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WO2019033722A1 - 电磁屏蔽膜的导电层、电磁屏蔽膜及其制备方法 - Google Patents

电磁屏蔽膜的导电层、电磁屏蔽膜及其制备方法 Download PDF

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Publication number
WO2019033722A1
WO2019033722A1 PCT/CN2018/075982 CN2018075982W WO2019033722A1 WO 2019033722 A1 WO2019033722 A1 WO 2019033722A1 CN 2018075982 W CN2018075982 W CN 2018075982W WO 2019033722 A1 WO2019033722 A1 WO 2019033722A1
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WO
WIPO (PCT)
Prior art keywords
conductive layer
conductive
electromagnetic shielding
layer
powder
Prior art date
Application number
PCT/CN2018/075982
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English (en)
French (fr)
Inventor
闫勇
高小君
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苏州城邦达力材料科技有限公司
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Priority to KR2020187000027U priority Critical patent/KR20190001141U/ko
Publication of WO2019033722A1 publication Critical patent/WO2019033722A1/zh

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • H05K9/0083—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising electro-conductive non-fibrous particles embedded in an electrically insulating supporting structure, e.g. powder, flakes, whiskers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • H05K9/0088—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising a plurality of shielding layers; combining different shielding material structure

Definitions

  • the present invention relates to the field of electromagnetic shielding technology, and in particular to a conductive layer of an electromagnetic shielding film and an electromagnetic shielding film.
  • Electromagnetic shielding is widely used in communications, electronic products, network hardware, medical instruments, aerospace and defense.
  • electromagnetic shielding is the separation of metal between two spatial regions to control electric, magnetic and electromagnetic waves.
  • the shield is used to surround the components, circuits, assemblies, cables, or interference sources of the entire system to prevent interference electromagnetic fields from spreading outward, or to surround the receiving circuits, devices, or systems with shields to prevent them.
  • the electromagnetic shielding film is a commonly used shielding body under the influence of external electromagnetic fields.
  • the coating machine is mainly used for the surface coating process of film, paper, etc. It is a machine for coating a roll of substrate with a special function of glue, paint or ink, and then winding and storing it after drying. .
  • the coating machine adopts a special multi-functional coating head, which can realize various forms of surface coating production. Since the development of the coating machine, laser transfer, bronzing, optical film, protective film, electronic film and dielectric exchange film have been realized. Coating process.
  • the coating production process of the existing electromagnetic shielding film is mainly to apply an insulating layer on the carrier film, and after drying and hardening the surface of the insulating layer, according to actual needs, the metal layer is processed on the outer side of the insulating layer to form a semi-finished product, and The outer side of the semi-finished product is coated with a conductive layer glue. Usually, the thickness of the conductive layer is 5-15 um. Finally, a protective film is attached on the outer side of the conductive layer to obtain an electromagnetic shielding film. In the manufacturing process of the electromagnetic shielding film, the shielding performance and the flatness of the electromagnetic shielding film often fail to balance.
  • the object of the embodiments of the present invention includes providing a conductive layer of an electromagnetic shielding film and an electromagnetic shielding film to solve the technical problems existing in the prior art.
  • the conductive layer of the electromagnetic shielding film provided by the embodiment of the present invention includes a first conductive layer and a second conductive layer coated on one side of the first conductive layer;
  • the conductive powder of the first conductive layer comprises a dendritic conductive powder, and the conductive particles of the dendritic conductive powder have a particle diameter of 5-20 um;
  • the conductive powder of the second conductive layer comprises a sheet-like conductive powder or a spherical conductive powder, and the particle diameter of the conductive particles of the sheet-like conductive powder or the spherical conductive powder is the same as the thickness of the second conductive layer.
  • the first conductive layer has a thickness of 5-10 um.
  • the conductive particles of the sheet-like conductive powder or the spherical conductive powder have a particle diameter of 1-3 um, and the second conductive layer has a thickness of 1-3 um.
  • the dendritic conductive powder has a powder content of 30-40% in the first conductive layer.
  • the conductive particles of the first conductive layer and the second conductive layer comprise one or more of silver, copper, iron, nickel, zinc, a silver alloy, a copper alloy, an iron alloy, a nickel alloy, and a zinc alloy. .
  • the material of the first conductive layer comprises a thermosetting epoxy resin, an acrylic resin or a polyurethane.
  • the material of the second conductive layer comprises a thermosetting epoxy resin, an acrylic resin or a polyurethane.
  • a side of the first conductive layer away from the second conductive layer is further coated with a third conductive layer, and the third conductive layer includes a metal layer and/or a graphene layer.
  • the conductive powder of the second conductive layer (200) includes at least one of a sheet-like conductive powder and a spherical conductive powder.
  • the present invention also provides an electromagnetic shielding film comprising the conductive layer of the electromagnetic shielding film according to any one of the above aspects.
  • the carrier film, the insulating layer and the protective film are further included;
  • the insulating layer is coated on one side of the carrier film, the first conductive layer is coated on a side of the insulating layer facing away from the carrier film, and the protective film is attached to the second conductive layer to face away from One side of the first conductive layer is disposed.
  • the material of the insulating layer comprises a thermosetting epoxy resin, an acrylic resin or a polyurethane glue.
  • the material of the protective film comprises a release film or a release paper.
  • a metal layer or a graphene layer is further disposed between the insulating layer and the conductive layer of the electromagnetic shielding film.
  • the embodiment of the invention further provides a method for preparing an electromagnetic shielding film, comprising:
  • a second conductive layer is formed on a side of the first conductive layer away from the insulating layer, and the conductive powder of the second conductive layer (200) comprises a sheet-like conductive powder or a spherical conductive powder.
  • the method further includes:
  • An insulating material is coated on one side of the carrier film to form an insulating layer, and the first conductive layer is disposed on a side of the insulating layer away from the carrier film.
  • the method further includes:
  • a metal layer or a graphene layer is formed on a side of the insulating layer away from the carrier film to form a third conductive layer.
  • the method further includes:
  • a protective film is attached to a side of the second conductive layer away from the first conductive layer.
  • the conductive layer of the electromagnetic shielding film provided by the embodiment of the invention includes a first conductive layer and a second conductive layer, and the second conductive layer is coated on one side of the first conductive layer, and the electromagnetic shielding film is improved by using two conductive layers.
  • the appearance of the conductive layer is rough and uneven, and the electromagnetic shielding film can have better electrical conductivity and shielding effectiveness.
  • the conductive powder of the first conductive layer includes a dendritic conductive powder, and the dendritic conductive powder is excellent in mutual adhesion due to a dendritic shape, and can be electrically conductive in horizontal and vertical directions, and is dendritic conductive.
  • the particle size of the conductive particles of the powder is 5-20 um. Since the particle size of the conductive particles of the first conductive layer is larger, the adhesion between the conductive particles is further increased, so that the first conductive layer has good electrical conductivity and Shield performance.
  • the conductive layer of the electromagnetic shielding film In order to prevent the particle size of the conductive particles of the first conductive layer from being excessively large, and the coating thickness is small, the conductive layer of the electromagnetic shielding film has a rough appearance and unevenness, and the second conductive layer is coated on one side of the first conductive layer due to The thickness of the conductive layer of the overall electromagnetic shielding film is not increased, so that the cost is not increased, and since the conductive particles of the first conductive layer have a large particle diameter, the conductive properties of the conductive layer of the electromagnetic shielding film are not lowered. Shield performance.
  • the conductive powder of the second conductive layer comprises a sheet-like conductive powder or a spherical conductive powder, and the sheet-like conductive powder or the spherical conductive powder provides the second conductive layer with good electrical conductivity, thereby enabling the second conductive layer to be electrically conductive with the first conductive layer.
  • the layer is turned on, and since the particle diameter of the conductive particles of the sheet-like conductive powder or the spherical conductive powder is the same as the thickness of the second conductive layer, the vertical conductivity between the second conductive layer and the first conductive layer is satisfied, so that the second
  • the conductive layer mainly functions as a vertical conduction
  • the first conductive layer serves as a main shielding function, so that the shielding effect of the conductive layer of the entire electromagnetic shielding film is more excellent, and the particle diameter of the conductive particles of the second conductive layer and the second conductive layer
  • the thickness of the layer is the same, and the appearance of the second conductive layer can be made flat, thereby making up for the appearance of the conductive layer being rough and uneven due to the excessively large coating particle size of the conductive particles of the first conductive layer.
  • FIG. 1 is a schematic structural view of an electromagnetic shielding film in the prior art
  • FIG. 2 is a schematic structural view of a first embodiment of an electromagnetic shielding film according to an embodiment of the present invention
  • FIG. 3 is a schematic structural view of a second embodiment of an electromagnetic shielding film according to an embodiment of the present invention.
  • FIG. 4 is a schematic structural view of a third embodiment of an electromagnetic shielding film according to an embodiment of the present invention.
  • Icons 100 - first conductive layer; 200 - second conductive layer; 300 - carrier film; 400 - insulating layer; 500 - protective film; 600 - metal layer; 700 - graphene layer.
  • the conductive particles of the conductive layer select a dendritic, sheet-like or spherical conductive powder having a larger particle diameter.
  • the conductive powder has a particle size of 5-20 um. Due to the larger particle size, the adhesion between the conductive particles is increased, so that the electrical conductivity and shielding effectiveness of the electromagnetic shielding film are good, but since the particle size of the conductive particles is large when the conductive layer is applied, when the conductive layer is coated 5-15 um At the thickness, the larger particle size makes the appearance of the conductive layer rougher and uneven.
  • the conductive layer In order to improve the roughness and unevenness of the appearance of the conductive layer, it is usually improved by increasing the thickness of the conductive layer, but the increase in the thickness of the conductive layer causes an increase in cost, and the appearance of the conductive layer is improved by reducing the particle diameter of the conductive particles.
  • the roughness and unevenness of the conductive particles are reduced due to the decrease in the particle size of the conductive particles, which in turn affects the conductivity of the conductive layer and the shielding effectiveness.
  • FIG. 1 is a schematic structural view of an electromagnetic shielding film in the prior art
  • FIG. 2 is a schematic structural view of a first embodiment of an electromagnetic shielding film according to an embodiment of the present invention
  • FIG. 3 is a schematic view of an electromagnetic shielding film according to an embodiment of the present invention
  • FIG. 4 is a schematic structural view of a third embodiment of an electromagnetic shielding film according to an embodiment of the present invention.
  • FIG. 1 is a schematic structural diagram of an electromagnetic shielding film in the prior art.
  • the conductive layer of the electromagnetic shielding film uses only a single layer of the first conductive layer 100.
  • the particle size of the conductive particles of the conductive layer 100 is too large, and when the coating thickness is small, the conductive layer of the electromagnetic shielding film is likely to be rough and uneven.
  • the increase in the thickness of the first conductive layer 100 requires more conductive material, which causes an increase in cost.
  • the roughness of the conductive layer is improved by reducing the particle size of the conductive particles, the unevenness of the conductive particles is reduced, and the mutual adhesion between the conductive particles is lowered, which in turn affects the conductivity of the conductive layer and the shielding effectiveness.
  • the embodiment provides a conductive layer of an electromagnetic shielding film, and the conductive layer of the electromagnetic shielding film includes a first conductive layer 100 and is coated on the first The second conductive layer 200 on one side of the conductive layer 100, specifically:
  • the conductive powder of the first conductive layer 100 comprises a dendritic conductive powder, and the conductive particles of the dendritic conductive powder have a particle size of 5-20 um;
  • the conductive powder of the second conductive layer 200 includes a sheet-like conductive powder or a spherical conductive powder, and the particle diameter of the conductive particles of the sheet-like conductive powder or the spherical conductive powder is the same as the thickness of the second conductive layer 200.
  • the conductive layer of the electromagnetic shielding film includes a first conductive layer 100 and a second conductive layer 200.
  • the second conductive layer 200 is coated on one side of the first conductive layer 100, and is improved by using two conductive layers.
  • the conductive layer of the electromagnetic shielding film has a rough appearance and an unevenness, and at the same time, the electromagnetic shielding film can have better electrical conductivity and shielding effectiveness.
  • the conductive powder of the first conductive layer 100 includes a dendritic conductive powder, and the conductive particles in the dendritic conductive powder have a dendritic shape, and the conductive particles are excellent in adhesion to each other, so that the first conductive layer 100 can be Electrical conduction is achieved both in the horizontal direction of the plane in which the first conductive layer 100 is located and in the vertical direction perpendicular to the plane in which the first conductive layer 100 is located.
  • the conductive particles of the dendritic conductive powder may have a particle diameter of 5-20 um. Since the particle diameter of the conductive particles of the first conductive layer 100 is larger, the adhesion between the conductive particles is further increased, thereby making the first conductive Layer 100 has good electrical conductivity and shielding effectiveness.
  • the surface of the first conductive layer 100 is rough and uneven.
  • One side is also coated with a second conductive layer 200.
  • the conductive layer of the electromagnetic shielding film in the embodiment of the present application is provided by two conductive layers, and the conductive powder used in the two conductive layers is different, the first conductive layer 100 includes a dendritic conductive powder, and the second conductive layer 200 includes a sheet-shaped conductive layer. Powder or spherical conductive powder.
  • the first conductive layer 100 in the conductive layer in the embodiment of the present application includes a dendritic conductive powder, and the conductive particles of the dendritic conductive powder have better adhesion and can achieve a level compared to an electromagnetic shielding film that uses only one conductive layer.
  • the sheet-like conductive powder or the spherical conductive powder can achieve electrical conduction in the vertical direction between the second conductive layer 200 and the first conductive layer 100.
  • the conductive layer of the electromagnetic shielding film having the first conductive layer 100 and the second conductive layer 200 in the embodiment of the present application is not provided with the same electromagnetic shielding performance as compared with the electromagnetic shielding film provided with only one conductive layer.
  • the thickness of the overall conductive layer is increased, since the thickness of the conductive layer of the overall electromagnetic shielding film is not increased, so that the cost is not increased, and since the particle size of the conductive particles of the first conductive layer 100 is large, it does not decrease.
  • the conductive layer and the shielding effectiveness of the conductive layer of the electromagnetic shielding film make the conductive layer in the embodiment of the present application have good electromagnetic shielding property.
  • the conductive layer of the electromagnetic shielding film in the embodiment of the present application has the first a conductive layer 100 and a second conductive layer 200.
  • the first conductive layer 100 includes a dendritic conductive powder
  • the second conductive layer 200 includes at least one of a sheet-like conductive powder or a spherical conductive powder.
  • the conductive layer of the film has better electromagnetic shielding performance and better electrical conductivity than the single conductive layer.
  • the conductive powder of the second conductive layer 200 includes a sheet-like conductive powder or a spherical conductive powder, and the sheet-like conductive powder or the spherical conductive powder provides the second conductive layer 200 with good electrical conductivity, thereby enabling the second conductive layer 200 to
  • the first conductive layer 100 is turned on, and since the particle diameter of the conductive particles of the sheet-like conductive powder or the spherical conductive powder is the same as the thickness of the second conductive layer 200, the vertical between the second conductive layer 200 and the first conductive layer 100 is satisfied.
  • the conductivity makes the second conductive layer 200 mainly perform vertical conduction, and the first conductive layer 100 plays a main shielding role, thereby making the shielding effect of the conductive layer of the entire electromagnetic shielding film more excellent, and the second conductive layer 200
  • the particle diameter of the conductive particles is the same as the thickness of the second conductive layer 200, and the appearance of the second conductive layer 200 can be made flat, thereby compensating for the coating thickness being low due to the excessive particle size of the conductive particles of the first conductive layer 100.
  • the resulting conductive layer has a rough appearance and is uneven.
  • the thickness of the first conductive layer 100 may be 5-10 um, and the thickness of the conductive layer of the electromagnetic shielding film is generally 5-15 um, and the thickness of the first conductive layer 100 is set to 5-10 um.
  • the first conductive layer 100 can play a main shielding role, and at the same time, since the particle diameter of the conductive particles of the first conductive layer 100 is large, and the thickness of the first conductive layer 100 is low, the surface of the first conductive layer 100 is relatively Rough, uneven, the particle size of the conductive particles of the sheet-like conductive powder or the spherical conductive powder of the second conductive layer 200 is set to 1-3 um, and the thickness of the second conductive layer 200 is 1-3 um, so that the second conductive layer
  • the thickness of 200 is the same as or similar to the particle diameter of the conductive particles of the second conductive layer 200, satisfying the vertical conductivity between the second conductive layer 200 and the first conductive layer 100, thereby making the conductive layer of the entire electromagnetic shielding film The shielding effect is
  • the powder content of the dendritic conductive powder in the first conductive layer 100 may be 30-40%, so that the powder content of the dendritic conductive powder in the first conductive layer 100 is small. Therefore, the processing cost can be reduced, and at the same time, since the conductive particles in the dendritic conductive powder have a dendritic shape, the conductive density of the conductive particles in the dendritic conductive powder is also large in the case where the content of the conductive layer powder is lowered. The cost of the electromagnetic shielding film is lowered and the shielding effectiveness is not affected. Through experimental research, the first conductive layer 100 of the electromagnetic shielding film on the soft board and the hard board is connected with the soft board and the hard board.
  • the experimental results show that the shielding performance of the conductive layer of the electromagnetic shielding film provided by the embodiment reaches 50 dB. As described above, the shielding effect is excellent, and the cost of the conductive layer of the electromagnetic shielding film is lowered due to the small powder content of the dendritic conductive powder in the first conductive layer 100.
  • the conductive particles of the dendritic conductive powder in the first conductive layer 100 may include one or more of silver, copper, iron, nickel, zinc, a silver alloy, a copper alloy, an iron alloy, a nickel alloy, and a zinc alloy.
  • the conductive particles in the sheet-like conductive powder or the spherical conductive powder in the second conductive layer 200 may include one or more of silver, copper, iron, nickel, zinc, a silver alloy, a copper alloy, an iron alloy, a nickel alloy, and a zinc alloy. .
  • the conductive particles are made of easily conductive silver, copper, iron, nickel, zinc, silver alloy, copper alloy, iron alloy, nickel alloy and zinc alloy, which can ensure the electromagnetic shielding film has excellent electrical conductivity and shielding effectiveness.
  • the material of the first conductive layer 100 may include at least one of a thermosetting epoxy resin, an acrylic resin, or a polyurethane.
  • the material of the second conductive layer 200 may include at least one of a thermosetting epoxy resin, an acrylic resin, or a polyurethane.
  • Thermosetting epoxy resin, acrylic resin or polyurethane has good physical and chemical properties. It has excellent bonding strength to metal and non-metal materials, good dielectric properties, small deformation shrinkage, and good dimensional stability of products. The hardness is high and the flexibility is good, so that the functions of the first conductive layer 100 and the second conductive layer 200 can be ensured.
  • This embodiment provides an electromagnetic shielding film including the conductive layer of the electromagnetic shielding film in Embodiment 1. Since the conductive layer uses two conductive layers, in order to prevent the particle size of the conductive particles of the first conductive layer 100 from being too large, and the coating thickness is small, the conductive layer of the electromagnetic shielding film has a rough appearance and is uneven, and the first conductive layer 100 is in the first conductive layer 100. Coating the second conductive layer 200 on one side does not increase the thickness of the conductive layer of the overall electromagnetic shielding film, and thus does not cause an increase in cost, and at the same time, since the particle diameter of the conductive particles of the first conductive layer 100 is large, It does not reduce the electrical conductivity and shielding effectiveness of the conductive layer of the electromagnetic shielding film.
  • the electromagnetic shielding film may further include a carrier film 300, an insulating layer 400, and a protective film 500.
  • the insulating layer 400 is coated on one side of the carrier film 300
  • the first conductive layer 100 is coated on the side of the insulating layer 400 facing away from the carrier film 300
  • the protective film 500 is attached to the second conductive layer 200 away from the first conductive layer.
  • One side of the 100 is set, so that a complete electromagnetic shielding film can be obtained, and the safety and service life of the electromagnetic shielding film can be improved.
  • the material of the insulating layer 400 includes a thermosetting epoxy resin, an acrylic resin or a urethane glue.
  • Thermosetting epoxy resin, acrylic resin or polyurethane glue has good physical and chemical properties. It has excellent bonding strength to metal and non-metal materials, good dielectric properties, small deformation shrinkage, and dimensional stability of products. Good, high hardness, and good flexibility, so that the function of the insulating layer 400 can be ensured.
  • the material of the protective film 500 includes a release film or a release paper.
  • the plastic film is plasma-treated, so that it can exhibit extremely light and stable release force for various organic pressure-sensitive adhesives.
  • the use of the release film or the release paper of the protective film 500 enables the protective film 500 to achieve an extremely light and stable release force upon peeling.
  • a metal layer 600 is further disposed between the insulating layer 400 and the conductive layer of the electromagnetic shielding film.
  • the metal layer 600 can be selectively disposed according to actual needs, and the metal layer 600 can be disposed to enable the electromagnetic shielding film to obtain better electrical conductivity and shielding performance.
  • the metal layer may be disposed between the insulating layer 400 and the first conductive layer 100 as a third conductive layer.
  • a graphene layer 700 is further disposed between the insulating layer 400 and the conductive layer of the electromagnetic shielding film.
  • the graphene layer 700 can be selected according to actual needs.
  • Graphene is a new type of nano material which is the thinnest, strongest, and most conductive and thermally conductive. The setting of the graphene layer 700 can make the electromagnetic shielding film better. Conductivity and shielding properties.
  • the graphene layer 700 may be disposed between the insulating layer 400 and the first conductive layer 100 as a third conductive layer.
  • the embodiment of the present application further provides a method for preparing an electromagnetic shielding film, which comprises the following steps.
  • step S101 a carrier film 300 is provided.
  • the thickness and size of the carrier film 300 can be determined according to actual needs.
  • the material of the carrier film 300 can also be selected according to actual conditions.
  • the specific material of the carrier film 300 is not limited in the embodiment of the present application.
  • Step S102 forming a first conductive layer 100 on the side of the carrier film, and the conductive powder of the first conductive layer 100 comprises a dendritic conductive powder.
  • a conductive material may be coated on the side of the carrier film 300, and the branched conductive powder is included to form the first conductive layer 100.
  • the conductive particles of the dendritic conductive powder may have a particle diameter of 5-20 um.
  • the insulating layer 400 may be formed on the side of the carrier film 300, and the insulating layer 400 may be formed by coating an insulating material. After the insulating layer 400 is completed, the first conductive layer 100 is formed on the side of the insulating layer 400 away from the carrier film 300.
  • a second conductive layer 200 is formed on a side of the first conductive layer 100 away from the insulating layer 400.
  • the conductive powder of the second conductive layer 200 includes a sheet-shaped conductive powder or a spherical conductive powder.
  • the second conductive layer 200 can be formed on the side of the first conductive layer 100 away from the carrier film 300.
  • the second conductive layer 200 can be formed by coating a conductive material to form a second conductive layer.
  • the conductive powder of 200 includes at least one of a sheet-like conductive powder and a spherical conductive powder.
  • the particle diameter of the conductive particles of the sheet-like conductive powder or the spherical conductive powder is the same as or similar to the thickness of the second conductive layer 200.
  • the conductive particles of the sheet-like conductive powder or the spherical conductive powder may have a particle diameter of 1-3 um, and the second conductive layer 200 may have a thickness of 1-3 um.
  • the method may further include the following steps.
  • Step S104 at least one of the metal layer 600 or the graphene layer 700 is formed on a side of the insulating layer 400 away from the carrier film 300 to form a third conductive layer.
  • the overall shielding performance of the electromagnetic shielding film and the electrical conductivity of the conductive layer can also be improved.
  • the thickness of the third conductive layer and the materials selected may be determined according to actual conditions.
  • the method may further include the following steps.
  • step S105 the protective film 500 is attached to the side of the second conductive layer 200 away from the first conductive layer 100.
  • the release film or the release paper may be attached to the side of the second conductive layer 200 away from the first conductive layer 100 to form a protective film 500 to achieve electrical conduction in the electromagnetic shielding film.
  • the protection of the layer prevents other objects from damaging the conductive layer when it comes into contact with other objects.
  • a conductive layer having two conductive powders is formed by forming the first conductive layer 100 and the second conductive layer 200 on the carrier film 300, and the conductive powder used in the first conductive layer 100 includes a dendritic shape.
  • the conductive powder, the conductive powder used in the second conductive layer 200 includes at least one of a sheet-like conductive powder or a spherical conductive powder.
  • the conductive particles of the dendritic conductive powder have better adhesion, and electrical conduction in the horizontal direction and the vertical direction can be achieved, while the second conductive layer 200 passes through the sheet-shaped conductive powder or the spherical conductive powder, and the sheet-like conductive powder or the spherical conductive powder
  • the particle diameter of the conductive particles is the same as or similar to the thickness of the second conductive layer, so that the sheet-like conductive powder or the spherical conductive powder can achieve electrical conduction in the vertical direction between the second conductive layer 200 and the first conductive layer 100.
  • the conductive layer of the electromagnetic shielding film having the first conductive layer 100 and the second conductive layer 200 in the embodiment of the present application is provided with the same electromagnetic shielding performance as compared with the electromagnetic shielding film provided with only one conductive layer.
  • the thickness of the overall conductive layer is not increased, and since the thickness of the conductive layer of the overall electromagnetic shielding film is not increased, the cost is not increased, and since the particle diameter of the conductive particles of the first conductive layer 100 is large, The conductive performance and shielding effectiveness of the conductive layer in the electromagnetic shielding film are reduced, so that the electromagnetic shielding film in the embodiment of the present application has good electromagnetic shielding property.
  • the embodiment of the invention provides a conductive layer of an electromagnetic shielding film, an electromagnetic shielding film and a preparation method thereof, and the electromagnetic shielding film is improved by providing a conductive layer including a first conductive layer and a second conductive layer in the electromagnetic shielding film.
  • the single-layer conductive layer indicates a rough and uneven phenomenon, and at the same time, the electromagnetic shielding film can have better electrical conductivity and shielding effectiveness.

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Abstract

本发明实施例提供了一种电磁屏蔽膜的导电层、电磁屏蔽膜及其制备方法，涉及电磁屏蔽技术领域。电磁屏蔽膜的导电层包括第一导电层以及涂布于第一导电层的一侧的第二导电层；第一导电层的导电粉包括枝状导电粉，枝状导电粉的导电粒子的粒径为5-20um；第二导电层的导电粉包括片状导电粉或球状导电粉，片状导电粉或球状导电粉的导电粒子的粒径与第二导电层的厚度相同，解决了现有技术中存在的为改善电磁屏蔽膜的导电层外观粗糙、不平整的现象，容易引起成本的增加或是导电性能及屏蔽效能的降低的技术问题，通过设置第二导电层弥补了第一导电层的外观粗糙、不平整，同时使整个电磁屏蔽膜的导电层的屏蔽效果更加优异。

Description

电磁屏蔽膜的导电层、电磁屏蔽膜及其制备方法
相关申请的交叉引用
本申请要求于2017年08月16日提交中国专利局的申请号为2017210230742，名称为“电磁屏蔽膜的导电层及电磁屏蔽膜”的中国专利申请的优先权，其全部内容通过引用结合在本申请中。
技术领域
本发明涉及电磁屏蔽技术领域，尤其是涉及一种电磁屏蔽膜的导电层及电磁屏蔽膜。
背景技术
电磁屏蔽广泛应用于通信、电子产品、网络硬件、医疗仪器、航天及国防等领域，在通信方面，电磁屏蔽就是对两个空间区域之间进行金属的隔离，以控制电场、磁场和电磁波由一个区域对另一个区域的感应和辐射。具体讲，就是用屏蔽体将元部件、电路、组合件、电缆或整个系统的干扰源包围起来，防止干扰电磁场向外扩散，或者，用屏蔽体将接收电路、设备或系统包围起来，防止它们受到外界电磁场的影响，电磁屏蔽膜即是一种常用的屏蔽体。
涂布机主要用于薄膜、纸张等的表面涂布工艺生产，它是将成卷的基材涂上一层特定功能的胶、涂料或油墨等，并且在烘干后进行收卷存放的机器设备。涂布机采用专用的多功能涂布头，能实现多种形式的表面涂布生产，涂布机发展至今，已能实现镭射转移、烫金、光学膜、保护膜、电子薄膜和介质交换薄膜等的涂布工艺。
现有的电磁屏蔽膜的涂布生产流程主要是在载体膜上涂布绝缘层，将绝缘层的表面烘干硬化后，根据实际需要选择在绝缘层的外侧加工金属层制成半成品，并在半成品的外侧涂布导电层胶水，通常导电层的厚度为5-15um，最后在导电层的外侧贴合保护膜从而制得电磁屏蔽膜。电磁屏蔽膜在制作过程中，经常出现电磁屏蔽膜的屏蔽性能和平整度无法平衡的情况。
发明内容
本发明实施例的目的包括提供一种电磁屏蔽膜的导电层及电磁屏蔽膜，以解决现有技术中存在的技术问题。
本发明实施例提供的电磁屏蔽膜的导电层包括第一导电层以及涂布于所述第一导电层的一侧的第二导电层；
所述第一导电层的导电粉包括枝状导电粉，所述枝状导电粉的导电粒子的粒径为5-20um；
所述第二导电层的导电粉包括片状导电粉或球状导电粉，所述片状导电粉或所述球状导电粉的导电粒子的粒径与所述第二导电层的厚度相同。
进一步的，所述第一导电层的厚度为5-10um。
进一步的，所述片状导电粉或所述球状导电粉的导电粒子的粒径为1-3um，所述第二导电层的厚度为1-3um。
进一步的，所述枝状导电粉在所述第一导电层中的粉体含量为30-40％。
进一步的，所述第一导电层和所述第二导电层的导电粒子包括银、铜、铁、镍、锌、银合金、铜合金、铁合金、镍合金、锌合金中的一种或多种。
进一步的，所述第一导电层的材质包括热固型环氧树脂、丙烯酸树脂或聚氨酯。
进一步的，所述第二导电层的材质包括热固型环氧树脂、丙烯酸树脂或聚氨酯。进一步的，所述第一导电层远离所述第二导电层的一侧还涂布有第三导电层，所述第三导电层包括金属层和/或石墨烯层。
进一步的，所述第二导电层(200)的导电粉包括片状导电粉和球状导电粉中的至少一种。
本发明实施还提供了一种电磁屏蔽膜，包括如上述技术方案中任一项所述的电磁屏蔽膜的导电层。
进一步的，还包括载体膜、绝缘层以及保护膜；
所述绝缘层涂布于所述载体膜的一侧，所述第一导电层涂布于所述绝缘层背离所述载体膜的一侧，所述保护膜贴合所述第二导电层背离所述第一导电层的一侧设置。
进一步的，所述绝缘层的材质包括热固型环氧树脂、丙烯酸树脂或聚氨酯胶水。
进一步的，所述保护膜的材质包括离型膜或离型纸。
进一步的，所述绝缘层和所述电磁屏蔽膜的导电层之间还设置有金属层或石墨烯层。
本发明实施例还提供了一种电磁屏蔽膜的制备方法，包括：
提供一载体膜；
在所述载体膜一侧制作第一导电层，所述第一导电层的导电粉包括枝状导电粉；
在所述第一导电层远离所述绝缘层的一侧制作第二导电层，所述第二导电层(200)的导电粉包括片状导电粉或球状导电粉。
进一步的，在形成第一导电层的步骤之前，该方法还包括：
在所述载体膜一侧涂布绝缘材料，形成绝缘层，所述第一导电层设置在所述绝缘层远离所述载体膜的一侧。
进一步的，在形成绝缘层的步骤之后，该方法还包括：
在所述绝缘层远离所述载体膜的一侧制作金属层或石墨烯层，形成第三导电层。
进一步的，在形成第二导电层的步骤之后，该方法还包括：
在所述第二导电层远离所述第一导电层的一侧贴合保护膜。
本发明实施例提供的电磁屏蔽膜的导电层包括第一导电层和第二导电层，第二导电层涂布于第一导电层的一侧，通过采用两层导电层来改善电磁屏蔽膜的导电层的外观粗糙、不平整的现象，同时使电磁屏蔽膜能够具备较好的导电性能和屏蔽效能。具体地，第一导电层的导电粉包括枝状导电粉，枝状导电粉由于类似树枝状的形态，其相互之间接着性优异，能够在水平和垂直方向实现导通，并且，枝状导电粉的导电粒子的粒径为5-20um，由于第一导电层的导电粒子的粒径较大，更加增大了导电粒子之间的接着性，从而使第一导电层具备良好的导电性能和屏蔽效能。
为避免第一导电层的导电粒子的粒径过大，而涂布厚度较小导致电磁屏蔽膜的导电层外观粗糙、不平整，在第一导电层的一侧涂布第二导电层，由于不会增大整体电磁屏蔽膜的导电层的厚度，因而不会引起成本的增加，同时由于第一导电层的导电粒子的粒径较大，不会降低电磁屏蔽膜的导电层的导电性能和屏蔽效能。
具体地，第二导电层的导电粉包括片状导电粉或球状导电粉，片状导电粉或球状导电粉使第二导电层具备良好的导电性能，从而使第二导电层能够与第一导电层导通，由于片状导电粉或球状导电粉的导电粒子的粒径与第二导电层的厚度相同，满足了第二导电层与第一导电层之间的垂直导通性，使第二导电层主要起垂直导通作用，而第一导电层起主要的屏蔽作用，从而使整个电磁屏蔽膜的导电层的屏蔽效果更加优异，同时第二导电层的导电粒子的粒径与第二导电层的厚度相同，能够使第二导电层的外观平整，从而弥补了由于第一导电层的导电粒子的粒径过大而涂布厚度较低造成的导电层外观粗糙、不平整。
附图说明
为了更清楚地说明本发明具体实施方式或现有技术中的技术方案，下面将对具体实施方式或现有技术描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图是本发明的一些实施方式，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1为现有技术中电磁屏蔽膜的结构示意图；
图2为本发明实施例提供的电磁屏蔽膜的第一种实施方式的结构示意图；
图3为本发明实施例提供的电磁屏蔽膜的第二种实施方式的结构示意图；
图4为本发明实施例提供的电磁屏蔽膜的第三种实施方式的结构示意图。
图标：100-第一导电层；200-第二导电层；300-载体膜；400-绝缘层；500-保护膜；600-金属层；700-石墨烯层。
具体实施方式
下面将结合附图对本发明的技术方案进行清楚、完整地描述，显然，所描述的实施例是本发明一部分实施例，而不是全部的实施例。基于本发明中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例，都属于本发明保护的范围。
在本发明的描述中，需要说明的是，如出现术语“中心”、“上”、“下”、“左”、“右”、“竖直”、“水平”、“内”、“外”等，其所指示的方位或位置关系为基于附图所示的方位或位置关系，仅是为了便于描述本发明和简化描述，而不是指示或暗示所指的装置或元件必须具有特定的方位、以特定的方位构造和操作，因此不能理解为对本发明的限制。此外，如出现术语“第一”、“第二”、“第三”仅用于描述目的，而不能理解为指示或暗示相对重要性。
发明人发现，在电磁屏蔽膜的制作过程中，为使电磁屏蔽膜能够获得较为优异的导电性能和屏蔽效能，导电层的导电粒子选择粒径较大的枝状、片状或球状导电粉，通常导电粉的粒径在5-20um。由于粒径较大使导电粒子间的接着性增加，从而使电磁屏蔽膜的导电性能和屏蔽效能良好，但由于导电层涂布时导电粒子的粒径本身较大，当导电层涂布5-15um厚度时，较大的粒径使得导电层的外观较粗糙、不平整。
为改善导电层外观的粗糙及不平整现象，通常采用提高导电层厚度的方法进行改善，但是，导电层厚度的提高会引起成本的增加，若通过减小导电粒子的粒径来改善导电层外观的粗糙、不平整，由于导电粒子的粒径降低，其相互接着性降低，反而会影响导电层的导电性以及屏蔽效能。
下面结合附图对实施例1及实施例2进行详细描述：
图1为现有技术中电磁屏蔽膜的结构示意图；图2为本发明实施例提供的电磁屏蔽膜的第一种实施方式的结构示意图；图3为本发明实施例提供的电磁屏蔽膜的第二种实施方式的结构示意图；图4为本发明实施例提供的电磁屏蔽膜的第三种实施方式的结构示意图。
请一并参照图1-4，如图1所示为现有技术中电磁屏蔽膜的结构示意图，现有技术中电磁屏蔽膜的导电层仅采用单层的第一导电层100，当第一导电层100的导电粒子的粒径过大，而涂布厚度较小时容易导致电磁屏蔽膜的导电层外观粗糙、不平整。为改善导电层外观的粗糙及不平整现象，可以采用提高第一导电层100厚度的方法进行改善，但是，第一导电层100厚度的提高需要更多的导电材料，会引起成本的增加。若通过减小导电粒子的粒径来改善导电层外观的粗糙、不平整，由于导电粒子的粒径降低，导电粒子之间的相互接着性降低，反而会影响导电层的导电性以及屏蔽效能。
图2-4为本实施例提供的电磁屏蔽膜的结构示意图，本实施例提供了一种电磁屏蔽膜的导电层，该电磁屏蔽膜的导电层包括第一导电层100以及涂布于第一导电层100的一侧的第二导电层200，具体而言：
第一导电层100的导电粉包括枝状导电粉，枝状导电粉的导电粒子的粒径为5-20um；
第二导电层200的导电粉包括片状导电粉或球状导电粉，片状导电粉或球状导电粉的导电粒子的粒径与第二导电层200的厚度相同。如图2所示，电磁屏蔽膜的导电层包括第一导电层100和第二导电层200，第二导电层200涂布于第一导电层100的一侧，通过采用两层导电层来改善电磁屏蔽膜的导电层的外观粗糙、不平整的现象，同时使电磁屏蔽膜能够具备较好的导电性能和屏蔽效能。具体地，第一导电层100的导电粉包括枝状导电粉，枝状导电粉中的导电粒子具有类似树枝状的形态，导电粒子相互之间的接着性优异，使第一导电层100能够在第一导电层100所在平面的水平方向和垂直于第一导电层100所在平面的竖直方向上都实现电导通。并且，枝状导电粉的导电粒子的粒径可以为5-20um，由于第一导电层100的导电粒子的粒径较大，更加增大了导电粒子之间的接着性，从而使第一导电层100具备良好的导电性能和屏蔽效能。
为避免第一导电层100的导电粒子的粒径过大，而涂布厚度较小导致第一导电层100的表面粗糙、不平整的情况，在本申请实施例中，在第一导电层100的一侧还涂布有第二导电层200。本申请实施例中的电磁屏蔽膜的导电层通过设置两层导电层，并且两层导电层采用的导电粉不同，第一导电层100包括枝状导电粉，第二导电层200包括片状导电粉或球状导电粉。相比只采用一层导电层的电磁屏蔽膜，本申请实施例中的导电层中的第一导电层100包括枝状导电粉，枝状导电粉的导电粒子的接着性更好，可以实现水平方向和垂直方向的电导通，同时第二导电层200通过片状导电粉或球状导电粉，且片状导电粉或球状导电粉的导电粒子的粒径与第二导电层的厚度相同或相近，使得片状导电粉或球状导电粉可以实现第二导电层200和第一导电层100之间的垂直方向上的电导通。与只设置一层导电层的电磁屏蔽膜相比，具备相同的电磁屏蔽性能的前提下，本申请实施例中的具有第一导电层100和第二导电层200的电磁屏蔽膜的导电层不会增加整体导电层的厚度，由于不会增大整体电磁屏蔽膜的导电层的厚度，因而不会引起成本的增加，同时由于第一导电层100的导电粒子的粒径较大，不会降低电磁屏蔽膜的导电层的导电性能和屏蔽效能，使本申请实施例中的导电层具有良好的电磁屏蔽性。
此外，如果本申请实施例中的电磁屏蔽膜的导电层的厚度与只设置一层导电层的电磁屏蔽膜中导电层的厚度相同，由于本申请实施例中的电磁屏蔽膜的导电层具有第一导电层100和第二导电层200，第一导电层100包括枝状导电粉，第二导电层200包括片状导电粉或球状导电粉中的至少一种，本申请实施例中的电磁屏蔽膜的导电层比单层导电层具有更好的电磁屏蔽性能和更好的导电性能。
具体地，第二导电层200的导电粉包括片状导电粉或球状导电粉，片状导电粉或球状导电粉使第二导电层200具备良好的导电性能，从而使第二导电层200能够与第一导电层 100导通，由于片状导电粉或球状导电粉的导电粒子的粒径与第二导电层200的厚度相同，满足了第二导电层200与第一导电层100之间的垂直导通性，使第二导电层200主要起垂直导通作用，而第一导电层100起主要的屏蔽作用，从而使整个电磁屏蔽膜的导电层的屏蔽效果更加优异，同时第二导电层200的导电粒子的粒径与第二导电层200的厚度相同，能够使第二导电层200的外观平整，从而弥补了由于第一导电层100的导电粒子的粒径过大而涂布厚度较低造成的导电层外观粗糙、不平整。
一种具体的实施方式中，第一导电层100的厚度可以为5-10um，由于电磁屏蔽膜的导电层厚度普遍在5-15um，将第一导电层100的厚度设置为5-10um，使第一导电层100能够起到主要的屏蔽作用，同时，由于第一导电层100的导电粒子的粒径较大，而第一导电层100的厚度较低，使得第一导电层100的表面较为粗糙、不平整，将第二导电层200的片状导电粉或球状导电粉的导电粒子的粒径设置为1-3um，同时第二导电层200的厚度为1-3um，使第二导电层200的厚度与第二导电层200的导电粒子的粒径相同或相近，满足了第二导电层200与第一导电层100之间的垂直导通性，从而使整个电磁屏蔽膜的导电层的屏蔽效果更加优异，同时能够使第二导电层200的表面平整，弥补由于第一导电层100的导电粒子的粒径过大而涂布厚度较低造成的导电层外观粗糙、不平整。由于第一导电层100的厚度为5-10um，第二导电层200的厚度为1-3um，因而不会增大整体电磁屏蔽膜的导电层的厚度，从而不会引起成本的增加。
本实施例的可选方案中，枝状导电粉在第一导电层100中的粉体含量可以为30-40％，使枝状导电粉在第一导电层100中的粉体含量较小，因而能够降低加工成本，同时由于枝状导电粉中的导电粒子具有类似树枝状的形态，在导电层粉体含量降低的情况下，枝状导电粉中的导电粒子的接着密度也较大，因而使得电磁屏蔽膜的成本降低且屏蔽效能不受影响。经试验研究，将压制软板、硬板上的电磁屏蔽膜的第一导电层100与软板、硬板连通，实验结果表明，本实施例提供的电磁屏蔽膜的导电层的屏蔽效能达到50dB以上，屏蔽效果优异，且由于枝状导电粉在第一导电层100中的粉体含量较小降低了电磁屏蔽膜的导电层的成本。
具体地，第一导电层100中的枝状导电粉的导电粒子可以包括银、铜、铁、镍、锌、银合金、铜合金、铁合金、镍合金、锌合金中的一种或多种，第二导电层200中片状导电粉或球状导电粉中的导电粒子可以包括银、铜、铁、镍、锌、银合金、铜合金、铁合金、镍合金、锌合金中的一种或多种。导电粒子采用易导电的银、铜、铁、镍、锌、银合金、铜合金、铁合金、镍合金、锌合金，能够保证电磁屏蔽膜具备优良的导电性能和屏蔽效能。
第一导电层100的材质可包括热固型环氧树脂、丙烯酸树脂或聚氨酯中的至少一种，第二导电层200的材质可包括热固型环氧树脂、丙烯酸树脂或聚氨酯中的至少一种。热固 型环氧树脂、丙烯酸树脂或聚氨酯具备良好的物理、化学性能，它对金属和非金属材料的表面具有优异的粘接强度，介电性能良好，变形收缩率小，制品尺寸稳定性好，硬度高，柔韧性较好，因而能够保证第一导电层100和第二导电层200的功能。
本实施例提供了一种电磁屏蔽膜，包括实施例1中的电磁屏蔽膜的导电层。由于导电层采用两层导电层，为避免第一导电层100的导电粒子的粒径过大，而涂布厚度较小导致电磁屏蔽膜的导电层外观粗糙、不平整，在第一导电层100的一侧涂布第二导电层200，由于不会增大整体电磁屏蔽膜的导电层的厚度，因而不会引起成本的增加，同时由于第一导电层100的导电粒子的粒径较大，不会降低电磁屏蔽膜的导电层的导电性能和屏蔽效能。
一种具体的实施方式中，如图2所示，电磁屏蔽膜还可包括载体膜300、绝缘层400以及保护膜500。具体地，绝缘层400涂布于载体膜300的一侧，第一导电层100涂布于绝缘层400背离载体膜300的一侧，保护膜500贴合第二导电层200背离第一导电层100的一侧设置，从而能够得到完整的电磁屏蔽膜，提高电磁屏蔽膜的安全性及使用寿命。
具体地，绝缘层400的材质包括热固型环氧树脂、丙烯酸树脂或聚氨酯胶水。热固型环氧树脂、丙烯酸树脂或聚氨酯胶水具备良好的物理、化学性能，它对金属和非金属材料的表面具有优异的粘接强度，介电性能良好，变形收缩率小，制品尺寸稳定性好，硬度高，柔韧性较好，因而能够保证绝缘层400的功能。
保护膜500的材质包括离型膜或离型纸。通常情况下为了增加塑料薄膜的离型力，会将塑料薄膜做等离子处理，让它对于各种不同的有机压感胶可以表现出极轻且稳定的离型力。保护膜500采用离型膜或离型纸能够使保护膜500在剥离时达到极轻且稳定的离型力。
本实施例的可选方案中，如图3所示，绝缘层400和电磁屏蔽膜的导电层之间还设置有金属层600。金属层600可根据实际需要选择设置，金属层600的设置能够使电磁屏蔽膜获得更好的导电性能和屏蔽性能。金属层可以作为第三导电层设置在绝缘层400和第一导电层100之间。
本实施例的另一可选方案中，如图4所示，绝缘层400和电磁屏蔽膜的导电层之间还设置有石墨烯层700。石墨烯层700可根据实际需要选择设置，石墨烯是目前发现的最薄、强度最大、导电导热性能最强的一种新型纳米材料，石墨烯层700的设置能够使电磁屏蔽膜获得更好的导电性能和屏蔽性能。石墨烯层700可以作为第三导电层设置在绝缘层400和第一导电层100之间。
本申请实施例还提供了一种电磁屏蔽膜的制备方法，该制备方法包括以下步骤。
步骤S101，提供一载体膜300。
载体膜300的厚度、尺寸等参数可以根据实际需要确定，载体膜300的材质也可以根据实际情况选用，本申请实施例并不限制载体膜300的具体材质。
步骤S102，在所述载体膜一侧制作第一导电层100，所述第一导电层100的导电粉包括枝状导电粉。
在制作电磁屏蔽膜时，可以在载体膜300一侧涂布导电材料，其中包含枝状导电粉，形成第一导电层100。其中，枝状导电粉的导电粒子的粒径可以为5-20um。
在制作第一导电层100之前，还可以在载体膜300一侧制作绝缘层400，通过涂布绝缘材料形成绝缘层400。在制作完成绝缘层400之后，再在绝缘层400远离载体膜300的一侧制作第一导电层100。
步骤S103，在所述第一导电层100远离所述绝缘层400的一侧制作第二导电层200，所述第二导电层200的导电粉包括片状导电粉或球状导电粉。
在制作完成第一导电层100后，就可以在第一导电层100远离载体膜300的一侧制作第二导电层200，可以通过涂布导电材料形成第二导电层200，形成第二导电层200的导电粉中包括片状导电粉和球状导电粉中的至少一种。所述片状导电粉或所述球状导电粉的导电粒子的粒径与所述第二导电层200的厚度相同或相近。所述片状导电粉或所述球状导电粉的导电粒子的粒径可以为1-3um，所述第二导电层200的厚度可以为1-3um。
在一种具体实施方式中，在形成绝缘层400的步骤之后，该方法还可以包括以下步骤。
步骤S104，在所述绝缘层400远离所述载体膜300的一侧制作金属层600或石墨烯层700中的至少一种，形成第三导电层。
通过形成第三导电层，还可以提高电磁屏蔽膜的整体屏蔽性能和导电层的导电性能。第三导电层的厚度和选用的材料可以根据实际情况确定。
在另一种具体实施方式中，在形成第二导电层的步骤之后，该方法还可以包括以下步骤。
步骤S105，在所述第二导电层200远离所述第一导电层100的一侧贴合保护膜500。
在制作完成第二导电层200后，可以在第二导电层200远离所述第一导电层100的一侧贴合离型膜或离型纸，形成保护膜500，实现对电磁屏蔽膜中导电层的保护作用，避免与其他物体接触时，其他物体对导电层造成损坏。
在本申请实施例中，通过在载体膜300上制作第一导电层100和第二导电层200，形成具有两层导电粉的导电层，并且第一导电层100采用的导电粉中包括枝状导电粉，第二导电层200采用的导电粉中包括片状导电粉或者球状导电粉中的至少一种。枝状导电粉的导电粒子的接着性更好，可以实现水平方向和垂直方向的电导通，同时第二导电层200通过片状导电粉或球状导电粉，且片状导电粉或球状导电粉的导电粒子的粒径与第 二导电层的厚度相同或相近，使得片状导电粉或球状导电粉可以实现第二导电层200和第一导电层100之间的垂直方向上的电导通。在与只设置一层导电层的电磁屏蔽膜相比，具备相同的电磁屏蔽性能的前提下，本申请实施例中的具有第一导电层100和第二导电层200的电磁屏蔽膜的导电层不会增加整体导电层的厚度，由于不会增大整体电磁屏蔽膜的导电层的厚度，因而不会引起成本的增加，同时由于第一导电层100的导电粒子的粒径较大，不会降低电磁屏蔽膜中导电层的导电性能和屏蔽效能，使本申请实施例中的电磁屏蔽膜具有良好的电磁屏蔽性。
最后应说明的是：以上各实施例仅用以说明本发明的技术方案，而非对其限制；尽管参照前述各实施例对本发明进行了详细的说明，本领域的普通技术人员应当理解：其依然可以对前述各实施例所记载的技术方案进行修改，或者对其中部分或者全部技术特征进行等同替换；而这些修改或者替换，并不使相应技术方案的本质脱离本发明各实施例技术方案的范围。
工业实用性
本发明实施例提供了一种电磁屏蔽膜的导电层、电磁屏蔽膜及其制备方法，通过在电磁屏蔽膜中设置包括第一导电层和第二导电层的导电层，来改善电磁屏蔽膜的单层导电层的表明粗糙、不平整的现象，同时使电磁屏蔽膜能够具备较好的导电性能和屏蔽效能。

Claims (18)

  1. 一种电磁屏蔽膜的导电层，其特征在于，包括第一导电层(100)以及涂布于所述第一导电层(100)的一侧的第二导电层(200)；
    所述第一导电层(100)的导电粉包括枝状导电粉，所述枝状导电粉的导电粒子的粒径为5-20um；
    所述第二导电层(200)的导电粉包括片状导电粉或球状导电粉，所述片状导电粉或所述球状导电粉的导电粒子的粒径与所述第二导电层(200)的厚度相同。
  2. 根据权利要求1所述的电磁屏蔽膜的导电层，其特征在于，所述第一导电层(100)的厚度为5-10um。
  3. 根据权利要求1或2任意一项所述的电磁屏蔽膜的导电层，其特征在于，所述片状导电粉或所述球状导电粉的导电粒子的粒径为1-3um，所述第二导电层(200)的厚度为1-3um。
  4. 根据权利要求1或2所述的电磁屏蔽膜的导电层，其特征在于，所述枝状导电粉在所述第一导电层(100)中的粉体含量为30-40％。
  5. 根据权利要求1至4任意一项所述的电磁屏蔽膜的导电层，其特征在于，所述第一导电层(100)和所述第二导电层(200)的导电粒子包括银、铜、铁、镍、锌、银合金、铜合金、铁合金、镍合金、锌合金中的一种或多种。
  6. 根据权利要求1至5任意一项所述的电磁屏蔽膜的导电层，其特征在于，所述第一导电层(100)的材质包括热固型环氧树脂、丙烯酸树脂或聚氨酯中的至少一种。
  7. 根据权利要求1至5任意一项所述的电磁屏蔽膜的导电层，其特征在于，所述第二导电层(200)的材质包括热固型环氧树脂、丙烯酸树脂或聚氨酯中的至少一种。
  8. 根据权利要求1至7任意一项所述的电磁屏蔽膜的导电层，其特征在于，所述第一导电层(100)远离所述第二导电层(200)的一侧还涂布有第三导电层，所述第三导电层包括金属层和/或石墨烯层。
  9. 根据权利要求1至8任意一项所述的电磁屏蔽膜的导电层，其特征在于，所述第二导电层(200)的导电粉包括片状导电粉和球状导电粉中的至少一种。
  10. 一种电磁屏蔽膜，其特征在于，包括如权利要求1-9中任一项所述的电磁屏蔽膜的导电层。
  11. 根据权利要求10所述的电磁屏蔽膜，其特征在于，还包括载体膜(300)、绝缘层(400)以及保护膜(500)；
    所述绝缘层(400)涂布于所述载体膜(300)的一侧，所述第一导电层(100)涂布于所述绝缘层(400)背离所述载体膜(300)的一侧，所述保护膜(500)贴合所述 第二导电层(200)背离所述第一导电层(100)的一侧设置。
  12. 根据权利要求10或11任意一项所述的电磁屏蔽膜，其特征在于，所述绝缘层(400)的材质包括热固型环氧树脂、丙烯酸树脂或聚氨酯胶水。
  13. 根据权利要求10或11任意一项所述的电磁屏蔽膜，其特征在于，所述保护膜(500)的材质包括离型膜或离型纸。
  14. 根据权利要求10至14中任一项所述的电磁屏蔽膜，其特征在于，所述绝缘层(400)和所述电磁屏蔽膜的导电层之间还设置有金属层(600)或石墨烯层(700)。
  15. 一种电磁屏蔽膜的制备方法，其特征在于，包括：
    提供一载体膜；
    在所述载体膜一侧制作第一导电层，所述第一导电层的导电粉包括枝状导电粉；
    在所述第一导电层远离所述绝缘层的一侧制作第二导电层，所述第二导电层(200)的导电粉包括片状导电粉或球状导电粉。
  16. 根据权利要求15所述的电磁屏蔽膜的制备方法，其特征在于，在形成第一导电层的步骤之前，该方法还包括：
    在所述载体膜一侧涂布绝缘材料，形成绝缘层，所述第一导电层设置在所述绝缘层远离所述载体膜的一侧。
  17. 根据权利要求15所述的电磁屏蔽膜的制备方法，其特征在于，在形成绝缘层的步骤之后，该方法还包括：
    在所述绝缘层远离所述载体膜的一侧制作金属层或石墨烯层，形成第三导电层。
  18. 根据权利要求15所述的电磁屏蔽膜的制备方法，其特征在于，在形成第二导电层的步骤之后，该方法还包括：
    在所述第二导电层远离所述第一导电层的一侧贴合保护膜。
PCT/CN2018/075982 2017-08-16 2018-02-09 电磁屏蔽膜的导电层、电磁屏蔽膜及其制备方法 WO2019033722A1 (zh)

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