WO2018011121A1 - Cmos pixel, bildsensor und kamera sowie verfahren zum auslesen eines cmos pixels - Google Patents
Cmos pixel, bildsensor und kamera sowie verfahren zum auslesen eines cmos pixels Download PDFInfo
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- WO2018011121A1 WO2018011121A1 PCT/EP2017/067216 EP2017067216W WO2018011121A1 WO 2018011121 A1 WO2018011121 A1 WO 2018011121A1 EP 2017067216 W EP2017067216 W EP 2017067216W WO 2018011121 A1 WO2018011121 A1 WO 2018011121A1
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- WIPO (PCT)
- Prior art keywords
- photodiode
- capacitance
- reading
- cmos pixel
- diffusion region
- Prior art date
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- 238000000034 method Methods 0.000 title claims description 18
- 230000009977 dual effect Effects 0.000 claims abstract description 66
- 238000006243 chemical reaction Methods 0.000 claims abstract description 63
- 238000009792 diffusion process Methods 0.000 claims abstract description 32
- 230000003321 amplification Effects 0.000 claims description 26
- 238000003199 nucleic acid amplification method Methods 0.000 claims description 26
- 239000003990 capacitor Substances 0.000 claims description 11
- 230000035945 sensitivity Effects 0.000 description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- 230000005670 electromagnetic radiation Effects 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- 206010034972 Photosensitivity reaction Diseases 0.000 description 1
- 230000006978 adaptation Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 230000036211 photosensitivity Effects 0.000 description 1
- 238000012805 post-processing Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14609—Pixel-elements with integrated switching, control, storage or amplification elements
- H01L27/1461—Pixel-elements with integrated switching, control, storage or amplification elements characterised by the photosensitive area
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
- H04N25/50—Control of the SSIS exposure
- H04N25/57—Control of the dynamic range
- H04N25/58—Control of the dynamic range involving two or more exposures
- H04N25/581—Control of the dynamic range involving two or more exposures acquired simultaneously
- H04N25/585—Control of the dynamic range involving two or more exposures acquired simultaneously with pixels having different sensitivities within the sensor, e.g. fast or slow pixels or pixels having different sizes
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B5/00—Optical elements other than lenses
- G02B5/02—Diffusing elements; Afocal elements
- G02B5/0205—Diffusing elements; Afocal elements characterised by the diffusing properties
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
- H04N25/50—Control of the SSIS exposure
- H04N25/57—Control of the dynamic range
- H04N25/59—Control of the dynamic range by controlling the amount of charge storable in the pixel, e.g. modification of the charge conversion ratio of the floating node capacitance
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
- H04N25/70—SSIS architectures; Circuits associated therewith
- H04N25/71—Charge-coupled device [CCD] sensors; Charge-transfer registers specially adapted for CCD sensors
- H04N25/75—Circuitry for providing, modifying or processing image signals from the pixel array
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
- H04N25/70—SSIS architectures; Circuits associated therewith
- H04N25/76—Addressed sensors, e.g. MOS or CMOS sensors
- H04N25/77—Pixel circuitry, e.g. memories, A/D converters, pixel amplifiers, shared circuits or shared components
- H04N25/771—Pixel circuitry, e.g. memories, A/D converters, pixel amplifiers, shared circuits or shared components comprising storage means other than floating diffusion
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
- H04N25/70—SSIS architectures; Circuits associated therewith
- H04N25/76—Addressed sensors, e.g. MOS or CMOS sensors
- H04N25/77—Pixel circuitry, e.g. memories, A/D converters, pixel amplifiers, shared circuits or shared components
- H04N25/778—Pixel circuitry, e.g. memories, A/D converters, pixel amplifiers, shared circuits or shared components comprising amplifiers shared between a plurality of pixels, i.e. at least one part of the amplifier must be on the sensor array itself
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
- H04N25/70—SSIS architectures; Circuits associated therewith
- H04N25/76—Addressed sensors, e.g. MOS or CMOS sensors
- H04N25/78—Readout circuits for addressed sensors, e.g. output amplifiers or A/D converters
Definitions
- CMOS pixel image sensor and camera as well as method for reading a CMOS pixel
- the present invention relates to a CMOS pixel, an image sensor and a camera, and a method for reading out a CMOS pixel.
- CMOS image sensors are made with different pixel designs. Common are designs with four to six transistors per pixel and one or two photodiodes.
- Photodiode is made by the silicon process such that the photodiode has no connection to a metal.
- a dual conversion gain read circuit is a circuit which is designed to charge the photodiode by means of at least two different ones
- electromagnetic radiation typically in the wavelength range of light, including the ultraviolet and infrared wavelengths to determine.
- designs with five transistors and two pinned photodiodes are known. Further, designs with six transistors are known. These are typically used to convert an image sensor with Global Shutter.
- the challenge in pixel design is to design a circuit that uses as few transistors as possible while meeting the performance requirements.
- transistor sharing for color sensors, multiple use of the transistors (transistor sharing) in a cluster of four pixels (eg, the Bayer pattern, i.e. red,
- US 2004/0251394 A1 discloses a CMOS pixel according to the preamble of the present invention.
- CMOS pixel with a dual conversation gain readout circuit comprising at least one first photodiode, one
- a diffusion region having a first capacitance for receiving a charge from the at least one first photodiode, wherein the dual conversation gain
- Readout circuit is adapted to read the charge of the diffusion region by means of a first amplification factor and by means of a second amplification factor, wherein the CMOS pixel has at least one second photodiode, wherein the diffusion region is further adapted to receive a charge from the at least one second photodiode and that the dual Conversion gain Readout circuit is adapted to read the charge of the diffusion region by means of at least one third gain factor and by means of at least one fourth gain factor.
- a split pixel i. a pixel with more than one photodiode, typically with two photodiodes, with a dual conversion
- the advantage of the pixel of the present invention is that it provides a pixel with a high dynamic (> 140 dB) and good dark sensitivity.
- High dynamics are necessary, for example, when recording an image that has a high dark content and a high light content.
- a typical situation in which such an image is to be recorded is when entering a tunnel in broad daylight.
- the dual conversion gain readout circuit of the CMOS pixel has a dual conversion gain capacity, wherein the dual conversion gain readout circuit is configured to form the second gain factor by means of the dual conversion gain capacity.
- the dual conversion gain capacity is provided by a dual conversion gain capacitor.
- the at least one first photodiode and the at least one second photodiode have different sizes.
- the different sizes of the photodiodes give a different sensitivity. By combining the signals of the two photodiodes, one obtains increased dynamics.
- the at least one first photodiode is smaller than the at least one second photodiode.
- a size or area ratio between the at least one first photodiode and the at least one second photodiode of 1: 8 has proven to be advantageous.
- the at least one first photodiode has a first photodiode capacitance and the at least one second photodiode has a second photodiode capacitance
- Photodiode capacity wherein the first photodiode capacitance is smaller than the second photodiode capacitance.
- the first photodiode capacitance has a capacitance of 5,000 e- (electrons) and the second photodiode capacitance has a capacitance of 10,000 e- (electrons).
- a switch in particular a transistor, is arranged between the diffusion region and the first capacitor.
- Readout circuit designed for the first photodiode capacity of the at least one first photodiode.
- the photodiodes also have different photodiode capacitances.
- Readout circuit for the respective photodiode capacitances of the photodiodes designed to provide readout circuits.
- the design of the dual conversion gain read circuit on the smaller of the two photodiode capacitors has the advantage that the same dual conversion gain readout circuit can be used for the larger of the two photodiode capacities.
- the number of transistors can be reduced for the individual pixel, and as a result, more area of the pixel can be used for the at least one first pixel Photodiode and the at least one second photodiode are provided. This improves the dark sensitivity of the pixel.
- Photodiode designed to provide the first photodiode capacity of the dual conversion gain read circuit and the dual conversion gain
- Readout circuit adapted to the at least one third amplification factor by means of the first capacitor or the first capacitor and the first
- the first photodiode is designed in such a way that the first photodiode capacitance and the first capacitance are suitable for designing the dual conversion gain read circuit for the at least one second photodiode. To a maximum between size or area ratio and
- the silicon process for producing the at least one first photodiode is set such that the doping of the at least one first photodiode leads to the highest possible or the desired photodiode capacity of the first photodiode ,
- This variant offers the advantage that, although only one common dual conversion gain read-out circuit is provided for the at least one first photodiode and the at least one second photodiode, there is still one for both
- Photodiodes or photodiode capacitors optimally designed reading can be achieved.
- Photodiode and the diffusion region a second switch, in particular a transistor arranged.
- Another aspect of the present invention is a method for reading out a
- CMOS pixels according to the present invention with the steps: Reading the charge of the at least one first photodiode from the
- This aspect of the present invention results from the recognition that the respective amplification factor results from the ratio between the photodiode capacitance to be read and the capacitance by means of which the dual conversion gain readout circuit reads the photodiode. Accordingly, even if the dual conversion gain readout circuit uses the same capacitance or the same capacitances, then another gain factor results, but in relation to this the read photodiode has a different photodiode capacitance.
- the first capacitance and the second capacitance are used.
- This embodiment provides a second gain factor for reading the first photodiode by the addition of the second capacitance of the dual conversion gain circuit.
- the first capacitance or the first capacitance and the first photodiode capacitance are used.
- Photodiode capacity used. Will the at least one second photodiode with the dual conversion gain
- Read-out circuit which is designed for the at least one first photodiode, then this leads to a particularly strong amplification factor. Thus, even very faint objects can be detected via the pixel.
- the readout circuit is detuned such that the dual conversion gain readout circuit, which is designed for the at least one first photodiode, is then designed for the at least one second photodiode.
- This embodiment is based on the recognition that the at least one first photodiode their
- Photodiode capacity of the dual conversion gain read circuit can provide to create a ratio between the photodiode capacity of the at least one second photodiode and the dual conversion gain readout circuit, which is optimal for the reading of the second photodiode.
- a particularly good result is achieved if the photodiode capacitance of the at least one first photodiode is chosen such that, in conjunction with the dual conversion gain readout circuit, a capacitance on the part of the
- Readout circuit is formed, which is optimal for the reading of the at least one second photodiode capacitance.
- FIG. 2 shows a CMOS pixel with dual conversion gain readout circuit according to the present invention
- FIG. 3 is a flow chart of a method for reading out a CMOS pixel according to the present invention.
- Fig. 1 shows a CMOS pixel with four transistors according to the prior art.
- the CMOS pixel has a photodiode PD and a diffusion region FD with an associated capacitance CFD. Between the diffusion region FD and the
- Photodiode PD is a transistor arranged as a transfer gate ⁇ . About the transfer Gate ⁇ the charge of the photodiode PD is transmitted to the diffusion region FD for reading. Between the diffusion region FD and the voltage supply VAA_PIX of the pixel, a transistor is arranged as a reset transistor TR to reset the pixel. Between the voltage supply VAA_PIX and the ground, two transistors are arranged as source follower transistor TSF for amplification and as a row select transistor TRS for selecting the row of pixels to be read, for example in the rolling shutter mode of a CMOS image sensor consisting of CMOS pixels.
- the electromagnetic radiation detected via the pixel typically light from the ultraviolet to the infrared range, can be read out as a quantity represented by a voltage value.
- FIG. 2 shows a CMOS pixel with a dual conversion gain readout circuit according to the present invention. Identical or equivalent elements are identified by the same or similar reference numerals.
- the illustrated pixel comprises a first photodiode PD1 and a second photodiode PD2.
- the two photodiodes PD1, PD2 are assigned to a common diffusion region FD.
- Each photodiode PD1, PD2 is associated with a respective transfer gate transistor ⁇ , ⁇ 2.
- the photodiodes PD1, PD2 and the photodiode capacitors can be connected to the diffusion region FD via the transfer gate transistors ⁇ , ⁇ 2.
- the illustrated pixel comprises a dual conversion gain readout circuit, which comprises at least a first
- the dual conversion gain read circuit consists of a transistor as a dual conversion gain transistor TDCG, which is arranged between the diffusion region FD and the capacity CDCG, which is likewise assigned to the dual conversion gain read circuit.
- Dual Conversion Gain Capacity CDCG is displayed in the CMOS pixel as Capacitor provided between the dual conversion gain transistor TDCG and the ground.
- the juxtaposed capacitances are the dual conversion gain readout circuit and the two photodiodes
- the size or area of the first layer is the size or area of the first layer
- Photodiode PDl in the ratio 1: 8 smaller than the size or the area of the second photodiode PD2. Accordingly, the first photodiode PD1 has a lower photodiode capacity.
- Silicon process for producing the photodiodes PDL, PD2 can be achieved that the photodiode capacitance of the first photodiode PDL 5000 e- (electrons) and the photodiode capacitance of the second photodiode PD2 is 10,000 e-, i. the ratio of the photodiode capacitances is 1: 2.
- the dual conversion gain readout circuit is designed for the photodiode capacitance of the first photodiode PD1 and provides for the reading of the charge of the first photodiode PD1 a high gain (High Conversation Gain) and a low gain (Low Conversation Gain ) ready.
- the Gain factors for the readout of the second photodiode are not necessarily optimal.
- the present invention is now based on that for reading the second
- Photodiode PD2 the optimized photodiode capacity of the first photodiode PD1 can be used by the dual conversion gain readout circuit. For this purpose, after reading the first photodiode PD1, the photodiode PD1 is reset via the reset transistor TR. For the readout of the second photodiode PD2, however, the transfer gate ⁇ of the first photodiode is not closed, i. not set to nonconductive, but remains open, i. set to conductive. This is possible, among other things, because compared to the exposure time of
- Photodiodes of the readout process is very short and therefore the exposure of the first Photodiode PD1 during the reading of the second photodiode PD2 does not negatively or falsely significant. This is also maximized by the
- Photodiode PD2 supported.
- CMOS pixel of the illustrated embodiment it is possible the dual
- Conversion gain readout circuit for reading the second photodiode PD2 by means of the photodiode capacitance of the first photodiode PD1 by a factor of 2 to detune the dual conversion gain readout circuit for the second
- Photodiode PD2 interpreted. The size and area ratios given above and
- Capacitance ratios are one possible embodiment of the CMOS pixel according to the present invention. Depending on the field of application, otheruccntig. Area ratios and capacity ratios possible.
- FIG. 3 shows a flow diagram of a method for reading out a CMOS pixel according to the present invention.
- step 301 the first photodiode PD1 is read out with a first amplification factor.
- the reset transistor TR, the dual conversion gain transistor TDCG and the transfer gate transistor ⁇ 2 of the second photodiode can be closed with reference to FIG.
- the transfer gate transistor ⁇ the first photodiode is opened accordingly.
- the first photodiode PD1 is read out with a second amplification factor.
- the reset transistor TR and the transfer gate transistor ⁇ 2 of the second photodiode can be closed with reference to FIG.
- step 303 the first photodiode PD1 and the dual conversion gain readout circuit are reset.
- the reset transistor TR, the dual conversion gain transistor TDCG and the transfer gate transistor ⁇ of the first photodiode PD1 are opened.
- Photodiode PD2 is closed.
- the second photodiode PD2 is read out with a third amplification factor.
- the reset transistor TR the dual conversion gain transistor TDCG
- the transfer gate transistors ⁇ , ⁇ 2 of the first and the second photodiode PD1, PD2 is opened accordingly. This achieves a high gain factor (high conversion gain) for the readout of the second photodiode PD2.
- Alternative can also be the transfer gate
- Transistor ⁇ the first photodiode PD1 be closed. This achieves an extremely high gain (ultra high conversion gain).
- step 305 the second photodiode PD2 is read out with a fourth amplification factor.
- the reset transistor can be closed with reference to FIG.
- Transistor ⁇ 2 of the second photodiode and the dual conversion gain transistor TDCG are opened accordingly. This achieves an extremely low gain (ultra low conversion gain) for the readout of the second photodiode PD2.
- the transfer gate transistor ⁇ of the first photodiode PD1 may be closed. This achieves a low gain (low conversion gain).
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Abstract
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Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2018568376A JP6767520B2 (ja) | 2016-07-13 | 2017-07-10 | Cmosピクセル、画像センサおよびカメラ、並びにcmosピクセルを読み出すための方法 |
CN201780043178.6A CN109479105B (zh) | 2016-07-13 | 2017-07-10 | Cmos像素、图像传感器、摄像机和用于读取cmos像素的方法 |
GB1817739.4A GB2564993A (en) | 2016-07-13 | 2017-07-10 | CMOS pixel, image sensor and camera, and method for reading a CMOS pixel |
US16/316,937 US10872913B2 (en) | 2016-07-13 | 2017-07-10 | CMOS pixel, image sensor, and camera and method for reading out a CMOS pixel |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102016212784.5A DE102016212784A1 (de) | 2016-07-13 | 2016-07-13 | CMOS Pixel, Bildsensor und Kamera sowie Verfahren zum Auslesen eienes CMOS Pixels |
DE102016212784.5 | 2016-07-13 |
Publications (1)
Publication Number | Publication Date |
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WO2018011121A1 true WO2018011121A1 (de) | 2018-01-18 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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PCT/EP2017/067216 WO2018011121A1 (de) | 2016-07-13 | 2017-07-10 | Cmos pixel, bildsensor und kamera sowie verfahren zum auslesen eines cmos pixels |
Country Status (6)
Country | Link |
---|---|
US (1) | US10872913B2 (de) |
JP (1) | JP6767520B2 (de) |
CN (1) | CN109479105B (de) |
DE (1) | DE102016212784A1 (de) |
GB (1) | GB2564993A (de) |
WO (1) | WO2018011121A1 (de) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110121037A (zh) * | 2018-02-07 | 2019-08-13 | 豪威科技股份有限公司 | 具有双重转换增益读出的图像传感器 |
EP3651450A4 (de) * | 2017-07-07 | 2022-03-30 | Brillnics Singapore Pte. Ltd. | Bildgebende festkörpervorrichtung, betriebsverfahren für die bildgebende festkörpervorrichtung, und elektronische ausstattung |
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Publication number | Priority date | Publication date | Assignee | Title |
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CN110336964B (zh) * | 2019-06-11 | 2022-03-25 | Oppo广东移动通信有限公司 | 一种cmos图像传感器及图像处理方法、存储介质 |
EP3876523A1 (de) * | 2020-03-06 | 2021-09-08 | Gpixel NV | Gemeinsamer pixel-komparator |
US11509843B2 (en) * | 2020-07-09 | 2022-11-22 | Semiconductor Components Industries, Llc | Low power shared image pixel architecture |
KR20220098587A (ko) * | 2021-01-04 | 2022-07-12 | 삼성전자주식회사 | 이미지 센서, 픽셀 및 픽셀의 동작 방법 |
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2016
- 2016-07-13 DE DE102016212784.5A patent/DE102016212784A1/de active Pending
-
2017
- 2017-07-10 GB GB1817739.4A patent/GB2564993A/en not_active Withdrawn
- 2017-07-10 JP JP2018568376A patent/JP6767520B2/ja active Active
- 2017-07-10 US US16/316,937 patent/US10872913B2/en active Active
- 2017-07-10 CN CN201780043178.6A patent/CN109479105B/zh active Active
- 2017-07-10 WO PCT/EP2017/067216 patent/WO2018011121A1/de active Application Filing
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US20090295973A1 (en) * | 2008-05-20 | 2009-12-03 | Texas Instruments Japan, Ltd. | Solid-State Image Pickup Device |
US20110140182A1 (en) * | 2009-12-15 | 2011-06-16 | Nagataka Tanaka | Solid-state imaging device which can expand dynamic range |
US20130256510A1 (en) * | 2012-03-29 | 2013-10-03 | Omnivision Technologies, Inc. | Imaging device with floating diffusion switch |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP3651450A4 (de) * | 2017-07-07 | 2022-03-30 | Brillnics Singapore Pte. Ltd. | Bildgebende festkörpervorrichtung, betriebsverfahren für die bildgebende festkörpervorrichtung, und elektronische ausstattung |
US11350044B2 (en) | 2017-07-07 | 2022-05-31 | Brillnics Singapore Pte. Ltd. | Solid-state imaging device, method for driving solid-state imaging device, and electronic apparatus |
CN110121037A (zh) * | 2018-02-07 | 2019-08-13 | 豪威科技股份有限公司 | 具有双重转换增益读出的图像传感器 |
Also Published As
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JP2019523589A (ja) | 2019-08-22 |
JP6767520B2 (ja) | 2020-10-14 |
US20190296059A1 (en) | 2019-09-26 |
DE102016212784A1 (de) | 2018-01-18 |
GB2564993A (en) | 2019-01-30 |
CN109479105A (zh) | 2019-03-15 |
CN109479105B (zh) | 2021-07-20 |
US10872913B2 (en) | 2020-12-22 |
GB201817739D0 (en) | 2018-12-19 |
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