WO2018003766A1

WO2018003766A1 - Vapor deposition mask, method for manufacturing organic semiconductor element, and method for manufacturing organic el display

Info

Publication number: WO2018003766A1
Application number: PCT/JP2017/023484
Authority: WO
Inventors: 博司川崎; 康子曽根; 久実子穂刈
Original assignee: 大日本印刷株式会社
Priority date: 2016-06-28
Filing date: 2017-06-27
Publication date: 2018-01-04
Also published as: KR102366019B1; KR20190021231A

Abstract

Provided is a vapor deposition mask formed by layering a resin mask having a plurality of resin mask openings that correspond to a pattern that is to be fabricated by vapor deposition, and a metal mask having a metal mask opening, said masks being layered such that the resin mask openings and the metal mask opening overlap, wherein the shape of the metal mask opening, when the metal mask is viewed from above, is polygonal as a basic shape, and is also a shape to which has been added an extended portion that extends the length of the entire periphery of the polygon.

Description

Vapor deposition mask, organic semiconductor element manufacturing method, and organic EL display manufacturing method

Embodiments of the present disclosure relate to an evaporation mask, an organic semiconductor element manufacturing method, and an organic EL display.

Formation of a vapor deposition pattern using a vapor deposition mask is usually performed by bringing a vapor deposition mask provided with an opening corresponding to a pattern to be vapor-deposited and an object to be vapor-deposited, and allowing a vapor deposition material released from a vapor deposition source to pass through the opening. It is performed by adhering to a vapor deposition object.

As a vapor deposition mask used for the formation of the vapor deposition pattern, for example, a metal mask having a resin mask opening having a resin mask opening corresponding to the pattern to be vapor deposited and a metal mask opening (sometimes referred to as a slit). A vapor deposition mask (for example, Patent Document 1) formed by laminating and is known.

Japanese Patent No. 5288072

Embodiments of the present disclosure provide a vapor deposition mask in which a higher-definition vapor deposition pattern can be formed in a vapor deposition mask formed by laminating a resin mask and a metal mask, and accurately manufacture an organic semiconductor element. An object of the present invention is to provide a method for forming an organic semiconductor element that can be used, and to provide a method for manufacturing an organic EL display.

A vapor deposition mask according to an embodiment of the present disclosure includes a resin mask having a plurality of resin mask openings corresponding to a pattern to be vapor-deposited and a metal mask having a metal mask opening, the resin mask openings and the metal A vapor deposition mask that is laminated so as to overlap with a mask opening, and the shape of the metal mask opening when the metal mask is viewed in plan is a polygon as a basic shape, and the entire shape of the polygon It is a shape with an extension that extends the circumference.

In the vapor deposition mask according to an embodiment of the present disclosure, the metal mask partially reduces the rigidity of the metal mask at a position where the metal mask does not overlap the resin mask opening. Or you may have a some rigidity adjustment part.

Further, in the vapor deposition mask according to an embodiment of the present disclosure, the rigidity adjusting unit may be a through hole penetrating the metal mask or a recess provided in the metal mask.

Moreover, the manufacturing method of the organic-semiconductor element concerning another one Embodiment of this indication includes the vapor deposition pattern formation process which forms a vapor deposition pattern in a vapor deposition target object using a vapor deposition mask, The said vapor deposition pattern formation process WHEREIN: The vapor deposition mask is a vapor deposition mask according to an embodiment of the present disclosure.

In addition, an organic EL element manufactured by the method for manufacturing an organic semiconductor element according to the embodiment of the present disclosure is used as a method of manufacturing the organic EL display according to another embodiment of the present disclosure.

According to the vapor deposition mask of the present disclosure, a high-definition vapor deposition pattern can be formed. Moreover, according to the manufacturing method of the organic-semiconductor element of this indication, an organic-semiconductor element can be manufactured accurately. Moreover, according to the manufacturing method of the organic EL display of this indication, an organic EL display can be manufactured accurately.

(A) is a schematic sectional drawing which shows an example of the vapor deposition mask concerning embodiment of this indication, (b) is when the vapor deposition mask concerning embodiment of this indication is planarly viewed from the metal mask side It is a front view which shows an example. It is a front view which shows an example of the shape of a metal mask opening part when the vapor deposition mask concerning embodiment of this indication is planarly viewed from the metal mask side. It is a front view which shows an example of the shape of a metal mask opening part when the vapor deposition mask concerning embodiment of this indication is planarly viewed from the metal mask side. It is a front view which shows an example of the shape of a metal mask opening part when the vapor deposition mask concerning embodiment of this indication is planarly viewed from the metal mask side. It is a front view which shows an example of the shape of a metal mask opening part when the vapor deposition mask concerning other embodiment of this indication is planarly viewed from the metal mask side. It is a front view which shows an example of the shape of a metal mask opening part when the vapor deposition mask concerning further another embodiment of this indication is planarly viewed from the metal mask side. It is a front view which shows an example of the shape of a metal mask opening part when the vapor deposition mask concerning further another embodiment of this indication is planarly viewed from the metal mask side. It is a front view which shows an example when the vapor deposition mask which concerns on embodiment of this indication is planarly viewed from the metal mask side. It is a front view which shows an example when the vapor deposition mask which concerns on embodiment of this indication is planarly viewed from the metal mask side. It is a front view which shows an example when the vapor deposition mask which concerns on embodiment of this indication is planarly viewed from the metal mask side. It is an enlarged front view which shows an example of the area | region shown by the code | symbol X of FIG.1 (b). FIG. 12 is an example of a schematic cross-sectional view along AA in FIG. FIG. 12 is an example of a schematic cross-sectional view along AA in FIG. FIG. 12 is an example of a schematic cross-sectional view along AA in FIG. It is an enlarged front view which shows an example of the area | region shown by the code | symbol X of FIG.1 (b). It is a front view which shows an example when the vapor deposition mask which concerns on embodiment of this indication is planarly viewed from the metal mask side. It is a front view which shows an example when the vapor deposition mask which concerns on embodiment of this indication is planarly viewed from the metal mask side. It is a front view which shows an example when the vapor deposition mask which concerns on embodiment of this indication is planarly viewed from the metal mask side. It is a front view which shows an example when the vapor deposition mask which concerns on embodiment of this indication is planarly viewed from the metal mask side. It is a figure which shows an example of a rigidity adjustment part. It is a figure which shows an example of a rigidity adjustment part. It is a figure which shows an example of the device in which the organic EL display was used.

Hereinafter, embodiments of the present invention will be described with reference to the drawings. Note that the present invention can be implemented in many different modes, and is not construed as being limited to the description of the embodiments exemplified below. In addition, the drawings may be schematically represented with respect to the width, thickness, shape, and the like of each part in comparison with actual aspects for the sake of clarity of explanation, but are merely examples, and the interpretation of the present invention is not limited. It is not limited. In addition, in the present specification and each drawing, the same elements as those described above with reference to the previous drawings are denoted by the same reference numerals, and detailed description may be omitted as appropriate. In addition, for convenience of explanation, the description will be made using words such as “upper” or “lower”, but the vertical direction may be reversed. The same applies to the left-right direction.

<< Vapor deposition mask >>
As shown in FIGS. 1A and 1B, a vapor deposition mask 100 according to an embodiment of the present disclosure (hereinafter, may be referred to as a vapor deposition mask of the present disclosure) includes a plurality of patterns corresponding to a pattern to be formed by vapor deposition. The resin mask 20 having the resin mask opening 25 and the metal mask 10 having the metal mask opening 15 are laminated such that the resin mask opening 25 and the metal mask opening 15 overlap. Yes. 1A is a schematic cross-sectional view illustrating an example of the vapor deposition mask 100 of the present disclosure, and FIG. 1B is a front view of the vapor deposition mask 100 of the present disclosure viewed from the metal mask side. In the form shown in FIG. 1, the description of the extension 35 described later is omitted.

In the case of forming a vapor deposition pattern on a vapor deposition object using such a vapor deposition mask 100, the vapor deposition mask 100 is usually used repeatedly, and between use, Cleaning using ultrasonic waves is performed. For example, when ultrasonic cleaning is performed, fine vibration is repeatedly applied to the vapor deposition mask 100. When the metal mask 10 constituting the vapor deposition mask 100 is resonated by this fine vibration, A part of the resin mask 20 located near the metal mask opening 15 of the metal mask 10 may be damaged. As a result of intensive research focusing on this point, the inventor of the present application has found that the resin mask due to the resonance of the metal mask 10 at the portion (reference numeral A) where the edge 15 ′ of the metal mask opening 15 of the metal mask 10 contacts the resin mask 20. It has been found that there is a high possibility that 20 damage will occur.

The vapor deposition mask 100 according to the embodiment of the present disclosure has been made based on the above knowledge, and as shown in FIGS. 2 to 4, the metal mask opening of the metal mask 10 when the metal mask 10 is viewed in plan view. The shape of 15 is a shape in which a polygon (in FIG. 2 to FIG. 4, a rectangle) is a basic shape, and an extension 35 that extends the entire circumference of the polygon is added. According to the vapor deposition mask 100 according to the embodiment of the present disclosure as described above, when the metal mask 10 resonates, the entire periphery of the opening, which is a portion where the resin mask 20 is likely to be damaged, that is, the edge portion. In addition, since an extension portion 35 that extends the length of the entire circumference is added, the stress applied to the portion can be dispersed by shifting the resonance frequency of the metal mask 10 by this extension. It becomes possible to reduce the probability that 20 will be damaged. 2 to 4 are plan views showing an example of the shape of the metal mask opening 15 when the vapor deposition mask 100 according to the embodiment of the present disclosure is viewed in plan from the metal mask 10 side.

Hereinafter, each configuration of the vapor deposition mask 100 of the present disclosure will be described with an example.

<Resin mask>
As shown in FIG. 1B, the resin mask 20 is provided with a plurality of resin mask openings 25. In the illustrated form, the opening shape of the resin mask opening 25 is rectangular, but the opening shape of the resin mask opening 25 is not particularly limited, and any shape can be used as long as it corresponds to the pattern to be deposited. It may be a shape. For example, the opening shape of the resin mask opening 25 may be a diamond shape or a polygonal shape, or may be a shape having a curvature such as a circle or an ellipse. In addition, it can be said that the rectangular or polygonal opening shape is a preferable opening shape of the resin mask opening 25 in that the light emission area can be increased as compared with the opening shape having a curvature such as a circle or an ellipse.

There is no limitation on the material of the resin mask 20. For example, a high-definition resin mask opening 25 can be formed by laser processing or the like, and a lightweight material with a small dimensional change rate and moisture absorption rate over time is used. It is preferable. Such materials include polyimide resin, polyamide resin, polyamideimide resin, polyester resin, polyethylene resin, polyvinyl alcohol resin, polypropylene resin, polycarbonate resin, polystyrene resin, polyacrylonitrile resin, ethylene vinyl acetate copolymer resin, ethylene- Examples thereof include vinyl alcohol copolymer resin, ethylene-methacrylic acid copolymer resin, polyvinyl chloride resin, polyvinylidene chloride resin, cellophane, and ionomer resin. Among the materials exemplified above, a resin material having a thermal expansion coefficient of 16 ppm / ° C. or less is preferable, a resin material having a moisture absorption rate of 1.0% or less is preferable, and a resin material having both conditions is particularly preferable. . By using the resin mask 20 using this resin material, the dimensional accuracy of the resin mask opening 25 can be improved, and the dimensional change rate and moisture absorption rate with time and heat can be reduced.

The thickness of the resin mask 20 is not particularly limited, but in the case of further improving the effect of suppressing the generation of shadows, the thickness of the resin mask 20 is preferably 25 μm or less, and more preferably less than 10 μm. Although there is no particular limitation on the preferable range of the lower limit value, when the thickness of the resin mask 20 is less than 3 μm, defects such as pinholes are likely to occur, and the risk of deformation and the like increases. In particular, by setting the thickness of the resin mask 20 to 3 μm or more and less than 10 μm, more preferably 4 μm or more and 8 μm or less, it is possible to more effectively prevent the influence of shadows when forming a high-definition pattern exceeding 400 ppi. . In addition, the resin mask 20 and the metal mask 10 to be described later may be bonded directly or via an adhesive layer, but the resin mask 20 and the metal mask via an adhesive layer. 10 is bonded, it is preferable that the total thickness of the resin mask 20 and the pressure-sensitive adhesive layer is within the range of the preferable thickness. In addition, the shadow means that a part of the vapor deposition material released from the vapor deposition source collides with the metal mask opening of the metal mask or the inner wall surface of the resin mask opening of the resin mask and does not reach the vapor deposition target. This refers to a phenomenon in which an undeposited portion having a film thickness thinner than the target deposition film thickness occurs.

The cross-sectional shape of the resin mask opening 25 is not particularly limited, and the end faces of the resin mask that form the resin mask opening 25 may be substantially parallel to each other. However, as shown in FIG. It is preferable that the cross-sectional shape of the mask opening 25 is a shape that expands toward the vapor deposition source. In other words, it is preferable to have a tapered surface that expands toward the metal mask 10 side. The taper angle can be appropriately set in consideration of the thickness of the resin mask 20 and the like, but the bottom bottom tip in the resin mask opening of the resin mask and the top bottom tip in the resin mask opening of the resin mask are also used. The angle formed by the connected straight line and the bottom surface of the resin mask, in other words, in the cross section in the thickness direction of the inner wall surface constituting the resin mask opening 25 of the resin mask 20, the inner wall surface of the resin mask opening 25 and the resin mask 20. The angle formed with the surface on the side not in contact with the metal mask 10 (in the embodiment shown, the upper surface of the resin mask) is preferably in the range of 5 ° to 85 °, and in the range of 15 ° to 75 °. It is more preferable that it is within the range of 25 ° or more and 65 ° or less. In particular, within this range, an angle smaller than the vapor deposition angle of the vapor deposition machine to be used is preferable. In the illustrated embodiment, the end face forming the resin mask opening 25 has a linear shape, but is not limited to this, and has an outwardly convex curved shape, that is, the resin mask opening. The entire shape of 25 may be a bowl shape. Further, it may be the opposite, that is, it may have a convex curved shape.

<Metal mask>
As shown in FIG. 1A, a metal mask 10 is laminated on one surface of the resin mask 20. The metal mask 10 is made of metal, and a metal mask opening 15 extending in the vertical direction or the horizontal direction is disposed as shown in FIG. The arrangement example of the metal mask openings 15 is not particularly limited, and the metal mask openings 15 extending in the vertical direction and the horizontal direction may be arranged in a plurality of rows in the vertical direction and the horizontal direction, and the metal extending in the vertical direction. The mask openings 15 may be arranged in a plurality of rows in the horizontal direction, and the metal mask openings extending in the horizontal direction may be arranged in a plurality of rows in the vertical direction. Further, only one row may be arranged in the vertical direction or the horizontal direction. Further, the plurality of metal mask openings 15 may be randomly arranged. Further, the number of metal mask openings 15 may be one. In the present specification, “vertical direction” and “lateral direction” mean the vertical and horizontal directions in the drawing, and are any of the longitudinal direction and the width direction of the vapor deposition mask, resin mask, and metal mask. May be. For example, the longitudinal direction of the vapor deposition mask, the resin mask, and the metal mask may be “vertical direction”, and the width direction may be “vertical direction”.

(Extension part)
As shown in FIGS. 2 to 4, when the metal mask 10 is viewed in plan, the shape of the metal mask opening 15 of the metal mask 10 is a rectangular shape that is one form of a polygon, while the rectangular shape is a rectangular shape. It has a shape with an extension 35 that extends the length of the entire circumference. By providing such an extension 35, the resonance frequency of the metal mask 10 when there is no extension 35 can be shifted, and as a result, the probability that the resin mask 20 is damaged can be reduced. .

Hereinafter, the various extensions 35 will be described in detail with reference to FIGS.

FIG. 2A shows the shape of the metal mask opening 15 when the extension 35 is not provided. Thus, the metal mask opening 15 in the vapor deposition mask 100 according to the embodiment of the present disclosure has a rectangular basic shape.

The metal mask opening 15 shown in FIG. 2 (b) has a plurality of continuous arc-shaped extensions 35 that protrude toward the outside of the opening 15 over the entire circumference of the metal mask opening 15 as a basic shape. Yes.

The metal mask opening 15 shown in FIG. 2 (c) has a plurality of continuous arc-shaped extensions 35 projecting toward the inside of the opening 15 over the entire circumference of the metal mask opening 15 having a rectangular basic shape. Yes.

The metal mask opening 15 shown in FIG. 2D has a rectangular shape as a basic shape, and has a plurality of continuous arc-shaped extensions 35 protruding toward both the outside and the inside of the opening 15 over the entire circumference. have.

As shown in FIGS. 2B to 2D, the resonance frequency of the metal mask 10 may be shifted by a plurality of continuous arc-shaped extensions 35.

On the other hand, the metal mask opening 15 shown in FIG. 2 (e) has a rectangular basic shape, and a plurality of continuous arc-shaped extensions protruding toward the outside of the opening 15 only on one side thereof. 35.

Further, the metal mask opening 15 shown in FIG. 2 (f) has a rectangular shape as a basic shape, and has arc-shaped extensions 35 protruding toward the outside of the opening 15 only at the four apexes thereof. Yes.

As shown in FIGS. 2 (e) and 2 (f), the extension 35 does not necessarily have to be provided over the entire circumference of the metal mask opening 15, and a portion that is likely to be damaged is known in advance. In such a case, it may be provided continuously or intermittently only in that portion. Even in this case, it is not always necessary to protrude outward, it may protrude toward the inside, and may protrude toward both the outside and the inside.

The metal mask opening 15 shown in FIG. 3A has a rectangular basic shape, and has a plurality of continuous triangular extensions 35 that protrude toward the outside of the opening 15 over the entire circumference. Yes.

The metal mask opening 15 shown in FIG. 3 (b) has a plurality of intermittent triangular extensions 35 that protrude toward the outside of the opening 15 over the entire circumference of the metal mask opening 15 as a basic shape. Yes.

The metal mask opening 15 shown in FIG. 3C has a rectangular shape as a basic shape, and a plurality of intermittently extending triangular extensions 35 projecting toward the outside of the opening 15 over the entire circumference. have.

As shown in FIGS. 3A to 3C, the shape of the extension 35 is not limited to an arc shape, and the resonance frequency of the metal mask 10 can be shifted even if it is a triangle shape.

The metal mask opening 15 shown in FIG. 3 (d) has a plurality of intermittent square extensions 35 projecting toward the outside of the opening 15 over the entire circumference of the metal mask opening 15 having a rectangular basic shape. Yes.

The metal mask opening 15 shown in FIG. 3 (e) has a plurality of intermittent trapezoidal extensions 35 that protrude toward the outside of the opening 15 over the entire circumference of the metal mask opening 15 having a rectangular basic shape. Yes.

The metal mask opening 15 shown in FIG. 3 (f) has a plurality of intermittent pentagonal extensions 35 projecting toward the outside of the opening 15 over the entire circumference of the metal mask opening 15 as a basic shape. Yes.

The metal mask opening 15 shown in FIG. 3 (g) has a plurality of intermittent cross-shaped extensions 35 projecting toward the outside of the opening 15 over the entire circumference while having a rectangular basic shape. Yes.

As shown in FIGS. 3D to 3G, the shape of the extension 35 is not limited to an arc shape or a triangle shape, and stress can be dispersed even in various polygonal shapes.

The metal mask opening 15 shown in FIG. 3 (h) has a rectangular shape as a basic shape, and a plurality of intermittent arcs and quadrangular shapes that protrude toward the outside of the opening 15 are combined over the entire circumference. It has a shape extension 35.

Thus, even if the shape is a combination of a plurality of shapes, the resonance frequency of the metal mask 10 can be shifted.

The metal mask opening 15 shown in FIG. 3 (i) has a rectangular basic shape, and a plurality of intermittent triangular and square extensions 35 projecting outward from the opening 15 over the entire circumference. have.

Thus, even when a plurality of shapes are included at the same time, the resonance frequency of the metal mask 10 can be shifted.

The metal mask opening 15 shown in FIG. 4 (a) has a rectangular shape as a basic shape, and has an extension 35 of a sine curve on the upper and lower sides thereof.

The metal mask opening 15 shown in FIG. 4 (b) has a rectangular shape as a basic shape, and has an extension 35 in which sine curves having different periods are combined only on the upper side thereof.

As shown in FIGS. 4A and 4B, the stress can be dispersed by providing a wave shape such as a sine curve only at a desired position.

The metal mask opening 15 shown in FIG. 4 (c) has a so-called fractal extension 35 having a basic shape of a rectangle and a triangular shape as a unit shape only on the upper side.

It is also possible to shift the resonance frequency of the metal mask 10 by such a fractal extension 35.

The shape of the extension 35 shown in FIGS. 2 to 4 is merely an example, and other shapes may be used as long as they can disperse the stress, or may be formed by appropriately combining them. Is possible.

In the vapor deposition mask 100 according to the embodiment of the present disclosure, it is not necessary to form the extension 35 in all the metal mask openings 15 in the metal mask 10, and the position where stress is concentrated can be specified. The extension 35 may be formed only in the metal mask opening 15 existing in that portion. Specifically, the extension 35 may be formed only in the metal mask opening 15 located at the center of the metal mask 10, and conversely, that is, only the metal mask opening 15 located near the outer edge of the metal mask 10. The extension 35 may be formed in

The material of the metal mask 10 is not particularly limited, and any conventionally known material can be appropriately selected and used in the field of the vapor deposition mask. Examples thereof include metal materials such as stainless steel, iron-nickel alloy, and aluminum alloy. be able to. Among them, an invar material that is an iron-nickel alloy can be suitably used because it is less deformed by heat.

Although the thickness of the metal mask 10 is not particularly limited, it is preferably 100 μm or less, more preferably 50 μm or less, and more preferably 35 μm or less in order to more effectively prevent the occurrence of shadows. Particularly preferred. When the thickness is less than 5 μm, the risk of breakage and deformation increases and handling tends to be difficult.

The cross-sectional shape of the metal mask opening 15 formed in the metal mask 10 is not particularly limited, but may have a shape that expands toward the vapor deposition source as shown in FIG. preferable. More specifically, the bottom of the metal mask 10 is formed by a straight line connecting the lower bottom tip of the metal mask opening 15 of the metal mask 10 and the upper bottom tip of the metal mask opening 15 of the metal mask 10. The angle, in other words, the cross-section in the thickness direction of the inner wall surface constituting the metal mask opening 15 of the metal mask 10, the surface on the side in contact with the resin mask 20 of the metal mask 10 and the metal mask 10 (illustrated) In an embodiment, the angle formed with the upper surface of the metal mask is preferably in the range of 5 ° to 85 °, more preferably in the range of 15 ° to 80 °, and in the range of 25 ° to 65 °. More preferably, it is within. In particular, within this range, an angle smaller than the vapor deposition angle of the vapor deposition machine to be used is preferable.

The method for laminating the metal mask 10 on the resin mask is not particularly limited, and the resin mask 20 and the metal mask 10 may be bonded together using various adhesives, or a resin mask having self-adhesiveness may be used. . Resin mask 20 and metal mask 10 may have the same size or different sizes. If the resin mask 20 is made smaller than the metal mask 10 and the outer peripheral portion of the metal mask 10 is exposed in consideration of the optional fixing to the frame thereafter, the metal mask 10 It is preferable because it can be easily fixed to the frame.

(Vapor deposition method using vapor deposition mask)
The vapor deposition method used for forming the vapor deposition pattern using the vapor deposition mask of the present disclosure is not particularly limited. For example, a physical vapor phase such as reactive sputtering, vacuum vapor deposition, ion plating, and electron beam vapor deposition. Examples thereof include a growth method (Physical Vapor Deposition), a chemical vapor deposition method such as thermal CVD, plasma CVD, and photo-CVD method. The vapor deposition pattern can be formed using a conventionally known vacuum vapor deposition apparatus or the like.

(Another embodiment of the evaporation mask)
In the vapor deposition mask 100 according to the embodiment of the present disclosure described above, the metal mask opening 15 of the metal mask 10 constituting the vapor deposition mask 100 has a rectangular basic shape, but is not limited thereto. If a polygon other than a rectangle, such as a triangle, pentagon, hexagon,..., Is a basic shape and an extension that extends the entire circumference of the polygon is added, the above action There is an effect.

FIG. 5 is a front view showing an example of the shape of the metal mask opening when the vapor deposition mask according to another embodiment of the present disclosure is viewed in plan from the metal mask side.

FIG. 5A shows the shape of the metal mask opening 15 when the extension 35 is not provided. Thus, the metal mask opening 15 in the vapor deposition mask 100 according to the embodiment of the present disclosure may have a triangular shape as a basic shape.

The metal mask opening 15 shown in FIG. 5 (b) has a plurality of continuous arc-shaped extensions 35 that protrude toward the outside of the opening 15 over the entire circumference of the triangle while having a triangular shape as a basic shape. Yes.

The metal mask opening 15 shown in FIG. 5C has a triangular shape as a basic shape, and has arc-shaped extensions 35 protruding toward the outside of the opening 15 only at the three apexes thereof.

The metal mask opening 15 shown in FIG. 5D has a triangular shape as a basic shape, and has a plurality of continuous arc-shaped extensions 35 protruding toward both the outside and the inside of the opening over the entire circumference. Have.

The metal mask opening 15 shown in FIG. 5 (e) has a plurality of continuous triangular extensions 35 that protrude toward the outside of the opening 15 over the entire circumference of the metal mask opening 15 as a basic shape. Yes.

The metal mask opening 15 shown in FIG. 5 (f) has a plurality of intermittent square extensions 35 that protrude toward the outside of the opening over the entire circumference of the metal mask opening 15 having a triangular shape. .

The metal mask opening 15 shown in FIG. 5 (g) has a shape that combines the above-described FIG. 5 (c) and FIG. 5 (f). Specifically, while having a triangular shape as a basic shape, the three apexes have an arc-shaped extension 35 protruding toward the outside of the opening 15, and the three sides are directed toward the outside of the opening. A plurality of intermittently extending square-shaped extensions 35 are provided.

FIG. 6 is a front view illustrating an example of the shape of the metal mask opening when the vapor deposition mask according to still another embodiment of the present disclosure is viewed in plan from the metal mask side.

FIG. 6A shows the shape of the metal mask opening 15 when the extension 35 is not provided. Thus, the metal mask opening 15 in the vapor deposition mask 100 according to the embodiment of the present disclosure may have a pentagon as a basic shape.

The metal mask opening 15 shown in FIG. 6B has a pentagonal basic shape, and has a plurality of continuous arc-shaped extensions 35 protruding outward from the opening 15 over the entire circumference. Yes.

The metal mask opening 15 shown in FIG. 6C has a pentagonal shape, and has an arc-shaped extension 35 protruding toward the outside of the opening 15 only at its five apexes.

The metal mask opening 15 shown in FIG. 6D has a pentagonal shape as a basic shape, and has a plurality of continuous arc-shaped extensions 35 protruding toward both the outside and the inside of the opening over the entire circumference. Have.

The metal mask opening 15 shown in FIG. 6E has a pentagonal basic shape, and has a plurality of continuous triangular extensions 35 protruding outward from the opening 15 over the entire circumference. Yes.

The metal mask opening 15 shown in FIG. 6 (f) has a plurality of intermittent square extensions 35 projecting toward the outside of the opening over the entire circumference of the pentagonal shape. .

The metal mask opening 15 shown in FIG. 6 (g) has a shape obtained by combining FIG. 6 (c) and FIG. 6 (f). Specifically, while having a pentagonal shape as a basic shape, the five apexes have arc-shaped extensions 35 protruding toward the outside of the opening 15, and five sides are directed toward the outside of the opening. A plurality of intermittently extending square-shaped extensions 35 are provided.

FIG. 7 is a front view showing an example of the shape of the metal mask opening when the vapor deposition mask according to still another embodiment of the present disclosure is viewed in plan from the metal mask side.

FIG. 7A shows the shape of the metal mask opening 15 when the extension 35 is not provided. Thus, the metal mask opening 15 in the vapor deposition mask 100 according to the embodiment of the present disclosure may have a hexagonal basic shape.

The metal mask opening 15 shown in FIG. 7 (b) has a plurality of continuous arc-shaped extensions 35 projecting toward the outside of the opening 15 over the entire circumference of the hexagonal shape. ing.

The metal mask opening 15 shown in FIG. 7C has a hexagonal shape, and has arc-shaped extensions 35 that protrude toward the outside of the opening 15 only at the five apexes. .

The metal mask opening 15 shown in FIG. 7D has a hexagonal shape as a basic shape, and a plurality of continuous arc-shaped extensions 35 projecting toward both the outside and the inside of the opening over the entire circumference. have.

The metal mask opening 15 shown in FIG. 7 (e) has a plurality of continuous triangular extensions 35 projecting toward the outside of the opening 15 over the entire circumference of the hexagonal base shape. ing.

The metal mask opening 15 shown in FIG. 7 (f) has a plurality of intermittent square extensions 35 projecting toward the outside of the opening over the entire circumference of the hexagonal base shape. Yes.

The metal mask opening 15 shown in FIG. 7 (g) has a shape that is a combination of FIG. 7 (c) and FIG. 7 (f). Specifically, while having a hexagonal shape as a basic shape, the six apexes have arc-shaped extensions 35 that protrude toward the outside of the opening 15, and the six sides face the outside of the opening. And a plurality of intermittently extending square-shaped extensions 35.

As mentioned above, although the basic shape of the metal mask opening 15 in the vapor deposition mask 100 according to the embodiment of the present disclosure has been described as an example of a rectangle, a triangle, a pentagon, and a hexagon, the present invention is not limited thereto. However, it may be a polygon, and is not necessarily a regular polygon.

<< Vapor deposition mask with rigidity adjustment part on metal mask >>
In the vapor deposition mask according to the embodiment of the present disclosure described above, the rigidity of the metal mask is partially reduced so that the metal mask constituting the vapor deposition mask does not overlap the resin mask opening of the resin mask. One or a plurality of rigidity adjusting portions may be provided.

Providing a rigidity adjusting part that reduces the rigidity of the metal mask in a predetermined part of the metal mask improves the followability of the metal mask against the deformation of the resin mask, and as a result, reduces the probability of the resin mask being damaged. Can do.

Such a rigidity adjusting portion in the vapor deposition mask having the rigidity adjusting portion in the metal mask according to the embodiment of the present disclosure will be described below with reference to the drawings. In addition, in the following drawings, the extension part provided in the metal mask opening part demonstrated above is abbreviate | omitted.

(Rigidity adjustment part)
As shown in FIGS. 8 to 19, the metal mask 10 in the vapor deposition mask 100 according to the embodiment of the present disclosure partially has the rigidity of the metal mask 10 at a position not overlapping the resin mask opening 25 of the resin mask 20. One or a plurality of rigidity adjusting portions 36 to be lowered are provided. Specifically, one or a plurality of rigidity adjusting portions 36 for partially reducing the rigidity of the metal mask 10 are located in the arrangement region 30 shown in FIGS. 8 to 10 and 16 to 19. Yes.

Note that the rigidity of the metal mask referred to in the specification of the present application means that when a certain load is applied to the vapor deposition mask, the metal mask is easily deformed (displacement or displacement amount) in an area where the load is applied. In other words, as the rigidity decreases, in other words, as the displacement increases, the rigidity of the metal mask decreases. The rigidity of the metal mask can be calculated by the following formula (1). Specifically, the rigidity of the metal mask is measured by applying a vertical load (F) to a predetermined area of the deposition mask 100 and measuring the displacement (δ) of the metal mask in the area where the vertical load (F) is applied. (K) can be calculated. The displacement amount (δ) of the metal mask can be measured using, for example, a laser displacement meter. In addition, as a method of applying a vertical load, for example, a method of placing a weight having a predetermined mass on a predetermined region, a device for applying a load, or the like can be used.
k = F / δ (1)

In the vapor deposition mask 100 of the present disclosure, by positioning the rigidity adjusting unit 36 in the arrangement region 30, the rigidity of the metal mask 10 in the arrangement region 30 is made lower than the rigidity of the region where the rigidity adjusting unit 36 is not arranged. be able to. That is, by using the metal mask 10 having the rigidity adjusting portion 36, flexibility can be imparted to the metal mask. According to the vapor deposition mask 100 of the present disclosure, the followability of the metal mask 10 to the resin mask 20 can be improved by the flexibility imparted to the metal mask 10, and as a result, the probability that the resin mask 20 is damaged is increased. Can be reduced.

The method for partially reducing the rigidity of the metal mask 10 by the rigidity adjusting unit 36 is not particularly limited, and can be realized by various methods as exemplified below. Further, the rigidity of the metal mask can be partially reduced by other methods.

(I) For example, one or a plurality of rigidity adjusting portions penetrating the metal mask 10 in a predetermined region of the metal mask that does not overlap with the resin mask opening 25 in the thickness direction, that is, in a region where a reduction in rigidity is desired. By providing the through hole 40 as 36, the rigidity of the metal mask 10 in the peripheral region including the through hole 40 can be reduced (see FIGS. 11B, 11C, and 15B).

Here, the through-hole 40 means a hole that penetrates only the metal mask 10. The method for forming the through hole 40 is not particularly limited, and etching, cutting, or the like can be selected as appropriate.

(Ii) One or a plurality of stiffness adjusting portions that do not penetrate through the metal mask 10 in a predetermined region of the metal mask that does not overlap with the resin mask opening 25 in the thickness direction, that is, in a region where a reduction in stiffness is desired. By providing the concave portion 45 as 36, the rigidity of the metal mask 10 in the peripheral region including the concave portion 45 can be reduced (see FIGS. 11 and 15).

The method for forming the recess 45 is not particularly limited, and etching, cutting, or the like can be selected as appropriate. The depth of the recess 45 is not particularly limited, and can be appropriately set in consideration of the thickness of the metal mask 10 and the degree of reduction in rigidity. As an example, it exists in the range of 1 micrometer or more and 100 micrometers or less.

Hereinafter, unless otherwise specified, the term “rigidity adjusting portion 36” includes the through hole 40 and the concave portion 45 as the rigidity adjusting portion 36.

There is no particular limitation on the shape of the through hole 40 or the recess 45 as the rigidity adjusting portion 36. For example, the shape when the vapor deposition mask 100 is viewed in plan from the metal mask 10 side is triangular, rectangular, rhombus, trapezoid, pentagon. In addition, a polygonal shape such as a hexagon, a circular shape, an elliptical shape, or a shape in which a corner of the polygonal shape has a curvature can be given. Moreover, it can also be set as the shape which combined these.

20 and 21 are diagrams showing an example when the assembly of the “rigidity adjusting portion” is viewed in plan from the metal mask 10 side. 20 and 21, the closed region may be the rigidity adjusting portion 36, and the closed region may be a non-through hole or a non-recessed portion. Further, as shown in FIG. 21, when there are a plurality of rigidity adjusting sections 36, the respective sizes do not necessarily have to be the same, and the rigidity adjusting sections 36 of different sizes may be mixed. Moreover, as shown in FIG. 21, it may be a so-called gradation as a whole.

There are no particular limitations on the size of the through hole 40 or the recess 45 as the rigidity adjusting portion 36, and it may be appropriately set according to the location where the rigidity adjusting portion 36 is located. For example, the area of the opening area of the rigidity adjusting unit 36 when viewed from the metal mask side may be larger, smaller, or the same as the area of the opening area of the metal mask opening 15. Good. In consideration of the ease of adjusting the rigidity of the metal mask 10, it is preferable that the area of the opening area of one rigidity adjusting portion 36 is smaller than the area of the opening area of the metal mask opening 15. As an example, the area of the opening area of one rigidity adjusting portion 36, in other words, the area of the opening area of one through hole 40 or one recess 45 is in the range of 1 μm ² or more and 1 × 10 ¹² μm ² or less. It is.

There is no particular limitation on the opening width of the through hole 40 or the recess 45 as the rigidity adjusting unit 36, for example, each of the rigidity adjusting unit 36 in the vapor deposition mask longitudinal direction and the width direction when viewed from the metal mask side. The opening width may be larger, smaller, or the same width as the respective opening widths of the metal mask opening 15 in the vapor deposition mask longitudinal direction and the width direction. The opening width of the rigidity adjusting portion 36 may be set as appropriate according to the location where the through hole 40 is located. For example, the metal mask 10 has a plurality of metal mask openings 15 and the length of the vapor deposition mask is long. When the rigidity adjusting unit 36 is positioned between the metal mask openings 15 adjacent to each other in the direction, the opening width in the longitudinal direction when the rigidity adjusting unit 36 is viewed in plan from the metal mask 10 side is the adjacent metal mask opening. What is necessary is just to make it smaller than the space | interval of 15 longitudinal directions. The same applies to the case where the rigidity adjusting portion 36 is positioned between the metal mask openings 15 adjacent in the width direction of the vapor deposition mask.

In addition, the total area of the through holes 40 as the rigidity adjusting portion 36 and the opening area of the recess 45 when the vapor deposition mask 100 of the present disclosure is viewed from the metal mask 10 side does not have the rigidity adjusting portion 36. It is preferably 3% or more when the area of the effective area of the metal mask is 100% when the metal mask assumed to be, that is, the metal mask having only the metal mask opening 15 is viewed from the metal mask side, It is more preferably 10% or more, and particularly preferably 30% or more. The area of the effective area of the metal mask referred to here means the surface area of the portion where the metal portion exists when the vapor deposition mask is viewed in plan from the metal mask 10 side. By setting the ratio of the area of the through hole 40 as the rigidity adjusting portion 36 and the opening area of the concave portion 45 within the above preferable range, the metal mask 10 has sufficient rigidity while being flexible to the metal mask 10. Therefore, the adhesion between the resin mask 20 of the vapor deposition mask 100 and the vapor deposition object can be further improved. Although there is no particular limitation on the upper limit of the total area of the opening regions of the rigidity adjusting portion 36, considering the rigidity of the metal mask, it is preferably 95% or less, more preferably 90% or less, and 70%. It is particularly preferred that

There is no particular limitation on the position and pitch of the rigidity adjusting part 36 described above, that is, the through hole 40 and the concave part 45 as the rigidity adjusting part, and they may be arranged with regularity and randomly arranged. May be. Moreover, as an example of the pitch between the adjacent rigidity adjusting portions 36, a range of 1 μm or more and 2 × 10 ⁶ μm or less can be exemplified.

Further, when a plurality of rigidity adjusting portions 36 are provided in the metal mask 10, the areas of the opening regions of the respective rigidity adjusting portions 36 may be the same or different. The same applies to the pitch. Further, the through hole 40 as the rigidity adjusting portion 36 and the concave portion 45 can be used in combination.

(Rigidity adjustment area)
There is no particular limitation on the arrangement area in which the rigidity adjusting unit 36 is arranged, and a position where the rigidity of the metal mask 10 is desired to be reduced, that is, a position where the resin mask 20 is likely to be destroyed, for example, a metal mask opening. What is necessary is just to arrange | position suitably in the periphery of 15. As shown in FIGS. 8 to 10 and FIGS. 16 to 19, the metal mask 10 of the preferred embodiment has an arrangement region 30 around the metal mask opening 15, and one or more of the arrangement regions 30 are arranged in the arrangement region 30. A rigidity adjusting unit 36 is disposed. According to the vapor deposition mask 100 of the present disclosure including the metal mask 10 in a preferable form, it is possible to reduce the probability that the resin mask is damaged.

8 and 9, the metal mask 10 has a plurality of metal mask openings 15, and the arrangement region 30 is located so as to surround the metal mask openings 15. In the form shown in FIG. 2, the arrangement region 30 is positioned so as to surround the metal mask opening 15 and the outer edge of the metal mask opening 15 and the outer edge of the arrangement region 30 overlap. Further, in the form shown in FIG. 9, the arrangement region surrounds at least one metal mask opening 15 of the plurality of metal mask openings 15 and the outer edge of the metal mask opening 15 and the outer edge of the arrangement region 30 overlap each other. 30 is located. In the embodiment shown in FIG. 10, the metal mask opening 15 is surrounded and the outer edge of the metal mask opening 15 and the outer edge of the arrangement region 30 do not overlap, in other words, the outer edge of the metal mask opening 15. The arrangement | positioning area | region 30 is located at predetermined intervals.

11 and 15 are enlarged front views (an enlarged front view showing an example of a region indicated by a symbol X in FIG. 1B) showing an example of the arrangement of the stiffness adjusting unit 36 arranged in the arrangement region 30. FIG. 12 is an example of the AA schematic cross-sectional view of FIG. 11A, and FIGS. 13A and 13B are examples of the AA schematic cross-sectional view of FIG. FIGS. 14A and 14B are examples of the AA schematic cross-sectional view of FIG. 11C. In the form shown in FIG. 11A, the outer edge of the metal mask opening 15 and the outer edge of the rigidity adjusting part 36 overlap so that one metal mask opening 15 is used as one continuous rigidity adjusting part 36. Is surrounded by a recess 45. Further, in the form shown in FIG. 11B, one metal mask opening 15 is connected to a plurality of rigidity adjusting parts 36 so that the outer edge of the metal mask opening 15 and the outer edge of the rigidity adjusting part 36 do not overlap. Surrounded by an aggregate. The rigidity adjusting portion 36 in the form shown in FIG. 11B may be either the through hole 40 or the recessed portion 45. Further, in the embodiment shown in FIG. 11C, one metal mask opening 15 is connected to one continuous rigidity adjusting portion so that the outer edge of the metal mask opening 15 and the outer edge of the rigidity adjusting portion 36 do not overlap. Surrounded by 36. The rigidity adjusting portion 36 shown in FIG. 11C may be one continuous through hole 40 or one continuous recess 45. Moreover, it is good also as a structure which combined these forms.

Further, the rigidity adjusting section 36 shown in each drawing can be divided into a plurality of rigidity adjusting sections 36. FIG. 15A shows a form in which one rigidity adjusting section 36 shown in FIG. 11A is divided into a plurality of rigidity adjusting sections 36, and FIG. 15B is shown in FIG. This is a configuration in which one rigidity adjusting portion 36 shown is divided into a plurality of rigidity adjusting portions 36. Moreover, the form shown in each figure can also be combined suitably.

In the vapor deposition mask 100 shown in FIGS. 16A, 16B, 17A, and 17B, the metal mask 10 has a plurality of metal mask openings 15, and the plurality of metal mask openings. The arrangement region 30 is located so as to surround the portion 15 together. In the form shown in FIG. 16, the outer edge of the metal mask opening 15 and the outer edge of the arrangement region 30 overlap each other. In the form shown in FIG. 17, a predetermined interval is provided from the outer edge of the metal mask opening 15. The outer edge of the arrangement region 30 is located. In the form shown in FIGS. 16 and 17, the plurality of rigidity adjusting portions 36 are arranged in the arrangement area 30. However, in the form shown in FIG. 16, the entire arrangement area 30 may be the recess 45. In the form shown in FIG. 17, the entire arrangement region 30 may be the through hole 40 or the recess 45.

18, the metal mask 10 has a plurality of metal mask openings 15, and the arrangement region 30 is located in at least a part between the adjacent metal mask openings 15. In the form shown in FIG. 18, the plurality of rigidity adjusting portions 36 are arranged in the arrangement area 30. However, in the form shown in FIG. 18, the entire arrangement area 30 may be the through hole 40 or the recess 45.

In the vapor deposition mask 100 of the form shown in FIGS. 19A and 19B, the metal mask 10 has only one metal mask opening 15, and is disposed so as to surround the one metal mask opening 15. 30 is located. In the form shown in FIG. 19A, the outer edge of the metal mask opening 15 and the outer edge of the arrangement region 30 overlap each other. In the form shown in FIG. The outer edge of the arrangement | positioning area | region 30 is located at intervals. Normally, the frame and the vapor deposition mask are fixed on the outer periphery of the vapor deposition mask. Therefore, considering this point, it is preferable that the outer edge of the metal mask 10 does not overlap the outer edge of the arrangement region 30. That is, it is preferable that the recess 45 is not located in a portion overlapping with the outer edge of the metal mask. In the form shown in FIG. 19, the plurality of rigidity adjusting portions 36 are arranged in the arrangement area 30. However, in the form shown in FIG. 19A, the entire arrangement area 30 may be the recess 45, and FIG. In the embodiment shown in FIG. 4, the entire arrangement region 30 may be the through hole 40 or the recess 45. In other words, the entire arrangement region is used as the rigidity adjusting portion 36, that is, one metal mask opening 15 may be surrounded by one continuous through hole 40 or recess 45 (FIGS. 11A and 11B). c)). Further, instead of the illustrated form, the rigidity adjusting unit 36 may be disposed only in a part of the arrangement region 30, for example, in the vicinity of the corner of the metal mask (not shown).

<< Vapor deposition mask preparation >>
Next, the vapor deposition mask preparation will be described. The vapor deposition mask preparation is a so-called semi-finished product prepared for manufacturing the vapor deposition mask 100 described above. Specifically, the resin mask 20 having a plurality of resin mask openings 25 corresponding to the pattern to be deposited and the metal mask 10 having the metal mask openings 15 are the resin mask openings 25 and the metal mask openings. A vapor deposition mask preparation for manufacturing a vapor deposition mask 100 that is laminated so that the portion 15 overlaps, the metal mask 10 and a resin plate provided on one surface of the metal mask. The shape of the metal mask opening 15 when the metal mask 10 is viewed in plan is configured to be a polygon, and the extension 35 extends the entire circumference of the polygon. It becomes the shape which added. By using such a vapor deposition mask preparation, for example, by forming a resin mask opening of a desired shape on a resin plate by a laser through the metal mask opening from the metal mask side of the vapor deposition mask preparation, It becomes possible to manufacture a high-density and high-definition deposition mask with high accuracy.

In addition, even if it exists in said vapor deposition mask preparation body, the rigidity adjustment part 36 demonstrated above may be provided in the metal mask 10 which comprises this.

<< Method for Manufacturing Deposition Mask >>
The manufacturing method of the vapor deposition mask 100 concerning embodiment of this indication demonstrated above is not specifically limited, A various method is employable suitably. For example, the metal mask 10 and the resin mask 20 may be manufactured separately, and then the two masks may be bonded using an adhesive or the like to form the vapor deposition mask 100. On the other hand, a laminated body in which a metal plate and a resin plate are laminated is prepared, and a metal mask opening 15 is formed in the metal plate constituting the laminated body to form the metal mask 10, thereby producing the above-described vapor deposition mask preparation. Then, the vapor deposition mask 100 may be obtained by forming the resin mask opening 25 in the resin plate constituting the vapor deposition mask preparation to form the resin mask 20.

The method for manufacturing the metal mask 10, in other words, the method for forming the metal mask opening 15, the extension 35, and the stiffness adjuster 36 is not particularly limited. The metal mask 10 may be manufactured by depositing a metal in a desired region by various PVD methods such as an ion plating method, a CVD method, or a plating method. On the other hand, the metal mask 10 having a desired opening region or recess may be manufactured by performing etching processing, excavation processing, laser processing or the like on the metal plate.

Further, the method for manufacturing the resin mask 20, in other words, the method for forming the resin mask opening 25 is not particularly limited, and the etching process, the excavation process, and the laser process for the resin plate are not limited. For example, the resin mask 20 having a desired opening region may be manufactured.

<< Method for Manufacturing Organic Semiconductor Element >>
Next, a method for manufacturing an organic semiconductor element according to an embodiment of the present disclosure (hereinafter referred to as an organic semiconductor element manufacturing method of the present disclosure) will be described. The method for producing an organic semiconductor element of the present disclosure includes a step of forming a vapor deposition pattern on a vapor deposition object using a vapor deposition mask, and the vapor deposition mask of the present disclosure described above is used in the step of forming the vapor deposition pattern. It is characterized by.

There is no particular limitation on the process of forming a vapor deposition pattern by a vapor deposition method using a vapor deposition mask, and it includes an electrode formation process for forming electrodes on a substrate, an organic layer formation process, a counter electrode formation process, a sealing layer formation process, and the like. In each optional step, a vapor deposition pattern is formed using the vapor deposition pattern forming method of the present disclosure described above. For example, when the deposition pattern forming method of the present disclosure described above is applied to each of the R (red), G (green), and B (blue) light emitting layer forming steps of the organic EL device, The vapor deposition pattern of each color light emitting layer is formed. In addition, the manufacturing method of the organic-semiconductor element of this indication is not limited to these processes, It is applicable to the arbitrary processes in manufacture of a conventionally well-known organic-semiconductor element.

According to the method for manufacturing an organic semiconductor element of the present disclosure described above, it is possible to perform vapor deposition for forming an organic semiconductor element in a state where the vapor deposition mask and the vapor deposition object are closely adhered to each other, and a high-definition organic semiconductor An element can be manufactured. As an organic semiconductor element manufactured with the manufacturing method of the organic semiconductor element of this indication, the organic layer, light emitting layer, cathode electrode, etc. of an organic EL element can be mentioned, for example. In particular, the method for manufacturing an organic semiconductor element of the present disclosure is preferably used for manufacturing R (red), G (green), and B (blue) light emitting layers of organic EL elements that require high-definition pattern accuracy. it can.

<< Organic EL Display Manufacturing Method >>
Next, a method for manufacturing an organic EL display (organic electroluminescence display) according to an embodiment of the present disclosure (hereinafter referred to as a method for manufacturing an organic EL display of the present disclosure) will be described. The manufacturing method of the organic EL display of the present disclosure uses the organic semiconductor element manufactured by the manufacturing method of the organic semiconductor element of the present disclosure described above in the manufacturing process of the organic EL display.

Examples of the organic EL display using the organic semiconductor element manufactured by the organic semiconductor element manufacturing method of the present disclosure include a notebook personal computer (see FIG. 22A) and a tablet terminal (see FIG. 22B). Mobile phones (see FIG. 22C), smartphones (see FIG. 22D), video cameras (see FIG. 22E), digital cameras (see FIG. 22F), smart watches (see FIG. 22). Examples thereof include organic EL displays used in g).

DESCRIPTION OF SYMBOLS 10 ... Metal mask 15 ... Metal mask opening part 20 ... Resin mask 25 ... Resin mask opening part 35 ... Extension part 36 ... Stiffness adjustment part 40 ... Through-hole 45 ... Concave part 100 ... Deposition mask

Claims

A resin mask having a plurality of resin mask openings corresponding to a pattern to be deposited and a metal mask having a metal mask opening are stacked such that the resin mask openings and the metal mask openings overlap. An evaporation mask comprising:
The shape of the metal mask opening when the metal mask is viewed in plan is a vapor deposition mask having a polygon as a basic shape and an extension that extends the entire circumference of the polygon.
The metal mask has one or a plurality of stiffness adjusting portions that partially reduce the stiffness of the metal mask at a position that does not overlap the resin mask opening of the resin mask. The vapor deposition mask of description.
The vapor deposition mask according to claim 2, wherein the rigidity adjusting portion is a through-hole penetrating the metal mask or a recess provided in the metal mask.
A method for producing an organic semiconductor element, comprising:
Including a vapor deposition pattern forming step of forming a vapor deposition pattern on a vapor deposition object using a vapor deposition mask;
The method for producing an organic semiconductor element, wherein the vapor deposition mask used in the vapor deposition pattern forming step is the vapor deposition mask according to any one of claims 1 to 3.
An organic EL display manufacturing method comprising:
The manufacturing method of an organic electroluminescent display in which the organic-semiconductor element manufactured by the manufacturing method of the organic-semiconductor element of Claim 4 is used.