KR20190021231A - Deposition mask, method of manufacturing organic semiconductor device and method of manufacturing organic EL display - Google Patents

Abstract

1. A deposition mask comprising a resin mask having a plurality of resin mask openings corresponding to a pattern to be formed by vapor deposition, and a metal mask having a metal mask opening, wherein the resin mask opening and the metal mask opening overlap each other, The shape of the opening portion of the metal mask when viewed in plan is a shape obtained by adding an extension extending the entire circumference of the polygon while making the polygon a basic shape.

Description

Deposition mask, method of manufacturing organic semiconductor device and method of manufacturing organic EL display

Embodiments of the present disclosure relate to a deposition mask, a method of manufacturing an organic semiconductor device, and an organic EL display.

Formation of a vapor deposition pattern using a vapor deposition mask is generally performed by adhering a vapor deposition mask with an evaporation mask provided with an opening corresponding to a pattern to be vapor deposited and adhering an evaporation material discharged from the evaporation source to an evaporation object through an opening .

As a deposition mask used for forming the deposition pattern, for example, a resin mask having a resin mask opening corresponding to a pattern to be formed by vapor deposition, and a metal mask having a metal mask opening (also referred to as a slit) (For example, Patent Document 1) and the like are known.

Japanese Patent No. 5288072

It is an object of the present invention to provide a deposition mask capable of forming a highly accurate deposition pattern in a deposition mask in which a resin mask and a metal mask are laminated, And a method of manufacturing an organic EL display.

A deposition mask according to an embodiment of the present disclosure is characterized by comprising a resin mask having a plurality of resin mask openings corresponding to a pattern to be deposited and formed, and a metal mask having a metal mask opening portion overlapping the resin mask opening portion and the metal mask opening portion The shape of the opening of the metal mask when the metal mask is viewed in a plane is a shape obtained by adding an extension extending the entire circumference of the polygon while the polygon is a basic shape.

In the deposition mask according to the embodiment of the present disclosure, the metal mask may be provided at a position where it does not overlap the resin mask opening of the resin mask, and one or a plurality of stiffness adjusting sections .

Further, in the deposition mask according to the embodiment of the present disclosure, the rigidity adjusting portion may be recessed provided in a through hole penetrating the metal mask or in a metal mask.

The method for manufacturing an organic semiconductor device according to another embodiment of the present disclosure includes a deposition pattern formation step of forming a deposition pattern on an object to be deposited by using a deposition mask, The mask is a deposition mask according to one embodiment of the present disclosure.

Further, in the method of manufacturing an organic EL display according to another embodiment of the present disclosure, an organic semiconductor element manufactured according to a method of manufacturing an organic semiconductor element according to an embodiment of the present disclosure is used.

According to the deposition mask of the present disclosure, a highly accurate vapor deposition pattern can be formed. Further, according to the manufacturing method of an organic semiconductor element of the present disclosure, an organic semiconductor element can be manufactured with high accuracy. Further, according to the manufacturing method of the organic EL display of the present disclosure, the organic EL display can be manufactured with high accuracy.

Fig. 1 (a) is a schematic cross-sectional view showing an example of a deposition mask according to an embodiment of the present disclosure, and Fig. 1 (b) is a schematic view of a deposition mask according to an embodiment of the present disclosure, Fig.
2 is a front view showing an example of a shape of a metal mask opening when the deposition mask according to the embodiment of the present disclosure is viewed from the metal mask side in a plan view.
3 is a front view showing an example of the shape of a metal mask opening when the deposition mask according to the embodiment of the present disclosure is viewed from the metal mask side in a plan view.
4 is a front view showing an example of the shape of a metal mask opening portion when the deposition mask according to the embodiment of the present disclosure is viewed from the metal mask side in a plan view.
5 is a front view showing an example of a shape of a metal mask opening portion when the deposition mask according to another embodiment of the present disclosure is viewed from the metal mask side in a plan view.
6 is a front view showing an example of a shape of a metal mask opening portion when the deposition mask according to still another embodiment of the present disclosure is viewed from the metal mask side in a plan view.
7 is a front view showing an example of the shape of a metal mask opening portion when the deposition mask according to still another embodiment of the present disclosure is viewed from the metal mask side in a plan view.
8 is a front view showing an example of a case where the deposition mask according to the embodiment of the present disclosure is viewed from the metal mask side in a plan view.
Fig. 9 is a front view showing an example when the deposition mask according to the embodiment of the present disclosure is viewed from a metal mask side in a plan view. Fig.
10 is a front view showing an example when the deposition mask according to the embodiment of the present disclosure is viewed from a metal mask side in a plan view.
Fig. 11 is an enlarged front view showing an example of an area denoted by reference character X in Fig. 1 (b).
Fig. 12 is an example of a AA schematic sectional view of Fig. 11 (a).
Fig. 13 is an example of a AA schematic sectional view of Fig. 11 (b).
Fig. 14 is an example of a AA schematic sectional view of Fig. 11 (c).
Fig. 15 is an enlarged front view showing an example of an area denoted by reference character X in Fig. 1 (b).
16 is a front view showing an example of a case where the deposition mask according to the embodiment of the present disclosure is viewed from a metal mask side in a plan view.
17 is a front view showing an example of a case where the deposition mask according to the embodiment of the present disclosure is viewed from the metal mask side in plan view.
18 is a front view showing an example when the deposition mask according to the embodiment of the present disclosure is viewed from the metal mask side in plan view.
19 is a front view showing an example when the deposition mask according to the embodiment of the present disclosure is viewed from the metal mask side in a plan view.
20 is a view showing an example of the stiffness adjusting section.
21 is a view showing an example of a stiffness adjusting section.
22 is a diagram showing an example of a device in which an organic EL display is used.

DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, embodiments of the present invention will be described with reference to the drawings. Further, the present invention can be carried out in many other aspects, and is not limited to the description of the embodiments described below. In the drawings, for the sake of clarity, the widths, thicknesses, shapes, and the like of the respective parts are schematically expressed in comparison with actual embodiments, but they are merely examples and do not limit the interpretation of the present invention. In the specification and drawings, elements similar to those described above with reference to drawings are denoted by the same reference numerals, and detailed descriptions can be appropriately omitted. For convenience of explanation, the phrase "upward" or "downward" is used, but the up and down direction may be reversed. The same applies to the left and right directions.

<< Evaporation Mask >>

As shown in Figs. 1 (a) and 1 (b), the deposition mask 100 according to the embodiment of the present disclosure (hereinafter sometimes referred to as the deposition mask of the present disclosure) The resin mask 20 having the plurality of resin mask openings 25 and the metal mask 10 having the metal mask openings 15 are formed by overlapping the resin mask openings 25 and the metal mask openings 15, As shown in Fig. 1 (a) is a schematic cross-sectional view showing one example of the deposition mask 100 of the present disclosure, and FIG. 1 (b) is a cross-sectional view of the deposition mask 100 of the present disclosure, In the embodiment shown in Fig. 1, the description of the extending portion 35, which will be described later, is omitted.

In the case of forming a vapor deposition pattern on the vapor deposition object by using the vapor deposition mask 100, the vapor deposition mask 100 is usually used repeatedly, and between use and use, cleaning using ultrasonic waves, It is being done. For example, when ultrasonic cleaning is performed, fine vibration is repeatedly applied to the deposition mask 100. When the metal mask 10 constituting the deposition mask 100 is resonated by this minute vibration, A part of the resin mask 20 located near the metal mask opening 15 of the metal mask 10 may be damaged. The inventors of the present application have found that the metal mask 10 has a metal mask opening 15 at a portion where the edge 15 'of the metal mask opening 15 is in contact with the resin mask 20 It is highly likely that breakage of the resin mask 20 due to resonance of the mask 10 occurs.

The deposition mask 100 according to the embodiment of the present disclosure is based on the above-described knowledge. As shown in Figs. 2 to 4, the metal mask 10 2 to 4) is a basic shape and an extended portion 35 that extends the entire circumference of the polygon is added to the shape of the metal mask opening 15 of the polygon have. According to the deposition mask 100 of this embodiment of the present disclosure, when the metal mask 10 is resonated, the entire periphery of the opening, that is, the corner where the resin mask 20 is likely to be broken, It is possible to disperse the stress applied to the portion by shifting the resonance frequency of the metal mask 10 by this extension, It is possible to reduce the probability of breakage. 2 to 4 are plan views showing an example of the shape of the metal mask opening 15 when the deposition mask 100 according to the embodiment of the present disclosure is viewed from the metal mask 10 side in a plan view.

Hereinafter, each configuration of the deposition mask 100 of the present disclosure will be described with an example.

&Lt; Resin mask &

As shown in FIG. 1 (b), the resin mask 20 is provided with a plurality of resin mask openings 25. Although the shape of the opening of the resin mask opening portion 25 is rectangular, the shape of the opening of the resin mask opening portion 25 is not particularly limited and may be any shape as long as it corresponds to the pattern to be formed by vapor deposition . For example, the opening shape of the resin mask opening portion 25 may be a diamond shape, a polygonal shape, or a shape having a curvature such as a circle or an ellipse. The opening shape of the rectangular or polygonal shape can be said to be the opening shape of the resin mask opening portion 25 in view of being able to take a large light emitting area as compared with an opening shape having a curvature such as a circle or an ellipse.

There is no limitation on the material of the resin mask 20, and for example, it is possible to form the resin mask opening 25 with a high precision by laser processing or the like, to have a small rate of dimensional change and moisture absorption rate in heat or with time, It is preferable to use a material. Examples of the material include polyimide resin, polyamide resin, polyamideimide resin, polyester resin, polyethylene resin, polyvinyl alcohol resin, polypropylene resin, polycarbonate resin, polystyrene resin, polyacrylonitrile resin, ethylene acetic acid Vinyl acetate copolymer resin, vinyl copolymer resin, ethylene-vinyl alcohol copolymer resin, ethylene-methacrylic acid copolymer resin, polyvinyl chloride resin, polyvinylidene chloride resin, cellophane, and ionomer resin. Among the materials exemplified above, a resin material having a thermal expansion coefficient of 16 ppm / 占 폚 or less is preferable, and a resin material having a moisture absorption rate of 1.0% or less is preferable, and a resin material having both of these conditions is particularly preferable. By using the resin mask 20 made of this resin material, the dimensional accuracy of the resin mask opening portion 25 can be improved, and the rate of dimensional change and moisture absorption rate in heat and time can be reduced.

Although the thickness of the resin mask 20 is not particularly limited, when the effect of suppressing the occurrence of the shadow is further improved, the thickness of the resin mask 20 is preferably 25 m or less, more preferably 10 m or less. When the thickness of the resin mask 20 is less than 3 mu m, defects such as pinholes are liable to occur, and the risk of deformation, etc. is increased. Particularly, by making the thickness of the resin mask 20 3 μm or more and less than 10 μm, and more preferably, 4 μm or more and 8 μm or less, it is possible to more effectively prevent the influence of the shadow when forming a high-precision pattern exceeding 400 ppi. The resin mask 20 and the metal mask 10 to be described later may be directly bonded to each other or may be bonded to each other through the pressure sensitive adhesive layer. It is preferable that the total thickness of the resin mask 20 and the pressure-sensitive adhesive layer is within the range of the preferable thickness. In addition, the shade is a phenomenon in which a part of the evaporation material emitted from the evaporation source collides with the opening of the metal mask of the metal mask or the inner wall surface of the resin mask opening of the resin mask and does not reach the evaporation object, And a non-deposited portion that becomes thicker is generated.

The cross-sectional shape of the resin mask opening 25 is not particularly limited, and the end faces of the resin mask openings 25 facing the resin mask may be substantially parallel to each other. However, as shown in Fig. 1 (a) The resin mask opening 25 preferably has a shape in which its cross-sectional shape widens toward the evaporation source. In other words, it is preferable to have a tapered surface that widens toward the metal mask 10 side. The taper angle can be appropriately set in consideration of the thickness of the resin mask 20 and the like, but it is also possible to connect the lower edge of the resin mask opening to the lower edge of the resin mask, The inner wall surface of the resin mask opening portion 25 and the inner wall surface of the resin mask opening portion 25 constitute the resin mask opening portion 25 of the resin mask 20, The angle formed by the surface (the upper surface of the resin mask in the illustrated embodiment) of the substrate 20 on the side not in contact with the metal mask 10 is preferably within a range of 5 degrees or more and 85 degrees or less, More preferably within the range of 25 DEG to 65 DEG. Particularly, within this range, it is preferable that the angle is smaller than the deposition angle of the evaporator to be used. In the illustrated embodiment, the end surface forming the resin mask opening portion 25 is straight, but the present invention is not limited thereto. The resin mask opening portion 25 may be curved in the outwardly convex shape, And the shape may be an air shape. Further, it may be formed in its inverse, that is, a curved shape of convex into the inside.

<Metal mask>

As shown in Fig. 1 (a), a metal mask 10 is laminated on one side of the resin mask 20. The metal mask 10 is made of metal, and as shown in Fig. 1 (b), a metal mask opening 15 extending in the longitudinal direction or the transverse direction is disposed. There are no particular limitations on the arrangement of the metal mask openings 15, and the metal mask openings 15 extending in the longitudinal direction and the transverse direction may be arranged in a plurality of rows in the longitudinal direction and in the lateral direction, The metal mask openings 15 may be arranged in a plurality of rows in the transverse direction and the metal mask openings extending in the transverse direction may be arranged in a plurality of columns in the longitudinal direction. Further, only one row may be arranged in the longitudinal direction or the lateral direction. The plurality of metal mask openings 15 may be randomly arranged. In addition, one metal mask opening 15 may be provided. The terms "longitudinal direction" and "lateral direction" in the present specification mean the vertical direction and the lateral direction of the drawing, and may be either the longitudinal direction of the deposition mask, the resin mask, or the width direction of the metal mask. For example, the longitudinal direction of the deposition mask, the resin mask, and the metal mask may be referred to as &quot; longitudinal direction &quot;, and the width direction may be referred to as &quot; longitudinal direction &quot;.

(Extension part)

As shown in Figs. 2 to 4, when the metal mask 10 is viewed in plan view, the shape of the metal mask opening 15 of the metal mask 10 is a rectangular shape of a polygonal shape, And an extension portion 35 extending the entire circumference of the rectangle. By providing such an extension 35, it is possible to shift the resonance frequency of the metal mask 10 in the absence of the extension 35, thereby reducing the probability of breakage of the resin mask 20 .

Hereinafter, various extension portions 35 will be described in detail with reference to Figs. 2 to 4. Fig.

2 (a) shows the shape of the metal mask opening 15 in the case where the extension portion 35 is not provided. As described above, the metal mask opening 15 in the deposition mask 100 according to the embodiment of the present disclosure has a rectangular shape as a basic shape.

The metal mask opening 15 shown in Figure 2B has a plurality of continuous arcuate extending portions 35 projecting toward the outside of the opening 15 over its entire circumference while having a rectangular basic shape ).

The metal mask opening 15 shown in Fig. 2 (c) has a rectangular shape as a basic shape, and has a plurality of continuous arcuate extending portions 35 projecting toward the inside of the opening 15 over its entire circumference ).

The metal mask opening 15 shown in FIG. 2 (d) has a rectangular shape as a basic shape, and has a plurality of continuous arc-shaped openings 15 projecting toward both the outer side and the inner side of the opening 15 And has an extending portion 35.

The resonance frequency of the metal mask 10 may be shifted by a plurality of continuous arcuate extending portions 35, as shown in Figs. 2 (b) to 2 (d).

On the other hand, the metal mask opening 15 shown in FIG. 2 (e) has a rectangular shape as a basic shape and has a plurality of continuous arc-shaped extensions 15 projecting outwardly of the opening 15 only on one side thereof (35).

The metal mask opening 15 shown in Fig. 2 (f) has an arcuate extending portion 35 protruding toward the outside of the opening 15 only for the four vertices of the metal mask opening 15, I have.

As shown in FIGS. 2 (e) and 2 (f), it is not always necessary that the extended portion 35 is provided over the entire circumference of the metal mask opening portion 15, and if a portion likely to be broken is known in advance Or may be provided only on that part continuously or intermittently. Also in this case, it is not necessarily required to protrude outwardly, but it may protrude inwardly, or may protrude toward both the outer side and the inner side.

The metal mask opening 15 shown in Figure 3 (a) has a plurality of continuous triangular-shaped extending portions 35 projecting toward the outside of the opening 15, ).

The metal mask opening 15 shown in Fig. 3 (b) has a rectangular shape as a basic shape and has a plurality of interlocking triangular-shaped extension portions 35 projecting toward the outside of the opening portion 15 ).

The metal mask opening 15 shown in Fig. 3 (c) has a rectangular shape as a basic shape, and has a plurality of openings 15 protruding outward from the entire circumference thereof, (35).

3 (a) to 3 (c), the shape of the extended portion 35 is not limited to the circular arc shape, and the resonance frequency of the metal mask 10 can be shifted even in a triangular shape.

The metal mask opening 15 shown in Fig. 3 (d) has a rectangular shape as a basic shape, and has a plurality of interlocking square-shaped extending portions 35 projecting toward the outside of the opening 15 ).

The metal mask opening 15 shown in FIG. 3E has a plurality of intermittently extending trapezoidal extending portions 35 projecting toward the outside of the opening portion 15 ).

The metal mask opening 15 shown in Fig. 3 (f) has a rectangular shape as a basic shape and has a plurality of interlocking pentagonal extension portions 35 projecting toward the outside of the opening portion 15 ).

The metal mask opening 15 shown in FIG. 3 (g) has a rectangular shape as a basic shape and has a plurality of interlocking cross-shaped extensions 35 ).

As shown in FIGS. 3 (d) to 3 (g), the shape of the extended portion 35 is not limited to the arc shape or the triangular shape, and the stress can be dispersed even in various polygonal shapes.

The metal mask opening 15 shown in FIG. 3 (h) has a rectangular shape as a basic shape and has a plurality of interrupted circular arc shapes and rectangular shapes protruding outward from the opening 15 over its entire circumference And an extended portion 35 of a combined shape.

As described above, even if a plurality of shapes are combined, the resonance frequency of the metal mask 10 can be shifted.

The metal mask opening 15 shown in Fig. 3 (i) has a rectangular shape as a basic shape, and has a plurality of intermittently extending triangular-shaped and rectangular-shaped openings 15 projecting toward the outside of the opening 15, And has an extending portion 35.

Thus, even when a plurality of shapes are included at the same time, the resonance frequency of the metal mask 10 can be shifted.

The metal mask opening 15 shown in Fig. 4 (a) has a rectangular shape as a basic shape, and has an extended portion 35 of a sine curve on the upper and lower sides thereof.

The metal mask opening 15 shown in Fig. 4 (b) has a rectangular shape as a basic shape, and has an extended portion 35 that combines sine curves having different cycles only on the upper side thereof.

As shown in Fig. 4 (a) or 4 (b), the stress can be dispersed even when a waveform shape such as a sine curve is provided only at a desired position.

The metal mask opening 15 shown in Fig. 4 (c) has a so-called fractal in extension portion 35 having a rectangular shape as a basic shape and a triangular shape as a unit shape only on the upper side thereof.

It is also possible to shift the resonance frequency of the metal mask 10 by the fractal extension portion 35.

The shape of the extended portion 35 shown in Figs. 2 to 4 is merely an example, and the shape other than the above may be a shape capable of dispersing the stress, and it is also possible to form them by appropriately combining them.

In the deposition mask 100 according to the embodiment of the present disclosure, it is not necessary to form the extending portions 35 in all the metal mask openings 15 in the metal mask 10, The extension portion 35 may be formed only in the metal mask opening portion 15 present in the portion. Specifically, the extending portion 35 may be formed only in the metal mask opening 15 located at the central portion of the metal mask 10, or in the opposite direction, that is, in the vicinity of the outer edge of the metal mask 10, The extended portion 35 may be formed only on the base 15.

There is no particular limitation on the material of the metal mask 10, and conventionally known materials can be appropriately selected and used in the field of the deposition mask. For example, a metal material such as stainless steel, iron nickel alloy, . Among them, an invar material, which is an iron nickel alloy, can be suitably used because it is less deformed by heat.

The thickness of the metal mask 10 is not particularly limited. However, in order to more effectively prevent the occurrence of the shadow, the thickness is preferably 100 占 퐉 or less, more preferably 50 占 퐉 or less, and particularly preferably 35 占 퐉 or less. Further, when the thickness is smaller than 5 占 퐉, risk of breakage or deformation increases and handling tends to become difficult.

The cross-sectional shape of the metal mask opening 15 formed in the metal mask 10 is not particularly limited, but it is preferable that the cross-sectional shape of the metal mask opening 15 widens toward the evaporation source as shown in Fig. 1 (a). More specifically, a straight line connecting the lower edge of the metal mask 10 in the metal mask opening 15 and the upper edge of the metal mask opening 15 of the metal mask 10, The inner wall surface of the metal mask opening 15 and the inner wall surface of the metal mask 10 constituting the metal mask opening 15 constitute the angle formed by the bottom surface of the metal mask 10, 10) formed by the side of the resin mask 20 on which the resin mask 20 contacts (the upper surface of the metal mask in the illustrated embodiment) is preferably in a range of 5 to 85, more preferably in a range of 15 to 80 More preferably in the range of 25 DEG to 65 DEG. Particularly, within this range, it is preferable that the angle is smaller than the deposition angle of the evaporator to be used.

The method of laminating the metal mask 10 on the resin mask is not particularly limited, and the resin mask 20 and the metal mask 10 may be bonded by using various pressure-sensitive adhesives, or a resin mask having self-adhesive property may be used . The size of the resin mask 20 and the metal mask 10 may be the same or different. If the size of the resin mask 20 is made smaller than the size of the metal mask 10 and the outer circumferential portion of the metal mask 10 is exposed in consideration of fixing to the frame to be arbitrarily performed later, So that it is easy to fix the frame 10 and the frame.

(Deposition method using a deposition mask)

The deposition method used in the formation of the deposition pattern using the deposition mask of the present disclosure is not particularly limited. For example, a physical vapor deposition method such as a reactive sputtering method, a vacuum deposition method, an ion plating method, ), Chemical vapor deposition (CVD) such as thermal CVD, plasma CVD, and photo CVD. The deposition pattern can be formed by using a conventionally known vacuum deposition apparatus or the like.

(Another embodiment of the deposition mask)

In the above-described deposition mask 100 according to the embodiment of the present disclosure, the metal mask opening 15 of the metal mask 10 constituting the deposition mask 100 has a rectangular shape as a basic shape. However, the present invention is not limited to this, If the polygon other than the rectangle such as a triangle, a pentagon, a hexagon, or the like is formed as a basic shape and an extended portion extending the entire circumference of the polygon is added, the above-mentioned function and effect can be exhibited.

5 is a front view showing an example of a shape of a metal mask opening portion when the deposition mask according to another embodiment of the present disclosure is viewed from the metal mask side in a plan view.

5A shows the shape of the metal mask opening 15 in the case where the extension portion 35 is not provided. As described above, the metal mask opening 15 in the deposition mask 100 according to the embodiment of the present disclosure may have a triangular shape as a basic shape.

The metal mask opening 15 shown in Fig. 5 (b) has a plurality of continuous arcuate extending portions 35 projecting toward the outside of the opening 15 over the entire circumference thereof, ).

The metal mask opening 15 shown in Fig. 5 (c) has an arc-shaped extension 35 projecting toward the outside of the opening 15 only with respect to the triangular point, .

The metal mask opening 15 shown in FIG. 5 (d) has a triangular shape as a basic shape and has a plurality of continuous arcuate extending portions (not shown) projecting toward both the outer side and the inner side of the opening 35).

The metal mask opening 15 shown in FIG. 5E has a plurality of continuous triangular-shaped projections 35 projecting toward the outside of the opening 15 over the entire circumference of the triangular- ).

The metal mask opening 15 shown in Fig. 5 (f) has a plurality of regularly extending square-shaped extending portions 35 projecting toward the outside of the opening over the entire circumference of the triangle as a basic shape have.

The metal mask opening 15 shown in FIG. 5 (g) has a shape obtained by combining the above-described FIG. 5 (c) and FIG. 5 (f). Specifically, the triangle has a basic shape, and has an arc-shaped extension portion 35 projecting toward the outside of the opening portion 15 with respect to the triple point, and the triangular portion is projected toward the outside of the opening portion with respect to the three sides And has a plurality of interlocking square-shaped extension portions 35.

6 is a front view showing an example of a shape of a metal mask opening portion when the deposition mask according to still another embodiment of the present disclosure is viewed from the metal mask side in a plan view.

6 (a) shows the shape of the metal mask opening 15 in the case where the extension 35 is not provided. As described above, the metal mask opening 15 in the deposition mask 100 according to the embodiment of the present disclosure may have a pentagon as a basic shape.

The metal mask opening 15 shown in Fig. 6 (b) has a plurality of continuous arcuate extending portions 35 projecting toward the outside of the opening 15 over the entire circumference thereof, ).

The metal mask opening 15 shown in Fig. 6 (c) has an arc-shaped extension 35 projecting toward the outside of the opening 15 only for the five vertexes, .

The metal mask opening 15 shown in Fig. 6 (d) has a basic shape of a pentagon and a plurality of continuous arcuate extending portions (not shown) projecting toward both the outside and the inside of the opening over the entire circumference 35).

The metal mask opening 15 shown in Fig. 6E has a plurality of continuous triangular-shaped extension portions 35 projecting toward the outside of the opening 15 over the entire circumference thereof, ).

The metal mask opening 15 shown in Fig. 6 (f) has a plurality of regularly extending square-shaped extending portions 35 projecting toward the outside of the opening over the entire periphery thereof while having a pentagon as a basic shape have.

The metal mask opening 15 shown in FIG. 6 (g) has a shape obtained by combining the above-described FIG. 6 (c) and FIG. 6 (f). Concretely, it has an arc-shaped extension 35 projecting toward the outside of the opening 15 with respect to the five apexes while having a pentagon as a basic shape, and the arc-shaped extension 35 protruding toward the outside of the opening with respect to the five sides And has a plurality of interlocking square-shaped extension portions 35.

7 is a front view showing an example of the shape of a metal mask opening portion when the deposition mask according to still another embodiment of the present disclosure is viewed from the metal mask side in a plan view.

7 (a) shows the shape of the metal mask opening 15 in the case where the extension 35 is not provided. As described above, the hexagonal shape of the metal mask opening 15 in the deposition mask 100 according to the embodiment of the present disclosure may be a basic shape.

The metal mask opening 15 shown in Fig. 7 (b) has a hexagonal basic shape and a plurality of continuous arcuate extending portions 35 projecting toward the outside of the opening 15 over its entire circumference ).

The metal mask opening 15 shown in Fig. 7C has a hexagonal basic shape, and has an arc-shaped extension portion 35 protruding toward the outside of the opening 15 only for the five vertices .

The metal mask opening portion 15 shown in FIG. 7 (d) has a hexagonal basic shape and a plurality of continuous arcuate extending portions (not shown) projecting toward both the outer side and the inner side of the opening portion 35).

The metal mask opening 15 shown in FIG. 7E has a plurality of continuous triangular-shaped projections 35 projecting toward the outside of the opening 15 over the entire circumference thereof, ).

The metal mask opening 15 shown in FIG. 7 (f) has a hexagonal basic shape and has a plurality of interrupted and extending square-shaped extending portions 35 projecting toward the outside of the opening over the entire circumference thereof have.

The metal mask opening 15 shown in FIG. 7 (g) has a shape obtained by combining the above-described FIG. 7 (c) and FIG. 7 (f). Specifically, the hexagonal shape has a basic shape, and has an arc-shaped extension 35 projecting toward the outside of the opening 15 with respect to the six vertexes. The hexagonal protrusion 35 protrudes toward the outside of the opening with respect to six sides And has a plurality of interlocking square-shaped extension portions 35.

As described above, the basic shapes of the metal mask openings 15 in the deposition mask 100 according to the embodiment of the present disclosure are rectangular, triangular, pentagonal, and hexagonal. However, the present invention is not limited to these, It may be a polygon, and it need not necessarily be a regular polygon.

<< Deposition mask with rigidity adjusting part in metal mask >>

In the deposition masks according to the embodiments of the present disclosure described above, it is preferable that the metal mask constituting the metal mask has a rigidity of one or more than one, which partly reduces the rigidity of the metal mask, It may have an adjusting section.

It is possible to improve the followability of the metal mask against the deformation of the resin mask and to reduce the probability that the resin mask will be broken as a result of the provision of the stiffness adjusting section which reduces the rigidity of the portion in the predetermined portion of the metal mask.

The rigidity adjusting section in the deposition mask having the rigidity adjusting section in the metal mask according to the embodiment of the present disclosure will be described below with reference to the drawings. In the following drawings, the extending portions provided in the metal mask opening portions described above are omitted.

(Rigidity adjusting section)

8 to 19, the metal mask 10 in the deposition mask 100 according to the embodiment of the present disclosure is arranged at a position that does not overlap the resin mask opening portion 25 of the resin mask 20, And one or a plurality of stiffness adjusting sections (36) for partially reducing the rigidity of the metal mask (10). Specifically, one or a plurality of stiffness adjusting portions 36 for partially lowering the rigidity of the metal mask 10 are placed in the arrangement region 30 shown in Figs. 8 to 10 and 16 to 19.

The rigidity of the metal mask in the present specification means the degree of ease of deformation (sometimes referred to as displacement or amount of displacement) of the metal mask in a region where the load is applied when a constant load is applied to the deposition mask As the rigidity decreases, in other words, as the displacement increases, the rigidity of the metal mask decreases. The rigidity of the metal mask can be calculated by the following equation (1). Specifically, the vertical load F is applied to a predetermined region of the deposition mask 100, and the displacement amount delta of the metal mask in the region where the vertical load F is applied is measured to determine the rigidity k ) Can be calculated. The displacement amount? Of the metal mask can be measured using, for example, a laser displacement meter or the like. As a method for applying the vertical load, for example, a method of loading a weight having a predetermined mass in a predetermined region, a device for applying a load, or the like can be used.

k = F /? (One)

In the deposition mask 100 of the present disclosure, the stiffness adjusting section 36 is disposed in the placing area 30 so that the stiffness of the metal mask 10 in the placing area 30 is determined by the stiffness adjusting section 36 The rigidity of the non-formed region can be lowered. In other words, by forming the metal mask 10 having the stiffness adjusting portion 36, it is possible to impart flexibility to the metal mask. According to the deposition mask 100 of the present disclosure, the flexibility of the metal mask 10 can improve the followability of the metal mask 10 to the resin mask 20, and as a result, the resin mask 20 ) Can be reduced.

The method of partially lowering the rigidity of the metal mask 10 by the rigidity adjusting section 36 is not particularly limited and can be realized by various methods as exemplified below. In addition, the rigidity of the metal mask can be partially lowered by other methods.

(i) One or a plurality of rigidities (for example, through holes) penetrating the metal mask 10 are formed in predetermined regions of the metal mask which do not overlap with the resin mask opening portions 25 in the thickness direction, The rigidity of the metal mask 10 in the peripheral region including the through hole 40 can be lowered by providing the through hole 40 as the adjustment portion 36 (Figs. 11 (b), (c), 15 (b)).

Here, the through hole 40 means a hole penetrating through the metal mask 10 only. The method of forming the through hole 40 is not particularly limited, and etching, cutting, or the like can be appropriately selected.

(ii) In addition, in a predetermined region of the metal mask which does not overlap with the resin mask opening portion 25 in the thickness direction, that is, in a region where a reduction in rigidity is desired, one or a plurality of rigidity adjusting portions The rigidity of the metal mask 10 in the peripheral region including the concave portion 45 may be lowered by providing the concave portion 45 as the concave portion 36 (see Figs. 11 and 15).

The method of forming the concave portion 45 is not particularly limited, and etching, cutting, or the like can be appropriately selected. The depth of the concave portion 45 is not particularly limited and can be appropriately set in consideration of the thickness of the metal mask 10 and the degree of reduction in rigidity. As an example, it is within a range of 1 μm or more and 100 μm or less.

The rigidity adjusting portion 36 includes a through hole 40 and a concave portion 45 as the rigidity adjusting portion 36 except for the case where a substrate is specifically provided.

The shape of the through hole 40 or the concave portion 45 as the rigidity adjusting portion 36 is not particularly limited and the shape of the through hole 40 and the concave portion 45 when the vapor deposition mask 100 is viewed from the side of the metal mask 10, Shape, rectangular shape, diamond shape, trapezoid shape, pentagonal shape, hexagonal shape, etc., circular shape, elliptical shape, or shape having angular curvature in polygonal shape. Alternatively, they may be combined.

20 and 21 are views showing an example when the aggregate of the &quot; rigidity adjusting portion &quot; is viewed from the metal mask 10 side in a plan view. 20 and 21, the closed area may be the rigidity adjusting part 36, or the closed area may be a non-through hole or a non-concave part. In addition, as shown in Fig. 21, when there are a plurality of stiffness adjusting sections 36, the sizes of the stiffness adjusting sections 36 do not always have to be the same, but stiffness adjusting sections 36 of different sizes may be mixed. 21, a so-called gradation may be used as a whole.

The size of the through hole 40 or the recess 45 as the rigidity adjusting portion 36 is not particularly limited and may be suitably set in accordance with the position at which the rigidity adjusting portion 36 is positioned. For example, the area of the opening area of the rigidity adjusting part 36 as viewed from the side of the metal mask may be larger than the area of the opening area of the metal mask opening 15, or may be smaller or the same. In consideration of easiness in adjusting the rigidity of the metal mask 10, it is preferable that the area of the opening area of one rigidity adjusting part 36 is made smaller than the area of the opening area of the metal mask opening 15. In one example, the area of the opening area of one stiffness adjusting part 36, that is, the area of the opening area of one through hole 40 and one concave part 45 is 1 μm ² Or more and 1 × 10 ¹² μm ² or less.

The opening width of the through hole 40 as the rigidity adjusting portion 36 and the opening width of the concave portion 45 is not particularly limited either. For example, in the longitudinal direction and the width direction of the deposition mask The opening width of each of the rigidity adjusting portions 36 may be larger or smaller than the respective opening widths in the longitudinal direction and the width direction of the deposition mask of the metal mask opening 15, or may be the same width. The opening width of the rigidity adjusting portion 36 may be appropriately set in accordance with the position at which the through hole 40 is located. For example, the metal mask 10 has a plurality of metal mask openings 15, When the rigidity adjusting portion 36 is positioned between the metal mask openings 15 adjacent to each other in the longitudinal direction of the mask, the width of the rigidity adjusting portion 36 in the longitudinal direction when viewed from the side of the metal mask 10 is And the distance in the longitudinal direction of the adjacent metal mask openings 15 may be smaller. This also applies to the case where the stiffness adjusting portion 36 is positioned between the metal mask openings 15 adjacent to each other in the width direction of the deposition mask.

The sum of the areas of the through holes 40 as the rigidity adjusting portions 36 and the opening areas of the recesses 45 when the deposition mask 100 of the present disclosure is viewed from the side of the metal mask 10 in a plan view, 3% when assuming that the area of the metal mask effective area of the metal mask having only the metal mask opening 15 as viewed from the metal mask side is 100%, assuming that the rigidity adjusting part 36 is not provided, , More preferably 10% or more, and particularly preferably 30% or more. Here, the area of the metal mask effective area means the surface area of the portion where the metal mask exists when the deposition mask is viewed from the side of the metal mask 10 in a plane. By setting the ratio of the area of the through hole 40 as the rigidity adjusting section 36 or the area of the opening area of the concave section 45 within the above preferable range, the rigidity of the metal mask 10 And the adhesion of the deposition mask 100 to the resin mask 20 and the deposition target can be further improved. The upper limit value of the sum of the areas of the opening areas of the rigidity adjusting part 36 is not particularly limited. However, considering rigidity of the metal mask, it is preferably 95% or less, more preferably 90% or less, particularly preferably 70% Do.

The positions and pitches of the through holes 40 and the recesses 45 as the rigidity adjusting portions 36, that is, the rigidity adjusting portions described above are not particularly limited and they may be arranged with regularity, . An example of the pitch between adjoining stiffness adjusting portions 36 is 1 占 퐉 to 2 占¹⁰⁶占 퐉.

In the case where a plurality of rigidity adjusting portions 36 are provided in the metal mask 10, the areas of the opening regions of the respective rigidity adjusting portions 36 may be the same or different. The same is true for the pitch. The through hole 40 and the concave portion 45 may be used in combination as the rigidity adjusting portion 36.

(Arrangement region of the rigidity adjusting section)

There is no particular limitation on the arrangement area in which the rigidity adjusting section 36 is disposed and it is possible to reduce the rigidity of the metal mask 10 at a desired position, that is, at a position where the resin mask 20 is likely to be broken, It may be appropriately disposed around the opening 15. As shown in Figs. 8 to 10 and Figs. 16 to 19, the metal mask 10 of the preferred embodiment has the arrangement region 30 in the periphery of the metal mask opening 15 and one Or a plurality of rigidity adjusting portions 36 are disposed. According to the deposition mask 100 of the present disclosure having the metal mask 10 of the preferred form, it is possible to reduce the probability of breakage of the resin mask.

The deposition mask 100 of the type shown in Figs. 8 and 9 is characterized in that the metal mask 10 has a plurality of metal mask openings 15 and the arrangement region 30 is located so as to surround the metal mask openings 15 have. 2, the arrangement region 30 is located so as to surround the metal mask opening portion 15 and also to overlap the outer edge of the arrangement region 30 with the outer edge of the metal mask opening portion 15. As shown in Fig. 9, the metal mask opening 15 is surrounded by at least one metal mask opening 15 of the plurality of metal mask openings 15 and the outer edge of the metal mask opening 15 and the outer edge of the arrangement region 30 So that the arrangement region 30 is located. In the embodiment shown in Fig. 10, the metal mask openings 15 are formed so as to surround the metal mask openings 15 and to prevent the outer edges of the metal mask openings 15 from overlapping with the outer edges of the arrangement regions 30. In other words, The positioning region 30 is positioned at a predetermined distance from the outer edge of the wafer W.

Figs. 11 and 15 are enlarged front views (an enlarged front view showing an example of an area denoted by a reference character X in Fig. 1B) showing an example of the arrangement of the stiffness adjusting portion 36 disposed in the arrangement region 30 , Fig. 12 is an example of a schematic AA sectional view of Fig. 11 (a), and Figs. 13 (a) and 13 (b) (b) is an example of a AA schematic sectional view of Fig. 11 (c). 11A, the outer edge of the metal mask opening 15 and the outer edge of the stiffness adjusting portion 36 are overlapped with each other, and one metal mask opening 15 is connected to one stiffness adjusting portion 36 as a recessed portion. 11 (b), one metal mask opening 15 is formed so as not to overlap the outer edge of the rigidity adjusting portion 36 with the outer edge of the metal mask opening 15, (36). The stiffness adjusting portion 36 of the type shown in FIG. 11 (b) may be any of the through hole 40 and the recess 45. 11 (c), one metal mask opening 15 is formed to have one continuous stiffness so that the outer edge of the metal mask opening 15 and the outer edge of the stiffness adjusting portion 36 do not overlap each other, And is surrounded by an adjustment unit 36. The stiffness adjusting portion 36 shown in Fig. 11 (c) may be one continuous through hole 40 or one continuous recessed portion 45. Fig. Further, these configurations may be combined.

It is also possible to divide the stiffness adjusting section 36 shown in each figure into a plurality of stiffness adjusting sections 36. 15A shows a configuration in which one stiffness adjusting section 36 shown in Fig. 11A is divided into a plurality of stiffness adjusting sections 36. Fig. one stiffness adjusting portion 36 shown in Fig. 4C is divided into a plurality of stiffness adjusting portions 36. Fig. It is also possible to appropriately combine the shapes shown in the drawings.

The deposition mask 100 of the type shown in FIGS. 16A, 16B and 17A and 17B is characterized in that the metal mask 10 has a plurality of metal mask openings 15, The arrangement region 30 is located so as to surround the plurality of metal mask openings 15 integrally. 16, the outer edge of the metal mask opening 15 overlaps with the outer edge of the arrangement region 30. In the embodiment shown in Fig. 17, the outer edge of the metal mask opening 15 is spaced apart from the outer edge of the metal mask opening 15 by a predetermined distance The outer edge of the arrangement area 30 is located at an interval. 16 and 17, a plurality of stiffness adjusting portions 36 are disposed in the arrangement region 30. In the embodiment shown in Fig. 16, even if the entire arrangement region 30 is formed as the concave portion 45 do. In the embodiment shown in Fig. 17, the entire arrangement area 30 may be the through hole 40 or the concave portion 45. Fig.

The deposition mask 100 of the type shown in FIG. 18 is a mask in which the metal mask 10 has a plurality of metal mask openings 15 and at least a part of the arrangement region 30 between adjacent metal mask openings 15 Is located. 18, a plurality of rigidity adjusting portions 36 are arranged in the arrangement region 30. In the configuration shown in Fig. 18, the entire arrangement region 30 is formed in the through hole 40 or the recess 45 ).

19 (a) and 19 (b), the metal mask 10 has only one metal mask opening 15, and the metal mask opening 15 has only one metal mask opening 15 The low placement area 30 is located. 19 (a), the outer edge of the metal mask opening 15 overlaps with the outer edge of the arrangement region 30. In the embodiment shown in Fig. 19 (b), the metal mask opening The outer edge of the positioning area 30 is positioned at a predetermined distance from the outer edge of the positioning area 30. In consideration of this point, the outer edge of the metal mask 10 does not overlap with the outer edge of the deposition area 30, because the frame and the deposition mask are normally fixed on the outer periphery of the deposition mask . That is, it is preferable that the concave portion 45 is not located at the portion overlapping with the outer edge of the metal mask. 19, a plurality of stiffness adjusting portions 36 are arranged in the arrangement region 30. In the configuration shown in Fig. 19 (a), the entire arrangement region 30 is divided into the concave portions 45 The entire arrangement area 30 may be the through hole 40 or the recess 45 in the form shown in FIG. 19 (b). In other words, one metal mask opening 15 may be surrounded by one continuous through-hole 40 or recess 45 (Fig. 11 (A) and (c) of FIG. Further, instead of the shape shown in the figure, the stiffness adjusting portion 36 may be disposed only in a part of the arrangement region 30, for example, in the vicinity of the metal mask (not shown).

<< Preparation of deposition mask >>

Next, the deposition mask preparation body will be described. The deposition mask preparation body is a semi-finished product prepared for manufacturing the deposition mask 100 described above. Specifically, a resin mask 20 having a plurality of resin mask openings 25 corresponding to the pattern to be vapor-deposited and a metal mask 10 having a metal mask opening 15 are formed on the resin mask opening 25 And the metal mask openings 15 are stacked one over the other on the surface of the metal mask 10. The metal mask 10 is made of a resin plate provided on one surface of the metal mask 10, The shape of the metal mask opening 15 when the metal mask 10 is viewed in a plane is a shape obtained by adding a polygon as a basic shape and an extended portion 35 extending the entire circumference of the polygon . By using such a deposition mask preparation body, for example, by forming a resin mask opening with a desired shape on a resin plate with a laser through a metal mask opening on the metal mask side of the deposition mask preparation body, It becomes possible to manufacture a deposition mask.

Also in the above-described deposition mask preparation body, the above-described rigidity adjusting section 36 may be provided on the metal mask 10 constituting the mask preparation body.

<< Manufacturing Method of Deposition Mask >>

The method of manufacturing the deposition mask 100 according to the embodiment of the present disclosure described above is not particularly limited, and various methods can be suitably employed. For example, the deposition mask 100 may be formed by separately manufacturing the metal mask 10 and the resin mask 20, and then bonding both masks using an adhesive or the like. A metal mask opening 15 is formed on a metal plate constituting the laminate to prepare a metal mask 10 to manufacture the deposition mask preparation body, The resin mask 20 may be formed by forming the resin mask openings 25 in the resin plate constituting the preparation body.

The method for manufacturing the metal mask 10, in other words, the method for forming the metal mask opening 15, the extending portion 35 and the rigidity adjusting portion 36 is not particularly limited, and for example, a vacuum deposition method, a sputtering The metal mask 10 may be produced by depositing a metal in a desired region by various PVD methods such as ion plating, chemical vapor deposition (CVD), plating, or the like. On the other hand, a metal mask 10 having a desired opening region or recess can be produced by subjecting a metal plate to an etching process, a digging process, or a laser processing process.

The method of manufacturing the resin mask 20, in other words, the method of forming the resin mask opening portion 25 is not particularly limited, and the resin plate is subjected to an etching treatment, an excavating treatment, and a laser processing treatment The resin mask 20 having a desired opening region may be produced.

&Lt; Method of manufacturing organic semiconductor device &gt;

Next, a method of manufacturing an organic semiconductor element according to an embodiment of the present disclosure (hereinafter referred to as a method of manufacturing an organic semiconductor element of the present disclosure) will be described. The method for manufacturing an organic semiconductor device of the present disclosure includes a step of forming a deposition pattern on an object to be deposited by using a deposition mask and the deposition mask of the present disclosure described above is used in the step of forming a deposition pattern .

There is no particular limitation on the step of forming a vapor deposition pattern according to a vapor deposition method using a vapor deposition mask. The vapor deposition method has an electrode forming step for forming electrodes on a substrate, an organic layer forming step, an opposing electrode forming step, a sealing layer forming step, A deposition pattern is formed by using the above-described deposition pattern formation method of the present disclosure described above. For example, when the above-described deposition pattern formation method of the present disclosure described above is applied to each of the R (red), G (green) and B (blue) emission layer forming steps of the organic EL device, A vapor deposition pattern of each color light emitting layer is formed. The method of manufacturing an organic semiconductor device of the present disclosure is not limited to these steps, but can be applied to any process in the production of conventionally known organic semiconductor devices.

According to the manufacturing method of an organic semiconductor device of the present disclosure described above, deposition can be performed to form an organic semiconductor device in a state in which a deposition mask and an object to be vapor-deposited are in close contact with each other without gap, and a highly accurate organic semiconductor device can be manufactured. Examples of the organic semiconductor device manufactured by the method for producing an organic semiconductor device of the present disclosure include an organic layer, an emitting layer, and a cathode electrode of an organic EL device. Particularly, the manufacturing method of the organic semiconductor device of the present disclosure can be suitably used for the production of R (red), G (green) and B (blue) light emitting layers of organic EL devices which require high precision pattern accuracy.

<< Manufacturing Method of Organic EL Display >>

Next, a manufacturing method of an organic EL display (organic electroluminescence display) according to an embodiment of the present disclosure (hereinafter referred to as a manufacturing method of the organic EL display of the present disclosure) will be described. In the manufacturing method of the organic EL display of the present disclosure, the organic semiconductor element manufactured according to the manufacturing method of the organic semiconductor element of the present disclosure described above is used in the manufacturing process of the organic EL display.

22 (a)), a tablet terminal (refer to FIG. 22 (b)), and a liquid crystal display device using the organic EL device according to the present invention 22C), a mobile phone (see FIG. 22C), a smart phone (see FIG. 22D), a video camera (see FIG. 22E), a digital camera And an organic EL display used for a smart watch (see Fig. 22 (g)).

10: Metal mask
15: Metal mask opening
20: Resin mask
25: resin mask opening
35: extension part
36: Stiffness adjusting section
40: Through hole
45:
100: deposition mask

Claims (5)

A resin mask having a plurality of resin mask openings corresponding to a pattern to be formed by vapor deposition, and a metal mask having a metal mask opening, wherein the resin mask opening and the metal mask opening overlap each other,
Wherein the shape of the opening of the metal mask when the metal mask is viewed in a plan view is a shape having a polygon as a basic shape and an extended portion extending the entire circumference of the polygon. The method according to claim 1,
Wherein the metal mask has one or a plurality of stiffness adjusting portions that partially reduce the rigidity of the metal mask at positions where the metal mask does not overlap the resin mask openings of the resin mask. 3. The method of claim 2,
Wherein the rigidity adjusting portion is a recess provided in a through hole or a metal mask through the metal mask. A method of manufacturing an organic semiconductor device,
And a deposition pattern forming step of forming a deposition pattern on an object to be deposited by using a deposition mask,
Wherein the deposition mask used in the deposition pattern formation step is the deposition mask according to any one of claims 1 to 3. A method of manufacturing an organic EL display,
A method of manufacturing an organic EL display, wherein an organic semiconductor device manufactured according to the method of manufacturing an organic semiconductor device according to claim 4 is used.

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