WO2022114257A1 - Communication module package - Google Patents

Abstract

The present invention relates to a communication module package comprising: a communication module which comprises a fist substrate, a main antenna disposed at a first surface of the first substrate, a communication control chip disposed at a second surface opposite to the first surface of the first substrate; and an auxiliary antenna module which is opposite to and faces the main antenna, and includes an auxiliary antenna having an antenna hole facing the main antenna.

Description

Communication module package

The present invention relates to a communication module package, and more particularly, to a communication module package having an antenna.

Recently, electronic devices having a wireless communication function, such as a tablet computer and various wearable devices, support a more advanced wireless communication function, and various functions are added in addition to the wireless communication function.

However, unlike the increasing variety of functions, the size of the electronic device is decreasing according to the user's request.

The recently developed and used wireless communication technology is characterized by using a signal of a higher frequency.

Since a signal of such a high frequency band has a relatively short wavelength, a large amount of transmission loss occurs during signal transmission, and thus a more sophisticated and complex antenna configuration is required to increase a signal reception rate.

In addition, in some cases, it is required to mount a plurality of antennas in a miniaturized electronic device. However, it is very difficult to mount a plurality of antennas in a conventional manner in an electronic device having a small and thin size.

Accordingly, there is an increasing demand for an antenna that can be easily mounted on an electronic device having a small and thin size while smoothly covering a high-frequency band signal.

In addition, the demand for reduction of transmission loss for a signal of a high frequency band received from an antenna also increases.

An object of the present invention is to reduce transmission loss for a signal in a high frequency band.

Another object to be solved by the present invention is to facilitate mounting of an electronic device having an antenna formed thereon.

A communication module package according to one aspect of the present invention includes a first substrate, a main antenna located on a first surface of the first substrate, and a communication located on a second surface opposite to the first surface of the first substrate. and a communication module including a control chip, and an auxiliary antenna module facing the main antenna from the opposite side of the main antenna and including an auxiliary antenna having an antenna hole facing the main antenna.

A planar size of the antenna hole may be larger than a planar size of a corresponding main antenna.

The antenna hole may have a polygonal planar shape.

The auxiliary antenna module may further include a second substrate attached to the communication module to face the main antenna and on which the second antenna is positioned.

The antenna hole may include a first antenna hole positioned on the second substrate and facing the main antenna, and a second antenna hole positioned on the auxiliary antenna and positioned to overlap the first antenna hole. .

The second substrate may be made of a non-conductive material.

The second substrate may include a liquid crystal polymer (LCP).

The auxiliary antenna module may be attached to or spaced apart from the communication module.

The auxiliary antenna module may be attached to or spaced apart from the communication module.

The communication module may further include a molding portion positioned on the first surface of the first substrate and sealing the main antenna.

The communication module may further include a multilayer substrate facing the first surface of the first substrate, and the main antenna may be located inside the multilayer substrate.

According to such a feature, an antenna device that can be easily mounted on an electronic device having a small and thin size while smoothly covering a signal of a high frequency band may be included.

Since the auxiliary antenna module having an additional antenna is coupled to the communication module having an antenna, it is possible to easily tune the antenna provided in the electronic device according to electrical and physical characteristics of the electronic device having the communication module.

For this reason, an operation of the antenna is performed in accordance with the characteristics of the corresponding electronic device, so that the signal reception rate of the antenna may be improved.

In addition, as the auxiliary antenna module is configured as an auxiliary antenna module having an auxiliary antenna, signal reception performance may be further improved.

1 is a schematic exploded perspective view of an electronic device having a communication module package according to an embodiment of the present invention.

2 and 3 are perspective views of a communication module package according to an embodiment of the present invention, respectively, and are perspective views obtained from different directions.

4 is a cross-sectional view obtained when the communication module package shown in FIG. 2 is cut along one direction.

5 and 6 are different views of another example of a communication module package according to an embodiment of the present invention, and FIG. 5 is a perspective view, and FIG. 6 is a cross-sectional view obtained when the communication module package is cut along one direction.

7 and 8 are views, respectively, according to another example of a communication module package according to an embodiment of the present invention, FIG. 7 is a perspective view, and FIG. 8 is a cross-sectional view obtained when the communication module package is cut along one direction. .

9 and 10 are views according to another example of a communication module package according to an embodiment of the present invention, respectively. FIG. 9 is a perspective view, and FIG. 10 is a cross-sectional view obtained when the communication module package is cut in one direction. .

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. In describing the present invention, if it is determined that adding a detailed description of a technique or configuration already known in the relevant field may make the gist of the present invention unclear, some of it will be omitted from the detailed description. In addition, the terms used in this specification are terms used to properly express embodiments of the present invention, which may vary according to a person or custom in the relevant field. Accordingly, definitions of these terms should be made based on the content throughout this specification.

The terminology used herein is for the purpose of referring to specific embodiments only, and is not intended to limit the invention. As used herein, the singular forms also include the plural forms unless the phrases clearly indicate the opposite. As used herein, the meaning of 'comprising' specifies a particular characteristic, region, integer, step, operation, element and/or component, and other specific characteristic, region, integer, step, operation, element, component, and/or group. It does not exclude the existence or addition of

Hereinafter, a communication module package according to an embodiment of the present invention will be described with reference to the accompanying drawings.

First, an electronic device including the communication module package 100 according to an embodiment of the present invention will be described with reference to FIGS. 1 to 4 .

In the present invention, the electronic device 10 having the communication module package may be an electronic device having a wireless communication function, such as a smart phone.

As shown in FIG. 1 , in the embodiment of the present invention, the electronic device is a smartphone as an example, but the electronic device 10 according to the present invention is not only a smartphone but also a tablet computer, a laptop computer, a smart watch, and a wireless device. It may be various types of electronic devices having a wireless communication function, such as a wearable device such as an earphone, a TV, a medical measuring device, and a head mounted device.

Referring to FIG. 1 , the electronic device 10 according to the present embodiment includes a communication module package 100 , a lower case 200 in which the communication module package 100 is located, and signal processing located inside the lower case 200 . The chip 300 , the camera module 400 and the circuit board 500 positioned inside the lower case 200 , and the upper case 600 coupled to the lower case 200 and having a display unit may be provided.

The lower case 200 may be coupled to the upper case 600 to form an accommodation space therein.

Accordingly, various electrical and electronic devices, chips, and modules required for the operation of the electronic device 10 in the accommodation space formed by the combination of the lower case 200 and the upper case 600, for example, are shown in FIG. 1 . The illustrated communication module package 100, signal processing chip 300, camera module 400, and circuit board 500, as well as a battery not shown in FIG. 1, a storage device such as a memory, various sensors, and various Connection elements and the like may be accommodated.

The communication module package 100 may receive a wireless communication signal transmitted from the outside and transmit it to the signal processing chip 300 , and may perform a function of wirelessly transmitting the signal transmitted from the signal processing chip 300 to the outside. .

Accordingly, the communication module package 100 may include a plurality of antennas, and the structure and number of antennas may be determined according to a frequency band of a wireless communication signal to be transmitted/received.

In this example, a portion of the antenna provided in the communication module package 100 may perform cellular wireless communication referred to as 3G, 4G, or 5G, and the other portion may perform short-range wireless communication such as NFC.

As shown in FIG. 1 , the communication module package 100 may be attached to one side of the electronic device 10 , and in this case, the mounting space of the communication module package 100 may be reduced.

The communication module package 100 of this example will be described in detail next.

The signal processing chip 300 may receive and process a wireless communication signal transmitted from the communication module package 100 , and process an input signal according to a user's operation to control the operation of the electronic device 10 . The signal processing chip 300 may be formed of a semiconductor chip and may be a processor that controls various applications that control the operation of the electronic device 10 .

The camera module 400 is a module for capturing an image, and may include an image sensor, a lens module, and various filters.

The circuit board 500 is accommodated in the space inside the lower case 200 as described above, and various components necessary for the operation of the electronic device 10 may be mounted thereon. For example, a storage device, various sensors, various devices and semiconductor chips having various functions may be mounted on the circuit board 500 .

The upper case 600 coupled to the lower case 200 may serve as a cover of the electronic device 10 , and may include a display unit such as a liquid crystal display unit or an organic light emitting display unit.

Accordingly, the display unit may output a related image by the control operation of the signal processing chip 300 .

Next, with reference to FIGS. 2 to 4, the communication module package 100 according to an embodiment of the present invention will be described in detail.

The communication module package 100 of this example is a communication module 110 having at least one first antenna (eg, a main antenna) 131 for receiving a wireless communication signal, and a communication module 110 and an auxiliary coupled to the communication module 110 . An auxiliary antenna module 120 that is an antenna module may be provided.

In this case, the communication module 110 and the auxiliary antenna module 120 may be coupled to each other and electrically connected to each other, as shown in FIGS. 2 and 3 .

In this example, the auxiliary antenna module 120 may be coupled to one side, for example, located on the lower surface of the communication module 110, and coupled to the communication module 110 located on the upper side through an adhesive tape or an adhesive. can be

As shown in FIG. 2 , the communication module 110 has a rectangular planar shape extending in a first direction (X), which is an extension direction, and a second direction (Y), which is a width direction that intersects the first direction (X). can have

As shown in FIG. 4 , the communication module 110 includes a substrate (eg, a first substrate) 101, a signal processing unit 102 located on one surface (eg, an upper surface) of the first substrate 101, and The antenna unit 103 positioned on the other surface (eg, the lower surface or the first surface) of the first substrate 101 may be provided. A lower surface of the first substrate 101 may be a first surface, and an upper surface may be a second surface.

The first substrate 101 is a base of the communication module 110 and may be formed of a printed circuit board such as a rigid circuit board.

The signal processing unit 102 and the antenna unit 103 may be respectively located on each side of the first substrate 101, that is, on the upper surface and the lower surface, and signal transmission is performed on at least one of the upper surface and the lower surface. A plurality of signal lines and at least one transmission line 125 such as a pad may be printed.

The signal processing unit 102 located on the upper surface, which is one surface of the first substrate 101, receives and processes the wireless communication signal applied from the antenna unit 103 and transmits it to the signal processing chip 300, or the signal processing chip ( The signal transmitted from the 300 ) may be processed and transmitted to the outside through the antenna unit 103 as a wireless communication signal having a size of a desired frequency band.

The signal processing unit 102 encapsulates the communication control chip 121 , a plurality of electrical and electronic devices (eg, at least one of an active device and a passive device) 122 , the communication control chip 121 and the electrical and electronic device 122 . Accordingly, the first molding part 123 and the connector 124 in which the communication control chip 121 and the electrical and electronic device 122 are built in may be provided.

The communication control chip 121 may be electrically connected to the antenna unit 103 through the transmission line 125 .

Therefore, the communication control chip 121 receives the signal applied from the antenna unit 103 and processes it and transmits it to the auxiliary antenna module 120 or receives the signal transmitted from the auxiliary antenna module 120 to the antenna unit 103 . It is possible to perform signal transmission wirelessly to the outside through

At this time, the communication control chip 121 and the plurality of electrical and electronic devices 122 transmit the signal of the first frequency band received from the antenna unit 103 to a signal of the first frequency band different from the first frequency band (eg, smaller than the first frequency band). ) converted into a signal of the second frequency band and then transmitted to the auxiliary antenna module 120 or vice versa after converting the signal of the second frequency band transmitted from the auxiliary antenna module 120 into a signal of the first frequency band can be transmitted

In this example, the signal of the first frequency band may be a signal of a millimeter wave (m8ilimeter Wave), for example, a frequency band of a millimeter wave of 28 GHz or higher, and the signal of the second frequency band is a signal of an intermediate frequency band can However, in an alternative example, the second frequency band may be smaller than the first frequency band.

In this way, the signal transmitted between the communication module 110 and the auxiliary antenna module 120 under the control of the communication control chip 121 is an intermediate having a smaller frequency than the millimeter wave signal received from the antenna unit 103 . Since it is a frequency signal, the signal loss between the communication module 110 and the signal processing chip 300 can be greatly improved.

Electronic components such as the communication control chip 121 and the electrical and electronic device 122 are mounted on the first substrate 101 through various mounting technologies such as a ball grid array (BGA), a land grid array (LGA), or a wire bonding method. can be mounted.

The first molding part 123 may be made of a molding material and may cover electronic components such as the communication control chip 112 and the electric/electronic device 113 positioned on the upper surface of the first substrate 101 , In some cases, the transmission line 125 may be additionally covered.

Accordingly, the components buried in the molding part 123 may be protected from external shocks or foreign substances such as moisture.

The connector 124 may be positioned on a corresponding surface (eg, an upper surface) of the exposed first substrate 101 that is not covered with the molding part 123 . The connector 124 may be located at one end of the first board 101 , and is for electrically connecting the communication module 110 and the signal processing chip 300 .

Accordingly, the connector 124 may be physically and electrically coupled to a wiring cable (not shown) that is physically and electrically connected to a connector (not shown) of the signal processing chip 300 .

The transmission line 125 may be positioned between the signal processor 102 and the connector 124 to electrically connect the signal processor 102 and the connector 124 to each other. Accordingly, the connector 124 may transmit/receive a signal to and from the signal processing unit 102 through the transmission line 125 positioned on the first board 101 .

As shown in FIG. 4 , the antenna unit 103 positioned on the lower surface of the first substrate 101 may be coupled to the signal processing unit 102 to be electrically and physically connected to the signal processing unit 102 .

The antenna unit 103 encapsulates at least one antenna (eg, a first antenna) 131 and at least one first antenna 131 connected to the communication control chip 121 of the signal processing unit 102 . A second molding part 132 having at least one first antenna 131 therein may be provided.

In this example, there may be a plurality of first antennas 131 provided in the antenna unit 103 and spaced apart from each other, but may be one.

Each first antenna 131 transmits/receives a wireless communication signal, and may be a conductive pattern connected to the first substrate 101 and electrically connected to the communication control chip 121 located on the first substrate 101 , , may have the same structure as each other, or at least two may have different structures. In this case, the number of the first antennas 131 may be changed as needed.

Accordingly, the plurality of first antennas 131 are electrically and It can be physically connected.

The plurality of first antennas 131 may be positioned to be spaced apart from each other in the first direction X along the first substrate 101 extending in the first direction X.

Since the pattern of the first antenna 131 illustrated in FIG. 4 is conceptually illustrated, the pattern shape of the first antenna 131 may have various shapes.

As an example, as shown in FIG. 3 , each of the first antennas 131 may have a rhombus planar shape. In FIG. 4 , each of the first antennas 131 includes a first pattern (eg, a horizontal pattern) printed along the first direction (X) and a second pattern (eg, a horizontal pattern) positioned along the thickness direction of the antenna unit 103 . At least two different shapes such as vertical patterns) may be provided.

However, each of the first antennas 131 may include only one pattern like the first pattern.

The first antenna 131 may transmit and receive a frequency of a millimeter wave band as described above.

The second molding part 132 includes a plurality of first antennas 131 positioned on the lower surface of the first substrate 101 through filling of the molding material in the same manner as the first molding part 123 of the signal processing unit 102 . Since the cover is surrounded, it is possible to protect the first antenna 131 .

Accordingly, the antenna unit 103 having the plurality of first antennas 131 therein and attached to the corresponding surface of the first substrate 101 may be formed by the second molding part 132 .

In an alternative example, the second molding part 132 may be omitted, and in this case, the plurality of first antennas 131 may be positioned in contact with the lower surface of the first substrate 101 .

When the first antenna 131 is sealed by the second molding part 132 , the first antenna 131 may be protected from external impurities such as moisture and impact, and the second molding part 132 is omitted. In this case, the size of the communication module package 100 can be reduced.

In another alternative example, the plurality of first antennas 131 may be located in the multilayer substrate. Accordingly, in this case, the second molding part 132 may encapsulate the multilayer substrate including the first antenna 131 . In this case, the multilayer substrate including the first antenna 131 may be located on the lower surface of the first substrate 101 .

Accordingly, the communication module 110 may further include a multilayer substrate facing the lower surface of the first substrate 101 , and the first antenna 131 may be located inside the multilayer substrate.

The auxiliary antenna module 120 may be positioned to be attached to a corresponding surface (eg, a lower surface) of the communication module 110 or positioned to be spaced apart.

When the communication module 100 does not include the second molding part 132 , the auxiliary antenna module 120 may be positioned to be spaced apart from the communication module 100 .

The auxiliary antenna module 120 is, as shown in FIGS. 3 and 4, a second antenna (eg, auxiliary) positioned on the substrate (eg, the second substrate) 201 and the second substrate 201 as an example. antenna) 202 .

The second substrate 201 may be a substrate (eg, a circuit board) or a film made of a non-conductive material or a dielectric material, or a non-conductive layer formed through coating, printing, or lamination of a non-conductive material.

The second substrate 201, the antenna coupling substrate 425 may contain a liquid crystal polymer (LCP).

The liquid crystal polymer (LCP) is a thermoplastic plastic that exhibits crystallinity when melted. When the second substrate 201 is manufactured using the liquid crystal polymer, the coefficient of linear expansion of the second substrate 201 can be minimized and low molding. It may have a shrinkage rate, and heat resistance and electrical insulation may be further improved compared to other materials.

As shown in FIG. 3 , the second substrate 201 may be attached to the lower surface of the second molding part 132 and extend long in the extending direction X of the communication module 110 .

However, the extended length of the second substrate 201 may be shorter than that of the second molding part 132 , so that the second substrate 201 may not be positioned in a portion of the second molding part 132 . . For example, as shown in FIG. 4 , since the first antenna 301 is not arranged in the second molding part 132 under the connector 124 , the second board 201 is present in this part. may not

The second antenna 202 may be made of a conductive material, and may be manufactured by printing or laminating a conductive pattern on the second substrate 201 .

The second antenna 202, which is an auxiliary antenna (slot antenna), may have a plate shape, may have a hollow hole therein, and may have a patch shape.

Accordingly, as shown in FIGS. 3 and 4 , a plurality of antenna holes H202 that completely penetrate the second antenna 202 in the thickness direction may be provided inside the second antenna 202 .

Each of these antenna holes H202 may be positioned to face each of the first antennas 131 of the antenna unit 103 .

Accordingly, the number of antenna holes H202 may be the same as the number of first antennas 131 positioned in the communication module 110 .

In addition, as shown in FIGS. 3 and 4 , the size of each antenna hole H202 may be larger or smaller than the corresponding planar size of each first antenna 131 .

When the size of each antenna hole H202 is greater than or equal to the plane size of each corresponding first antenna 131, at least a partial plane of the first antenna 131 is positioned to correspond to each antenna hole H202. It may be positioned to overlap the corresponding antenna hole H202 with the second substrate 201 interposed therebetween.

However, when the size of each antenna hole H202 is smaller than the corresponding plane size of each first antenna 131 , a part of the plane of the first antenna 131 is positioned to correspond to each antenna hole H202 and the second It may be positioned to overlap the corresponding antenna hole H202 with the substrate 201 interposed therebetween. As an example, as shown in FIG. 5 , the planar size of each antenna hole H202 is a rhombus having a planar shape. One antenna 131 may have a planar shape of a polygon such as an octagon or a hexagon having a larger planar size than the planar size of the antenna 131 .

However, the planar shape of the antenna hole H202 is not limited thereto, and may have various planar shapes, and the shape and size may be determined according to the corresponding planar shape and planar size of the first antenna 301 .

In this case, the shape of each antenna hole H202 may be the same as or different from the planar shape of the corresponding first antenna 301 .

The second antenna 202 of this example may be located on at least one of an upper surface and a lower surface of the second substrate 201 .

Accordingly, as shown in FIG. 4 , when the second antenna 202 is positioned on the lower surface of the second substrate 201 , at least a portion of each antenna hole H202 of the second antenna 202 is formed on the second substrate. At least a portion of the corresponding first antenna 301 may be faced through 201 . In this case, the second antenna 202 may be exposed to the outside.

On the other hand, when positioned directly on the upper surface of the second substrate 201 , that is, directly contacting the second molding part 131 of the antenna unit 103 , the distance between the first antenna 301 and the second antenna 202 . is a little closer so that the mutual operation of the first antenna 301 and the second antenna 202 can be made more smoothly. In this case, the second antenna 202 is covered with the second substrate 201 to the outside. Since it is not exposed, the risk of damage or contamination of the second antenna 202 can be greatly reduced.

When the second antenna 202 is located on both the lower surface and the upper surface of the second substrate 201 , the antenna patterns respectively located on the lower surface and the upper surface of the second substrate 201 are the same, so that each antenna pattern Each of the antenna holes positioned in . may overlap each other.

As described above, since the second antenna 202 is positioned to overlap with the at least one first antenna 131 , the second antenna 202 cooperates with the first antenna 131 installed in the communication module 110 for wireless communication. Signal transmission and reception can be performed.

In addition, as the second antenna 202 is manufactured as an auxiliary antenna having a plurality of antenna holes H202, antenna performance may be improved.

For this reason, due to the second antenna 202 of the auxiliary antenna module 120 coupled to the first antenna 131 , the tuning operation of the first antenna 131 may be performed.

That is, the plurality of first antennas 131 integrated into the communication module 110 and manufactured together when the communication module 110 is manufactured are designed to match the operating characteristics of a specific device, eg, the signal processing chip 300 , and the specific The device may be designed to optimally receive wireless communication signals.

However, the communication module 110 having the first antenna 131 may be installed in various types of electronic devices such as the electronic device 10 as well as a specific optimized device, and may be covered with a case or the like. Accordingly, the installation condition of the first antenna 131 may vary in many parts from the condition when the operating characteristics of the first antenna 131 are designed to be optimized.

As such, according to the changed conditions, the first antenna 131 may receive a lot of electrical interference depending on the structure and operation of the corresponding electronic device 10 , and thus may not exhibit optimal performance.

For this reason, reception of the wireless communication signal through the plurality of first antennas 131 is also greatly affected, and the plurality of first antennas 131 cannot smoothly receive the wireless communication signal of the corresponding frequency band.

In particular, when a case or the like is positioned on the first antenna 131 , as shown in Table 1, a large change in antenna performance occurs in the radiation direction of the radiator.

band (band)	frequency (GHz)	When no case is installed	When installing the case	Emissivity (deviaton) (dB)
n258 & n261	24.4	8.27	6.97	-1.30
	25.5	8.75	7.56	-1.19
	26.5	8.79	8.07	-0.72
	27.5	8.76	8.29	-0.47
	28.5	8.46	7.91	-0.55
n260	37.0	9.79	8.42	-1.37
	38.5	9.85	8.49	-1.36
	40.0	9.86	6.98	-2.88

As shown in [Table 1], the frequency gain is reduced after assembling the case compared to before assembling the case, and in particular, in the n260 band, a large difference occurs before and after assembling the case. In general, when a frequency gain is reduced, problems such as a decrease in communication speed and an increase in battery consumption may occur.

However, as in this example, when the auxiliary antenna module 120 manufactured separately from the communication module 110 to match the condition in which the communication module 110 is mounted is coupled to the communication module 110 and located, the installation condition is changed The performance of the first antenna 131 falling according to the effect is compensated by the auxiliary antenna module 120 having the auxiliary antenna, so that the antenna performance can be improved as shown in [Table 2].

band (band)	frequency (GHz)	When no case is installed	When installing the case	Emissivity (deviaton) (dB)
n258 & n261	24.4	6.97	8.27	1.30
	25.5	7.56	8.32	0.76
	26.5	8.07	8.28	0.21
	27.5	8.29	7.97	-0.32
	28.5	7.91	7.20	-0.71
n260	37.0	8.42	10.20	1.78
	38.5	8.49	10.78	2.29
	40.0	6.98	10.14	3.16

In this way, by stacking the auxiliary antenna module 120 , which is a parasitic element corresponding to the antenna unit 13 , between the case and the communication module 110 , the communication module package 100 is mounted on the electronic device model. Therefore, by comparing [Table 1] and [Table 2], as the auxiliary antenna module 120 is applied, the decrease in the frequency gain is reduced, and the effect of increasing the frequency gain in a specific band is observed. occurred.

In addition, due to the plurality of antenna holes H202 having a shape similar to the planar shape of the first antenna 131 , which is a radiator, a decrease in antenna performance according to an incident angle (ie, an incident direction) of a radio signal can be greatly alleviated.

In this way, the auxiliary antenna module 120 , particularly the second antenna 202 , which cooperates with the first antenna 131 to improve the antenna performance of the electronic device 100 , is an auxiliary antenna or a booster antenna of the first antenna 131 . can function as

As a result, the auxiliary antenna module 120 having the second antenna 202 is manufactured in consideration of the characteristics and mounting conditions of the electronic device 10 on which the communication module 110 is mounted, and the auxiliary antenna module 120 is communicated. When combined with the module 110, the second antenna 202 can improve the reception efficiency of the wireless communication signal by adjusting the operating characteristics of the first antenna 131 of the communication module 110 having predetermined operating characteristics. . Due to this, the communication module package 100 may implement excellent antenna performance.

In FIGS. 3 and 4 , each antenna hole H202 of the auxiliary antenna module 120 penetrates only the corresponding portion of the second antenna 202 and does not penetrate the portion of the second substrate 201 located below the second antenna 202 . can Accordingly, the second substrate 201 may be exposed through each antenna hole H202.

However, in the auxiliary antenna module 120a according to another example shown in FIGS. 5 and 6 , each antenna hole H202a is not only a part of the corresponding second antenna 202 but also a second substrate 201a positioned thereon. It may be the same as the auxiliary antenna module 120 shown in FIGS. 3 and 4 except that it may be positioned up to a portion of .

Accordingly, each antenna hole H202a may include a first antenna hole portion H21 positioned on the second substrate 201a and a second antenna hole portion H22 positioned on the second antenna 202 . The first antenna hole H21 and the second antenna hole H22 forming the same antenna hole H202a have the same shape and may be positioned to overlap each other in the thickness direction of the auxiliary antenna module 120a.

In this case, compared to FIGS. 3 and 4 , since each of the first antennas 301 is not covered with the second substrate 201 , signal reception performance may be further improved.

Except for the difference in the antenna hole (H202a), as already described, the auxiliary antenna module 120a of this example may be the same as the auxiliary antenna module 120 shown in FIGS. 3 and 4, and in the same part. A detailed description thereof will be omitted.

Next, another example of the auxiliary antenna module 120b will be described with reference to FIGS. 7 and 8 .

As shown in Figs. 7 and 8, the auxiliary antenna module 120b of this example is shown in Figs. It may be the same as one auxiliary antenna module 120a. Accordingly, the second antenna 202 may be an auxiliary antenna having a plurality of antenna holes H202.

For this reason, in this example, the second antenna 202 is manufactured separately from the communication module 110 and then directly attached to the second molding part 132 of the antenna unit 103 using an adhesive or adhesive tape. can

In this case, since the second substrate on which the second antenna 202 is positioned is omitted, the thickness of the auxiliary antenna module 120b is reduced, and manufacturing cost can be reduced.

In this example, in the communication module 110 , when the second molding part 132 sealing the first antenna 131 is omitted, the auxiliary antenna module 120b having only the second antenna 202 communicates Modules 110 may be spaced apart.

Another auxiliary antenna module 120c shown in FIGS. 9 and 10 is, compared with FIGS. 7 and 8 , in which the auxiliary antenna module 120c is attached to the second molding part 132 of the antenna unit 103 . Rather, it may be positioned to be attached to a corresponding part of the corresponding electronic device 10 in which it is located, for example, the lower case 200 using an adhesive or an adhesive film.

Even in this case, the auxiliary antenna module 120c is provided with only the second antenna 202 having a plurality of antenna holes H202 as shown in FIGS. 9 and 10, or as shown in FIGS. 3 to 6, the second In addition to the antenna 202 , the second substrates 201 and 201a on which the second antenna 202 are positioned may be provided.

Even in this example, the second antenna 202 of the auxiliary antenna module 120c may be positioned to face the first antenna 131 of the communication module 103, and each antenna hole ( H202 may be positioned to face each of the first antennas 131 .

When the auxiliary antenna module 120c is attached to the corresponding electronic device 10, the auxiliary antenna module 120c is an exposed surface of the communication module 110 facing itself, for example, the second molding part 103 and They may be located adjacent to each other or spaced apart.

In this example, the margin for the mounting position of the auxiliary antenna module 120c is increased, and thus the margin for designing the corresponding electronic device 100 may also be increased.

In the above, embodiments of the present invention have been described. The present invention is not limited to the above-described embodiments and the accompanying drawings, and various modifications and variations will be possible from the point of view of those of ordinary skill in the art to which the present invention pertains. Accordingly, the scope of the present invention should be defined not only by the claims of the present specification, but also by those claims and their equivalents.

Claims (11)

1. a communication module including a first substrate, a main antenna located on a first surface of the first substrate, and a communication control chip located on a second surface opposite to the first surface of the first substrate; and

   Auxiliary antenna module facing the main antenna from the opposite side of the main antenna and including an auxiliary antenna having an antenna hole facing the main antenna

   Communication module package that includes.
2. In claim 1,

   A planar size of the antenna hole is larger than a planar size of the corresponding main antenna.
3. In claim 1,

   The antenna hole is a communication module package having a polygonal planar shape.
4. In claim 1,

   The auxiliary antenna module is attached to the communication module to face the main antenna, the communication module package further comprising a second substrate on which the second antenna is located.
5. In claim 4,

   The antenna hole is located on the second board and a communication module including a first antenna hole facing the main antenna, and a second antenna hole located on the auxiliary antenna and overlapping the first antenna hole. package.
6. In claim 4,

   The second substrate is a communication module package made of a non-conductive material.
7. In claim 4,

   The second substrate is a communication module package including a liquid crystal polymer (LCP).
8. In claim 4,

   The auxiliary antenna module is a communication module package attached to or spaced apart from the communication module.
9. According to claim 1,

   The auxiliary antenna module is a communication module package attached to or spaced apart from the communication module.
10. According to claim 1,

    The communication module package further comprising a molding portion positioned on the first surface of the first substrate and encapsulating the main antenna.
11. According to claim 1,

    The communication module further comprises a multi-layer substrate facing the first surface of the first substrate,

    The main antenna is a communication module package located inside the multi-layer board

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