JPH08222671A - Cooler for circuit module - Google Patents

Abstract

PURPOSE: To obtain a cooler for a circuit module in which heat can be dissipated efficiently from a semiconductor chip without being transmitted to a circuit board. CONSTITUTION: A circuit module comprises a circuit board 18 mounting a semiconductor chip 28. The circuit board has a hole 35 larger than the semiconductor chip and a thermally conductive heat dissipation member 41 is disposed on the rear 28b of the circuit board. The heat dissipation member has a protrusion 50 being fitted in the hole while coming into contact, on the contact face 50a thereof, with the rear 28b of the semiconductor chip. The contact face is larger than the rear of the semiconductor chip. A cover 42 is applied to the surface 28a of the circuit board. A rubber-like elastic body 58 is interposed between the cover and the semiconductor chip. The cover is coupled with the heat dissipation member by means of a screw 56 penetrating the circuit board thus sandwiching the semiconductor chip between the contact face and the rubber-like elastic body.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an apparatus for cooling a semiconductor chip which generates heat during operation in a circuit module having a circuit board having wiring and a semiconductor chip mounted on the circuit board. .

[0002]

2. Description of the Related Art Recent book-type or notebook-type portable computers are being made compact and highly functional. Therefore, even in the case of an LSI package mounted on a computer, the capacity and the number of functions are increasing. The increase in the capacity and the increase in the functions of the LSI package leads to the increase in the chip size and the increase in the number of pins, and the area occupied by the LSI package on the circuit board increases accordingly. In order to cope with the increase in the number of pins while suppressing the occupied area of the LSI package, it is necessary to miniaturize the lead pitch of the LSI package.

Recently, a TCP (tape carrier package) has been attracting attention as a compact package that can be adapted to a large number of pins. The TCP has a resin film having leads and a semiconductor chip supported by the resin film. In this TCP, the tips of the leads are led out to the outer peripheral edge of the resin film, and the tips of the leads are soldered to the connection pads on the circuit board.

By the way, in this type of TCP, the semiconductor chip is not molded with resin, and the semiconductor chip is exposed to the outside. Therefore, TCP uses P
Although mechanical strength is weaker than that of GA (pin grid array) and the amount of heat generated during operation is large, it is difficult to directly attach a heat sink having a large number of heat radiation fins. Therefore, when accommodating the heat-generating TCP together with the circuit board in the housing of the computer, it is important to reduce the thermal resistance of the TCP.

Japanese Patent Publication No. 5-52079 discloses a means for achieving a low thermal resistance of a semiconductor chip which generates a large amount of heat. In this prior art, an electronic device including a semiconductor chip is mounted on the surface of a circuit board. This circuit board has a relatively large through hole in a portion facing the electronic device.

A cooling plate is arranged on the back side of the circuit board. The cooling plate has a separate or integral convex portion that fits into the through hole. This protrusion is
It is made of a material having thermal conductivity such as copper or brass. The tip end surface of the convex portion is in contact with the back surface of the electronic device without a gap, and this contact allows heat of the electronic device to escape to the cooling plate through the convex portion.

[0007]

However, according to the above-mentioned prior art, since the convex portion of the cooling plate is in contact with the plating layer covering the inner surface of the through hole, the heat transferred from the electronic device to the convex portion is It is directly transmitted to the circuit board through the plating layer. Moreover, the through hole has a diameter much smaller than the planar shape of the electronic device, and most of the back surface of the electronic device is in contact with the front surface of the circuit board via the layer of solder or thermal compound.

Therefore, the heat of the electronic device is more and more easily transferred to the circuit board, and the heat of the electronic device tends to be trapped on the circuit board. Then, since many semiconductor chips and circuit components are mounted on this circuit board in addition to the electronic device that generates a large amount of heat, the heat of the electronic device is transmitted to these semiconductor chips and circuit components through the circuit board. I will end up. Therefore, there is a problem in that other semiconductor chips and circuit components located around the electronic device are greatly affected by heat.

Further, as described above, since the through hole has a diameter much smaller than the planar shape of the electronic device, the contact area between the convex portion and the electronic device is small, and the heat of the electronic device is efficiently transmitted to the convex portion. I can't communicate well. Therefore, although the heat conduction path from the electronic device to the cooling plate is formed, the heat dissipation effect of the electronic device becomes insufficient, and there is still room for improvement in reducing the thermal resistance of the electronic device. .

The present invention has been made under such circumstances, and the heat of the semiconductor chip can be efficiently released to the outside without being transferred to the circuit board, and the thermal resistance of the semiconductor chip can be reduced. An object is to provide a cooling device for a circuit module.

Another object of the present invention is to provide a cooling device for a circuit module in which a semiconductor chip can be grounded by utilizing a heat dissipation member while efficiently cooling the semiconductor chip and special grounding means can be omitted. It is in.

[0012]

To achieve the above object, a circuit module as claimed in claim 1 comprises a first surface having a connection pad and a second surface located opposite the first surface. And a semiconductor chip which is connected to the connection pads of the circuit board via leads and generates heat during operation.

The semiconductor chip has a first chip surface having a connecting portion for the lead and a second chip surface located opposite to the first chip surface. Is mounted on the circuit board in a posture in which the chip surface of the circuit board faces the first surface of the circuit board, and the circuit board has a hole having a larger opening shape than the semiconductor chip in a portion facing the semiconductor chip. A heat conductive heat dissipating member having a convex portion that enters the hole is disposed on a second surface of the circuit board opposite to the semiconductor chip, and the convex portion of the heat dissipating member is the semiconductor chip. Of the semiconductor chip including a flat contact surface that is in contact with the second chip surface of the semiconductor chip and has a larger area than the second chip surface of the semiconductor chip. For heat insulation between each part A cover is arranged on the first surface of the circuit board to form a gap and to cover the connection portion between the semiconductor chip and the lead and the connection pad, and between the cover and the first chip surface of the semiconductor chip. A rubber-like elastic body that is elastically deformable is disposed, and the cover and the heat dissipation member are coupled to each other via a fastening member that penetrates the circuit board in the thickness direction. It is characterized in that it is sandwiched between the contact surface of the section and the rubber-like elastic body.

According to a second aspect, the circuit board according to the first aspect has a ground wiring layer on the second surface thereof, and the heat dissipation member is made of a conductive metal material. The heat dissipation member is in contact with the ground wiring layer.

According to the third aspect, the rubber-like elastic body according to the first aspect has thermal conductivity, and the cover is made of a metallic material having thermal conductivity. Is characterized by.

According to a fourth aspect, the contact surface of the convex portion according to the first aspect and the second chip surface of the semiconductor chip are bonded to each other with a conductive adhesive. Is characterized by.

According to a fifth aspect of the present invention, the semiconductor chip according to the first aspect is supported by a flexible resin film having the leads. According to a sixth aspect, the heat dissipation member according to the first or third aspect is provided with a large number of cooling fins protruding toward the side opposite to the convex portion.

Further, in order to achieve the above-mentioned object, claim 7
The circuit module described in 1) includes a circuit board including a first surface having a connection pad and a second surface located opposite to the first surface, and a lead to the connection pad of the circuit board. And a semiconductor chip which is connected and generates heat during operation.

The semiconductor chip has a first chip surface having the lead connecting portion and a second chip surface located opposite to the first chip surface. Is mounted on the circuit board with its chip surface facing the first surface of the circuit board, and the circuit board has a hole having a larger opening shape than the semiconductor chip in the mounting portion of the semiconductor chip. , A plurality of fitting holes located around this hole, and a heat radiating member having heat conductivity is arranged on the second surface of the circuit board opposite to the semiconductor chip. The member has a convex portion that enters the hole and a plurality of legs that are press-fitted into the fitting hole, and the convex portion has a larger area than the second chip surface of the semiconductor chip. Contact the second chip surface of this semiconductor chip Has a flat contact surface that is, in and between the above hole and the convex portion of the heat radiating member and the circuit board, is characterized by forming the clearance for each heat shield.

According to claim 8, the circuit board according to claim 7 has a ground wiring layer on its second surface, and the heat dissipation member is made of a conductive metal material. The heat dissipation member is in contact with the ground wiring layer.

According to a ninth aspect, the contact surface of the convex portion according to the seventh aspect and the second chip surface of the semiconductor chip are bonded to each other via a conductive adhesive. Is characterized by.

According to a tenth aspect, the above-mentioned claim 7 or 9
The heat dissipation member described in (1) is characterized in that it is provided with a large number of cooling fins that project toward the side opposite to the convex portion. According to claim 11, the circuit board according to claim 7 has a multi-layer structure in which a plurality of wiring layers and insulating layers are alternately stacked, and the fitting hole of the circuit board has the above-mentioned structure. It is characterized in that it is arranged between the connection pad and the hole.

According to claim 12, the circuit board according to claim 7 has a ground wiring layer covered with an insulating layer, and the inner surface of the fitting hole is electrically connected to the ground wiring layer. The heat dissipation member is covered with a conductive layer connected thereto, and the heat dissipation member is made of a conductive metal material, and the legs of the heat dissipation member are pressed against the conductive layer.

According to a thirteenth aspect, a cover is disposed on the first surface of the circuit board according to the seventh aspect for covering the semiconductor chip and the connecting portion between the lead and the connection pad. There is.

According to a fourteenth aspect, the cover according to the thirteenth aspect is made of a metal material having thermal conductivity,
Between this cover and the first chip surface of the semiconductor chip,
It is characterized in that a heat transfer sheet made of a rubber-like elastic material is arranged.

In order to achieve the above-mentioned other object, a circuit module according to a fifteenth aspect is provided with a first surface having a connection pad and a ground wiring layer which is located on the opposite side of the first surface. And a semiconductor chip that is connected to the connection pads of the circuit board via leads and that generates heat during operation.

The semiconductor chip has a first chip surface having the lead connecting portion and a second chip surface located opposite to the first chip surface. Is mounted on the circuit board in a posture in which the chip surface of the circuit board faces the first surface of the circuit board, and the circuit board has a hole having a larger opening shape than the semiconductor chip in a portion facing the semiconductor chip. And a heat dissipating member having thermal conductivity and conductivity is housed in the hole, and the heat dissipating member has a larger area than the second chip surface of the semiconductor chip and has a second surface of the semiconductor chip. A flat contact surface that comes into contact with the chip surface, and a flat heat dissipation surface that is substantially flush with the second surface of the circuit board,
A conductive film formed by reflowing solder paste is applied to the second surface of the circuit board including the heat dissipation surface of the heat dissipation member, and the ground wiring layer and the heat dissipation member are electrically connected via the conductive film. It is characterized by being connected to.

According to a sixteenth aspect, the contact surface of the heat dissipation member according to the fifteenth aspect and the second chip surface of the semiconductor chip are adhered to each other via a conductive adhesive. Is characterized by.

According to a seventeenth aspect, the heat dissipation member according to the fifteenth aspect is adhered to the inner peripheral surface of the hole through an electrically insulating adhesive having a large thermal resistance. .

To achieve the above object, a circuit module according to a eighteenth aspect of the invention is connected to a circuit board including a chip mounting surface having a connection pad and a connection pad of the circuit board through a lead, and is in operation. And a semiconductor chip that generates heat.

The semiconductor chip has a first chip surface having the lead connecting portion and a second chip surface located on the side opposite to the first chip surface. Of the semiconductor chip and the leads and the connection pads are mounted on the circuit board with the chip surface of the circuit board facing in a direction opposite to the chip mounting surface of the circuit board. A heat-conducting heat-dissipating member that covers the connection portion is attached, and the heat-dissipating member and the second chip surface of the semiconductor chip are bonded to each other via an adhesive having heat-conductivity, and the chip mounting surface of the circuit board Between the first chip surface of the semiconductor chip and
During the period until the adhesive is cured, a pressing member that presses the semiconductor chip toward the heat dissipation member is interposed,
Further, the circuit board is characterized by having a through hole in a portion facing the semiconductor chip for taking out the pressing member from between the semiconductor chip and the circuit board after the adhesive is cured. .

According to a nineteenth aspect, the circuit board according to the eighteenth aspect has a ground wiring layer, and the heat dissipation member is made of a conductive metal material. The ground wiring layer is electrically connected. According to a twentieth aspect, the heat dissipation member according to the eighteenth aspect is provided with a large number of cooling fins.

[0033]

According to the structure of the first aspect, the semiconductor chip is mounted on the circuit board in a so-called face-up posture in which the first chip surface where the leads are connected faces the direction opposite to the circuit board. Then, when the semiconductor chip generates heat due to the operation of the semiconductor chip, the heat of the semiconductor chip is released to the heat dissipation member from the second chip surface through the convex portion. In this case, since there is no lead connecting portion on the second chip surface of the semiconductor chip that is in contact with the contact surface of the convex portion,
Every corner of the chip surface can be used as a flat heat conducting surface. At the same time, since the contact surface of the convex portion has a larger area than the second chip surface of the semiconductor chip, the heat of the semiconductor chip is transferred from the entire second chip surface to the convex portion.

Moreover, since the semiconductor chip is sandwiched between the contact surface of the convex portion and the rubber-like elastic body, the second chip surface of the semiconductor chip can be pressed against the contact surface without a gap. Therefore, the contact state between the semiconductor chip and the contact surface becomes good. Therefore, in addition to increasing the contact area between the semiconductor chip and the convex portion, the heat of the semiconductor chip can be efficiently transferred to the heat dissipation member.

Further, according to the above structure, since there is a gap between the convex portion and the hole of the circuit board and between the heat dissipation member and the circuit board, the air in this gap functions as a heat insulating layer. Therefore, it becomes difficult for the heat of the semiconductor chip transferred to the convex portions and the heat dissipation member to be directly transferred to the circuit board, and it is possible to prevent heat from being trapped inside the circuit board.

According to the structure of claim 2, when the semiconductor chip is sandwiched between the contact surface of the convex portion and the rubber-like elastic body, the semiconductor chip causes the ground wiring layer of the circuit board via the convex portion and the heat dissipation member. Electrically connected to. Therefore, the semiconductor chip is grounded at the same time when the heat dissipation member and the cover are attached to the circuit board, so that special grounding work can be omitted.

According to the third aspect of the invention, since the rubber-like elastic body and the cover both have thermal conductivity, the first chip surface of the semiconductor chip and the cover are thermally connected. Therefore, the heat of the semiconductor chip is released from the first chip surface through the rubber-like elastic body to the cover, and the heat can be radiated from both the first and second chip surfaces of the semiconductor chip.

According to the structure of claim 4, the second chip surface of the semiconductor chip is firmly and closely contacted with the contact surface of the convex portion without a gap, and the heat of the semiconductor chip can be efficiently released to the convex portion.

According to the structure of claim 5, the circuit board generally has poor dimensional accuracy, and in particular, the thickness dimension thereof tends to vary. Therefore, when the heat dissipation member is attached to the second surface of the circuit board, the contact surface of the convex portion of the heat dissipation member is the first surface of the circuit board.
There is a possibility that the position of the semiconductor chip with respect to the circuit board may fluctuate in the thickness direction of the circuit board due to the fact that the position of the semiconductor chip may largely protrude from the surface of the circuit board or may be retracted inside the hole. However,
Since the resin film that supports the semiconductor chip is flexible and elastically deformable, when the position of the contact surface with respect to the first surface of the circuit board changes, the resin film deforms,
Absorb variations in thickness of circuit boards. for that reason,
It is possible to prevent peeling and disconnection of the lead in advance, without applying unreasonable force to the connecting portion between the semiconductor chip and the lead and the connecting portion between the lead and the connecting pad.

According to the structure of claim 6, the presence of the cooling fins increases the heat radiation area of the heat radiation member. For this reason,
The heat dissipation of the heat dissipation member is improved, and the heat of the semiconductor chip can be efficiently released to the outside.

According to the seventh aspect of the invention, the heat radiating member is fixed to the circuit board by being press-fitted into the fitting hole of the circuit board, so that the heat radiating member is fixed to the circuit board. No special screws are required. In addition, the semiconductor chip is mounted on the circuit board in a so-called face-up posture in which the first chip surface where the leads are connected faces the direction opposite to the circuit board. Therefore, when the heat dissipating member is fixed to the circuit board, the contact surface of the protrusion contacts the second chip surface of the semiconductor chip. Then, when the semiconductor chip generates heat due to the operation of the semiconductor chip, the heat of the semiconductor chip is released to the heat dissipation member from the contact surface through the convex portion. In this case, since the lead connecting portion does not exist on the second chip surface of the semiconductor chip in contact with the contact surface, every corner of the second chip surface can be used as a flat heat conducting surface. Moreover, since the contact surface of the convex portion has a larger area than the second chip surface of the semiconductor chip, the heat of the semiconductor chip is transferred to the convex portion from the entire surface of the second chip surface.

Further, since there is a gap between the convex portion and the hole of the circuit board and between the heat dissipation member and the circuit board, the air in the gap functions as a heat insulating layer. Therefore, the heat of the semiconductor chip transmitted to the convex portion and the heat dissipation member is
It becomes difficult for the heat to be directly transmitted to the circuit board, and heat can be prevented from being trapped inside the circuit board.

According to the structure of claim 8, when the leg portion of the heat dissipation member is press-fitted into the fitting hole of the circuit board, the semiconductor chip is electrically connected to the ground wiring layer of the circuit board through the projection and the heat dissipation member. It Therefore, the semiconductor chip is grounded at the same time when the heat dissipation member is attached to the circuit board, and no special grounding work is required.

According to the ninth aspect of the invention, the second chip surface of the semiconductor chip is firmly brought into close contact with the contact surface of the convex portion without a gap, and the heat of the semiconductor chip can be efficiently released to the convex portion.

According to the structure of claim 10, the presence of the cooling fin increases the heat dissipation area of the heat dissipation member. Therefore, the heat dissipation of the heat dissipation member is improved, and the heat of the semiconductor chip can be efficiently dissipated to the outside.

According to the structure of the eleventh aspect, the region of the circuit board between the connection pad and the hole faces the lead, and normally there is no wiring layer in this region. The fitting hole can be formed in the circuit board without receiving it. On the contrary, since there is no fitting hole around the outer periphery of the connection pad, the degree of freedom in arranging the wiring layer on the circuit board increases.

According to the twelfth aspect, when the leg portion of the heat dissipation member is press-fitted into the fitting hole, the leg portion electrically contacts the conductive layer, and the semiconductor chip has the circuit board via the leg portion and the conductive layer. Is electrically connected to the ground wiring layer. Therefore, the semiconductor chip is grounded at the same time when the heat dissipation member is attached to the circuit board, and no special grounding work is required.

According to the thirteenth aspect, since the cover bears an impact from the outside, it is possible to sufficiently secure the impact resistance performance of the bare semiconductor chip having a weak mechanical strength.
According to the structure of claim 14, since the first chip surface of the semiconductor chip and the cover are thermally connected via the heat transfer sheet, the heat of the semiconductor chip can be released from the first chip surface to the cover. Therefore, heat can be radiated from both the first and second chip surfaces of this semiconductor chip. Moreover, when an external impact is applied to the cover, the impact can be received by the heat transfer sheet, and the impact is absorbed and relaxed by the deformation of the heat transfer sheet. Therefore, no impact is directly applied to the semiconductor chip, and the impact resistance performance of the semiconductor chip can be sufficiently secured.

According to the structure of the fifteenth aspect, the semiconductor chip is mounted on the circuit board in a so-called face-up posture in which the first chip surface where the leads are continuous faces the direction opposite to the circuit board. And with the operation of the semiconductor chip,
When this semiconductor chip generates heat, the heat of the semiconductor chip becomes
The heat dissipation member escapes from the contact surface. In this case, since the lead connecting portion does not exist on the second chip surface of the semiconductor chip in contact with the contact surface, every corner of the second chip surface can be used as a flat heat conducting surface. Moreover, since the contact surface of the heat dissipation member has a larger area than the second chip surface of the semiconductor chip, the heat of the semiconductor chip is transferred to the convex portion from the entire surface of the second chip surface. Therefore, the heat of the semiconductor chip can be efficiently transmitted to the heat dissipation member, and the heat dissipation effect of the semiconductor chip is improved.

The conductive coating is melted by heating the solder paste supplied to the second surface of the circuit board,
Since it is obtained by curing the melted solder, the second surface of the circuit board including the heat dissipation surface of the heat dissipation member becomes a smooth surface without unevenness. Therefore, a heat sink for heat dissipation can be easily attached to the heat dissipation surface of the heat dissipation member,
This is convenient for improving the heat dissipation of the heat dissipation member.

Moreover, since the heat dissipation member and the ground wiring layer are electrically connected by the conductive film, this heat dissipation member can be used as a part of the ground circuit of the semiconductor chip, and a special member for grounding. Is unnecessary.

According to the sixteenth aspect, the second chip surface of the semiconductor chip is firmly brought into close contact with the contact surface of the heat dissipation member without a gap, and the heat of the semiconductor chip can be efficiently released to the heat dissipation member.

According to the seventeenth aspect, the adhesive for fixing the heat dissipation member to the inner peripheral surface of the hole functions as a kind of heat insulating layer, so that the heat of the semiconductor chip transferred to the heat dissipation member is transferred to the circuit board. Can be prevented, and heat is less likely to be trapped inside the circuit board.

According to the structure of the eighteenth aspect, the semiconductor chip is mounted on the circuit board in a so-called face-down posture in which the first chip surface where the leads are connected faces the chip mounting surface of the circuit board. When the semiconductor chip generates heat due to the operation of the semiconductor chip, the heat of the semiconductor chip is released to the heat dissipation member through the second chip surface opposite to the circuit board. Since the second chip surface of this semiconductor chip and the heat dissipation member are bonded together via a heat conductive adhesive, there is a gap between the second chip surface and the heat dissipation member that hinders heat conduction. The heat of the semiconductor chip can be efficiently released to the heat dissipation member without being generated. Therefore, even when the semiconductor chip is mounted face down on the circuit board, a sufficient heat dissipation path can be secured on the side of the semiconductor chip opposite to the circuit board.

When the semiconductor chip is mounted face down on the circuit board, a gap is created between the first chip surface of the semiconductor chip and the chip mounting surface of the circuit board. Therefore, the semiconductor chip may be easily peeled off from the heat dissipation member or may be displaced by the time the adhesive is cured, and the posture of the semiconductor chip may change.

However, according to the above structure, since the semiconductor chip is pressed by the heat dissipation member via the pressing member until the adhesive is cured, the change in the attitude of the semiconductor chip can be suppressed. Therefore, the second chip surface of the semiconductor chip can be reliably bonded to the heat dissipation member, and the heat of the semiconductor chip can be efficiently transferred to the heat dissipation member.

Moreover, since the pressing member is removed from between the semiconductor chip and the circuit board through the through hole of the circuit board after the adhesive is hardened, the heat of the semiconductor chip is transferred to the circuit board through the pressing member. There is no. At the same time, when the pressing member is taken out, a gap is created between the first chip surface of the semiconductor chip and the circuit board. This gap serves as a kind of heat insulating space, and the radiant heat of the semiconductor chip is directly transmitted to the circuit board. It will be difficult.

Moreover, since the gap is continuous with the through hole, the radiant heat of the semiconductor chip can be released to the outside through the through hole. Therefore, the heat of the semiconductor chip is less likely to be trapped between the heat dissipation member and the circuit board, and the heat effect on the circuit board can be suppressed as much as possible, in addition to the fact that the gap serves as a heat insulating space.

According to the structure of the nineteenth aspect, when the heat dissipation member is attached to the chip mounting surface of the circuit board, the semiconductor chip is electrically connected to the ground wiring layer of the circuit board through the heat dissipation member, and this semiconductor chip is exceptional. It is possible to omit a complicated grounding work.

According to the twentieth aspect, since the heat radiation area of the heat radiation member increases due to the presence of the cooling fins, a sufficient heat radiation path can be secured on the side of the semiconductor chip opposite to the circuit board. Therefore, the heat dissipation of the heat dissipation member is improved, and the heat of the semiconductor chip can be efficiently dissipated to the outside from the side opposite to the circuit board.

[0061]

DESCRIPTION OF THE PREFERRED EMBODIMENTS A first embodiment of the present invention will be described below with reference to FIGS. 1 to 7 applied to a book type portable computer. FIG. 5 shows an A4 size book-type portable computer 1. This computer 1
Includes a casing 2 having a rectangular box shape and a flat panel type display unit 3 supported by the casing 2. The housing 2 is divided into a lower housing 4 and an upper housing 5. The lower housing 4 and the upper housing 5 are made of a synthetic resin material such as ABS resin.

The housing 2 has a bottom wall 6a, an upper wall 6b, and four side walls 6c connected to both the walls 6a and 6b. A keyboard 8 is provided on the front half of the upper wall 6b of the housing 2.
Is arranged. A hollow convex portion 9 is arranged at the rear end of the upper wall 6b. The convex portion 9 extends in the width direction of the housing 2, and display supporting portions 10a and 10b are formed at both left and right ends of the convex portion 9.

The display unit 3 is provided with a flat box-shaped housing 12 and a liquid crystal display 13 housed inside the housing 12. The housing 12 has a pair of pivot support legs 14a and 14b. The pivot support legs 14a and 14b are rotatably supported by the display support portions 10a and 10b via hinge devices (not shown).

As shown in FIG. 7, a frame 16 is housed inside the lower housing 4. Frame 16
Is a first support 17 for supporting a hard disk drive or a floppy disk drive (not shown) and a second support 19 for supporting the circuit module 11 according to the present invention.
Are integrally provided. The frame 16 is made of a magnesium alloy or an aluminum alloy having heat conductivity, and has a size that fits tightly inside the lower housing 4.

Further, as shown in FIG. 6, a shield plate 15 made of metal is attached to the second supporting portion 19 of the frame 16. The shield plate 15 is the circuit module 1
1 and the upper wall 6b of the housing 2 are interposed, and the circuit module 11 is hidden from above.

The circuit module 11 has a rectangular circuit board 18. The circuit board 18 is
The front surface 18a that is the first surface and the back surface 18 that is the second surface
b. As shown in FIG. 4, the circuit board 18 is supported by the second support portion 19 in a posture parallel to the bottom wall 6a and the top wall 6b of the housing 2. The second support portion 19 has a wall portion 20 facing the right end portion of the back surface 18b of the circuit board 18.

As shown in FIG. 1, the circuit board 18 has a multi-layer structure in which a plurality of signal wiring layers 21 and insulating layers 22 are alternately laminated. One of the signal wiring layers 21 is a circuit board. 18 is arranged on the surface 18a. A ground wiring layer 23 is arranged on the back surface 18b of the circuit board 18.

The front surface 18a and the back surface 18 of the circuit board 18
A plurality of connectors 24 and a plurality of quad flat packages (QFPs) 25 as an LSI package are mounted on each of b. A TCP (tape carrier package) 26 is mounted on the right end of the surface 18 a of the circuit board 18. The TCP 26 has an extremely large amount of heat generation during operation because of the speeding up and the increasing capacity associated with the demand for the increased use of the functions of the computer 1.

As shown in FIGS. 1 and 3, the TCP 26 is
A carrier 27 made of a flexible resin film and a semiconductor chip 28 supported by the carrier 27 are provided. The carrier 27 has four edges 27 that are orthogonal to each other.
It has a rectangular frame shape having a to 27d. A large number of leads 30 made of copper foil are formed on the carrier 27 by etching. The tips of these leads 30 are led out from the edge portions 27 a to 27 d of the carrier 27.

The semiconductor chip 28 has a front surface 28a and a back surface 2
8b and has a substantially square shape. A plurality of bumps 31 are formed on the outer peripheral portion of the surface 28a of the semiconductor chip 28, and the base ends of the leads 30 are bonded to these bumps 31. Therefore, in the case of the present embodiment, the surface 28a has the first portion having the connecting portion of the lead 30.
It is the chip surface of this, and this lead 30 and bump 31
The connection portion with and is sealed with potting resin 32. The potting resin 32 is used for the semiconductor chip 2
8 is located on the surface 28a.

The back surface 28b of the semiconductor chip 28 is
Without being covered by the potting resin 32,
It is exposed to the outside as it is. This semiconductor chip 28
Conductive plating is applied to the entire back surface 28b.

As shown in FIG. 1, such a TCP 26 has a surface 2 of a semiconductor chip 28 on which the leads 30 are connected.
8a is mounted on the circuit board 18 in a so-called face-up posture with the circuit board 18 facing away from the circuit board 18.
Therefore, the back surface 28b of the semiconductor chip 28 faces the front surface 28a of the circuit board 28.
Is the second chip surface located on the side opposite to the connecting portion of the lead 30.

The tips of the leads 30 are soldered to the connection pads 33 of the circuit board 18. The connection pads 33 are arranged on the surface 18a of the circuit board 18 along the edges 27a to 27d of the carrier 27. These connection pads 33 are electrically connected to desired signal wiring layers 21 of the circuit board 18.

As shown in FIG. 3, the circuit board 18 is provided at the mounting portion of the TCP 26 and has a square hole 35. The hole 35 faces the semiconductor chip 28 and is located in a portion surrounded by the connection pad 33. The hole 35 has a similar shape to the semiconductor chip 28 and has an opening area larger than the planar shape of the semiconductor chip 28.

As shown in FIG. 1, the signal wiring layer 21 of the circuit board 18 does not exist in the mounting area of the TCP 26, and the mounting area of the TCP 26 of the circuit board 18 is only the insulating layer 22. ing. Therefore, the hole 35
Are formed on the insulating layer 22.

A radiator 40 is attached to the portion where the TCP 26 is mounted on the circuit board 18. The radiator 40 is
The heat dissipation member 41 arranged on the back surface 18b of the circuit board 18.
And a cover 42 arranged on the surface 18a of the circuit board 18.
And the heat dissipating member 41 and the cover 42.
Cooperate with each other to sandwich the circuit board 18.

The heat dissipating member 41 is made of a metal material such as aluminum alloy, which has excellent thermal conductivity and conductivity. The heat dissipation member 41 has the hole 35.
It has a flat rectangular plate shape having a plane shape much larger than that. The heat dissipation member 41 includes a flat upper surface 41 a facing the back surface 18 b of the circuit board 18, and a top surface 4 a.
It has a flat lower surface 41b that is parallel to 1a.

Boss portions 44 each having a screw hole 43 are integrally formed at four corners of the upper surface 41a.
Each boss portion 44 has a flat support surface 44a in which the screw hole 43 is opened. These supporting surfaces 44a are located on the same plane, and the back surfaces 18 of the circuit board 18 are respectively arranged.
It is in surface contact with b.

Further, the circuit board 18 has a plurality of mounting holes 45 at the contact portion with the boss portion 44. The mounting holes 45 are arranged outside the mounting area of the TCP 26, and the mounting holes 45 are connected to the screw holes 43.

At the center of the upper surface 41a of the heat dissipation member 41,
A seat 47 is provided so as to project. The seat portion 47 has a flat seat surface 47a facing the hole 35.
Has an area larger than the opening area of the hole 35.
The seat surface 47a is the support surface 44a of the boss 44.
And the outer peripheral portion of the seat surface 47a is in contact with the back surface 18b of the circuit board 18. Therefore, the heat dissipation member 41 closes the hole 35 from the direction of the back surface 18b of the circuit board 18.

In this case, the ground wiring layer 23 on the back surface 18b of the circuit board 18 has holes 35 as shown in FIG. 1 and FIG.
Is located at the peripheral edge of the opening of the ground wiring layer 2
The seat surface 47 a of the seat portion 47 is in contact with 3. When the heat dissipation member 41 is placed on the back surface 18b of the circuit board 18, the upper surface 41a of the heat dissipation member 41 has a boss 4a.
4 and the seat portion 47 are separated from the rear surface 18b of the circuit board 18 by the protruding height.
A first gap 48 is formed between the first gap 48 and 1a.

A convex portion 50 is integrally provided at the center of the seat surface 47a. The convex portion 50 enters the inside of the hole 35. A second gap 51 continuous in the circumferential direction is formed between the outer peripheral surface of the convex portion 50 and the inner peripheral surface of the hole 35.

The tip of the protrusion 50 forms a flat contact surface 50a. The contact surface 50a is exposed on the surface 18a of the circuit board 18 through the hole 35. The contact surface 50a has a larger area than the back surface 28b of the semiconductor chip 28 and is flush with the front surface 18a of the circuit board 18. The term “flush” means that some irregularities are included due to manufacturing errors, and it does not matter if the contact surface 50a slightly projects from the surface 18a or is slightly recessed.

In the case of this embodiment, the convex portion 50
The back surface 28b of the semiconductor chip 28 is adhered to the contact surface 50a of the semiconductor chip 28 without a gap via a conductive adhesive 52 as a die attach material.

On the other hand, the cover 42 has the heat dissipation member 4
A substantially square panel 53 having substantially the same size as 1.
A support frame 54 made of synthetic resin is attached to the lower surface of the panel 53. The panel 53 is made of, for example, a metal material having excellent thermal conductivity such as an aluminum alloy, and the central portion of the lower surface of the panel 53 faces the surface 28a of the semiconductor chip 28. The support frame 54 extends along the peripheral edge of the panel 53.
The connection portion between the lead 30 of the CP 26 and the connection pad 33 is surrounded.

The panel 53 has insertion holes 55 at its four corners. The insertion hole 55 is located outside the mounting area of the TCP 26, and is connected to the screw hole 43 of the heat dissipation member 41 via the mounting hole 45 of the circuit board 18.

A screw 56 as a tightening member is inserted through each insertion hole 55. The screw 56 is attached to the mounting hole 4
5, the circuit board 18 is penetrated through in the thickness direction, and the tip end thereof is screwed into the screw hole 43. By this screwing, the cover 42 and the heat dissipation member 41 are tightened in the direction in which they are close to each other to sandwich the circuit board 18, and the TCP 26 is housed between the cover 42 and the heat dissipation member 41. .

Further, a soft heat transfer sheet 58 is arranged between the panel 53 and the surface 28a of the semiconductor chip 28. The heat transfer sheet 58 is a rubber-like elastic body formed by adding alumina to a silicone resin, for example, and has thermal conductivity. The heat transfer sheet 58 is sandwiched between the panel 53 and the surface 28a of the semiconductor chip 28 by tightening the screws 56, and thermally connects the panel 53 and the semiconductor chip 28. There is.

As shown in FIG. 4, the heat dissipating member 41 of the heat dissipator 40 is located right above the wall portion 20 of the frame 16. A seat 60 is integrally formed on the upper surface of the wall 20 so as to project therefrom. As shown in FIG. 6, the seat portion 60 has a flat seat surface 60a, and the lower surface 41b of the heat dissipation member 41 is in contact with the seat surface 60a. The seat 60 and the heat dissipation member 4
The contact portion with 1 is located directly below the semiconductor chip 28. Further, the cover 42 of the radiator 40 is located directly below the shield plate 15. This cover 42
Also has a function of protecting the TCP 26 from an impact.

In such a configuration, the computer 1
During the operation, the semiconductor chip 28 of the TCP 26 generates heat. In this case, a radiator 40 that sandwiches the TCP 26 is attached to the circuit board 18 on which the TCP 26 is mounted, and the radiator member 41 of the radiator 40 is the circuit board 18.
It has a convex portion 50 that enters into the hole 35. This convex part 5
The contact surface 50a at the tip of 0 is the surface 18a of the circuit board 18.
Exposed flush with the semiconductor chip 2 on the contact surface 50a.
The back surface 28b of No. 8 is adhered via a heat conductive adhesive 52.

From this, the heat of the semiconductor chip 28 is
It escapes from the contact surface 50a to the heat dissipation member 41 through the convex portion 50, and a heat conduction path is formed so as to be directly connected to the heat dissipation member 41 from the semiconductor chip 28.

According to the above construction, the contact surface 50a
The back surface 28b of the semiconductor chip 28 contacting the
Since there are no 0 connecting portions, every corner of the back surface 28b can be used as a flat heat conducting surface. At the same time, the contact surface 50a of the convex portion 50 is
8 has a larger area than the back surface 28b of the semiconductor chip 28, the heat of the semiconductor chip 28 is transferred to the protrusion 50 from the entire back surface 28b.

At this time, since the heat dissipation member 41 cooperates with the cover 42 to sandwich the circuit board 18, the semiconductor chip 28 is interposed between the contact surface 50a of the heat dissipation member 41 and the heat transfer sheet 58. It is included. Therefore, the semiconductor chip 2
The back surface 28b of the semiconductor chip 8 receives the force of being pressed against the contact surface 50a of the convex portion 50, and the semiconductor chip 28 and the contact surface 50a.
The contact state with a becomes good.

In particular, in this embodiment, since the semiconductor chip 28 and the convex portion 50 are adhered to each other via the conductive adhesive 52, the contact portions between them may be displaced or the heat conduction may be hindered. Such a gap does not occur, and heat can be efficiently conducted from the semiconductor chip 28 to the heat dissipation member 41.

Moreover, since the heat dissipation member 41 is in surface contact with the seat portion 60 of the metal frame 16, the heat dissipation member 4 is
The heat transmitted to the No. 1 is transmitted to the frame 16 through the seat portion 60 and diffused over a wide range of the frame 16.

Therefore, even in the TCP 26, which has conventionally been difficult to cool by a general radiation fin, the heat of the semiconductor chip 28 can be efficiently dissipated to the outside.
It is possible to reduce the thermal resistance of the TCP 26.

Further, the heat transfer sheet 58 in contact with the surface 28a of the semiconductor chip 28 and the panel 53 of the cover 42.
Since both have thermal conductivity, the heat of the semiconductor chip 28 is also diffused to the panel 53 via the heat transfer sheet 58, and the heat dissipation path is also provided on the side of the semiconductor chip 28 opposite to the circuit board 18. Can be secured. Therefore, the heat of the semiconductor chip 28 is applied to the front surface 2 as well as the back surface 28b.
It can be escaped from 8a to the outside, and the heat dissipation effect of the TCP 26 can be further enhanced.

Further, according to the above structure, the first surface is provided between the rear surface 18b of the circuit board 18 and the upper surface 41a of the heat dissipation member 41 and between the inner peripheral surface of the hole 35 and the outer peripheral surface of the convex portion 50.
And since the second gaps 48 and 51 are present, the air in these gaps 48 and 51 functions as a heat insulating layer. Therefore, it becomes difficult for the heat transferred to the protrusion 50 and the heat dissipation member 41 to be directly transferred to the circuit board 18, and it is possible to prevent the heat from being collected inside the circuit board 18.

Therefore, the heat of the TCP 26 can be prevented from being transferred to other circuit components on the circuit board 18, for example, the QFP 25 and the connector 24, and the thermal influence on these other circuit components can be suppressed as much as possible.

In addition, in the case of the above configuration, when the circuit board 18 is sandwiched between the heat dissipation member 41 and the cover 42, the heat dissipation member 4
The first bearing surface 47a contacts the ground wiring layer 23 on the back surface 18b of the circuit board 18. Since the heat dissipation member 41 has conductivity, the semiconductor chip 28 and the ground wiring layer 2
3 can be electrically connected to each other using the heat dissipation member 41. Therefore, the semiconductor chip 28 can be grounded at the same time when the heat dissipation member 41 is attached to the circuit board 18, and no special grounding work is required.

On the other hand, the circuit board 1 on which the TCP 26 is mounted
No. 8 generally has poor dimensional accuracy, and its thickness dimension tends to vary from product to product. Therefore, even if the heat dissipation member 41 including the convex portion 50 is finished to a prescribed size, the convex portion 50 penetrates the circuit board 18 in the thickness direction, so that the contact surface 50a of the convex portion 50 is separated from the surface 18a of the circuit board 18. There is a risk of protruding beyond the error range or retracting inside the hole 35.

However, the TCP 26 semiconductor chip 28
Is supported by the flexible carrier 27, so that the contact surface 50a of the convex portion 50 contacting the semiconductor chip 28 greatly protrudes from the surface 18a of the circuit board 18 or, on the contrary, is retracted inside the hole 35, so that the circuit Even if the position of the semiconductor chip 28 on the board 18 is changed, the carrier 27 is elastically deformed to absorb the dimensional error of the circuit board 18.

Therefore, the semiconductor chip 28 and the leads 3 are
There is no unreasonable force applied to the connection portion with 0 and the connection portion between the lead 30 and the connection pad 33.
The reliability of the connection with the CP 26 can be sufficiently ensured.

The present invention is not limited to the first embodiment described above, and FIG. 8 shows a second embodiment of the present invention. In the second embodiment, the back surface 28b of the semiconductor chip 28 is brought into direct contact with the contact surface 50a of the convex portion 50 without using an adhesive, and the other configurations are similar to those of the first embodiment. Is.

Also in such a structure, the heat dissipation member 41
Since the convex portion 50 cooperates with the heat transfer sheet 58 on the cover 42 side to sandwich the semiconductor chip 28, the contact surface 50a of the convex portion 50 contacts the back surface 28b of the semiconductor chip 28 without a gap. Therefore, from the semiconductor chip 28 to the convex portion 5
The heat transfer to 0 is performed well, and this semiconductor chip 28
The heat can be efficiently dissipated to the heat dissipation member 41.

Further, FIG. 9 discloses a third embodiment which is a development of the first embodiment. The third embodiment is different from the first embodiment in the shape of the heat dissipation member 41, and the other configurations are the same as those in the first embodiment.

The heat dissipating member 41 of the third embodiment has a large number of heat dissipating fins 71 integrally formed on its lower surface 41a.
The heat dissipation fin 71 is located on the lower surface 41 a of the heat dissipation member 41 on the opposite side of the protrusion 50. The heat radiation fin 71 is exposed in the space between the wall portion 20 of the frame 16 and the circuit board 18 inside the housing 2.

According to such a configuration, the semiconductor chip 2
Since the heat dissipation member 41 to which the heat of 8 is transmitted has the heat dissipation fins 71, the surface area of the heat dissipation member 41 increases accordingly. Then, in this case, if cooling air is positively blown to the space portion where the radiation fin 71 is exposed, the cooling fin 71
It is possible to further enhance the heat radiation effect due to, and it is more convenient for realizing the low thermal resistance of the TCP 26.

A fourth embodiment of the present invention is disclosed in FIGS. 10 to 12. In the fourth embodiment, the structure for attaching the radiator 40 to the circuit board 18 is mainly the first embodiment.
The structure is different from that of the first embodiment, and the other structure is the same as that of the first embodiment. Therefore, in this fourth embodiment,
The same components as those in the first embodiment are designated by the same reference numerals and the description thereof will be omitted.

As shown in FIGS. 10 and 12, the heat dissipation member 4
Fitting protrusions 81 are integrally provided on the four support surfaces 44a of the first structure. Each fitting protrusion 81 has a prismatic shape. Further, four fitting holes 82 are opened in the circuit board 18. The fitting hole 82 is formed around the hole 35.
It is located between the adjacent connection pads 33. The fitting holes 82 have a square hole shape, and the fitting protrusions 81 are fitted in the fitting holes 82 without any gap. By this fitting, the heat dissipation member 41 is held on the back surface 18b of the circuit board 18, and the convex portion 50 thereof enters the hole 35.

The lower surface of the supporting frame 54 of the cover 42 is fixed to the surface 18a of the circuit board 18 with an adhesive 83. Therefore, in the case of the present embodiment, the heat dissipation member 4
1 and the cover 42 are individually held by the circuit board 18, and the convex portion 50 of the heat dissipation member 41 and the heat transfer sheet 58 on the cover 42 side are in contact with the semiconductor chip 28, respectively.

The fourth embodiment having such a structure is the same as the first embodiment except that the heat dissipation member 41 and the cover 42 are not connected to each other, so the semiconductor chip 2
The heat of 8 can be released to both the heat dissipation member 41 and the cover 42. Therefore, the heat dissipation of the semiconductor chip 28 can be efficiently performed, and the thermal resistance of the TCP 26 can be reduced.

In carrying out the fourth embodiment, a large number of cooling fins 71 may be integrally formed on the lower surface 41b of the heat dissipating member 41 as shown by the chain double-dashed line in FIG. Further, since the circuit board 18 is held by the circuit board 18 by press-fitting the fitting protrusion 81 into the fitting hole 82,
The cover 42 is not always necessary, and the TCP 26 may be exposed on the surface 18 a of the circuit board 18 in some cases.

FIG. 13 discloses a fifth embodiment which is a development of the fourth embodiment. In the fifth embodiment, the ground wiring layer 23 is laminated inside the circuit board 18 and covered with the insulating layer 22. Therefore, the heat dissipation member 4
1 does not include a seat portion that contacts the peripheral edge of the opening of the hole 35, and the convex portion 50 is directly provided on the upper surface 41a of the heat dissipation member 41.

The circuit board 18 is also provided with four through holes 91 into which the fitting protrusions 81 are fitted. As shown in FIG. 13B, the through hole 91 has a circular cross section, and its inner surface is covered with a conductive plating layer 92. The plating layer 92 is electrically connected to the ground wiring layer 23 inside the circuit board 18.

Then, when the fitting projections 81 of the heat dissipation member 41 are fitted into the through holes 91, the corners of the fitting projections 81 are tightly pressed against the plating layer 92. By this pressure contact, the mechanical connection between the circuit board 18 and the heat dissipation member 41 and the electrical connection between the ground wiring layer 23 and the heat dissipation member 41 are simultaneously made.

According to the fifth embodiment having such a structure, the heat of the semiconductor chip 28 can be dissipated to both the heat dissipation member 41 and the cover 42, and the heat dissipation of the semiconductor chip 28 can be efficiently performed.

Further, since the fitting protrusion 81 of the conductive heat dissipating member 41 is in contact with the plated layer 92 on the inner surface of the through hole 91, the semiconductor is formed by utilizing the joint portion of the heat dissipating member 41 and the circuit board 18. Chip 28 to ground wiring layer 23
Can be electrically connected to. Therefore, there is an advantage that no special work for grounding the semiconductor chip 28 is required.

FIG. 14 discloses a sixth embodiment which is a further development of the fourth embodiment. In the sixth embodiment, the fitting projection 81 on the upper surface 41a of the heat dissipation member 41 is arranged at a position closer to the convex portion 50 than the corner of the heat dissipation member 41. Therefore, even the fitting hole 82 of the circuit board 18 is arranged between the hole 35 and the connection pad 33, and the fitting portion between the fitting hole 82 and the fitting protrusion 81 is T.
It is located inside the outer periphery of CP26. The signal wiring layer 21 inside the circuit board 18 has the fitting hole 8
2 is extended toward the direction of the hole 35 by the amount of deviation, and the extended portion 21 a is located below the connection pad 33.

According to this structure, the circuit board 18 does not normally have the signal wiring layer 21 in the region between the connection pad 33 and the hole 35.
The signal wiring layer 21 does not hinder the opening of the fitting holes 82, and the degree of freedom in arranging the fitting holes 82 increases.

Moreover, since the fitting hole 82 does not exist around the outer periphery of the connection pad 33, the signal wiring layer 21 is connected to the connection pad 3.
It can be easily extended to the position corresponding to 3. Therefore, the degree of freedom in forming the signal wiring layer 21 is increased, which is convenient when the circuit board 18 has a multilayer structure.

Further, FIG. 16 discloses a seventh embodiment of the present invention. The seventh embodiment mainly deals with the semiconductor chip 2.
8 is different from that of the first embodiment in that the heat is dissipated.
The basic structure of the CP 26 and the circuit board 18 is the same as that of the first embodiment. Therefore, in the seventh embodiment, the same components as those in the first embodiment are designated by the same reference numerals and the description thereof will be omitted.

As shown in FIG. 16, the holes 3 of the circuit board 18
A heat radiating member 101 is disposed inside the member 5. The heat radiating member 101 is made of a metal material such as an aluminum alloy, which has electrical conductivity and is excellent in thermal conductivity. The heat dissipation member 101 is similar to the hole 35 and has a rectangular plate shape having the same thickness as the circuit board 18. The heat dissipation member 101 is fixed inside the hole 35 with an adhesive 102. This adhesive 10
2 is filled in the gap between the outer peripheral surface of the heat dissipation member 101 and the inner peripheral surface of the hole 35. As the adhesive 102, a non-conductive adhesive having a large heat resistance is selected and used.
As a result, the heat dissipation member 101 and the circuit board 18 are
They are integrated while being electrically insulated from each other.

The heat dissipation member 101 has a flat contact surface 10
It has 1a and a heat dissipation surface 101b. Heat dissipation member 101
Of the contact surface 101a is exposed flush with the surface 18a of the circuit board 18. Similarly, the heat dissipation surface 1 of the heat dissipation member 101
01b is exposed flush with the back surface 18b of the circuit board 18. Here, the term “flush” includes a certain amount of unevenness due to manufacturing error, and it does not matter if the contact surface 101a slightly projects from the surface 18a or is slightly recessed. Then, the contact surface 101 of the heat dissipation member 101
a has a larger area than the back surface 28b of the semiconductor chip 28, and the back surface 28b of the semiconductor chip 28 is bonded to the contact surface 101a with an adhesive 52.

The ground wiring layer 23 is used for the circuit board 1.
8 is arranged on the back surface 18b. The back surface 18b is covered with a solder layer 103 as a conductive coating extending over the heat dissipation surface 101b of the heat dissipation member 101.

To form the solder layer 103, first, the heat dissipation member 101 is adhered to the circuit board 18, and the back surface 18b of the circuit board 18 and the heat dissipation surface 1 of the heat dissipation member 101.
Pastes of solder are applied to 01b, respectively. next,
The circuit board 18 is heated to melt the paste-like solder, and the melted solder is cured. By this,
The solder layer 103 has a thin film shape, and the back surface 18b of the circuit board 18 including the heat dissipation surface 101b of the heat dissipation member 101 is kept flat with no unevenness.

Therefore, the ground wiring layer 23 and the heat dissipation member 101 are electrically connected to each other through the film-shaped solder layer 103. The back surface 18 b of the circuit board 18 covered with the solder layer 103 is the seat surface 60 of the frame 16.
It is in contact with a.

According to such a configuration, the semiconductor chip 2
The heat of No. 8 is transferred from the entire surface of the back surface 28b to the heat dissipation member 101 via the adhesive 52, and escapes to the frame 16 from the heat dissipation surface 101b of the heat dissipation member 101. for that reason,
The heat of the semiconductor chip 28 can be efficiently radiated using the frame 16.

Since the solder layer 103 is in the form of a thin film, the back surface 18b of the circuit board 18 is a flat surface without any unevenness, and the back surface 18b of the circuit board 18 is placed on the seat surface 60a of the frame 16 without any gap. Can be contacted. Therefore, there is no gap between heat dissipation member 101 and frame 16 that hinders heat conduction, and the heat transferred to heat dissipation member 101 can be efficiently released to frame 16.

Moreover, according to the above configuration, the circuit board 18
Of the ground wiring layer 23 and the heat dissipation member 101
Since it is electrically connected via 03, this heat dissipation member 1
01 can be used as part of the ground circuit. Therefore, no special work for grounding the semiconductor chip 28 is required.

Since the adhesive 102 for adhering the heat dissipation member 101 to the circuit board 18 has a large thermal resistance, this adhesive 102 is applied from the heat dissipation member 101 to the circuit board 1.
It also functions as a kind of heat insulating layer that prevents heat transfer to the heat sink 8.
Therefore, it becomes difficult for the heat transferred to the heat dissipation member 101 to be directly transferred to the circuit board 18, and it is possible to prevent the heat from being trapped inside the circuit board 18.

Therefore, the heat of the TCP 26 can be prevented from being transferred to other circuit components on the circuit board 18, for example, the QFP 25 and the connector 24, and the thermal influence on these other circuit components can be suppressed as much as possible.

Also in the seventh embodiment, the cover 42 as shown in the sixth embodiment is adhered to the surface 18a of the circuit board 18, and the TCP 42 is attached by the cover 42.
6 may be covered.

Further, FIGS. 17 to 20 disclose an eighth embodiment of the present invention. The eighth embodiment mainly relates to a method of connecting the circuit board 18 and the TCP 26 and the TCP.
The heat radiation path of 26 is different from that of the first embodiment, and TC
The basic structure of P26 is the same as that of the first embodiment. Therefore, in the eighth embodiment, the same components as those in the first embodiment are designated by the same reference numerals and the description thereof will be omitted.

As shown in FIG. 17, the TCP 26 is mounted on the circuit board 18 in a so-called face-down posture in which the surface 28a of the semiconductor chip 28 where the leads 30 are continuous is directed to the circuit board 18. Therefore, the surface 18a of the circuit board 18 is a chip mounting surface.

The back surface 28b of the semiconductor chip 28 is
The surface 18a of the circuit board 18 faces in the opposite direction,
A gap 120 is formed between the surface 18 a of the circuit board 18 and the surface 28 a of the semiconductor chip 28.

The circuit board 18 has a ground wiring layer 23 covered with an insulating layer 22. As shown in FIG. 17, the ground wiring layer 23 is formed at a position outside the mounting area of the TCP 26. Therefore, the portion of the circuit board 18 corresponding to the mounting area of the TCP 26 is
It is only the insulating layer 22.

A heat radiating member 123 is attached to the portion of the circuit board 18 where the TCP 26 is mounted. Heat dissipation member 1
23 is made of a metal material such as an aluminum alloy having excellent thermal conductivity and conductivity. The heat dissipation member 123 integrally includes a substantially square panel portion 124 having a larger planar shape than the TCP 26, and a frame portion 125 extending downward from a peripheral edge portion of the panel portion 124. The frame portion 125 is located outside the mounting area of the TCP 26, and the lower surface of the frame portion 125 is overlaid on the surface 18 a of the circuit board 18.

As shown in FIG. 18, the panel portion 124 is
The four corners have screw holes 126, respectively. The screw hole 126 is located outside the mounting area of the TCP 26 and faces the mounting hole 45 of the circuit board 18. Screws 127 are inserted into the mounting holes 45 of the circuit board 18 from the direction of the back surface 18b thereof, and the tips of these screws 127 are screwed into the screw holes 126. By this screwing, the heat dissipation member 123 is fixed to the surface 18a of the circuit board 18, and the TCP 26, the lead 30, and the connection pad 33 of the TCP 26 are included.
The connection portion with is covered with the heat dissipation member 123.

The central portion of the lower surface of the panel portion 124 of the heat dissipation member 123 faces the back surface 28b of the semiconductor chip 28. The back surface 28b of the semiconductor chip 28 is
It is adhered to the panel portion 124 via a conductive adhesive 128 as a die attach material.

As shown in FIG. 17, a conductive layer 131 is arranged on the surface 18a of the circuit board 18. Conduction layer 1
Reference numeral 31 is located outside the mounting area of the TCP 26. The conductive layer 131 is provided on the heat dissipation member 123.
When is fixed to the surface 18a of the circuit board 18, it contacts the lower surface of the frame portion 125 of the heat dissipation member 123.

The conductive layer 131 is the ground wiring layer 23.
It is located above. The conductive layer 131 and the ground wiring layer 23 are electrically connected via the conductive pin 132. The conduction pin 132 penetrates the circuit board 18 and the ground wiring layer 23 in the thickness direction, and the tip of the conduction pin 132 is in contact with the conduction layer 131.
Therefore, when the heat radiation member 123 is fixed to the surface 18 a of the circuit board 18 with the screw 127, the heat radiation member 123 is fixed.
The frame portion 125 is electrically connected to the ground wiring layer 23 via the conductive layer 131 and the conduction pin 132.

Therefore, according to this structure, the semiconductor chip 28 can be connected to the ground wiring layer 23 at the same time when the heat dissipation member 123 is attached to the circuit board 18.
Special grounding work of the TCP 26 can be omitted.

The circuit board 18 is the same as the circuit board 18
Is provided with a through hole 135 penetrating in the thickness direction. Through hole 1
35 is located in the mounting portion of the TCP 26,
It faces the surface 28 a of the semiconductor chip 28.

On the other hand, when the TCP 26 is mounted on the circuit board 18 in a face-down posture, as described above, the gap 120 is formed between the surface 28a of the semiconductor chip 28 and the surface 18a of the circuit board 18, and this semiconductor chip is formed. 28 cannot be supported by the circuit board 18. Therefore, as shown in FIG. 20, the semiconductor chip 28 is pressed against the panel portion 124 of the heat dissipation member 123 via the pressing member 136 until the adhesive 128 is cured.

The pressing member 136 penetrates through the through hole 135 and the main body 136a interposed between the surface 18a of the circuit board 18 and the surface 28a of the semiconductor chip 28 and is led out to the rear surface 18b side of the circuit board 18. Guide part 136b
And have. The pressing member 136 is made of, for example, a rubber-like elastic body that is elastically deformable.

Then, the through hole 135 of the circuit board 18 is formed.
After the adhesive 128 is cured, the pressing member 136
Is taken out from between the circuit board 18 and the semiconductor chip 28, and has an opening area smaller than that of the main body 136a. That is, as shown in FIG. 20, the guide portion 136 b of the pressing member 136 has the through hole 135.
Since it is led out in the direction of the back surface 18b of the circuit board 18 through the
When pulling the tip of the guide portion 136b, the main body 13
6a is elastically deformed and drawn into the through hole 135, and is taken out to the back surface 18b side of the circuit board 18 through the through hole 135.

Therefore, the TCP 26 semiconductor chip 18
Are held in a state of being hung on the lower surface of the panel portion 124 via an adhesive 128. Next, a procedure for mounting the TCP 26 on the circuit board 18 will be described.

As shown in FIG. 19, first, the circuit board 18
The pressing member 136 is inserted into the through hole 135 from the direction of the surface 18a of the circuit board 18, and the main body 136a of the pressing member 136 is hooked on the opening edge of the through hole 135.

Next, TCP is formed on the surface 18a of the circuit board 18.
26 is supplied. At this time, the TCP 26 supplies the surface 28a of the semiconductor chip 28, in which the leads 30 are continuous, to the circuit board 18 in a face-down posture toward the circuit board 18,
The tips of the leads 30 are soldered to the connection pads 33. By this soldering, the main body 136a of the pressing member 136 comes into contact with the surface 18a of the semiconductor chip 18, and the semiconductor chip 18 is supported via the pressing member 136.

Next, the adhesive 128 is applied to the back surface 28b of the semiconductor chip 28. Then, the surface 1 of the circuit board 18
8a is covered with a heat dissipation member 123, and the heat dissipation member 123 covers the TCP 26 and the connection portion between the lead 30 of the TCP 26 and the connection pad 33. Then, in the mounting hole 45 of the circuit board 18, the screw 1
The heat radiation member 123 is fastened and fixed to the circuit board 18 by inserting the screw 27 into the screw hole 126.

By this fixing, the semiconductor chip 28 is sandwiched between the panel portion 124 of the heat dissipation member 123 and the pressing member 136, and the adhesive is provided between the back surface 28b of the semiconductor chip 28 and the lower surface of the panel portion 124. 128 is filled.
In this case, since the pressing member 136 has elasticity, the semiconductor chip 28 is pressed toward the panel section 124. For this reason, it is possible to prevent the semiconductor chip 28 from hanging down from the panel portion 124 and shifting from moving until the adhesive 128 is cured, and the posture of the semiconductor chip 28 is maintained integrally.

When the adhesive 128 is hardened and the semiconductor chip 28 is fixed to the panel portion 124, as shown by the arrow in FIG. 20, the guide portion 136b of the pressing member 136 led out from the through hole 135 is removed. pull. Then, the body 136a of the pressing member 136 is elastically deformed and the through hole 135
While being drawn in, it is taken out to the back surface 18b side of the circuit board 18 through the through hole 135, and the pressing member 13
6 is removed from between the TCP 26 and the circuit board 18.

According to the eighth embodiment of the present invention as described above,
When the semiconductor chip 28 generates heat, this semiconductor chip 28
Of the heat is released to the heat dissipation member 123 from the back surface 28b on the side opposite to the circuit board 18. Back surface 28 of semiconductor chip 28
Since b is adhered to the lower surface of the panel portion 124 with an adhesive 128, no gap that hinders heat conduction is generated between the semiconductor chip 28 and the panel portion 124, and Heat dissipation member 12 efficiently
You can escape to 3.

Therefore, even when the TCP 26 is mounted on the circuit board 18 in a face-down posture, it is possible to secure a sufficient heat dissipation path on the side of the semiconductor chip 28 opposite to the circuit board 18, and to dissipate the heat of the TCP 26 from the circuit. Board 18
Can be actively done without using.

Further, when the pressing member 136 is removed from between the circuit board 18 and the semiconductor chip 28, a gap 120 is provided between the circuit board 18 and the semiconductor chip 28.
As a result, the gap 120 serves as a kind of heat insulating space that shields the radiant heat from the semiconductor chip 28 toward the circuit board 18, and the heat effect on the circuit board 18 can be suppressed to a small level.

Moreover, when the pressing member 136 is removed, the through hole 135 of the circuit board 18 is connected to the gap 120, and the through hole 135 is formed on the surface 28a of the semiconductor chip 28.
Radiant heat of the semiconductor chip 28 through the holes 1
It can escape to the outside through 35. Therefore, between the heat dissipation member 123 and the circuit board 18, the semiconductor chip 2
It becomes difficult for the heat of No. 8 to collect, and in this respect as well, the heat effect on the circuit board 18 can be suppressed to be small.

Further, according to the above structure, the semiconductor chip 2
Since No. 8 is pressed against the panel section 124 of the heat dissipation member 123 via the pressing member 136 until the adhesive 128 is cured, the posture of the semiconductor chip 28 is kept constant. Therefore, the back surface 28b of the semiconductor chip 28 can be reliably bonded to the lower surface of the panel portion 124, and the heat of the semiconductor chip 28 can be efficiently transferred to the panel portion 124.

FIG. 21 shows a ninth embodiment which is a further development of the eighth embodiment. The ninth embodiment differs from the eighth embodiment in the shape of the heat dissipation member 123, and the other configurations are the same as those in the eighth embodiment.

The heat dissipation member 123 of the ninth embodiment has a large number of heat dissipation fins 141 integrally provided on the upper surface of the panel portion 124. These heat radiation fins 141 are used for the semiconductor chip 2
8 and the panel portion 124 are arranged at positions corresponding to the bonding portions.

According to such a configuration, the semiconductor chip 2
Since the heat radiation area of the panel portion 124 through which the heat of 8 is directly transmitted is increased, there is an advantage that the heat radiation effect of the panel portion 124 can be further enhanced, which is more convenient in realizing the low thermal resistance of the TCP 26.

Although the leads formed on the carrier are connected to the bumps on the surface of the semiconductor chip in the above embodiment, the present invention is not limited to this, and the bumps on the semiconductor chip and the connection pads on the circuit board may be connected to each other by wire. -You may connect by bonding.

Further, the cooling device for a circuit module according to the present invention is not limited to a portable computer, but can be applied to other electronic devices and various fields.

[0164]

According to the first aspect of the present invention, the heat of the semiconductor chip is radiated from the entire surface of the second chip surface to the heat radiating member through the convex portion, so that heat that directly connects the heat generating semiconductor chip and the heat radiating member is obtained. Conduction paths can be formed. Moreover, since the second chip surface of the semiconductor chip is pressed against the contact surface without a gap and the contact state between the semiconductor chip and the contact surface is maintained well, the heat of the semiconductor chip is efficiently transmitted to the heat dissipation member. Therefore, low thermal resistance of the semiconductor chip can be realized.

Furthermore, since the gaps between the protrusions and the holes of the circuit board and between the heat dissipating member and the circuit board function as a heat insulating layer, the heat of the semiconductor chip transferred to the protrusions and the heat dissipating member is applied to the circuit. It is difficult to reach the substrate directly. Therefore, heat can be prevented from being trapped inside the circuit board, and the thermal influence on other circuit components mounted on the circuit board can be suppressed to be small.

According to the second aspect, since the semiconductor chip is electrically connected to the ground wiring layer of the circuit board through the projection and the heat dissipation member, the heat dissipation member and the cover are attached to the circuit board and at the same time the semiconductor chip is attached. Since it is grounded, no special grounding work is required.

According to the third aspect, since the first chip surface of the semiconductor chip and the cover are thermally connected to each other, heat is radiated from both the first and second chip surfaces of the semiconductor chip. Therefore, the heat dissipation performance of the semiconductor chip can be improved accordingly.

According to the fourth aspect, since the second chip surface of the semiconductor chip is firmly brought into close contact with the contact surface of the convex portion without a gap, the heat of the semiconductor chip can be efficiently released to the convex portion.

According to the fifth aspect, since the resin film supporting the semiconductor chip is elastically deformable, the contact surface of the convex portion is the first surface of the circuit board due to the variation in the thickness dimension of the circuit board. Even if the resin film protrudes from the substrate or, on the contrary, retracts into the hole, the resin film is deformed so as to follow the position of the semiconductor chip, and variations in thickness of the circuit board are absorbed. Therefore, the peeling and disconnection of the lead can be prevented in advance without applying an unreasonable force to the connecting portion between the semiconductor chip and the lead and the connecting portion between the lead and the connecting pad.

According to the sixth aspect, since the heat radiation area of the heat radiation member is increased by the presence of the cooling fin, the heat radiation property of the heat radiation member is improved, and the heat of the semiconductor chip can be efficiently released to the outside.

According to claim 7, the heat of the semiconductor chip is
Since the heat is radiated from the entire surface of the second chip to the heat dissipation member through the convex portion, it is possible to form a heat conduction path that directly connects the heat generating semiconductor chip and the heat dissipation member. Therefore, the heat of the semiconductor chip can be efficiently transferred to the heat dissipation member, and the low thermal resistance of the semiconductor chip can be realized.

Furthermore, since the gaps between the protrusions and the holes of the circuit board and between the heat dissipating member and the circuit board function as a heat insulating layer, the heat of the semiconductor chip transferred to the protrusions and the heat dissipating member is applied to the circuit. It is difficult to reach the substrate directly. Therefore, heat can be prevented from being trapped inside the circuit board, and the thermal influence on other circuit components mounted on the circuit board can be suppressed to be small.

According to the eighth aspect, since the semiconductor chip is electrically connected to the ground wiring layer of the circuit board through the projection and the heat dissipation member, the heat dissipation member is attached to the circuit board and the semiconductor chip is grounded at the same time. This eliminates the need for special grounding work.

According to the ninth aspect, since the second chip surface of the semiconductor chip is firmly brought into close contact with the contact surface of the convex portion without a gap, the heat of the semiconductor chip can be efficiently released to the convex portion.

According to the tenth aspect, since the heat radiation area of the heat radiation member is increased by the presence of the cooling fin, the heat radiation property of the heat radiation member is improved, and the heat of the semiconductor chip can be efficiently dissipated to the outside.

According to the eleventh aspect, the fitting hole can be freely opened without being restricted by the position of the wiring layer, and conversely, there is no fitting hole on the outer periphery of the connection pad. The degree of freedom in arranging the wiring layer inside is increased.

According to the twelfth aspect, since the semiconductor chip is electrically connected to the ground wiring layer of the circuit board through the leg portion and the conductive layer, the heat dissipation member is attached to the circuit board and the semiconductor chip is grounded at the same time. This eliminates the need for special grounding work.

According to the thirteenth aspect, since the cover bears an impact from the outside, the impact resistance performance of the bare semiconductor chip having a weak mechanical strength can be sufficiently enhanced. Claim 1
According to 4, since the first chip surface of the semiconductor chip and the cover are thermally connected via the heat transfer sheet, the heat of the semiconductor chip is released from the first chip surface to the cover via the heat transfer sheet. It is possible to radiate heat from both the first and second chip surfaces of this semiconductor chip. Moreover, if an external shock is applied to the cover,
This impact is absorbed and relaxed by the deformation of the heat transfer sheet, so no impact is applied to the semiconductor chip,
Sufficient impact resistance of the semiconductor chip can be secured.

According to the fifteenth aspect, the heat of the semiconductor chip is radiated from the entire surface of the second chip surface to the heat dissipation member, so that a heat conduction path is formed so as to directly connect the heat generating semiconductor chip and the heat dissipation member. be able to. Therefore, the heat of the semiconductor chip can be efficiently transferred to the heat dissipation member,
It is possible to reduce the thermal resistance of the semiconductor chip. Further, since the conductive coating is formed by curing the melted solder paste, the second surface of the circuit board including the heat dissipation surface of the heat dissipation member becomes a smooth surface without unevenness. Therefore, even if a heat sink for heat dissipation is attached to the heat dissipation surface of the heat dissipation member, there is no problem and it is convenient for improving the heat dissipation of the heat dissipation member.

Moreover, since the heat dissipation member and the ground wiring layer are electrically connected by the conductive film, this heat dissipation member can be used as a ground circuit of the semiconductor chip,
No special member for grounding is required.

According to the sixteenth aspect, the second semiconductor chip is provided.
Because the chip surface of the semiconductor chip is firmly and closely contacted with the contact surface of the heat dissipation member, the heat of the semiconductor chip can be efficiently released to the heat dissipation member.

According to the seventeenth aspect, since the adhesive for fixing the heat dissipation member to the inside of the hole functions as a kind of heat insulating layer,
The heat of the semiconductor chip transferred to the heat dissipation member can be prevented from being transferred to the circuit board. For this reason, heat is less likely to be trapped inside the circuit board, and thermal influence on other circuit components mounted on the circuit board can be suppressed to a small level.

According to the eighteenth aspect, even when the semiconductor chip is mounted in a face-down posture with the first chip surface where the leads are connected facing the circuit board, the semiconductor chip is mounted on the side opposite to the circuit board. A sufficient heat dissipation path can be secured, and heat dissipation of the semiconductor chip can be positively performed without using the circuit board.

Further, when the pressing member is removed from between the circuit board and the semiconductor chip, the gap formed between the circuit board and the semiconductor chip becomes a kind of heat insulating space that shields the radiant heat from the semiconductor chip to the circuit board. The heat effect on the circuit board can be reduced. At the same time, when the pressing member is removed, the through hole of the circuit board faces the connection surface of the semiconductor chip, and the radiant heat of the semiconductor chip is released to the outside through this through hole. It becomes difficult for heat to collect, and the heat effect on the circuit board can be reduced.

Further, since the semiconductor chip is pressed against the heat dissipation member via the pressing member until the adhesive is hardened, the semiconductor chip can be reliably adhered to the heat dissipation member. The heat of can be efficiently transmitted to the heat dissipation member.

According to the nineteenth aspect, since the semiconductor chip is electrically connected to the ground wiring layer of the circuit board through the heat dissipation member, the semiconductor chip is grounded at the same time when the heat dissipation member is attached to the circuit board, which is exceptional. No need for grounding work.

According to the twentieth aspect, since the heat radiation area of the heat radiation member is increased by the presence of the cooling fin, the heat radiation property of the heat radiation member is improved, and the heat of the semiconductor chip can be efficiently dissipated to the outside.

[Brief description of drawings]

FIG. 1 is a sectional view showing a mounting portion of a TCP according to a first embodiment of the present invention.

FIG. 2 is a sectional view showing a state in which a circuit board, a TCP and a radiator are separated from each other.

FIG. 3 is a perspective view showing a state in which a circuit board, a TCP and a radiator are separated from each other.

FIG. 4 is a cross-sectional view of the portable computer showing a state in which a circuit board having a TCP is housed inside a housing.

FIG. 5 is a perspective view of a portable computer.

FIG. 6 is a perspective view showing a state in which a frame, a circuit board, and a shield plate are separated from each other.

FIG. 7 is a perspective view showing a state in which a frame is incorporated in the lower housing of the housing.

FIG. 8 is a sectional view showing a mounting portion of a TCP according to the second embodiment of the present invention.

FIG. 9 is a cross-sectional view showing a TCP mounting portion in the third embodiment of the present invention.

FIG. 10 is a cross-sectional view showing a TCP mounting portion in the fourth embodiment of the present invention.

FIG. 11 is a cross-sectional view showing a state in which a circuit board, a TCP and a radiator are separated from each other.

FIG. 12 is a perspective view showing a state in which a circuit board, a TCP and a radiator are separated from each other.

FIG. 13 (A) shows a TC in the fifth embodiment of the present invention.
Sectional drawing which shows the mounting part of P. 13B is a sectional view taken along the line AA of FIG.

FIG. 14 is a sectional view showing a mounting portion of a TCP according to a sixth embodiment of the present invention.

FIG. 15 is a perspective view showing a state in which a circuit board, a TCP and a radiator are separated from each other.

FIG. 16 is a cross-sectional view showing a TCP mounting portion in the seventh embodiment of the present invention.

FIG. 17 is a cross-sectional view showing a TCP mounting portion in the eighth embodiment of the present invention.

FIG. 18 is a perspective view showing a state in which the circuit board, the TCP, and the heat dissipation member are separated from each other.

FIG. 19 is a cross-sectional view showing a state in which a circuit board, a TCP, a pressing member, and a heat dissipation member are separated from each other.

FIG. 20 is a cross-sectional view showing a state where a TCP semiconductor chip is pressed against a heat dissipation member via a pressing member.

FIG. 21 is a sectional view showing a TCP mounting portion in the ninth embodiment of the present invention.

[Explanation of symbols]

 18 ... Circuit board 18a ... 1st surface, chip mounting surface (front surface) 18b ... 2nd surface (back surface) 23 ... Ground wiring layer 28 ... Semiconductor chip 28a ... 1st chip surface (front surface) 28b ... Second Chip surface (back surface) 30 ... Lead 33 ... Connection pad 35 ... Hole 41 ... Heat dissipation member 42 ... Cover 48, 51 ... Gap (first gap, second gap) 50 ... Convex portion 50a, 101a ... Contact surface 56 ... Tightening member (screw) 58 ... Rubber-like elastic body (heat transfer sheet) 103 ... Conductive film (solder layer) 123 ... Heat dissipation member 128 ... Adhesive agent 135 ... Through hole 136 ... Pressing member

Claims (20)

[Claims] 1. A circuit board including a first surface having a connection pad and a second surface located opposite to the first surface, and connected to a connection pad of the circuit board through a lead,
A circuit module including a semiconductor chip that generates heat during operation, wherein the semiconductor chip is a first module having a connecting portion for the lead.
And a second chip surface located on the opposite side of the first chip surface, the second chip surface facing the first surface of the circuit board with the second chip surface facing the first surface. The second surface of the circuit board opposite to the semiconductor chip is provided with a hole having a larger opening shape than the semiconductor chip in a portion facing the semiconductor chip while being mounted on the board. A heat-conducting heat dissipation member having a convex portion that enters the hole, and the convex portion of the heat dissipation member has a larger area than the second chip surface of the semiconductor chip. A flat contact surface that is in contact with the second chip surface is included, and a heat-shielding gap is formed between the heat dissipation member and the circuit board and between the hole and the convex portion, and the circuit is formed. The semiconductor chip is provided on the first surface of the substrate. And a cover for covering the connecting portion between the lead and the connection pad is arranged, and between the cover and the first chip surface of the semiconductor chip,
By disposing a rubber-like elastic body that is elastically deformable, and by coupling the cover and the heat dissipation member via a fastening member that penetrates the circuit board in the thickness direction, the semiconductor chip A cooling device for a circuit module, which is sandwiched between a contact surface and a rubber-like elastic body. 2. The circuit board according to claim 1, wherein the circuit board has a ground wiring layer on a second surface thereof, and the heat dissipation member is made of a conductive metal material. A cooling device for a circuit module, wherein the member is in contact with the ground wiring layer. 3. The rubber elastic body according to claim 1, wherein the rubber-like elastic body has thermal conductivity, and the cover is made of a metallic material having thermal conductivity. Cooling device for circuit module. 4. The circuit according to claim 1, wherein the contact surface of the convex portion and the second chip surface of the semiconductor chip are bonded to each other with a conductive adhesive. Module cooling system. 5. The cooling device for a circuit module according to claim 1, wherein the semiconductor chip is supported by a flexible resin film having the leads. 6. The cooling device for a circuit module according to claim 1, wherein the heat dissipation member includes a large number of cooling fins protruding toward the side opposite to the convex portion. 7. A circuit board including a first surface having a connection pad and a second surface located opposite to the first surface, and connected to the connection pad of the circuit board via a lead,
A circuit module including a semiconductor chip that generates heat during operation, wherein the semiconductor chip is a first module having a connecting portion for the lead.
And a second chip surface located on the opposite side of the first chip surface, the second chip surface facing the first surface of the circuit board with the second chip surface facing the first surface. Along with being mounted on a board, the circuit board includes a hole having a larger opening shape than the semiconductor chip in a mounting portion of the semiconductor chip, and a plurality of fitting holes located around the hole, A heat-dissipating member having heat conductivity is arranged on a second surface of the circuit board opposite to the semiconductor chip, and the heat-dissipating member is press-fitted into the convex portion that enters the hole and the fitting hole. While having a plurality of legs, the convex portion has a larger area than the second chip surface of the semiconductor chip,
The semiconductor chip has a flat contact surface that comes into contact with the second chip surface, and heat shield gaps are formed between the heat dissipation member and the circuit board and between the hole and the convex portion, respectively. A cooling device for a circuit module characterized by the above. 8. The circuit board according to claim 7, wherein the circuit board has a ground wiring layer on a second surface thereof, and the heat dissipation member is made of a conductive metal material. A cooling device for a circuit module, wherein the member is in contact with the ground wiring layer. 9. The circuit according to claim 7, wherein the contact surface of the convex portion and the second chip surface of the semiconductor chip are bonded to each other via a conductive adhesive. Module cooling system. 10. The cooling device for a circuit module according to claim 7, wherein the heat dissipation member includes a large number of cooling fins protruding toward the side opposite to the convex portion. 11. The circuit board according to claim 7, wherein the circuit board has a multi-layer structure in which a plurality of wiring layers and insulating layers are alternately stacked, and the fitting hole of the circuit board has the connection. A cooling device for a circuit module, which is arranged between the pad and the hole. 12. The circuit board according to claim 7, wherein the circuit board has a ground wiring layer covered with an insulating layer, and the inner surface of the fitting hole is electrically connected to the ground wiring layer. A cooling device for a circuit module, wherein the heat dissipation member is covered with a layer, and the heat dissipation member is made of a conductive metal material, and legs of the heat dissipation member are pressed against the conductive layer. 13. The cooling of a circuit module according to claim 7, wherein a cover is provided on the first surface of the circuit board to cover the semiconductor chip and the connection portion between the lead and the connection pad. apparatus. 14. The cover according to claim 13, wherein the cover is made of a metal material having thermal conductivity, and is made of a rubber-like elastic body between the cover and the first chip surface of the semiconductor chip. A cooling device for a circuit module, in which a heat transfer sheet is arranged. 15. A circuit board including a first surface having a connection pad and a second surface positioned on the opposite side of the first surface and having a ground wiring layer, and a lead being connected to the connection pad of the circuit board. Connected through
A semiconductor module that generates heat during operation, wherein the semiconductor chip is a first module having a connection portion of the lead.
And a second chip surface located on the opposite side of the first chip surface, the second chip surface facing the first surface of the circuit board with the second chip surface facing the first surface. The circuit board is mounted on a board, and the circuit board has a hole having an opening shape larger than that of the semiconductor chip in a portion facing the semiconductor chip, and the heat dissipation member having heat conductivity and conductivity is accommodated in the hole. In addition, the heat dissipation member has a larger area than the second chip surface of the semiconductor chip and is in contact with the second chip surface of the semiconductor chip, and the second contact surface of the circuit board. And a flat heat dissipation surface that is substantially flush with the heat dissipation surface of the heat dissipation member. Through the conductive coating, the ground Cooling apparatus for circuit modules, characterized in that the wiring layer and the heat radiating member and electrically connected. 16. The circuit according to claim 15, wherein the contact surface of the heat dissipation member and the second chip surface of the semiconductor chip are bonded to each other via a conductive adhesive. Module cooling system. 17. The cooling of a circuit module according to claim 15, wherein the heat dissipation member is adhered to the inner peripheral surface of the hole via an electrically insulating adhesive having a large heat resistance. apparatus. 18. A circuit board including a chip mounting surface having a connection pad, and being connected to a connection pad of the circuit board via a lead,
A circuit module including a semiconductor chip that generates heat during operation, wherein the semiconductor chip is a first module having a connecting portion for the lead.
And a second chip surface located opposite to the first chip surface, the second chip surface being oriented in a direction opposite to the chip mounting surface of the circuit board. Is mounted on the circuit board, and on the chip mounting surface of the circuit board, a heat-conducting heat-dissipating member that covers the semiconductor chip and the connection between the lead and the connection pad is attached. And the second chip surface of the semiconductor chip are bonded to each other via an adhesive having thermal conductivity, and the adhesive is provided between the chip mounting surface of the circuit board and the first chip surface of the semiconductor chip. During the period until curing, a pressing member that presses the semiconductor chip toward the heat dissipation member is interposed, and in the circuit board, at a portion facing the semiconductor chip, after the adhesive is cured, Cooling apparatus for circuit modules, characterized in that it has a hole for taking out the member from between the semiconductor chip and the circuit board. 19. The circuit board according to claim 18, wherein the circuit board has a ground wiring layer, and the heat dissipation member is made of a conductive metal material, and the heat dissipation member is provided with the ground wiring layer. Is electrically connected to the circuit module cooling device. 20. The cooling device for a circuit module according to claim 18, wherein the heat dissipation member includes a large number of cooling fins.