WO2022149537A1 - 接着剤組成物、電子部品用接着剤及び携帯電子機器用接着剤 - Google Patents
接着剤組成物、電子部品用接着剤及び携帯電子機器用接着剤 Download PDFInfo
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- WO2022149537A1 WO2022149537A1 PCT/JP2021/048726 JP2021048726W WO2022149537A1 WO 2022149537 A1 WO2022149537 A1 WO 2022149537A1 JP 2021048726 W JP2021048726 W JP 2021048726W WO 2022149537 A1 WO2022149537 A1 WO 2022149537A1
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- 239000000853 adhesive Substances 0.000 title claims abstract description 184
- 230000001070 adhesive effect Effects 0.000 title claims abstract description 184
- 239000000203 mixture Substances 0.000 title claims abstract description 142
- 239000011347 resin Substances 0.000 claims abstract description 143
- 229920005989 resin Polymers 0.000 claims abstract description 143
- IQPQWNKOIGAROB-UHFFFAOYSA-N isocyanate group Chemical group [N-]=C=O IQPQWNKOIGAROB-UHFFFAOYSA-N 0.000 claims abstract description 91
- 239000004417 polycarbonate Substances 0.000 claims abstract description 64
- 229920000515 polycarbonate Polymers 0.000 claims abstract description 64
- 125000003647 acryloyl group Chemical group O=C([*])C([H])=C([H])[H] 0.000 claims abstract description 41
- 229920000728 polyester Polymers 0.000 claims abstract description 35
- 150000001875 compounds Chemical class 0.000 claims description 174
- 125000003118 aryl group Chemical group 0.000 claims description 40
- 239000003795 chemical substances by application Substances 0.000 claims description 2
- 125000005462 imide group Chemical group 0.000 claims 1
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 102
- -1 polyol compound Chemical class 0.000 description 79
- 229920002803 thermoplastic polyurethane Polymers 0.000 description 72
- 229920005862 polyol Polymers 0.000 description 51
- 239000000758 substrate Substances 0.000 description 43
- 239000005056 polyisocyanate Substances 0.000 description 38
- 229920001228 polyisocyanate Polymers 0.000 description 38
- 125000001931 aliphatic group Chemical group 0.000 description 35
- 239000003921 oil Substances 0.000 description 35
- 150000001252 acrylic acid derivatives Chemical class 0.000 description 27
- 150000003077 polyols Chemical class 0.000 description 20
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 18
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 18
- 239000002994 raw material Substances 0.000 description 17
- 238000013008 moisture curing Methods 0.000 description 16
- 229920005906 polyester polyol Polymers 0.000 description 16
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 14
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 13
- 150000003949 imides Chemical group 0.000 description 12
- 239000000945 filler Substances 0.000 description 11
- 239000003999 initiator Substances 0.000 description 11
- 125000004432 carbon atom Chemical group C* 0.000 description 10
- 150000002009 diols Chemical class 0.000 description 10
- 125000000524 functional group Chemical group 0.000 description 10
- 238000000016 photochemical curing Methods 0.000 description 10
- UPMLOUAZCHDJJD-UHFFFAOYSA-N 4,4'-Diphenylmethane Diisocyanate Chemical compound C1=CC(N=C=O)=CC=C1CC1=CC=C(N=C=O)C=C1 UPMLOUAZCHDJJD-UHFFFAOYSA-N 0.000 description 9
- 239000007795 chemical reaction product Substances 0.000 description 9
- 238000001723 curing Methods 0.000 description 9
- 150000002430 hydrocarbons Chemical group 0.000 description 9
- 239000012948 isocyanate Substances 0.000 description 9
- 239000000047 product Substances 0.000 description 9
- 230000014759 maintenance of location Effects 0.000 description 8
- 238000005259 measurement Methods 0.000 description 8
- 229930195734 saturated hydrocarbon Natural products 0.000 description 8
- 125000003808 silyl group Chemical group [H][Si]([H])([H])[*] 0.000 description 8
- 230000015572 biosynthetic process Effects 0.000 description 7
- 239000003054 catalyst Substances 0.000 description 7
- 238000003786 synthesis reaction Methods 0.000 description 7
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 6
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 6
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 description 6
- WERYXYBDKMZEQL-UHFFFAOYSA-N butane-1,4-diol Chemical compound OCCCCO WERYXYBDKMZEQL-UHFFFAOYSA-N 0.000 description 6
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 6
- QQVIHTHCMHWDBS-UHFFFAOYSA-N isophthalic acid Chemical compound OC(=O)C1=CC=CC(C(O)=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-N 0.000 description 6
- 239000000463 material Substances 0.000 description 6
- HRPVXLWXLXDGHG-UHFFFAOYSA-N Acrylamide Chemical compound NC(=O)C=C HRPVXLWXLXDGHG-UHFFFAOYSA-N 0.000 description 5
- 230000000052 comparative effect Effects 0.000 description 5
- 238000011156 evaluation Methods 0.000 description 5
- PUPZLCDOIYMWBV-UHFFFAOYSA-N (+/-)-1,3-Butanediol Chemical compound CC(O)CCO PUPZLCDOIYMWBV-UHFFFAOYSA-N 0.000 description 4
- UKLDJPRMSDWDSL-UHFFFAOYSA-L [dibutyl(dodecanoyloxy)stannyl] dodecanoate Chemical compound CCCCCCCCCCCC(=O)O[Sn](CCCC)(CCCC)OC(=O)CCCCCCCCCCC UKLDJPRMSDWDSL-UHFFFAOYSA-L 0.000 description 4
- 238000006243 chemical reaction Methods 0.000 description 4
- 239000007822 coupling agent Substances 0.000 description 4
- 239000012975 dibutyltin dilaurate Substances 0.000 description 4
- RTZKZFJDLAIYFH-UHFFFAOYSA-N ether Substances CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 4
- 238000005227 gel permeation chromatography Methods 0.000 description 4
- XXMIOPMDWAUFGU-UHFFFAOYSA-N hexane-1,6-diol Chemical compound OCCCCCCO XXMIOPMDWAUFGU-UHFFFAOYSA-N 0.000 description 4
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 229920001223 polyethylene glycol Polymers 0.000 description 4
- 239000002904 solvent Substances 0.000 description 4
- 229910001220 stainless steel Inorganic materials 0.000 description 4
- 239000010935 stainless steel Substances 0.000 description 4
- ARCGXLSVLAOJQL-UHFFFAOYSA-N trimellitic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C(C(O)=O)=C1 ARCGXLSVLAOJQL-UHFFFAOYSA-N 0.000 description 4
- UHFFVFAKEGKNAQ-UHFFFAOYSA-N 2-benzyl-2-(dimethylamino)-1-(4-morpholin-4-ylphenyl)butan-1-one Chemical compound C=1C=C(N2CCOCC2)C=CC=1C(=O)C(CC)(N(C)C)CC1=CC=CC=C1 UHFFVFAKEGKNAQ-UHFFFAOYSA-N 0.000 description 3
- 125000004839 3-methylpentylene group Chemical group [H]C([H])([H])C([H])(C([H])([H])C([H])([H])[*:1])C([H])([H])C([H])([H])[*:2] 0.000 description 3
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 3
- 239000005977 Ethylene Substances 0.000 description 3
- 239000002202 Polyethylene glycol Substances 0.000 description 3
- ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical group CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 description 3
- 239000002253 acid Substances 0.000 description 3
- 239000000654 additive Substances 0.000 description 3
- 239000001361 adipic acid Substances 0.000 description 3
- 235000011037 adipic acid Nutrition 0.000 description 3
- 125000000217 alkyl group Chemical group 0.000 description 3
- 230000006866 deterioration Effects 0.000 description 3
- 125000005442 diisocyanate group Chemical group 0.000 description 3
- 125000004836 hexamethylene group Chemical group [H]C([H])([*:2])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[*:1] 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 3
- 239000002245 particle Substances 0.000 description 3
- 239000000377 silicon dioxide Substances 0.000 description 3
- KDYFGRWQOYBRFD-UHFFFAOYSA-N succinic acid Chemical compound OC(=O)CCC(O)=O KDYFGRWQOYBRFD-UHFFFAOYSA-N 0.000 description 3
- 210000004243 sweat Anatomy 0.000 description 3
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 3
- DNIAPMSPPWPWGF-VKHMYHEASA-N (+)-propylene glycol Chemical compound C[C@H](O)CO DNIAPMSPPWPWGF-VKHMYHEASA-N 0.000 description 2
- YPFDHNVEDLHUCE-UHFFFAOYSA-N 1,3-propanediol Substances OCCCO YPFDHNVEDLHUCE-UHFFFAOYSA-N 0.000 description 2
- TXBCBTDQIULDIA-UHFFFAOYSA-N 2-[[3-hydroxy-2,2-bis(hydroxymethyl)propoxy]methyl]-2-(hydroxymethyl)propane-1,3-diol Chemical compound OCC(CO)(CO)COCC(CO)(CO)CO TXBCBTDQIULDIA-UHFFFAOYSA-N 0.000 description 2
- 125000000954 2-hydroxyethyl group Chemical group [H]C([*])([H])C([H])([H])O[H] 0.000 description 2
- UDXXYUDJOHIIDZ-UHFFFAOYSA-N 2-phosphonooxyethyl prop-2-enoate Chemical compound OP(O)(=O)OCCOC(=O)C=C UDXXYUDJOHIIDZ-UHFFFAOYSA-N 0.000 description 2
- SXIFAEWFOJETOA-UHFFFAOYSA-N 4-hydroxy-butyl Chemical group [CH2]CCCO SXIFAEWFOJETOA-UHFFFAOYSA-N 0.000 description 2
- KWOLFJPFCHCOCG-UHFFFAOYSA-N Acetophenone Chemical compound CC(=O)C1=CC=CC=C1 KWOLFJPFCHCOCG-UHFFFAOYSA-N 0.000 description 2
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- RGSFGYAAUTVSQA-UHFFFAOYSA-N Cyclopentane Chemical compound C1CCCC1 RGSFGYAAUTVSQA-UHFFFAOYSA-N 0.000 description 2
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 2
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 2
- 239000004793 Polystyrene Substances 0.000 description 2
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 description 2
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 2
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 2
- 150000001298 alcohols Chemical class 0.000 description 2
- 125000002723 alicyclic group Chemical group 0.000 description 2
- 150000001335 aliphatic alkanes Chemical class 0.000 description 2
- 150000007933 aliphatic carboxylic acids Chemical class 0.000 description 2
- 150000001412 amines Chemical class 0.000 description 2
- 239000003963 antioxidant agent Substances 0.000 description 2
- 230000001588 bifunctional effect Effects 0.000 description 2
- 150000001732 carboxylic acid derivatives Chemical class 0.000 description 2
- 125000004122 cyclic group Chemical group 0.000 description 2
- 125000002147 dimethylamino group Chemical group [H]C([H])([H])N(*)C([H])([H])[H] 0.000 description 2
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N diphenyl Chemical group C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 description 2
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 2
- NIHNNTQXNPWCJQ-UHFFFAOYSA-N fluorene Chemical compound C1=CC=C2CC3=CC=CC=C3C2=C1 NIHNNTQXNPWCJQ-UHFFFAOYSA-N 0.000 description 2
- 230000001678 irradiating effect Effects 0.000 description 2
- 150000002513 isocyanates Chemical group 0.000 description 2
- ZFSLODLOARCGLH-UHFFFAOYSA-N isocyanuric acid Chemical compound OC1=NC(O)=NC(O)=N1 ZFSLODLOARCGLH-UHFFFAOYSA-N 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- RBQRWNWVPQDTJJ-UHFFFAOYSA-N methacryloyloxyethyl isocyanate Chemical compound CC(=C)C(=O)OCCN=C=O RBQRWNWVPQDTJJ-UHFFFAOYSA-N 0.000 description 2
- SLCVBVWXLSEKPL-UHFFFAOYSA-N neopentyl glycol Chemical compound OCC(C)(C)CO SLCVBVWXLSEKPL-UHFFFAOYSA-N 0.000 description 2
- BDJRBEYXGGNYIS-UHFFFAOYSA-N nonanedioic acid Chemical compound OC(=O)CCCCCCCC(O)=O BDJRBEYXGGNYIS-UHFFFAOYSA-N 0.000 description 2
- WXZMFSXDPGVJKK-UHFFFAOYSA-N pentaerythritol Chemical compound OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 description 2
- 125000005359 phenoxyalkyl group Chemical group 0.000 description 2
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 2
- 229920001610 polycaprolactone Polymers 0.000 description 2
- 229920002223 polystyrene Polymers 0.000 description 2
- 229920000166 polytrimethylene carbonate Polymers 0.000 description 2
- QQONPFPTGQHPMA-UHFFFAOYSA-N propylene Natural products CC=C QQONPFPTGQHPMA-UHFFFAOYSA-N 0.000 description 2
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 description 2
- CYIDZMCFTVVTJO-UHFFFAOYSA-N pyromellitic acid Chemical compound OC(=O)C1=CC(C(O)=O)=C(C(O)=O)C=C1C(O)=O CYIDZMCFTVVTJO-UHFFFAOYSA-N 0.000 description 2
- 239000002516 radical scavenger Substances 0.000 description 2
- 150000003254 radicals Chemical class 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- DTGKSKDOIYIVQL-WEDXCCLWSA-N (+)-borneol Chemical group C1C[C@@]2(C)[C@@H](O)C[C@@H]1C2(C)C DTGKSKDOIYIVQL-WEDXCCLWSA-N 0.000 description 1
- QNODIIQQMGDSEF-UHFFFAOYSA-N (1-hydroxycyclohexyl)-phenylmethanone Chemical compound C=1C=CC=CC=1C(=O)C1(O)CCCCC1 QNODIIQQMGDSEF-UHFFFAOYSA-N 0.000 description 1
- ZMZHRHTZJDBLEX-UHFFFAOYSA-N (2-phenylphenyl) prop-2-enoate Chemical class C=CC(=O)OC1=CC=CC=C1C1=CC=CC=C1 ZMZHRHTZJDBLEX-UHFFFAOYSA-N 0.000 description 1
- WYTZZXDRDKSJID-UHFFFAOYSA-N (3-aminopropyl)triethoxysilane Chemical compound CCO[Si](OCC)(OCC)CCCN WYTZZXDRDKSJID-UHFFFAOYSA-N 0.000 description 1
- WRIDQFICGBMAFQ-UHFFFAOYSA-N (E)-8-Octadecenoic acid Natural products CCCCCCCCCC=CCCCCCCC(O)=O WRIDQFICGBMAFQ-UHFFFAOYSA-N 0.000 description 1
- YOBOXHGSEJBUPB-MTOQALJVSA-N (z)-4-hydroxypent-3-en-2-one;zirconium Chemical compound [Zr].C\C(O)=C\C(C)=O.C\C(O)=C\C(C)=O.C\C(O)=C\C(C)=O.C\C(O)=C\C(C)=O YOBOXHGSEJBUPB-MTOQALJVSA-N 0.000 description 1
- FKTHNVSLHLHISI-UHFFFAOYSA-N 1,2-bis(isocyanatomethyl)benzene Chemical class O=C=NCC1=CC=CC=C1CN=C=O FKTHNVSLHLHISI-UHFFFAOYSA-N 0.000 description 1
- MSAHTMIQULFMRG-UHFFFAOYSA-N 1,2-diphenyl-2-propan-2-yloxyethanone Chemical compound C=1C=CC=CC=1C(OC(C)C)C(=O)C1=CC=CC=C1 MSAHTMIQULFMRG-UHFFFAOYSA-N 0.000 description 1
- CDMDQYCEEKCBGR-UHFFFAOYSA-N 1,4-diisocyanatocyclohexane Chemical compound O=C=NC1CCC(N=C=O)CC1 CDMDQYCEEKCBGR-UHFFFAOYSA-N 0.000 description 1
- SBJCUZQNHOLYMD-UHFFFAOYSA-N 1,5-Naphthalene diisocyanate Chemical compound C1=CC=C2C(N=C=O)=CC=CC2=C1N=C=O SBJCUZQNHOLYMD-UHFFFAOYSA-N 0.000 description 1
- VZXPHDGHQXLXJC-UHFFFAOYSA-N 1,6-diisocyanato-5,6-dimethylheptane Chemical compound O=C=NC(C)(C)C(C)CCCCN=C=O VZXPHDGHQXLXJC-UHFFFAOYSA-N 0.000 description 1
- ALVZNPYWJMLXKV-UHFFFAOYSA-N 1,9-Nonanediol Chemical compound OCCCCCCCCCO ALVZNPYWJMLXKV-UHFFFAOYSA-N 0.000 description 1
- LTXMGJMNBACUIY-UHFFFAOYSA-N 1-(2-hydroxyethoxy)-2-phenoxyundecan-2-ol Chemical compound CCCCCCCCCC(O)(COCCO)OC1=CC=CC=C1 LTXMGJMNBACUIY-UHFFFAOYSA-N 0.000 description 1
- JWYVGKFDLWWQJX-UHFFFAOYSA-N 1-ethenylazepan-2-one Chemical compound C=CN1CCCCCC1=O JWYVGKFDLWWQJX-UHFFFAOYSA-N 0.000 description 1
- SDXHBDVTZNMBEW-UHFFFAOYSA-N 1-ethoxy-2-(2-hydroxyethoxy)ethanol Chemical compound CCOC(O)COCCO SDXHBDVTZNMBEW-UHFFFAOYSA-N 0.000 description 1
- WWVBRUMYFUDEJQ-UHFFFAOYSA-N 1-ethoxyethane-1,2-diol Chemical compound CCOC(O)CO WWVBRUMYFUDEJQ-UHFFFAOYSA-N 0.000 description 1
- CSCSROFYRUZJJH-UHFFFAOYSA-N 1-methoxyethane-1,2-diol Chemical compound COC(O)CO CSCSROFYRUZJJH-UHFFFAOYSA-N 0.000 description 1
- RTBFRGCFXZNCOE-UHFFFAOYSA-N 1-methylsulfonylpiperidin-4-one Chemical compound CS(=O)(=O)N1CCC(=O)CC1 RTBFRGCFXZNCOE-UHFFFAOYSA-N 0.000 description 1
- XLPJNCYCZORXHG-UHFFFAOYSA-N 1-morpholin-4-ylprop-2-en-1-one Chemical compound C=CC(=O)N1CCOCC1 XLPJNCYCZORXHG-UHFFFAOYSA-N 0.000 description 1
- CMTIHEOOVZATEB-UHFFFAOYSA-N 1-n,1-n,1-n',1-n'-tetramethylethane-1,1-diamine Chemical group CN(C)C(C)N(C)C CMTIHEOOVZATEB-UHFFFAOYSA-N 0.000 description 1
- 125000004206 2,2,2-trifluoroethyl group Chemical group [H]C([H])(*)C(F)(F)F 0.000 description 1
- KWVGIHKZDCUPEU-UHFFFAOYSA-N 2,2-dimethoxy-2-phenylacetophenone Chemical compound C=1C=CC=CC=1C(OC)(OC)C(=O)C1=CC=CC=C1 KWVGIHKZDCUPEU-UHFFFAOYSA-N 0.000 description 1
- OVJHMJJVXOJMBB-UHFFFAOYSA-N 2-(1,3-dioxo-3a,4,5,6,7,7a-hexahydroisoindol-2-yl)ethyl prop-2-enoate Chemical compound C1CCCC2C(=O)N(CCOC(=O)C=C)C(=O)C21 OVJHMJJVXOJMBB-UHFFFAOYSA-N 0.000 description 1
- VJZBTBIZXCDAMV-UHFFFAOYSA-N 2-(1,3-dioxo-5,6,7,7a-tetrahydro-4h-isoindol-3a-yl)ethyl prop-2-enoate Chemical compound C1CCCC2C(=O)NC(=O)C21CCOC(=O)C=C VJZBTBIZXCDAMV-UHFFFAOYSA-N 0.000 description 1
- YHYCMHWTYHPIQS-UHFFFAOYSA-N 2-(2-hydroxyethoxy)-1-methoxyethanol Chemical compound COC(O)COCCO YHYCMHWTYHPIQS-UHFFFAOYSA-N 0.000 description 1
- HLIQLHSBZXDKLV-UHFFFAOYSA-N 2-(2-hydroxyethoxy)-1-phenoxyethanol Chemical compound OCCOCC(O)OC1=CC=CC=C1 HLIQLHSBZXDKLV-UHFFFAOYSA-N 0.000 description 1
- YKLJXSCAOKQNCN-UHFFFAOYSA-N 2-(2-isocyanatoethoxy)ethyl prop-2-enoate Chemical compound C=CC(=O)OCCOCCN=C=O YKLJXSCAOKQNCN-UHFFFAOYSA-N 0.000 description 1
- IEQWWMKDFZUMMU-UHFFFAOYSA-N 2-(2-prop-2-enoyloxyethyl)butanedioic acid Chemical compound OC(=O)CC(C(O)=O)CCOC(=O)C=C IEQWWMKDFZUMMU-UHFFFAOYSA-N 0.000 description 1
- GJKGAPPUXSSCFI-UHFFFAOYSA-N 2-Hydroxy-4'-(2-hydroxyethoxy)-2-methylpropiophenone Chemical compound CC(C)(O)C(=O)C1=CC=C(OCCO)C=C1 GJKGAPPUXSSCFI-UHFFFAOYSA-N 0.000 description 1
- WFSMVVDJSNMRAR-UHFFFAOYSA-N 2-[2-(2-ethoxyethoxy)ethoxy]ethanol Chemical compound CCOCCOCCOCCO WFSMVVDJSNMRAR-UHFFFAOYSA-N 0.000 description 1
- LCZVSXRMYJUNFX-UHFFFAOYSA-N 2-[2-(2-hydroxypropoxy)propoxy]propan-1-ol Chemical compound CC(O)COC(C)COC(C)CO LCZVSXRMYJUNFX-UHFFFAOYSA-N 0.000 description 1
- GTEXIOINCJRBIO-UHFFFAOYSA-N 2-[2-(dimethylamino)ethoxy]-n,n-dimethylethanamine Chemical compound CN(C)CCOCCN(C)C GTEXIOINCJRBIO-UHFFFAOYSA-N 0.000 description 1
- DSKYSDCYIODJPC-UHFFFAOYSA-N 2-butyl-2-ethylpropane-1,3-diol Chemical compound CCCCC(CC)(CO)CO DSKYSDCYIODJPC-UHFFFAOYSA-N 0.000 description 1
- IGDLZDCWMRPMGL-UHFFFAOYSA-N 2-ethenylisoindole-1,3-dione Chemical compound C1=CC=C2C(=O)N(C=C)C(=O)C2=C1 IGDLZDCWMRPMGL-UHFFFAOYSA-N 0.000 description 1
- KMNCBSZOIQAUFX-UHFFFAOYSA-N 2-ethoxy-1,2-diphenylethanone Chemical compound C=1C=CC=CC=1C(OCC)C(=O)C1=CC=CC=C1 KMNCBSZOIQAUFX-UHFFFAOYSA-N 0.000 description 1
- NLGDWWCZQDIASO-UHFFFAOYSA-N 2-hydroxy-1-(7-oxabicyclo[4.1.0]hepta-1,3,5-trien-2-yl)-2-phenylethanone Chemical compound OC(C(=O)c1cccc2Oc12)c1ccccc1 NLGDWWCZQDIASO-UHFFFAOYSA-N 0.000 description 1
- OMIGHNLMNHATMP-UHFFFAOYSA-N 2-hydroxyethyl prop-2-enoate Chemical compound OCCOC(=O)C=C OMIGHNLMNHATMP-UHFFFAOYSA-N 0.000 description 1
- DPNXHTDWGGVXID-UHFFFAOYSA-N 2-isocyanatoethyl prop-2-enoate Chemical compound C=CC(=O)OCCN=C=O DPNXHTDWGGVXID-UHFFFAOYSA-N 0.000 description 1
- 125000004200 2-methoxyethyl group Chemical group [H]C([H])([H])OC([H])([H])C([H])([H])* 0.000 description 1
- LWRBVKNFOYUCNP-UHFFFAOYSA-N 2-methyl-1-(4-methylsulfanylphenyl)-2-morpholin-4-ylpropan-1-one Chemical compound C1=CC(SC)=CC=C1C(=O)C(C)(C)N1CCOCC1 LWRBVKNFOYUCNP-UHFFFAOYSA-N 0.000 description 1
- RZVINYQDSSQUKO-UHFFFAOYSA-N 2-phenoxyethyl prop-2-enoate Chemical compound C=CC(=O)OCCOC1=CC=CC=C1 RZVINYQDSSQUKO-UHFFFAOYSA-N 0.000 description 1
- 125000000094 2-phenylethyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])C([H])([H])* 0.000 description 1
- XVKREICBUWCANY-UHFFFAOYSA-N 2-prop-2-enoxyisoindole-1,3-dione Chemical compound C1=CC=C2C(=O)N(OCC=C)C(=O)C2=C1 XVKREICBUWCANY-UHFFFAOYSA-N 0.000 description 1
- MHHGQWMCVNQHLG-UHFFFAOYSA-N 2-prop-2-enylisoindole-1,3-dione Chemical compound C1=CC=C2C(=O)N(CC=C)C(=O)C2=C1 MHHGQWMCVNQHLG-UHFFFAOYSA-N 0.000 description 1
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 description 1
- LQJBNNIYVWPHFW-UHFFFAOYSA-N 20:1omega9c fatty acid Natural products CCCCCCCCCCC=CCCCCCCCC(O)=O LQJBNNIYVWPHFW-UHFFFAOYSA-N 0.000 description 1
- ZBRZSJUFJUMKIM-UHFFFAOYSA-N 3-(1-phenylpropan-2-ylamino)propanenitrile;hydrochloride Chemical compound Cl.N#CCCNC(C)CC1=CC=CC=C1 ZBRZSJUFJUMKIM-UHFFFAOYSA-N 0.000 description 1
- UDWIZRDPCQAYRF-UHFFFAOYSA-N 3-[diethoxy(methyl)silyl]propyl prop-2-enoate Chemical compound CCO[Si](C)(OCC)CCCOC(=O)C=C UDWIZRDPCQAYRF-UHFFFAOYSA-N 0.000 description 1
- IKYAJDOSWUATPI-UHFFFAOYSA-N 3-[dimethoxy(methyl)silyl]propane-1-thiol Chemical compound CO[Si](C)(OC)CCCS IKYAJDOSWUATPI-UHFFFAOYSA-N 0.000 description 1
- MCDBEBOBROAQSH-UHFFFAOYSA-N 3-[dimethoxy(methyl)silyl]propyl prop-2-enoate Chemical compound CO[Si](C)(OC)CCCOC(=O)C=C MCDBEBOBROAQSH-UHFFFAOYSA-N 0.000 description 1
- DCQBZYNUSLHVJC-UHFFFAOYSA-N 3-triethoxysilylpropane-1-thiol Chemical compound CCO[Si](OCC)(OCC)CCCS DCQBZYNUSLHVJC-UHFFFAOYSA-N 0.000 description 1
- XDQWJFXZTAWJST-UHFFFAOYSA-N 3-triethoxysilylpropyl prop-2-enoate Chemical compound CCO[Si](OCC)(OCC)CCCOC(=O)C=C XDQWJFXZTAWJST-UHFFFAOYSA-N 0.000 description 1
- SJECZPVISLOESU-UHFFFAOYSA-N 3-trimethoxysilylpropan-1-amine Chemical compound CO[Si](OC)(OC)CCCN SJECZPVISLOESU-UHFFFAOYSA-N 0.000 description 1
- UUEWCQRISZBELL-UHFFFAOYSA-N 3-trimethoxysilylpropane-1-thiol Chemical compound CO[Si](OC)(OC)CCCS UUEWCQRISZBELL-UHFFFAOYSA-N 0.000 description 1
- KBQVDAIIQCXKPI-UHFFFAOYSA-N 3-trimethoxysilylpropyl prop-2-enoate Chemical compound CO[Si](OC)(OC)CCCOC(=O)C=C KBQVDAIIQCXKPI-UHFFFAOYSA-N 0.000 description 1
- PENRYFPQHOTBJV-UHFFFAOYSA-N 4-(3-morpholin-4-ylpropyl)morpholine Chemical compound C1COCCN1CCCN1CCOCC1 PENRYFPQHOTBJV-UHFFFAOYSA-N 0.000 description 1
- ZMSQJSMSLXVTKN-UHFFFAOYSA-N 4-[2-(2-morpholin-4-ylethoxy)ethyl]morpholine Chemical compound C1COCCN1CCOCCN1CCOCC1 ZMSQJSMSLXVTKN-UHFFFAOYSA-N 0.000 description 1
- ZOTKGMAKADCEDH-UHFFFAOYSA-N 5-triethoxysilylpentane-1,3-diamine Chemical compound CCO[Si](OCC)(OCC)CCC(N)CCN ZOTKGMAKADCEDH-UHFFFAOYSA-N 0.000 description 1
- QSBYPNXLFMSGKH-UHFFFAOYSA-N 9-Heptadecensaeure Natural products CCCCCCCC=CCCCCCCCC(O)=O QSBYPNXLFMSGKH-UHFFFAOYSA-N 0.000 description 1
- WMONOXOCMIPNNU-UHFFFAOYSA-N C=CC(=O)OCCCC(O)COC(=O)C1=CC=CC=C1C(O)=O Chemical compound C=CC(=O)OCCCC(O)COC(=O)C1=CC=CC=C1C(O)=O WMONOXOCMIPNNU-UHFFFAOYSA-N 0.000 description 1
- 239000005057 Hexamethylene diisocyanate Substances 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- 239000005058 Isophorone diisocyanate Substances 0.000 description 1
- YNAVUWVOSKDBBP-UHFFFAOYSA-N Morpholine Chemical group C1COCCN1 YNAVUWVOSKDBBP-UHFFFAOYSA-N 0.000 description 1
- WHNWPMSKXPGLAX-UHFFFAOYSA-N N-Vinyl-2-pyrrolidone Chemical compound C=CN1CCCC1=O WHNWPMSKXPGLAX-UHFFFAOYSA-N 0.000 description 1
- UVNYQSUCIGWUHW-UHFFFAOYSA-N N=C=O.CCCC Chemical compound N=C=O.CCCC UVNYQSUCIGWUHW-UHFFFAOYSA-N 0.000 description 1
- QMOWYWSHERGNQQ-UHFFFAOYSA-N N=C=O.CCCCCCCCCC Chemical compound N=C=O.CCCCCCCCCC QMOWYWSHERGNQQ-UHFFFAOYSA-N 0.000 description 1
- OMRDSWJXRLDPBB-UHFFFAOYSA-N N=C=O.N=C=O.C1CCCCC1 Chemical compound N=C=O.N=C=O.C1CCCCC1 OMRDSWJXRLDPBB-UHFFFAOYSA-N 0.000 description 1
- XBXFGOSIPGWNLZ-UHFFFAOYSA-N O=C1C=C(CC(C)(C)C1)C.N=C=O Chemical class O=C1C=C(CC(C)(C)C1)C.N=C=O XBXFGOSIPGWNLZ-UHFFFAOYSA-N 0.000 description 1
- 239000005642 Oleic acid Substances 0.000 description 1
- ZQPPMHVWECSIRJ-UHFFFAOYSA-N Oleic acid Natural products CCCCCCCCC=CCCCCCCCC(O)=O ZQPPMHVWECSIRJ-UHFFFAOYSA-N 0.000 description 1
- ALQSHHUCVQOPAS-UHFFFAOYSA-N Pentane-1,5-diol Chemical compound OCCCCCO ALQSHHUCVQOPAS-UHFFFAOYSA-N 0.000 description 1
- 229920003171 Poly (ethylene oxide) Polymers 0.000 description 1
- 239000005062 Polybutadiene Substances 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000004721 Polyphenylene oxide Substances 0.000 description 1
- 239000006087 Silane Coupling Agent Substances 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical group [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 description 1
- 239000007983 Tris buffer Substances 0.000 description 1
- MZVQCMJNVPIDEA-UHFFFAOYSA-N [CH2]CN(CC)CC Chemical group [CH2]CN(CC)CC MZVQCMJNVPIDEA-UHFFFAOYSA-N 0.000 description 1
- 150000003926 acrylamides Chemical class 0.000 description 1
- 125000004183 alkoxy alkyl group Chemical group 0.000 description 1
- 230000029936 alkylation Effects 0.000 description 1
- 238000005804 alkylation reaction Methods 0.000 description 1
- JFCQEDHGNNZCLN-UHFFFAOYSA-N anhydrous glutaric acid Natural products OC(=O)CCCC(O)=O JFCQEDHGNNZCLN-UHFFFAOYSA-N 0.000 description 1
- 125000004429 atom Chemical group 0.000 description 1
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 description 1
- 239000012965 benzophenone Substances 0.000 description 1
- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 description 1
- HIFVAOIJYDXIJG-UHFFFAOYSA-N benzylbenzene;isocyanic acid Chemical class N=C=O.N=C=O.C=1C=CC=CC=1CC1=CC=CC=C1 HIFVAOIJYDXIJG-UHFFFAOYSA-N 0.000 description 1
- 235000010290 biphenyl Nutrition 0.000 description 1
- 239000004305 biphenyl Chemical group 0.000 description 1
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 150000001735 carboxylic acids Chemical class 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 238000013329 compounding Methods 0.000 description 1
- 229940120693 copper naphthenate Drugs 0.000 description 1
- SEVNKWFHTNVOLD-UHFFFAOYSA-L copper;3-(4-ethylcyclohexyl)propanoate;3-(3-ethylcyclopentyl)propanoate Chemical compound [Cu+2].CCC1CCC(CCC([O-])=O)C1.CCC1CCC(CCC([O-])=O)CC1 SEVNKWFHTNVOLD-UHFFFAOYSA-L 0.000 description 1
- 239000002537 cosmetic Substances 0.000 description 1
- MNUSMUGFHGAOIW-UHFFFAOYSA-N cyclohexane-1,1,2-tricarboxylic acid Chemical class OC(=O)C1CCCCC1(C(O)=O)C(O)=O MNUSMUGFHGAOIW-UHFFFAOYSA-N 0.000 description 1
- PDXRQENMIVHKPI-UHFFFAOYSA-N cyclohexane-1,1-diol Chemical compound OC1(O)CCCCC1 PDXRQENMIVHKPI-UHFFFAOYSA-N 0.000 description 1
- LAGWVZPUXSKERV-UHFFFAOYSA-N cyclohexane;isocyanic acid Chemical class N=C=O.C1CCCCC1 LAGWVZPUXSKERV-UHFFFAOYSA-N 0.000 description 1
- 125000000113 cyclohexyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 description 1
- FOTKYAAJKYLFFN-UHFFFAOYSA-N decane-1,10-diol Chemical compound OCCCCCCCCCCO FOTKYAAJKYLFFN-UHFFFAOYSA-N 0.000 description 1
- 229940098237 dicel Drugs 0.000 description 1
- 235000014113 dietary fatty acids Nutrition 0.000 description 1
- OTARVPUIYXHRRB-UHFFFAOYSA-N diethoxy-methyl-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CCO[Si](C)(OCC)CCCOCC1CO1 OTARVPUIYXHRRB-UHFFFAOYSA-N 0.000 description 1
- 239000003085 diluting agent Substances 0.000 description 1
- WHGNXNCOTZPEEK-UHFFFAOYSA-N dimethoxy-methyl-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](C)(OC)CCCOCC1CO1 WHGNXNCOTZPEEK-UHFFFAOYSA-N 0.000 description 1
- SZXQTJUDPRGNJN-UHFFFAOYSA-N dipropylene glycol Chemical compound OCCCOCCCO SZXQTJUDPRGNJN-UHFFFAOYSA-N 0.000 description 1
- TVIDDXQYHWJXFK-UHFFFAOYSA-N dodecanedioic acid Chemical compound OC(=O)CCCCCCCCCCC(O)=O TVIDDXQYHWJXFK-UHFFFAOYSA-N 0.000 description 1
- 125000003438 dodecyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000006735 epoxidation reaction Methods 0.000 description 1
- FWDBOZPQNFPOLF-UHFFFAOYSA-N ethenyl(triethoxy)silane Chemical compound CCO[Si](OCC)(OCC)C=C FWDBOZPQNFPOLF-UHFFFAOYSA-N 0.000 description 1
- NKSJNEHGWDZZQF-UHFFFAOYSA-N ethenyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)C=C NKSJNEHGWDZZQF-UHFFFAOYSA-N 0.000 description 1
- 230000001747 exhibiting effect Effects 0.000 description 1
- 239000000194 fatty acid Substances 0.000 description 1
- 229930195729 fatty acid Natural products 0.000 description 1
- 150000004665 fatty acids Chemical class 0.000 description 1
- 125000003983 fluorenyl group Chemical group C1(=CC=CC=2C3=CC=CC=C3CC12)* 0.000 description 1
- 239000004088 foaming agent Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 235000011187 glycerol Nutrition 0.000 description 1
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 description 1
- DMEGYFMYUHOHGS-UHFFFAOYSA-N heptamethylene Natural products C1CCCCCC1 DMEGYFMYUHOHGS-UHFFFAOYSA-N 0.000 description 1
- 125000000623 heterocyclic group Chemical group 0.000 description 1
- RRAMGCGOFNQTLD-UHFFFAOYSA-N hexamethylene diisocyanate Chemical compound O=C=NCCCCCCN=C=O RRAMGCGOFNQTLD-UHFFFAOYSA-N 0.000 description 1
- SEIUOYFQDIJJEO-UHFFFAOYSA-N hexane-1,1,1-tricarboxylic acid Chemical class CCCCCC(C(O)=O)(C(O)=O)C(O)=O SEIUOYFQDIJJEO-UHFFFAOYSA-N 0.000 description 1
- KPYCPQVKYYJPIY-UHFFFAOYSA-N hexane;isocyanic acid Chemical compound N=C=O.CCCCCC KPYCPQVKYYJPIY-UHFFFAOYSA-N 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 1
- 230000007062 hydrolysis Effects 0.000 description 1
- 238000006460 hydrolysis reaction Methods 0.000 description 1
- 230000005661 hydrophobic surface Effects 0.000 description 1
- 125000002768 hydroxyalkyl group Chemical group 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 239000011256 inorganic filler Substances 0.000 description 1
- 229910003475 inorganic filler Inorganic materials 0.000 description 1
- 239000002608 ionic liquid Substances 0.000 description 1
- 125000000959 isobutyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])* 0.000 description 1
- YPQKTLPPOXNDMC-UHFFFAOYSA-N isocyanic acid;methylcyclohexane Chemical compound N=C=O.CC1CCCCC1 YPQKTLPPOXNDMC-UHFFFAOYSA-N 0.000 description 1
- DJFNMTSCKHMHQI-UHFFFAOYSA-N isocyanic acid;octane Chemical compound N=C=O.CCCCCCCC DJFNMTSCKHMHQI-UHFFFAOYSA-N 0.000 description 1
- QXJSBBXBKPUZAA-UHFFFAOYSA-N isooleic acid Natural products CCCCCCCC=CCCCCCCCCC(O)=O QXJSBBXBKPUZAA-UHFFFAOYSA-N 0.000 description 1
- NIMLQBUJDJZYEJ-UHFFFAOYSA-N isophorone diisocyanate Chemical compound CC1(C)CC(N=C=O)CC(C)(CN=C=O)C1 NIMLQBUJDJZYEJ-UHFFFAOYSA-N 0.000 description 1
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 125000000956 methoxy group Chemical group [H]C([H])([H])O* 0.000 description 1
- AYLRODJJLADBOB-QMMMGPOBSA-N methyl (2s)-2,6-diisocyanatohexanoate Chemical compound COC(=O)[C@@H](N=C=O)CCCCN=C=O AYLRODJJLADBOB-QMMMGPOBSA-N 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- PHQOGHDTIVQXHL-UHFFFAOYSA-N n'-(3-trimethoxysilylpropyl)ethane-1,2-diamine Chemical compound CO[Si](OC)(OC)CCCNCCN PHQOGHDTIVQXHL-UHFFFAOYSA-N 0.000 description 1
- MQWFLKHKWJMCEN-UHFFFAOYSA-N n'-[3-[dimethoxy(methyl)silyl]propyl]ethane-1,2-diamine Chemical compound CO[Si](C)(OC)CCCNCCN MQWFLKHKWJMCEN-UHFFFAOYSA-N 0.000 description 1
- GEMHFKXPOCTAIP-UHFFFAOYSA-N n,n-dimethyl-n'-phenylcarbamimidoyl chloride Chemical compound CN(C)C(Cl)=NC1=CC=CC=C1 GEMHFKXPOCTAIP-UHFFFAOYSA-N 0.000 description 1
- 125000004108 n-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- ZZHGIUCYKGFIPV-UHFFFAOYSA-M n-butylcarbamate Chemical compound CCCCNC([O-])=O ZZHGIUCYKGFIPV-UHFFFAOYSA-M 0.000 description 1
- KVQQRFDIKYXJTJ-UHFFFAOYSA-N naphthalene-1,2,3-tricarboxylic acid Chemical compound C1=CC=C2C(C(O)=O)=C(C(O)=O)C(C(=O)O)=CC2=C1 KVQQRFDIKYXJTJ-UHFFFAOYSA-N 0.000 description 1
- RXOHFPCZGPKIRD-UHFFFAOYSA-N naphthalene-2,6-dicarboxylic acid Chemical compound C1=C(C(O)=O)C=CC2=CC(C(=O)O)=CC=C21 RXOHFPCZGPKIRD-UHFFFAOYSA-N 0.000 description 1
- 125000001624 naphthyl group Chemical group 0.000 description 1
- 239000004745 nonwoven fabric Substances 0.000 description 1
- 125000003261 o-tolyl group Chemical group [H]C1=C([H])C(*)=C(C([H])=C1[H])C([H])([H])[H] 0.000 description 1
- WWZKQHOCKIZLMA-UHFFFAOYSA-N octanoic acid Chemical compound CCCCCCCC(O)=O WWZKQHOCKIZLMA-UHFFFAOYSA-N 0.000 description 1
- ZQPPMHVWECSIRJ-KTKRTIGZSA-N oleic acid Chemical compound CCCCCCCC\C=C/CCCCCCCC(O)=O ZQPPMHVWECSIRJ-KTKRTIGZSA-N 0.000 description 1
- 229940105570 ornex Drugs 0.000 description 1
- 239000011236 particulate material Substances 0.000 description 1
- 125000004817 pentamethylene group Chemical group [H]C([H])([*:2])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[*:1] 0.000 description 1
- 125000003884 phenylalkyl group Chemical group 0.000 description 1
- XKJCHHZQLQNZHY-UHFFFAOYSA-N phthalimide Chemical compound C1=CC=C2C(=O)NC(=O)C2=C1 XKJCHHZQLQNZHY-UHFFFAOYSA-N 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920002857 polybutadiene Polymers 0.000 description 1
- 239000004632 polycaprolactone Substances 0.000 description 1
- 229920000570 polyether Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 229920001451 polypropylene glycol Polymers 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 239000011164 primary particle Substances 0.000 description 1
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 230000009257 reactivity Effects 0.000 description 1
- 238000007151 ring opening polymerisation reaction Methods 0.000 description 1
- 210000002374 sebum Anatomy 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 238000006884 silylation reaction Methods 0.000 description 1
- WSFQLUVWDKCYSW-UHFFFAOYSA-M sodium;2-hydroxy-3-morpholin-4-ylpropane-1-sulfonate Chemical compound [Na+].[O-]S(=O)(=O)CC(O)CN1CCOCC1 WSFQLUVWDKCYSW-UHFFFAOYSA-M 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 125000004079 stearyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 125000005504 styryl group Chemical group 0.000 description 1
- 239000001384 succinic acid Substances 0.000 description 1
- 230000000475 sunscreen effect Effects 0.000 description 1
- 239000000516 sunscreening agent Substances 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- HQHCYKULIHKCEB-UHFFFAOYSA-N tetradecanedioic acid Chemical compound OC(=O)CCCCCCCCCCCCC(O)=O HQHCYKULIHKCEB-UHFFFAOYSA-N 0.000 description 1
- UWHCKJMYHZGTIT-UHFFFAOYSA-N tetraethylene glycol Chemical compound OCCOCCOCCOCCO UWHCKJMYHZGTIT-UHFFFAOYSA-N 0.000 description 1
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 1
- 125000000383 tetramethylene group Chemical group [H]C([H])([*:1])C([H])([H])C([H])([H])C([H])([H])[*:2] 0.000 description 1
- 125000003396 thiol group Chemical group [H]S* 0.000 description 1
- YRHRIQCWCFGUEQ-UHFFFAOYSA-N thioxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=CC=CC=C3SC2=C1 YRHRIQCWCFGUEQ-UHFFFAOYSA-N 0.000 description 1
- 150000003606 tin compounds Chemical class 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- DVKJHBMWWAPEIU-UHFFFAOYSA-N toluene 2,4-diisocyanate Chemical compound CC1=CC=C(N=C=O)C=C1N=C=O DVKJHBMWWAPEIU-UHFFFAOYSA-N 0.000 description 1
- JLGLQAWTXXGVEM-UHFFFAOYSA-N triethylene glycol monomethyl ether Chemical compound COCCOCCOCCO JLGLQAWTXXGVEM-UHFFFAOYSA-N 0.000 description 1
- IMNIMPAHZVJRPE-UHFFFAOYSA-N triethylenediamine Chemical group C1CN2CCN1CC2 IMNIMPAHZVJRPE-UHFFFAOYSA-N 0.000 description 1
- WYDMCUJHXCLUPN-UHFFFAOYSA-N trimethoxy(4-methylpentyl)silane Chemical compound CO[Si](OC)(OC)CCCC(C)C WYDMCUJHXCLUPN-UHFFFAOYSA-N 0.000 description 1
- DQZNLOXENNXVAD-UHFFFAOYSA-N trimethoxy-[2-(7-oxabicyclo[4.1.0]heptan-4-yl)ethyl]silane Chemical compound C1C(CC[Si](OC)(OC)OC)CCC2OC21 DQZNLOXENNXVAD-UHFFFAOYSA-N 0.000 description 1
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 1
- QXJQHYBHAIHNGG-UHFFFAOYSA-N trimethylolethane Chemical compound OCC(C)(CO)CO QXJQHYBHAIHNGG-UHFFFAOYSA-N 0.000 description 1
- LENZDBCJOHFCAS-UHFFFAOYSA-N tris Chemical compound OCC(N)(CO)CO LENZDBCJOHFCAS-UHFFFAOYSA-N 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 238000004383 yellowing Methods 0.000 description 1
- 150000003752 zinc compounds Chemical class 0.000 description 1
- 239000011787 zinc oxide Substances 0.000 description 1
- JBCJMTUHAXHILC-UHFFFAOYSA-N zinc;octanoic acid Chemical compound [Zn+2].CCCCCCCC(O)=O JBCJMTUHAXHILC-UHFFFAOYSA-N 0.000 description 1
- PAPBSGBWRJIAAV-UHFFFAOYSA-N ε-Caprolactone Chemical compound O=C1CCCCCO1 PAPBSGBWRJIAAV-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
- C08G18/40—High-molecular-weight compounds
- C08G18/42—Polycondensates having carboxylic or carbonic ester groups in the main chain
- C08G18/44—Polycarbonates
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/08—Macromolecular additives
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
- C09J175/04—Polyurethanes
- C09J175/06—Polyurethanes from polyesters
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
- C09J175/04—Polyurethanes
- C09J175/14—Polyurethanes having carbon-to-carbon unsaturated bonds
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
Definitions
- the present invention relates to an adhesive composition, an adhesive for electronic parts, and an adhesive for portable electronic devices.
- a moisture-curable adhesive containing a moisture-curable resin that is cured by external moisture has been widely used.
- the moisture-curable adhesive for example, in Patent Document 1, a polyol containing a polycarbonate diol having a specific structure and a polyisocyanate compound are used so that the isocyanate group / hydroxyl group has a molar ratio of 1.3 to 3.5.
- a moisture-curable adhesive containing an isocyanate group-terminated prepolymer obtained by reacting with is shown.
- the moisture-curable adhesive shown in Patent Document 1 can be used for clothing applications, has excellent sweat deterioration resistance and hydrolysis resistance, can have high flexibility, and is particularly a higher fatty acid which is one of the components of sweat. It has been shown to be excellent in deterioration resistance to.
- Patent Document 1 a certain oil resistance can be ensured by using a polyol having a specific structure such as polycarbonate as the polyol used for the moisture-curable resin.
- a polyol having a specific structure such as polycarbonate
- an object of the present invention is to achieve both high oil resistance and high impact resistance in an adhesive composition having moisture curability.
- An adhesive composition comprising a moisture-curable resin (B) having an isocyanate group and no (meth) acryloyl group.
- the content of the radically polymerizable compound (C) is 5 parts by mass or more and 50 parts by mass or less with respect to 100 parts by mass of the total amount of the moisture-curable resin and the radically polymerizable compound [7].
- the content of the moisture-curable resin (A) is 0.1 parts by mass or more and 30 parts by mass or less with respect to 100 parts by mass of the total amount of the moisture-curable resin and the radically polymerizable compound [1]. ]
- the adhesive composition according to any one of. [18] The adhesive composition according to any one of the above [1] to [17], wherein the moisture-curable resin (B) is a moisture-curable urethane resin (B1).
- the adhesive composition according to the above [18], wherein the moisture-curable urethane resin (B1) is obtained by reacting a polyol compound with a polyisocyanate compound.
- the content of the moisture-curable resin (B) is 30 parts by mass or more and 99.9 parts by mass or less with respect to 100 parts by mass of the total amount of the moisture-curable resin and the radically polymerizable compound.
- [21] The adhesive composition according to any one of the above [1] to [20] further containing a filler [22] The adhesive according to any one of the above [1] to [21].
- An adhesive for electronic components consisting of a composition.
- An adhesive for portable electronic devices comprising the adhesive composition according to any one of the above [1] to [21].
- [26] Use of the adhesive composition according to any one of the above [1] to [21] in portable electronic devices.
- FIG. 1 (a) is a plan view
- FIG. 1 (b) is a side view. It is a schematic side view which shows the evaluation method of impact resistance.
- the adhesive composition of the present invention contains a moisture-curable resin (A) and a moisture-curable resin (B).
- A moisture-curable resin
- B moisture-curable resin
- the moisture-curable resin (A) has at least one of a polycarbonate skeleton and a polyester skeleton, and has an isocyanate group and a (meth) acryloyl group.
- the moisture-curable resin (A) having the above structure is used in combination with the moisture-curable resin (B) having the structure described later, while ensuring a certain adhesiveness. It is possible to achieve both high oil resistance and high impact resistance.
- the adhesive composition has a moisture-curable property by having the moisture-curable resin (A) and the moisture-curable resin (B), and can be used as a moisture-curable adhesive.
- "(meth) acryloyl group” means acryloyl group or methacryloyl group, and other similar terms are also the same.
- the moisture-curable resin (A) may have either a polycarbonate skeleton or a polyester skeleton in one molecule, but may contain both a polycarbonate skeleton and a polyester skeleton in one molecule. Further, as the moisture-curable resin (A), a moisture-curable resin having a polycarbonate skeleton and a moisture-curable resin having a polyester skeleton may be used in combination. As the moisture-curable resin (A), a moisture-curable resin having a polyester skeleton may be used from the viewpoint of flexibility and the like, but it is preferable to use a moisture-curable resin having a polycarbonate skeleton.
- the moisture-curable resin (A) having a polycarbonate skeleton By using a moisture-curable resin having a polycarbonate skeleton, oil resistance is improved, and it becomes easy to maintain good adhesive strength even after contact with oil.
- the moisture-curable resin (A) it is preferable to use the moisture-curable resin (A) having a polycarbonate skeleton alone, but as described above, it may be used in combination with the moisture-curable resin (A) having a polyester skeleton. good.
- the moisture-curable resin (A) having a polycarbonate skeleton is preferably 50% by mass or more, more preferably 75% by mass. It is preferable that the content is 100% by mass or more and 100% by mass or less.
- the polycarbonate skeleton and the polyester skeleton in the moisture-curable resin (A) are preferably derived from a polyol compound, respectively, as described later. Therefore, the polycarbonate skeleton is preferably derived from the polycarbonate polyol, and the polyester skeleton is preferably derived from the polyester polyol.
- the moisture-curable resin (A) may have one or two or more isocyanate groups in one molecule, but preferably has one isocyanate group in one molecule. Further, the moisture-curable resin (A) may have one or both of an aliphatic isocyanate group and an aromatic isocyanate group, but preferably has an aromatic isocyanate group. Since the moisture-curable resin (A) has an aromatic isocyanate group, the oil resistance is improved, and it becomes easy to maintain good adhesive strength even after contact with the oil component. The moisture-curable resin (A) preferably has an isocyanate group at the end.
- the aromatic isocyanate group is an isocyanate group directly bonded to the aromatic ring
- the aliphatic isocyanate group is an isocyanate group in which the isocyanate group is directly bonded to the aliphatic carbon atom.
- the aromatic isocyanate group is an isocyanate group derived from an aromatic isocyanate compound, and the details of the aromatic isocyanate compound will be described later.
- the aliphatic isocyanate group is an isocyanate group derived from an aliphatic isocyanate compound, and the details of the aliphatic isocyanate group will be described later.
- the (meth) acryloyl group of the moisture-curable resin (A) may be derived from a compound having a (meth) acryloyl group described later.
- the moisture-curable resin (A) preferably has a (meth) acryloyl group at the end.
- the (meth) acryloyl group of the moisture-curable resin (A) may be reacted by photocuring, which will be described later, but it is not always necessary to react by photocuring. That is, the moisture-curable resin (A) may react with the moisture-curable resin (A) by photocuring, or may react with the radically polymerizable compound (C) described later, but it reacts. It does not have to be.
- the moisture-curable resin (A) preferably has an isocyanate group at one end and a (meth) acryloyl group at one end.
- a "terminal" means the end of the main chain.
- the moisture-curable resin (A) is preferably a moisture-curable urethane resin (A1). Therefore, the moisture-curable resin (A) preferably has a urethane bond in addition to the isocyanate group and the (meth) acryloyl group.
- the moisture-curable urethane resin (A1) As the moisture-curable resin (A), oil resistance and the like can be easily improved.
- the moisture-curable resin (A) is the moisture-curable urethane resin (A1) will be described in more detail.
- the moisture-curable urethane resin (A1) is preferably obtained by reacting a polyol compound, a polyisocyanate compound, and a compound having a (meth) acryloyl group.
- the compound having a (meth) acryloyl group may have either a hydroxyl group or an isocyanate group, but it is preferable to have an isocyanate group from the viewpoint that the (meth) acryloyl group can be easily introduced into the resin (A1).
- the moisture-curable urethane resin (A1) may be obtained by further reacting a reaction product obtained by reacting a polyol compound with a polyisocyanate compound with a compound having an isocyanate group or a hydroxyl group and a (meth) acryloyl group. Further, a reaction product obtained by reacting a polyol compound with a compound having an isocyanate group and a (meth) acryloyl group may be obtained by reacting with a polyisocyanate compound. Further, a reaction product obtained by reacting a polyisocyanate compound with a compound having a hydroxyl group and a (meth) acryloyl group may be obtained by reacting with a polyol compound.
- the moisture-curable urethane resin (A1) may be obtained by reacting a polyol compound, a polyisocyanate compound, and a compound having an isocyanate group or a hydroxyl group and a (meth) acryloyl group in parallel in parallel. Further, in the synthesis of the moisture-curable urethane resin (A1), at least a part of the moisture-curable urethane resin (B1) described later may be synthesized at the same time. Examples of such a moisture-curable urethane resin (B1) include urethane resins having isocyanate groups at both ends. Further, in the synthesis of the moisture-curable urethane resin (A1), a urethane (meth) acrylate having a (meth) acryloyl group may be synthesized without having an isocyanate group.
- the polyol compound used as a raw material for the moisture-curable urethane resin (A1) has two or more hydroxyl groups in one molecule.
- the polyol compound either a polycarbonate polyol or a polyester polyol can be used.
- polycarbonate polyol polycarbonate diol is preferable.
- Specific examples of the polycarbonate diol include a compound represented by the following formula (1).
- R is a divalent hydrocarbon group having 4 to 16 carbon atoms, and n is an integer of 2 to 500.
- R is preferably an aliphatic saturated hydrocarbon group. Since R is an aliphatic saturated hydrocarbon group, heat resistance and flexibility tend to be improved. In addition, yellowing and the like are less likely to occur due to thermal deterioration and the like, and the weather resistance is improved.
- the R composed of an aliphatic saturated hydrocarbon group may have a chain structure or a cyclic structure, but preferably has a chain structure. Further, the R of the chain structure may be either linear or branched. n is preferably 5 to 200, more preferably 10 to 150, and even more preferably 20 to 50. Further, R contained in the polycarbonate polyol constituting the moisture-curable urethane resin (A1) may be used alone or in combination of two or more.
- a chain aliphatic saturated hydrocarbon group having 6 or more carbon atoms is a chain aliphatic saturated hydrocarbon group having 6 or more carbon atoms. Further, it preferably contains two or more types of R in one molecule, and more preferably contains two or three types of R in one molecule.
- the chain aliphatic saturated hydrocarbon group having 6 or more carbon atoms is preferably 6 or more and 12 or less carbon atoms, more preferably 6 or more and 10 or less carbon atoms, and further preferably 6 or more and 8 or less carbon atoms.
- R may be linear such as a tetramethylene group, a pentylene group, a hexamethylene group, a heptamethylene group, an octamethylene group, a nonamethylene group, a decamethylene group, and for example, a 3-methylpentylene group. It may be branched such as a methylpentylene group such as or a methyloctamethylene group.
- a plurality of Rs in one molecule may be the same as each other or may be different from each other.
- R preferably contains a branched aliphatic saturated hydrocarbon group, and from the viewpoint of weather resistance, R contains a linear aliphatic saturated hydrocarbon group. Is preferable.
- R in the polycarbonate polyol a branched R and a linear R may be used in combination.
- the polycarbonate polyol may be used alone or in combination of two or more.
- polyester polyol examples include a polyester polyol obtained by reacting a polyvalent carboxylic acid with a polyol, a poly- ⁇ -caprolactone polyol obtained by ring-opening polymerization of ⁇ -caprolactone, and the like.
- the polyester polyol is preferably polyester diol.
- polyvalent carboxylic acid used as a raw material for the polyester polyol examples include divalent aromatic carboxylic acids such as terephthalic acid, isophthalic acid, 1,5-naphthalic acid and 2,6-naphthalic acid, succinic acid and glutaric acid. , Adipic acid, Pimelli acid, Sveric acid, Azelaic acid, Sevacinic acid, Decamethylene dicarboxylic acid, Dodecamethylene dicarboxylic acid and other divalent aliphatic carboxylic acids, trimellitic acid, trimellitic acid, pyromellitic acid, naphthalenetricarboxylic acid and the like.
- divalent aromatic carboxylic acids such as terephthalic acid, isophthalic acid, 1,5-naphthalic acid and 2,6-naphthalic acid, succinic acid and glutaric acid.
- Adipic acid Pimelli acid, Sveric acid, Azelaic acid, Sevacinic acid, Decamethylene dicarboxylic acid,
- Examples thereof include trivalent or higher aromatic carboxylic acids, cyclohexanetricarboxylic acids, and trivalent or higher aliphatic carboxylic acids such as hexanetricarboxylic acids. These polyvalent carboxylic acids may be used alone or in combination of two or more.
- Examples of the polyol which is a raw material of the polyester polyol include ethylene glycol, propylene glycol, 1,3-propanediol, 1,4-butanediol, neopentyl glycol, 1,5-pentanediol, and 1,6-hexanediol. Examples thereof include diethylene glycol and cyclohexanediol.
- the moisture-curable urethane resin (A1) one type of polyol compound may be used alone, or two or more types may be used in combination.
- a polycarbonate polyol as the polyol compound that is the raw material of the moisture-curable urethane resin (A1), the polycarbonate skeleton is introduced into the moisture-curable urethane resin (A1), and the moisture having the polycarbonate skeleton is introduced. It may be a curable urethane resin (A1).
- the polyester skeleton is introduced into the moisture-curable urethane resin (A1), and the moisture-curable urethane having a polyester skeleton is introduced.
- the resin (A1) may be used.
- the moisture-curable urethane resin (A1) can be made into a moisture-curable urethane resin (A1) by using both a polycarbonate polyol and a polyester polyol as the polyol compound which is a raw material of the moisture-curable urethane resin (A1). Both a polycarbonate skeleton and a polyester skeleton may be introduced. That is, the moisture-curable urethane resin (A1) may be a moisture-curable urethane resin (A1) having both a polycarbonate skeleton and a polyester skeleton in one molecule.
- the moisture-curable urethane resin (A1) having a polycarbonate skeleton also includes a moisture-curable urethane resin (A1) containing both a polycarbonate skeleton and a polyester skeleton. The same is true for other similar terms.
- the polyisocyanate compound used as a raw material for the moisture-curable urethane resin (A1) has two or more isocyanate groups in one molecule, but preferably has two isocyanate groups.
- the polyisocyanate compound include aromatic polyisocyanate compounds and aliphatic polyisocyanate compounds.
- the aromatic polyisocyanate compound include diphenylmethane diisocyanate, liquid modified products of diphenylmethane diisocyanate, tolylene diisocyanate, naphthalene-1,5-diisocyanate and the like.
- the aromatic polyisocyanate compound may be an abundant amount of these compounds, or may be a polymeric MDI or the like.
- diphenylmethane diisocyanate is preferable.
- the aliphatic polyisocyanate compound include hexamethylene diisocyanate, trimethylhexamethylene diisocyanate, lysine diisocyanate, norbornan diisocyanate, transcyclohexane-1,4-diisocyanate, isophorone diisocyanate, hydrogenated xylylene diisocyanate, hydrogenated diphenylmethane diisocyanate, and cyclohexane diisocyanate. , Bis (isocyanate methyl) cyclohexane, dicyclohexamethylene diisocyanate and the like.
- the aliphatic polyisocyanate compound may be an a large amount of these compounds.
- the polyisocyanate compound may be used alone or in combination of two or more.
- the moisture-curable resin (A) when an aromatic polyisocyanate compound is used in the synthesis of the moisture-curable urethane resin (A1), the moisture-curable resin (A) contains an aromatic isocyanate group, and when an aliphatic polyisocyanate compound is used, The moisture-curable resin (A) contains an aliphatic isocyanate group. Therefore, it is preferable to use an aromatic polyisocyanate compound as the polyisocyanate compound.
- the compound having a (meth) acryloyl group which is a raw material of the moisture-curable urethane resin (A1) may contain either an isocyanate group or a hydroxyl group, but a compound having an isocyanate group and a (meth) acryloyl group. Is preferable.
- Examples of the compound having an isocyanate group and a (meth) acryloyl group include a compound represented by the following formula (2).
- R 1 represents a hydrogen or a methyl group
- R 2 represents a divalent saturated hydrocarbon group having 1 to 10 carbon atoms which may have an ether bond.
- Preferred examples of the compound having an isocyanate group and a (meth) acryloyl group include 2- (meth) acryloyloxyethyl isocyanate and 2- (meth) acryloyloxyethoxyethyl isocyanate.
- Examples of the compound having a hydroxyl group and a (meth) acloyl group as a raw material of the moisture-curable urethane resin (A1) include 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, and 2-hydroxybutyl (meth). Examples thereof include hydroxyalkyl (meth) acrylates such as acrylates and 4-hydroxybutyl (meth) acrylates.
- a moisture-curable urethane is obtained by reacting various diisocyanate compounds with a compound obtained by reacting the isocyanate group / hydroxyl group (molar ratio) at a ratio of 2. It may be used as a compound having a (meth) acryloyl group which is a raw material of the resin (A1).
- the weight average molecular weight of the moisture-curable resin (A) is not particularly limited, but is preferably 1000 or more and 50,000 or less, more preferably 2000 or more and 30,000 or less, and further preferably 3000 or more and 20,000 or less.
- the weight average molecular weight is equal to or higher than the above lower limit, the crosslink density does not become too high during curing, and the flexibility after curing tends to increase. Further, for example, in a semi-cured state after photo-curing and before moisture-curing, the hardness is above a certain level, and it becomes easy to secure excellent shape retention.
- the weight average molecular weight is not more than the above upper limit value, the adhesive composition tends to have appropriate fluidity even at room temperature (for example, 25 ° C.) before curing, and the coatability becomes good. ..
- the weight average molecular weight is a value obtained by measuring by gel permeation chromatography (GPC) and converting it into polystyrene.
- GPC gel permeation chromatography
- Shodex LF-804 manufactured by Showa Denko KK
- examples of the solvent used in GPC include tetrahydrofuran.
- the content of the moisture-curable resin (A) in the adhesive composition is, for example, 0.1 part by mass or more and 30 parts by mass or less with respect to 100 parts by mass of the total amount of the moisture-curable resin and the radically polymerizable compound.
- the adhesive composition tends to improve the impact resistance while improving the oil resistance and the adhesiveness.
- the content of the moisture-curable resin (A) is preferably 0.5 parts by mass or more and 25 parts by mass or less, more preferably 0.7 parts by mass or more and 15 parts by mass or less, and further preferably 1 part by mass. It is 10 parts by mass or less.
- the total amount of the moisture-curable resin and the radically polymerizable compound means the total content of the moisture-curable resin when the radical-polymerizable compound (C) component is not contained.
- the moisture-curable resin (B) in the present invention is a resin having an isocyanate group but not a (meth) acryloyl group.
- the moisture-curable resin (B) in the adhesive composition it is possible to impart appropriate adhesive performance to the adhesive composition.
- the moisture-curable resin (B) preferably has at least one of a polycarbonate skeleton and a polyester skeleton. By having any of these, the moisture-curable resin (B) can easily achieve both oil resistance and impact resistance.
- the moisture-curable resin (B) having at least one of a polycarbonate skeleton and a polyester skeleton may have either a polycarbonate skeleton or a polyester skeleton in one molecule, but both a polycarbonate skeleton and a polyester skeleton may be contained in one molecule. It may be contained. Further, as the moisture-curable resin (B), a moisture-curable resin having a polycarbonate skeleton and a moisture-curable resin having a polyester skeleton may be used in combination.
- the moisture-curable resin (B) has a polycarbonate skeleton.
- the moisture-curable resin (B) having a polycarbonate skeleton in the adhesive composition it becomes easier to achieve both high oil resistance and high impact resistance. In particular, the oil resistance becomes good, and it becomes easy to secure a high adhesive force even after contacting with oil.
- the moisture-curable resin (B) it is preferable to use the moisture-curable resin (B) having a polycarbonate skeleton alone, but as described above, it may be used in combination with the moisture-curable resin (B) having a polyester skeleton. good.
- the moisture-curable resin (B) having a polycarbonate skeleton is preferably 50% by mass or more, more preferably 75% by mass. It is preferable that the content is 100% by mass or more and 100% by mass or less.
- the polycarbonate skeleton and the polyester skeleton in the moisture-curable resin (B) are preferably derived from a polyol compound as described later. Therefore, the polycarbonate skeleton is preferably derived from the polycarbonate polyol, and the polyester skeleton is preferably derived from the polyester polyol.
- the moisture-curable resin (B) may have one or two or more isocyanate groups in one molecule, but preferably has two or more isocyanate groups in one molecule, and more preferably two isocyanate groups. preferable. Further, the moisture-curable resin (B) may have either one or both of an aliphatic isocyanate group and an aromatic isocyanate group, but preferably has an aromatic isocyanate group. Since the moisture-curable resin (B) has an aromatic isocyanate group, the oil resistance is improved, and it becomes easy to maintain good adhesive strength even after contact with the oil component.
- the aromatic isocyanate group is an isocyanate group derived from an aromatic isocyanate compound
- the aliphatic isocyanate group is an isocyanate group derived from an aliphatic isocyanate compound.
- the moisture-curable resin (B) preferably has an isocyanate group at the end, and more preferably has an isocyanate group at both ends. Since the moisture-curable resin (B) has isocyanate groups at both ends, it is easy to increase the molecular weight by moisture curing, and it is easy to secure high adhesiveness. From the viewpoint of oil resistance, the moisture-curable resin (B) is more preferably provided with aromatic isocyanate groups at both ends.
- the moisture-curable resin (B) is preferably a moisture-curable urethane resin (B1). Therefore, the moisture-curable resin (B) preferably has a urethane bond in addition to the isocyanate group.
- the moisture-curable urethane resin (B1) as the moisture-curable resin (B), the oil resistance and the like can be easily improved.
- the moisture-curable urethane resin (B1) may have one isocyanate group in one molecule or two or more isocyanate groups, but as described above, it has isocyanate groups at both ends of the main chain. Is more preferable.
- the moisture-curable urethane resin (B1) can react the polyol compound with the polyisocyanate compound.
- the polyol compound used for the moisture-curable urethane resin (B1) a known polyol compound usually used in the production of polyurethane can be used, and polyester can be used from the viewpoint of achieving both oil resistance and impact resistance. Polyols and polycarbonate polyols are preferable, and polycarbonate polyols are particularly preferable.
- a polycarbonate polyol as the polyol compound that is the raw material of the moisture-curable urethane resin (B1), the polycarbonate skeleton is introduced into the moisture-curable urethane resin (B1), and the moisture having the polycarbonate skeleton is introduced. It may be a curable urethane resin (B1).
- the polyester skeleton is introduced into the moisture-curable urethane resin (B1), and the moisture-curable urethane resin having the polyester skeleton is introduced. It may be (B1). Further, both the polycarbonate skeleton and the polyester skeleton may be introduced into one molecule.
- the polycarbonate polyol and the polyester polyol used as the raw material of the moisture-curable urethane resin (B1) those listed as the raw materials of the moisture-curable urethane resin (A1) can be used, and the description thereof is the same. The explanation is omitted.
- the polyisocyanate compound used as a raw material for the moisture-curable urethane resin (B1) has two or more isocyanate groups in one molecule, preferably two isocyanate groups.
- the polyisocyanate compound include aromatic polyisocyanate compounds and aliphatic polyisocyanate compounds.
- aromatic polyisocyanate compound and the aliphatic polyisocyanate compound those listed as raw materials for the moisture-curable urethane resin (A1) can be used, and the description thereof is the same, so the description thereof will be omitted.
- an aromatic polyisocyanate compound is preferable, and among them, diphenylmethane diisocyanate is preferable.
- the moisture-curable resin (B) may be a resin having an organic silyl group represented by the following formula (3) in addition to the isocyanate group.
- R 3 and R 4 are independently hydrogen atoms, an alkyl group having 1 to 5 carbon atoms, or an aryl group, and each of R 3 and R 4 may be the same. And may be different.
- x represents an integer of 0 to 2.
- R 3 and R 4 when R 3 and R 4 are each an aryl group, examples of the aryl group include a phenyl group, a naphthyl group, and a 2-methylphenyl group.
- x is preferably 1 or 2 from the viewpoint of exhibiting more excellent adhesiveness.
- the case where x is 0 in the above formula (3) means that the silicon atom is bonded to three ⁇ OR 4 without being bonded to the atom or group represented by R3.
- R 3 and R 4 are preferably alkyl groups having 1 to 5 carbon atoms from the viewpoint of improving adhesiveness, and may be either a methyl group or an ethyl group. It is more preferable to have.
- the moisture-curable resin (B) is preferably a moisture-curable urethane resin (B1), and therefore, an isocyanate group and an organic silyl group. In addition, it is preferable to have a urethane bond.
- the moisture-curable resin (B) contains the above-mentioned organic silyl group, it is preferable that the moisture-curable resin (B) has an organic silyl group and an isocyanate group at one end thereof. It was
- the moisture-curable urethane resin (B1) having an organic silyl group is a compound having a urethane bond and an isocyanate group obtained by reacting a polyol compound with a polyisocyanate compound, and a reactive functional group and a formula (3). It can be obtained by reacting with a compound having a group represented.
- the "reactive functional group” means a group capable of reacting with the compound having a urethane bond and an isocyanate group, and a group capable of reacting with the isocyanate group is preferable. It was
- the polyol compound and the polyisocyanate compound are as described above.
- Examples of the compound having the above reactive functional group and the group represented by the formula (3) include 3-mercaptopropyltrimethoxysilane, 3-mercaptopropyltriethoxysilane, and 3-glycidoxypropyltrimethoxysilane.
- the weight average molecular weight of the moisture-curable resin (B) is not particularly limited, but is preferably 1000 or more and 50,000 or less.
- the weight average molecular weight is equal to or higher than the above lower limit, the crosslink density does not become too high during curing, and the flexibility after curing tends to increase. Further, for example, in a semi-cured state after photo-curing and before moisture-curing, the hardness is above a certain level, and it becomes easy to secure excellent shape retention. Further, when the weight average molecular weight is not more than the above upper limit value, the adhesive composition has appropriate fluidity even at room temperature (for example, 25 ° C.) before curing, and the room temperature coatability is good. From these viewpoints, the weight average molecular weight of the moisture-curable resin (B) is more preferably 2000 or more and 30,000 or less, and further preferably 3000 or more and 20000 or less.
- the content of the moisture-curable resin (B) in the adhesive composition is, for example, 30 parts by mass or more and 99.9 parts by mass or less with respect to 100 parts by mass of the total amount of the moisture-curable resin and the radically polymerizable compound.
- the content is at least the above lower limit value, it becomes easy to improve the adhesive strength, and it becomes easy to impart appropriate moisture curability.
- it becomes easy to contain the moisture curable resin (A) in a certain amount or more, and it becomes easy to achieve both oil resistance and impact resistance.
- the content of the moisture-curable resin (B) is preferably 45 parts by mass or more and 94 parts by mass or less, more preferably. It is 50 parts by mass or more and 88 parts by mass or less, more preferably 53 parts by mass or more and 80 parts by mass or less.
- the moisture-curable resin is preferably composed of the moisture-curable resins (A) and (B), but is moisture-curable other than the moisture-curable resins (A) and (B) as long as the effects of the present invention are not impaired. It may have a resin.
- the moisture-curable resin is a resin that can be cured by reacting with water present in the air or in an adherend, and may have a functional group such as an isocyanate group or an organic silyl group.
- the content of the moisture-curable resin other than the moisture-curable resins (A) and (B) is not particularly limited, but is, for example, 30 parts by mass or less when the entire moisture-curable resin is 100 parts by mass. It may be about 10 parts by mass or less.
- the adhesive composition of the present invention preferably contains a radically polymerizable compound (C) in addition to the moisture-curable resins (A) and (B).
- the radically polymerizable compound (C) is a compound that does not contain an isocyanate group.
- photocurability is easily imparted to the adhesive composition, and the adhesive composition is made into a photo-moisture-curable type having good photocurability. Can be done.
- the adhesive composition can be imparted with a certain adhesive force only by irradiating with light, it is possible to secure a certain level of adhesive force even in a semi-cured state after photo-curing and before moisture curing. Further, in the semi-cured state after photo-curing and before moisture-curing, the hardness is above a certain level, and it becomes easy to secure excellent shape retention.
- the shape retention is excellent, for example, the adhesive composition applied by a dispenser or the like can secure a certain height after photo-curing, so that the cured body formed from the adhesive composition is used between the adherends. It will be possible to secure a certain interval.
- the radically polymerizable compound (C) in addition to the moisture-curable resins (A) and (B), the viscosity of the adhesive composition tends to decrease. Therefore, the adhesive composition can easily secure an appropriate fluidity at room temperature (for example, 25 ° C.) or the like before curing, and can improve the coatability.
- the radically polymerizable compound (C) may be a compound having no moisture curability, and therefore may not contain a moisture curable functional group such as the organic silyl group.
- the radically polymerizable compound (C) has a radically polymerizable functional group in the molecule.
- a compound having an unsaturated double bond is preferable, and examples thereof include a (meth) acryloyl group, a vinyl group, a styryl group, and an allyl group.
- the (meth) acryloyl group is preferable from the viewpoint of adhesiveness, that is, the radically polymerizable compound (C) preferably contains a compound having a (meth) acryloyl group.
- the compound having a (meth) acryloyl group is also hereinafter referred to as “(meth) acrylic compound”.
- the radically polymerizable compound (C) preferably contains at least one selected from the group consisting of a radically polymerizable compound having an aromatic ring and a radically polymerizable compound having an imide ring. These compounds are preferably monofunctional having one radically polymerizable functional group in the molecule, but may be a polyfunctional compound having two or more radically polymerizable functional groups.
- Examples of the radically polymerizable compound having an aromatic ring include a monofunctional (meth) acrylic acid ester compound having an aromatic ring. Specific examples thereof include phenylalkyl (meth) acrylates such as benzyl (meth) acrylate and 2-phenylethyl (meth) acrylate, and phenoxyalkyl (meth) acrylates such as phenoxyethyl (meth) acrylate.
- it may be a (meth) acrylate having a plurality of benzene rings such as a fluorene skeleton and a biphenyl skeleton, and specific examples thereof include fluorene type (meth) acrylate and ethoxylated o-phenylphenol acrylate.
- phenoxypolyoxyethylene-based (meth) acrylates such as phenoxydiethylene glycol (meth) acrylate, phenoxypolyethylene glycol (meth) acrylate, nonylphenoxydiethylene glycol (meth) acrylate, and nonylphenoxypolyethylene glycol (meth) acrylate can also be mentioned.
- phenoxyalkyl (meth) acrylate is preferable, and among them, phenoxyethyl (meth) acrylate is more preferable.
- the radically polymerizable compound having an imide ring include a (meth) acrylic acid ester compound having an imide ring such as N- (meth) acryloyloxyethyl hexahydrophthalimide, N-vinylphthalimide, N-allylphthalimide, and N-.
- vinyl compounds having an imide ring such as (3-butene-1-in) phthalimide and N-allyloxyphthalimide.
- the adhesive composition contains at least one of a radically polymerizable compound having an aromatic ring and a radically polymerizable compound having an imide ring, whereby oil resistance is improved and adhesive strength is improved even after contact with oil. Will be easier to maintain.
- the radically polymerizable compound (C) may have one of the radically polymerizable compound having an aromatic ring and the radically polymerizable compound having an imide ring, but may have both. Further, the radically polymerizable compound (C) more preferably contains at least a radically polymerizable compound having an imide ring.
- the radically polymerizable compound (C) may consist of at least one selected from a radically polymerizable compound having an aromatic ring and a radically polymerizable compound having an imide ring, but other radically polymerizable compounds ( It may contain (referred to as "another radically polymerizable compound").
- the content of the compound selected from the group consisting of the radically polymerizable compound having an aromatic ring and the radically polymerizable compound having an imide ring in the adhesive composition is based on the total amount of the radically polymerizable compound (C). 20% by mass or more is preferable, 25% by mass or more is more preferable, 50% by mass or more is further preferable, and 80% by mass or more is further preferable.
- the content of these compounds may be 100% by mass or less.
- Examples of other radically polymerizable compounds include various aliphatic (meth) acrylic compounds.
- an aliphatic urethane (meth) acrylate or the like may be used, or a (meth) acrylic acid ester compound other than the aliphatic urethane (meth) acrylate may be used. May be good.
- the aliphatic urethane (meth) acrylate does not have a residual isocyanate group as described above.
- the other radically polymerizable compound may be monofunctional or polyfunctional such as bifunctional, but monofunctional is preferable. Further, the aliphatic urethane (meth) acrylate may be used in combination with polyfunctionality such as bifunctionality when monofunctional is used.
- the aliphatic urethane (meth) acrylate is preferably monofunctional as described above, and for example, an isocyanate compound reacted with a (meth) acrylic acid derivative having a hydroxyl group can be used.
- a (meth) acrylic acid derivative having a hydroxyl group include dihydric alcohols such as ethylene glycol, propylene glycol, 1,3-propanediol, 1,3-butanediol, 1,4-butanediol, and polyethylene glycol.
- Examples thereof include mono (meth) acrylates of trihydric alcohols such as trimethylolethane, trimethylolpropane, and glycerin.
- Examples of the isocyanate compound used to obtain the aliphatic urethane (meth) acrylate include alkane monoisocyanate (preferably about 3 to 12 carbon atoms of alkane) such as butane isocyanate, hexane isocyanate, octane isocyanate, and decane isocyanate, and cyclopentane.
- alkane monoisocyanate preferably about 3 to 12 carbon atoms of alkane
- alkane monoisocyanate preferably about 3 to 12 carbon atoms of alkane
- alkane monoisocyanate preferably about 3 to 12 carbon atoms of alkane
- alkane monoisocyanate preferably about 3 to 12 carbon atoms of alkane
- alkane monoisocyanate preferably about 3 to 12 carbon atoms of alkane
- aliphatic monoisocyanates such as cyclic aliphatic monoisocyanates such as isocyanates, cyclo
- the monofunctional aliphatic urethane (meth) acrylate is preferably a urethane (meth) acrylate obtained by reacting the above-mentioned monoisocyanate compound with a mono (meth) acrylate of a dihydric alcohol.
- a urethane (meth) acrylate obtained by reacting the above-mentioned monoisocyanate compound with a mono (meth) acrylate of a dihydric alcohol a suitable specific example thereof, 1,2-ethanediol 1-acrylate 2- (N-alkylcarbamate) such as 1,2-ethanediol 1-acrylate2- (N-butylcarbamate) can be mentioned. ..
- polyfunctional aliphatic urethane (meth) acrylate examples include a reaction product obtained by reacting a polyol compound with a compound having an isocyanate group and a (meth) acryloyl group. Specific examples thereof include urethane (meth) acrylates having (meth) acryloyl groups at both ends.
- the details of the polyol compound and the compound having an isocyanate group and a (meth) acryloyl group are as described in the raw material of the moisture-curable urethane resin (A1).
- the (meth) acrylic acid ester compound other than the aliphatic urethane (meth) acrylate may be monofunctional or polyfunctional, but monofunctional is preferable.
- monofunctional ones include, for example, methyl (meth) acrylate, ethyl (meth) acrylate, propyl (meth) acrylate, n-butyl (meth) acrylate, and isobutyl.
- Alkoxyethylene glycol (meth) acrylates such as alkoxyalkyl (meth) acrylates, methoxyethylene glycol (meth) acrylates, and ethoxyethylene glycol (meth) acrylates, methoxydiethylene glycol (meth) acrylates, methoxytriethylene glycol (meth) acrylates, and methoxy Examples thereof include polyoxyethylene-based (meth) acrylates such as polyethylene glycol (meth) acrylate, ethoxydiethylene glycol (meth) acrylate, ethoxytriethylene glycol (meth) acrylate, and ethoxypolyethylene glycol (meth) acrylate.
- examples of the monofunctional (meth) acrylic acid ester compound include tetrahydrofurfuryl (meth) acrylate, alkoxylated tetrahydrofurfuryl (meth) acrylate, cyclic trimethylolpropaneformal (meth) acrylate, and 3-ethyl-3-.
- (Meta) acrylate having a heterocyclic structure such as oxetanylmethyl (meth) acrylate, 2,2,2-trifluoroethyl (meth) acrylate, 2,2,3,3-tetrafluoropropyl (meth) acrylate, 1H , 1H, 5H-Octafluoropentyl (meth) acrylate, dimethylaminoethyl (meth) acrylate, diethylaminoethyl (meth) acrylate, 2- (meth) acryloyloxyethyl succinic acid, 2- (meth) acryloyloxyethyl- 2-Hydroxypropyl phthalate, glycidyl (meth) acrylate, 2- (meth) acryloyloxyethyl phosphate and the like can also be mentioned.
- oxetanylmethyl (meth) acrylate 2,2,2-trifluoroethyl (
- bifunctional ones include, for example, 1,3-butanediol di (meth) acrylate, 1,4-butanediol di (meth) acrylate, and 1,6-hexanediol di ().
- those having trifunctionality or higher include, for example, trimethylol propanetri (meth) acrylate, ethylene oxide-added trimethylol propanetri (meth) acrylate, and propylene oxide-added trimethylol propanetri (meth) acrylate.
- other radically polymerizable compound other radically polymerizable compounds other than those described above can be appropriately used.
- examples of other radically polymerizable compounds include N, N-dimethyl (meth) acrylamide, N- (meth) acryloylmorpholine, N-hydroxyethyl (meth) acrylamide, N, N-diethyl (meth) acrylamide, and N-.
- examples thereof include (meth) acrylamide compounds such as isopropyl (meth) acrylamide and N, N-dimethylaminopropyl (meth) acrylamide, and vinyl compounds such as N-vinyl-2-pyrrolidone and N-vinyl- ⁇ -caprolactam.
- Eposiki (meth) acrylate or the like can also be used as the (meth) acrylic acid ester compound.
- the radically polymerizable compound other than the radically polymerizable compound having an aromatic ring and the radically polymerizable compound having an imide ring is selected from the group consisting of an aliphatic urethane (meth) acrylate and a (meth) acrylic acid ester compound. At least one is preferred. Among them, at least one selected from the group consisting of an aliphatic urethane (meth) acrylate and a (meth) acrylate having an alicyclic structure is more preferable.
- Other radically polymerizable compounds may be used alone or in combination of two or more.
- the content of the radically polymerizable compound (C) is preferably 5 parts by mass or more and 50 parts by mass or less with respect to 100 parts by mass of the total amount of the moisture-curable resin and the radically polymerizable compound.
- the content of the radically polymerizable compound (C) is equal to or higher than the above lower limit, it becomes easy to appropriately impart photocurability to the adhesive composition, and the shape retention after photocuring and before moisture curing is ensured. It will be easier to do. In addition, it becomes easy to improve the coatability of the adhesive composition.
- the amounts of the moisture-curable resins (A) and (B) can be increased to a certain amount or more, and appropriate moisture-curable properties can be imparted to the adhesive composition.
- the content of the radically polymerizable compound (C) is more preferably 10 parts by mass or more and 45 parts by mass or less, and further preferably 15 parts by mass or more and 40 parts by mass or less.
- the adhesive composition of the present invention may further contain a photopolymerization initiator.
- a photopolymerization initiator By containing the photopolymerization initiator in the adhesive composition, it is possible to appropriately impart photocurability to the adhesive composition.
- the adhesive composition contains the radically polymerizable compound (C), it is preferable to use a photopolymerization initiator.
- the photopolymerization initiator include benzophenone-based compounds, acetophenone-based compounds, acylphosphine oxide-based compounds, titanosen-based compounds, oxime ester-based compounds, benzoin ether-based compounds, and thioxanthone.
- photopolymerization initiators include, for example, IRGACURE184, IRGACURE369, IRGACURE379, IRGACURE651, IRGACURE784, IRGACURE819, IRGACURE907, IRGACURE2959, IRGACURE OXE01, and Lucillin TPO.
- examples thereof include benzoin ethyl ether and benzoin isopropyl ether (both manufactured by Tokyo Chemical Industry Co., Ltd.).
- the content of the photopolymerization initiator in the adhesive composition is preferably 0.01 parts by mass or more and 8 parts by mass or less, and more preferably 0.1 parts by mass or more and 6 parts by mass with respect to 100 parts by mass of the adhesive composition. Hereinafter, it is more preferably 0.4 parts by mass or more and 4 parts by mass or less.
- the content of the photopolymerization initiator is within these ranges, the obtained adhesive composition has excellent photocurability and storage stability. Further, when the content is within the above range, the photoradical polymerization compound (C) is appropriately cured, and it becomes easy to improve the adhesive strength.
- the adhesive composition of the present invention may contain a moisture curing accelerating catalyst that accelerates the moisture curing reaction of the moisture curable resin.
- a moisture curing accelerating catalyst that accelerates the moisture curing reaction of the moisture curable resin.
- the adhesive composition becomes more excellent in moisture-curing property, and it becomes easy to enhance the adhesive force.
- Specific examples of the moisture curing accelerating catalyst include amine-based compounds and metal-based catalysts.
- Examples of the amine-based compound include compounds having a morpholine skeleton such as di (methylmorpholino) diethyl ether, 4-morpholinopropylmorpholin, and 2,2'-dimorpholinodiethyl ether, bis (2-dimethylaminoethyl) ether, 1,2.
- -A dimethylamino group-containing amine compound having two dimethylamino groups such as bis (dimethylamino) ethane, triethylamine, 1,4-diazabicyclo [2.2.2] octane, 2,6,7-trimethyl-1,4. -Diazabicyclo [2.2.2] octane and the like can be mentioned.
- the metal catalyst include tin compounds such as din-butyltin dilaurate, din-butyltin diacetate and tin octylate, zinc compounds such as zinc octylate and zinc naphthenate, zirconium tetraacetylacetonate and copper naphthenate.
- the content of the moisture curing accelerating catalyst in the adhesive composition is preferably 0.1 part by mass or more and 10 parts by mass or less, and more preferably 0.2 parts by mass or more and 8 parts by mass with respect to 100 parts by mass of the adhesive composition. Hereinafter, it is more preferably 0.3 parts by mass or more and 5 parts by mass or less.
- the adhesive composition of the present invention may contain a filler.
- the filler By containing the filler, the adhesive composition of the present invention has suitable thixo property, and it becomes easy to improve the shape retention after application.
- a particulate material may be used.
- an inorganic filler is preferable, and examples thereof include silica, talc, titanium oxide, zinc oxide, and calcium carbonate. Among them, silica is preferable because the adhesive composition has excellent ultraviolet transparency.
- the filler may be subjected to a hydrophobic surface treatment such as a silylation treatment, an alkylation treatment and an epoxidation treatment. The filler may be used alone or in combination of two or more.
- the content of the filler is preferably 0.5 parts by mass or more and 30 parts by mass or less, more preferably 1 part by mass or more and 25 parts by mass or less, and further preferably 2 parts by mass or more with respect to 100 parts by mass of the adhesive composition. It is 15 parts by mass or less.
- the adhesive composition of the present invention includes coupling agents such as silane coupling agents, titanate-based coupling agents, and zirconate-based coupling agents, wax particles, ionic liquids, colorants, and foaming agents. It may contain other additives such as particles, expanded particles, reactive diluents, antioxidants, radical scavengers and the like.
- the adhesive composition may be diluted with a solvent, if necessary. When the adhesive composition is diluted with a solvent, each amount (parts by mass,% by mass) of the adhesive composition is based on the solid content, that is, means parts by mass,% by mass excluding the solvent.
- a moisture-curable resin (A), (B), and a radically polymerizable compound (C), which is blended as necessary, using a mixer are used.
- examples thereof include a method of mixing with other additives such as a photopolymerization initiator, a moisture curing accelerator, a filler, and a coupling agent.
- the mixer include a homodisper, a homomixer, a universal mixer, a planetary mixer (planetary stirrer), a kneader, a three-roll, and the like.
- the adhesive composition of the present invention may be cured and used as a cured product.
- the adhesive composition of the present invention has at least moisture curability. Therefore, the adhesive composition is, for example, by arranging an adhesive composition or a semi-cured adhesive composition between two adherends and at least using an adhesive composition (cured body) cured by moisture. It is advisable to bond the two adherends together.
- the adhesive composition of the present invention is preferably photocurable, and preferably has good photocurability by having the radically polymerizable compound (C). That is, it is preferable that the adhesive composition is used as a light-moisture-curable type. Therefore, it is preferable that the adhesive composition of the present invention is photo-cured by light irradiation to, for example, a B stage state (semi-cured state), and then further cured by moisture to be fully cured before use.
- the adhesive composition is arranged between the adherends, and when the adherends are joined, the adhesive composition is applied to one of the adherends, and then photocured by light irradiation, for example, B stage.
- the other adherend on the photocured adhesive composition in a state and temporarily bond the adherends with an appropriate adhesive force.
- the adhesive composition in the B stage state is completely cured by curing the moisture-curable resin (A) with moisture, and the adherends laminated via the adhesive composition have sufficient adhesive strength. Be joined.
- the adhesive composition may be applied to the adherend by, for example, a dispenser, but the application is not particularly limited.
- the light irradiated during photocuring is not particularly limited as long as it cures one or both of the moisture-curable resin (A) and the radically polymerizable compound (C), but ultraviolet rays are preferable. Further, when the adhesive composition is completely cured by moisture, it may be left in the air for a predetermined time.
- the adhesive composition of the present invention is used, for example, as an adhesive for electronic parts. Further, the adhesive composition of the present invention is preferably used as an adhesive for electronic devices, especially portable electronic devices.
- the electronic component or portable electronic device in which the adhesive composition of the present invention is used may have a cured product of the adhesive composition.
- the adherend in which the adhesive composition is used is not particularly limited, but is preferably a component constituting a portable electronic device, and the component is preferably an electronic component.
- the material of the adherend may be any of metal, glass, plastic and the like.
- the shape of the adherend is not particularly limited, and examples thereof include a film shape, a sheet shape, a plate shape, a panel shape, a tray shape, a rod shape, a box shape, and a housing shape.
- the portable electronic device is not particularly limited, and examples thereof include mobile phones such as smartphones, digital cameras, wearable terminals, portable game devices, tablet computers, notebook computers, action cameras, etc. Among these, smartphones and wearable terminals. Is preferable.
- the adhesive composition of the present invention has good impact resistance and oil resistance, and is therefore particularly suitable for portable electronic devices.
- the electronic component generally has a substrate, and therefore, the electronic component in which the adhesive composition of the present invention is used may have a cured body of the adhesive composition and a substrate. Various electronic circuits and the like are generally provided on the substrate. Similarly, an electronic device such as a portable electronic device in which the adhesive composition of the present invention is used may also have a cured product of the adhesive composition of the present invention and a substrate.
- the substrate may be used as an adherend and the substrates may be joined to each other via the adhesive composition of the present invention, but the substrate may be bonded to other members of the electronic device via the adhesive composition of the present invention. It may be joined to (for example, a housing) or the like.
- the adhesive composition of the present invention may be used inside an electronic device, for example, to join a substrate to a substrate to obtain an assembly part.
- the assembly component thus obtained has a first substrate, a second substrate, and a cured product of the present invention, and at least a part of the first substrate is at least a part of the second substrate. Is joined via a hardened body.
- the adhesive composition was evaluated as follows. (Adhesive strength) As shown in FIG. 1A, a first substrate 11 having a diameter of 90 mm ⁇ 50 mm and a thickness of 5 mm and having a circular hole 11A having a diameter of 12 mm in the center, and a second substrate 12 having a thickness of 50 mm ⁇ 50 mm and a thickness of 5 mm are provided. I prepared it. Both the first substrate 11 and the second substrate 12 were polycarbonate plates.
- the adhesive composition 10 has a width of 1 mm ⁇ 0.2 mm, a height of 0.25 mm ⁇ 0.05 mm, and a square frame of 20 mm ⁇ 20 mm so as to surround the hole 11A of the first substrate 11 in the center.
- the adhesive composition 10 was photocured by irradiating with UV-LED (wavelength 365 nm) at 1000 mJ / cm 2 of ultraviolet rays.
- the first substrate 11 is made so that the center positions of the first and second substrates 11 and 12 coincide with each other through a gap material (not shown) having a height of 0.2 mm and the adhesive composition 10.
- the first and second substrates 11 and 12 are put on the adhesive composition 10. It was crimped through. Then, 2 kg of the weight was removed, and the adhesive composition 10 was moisture-cured by leaving it at 25 ° C. and 50% RH for 24 hours to obtain a measurement sample 13. After moisture curing, the gap material was removed from the measurement sample 13.
- the first substrate 11 is arranged so as to be on the upper side and the second substrate 12 is arranged on the lower side, and the first substrate 11 is supported by a stainless steel jig in a diameter.
- a rod-shaped member 14 having a circular cross section of 10 mm was inserted into the hole 11A.
- the rod-shaped member 14 pushes the second substrate 12 vertically downward at a speed of 10 mm / min to apply stress when the second substrate 12 is peeled off from the first substrate 11. It was measured and used as the adhesive strength (adhesive strength before oil contact).
- the adhesive strength was evaluated according to the following evaluation criteria. AA: Adhesive strength is 4 MPa or more A: Adhesive strength is 3 MPa or more and less than 4 MPa B: Adhesive strength is less than 3 MPa
- Adhesive force after oil contact A measurement sample was prepared by the same procedure as above. The entire measurement sample was wrapped in a non-woven fabric (product name "Kimwipe", manufactured by Nippon Paper Cresia Co., Ltd.) soaked with oleic acid, and sealed in a polyethylene bag. The bag was cured in an environment of 60 ° C. and 90% RH for 2 days. After curing, the measurement sample was washed with ethanol, and the adhesive strength was measured in the same manner as above to obtain the adhesive strength after oil contact. The rate of decrease in the adhesive force after the oil contact with respect to the adhesive force before the oil contact was evaluated according to the following evaluation criteria. AA: Adhesive strength reduction rate is 30% or less A: Adhesive strength reduction rate is greater than 30% and 50% or less B: Adhesive strength reduction rate is greater than 50% and 70% or less C: Adhesive strength reduction rate is greater than 70%
- a measurement sample 13 is prepared in the same procedure as above, the first substrate 11 is placed on the upper side, the second substrate 12 is placed on the lower side, and the first substrate 11 is made of stainless steel. I supported it with a tool. Further, a jig 16 (material: stainless steel) having a flat plate portion 16B (20 mm ⁇ 20 mm, thickness 5 mm) and a rod-shaped portion 16A (diameter 10 mm, columnar) connected to the center of the flat plate portion 16B is prepared. As shown in FIG. 2, the rod-shaped portion 16A of the jig 16 was inserted into the hole 11A of the first substrate 11 and stood in the center of the second substrate 12.
- the first and second substrates were prepared in the same procedure as when the measurement sample was prepared, and the adhesive composition was applied to the first substrate and photo-cured. Then, without using a gap material, the second substrate is superposed on the first substrate so that the center positions of the first and second substrates are aligned with each other via the adhesive composition. A further 100 g of a weight was allowed to stand on the second substrate for 10 seconds, and the first and second substrates were crimped via an adhesive composition to remove the weight. The thickness of the adhesive composition after removing the weight was measured and evaluated according to the following evaluation criteria. A: The thickness of the adhesive composition is 0.1 mm or more C: The thickness of the adhesive composition is less than 0.1 mm
- Moisture Curable Resin (1) 100 parts by mass of a polycarbonate diol (a compound represented by the formula (1), 90 mol% of R is a 3-methylpentylene group, 10 mol% is a hexamethylene group, manufactured by Kuraray Co., Ltd., trade name "Kuraraypolyol C”. -1090 ") and 0.01 parts by mass of dibutyltin dilaurate were placed in a separable flask having a capacity of 500 mL.
- a polycarbonate diol a compound represented by the formula (1), 90 mol% of R is a 3-methylpentylene group, 10 mol% is a hexamethylene group, manufactured by Kuraray Co., Ltd., trade name "Kuraraypolyol C”. -1090 ”
- 0.01 parts by mass of dibutyltin dilaurate were placed in a separable flask having a capacity of 500 mL.
- the inside of the flask was stirred under vacuum (20 mmHg or less) at 80 ° C. for 60 minutes to mix. Then, under normal pressure, 30 parts by mass of 2-methacryloyloxyethyl isocyanate (manufactured by Showa Denko KK, trade name "Karenzu MOI") was added to the obtained reaction product, and the mixture was stirred at 100 ° C. for 3 hours for reaction.
- the reaction product was obtained having a polycarbonate (PC) skeleton and having a methacryloyl group at one end.
- a moisture-curable urethane resin (1-1) having the above was obtained.
- the proportion of the moisture-curable urethane resin (A1) having a methacryloyl group at one end and an isocyanate group at one end was 80% by mass.
- the moisture-curable urethane resin (1-1) also contained a moisture-curable urethane resin (B1) having isocyanate groups at both ends.
- the weight average molecular weight of the obtained moisture-curable urethane resin (1-1) was 5000.
- polyester polyol obtained mainly containing adipic acid, 1,6-hexanediol and isophthalic acid, aromatic ring concentration 15% by mass, weight average molecular weight 1000
- dibutyltin dilaurate was placed in a 500 mL separable flask. Under vacuum (20 mmHg or less), the mixture was stirred at 80 ° C. for 1 hour and mixed.
- Resin (1-2) was obtained.
- the proportion of the moisture-curable urethane resin (A1) having a methacryloyl group at one end and an isocyanate group at one end was 80% by mass.
- the moisture-curable urethane resin (1-2) also contained a moisture-curable urethane resin (B1) having isocyanate groups at both ends.
- the weight average molecular weight of the obtained moisture-curable urethane resin (1-2) was 3000.
- polyester polyol obtained mainly containing adipic acid, 1,6-hexanediol and isophthalic acid, aromatic ring concentration 15% by mass, weight average molecular weight 1000
- dibutyltin dilaurate was placed in a 500 mL separable flask. Under vacuum (20 mmHg or less), the mixture was stirred at 100 ° C. for 30 minutes and mixed.
- a moisture-curable urethane resin (2-2) having an isocyanate group was obtained.
- the weight average molecular weight of the obtained moisture-curable urethane resin (2-2) was 1500.
- the components other than the moisture-curable urethane resin used in each Example and Comparative Example were as follows.
- Imid ring-containing acrylate Toa Synthetic Co., Ltd., trade name "M-140", N-acryloyloxyethyl hexahydrophthalimide, monofunctional aromatic ring-containing acrylate: Kyoeisha Chemical Co., Ltd., trade name "Light acrylate PO-A” , Phenoxyethyl acrylate, monofunctional aliphatic acrylate: manufactured by Dicel Ornex, trade name "IBOA-B", isobonyl acrylate, monofunctional filler: trimethylsilylated silica, manufactured by Nippon Aerozil, trade name "R812".
- Photopolymerization Initiator 2-Benzyl-2-dimethylamino-1- (4-morpholinophenyl) -butanone-1, manufactured by BASF, trade name "IRGACURE 369"
- Other additives Radical scavengers, antioxidants and moisture curing catalysts
- Examples 1 to 6, Comparative Examples 1 to 3 According to the compounding ratios shown in Table 1, each material is stirred at a temperature of 50 ° C. with a planetary stirrer (Sinky Co., Ltd., “Awatori Rentaro”), and then at a temperature of 50 ° C. with three ceramic rolls. The mixture was uniformly mixed to obtain the adhesive compositions of Examples 1 to 6 and Comparative Examples 1 to 3.
- the adhesive composition contains a moisture-curable resin (A) having a specific structure and a moisture-curable resin (B) to increase impact resistance.
- the oil resistance was improved, and high adhesive strength could be maintained even after oil contact.
- the adhesive composition also has shape retention by containing the radically polymerizable compound (C) in addition to the moisture-curable resins (A) and (B). It became good, and the cured product formed from the adhesive composition made it possible to secure a certain distance between the adherends.
- the adhesive composition contained the moisture-curable resin (B) to secure the adhesive strength of a certain value or more, but contained the moisture-curable resin (A). Therefore, it was not possible to improve the impact resistance while improving the oil resistance.
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Abstract
Description
特許文献1に示される湿気硬化型接着剤は、衣料用途に使用可能であり、耐汗劣化性及び耐加水分解性に優れ、柔軟性を高くでき、特に汗の成分の1つである高級脂肪酸に対する耐劣化性に優れることが示されている。
また、携帯電子機器は、使用時に落下することが多いため、携帯電子機器に使用される接着剤は、落下時に部品が脱落しないように高い耐衝撃性が求められることが多い。
[1]ポリカーボネート骨格及びポリエステル骨格の少なくともいずれかを有し、かつイソシアネート基と(メタ)アクリロイル基とを有する湿気硬化性樹脂(A)と、
イソシアネート基を有し、かつ(メタ)アクリロイル基を有さない湿気硬化性樹脂(B)とを含む、接着剤組成物。
[2]前記湿気硬化樹脂(B)が、ポリカーボネート骨格及びポリエステル骨格の少なくともいずれかを有する、上記[1]に記載の接着剤組成物。
[3]前記湿気硬化樹脂(B)がポリカーボネート骨格を有する、上記[1]又は[2]に記載の接着剤組成物。
[4]前記湿気硬化樹脂(B)が両末端にイソシアネート基を有する、上記[1]~[3]のいずれか1項に記載の接着剤組成物。
[5]前記湿気硬化樹脂(A)がポリカーボネート骨格を有する、上記[1]~[4]のいずれか1項に記載の接着剤組成物。
[6]前記湿気硬化樹脂(A)が芳香族イソシアネート基を有する、上記[1]~[5]のいずれか1項に記載の接着剤組成物。
[7]イソシアネート基を含有しないラジカル重合性化合物(C)をさらに含む、上記[1]~[6]のいずれか1項に記載の接着剤組成物。
[8]前記ラジカル重合性化合物(C)が、芳香族環を有するラジカル重合性化合物、及びイミド環を有するラジカル重合性化合物からなる群より選択される少なくとも1種を含有する、上記[7]に記載の接着剤組成物。
[9]前記ラジカル重合性化合物(C)が、(メタ)アクリロイル基を有する化合物を含有する上記[7]又は[8]に記載の接着剤組成物。
[10]前記ラジカル重合性化合物(C)が、芳香族環を有するラジカル重合性化合物、及びイミド環を有するラジカル重合性化合物以外の他のラジカル重合性化合物を含有する上記[7]~[9]のいずれか1項に記載の接着剤組成物。
[11]前記他のラジカル重合性化合物が、脂肪族ウレタン(メタ)アクリレート及び(メタ)アクリル酸エステル化合物からなる群から選択される少なくとも1種を含む上記[10]に記載の接着剤組成物。
[12]前記ラジカル重合性化合物(C)の含有量が、湿気硬化性樹脂とラジカル重合性化合物の合計量100質量部に対して、5質量部以上50質量部以下である、上記[7]~[11]のいずれか1項に記載の接着剤組成物。
[13]さらに光重合開始剤を含有する、上記[7]~[12]のいずれか1項に記載の接着剤組成物。
[14]前記湿気硬化性樹脂(A)が、片末端にイソシアネート基を有し、かつ片末端に(メタ)アクリロイル基を有する上記[1]~[13]のいずれか1項に記載の接着剤組成物。
[15]前記湿気硬化性樹脂(A)が、湿気硬化性ウレタン樹脂(A1)である上記[1]~[14]のいずれか1項に記載の接着剤組成物。
[16]前記湿気硬化性ウレタン樹脂(A1)が、ポリオール化合物と、ポリイソシアネート化合物と、(メタ)アクリロイル基を有する化合物とを反応させて得られたものである、上記[15]に記載の接着剤組成物。
[17]前記湿気硬化性樹脂(A)の含有量が、湿気硬化性樹脂とラジカル重合性化合物の合計量100質量部に対して、0.1質量部以上30質量部以下である上記[1]~[16]のいずれか1項に記載の接着剤組成物。
[18]前記湿気硬化性樹脂(B)が、湿気硬化性ウレタン樹脂(B1)である上記[1]~[17]のいずれか1項に記載の接着剤組成物。
[19]前記湿気硬化性ウレタン樹脂(B1)が、ポリオール化合物と、ポリイソシアネート化合物とを反応して得られたものである、上記[18]に記載の接着剤組成物。
[20]前記湿気硬化性樹脂(B)の含有量が、湿気硬化性樹脂とラジカル重合性化合物の合計量100質量部に対して、30質量部以上99.9質量部以下上記[1]~[19]のいずれか1項に記載の接着剤組成物。
[21]充填剤をさらに含有する上記[1]~[20]のいずれか1項に記載の接着剤組成物
[22]上記[1]~[21]のいずれか1項に記載の接着剤組成物からなる、電子部品用接着剤。
[23]上記[1]~[21]のいずれか1項に記載の接着剤組成物からなる、携帯電子機器用接着剤。
[24]上記[1]~[21]のいずれか1項に記載の接着剤組成物の硬化体。
[25]上記[1]~[21]のいずれか1項に記載の接着剤組成物の電子部品への使用。
[26]上記[1]~[21]のいずれか1項に記載の接着剤組成物の携帯電子機器への使用。
本発明の接着剤組成物は、湿気硬化性樹脂(A)と湿気硬化性樹脂(B)とを含有する。
以下、各湿気硬化性樹脂について詳細に説明する。
湿気硬化性樹脂(A)は、ポリカーボネート骨格及びポリエステル骨格の少なくともいずれかを有し、かつイソシアネート基と(メタ)アクリロイル基とを有する。
本発明の接着剤組成物は、以上の構造を有する湿気硬化性樹脂(A)を、後述する構造を有する湿気硬化性樹脂(B)と併用することで、一定の接着性を確保しつつ、高い耐油性と高い耐衝撃性の両立を図ることができる。また、接着剤組成物は、湿気硬化性樹脂(A)及び湿気硬化性樹脂(B)を有することで湿気硬化性を有し、湿気硬化型接着剤として使用できる。
なお、本明細書において、「(メタ)アクリロイル基」は、アクリロイル基又はメタクリロイル基を意味し、他の類似する用語も同様である。
湿気硬化性樹脂(A)としては、柔軟性などの観点から、ポリエステル骨格を有する湿気硬化性樹脂を使用してもよいが、ポリカーボネート骨格を有する湿気硬化性樹脂を使用することが好ましい。ポリカーボネート骨格を有する湿気硬化性樹脂を使用することで、耐油性が向上して、油分に接触した後でも、接着力を良好に維持しやすくなる。
湿気硬化性樹脂(A)としては、ポリカーボネート骨格を有する湿気硬化性樹脂(A)を単独で使用することが好ましいが、上記のとおりポリエステル骨格を有する湿気硬化性樹脂(A)と併用してもよい。湿気硬化性樹脂(A)は、ポリカーボネート骨格を有する湿気硬化性樹脂(A)を含有する場合、ポリカーボネート骨格を有する湿気硬化性樹脂(A)を好ましくは50質量%以上、より好ましくは75質量%以上100質量%以下含有するとよい。
湿気硬化性樹脂(A)におけるポリカーボネート骨格及びポリエステル骨格は、後述する通り、それぞれポリオール化合物由来であることが好ましい。したがって、ポリカーボネート骨格は、ポリカーボネートポリオール由来であるとよく、ポリエステル骨格は、ポリエステルポリオール由来であるとよい。
なお、芳香族イソシアネート基は、芳香族環に直接結合したイソシアネート基であり、脂肪族イソシアネート基は、イソシアネート基が脂肪族の炭素原子に直接結合したイソシアネート基である。
湿気硬化性樹脂(A)の(メタ)アクリロイル基は、後述する(メタ)アクリロイル基を有する化合物由来であるとよい。湿気硬化性樹脂(A)は、(メタ)アクリロイル基を末端に有することが好ましい。湿気硬化性樹脂(A)の(メタ)アクリロイル基は、後述する光硬化により反応させるとよいが、必ずしも光硬化により反応させる必要はない。すなわち、湿気硬化性樹脂(A)は、光硬化により、湿気硬化性樹脂(A)同士で反応してもよいし、後述するラジカル重合性化合物(C)と反応してもよいが、反応しなくてもよい。
湿気硬化性樹脂(A)は、耐衝撃性の観点から、好ましくは、片末端にイソシアネート基を有し、片末端に(メタ)アクリロイル基を有する。なお、本明細書において、「末端」とは、主鎖の末端を意味する。
湿気硬化性樹脂(A)は、湿気硬化性ウレタン樹脂(A1)であることが好ましい。したがって、湿気硬化性樹脂(A)は、イソシアネート基及び(メタ)アクリロイル基に加えて、ウレタン結合を有することが好ましい。湿気硬化性樹脂(A)として湿気硬化性ウレタン樹脂(A1)を使用することで、耐油性などが向上しやすい。以下、湿気硬化性樹脂(A)が湿気硬化性ウレタン樹脂(A1)である場合についてより詳細に説明する。
上記したポリオール化合物と、ポリイソシアネート化合物と、(メタ)アクリロイル基を有する化合物との反応は、通常、これら化合物中の水酸基(OH)と、イソシアネート基(NCO)とのモル比が[NCO]/[OH]=2.0~2.5となる範囲で行われる。
また、湿気硬化性ウレタン樹脂(A1)の合成においては、併せて後述する湿気硬化性ウレタン樹脂(B1)の少なくとも一部を合成してもよい。そのような湿気硬化性ウレタン樹脂(B1)としては、両末端にイソシアネート基を有するウレタン樹脂が挙げられる。さらに、湿気硬化性ウレタン樹脂(A1)の合成においては、イソシアネート基を有さずに、(メタ)アクリロイル基を有するウレタン(メタ)アクリレートを合成してもよい。
nは5~200であることが好ましく、10~150であることがより好ましく、20~50であることがさらに好ましい。
また、湿気硬化性ウレタン樹脂(A1)を構成するポリカーボネートポリオールに含まれるRは、1種単独で使用してよいし、2種以上を併用してもよい。2種以上併用する場合には、少なくとも一部が炭素数6以上の鎖状の脂肪族飽和炭化水素基であることが好ましい。また、好ましくは一分子中に2種類以上のRを含み、より好ましくは一分子中に2種又は3種のRを含む。
炭素数6以上の鎖状の脂肪族飽和炭化水素基は、好ましくは炭素数6以上12以下であり、さらに好ましくは炭素数6以上10以下、よりさらに好ましくは炭素数6以上8以下である。
Rの具体例としては、テトラメチレン基、ペンチレン基、ヘキサメチレン基、ヘプタメチレン基、オクタメチレン基、ノナメチレン基、デカメチレン基などの直鎖状であってもよいし、例えば3-メチルペンチレン基などのメチルペンチレン基、メチルオクタメチレン基などの分岐状であってもよい。一分子中における複数のRは、互いに同一であってもよいし、異なっていてもよい。さらに、弾性率を一定値以上とする観点からRは分岐状の脂肪族飽和炭化水素基を含むことが好ましく、耐候性の観点からはRは直鎖状の脂肪族飽和炭化水素基を含むことが好ましい。ポリカーボネートポリオールにおけるRは分岐状と直鎖状のRが併用されていてもよい。
なお、ポリカーボネートポリオールは、1種単独で用いてもよいし、2種以上を組み合わせて用いてもよい。
ポリエステルポリオールの原料となるポリオールとしては、例えば、エチレングリコール、プロピレングリコール、1,3-プロパンジオール、1,4-ブタンジオール、ネオペンチルグリコール、1,5-ペンタンジオール、1,6-ヘキサンジオール、ジエチレングリコール、シクロヘキサンジオール等が挙げられる。
なお、本発明では、湿気硬化性ウレタン樹脂(A1)の原料となるポリオール化合物に、ポリカーボネートポリオールを使用することで、湿気硬化性ウレタン樹脂(A1)にポリカーボネート骨格を導入させ、ポリカーボネート骨格を有する湿気硬化性ウレタン樹脂(A1)とすればよい。同様に、湿気硬化性ウレタン樹脂(A1)の原料となるポリオール化合物に、ポリエステルポリオールを使用することで、湿気硬化性ウレタン樹脂(A1)にポリエステル骨格を導入させ、ポリエステル骨格を有する湿気硬化性ウレタン樹脂(A1)とすればよい。
芳香族ポリイソシアネート化合物としては、例えば、ジフェニルメタンジイソシアネート、ジフェニルメタンジイソシアネートの液状変性物、トリレンジイソシアネート、ナフタレン-1,5-ジイソシアネート等が挙げられる。芳香族ポリイソシアネート化合物は、これらを多量化したものでもあってもよく、ポリメリックMDIなどでもよい。芳香族ポリイソシアネート化合物としては、ジフェニルメタンジイソシアネートが好ましい。
脂肪族ポリイソシアネート化合物としては、例えば、ヘキサメチレンジイソシアネート、トリメチルヘキサメチレンジイソシアネート、リジンジイソシアネート、ノルボルナンジイソシアネート、トランスシクロヘキサン-1,4-ジイソシアネート、イソホロンジイソシアネート、水添キシリレンジイソシアネート、水添ジフェニルメタンジイソシアネート、シクロヘキサンジイソシアネート、ビス(イソシアネートメチル)シクロヘキサン、ジシクロヘキシルメタンジイソシアネート等が挙げられる。脂肪族ポリイソシアネート化合物は、これらを多量化したものなどであってもよい。
ポリイソシアネート化合物は、1種単独で用いられてもよいし、2種以上を組み合わせて用いられてもよい。
また、これら水酸基及び(メタ)アクロイル基を有する化合物は、各種ジイソシアネート化合物と、イソシアネート基/水酸基(モル比)が2となるような割合で反応させることにより得られる化合物等を、湿気硬化性ウレタン樹脂(A1)の原料となる(メタ)アクリロイル基を有する化合物として使用してもよい。
なお、本明細書において重量平均分子量は、ゲルパーミエーションクロマトグラフィー(GPC)で測定を行い、ポリスチレン換算により求められる値である。GPCによってポリスチレン換算による重量平均分子量を測定する際のカラムとしては、Shodex LF-804(昭和電工社製)が挙げられる。また、GPCで用いる溶媒としては、テトラヒドロフランが挙げられる。
なお、本明細書において、湿気硬化性樹脂とラジカル重合性化合物の合計量は、ラジカル重合性化合物(C)成分が含有されないときには、湿気硬化性樹脂の合計含有量を意味する。
本発明における湿気硬化性樹脂(B)は、イソシアネート基を有するが、(メタ)アクリロイル基を有さない樹脂である。接着剤組成物は、湿気硬化性樹脂(B)を有することで、接着剤組成物に適切な接着性能を付与できる。
ポリカーボネート骨格及びポリエステル骨格の少なくともいずれかを有する湿気硬化性樹脂(B)は、一分子中にポリカーボネート骨格及びポリエステル骨格の一方を有すればよいが、一分子中にポリカーボネート骨格及びポリエステル骨格の両方を含有してもよい。また、湿気硬化性樹脂(B)は、ポリカーボネート骨格を有する湿気硬化性樹脂と、ポリエステル骨格を有する湿気硬化性樹脂とを併用してもよい。
湿気硬化性樹脂(B)としては、ポリカーボネート骨格を有する湿気硬化性樹脂(B)を単独で使用することが好ましいが、上記のとおりポリエステル骨格を有する湿気硬化性樹脂(B)と併用してもよい。湿気硬化性樹脂(B)は、ポリカーボネート骨格を有する湿気硬化性樹脂(B)を含有する場合、ポリカーボネート骨格を有する湿気硬化性樹脂(B)を好ましくは50質量%以上、より好ましくは75質量%以上100質量%以下含有するとよい。
湿気硬化性樹脂(B)は、イソシアネート基を末端に有することが好ましく、両末端にイソシアネート基を有することがより好ましい。湿気硬化性樹脂(B)は、両末端にイソシアネート基を有することで湿気硬化により高分子量化しやすくなり、高い接着性を確保しやすくなる。そして、湿気硬化性樹脂(B)は、耐油性の観点から、両末端に芳香族イソシアネート基を有することがさらに好ましい。
湿気硬化性樹脂(B)は、湿気硬化性ウレタン樹脂(B1)であることが好ましい。したがって、湿気硬化性樹脂(B)は、イソシアネート基に加えて、ウレタン結合を有することが好ましい。湿気硬化性樹脂(B)として湿気硬化性ウレタン樹脂(B1)を使用することで、耐油性などが向上しやすい。以下、湿気硬化性樹脂(B)が湿気硬化性ウレタン樹脂(B1)である場合についてより詳細に説明する。
湿気硬化性ウレタン樹脂(B1)は、1分子中にイソシアネート基を1個有していてもよいし、2個以上有していてもよいが、上記の通り主鎖両末端にイソシアネート基を有することがより好ましい。
なお、本発明では、湿気硬化性ウレタン樹脂(B1)の原料となるポリオール化合物に、ポリカーボネートポリオールを使用することで、湿気硬化性ウレタン樹脂(B1)にポリカーボネート骨格を導入させ、ポリカーボネート骨格を有する湿気硬化性ウレタン樹脂(B1)とすればよい。また、湿気硬化性ウレタン樹脂(B1)の原料となるポリオール化合物に、ポリエステルポリオールを使用することで、湿気硬化性ウレタン樹脂(B1)にポリエステル骨格を導入させ、ポリエステル骨格を有する湿気硬化性ウレタン樹脂(B1)とすればよい。また、一分子中にポリカーボネート骨格とポリエステル骨格の両方を導入させてもよい。
なお、上記式(3)中におけるxが0の場合とは、ケイ素原子がR3で表される原子又は基と結合せずに3つの-OR4と結合している場合を意味する。
式(3)で表される基において、R3及びR4は、接着性を向上させる観点などから、炭素数1~5のアルキル基であることが好ましく、メチル基又はエチル基のいずれかであることがより好ましい。
上記反応性官能基と式(3)で表される基とを有する化合物としては、例えば、3-メルカプトプロピルトリメトキシシラン、3-メルカプトプロピルトリエトキシシラン、3-グリシドキシプロピルトリメトキシシラン、3-グリシドキシプロピルトリエトキシシラン、2-(3,4-エポキシシクロヘキシル)エチルトリメトキシシラン、3-グリシドキシプロピルメチルジエトキシシラン、3-アミノプロピルトリメトキシシラン、3-アミノプロピルトリエトキシシラン、3-(2-アミノエチル)アミノプロピルトリメトキシシラン、3-(2-アミノエチル)アミノプロピルトリエトキシシラン、3-(2-アミノエチル)アミノプロピルメチルジメトキシシラン、3-(メタ)アクリロイルオキシプロピルトリメトキシシラン、3-(メタ)アクリロイルオキシプロピルトリエトキシシラン、3-(メタ)アクリロイルオキシプロピルメチルジメトキシシラン、3-(メタ)アクリロイルオキシプロピルメチルジエトキシシラン、ビニルトリメトキシシラン、ビニルトリエトキシシラン、3-イソシアネートプロピルトリメトキシシラン、3-メルカプトプロピルメチルジメトキシシラン、3-メルカプトプロピルメチルジエトシキシラン、3-グリシドキシプロピルメチルジメトキシシラン、3-グリシドキシプロピルメチルジエトシキシラン等が挙げられる。なかでも、反応性の観点から、反応性官能基としてチオール基を有するものが好ましい。
これら観点から、湿気硬化性樹脂(B)の重量平均分子量は2000以上30000以下がより好ましく、3000以上20000以下がさらに好ましい。
以上の観点、及び後述するラジカル重合性化合物(C)を一定量以上含有させる観点から、湿気硬化性樹脂(B)の上記含有量は、好ましくは45質量部以上94質量部以下、より好ましくは50質量部以上88質量部以下、さらに好ましくは53質量部以上80質量部以下である。
上記湿気硬化性樹脂(A),(B)以外の湿気硬化性樹脂の含有量は、特に限定されないが、湿気硬化性樹脂全体を100質量部としたときに、例えば30質量部以下であってもよいし、10質量部以下程度であってもよい。
本発明の接着剤組成物は、上記湿気硬化性樹脂(A),(B)以外にラジカル重合性化合物(C)を含有することが好ましい。ラジカル重合性化合物(C)は、イソシアネート基を含有しない化合物である。
本発明では、ラジカル重合性化合物(C)を含有することで、接着剤組成物に光硬化性を容易に付与して、接着剤組成物を光硬化性が良好な光湿気硬化型とすることができる。したがって、接着剤組成物は、光照射するだけで一定の接着力が付与できるので、光硬化後かつ湿気硬化前の半硬化状態においても一定以上の接着力を確保できる。また、光硬化後かつ湿気硬化前の半硬化状態において、一定以上の硬度を有し、優れた形状保持性を確保しやすくなる。形状保持性が優れたものとなると、例えばディスペンサーなどにより塗布した接着剤組成物は、光硬化後に一定の高さを確保できるので、接着剤組成物から形成された硬化体により被着体間に一定の間隔を確保できるようになる。
また、湿気硬化性樹脂(A)、(B)に加えて、ラジカル重合性化合物(C)を使用することで、接着剤組成物の粘度が低下しやすくなる。そのため、接着剤組成物は、硬化前において、常温(例えば、25℃)などにおいて適度な流動性を確保しやすくなり、塗布性を良好にできる。
なお、ラジカル重合性化合物(C)は、湿気硬化性を有しない化合物であるとよく、したがって、上記有機シリル基などの湿気硬化性の官能基も含有しないとよい。
上記したものの中では、接着性の観点から、(メタ)アクリロイル基が好適であり、すなわち、ラジカル重合性化合物(C)は、(メタ)アクリロイル基を有する化合物を含有することが好ましい。なお、(メタ)アクリロイル基を有する化合物は、以下、「(メタ)アクリル化合物」ともいう。
また、フェノキシジエチレングリコール(メタ)アクリレート、フェノキシポリエチレングリコール(メタ)アクリレート、ノニルフェノキシジエチレングリコール(メタ)アクリレート、ノニルフェノキシポリエチレングリコール(メタ)アクリレートなどのフェノキシポリオキシエチレン系(メタ)アクリレートなども挙げられる。
これらの中では、フェノキシアルキル(メタ)アクリレートが好ましく、中でも、フェノキシエチル(メタ)アクリレートがより好ましい。
また、イミド環を有するラジカル重合性化合物としては、N-(メタ)アクリロイルオキシエチルヘキサヒドロフタルイミド等のイミド環を有する(メタ)アクリル酸エステル化合物、N-ビニルフタルイミド、N-アリルフタルイミド、N-(3-ブテン-1-イン)フタルイミド、N-アリルオキシフタルイミド等のイミド環を有するビニル化合物などが挙げられる。
ラジカル重合性化合物(C)は、芳香族環を有するラジカル重合性化合物、及びイミド環を有するラジカル重合性化合物について、これらのうち一方を有するとよいが、両方を有してもよい。また、ラジカル重合性化合物(C)は、少なくともイミド環を有するラジカル重合性化合物を含有することがより好ましい。
接着剤組成物における、芳香族環を有するラジカル重合性化合物、及びイミド環を有するラジカル重合性化合物からなる群から選択される化合物の含有量は、ラジカル重合性化合物(C)全量に対して、20質量%以上が好ましく、25質量%以上がより好ましく、50質量%以上がさらに好ましく、80質量%以上がよりさらに好ましい。また、これら化合物の上記含有量は、100質量%以下であればよい。これら化合物の含有量を多くすることで、接着剤組成物の耐油性が向上して、油分に接触した後でも高い接着力を維持できる。
なお、脂肪族ウレタン(メタ)アクリレートは、上記の通り残存イソシアネート基を有さないものである。他のラジカル重合性化合物は、単官能であってもよいし、2官能などの多官能であってもよいが、単官能が好ましい。また、脂肪族ウレタン(メタ)アクリレートは、単官能を使用する場合、2官能などの多官能と併用してもよい。
上記水酸基を有する(メタ)アクリル酸誘導体としては、例えば、エチレングリコール、プロピレングリコール、1,3-プロパンジオール、1,3-ブタンジオール、1,4-ブタンジオール、ポリエチレングリコール等の二価のアルコールのモノ(メタ)アクリレートや、トリメチロールエタン、トリメチロールプロパン、グリセリン等の三価のアルコールのモノ(メタ)アクリレート等が挙げられる。
単官能の脂肪族ウレタン(メタ)アクリレートは、より具体的には、上記したモノイソシアネート化合物と、二価のアルコールのモノ(メタ)アクリレートとを反応して得られたウレタン(メタ)アクリレートが好ましく、その好適な具体例としては、1,2-エタンジオール1-アクリラート2-(N-ブチルカルバマート)などの1,2-エタンジオール1-アクリラート2-(N-アルキルカルバマート)が挙げられる。
また、多官能の脂肪族ウレタン(メタ)アクリレートとしては、ポリオール化合物を、イソシアネート基と(メタ)アクリロイル基を有する化合物に反応させて得た反応生成物が挙げられる。具体的には、両末端に(メタ)アクリロイル基を有するウレタン(メタ)アクリレートが挙げられる。なお、ポリオール化合物、並びにイソシアネート基及び(メタ)アクリロイル基を有する化合物の詳細は、湿気硬化性ウレタン樹脂(A1)の原料において説明したとおりである。
具体的には、(メタ)アクリル酸エステル化合物のうち単官能のものとしては、例えば、メチル(メタ)アクリレート、エチル(メタ)アクリレート、プロピル(メタ)アクリレート、n-ブチル(メタ)アクリレート、イソブチル(メタ)アクリレート、t-ブチル(メタ)アクリレート、n-オクチル(メタ)アクリレート、イソオクチル(メタ)アクリレート、2-エチルヘキシル(メタ)アクリレート、イソノニル(メタ)アクリレート、イソデシル(メタ)アクリレート、ラウリル(メタ)アクリレート、イソミリスチル(メタ)アクリレート、ステアリル(メタ)アクリレートなどのアルキル(メタ)アクリレート、シクロヘキシル(メタ)アクリレート、4-tert-ブチルシクロヘキシル(メタ)アクリレート、3,3,5-トリメチルシクロヘキシル(メタ)アクリレート、イソボルニル(メタ)アクリレート、ジシクロペンテニル(メタ)アクリレート等の脂環式構造を有する(メタ)アクリレート、2-ヒドロキシエチル(メタ)アクリレート、2-ヒドロキシプロピル(メタ)アクリレート、2-ヒドロキシブチル(メタ)アクリレート、4-ヒドロキシブチル(メタ)アクリレートなどのヒドロキシアルキル(メタ)アクリレート、2-メトキシエチル(メタ)アクリレート、2-エトキシエチル(メタ)アクリレート、2-ブトキシエチル(メタ)アクリレートなどのアルコキシアルキル(メタ)アクリレート、メトキシエチレングリコール(メタ)アクリレート、エトキシエチレングリコール(メタ)アクリレートなどのアルコキシエチレングリコール(メタ)アクリレート、メトキシジエチレングリコール(メタ)アクリレート、メトキシトリエチレングリコール(メタ)アクリレート、メトキシポリエチレングリコール(メタ)アクリレート、エトキシジエチレングリコール(メタ)アクリレート、エトキシトリエチレングリコール(メタ)アクリレート、エトキシポリエチレングリコール(メタ)アクリレートなどのポリオキシエチレン系(メタ)アクリレートなどが挙げられる。
他のラジカル重合性化合物も1種単独で使用してもよいし、2種以上を併用してもよい。
本発明の接着剤組成物は、さらに光重合開始剤を含有してもよい。接着剤組成物は、光重合開始剤を含有することで、接着剤組成物に光硬化性を適切に付与できる。接着剤組成物は、ラジカル重合性化合物(C)を含有する場合に、光重合開始剤を使用することが好ましい。
光重合開始剤としては、例えば、ベンゾフェノン系化合物、アセトフェノン系化合物、アシルフォスフィンオキサイド系化合物、チタノセン系化合物、オキシムエステル系化合物、ベンゾインエーテル系化合物、チオキサントン等が挙げられる。
上記光重合開始剤のうち市販されているものとしては、例えば、IRGACURE184、IRGACURE369、IRGACURE379、IRGACURE651、IRGACURE784、IRGACURE819、IRGACURE907、IRGACURE2959、IRGACURE OXE01、ルシリンTPO(いずれもBASF社製)、ベンゾインメチルエーテル、ベンゾインエチルエーテル、ベンゾインイソプロピルエーテル(いずれも東京化成工業社製)等が挙げられる。
本発明の接着剤組成物は、湿気硬化性樹脂の湿気硬化反応を促進させる湿気硬化促進触媒を含有させてもよい。湿気硬化促進触媒を使用することにより、接着剤組成物は、湿気硬化性がより優れたものとなり、接着力を高めやすくなる。
湿気硬化促進触媒としては、具体的にはアミン系化合物、金属系触媒などが挙げられる。アミン系化合物としては、ジ(メチルモルホリノ)ジエチルエーテル、4-モルホリノプロピルモルホリン、2,2’-ジモルホリノジエチルエーテル等のモルホリン骨格を有する化合物、ビス(2-ジメチルアミノエチル)エーテル、1,2-ビス(ジメチルアミノ)エタンなどのジメチルアミノ基を2つ有するジメチルアミノ基含有アミン化合物、トリエチルアミン、1,4-ジアザビシクロ[2.2.2]オクタン、2,6,7-トリメチル-1,4-ジアザビシクロ[2.2.2]オクタン等が挙げられる。
金属系触媒としては、ジラウリル酸ジn-ブチルスズ、ジ酢酸ジn-ブチルスズ、オクチル酸スズ等のスズ化合物、オクチル酸亜鉛、ナフテン酸亜鉛等の亜鉛化合物、ジルコニウムテトラアセチルアセトナート、ナフテン酸銅、ナフテン酸コバルト等のその他の金属化合物が挙げられる。
接着剤組成物における湿気硬化促進触媒の含有量は、接着剤組成物100質量部に対して、好ましくは0.1質量部以上10質量部以下、より好ましくは0.2質量部以上8質量部以下、さらに好ましくは0.3質量部以上5質量部以下である。
本発明の接着剤組成物は、充填剤を含有してもよい。充填剤を含有することにより、本発明の接着剤組成物は、好適なチクソ性を有するものとなり、塗布後の形状保持性を良好にしやすくなる。充填剤としては、粒子状のものを使用すればよい。
充填剤としては、無機充填剤が好ましく、例えば、シリカ、タルク、酸化チタン、酸化亜鉛、炭酸カルシウム等が挙げられる。なかでも、接着剤組成物が紫外線透過性に優れるものとなることから、シリカが好ましい。また、充填剤は、シリル化処理、アルキル化処理、エポキシ化処理等の疎水性表面処理がなされていてもよい。
充填剤は、1種単独で用いられてもよいし、2種以上が組み合わせて用いられてもよい。
充填剤の含有量は、接着剤組成物100質量部に対して、好ましくは0.5質量部以上30質量部以下、より好ましくは1質量部以上25質量部以下、さらに好ましくは2質量部以上15質量部以下である。
接着剤組成物は、必要に応じて、溶剤により希釈されていてもよい。接着剤組成物が溶剤により希釈される場合、接着剤組成物の各量(質量部、質量%)は、固形分基準であり、すなわち、溶剤を除いた質量部、質量%を意味する。
本発明の接着剤組成物は、硬化され、硬化体として使用されるとよい。本発明の接着剤組成物は、少なくとも湿気硬化性を有する。したがって、接着剤組成物は、例えば、2つの被着体間に接着剤組成物又は半硬化された接着剤組成物を配置して、少なくとも湿気により硬化された接着剤組成物(硬化体)により、2つの被着体を接着させるとよい。
ここで、接着剤組成物は、被着体間に配置させ、その被着体間を接合させる場合には、一方の被着体に塗布し、その後、光照射により光硬化させ、例えばBステージ状態にし、その光硬化した接着剤組成物の上に他方の被着体を重ね合わせ、被着体間を適度な接着力で仮接着させるとよい。その後、Bステージ状態の接着剤組成物は、湿気硬化性樹脂(A)を湿気により硬化させることで全硬化させ、接着剤組成物を介して重ね合わされた被着体間が十分な接着力で接合される。
接着剤組成物が使用される被着体は、特に限定されないが、好ましくは、携帯電子機器を構成する部品であり、その部品は電子部品であることが好ましい。被着体の材質としては、金属、ガラス、プラスチック等のいずれでもよい。また、被着体の形状としては、特に限定されず、例えば、フィルム状、シート状、板状、パネル状、トレイ状、ロッド(棒状体)状、箱体状、筐体状等が挙げられる。
携帯電子機器としては、特に限定されないが、スマートフォンなどの携帯電話、デジタルカメラ、ウェラブル端末、携帯ゲーム機器、タブレット型コンピューター、ノート型コンピューター、アクションカメラなどが挙げられ、これらの中ではスマートフォン、ウェラブル端末が好ましい。本発明の接着剤組成物は、耐衝撃性及び耐油性のいずれも良好であるので、携帯電子機器に特に好適である。
例えば、本発明の接着剤組成物は、電子機器内部などにおいて、例えば基板と基板とを接合して組立部品を得るために使用されてもよい。このようにして得られた組立部品は、第1の基板と、第2の基板と、本発明の硬化体を有し、第1の基板の少なくとも一部が、第2の基板の少なくとも一部に硬化体を介して接合される。
(接着力)
図1(a)に示すように、90mm×50mmで厚み5mmであり、中央に直径12mmの円形の孔11Aを有する第1の基板11、及び50mm×50mmで厚み5mmの第2の基板12を用意した。第1の基板11及び第2の基板12はいずれもポリカーボネート板であった。
第1の基板11の孔11Aを中心に囲むように、ディスペンサーを用いて、幅1mm±0.2mm、高さ0.25mm±0.05mmで20mm×20mmの四角枠状に接着剤組成物10を塗布した。塗布完了後1分以内に、UV-LED(波長365nm)を用いて、紫外線を1000mJ/cm2照射することによって、接着剤組成物10を光硬化させた。その後、高さ0.2mmのギャップ材(図示しない)及び接着剤組成物10を介して、第1及び第2の基板11,12同士の中心位置が一致するようにして、第1の基板11の上に第2の基板12を重ね合わせ、第2の基板12の上にさらに2kgのおもりを10秒間静置させることで、第1及び第2の基板11,12を、接着剤組成物10を介して圧着させた。その後、2kgのおもりを取り除き、25℃、50%RHで24時間放置することにより、接着剤組成物10を湿気硬化させ、測定用サンプル13を得た。湿気硬化後、ギャップ材は測定用サンプル13から取り除いた。
得られた測定用サンプル13において、第1の基板11を上側、第2の基板12を下側になるように配置して、第1の基板11をステンレス製治具で支持した状態で、直径が10mmの断面円形状である棒状部材14を、孔11Aに挿入した。そして、図1(b)に示すように、棒状部材14により10mm/分の速度で第2の基板12を鉛直下向きに押して、第2の基板12が第1の基板11から剥がれる際の応力を測定して接着力(油接触前の接着力)とした。接着力は、以下の評価基準で評価した。
AA:接着力が4MPa以上
A:接着力が3MPa以上4MPa未満
B:接着力が3MPa未満
上記と同様の手順で測定用サンプルを用意した。オレイン酸を吸わせた不織布(製品名「キムワイプ」、日本製紙クレシア社製)で測定用サンプル全体を包み、ポリエチレンの袋で密封した。その袋を60℃、90%RHの環境下に2日間養生させた。養生後にエタノールで測定用サンプルを洗浄し、上記と同様に接着力を測定し、油接触後の接着力とした。油接触前の接着力に対する、油接触後の接着力の低下率により以下の評価基準により評価した。
AA:接着力低下率が30%以下
A:接着力低下率が30%より大きく50%以下
B:接着力低下率が50%より大きく70%以下
C:接着力低下率が70%より大きい
図2に示すとおり、上記と同様の手順で測定用サンプル13を用意し、第1の基板11を上側、第2の基板12を下側に配置したうえで第1の基板11をステンレス製治具で支持した。
また、平板部16B(20mm×20mm、厚み5mm)と、平板部16Bの中心に接続された棒状部16A(直径10mm、円柱状)とを有する治具16(材質:ステンレス)を用意して、治具16の棒状部16Aを図2に示すとおり、第1の基板11の孔11Aに挿入して、第2の基板12の中央に立たせた。
その状態で、デュポン式落下衝撃試験機を用いて、平板部16Bに対する高さが200mmとなる位置から、平板部16Bの中央に鉛直下向きに300gの球状のステンレス製のおもり15を繰り返し落下させ、おもり15の衝撃により、第2の基板12が剥がれ落ちるまでのおもりの落下回数を耐久回数として評価した。
AA:耐久回数が50回以上
A:耐久回数が30回以上50回未満
C:耐久回数が30回未満
測定用サンプルを用意するときと同様の手順で、第1及び第2の基板を用意し、第1の基板に接着剤組成物を塗布して光硬化させた。
その後、ギャップ材を使用せずに、接着剤組成物を介して、第1及び第2の基板同士の中心位置が一致するようにして、第1の基板の上に第2の基板を重ね合わせ、第2の基板の上にさらに100gのおもりを10秒間静置させ、第1及び第2の基板を、接着剤組成物を介して圧着させ、おもりを取り除いた。おもりを取り除いた後の接着剤組成物の厚みを測定して以下の評価基準により評価した。
A:接着剤組成物の厚みが0.1mm以上
C:接着剤組成物の厚みが0.1mm未満
<<湿気硬化性樹脂(1)>>
[合成例1]
ポリオール化合物として100質量部のポリカーボネートジオール(式(1)で表される化合物、Rの90モル%が3-メチルペンチレン基、10モル%がヘキサメチレン基、クラレ社製、商品名「Kuraraypolyol C-1090」)と、0.01質量部のジブチル錫ジラウレートとを500mL容量のセパラブルフラスコに入れた。フラスコ内を真空下(20mmHg以下)、80℃で60分間撹拌して混合した。その後常圧として、得られた反応生成物に対して、2-メタクリロイルオキシエチルイソシアナート(昭和電工社製、商品名「カレンズMOI」)30質量部を加え、100℃で3時間撹拌して反応させ、ポリカーボネート(PC)骨格を有し、片末端がメタクリロイル基である、反応生成物を得た。
得られた反応生成物に対して、ポリイソシアネート化合物としてジフェニルメタンジイソシアネート(東ソー社製、商品名「ミリオネートMT」)50質量部を入れ、80℃で3時間撹拌して反応させ、ポリカーボネート(PC)骨格を有する湿気硬化性ウレタン樹脂(1-1)を得た。湿気硬化性ウレタン樹脂(1-1)中、片末端はメタクリロイル基であり、片末端がイソシアネート基である湿気硬化性ウレタン樹脂(A1)の割合は80質量%であった。また、湿気硬化性ウレタン樹脂(1-1)は、両末端がイソシアネート基である湿気硬化性ウレタン樹脂(B1)も含有していた。得られた湿気硬化性ウレタン樹脂(1-1)の重量平均分子量は5000であった。
ポリオール化合物として100質量部のポリエステルポリオール(アジピン酸、1,6-ヘキサンジオール及びイソフタル酸を主成分として得られたポリエステルポリオール、芳香環濃度15質量%、重量平均分子量1000)と、0.01質量部のジブチル錫ジラウレートとを500mL容のセパラブルフラスコに入れた。真空下(20mmHg以下)、80℃で1時間撹拌し、混合した。その後常圧とし、2-メタクリロイルオキシエチルイソシアナート(昭和電工社製、商品名「カレンズMOI」)30質量部を加え、100℃で3時間撹拌して反応させ、ポリエステル骨格を含有し、片末端がメタクリロイル基である、反応生成物を得た。
得られた反応生成物に対して、ポリイソシアネート化合物としてジフェニルメタンジイソシアネート(東ソー社製、商品名「ミリオネートMT」)50質量部を入れ、80℃で3時間反応させ、ポリエステル骨格を有する湿気硬化性ウレタン樹脂(1-2)を得た。湿気硬化性ウレタン樹脂(1-2)中、片末端はメタクリロイル基であり、片末端がイソシアネート基である湿気硬化性ウレタン樹脂(A1)の割合は80質量%であった。また、湿気硬化性ウレタン樹脂(1-2)は、両末端がイソシアネート基である湿気硬化性ウレタン樹脂(B1)も含有していた。得られた湿気硬化性ウレタン樹脂(1-2)の重量平均分子量は3000であった。
[合成例3]
ポリオール化合物として100質量部のポリカーボネートジオール(式(1)で表される化合物、Rの90モル%が3-メチルペンチレン基、10モル%がヘキサメチレン基、クラレ社製、商品名「Kuraraypolyol C-1090」)と、0.01質量部のジブチル錫ジラウレートとを500mL容量のセパラブルフラスコに入れた。フラスコ内を真空下(20mmHg以下)、100℃で30分間撹拌して混合した。その後常圧とし、ポリイソシアネート化合物としてジフェニルメタンジイソシアネート(東ソー社製、商品名「ミリオネートMT」)50質量部を入れ、80℃で3時間撹拌して反応させ、ポリカーボネート(PC)骨格を有し、両末端がイソシアネート基である、湿気硬化性ウレタン樹脂(2-1)を得た。得られた湿気硬化性ウレタン樹脂(2-1)の重量平均分子量は6000であった。
ポリオール化合物として100質量部のポリエステルポリオール(アジピン酸、1,6-ヘキサンジオール及びイソフタル酸を主成分として得られたポリエステルポリオール、芳香環濃度15質量%、重量平均分子量1000)と、0.01質量部のジブチル錫ジラウレートとを500mL容のセパラブルフラスコに入れた。真空下(20mmHg以下)、100℃で30分間撹拌し、混合した。その後常圧とし、ポリイソシアネート化合物としてジフェニルメタンジイソシアネート(東ソー社製、商品名「ミリオネートMT」)52.5質量部を入れ、80℃で3時間撹拌して反応させ、ポリエステル骨格を含有し、両末端がイソシアネート基である、湿気硬化性ウレタン樹脂(2-2)を得た。得られた湿気硬化性ウレタン樹脂(2-2)の重量平均分子量は1500であった。
(ラジカル重合性化合物)
イミド環含有アクリレート:東亜合成株式会社製、商品名「M-140」、N-アクリロイルオキシエチルヘキサヒドロフタルイミド、単官能
芳香族環含有アクリレート:共栄社化学株式会社製、商品名「ライトアクリレートPO-A」、フェノキシエチルアクリレート、単官能
脂肪族アクリレート:ダイセルオルネクス社製、商品名「IBOA-B」、イソボニルアクリレート、単官能
充填剤:トリメチルシリル化処理シリカ、日本アエロジル社製、商品名「R812」、一次粒子径7nm
光重合開始剤:2-ベンジル-2-ジメチルアミノ-1-(4-モルフォリノフェニル)-ブタノン-1、BASF社製、商品名「IRGACURE 369」
その他添加剤:ラジカル捕捉剤、酸化防止剤及び湿気硬化触媒
表1に記載された配合比に従い、各材料を、遊星式撹拌装置(シンキー社製、「あわとり練太郎」)にて温度50℃で撹拌した後、セラミック3本ロールにて温度50℃で均一に混合して実施例1~6、比較例1~3の接着剤組成物を得た。
それに対して、比較例1~3では、接着剤組成物は、湿気硬化性樹脂(B)を含有することで一定値以上の接着力を確保できたが、湿気硬化性樹脂(A)を含有しないので、耐油性を良好にしつつ、耐衝撃性を高めることができなかった。
Claims (11)
- ポリカーボネート骨格及びポリエステル骨格の少なくともいずれかを有し、かつイソシアネート基と(メタ)アクリロイル基とを有する湿気硬化性樹脂(A)と、
イソシアネート基を有し、かつ(メタ)アクリロイル基を有さない湿気硬化性樹脂(B)とを含む、接着剤組成物。 - 前記湿気硬化樹脂(B)が、ポリカーボネート骨格及びポリエステル骨格の少なくともいずれかを有する、請求項1に記載の接着剤組成物。
- 前記湿気硬化樹脂(B)がポリカーボネート骨格を有する、請求項1又は2に記載の接着剤組成物。
- 前記湿気硬化樹脂(B)が両末端にイソシアネート基を有する、請求項1~3のいずれか1項に記載の接着剤組成物。
- 前記湿気硬化樹脂(A)がポリカーボネート骨格を有する、請求項1~4のいずれか1項に記載の接着剤組成物。
- 前記湿気硬化樹脂(A)が芳香族イソシアネート基を有する、請求項1~5のいずれか1項に記載の接着剤組成物。
- イソシアネート基を含有しないラジカル重合性化合物(C)をさらに含む、請求項1~6のいずれか1項に記載の接着剤組成物。
- 前記ラジカル重合性化合物(C)が、芳香族環を有するラジカル重合性化合物、及びイミド環を有するラジカル重合性化合物からなる群より選択される少なくとも1種を含有する、請求項7に記載の接着剤組成物。
- 請求項1~8のいずれか1項に記載の接着剤組成物からなる、電子部品用接着剤。
- 請求項1~8のいずれか1項に記載の接着剤組成物からなる、携帯電子機器用接着剤。
- 請求項1~8のいずれか1項に記載の接着剤組成物の硬化体。
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JP2003313531A (ja) * | 2002-04-22 | 2003-11-06 | Asahi Glass Co Ltd | 湿気硬化型接着剤 |
JP2012067278A (ja) * | 2010-08-27 | 2012-04-05 | Sanyo Chem Ind Ltd | ドライラミネート用接着剤 |
JP2012114243A (ja) * | 2010-11-25 | 2012-06-14 | Toyo Ink Sc Holdings Co Ltd | (メタ)アクリロイル基を有するウレタン・ウレア樹脂及び該ウレタン・ウレア樹脂を含有する活性エネルギー線硬化性接着剤、並びに太陽電池用裏面保護シート |
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WO2020149377A1 (ja) * | 2019-01-18 | 2020-07-23 | 積水化学工業株式会社 | 硬化性樹脂組成物、及び硬化体 |
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