitted or received between the electronic device 101 and the external electronic device 104 through the server 108 connected to the second network 199 . Each of the external

electronic devices

102 or 104 may be the same as or different from the electronic device 101 . According to an embodiment, all or part of the operations executed in the electronic device 101 may be executed in one or more of the external

electronic devices

102 , 104 , or 108 . For example, when the electronic device 101 needs to perform a function or service automatically or in response to a request from a user or other device, the electronic device 101 may perform the function or service itself instead of executing the function or service itself. Alternatively or additionally, one or more external electronic devices may be requested to perform at least a part of the function or the service. One or more external electronic devices that have received the request may execute at least a part of the requested function or service, or an additional function or service related to the request, and transmit a result of the execution to the electronic device 101 . The electronic device 101 may process the result as it is or additionally and provide it as at least a part of a response to the request. For this purpose, for example, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used. The electronic device 101 may provide an ultra-low latency service using, for example, distributed computing or mobile edge computing. In another embodiment, the external electronic device 104 may include an Internet of things (IoT) device. The server 108 may be an intelligent server using machine learning and/or neural networks. According to an embodiment, the external electronic device 104 or the server 108 may be included in the second network 199 . The electronic device 101 may be applied to an intelligent service (eg, smart home, smart city, smart car, or health care) based on 5G communication technology and IoT-related technology.

The electronic device according to various embodiments disclosed in this document may have various types of devices. The electronic device may include, for example, a portable communication device (eg, a smart phone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a home appliance device. The electronic device according to the embodiment of the present document is not limited to the above-described devices.

The various embodiments of this document and terms used therein are not intended to limit the technical features described in this document to specific embodiments, but it should be understood to include various modifications, equivalents, or substitutions of the embodiments. In connection with the description of the drawings, like reference numerals may be used for similar or related components. The singular form of the noun corresponding to the item may include one or more of the item, unless the relevant context clearly dictates otherwise. As used herein, "A or B", "at least one of A and B", "at least one of A or B", "A, B or C", "at least one of A, B and C", and "A , B, or C," each of which may include any one of the items listed together in the corresponding one of the phrases, or all possible combinations thereof. Terms such as “first”, “second”, or “first” or “second” may simply be used to distinguish the component from other such components, and refer to those components in other aspects (e.g., importance or order) is not limited. It is said that one (eg, first) component is “coupled” or “connected” to another (eg, second) component, with or without the terms “functionally” or “communicatively”. When referenced, it means that one component can be connected to the other component directly (eg by wire), wirelessly, or through a third component.

The term “module” used in various embodiments of this document may include a unit implemented in hardware, software, or firmware, and is interchangeable with terms such as, for example, logic, logic block, component, or circuit. can be used as A module may be an integrally formed part or a minimum unit or a part of the part that performs one or more functions. For example, according to an embodiment, the module may be implemented in the form of an application-specific integrated circuit (ASIC).

Various embodiments of the present document include one or more instructions stored in a storage medium (eg, internal memory 136 or external memory 138) readable by a machine (eg, electronic device 101). may be implemented as software (eg, the program 140) including For example, the processor (eg, the processor 120 ) of the device (eg, the electronic device 101 ) may call at least one of the one or more instructions stored from the storage medium and execute it. This makes it possible for the device to be operated to perform at least one function according to the called at least one command. The one or more instructions may include code generated by a compiler or code executable by an interpreter. The device-readable storage medium may be provided in the form of a non-transitory storage medium. Here, 'non-transitory' only means that the storage medium is a tangible device and does not contain a signal (eg, electromagnetic wave), and this term is different from the case where data is semi-permanently stored in the storage medium. It does not distinguish between temporary storage cases.

According to one embodiment, the method according to various embodiments disclosed in this document may be provided in a computer program product (computer program product). Computer program products may be traded between sellers and buyers as commodities. The computer program product is distributed in the form of a machine-readable storage medium (eg compact disc read only memory (CD-ROM)), or via an application store (eg Play Store ^TM ) or on two user devices ( It can be distributed (eg downloaded or uploaded) directly or online between smartphones (eg: smartphones). In the case of online distribution, at least a portion of the computer program product may be temporarily stored or temporarily generated in a machine-readable storage medium such as a memory of a server of a manufacturer, a server of an application store, or a memory of a relay server.

According to various embodiments, each component (eg, a module or a program) of the above-described components may include a singular or a plurality of entities, and some of the plurality of entities may be separately disposed in other components. have. According to various embodiments, one or more components or operations among the above-described corresponding components may be omitted, or one or more other components or operations may be added. Alternatively or additionally, a plurality of components (eg, a module or a program) may be integrated into one component. In this case, the integrated component may perform one or more functions of each component of the plurality of components identically or similarly to those performed by the corresponding component among the plurality of components prior to the integration. . According to various embodiments, operations performed by a module, program, or other component are executed sequentially, in parallel, repeatedly, or heuristically, or one or more of the operations are executed in a different order, or omitted. , or one or more other operations may be added.

Referring to FIG. 2 , the electronic device 200 is a wearable electronic device in the form of glasses, and a user can visually recognize a surrounding object or environment while wearing the electronic device 200 . For example, the electronic device 200 may be a head mounting device (HMD) or smart glasses capable of providing an image directly in front of the user's eyes. The configuration of the electronic device 200 of FIG. 2 may be the same in whole or part as the configuration of the electronic device 101 of FIG. 1 .

According to various embodiments, the electronic device 200 may include a housing 210 that forms an exterior of the electronic device 200 . The housing 210 may provide a space in which components of the electronic device 200 may be disposed. For example, the housing 210 may include a lens frame 202 and at least one wearing member 203 .

According to various embodiments, the electronic device 200 may include at least one display member 201 capable of providing visual information to the user. For example, the display member 201 may include a module equipped with a lens, a display, a waveguide, and/or a touch circuit. According to an exemplary embodiment, the display member 201 may be transparent or translucent. According to an exemplary embodiment, the display member 201 may include a translucent glass or a window member whose transmittance of light can be adjusted as the color concentration is adjusted. According to an embodiment, the display member 201 may be provided as a pair, and may be respectively disposed to correspond to the left eye and the right eye of the user while the electronic device 200 is worn on the user's body.

According to various embodiments, the lens frame 202 may accommodate at least a portion of the display member 201 . For example, the lens frame 202 may surround at least a portion of an edge of the display member 201 . According to an embodiment, the lens frame 202 may position at least one of the display members 201 to correspond to the user's eyes. According to an embodiment, the lens frame 202 may be a rim of a general eyeglass structure. According to an embodiment, the lens frame 202 may include at least one closed curve surrounding the display member 201 .

According to various embodiments, the wearing member 203 may extend from the lens frame 202 . For example, the wearing member 203 may extend from an end of the lens frame 202 and may be supported or positioned on the user's body (eg, an ear) together with the lens frame 202 . According to an embodiment, the wearing member 203 may be rotatably coupled to the lens frame 202 through the hinge structure 229 . According to an embodiment, the wearing member 203 may include an inner side 231c configured to face the user's body and an outer side 231d opposite to the inner side.

According to various embodiments, the electronic device 200 may include a hinge structure 229 configured to fold the wearing member 203 with respect to the lens frame 202 . The hinge structure 229 may be disposed between the lens frame 202 and the wearing member 203 . In a state where the electronic device 200 is not worn, the user may carry or store the wearing member 203 by folding the wearing member 203 to partially overlap with the lens frame 202 .

3 is a perspective view illustrating an internal configuration of an electronic device according to one of various embodiments of the present disclosure; 4 is a perspective view illustrating an internal configuration of an electronic device according to another one of various embodiments of the present disclosure; 5 is an exploded perspective view of an electronic device according to various embodiments of the present disclosure;

3 to 5 , the electronic device 200 includes components accommodated in a housing 210 (eg, at least one circuit board 241 (eg, a printed circuit board (PCB), a printed board assembly (PBA)). , flexible PCB (FPCB) or rigid-flex PCB (RFPCB), at least one battery 243, at least one speaker module 245, at least one power transmission structure 246, and a camera module 250) may include The configuration of the housing 210 of FIGS. 3 and 4 may be all or partly the same as the configuration of the display member 201, the lens frame 202, the wearing member 203, and the hinge structure 229 of FIG. 2 . have.

According to various embodiments, the electronic device 200 uses the camera module 250 (eg, the camera module 180 of FIG. 1 ) in a direction that the user looks at or the electronic device 200 is oriented in (eg, the camera module 180 of FIG. 1 ). -Y direction) acquires and/or recognizes a visual image of an object or environment, and an external electronic device (eg, the first network 198 or the second network 199 in FIG. 1 ) : Information about an object or environment may be provided from the

electronic devices

102 and 104 or the server 108 of FIG. 1 . In another embodiment, the electronic device 200 may provide the provided information about the object or environment to the user in an acoustic or visual form. The electronic device 200 may provide the provided information about the object or environment to the user through the display member 201 in a visual form using a display module (eg, the display module 160 of FIG. 1 ). For example, the electronic device 200 may implement augmented reality by realizing information about an object or environment in a visual form and combining it with an actual image of a user's surrounding environment.

According to various embodiments of the present disclosure, the display member 201 includes a first surface F1 facing a direction (eg, a -Y direction) to which external light is incident and a direction opposite to the first surface F1 (eg, + A second surface F2 facing the Y direction) may be included. In a state in which the user wears the electronic device 200 , at least a portion of the light or image incident through the first surface F1 is a second portion of the display member 201 disposed to face the user's left and/or right eyes. It may be incident to the user's left eye and/or right eye through the surface F2.

According to various embodiments, the lens frame 202 may include at least two or more frames. For example, the lens frame 202 may include a first frame 202a and a second frame 202b. According to an embodiment, when the user wears the electronic device 200 , the first frame 202a is a frame of a portion facing the user's face, and the second frame 202b is attached to the first frame 202a. It may be a part of the lens frame 202 that is spaced apart in the user's gaze direction (eg, -Y direction).

According to various embodiments, the light output module 211 may provide an image and/or an image to a user. For example, the light output module 211 includes a display panel (not shown) capable of outputting an image, and a lens (not shown) corresponding to the user's eye and guiding the image to the display member 201 . can do. For example, the user may obtain an image output from the display panel of the light output module 211 through the lens of the light output module 211 . According to various embodiments, the light output module 211 may include a device configured to display various information. For example, the light output module 211 may include a liquid crystal display (LCD), a digital mirror device (DMD), a liquid crystal on silicon (LCoS), or an organic light emitting diode. It may include at least one of an organic light emitting diode (OLED) and a micro light emitting diode (micro LED). According to an embodiment, when the light output module 211 and/or the display member 201 includes one of a liquid crystal display device, a digital mirror display device, or a silicon liquid crystal display device, the electronic device 200 may display the light It may include a light source irradiating light to the display area of the output module 211 and/or the display member 201 . According to another embodiment, when the light output module 211 and/or the display member 201 includes one of an organic light emitting diode and a micro LED, the electronic device 200 does not include a separate light source and provides the user with a light source. A virtual image may be provided.

According to various embodiments, at least a portion of the light output module 211 may be disposed in the housing 210 . For example, the light output module 211 may be disposed on the wearing member 203 or the lens frame 202 to correspond to the user's right eye and left eye, respectively. According to an embodiment, the light output module 211 may be connected to the display member 201 and provide an image to the user through the display member 201 . For example, an image output from the light output module 211 is incident on the display member 210 through an input optical member positioned at one end of the display member 201 , and is positioned on at least a portion of the display member 210 . It may be radiated toward the user's eye through a waveguide and an output optical member. According to an embodiment, the waveguide may be made of glass, plastic, or polymer, and may include a nano-pattern formed on one surface inside or outside, for example, a polygonal or curved grating structure. have. According to an embodiment, the waveguide may include at least one of at least one diffractive element (eg, a diffractive optical element (DOE), a holographic optical element (HOE)) or a reflective element (eg, a reflective mirror). .

According to various embodiments, the circuit board 241 may include components for driving the electronic device 200 . For example, circuit board 241 may include at least one integrated circuit chip, processor 120 , memory 130 , power management module 188 , or communication module of FIG. 1 . At least one of 190 may be provided in the integrated circuit chip. According to an embodiment, the circuit board 241 may be disposed in the wearing member 203 of the housing 210 . According to an embodiment, the circuit board 241 may be electrically connected to the battery 243 through the power transmission structure 246 . According to an embodiment, the circuit board 241 is connected to the flexible printed circuit board 205 and electronic components (eg, the optical output module 211) of the electronic device through the flexible printed circuit board 205; An electric signal may be transmitted to the camera module 250 and the light emitting unit (eg, the light emitting unit 330 of Fig. 5), according to an embodiment, the circuit board 241 may be an interposer substrate.

According to various embodiments, the flexible printed circuit board 205 may extend from the circuit board 241 across the hinge structure 229 into the interior of the lens frame 202 , and from the interior of the lens frame 202 . It may be disposed on at least a portion of the circumference of the display member 201 .

According to various embodiments, the battery 243 (eg, the battery 189 of FIG. 1 ) is a component of the electronic device 200 (eg, the optical output module 211 , the circuit board 241 , and the speaker module 245 ). ), the microphone module 247 , and/or the camera module 250 ) and may supply power to components of the electronic device 200 .

According to various embodiments, at least a portion of the battery 243 may be disposed on the wearing member 203 . According to an embodiment, the battery 243 may be disposed adjacent to the

ends

203a and 203b of the wearing member 203 . For example, the battery 243 may include a first battery 243a disposed at the first end 203a of the wearable member 203 and a second battery 243b disposed at the second end 203b of the wearable member 203 . have.

According to various embodiments, the speaker module 245 (eg, the audio module 170 or the sound output module 155 of FIG. 1 ) may convert an electrical signal into sound. At least a portion of the speaker module 245 may be disposed in the wearing member 203 of the housing 210 . According to an embodiment, the speaker module 245 may be located in the wearing member 203 to correspond to the user's ear. According to an embodiment (eg, FIG. 3 ), the speaker module 245 may be disposed on the circuit board 241 . For example, the speaker module 245 may be disposed between the circuit board 241 and the inner case (eg, the inner case 231 of FIG. 5 ). According to an embodiment (eg, FIG. 4 ), the speaker module 245 may be disposed next to the circuit board 241 . For example, the speaker module 245 may be disposed between the circuit board 241 and the battery 243 .

According to various embodiments, the electronic device 200 may include a speaker module 245 and a connection member 248 connected to the circuit board 241 . The connection member 248 may transmit at least a portion of the sound and/or vibration generated by the speaker module 245 to the circuit board 241 . According to an embodiment, the connection member 248 may be integrally formed with the speaker module 245 . For example, a portion extending from the speaker frame of the speaker module 245 may be interpreted as the connection member 248 . According to an embodiment (eg, FIG. 3 ), the connecting member 248 may be omitted. For example, when the speaker module 245 is disposed on the circuit board 241 , the connection member 248 may be omitted.

According to various embodiments, the power transmission structure 246 may transmit power from the battery 243 to an electronic component (eg, the light output module 211 ) of the electronic device 200 . For example, the power transmission structure 246 is electrically connected to the battery 243 and/or the circuit board 241 , and the circuit board 241 transmits power received through the power transmission structure 246 to an optical output. may be transmitted to the module 211 .

According to various embodiments, the power delivery structure 246 may be a configuration capable of delivering power. For example, the power delivery structure 246 may include a flexible printed circuit board or wire. For example, the wire may include a plurality of cables (not shown). In various embodiments, the shape of the power transmission structure 246 may be variously modified in consideration of the number and/or type of cables.

According to various embodiments, the microphone module 247 (eg, the input module 150 and/or the audio module 170 of FIG. 1 ) may convert a sound into an electrical signal. According to an embodiment, the microphone module 247 may be disposed on at least a portion of the lens frame 202 . For example, the at least one microphone module 247 may be disposed at a lower end (eg, in a direction toward the -X axis) and/or at an upper end (eg, in a direction toward the X axis) of the electronic device 200 . According to various embodiments, the electronic device 200 may more clearly recognize the user's voice by using voice information (eg, sound) acquired from the at least one microphone module 247 . For example, the electronic device 200 may distinguish the voice information from the ambient noise based on the acquired voice information and/or additional information (eg, low-frequency vibration of the user's skin and bones). For example, the electronic device 200 may clearly recognize the user's voice and may perform a function of reducing ambient noise (eg, noise canceling).

According to various embodiments, the camera module 250 may capture a still image and/or a video. The camera module 250 may include at least one of a lens, at least one image sensor, an image signal processor, and a flash. According to an exemplary embodiment, the camera module 250 may be disposed in the lens frame 202 and disposed around the display member 201 .

According to various embodiments, the camera module 250 may include at least one first camera module 251 . According to an embodiment, the first camera module 251 may photograph the user's eye (eg, a pupil) or the trajectory of the gaze. For example, the first camera module 251 may photograph the reflection pattern of the light emitted by the light emitting unit (eg, the light emitting unit 330 of FIG. 5 ) to the user's eyes. For example, the light emitting unit 330 may emit light in an infrared band for tracking the trajectory of the gaze using the first camera module 251 . For example, the light emitting unit 330 may include an IR LED. According to an embodiment, the processor (eg, the processor 120 of FIG. 1 ) may adjust the position of the virtual image so that the virtual image projected on the display member 201 corresponds to the direction in which the user's pupils gaze. According to an embodiment, the first camera module 251 may include a global shutter (GS) type camera, and use a plurality of first camera modules 251 having the same standard and performance to protect the user's eyes or The trajectory of the gaze can be traced.

According to various embodiments, the first camera module 251 periodically or aperiodically transmits information (eg, trajectory information) related to the trajectory of the user's eyes or gaze to the processor (eg, the processor 120 of FIG. 1 ). can be sent to According to another embodiment, when the first camera module 251 detects that the user's gaze has changed based on the trajectory information (eg, the eyes move more than a reference value while the head is not moving), the first camera module 251 processes the trajectory information can be sent to

According to various embodiments, the camera module 250 may include a second camera module 253 . According to an embodiment, the second camera module 253 may capture an external image. According to an embodiment, the second camera module 253 may be a global shutter type or a rolling shutter (RS) type camera. According to an embodiment, the second camera module 253 may capture an external image through the second optical hole 223 formed in the second frame 202b. For example, the second camera module 253 may include a high-resolution color camera, and may be a high resolution (HR) or photo video (PV) camera. Also, the second camera module 253 may provide an auto focus (AF) function and an optical image stabilizer (OIS) function.

According to various embodiments (not shown), the electronic device 200 may include a flash (not shown) positioned adjacent to the second camera module 253 . For example, a flash (not shown) may provide light to increase brightness (eg, illuminance) around the electronic device 200 when an external image of the second camera module 253 is acquired, in a dark environment; It is possible to reduce the difficulty of acquiring an image due to the incorporation of various light sources, and/or the reflection of light.

According to various embodiments, the camera module 250 may include at least one third camera module 255 . According to an embodiment, the third camera module 255 may photograph a user's motion through the first optical hole 221 formed in the lens frame 202 . For example, the third camera module 255 may photograph a user's gesture (eg, a hand gesture). The third camera module 255 and/or the first optical hole 221 is formed at both side ends of the lens frame 202 (eg, the second frame 202b), for example, the lens frame 202 in the X direction. (eg, the second frame 202b) may be disposed at both ends. According to an embodiment, the third camera module 255 may be a global shutter (GS) type camera. For example, the third camera module 255 may provide 360-degree spatial (eg omnidirectional), positional, and/or movement recognition with a camera that supports 3DoF (degrees of freedom), or 6DoF. can According to an embodiment, the third camera module 255 uses a plurality of global shutter-type cameras of the same standard and performance as a stereo camera to perform simultaneous localization and mapping (SLAM) and user movement recognition. function can be performed. According to an embodiment, the third camera module 255 may include an infrared (IR) camera (eg, a time of flight (TOF) camera, or a structured light camera). For example, the IR camera may be operated as at least a part of a sensor module (eg, the sensor module 176 of FIG. 1 ) for detecting a distance to the subject.

According to an embodiment, at least one of the first camera module 251 and the third camera module 255 may be replaced with a sensor module (eg, the sensor module 176 of FIG. 1 ). For example, the sensor module may include at least one of a vertical cavity surface emitting laser (VCSEL), an infrared sensor, and/or a photodiode. For example, the photodiode may include a positive intrinsic negative (PIN) photodiode or an avalanche photodiode (APD). The photodiode may be referred to as a photo detector or a photo sensor.

According to an embodiment, at least one of the first camera module 251 , the second camera module 253 , and the third camera module 255 may include a plurality of camera modules (not shown). For example, the second camera module 253 includes a plurality of lenses (eg, wide-angle and telephoto lenses) and image sensors, and is disposed on one side (eg, a side facing the -Y axis) of the electronic device 200 . can be For example, the electronic device 200 may include a plurality of camera modules each having different attributes (eg, angle of view) or functions, and change the angle of view of the camera module based on a user's selection and/or trajectory information. can be controlled to do so. For example, at least one of the plurality of camera modules may be a wide-angle camera, and at least the other may be a telephoto camera.

According to various embodiments, the processor (eg, the processor 120 of FIG. 1 ) acquires using at least one of a gesture sensor, a gyro sensor, or an acceleration sensor of a sensor module (eg, the sensor module 176 of FIG. 1 ) Movement of the electronic device 200 using information on one electronic device 200 and a user's motion acquired using the third camera module 255 (eg, the user's body approaches to the electronic device 200) and/or the user's movement may be determined. According to an embodiment, the electronic device 200 uses a magnetic (geomagnetic) sensor capable of measuring an orientation using a magnetic field and a magnetic force in addition to the described sensor, and/or a strength of a magnetic field to provide movement information (eg, movement). direction or movement distance) may be included. For example, the processor may determine the movement of the electronic device 200 and/or the movement of the user based on information obtained from the magnetic (geomagnetic) sensor and/or the Hall sensor.

According to various embodiments (not shown), the electronic device 200 may perform an input function (eg, a touch and/or a pressure sensing function) capable of interacting with a user. For example, a component configured to perform a touch and/or pressure sensing function (eg, a touch sensor and/or a pressure sensor) may be disposed on at least a portion of the wearing member 203 . The electronic device 200 may control the virtual image output through the display member 201 based on the information obtained through the component. For example, a sensor related to a touch and/or pressure sensing function may be a resistive type, a capacitive type, an electro-magnetic type (EM), or an optical type. ) can be configured in various ways. According to an embodiment, the components configured to perform the touch and/or pressure sensing function may be all or partly the same as the configuration of the input module 150 of FIG. 1 .

According to various embodiments, the electronic device 200 may include the reinforcing member 260 disposed in the inner space of the lens frame 202 and formed to have a higher rigidity than that of the lens frame 202 .

According to various embodiments, the electronic device 200 may include a lens structure 270 . The lens structure 270 may refract at least a portion of light. For example, the lens structure 270 may be a prescription lens with a specified refractive power. According to an exemplary embodiment, the lens structure 270 may be disposed behind (eg, in the +Y direction) of the second window member (not shown) of the display member 201 . For example, the lens structure 270 may be positioned between the display member 201 and the user's eye. For example, the lens structure 270 may face one surface of the display member.

According to various embodiments, the housing 210 may include a hinge cover 227 that may conceal a portion of the hinge structure 229 . Another portion of the hinge structure 229 may be accommodated or concealed between the inner case 231 and the outer case 233 to be described later.

According to various embodiments, the wearing member 203 may include an inner case 231 and an outer case 233 . The inner case 231 is, for example, a case configured to face the user's body or directly contact the user's body, and may be made of a material having low thermal conductivity, for example, a synthetic resin. According to an embodiment, the inner case 231 may include an inner side (eg, the inner side 231c of FIG. 2 ) facing the user's body. The outer case 233 may include, for example, a material (eg, a metal material) capable of at least partially transferring heat, and may be coupled to the inner case 231 to face the inner case 231 . According to an embodiment, the outer case 233 may include an outer side opposite to the inner side 231c (eg, the outer side 231d of FIG. 2 ). In an embodiment, at least one of the circuit board 241 and the speaker module 245 may be accommodated in a space separated from the battery 243 in the wearing member 203 . In the illustrated embodiment, the inner case 231 includes a first case 231a including a circuit board 241 and/or a speaker module 245 and a second case 231b for accommodating the battery 243 . The outer case 233 may include a third case 233a coupled to face the first case 231a, and a fourth case 233b coupled to face the second case 231b. can For example, the first case 231a and the third case 233a are coupled (hereinafter, '

first case parts

231a and 233a') to accommodate the circuit board 241 and/or the speaker module 245 . The second case 231b and the fourth case 233b may be coupled (hereinafter, '

second case parts

231b and 233b') to accommodate the battery 243 .

According to various embodiments, the

first case portions

231a and 233a are rotatably coupled to the lens frame 202 through the hinge structure 229 , and the

second case portions

231b and 233b are connected to the connection structure 235 . It may be connected or mounted to the ends of the

first case parts

231a and 233a through the . In some embodiments, a portion of the connection structure 235 in contact with the user's body may be made of a material having low thermal conductivity, for example, an elastic material such as silicone, polyurethane, or rubber. , the part that does not come into contact with the user's body may be made of a material with high thermal conductivity (eg, a metal material). For example, when heat is generated from the circuit board 241 or the battery 243 , the connection structure 235 blocks heat from being transferred to a portion in contact with the user's body, and heat is transferred through a portion that does not contact the user's body. It can be dispersed or released. According to an embodiment, a portion of the connection structure 235 configured to contact the user's body may be interpreted as a part of the inner case 231 , and a portion of the connection structure 235 that does not contact the user's body is an outer case ( 233) can be interpreted as part of the According to an embodiment (not shown), the first case 231a and the second case 231b are integrally configured without the connection structure 235 , and the third case 233a and the fourth case 233b are connected to each other. It may be integrally configured without the structure 235 . According to various embodiments, other components (eg, the antenna module 197 of FIG. 1 ) may be further included in addition to the illustrated components, and by using the communication module 190 , the network (eg, the first example of FIG. 1 ) may be included. Information about a thing or environment may be provided from an external electronic device (eg, the

electronic devices

102 and 104 or the server 108 of FIG. 1 ) through the first network 198 or the second network 199 ). .

2 to 5 , the electronic device 200 is described using a wearable electronic device in the form of glasses as an example, but the present disclosure is not limited thereto. For example, the electronic device 200 may include a device that performs a specific function according to a loaded program, such as an electronic notebook, a portable multimedia player, a mobile communication terminal, a tablet PC, an image/sound device, a desktop/laptop computer, and a vehicle navigation system. may mean, and the present disclosure is applicable to all electronic devices on which a circuit board is mounted among these electronic devices.

According to various embodiments, the electronic device 200 includes a housing 210 , a light output module (eg, the light output module 211 of FIGS. 3 and 4 ), a circuit board 241 , and a first shielding member 410 . may include. The configuration of the housing 210 , the light output module 211 , and the circuit board 241 of FIG. 6 includes the housing 210 , the light output module 211 , and the circuit board 241 of FIGS. 3 and 4 . Some or all of the composition may be the same.

According to various embodiments, the housing 210 is configured to form the exterior of the electronic device 200 and may provide a space in which components may be disposed. The housing 210 includes a first plate 310 facing a first direction (+Z-axis direction), and a second plate facing a second direction (-Z-axis direction) opposite to the first direction (+Z-axis direction). 320 may be included. For example, when the electronic device 200 is a wearable electronic device including glasses, the first plate 310 may be a part of the inner case 231 of FIG. 5 , and the second plate 320 may be 5 may be a part of the outer case 233 . As another example, when the electronic device 200 is a wearable electronic device including glasses, the first plate 310 may be a part of the outer case 233 of FIG. 5 , and the second plate 320 may be 5 may be a part of the inner case 231 .

According to an embodiment, various structures may be formed on the inner surface of the housing 210 according to the arrangement of electronic components disposed inside the electronic device 200 or the bonding structure between the housing 210 and the internal electronic component. have. For example, a space for accommodating the circuit board 241 and/or electrical components (eg, integrated circuit chips) mounted on the circuit board 241 may be formed in the housing 210 , the circuit board 241 and /or the space for accommodating the integrated circuit chips may be formed in a recessed shape or a structure such as a rib surrounding the integrated circuit chip.

According to an embodiment, the first plate 310 may include a plurality of first protruding portions 311 protruding toward the second plate 320 . The plurality of first protruding parts 311 are various for fixing or guiding the circuit board 241 and/or the first

electrical components

421 and 422 disposed between the first plate 310 and the second plate 320 . shape can be designed.

According to an embodiment, the second plate 320 may include a plurality of second protruding parts 321 protruding toward the first plate 310 . The plurality of second protruding parts 321 are various for fixing or guiding the circuit board 241 and/or the second electrical components 423 disposed between the first plate 310 and the second plate 320 . shape can be designed.

According to an exemplary embodiment, the circuit board 241 coupled to the first shielding member 410 includes a plurality of first protruding portions 311 and a plurality of first protruding portions 311 and a plurality of portions between the first plate 310 and the second plate 320 . It is supported and fixed by the dog's second protruding parts 321 , so movement may be restricted. For example, at least one of the plurality of second protruding portions 321 is disposed in contact with the second surface 330b of the circuit board 241 (eg, a surface facing the second plate 320 ), and thus the circuit Movement of the substrate 241 in the direction of the second plate 320 may be restricted. As another example, at least one of the first protruding portions 311 may include a first shielding member ( 410 , the circuit board 241 may limit movement in the direction of the first plate 310 .

According to an embodiment, at least one 1-1 protruding part 311a of the plurality of first protruding parts 311 faces the circuit board 241 and/or the 1-1 electrical component 421 . can be arranged to do so. The 1-1 protruding portion 311a may have a flat end and may be disposed in contact with the outer surface of the first shielding member 410 shielding the 1-1 electrical component 421 . The first surface 330a of the circuit board 241 and the first shielding member 410 are designed to be coupled by, for example, a soldering method or a conductive adhesive member, and at least one 1-1 protruding part ( 311a is disposed to press the first shielding member 410 in the second direction (-Z-axis direction), thereby limiting the movement of the circuit board 241 .

According to another embodiment, at least one 1-2 protruding part 311b of the plurality of first protruding parts 311 may be formed along the edge of the first shielding member 410 by the second plate 320 or It may be formed to protrude toward the circuit board 241 . At least one 1-2 protrusion part 311b is disposed along a side surface of the first shielding member 410 coupled to the circuit board 241 , so that the first shielding member 410 and the circuit board 241 are separated from each other. Movement in a third direction perpendicular to the first direction (+Z-axis direction) and/or the second direction (-Z-axis direction) may be restricted.

According to another embodiment, at least one of the first 1-3 protruding parts 311c among the plurality of first protruding parts 311 is a guide part 3111 disposed along an edge of the first shielding member 410 . and a hook end 3112 protruding toward the first shielding member 410 . As the guide part 3111 is disposed along the outer surface of the first shielding member 410 coupled to the circuit board 241 , the first shielding member 410 moves in the first direction (+Z-axis direction) and/or the second Movement in a third direction perpendicular to the second direction (-Z-axis direction) may be restricted. The hook end 3112 may be manufactured in a through hook shape so as to be inserted into a hole or groove-shaped recess formed on the outer surface of the first shielding member 410 , and thus, the first portion coupled to the circuit board 241 . The shielding member 410 may be fixed so as not to deviate from a designated position.

According to various embodiments, the circuit board 241 may provide a space for mounting a plurality of electrical components (eg, an integrated circuit chip). For example, the circuit board 241 includes a first surface 330a facing the first plate 310 and a second surface 330b facing the second plate 320 , the first surface 330a and / Alternatively, a plurality of

electrical components

421 , 422 , and 423 may be mounted on the second surface 330b. According to an embodiment, the first surface 330a of the circuit board 241 may be spaced apart from the plurality of first protruding portions 311 of the first plate 310 . For example, the second surface 330b of the circuit board 241 may be disposed in contact with the plurality of second protruding portions 321 of the second plate 320 .

According to an embodiment, first

electrical components

421 and 422 may be disposed on the first surface 330a of the circuit board 241 . The first surface 330a of the circuit board 241 may include at least one 1-1 region S11 and at least one 1-2 region S12 adjacent to the 1-1 region S11. can When viewed from above the first plate 310 by projecting the internal structure, at least a portion of the 1-1 region S11 of the circuit board 241 is the 1-1 protrusion 311a of the first plate 310 . ) and overlapping regions. For example, in the first-first region S11 of the circuit board 241 , the first shielding member 410 (eg, the first connection part 410a) is interposed therebetween, and the It may be a region facing the 1-1 protrusion 311a. As another example, the 1-2 th region S12 of the circuit board 241 may be a region that does not overlap the 1-1 th protruding part 311a among the first protruding parts 311 of the first plate 310 . .

According to an embodiment, the height (eg, thickness) of the electrical components that can be mounted on the 1-1 region S11 of the circuit board 241 is the height (eg, thickness) of the electrical components mounted on the 1-2 th region S12 of the circuit board 241 . It may be smaller than the height of possible electrical components. For example, in the 1-1 region S11, only electrical components (eg, the 1-1 electrical component 421) having a height of d1 or less may be mounted by the 1-1 protrusion part 311a. In addition, in the 1-2 region S12 , there is no separate structure in the first direction (+Z-axis direction), so electrical components having a height of d2 or less (eg, 1-2 electric parts relatively larger than d1) are not present. component 422) may be mounted. According to another embodiment, when there are a plurality of first-2 electrical components 422 , each component may have a different size (eg, height), so that the 1-2 first area S12 may be divided into two or more areas. have.

According to an embodiment, second electrical components 423 may be disposed on the second surface 330b of the circuit board 241 . As the second protruding parts 321 are disposed in contact with one region of the second surface 330b of the circuit board 241 , the second electrical components 423 are formed except for the region where the second protruding part 321 is located. can be placed in the area.

According to an embodiment, at least some of the first

electrical components

421 and 422 and/or the second electrical components 423 are heat sources that generate heat, for example, a power management integrated circuit (PMIC), a PAM (power management integrated circuit) It may include at least one of a power amplifier), an application processor (AP), a communication processor (CP), a charger integrated circuit (IC), and a DC converter.

According to various embodiments, the first shielding member 410 is disposed on the first surface 330a of the circuit board 241 in a state of accommodating the first

electrical components

421 and 422 of the circuit board 241, It may be formed to be fixed and/or supported by the first protruding parts 311 . The first shielding member 410 provides a shielding function against electromagnetic waves that may be generated by the first

electrical components

421 and 422 and generates heat that may be generated by the first

electrical components

421 and 422 to the first electrical component ( 421,422) may provide a heat conduction function for transferring to the outside.

According to an embodiment, the first shielding member 410 may have a flexible structure and may be formed to entirely surround the first

electrical components

421 and 422 . For example, in order to be disposed in direct contact with the plurality of surfaces of the first

electrical components

421 and 422 , at least a portion may form an inclined surface and/or a curved surface.

According to an embodiment, the flexible structure of the first shielding member 410 includes a plurality of components (eg, 1-1) having different heights disposed on the first surface 330a of the circuit board 241 . The electrical component 421 and the 1-2-th electrical component 422 may be entirely covered. For example, the first shielding member 410 performs pre-forming to cover parts having different heights using a silicone compression jig, and includes an inclined surface or a curved surface through the pre-forming. can provide As another example, the first shielding member 410 has a three-dimensional shape (eg, conformal type) structure to encapsulate parts of various sizes and shapes disposed on the circuit board 241 into a single sheet paper. and can provide a shielding function through it. According to one embodiment, the first shielding member 410 may be provided by designing at least one of stainless steel (SUS), nickel silver, graphite, copper, or electromagnetic interference (EMI) paint in the form of a sheet or plate advantageous for shielding. According to one embodiment, the first shielding member 410 is a first protrusion of the housing 210 to support the circuit board 241 and/or the first

electrical components

421 and 422 in the housing 210 . It may be directly connected and/or coupled to the portions 311 . The first protruding portions 311 are disposed in direct contact with one region of the first shielding member 410 rather than the first surface 330a of the circuit board 241, and thus the circuit board 241 is attached to the housing ( 210) may be supported and/or secured within. As the first protruding parts 311 are spaced apart from the circuit board 241 , a space in which the first

electrical components

421 and 422 can be mounted on the circuit board 241 may be expanded.

According to an embodiment, the first shielding member 410 may include first connecting portions 410a connected to (eg, in contact with) the first protruding portions 311 . The first connection parts 410a of the first shielding member 410 are at least one 1-1 connection part 411 spaced apart from the middle region of the circuit board 241 , and in the edge region of the circuit board 241 . It may include at least one 1-2 connection part 412 and a 1-3 th connection part 413 for fixing the circuit board 241 not to move. For example, the at least one 1-1 connection portion 411 of the first shielding member 410 is a portion connected to the 1-1 protrusion portion 311a, and is a portion connected to the middle region (eg, the circuit board 241 ). : It may be designed in a position corresponding to the 1-1 region (S11)). The 1-1 connection part 411 of the shielding member 410 may be disposed in direct contact with the 1-1 protrusion part 311a to support the intermediate region of the circuit board 241 so as not to be bent. As another example, at least one 1-2 connection portion 412 and a 1-3 connection portion 413 of the first shielding member 410 are disposed along an edge region of the circuit board 241 , It is in direct contact with the 1-2 protrusion part 311b and the 1-3 protrusion part 311c, and vibration of the circuit board 241 may be prevented. As another example, one region of the 1-3 connection part 413 may include a recess in the shape of a groove or a hole in which the hook end 3112 of the 1-3 protrusion part 311c may be located. The 1-3 connecting portion 413 includes a recess corresponding to the hook end 3112 so that the hook end 3112 of the 1-3 protruding portion 311c can be inserted and fixed, so that the circuit Side fixing of the first shielding member 410 coupled to the substrate 241 may be provided.

According to various embodiments, the electronic device 200 includes a housing 210 , a light output module (eg, the light output module 211 of FIGS. 3 and 4 ), a circuit board 241 , a first shielding member 410 , and a second shielding member 430 . The configuration of the housing 210 and the circuit board 241 of FIG. 7 is the same as that of the housing 210 , the light output module 211 , and the circuit board 241 of FIGS. 2 to 5 in part or in whole can do. The configuration of the first shielding member 410 of FIG. 7 may be partially or entirely the same as the configuration of the first shielding member 410 of FIG. 6 .

According to various embodiments, the housing 210 is configured to form the exterior of the electronic device 200 and may provide a space in which components may be mounted. The housing 210 includes a first plate 310 facing a first direction (+Z-axis direction), and a second plate facing a second direction (-Z-axis direction) opposite to the first direction (+Z-axis direction). 320 may be included.

According to an embodiment, various structures may be formed on the inner surface of the housing 210 according to the arrangement of electronic components disposed inside the electronic device 200 or the bonding structure between the housing 210 and the internal electronic component. have. According to an embodiment, the circuit board 241 coupled to the first shielding member 410 and the second shielding member 430 is disposed between the first plate 310 and the second plate 320 , and a plurality of first It is supported and fixed by the protruding parts 311 and the plurality of second protruding parts 321 , so that movement may be restricted.

electrical components

421 and 422 disposed between the first plate 310 and the second plate 320 . shape can be designed. A plurality of first protruding parts 311, for example, at least one 1-1 protrusion 311a, at least one 1-2 protrusion part 311b, and at least one 1-3 protrusion The configuration of the portion 311c includes at least one 1-1 protrusion part 311a, at least one 1-2 protrusion part 311b, and at least one 1-3 protrusion part 311c of FIG. 6 . configuration can be applied mutatis mutandis.

According to an embodiment, the second plate 320 may include a plurality of second protruding parts 321 protruding toward the first plate 310 . The plurality of second protruding parts 321 are various for fixing or guiding the circuit board 241 and/or the second electrical components 423,424 disposed between the first plate 310 and the second plate 320 . shape can be designed.

According to an embodiment, at least one 2-1 protrusion part 321a of the plurality of second protrusion parts 321 faces the circuit board 241 and/or the 2-1 th electrical component 423 . can be arranged to do so. The 2-1 protrusion portion 321a may have a flat end and may be disposed in contact with the outer surface of the second shielding member 430 shielding the 2-1 th electrical components 423 . The second surface 330b of the circuit board 241 and the second shielding member 430 are designed to be coupled to each other, and at least one 2-1 protrusion portion 321a forms the second shielding member 430 . It is arranged to press in one direction (+Z-axis direction), so that movement of the circuit board 241 can be restricted.

According to another embodiment, at least one 2-2 protrusion part 321b of the plurality of second protrusion parts 321 may be formed along the edge of the second shielding member 430 by the first plate 310 or It may be formed to protrude toward the circuit board 241 . At least one 2-2 protrusion part 321b is disposed along the outer surface of the second shielding member 430 coupled to the circuit board 241 , so that the second shielding member 430 moves in the first direction (+Z). axial direction) and/or movement in a third direction perpendicular to the second direction (-Z-axis direction) may be restricted.

According to another exemplary embodiment, at least one 2-3 protrusion part 321c of the plurality of second protrusion parts 321 includes a guide part and a second part disposed along an edge of the second shielding member 430 . It may include a hook end protruding toward the shielding member 430 . As the guide portion is disposed along the outer surface of the second shielding member 430 coupled to the circuit board 241, the second shielding member 430 moves in the first direction (+Z-axis direction) and/or in the second direction ( -Z-axis direction) and the third direction perpendicular to the movement can be restricted. The hook end may be manufactured in a through hook shape to be inserted into a hole or groove-shaped recess formed on the outer surface of the second shielding member 430 , and thus the second shielding member coupled to the circuit board 241 ( 430) can be fixed so as not to deviate from the designated position. According to one embodiment, the position of the 2-3 protruding portion 321c is not limited to one side of the second shielding member 430 as shown in FIG. 7 , and various design changes can be made to be disposed on the other side or both sides. According to various embodiments, the circuit board 241 may provide a space in which a plurality of electrical components (eg, integrated circuit chips) may be disposed. For example, the circuit board 241 includes a first surface 330a facing the first plate 310 and a second surface 330b facing the second plate 320 , the first surface 330a and / Alternatively, a plurality of

electrical components

421 , 422 , 423,424 may be mounted on the second surface 330b . According to an embodiment, the first surface 330a of the circuit board 241 may be spaced apart from the plurality of first protruding portions 311 of the first plate 310 . The second surface 330b of the circuit board 241 may be spaced apart from the plurality of second protruding portions 321 of the second plate 320 .

According to an embodiment, first

electrical components

421 and 422 may be disposed on the first surface 330a of the circuit board 241 . The relationship between the first

electrical components

421 and 422 mounted on the first surface 330a of the circuit board 241 and the first protruding parts 311 of the first plate 310 applies the configuration of FIG. 6 mutatis mutandis. can do.

According to an embodiment, second electrical components 423,424 may be disposed on the second surface 330b of the circuit board 241 . The second surface 330b of the circuit board 241 may include a 2-1 region S21 and at least one 2-2 region S22 adjacent to the 2-1 region S21. The 2-1-th region S21 may be a region at least partially facing the 2-1-th protruding part 321a, and the 2-2nd region S22 is a second protruding part ( 321) may be an area that does not face them. Accordingly, in the 2-1 region S21, electric components having a height (eg, thickness) of the mountable electrical components smaller than the height of the mountable electrical components in the 2-2 region S22 may be located. For example, in the 2-1 region S21, only electrical components (eg, the 2-1 electrical component 423) having a height of d3 or less may be mounted by the 2-1 protrusion part 321a. There is no separate structure in the 2-2 region S22 in the second direction (-Z-axis direction), so electrical components having a height of d4 or less (eg, 2-2 electricity) that are relatively larger than d3 are not present. component 424) may be mounted.

According to various embodiments, a first shielding member 410 formed to surround the first

electrical components

421 and 422 is disposed on the first surface 330a of the circuit board 241 , and the second surface of the circuit board 241 . A second shielding member 430 formed to surround the second electrical components 423 may be disposed on the 330b.

According to an embodiment, the first and

second shielding members

410 and 430 provide a shielding function against electromagnetic waves that may be generated by the first and second electrical components 421,422, 423,424, and the first and second electrical components 421,422, 423,424. It is possible to provide a heat conduction function for transferring heat that may be generated by the first and second

electrical components

421 , 422 , 423,424 to the outside. The first and

second shielding members

410 and 430 may have a flexible structure and may be formed to entirely surround the first and second

electrical components

421 , 422 , 423,424 . For example, in order to be disposed in direct contact with the plurality of surfaces of the first and second

electrical components

421 , 422 , 423,424 , at least a portion may form an inclined surface and/or a curved surface.

A configuration of the first shielding member 410 of FIG. 7 may be partially or entirely the same as that of the first shielding member 410 of FIG. 6 . Hereinafter, the second shielding member 430 not shown in FIG. 6 will be described.

According to various embodiments, the second shielding member 430 is a second protruding portion of the housing 210 ( 321) can be directly connected and/or combined with The second protruding portions 321 are disposed in direct contact with one region of the second shielding member 430 rather than the second surface 330b of the circuit board 241, and thus the circuit board 241 is attached to the housing ( 210) may be supported and/or secured within. As the second protruding parts 321 are spaced apart from the circuit board 241 , a space in which the second electrical components 423,424 can be mounted on the circuit board 241 may be expanded.

According to an embodiment, the second shielding member 430 may include second connecting portions 430a connected to the second protruding portions 321 . The second connection portions 430a of the second shielding member 430 include at least one 2-1 connection portion 431 spaced apart from the middle region of the second surface 330b of the circuit board 241 , the circuit board. It is located in the edge region of the 241 and may include at least one 2-2 connection part 432 and a 2-3 connection part 433 for fixing the circuit board 241 not to move. For example, at least one 2-1 connecting portion 431 of the second shielding member 430 is a portion connected to the 2-1 protruding portion 321a, and the second surface ( 330b) may be designed at a position corresponding to the middle region (eg, the 2-1 region S21). The 2-1 th connection part 431 may be disposed in direct contact with the 2-1 th protrusion part 321a to support the intermediate region of the circuit board 241 so as not to be bent. As another example, at least one 2-2 connection portion 432 and a 2-3 connection portion 433 of the second shielding member 430 are disposed along an edge region of the circuit board 241 , The 2-2 protrusion part 321b and the 2-3rd protrusion part 321c are in direct contact with each other, and vibration of the circuit board 241 can be prevented. As another example, one region of the 2-3 th connection part 433 may include a recess in the shape of a groove or a hole in which the hook end of the 2-3 th protruding part 321c may be located. The 2-3 th connection portion 433 includes a recess corresponding to the hook end so that the hook end of the 2-3 th protruding portion 321c can be inserted and fixed, so that it is coupled to the circuit board 241 . Side fixing of the second shielding member 430 may be provided.

According to various embodiments, the electronic device 200 includes a housing 210 , a light output module (eg, the light output module 211 of FIGS. 2 to 5 ), a circuit board 241 , and a first shielding member (eg, a first shielding member). The first shield can 510) and a second shielding member (eg, the second shield can 530) may be included. The configuration of the housing 210 and the circuit board 241 of FIG. 7 is the same as that of the housing 210 , the light output module 211 , and the circuit board 241 of FIGS. 2 to 5 in part or in whole can do.

According to various embodiments, the first shielding member and the second shielding member of FIG. 8 may have different structures from the first shielding member 410 and the second shielding member 430 of FIGS. 6 and 7 . For example, the first shielding member of FIG. 8 is spaced apart from the first electrical components 420a by a specified distance, and a first direction (+Z-axis direction) and a first direction (+) toward the first plate 310 . Z-axis direction) and has a closed rectangular shape, and may be a first shield can 510 made of a stainless-based material such as SUS. The second shielding member is spaced apart from the second electrical components 420b by a specified distance, and is perpendicular to the second direction (-Z-axis direction) and the second direction (-Z-axis direction) facing the second plate 320 . It may have a rectangular shape with one side closed, and may be a second shield can 530 made of a stainless-based material such as SUS.

According to an embodiment, various structures may be formed on the inner surface of the housing 210 according to the arrangement of electronic components disposed inside the electronic device 200 or the bonding structure between the housing 210 and the internal electronic component. have. According to an embodiment, the circuit board 241 formed by being coupled to the first shield can 510 and the second shield can 530 is disposed between the first plate 310 and the second plate 320 , and a plurality of first It is supported and fixed by the protruding parts 315 and the plurality of second protruding parts 325 , so that movement may be restricted.

According to an embodiment, the first plate 310 may include a plurality of first protruding portions 315 protruding toward the second plate 320 . According to another embodiment, the second plate 320 may include a plurality of second protruding portions 325 protruding toward the first plate 310 . The plurality of first protruding portions 315 and second protruding portions 325 include a circuit board 241 and/or an electrical component 420a disposed between the first plate 310 and the second plate 320 ; 420b) can be designed in various forms for fixing or guiding.

According to an embodiment, the at least one first protruding portion 315 may be formed to protrude toward the second plate 320 or the circuit board 241 along the edge of the first shield can 510 . . For example, the first protruding part 315 may include a 1-1 protruding part 315a and a 1-2 protruding part 315b, and the 1-1 protruding part 315a and the 1-th protruding part 315b. The second protruding portion 315b is disposed along the outer surface of the first shield can 510 coupled to the circuit board 241 , so that the first shield can 510 moves in the first direction (+Z-axis direction) and/or Movement in a third direction perpendicular to the second direction (-Z-axis direction) may be restricted. According to an exemplary embodiment, the first-first protruding portion 315a may have a hook end and be positioned in one area of the first shield can 510 . For example, the first shield can 510 may include a groove or a groove-shaped recess for the end of the hook, and the recess may have a minimum size for shielding performance.

According to another embodiment, according to one embodiment, the at least one second protruding portion 325 faces the first plate 310 or the circuit board 241 along the edge of the second shield can 530 . It may be formed to protrude to do so. The second protrusion part 325 may include a 1-1 protrusion part 325a and a 1-2 protrusion part 325b, and a 1-1 protrusion part 325a and a 1-2 protrusion part ( 325b) is disposed along the outer surface of the second shield can 530 coupled to the circuit board 241, so that the second shield can 530 moves in the first direction (+Z-axis direction) and/or in the second direction ( -Z-axis direction) and the third direction perpendicular to the movement can be restricted. According to an embodiment, the 2-1 protrusion part 325a may have a hook end formed therein, and may be positioned in an area of the second shield can 530 . The second shield can 530 may include a groove or a groove-shaped recess for the end of the hook, and the recess may have a minimum size for shielding performance.

According to various embodiments, the first surface 330a of the circuit board 241 may be spaced apart from the plurality of first protruding portions 315 of the first plate 310 . The second surface 330b of the circuit board 241 may be spaced apart from the plurality of second protruding portions 325 of the second plate 320 .

According to various embodiments, the first shield can 510 may be coupled to at least a portion of the first surface 330a of the circuit board 241 by a soldering method, and the second shield can 530 may be connected to the circuit board 241 . ) may be coupled to at least a portion of the second surface 330b by a soldering method. The first shield can 510 provides a shielding function against electromagnetic waves that may be generated by the first electrical components 420a, and generates heat that may be generated by the first electrical components 420a to the first electrical component ( 420a) may provide a heat conduction function for transferring to the outside. The second shield can 530 provides a shielding function against electromagnetic waves that may be generated by the second electrical components 420b and dissipates heat that may be generated by the second electrical components 420b to the second electrical component ( 420b) may provide a heat conduction function for transferring to the outside.

According to various embodiments, the first shield can 510 is provided with a first protruding portion ( 315) may be directly connected and/or combined. According to various embodiments, the second shield can 530 is provided with a second protruding portion ( 325) may be directly connected and/or combined. The first protruding parts 315 are disposed in direct contact with one area of the first shield can 510, not the first surface 330a of the circuit board 241, and thus the circuit board 241 is attached to the housing ( 210) may be supported and/or secured within. The second protruding parts 325 are disposed in direct contact with one area of the second shield can 530, not the second surface 330b of the circuit board 241, and thus the circuit board 241 is attached to the housing ( 210) may be supported and/or secured within. The first and second protruding

parts

315 and 325 are spaced apart from the circuit board 241 so that electrical components (eg, the first and second

electrical components

420a and 420b) can be mounted on the circuit board 241 . space can be expanded.

According to various embodiments, a heat transfer member (not shown) for easily diffusing heat may be further included between the first shield can 510 and the first electrical component 420a. According to various embodiments, a heat transfer member (not shown) for easily diffusing heat may be further included between the second shield can 530 and the second electrical component 420b. The heat transfer member may include various heat dissipating materials or members. For example, it may be configured to include a thermal interface material (TIM), a heat pipe, a vapor chamber, a heat dissipation sheet, or a heat dissipation paint. Here, the material of the heat dissipation sheet or the heat dissipation paint may include, for example, graphite, carbon nanotubes, a natural regenerated material, silicon, silicon, or a high heat conductivity material such as graphite. As another example, the carbon fiber TIM (carbon fiber TIM) may include at least one of a liquid phase thermal interface material (TIM) and/or a solid phase thermal interface material (TIM).

9 is a projection view of an electronic device showing connection portions of a shielding member coupled to a circuit board and a shielding member coupled to a housing, according to various embodiments of the present disclosure;

According to various embodiments, the electronic device 200 may include a housing 210 , a circuit board 241 , and a first shielding member 410 . The configuration of the housing 210 , the circuit board 241 , and the first shielding member 410 of FIG. 9 is the configuration of the housing 210 , the circuit board 241 , and the first shielding member 410 of FIG. 6 . and some or all of it may be the same.

According to various embodiments, the housing 210 is configured to form the exterior of the electronic device 200 and may provide a space in which components may be mounted. According to an embodiment, various structures may be formed on the inner surface of the housing 210 according to the arrangement of electronic components disposed inside the electronic device 200 or the bonding structure between the housing 210 and the internal electronic component. have. For example, a space for accommodating the circuit board 241 and/or electrical components (eg, integrated circuit chips) mounted on the circuit board 241 may be formed in the housing 210 , the circuit board 241 and / Alternatively, the space for accommodating the integrated circuit chips may be formed in a recessed shape or a structure such as a rib surrounding the integrated circuit chip (eg, the first protruding portion 311 ).

According to various embodiments, first

electrical components

421 and 422 may be disposed on the first surface 310a of the circuit board 241 . The housing 310 may include a first protruding portion (eg, the first protruding portion 311 of FIG. 6 ) formed to face the side surface and the first surface 310a of the circuit board 241 .

According to various embodiments, the first shielding member 410 may include first connecting portions 410a connected to the first protruding portions 311 . The first connection parts 410a of the first shielding member 410 are at least one 1-1 connection part 411 spaced apart from the middle region of the circuit board 241 , and in the edge region of the circuit board 241 . It may include at least one 1-2 connection part 412 and a 1-3 th connection part 413 for fixing the circuit board 241 not to move.

According to an exemplary embodiment, the 1-1 connection part 411 is disposed in direct contact with the 1-1 protrusion part (eg, the 1-1 protrusion part 311a of FIG. 6 ), so that the circuit board 241 is formed. The middle region can be supported so that it does not bend. The 1-2 connection part 412 and the 1-3 connection part 413 are disposed along the edge region of the circuit board 241 , and the 1-2 protrusion part (eg, 1-2 in FIG. 6 ). The protrusion part 311b) and the 1-3 protrusion part (eg, the 1-3 protrusion part 311c of FIG. 6 ) are in direct contact to prevent shaking of the circuit board 241 . According to another embodiment, one region of the 1-3 connection part 413 may include a recess in the shape of a groove or a hole through which the hook end of the 1-3 protrusion part may pass. The 1-3 connecting portion 413 includes a recess corresponding to the hook end so that the hook end of the 1-3 protruding portion can be inserted and fixed, so that the first connected portion 413 is coupled to the circuit board 241 . Side fixing of the shielding member 410 may be provided.

The electronic device (eg, the electronic device 200 of FIGS. 2 to 5 ) according to various embodiments of the present disclosure includes a first plate (eg, the first plate 310 of FIG. 6 ) facing a first direction and the A housing including a second plate (eg, the second plate 320 of FIG. 6 ) facing a second direction opposite to the first direction, wherein the first plate has a first protrusion formed to protrude toward the second plate A housing (eg, the housing 210 of FIG. 6 ) including (eg, 311 of FIG. 6 ), an optical output module disposed in the housing and configured to output an image (eg, the optical output module of FIGS. 2 to 5 ) (211)), disposed in the housing, the circuit board comprising a first surface on which at least one first electrical component (eg, the first electrical component 421, 422 of FIG. 6) is disposed to face the first plate; (eg, the circuit board 241 of FIG. 6 ), and in a state for accommodating the at least one first electrical component, disposed on the first surface of the circuit board, and fixed by the first protruding portion or It may include a first shielding member (eg, the first shielding member 410 of FIG. 6 ) formed to be supported. The first surface of the circuit board may be spaced apart from the first protruding portion.

According to various embodiments, the circuit board may be disposed between the first plate and the second plate to be spaced apart from the first plate and the second plate.

According to various embodiments, the first shielding member may be disposed in contact with one surface of the first plate while being coupled to the first surface of the circuit board.

According to various embodiments, the first shielding member may provide a three-dimensional structure to encapsulate a plurality of electrical elements disposed on the circuit board into a single sheet paper.

According to various embodiments, the first protrusion part may include a 1-1 protrusion part (eg, the 1-1 protrusion part 311a of FIG. 6 ) disposed to face at least one of the first electrical components. may include The first-first protrusion portion may be formed to press at least a portion of an outer surface of the first shielding member in the second direction to limit movement of the circuit board.

According to various embodiments, the circuit board includes a 1-1 region (eg, a 1-1 region S11 of FIG. 6 ) formed to face the 1-1 protrusion portion, and the 1-1 protrusion portion It does not face the 1-1 region and may include a 1-2 th region (eg, a 1-2 th region S12 of FIG. 6 ) formed adjacent to the 1-1 region. A thickness of one of the first electrical components to be disposed in the 1-1 region may be smaller than a thickness of another one of the first electrical components to be disposed in the 1-2 th region.

According to various embodiments, the first protrusion part may include a 1-2 protrusion part (eg, a first protrusion part of FIG. 6 ) disposed to face the second plate or the circuit board along an edge of the first shielding member. -2 protruding portion 311b). As the 1-2 protrusion part is disposed along a side surface of the first shielding member coupled to the circuit board, movement of the circuit board in a third direction perpendicular to the first direction may be restricted.

According to various embodiments, the first protruding portion may include a guide portion disposed along an edge of the first shielding member (eg, the guide portion 3111 of FIG. 6 ) and a hook protruding toward the first shielding member. and a 1-3 th protruding portion (eg, a 1-3 th protruding portion 311c of FIG. 6 ) including an end (eg, the hook end 3112 of FIG. 6 ). The hook end of the 1-3 protruding part may be inserted into a recess formed in a side surface of the first shielding member to fix the first shielding member coupled to the circuit board so as not to deviate from a designated position. .

According to various embodiments, the guide part of the 1-3 protrusion part is disposed along a side surface of the first shielding member coupled to the circuit board, so that the circuit board is a first direction perpendicular to the first direction. You can restrict movement in 3 directions.

According to various embodiments, the second plate includes a second protruding portion (eg, the second protruding portion 321 of FIG. 7 ) protruding toward the first plate, and the second protruding portion includes the circuit It may be disposed in contact with a second surface opposite to the first surface of the substrate to limit movement of the circuit board in the direction of the second plate.

According to various embodiments, the electronic device may further include a second shielding member (eg, the second shielding member 430 of FIG. 7 ) formed to face the first shielding member with the circuit board interposed therebetween. . The second plate may include a second protruding portion protruding toward the first plate, and the circuit board may include a second surface on which at least one second electrical component is disposed to face the second plate. have. The second shielding member may be disposed on the second surface of the circuit board in a state of accommodating the at least one second electrical component, and be fixed or supported by the second protruding portion.

According to various embodiments, the second surface of the circuit board may be spaced apart from the second protruding portion.

According to various embodiments, the second shielding member may provide a three-dimensional structure to encapsulate a plurality of electrical elements disposed on the circuit board into one sheet paper.

According to various embodiments, the second protrusion part may include a 2-1 protrusion part (eg, the 2-1 protrusion part 321a of FIG. 7 ) disposed to face at least one of the second electrical components. and wherein the 2-1 protrusion part is formed to press at least a portion of the outer surface of the second shielding member in the first direction to restrict movement of the circuit board in the first direction or the second direction. can

According to various embodiments, the second protrusion part may include a 2-2 protrusion part (eg, a second protrusion part of FIG. 7 ) disposed to face the first plate or the circuit board along an edge of the second shielding member. -1 protruding part 321b), wherein the 2-2 protruding part is disposed along a side surface of the second shielding member coupled to the circuit board, so that the circuit board is perpendicular to the first direction Movement in the third direction may be restricted.

According to various embodiments, the first shielding member is spaced apart from the first electrical components by a specified distance, and a first direction toward the first plate and one surface perpendicular to the first direction are closed in a rectangular shape. , may include a shield can made of a stainless-based material.

The electronic device (eg, the electronic device 200 of FIGS. 2 to 5 ) according to various embodiments of the present disclosure includes a lens frame (eg, the lens frame 202 of FIGS. 2 to 5 ) for accommodating the display member; A wearing member extending from the lens frame and including a first case (eg, a first case 231a) and a second case (eg, a second case 231b), wherein the first case supports the second case A wearing member including a first protruding portion (eg, the first protruding portion 311 in FIG. 6 ) protruding toward the wearing member, disposed within the wearing member, and at least one first electric component disposed to face the first case a circuit board (eg, the circuit board 241 of FIG. 6 ) including a first surface, and disposed on the first surface of the circuit board to receive the at least one first electrical component, and a first shielding member (eg, the first shielding member 410 of Fig. 6 ) formed to be fixed or supported by the first protrusion portion, the first surface of the circuit board may include the first protrusion portion and may be spaced apart from each other.

According to various embodiments, the circuit board may be disposed to be spaced apart from the first case and the second case between the first case and the second case.

According to various embodiments, the first shielding member may be disposed in contact with the inner surface of the first case while being coupled to the first surface of the circuit board.

The shielding member coupled to the circuit board and the electronic device including the same according to the various embodiments of the present disclosure described above are not limited by the above-described embodiments and drawings, and various substitutions, modifications and It will be apparent to those of ordinary skill in the art to which the present invention pertains that modifications are possible.

Claims

In an electronic device,

A housing including a first plate facing a first direction and a second plate facing a second direction opposite to the first direction, wherein the first plate includes a first protruding portion protruding toward the second plate housing;

an optical output module disposed in the housing and configured to output an image;

a circuit board disposed in the housing and including a first surface on which at least one first electrical component is disposed so as to face the first plate; and

a first shielding member disposed on the first surface of the circuit board in a state of accommodating the at least one first electrical component and formed to be fixed or supported by the first protruding portion;

The first surface of the circuit board is disposed to be spaced apart from the first protruding portion.
The method of claim 1,

The circuit board is disposed between the first plate and the second plate to be spaced apart from the first plate and the second plate.
The method of claim 1,

The first shielding member is coupled to the first surface of the circuit board and is disposed in contact with one surface of the first plate.
The method of claim 1,

and the first shielding member provides a three-dimensional structure to encapsulate a plurality of electrical elements disposed on the circuit board into a single sheet paper.
The method of claim 1,

The first protruding portion includes a 1-1 protruding portion disposed to face at least one of the first electrical components,

The first-first protrusion portion is formed to press at least a portion of an outer surface of the first shielding member in the second direction to limit movement of the circuit board.
6. The method of claim 5,

the circuit board includes a 1-1 region formed to face the 1-1 protrusion part, and a 1-2 th region formed adjacent to the 1-1 region without facing the 1-1 protrusion part; ,

A thickness of one of the first electrical components to be disposed in the 1-1 region is smaller than a thickness of the other one of the first electrical components to be disposed in the 1-2 th region.
The method of claim 1,

The first protruding portion includes a 1-2 protruding portion disposed along an edge of the first shielding member to face the second plate or the circuit board,

The first-second protrusion portion is disposed along a side surface of the first shielding member coupled to the circuit board, thereby limiting movement of the circuit board in a third direction perpendicular to the first direction.
The method of claim 1,

The first protruding portion includes a guide portion disposed along an edge of the first shielding member and a first 1-3 protruding portion including a hook end protruding toward the first shielding member,

The hook end of the 1-3 protrusion part is inserted into a recess formed in a side surface of the first shielding member, and the first shielding member coupled to the circuit board is fixed so as not to deviate from a designated position. .
9. The method of claim 8,

The guide part of the 1-3 protrusion part is disposed along a side surface of the first shielding member coupled to the circuit board, so that the circuit board is restricted from moving in a third direction perpendicular to the first direction electronic device.
The method of claim 1,

The second plate includes a second protruding portion protruding toward the first plate,

The second protrusion portion is disposed in contact with a second surface opposite to the first surface of the circuit board to limit movement of the circuit board in the direction of the second plate.
The method of claim 1,

The electronic device further includes a second shielding member formed to face the first shielding member with the circuit board interposed therebetween,

The second plate includes a second protruding portion protruding toward the first plate,

The circuit board includes a second surface on which at least one second electrical component is disposed to face the second plate,

The second shielding member is disposed on the second surface of the circuit board in a state of accommodating the at least one second electrical component, and is formed to be fixed or supported by the second protruding portion.
12. The method of claim 11,

The second surface of the circuit board is disposed to be spaced apart from the second protruding portion.
13. The method of claim 12,

and the second shielding member provides a three-dimensional structure to encapsulate the plurality of electrical elements disposed on the circuit board into a single sheet paper.
13. The method of claim 12,

The second protruding portion includes a 2-1 protruding portion disposed to face at least one of the second electrical components,

The second-first protrusion portion is formed to press at least a portion of an outer surface of the second shielding member in the first direction to limit movement of the circuit board in the first direction or the second direction.
13. The method of claim 12,

The second protrusion part includes a 2-2 protrusion part disposed along an edge of the second shielding member to face the first plate or the circuit board,

The second-second protrusion portion is disposed along a side surface of the second shielding member coupled to the circuit board, thereby limiting movement of the circuit board in a third direction perpendicular to the first direction.