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WO2020024705A1 - 显示基板及其制备方法、显示面板 - Google Patents

显示基板及其制备方法、显示面板 Download PDF

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Publication number
WO2020024705A1
WO2020024705A1 PCT/CN2019/091127 CN2019091127W WO2020024705A1 WO 2020024705 A1 WO2020024705 A1 WO 2020024705A1 CN 2019091127 W CN2019091127 W CN 2019091127W WO 2020024705 A1 WO2020024705 A1 WO 2020024705A1
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WO
WIPO (PCT)
Prior art keywords
layer
barrier
base substrate
dam
substrate
Prior art date
Application number
PCT/CN2019/091127
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English (en)
French (fr)
Inventor
龙春平
Original Assignee
京东方科技集团股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 京东方科技集团股份有限公司 filed Critical 京东方科技集团股份有限公司
Priority to JP2019563792A priority Critical patent/JP7512040B2/ja
Priority to US16/614,140 priority patent/US11289678B2/en
Priority to KR1020227000066A priority patent/KR102481426B1/ko
Priority to KR1020197035932A priority patent/KR20200015522A/ko
Publication of WO2020024705A1 publication Critical patent/WO2020024705A1/zh

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/873—Encapsulations
    • H10K59/8731—Encapsulations multilayered coatings having a repetitive structure, e.g. having multiple organic-inorganic bilayers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/844—Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/124—Insulating layers formed between TFT elements and OLED elements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K2102/00—Constructional details relating to the organic devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K2102/00—Constructional details relating to the organic devices covered by this subclass
    • H10K2102/301—Details of OLEDs
    • H10K2102/351—Thickness
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/1201—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/122—Pixel-defining structures or layers, e.g. banks

Definitions

  • At least one embodiment of the present disclosure relates to a display substrate, a manufacturing method thereof, and a display panel.
  • OLED Organic Light-Emitting Diode
  • OLED electronic display products need to be packaged to prevent the internal components from being aged and damaged due to the influence of water vapor and oxygen infiltration.
  • the current OLED electronic display products are limited by their own design structures, resulting in a package yield that cannot be further improved.
  • At least one embodiment of the present disclosure provides a display substrate including a display area and a non-display area located around the display area.
  • the display substrate further includes a base substrate and at least one barrier dam disposed on the base substrate.
  • a first encapsulation layer the barrier dam is located on the base substrate in the non-display area, the first encapsulation layer is located on the base substrate and at least one of the barrier dams faces the On one side of the display area, the first encapsulation layer is formed of a cured first encapsulation material, and at least the side of the barrier dam facing the first encapsulation layer is relative to the first encapsulation material before curing. It is lyophobic.
  • a planar shape of the blocking dam is a closed loop surrounding the display area.
  • the display substrate includes a plurality of the barrier dams, and the plurality of the barrier dams are arranged at a distance from each other.
  • a plurality of the barrier dams include a first barrier dam and a second barrier dam, and the first barrier dam is located in the second barrier dam and the display area. And the distance between the surface of the first barrier dam far from the base substrate and the surface of the base substrate is smaller than the surface of the second barrier dam far from the base substrate to the substrate The distance from the surface of the substrate.
  • a plurality of the barrier dams further include a third barrier dam, and the third barrier dam is located at a distance from the first barrier dam of the second barrier dam.
  • One side, and the distance from the surface of the second barrier dam far from the base substrate to the surface of the base substrate is smaller than the surface of the third barrier dam far from the base substrate to the substrate The distance from the surface of the substrate.
  • a distance from a surface of the first encapsulation layer away from the base substrate to a surface of the base substrate is greater than a distance of the blocking dam away from the liner. The distance from the surface of the base substrate to the surface of the base substrate.
  • the display substrate provided by at least one embodiment of the present disclosure further includes a pixel defining layer located on the base substrate, wherein the pixel defining layer is located between the base substrate and the first encapsulation layer.
  • the pixel defining layer is configured as a single layer structure
  • the blocking dam includes a first blocking layer
  • the first blocking layer is on the same layer as the pixel defining layer And the same material.
  • the pixel-defining layer is provided as a single-layer structure
  • the barrier dam includes a first barrier layer and a photoresist layer stacked on each other, and the first barrier A layer is located between the base substrate and the photoresist layer, and the first blocking layer is the same layer and the same material as the pixel defining layer.
  • the pixel defining layer includes a first defining layer and a second defining layer stacked on each other, and the first defining layer is located between the second defining layer and the second defining layer.
  • the barrier dam includes a first barrier layer and a second barrier layer, the first barrier layer is the same layer and the same material as the first defining layer, and the second barrier layer and the The second defining layer is the same layer and the same material.
  • the barrier dam further includes at least one photoresist layer, and the photoresist layer is located away from the first barrier layer or the second barrier layer.
  • the photoresist layer is located away from the first barrier layer or the second barrier layer.
  • One side of the base substrate is located away from the first barrier layer or the second barrier layer.
  • a material of the pixel defining layer includes at least one of polymethyl methacrylate, polyimide, and acrylic.
  • the display substrate provided by at least one embodiment of the present disclosure further includes a second packaging layer and a third packaging layer, the second packaging layer is located between the first packaging layer and the base substrate, and the third The packaging layer is located on a side of the first packaging layer remote from the base substrate, wherein the first packaging layer is an organic layer, and the second packaging layer and the third packaging layer are inorganic layers.
  • an orthographic projection of the blocking dam on the base substrate is located on the first encapsulation layer and the second encapsulation layer on the base substrate. And the orthographic projection of the first encapsulation layer on the base substrate is within the orthographic projection of the third encapsulation layer on the base substrate, and the blocking dam is at The orthographic projection on the base substrate is located within the orthographic projection of the third encapsulation layer on the base substrate.
  • an orthographic projection of at least one of the blocking dams on the base substrate is located on the first encapsulation layer and the second encapsulation layer on the substrate.
  • the orthographic projection of at least one of the barrier dams on the base substrate is located between the orthographic projections of the first and second encapsulation layers on the base substrate.
  • the orthographic projection of the first encapsulation layer on the base substrate is within the orthographic projection of the third encapsulation layer on the base substrate, and the blocking dam is on the base substrate
  • the orthographic projection on is within the orthographic projection of the third encapsulation layer on the base substrate.
  • the display substrate provided by at least one embodiment of the present disclosure further includes a plurality of organic light emitting devices, wherein the organic light emitting device is located in the display area and between the first encapsulation layer and the base substrate .
  • the display substrate provided by at least one embodiment of the present disclosure further includes a flat layer, wherein the flat layer is located between the organic light emitting device and the base substrate, and the barrier dam is at least partially the same as the flat layer. Layer and same material.
  • a material of the flat layer includes polymethyl methacrylate, polyimide, epoxy resin, polyamide, acrylic.
  • At least one embodiment of the present disclosure provides a display panel including the display substrate described in any of the foregoing embodiments.
  • At least one embodiment of the present disclosure provides a method for preparing a display substrate, including: providing a base substrate, defining a display area of the display substrate to be formed on the base substrate, and a non-display located around the display area. Area; forming at least one barrier dam on the base substrate in the non-display area; applying a first packaging material on the base substrate in the display area; and curing the first packaging material to Forming a first encapsulation layer; wherein at least one side of the barrier dam facing the first encapsulation layer is lyophobic relative to the first encapsulation material before curing.
  • the barrier dam is treated with a halogen element. Perform modification treatment.
  • 1A is a plan view of a partial structure of a display substrate according to an embodiment of the present disclosure
  • FIG. 1B is a cross-sectional view of the display substrate shown in FIG. 1A along A-B;
  • FIG. 2 is a cross-sectional view of another display substrate provided by an embodiment of the present disclosure.
  • FIG. 3 is a cross-sectional view of another display substrate provided by an embodiment of the present disclosure.
  • FIG. 4 is a cross-sectional view of another display substrate provided by an embodiment of the present disclosure.
  • FIG. 5 is a cross-sectional view of another display substrate provided by an embodiment of the present disclosure.
  • FIG. 6 is a cross-sectional view of another display substrate provided by an embodiment of the present disclosure.
  • FIG. 7 is a cross-sectional view of another display substrate provided by an embodiment of the present disclosure.
  • FIG. 8 is a cross-sectional view of another display substrate according to an embodiment of the present disclosure.
  • 9A-9G are process diagrams of a method for manufacturing a display substrate according to an embodiment of the present disclosure.
  • a barrier dam can be set along the periphery of the display substrate.
  • the barrier dam can block the packaging material (for example, the packaging material is in the form of ink in the inkjet printing process), and the packaging material is dried and cured. After forming an encapsulation layer. If the barrier dam is not high enough, the packaging material will overflow and waste material, and this may result in the packaging layer formed by the packaging material having poor flatness and small thickness, and the packaging effect of the packaging layer is limited. However, if the barrier dam is raised, the step difference in the area where the barrier dam is located will not only increase the design thickness of the display substrate, increase the difficulty of the manufacturing process, but also adversely affect the subsequent manufacturing process of the display substrate.
  • At least one embodiment of the present disclosure provides a display substrate including a display area and a non-display area located around the display area.
  • the display substrate further includes a base substrate, a first encapsulation layer disposed on the base substrate, and at least A blocking dam, the blocking dam is located on the base substrate in the non-display area, the first encapsulation layer is located on the base substrate and at a side of the at least one blocking dam facing the display area, and the first encapsulation layer is formed by the cured first
  • the packaging material is formed, and at least the side of the blocking dam facing the first packaging layer is liquid-repellent relative to the first packaging material before curing.
  • the blocking dam can prevent the overflow of the first packaging material used to obtain the first packaging layer, thereby improving the flatness of the first packaging layer; moreover, compared with the current display substrate structure,
  • the barrier dam in the embodiment of the present disclosure can also enable the display substrate to retain more first packaging material in the packaging process, thereby increasing the design thickness of the first packaging layer.
  • the barrier dam provided by the embodiments of the present disclosure can improve the packaging effect of the display substrate.
  • FIG. 1A is a plan view of a partial structure of a display substrate according to an embodiment of the present disclosure
  • FIG. 1B is a cross-sectional view of the display substrate shown in FIG. 1A along A-B.
  • the display substrate includes a display area 101 and a non-display area 102 located around the display area 101.
  • the display substrate further includes a base substrate 100.
  • the dam 200 is located on the base substrate 100 in the non-display area 102, and the first encapsulation layer 310 is located on the base substrate 100 and on the side of the blocking dam 200 facing the display area 101.
  • the first encapsulation layer 310 is An encapsulating material (not shown, refer to the first encapsulating material 301 in FIG.
  • the display area 101 is an area defined by a dotted frame in FIG. 1A.
  • a spatial rectangular coordinate system is established with the base substrate 100 as a reference, and the positions of various components of the display substrate in at least one embodiment of the present disclosure described below are described.
  • the directions of the X and Y axes are parallel to the surface of the substrate 100 facing the barrier dam 200, and the direction of the Z axis is perpendicular to the substrate.
  • the surface of the substrate 100 facing the barrier dam 200 is perpendicular to the substrate.
  • “upper” and “lower”, “height”, and “thickness” are defined by a distance near the surface of the substrate substrate 100 facing the barrier dam 200.
  • the “height” and “thickness” of the barrier dam 200 are not limited by other components (such as the thin film transistor 500 shown in FIG. 6) provided between the substrate 100 and the barrier dam 200. .
  • the photoresist layer 230 is located above the first blocking layer 210, the first blocking layer 210 is located below the photoresist layer 230, and the photoresist layer
  • the thickness of 230 is the distance from the surface of the photoresist layer 230 facing away from the substrate 100 to the surface of the photoresist layer 230 facing the substrate 100, and the height of the photoresist layer 230 is the distance from the photoresist layer 230.
  • the surface of the blocking dam 200 facing the substrate 100 is the lower surface, and the surface of the blocking dam 200 facing away from the substrate 100 is the upper surface; the first encapsulation layer 310 is located on the substrate.
  • the base substrate 100 (or the organic light emitting device 400 in the following embodiments) is located under the first encapsulation layer 310.
  • the height of the barrier dam 200 is the distance from the upper surface of the barrier dam 200 to the surface of the substrate 100 facing the barrier dam 200; the thickness of the barrier dam 200 is the size of the barrier dam 200 in the Z-axis direction.
  • the height of the barrier dam 200 is h
  • the height of the first encapsulation layer 310 is H.
  • the height of the barrier dam 200 and the substrate 100 Structures such as a thin film transistor 500 are arranged between the three, the height of the third blocking dam 203 of the blocking dam 200 is h3, the thickness of the third blocking dam 203 is L3, and the height of the first encapsulation layer 310 is H.
  • a first packaging material is applied in a region defined by the barrier dam. Because the side (side surface) of the barrier dam facing the first encapsulation layer is lyophobic relative to the first encapsulation material, the contact angle of the first encapsulation material on the side surface is greater than 90 degrees, thereby preventing the first encapsulation material from The climbing on the side surface of the barrier dam, and the height of the central portion (the portion of the display area) of the first packaging material may be greater than the height of the edge portion (the portion near the barrier dam). For example, the height of the central portion of the first packaging material may be greater than the height of the barrier dam.
  • the amount of the first packaging material applied on the display substrate can be less limited by the height of the barrier dam, and it is more difficult for the first packaging material to spill over the barrier dam, so that a larger thickness can be formed.
  • the first encapsulation layer; and in addition to the edge portion of the first encapsulation material, the surface of the central portion of the first encapsulation material (for example, the portion of the first encapsulation material at least in the display area) is substantially flat, so that the first encapsulation material is dry The flatness of the surface of the first packaging layer formed later is higher. In this way, the packaging yield of the display substrate can be improved.
  • the first packaging material needs to form a first packaging layer after drying, so the thickness of the first packaging layer is usually smaller than the thickness of the first packaging material.
  • the height relationship between the first encapsulation layer and the barrier dam is not limited, and the height of the first encapsulation layer may be greater than, less than or equal to the height of the barrier dam.
  • the distance from the surface of the first encapsulation layer away from the substrate to the surface of the substrate is greater than the surface of the barrier dam away from the substrate to the surface of the substrate distance.
  • the height H of the first encapsulation layer 310 is greater than the height h of the barrier dam 200.
  • the planar shape of the barrier dam is a closed loop surrounding the display area.
  • the shape of the blocking dam 200 in the X-Y plane is a closed loop, and the display area 101 is located inside the closed loop.
  • the blocking dam 200 can further reduce the overflow of the first packaging material used to form the first packaging layer, thereby further improving the packaging yield of the display substrate.
  • FIG. 2 is a cross-sectional view of another display substrate provided by an embodiment of the present disclosure.
  • the display substrate includes a plurality of barrier dams, and the plurality of barrier dams are arranged at intervals from each other.
  • a plurality of blocking dams may be spaced from the inside to the outside around the display area.
  • the height relationship between the plurality of barrier dams is not limited as long as the barrier dam can prevent the first packaging material from overflowing.
  • the height of each barrier dam is equal.
  • the height of the barrier dam near the display area is smaller than the height of the barrier dam far from the display area.
  • the depth of the opening formed between adjacent barrier dams can be reduced, and the subsequent process such as forming the encapsulation layer in the following embodiments can improve the quality of the film formation of the encapsulation layer; and the height of the barrier dam close to the display area Relatively low, it can reduce the adverse effect of the barrier dam near the display area on the components in the display area, and the height of the barrier dam far from the display area is relatively high.
  • the packaging layer it can extend the path of water and oxygen intrusion, reduce water, The risk of oxygen intrusion is a new step to improve the packaging effect of the display substrate.
  • the plurality of barrier dams include a first barrier dam and a second barrier dam, the first barrier dam is located between the second barrier dam and the display area, and the first barrier dam The distance from the surface of the second barrier dam to the surface of the substrate is smaller than the distance of the surface of the second barrier dam from the surface of the substrate to the surface of the substrate.
  • the plurality of barrier dams include a first barrier dam, a second barrier dam, and a third barrier dam, and the first barrier dam is located between the second barrier dam and the display area.
  • the third barrier dam is located on a side of the second barrier dam away from the first barrier dam, and the distance from the surface of the second barrier dam away from the substrate to the surface of the substrate is smaller than the distance of the third barrier dam away from the substrate. The distance from the surface of the substrate to the surface of the substrate.
  • the barrier dam 200 provided on the display substrate includes a first barrier dam 201, a second barrier dam 202, and a third barrier 203 spaced from each other.
  • the first barrier dam 201, the second barrier dam 202, and the third barrier 203 are arranged in sequence, and the The height increases in order.
  • the type of the display substrate is not limited.
  • the display substrate is an OLED display substrate, and the display substrate further includes a plurality of organic light emitting devices, wherein the organic light emitting device is located in the display area and between the first encapsulation layer and the base substrate.
  • the organic light emitting device 400 is located between the first encapsulation layer 310 and the base substrate 100.
  • the organic light emitting device 400 includes a first electrode layer 410, an organic layer stacked on the base substrate 100 in order.
  • the light emitting functional layer 430 and the second electrode layer 420 are examples of the display substrate.
  • the first encapsulation layer 310 covers the organic light emitting device 400, thereby preventing the organic light emitting functional layer, the cathode, and the like from reacting with invading water, oxygen and other external substances and aging, thereby ensuring the performance of the organic light emitting device 400 and extending the life of the organic light emitting device 400
  • the flatness of the first encapsulation layer 310 is high and has a large thickness, which can improve the flatness of the surface of the display substrate and relieve the stress, thereby reducing mechanical damage to the display substrate and protecting the display substrate.
  • the second electrode layer 420 may be provided as a common driving electrode of a plurality of organic light emitting devices 400.
  • the organic light emitting functional layer in the organic light emitting device may include a hole injection layer, a hole transport layer, an organic light emitting layer, an electron transport layer, an electron injection layer, and the like, and may further include a hole blocking layer, an electron blocking layer, etc. .
  • the display substrate in at least one embodiment of the present disclosure is described below by taking the display substrate as an OLED display substrate as an example.
  • FIG. 3 is a cross-sectional view of another display substrate according to an embodiment of the present disclosure.
  • the display substrate provided by at least one embodiment of the present disclosure further includes a pixel defining layer located on the base substrate, and the pixel defining layer is located between the base substrate and the first packaging layer.
  • the pixel defining layer 103 has a single-layer structure, and the pixel defining layer 103 is located between the first encapsulation layer 310 and the base substrate 100.
  • the organic light emitting functional layer 430 of the organic light emitting device 400 may be formed on Among the openings of the pixel defining layer 103, these openings space adjacent pixel units from each other to prevent interference with each other.
  • the organic light emitting functional layer 430 such as a hole injection layer, a hole transport layer, an organic light emitting layer, and the like can be manufactured in the opening of the pixel defining layer 103 using inkjet printing.
  • some film layers in the organic light-emitting functional layer 430 may be formed by inkjet printing, and other film layers may be formed by processes such as evaporation.
  • some film layers such as hole injection layers may be manufactured by inkjet printing in the openings of the pixel defining layer, and then other film layers such as organic light emitting layers and electron injection layers may be manufactured by an evaporation process.
  • the thickness of the pixel-defining layer does not need to be increased, and the subsequent film layer (such as organic Light-emitting layer).
  • FIG. 4 is a cross-sectional view of another display substrate provided by an embodiment of the present disclosure.
  • the pixel defining layer includes a first defining layer and a second defining layer stacked on each other, and the first defining layer is located between the second defining layer and the base substrate.
  • the pixel defining layer 103 includes a first defining layer 110 and a second defining layer 120 stacked on each other, and the second defining layer 120 is located between the first encapsulating layer 310 and the first defining layer 110. .
  • the second defining layer 120 may be used to increase the first defining layer 110, so that the opening capacity of the second defining layer 120 and the first defining layer 110 is increased, thereby increasing the thickness of the organic light emitting functional layer 430 and improving the organic light emitting device.
  • Illumination function For example, the orthographic projection of the second defining layer 120 on the base substrate 100 coincides with the orthographic projection of the first defining layer 110 on the base substrate 100.
  • the barrier dam there is no limitation on the manner in which the barrier dam is formed.
  • the barrier dam may be formed separately, so that the parameters such as the material and thickness of the barrier dam are not limited by the manufacturing process of the display substrate.
  • the barrier dam may be manufactured simultaneously in the process of manufacturing the components (other than the barrier dam) in the display substrate. In this way, there is no need to increase the manufacturing process of the display substrate and reduce the cost.
  • the pixel defining layer is provided as a single-layer structure
  • the barrier dam includes a first barrier layer
  • the first barrier layer is the same layer and the same material as the pixel defining layer.
  • the barrier dam 200 includes a first barrier layer 210.
  • a patterning process may be performed on the insulating material film to simultaneously form the pixel defining layer 103 and the first blocking layer 210.
  • the pixel defining layer is provided as a single-layer structure
  • the barrier dam includes a first barrier layer and a photoresist layer, and the first barrier layer is located on the substrate substrate and the photoresist layer.
  • the first blocking layer is the same layer and the same material as the pixel defining layer.
  • the barrier dam 200 includes a photoresist layer 230, and the photoresist layer 230 is located on the first barrier layer 210.
  • a photoresist can be used to pattern the insulating material film used to form the pixel defining layer 103 and the first barrier layer 210, and after the patterning process is completed, the pattern on the first barrier layer 210 is retained. Photoresist, thereby obtaining a photoresist layer 230.
  • the photoresist layer 230 can increase the height of the barrier layer 200 so that more first packaging material can be applied to the display substrate, thereby increasing the thickness of the first packaging layer 310 and improving the packaging effect of the display substrate.
  • the pixel defining layer includes a first defining layer and a second defining layer stacked on each other, and the first defining layer is located between the second defining layer and the base substrate, and blocks
  • the dam includes a first barrier layer and a second barrier layer, and the first barrier layer is the same layer and the same material as the first defining layer, and the second barrier layer is the same layer and the same material as the second defining layer.
  • the barrier dam 200 includes a first barrier layer 210 and a second barrier layer 220 which are sequentially stacked on the base substrate 100.
  • a patterning process may be performed on one film to form a first defining layer 110 and a first barrier layer 210, and a patterning process may be performed on another film to form a second defining layer 120 and a second barrier Layer 220.
  • the barrier dam includes a first barrier layer, a second barrier layer, and at least one photoresist layer stacked on each other, and the first barrier layer and the first defining layer are in the same layer. And the same material, the second barrier layer and the second defining layer are the same layer and the same material, and the photoresist layer is located on the side of the first barrier layer or the second barrier layer away from the substrate.
  • the barrier dam 200 includes a photoresist layer 230, and each of the barrier dam 200 is provided between the first barrier layer 210 and the second barrier layer 220 and above the second barrier layer 220. Photoresist layer 230.
  • the photoresist layer 230 may be formed using a photoresist used in a patterning process of forming the first defining layer 110 and the second defining layer 120.
  • the photoresist layer 230 can increase the height of the barrier layer 200 so that more first packaging material can be applied to the display substrate, thereby increasing the thickness of the first packaging layer 310 and improving the packaging effect of the display substrate.
  • FIG. 5 is a cross-sectional view of another display substrate provided by an embodiment of the present disclosure.
  • the thickness of the first defining layer of the pixel defining layer is different from the thickness of the second defining layer.
  • the display substrate can be provided with a plurality of barrier dams arranged at intervals, and the height of the plurality of barrier dams is sequentially increased in the direction from the display area to the non-display area. .
  • a plurality of barrier dams are provided, and one of the plurality of barrier dams is on the same layer as the first delimitation layer.
  • the same material, the other of the multi-blocking dam is the same layer and the same material as the second defining layer, and the other of the multi-blocking dam is the same layer and the same material as the first defining layer and the second defining layer.
  • the heights of at least three blocking dams are different from each other, and forming the three blocking dams does not increase the manufacturing process of the display substrate.
  • the same layer and the same material may mean that two structures may be formed by one film layer, for example, the two structures may be in the same patterning process of the film layer form.
  • the pixel definition includes a first definition layer and a second definition layer having different thicknesses, taking the thickness of the first definition layer to be greater than the thickness of the second definition layer as an example, for at least one of the following embodiments of the present disclosure,
  • the display substrate will be described.
  • the display substrate includes a first barrier dam 201, a second barrier dam 202, and a third barrier arranging in a direction from the close to the display area to the far away from the display area (positive X-axis direction).
  • Blocking dam 203 The first barrier dam 201 is the same layer and the same material as the second defining layer 120; the second barrier dam 202 is the same layer and the same material as the first defining layer 110; and, a portion of the third barrier 203 near the base substrate 100 and
  • the first defining layer 110 is of the same layer and the same material, and the portion of the third blocking dam 203 away from the substrate 100 is the same layer and of the same material as the second defining layer 120.
  • the height of the third barrier dam 203 can be greater than the height of the second barrier dam 202, and the height of the second barrier dam 202 can be greater than the height of the first barrier dam 201.
  • the thickness of the first packaging layer and the pixel defining layer is not limited, and may be designed according to an actual process.
  • the thickness of the first encapsulation layer may be 3 to 10 microns; when the pixel defining layer is a single-layer structure, the thickness of the pixel defining layer may be 1 to 2 microns; and, the pixel defining layer includes the first defining layer and In the case of the second defining layer, the thickness of the first defining layer may be 1 to 2 microns, and the thickness of the second defining layer may be 1 to 1.5 microns.
  • the separation distance before each barrier dam in the case where a plurality of barrier dams are provided, there is no limitation on the separation distance before each barrier dam.
  • the separation distance before the blocking dam is 10-100 micrometers, for example, about 30 micrometers, 50 micrometers, 80 micrometers, and the like.
  • the width of the barrier dam is not limited.
  • the width of the barrier dam is 10 to 100 micrometers, such as about 30 micrometers, 50 micrometers, 80 micrometers, and the like.
  • the materials of the first defining layer and the second defining layer are not limited.
  • the first defining layer may be one or more of a polymer resin material such as polymethyl methacrylate, polyimide, acrylic, or the like, or may be a photoresist.
  • the second defining layer may be a polymer resin material such as polyimide. It should be noted that in the case where the first barrier layer of the barrier dam is the same layer and the same material as the first defining layer, if the first defining layer is a photoresist, the surface of the first barrier layer far from the substrate It may not be necessary to form a photoresist layer.
  • FIG. 6 is a cross-sectional view of another display substrate provided by an embodiment of the present disclosure.
  • the display substrate provided by at least one embodiment of the present disclosure further includes a flat layer, and the flat layer is located between the organic light emitting device and the base substrate.
  • a flat layer 600 is provided between the organic light emitting device 400 and the base substrate 100.
  • the planarization layer 600 may planarize the surface of the display substrate, thereby improving the yield of the organic light emitting device 400.
  • the barrier dam is at least partially the same layer and the same material as the planar layer.
  • a portion of the barrier dam 200 near the substrate is the same layer and the same material as the flat layer 600.
  • the thickness of the barrier dam 200 can be increased, and after the display substrate is packaged (for example, the third encapsulation layer in the following embodiment is formed), the path of water, oxygen, etc. entering the display substrate can be extended, and water and oxygen can be reduced.
  • the risk of intrusion improve the packaging effect of the display substrate.
  • the material of the flat layer is not limited.
  • the material of the flat layer may be an acrylic material, and the acrylic material may be one or more of materials such as polymethyl methacrylate, polyimide, epoxy resin, polyamide, acrylic, or the like. For other suitable materials.
  • the packaging manner of the display substrate may be packaged with a single-layer film (first packaging layer), or may be packaged with a multilayer film (including the first packaging layer). Multi-layer thin film packaging can further improve the packaging effect of a display substrate.
  • FIG. 7 is a cross-sectional view of another display substrate according to an embodiment of the present disclosure.
  • the display substrate provided by at least one embodiment of the present disclosure further includes a second packaging layer and a third packaging layer, the second packaging layer is located between the first packaging layer and the base substrate, and the third packaging layer is located at the first packaging layer.
  • the side far from the substrate exemplary, as shown in FIG. 7, a second packaging layer 320 is disposed between the first packaging layer 310 and the organic light emitting device 400, and a third packaging layer 330 is disposed above the first packaging layer 310.
  • the composite packaging stack composed of the first packaging layer 310, the second packaging layer 320, and the third packaging layer 330 can further improve the packaging effect on the display substrate.
  • the first encapsulation layer is an organic layer
  • the second and third encapsulation layers are inorganic layers.
  • the materials of the second encapsulation layer and the third encapsulation layer can be inorganic materials such as silicon nitride, silicon oxide, silicon oxynitride, and fluoride.
  • the inorganic materials have high density and can prevent the intrusion of water and oxygen.
  • the first encapsulation layer includes an organic material, such as a polymer resin such as polyethylene terephthalate and polyacrylate. In this way, the first encapsulation layer can relieve the stress of the second encapsulation layer and the third encapsulation layer, and materials such as a desiccant can be provided in the first encapsulation layer.
  • the desiccant may include a water-absorbing material, such as an alkali metal (such as Li, Na), an alkaline earth metal (such as Ba, Ca), or other moisture-reactive metals (such as Al, Fe); it may also be an alkali metal oxide ( (Such as Li2O, Na2O), alkaline earth metal oxides (such as MgO, CaO, BaO), sulfates (such as anhydrous MgSO4), metal halides (such as CaCl2), or perchlorates (such as Mg (ClO4) 2), etc., In order to absorb water, oxygen and other substances entering the interior.
  • an alkali metal such as Li, Na
  • an alkaline earth metal such as Ba, Ca
  • other moisture-reactive metals such as Al, Fe
  • the desiccant may also be an alkali metal oxide (Such as Li2O, Na2O), alkaline earth metal oxides (such as MgO, CaO, BaO), sulfates (
  • the thickness of the second packaging layer and the third packaging layer are not limited.
  • the thickness of the second and third packaging layers is not greater than 1 micron.
  • the orthographic projection of the blocking dam on the base substrate is located outside the orthographic projection of the second encapsulation layer on the base substrate, and the first encapsulation layer is on the base substrate.
  • the orthographic projection of is located within the orthographic projection of the third encapsulation layer on the base substrate, and the orthographic projection of the barrier dam on the base substrate is within the orthographic projection of the third encapsulation layer on the base substrate.
  • the second encapsulation layer 320 is located on the side of the barrier dam 200 facing the display area.
  • the third encapsulation layer 330 covers the first encapsulation layer 310, which can prevent outside water, oxygen, etc. from entering the first encapsulation layer 310, and the third encapsulation layer 330 covers the barrier dam 200 and the third encapsulation layer 330 Cooperating with the blocking dam 200 can increase the path for external water, oxygen, etc. to invade the interior of the display substrate. In this way, the first packaging layer 310, the second packaging layer 320, and the third packaging layer 330 can further improve the packaging effect of the display substrate.
  • FIG. 8 is a cross-sectional view of another display substrate provided by an embodiment of the present disclosure.
  • the second encapsulation layer may be set to cover at least one barrier dam and not cover at least one barrier dam, so that Improve the packaging effect of the display substrate.
  • the orthographic projection of at least one blocking dam on the base substrate is located within the orthographic projection of the first and second packaging layers on the base substrate, and at least The orthographic projection of a barrier dam on the base substrate is outside the orthographic projection of the first and second encapsulation layers on the base substrate; and the orthographic projection of the first encapsulation layer on the base substrate is in the third encapsulation layer Within the orthographic projection on the base substrate, and the orthographic projection of the blocking dam on the base substrate is within the orthographic projection of the third encapsulation layer on the base substrate.
  • the display substrate includes a first barrier dam 201, a second barrier dam 202, and a third barrier arranging in a direction from the close to the display area to the far away from the display area (positive X-axis direction).
  • the barrier dam 203 and the second encapsulation layer 320 are disposed to cover the first barrier dam 201, and the second barrier dam 202 and the third barrier dam 203 are not covered by the second encapsulation layer 220.
  • the first blocking dam 201 improves the packaging effect of the second packaging layer 320, and the first packaging material used to form the first packaging layer 310 will still be blocked by the second blocking dam 202 and the third blocking dam 203. In this way, it is possible to further improve the packaging effect of the display substrate while ensuring the thickness, flatness, and the like of the first packaging layer.
  • the display substrate may further include a structure such as a driving circuit layer disposed on the base substrate.
  • the driving circuit layer includes a plurality of switching elements, capacitors, gate lines, data lines, power lines, etc. These switching elements are, for example, thin film transistors.
  • the thin film transistors are connected to the organic light emitting device to control the electrical function of the organic light emitting device. Exemplarily, in the embodiment shown in FIG. 6 to FIG.
  • the display substrate includes a driving circuit layer, and the driving circuit layer includes a plurality of thin film transistors 500 (one is shown in the figure as an example) and
  • the interlayer structure is, for example, a gate insulating layer 510, an interlayer dielectric layer 520, a passivation layer 530, and the like.
  • the type of the thin film transistor is not limited.
  • the thin film transistor may be a top gate type, a bottom gate type, a double gate type, or the like.
  • the positions of the interlayer structures such as the gate insulating layer, the interlayer dielectric layer, and the passivation layer can be set according to the type of the thin film transistor.
  • the display panel may include a packaging cover plate opposite to the display substrate.
  • the packaging cover plate may be located on the first packaging layer (or the third packaging layer), and the packaging cover plate may further protect components in the display substrate.
  • the display panel may be any product or component having a display function, such as a television, a digital camera, a mobile phone, a watch, a tablet computer, a notebook computer, a navigator, and the like.
  • the present disclosure does not describe the entire structure of the display panel in at least one embodiment of the present disclosure.
  • those skilled in the art may set other structures (such as a touch structure, etc.) according to a specific application scenario, which is not limited in the embodiments of the present disclosure.
  • At least one embodiment of the present disclosure provides a method for manufacturing a display substrate, including: providing a base substrate, defining a display area of a display substrate to be formed on the base substrate, and a non-display area located around the display area; in the non-display area Forming at least one blocking dam on the base substrate in the substrate; applying a first packaging material on the base substrate in the display area; and curing the first packaging material to form a first packaging layer, at least the blocking dam faces at least the first packaging layer One side of is relatively lyophobic relative to the first packaging material before curing.
  • the blocking dam can prevent the overflow of the first packaging material used to obtain the first packaging layer, thereby improving the flatness of the first packaging layer and enabling the display substrate to be used in the packaging process. Maintain more first packaging material, thereby increasing the design thickness of the first packaging layer and improving the packaging effect of the display substrate.
  • the barrier dam is modified with a halogen element and / or an inert gas.
  • the modification treatment may be a plasma treatment or an ion doping treatment; and, for example, the modification treatment may use a mask to limit the modification treatment area.
  • the halogen element is, for example, a fluorine element, a chlorine element, a bromine element, or the like.
  • the organic compounds of these halogen elements can be used to obtain the corresponding plasma, thereby generating a liquid-repellent coating on the surface of the barrier dam.
  • the halogen element can modify the material of at least the surface of the barrier dam, so that the barrier dam has liquid repellency with respect to the first packaging material.
  • the solvent of the first packaging material is water, and after the halogen element is doped, the barrier dam is hydrophobic.
  • the inert gas may be helium, neon, argon, krypton, or the like.
  • the barrier dam can be modified by using argon and hydrogen plasma.
  • 9A-9G are process diagrams of a method for manufacturing a display substrate according to an embodiment of the present disclosure.
  • a method for manufacturing a display substrate in at least one embodiment of the present disclosure will be described by taking the manufacturing of a display substrate as shown in FIG. 7 as an example.
  • a process of a method for manufacturing a display substrate provided by at least one embodiment of the present disclosure is as follows.
  • a base substrate 100 is provided, and a driving circuit layer is formed on the base substrate 100.
  • the driving circuit layer includes a plurality of thin film transistors 500 (only one is shown in the figure as an example).
  • a gate electrode, a gate insulating layer 510, an active layer, an interlayer dielectric layer 520, a source-drain electrode layer, a passivation layer 530, and the like are sequentially formed on the substrate 100.
  • the source-drain electrode layer includes source and drain electrodes spaced apart from each other.
  • the thin film transistor 500 is a bottom-gate thin film transistor; then, a flat layer 600 is formed on the base substrate 100 to planarize the surface of the display substrate; and then, a patterning process is performed on the flat layer 600 to flatten the flat layer 600 and the passivation layer.
  • a via hole is formed in the metallization layer 530; then, a first electrode layer 410 is formed on the flat layer 600, and the first electrode layer 410 is electrically connected to the drain electrode in the source-drain electrode layer through the above-mentioned via hole.
  • the portion of the flat layer 600 located in the non-display area 102 may be formed as the first portion 201a of the first barrier dam, the first portion 202a of the second barrier dam, and The first part 203a of the third barrier dam.
  • the patterning process may be a photolithographic patterning process, for example, it may include: coating a photoresist on a structure layer to be patterned, exposing the photoresist using a mask, and exposing the photoresist. The photoresist is developed to obtain a photoresist pattern, the structure layer is etched using the photoresist pattern, and then the photoresist pattern is optionally removed. It should be noted that if the patterned structure layer includes a photoresist, a process of coating the photoresist may not be required.
  • a first defining layer 110 is formed on the base substrate 100, a patterning process is performed on the first defining layer 110, a plurality of openings are formed in the first defining layer 110 of the display area 101, and The portion of the first delimiting layer 110 located in the non-display area 102 is formed as a second portion 202 b of the second barrier dam and a second portion 203 b of the third barrier dam.
  • the second barrier dam and the third barrier dam are barrier dams to be formed in a subsequent process.
  • a second defining layer 120 is formed on the base substrate 100, a patterning process is performed on the second defining layer 120, a plurality of openings are formed in the second defining layer 120 of the display area 101, and The portion of the second defining layer 120 located in the non-display area 102 is formed as a second portion 201b of the first barrier dam and a third portion 203c of the third barrier dam.
  • the first barrier dam 201, the second barrier dam 202, and the third barrier dam 203 can be obtained, and the first defining layer 110 and the second defining layer 120 can form the pixel defining layer 103.
  • first barrier dam 201, the second barrier dam 202, and the third barrier dam 203 may be lyophobic relative to the first packaging material; or, the first barrier dam 201, The second barrier dam 202 and the third barrier dam 203 are modified so that the first barrier dam 201, the second barrier dam 202, and the third barrier 203 have liquid repellency with respect to the first packaging material.
  • an organic light emitting functional layer 430 is formed in the opening of the pixel defining layer 103, and then a second electrode layer 420 is formed on the organic light emitting functional layer 430.
  • the first electrode layer 410, the organic light emitting functional layer 430, and the second electrode layer 420 are formed as an organic light emitting device 400.
  • a thin film of an inorganic material is deposited on the organic light emitting device 400 to form a second encapsulation layer 320.
  • the second encapsulation layer 320 is formed on a side of the first barrier dam 201 facing the display area.
  • a first packaging material 301 including an organic material is applied on the second packaging layer 320.
  • the height of the first packaging material 301 is greater than the height of the first barrier dam 201, and the first barrier dam 201 blocks
  • the first packaging material 301 is such that the first packaging material 301 cannot extend to the second barrier dam 202.
  • the first packaging material 301 is applied using an inkjet printing method.
  • the first packaging material 301 can also be applied by spin coating or the like.
  • the first packaging material 301 is dried, so that the first packaging material 301 is formed as the first packaging layer 310.
  • the first packaging layer 310 is formed on a side of the first blocking dam 201 that faces the display area, and the height of the first packaging layer 310 is greater than the height of the first blocking dam 201.
  • a thin film of an inorganic material is deposited on the first packaging layer 310 to form a third packaging layer 330.
  • the third encapsulation layer 330 covers the first encapsulation layer 310, and the third encapsulation layer 330 covers the first barrier dam 201, the second barrier dam 202, and the third barrier dam 203.
  • At least one embodiment of the present disclosure provides a display substrate, a manufacturing method thereof, and a display panel, and may have at least one of the following beneficial effects:
  • the blocking dam can prevent overflow of the first packaging material used to obtain the first packaging layer, thereby improving the flatness and design thickness of the first packaging layer, This improves the packaging effect of the display substrate.
  • At least a part of the structure in the barrier dam may be the same layer and the same material as the pixel defining layer, without increasing the manufacturing process of the display substrate and reducing the cost.
  • a part of the structure in the barrier dam may be a photoresist layer.
  • the manufacturing process of the display substrate is not increased.

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Abstract

一种显示基板及其制备方法、显示面板。该显示基板包括显示区(101)以及位于显示区(101)周围的非显示区(102)，显示基板还包括衬底基板(100)以及设置于衬底基板(100)上的第一封装层(310)和至少一个阻挡坝(200)，阻挡坝(200)位于非显示区(102)中的衬底基板(100)上，第一封装层(310)位于衬底基板(100)上并且位于至少一个阻挡坝(200)的面向显示区(101)的一侧，第一封装层(310)由固化后的第一封装材料(301)形成，阻挡坝的至少面对第一封装层(310)的一侧相对于固化前的第一封装材料(301)具有疏液性。该阻挡坝(200)可以提高显示基板的封装效果。

Description

显示基板及其制备方法、显示面板
本申请要求于2018年8月1日递交的中国专利申请第201810862548.5号的优先权，在此全文引用上述中国专利申请公开的内容以作为本申请的一部分。
技术领域
本公开至少一个实施例涉及一种显示基板及其制备方法、显示面板。
背景技术
有机发光二极管(OLED，Organic Light-Emitting Diode)是一种有机薄膜电致发光器件，其因具有制备工艺简单、成本低、功耗小、亮度高、视角宽、对比度高及可实现柔性显示等优点，而受到人们极大的关注。
OLED电子显示产品需要进行封装，以避免其内部的部件因渗透进来的水汽和氧气等的影响而受到老化、损坏。但是，当前的OLED电子显示产品受限于自身的设计结构，导致封装的良率不能进一步提高。
发明内容
本公开至少一个实施例提供一种显示基板，包括显示区以及位于所述显示区周围的非显示区，所述显示基板还包括衬底基板以及设置于所述衬底基板上的至少一个阻挡坝和第一封装层，所述阻挡坝位于所述非显示区中的所述衬底基板上，所述第一封装层位于所述衬底基板上并且位于至少一个所述阻挡坝的面向所述显示区的一侧，所述第一封装层由固化后的第一封装材料形成，所述阻挡坝的至少面对所述第一封装层的一侧相对于固化前的所述第一封装材料具有疏液性。
例如，在本公开至少一个实施例提供的显示基板中，所述阻挡坝的平面形状为环绕所述显示区的闭合环形。
例如，在本公开至少一个实施例提供的显示基板中，所述显示基板包括多个所述阻挡坝，并且多个所述阻挡坝彼此间隔排布。
例如，在本公开至少一个实施例提供的显示基板中，多个所述阻挡坝 包括第一阻挡坝和第二阻挡坝，所述第一阻挡坝位于所述第二阻挡坝和所述显示区之间，以及所述第一阻挡坝的远离所述衬底基板的表面至所述衬底基板的表面的距离小于所述第二阻挡坝的远离所述衬底基板的表面至所述衬底基板的表面的距离。
例如，在本公开至少一个实施例提供的显示基板中，多个所述阻挡坝还包括第三阻挡坝，所述第三阻挡坝位于所述第二阻挡坝的远离所述第一阻挡坝的一侧，以及所述第二阻挡坝的远离所述衬底基板的表面至所述衬底基板的表面的距离小于所述第三阻挡坝的远离所述衬底基板的表面至所述衬底基板的表面的距离。
例如，在本公开至少一个实施例提供的显示基板中，所述第一封装层的远离所述衬底基板的表面至所述衬底基板的表面的距离大于所述阻挡坝的远离所述衬底基板的表面至所述衬底基板的表面的距离。
例如，本公开至少一个实施例提供的显示基板还包括位于所述衬底基板上的像素界定层，其中，所述像素界定层位于所述衬底基板和所述第一封装层之间。
例如，在本公开至少一个实施例提供的显示基板中，所述像素界定层设置为单层结构，所述阻挡坝包括第一阻挡层，所述第一阻挡层与所述像素界定层同层且同材料。
例如，在本公开至少一个实施例提供的显示基板中，所述像素界定层设置为单层结构，所述阻挡坝包括彼此叠置的第一阻挡层和光刻胶层，所述第一阻挡层位于所述衬底基板和所述光刻胶层之间，以及所述第一阻挡层与所述像素界定层同层且同材料。
例如，在本公开至少一个实施例提供的显示基板中，所述像素界定层包括彼此叠置的第一界定层和第二界定层，所述第一界定层位于所述第二界定层和所述衬底基板之间，以及所述阻挡坝包括第一阻挡层和第二阻挡层，所述第一阻挡层与所述第一界定层同层且同材料，所述第二阻挡层与所述第二界定层同层且同材料。
例如，在本公开至少一个实施例提供的显示基板中，所述阻挡坝还包括至少一个光刻胶层，所述光刻胶层位于所述第一阻挡层或所述第二阻挡层的远离所述衬底基板的一侧。
例如，在本公开至少一个实施例提供的显示基板中，所述像素界定层 的材料包括聚甲基丙烯酸甲酯、聚酰亚胺和丙烯酸中至少之一。
例如，本公开至少一个实施例提供的显示基板还包括第二封装层和第三封装层，所述第二封装层位于所述第一封装层和所述衬底基板之间，所述第三封装层位于所述第一封装层的远离所述衬底基板的一侧，其中，所述第一封装层为有机层，所述第二封装层和所述第三封装层为无机层。
例如，在本公开至少一个实施例提供的显示基板中，所述阻挡坝在所述衬底基板上的正投影位于所述第一封装层和所述第二封装层在所述衬底基板上的正投影之外；以及所述第一封装层在所述衬底基板上的正投影位于所述第三封装层在所述衬底基板上的正投影之内，并且所述阻挡坝在所述衬底基板上的正投影位于所述第三封装层在所述衬底基板上的正投影之内。
例如，在本公开至少一个实施例提供的显示基板中，至少一个所述阻挡坝在所述衬底基板上的正投影位于所述第一封装层和所述第二封装层在所述衬底基板上的正投影之内，并且至少一个所述阻挡坝在所述衬底基板上的正投影位于所述第一封装层和所述第二封装层在所述衬底基板上的正投影之外；以及所述第一封装层在所述衬底基板上的正投影位于所述第三封装层在所述衬底基板上的正投影之内，并且所述阻挡坝在所述衬底基板上的正投影位于所述第三封装层在所述衬底基板上的正投影之内。
例如，本公开至少一个实施例提供的显示基板还包括多个有机发光器件，其中，所述有机发光器件位于所述显示区中，并且位于所述第一封装层和所述衬底基板之间。
例如，本公开至少一个实施例提供的显示基板还包括平坦层，其中，所述平坦层位于所述有机发光器件和所述衬底基板之间，所述阻挡坝至少部分与所述平坦层同层且同材料。
例如，在本公开至少一个实施例提供的显示基板中，所述平坦层的材料包括聚甲基丙烯酸甲酯、聚酰亚胺、环氧树脂、聚酰胺、丙烯酸。
本公开至少一个实施例提供一种显示面板，包括前述任一实施例中所述的显示基板。
本公开至少一个实施例提供一种显示基板的制备方法，包括：提供衬底基板，在所述衬底基板上限定欲形成的所述显示基板的显示区以及位于所述显示区周围的非显示区；在所述非显示区中的所述衬底基板上形成至 少一个阻挡坝；在所述显示区中的所述衬底基板上施加第一封装材料；以及固化所述第一封装材料以形成第一封装层；其中，所述阻挡坝的至少面对所述第一封装层的一侧相对于固化前的所述第一封装材料具有疏液性。
例如，在本公开至少一个实施例提供的显示基板的制备方法中，形成所述阻挡坝之后并且在所述衬底基板上施加所述第一封装材料之前，利用卤族元素对所述阻挡坝进行改性处理。
附图说明
为了更清楚地说明本发明实施例的技术方案，下面将对实施例的附图作简单地介绍，显而易见地，下面描述中的附图仅仅涉及本发明的一些实施例，而非对本发明的限制。
图1A为本公开一实施例提供的一种显示基板的部分结构的平面图；
图1B为图1A所示的显示基板沿A-B的截面图；
图2为本公开一实施例提供的另一种显示基板的截面图；
图3为本公开一实施例提供的另一种显示基板的截面图；
图4为本公开一实施例提供的另一种显示基板的截面图；
图5为本公开一实施例提供的另一种显示基板的截面图；
图6为本公开一实施例提供的另一种显示基板的截面图；
图7为本公开一实施例提供的另一种显示基板的截面图；
图8为本公开一实施例提供的另一种显示基板的截面图；以及
图9A～图9G为本公开一实施例提供的一种显示基板的制备方法的过程图。
附图标记：
100-衬底基板；101-显示区；102-非显示区；103-像素界定层；110-第一界定层；120-第二界定层；200-阻挡坝；201-第一阻挡坝；202-第二阻挡坝；203-第三阻挡坝；210-第一阻挡层；220-第二阻挡层；230-光刻胶层；240-第三阻挡层；301-第一封装材料；310-第一封装层；320-第二封装层；330-第三封装层；400-有机发光器件；410-第一电极层；420-第二电极层；430-有机发光功能层；500-薄膜晶体管；510-栅绝缘层；520-层间介质层；530-钝化层；600-平坦层。
具体实施方式
为使本发明实施例的目的、技术方案和优点更加清楚，下面将结合本发明实施例的附图，对本发明实施例的技术方案进行清楚、完整地描述。显然，所描述的实施例是本发明的一部分实施例，而不是全部的实施例。基于所描述的本发明的实施例，本领域普通技术人员在无需创造性劳动的前提下所获得的所有其他实施例，都属于本发明保护的范围。
除非另外定义，本公开使用的技术术语或者科学术语应当为本发明所属领域内具有一般技能的人士所理解的通常意义。本公开中使用的“第一”、“第二”以及类似的词语并不表示任何顺序、数量或者重要性，而只是用来区分不同的组成部分。“包括”或者“包含”等类似的词语意指出现该词前面的元件或者物件涵盖出现在该词后面列举的元件或者物件及其等同，而不排除其他元件或者物件。“连接”或者“相连”等类似的词语并非限定于物理的或者机械的连接，而是可以包括电性的连接，不管是直接的还是间接的。“上”、“下”、“左”、“右”等仅用于表示相对位置关系，当被描述对象的绝对位置改变后，则该相对位置关系也可能相应地改变。
例如，沿显示基板的周边可以设置阻挡坝，在显示基板的封装过程中，阻挡坝可以对封装材料(例如该封装材料在喷墨打印工艺中为墨液形式)进行阻挡，封装材料在干燥固化后形成封装层。如果阻挡坝高度不够，封装材料会溢流，浪费材料，而且这样可能导致封装材料形成的封装层平坦度差且厚度较小，封装层的封装效果有限。但是，如果加高阻挡坝，则会增加阻挡坝所在区域的段差，不仅会增加显示基板的设计厚度、增加制造工艺的难度，而且对显示基板的后续制备工艺产生不良影响。
本公开至少一个实施例提供一种显示基板，该显示基板包括显示区以及位于显示区周围的非显示区，该显示基板还包括衬底基板以及设置于衬底基板上的第一封装层和至少一个阻挡坝，阻挡坝位于非显示区中的衬底基板上，第一封装层位于衬底基板上并且位于至少一个阻挡坝的面向显示区的一侧，第一封装层由固化后的第一封装材料形成，阻挡坝的至少面对第一封装层的一侧相对于固化前的第一封装材料具有疏液性。在该显示基板中，阻挡坝可以防止用于获得第一封装层的第一封装材料的溢流，从而提高第一封装层的平坦度；而且，与当前的显示基板的结构相比，在阻挡坝的设计厚度相同的情况下，本公开的实施例中的阻挡坝也可以使得显示 基板在封装工艺中可以保持更多的第一封装材料，从而提高第一封装层的设计厚度。如此，本公开的实施例提供的阻挡坝可以提高显示基板的封装效果。
下面，结合附图对根据本公开至少一个实施例中的显示基板及其制备方法、显示面板进行说明。
图1A为本公开一实施例提供的一种显示基板的部分结构的平面图，图1B为图1A所示的显示基板沿A-B的截面图。
例如，在本公开至少一个实施例显示基板中，如图1A和图1B所示，显示基板包括显示区101以及位于显示区101周围的非显示区102，显示基板还包括衬底基板100，阻挡坝200位于非显示区102中的衬底基板100上，第一封装层310位于衬底基板100上并且位于阻挡坝200的面向显示区101的一侧，第一封装层310由固化后的第一封装材料(未示出，可以参考图9F中的第一封装材料301)形成，阻挡坝200的至少面对第一封装层310的一侧相对于固化前的第一封装材料具有疏液性。显示区101为图1A中虚线框所限定的区域。
下面，以衬底基板100为参考建立空间直角坐标系，对本公开下述至少一个实施例中的显示基板的各个部件的位置进行说明。示例性的，如图1A和图1B所示，在上述空间直角坐标系中，X轴和Y轴的方向平行于衬底基板100的面向阻挡坝200的表面，Z轴的方向垂直于衬底基板100的面向阻挡坝200的表面。
此外，在本公开下述至少一个实施例中，“上”和“下”、“高度”、“厚度”是以靠近衬底基板100的面向阻挡坝200的表面的距离来界定的。此外，以阻挡坝200为例，阻挡坝200的“高度”和“厚度”不受衬底基板100和阻挡坝200之间设置的其它部件(例如图6所示的薄膜晶体管500等)的限制。示例性的，以图3所示的下述的实施例为例，光刻胶层230位于第一阻挡层210之上，第一阻挡层210位于光刻胶层230之下，光刻胶层230的厚度为光刻胶层230的背离衬底基板100的表面至光刻胶层230的面向衬底基板100的表面的距离，光刻胶层230的高度为光刻胶层230的背离衬底基板100的表面至衬底基板100的面向光刻胶层230的表面的距离。
例如，如图1A和图1B所示，阻挡坝200的面向衬底基板100的表面为下表面，阻挡坝200的远离衬底基板100的表面为上表面；第一封装层 310位于衬底基板100(或者下述实施例中的有机发光器件400)之上，衬底基板100(或者下述实施例中的有机发光器件400)位于第一封装层310之下。
例如，阻挡坝200的高度为阻挡坝200的上表面至衬底基板100的面向阻挡坝200的表面的距离；阻挡坝200的厚度为阻挡坝200在Z轴方向上的尺寸。示例性的，如图1B所示，阻挡坝200的高度为h，第一封装层310的高度为H；此外，如下述实施例中的图6所示，阻挡坝200和衬底基板100之间设置有薄膜晶体管500等结构，阻挡坝200的第三阻挡坝203的高度为h3，第三阻挡坝203的厚度为L3，第一封装层310的高度为H。
例如，在显示基板的制备过程中，在阻挡坝限定的区域内施加第一封装材料。由于阻挡坝的面向第一封装层的一侧(侧表面)相对于第一封装材料具有疏液性，使得第一封装材料在侧表面上的接触角大于90度，从而阻止第一封装材料在阻挡坝的侧表面上的攀爬，并且使得第一封装材料的中心部分(显示区的部分)的高度可以大于边缘部分(靠近阻挡坝的部分)的高度。例如，第一封装材料的中心部分的高度可以大于阻挡坝的高度。与当前的显示基板相比，显示基板上施加的第一封装材料的量可以较少地受阻挡坝的高度限制，第一封装材料也更难以越过阻挡坝而溢出，从而可以形成更大厚度的第一封装层；而且，除了第一封装材料的边缘部分外，第一封装材料的中心部分(例如第一封装材料的至少位于显示区的部分)的表面基本为平面，使得第一封装材料干燥后形成的第一封装层的表面的平坦度更高。如此，可以提高显示基板的封装良率。
需要说明的是，第一封装材料需要在干燥后形成第一封装层，所以第一封装层的厚度通常会小于第一封装材料的厚度。在本公开至少一个实施例中，对第一封装层和阻挡坝的高度关系不做限制，第一封装层的高度可以大于、小于或等于阻挡坝的高度。
例如，在本公开至少一个实施例提供的显示基板中，第一封装层的远离衬底基板的表面至衬底基板的表面的距离大于阻挡坝的远离衬底基板的表面至衬底基板的表面的距离。示例性的，如图1B所示，第一封装层310的高度H大于阻挡坝200的高度h。
例如，在本公开至少一个实施例提供的显示基板中，阻挡坝的平面形状为环绕显示区的闭合环形。示例性的，如图1A所示，阻挡坝200的在 X-Y的平面内的形状为闭合环形，显示区101位于该闭合环形的内侧。如此，阻挡坝200可以进一步减少用于形成第一封装层的第一封装材料的溢流，从而进一步提高显示基板的封装良率。
图2为本公开一实施例提供的另一种显示基板的截面图。
例如，在本公开至少一个实施例提供的显示基板中，显示基板包括多个阻挡坝，并且多个阻挡坝彼此间隔排布。例如，多个阻挡坝可以环绕显示区由内向外间隔排布。如此，在实际工艺中，即使第一封装材料越过靠近显示区的阻挡坝，远离显示区的阻挡坝仍可以阻止第一封装材料溢流，可以进一步降低第一封装材料溢出的风险。
在本公开至少一个实施例中，对多个阻挡坝之间的高度关系不做限制，只要阻挡坝可以防止第一封装材料溢流即可。例如，在本公开一些实施例中，各个阻挡坝的高度相等。例如，在本公开另一些实施例中，靠近显示区的阻挡坝的高度小于远离显示区的阻挡坝的高度。如此，可以降低相邻阻挡坝之间形成的开口的深度，在进行后续工艺例如形成下述实施例中的封装层时，提高封装层成膜时的质量；而且靠近显示区的阻挡坝的高度相对较低，可以降低靠近显示区的阻挡坝对显示区中的部件的不良影响，远离显示区的阻挡坝的高度相对较高，与封装层配合，可以延长水、氧侵入路径，降低水、氧侵入的风险，新一步提高显示基板的封装效果。
例如，在本公开至少一个实施例提供的显示基板中，多个阻挡坝包括第一阻挡坝和第二阻挡坝，第一阻挡坝位于第二阻挡坝和显示区之间，以及第一阻挡坝的远离衬底基板的表面至衬底基板的表面的距离小于第二阻挡坝的远离衬底基板的表面至衬底基板的表面的距离。
又例如，在本公开至少一个实施例提供的显示基板中，多个阻挡坝包括第一阻挡坝、第二阻挡坝和第三阻挡坝，第一阻挡坝位于第二阻挡坝和显示区之间，第三阻挡坝位于第二阻挡坝的远离第一阻挡坝的一侧，并且第二阻挡坝的远离衬底基板的表面至衬底基板的表面的距离小于第三阻挡坝的远离衬底基板的表面至衬底基板的表面的距离。
示例性的，如图2所示，显示基板上设置的阻挡坝200包括有彼此间隔的第一阻挡坝201、第二阻挡坝202和第三阻挡坝203，在由靠近显示区至远离显示区的方向(X轴正方向)上，第一阻挡坝201、第二阻挡坝202和第三阻挡坝203依次排布，并且第一阻挡坝201、第二阻挡坝202和第 三阻挡坝203的高度依次增加。
在本公开至少一个实施例中，对显示基板的类型不做限制。例如，显示基板为OLED显示基板，显示基板还包括多个有机发光器件，其中，有机发光器件位于显示区中，并且位于第一封装层和衬底基板之间。示例性的，如图1B所示，有机发光器件400位于第一封装层310和衬底基板100之间，有机发光器件400包括依次叠置在衬底基板100上的第一电极层410、有机发光功能层430和第二电极层420。例如，第一电极层410和第二电极层420中之一为阳极，第一电极层410和第二电极层420中另一为阳极。第一封装层310覆盖有机发光器件400，从而防止有机发光功能层、阴极等与侵入的水、氧等外界物质发生反应而老化，从而保障有机发光器件400的性能，延长有机发光器件400的寿命；此外，第一封装层310的平坦度高并且具有较大的厚度，可以提高显示基板的表面的平整度并且缓解受到的应力，从而减少显示基板的机械损伤，对显示基板进行保护。
例如，如图1B所示，第二电极层420可以设置为多个有机发光器件400的公共驱动电极。例如，有机发光器件中的有机发光功能层可以包括空穴注入层、空穴传输层、有机发光层、电子传输层、电子注入层等，例如还可以进一步包括空穴阻挡层、电子阻挡层等。
下面，以显示基板为OLED显示基板为例，对本公开至少一个实施例中的显示基板进行说明。
图3为本公开一实施例提供的另一种显示基板的截面图。
例如，本公开至少一个实施例提供的显示基板还包括位于衬底基板上的像素界定层，像素界定层位于衬底基板和第一封装层之间。示例性的，如图3所示，像素界定层103为单层结构，像素界定层103位于第一封装层310和衬底基板100之间，有机发光器件400的有机发光功能层430可以形成在像素界定层103的开口中，这些开口将相邻的像素单元彼此间隔开以防止彼此干扰。例如，可以利用喷墨打印在像素界定层103的开口中制造有机发光功能层430的至少部分结构例如空穴注入层、空穴传输层、有机发光层等。
需要说明的是，在本公开至少一个实施例中，有机发光功能层430中的一些膜层可以通过喷墨打印形成，另一些膜层可以通过蒸镀等工艺形成。示例性的，可以先在像素界定层的开口中通过喷墨打印制造一些膜层例如 空穴注入层等，然后再通过蒸镀工艺制造另一些膜层例如有机发光层、电子注入层等，如此，随着在开口中形成的膜层的增加，开口的剩余空间的深度变小，通过蒸镀工艺，可以在不需要加厚像素界定层的厚度的同时，保证后续形成的膜层(例如有机发光层)的厚度。
图4为本公开一实施例提供的另一种显示基板的截面图。
例如，在本公开至少一个实施例提供的显示基板中，像素界定层包括彼此叠置的第一界定层和第二界定层，第一界定层位于第二界定层和衬底基板之间。示例性的，如图4所示，像素界定层103包括彼此叠置的第一界定层110和第二界定层120，第二界定层120位于第一封装层310和第一界定层110之间。例如，第二界定层120可以用于加高第一界定层110，使得第二界定层120和第一界定层110的开口容量增加，从而增加有机发光功能层430的厚度，提高有机发光器件的发光功能。例如，第二界定层120在衬底基板100上的正投影与第一界定层110在衬底基板100上的正投影重合。
在本公开至少一个实施例中，对阻挡坝的形成方式不做限制。例如，在本公开一些实施例中，阻挡坝可以单独形成，如此，阻挡坝的材料、厚度等参数不会受显示基板的制备工艺的限制。例如，在本公开另一些实施例中，可以在制造显示基板中的部件(除阻挡坝的其它部件)的工艺中，同步制造阻挡坝，如此，不需要增加显示基板的制备工艺，降低成本。
例如，在本公开至少一个实施例提供的显示基板中，像素界定层设置为单层结构，阻挡坝包括第一阻挡层，第一阻挡层与像素界定层同层且同材料。示例性的，在如图3所示的显示基板中，阻挡坝200包括第一阻挡层210。在制造显示基板的过程中，在衬底基板100上形成绝缘材料薄膜之后，可以对该绝缘材料薄膜进行构图工艺以同步形成像素界定层103和第一阻挡层210。
例如，在本公开至少一个实施例提供的显示基板中，像素界定层设置为单层结构，阻挡坝包括第一阻挡层和光刻胶层，第一阻挡层位于衬底基板和光刻胶层之间，第一阻挡层与像素界定层同层且同材料。示例性的，如图3所示的显示基板中，阻挡坝200包括光刻胶层230，光刻胶层230位于第一阻挡层210之上。在制造显示基板的过程中，可以利用光刻胶对用于形成像素界定层103和第一阻挡层210的绝缘材料薄膜进行构图工艺， 并且在完成构图工艺之后，保留第一阻挡层210上的光刻胶，从而获得光刻胶层230。光刻胶层230可以增加阻挡层200的高度，使得显示基板上可以施加更多的第一封装材料，从而提高第一封装层310的厚度，提高显示基板的封装效果。
例如，在本公开至少一个实施例提供的显示基板中，像素界定层包括彼此叠置的第一界定层和第二界定层，第一界定层位于第二界定层和衬底基板之间，阻挡坝包括第一阻挡层和第二阻挡层，并且第一阻挡层与第一界定层同层且同材料，第二阻挡层与第二界定层同层且同材料。示例性的，在如图4所示的显示基板中，阻挡坝200包括依次叠置在衬底基板100上的第一阻挡层210和第二阻挡层220。例如，在制造显示基板的过程中，可以对一薄膜进行构图工艺以形成第一界定层110和第一阻挡层210，并且对另一薄膜进行构图工艺以形成第二界定层120和第二阻挡层220。
例如，在本公开至少一个实施例提供的显示基板中，阻挡坝包括彼此叠置的第一阻挡层、第二阻挡层和至少一个光刻胶层，第一阻挡层与第一界定层同层且同材料，第二阻挡层与第二界定层同层且同材料，光刻胶层位于第一阻挡层或第二阻挡层的远离衬底基板的一侧。示例性的，在如图4所示的显示基板中，阻挡坝200包括光刻胶层230，并且第一阻挡层210和第二阻挡层220之间以及第二阻挡层220之上各设置有光刻胶层230。光刻胶层230可以利用在形成第一界定层110和第二界定层120的构图工艺中使用的光刻胶形成。光刻胶层230可以增加阻挡层200的高度，使得显示基板上可以施加更多的第一封装材料，从而提高第一封装层310的厚度，提高显示基板的封装效果。
图5为本公开一实施例提供的另一种显示基板的截面图。
例如，在本公开至少一个实施例中，像素界定层的第一界定层的厚度与第二界定层的厚度不同。如此，可以在不增加显示基板的制造工艺的情况下，使得显示基板上可以设置多个间隔排列的阻挡坝，并且沿着显示区至非显示区的方向上，多个阻挡坝的高度依次增加。
例如，在本公开至少一个实施例中，在第一界定层的厚度大于第二界定层的厚度不同的情况下，阻挡坝设置为多个，并且多阻挡坝之一与第一界定层同层且同材料，多阻挡坝之另一与第二界定层同层且同材料，多阻挡坝之另一与第一界定层和第二界定层同层且同材料。如此，至少三个阻 挡坝中的高度都彼此不同，并且形成该三个阻挡坝不会增加显示基板的制备工艺。
需要说明的是，在本公开至少一个实施例中，“同层且同材料”可以表示两个结构可以通过一个膜层形成，例如，该两个结构可以在对该膜层的同一构图工艺中形成。
下面，在像素界定包括具有不同厚度的第一界定层和第二界定层的情况下，以第一界定层的厚度大于第二界定层的厚度为例，对本公开下述至少一个实施例中的显示基板进行说明。
示例性的，如图5所示，在由靠近显示区至远离显示区的方向(X轴正方向)上，显示基板包括依次排布的第一阻挡坝201、第二阻挡坝202和第三阻挡坝203。第一阻挡坝201与第二界定层120同层且同材料；第二阻挡坝202与第一界定层110同层且同材料；并且，第三阻挡坝203的靠近衬底基板100的部分与第一界定层110同层且同材料，第三阻挡坝203的远离衬底基板100的部分与第二界定层120同层且同材料。如此，在不增加显示板的制造工艺的基础上，可以使得第三阻挡坝203的高度大于第二阻挡坝202的高度，第二阻挡坝202的高度大于第一阻挡坝201的高度。
在本公开至少一个实施例中，对第一封装层、像素界定层的厚度不做限制，可以根据实际工艺进行设计。例如，第一封装层的厚度可以为3～10微米；像素界定层为单层结构的情况下，像素界定层的厚度可以为1～2微米；以及，在像素界定层包括第一界定层和第二界定层的情况下，第一界定层的厚度可以为1～2微米，第二界定层的厚度可以为1～1.5微米。
例如，在本公开至少一个实施例中，在设置有多个阻挡坝的情况下，对各个阻挡坝之前的间隔距离不做限制。例如，在平行于X-Y的平面的方向上，阻挡坝之前的间隔距离为10～100微米，例如进一步约为30微米、50微米、80微米等。
例如，在本公开至少一个实施例中，对阻挡坝的宽度不做限制。例如，在平行于X-Y的平面的方向上，阻挡坝的宽度为10～100微米，例如进一步约为30微米、50微米、80微米等。
在本公开至少一个实施例中，对第一界定层和第二界定层的材料不做限制。例如，第一界定层可以为高分子树脂材料例如聚甲基丙烯酸甲酯、聚酰亚胺和丙烯酸等中的一种或多种，或者也可以为光刻胶。例如，第二 界定层可以为高分子树脂材料例如聚酰亚胺等。需要说明的是，在阻挡坝的第一阻挡层与第一界定层同层且同材料的情况下，如果第一界定层为光刻胶，则第一阻挡层的远离衬底基板的表面上可以不需要形成光刻胶层。
图6为本公开一实施例提供的另一种显示基板的截面图。
例如，本公开至少一个实施例提供的显示基板还包括平坦层，平坦层位于有机发光器件和衬底基板之间。示例性的，如图6所示，在有机发光器件400和衬底基板100之间设置平坦层600。在显示基板的制造过程中，在形成有机发光器件400之前，平坦层600可以将显示基板的表面平坦化，从而提高有机发光器件400的良率。
例如，在本公开至少一个实施例中，阻挡坝至少部分与平坦层同层且同材料。示例性的，如图6所示，阻挡坝200的靠近衬底基板的部分与平坦层600同层且同材料。如此，可以增加阻挡坝200的厚度，在完成对显示基板的封装(例如形成下述实施例中的第三封装层)后，可以延长水、氧等侵入显示基板内部的路径，降低水、氧等侵入的风险，提高显示基板的封装效果。
在本公开至少一个实施例中，对平坦层的材料不做限制。例如，平坦层的材料可以为亚克力系材料，该亚克力系材料可以为聚甲基丙烯酸甲酯、聚酰亚胺、环氧树脂、聚酰胺、丙烯酸等材料的一种或多种，或者也可以为其他合适的材料。
在本公开至少一个实施例中，对显示基板的封装方式不做限制。例如，显示基板可以用单层薄膜(第一封装层)进行封装，也可以用多层薄膜(包括第一封装层)进行封装。多层薄膜封装可以进一步提高显示基板的封装效果。
图7为本公开一实施例提供的另一种显示基板的截面图。
例如，本公开至少一个实施例提供的显示基板还包括第二封装层和第三封装层，第二封装层位于第一封装层和衬底基板之间，第三封装层位于第一封装层的远离衬底基板的一侧。示例性的，如图7所示，在第一封装层310和有机发光器件400之间设置第二封装层320，在第一封装层310之上设置第三封装层330。第一封装层310、第二封装层320和第三封装层330构成的复合封装叠层可以进一步提高对显示基板的封装效果。
例如，第一封装层为有机层，第二封装层和第三封装层为无机层。例 如，第二封装层和第三封装层的材料可以为氮化硅、氧化硅、氮氧化硅、氟化物等无机材料，无机材料的致密性高，可以防止水、氧等的侵入。例如，第一封装层包括有机材料，例如聚对苯二甲酸乙二醇酯、聚丙烯酸酯等高分子树脂。如此，第一封装层可以缓解第二封装层和第三封装层的应力，并且第一封装层中可以设置例如干燥剂等材料，在对显示基板进行封装的同时还可以吸收侵入内部的水、氧等物质，对显示基板中的部件进行进一步保护。例如，干燥剂可以包括吸水性材料，例如碱金属(例如Li、Na)、碱土金属(例如Ba、Ca)或其它湿气反应性金属(例如Al、Fe)；还可以为碱金属氧化物(例如Li2O、Na2O)、碱土金属氧化物(例如MgO、CaO、BaO)、硫酸盐(例如无水MgSO4)、金属卤化物(例如CaCl2)或高氯酸盐(例如Mg(ClO4)2)等，以吸收侵入内部的水、氧等物质。
在本公开至少一个实施例中，对第二封装层和第三封装层的厚度不做限制。例如，第二封装层和第三封装层的厚度不大于1微米。
例如，在本公开至少一个实施例提供的显示基板中，阻挡坝在衬底基板上的正投影位于第二封装层在衬底基板上的正投影之外，第一封装层在衬底基板上的正投影位于第三封装层在衬底基板上的正投影之内，并且阻挡坝在衬底基板上的正投影位于第三封装层在衬底基板上的正投影之内。示例性的，如图7所示，第二封装层320位于阻挡坝200的面向显示区的一侧，如此，阻挡坝200不会被第二封装层320覆盖，保障阻挡坝200的阻挡第一封装材料的效果；此外，第三封装层330覆盖第一封装层310，可以防止外界水、氧等进入第一封装层310中，而且第三封装层330覆盖阻挡坝200，第三封装层330和阻挡坝200配合可以增加外界水、氧等侵入显示基板内部的路径。如此，第一封装层310、第二封装层320和第三封装层330可以进一步提高显示基板的封装效果。
图8为本公开一实施例提供的另一种显示基板的截面图。
需要说明的是，在本公开至少一个实施例中，在显示基板上设置有多个阻挡坝的情况下，可以将第二封装层设置为覆盖至少一个阻挡坝且未覆盖至少一个阻挡坝，从而提高显示基板的封装效果。例如，在本公开至少一个实施例提供的显示基板中，至少一个阻挡坝在衬底基板上的正投影位于第一封装层和第二封装层在衬底基板上的正投影之内，并且至少一个阻挡坝在衬底基板上的正投影位于第一封装层和第二封装层在衬底基板上的 正投影之外；以及第一封装层在衬底基板上的正投影位于第三封装层在衬底基板上的正投影之内，并且阻挡坝在衬底基板上的正投影位于第三封装层在衬底基板上的正投影之内。
示例性的，如图8所示，在由靠近显示区至远离显示区的方向(X轴正方向)上，显示基板包括依次排布的第一阻挡坝201、第二阻挡坝202和第三阻挡坝203，并且第二封装层320设置为覆盖第一阻挡坝201，第二阻挡坝202和第三阻挡坝203未被第二封装层220覆盖。如此，第一阻挡坝201提升了第二封装层320的封装效果，用于形成第一封装层310的第一封装材料仍会被第二阻挡坝202和第三阻挡坝203阻挡。如此，可以在保证第一封装层的厚度、平坦度等的情况下，进一步提高显示基板的封装效果。
例如，在本公开至少一个实施例提供中，显示基板还可以包括设置在衬底基板上的驱动电路层等结构。例如，驱动电路层包括多个开关元件、电容、栅线、数据线、电源线等，这些开关元件例如为薄膜晶体管，例如薄膜晶体管与有机发光器件连接从而对有机发光器件的电学功能进行控制。示例性的，如图6-图8所示的实施例中，显示基板包括驱动电路层，该驱动电路层包括多个薄膜晶体管500(图中示出一个为例)以及配合薄膜晶体管500设置的层间结构例如栅绝缘层510、层间介质层520和钝化层530等。
需要说明的是，在本公开至少一个实施例中，对薄膜晶体管的类型不做限制。薄膜晶体管可以为顶栅型、底栅型、双栅型等。栅绝缘层、层间介质层和钝化层等层间结构的设置位置可以根据薄膜晶体管的类型进行设置。
本公开至少一个实施例提供一种显示面板，包括前述任一实施例中的显示基板。例如，显示面板可以包括与显示基板对置的封装盖板，该封装盖板可以位于第一封装层(或者第三封装层)之上，封装盖板可以对显示基板中的部件进行进一步的保护。例如，该显示面板可以为电视、数码相机、手机、手表、平板电脑、笔记本电脑、导航仪等任何具有显示功能的产品或者部件。
需要说明的是，为表示清楚，本公开并没有叙述本公开至少一个实施例中的显示面板的全部结构。为实现显示面板的必要功能，本领域技术人 员可以根据具体应用场景设置其他结构(例如触控结构等)，本公开的实施例对此不作限制。
本公开至少一个实施例提供一种显示基板的制备方法，包括：提供衬底基板，在衬底基板上限定欲形成的显示基板的显示区以及位于显示区周围的非显示区；在非显示区中的衬底基板上形成至少一个阻挡坝；在显示区中的衬底基板上施加第一封装材料；以及固化第一封装材料以形成第一封装层，阻挡坝的至少面对第一封装层的一侧相对于固化前的第一封装材料具有疏液性。在利用上述制备方法获得的显示基板中，阻挡坝可以防止用于获得第一封装层的第一封装材料的溢流，从而提高第一封装层的平坦度，并且使得显示基板在封装工艺中可以保持更多的第一封装材料，从而提高第一封装层的设计厚度，提高显示基板的封装效果。利用上述制备方法获得的显示基板的结构可以参考前述实施例中的相关说明，在此不作赘述。
例如，在本公开至少一个实施例提供的显示基板的制备方法中，形成阻挡坝之后并且在衬底基板上施加第一封装材料之前，利用卤族元素和/或惰性气体对阻挡坝进行改性处理。例如该改性处理可以为等离子处理或离子掺杂处理；并且，例如改性处理可以使用掩模以限制改性处理区域。该卤族元素例如为氟元素、氯元素和溴元素等。例如，在等离子处理中可以这些卤族元素的有机物来得到相应等离子体，由此在阻挡坝的表面产生具有疏液性覆层。卤族元素可以使得至少阻挡坝的表面的材料改性，从而阻挡坝相对于第一封装材料具有疏液性。示例性的，第一封装材料的溶剂为水，掺杂卤族元素后，阻挡坝具有疏水性。例如，该惰性气体可以为氦气、氖气、氩气、氪气等。例如，以惰性气体为氩气为例，可以利用氩和氢的等离子体对阻挡坝进行改性处理。
图9A～图9G为本公开一实施例提供的一种显示基板的制备方法的过程图。
下面，以制造如图7所示的显示基板为例，对本公开至少一个实施例中的显示基板的制备方法进行说明。示例性的，如图9A～图9G和图7所示，本公开至少一个实施例提供的显示基板的制备方法的过程如下。
如图9A所示，提供衬底基板100，并且在衬底基板100上形成驱动电路层，该驱动电路层包括多个薄膜晶体管500(图中仅示出一个为例)，例 如，在衬底基板100上依次形成栅电极、栅绝缘层510、有源层、层间介质层520、源漏电极层、钝化层530等，该源漏电极层包括彼此间隔开的源极和漏极，该薄膜晶体管500为底栅型薄膜晶体管；然后，在衬底基板100上形成平坦层600，以平坦化显示基板的表面；然后，对平坦层600进行构图工艺处理，以在平坦层600和钝化层530中形成过孔；然后，在平坦层600上形成第一电极层410，第一电极层410通过上述过孔例如与源漏电极层中的漏电极电连接。
需要说明的是，在对平坦层600进行构图工艺的过程中，可以使得平坦层600的位于非显示区102的部分形成为第一阻挡坝的第一部分201a、第二阻挡坝的第一部分202a和第三阻挡坝的第一部分203a。
例如，在本公开至少一个实施例中，构图工艺可以为光刻构图工艺，例如可以包括：在需要被构图的结构层上涂覆光刻胶，使用掩模板对光刻胶进行曝光，对曝光的光刻胶进行显影以得到光刻胶图案，使用光刻胶图案对结构层进行蚀刻，然后可选地去除光刻胶图案。需要说明的是，如果被构图的结构层包括光刻胶，则可以不需要再进行涂覆光刻胶的工艺。
如图9A～图9B所示，在衬底基板100上形成第一界定层110，对第一界定层110进行构图工艺，在显示区101的第一界定层110中形成多个开口，并且使得第一界定层110的位于非显示区102的部分形成为第二阻挡坝的第二部分202b和第三阻挡坝的第二部分203b。第二阻挡坝和第三阻挡坝为在后续工艺中欲形成的阻挡坝。
如图9B～图9C所示，在衬底基板100上形成第二界定层120，对第二界定层120进行构图工艺，在显示区101的第二界定层120中形成多个开口，并且使得第二界定层120的位于非显示区102的部分形成为第一阻挡坝的第二部分201b和第三阻挡坝的第三部分203c。如此，可以获得第一阻挡坝201、第二阻挡坝202和第三阻挡坝203，第一界定层110和第二界定层120可以形成像素界定层103。
需要说明的是，形成第一阻挡坝201、第二阻挡坝202和第三阻挡坝203的材料可以相对于第一封装材料具有疏液性；或者，利用卤族元素对第一阻挡坝201、第二阻挡坝202和第三阻挡坝203进行改性处理，以使得第一阻挡坝201、第二阻挡坝202和第三阻挡坝203相对于第一封装材料具有疏液性。
如图9C～图9D所示，在像素界定层103的开口中形成有机发光功能层430，然后在有机发光功能层430上形成第二电极层420。第一电极层410、有机发光功能层430和第二电极层420形成为有机发光器件400。
如图9D～图9E所示，在有机发光器件400沉积无机材料薄膜以形成第二封装层320，第二封装层320形成在第一阻挡坝201的面向显示区的一侧。
如图9E～图9F所示，在第二封装层320上施加包括有机材料的第一封装材料301，第一封装材料301的高度大于第一阻挡坝201的高度，并且第一阻挡坝201阻挡第一封装材料301以使得第一封装材料301不能延伸至第二阻挡坝202。例如，利用喷墨打印方法施加第一封装材料301。例如，还可以通过旋涂等方式施加第一封装材料301。
如图9F～图9G所示，干燥第一封装材料301，使得第一封装材料301形成为第一封装层310。第一封装层310形成在第一阻挡坝201的面向显示区的一侧，并且第一封装层310的高度大于第一阻挡坝201的高度。
如图9G和图7所示，在第一封装层310上沉积无机材料薄膜以形成第三封装层330。第三封装层330覆盖第一封装层310，并且第三封装层330覆盖第一阻挡坝201、第二阻挡坝202和第三阻挡坝203。
本公开至少一个实施例提供一种显示基板及其制备方法、显示面板，并且可以具有以下至少一项有益效果：
(1)在本公开至少一个实施例提供的显示基板中，阻挡坝可以防止用于获得第一封装层的第一封装材料的溢流，从而提高第一封装层的平坦度，和设计厚度，从而提高显示基板的封装效果。
(2)在本公开至少一个实施例提供的显示基板中，阻挡坝中的至少部分结构可以与像素界定层同层且同材料，不需要增加显示基板的制备工艺，降低成本。
(3)在本公开至少一个实施例提供的显示基板中，阻挡坝中的部分结构可以为光刻胶层，在增加阻挡坝的设计高度的基础上，不会增加显示基板的制备工艺。
对于本公开，还有以下几点需要说明：
(1)本公开实施例附图只涉及到与本公开实施例涉及到的结构，其他结构可参考通常设计。
(2)为了清晰起见，在用于描述本公开的实施例的附图中，层或区域的厚度被放大或缩小，即这些附图并非按照实际的比例绘制。
(3)在不冲突的情况下，本公开的实施例及实施例中的特征可以相互组合以得到新的实施例。
以上，仅为本公开的具体实施方式，但本公开的保护范围并不局限于此，本公开的保护范围应以权利要求的保护范围为准。

Claims (21)

  1. 一种显示基板，包括显示区以及位于所述显示区周围的非显示区，所述显示基板还包括：
    衬底基板；
    至少一个阻挡坝，位于所述非显示区中的所述衬底基板上；以及
    第一封装层，位于所述衬底基板上，并且位于至少一个所述阻挡坝的面向所述显示区的一侧；
    其中，所述第一封装层由固化后的第一封装材料形成，所述阻挡坝的至少面对所述第一封装层的一侧相对于固化前的所述第一封装材料具有疏液性。
  2. 根据权利要求1所述的显示基板，其中，所述阻挡坝的平面形状为环绕所述显示区的闭合环形。
  3. 根据权利要求1或2所述的显示基板，其中，所述显示基板包括多个所述阻挡坝，并且多个所述阻挡坝彼此间隔排布。
  4. 根据权利要求3所述的显示基板，其中，
    多个所述阻挡坝包括第一阻挡坝和第二阻挡坝，所述第一阻挡坝位于所述第二阻挡坝和所述显示区之间，以及
    所述第一阻挡坝的远离所述衬底基板的表面至所述衬底基板的表面的距离小于所述第二阻挡坝的远离所述衬底基板的表面至所述衬底基板的表面的距离。
  5. 根据权利要求4所述的显示基板，其中，
    多个所述阻挡坝还包括第三阻挡坝，所述第三阻挡坝位于所述第二阻挡坝的远离所述第一阻挡坝的一侧，以及
    所述第二阻挡坝的远离所述衬底基板的表面至所述衬底基板的表面的距离小于所述第三阻挡坝的远离所述衬底基板的表面至所述衬底基板的表面的距离。
  6. 根据权利要求1-5中任一项所述的显示基板，其中，所述第一封装层的远离所述衬底基板的表面至所述衬底基板的表面的距离大于所述阻挡坝的远离所述衬底基板的表面至所述衬底基板的表面的距离。
  7. 根据权利要求1-6中任一项所述的显示基板，还包括位于所述衬底 基板上的像素界定层，
    其中，所述像素界定层位于所述衬底基板和所述第一封装层之间。
  8. 根据权利要求7所述的显示基板，其中，所述像素界定层设置为单层结构，所述阻挡坝包括第一阻挡层，所述第一阻挡层与所述像素界定层同层且同材料。
  9. 根据权利要求7所述的显示基板，其中，所述像素界定层设置为单层结构，所述阻挡坝包括彼此叠置的第一阻挡层和光刻胶层，所述第一阻挡层位于所述衬底基板和所述光刻胶层之间，以及
    所述第一阻挡层与所述像素界定层同层且同材料。
  10. 根据权利要求7所述的显示基板，其中，
    所述像素界定层包括彼此叠置的第一界定层和第二界定层，所述第一界定层位于所述第二界定层和所述衬底基板之间，以及
    所述阻挡坝包括第一阻挡层和第二阻挡层，所述第一阻挡层与所述第一界定层同层且同材料，所述第二阻挡层与所述第二界定层同层且同材料。
  11. 根据权利要求10所述的显示基板，其中，
    所述阻挡坝还包括至少一个光刻胶层，所述光刻胶层位于所述第一阻挡层或所述第二阻挡层的远离所述衬底基板的一侧。
  12. 根据权利要求7-11中任一项所述的显示基板，其中，
    所述像素界定层的材料包括聚甲基丙烯酸甲酯、聚酰亚胺和丙烯酸中至少之一。
  13. 根据权利要求1-12中任一项所述的显示基板，还包括：
    第二封装层，位于所述第一封装层和所述衬底基板之间；以及
    第三封装层，位于所述第一封装层的远离所述衬底基板的一侧；
    其中，所述第一封装层为有机层，所述第二封装层和所述第三封装层为无机层。
  14. 根据权利要求13所述的显示基板，其中，
    所述阻挡坝在所述衬底基板上的正投影位于所述第一封装层和所述第二封装层在所述衬底基板上的正投影之外；以及
    所述第一封装层在所述衬底基板上的正投影位于所述第三封装层在所述衬底基板上的正投影之内，并且所述阻挡坝在所述衬底基板上的正投影位于所述第三封装层在所述衬底基板上的正投影之内。
  15. 根据权利要求13所述的显示基板，其中，
    至少一个所述阻挡坝在所述衬底基板上的正投影位于所述第一封装层和所述第二封装层在所述衬底基板上的正投影之内，并且至少一个所述阻挡坝在所述衬底基板上的正投影位于所述第一封装层和所述第二封装层在所述衬底基板上的正投影之外；以及
    所述第一封装层在所述衬底基板上的正投影位于所述第三封装层在所述衬底基板上的正投影之内，并且所述阻挡坝在所述衬底基板上的正投影位于所述第三封装层在所述衬底基板上的正投影之内。
  16. 根据权利要求1-15中任一项所述的显示基板，还包括多个有机发光器件，
    其中，所述有机发光器件位于所述显示区中，并且位于所述第一封装层和所述衬底基板之间。
  17. 根据权利要求1-16中任一项所述的显示基板，还包括平坦层，其中，所述平坦层位于所述有机发光器件和所述衬底基板之间，所述阻挡坝至少部分与所述平坦层同层且同材料。
  18. 根据权利要求17所述的显示基板，其中，
    所述平坦层的材料包括聚甲基丙烯酸甲酯、聚酰亚胺、环氧树脂、聚酰胺、丙烯酸。
  19. 一种显示面板，包括权利要求1-18中任一项所述的显示基板。
  20. 一种显示基板的制备方法，包括：
    提供衬底基板，在所述衬底基板上限定欲形成的所述显示基板的显示区以及位于所述显示区周围的非显示区；
    在所述非显示区中的所述衬底基板上形成至少一个阻挡坝；
    在所述显示区中的所述衬底基板上施加第一封装材料；以及
    固化所述第一封装材料以形成第一封装层；
    其中，所述阻挡坝的至少面对所述第一封装层的一侧相对于固化前的所述第一封装材料具有疏液性。
  21. 根据权利要求20所述的制备方法，其中，
    形成所述阻挡坝之后并且在所述衬底基板上施加所述第一封装材料之前，利用卤族元素和/或惰性气体对所述阻挡坝进行改性处理。
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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112599702A (zh) * 2020-12-14 2021-04-02 合肥维信诺科技有限公司 显示面板制造方法、显示面板和显示装置
CN115224220A (zh) * 2022-08-02 2022-10-21 维信诺科技股份有限公司 显示面板、显示装置及显示面板的制备方法

Families Citing this family (34)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109904336B (zh) * 2017-12-07 2020-06-30 京东方科技集团股份有限公司 电子装置基板及制造方法/显示装置
CN109037289B (zh) * 2018-08-01 2021-02-19 京东方科技集团股份有限公司 显示基板及其制备方法、显示面板
CN109638049B (zh) 2018-12-13 2021-06-01 武汉华星光电半导体显示技术有限公司 显示面板
CN109841752B (zh) * 2019-01-29 2021-09-28 云谷（固安）科技有限公司 显示面板及显示装置
CN109888116A (zh) * 2019-02-14 2019-06-14 固安翌光科技有限公司 一种高稳定性的oled器件及其制备方法
CN109888125B (zh) * 2019-02-28 2021-06-22 武汉华星光电半导体显示技术有限公司 一种显示面板及其制作方法
CN109904346B (zh) * 2019-02-28 2021-03-26 云谷（固安）科技有限公司 显示装置、显示面板及其制作方法
CN109920933B (zh) * 2019-03-05 2021-02-09 京东方科技集团股份有限公司 显示基板及其制造方法，显示面板、显示装置
US20220181582A1 (en) * 2019-03-28 2022-06-09 Sharp Kabushiki Kaisha Display device, and method for manufacturing display device
CN110061149B (zh) * 2019-04-28 2020-11-10 福州大学 一种柔性oled器件薄膜封装方法
CN112133706A (zh) * 2019-06-25 2020-12-25 上海箩箕技术有限公司 半导体结构及其形成方法
CN110265579A (zh) 2019-06-27 2019-09-20 京东方科技集团股份有限公司 一种显示面板及其制作方法、显示装置
CN119012830A (zh) * 2019-08-01 2024-11-22 京东方科技集团股份有限公司 显示基板及显示装置
CN110600631A (zh) * 2019-08-28 2019-12-20 武汉华星光电半导体显示技术有限公司 显示面板及显示装置
CN113068416B (zh) * 2019-11-01 2025-01-17 京东方科技集团股份有限公司 显示面板及其制作方法、显示装置
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CN110752318B (zh) * 2019-11-28 2022-12-06 昆山国显光电有限公司 显示面板
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CN110931536A (zh) * 2019-12-12 2020-03-27 武汉天马微电子有限公司 一种有机发光显示面板及显示装置
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WO2022160635A1 (zh) * 2021-01-28 2022-08-04 京东方科技集团股份有限公司 显示面板及其制作方法、显示装置
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CN114284456B (zh) * 2021-12-29 2023-11-10 湖北长江新型显示产业创新中心有限公司 一种显示面板及显示装置
CN114430014B (zh) * 2022-01-28 2024-06-21 京东方科技集团股份有限公司 显示基板及其制备方法、显示装置
CN115224219A (zh) * 2022-08-02 2022-10-21 维信诺科技股份有限公司 显示面板、显示面板制备方法及显示装置
CN115275069A (zh) * 2022-08-30 2022-11-01 昆山国显光电有限公司 显示面板、显示装置及显示面板的制作方法
CN116013937A (zh) * 2023-01-03 2023-04-25 京东方科技集团股份有限公司 显示面板及显示装置
WO2024197749A1 (zh) * 2023-03-30 2024-10-03 京东方科技集团股份有限公司 发光基板及其制备方法、背光模组、显示装置

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101908599A (zh) * 2009-06-08 2010-12-08 松下电器产业株式会社 功能膜制造方法
CN104900681A (zh) * 2015-06-09 2015-09-09 上海天马有机发光显示技术有限公司 有机发光显示面板及其形成方法
CN105914224A (zh) * 2016-05-04 2016-08-31 京东方科技集团股份有限公司 一种有机发光二极管显示基板及其制作方法、显示装置
US20170149017A1 (en) * 2014-06-25 2017-05-25 Lg Display Co., Ltd. Organic light emitting display apparatus
CN106953029A (zh) * 2017-03-22 2017-07-14 京东方科技集团股份有限公司 一种薄膜封装方法及封装薄膜、喷墨打印设备
CN107507931A (zh) * 2017-08-23 2017-12-22 京东方科技集团股份有限公司 Oled显示基板的封装方法、封装结构及显示装置
CN206893618U (zh) * 2017-07-18 2018-01-16 京东方科技集团股份有限公司 一种有机显示面板以及有机显示装置
CN109037289A (zh) * 2018-08-01 2018-12-18 京东方科技集团股份有限公司 显示基板及其制备方法、显示面板

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7109653B2 (en) 2002-01-15 2006-09-19 Seiko Epson Corporation Sealing structure with barrier membrane for electronic element, display device, electronic apparatus, and fabrication method for electronic element
JP5612691B2 (ja) * 2010-08-06 2014-10-22 パナソニック株式会社 有機ｅｌ素子およびその製造方法
KR102218573B1 (ko) 2013-09-30 2021-02-23 삼성디스플레이 주식회사 표시 장치 및 표시 장치의 제조 방법
CN104659287B (zh) * 2015-03-12 2017-05-31 京东方科技集团股份有限公司 像素界定层及制备方法、显示基板及制备方法、显示装置
KR101763616B1 (ko) * 2015-07-29 2017-08-02 삼성디스플레이 주식회사 유기 발광 표시 장치
CN105304676A (zh) * 2015-09-22 2016-02-03 深圳市华星光电技术有限公司 柔性有机电致发光器件的封装结构、柔性显示装置
JP6807178B2 (ja) 2016-07-07 2021-01-06 株式会社ジャパンディスプレイ 表示装置、表示装置の製造方法
JP2018054874A (ja) 2016-09-29 2018-04-05 株式会社ジャパンディスプレイ 表示装置
KR20180054386A (ko) * 2016-11-15 2018-05-24 엘지디스플레이 주식회사 유기 발광 표시 장치
KR20180060851A (ko) * 2016-11-29 2018-06-07 엘지디스플레이 주식회사 유기 발광 표시 장치
KR102470042B1 (ko) * 2017-11-16 2022-11-24 삼성디스플레이 주식회사 표시 장치
CN108461653A (zh) * 2018-04-04 2018-08-28 武汉华星光电半导体显示技术有限公司 柔性oled屏幕、柔性面板薄膜封装结构和封装方法
US10637002B2 (en) * 2018-05-17 2020-04-28 Wuhan China Star Optoelectronics Semiconductor Display Technology Co., Ltd. Organic light emitting diode display panel, manufacturing method thereof, and organic light emitting diode display apparatus

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101908599A (zh) * 2009-06-08 2010-12-08 松下电器产业株式会社 功能膜制造方法
US20170149017A1 (en) * 2014-06-25 2017-05-25 Lg Display Co., Ltd. Organic light emitting display apparatus
CN104900681A (zh) * 2015-06-09 2015-09-09 上海天马有机发光显示技术有限公司 有机发光显示面板及其形成方法
CN105914224A (zh) * 2016-05-04 2016-08-31 京东方科技集团股份有限公司 一种有机发光二极管显示基板及其制作方法、显示装置
CN106953029A (zh) * 2017-03-22 2017-07-14 京东方科技集团股份有限公司 一种薄膜封装方法及封装薄膜、喷墨打印设备
CN206893618U (zh) * 2017-07-18 2018-01-16 京东方科技集团股份有限公司 一种有机显示面板以及有机显示装置
CN107507931A (zh) * 2017-08-23 2017-12-22 京东方科技集团股份有限公司 Oled显示基板的封装方法、封装结构及显示装置
CN109037289A (zh) * 2018-08-01 2018-12-18 京东方科技集团股份有限公司 显示基板及其制备方法、显示面板

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112599702A (zh) * 2020-12-14 2021-04-02 合肥维信诺科技有限公司 显示面板制造方法、显示面板和显示装置
CN115224220A (zh) * 2022-08-02 2022-10-21 维信诺科技股份有限公司 显示面板、显示装置及显示面板的制备方法

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