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WO2022012146A1 - 多工位点胶机及其点胶方法 - Google Patents

多工位点胶机及其点胶方法 Download PDF

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Publication number
WO2022012146A1
WO2022012146A1 PCT/CN2021/094063 CN2021094063W WO2022012146A1 WO 2022012146 A1 WO2022012146 A1 WO 2022012146A1 CN 2021094063 W CN2021094063 W CN 2021094063W WO 2022012146 A1 WO2022012146 A1 WO 2022012146A1
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WO
WIPO (PCT)
Prior art keywords
wafer
glue
loading
heating
station
Prior art date
Application number
PCT/CN2021/094063
Other languages
English (en)
French (fr)
Inventor
曲东升
李长峰
郜福亮
王晓春
周典虬
林翔
苗虎
黄继明
樊建
Original Assignee
常州铭赛机器人科技股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 常州铭赛机器人科技股份有限公司 filed Critical 常州铭赛机器人科技股份有限公司
Priority to KR1020227038521A priority Critical patent/KR20230018364A/ko
Priority to JP2022567194A priority patent/JP7550241B2/ja
Publication of WO2022012146A1 publication Critical patent/WO2022012146A1/zh
Priority to TW111118136A priority patent/TW202245914A/zh

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
    • B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
    • B05C5/0208—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work for applying liquid or other fluent material to separate articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C13/00—Means for manipulating or holding work, e.g. for separate articles
    • B05C13/02—Means for manipulating or holding work, e.g. for separate articles for particular articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
    • B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C9/00—Apparatus or plant for applying liquid or other fluent material to surfaces by means not covered by any preceding group, or in which the means of applying the liquid or other fluent material is not important
    • B05C9/08—Apparatus or plant for applying liquid or other fluent material to surfaces by means not covered by any preceding group, or in which the means of applying the liquid or other fluent material is not important for applying liquid or other fluent material and performing an auxiliary operation
    • B05C9/14—Apparatus or plant for applying liquid or other fluent material to surfaces by means not covered by any preceding group, or in which the means of applying the liquid or other fluent material is not important for applying liquid or other fluent material and performing an auxiliary operation the auxiliary operation involving heating or cooling
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
    • B05D3/02—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by baking
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
    • B05D3/02—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by baking
    • B05D3/0218—Pretreatment, e.g. heating the substrate
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D5/00—Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures
    • B05D5/10—Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures to obtain an adhesive surface
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67103—Apparatus for thermal treatment mainly by conduction
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67207—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices

Definitions

  • the invention belongs to the technical field of glue dispensing machines, in particular to a multi-station glue dispensing machine and a glue dispensing method of the multi-station glue dispensing machine.
  • Wafers are the basic material for manufacturing semiconductor chips.
  • Wafer dispensing technology is the most important key technology in advanced electronics manufacturing. It is widely used in In chip packaging and integrated circuit equipment, the purpose is to reduce the failure probability of components due to cold and heat changes, drops, vibrations and other factors during the use of the product, thereby extending the service life of the product. Therefore, as the key and core of electronic packaging technology, dispensing technology is directly related to the quality of packaging technology.
  • the traditional manual glue gun dispensing method has low production efficiency and uneven flow rate of glue, which can easily lead to excessive glue output and poor production quality.
  • the glue dispenser mainly completes the function of dripping the colloid to the corresponding position through a preset path in a specific way.
  • the existing automatic glue dispensing machine is generally a work station.
  • the material is taken by the robot and sent to the glue dispensing unit. After being preheated by the preheating unit, the glue is dispensed.
  • the dispensing and preheating process takes a long time.
  • the manipulator of the dispensing machine can only take the material after the dispensing is completed. Not only the idle time of the manipulator is too long, the utilization rate of the manipulator is low, and the production efficiency is correspondingly reduced. It is difficult to meet the requirements of multiple batches.
  • the structure of the automatic production line of the glue dispenser is not compact enough, which makes the working route of the manipulator long, resulting in waste of resources.
  • the temperature control of the wafer in the prior art is not good, not only the yield is low, but also the dispensing effect is affected.
  • the present invention aims to solve at least one of the technical problems existing in the prior art.
  • the present invention proposes a multi-station glue dispenser, which has the advantages of compact overall structure, good glue dispensing effect, precise temperature control, high production efficiency, and high product quality.
  • the invention also proposes a glue dispensing method for a multi-station glue dispensing machine, which has the advantages of high degree of mechanization and high product quality.
  • the multi-station glue dispenser includes: a loading and unloading mechanism, wherein the loading and unloading mechanism defines an active space, and a plurality of processing stations are arranged on the periphery of the loading and unloading mechanism.
  • the feeding mechanism moves between the active space and each of the processing stations to transport the wafers, and the plurality of processing stations include a positioning station, a preheating station and a plurality of dispensing stations; the wafers a code scanning alignment device, the wafer scanning code alignment device is located at the positioning station, and the wafer code scanning alignment device scans and aligns the wafers transported by the loading and unloading mechanism; a wafer preheating mechanism, the wafer preheating mechanism is located at the preheating station, and the wafer preheating mechanism preheats the wafers transported by the loading and unloading mechanism; the wafer heating device, the The wafer heating device is located in the glue dispensing station, and the wafer heating device heats the wafer on the processing station; the glue dispensing device matches the wafer heating device A device is used to dispense glue on the heated wafer.
  • the multi-station glue dispenser by adopting the loading and unloading mechanism, the wafer code scanning alignment device, the wafer preheating mechanism, the wafer heating device and the glue dispensing device, the wafer can be scanned and processed. Alignment, preheating, heating, dispensing, and multiple processing stations can not only improve the dispensing quality, but also improve the utilization rate of the loading and unloading mechanism and reduce the waiting time.
  • the multi-station glue dispenser has the advantages of compact structure, high work efficiency and high product quality.
  • the loading and unloading mechanism includes: a loading and unloading body, the moving space is defined in the loading and unloading body, and two ends of the loading and unloading body are respectively provided with materials communicating with the moving space At least two processing stations are respectively provided on both sides of the loading and unloading body; a moving piece, the moving piece is movably arranged in the moving space between the two material openings; a material reclaiming piece , the pick-up piece is arranged on the movable piece to pick up and place the wafer from the feed port and the processing station.
  • the loading and unloading body is formed into a concave shape with an opening downward
  • the feeding port is respectively provided on each leg of the loading and unloading body
  • the loading and unloading mechanism further includes: two feeders
  • the two material boxes are respectively arranged on the two feet at the positions corresponding to the material openings, and at least a part of the reclaiming member extends out of the material openings and enters the material boxes for loading and unloading.
  • the reclaiming part includes: a manipulator, one end of the manipulator is connected to the movable part, and the other end of the manipulator is movable; a tray, the tray is arranged on the other end of the manipulator , the tray is used for receiving the wafer.
  • the loading and unloading mechanism further includes: a loading and unloading conveying mechanism, the loading and unloading conveying mechanism is arranged between the two material openings, and the loading and unloading conveying mechanism is located between the two material openings. It can move between the upper and lower materials to drive the movable parts to move.
  • the upper and lower material conveying mechanism includes: a side plate, and the side plate is arranged in the upper and lower material body extending along the length direction of the upper and lower material body.
  • One side of the plate is formed as an installation surface; a conveying rail, the conveying rail is arranged on the installation surface extending along the length direction of the loading and unloading body, and the movable part is movably arranged on the conveying rail; A driving member, the loading and unloading driving member is arranged on the installation surface, and the loading and unloading driving member is connected with the movable member to drive the movable member to move.
  • the wafer code scanning alignment device is arranged between two adjacent dispensing stations, and the wafer code scanning alignment device includes: a code scanning device, the scanning The code device scans the code to identify the wafer; the alignment device aligns the wafer conveyed by the loading and unloading mechanism to adjust the position of the wafer.
  • the wafer preheating mechanism and the wafer heating device include: a base; a heater, the heater is provided on the base, and an upper surface of the heater is formed as a heating surface;
  • the jacking assembly, the jacking assembly is arranged on the base, the jacking assembly can move between a jacking state and a non-lifting state, and the jacking assembly supports the wafer when it is in the jacking state.
  • the wafer is spaced apart from the heating surface; when the lifting component is in the non-lifting state, the wafer is in contact with the heating surface; the lifting component gradually moves from the lifting state to the heating surface.
  • the heater performs non-contact heating on the wafer to gradually increase the temperature of the wafer.
  • the base includes: a bottom plate; a support rod, the support rod is arranged on the bottom plate; Both the heater and the jacking assembly are arranged on the heating support table.
  • the heater and the heating support table are respectively provided with a plurality of through holes that penetrate each other
  • the lifting assembly includes: a plurality of thimbles, and a plurality of the thimbles respectively pass through the
  • the heater and the through hole on the heating support table are movable along the axial direction of the through hole.
  • the ejector pin driver is provided on the bottom plate and connected to the ejector pin , the ejector pin driving part drives the ejector pin to move.
  • the heating surface is provided with at least two heating zones capable of heating wafers of different sizes, each of the heating zones is respectively provided with at least one vacuum suction hole, and the wafers are preheated
  • the mechanism further includes a vacuum suction device in communication with the vacuum suction hole to suction the wafer when the wafer is on the heater.
  • a heating chamber is defined in the heating support table, and the heater includes: a heating tube, the heating tube extends into the heating chamber for heating; a heating plate, the heating plate is attached to On the heating support table and above the heating support table, the upper surface of the heating plate is formed as a heating surface, the heating plate receives the heat of the heating pipe and transfers the heat from the heating surface to the wafer, the heating surface There are at least two heating zones on the heating plate; at least two thermocouples, at least two of the thermocouples are respectively set in the at least two heating zones to detect the temperature of each of the heating zones; a thermostat, so The temperature controller is connected with the heating tube and the thermocouple, and the temperature controller controls the heating of the heating tube according to the temperature detected by the thermocouple.
  • the glue dispensing device includes: a glue dispenser body; a glue dispenser head assembly, the glue dispenser head assembly is movably arranged on the glue dispenser body and located in the glue dispenser body. Above the wafer heating device to dispense glue on the wafer placed on the wafer heating device; a static dissipating device, the static dissipating device is movably arranged on the dispenser body and located on the wafer Above the circular heating device, the wafer heating device and the wafer are electrostatically removed.
  • the glue dispensing device further includes: an installation frame, which is installed on the glue dispenser body; a glue bucket, which is arranged on the installation frame, and the glue bucket is filled with There is glue; a liquid level detection device, the liquid level detection device is installed in the glue bucket and/or the mounting frame to judge the glue in the glue bucket according to the optical signal or the induction signal of the glue liquid level in the glue bucket the liquid level.
  • the glue dispensing method of the multi-station glue dispenser includes the following steps: S1, obtaining a wafer, and scanning the wafer for alignment; Preheating, and continuously measure the temperature of the wafer during the preheating process; S3, after the wafer is preheated to the first set temperature, transport the wafer to the dispensing station to continue heating; S4. After the wafer is heated to the second set temperature, dispensing glue is performed on the wafer.
  • step S2 the wafer is preheated by adjusting the distance between the wafer and the heating source.
  • step S4 the temperature of the wafer is continuously detected, and the wafer is continuously heated when the temperature of the wafer is lower than the second set temperature.
  • FIG. 1 is a schematic diagram of the overall structure of a multi-station glue dispenser according to an embodiment of the present invention
  • FIG. 2 is a schematic structural diagram of a loading and unloading mechanism of a multi-station glue dispenser according to an embodiment of the present invention
  • FIG. 3 is a partial structural schematic diagram of a loading and unloading mechanism of a multi-station glue dispenser according to an embodiment of the present invention
  • FIG. 4 is a perspective view of a loading and unloading mechanism of a multi-station glue dispenser according to an embodiment of the present invention
  • FIG. 5 is a schematic structural diagram of a wafer preheating mechanism of a multi-station glue dispenser according to an embodiment of the present invention
  • FIG. 6 is a front view of a wafer preheating mechanism of a multi-station glue dispenser according to an embodiment of the present invention.
  • FIG. 7 is a partial schematic diagram of a lifting assembly of a wafer heating device of a multi-station glue dispenser according to an embodiment of the present invention.
  • FIG. 8 is a partial structural schematic diagram of a wafer adsorption device of a multi-station glue dispenser according to an embodiment of the present invention.
  • FIG. 9 is a schematic structural diagram of a wafer scanning code alignment device of a multi-station glue dispenser according to an embodiment of the present invention.
  • FIG. 10 is a schematic structural diagram of a heating tube of a wafer heating device of a multi-station glue dispenser according to an embodiment of the present invention.
  • FIG. 11 is a schematic structural diagram of a wafer heating device in a processing station of a multi-station glue dispenser according to an embodiment of the present invention
  • FIG. 12 is a partial structural schematic diagram of a static elimination device of a multi-station glue dispenser according to an embodiment of the present invention.
  • FIG. 13 is a front view of a glue dispensing device of a multi-station glue dispenser according to an embodiment of the present invention.
  • FIG. 14 is a schematic structural diagram of a glue dispensing device of a multi-station glue dispenser according to an embodiment of the present invention.
  • 15 is a partial schematic diagram of a processing station of a multi-station glue dispenser according to an embodiment of the present invention.
  • FIG. 16 is a flowchart of a glue dispensing method of a multi-station glue dispensing machine according to an embodiment of the present invention.
  • Multi-station glue dispenser 1000
  • Reclaimer 130 Robot 131; Tray 132;
  • wafer heating device 210 base 220; bottom plate 230; support rod 240;
  • vacuum adsorption device 280 vacuum adsorption hole 281;
  • Wafer scanning code alignment device 300 Wafer scanning code alignment device 300; code scanning device 310; alignment device 320;
  • Dispensing device 400
  • Glue bucket 600 Liquid level detection device 610; Dispenser body 620; Dispenser head assembly 630;
  • Static dissipating device 700 Static dissipating device 700 .
  • the terms “installed”, “connected” and “connected” should be understood in a broad sense, unless otherwise expressly specified and limited, for example, it may be a fixed connection or a detachable connection Connection, or integral connection; can be mechanical connection, can also be electrical connection; can be directly connected, can also be indirectly connected through an intermediate medium, can be internal communication between two elements.
  • installed should be understood in a broad sense, unless otherwise expressly specified and limited, for example, it may be a fixed connection or a detachable connection Connection, or integral connection; can be mechanical connection, can also be electrical connection; can be directly connected, can also be indirectly connected through an intermediate medium, can be internal communication between two elements.
  • the multi-station glue dispenser 1000 according to the embodiment of the present invention will be described in detail below with reference to the accompanying drawings.
  • a multi-station glue dispenser 1000 includes: a loading and unloading mechanism 100 , a wafer scanning code alignment device 300 , a wafer preheating mechanism 200 , and a wafer heating device 210 and dispensing device 400.
  • the loading and unloading mechanism 100 is defined with an active space, and the periphery of the loading and unloading mechanism 100 is provided with several processing stations 113.
  • the processing stations 113 move between each other to transport the wafers.
  • the processing stations include a positioning station, a preheating station and a plurality of glue dispensing stations; the wafer scanning and alignment device 300 is located in the positioning station.
  • the wafer scanning and alignment device 300 scans and aligns the wafers transported by the loading and unloading mechanism 100; The wafer is preheated; the wafer heating device 210 is located in the dispensing station, and the wafer heating device 210 heats the wafer on the processing station 113; the dispensing device 400 is matched with the wafer heating device to The wafers are dispensed.
  • the multi-station glue dispenser 1000 is mainly composed of a loading and unloading mechanism 100, a wafer scanning code alignment device 300, a wafer preheating mechanism 200, a plurality of wafer heating devices 210 and a plurality of points Glue device composition.
  • At least two processing stations 113 are respectively provided on both sides of the loading and unloading mechanism 100, and the wafer preheating mechanism 200 of the wafer scanning code alignment device 300 is respectively provided on both sides of the loading and unloading mechanism 100.
  • the loading and unloading mechanism 100 may be four processing stations 113 but not limited to four, wherein one side of the loading and unloading mechanism 100 is two processing stations 113, and the wafer scanning code alignment device 300 may be provided in the two processing stations 113 In the middle of the station 113 , there are also two processing stations 113 on the other side, and the wafer preheating mechanism 200 may be arranged between the two processing stations 113 .
  • Each processing station 113 corresponds to a dispensing device 400 and a wafer heating device 210.
  • the dispensing device 400 and the wafer heating device 210 are arranged in the processing station 113.
  • the wafer heating device 210 can heat the wafer, and the wafer heating device 210 After the circle is heated, the wafer is dispensed by the dispensing device 400 .
  • a moving space is defined inside the loading and unloading body 110, and at least a part of the loading and unloading mechanism 100 can reciprocate between the moving space, the wafer scanning and positioning device 300, the wafer preheating mechanism 200 and the processing station 113, The wafer can be transported to the wafer scanning code alignment device 300 , the wafer preheating mechanism 200 and the processing station 113 , or the processed wafer can be transported out.
  • the loading and unloading mechanism 100 picks up the material, sends the wafer to the wafer code scanning and alignment device 300 for scanning and alignment, and takes it out after the end; secondly, the loading and unloading mechanism 100 transports the wafer to the wafer pre-positioning device 300. The wafer is preheated in the thermal mechanism 200, and taken out after the end; finally, the loading and unloading mechanism 100 transports the wafer to the processing station 113, and the wafer is heated by the wafer heating device 210.
  • the glue dispensing device 400 dispenses glue to the wafer.
  • the multi-station glue dispenser 1000 by using the loading and unloading mechanism 100, the wafer scanning code alignment device 300, the wafer preheating mechanism 200, the multiple wafer heating devices 210 and the multiple The glue dispensing device can scan the code, align, preheat, heat and dispense the wafer, and there can be multiple processing stations 113, which not only improves the dispensing quality, but also improves the utilization of the loading and unloading mechanism 100. rate and reduce waiting time.
  • the multi-station glue dispenser 1000 has the advantages of compact structure, high work efficiency and high product quality.
  • the loading and unloading mechanism 100 includes a loading and unloading body 110 , a movable part 120 and a reclaiming part 130 .
  • the loading and unloading body 110 defines a movable space inside the loading and unloading body 110 .
  • the two ends of the feeder 112 are respectively provided with material ports 112 communicating with the movable space, and at least two processing stations 113 are respectively provided on both sides of the upper and lower material body 110;
  • the pick-up part 130 is arranged on the movable part 120 to pick and place the wafers from the material port 112 and the processing station 113 .
  • the left and right sides of the loading and unloading body 110 may be provided with a feeding port 112 respectively.
  • the wafers to be processed may be transported to the vicinity of the feeding port 112 by manual or mechanical parts.
  • a moving space is defined inside the loading and unloading body 110, and a moving piece 120 is installed in the moving space.
  • a pick-up piece 130 may be provided on the movable piece 120, and the pick-up piece 130 cooperates with the movable piece 120, and can transport the wafer from the feed port 112 to the processing station 113, or transport the wafer from the processing station 113 to the processing station 113.
  • At least two processing stations 113 can be respectively provided on both sides of the loading and unloading body 110.
  • the reclaiming member 130 can correspondingly complete the processing of the designated station. The action of feeding or retrieving.
  • the loading and unloading mechanism 100 sets the movable member 120 and the reclaiming member 130 in the loading and unloading body 110, and the movable member 120 reciprocates in the loading and unloading body 110 to drive the loading member 130 to move in the loading and unloading body 110, thereby
  • the wafer to be processed can be transported to a designated station, and after the processing is completed, the processed wafer can be taken out and the next step can be continued.
  • the loading and unloading body 110 is formed into a concave shape with an opening downward, and each leg 114 of the loading and unloading body 110 is provided with a feeding port 112 respectively.
  • each leg 114 of the loading and unloading body 110 is respectively provided with a feeding port 112, which is more convenient for feeding and reclaiming of the loading and unloading mechanism, which not only saves the overall space, but also saves the time for transporting wafers, and improves the overall processing efficiency.
  • two material boxes 140 are arranged on the two legs 114 of the loading and unloading body 110 to facilitate the storage of the materials to be processed and the processed wafers, thereby saving a lot of manpower and material resources.
  • arranging the material box 140 at a position corresponding to the material opening 112 is more conducive to the unloading and unloading operation of the material reclaiming member 130, and unnecessary travel is avoided.
  • the pick-up part 130 includes a manipulator 131 and a tray 132, one end of the manipulator 131 is connected to the movable part 120, and the other end of the manipulator 131 is movable; the tray 132 is provided at the other end of the manipulator 131, and the tray 132 is used for receiving wafers .
  • the manipulator 131 the reclaimer 130 can easily reach the designated target position, which improves the accuracy and sensitivity of the loading and unloading process.
  • the tray 132 at the other end of the robot arm 131, it is convenient to place the wafer on the tray 132, thereby ensuring that the picker 130 drives the wafer to reach the target position smoothly during the operation.
  • the loading and unloading mechanism 100 further includes a loading and unloading conveying mechanism 150 , the loading and unloading conveying mechanism 150 is arranged between the two feeding ports 112 , and the loading and unloading conveying mechanism 150 is between the two feeding ports 112 . It is movable to drive the movable member 120 to move.
  • the loading and unloading conveying mechanism 150 includes a side plate 115, a conveying rail 118 and a loading and unloading driving member.
  • the side plate 115 extends along the length direction of the loading and unloading body 110.
  • One side of the plate 115 is formed as an installation surface 116; the conveying rail 118 is extended on the installation surface 116 along the length direction of the loading and unloading body 110, and the movable part 120 is movably arranged on the conveying rail 118; 116 , the loading and unloading driving member is connected with the movable member 120 to drive the movable member 120 to move. That is to say, a loading and unloading conveying mechanism 150 is provided between the two material openings 112 , and the reciprocating movement of the movable member 120 in the loading and unloading body 110 can be completed by the loading and unloading conveying mechanism 150 .
  • the loading and unloading conveying mechanism 150 of the multi-station glue dispenser 1000 is arranged inside the loading and unloading body of the multi-station glue dispensing machine 1000.
  • the side plate 115 is located in the loading and unloading body and extends along the length direction of the loading and unloading body.
  • One side of the side plate 115 is formed as a mounting surface 116, and the conveying rail 118 extends along the length of the loading and unloading body.
  • the conveying rail 118 is provided with a movable member 120 , and the movable member 120 can reciprocate on the conveying rail 118 by being driven by the loading and unloading driving member, and the loading and unloading driving member can be arranged on the installation surface 116 .
  • the loading and unloading conveying mechanism 150 is installed in the loading and unloading body of the multi-station glue dispenser 1000 to drive the movable member 120 to move. 120 can reciprocate on the conveying rail 118, so as to achieve the effect of conveying the material to the designated station.
  • the wafer scanning code alignment device 300 is arranged between two adjacent dispensing stations.
  • the wafer code scanning alignment device 300 includes a code scanning device and an alignment device, and the code scanning device scans the wafer. Code identification; the alignment device aligns the wafers conveyed by the loading and unloading mechanism 100 to adjust the position of the wafers. That is to say, by arranging the wafer scanning code alignment device 300 between the two glue dispensers 400, after the wafer code scanning and/or positioning operation is performed, the wafer can be easily transported to the two glue dispensers.
  • any one of the machines 400 can effectively shorten the conveying stroke, which not only facilitates the conveying of wafers by the loading and unloading mechanism 100, but also makes the multi-station glue dispenser 1000 with the wafer scanning code alignment device 300 compact overall and beautiful in appearance. Further, by setting the code scanning device 310, the wafer can be scanned to determine whether the wafer has been dispensed, which can reduce the error rate, prevent repeated operations on the processed wafer, and prevent leakage of the unprocessed wafer. Operation can effectively ensure the accuracy and efficiency of processing. By performing alignment processing on the wafer, the wafer can be precisely aligned according to the specific position on the wafer that needs to be dispensed, the position of the wafer can be adjusted, the subsequent workload is reduced, and the processing efficiency is improved.
  • the wafer preheating mechanism 200 and the wafer heating device 210 include a base 220 , a heater 260 and a lifting assembly 270 , and the heater 260 is provided on the base 220 ,
  • the upper surface of the heater 260 is formed as a heating surface;
  • the jacking assembly 270 is arranged on the base 220, the jacking assembly 270 is movable between a jacking state and a non-jacking state, and the jacking assembly 270 supports the crystal when in the jacking state
  • the circle separates the wafer from the heating surface.
  • the lifting component 270 is in the non-lifting state, the wafer contacts the heating surface.
  • the heater 260 When the lifting component 270 gradually transitions from the lifting state to the non-lifting state, the heater 260 will The wafer undergoes non-contact heating to gradually heat the wafer.
  • the wafer preheating mechanism 200 is mainly composed of the base 220 , the heater 260 and the lifting assembly 270 .
  • Lift assembly 270 and heater 260 The upper surface of the heater 260 may be formed as a heating surface.
  • the jack-up assembly 270 is capable of receiving the wafer, and the jack-up assembly 270 is movable between a jack-up state and a non-lift state.
  • the jacking assembly 270 can be moved from the non-lifting state to the jacking state by passing through the surface of the heating surface, and can be moved from the jacking state to the non-lifting state by retracting from the surface of the heating surface. In the jacking state, specifically, when the jacking assembly 270 is located below the heating surface, the jacking assembly 270 is in the non-jacking state.
  • the wafer preheating mechanism 200 may also adopt the lifting assembly 270 and the heater 260 of other assembly structures, and only needs to be able to satisfy the lifting state and non-lifting state of the lifting assembly 270 The needs of the activities in between can be.
  • the heater 260 includes two parts, one part is the heating module located in the groove of the heating support table, and the other part is the heat conducting plate attached to the upper surface of the heating module.
  • the upper surface of the heat conducting plate is the heating surface.
  • the wafer preheating mechanism 200 cooperates with the base 220, the heater 260 and the lifting assembly 270 to drive the lifting assembly 270 to move between the lifting state and the non-lifting state, so as to change the wafer and the heating surface
  • the distance between the wafers realizes non-contact heating of the wafers.
  • the wafers can even gradually move from the highest position where the lift assembly 270 can rise to the heating surface, and the temperature of the wafers gradually increases, which solves the problem of existing contacts.
  • the temperature of the wafer suddenly rises and the wafer is broken due to the preheating, and the height of the wafer from the heating surface can be adjusted. It can be heated at different positions according to the needs, with uniform heating, high selectivity, and controllability. strong and other advantages.
  • the base 220 includes a bottom plate 230, a support rod 240 and a heating support table 250.
  • the support rod 240 is arranged on the bottom plate 230; Installed on the heating support table 250 .
  • the heating support table 250 can be supported by the support rod 240 , and the heating support table 250 and the bottom plate 230 are spaced apart to facilitate the installation of the driving mechanism of the jacking assembly 270 and the electric control assembly of the heater 260 .
  • the heater 260 and the heating support table 250 are respectively provided with a plurality of through holes that pass through each other
  • the jacking assembly 270 includes a plurality of ejector pins 272 and a ejector pin driver 274, and the plurality of ejector pins 272 pass through the heaters 260 and 274 respectively.
  • the through hole on the heating support table 250 is movable along the axial direction of the through hole. When the lift assembly 270 is at the first position, the upper end of the ejector pin 272 extends out of the through hole to receive the wafer.
  • the ejector pin driver 274 is arranged between the heating support table 250 and the bottom plate 230 and connected to the ejector pin 272 , and the ejector pin driver 274 drives the ejector pin 272 to move.
  • the ejector pins 272 are driven to pass out of the heating surface by the ejector pins 272, so that not only the ejector pins 272 can be used to support the wafer, but also the height of the ejector pins 272 extending from the heating surface can be adjusted, so that the wafer can be heated in a non-contact manner.
  • the ejector pin 272 descends below the heating surface, the wafer can fall onto the heating surface and be in contact with the heating surface.
  • the heating surface is provided with at least two heating areas capable of heating wafers of different sizes, each heating area is respectively provided with at least one vacuum suction hole 281, and the wafer preheating mechanism 200 further includes a vacuum suction device 280,
  • the vacuum suction device 280 communicates with the vacuum suction hole 281 to hold the wafer when the wafer is on the heater 260 .
  • the lifting mechanism when the lifting mechanism is located under the heating surface, the lifting mechanism no longer supports the wafer, and the wafer directly contacts the heating surface. At this time, vacuum adsorption is used to fix the wafer on the heating surface.
  • the wafer can be placed to move, which is convenient for the next operation, and has the advantages of simple structure, easy implementation, and no damage to the wafer.
  • the heater 260 includes a heating tube 252, a heating plate 257, at least two thermocouples 258 and a temperature controller.
  • the heating tube 252 extends into the heating chamber for heating; the heating plate 257
  • the upper surface of the heating plate 257 is formed as a heating surface, and the heating plate 257 receives the heat of the heating pipe 252 and transfers it to the wafer from the heating surface.
  • the heating plate 257 is provided with at least Two heating zones; at least two thermocouples 258 are respectively set in the at least two heating zones to detect the temperature of each heating zone; the thermostat is connected with the heating tube 252 and the thermocouple 258, The temperature control heating tube 252 heats.
  • a heating cavity is provided inside the heating support table 250, and a heating tube 252 for supplying heat to the wafer is provided in the heating cavity, and the heating tube 252 can be bent and formed.
  • a heating plate 257 is arranged above the heating chamber, and the upper surface of the heating plate 257 is a heating surface, and the heating surface can transfer the heat provided by the heating tube 252 to the wafer to heat the wafer.
  • At least two heating zones can be divided on the heating plate 257, and at least two thermocouples 258 are respectively arranged in the at least two heating zones to detect the temperature of each heating zone.
  • the wafer heating device 210 for zone heating is further provided with a temperature controller, which is installed on the rack and can be connected with the heating tube 252 and the thermocouple 258, and the temperature information detected by the thermocouple 258 can be fed back to the temperature controller, Therefore, the temperature controller can control the heating state of the heating tube 252 according to the feedback situation.
  • a temperature controller which is installed on the rack and can be connected with the heating tube 252 and the thermocouple 258, and the temperature information detected by the thermocouple 258 can be fed back to the temperature controller, Therefore, the temperature controller can control the heating state of the heating tube 252 according to the feedback situation.
  • the partition control of the wafer heating device 210 can be realized, and the partition temperature of the wafer can be realized. Control, so that the wafer is heated evenly, the dispensing efficiency is higher, and the finished product effect is better.
  • the dispensing device includes a dispensing machine body 620 , a dispensing machine head assembly 630 and a static electricity dissipation device 700 , and the dispensing machine body 620 is provided with
  • the glue dispenser head assembly 630 is movably disposed on the glue dispenser body 620 and above the wafer heating device to dispense glue on the wafer placed on the wafer heating device
  • the static electricity dissipation device 700 It is movably arranged on the dispenser body 620 and located above the wafer heating device to perform electrostatic removal processing on the wafer heating device and the wafer.
  • the glue dispenser 1000 provided with the static electricity dissipation device is composed of the glue dispenser body 620 , the glue dispenser head assembly 630 and the static electricity dissipation device 700 .
  • the dispenser body 620 is provided with a processing station for placing wafers, and the dispenser head assembly 630 is arranged above the processing station for dispensing wafers. During the dispensing process, the dispenser head assembly The 630 can be moved over the designated location of the wafer to be dispensed.
  • the body 620 of the dispenser is also provided with a static dissipating device 700. During the dispensing process of the dispenser head assembly 630 to the wafer, the static dissipating device 700 can be activated as required to dissipate the static electricity at the processing station and the surrounding processing environment. Perform static removal treatment.
  • the glue dispenser 1000 provided with the static electricity dissipation device according to the embodiment of the present invention combines the glue dispenser body 620 , the glue dispenser head assembly 630 and the static electricity dissipation device 700 , and uses the static electricity dissipation device 700 to dissipate the air into the air. Ionization generates a large number of positive and negative charges, and blows the positive and negative charges out, forming a positive and negative air flow, which neutralizes the charges on the surface of the object.
  • the glue dispensing device 400 further includes an installation frame, a glue bucket 600 and a liquid level detection device 610, which is installed on the glue dispenser body 620; the glue bucket 600 is arranged on the installation frame, and the glue bucket 600 is filled with glue; the liquid level detection The device 610 is disposed on the glue bucket 600 and/or the mounting frame to determine the glue liquid level in the glue bucket 600 according to the optical signal or the sensing signal of the glue liquid level in the glue bucket 600 .
  • the glue dispensing device 400 is mainly composed of an installation frame, a glue bucket 600 and a liquid level detection device 610, wherein the installation frame can be used to fix the glue bucket 600, and the glue bucket 600 can be used to hold glue required for glue dispensing.
  • a liquid level detection device 610 is provided at the glue bucket 600 or at the mounting frame, and the liquid level detection device 610 can judge the glue liquid level in the glue bucket 600 according to the optical signal or the induction signal of the glue liquid level in the glue bucket 600 . Therefore, by combining the mounting frame, the glue bucket 600 and the liquid level detection device 610, the liquid level of the glue in the glue bucket 600 is judged by using the optical signal or the sensing signal of the glue liquid level in the glue bucket 600.
  • the liquid level detection device 610 is provided on the glue dispenser 400 to facilitate the staff to monitor the amount of glue in the glue bucket 600 in real time, and remind the staff to add glue in time or replace the glue bucket 600 filled with glue when the glue reserve is insufficient, preventing the Processing is interrupted due to insufficient glue, reducing production efficiency.
  • a glue dispensing method for a multi-station glue dispenser includes the following steps: S1, acquiring a wafer, and scanning the wafer for alignment; S2, aligning the wafer The wafer is preheated, and the temperature of the wafer is continuously measured during the preheating process; S3, after the wafer is preheated to the first set temperature, the wafer is transported to the dispensing station Continue heating; S4, when the wafer is heated to the second set temperature, dispense glue on the wafer.
  • step S2 the wafer is preheated by adjusting the distance between the wafer and the heating source.
  • step S4 the temperature of the wafer is continuously detected, and the wafer is continuously heated when the temperature of the wafer is lower than the second set temperature.
  • the multi-station glue dispenser 1000 has the advantages of compact overall structure, good glue dispensing effect, precise temperature control, high production efficiency, and high product quality.

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Abstract

多工位点胶机及其点胶方法。多工位点胶机（1000）包括：上下料机构（100），外围设有数个加工工位（113），上下料机构（100）在活动空间与各个加工工位（113）之间往复运动以输送晶圆，加工工位（113）包括一个定位工位、一个预热工位及多个点胶工位；晶圆扫码对位装置（300）位于定位工位，对晶圆进行扫码和对位；晶圆预热机构（200）位于预热工位，对晶圆进行预热；多个晶圆加热装置（210）对晶圆进行加热；多个点胶装置（400）对加热后的晶圆进行点胶。该点胶机能够对晶圆进行扫码、对位、预热、加热和点胶，结构紧凑，生产效率高，点胶质量高。

Description

多工位点胶机及其点胶方法 技术领域
本发明属于点胶机技术领域，具体涉及一种多工位点胶机以及该多工位点胶机的点胶方法。
背景技术
随着经济技术的飞速发展，市场对半导体需求的不断增加，晶圆是制造半导体芯片的基本材料，晶圆的点胶技术是先进电子制造业中至为重要的关键性术，其广泛应用于芯片封装和集成电路装备中，其目的是为了减少在产品使用过程中因冷热变化、跌落、振动等因素导致元件的失效机率，从而延长产品的使用寿命。因此，点胶技术作为电子封装技术的关键和核心，其技术水平的提高直接关系到封装技术的优劣。然而，传统的人工胶枪点胶方法，生产效率低，胶水的流速不均匀，极易导致出胶量过多，生产质量不过关。点胶机作为一种新型的自动化设备主要是完成胶体以特定方式通过预先设定的路径点滴到相应位置的功能。
现有的自动化点胶机普遍为一个工位，由机械手取料送至点胶单元，通过预热单元预热后，再进行点胶。点胶及预热过程耗时长，点胶机的机械手只能等待点胶结束后才能再次取料，不仅机械手的闲置时间过长，对机械手的利用率低，相应降低生产效率，难以满足多批量生产；并且其点胶机自动化生产线结构不够紧凑，使得机械手的工作路线较长，造成资源浪费。此外，现有技术中对晶圆的温度控制不好，不仅成品率低，影响点胶效果。
发明内容
本发明旨在至少解决现有技术中存在的技术问题之一。
为此，本发明提出一种多工位点胶机，该多工位点胶机具有整体结构紧凑、点胶效果好、温度控制精准、生产效率高、产品质量高等优点。
本发明还提出一种多工位点胶机的点胶方法，该点胶方法具有机械化程度高，产品质量高等优点。
根据本发明第一方面实施例的多工位点胶机，包括：上下料机构，所述上下料机构 内限定有活动空间，所述上下料机构的外围设有数个加工工位，所述上下料机构在所述活动空间与各个所述加工工位之间运动以输送晶圆，数个所述加工工位包括一个定位工位、一个预热工位及多个点胶工位；晶圆扫码对位装置，所述晶圆扫码对位装置位于所述定位工位，所述晶圆扫码对位装置对所述上下料机构输送的所述晶圆进行扫码和对位；晶圆预热机构，所述晶圆预热机构位于所述预热工位，所述晶圆预热机构对所述上下料机构输送的所述晶圆进行预热；晶圆加热装置，所述晶圆加热装置位于所述点胶工位，所述晶圆加热装置对所述加工工位上的所述晶圆进行加热；点胶装置，所述点胶装置匹配于所述晶圆加热装置，以对加热后的所述晶圆进行点胶。
根据本发明实施例的多工位点胶机，通过采用上下料机构、晶圆扫码对位装置、晶圆预热机构、晶圆加热装置和点胶装置，能够对晶圆进行扫码、对位、预热、加热、点胶，并且加工工位可以为多个，不仅提高了点胶质量，还能够提高对上下料机构的利用率，减少等待时间。该多工位点胶机具有结构紧凑、工作效率高和产品质量高等优点。
根据本发明一个实施例，所述上下料机构包括：上下料机体，所述上下料机体内限定有所述活动空间，所述上下料机体的两端分别设有与所述活动空间连通的料口，所述上下料机体的两侧分别设有至少两个加工工位；活动件，所述活动件在两个所述料口之间可活动地设在所述活动空间内；取料件，所述取料件设在所述活动件上以从所述料口及所述加工工位取放晶圆。
根据本发明一个实施例，所述上下料机体形成为开口向下的匚形，所述上下料机体的每个支脚上分别设有所述料口，所述上下料机构还包括：两个料盒，两个所述料盒分别设在两个所述支脚上与所述料口相对应的位置，所述取料件的至少一部分伸出所述料口进入所述料盒内进行上下料。
根据本发明一个实施例，所述取料件包括：机械手，所述机械手的一端与所述活动件相连，所述机械手的另一端可活动；托盘，所述托盘设于所述机械手的另一端，所述托盘用于承接所述晶圆。
根据本发明一个实施例，所述上下料机构还包括：上下料传送机构，所述上下料传送机构设在两个所述料口之间，所述上下料传送机构在两个所述料口之间可活动以驱动所述活动件活动，所述上下料传送机构包括：侧板，所述侧板沿所述上下料机体的长度方向延伸地设于所述上下料机体内，所述侧板的一侧形成为安装面；输送轨，所述输送轨沿所述上下料机体的长度方向延伸地设于所述安装面，所述活动件可活动地设于所述输送轨；上下料驱动件，所述上下料驱动件设于所述安装面，所述上下料驱动件与所述活动件相连以驱动所述活动件活动。
根据本发明一个实施例，所述晶圆扫码对位装置设于相邻的两个所述点胶工位之间，所述晶圆扫码对位装置包括：扫码装置，所述扫码装置对所述晶圆进行扫码识别；对位装置，所述对位装置对所述上下料机构输送的所述晶圆进行对位以调整所述晶圆的位置。
根据本发明一个实施例，所述晶圆预热机构和所述晶圆加热装置包括：底座；加热器，所述加热器设于所述底座，所述加热器的上表面形成为加热面；顶升组件，所述顶升组件设于所述底座，所述顶升组件可在顶升状态和非顶升状态之间活动，所述顶升组件处于所述顶升状态时支承晶圆使所述晶圆与所述加热面间隔开；所述顶升组件处于所述非顶升状态时，所述晶圆与所述加热面接触；所述顶升组件从所述顶升状态逐步向所述非顶升状态逐渐过渡时，所述加热器对所述晶圆进行非接触式加热以使所述晶圆逐步升温。
根据本发明一个实施例，所述底座包括：底板；支撑杆，所述支撑杆设于所述底板；发热支撑台，所述发热支撑台设于所述支撑杆且与所述底板间隔开，所述加热器和所述顶升组件均设于所述发热支撑台。
根据本发明一个实施例，所述加热器和所述发热支撑台上分别设有多个互相贯通的通孔，所述顶升组件包括：多个顶针，多个所述顶针分别穿过所述加热器和所述发热支撑台上的通孔且沿所述通孔的轴向可活动，所述顶升组件位于所述顶升状态时，所述顶针的上端伸出所述通孔承接所述晶圆，所述顶升组件位于所述非顶升状态时，所述顶针的上端不超出所述加热面；顶针驱动件，所述顶针驱动件设于所述底板且与所述顶针相连，所述顶针驱动件驱动所述顶针活动。
根据本发明一个实施例，所述加热面设有至少两个能对不同尺寸的晶圆进行加热的加热区，每个所述加热区分别设有至少一个真空吸附孔，所述晶圆预热机构还包括：真空吸附装置，所述真空吸附装置与所述真空吸附孔连通以在所述晶圆位于所述加热器上时吸附所述晶圆。
根据本发明一个实施例，所述发热支撑台内限定有加热腔，所述加热器包括：加热管，所述加热管伸入所述加热腔以进行加热；加热盘，所述加热盘贴合于所述发热支撑台且位于发热支撑台的上方，所述加热盘的上表面形成为加热面，所述加热盘接收所述加热管的热量并由所述加热面传递给晶圆，所述加热盘上设有至少两个加热区；至少两个热电偶，至少两个所述热电偶分别设在至少两个所述加热区以检测每个所述加热区的温度；温控器，所述温控器与所述加热管和所述热电偶相连，所述温控器根据所述热电偶检测的温度控制所述加热管加热。
根据本发明一个实施例，所述点胶装置包括：点胶机机体；点胶机机头组件，所述点胶机机头组件可活动地设于所述点胶机机体上且位于所述晶圆加热装置的上方以对放置在所述晶圆加热装置上的晶圆进行点胶；静电消散装置，所述静电消散装置可活动地设于所述点胶机机体上且位于所述晶圆加热装置的上方以对所述晶圆加热装置及晶圆进行静电去除处理。
根据本发明一个实施例，所述点胶装置还包括：安装架，所述安装架设于所述点胶机机体；胶桶，所述胶桶设于所述安装架，所述胶桶内填充有胶水；液位检测装置，所述液位检测装置设于所述胶桶和/或所述安装架以根据所述胶桶内胶水液位的光信号或者感应信号判断所述胶桶内胶水的液位。
根据本发明第二方面实施例的多工位点胶机的点胶方法，包括以下步骤：S1、获取晶圆，并对所述晶圆进行扫码对位；S2、对所述晶圆进行预热，并在预热过程中持续对所述晶圆进行测温；S3、当所述晶圆预热至第一设定温度后，将所述晶圆输送至点胶工位继续加热；S4、当所述晶圆加热至第二设定温度后，对所述晶圆进行点胶。
根据本发明一个实施例，在步骤S2中，通过调节所述晶圆与加热源之间的距离以对所述晶圆进行预热。
根据本发明一个实施例，在步骤S4中，持续检测所述晶圆的温度，在所述晶圆的温度低于所述第二设定温度时对所述晶圆继续加热。
本发明的附加方面和优点将在下面的描述中部分给出，部分将从下面的描述中变得明显，或通过本发明的实践了解到。
附图说明
本发明的上述和/或附加的方面和优点从结合下面附图对实施例的描述中将变得明显和容易理解，其中：
图1是根据本发明实施例的多工位点胶机的整体结构示意图；
图2是根据本发明实施例的多工位点胶机的上下料机构的结构示意图；
图3是根据本发明实施例的多工位点胶机的上下料机构的局部结构示意图；
图4是根据本发明实施例的多工位点胶机的上下料机构的立体图；
图5是根据本发明实施例的多工位点胶机的晶圆预热机构的结构示意图；
图6是根据本发明实施例的多工位点胶机的晶圆预热机构的主视图。
图7是根据本发明实施例的多工位点胶机的晶圆加热装置的顶升组件的局部示意图；
图8是根据本发明实施例的多工位点胶机的晶圆吸附装置的局部结构示意图；
图9是根据本发明实施例的多工位点胶机的晶圆扫码对位装置的结构示意图；
图10是根据本发明实施例的多工位点胶机的晶圆加热装置的加热管的结构示意图；
图11是根据本发明实施例的多工位点胶机的加工工位中晶圆加热装置的结构示意图；
图12是根据本发明实施例的多工位点胶机的静电消除装置的局部结构示意图；
图13是根据本发明实施例的多工位点胶机的点胶装置的主视图；
图14是根据本发明实施例的多工位点胶机的点胶装置的结构示意图；
图15是根据本发明实施例的多工位点胶机的加工工位局部示意图；
图16是根据本发明实施例的多工位点胶机的点胶方法的流程图。
附图标记：
多工位点胶机1000；
上下料机构100；
上下料机体110；料口112；加工工位113；支脚114；侧板115；安装面116；输送轨118；
活动件120；
取料件130；机械手131；托盘132；
料盒140；
上下料传送机构150；
晶圆预热机构200；
晶圆加热装置210；底座220；底板230；支撑杆240；
发热支撑台250；加热管252；加热盘257；热电偶258；
加热器260；
顶升组件270；顶针272；顶针驱动件274；
真空吸附装置280；真空吸附孔281；
晶圆扫码对位装置300；扫码装置310；对位装置320；
点胶装置400；
胶桶600；液位检测装置610；点胶机机体620；点胶机机头组件630；
静电消散装置700。
具体实施方式
下面详细描述本发明的实施例，所述实施例的示例在附图中示出，其中自始至终相同或类似的标号表示相同或类似的元件或具有相同或类似功能的元件。下面通过参考附图描述的实施例是示例性的，仅用于解释本发明，而不能理解为对本发明的限制。
在本发明的描述中，需要理解的是，术语“中心”、“纵向”、“横向”、“长度”、“宽度”、“厚度”、“上”、“下”、“前”、“后”、“左”、“右”、“竖直”、“水平”、“顶”、“底”“内”、“外”、“顺时针”、“逆时针”、“轴向”、“径向”、“周向”等指示的方位或位置关系为基于附图所示的方位或位置关系，仅是为了便于描述本发明和简化描述，而不是指示或暗示所指的装置或元件必须具有特定的方位、以特定的方位构造和操作，因此不能理解为对本发明的限制。此外，限定有“第一”、“第二”的特征可以明示或者隐含地包括一个或者更多个该特征。在本发明的描述中，除非另有说明，“多个”的含义是两个或两个以上。
在本发明的描述中，需要说明的是，除非另有明确的规定和限定，术语“安装”、“相连”、“连接”应做广义理解，例如，可以是固定连接，也可以是可拆卸连接，或一体地连接；可以是机械连接，也可以是电连接；可以是直接相连，也可以通过中间媒介间接相连，可以是两个元件内部的连通。对于本领域的普通技术人员而言，可以具体情况理解上述术语在本发明中的具体含义。
下面参考附图具体描述根据本发明实施例的多工位点胶机1000。
如图1至图15所示，根据本发明实施例的多工位点胶机1000,包括：上下料机构100、晶圆扫码对位装置300、晶圆预热机构200、晶圆加热装置210和点胶装置400。
具体而言，根据本发明实施例的多工位点胶机1000,上下料机构100内限定有活动空间，上下料机构100的外围设有数个加工工位113，上下料机构100在活动空间与各个加工工位113之间运动以输送晶圆，数个所述加工工位包括一个定位工位、一个预热工位及多个点胶工位；晶圆扫码对位装置300位于定位工位，晶圆扫码对位装置300对上下料机构100输送的晶圆进行扫码和对位；晶圆预热机构200位于预热工位，晶圆预热机构200对上下料机构100输送的晶圆进行预热；晶圆加热装置210位于点胶工位，晶圆加热装置210对加工工位113上的晶圆进行加热；点胶装置400匹配于晶圆加热装置，以对加热后的晶圆进行点胶。
换言之，根据本发明实施例的多工位点胶机1000,主要由上下料机构100、晶圆扫码对位装置300、晶圆预热机构200、多个晶圆加热装置210和多个点胶装置组成。上下料机构100的两侧分别设有至少两个加工工位113，晶圆扫码对位装置300晶圆预热机构200分别 设于上下料机构100的两侧。其中，上下料机构100可以为四个加工工位113但不限于四个，其中上下料机构100的一侧为两个加工工位113，晶圆扫码对位装置300可设在两个加工工位113中间，另一侧也为两个加工工位113，晶圆预热机构200可以设在两个加工工位113之间。每一个加工工位113对应一个点胶装置400和晶圆加热装置210,点胶装置400和晶圆加热装置210设在加工工位113内，晶圆加热装置210能够对晶圆进行加热，晶圆加热好后由点胶装置400对晶圆进行点胶。在上下料机体110内部限定有活动空间，上下料机构100的至少一部分能在在活动空间、晶圆扫码对位装置300、晶圆预热机构200和加工工位113之间进行往复活动，能够将晶圆输送至晶圆扫码对位装置300、晶圆预热机构200和加工工位113，或者是将加工好的晶圆输送出去。具体地，首先，上下料机构100进行取料，将晶圆送至晶圆扫码对位装置300进行扫码和对位，结束后取出；其次，上下料机构100输送晶圆至晶圆预热机构200内对晶圆进行预热，结束后取出；最后，上下料机构100输送晶圆至加工工位113内，由晶圆加热装置210对晶圆进行加热，达到温度要求后，再由点胶装置400对晶圆进行点胶。
由此，根据本发明实施例的多工位点胶机1000,通过采用上下料机构100、晶圆扫码对位装置300、晶圆预热机构200、多个晶圆加热装置210和多个点胶装置，能够对晶圆进行扫码、对位、预热、加热、点胶，并且加工工位113可以为多个，不仅提高了点胶质量，还能够提高对上下料机构100的利用率，减少等待时间。该多工位点胶机1000具有结构紧凑、工作效率高和产品质量高等优点。
如图2至图4所示，根据本发明的一个实施例，上下料机构100包括上下料机体110、活动件120和取料件130，上下料机体110内限定有活动空间，上下料机体110的两端分别设有与活动空间连通的料口112，上下料机体110的两侧分别设有至少两个加工工位113；活动件120在两个料口112之间可活动地设在活动空间内；取料件130设在活动件120上以从料口112及加工工位113取放晶圆。也就是说，在上下料机体110的左右两侧可分别设有一料口112，在加工时，可以将待加工晶圆采用人工或者机械部件输送至料口112附近处。在上下料机体110内部限定有活动空间，在活动空间内安装有活动件120，活动件120可在两端的料口112之间进行往复活动，从而能够调节其在活动空间内的位置。在活动件120上可设有取料件130，取料件130与活动件120相配合，可以从料口112将晶圆输送至加工工位113，或者将晶圆从加工工位113输送至料口112。其中需要说明的是，在上下料机体110的两侧可分别设有至少两个加工工位113，当活动件120移动到指定工位时，取料件130相应的可以完成该指定工位的送料或取料的动作。
由此，上下料机构100通过在上下料机体110内设置活动件120和取料件130，活动件 120在上下料机体110内做往复活动带动取料件130在上下料机体110内活动，从而可以实现将待加工晶圆运送到指定工位，并且能够在加工完成后，将已加工的晶圆取出，继续进行下一步工序。
进一步地，上下料机体110形成为开口向下的匚形，上下料机体110的每个支脚114上分别设有料口112，上下料机构100还包括两个料盒140，两个料盒140分别设在两个支脚114上与料口112相对应的位置，取料件130的至少一部分伸出料口112进入料盒140内进行上下料。也就是说，通过将上下料机体110设置为开口向下的匚形，使得多工位点胶机整体结构更加紧凑，空间得到更完善地利用。并且，在上下料机体110的每个支脚114上分别设有料口112，更便于上下料机构的送料与取料，不仅节省整体的空间，更节省输送晶圆的时间，提高整体加工效率。进一步地，通过在上下料机体110的两个支脚114上设置两个料盒140，是为了便于待加工料件以及加工完成的晶圆的存放，节省了大量人力、物力。并且，将料盒140设置在与料口112相对应的位置，更有利于取料件130执行上下料操作，避免了不必要的行程。
可选地，取料件130包括机械手131和托盘132，机械手131的一端与活动件120相连，机械手131的另一端可活动；托盘132设于机械手131的另一端，托盘132用于承接晶圆。需要说明的是，通过采用机械手131可以使得取料件130轻松到达指定目标位置，提高了上下料过程的准确度和灵敏度。另外，通过在机械手131的另一端设置托盘132，便于将晶圆放置在托盘132上，从而能够保证取料件130在运行过程中驱动晶圆平稳地到达目标位置。
在本发明的一些具体实施方式中，上下料机构100还包括上下料传送机构150，上下料传送机构150设在两个料口112之间，上下料传送机构150在两个料口112之间可活动以驱动活动件120活动，上下料传送机构150包括侧板115、输送轨118和上下料驱动件，侧板115沿上下料机体110的长度方向延伸地设于上下料机体110内，侧板115的一侧形成为安装面116；输送轨118沿上下料机体110的长度方向延伸地设于安装面116，活动件120可活动地设于输送轨118；上下料驱动件设于安装面116，上下料驱动件与活动件120相连以驱动活动件120活动。也就是说，在两个料口112之间设有上下料传送机构150，活动件120在上下料机体110内往复活动可以通过上下料传送机构150来完成。多工位点胶机1000的上下料传送机构150设于多工位点胶机1000的上下料机体内部，上下料传送机构150由侧板115、输送轨118和上下料驱动件组成。其中，侧板115位于上下料机体内并且沿上下料机体的长度方向延伸，侧板115的一侧形成为安装面116，输送轨118沿上下料机体的长度方向延伸地设于安装面116。输送轨118上设有活动件120，活动件120通过上下料驱动件驱动可在输送轨118上做往复运动，上下料驱动件可设于安装面116上。
由此，上下料传送机构150设于多工位点胶机1000的上下料机体内以驱动活动件120活动，通过将侧板115、输送轨118和上下料驱动件相结合，保证了活动件120可以在输送轨118上做往复运动，从而可以实现将物料输送到指定工位的效果。
进一步地，晶圆扫码对位装置300设于相邻的两个点胶工位之间，晶圆扫码对位装置300包括扫码装置和对位装置，扫码装置对晶圆进行扫码识别；对位装置对上下料机构100输送的晶圆进行对位以调整晶圆的位置。也就是说，通过将晶圆扫码对位装置300设于两个点胶机400之间，在对晶圆进行扫码和/或定位操作后，便于将该晶圆输送至两个点胶机400中的任一个，能够有效缩短输送行程，不仅便于上下料机构100对晶圆的输送，更加使具有晶圆扫码对位装置300的多工位点胶机1000整体紧凑、外表美观。进一步地，通过设置扫码装置310能够对晶圆进行扫码处理，判断晶圆是否已进行点胶操作，可以减少失误率，防止对已经加工的晶圆重复操作，对未加工的晶圆漏操作，能够有效保证加工的精准性和效率。通过对晶圆进行对位处理，可以根据晶圆上具体需要点胶的位置对晶圆进行精准对位，调整晶圆的位置，减少后续的工作量，提高了加工效率。
如图5至图7所示，根据本发明的一个实施例，晶圆预热机构200和晶圆加热装置210包括底座220、加热器260和顶升组件270，加热器260设于底座220，加热器260的上表面形成为加热面；顶升组件270设于底座220，顶升组件270可在顶升状态和非顶升状态之间可活动，顶升组件270处于顶升状态时支承晶圆使晶圆与加热面间隔开，顶升组件270处于非顶升状态时，晶圆与加热面接触，顶升组件270从顶升状态逐步向非顶升状态逐渐过渡时，加热器260对晶圆进行非接触式加热以使晶圆逐步升温。换言之，根据本发明实施例的晶圆预热机构200主要由底座220、加热器260和顶升组件270组成，底座220可以位于加热器260和顶升组件270的下方，通过底座220能够支撑顶升组件270和加热器260。加热器260的上表面可以形成为加热面。顶升组件270能够承接晶圆，并且顶升组件270能够在顶升状态和非顶升状态之间可活动。具体地，当顶升组件270位于顶升状态时，晶圆与加热面之间间隔开设置，当顶升组件270位于非顶升状态时，晶圆与加热面接触，也就是说，随着晶圆和加热面距离的改变，晶圆的温度也将改变。可选地，顶升组件270可以采用从加热面的表面穿出的方式实现其从非顶升状态活动至顶升状态，从加热面的表面缩回的方式实现其从顶升状态活动至非顶升状态，具体地，当顶升组件270位于加热面的下方时，顶升组件270位于非顶升状态。需要说明的是，根据本发明实施例的晶圆预热机构200还可以采用其他装配结构的顶升组件270和加热器260，只需要能够满足顶升组件270在顶升状态和非顶升状态之间可活动的需求即可。
需要说明的是，加热器260包括两个部分，一部分为位于发热支撑台的槽体内的加热模 块，另一部分为与加热模块的上表面贴合的导热盘。导热盘的上表面为加热面。当顶升组件270从顶升状态向非顶升状态活动时，晶圆可以停在顶升状态和非顶升状态之间的任意位置并进行加热，也就是说，可以根据温度要求选择加热位置。当晶圆逐步地靠近加热面，晶圆的温度将逐渐升高，从而实现均匀平稳加热。
由此，晶圆预热机构200通过底座220、加热器260和顶升组件270相配合，驱动顶升组件270在顶升状态和非顶升状态之间可活动，来改变晶圆与加热面之间的距离，实现对晶圆的非接触式加热，晶圆甚至可从顶升组件270能够上升的最高位置逐渐活动至加热面上，晶圆的温度逐渐升高，解决了现有的接触式预加热致使的晶圆温度突然上升而导致晶圆破裂的问题，并且晶圆距离加热面的高度可调控，可根据需求，在不同位置进行加热，具有均匀升温、可选择性高，操控性强等优点。
进一步地，底座220包括底板230、支撑杆240和发热支撑台250，支撑杆240设于底板230；发热支撑台250设于支撑杆240且与底板230间隔开，加热器260和顶升组件270设于发热支撑台250。通过支撑杆240能够支撑发热支撑台250，发热支撑台250与底板230之间间隔开设置，便于安装顶升组件270的驱动机构以及加热器260的电控组件。
可选地，加热器260和发热支撑台250上分别设有多个互相贯通的通孔，顶升组件270包括多个顶针272和顶针驱动件274，多个顶针272分别穿过加热器260和发热支撑台250上的通孔且沿通孔的轴向可活动，顶升组件270位于第一位置时，顶针272的上端伸出通孔承接晶圆，顶升组件270位于第二位置时，顶针272的上端不超出加热面；顶针驱动件274设于发热支撑台250与底板230之间且与顶针272相连，顶针驱动件274驱动顶针272活动。由此通过顶针272驱动件驱动多个顶针272从加热面穿出，不仅能够利用顶针272支撑晶圆，还能够调节顶针272伸出加热面的高度，使晶圆实现非接触式加热，需要说明的是，当顶针272下行至加热面的下方时，晶圆可落至加热面上且与加热面相接触。
优选地，加热面设有至少两个能对不同尺寸的晶圆进行加热的加热区，每个加热区分别设有至少一个真空吸附孔281，晶圆预热机构200还包括真空吸附装置280，真空吸附装置280与真空吸附孔281连通以在晶圆位于加热器260上时固定晶圆。具体地，当顶升机构位于加热面下方时，此时顶升机构不再对晶圆起到支撑作用，晶圆直接与加热面进行接触，此时采用真空吸附使晶圆固定在加热面上，可放置晶圆发生移动，便于下一步操作，且具有结构简单，便于实施，不会对晶圆产生损坏等优点。
进一步地，发热支撑台250内限定有加热腔，加热器260包括加热管252、加热盘257、至少两个热电偶258和温控器，加热管252伸入加热腔以进行加热；加热盘257贴合于发热支撑台且位于发热支撑台的上方，加热盘257的上表面形成为加热面，加热盘257接收加热 管252的热量并由加热面传递给晶圆，加热盘257上设有至少两个加热区；至少两个热电偶258分别设在至少两个加热区以检测每个加热区的温度；温控器与加热管252和热电偶258相连，温控器根据热电偶258检测的温度控制加热管252加热。
也就是说，在发热支撑台250的内部设有加热腔，加热腔内设有用于给晶圆提供热量的加热管252，加热管252可弯曲成型。在加热腔上方设有加热盘257，加热盘257的上表面为加热面，加热面可以将加热管252提供的热量传递给晶圆，使晶圆升温。在加热盘257上至少可以划分出两个加热区，至少两个热电偶258分别设在至少两个加热区以检测每个加热区的温度。分区加热的晶圆加热装置210还设有温控器，温控器安装于机架上且能够与加热管252和热电偶258相连，热电偶258检测得到的温度信息可以反馈给温控器，从而温控器可以根据反馈情况对加热管252的加热状态进行控制。
由此，通过将发热支撑台250、加热管252、加热盘257、至少两个热电偶258和温控器结合，可以实现对晶圆加热装置210的分区控制，实现对于晶圆的温度的分区控制，使得晶圆受热均匀，点胶效率更高，成品效果更好。
如图13至图15所示，在本发明的一些具体实施方式中，点胶装置包括点胶机机体620、点胶机机头组件630和静电消散装置700，点胶机机体620上设有加工工位，点胶机机头组件630可活动地设于点胶机机体620上且位于晶圆加热装置的上方以对放置在晶圆加热装置上的晶圆进行点胶，静电消散装置700可活动地设于点胶机机体620上且位于晶圆加热装置的上方以对晶圆加热装置及晶圆进行静电去除处理。换言之，根据本实用新型实施例的设有静电消散装置的点胶机1000由点胶机机体620、点胶机机头组件630和静电消散装置700构成。点胶机机体620内设有加工工位用于放置晶圆，点胶机机头组件630设于加工工位上方用于对晶圆进行点胶，点胶过程中，点胶机机头组件630可移动到晶圆需要点胶的指定位置上方。点胶机机体620内还设有静电消散装置700，在点胶机机头组件630对晶圆点胶的过程中，静电消散装置700可以根据需要进行活动，对加工工位以及周围的加工环境进行静电去除处理。
由此，根据本实用新型实施例的设有静电消散装置的点胶机1000通过将点胶机机体620、点胶机机头组件630和静电消散装置700相结合，利用静电消散装置700将空气电离产生大量正负电荷，并将正负电荷吹出，形成一股正负电荷的气流，将物体表面所带的电荷中和掉。当物体表面所带为负电荷时，它会吸引气流中的正电荷，当物体表面所带为正电荷时，它会吸引电流中的负电荷，从而使物体表面上的静电被中和，从而达到消除静电的目的。
进一步地，点胶装置400还包括安装架、胶桶600和液位检测装置610，安装架设于点胶机机体620；胶桶600设于安装架，胶桶600内填充有胶水；液位检测装置610设于胶桶 600和/或安装架以根据胶桶600内胶水液位的光信号或者感应信号判断胶桶600内胶水的液位。换言之，点胶装置400主要由安装架、胶桶600以及液位检测装置610组成，其中，安装架能够用于固定胶桶600，胶桶600能够用于盛装点胶所需的胶水。在胶桶600处或在安装架处设置液位检测装置610，液位检测装置610可以根据胶桶600内胶水液位的光信号或感应信号判断桶内胶水的液位。由此，通过将安装架、胶桶600和液位检测装置610相结合，利用胶桶600内胶水液位的光信号或者感应信号，从而判断胶桶600内胶水的液位。在点胶机400上设置液位检测装置610便于工作人员实时监测胶桶600内胶水的余量，提醒工作人员在胶水余量不足时可以及时添加胶水或更换充满有胶水的胶桶600，防止因胶水不足而中断加工，降低生产效率。
如图16所示，根据本发明实施例的多工位点胶机的点胶方法，包括以下步骤：S1、获取晶圆，并对所述晶圆进行扫码对位；S2、对所述晶圆进行预热，并在预热过程中持续对所述晶圆进行测温；S3、当所述晶圆预热至第一设定温度后，将所述晶圆输送至点胶工位继续加热；S4、当所述晶圆加热至第二设定温度后，对所述晶圆进行点胶。
根据本发明的一个实施例，在步骤S2中，通过调节所述晶圆与加热源之间的距离以对所述晶圆进行预热。
在本发明的一些具体实施方式中，在步骤S4中，持续检测所述晶圆的温度，在所述晶圆的温度低于所述第二设定温度时对所述晶圆继续加热。
总而言之，根据本发明实施例的多工位点胶机1000,具有整体结构紧凑、点胶效果好、温度控制精准、生产效率高、产品质量高等优点。
根据本发明实施例的多工位点胶机的其他结构和操作对于本领域技术人员而言都是可以理解并且容易实现的，因此不再详细描述。
在本说明书的描述中，参考术语“一个实施例”、“一些实施例”、“示意性实施例”、“示例”、“具体示例”、或“一些示例”等的描述意指结合该实施例或示例描述的具体特征、结构、材料或者特点包含于本发明的至少一个实施例或示例中。在本说明书中，对上述术语的示意性表述不一定指的是相同的实施例或示例。而且，描述的具体特征、结构、材料或者特点可以在任何的一个或多个实施例或示例中以合适的方式结合。
尽管已经示出和描述了本发明的实施例，本领域的普通技术人员可以理解：在不脱离本发明的原理和宗旨的情况下可以对这些实施例进行多种变化、修改、替换和变型，本发明的范围由权利要求及其等同物限定。

Claims (12)

  1. 一种多工位点胶机，其特征在于，包括：
    上下料机构，所述上下料机构内限定有活动空间，所述上下料机构的外围设有数个加工工位，所述上下料机构在所述活动空间与各个加工工位之间运动以输送晶圆，数个所述加工工位包括一个定位工位、一个预热工位及多个点胶工位；
    晶圆扫码对位装置，所述晶圆扫码对位装置位于所述定位工位，所述晶圆扫码对位装置对所述上下料机构输送的所述晶圆进行扫码和对位；
    晶圆预热机构，所述晶圆预热机构位于所述预热工位，所述晶圆预热机构对所述上下料机构输送的所述晶圆进行预热；
    晶圆加热装置，所述晶圆加热装置位于所述点胶工位，所述晶圆加热装置对所述加工工位上的所述晶圆进行加热；
    点胶装置，所述点胶装置匹配于所述晶圆加热装置，以对加热后的所述晶圆进行点胶。
  2. 根据权利要求1所述的多工位点胶机，其特征在于，所述上下料机构包括：
    上下料机体，所述上下料机体内限定有所述活动空间，所述上下料机体的两端分别设有与所述活动空间连通的料口，所述上下料机体的两侧分别设有至少两个加工工位；
    活动件，所述活动件在两个所述料口之间可活动地设在所述活动空间内；
    取料件，所述取料件设在所述活动件上以从所述料口及所述加工工位取放晶圆。
  3. 根据权利要求2所述的多工位点胶机，其特征在于，所述上下料机体形成为开口向下的匚形，所述上下料机体的每个支脚上分别设有所述料口，所述上下料机构还包括：
    两个料盒，两个所述料盒分别设在两个所述支脚上与所述料口相对应的位置，所述取料件的至少一部分伸出所述料口进入所述料盒内进行上下料。
  4. 根据权利要求2所述的多工位点胶机，其特征在于，所述上下料机构还包括：上下料传送机构，所述上下料传送机构设在两个所述料口之间，所述上下料传送机构在两个所述料口之间可活动以驱动所述活动件活动，所述上下料传送机构包括：
    侧板，所述侧板沿所述上下料机体的长度方向延伸地设于所述上下料机体内，所述侧板的一侧形成为安装面；
    输送轨，所述输送轨沿所述上下料机体的长度方向延伸地设于所述安装面，所述活动件可活动地设于所述输送轨；
    上下料驱动件，所述上下料驱动件设于所述安装面，所述上下料驱动件与所述活动 件相连以驱动所述活动件活动。
  5. 根据权利要求1所述的多工位点胶机，其特征在于，所述晶圆扫码对位装置设于相邻的两个所述点胶工位之间，所述晶圆扫码对位装置包括：
    扫码装置，所述扫码装置对所述晶圆进行扫码识别；
    对位装置，所述对位装置对所述上下料机构输送的所述晶圆进行对位以调整所述晶圆的位置。
  6. 根据权利要求1所述的多工位点胶机，其特征在于，所述晶圆预热机构和所述晶圆加热装置包括：
    底座；
    加热器，所述加热器设于所述底座，所述加热器的上表面形成为加热面；
    顶升组件，所述顶升组件设于所述底座，所述顶升组件可在顶升状态和非顶升状态之间活动，所述顶升组件处于所述顶升状态时支承晶圆使所述晶圆与所述加热面间隔开；所述顶升组件处于所述非顶升状态时，所述晶圆与所述加热面接触；
    所述顶升组件从所述顶升状态逐步向所述非顶升状态逐渐过渡时，所述加热器对所述晶圆进行非接触式加热以使所述晶圆逐步升温。
  7. 根据权利要求6所述的多工位点胶机，其特征在于，所述底座包括：
    底板；
    支撑杆，所述支撑杆设于所述底板；
    发热支撑台，所述发热支撑台设于所述支撑杆且与所述底板间隔开，所述加热器和所述顶升组件均设于所述发热支撑台。
  8. 根据权利要求7所述的多工位点胶机，其特征在于，所述加热面设有至少两个能对不同尺寸的晶圆进行加热的加热区，每个所述加热区分别设有至少一个真空吸附孔，所述晶圆预热机构还包括：
    真空吸附装置，所述真空吸附装置与所述真空吸附孔连通以在所述晶圆位于所述加热器上时吸附所述晶圆。
  9. 根据权利要求1所述的多工位点胶机，其特征在于，所述点胶装置包括：
    点胶机机体；
    点胶机机头组件，所述点胶机机头组件可活动地设于所述点胶机机体上且位于所述晶圆加热装置的上方以对放置在所述晶圆加热装置上的晶圆进行点胶；
    静电消散装置，所述静电消散装置可活动地设于所述点胶机机体上且位于所述晶圆加热装置的上方以对所述晶圆加热装置及晶圆进行静电去除处理。
  10. 根据权利要求9所述的多工位点胶机，其特征在于，所述点胶装置还包括：
    安装架，所述安装架设于所述点胶机机体；
    胶桶，所述胶桶设于所述安装架，所述胶桶内填充有胶水；
    液位检测装置，所述液位检测装置设于所述胶桶和/或所述安装架以根据所述胶桶内胶水液位的光信号或者感应信号判断所述胶桶内胶水的液位。
  11. 一种多工位点胶机的点胶方法，其特征在于，包括以下步骤：
    S1、获取晶圆，并对所述晶圆进行扫码对位；
    S2、对所述晶圆进行预热，并在预热过程中持续对所述晶圆进行测温；
    S3、当所述晶圆预热至第一设定温度后，将所述晶圆输送至点胶工位继续加热；
    S4、当所述晶圆加热至第二设定温度后，对所述晶圆进行点胶。
  12. 根据权利要求11所述的方法，其特征在于，在步骤S4中，持续检测所述晶圆的温度，在所述晶圆的温度低于所述第二设定温度时对所述晶圆继续加热。
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