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WO2021059914A1 - Electronic circuit device - Google Patents

Electronic circuit device Download PDF

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Publication number
WO2021059914A1
WO2021059914A1 PCT/JP2020/033435 JP2020033435W WO2021059914A1 WO 2021059914 A1 WO2021059914 A1 WO 2021059914A1 JP 2020033435 W JP2020033435 W JP 2020033435W WO 2021059914 A1 WO2021059914 A1 WO 2021059914A1
Authority
WO
WIPO (PCT)
Prior art keywords
electronic circuit
heat
circuit device
metal layer
wall portions
Prior art date
Application number
PCT/JP2020/033435
Other languages
French (fr)
Japanese (ja)
Inventor
亨典 平木
藤田　治彦
Original Assignee
日立Astemo株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日立Astemo株式会社 filed Critical 日立Astemo株式会社
Priority to JP2021548740A priority Critical patent/JPWO2021059914A1/ja
Priority to DE112020004544.7T priority patent/DE112020004544T5/en
Publication of WO2021059914A1 publication Critical patent/WO2021059914A1/en

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3677—Wire-like or pin-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
    • H01L23/5383—Multilayer substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
    • H01L23/5384—Conductive vias through the substrate with or without pins, e.g. buried coaxial conductors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws

Definitions

  • the present invention relates to an electronic circuit device in which heat-generating components such as semiconductor switching elements are mounted on a circuit board.
  • the heat of the heat-generating components is transferred to a casing or the like that serves as a heat sink in some way.
  • a structure that dissipates heat is required.
  • a gel-like fluid heat transfer is performed between a circuit board on which a heat generating component is mounted and a member on the other side that receives heat, for example, a casing. It is known to intervene with materials. Since this type of fluid heat transfer material can follow and come into close contact with each facing surface, that is, the heat transfer surface, heat transfer is improved as compared with the case where there are minute gaps due to minute irregularities at the interface.
  • An object of the present invention is to provide an electronic circuit device capable of easily dissipating heat from heat generating parts without using a fluid heat transfer material.
  • the electronic circuit device includes a circuit board on which a heat generating component is mounted and having a through hole penetrating in the thickness direction, and a metal radiator having a boss portion inserted into the through hole. , Is provided.
  • heat can be easily dissipated from heat generating parts without using a fluid heat transfer material.
  • FIG. 1 An enlarged view of part A in FIG. FIG. 1 is an enlarged view of part B in FIG.
  • the perspective view of the housing which accommodates the electronic circuit apparatus which concerns on this embodiment.
  • the perspective view of the bracket which connects the electronic circuit apparatus which concerns on this embodiment to a vehicle body.
  • FIG. 3 is a perspective view of a state in which the electronic circuit device according to the present embodiment is housed in a housing.
  • FIG. 5 is a cross-sectional view showing a state in which the electronic circuit device according to the present embodiment is connected to a vehicle body via a bracket.
  • the electronic circuit device 1 As shown in FIGS. 1 to 5, the electronic circuit device 1 according to the present embodiment is configured such that a circuit board 2 is placed on a metal radiator body 3 serving as a heat sink. A plurality of semiconductor switching elements (for example, MOS-FETs) 10 which are heat generating elements are surface-mounted on the circuit board 2.
  • the circuit board 2 includes, for example, first to fourth conductive metal layers 4A, 4B, 4C, and 4D made of four layers of copper foil, and first to first glass epoxy resins and the like. It is composed of a multilayer substrate in which three resin layers 5A, 5B, and 5C are alternately arranged. Land portions and circuit wirings (patterns) necessary for mounting electronic components are appropriately formed on the first to fourth conductive metal layers 4A to 4D.
  • the semiconductor switching element 10 which is a heat generating component (heating element) is electrically mounted with a lead terminal connected to a land portion (not shown) formed on the first conductive metal layer 4A of the circuit board 2.
  • a heat receiving metal portion 8 is formed in a region of the first conductive metal layer 4A where the semiconductor switching element 10 is in contact so as to avoid circuit wiring (pattern) and the like. With reference to FIG. 3, in this region, the heat receiving metal portion 8 of the first conductive metal layer 4A, the first resin layer 5A, the second conductive metal layer 4B, the second resin layer 5B, the third conductive metal layer 4C, A plurality of first through holes 11 penetrating the third resin layer 5C and the fourth conductive metal layer 4D are formed.
  • a metal layer 12 is provided on the inner peripheral surface of these first through holes 11 by electroplating or the like.
  • a pattern is formed so as to hollow out around the first through hole 11 and is insulated from the first through hole 11.
  • Each of the first through holes 11 having the metal layer 12 is provided to guide the heat from the semiconductor switching element 10 from the heat receiving metal portion 8 of the first conductive metal layer 4A to the third conductive metal layer 4C.
  • each first through hole 11 serves as a heat transfer path from the semiconductor switching element 10 in the thickness direction of the circuit board 2.
  • a plurality of second through holes 14 penetrating the circuit board 2 are formed in the vicinity of the semiconductor switching element 10. Specifically, the second through holes 14 penetrating the first to fourth conductive metal layers 4A to 4D and the first to third resin layers 5A to 5C constituting the circuit board 2 are formed. A metal layer 15 by electroplating or the like is provided on the inner peripheral surface of the second through hole 14. The first to third conductive metal layers 4A to 4C and the metal layer 15 of the second through hole 14 are insulated by interposing a resin layer 17, respectively. As a result, the second through hole 14 is insulated from the conductor portion of the semiconductor switching element 10.
  • the fourth conductive metal layer 4D and the metal layer 15 of the second through hole 14 are connected by a pattern of the fourth conductive metal layer 4D. As described above, the fourth conductive metal layer 4D is insulated from the third conductive metal layer 4C by interposing the third resin layer 5C.
  • the heat radiating body 3 is formed of a metal member such as an aluminum alloy having excellent heat conduction.
  • the heat radiating body 3 includes a rectangular parallelepiped portion 20 and a plurality of boss portions 21 projecting from one surface of the rectangular parallelepiped portion 20.
  • Each boss portion 21 has a columnar shape and is press-fitted into each of the second through holes 14 provided in the circuit board 2.
  • the surface of the rectangular parallelepiped portion 20 facing the fourth conductive metal layer 4D of the circuit board 2 is formed in a substantially flat shape without unevenness.
  • the rectangular parallelepiped portion 20 is configured to be in contact with the fourth conductive metal layer 4D of the circuit board 2 over substantially the entire area.
  • the height of each boss portion 21 substantially matches the thickness of the circuit board 2.
  • Each boss portion 21 is integrally connected to the rectangular parallelepiped portion 20 by press-fitting into one surface of the rectangular parallelepiped portion 20. Further, on the other surface of the rectangular parallelepiped portion 20 of the heat radiating body 3, a plurality of screw holes 24, 24 for fixing the electronic circuit device 1 to the bracket 40, which will be described later, are formed at intervals.
  • the heat from the semiconductor switching element 10 is transferred from the heat receiving metal portion 8 of the first conductive metal layer 4A to the third conductive metal layer 12 of each first through hole 11. It is guided to the metal layer 4C. At this time, since the heat receiving metal layer 8 and the third conductive metal layer 4C are connected by the metal layer 12 of each first through hole 11, the heat transfer property is improved. Next, the heat of the third conductive metal layer 4C is guided to the fourth conductive metal layer 4D via the insulated third resin layer 5C.
  • the third resin layer 5C is thin (the length in the thickness direction is short), and the third conductive metal layer 4C and the fourth conductive metal layer 4D are in contact with each other in a planar manner via the third resin layer 5C.
  • the heat transfer property is good.
  • the heat of the fourth conductive metal layer 4D is guided to the metal layer 15 of the second through hole 14 via the connected pattern, and from the metal layer 15, the heat radiator 3 is press-fitted (press-fitted). It is guided to the rectangular parallelepiped portion 20 via the boss portion 21 (in close contact) and dissipates heat.
  • the fourth conductive metal layer 4D and the metal layer 15 of the second through hole 14 are connected to each other by metals, and the metal layer 15 and the boss portion 21 are in surface contact with each other.
  • the heat transfer property is good because it is in close contact with the surface.
  • the facing surface of the rectangular parallelepiped portion 20 is formed between the fourth conductive metal layer 4D and the rectangular parallelepiped portion 20 of the heat radiating body 3 in a substantially flat shape without unevenness, the circuit board 2 is warped. Since there are some parts where minute voids appear and are not in close contact with each other due to such factors, a good heat transfer effect cannot be expected.
  • the electronic circuit device 1 is mounted in the housing 30.
  • the housing 30 is made of synthetic resin and integrally molded.
  • the housing 30 is formed in a substantially square tube shape so as to surround the electronic circuit device 1.
  • the housing 30 has a pair of side wall portions 31 and 31 facing each other and a pair of support wall portions 32 and 32 that support the electronic circuit device 1 from the radiator 3 side (in FIG. 7, one of the front support wall portions 32 and 32). 32 is shown), and a covering wall portion 33 that faces the pair of support wall portions 32, 32 and covers the electronic circuit device 1 from each semiconductor switching element 10 side.
  • a pair of engaging wall portions 34, 34 are projected outward from the outer surfaces of the pair of side wall portions 31, 31.
  • the pair of engaging wall portions 34, 34 extend along the thickness direction of the electronic circuit device 1.
  • stopper wall portions 35, 35 extend along the longitudinal direction of the housing 30. The distance between the pair of stopper wall portions 35, 35 and the pair of support wall portions 32, 32 is substantially the same as the thickness of the electronic circuit device 1.
  • the housing 30 is connected to the vehicle body 43 by the bracket 40.
  • the bracket 40 is made of metal.
  • the bracket 40 is provided between the pair of vehicle body side fixed wall portions 45, 45 fixed to the vehicle body 43 side and the pair of vehicle body side fixed wall portions 45, 45, and is provided on the electronic circuit device 1 side.
  • Mounting holes 45A and 45A are formed in the vehicle body side fixed wall portion 45 at intervals along the longitudinal direction thereof, respectively.
  • Mounting holes 46A and 46A are formed in the circuit-side fixed wall portion 46 at intervals along the longitudinal direction thereof.
  • the bracket 40 is connected to the housing 30 by engaging the housing-side engaging wall portions 47, 47 between the pair of engaging wall portions 34, 34 of the housing 30. Will be done.
  • a pair of circuit-side fixed wall portions 46, 46 of the bracket 40 are arranged, respectively, a surface of the housing 30 on the covering wall portion 33 side of the pair of support wall portions 32, 32, and a pair of circuit-side fixed wall portions of the bracket 40.
  • the surfaces of 46 and 46 on the side of the covering wall portion 33 are located on the same plane.
  • the pair of vehicle body side fixed wall portions 45, 45 of the bracket 40 are located outside the pair of side wall portions 31, 31 of the housing 30.
  • the electronic circuit device 1 is provided with a pair of support wall portions 32, 32 (a pair of circuit-side fixed wall portions 46, 46 of the bracket 40) and a pair of stopper wall portions 35 of the housing 30. , 35 and so as to be inserted.
  • the heat radiating body 3 of the electronic circuit device 1 comes into contact with the pair of support wall portions 32, 32 of the housing 30, and also comes into contact with the pair of circuit-side fixed wall portions 46, 46 of the bracket 40.
  • metal mounting screws 50, 50 are inserted into the mounting holes 46A, 46A provided in the pair of circuit-side fixed wall portions 46, 46 of the bracket 40, and the mounting screws are inserted. 50, 50 are screwed into the screw holes 24, 24 of the radiator body 3 of the electronic circuit device 1.
  • the bracket 40 can be fixed to the electronic circuit device 1.
  • metal mounting screws 51 and 51 are inserted into the mounting holes 45A and 45A provided in the pair of vehicle body side fixed wall portions 45 and 45 of the bracket 40, and the mounting screws are inserted. 51 and 51 are screwed into the screw holes 60 and 60 provided on the vehicle body 43 side.
  • the bracket 40 can be fixed to the vehicle body 43.
  • the electronic circuit device 1 including the housing 30 can be connected to the vehicle body 43 via the bracket 40.
  • the heat from each semiconductor switching element 10 of the electronic circuit device 1 is guided to the heat radiating body 3 as described above, and finally, the heat from the heat radiating body 3 is transferred to each mounting screw 50, the bracket 40, and each mounting. It is guided to the vehicle body 43 via the screw 51.
  • the semiconductor switching element 10 which is a heat generating component (heating element) is mounted, and the circuit board 2 has a second through hole 14 penetrating in the thickness direction.
  • a metal radiator 3 having a boss portion 21 inserted into the second through hole 14 is provided.
  • the heat from the semiconductor switching element 10 can be guided to the radiator 3 via the circuit board 2.
  • heat can be easily dissipated from the semiconductor switching element 10 which is a heat generating component (heat generating element) without using a conventional fluid heat transfer material.
  • the semiconductor switching element 10 which is a heat generating component (heating element) is used. Heat can be easily directed to the radiator 3. Further, in the electronic circuit device 1 according to the present embodiment, since the heat radiating body 3 of the electronic circuit device 1 is connected to the vehicle body 43 side via the metal bracket 40, heat from the heat radiating body 3 can be easily obtained. It can be guided to the vehicle body 43 side.
  • the first aspect is a circuit board (2) on which a heat generating component (10) is mounted and having a through hole (14) penetrating in the thickness direction, and a boss portion (21) inserted into the through hole (14).
  • the metal radiator (3) having the above-mentioned is provided.
  • the circuit board (2) is configured by providing the through hole (14) in the vicinity of the heat generating component (10).
  • the through hole (14) is insulated from the conductor portion of the heat generating component (10).
  • the heat radiating body (3) is connected to the vehicle body (43) via a metal bracket (40).
  • the heat generating component (10) is a heat generating element.
  • the present invention is not limited to the above-described embodiment, and includes various modifications.
  • the above-described embodiment has been described in detail in order to explain the present invention in an easy-to-understand manner, and is not necessarily limited to the one including all the described configurations.
  • it is possible to replace a part of the configuration of one embodiment with the configuration of another embodiment and it is also possible to add the configuration of another embodiment to the configuration of one embodiment.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

This electronic circuit device comprises: a circuit substrate which has mounted thereon a semiconductor switching element that is a heat-generating component, and which has a second through-hole that penetrates the substrate in the thickness direction; and a heat-dissipating body which is made of metal and has a boss part that is inserted into the second through-hole. Due to this configuration, without using a conventional flowable heat-transfer material, heat can be easily dissipated from a semiconductor element that is a heat-generating component.

Description

電子回路装置Electronic circuit equipment
　本発明は、半導体スイッチング素子等の発熱部品が回路基板上に実装された電子回路装置に関する。 The present invention relates to an electronic circuit device in which heat-generating components such as semiconductor switching elements are mounted on a circuit board.
　半導体スイッチング素子等の発熱部品を回路基板上に備えた電子回路装置にあっては、発熱部品の温度上昇を抑制するために、ヒートシンクとなるケーシング等へ何らかの形で発熱部品の熱を伝達し、放熱させる構造が必要である。 In an electronic circuit device equipped with heat-generating components such as semiconductor switching elements on a circuit board, in order to suppress the temperature rise of the heat-generating components, the heat of the heat-generating components is transferred to a casing or the like that serves as a heat sink in some way. A structure that dissipates heat is required.
　伝熱構造の一つとして、特許文献１に開示されているように、発熱部品を実装した回路基板と熱を受熱する相手側の部材、例えばケーシングとの間に、ゲル状の流動性伝熱材料を介在させることが公知である。この種の流動性伝熱材料は、各々の対向面つまり伝熱面に追従して密接し得るため、界面に微小な凹凸による微小隙間が存在する場合に比較して、熱伝達が向上する。 As one of the heat transfer structures, as disclosed in Patent Document 1, a gel-like fluid heat transfer is performed between a circuit board on which a heat generating component is mounted and a member on the other side that receives heat, for example, a casing. It is known to intervene with materials. Since this type of fluid heat transfer material can follow and come into close contact with each facing surface, that is, the heat transfer surface, heat transfer is improved as compared with the case where there are minute gaps due to minute irregularities at the interface.
特開２０１５－２１１１４４号公報Japanese Unexamined Patent Publication No. 2015-21144
　上述した特許文献１に開示された電子回路装置では、回路基板に流動性伝熱材料を密着させ、且つケーシングに流動性伝熱材料を密着させるべく、回路基板にケーシングをネジ止めする必要があるために、回路基板を大きくして、ネジ止めするスペースを確保する必要があり、好ましくない。また、流動性伝熱材料を採用しているために、流動性伝熱材料を塗布する設備及び工程が必要になり、設備の増加やコスト面で好ましくない。 In the electronic circuit device disclosed in Patent Document 1 described above, it is necessary to screw the casing to the circuit board so that the fluid heat transfer material is brought into close contact with the circuit board and the fluid heat transfer material is brought into close contact with the casing. Therefore, it is necessary to enlarge the circuit board to secure a space for screwing, which is not preferable. Further, since the fluid heat transfer material is used, equipment and a process for applying the fluid heat transfer material are required, which is not preferable in terms of increase in equipment and cost.
　そして、本発明は、流動性伝熱材料を用いることなく、発熱部品から容易に放熱することが可能な電子回路装置を提供することを課題とする。 An object of the present invention is to provide an electronic circuit device capable of easily dissipating heat from heat generating parts without using a fluid heat transfer material.
　本発明の一実施形態に係る電子回路装置は、発熱部品が実装され、厚さ方向に貫通するスルーホールを有する回路基板と、前記スルーホールに挿入されるボス部を有する金属製の放熱体と、を備えることを特徴とする。 The electronic circuit device according to the embodiment of the present invention includes a circuit board on which a heat generating component is mounted and having a through hole penetrating in the thickness direction, and a metal radiator having a boss portion inserted into the through hole. , Is provided.
　本発明の一実施形態によれば、流動性伝熱材料を用いることなく、発熱部品から容易に放熱することができる。 According to one embodiment of the present invention, heat can be easily dissipated from heat generating parts without using a fluid heat transfer material.
本実施形態に係る電子回路装置を模式的に示した断面図。The cross-sectional view which shows typically the electronic circuit apparatus which concerns on this embodiment. 図１のＡ部拡大図。An enlarged view of part A in FIG. 図１のＢ部拡大図。FIG. 1 is an enlarged view of part B in FIG. 本実施形態に係る電子回路装置の斜視図。The perspective view of the electronic circuit apparatus which concerns on this embodiment. 本実施形態に係る電子回路装置の回路基板の斜視図。The perspective view of the circuit board of the electronic circuit apparatus which concerns on this embodiment. 本実施形態に係る電子回路装置の放熱体の斜視図。The perspective view of the radiator body of the electronic circuit apparatus which concerns on this embodiment. 本実施形態に係る電子回路装置を収容するハウジングの斜視図。The perspective view of the housing which accommodates the electronic circuit apparatus which concerns on this embodiment. 本実施形態に係る電子回路装置を車体に連結するブラケットの斜視図。The perspective view of the bracket which connects the electronic circuit apparatus which concerns on this embodiment to a vehicle body. ハウジングにブラケットを係合した状態の斜視図。The perspective view of the state where the bracket is engaged with the housing. 本実施形態に係る電子回路装置をハウジング内に収容した状態の斜視図。FIG. 3 is a perspective view of a state in which the electronic circuit device according to the present embodiment is housed in a housing. 本実施形態に係る電子回路装置を、ブラケットを介して車体に連結した状態を示す断面図。FIG. 5 is a cross-sectional view showing a state in which the electronic circuit device according to the present embodiment is connected to a vehicle body via a bracket.
　以下に、本実施形態に係る電子回路装置１を図１～図１１に基づいて詳細に説明する。
　図１～図５に示すように、本実施形態に係る電子回路装置１は、回路基板２が、ヒートシンクとなる金属製の放熱体３の上に載置されて構成されている。回路基板２には、発熱部品としての、発熱素子である半導体スイッチング素子（例えばＭＯＳ－ＦＥＴ）１０が複数表面実装されている。図１～図３に示すように、回路基板２は、例えば、４層の銅箔からなる第１～第４導電金属層４Ａ、４Ｂ、４Ｃ、４Ｄと、ガラスエポキシ樹脂等の第１～第３樹脂層５Ａ、５Ｂ、５Ｃとが交互に配置されてなる多層基板にて構成される。第１～第４導電金属層４Ａ～４Ｄには、電子部品の実装に必要なランド部、及び回路配線（パターン）が適宜に形成されている。 Hereinafter, the electronic circuit device 1 according to the present embodiment will be described in detail with reference to FIGS. 1 to 11.
As shown in FIGS. 1 to 5, the electronic circuit device 1 according to the present embodiment is configured such that a circuit board 2 is placed on a metal radiator body 3 serving as a heat sink. A plurality of semiconductor switching elements (for example, MOS-FETs) 10 which are heat generating elements are surface-mounted on the circuit board 2. As shown in FIGS. 1 to 3, the circuit board 2 includes, for example, first to fourth conductive metal layers 4A, 4B, 4C, and 4D made of four layers of copper foil, and first to first glass epoxy resins and the like. It is composed of a multilayer substrate in which three resin layers 5A, 5B, and 5C are alternately arranged. Land portions and circuit wirings (patterns) necessary for mounting electronic components are appropriately formed on the first to fourth conductive metal layers 4A to 4D.
　発熱部品（発熱素子）である半導体スイッチング素子１０は、回路基板２の第１導電金属層４Ａに形成されたランド部（図示せず）にリード端子が結線されて電気的に装着されている。第１導電金属層４Ａの、半導体スイッチング素子１０が接触する領域には、回路配線（パターン）等を避けるように受熱金属部８が形成される。図３を参照して、この領域には、第１導電金属層４Ａの受熱金属部８、第１樹脂層５Ａ、第２導電金属層４Ｂ、第２樹脂層５Ｂ、第３導電金属層４Ｃ、第３樹脂層５Ｃ、第４導電金属層４Ｄを貫通する第１スルーホール１１が複数形成されている。これらの第１スルーホール１１の内周面には、電解メッキ処理などによる金属層１２が設けられている。第４導電金属層４Ｄでは、第１スルーホール１１の周りをくり抜くようにパターンが形成され、第１スルーホール１１と絶縁されている。金属層１２を有する各第１スルーホール１１は、半導体スイッチング素子１０からの熱を、第１導電金属層４Ａの受熱金属部８から第３導電金属層４Ｃに導くために設けられている。要するに、各第１スルーホール１１が、半導体スイッチング素子１０から回路基板２の厚さ方向への伝熱経路となる。 The semiconductor switching element 10 which is a heat generating component (heating element) is electrically mounted with a lead terminal connected to a land portion (not shown) formed on the first conductive metal layer 4A of the circuit board 2. A heat receiving metal portion 8 is formed in a region of the first conductive metal layer 4A where the semiconductor switching element 10 is in contact so as to avoid circuit wiring (pattern) and the like. With reference to FIG. 3, in this region, the heat receiving metal portion 8 of the first conductive metal layer 4A, the first resin layer 5A, the second conductive metal layer 4B, the second resin layer 5B, the third conductive metal layer 4C, A plurality of first through holes 11 penetrating the third resin layer 5C and the fourth conductive metal layer 4D are formed. A metal layer 12 is provided on the inner peripheral surface of these first through holes 11 by electroplating or the like. In the fourth conductive metal layer 4D, a pattern is formed so as to hollow out around the first through hole 11 and is insulated from the first through hole 11. Each of the first through holes 11 having the metal layer 12 is provided to guide the heat from the semiconductor switching element 10 from the heat receiving metal portion 8 of the first conductive metal layer 4A to the third conductive metal layer 4C. In short, each first through hole 11 serves as a heat transfer path from the semiconductor switching element 10 in the thickness direction of the circuit board 2.
　また、図２、図４及び図５も参照して、半導体スイッチング素子１０の近傍には、回路基板２を貫通する第２スルーホール１４が複数形成される。詳しくは、回路基板２を構成する、第１～第４導電金属層４Ａ～４Ｄと、第１～第３樹脂層５Ａ～５Ｃと、を貫通する第２スルーホール１４が形成される。第２スルーホール１４の内周面には、電解メッキ処理などによる金属層１５が設けられている。第１～第３導電金属層４Ａ～４Ｃと、第２スルーホール１４の金属層１５との間は、樹脂層１７がそれぞれ介在することで絶縁されている。これにより、第２スルーホール１４は、半導体スイッチング素子１０の導電体部と絶縁されることになる。第４導電金属層４Ｄと、第２スルーホール１４の金属層１５との間は、第４導電金属層４Ｄのパターンにより接続されている。なお、上述しているように、第４導電金属層４Ｄは、第３樹脂層５Ｃが介在することで、第３導電金属層４Ｃと絶縁されている。 Further, with reference to FIGS. 2, 4 and 5, a plurality of second through holes 14 penetrating the circuit board 2 are formed in the vicinity of the semiconductor switching element 10. Specifically, the second through holes 14 penetrating the first to fourth conductive metal layers 4A to 4D and the first to third resin layers 5A to 5C constituting the circuit board 2 are formed. A metal layer 15 by electroplating or the like is provided on the inner peripheral surface of the second through hole 14. The first to third conductive metal layers 4A to 4C and the metal layer 15 of the second through hole 14 are insulated by interposing a resin layer 17, respectively. As a result, the second through hole 14 is insulated from the conductor portion of the semiconductor switching element 10. The fourth conductive metal layer 4D and the metal layer 15 of the second through hole 14 are connected by a pattern of the fourth conductive metal layer 4D. As described above, the fourth conductive metal layer 4D is insulated from the third conductive metal layer 4C by interposing the third resin layer 5C.
　図１、図４及び図６に示すように、放熱体３は、例えば熱伝導に優れたアルミニウム合金などの金属部材で形成されている。放熱体３は、直方体状部２０と、該直方体状部２０の一面から突設される複数のボス部２１と、を備えている。各ボス部２１は、円柱状であって、回路基板２に設けた各第２スルーホール１４にそれぞれ圧入される。直方体状部２０の、回路基板２の第４導電金属層４Ｄと対向する面は、凹凸のない略平面状に形成されている。直方体状部２０は、回路基板２の第４導電金属層４Ｄに対して、略全域に亘って当接されるように構成される。各ボス部２１の高さは、回路基板２の厚さと略一致する。各ボス部２１は、直方体状部２０の一面に圧入することで、直方体状部２０に一体的に接続される。また、放熱体３の直方体状部２０の他面には、本電子回路装置１を、後述するブラケット４０に固定するためのネジ孔２４、２４が間隔を開けて複数形成されている。 As shown in FIGS. 1, 4 and 6, the heat radiating body 3 is formed of a metal member such as an aluminum alloy having excellent heat conduction. The heat radiating body 3 includes a rectangular parallelepiped portion 20 and a plurality of boss portions 21 projecting from one surface of the rectangular parallelepiped portion 20. Each boss portion 21 has a columnar shape and is press-fitted into each of the second through holes 14 provided in the circuit board 2. The surface of the rectangular parallelepiped portion 20 facing the fourth conductive metal layer 4D of the circuit board 2 is formed in a substantially flat shape without unevenness. The rectangular parallelepiped portion 20 is configured to be in contact with the fourth conductive metal layer 4D of the circuit board 2 over substantially the entire area. The height of each boss portion 21 substantially matches the thickness of the circuit board 2. Each boss portion 21 is integrally connected to the rectangular parallelepiped portion 20 by press-fitting into one surface of the rectangular parallelepiped portion 20. Further, on the other surface of the rectangular parallelepiped portion 20 of the heat radiating body 3, a plurality of screw holes 24, 24 for fixing the electronic circuit device 1 to the bracket 40, which will be described later, are formed at intervals.
　そして、図１～図３を参照して、半導体スイッチング素子１０からの熱は、第１導電金属層４Ａの受熱金属部８から各第１スルーホール１１の金属層１２を経由して第３導電金属層４Ｃに導かれる。このとき、受熱金属層８と第３導電金属層４Ｃとは、各第１スルーホール１１の金属層１２により接続されているために伝熱性が良好となる。次に、第３導電金属層４Ｃの熱は、絶縁された第３樹脂層５Ｃを介して第４導電金属層４Ｄに導かれる。なお、第３樹脂層５Ｃは薄く（厚み方向の長さが短い）、第３導電金属層４Ｃと第４導電金属層４Ｄとは、第３樹脂層５Ｃを介して面状で当接されているために、伝熱性が良好となる。最終的に、第４導電金属層４Ｄの熱は、接続されているパターンを経由して第２スルーホール１４の金属層１５に導かれ、当該金属層１５から、放熱体３である、圧入（密着）されているボス部２１を経由して直方体状部２０に導かれて放熱される。このとき、第４導電金属層４Ｄと第２スルーホール１４の金属層１５とは、互いに金属同士で接続されており、また、当該金属層１５とボス部２１とは、互いに金属同士で面接触（面密着）しているために伝熱性が良好となる。なお、第４導電金属層４Ｄと、放熱体３の直方体状部２０との間には、直方体状部２０の対向面が凹凸のない略平面状に形成されているものの、回路基板２の反り等により微小な空隙が現出して密着されていない部位があるために、良好な伝熱効果を期待することができない。 Then, referring to FIGS. 1 to 3, the heat from the semiconductor switching element 10 is transferred from the heat receiving metal portion 8 of the first conductive metal layer 4A to the third conductive metal layer 12 of each first through hole 11. It is guided to the metal layer 4C. At this time, since the heat receiving metal layer 8 and the third conductive metal layer 4C are connected by the metal layer 12 of each first through hole 11, the heat transfer property is improved. Next, the heat of the third conductive metal layer 4C is guided to the fourth conductive metal layer 4D via the insulated third resin layer 5C. The third resin layer 5C is thin (the length in the thickness direction is short), and the third conductive metal layer 4C and the fourth conductive metal layer 4D are in contact with each other in a planar manner via the third resin layer 5C. Therefore, the heat transfer property is good. Finally, the heat of the fourth conductive metal layer 4D is guided to the metal layer 15 of the second through hole 14 via the connected pattern, and from the metal layer 15, the heat radiator 3 is press-fitted (press-fitted). It is guided to the rectangular parallelepiped portion 20 via the boss portion 21 (in close contact) and dissipates heat. At this time, the fourth conductive metal layer 4D and the metal layer 15 of the second through hole 14 are connected to each other by metals, and the metal layer 15 and the boss portion 21 are in surface contact with each other. The heat transfer property is good because it is in close contact with the surface. Although the facing surface of the rectangular parallelepiped portion 20 is formed between the fourth conductive metal layer 4D and the rectangular parallelepiped portion 20 of the heat radiating body 3 in a substantially flat shape without unevenness, the circuit board 2 is warped. Since there are some parts where minute voids appear and are not in close contact with each other due to such factors, a good heat transfer effect cannot be expected.
　図１０及び図１１を参照して、本実施形態に係る電子回路装置１は、ハウジング３０内に装着される。図７に示すように、ハウジング３０は、合成樹脂製にて一体成形される。ハウジング３０は、電子回路装置１を囲むように、略角筒状に形成される。詳しくは、ハウジング３０は、対向する一対の側壁部３１、３１と、電子回路装置１を放熱体３側から支持する一対の支持壁部３２、３２（図７では、手前の一方の支持壁部３２だけが図示されている）と、該一対の支持壁部３２、３２と対向して、電子回路装置１を各半導体スイッチング素子１０側から覆う被覆壁部３３と、から構成されている。一対の側壁部３１、３１の外面には、一対の係合壁部３４、３４が外方に向かって突設される。一対の係合壁部３４、３４は、電子回路装置１の厚さ方向に沿って延びている。一方、一対の側壁部３１、３１の内面には、内方に突設するストッパ壁部３５、３５がそれぞれ突設されている。各ストッパ壁部３５、３５は、ハウジング３０の長手方向に沿って延びている。一対のストッパ壁部３５、３５と、一対の支持壁部３２、３２との間の距離は、電子回路装置１の厚さと略一致している。 With reference to FIGS. 10 and 11, the electronic circuit device 1 according to the present embodiment is mounted in the housing 30. As shown in FIG. 7, the housing 30 is made of synthetic resin and integrally molded. The housing 30 is formed in a substantially square tube shape so as to surround the electronic circuit device 1. Specifically, the housing 30 has a pair of side wall portions 31 and 31 facing each other and a pair of support wall portions 32 and 32 that support the electronic circuit device 1 from the radiator 3 side (in FIG. 7, one of the front support wall portions 32 and 32). 32 is shown), and a covering wall portion 33 that faces the pair of support wall portions 32, 32 and covers the electronic circuit device 1 from each semiconductor switching element 10 side. A pair of engaging wall portions 34, 34 are projected outward from the outer surfaces of the pair of side wall portions 31, 31. The pair of engaging wall portions 34, 34 extend along the thickness direction of the electronic circuit device 1. On the other hand, on the inner surfaces of the pair of side wall portions 31, 31, stopper wall portions 35, 35 projecting inward are projected, respectively. The stopper wall portions 35, 35 extend along the longitudinal direction of the housing 30. The distance between the pair of stopper wall portions 35, 35 and the pair of support wall portions 32, 32 is substantially the same as the thickness of the electronic circuit device 1.
　図１１を参照して、ハウジング３０は、ブラケット４０により車体４３に連結されている。ブラケット４０は金属製である。図８に示すように、ブラケット４０は、車体４３側に固定される一対の車体側固定壁部４５、４５と、一対の車体側固定壁部４５、４５間に設けられ、電子回路装置１側に固定される一対の回路側固定壁部４６、４６と、一対の車体側固定壁部４５、４５の内側からそれぞれ立設される一対のハウジング側係合壁部４７、４７と、を備えている。車体側固定壁部４５には、取付孔４５Ａ、４５Ａがその長手方向に沿って間隔を置いてそれぞれ形成される。回路側固定壁部４６には、取付孔４６Ａ、４６Ａがその長手方向に沿って間隔を置いてそれぞれ形成される。 With reference to FIG. 11, the housing 30 is connected to the vehicle body 43 by the bracket 40. The bracket 40 is made of metal. As shown in FIG. 8, the bracket 40 is provided between the pair of vehicle body side fixed wall portions 45, 45 fixed to the vehicle body 43 side and the pair of vehicle body side fixed wall portions 45, 45, and is provided on the electronic circuit device 1 side. A pair of circuit-side fixed wall portions 46, 46 fixed to the vehicle, and a pair of housing-side engaging wall portions 47, 47 erected from the inside of the pair of vehicle body-side fixed wall portions 45, 45, respectively. There is. Mounting holes 45A and 45A are formed in the vehicle body side fixed wall portion 45 at intervals along the longitudinal direction thereof, respectively. Mounting holes 46A and 46A are formed in the circuit-side fixed wall portion 46 at intervals along the longitudinal direction thereof.
　そして、図９に示すように、ブラケット４０は、そのハウジング側係合壁部４７、４７が、ハウジング３０の一対の係合壁部３４、３４間に係合されることで、ハウジング３０に連結される。このように、ブラケット４０のハウジング側係合壁部４７が、ハウジング３０の一対の係合壁部３４、３４間に係合されると、ハウジング３０の一対の支持壁部３２、３２間に、ブラケット４０の一対の回路側固定壁部４６、４６がそれぞれ配置され、これらハウジング３０の一対の支持壁部３２、３２の被覆壁部３３側の面と、ブラケット４０の一対の回路側固定壁部４６、４６の被覆壁部３３側の面とが同一平面状に位置する。また、ブラケット４０の一対の車体側固定壁部４５、４５が、ハウジング３０の一対の側壁部３１、３１の外方に位置する。 Then, as shown in FIG. 9, the bracket 40 is connected to the housing 30 by engaging the housing-side engaging wall portions 47, 47 between the pair of engaging wall portions 34, 34 of the housing 30. Will be done. In this way, when the housing-side engaging wall portion 47 of the bracket 40 is engaged between the pair of engaging wall portions 34, 34 of the housing 30, the housing 30 is engaged between the pair of supporting wall portions 32, 32. A pair of circuit-side fixed wall portions 46, 46 of the bracket 40 are arranged, respectively, a surface of the housing 30 on the covering wall portion 33 side of the pair of support wall portions 32, 32, and a pair of circuit-side fixed wall portions of the bracket 40. The surfaces of 46 and 46 on the side of the covering wall portion 33 are located on the same plane. Further, the pair of vehicle body side fixed wall portions 45, 45 of the bracket 40 are located outside the pair of side wall portions 31, 31 of the housing 30.
　続いて、図１０に示すように、電子回路装置１を、ハウジング３０の一対の支持壁部３２、３２（ブラケット４０の一対の回路側固定壁部４６、４６）と、一対のストッパ壁部３５、３５との間に挿入するように配置する。この状態では、電子回路装置１の放熱体３が、ハウジング３０の一対の支持壁部３２、３２に当接すると共に、ブラケット４０の一対の回路側固定壁部４６、４６に当接する。続いて、図１１に示すように、ブラケット４０の一対の回路側固定壁部４６、４６に設けた各取付孔４６Ａ、４６Ａに、金属製の取付ネジ５０、５０を挿通して、該取付ネジ５０、５０を、電子回路装置１の放熱体３の各ネジ孔２４、２４に螺合する。その結果、このブラケット４０を電子回路装置１に固定することができる。 Subsequently, as shown in FIG. 10, the electronic circuit device 1 is provided with a pair of support wall portions 32, 32 (a pair of circuit-side fixed wall portions 46, 46 of the bracket 40) and a pair of stopper wall portions 35 of the housing 30. , 35 and so as to be inserted. In this state, the heat radiating body 3 of the electronic circuit device 1 comes into contact with the pair of support wall portions 32, 32 of the housing 30, and also comes into contact with the pair of circuit-side fixed wall portions 46, 46 of the bracket 40. Subsequently, as shown in FIG. 11, metal mounting screws 50, 50 are inserted into the mounting holes 46A, 46A provided in the pair of circuit-side fixed wall portions 46, 46 of the bracket 40, and the mounting screws are inserted. 50, 50 are screwed into the screw holes 24, 24 of the radiator body 3 of the electronic circuit device 1. As a result, the bracket 40 can be fixed to the electronic circuit device 1.
　続いて、図１１に示すように、ブラケット４０の一対の車体側固定壁部４５、４５に設けた各取付孔４５Ａ、４５Ａに、金属製の取付ネジ５１、５１を挿通して、該取付ネジ５１、５１を、車体４３側に設けた各ネジ孔６０、６０に螺合する。その結果、ブラケット４０を車体４３に固定することができる。これにより、ハウジング３０を含む電子回路装置１を、ブラケット４０を介して車体４３に連結することができる。そして、電子回路装置１の各半導体スイッチング素子１０からの熱は、上述したように放熱体３に導かれ、最終的に、放熱体３からの熱は、各取付ネジ５０、ブラケット４０及び各取付ネジ５１を介して車体４３に導かれる。 Subsequently, as shown in FIG. 11, metal mounting screws 51 and 51 are inserted into the mounting holes 45A and 45A provided in the pair of vehicle body side fixed wall portions 45 and 45 of the bracket 40, and the mounting screws are inserted. 51 and 51 are screwed into the screw holes 60 and 60 provided on the vehicle body 43 side. As a result, the bracket 40 can be fixed to the vehicle body 43. As a result, the electronic circuit device 1 including the housing 30 can be connected to the vehicle body 43 via the bracket 40. Then, the heat from each semiconductor switching element 10 of the electronic circuit device 1 is guided to the heat radiating body 3 as described above, and finally, the heat from the heat radiating body 3 is transferred to each mounting screw 50, the bracket 40, and each mounting. It is guided to the vehicle body 43 via the screw 51.
　以上説明したように、本実施形態に係る電子回路装置１では、発熱部品（発熱素子）である半導体スイッチング素子１０が実装され、厚さ方向に貫通する第２スルーホール１４を有する回路基板２と、第２スルーホール１４に挿入されるボス部２１を有する金属製の放熱体３と、を備えている。その結果、半導体スイッチング素子１０からの熱を、回路基板２を経由して放熱体３に導くことができる。これにより、本実施形態に係る電子回路装置１では、従来のような流動性伝熱材料を用いることなく、発熱部品（発熱素子）である半導体スイッチング素子１０から容易に放熱することができる。 As described above, in the electronic circuit device 1 according to the present embodiment, the semiconductor switching element 10 which is a heat generating component (heating element) is mounted, and the circuit board 2 has a second through hole 14 penetrating in the thickness direction. A metal radiator 3 having a boss portion 21 inserted into the second through hole 14 is provided. As a result, the heat from the semiconductor switching element 10 can be guided to the radiator 3 via the circuit board 2. As a result, in the electronic circuit device 1 according to the present embodiment, heat can be easily dissipated from the semiconductor switching element 10 which is a heat generating component (heat generating element) without using a conventional fluid heat transfer material.
　また、本実施形態に係る電子回路装置１では、第２スルーホール１４は、発熱部品である半導体スイッチング素子１０の近傍に配置されるので、発熱部品（発熱素子）である半導体スイッチング素子１０からの熱を容易に放熱体３に導くことができる。
　さらに、本実施形態に係る電子回路装置１では、当該電子回路装置１の放熱体３が、金属製のブラケット４０を介して車体４３側に連結されるので、放熱体３からの熱を容易に車体４３側に導くことができる。 Further, in the electronic circuit device 1 according to the present embodiment, since the second through hole 14 is arranged in the vicinity of the semiconductor switching element 10 which is a heat generating component, the semiconductor switching element 10 which is a heat generating component (heating element) is used. Heat can be easily directed to the radiator 3.
Further, in the electronic circuit device 1 according to the present embodiment, since the heat radiating body 3 of the electronic circuit device 1 is connected to the vehicle body 43 side via the metal bracket 40, heat from the heat radiating body 3 can be easily obtained. It can be guided to the vehicle body 43 side.
　以上説明した、本実施形態に基づく電子回路装置１として、例えば、以下に述べる態様のものが考えられる。
　第１の態様は、発熱部品（１０）が実装され、厚さ方向に貫通するスルーホール（１４）を有する回路基板（２）と、前記スルーホール（１４）に挿入されるボス部（２１）を有する金属製の放熱体（３）と、を備える。
　第２の態様は、第１の態様において、前記回路基板（２）は、前記発熱部品（１０）の近傍に前記スルーホール（１４）を設けて構成される。 As the electronic circuit device 1 based on the present embodiment described above, for example, the electronic circuit device 1 described below can be considered.
The first aspect is a circuit board (2) on which a heat generating component (10) is mounted and having a through hole (14) penetrating in the thickness direction, and a boss portion (21) inserted into the through hole (14). The metal radiator (3) having the above-mentioned is provided.
In the second aspect, in the first aspect, the circuit board (2) is configured by providing the through hole (14) in the vicinity of the heat generating component (10).
　第３の態様は、第１または第２の態様において、前記スルーホール（１４）は、前記発熱部品（１０）の導電体部と絶縁されている。
　第４の態様は、第１乃至第３いずれかの態様において、前記放熱体（３）が、金属製のブラケット（４０）を介して車体（４３）に連結される。
　第５の態様は、第１乃至第４いずれかの態様において、前記発熱部品（１０）は、発熱素子である。 In the third aspect, in the first or second aspect, the through hole (14) is insulated from the conductor portion of the heat generating component (10).
In the fourth aspect, in any one of the first to third aspects, the heat radiating body (3) is connected to the vehicle body (43) via a metal bracket (40).
In a fifth aspect, in any one of the first to fourth aspects, the heat generating component (10) is a heat generating element.
　尚、本発明は上記した実施形態に限定されるものではなく、様々な変形例が含まれる。例えば、上記した実施形態は本発明を分かりやすく説明するために詳細に説明したものであり、必ずしも説明した全ての構成を備えるものに限定されるものではない。また、ある実施形態の構成の一部を他の実施形態の構成に置き換えることが可能であり、また、ある実施形態の構成に他の実施形態の構成を加えることも可能である。また、各実施形態の構成の一部について、他の構成の追加・削除・置換をすることが可能である。 The present invention is not limited to the above-described embodiment, and includes various modifications. For example, the above-described embodiment has been described in detail in order to explain the present invention in an easy-to-understand manner, and is not necessarily limited to the one including all the described configurations. Further, it is possible to replace a part of the configuration of one embodiment with the configuration of another embodiment, and it is also possible to add the configuration of another embodiment to the configuration of one embodiment. Further, it is possible to add / delete / replace a part of the configuration of each embodiment with another configuration.
　本願は、２０１９年９月２５日付出願の日本国特許出願第２０１９－１７４３２３号に基づく優先権を主張する。２０１９年９月２５日付出願の日本国特許出願第２０１９－１７４３２３号の明細書、特許請求の範囲、図面、及び要約書を含む全開示内容は、参照により本願に全体として組み込まれる。 This application claims priority based on Japanese Patent Application No. 2019-174323 filed on September 25, 2019. The entire disclosure, including the specification, claims, drawings, and abstract of Japanese Patent Application No. 2019-174323 filed September 25, 2019, is incorporated herein by reference in its entirety.
　１　電子回路装置，２　回路基板，３　放熱体，４Ａ　第１導電金属層，４Ｂ　第２導電金属層，４Ｃ　第３導電金属層，４Ｄ　第４導電金属層，１０　半導体スイッチング素子（発熱部品、発熱素子），１４　第２スルーホール，２１　ボス部，４０　ブラケット　４３　車体 1 Electronic circuit device, 2 Circuit board, 3 Heat radiator, 4A 1st conductive metal layer, 4B 2nd conductive metal layer, 4C 3rd conductive metal layer, 4D 4th conductive metal layer, 10 Semiconductor switching elements (heat generating parts, heat generation) Element), 14 2nd through hole, 21 boss part, 40 bracket 43 body

Claims (5)

  1. 　電子回路装置であって、
    　前記電子回路装置は、
    　発熱部品が実装され、厚さ方向に貫通するスルーホールを有する回路基板と、
    　前記スルーホールに挿入されるボス部を有する金属製の放熱体と、を備えることを特徴とする電子回路装置。     It is an electronic circuit device
    The electronic circuit device is
    A circuit board on which heat-generating components are mounted and has through holes that penetrate in the thickness direction,
    An electronic circuit device including a metal radiator having a boss portion inserted into the through hole.
  2. 　請求項１に記載の電子回路装置であって、
    　前記回路基板は、前記発熱部品の近傍に前記スルーホールを設けて構成されることを特徴とする電子回路装置。     The electronic circuit device according to claim 1.
    The circuit board is an electronic circuit device characterized in that the through hole is provided in the vicinity of the heat generating component.
  3. 　請求項１または２に記載の電子回路装置であって、
    　前記スルーホールは、前記発熱部品の導電体部と絶縁されていることを特徴とする電子回路装置。     The electronic circuit device according to claim 1 or 2.
    The through hole is an electronic circuit device characterized in that it is insulated from a conductor portion of the heat generating component.
  4. 　請求項１乃至３いずれかに記載の電子回路装置であって、
    　前記放熱体が、金属製のブラケットを介して車体に連結されることを特徴とする電子回路装置。     The electronic circuit device according to any one of claims 1 to 3.
    An electronic circuit device characterized in that the radiator is connected to a vehicle body via a metal bracket.
  5. 　請求項１乃至４いずれかに記載の電子回路装置であって、
    　前記発熱部品は、発熱素子であることを特徴とする電子回路装置。     The electronic circuit device according to any one of claims 1 to 4.
    The heat generating component is an electronic circuit device characterized in that it is a heat generating element.
PCT/JP2020/033435 2019-09-25 2020-09-03 Electronic circuit device WO2021059914A1 (en)

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