WO2016104314A1 - エポキシ樹脂組成物、並びにこれを用いたフィルム、プリプレグ及び繊維強化プラスチック - Google Patents
エポキシ樹脂組成物、並びにこれを用いたフィルム、プリプレグ及び繊維強化プラスチック Download PDFInfo
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- WO2016104314A1 WO2016104314A1 PCT/JP2015/085336 JP2015085336W WO2016104314A1 WO 2016104314 A1 WO2016104314 A1 WO 2016104314A1 JP 2015085336 W JP2015085336 W JP 2015085336W WO 2016104314 A1 WO2016104314 A1 WO 2016104314A1
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- WIPO (PCT)
- Prior art keywords
- epoxy resin
- resin composition
- component
- mass
- parts
- Prior art date
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- 229920000647 polyepoxide Polymers 0.000 title claims abstract description 283
- 239000003822 epoxy resin Substances 0.000 title claims abstract description 282
- 239000000203 mixture Substances 0.000 title claims abstract description 140
- 229920002430 Fibre-reinforced plastic Polymers 0.000 title claims abstract description 76
- 239000011151 fibre-reinforced plastic Substances 0.000 title claims abstract description 75
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 11
- 239000007788 liquid Substances 0.000 claims abstract description 6
- 238000005452 bending Methods 0.000 claims description 80
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 claims description 43
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 claims description 30
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 claims description 28
- 239000000835 fiber Substances 0.000 claims description 28
- 229920005992 thermoplastic resin Polymers 0.000 claims description 21
- 229920003229 poly(methyl methacrylate) Polymers 0.000 claims description 20
- 239000004926 polymethyl methacrylate Substances 0.000 claims description 19
- 239000000463 material Substances 0.000 claims description 18
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- 229920000428 triblock copolymer Polymers 0.000 claims description 17
- 229920000049 Carbon (fiber) Polymers 0.000 claims description 16
- 239000004917 carbon fiber Substances 0.000 claims description 16
- 229920006287 phenoxy resin Polymers 0.000 claims description 14
- 239000013034 phenoxy resin Substances 0.000 claims description 14
- 125000002723 alicyclic group Chemical group 0.000 claims description 13
- KAKZBPTYRLMSJV-UHFFFAOYSA-N Butadiene Chemical compound C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 claims description 12
- 239000007787 solid Substances 0.000 claims description 11
- 230000001588 bifunctional effect Effects 0.000 claims description 10
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- 238000002844 melting Methods 0.000 claims description 8
- 230000008018 melting Effects 0.000 claims description 8
- 229920001485 poly(butyl acrylate) polymer Polymers 0.000 claims description 8
- VPWNQTHUCYMVMZ-UHFFFAOYSA-N 4,4'-sulfonyldiphenol Chemical compound C1=CC(O)=CC=C1S(=O)(=O)C1=CC=C(O)C=C1 VPWNQTHUCYMVMZ-UHFFFAOYSA-N 0.000 claims description 7
- XSQUKJJJFZCRTK-UHFFFAOYSA-N Urea Chemical compound NC(N)=O XSQUKJJJFZCRTK-UHFFFAOYSA-N 0.000 claims description 7
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 claims description 7
- WDGCBNTXZHJTHJ-UHFFFAOYSA-N 2h-1,3-oxazol-2-id-4-one Chemical group O=C1CO[C-]=N1 WDGCBNTXZHJTHJ-UHFFFAOYSA-N 0.000 claims description 6
- 229920002223 polystyrene Polymers 0.000 claims description 6
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- DHKHKXVYLBGOIT-UHFFFAOYSA-N 1,1-Diethoxyethane Chemical compound CCOC(C)OCC DHKHKXVYLBGOIT-UHFFFAOYSA-N 0.000 claims description 5
- 229930185605 Bisphenol Natural products 0.000 claims description 4
- 239000011354 acetal resin Substances 0.000 claims description 4
- 125000000217 alkyl group Chemical group 0.000 claims description 4
- 150000001721 carbon Chemical group 0.000 claims description 4
- 229910052799 carbon Inorganic materials 0.000 claims description 4
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 4
- 229920006324 polyoxymethylene Polymers 0.000 claims description 4
- 125000002023 trifluoromethyl group Chemical group FC(F)(F)* 0.000 claims description 4
- OECTYKWYRCHAKR-UHFFFAOYSA-N 4-vinylcyclohexene dioxide Chemical compound C1OC1C1CC2OC2CC1 OECTYKWYRCHAKR-UHFFFAOYSA-N 0.000 claims description 3
- 125000000962 organic group Chemical group 0.000 claims description 3
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 claims description 2
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims description 2
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- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 8
- 230000000704 physical effect Effects 0.000 description 7
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- XXOYNJXVWVNOOJ-UHFFFAOYSA-N fenuron Chemical compound CN(C)C(=O)NC1=CC=CC=C1 XXOYNJXVWVNOOJ-UHFFFAOYSA-N 0.000 description 6
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 5
- 238000013001 point bending Methods 0.000 description 5
- 229920000642 polymer Polymers 0.000 description 5
- 238000002360 preparation method Methods 0.000 description 5
- XMTQQYYKAHVGBJ-UHFFFAOYSA-N 3-(3,4-DICHLOROPHENYL)-1,1-DIMETHYLUREA Chemical compound CN(C)C(=O)NC1=CC=C(Cl)C(Cl)=C1 XMTQQYYKAHVGBJ-UHFFFAOYSA-N 0.000 description 4
- 230000000996 additive effect Effects 0.000 description 4
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N diphenyl Chemical compound C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 description 4
- 238000011156 evaluation Methods 0.000 description 4
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- HECLRDQVFMWTQS-RGOKHQFPSA-N 1755-01-7 Chemical compound C1[C@H]2[C@@H]3CC=C[C@@H]3[C@@H]1C=C2 HECLRDQVFMWTQS-RGOKHQFPSA-N 0.000 description 2
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 2
- KGYYLUNYOCBBME-UHFFFAOYSA-M 4-fluoro-2-phenyl-4-(4-propylcyclohexyl)cyclohexa-1,5-diene-1-carboxylate Chemical compound C1CC(CCC)CCC1C1(F)C=CC(C([O-])=O)=C(C=2C=CC=CC=2)C1 KGYYLUNYOCBBME-UHFFFAOYSA-M 0.000 description 2
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 2
- 239000004697 Polyetherimide Substances 0.000 description 2
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- 230000008901 benefit Effects 0.000 description 2
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- 125000000524 functional group Chemical group 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 description 2
- 238000005470 impregnation Methods 0.000 description 2
- 230000006872 improvement Effects 0.000 description 2
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- IZXIZTKNFFYFOF-UHFFFAOYSA-N 2-Oxazolidone Chemical group O=C1NCCO1 IZXIZTKNFFYFOF-UHFFFAOYSA-N 0.000 description 1
- STHCTMWQPJVCGN-UHFFFAOYSA-N 2-[[2-[1,1,2-tris[2-(oxiran-2-ylmethoxy)phenyl]ethyl]phenoxy]methyl]oxirane Chemical compound C1OC1COC1=CC=CC=C1CC(C=1C(=CC=CC=1)OCC1OC1)(C=1C(=CC=CC=1)OCC1OC1)C1=CC=CC=C1OCC1CO1 STHCTMWQPJVCGN-UHFFFAOYSA-N 0.000 description 1
- UJWXADOOYOEBCW-UHFFFAOYSA-N 2-[[2-[bis[2-(oxiran-2-ylmethoxy)phenyl]methyl]phenoxy]methyl]oxirane Chemical compound C1OC1COC1=CC=CC=C1C(C=1C(=CC=CC=1)OCC1OC1)C1=CC=CC=C1OCC1CO1 UJWXADOOYOEBCW-UHFFFAOYSA-N 0.000 description 1
- FSYPIGPPWAJCJG-UHFFFAOYSA-N 2-[[4-(oxiran-2-ylmethoxy)phenoxy]methyl]oxirane Chemical compound C1OC1COC(C=C1)=CC=C1OCC1CO1 FSYPIGPPWAJCJG-UHFFFAOYSA-N 0.000 description 1
- PULOARGYCVHSDH-UHFFFAOYSA-N 2-amino-3,4,5-tris(oxiran-2-ylmethyl)phenol Chemical compound C1OC1CC1=C(CC2OC2)C(N)=C(O)C=C1CC1CO1 PULOARGYCVHSDH-UHFFFAOYSA-N 0.000 description 1
- CDAWCLOXVUBKRW-UHFFFAOYSA-N 2-aminophenol Chemical compound NC1=CC=CC=C1O CDAWCLOXVUBKRW-UHFFFAOYSA-N 0.000 description 1
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- GZPUHNGIERMRFC-UHFFFAOYSA-N 4-(oxiran-2-ylmethyl)isoindole-1,3-dione Chemical compound O=C1NC(=O)C2=C1C=CC=C2CC1CO1 GZPUHNGIERMRFC-UHFFFAOYSA-N 0.000 description 1
- 229920003319 Araldite® Polymers 0.000 description 1
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- IOWNVHUKWGXEMV-UHFFFAOYSA-N C(C1CO1)NCC1CO1.NC=1C(=CC=CC1)C Chemical compound C(C1CO1)NCC1CO1.NC=1C(=CC=CC1)C IOWNVHUKWGXEMV-UHFFFAOYSA-N 0.000 description 1
- 0 CCC(*)CNC Chemical compound CCC(*)CNC 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
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- 229920000297 Rayon Polymers 0.000 description 1
- FDLQZKYLHJJBHD-UHFFFAOYSA-N [3-(aminomethyl)phenyl]methanamine Chemical compound NCC1=CC=CC(CN)=C1 FDLQZKYLHJJBHD-UHFFFAOYSA-N 0.000 description 1
- 150000001241 acetals Chemical class 0.000 description 1
- 150000008065 acid anhydrides Chemical class 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
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- JRPRCOLKIYRSNH-UHFFFAOYSA-N bis(oxiran-2-ylmethyl) benzene-1,2-dicarboxylate Chemical compound C=1C=CC=C(C(=O)OCC2OC2)C=1C(=O)OCC1CO1 JRPRCOLKIYRSNH-UHFFFAOYSA-N 0.000 description 1
- NEPKLUNSRVEBIX-UHFFFAOYSA-N bis(oxiran-2-ylmethyl) benzene-1,4-dicarboxylate Chemical compound C=1C=C(C(=O)OCC2OC2)C=CC=1C(=O)OCC1CO1 NEPKLUNSRVEBIX-UHFFFAOYSA-N 0.000 description 1
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- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
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- JAYXSROKFZAHRQ-UHFFFAOYSA-N n,n-bis(oxiran-2-ylmethyl)aniline Chemical compound C1OC1CN(C=1C=CC=CC=1)CC1CO1 JAYXSROKFZAHRQ-UHFFFAOYSA-N 0.000 description 1
- AFEQENGXSMURHA-UHFFFAOYSA-N oxiran-2-ylmethanamine Chemical compound NCC1CO1 AFEQENGXSMURHA-UHFFFAOYSA-N 0.000 description 1
- WXZMFSXDPGVJKK-UHFFFAOYSA-N pentaerythritol Chemical compound OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 description 1
- IGALFTFNPPBUDN-UHFFFAOYSA-N phenyl-[2,3,4,5-tetrakis(oxiran-2-ylmethyl)phenyl]methanediamine Chemical compound C=1C(CC2OC2)=C(CC2OC2)C(CC2OC2)=C(CC2OC2)C=1C(N)(N)C1=CC=CC=C1 IGALFTFNPPBUDN-UHFFFAOYSA-N 0.000 description 1
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 description 1
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Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/32—Epoxy compounds containing three or more epoxy groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/32—Epoxy compounds containing three or more epoxy groups
- C08G59/3218—Carbocyclic compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/32—Epoxy compounds containing three or more epoxy groups
- C08G59/36—Epoxy compounds containing three or more epoxy groups together with mono-epoxy compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/32—Epoxy compounds containing three or more epoxy groups
- C08G59/38—Epoxy compounds containing three or more epoxy groups together with di-epoxy compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/4007—Curing agents not provided for by the groups C08G59/42 - C08G59/66
- C08G59/4014—Nitrogen containing compounds
- C08G59/4021—Ureas; Thioureas; Guanidines; Dicyandiamides
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/04—Reinforcing macromolecular compounds with loose or coherent fibrous material
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/04—Reinforcing macromolecular compounds with loose or coherent fibrous material
- C08J5/0405—Reinforcing macromolecular compounds with loose or coherent fibrous material with inorganic fibres
- C08J5/042—Reinforcing macromolecular compounds with loose or coherent fibrous material with inorganic fibres with carbon fibres
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/18—Manufacture of films or sheets
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
- C08J5/241—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres
- C08J5/243—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres using carbon fibres
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
- C08J5/249—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs characterised by the additives used in the prepolymer mixture
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2363/00—Characterised by the use of epoxy resins; Derivatives of epoxy resins
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2463/00—Characterised by the use of epoxy resins; Derivatives of epoxy resins
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/18—Applications used for pipes
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
- C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
Definitions
- the present invention relates to an epoxy resin composition suitably used for fiber reinforced plastics used in sports / leisure applications, industrial applications, and the like, and a film, prepreg and fiber reinforced plastic using the same.
- Fiber reinforced plastics one of fiber reinforced composite materials, are widely used from sports / leisure applications to industrial applications such as automobiles and airplanes because of their light weight, high strength and high rigidity.
- a method for producing fiber reinforced plastic there is a method of using an intermediate material obtained by impregnating a matrix resin into a reinforcing material composed of long fibers (continuous fibers) such as reinforcing fibers, that is, a prepreg. According to this method, there is an advantage that the content of the reinforcing fiber of the fiber reinforced plastic can be easily managed and the content can be designed to be higher.
- Specific methods for obtaining fiber reinforced plastic from prepreg include a method using an autoclave, press molding, internal pressure molding, oven molding, and sheet wrap molding.
- fiber reinforced plastic tubular bodies are widely used for sports and leisure applications such as fishing rods, golf club shafts, ski poles, bicycle frames and the like.
- fiber reinforced plastic tubular bodies are widely used for sports and leisure applications such as fishing rods, golf club shafts, ski poles, bicycle frames and the like.
- the carbon fiber when the carbon fiber is made to have a high elastic modulus, the strength generally tends to decrease, and the fiber-reinforced plastic is easily broken, so the amount of use is limited. Moreover, the high elastic modulus carbon fiber is expensive and may not be used from an economical viewpoint. If the amount of prepreg used is reduced to reduce the weight of the current carbon fiber, the breaking strength of the tubular body is lowered.
- JP 2002-284852 A Japanese Patent Laid-Open No. 11-171972
- the present invention has been made in view of the above background, and has found that a fiber-reinforced plastic having excellent mechanical properties can be obtained by using a specific epoxy resin composition as a matrix resin.
- a specific epoxy resin composition capable of obtaining excellent breaking strength, a prepreg using the resin composition, and a fiber reinforced formed using the prepreg.
- plastic when used as a material for tubular fiber reinforced plastics, an epoxy resin composition capable of obtaining excellent breaking strength, a prepreg using the resin composition, and a fiber reinforced formed using the prepreg.
- An epoxy resin composition comprising the following components (A), (C) and (D).
- n and m represent average values
- n is in the range of 1 to 10
- m is a real number in the range of 0 to 10
- R 1 and R 2 are each independently a hydrogen atom or a carbon atom Either an alkyl group having 1 to 4 or a trifluoromethyl group is shown.
- Component (B) Epoxy resin other than component (A) which is solid at 25 ° C.
- the content of the component (A) with respect to 100 parts by mass of the total amount of epoxy resins contained in the epoxy resin composition is 1 part by mass or more and 80 parts by mass or less, according to [1] or [2] Epoxy resin composition.
- the component (B) is at least one epoxy selected from the group consisting of bisphenol A type epoxy resins, bisphenol F type epoxy resins, bisphenol S type epoxy resins, oxazolidone ring type epoxy resins and alicyclic epoxy resins.
- R 1 represents a p-valent organic group.
- p represents an integer of 1 to 20.
- q represents an integer of 1 to 50, and the sum of q in the formula (2) is an integer of 3 to 100.
- R 2 represents one of the groups represented by the following formula (2a) or (2b). However, at least one of R 2 in the formula (2) is a group represented by the formula (2a).
- the alicyclic epoxy resin contains a 1,2-epoxy-4- (2-oxiranyl) cyclohexane adduct of 2,2-bis (hydroxymethyl) -1-butanol, Epoxy resin composition.
- the epoxy resin composition according to one item.
- any one of [1] to [10], wherein the content of the component (C) is from 20 parts by mass to 99 parts by mass with respect to 100 parts by mass of the total amount of epoxy resins contained in the epoxy resin composition The epoxy resin composition according to one item.
- the thermoplastic resin is a phenoxy resin, a polyvinyl acetal resin, a poly (methyl methacrylate) / poly (butyl acrylate) / poly (methyl methacrylate) triblock copolymer, poly (styrene) / poly (butadiene) /
- the epoxy resin composition according to [14] which is at least one selected from the group consisting of poly (methyl methacrylate) triblock copolymers.
- a film comprising the epoxy resin composition according to any one of [1] to [15].
- a prepreg in which a reinforcing fiber base material is impregnated with the epoxy resin composition according to any one of [1] to [15].
- a fiber-reinforced plastic comprising a cured product of the epoxy resin composition according to any one of [1] to [15] and reinforcing fibers.
- An epoxy resin composition containing an epoxy resin and a curing agent and satisfying the following (1) to (4).
- the bending elastic modulus of the cured product of the epoxy resin composition is 3.3 GPa or more.
- the bending fracture strain of the cured product of the epoxy resin composition is 9% or more.
- the cured product of the epoxy resin composition and 90 ° bending strength of a fiber reinforced plastic comprising a reinforced fiber base material in which carbon fibers that are continuous fibers are aligned in one direction, (4) 90% of the fiber reinforced plastic described in (3) above. ° Bending fracture strain is 1.8% or more
- the epoxy resin composition of the present invention as a matrix resin for fiber reinforced plastic, a fiber reinforced plastic having excellent mechanical properties can be obtained.
- excellent fracture strength can be obtained in a fiber reinforced plastic of a tubular body.
- the present invention resides in an epoxy resin composition containing the following components (A), (C) and (D) and its use.
- Component (A) Epoxy resin represented by the following general formula (1)
- Component (C) Epoxy resin other than component (A) that is liquid at 25 ° C.
- n and m represent average values
- n is in the range of 1 to 10
- m is a real number in the range of 0 to 10
- R 1 and R 2 are each independently a hydrogen atom or a carbon atom Either an alkyl group having 1 to 4 or a trifluoromethyl group is shown.
- epoxy resin is used as the name of one category of a thermosetting resin or the name of a category of chemical substance called a compound having an epoxy group in the molecule, but in the present invention, it is used in the latter sense. (However, the mass average molecular weight of an epoxy resin shall be less than 50000).
- epoxy resin composition means a composition containing an epoxy resin and a curing agent, and optionally other additives.
- the bending elastic modulus of the cured product of the epoxy resin composition is referred to as “the bending elastic modulus of the resin”
- the bending breaking strain of the cured product of the epoxy resin composition is referred to as “the bending bending strain of the resin”.
- 90 ° bending strength of fiber reinforced plastic consisting of a reinforced fiber base material in which a cured product of an epoxy resin composition and carbon fibers as continuous fibers are aligned in one direction” is simply “90 ° of fiber reinforced plastic” Sometimes referred to as “bending strength”.
- the epoxy resin composition of this invention contains the epoxy resin shown by following General formula (1) as a component (A).
- n and m represent average values
- n is in the range of 1 to 10
- m is a real number in the range of 0 to 10
- R 1 and R 2 are each independently a hydrogen atom or a carbon atom Either an alkyl group having 1 to 4 or a trifluoromethyl group is shown.
- the epoxy resin represented by the general formula (1) increases the bending strength of the cured product of the epoxy resin composition and increases the 90 ° bending strength of the fiber reinforced plastic when used as a matrix resin of the fiber reinforced plastic. Can do.
- Examples of the epoxy resin represented by the general formula (1) include NER-7604, NER-7403, NER-1302, and NER-1202 (manufactured by Nippon Kayaku Co., Ltd .: Epoxy equivalent 200 g / eq. Or more 500 g / eq., softening point 55 ° C. or higher and 75 ° C. or lower).
- components (A) can be used by appropriately selecting one or more kinds, but from the viewpoint of improving the resin bending elastic modulus, an epoxy resin represented by the following general formula (1a) (for example, NER) ⁇ 7604, NER-7403) is preferred, and from the viewpoint of improving the resin bending strain, the sum of k and j is preferably 5 or more, and NER-7604 is particularly preferred.
- an epoxy resin represented by the following general formula (1a) for example, NER) ⁇ 7604, NER-7403
- the sum of k and j is preferably 5 or more, and NER-7604 is particularly preferred.
- k and j represent average values, k is in the range of 1 to 10, and j is a real number in the range of 0 to 10.
- the component (A) is preferably 1 part by mass or more and 80 parts by mass or less with respect to 100 parts by mass of the total amount of all epoxy resins contained in the epoxy resin composition of the present invention. This is because if the amount of the component (A) is 1 part by mass or more, the bending strength of the cured product of the epoxy resin composition of the present invention is increased, and when this is used for a matrix resin of a fiber reinforced plastic, This is because the 90 ° bending strength of plastic tends to be increased. More preferably, it is 5 mass parts or more, More preferably, it is 10 mass parts or more.
- Component (B) Epoxy resin other than component (A) that is solid at 25 ° C.”
- the epoxy resin composition of this invention can contain a solid epoxy resin at 25 degreeC as a component (B) as needed. This epoxy resin solid at 25 ° C. further enhances the flexural modulus and heat resistance of the cured product of the epoxy resin composition, and when used as a matrix resin for fiber reinforced plastic, the adhesion of the matrix resin to the reinforced fiber. Can be further enhanced.
- the epoxy resin solid at 25 ° C. is, for example, at least one selected from the group consisting of bisphenol A type epoxy resin, bisphenol F type epoxy resin, bisphenol S type epoxy resin, oxazolidone ring type epoxy resin and alicyclic epoxy resin. It is.
- These components (B) can be used by appropriately selecting one or more kinds, but it is preferable to use those having a softening point or a melting point of 50 ° C. or more. This is because by using a component (B) having a softening point or melting point of 50 ° C. or higher, an appropriate tack is obtained in the prepreg, and the handleability tends to be good. More preferably, it is 60 degreeC or more, More preferably, it is 70 degreeC or more.
- the softening point or melting point of the component (B) is preferably 160 ° C. or lower from the viewpoint of good compatibility with other components. More preferably, it is 150 degrees C or less.
- Examples of the bisphenol A type epoxy resin that can be used as the component (B) include jER1001 (softening point 64 ° C.), jER1003 (softening point: 89 ° C.), jER1004 (softening point: 97 ° C.), jER1007 (softening point). : 128 ° C), jER1009 (softening point: 144 ° C) (Mitsubishi Chemical Co., Ltd.), Epototo YD-014 (softening point: 91 ° C to 102 ° C), Epotot YD-017 (softening point: 117) And Epototo “YD-019 (softening point: 130 ° C.
- jER4004P softening point: 85 degreeC
- jER4007P softening point: 108 degreeC
- jER4010P softening point: 135 degreeC
- examples of the bisphenol S type epoxy resin that can be used as the component (B) include EXA-1514 (softening point: 75 ° C.), EXA-1517 (softening point: 60 ° C.) (above, DIC Corporation). Manufactured).
- Examples of the oxazolidone ring-type epoxy resin that can be used as the component (B) include AER4152 (softening point: 98 ° C.), XAC4151 (softening point: 98 ° C.) (above, manufactured by Asahi Kasei Emertel Corporation), ACR1348 (manufactured by ADEKA Corporation), DER858 (manufactured by DOW, softening point: 100 ° C.) and the like can be mentioned.
- the alicyclic epoxy resin that can be used as the component (B) is an alicyclic epoxy resin represented by the following general formula (2), for example, 2,2-bis (hydroxymethyl)- Examples include 1,2-epoxy-4- (2-oxiranyl) cyclohexane adduct of 1-butanol and EHPE3150 (manufactured by Daicel Corporation, softening point: 75 ° C.).
- R 1 represents a p-valent organic group.
- p represents an integer of 1 to 20.
- q represents an integer of 1 to 50, and the sum of q in the formula (2) is an integer of 3 to 100.
- R 2 represents one of the groups represented by the following formula (2a) or (2b). However, at least one of R 2 in the formula (2) is a group represented by the formula (2a).
- epoxy resins that can be used as component (B) include hydroquinone diglycidyl ether (eg, EX-203 (melting point: 88 ° C.)), diglycidyl terephthalate (eg, EX-711 (melting point: 106 ° C.)), N— Examples thereof include glycidyl phthalimide (for example, EX-731 (melting point: 95 ° C.)) (manufactured by Nagase ChemteX Corporation).
- hydroquinone diglycidyl ether eg, EX-203 (melting point: 88 ° C.)
- diglycidyl terephthalate eg, EX-711 (melting point: 106 ° C.)
- the epoxy resin used as the component (B) is selected from the group consisting of the above bisphenol A type epoxy resin, bisphenol F type epoxy resin, bisphenol S type epoxy resin, oxazolidone ring type epoxy resin and alicyclic epoxy resin. At least one or more may be selected as appropriate.
- the adhesion of the matrix resin to the reinforcing fiber tends to be good
- the alicyclic epoxy resin and bisphenol when the S-type epoxy resin is used, the bending elastic modulus of the resin and the heat resistance of the resin tend to be particularly good.
- the content is 5 mass parts or more and 60 mass parts or less with respect to 100 mass parts of total amounts of all the epoxy resins contained in the epoxy resin composition of this invention, 7 More preferably, they are 9 to 55 mass parts, More preferably, they are 9 to 40 mass parts. If the amount of the component (B) is 5 parts by mass or more, the bending elastic modulus and heat resistance of the cured product of the epoxy resin composition of the present invention are further increased, and this is used for the matrix resin of the fiber reinforced plastic. This is because the adhesiveness of the matrix resin to the reinforcing fibers tends to be further improved.
- the resin has excellent impregnation in the prepreg manufacturing process, and the resulting prepreg is easy to handle (tackiness, drapeability, winding property on a mandrel). This is because the physical properties of the fiber-reinforced composite material tend to be good as well as good.
- the epoxy resin composition of the present invention contains an epoxy resin other than the component (A) that is liquid at 25 ° C. as the component (C).
- This component (C) can easily control the viscosity of the epoxy resin composition of the present invention within an appropriate range, and adjusts the tackiness of the prepreg containing the epoxy resin composition.
- a fiber reinforced plastic is produced from this prepreg, a molded product with less voids can be obtained.
- This component (C) includes, for example, jER825 (viscosity at 25 ° C .: 40 poise or more and 70 poise or less), jER827 (viscosity at 25 ° C .: 90 poise or more and 110 poise or less), jER828 as bisphenol A type epoxy resin.
- the epoxy resin used as the component (C) may be appropriately selected from one or more epoxy resins that are liquid at 25 ° C. As described above, since the heat resistance of the cured product tends to be excellent, it is bifunctional or more. In particular, a bisphenol type bifunctional epoxy resin is more preferable because there is no sudden increase in viscosity even when the curing temperature is reached, and it tends to be excellent in suppressing voids during molding. Further, when all or a part of the component (C) is a bisphenol F type epoxy resin, it is particularly preferable because it tends to be excellent in the bending elastic modulus of the resin.
- the component (C) is preferably 20 parts by mass or more and 99 parts by mass or less, and 25 parts by mass or more and 80 parts by mass or less with respect to 100 parts by mass of the total amount of all epoxy resins contained in the epoxy resin composition of the present invention. Is more preferably 25 parts by mass or more and 50 parts by mass or less, and particularly preferably 25 parts by mass or more and 45 parts by mass or less. If the amount of the component (C) is 20 parts by mass or more, the viscosity of the epoxy resin composition of the present invention can be easily controlled within an appropriate range, and the tack of the prepreg containing the epoxy resin composition can be controlled.
- Component (D): Curing Agent The epoxy resin composition of this invention contains a hardening
- the kind of the curing agent of component (D) is not particularly limited, and examples thereof include amine curing agents, imidazoles, acid anhydrides, boron chloride amine complexes, etc. Among them, dicyandiamide is used before curing.
- the epoxy resin composition is preferable because it does not change in performance due to moisture and tends to be cured at a relatively low temperature while having long-term stability.
- the preferred amount of dicyandiamide is such that the number of active hydrogen moles of dicyandiamide is 0.6 to 1 times the number of moles of epoxy groups derived from all epoxy resins blended in the epoxy resin composition. It is preferable from the point that the hardened
- Component (E): Urea-based curing aid The epoxy resin composition of the present invention may further use a urea-based curing aid as component (E).
- a urea-based curing aid it is preferable to use dicyandiamide as the component (D) and to use the component (E): urea-based curing aid in combination with this, so that the epoxy resin composition can be cured in a short time even at a low temperature.
- urea curing aids examples include 3-phenyl-1,1-dimethylurea (PDMU), toluenebisdimethylurea (TBDMU), 3- (3,4-dichlorophenyl) -1,1-dimethylurea (DCMU), and the like. Examples include, but are not limited to, urea derivative compounds. Urea-based curing aids can be used alone or in combination of two or more. In particular, 3-phenyl-1,1-dimethylurea and toluenebisdimethylurea increase the heat resistance and bending strength of the cured epoxy resin composition, and shorten the curing time of the epoxy resin composition. To preferred.
- the toughness of the cured product of the epoxy resin composition containing the same is particularly high. Therefore, it is preferable.
- Component (E) is preferably blended in an amount of 1 part by mass or more and 5 parts by mass or less with respect to 100 parts by mass of the total amount of epoxy resins contained in the epoxy resin composition. Particularly preferably, it is 1.5 parts by mass or more and 4 parts by mass or less.
- the epoxy resin composition of the present invention may further contain a thermoplastic resin as necessary.
- This thermoplastic resin tends to improve the resin bending fracture strain of the cured product.
- the thermoplastic resin include phenoxy resin, polyvinyl acetal resin, poly (methyl methacrylate) / poly (butyl acrylate) / poly (methyl methacrylate) triblock copolymer, poly (styrene) / poly (butadiene) / Although it can be used by appropriately selecting from a poly (methyl methacrylate) triblock copolymer, etc., by using a phenoxy resin, it is possible to achieve both the above-mentioned cured resin bending strain and resin bending elastic modulus. Tend to be able to.
- phenoxy resin examples include bisphenol A type phenoxy resin, bisphenol F type phenoxy resin, or phenoxy resin in which bisphenol A type and bisphenol F type are mixed. Not done. Two or more of these phenoxy resins may be used in combination.
- the mass average molecular weight of the phenoxy resin is preferably 50,000 or more and 80,000 or less. If the weight average molecular weight of the phenoxy resin is 50,000 or more, the viscosity of the epoxy resin composition can be prevented from becoming too low, and the viscosity of the epoxy resin composition can be easily adjusted to an appropriate viscosity range with an appropriate blending amount. It tends to be possible. On the other hand, if the phenoxy resin has a mass average molecular weight of 80,000 or less, it can be dissolved in the epoxy resin, and even if the amount is extremely small, the viscosity of the epoxy resin composition can be prevented from becoming too high. The viscosity of the composition tends to be easily adjusted to an appropriate viscosity range.
- phenoxy resins include YP-50, YP-50S, YP-70 (all trade names, manufactured by Nippon Steel & Sumikin Chemical Co., Ltd.), jER1256, jER4250, jER4275 (all trade names, Mitsubishi Chemical Corporation). Manufactured).
- polyvinyl acetal resin examples include vinylec K (average molecular weight: 59000), vinylec L (average molecular weight: 66000), vinylec H (average molecular weight: 73000), vinylec E (average molecular weight: 126000) (all trade names, Polyvinyl formal such as Chisso Co., Ltd., polyvinyl acetal such as ESREC K (manufactured by Sekisui Chemical Co., Ltd.), ESREC B (manufactured by Sekisui Chemical Co., Ltd.) and Denkabu Chiral (manufactured by Denki Kagaku Kogyo Co., Ltd.) And polyvinyl butyral.
- ESREC K manufactured by Sekisui Chemical Co., Ltd.
- ESREC B manufactured by Sekisui Chemical Co., Ltd.
- Denkabu Chiral manufactured by Denki Kagaku Kogyo Co., Ltd.
- Polyvinyl butyral examples
- triblock copolymer examples include poly (methyl methacrylate) / poly (butyl acrylate) / poly (methyl methacrylate) triblock copolymer, poly (styrene) / poly (butadiene) / poly (methyl methacrylate).
- Triblock copolymer That is, a triblock copolymer obtained by copolymerizing poly (methyl methacrylate), poly (butyl acrylate), and poly (methyl methacrylate) in this order, or poly (styrene), poly (butadiene), and poly (methacrylic acid). And a triblock copolymer in which methyl) is copolymerized in this order.
- the triblock copolymer is micro-dispersed in the epoxy resin by selecting a polymer that is incompatible with the epoxy resin in the central soft block and selecting a polymer that is compatible with the epoxy resin as one or both of the hard blocks. To do.
- the polymer constituting the soft block has a lower glass transition temperature and better fracture toughness than the polymer constituting the hard block. Therefore, by microdispersing the triblock copolymer having this structure in the epoxy resin, it is possible to suppress a decrease in heat resistance of the cured product of the epoxy resin composition and improve fracture toughness.
- Poly (methyl methacrylate) / poly (butyl acrylate) / poly (methyl methacrylate) triblock copolymers with hard blocks on both sides which are polymers that are easily compatible with epoxy resins, have good dispersion in epoxy resins. Since the fracture toughness of the hardened
- Examples of commercially available triblock copolymers of poly (methyl methacrylate) / poly (butyl acrylate) / poly (methyl methacrylate) include Nanostrength (registered trademark) M52, M52N, M22, and M22N (any Product name, manufactured by Arkema Co., Ltd.).
- Examples of commercially available triblock copolymers of poly (styrene) / poly (butadiene) / poly (methyl methacrylate) include, for example, Nanostrength 123, 250, 012, E20, and E40 (manufactured by Arkema). Name).
- the amount of the thermoplastic resin used in the epoxy resin composition of the present invention ranges from 0.1 parts by mass to 10 parts by mass with respect to 100 parts by mass of the total amount of all epoxy resins contained in the epoxy resin composition. It is preferable to be 1 to 6 parts by mass. This is because when the amount of the thermoplastic resin used is 0.1 parts by mass or more, the resin bending fracture strain of the cured epoxy resin composition tends to increase. Moreover, it is because it exists in the tendency for the bending elastic modulus of the hardened
- epoxy resins In the epoxy resin composition of the present invention, an epoxy resin other than the above-described epoxy resins listed as any of the component (A), the component (B), and the component (C) within a range not impairing the effects of the present invention. (Hereinafter referred to as “other epoxy resin”).
- Examples of other epoxy resins include bifunctional epoxy resins such as bisphenol A type epoxy resins, bisphenol F type epoxy resins, glycidylamine type epoxy resins, biphenyl type epoxy resins, dicyclopentadiene type epoxy resins, and epoxies obtained by modifying these. Examples thereof include resins.
- Examples of the trifunctional or higher polyfunctional epoxy resin include phenol novolac type epoxy resin, cresol novolac type epoxy resin, tetraglycidyldiamine type epoxy resin such as tetraglycidyldiaminodiphenylmethane, triglycidylaminophenol, tetrakis (glycidyloxyphenyl) ethane.
- epoxy resin such as tris (glycidyloxyphenyl) methane.
- epoxy resins obtained by modifying these epoxy resins, brominated epoxy resins obtained by brominating these epoxy resins, and the like are exemplified, but not limited thereto. Two or more of these epoxy resins may be combined and used as other epoxy resins.
- the amount of “other epoxy resin” contained in the epoxy resin composition of the present invention is preferably 30 parts by mass or less with respect to 100 parts by mass of the total amount of all epoxy resins contained in the epoxy resin composition.
- the epoxy resin composition of the present invention contains at least one additive selected from the group consisting of a thermoplastic resin other than the thermoplastic resin, a thermoplastic elastomer, and an elastomer as long as the effects of the present invention are not impaired. It may be.
- a thermoplastic resin other than the thermoplastic resin elastomer
- an elastomer elastomer
- the thermoplastic resin, thermoplastic elastomer or elastomer used as the additive may be used alone or in combination of two or more.
- the additive may be melt
- the additive is arranged on the surface layer of the prepreg in the form of fine particles, long fibers, short fibers, woven fabric, nonwoven fabric, mesh, pulp, etc., it is preferable because delamination of the fiber reinforced plastic can be suppressed.
- thermoplastic resin used here includes carbon-carbon bond, amide bond, imide bond, ester bond, ether bond, carbonate bond, urethane bond, urea bond, thioether bond, sulfone bond, imidazole bond and carbonyl in the main chain.
- a thermoplastic resin having a bond selected from the group consisting of bonds can be selected, for example, polyacrylate, polyamide, polyaramid, polyester, polycarbonate, polyphenylene sulfide, polybenzimidazole, polyimide, polyetherimide, polysulfone and polysulfone.
- a group of thermoplastic resins belonging to engineering plastics such as ethersulfone is more preferably used.
- thermoplastic resins have a functional group reactive with an epoxy resin from the viewpoint of improving the toughness of the cured resin of the resin composition of the present invention and maintaining environmental resistance.
- Preferred functional groups reactive with the epoxy resin include a carboxyl group, an amino group, and a hydroxyl group.
- the cured product of the epoxy resin composition of the present invention satisfies the following (1) to (4).
- the improvement in flexural modulus and the improvement in bending fracture strain are in a trade-off relationship, but as a result of intensive studies, the present inventors have determined that by using the epoxy resin composition of the present invention. The present inventors have found that these physical properties can be compatible at a higher level. By using such an epoxy resin composition, the breaking strength of the fiber-reinforced plastic obtained can be improved.
- the epoxy resin composition of the present invention is particularly suitable for use in a tubular fiber reinforced plastic by having the above physical properties.
- Flexural modulus of resin 3.3 GPa or more
- the flexural modulus of resin in the present invention is a value measured by the following method.
- the bending elastic modulus of the resin may be 3.3 GPa or more, but more preferably 3.4 GPa or more because higher 0 ° bending strength and 90 ° bending strength can be obtained.
- limiting in particular in the upper limit of the bending elastic modulus of resin Usually, it is 6 GPa or less.
- the bending fracture strain of the resin is 9% or more
- the bending fracture strain of the resin is a value measured by the following method.
- the test piece is bent under the conditions described above to obtain the strain and the breaking strain at the maximum load.
- the resin plate may not break in the resin bending test. In that case, the apparatus is stopped when 13% is exceeded, and the value is taken as the breaking strain.
- the bending fracture strain of the resin may be 9% or more, but more preferably 11% or more because a higher 90 ° bending strength can be obtained. More preferably, it is 12% or more.
- the upper limit of the bending fracture strain of the resin is 13% as is apparent from the above-described measurement method.
- the 90 ° bending strength of the fiber reinforced plastic is 150 MPa or more.
- the 90 ° bending strength of the fiber reinforced plastic is a value measured by the following method. A fiber reinforced plastic panel obtained by aligning carbon fibers in one direction, producing a prepreg having a fiber basis weight of 125 g / m 2 and a resin content of 28% by mass and curing the prepreg is produced.
- the obtained fiber reinforced plastic panel is processed into a test piece (length 60 mm ⁇ width 12.7 mm) so that the reinforcing fibers are oriented at 90 ° with respect to the longitudinal direction of the test piece, and a universal test made by Instron.
- the 90 ° bending strength of the fiber reinforced plastic is 150 MPa or more, a high bending strength of the tubular body can be obtained in the tubular fiber reinforced plastic.
- the 90 ° bending strength of the fiber reinforced plastic may be 150 MPa or more, but is more preferably 160 MPa or more because a higher bending strength of the tubular body can be obtained.
- the epoxy resin composition of the present invention can be applied to release paper to obtain a resin film.
- the film of the present invention is useful as an intermediate material for producing a prepreg, and as a surface protective film and an adhesive film by being attached to a substrate and cured.
- a prepreg can be obtained by impregnating the reinforcing fiber base material with the epoxy resin composition of the present invention.
- the reinforcing fiber base material that can be used in the prepreg of the present invention is not limited, and carbon fiber, graphite fiber, glass fiber, organic fiber, boron fiber, steel fiber, etc. are combined with tow, cloth, chopped fiber, and continuous fiber. Aligned in the direction, woven fabric with continuous fibers as the background, aligned tow in one direction and held by weft auxiliary yarn, assisting by stacking multiple unidirectional reinforcing fiber sheets in different directions Examples include a multi-axial warp knit that is stitched with yarn and a non-woven fabric made of reinforcing fibers.
- carbon fibers and graphite fibers have good specific elastic modulus and a large effect on weight reduction is recognized, so that they can be suitably used for the prepreg of the present invention. Also, any type of carbon fiber or graphite fiber can be used depending on the application.
- a fiber reinforced plastic containing a cured product of the epoxy resin composition and reinforcing fibers can be obtained.
- Manufacturing methods for fiber reinforced plastic include processing methods such as autoclave molding, sheet wrap molding, and press molding by processing into a sheet-like molding intermediate called prepreg, and epoxy resin composition for reinforcing fiber filaments and preforms. Examples of molding methods such as RTM, VaRTM, filament winding, and RFI that impregnate and cure a product to obtain a molded product are not limited thereto.
- the fiber-reinforced plastic of the present invention can be used particularly suitably for a golf club shaft or the like that takes advantage of high breaking strength by making it tubular.
- NER-7604 (trade name): Multifunctional bisphenol F type epoxy resin, epoxy equivalent 350 g / eq, softening point 70 ° C., Nippon Kayaku Co., Ltd.
- NER-7403 (trade name): Multifunctional bisphenol F type epoxy resin, Epoxy equivalent 300 g / eq, softening point 58 ° C., Nippon Kayaku Co., Ltd.
- NER-1302 (trade name): Multifunctional bisphenol A type epoxy resin, epoxy equivalent 330 g / eq, softening point 70 ° C., Nippon Kayaku Co., Ltd. ) Made
- AER4152 (trade name “Araldite AER4152”): bifunctional epoxy resin having an oxazolidone ring in the skeleton, number average molecular weight 814, manufactured by Asahi Kasei E-Materials Co., Ltd.
- jER1001 bisphenol A type bifunctional epoxy resin, epoxy equivalent 450 g / eq or more and 500 g / eq or less, number average molecular weight 900, manufactured by Mitsubishi Chemical Corporation EHPE3150 (trade name): solid alicyclic epoxy resin, softening point: 75 ° C, manufactured by Daicel Corporation EXA-1514 (trade name) : Bisphenol S type epoxy resin, softening point: 75 ° C, manufactured by DIC Corporation EXA-1517 (trade name): Bisphenol S type epoxy resin, softening point: 60 ° C, manufactured by DIC Corporation jER4004P (trade name): bisphenol F type bifunctional epoxy resin, epoxy equivalent 840g / q above 975 g / eq or less, a softening point: 85 ° C., manufactured by Mitsubishi Chemical Corporation
- a catalyst resin composition is prepared by uniformly dispersing a component (D) and a component (E) shown in the table in a part of the liquid epoxy resin component contained in the resin composition shown in Table 1 with a three-roll mill. did.
- the catalyst resin composition prepared in advance and the remainder of the liquid epoxy resin component are weighed and added uniformly and mixed at 60 ° C. To obtain an epoxy resin composition.
- ⁇ Production of cured resin plate> The epoxy resin composition obtained in ⁇ Preparation of epoxy resin composition> is sandwiched between glass plates together with a spacer made of polytetrafluoroethylene having a thickness of 2 mm, and the temperature is increased at a rate of temperature increase of 2 ° C./min.
- the cured resin plate was obtained by holding and curing at 130 ° C. for 90 minutes.
- ⁇ Composite (fiber reinforced plastic) panel manufacturing method> The epoxy resin composition obtained in ⁇ Preparation of Epoxy Resin Composition> was heated to 60 ° C. and applied to release paper with a film coater to produce a resin film. The thickness of the resin film was set so that the resin content of the prepreg was 28% by mass when a prepreg was prepared using two resin films as described later.
- a carbon fiber (manufactured by Mitsubishi Rayon Co., Ltd., TR 50S) is wound on this resin film (on the surface of the release paper on the resin film forming side) with a drum winder so that the fiber basis weight is 125 g / m 2. It was. Further, another resin film was bonded onto the carbon fiber sheet on the drum winder.
- a carbon fiber sheet sandwiched between two resin films was fused at a temperature of 100 ° C., a pressure of 0.4 MPa, and a feed rate of 3 m / min (Asahi Textile Machinery Co., Ltd., JR-600S, treatment length 1340 mm, pressure Is a cylinder pressure) to obtain a prepreg having a fiber basis weight of 125 g / m 2 and a resin content of 28% by mass.
- 18 sheets of the obtained prepreg were laminated, heated at 2 ° C./min under a pressure of 0.04 MPa in an autoclave, held at 80 ° C. for 60 minutes, further heated at 2 ° C./min, and increased to 130 ° C. Warm and heat cure for 90 minutes under a pressure of 0.6 MPa to obtain a fiber reinforced plastic panel.
- the test piece is arranged as follows so that the reinforcing fibers are oriented at 0 ° or 90 ° with respect to the longitudinal direction of the test piece.
- the flexural modulus of the resin is higher than 3.3 GPa
- the breaking strain of the resin is 9% or more
- the 90 ° bending strength of the fiber reinforced plastic is 150 MPa or more
- the fiber reinforced plastic was 1.8% or more.
- the breaking strain is lower than 9%
- the 90 ° bending strength of the fiber reinforced plastic of Comparative Example 1 is less than 150 MPa
- Comparative Example 2 the 90 ° bending strength of the fiber reinforced plastic is less than 150 MPa. It was.
- An excellent tubular fiber-reinforced plastic can be obtained by using the epoxy resin composition of the present invention. Therefore, according to the present invention, a wide range of fiber reinforced plastic molded articles having excellent mechanical properties, such as molded articles for sports / leisure use such as golf club shafts, and industrial use such as aircraft can be provided.
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Abstract
Description
本願は、2014年12月25日に、日本に出願された特願2014-261453号に基づき優先権を主張し、その内容をここに援用する。
〔1〕 下記成分(A)、(C)及び(D)を含むエポキシ樹脂組成物。
成分(A)下記一般式(1)で示されるエポキシ樹脂
成分(C)25℃で液状である成分(A)以外のエポキシ樹脂
成分(D)硬化剤
成分(B)25℃で固形である成分(A)以外のエポキシ樹脂。
〔3〕 前記エポキシ樹脂組成物に含まれるエポキシ樹脂の合計量100質量部に対する前記成分(A)の含有量が1質量部以上80質量部以下である、〔1〕又は〔2〕に記載のエポキシ樹脂組成物。
〔4〕 前記成分(B)が、軟化点または融点が50℃以上の固形エポキシ樹脂である、〔2〕又は〔3〕に記載のエポキシ樹脂組成物。
〔5〕 前記成分(B)が、ビスフェノールA型エポキシ樹脂、ビスフェノールF型エポキシ樹脂、ビスフェノールS型エポキシ樹脂、オキサゾリドン環型エポキシ樹脂及び脂環式エポキシ樹脂からなる群から選ばれる少なくとも1種のエポキシ樹脂である、〔2〕~〔4〕のいずれか一項に記載のエポキシ樹脂組成物。
〔6〕前記成分(B)として、下記一般式(2)で表される脂環式エポキシ樹脂を含有する、〔2〕~〔5〕のいずれか一項に記載のエポキシ樹脂組成物。
〔8〕 前記エポキシ樹脂組成物に含まれるエポキシ樹脂の合計量100質量部に対する前記成分(B)の含有量が5質量部以上60質量部以下である、〔2〕~〔7〕のいずれか一項に記載のエポキシ樹脂組成物。
〔9〕 前記成分(C)が、2官能以上のエポキシ樹脂である、〔1〕~〔8〕のいずれか一項に記載のエポキシ樹脂組成物。
〔10〕 前記成分(C)が、ビスフェノール型エポキシ樹脂である、〔9〕に記載のエポキシ樹脂組成物。
〔11〕 前記エポキシ樹脂組成物に含まれるエポキシ樹脂の合計量100質量部に対する前記成分(C)の含有量が20質量部以上99質量部以下である、〔1〕~〔10〕のいずれか一項に記載のエポキシ樹脂組成物。
〔12〕 前記成分(D)がジシアンジアミドである、〔1〕~〔11〕のいずれか一項に記載のエポキシ樹脂組成物。
〔13〕 さらに、成分(E)として、ウレア系硬化助剤を含む、〔1〕~〔12〕のいずれか一項に記載のエポキシ樹脂組成物。
〔14〕 前記エポキシ樹脂組成物中に含まれるエポキシ樹脂の総量100質量部に対して、熱可塑性樹脂を0.1~10質量部含有する、〔1〕~〔13〕のいずれか一項に記載のエポキシ樹脂組成物。
〔15〕 前記熱可塑性樹脂が、フェノキシ樹脂、ポリビニルアセタール樹脂、ポリ(メチルメタクリレート)/ポリ(ブチルアクリレート)/ポリ(メチルメタクリレート)のトリブロック共重合体、ポリ(スチレン)/ポリ(ブタジエン)/ポリ(メタクリル酸メチル)のトリブロック共重合体からなる群から選ばれる少なくとも1種である、〔14〕に記載のエポキシ樹脂組成物。
〔16〕 〔1〕~〔15〕のいずれか一項に記載のエポキシ樹脂組成物からなるフィルム。
〔17〕 〔1〕~〔15〕のいずれか一項に記載のエポキシ樹脂組成物が強化繊維基材に含浸されたプリプレグ。
〔18〕 〔1〕~〔15〕のいずれか一項に記載のエポキシ樹脂組成物の硬化物と強化繊維からなる繊維強化プラスチック。
〔19〕 管状である〔18〕に記載の繊維強化プラスチック。
〔20〕 エポキシ樹脂及び硬化剤を含有し、かつ下記(1)~(4)を満たすエポキシ樹脂組成物。
(1)前記エポキシ樹脂組成物の硬化物の曲げ弾性率が3.3GPa以上
(2)前記エポキシ樹脂組成物の硬化物の曲げ破断歪が9%以上
(3)前記エポキシ樹脂組成物の硬化物と、連続繊維である炭素繊維が一方向に引き揃えられた強化繊維基材からなる繊維強化プラスチックの、90°曲げ強度が150MPa以上
(4)上記(3)に記載の繊維強化プラスチックの、90°曲げ破断歪が1.8%以上
成分(C)25℃で液状である成分(A)以外のエポキシ樹脂
成分(D)硬化剤
「成分(A):下記一般式(1)で示されるエポキシ樹脂」
本発明のエポキシ樹脂組成物は、成分(A)として下記一般式(1)で示されるエポキシ樹脂を含有する。
これら成分(A)は、1種または2種以上を適宜選択して使用することができるが、樹脂曲げ弾性率を向上させる点から、下記一般式(1a)で示されるエポキシ樹脂(例えば、NER-7604、NER-7403)が好ましく、さらに、樹脂曲げ破断歪を向上させる点から、kとjの総和が5以上であることが好ましく、NER-7604が特に好ましい。
本発明のエポキシ樹脂組成物は、必要に応じて、成分(B)として25℃で固形のエポキシ樹脂を含有することができる。
この25℃で固形のエポキシ樹脂は、前記エポキシ樹脂組成物の硬化物の曲げ弾性率及び耐熱性をより高め、かつ繊維強化プラスチックのマトリックス樹脂に用いる場合に、強化繊維へのマトリックス樹脂の接着性をより高めることができる。
これは、成分(B)の軟化点または融点が50℃以上のものを使用することによって、プリプレグに適度なタックが得られ、取扱い性を良好となる傾向にあるためである。より好ましくは60℃以上であり、さらに好ましくは70℃以上である。また、成分(B)の軟化点または融点は、他成分との相溶性が良好となる点から160℃以下とするのが好ましい。より好ましくは、150℃以下である。
また、成分(B)として使用することのできるビスフェノールF型エポキシ樹脂としては、例えば、jER4004P(軟化点:85℃)、jER4007P(軟化点:108℃)、jER4010P(軟化点:135℃)(以上、三菱化学(株)製)等を挙げることができる。
さらに、成分(B)として使用することのできるビスフェノールS型エポキシ樹脂としては、例えば、EXA-1514(軟化点:75℃)、EXA-1517(軟化点:60℃)(以上、DIC(株)製)等を挙げることができる。
また、成分(B)として使用することのできるオキサゾリドン環型エポキシ樹脂としては、例えば、AER4152(軟化点:98℃)、XAC4151(軟化点:98℃)(以上、旭化成イーマテルアル(株)製)、ACR1348(株式会社ADEKA製)、DER858(DOW社製、軟化点:100℃)等を挙げることができる。
これは、成分(B)の量が5質量部以上であれば、本発明のエポキシ樹脂組成物の硬化物の曲げ弾性率及び耐熱性をより高め、かつこれを繊維強化プラスチックのマトリックス樹脂に用いる場合に、強化繊維へのマトリックス樹脂の接着性をより高めることができる傾向にあるためである。また、成分(B)の量を60質量部以下とすることによって、プリプレグの製造工程における樹脂の含浸性に優れ、得られるプリプレグの取扱い性(タック性、ドレープ性、マンドレルへの巻き付け性)が良好となるとともに、繊維強化複合材料の物性も良好となる傾向あるためである。
この成分(C)は、本発明のエポキシ樹脂組成物の粘度を適切な範囲に容易に制御することができ、前記エポキシ樹脂組成物を含むプリプレグのタック性を調整し、また、成分(C)の使用によって、このプリプレグから繊維強化プラスチックを製造した時にボイドの少ない成形品を得ることができる。
本発明のエポキシ樹脂組成物は、成分(D)として硬化剤を含有する。
成分(D)の硬化剤の種類は、特に限定されず、アミン系硬化剤、イミダゾール類、酸無水物、塩化ホウ素アミン錯体等を挙げることができるが、中でもジシアンジアミドを用いるのが、硬化前のエポキシ樹脂組成物の湿気による性能変化がなく、長期安定性をもちながら比較的低温で硬化を完了することができる傾向にあるので好ましい。ジシアンジアミドの好ましい配合量は、エポキシ樹脂組成物に配合される全てのエポキシ樹脂に由来するエポキシ基のモル数に対し、ジシアンジアミドの活性水素のモル数が0.6倍以上1倍以下となる配合量であることが良好な機械物性を発現する硬化物が得られる点から好ましい。さらに0.6倍以上0.8倍以下であると耐熱性に優れるのでさらに好ましい。
本発明のエポキシ樹脂組成物は、更に成分(E)としてウレア系硬化助剤を用いてもよい。
特に成分(D)としてジシアンジアミドを用い、これに成分(E):ウレア系硬化助剤を併用することで、低温でも短時間にエポキシ樹脂組成物を硬化完了することができ好ましい。
本発明のエポキシ樹脂組成物には、さらに熱可塑性樹脂を必要に応じて含有させることができる。この熱可塑性樹脂により、硬化物の樹脂曲げ破断歪を向上させることができる傾向にある。
この熱可塑性樹脂としては、例えば、フェノキシ樹脂、ポリビニルアセタール樹脂、ポリ(メチルメタクリレート)/ポリ(ブチルアクリレート)/ポリ(メチルメタクリレート)のトリブロック共重合体、ポリ(スチレン)/ポリ(ブタジエン)/ポリ(メタクリル酸メチル)のトリブロック共重合体等から適宜選択して使用することができるが、フェノキシ樹脂を使用することによって、上述の硬化物の樹脂曲げ破断歪と樹脂曲げ弾性率を両立させることができる傾向にある。
本発明のエポキシ樹脂組成物には、本発明の効果を損なわない範囲で、成分(A)、成分(B)、成分(C)のいずれかとして列挙された上述のエポキシ樹脂以外のエポキシ系樹脂(以下、「その他エポキシ樹脂」と称する。)を含有していても良い。
本発明のエポキシ樹脂組成物は、本発明の効果を損なわない範囲で、前記熱可塑性樹脂以外の熱可塑性樹脂、熱可塑性エラストマーおよびエラストマーからなる群から選ばれた1種以上の添加剤を含有していてもよい。このような添加剤によって、本発明のエポキシ樹脂組成物の粘弾性を変化させて、粘度、貯蔵弾性率およびチキソトロープ性を適正化することができるとともに、本発明のエポキシ樹脂組成物の硬化物の靭性を向上させることもできる。添加剤として用いられる熱可塑性樹脂、熱可塑性エラストマーまたはエラストマーは、単独で使用してもよいし2種以上を併用してもよい。また、エポキシ樹脂成分中に溶解して配合されてもよく、微粒子、長繊維、短繊維、織物、不織布、メッシュ、パルプなどの形状でエポキシ樹脂組成物中に含まれていても良い。添加剤が、微粒子、長繊維、短繊維、織物、不織布、メッシュ、パルプなどの形状でプリプレグの表層に配置される場合には、繊維強化プラスチックの層間剥離を抑制することができるので好ましい。
(1)前記エポキシ樹脂組成物の硬化物の曲げ弾性率が3.3GPa以上
(2)前記エポキシ樹脂組成物の硬化物の曲げ破断歪が9%以上
(3)前記エポキシ樹脂組成物の硬化物と、連続繊維である炭素繊維が一方向に引き揃えられた強化繊維基材からなる繊維強化プラスチックの、90°曲げ強度が150MPa以上
(4)上記(3)に記載の繊維強化プラスチックの、90°曲げ破断歪が1.8%以上
本発明のエポキシ樹脂組成物は、上記の物性を有することによって、特に、管状の繊維強化プラスチックへの利用に適するものである。
本発明における樹脂の曲げ弾性率は、以下方法において測定された値である。
樹脂の曲げ破断歪は、以下方法において測定された値である。
繊維強化プラスチックの90°曲げ強度は、以下方法にて測定された値である。
炭素繊維を一方向に引き揃え、繊維目付が125g/m2、樹脂含有量が28質量%のプリプレグを作製し、これを硬化して得た繊維強化プラスチックパネルを作製する。
さらに繊維強化プラスチックの90°曲げ破断歪が1.8%以上であると、高い管状体の曲げ強度が得られる。より好ましくは1.9%以上である。
成分(A):
NER-7604(商品名):多官能ビスフェノールF型エポキシ樹脂、エポキシ当量350g/eq、軟化点70℃、日本化薬(株)製
NER-7403(商品名):多官能ビスフェノールF型エポキシ樹脂、エポキシ当量300g/eq、軟化点58℃、日本化薬(株)製
NER-1302(商品名):多官能ビスフェノールA型エポキシ樹脂、エポキシ当量330g/eq、軟化点70℃、日本化薬(株)製
AER4152(商品名「アラルダイトAER4152」):骨格中にオキサゾリドン環を持つ2官能エポキシ樹脂、数平均分子量814、旭化成イーマテリアルズ株式会社製
jER1001(商品名):ビスフェノールA型2官能エポキシ樹脂、エポキシ当量450g/eq以上500g/eq以下、数平均分子量900、三菱化学(株)製
EHPE3150(商品名):固形脂環式エポキシ樹脂、軟化点:75℃、株式会社ダイセル製
EXA-1514(商品名):ビスフェノールS型エポキシ樹脂、軟化点:75℃、DIC(株)製
EXA-1517(商品名):ビスフェノールS型エポキシ樹脂、軟化点:60℃、DIC(株)製
jER4004P(商品名):ビスフェノールF型2官能エポキシ樹脂、エポキシ当量840g/eq以上975g/eq以下、軟化点:85℃、三菱化学(株)製
jER828(商品名):ビスフェノールA型2官能エポキシ樹脂、エポキシ当量189g/eq、三菱化学(株)製
jER807(商品名):ビスフェノールF型2官能エポキシ樹脂、エポキシ当量167g/eq、三菱化学(株)製
熱可塑性樹脂:
YP-50S(商品名):フェノキシ樹脂、質量平均分子量50,000以上70,000以下、新日鉄住金化学(株)製
M52N(商品名「NanostrengthM52N」)、アクリル系ブロック共重合体(ポリ(メチルメタクリレート)/ポリ(ブチルアクリレート)/ポリ(メチルメタクリレート)のトリブロック共重合体であり、さらにジメチルアクリルアミドが共重合したもの、アルケマ(株)製
DICY15(商品名):ジシアンジアミド、三菱化学(株)製
DCMU99(商品名):3-(3,4-ジクロロフェニル)-1,1-ジメチルウレア、保土谷化学工業(株)製
Omicure94(商品名):3-フェニル-1,1-ジメチルウレア、PTIジャパン(株)製
以下の手順でエポキシ樹脂組成物を調製し、これを用いて樹脂の曲げ弾性率、樹脂の曲げ破断歪み、及び繊維強化プラスチックの曲げ強度を測定した。樹脂組成および測定(評価)結果を表1に示す。
表1に示す樹脂組成に含まれる液体状のエポキシ樹脂成分の一部に、同表に示す成分(D)および成分(E)を3本ロールミルで均一に分散させて、触媒樹脂組成物を調製した。
表1に示す樹脂組成に含まれる固体状のエポキシ樹脂成分の一部と、液体状のエポキシ樹脂成分の残部の一部、及び熱可塑性樹脂を、160℃にて加熱混合することで均一なマスターバッチ(1)を得た。
上述の<エポキシ樹脂組成物の調製>にて得られたエポキシ樹脂組成物を、厚さ2mmのポリテトラフルオロエチレン製のスペーサーと共にガラス板で挟んで、昇温速度2℃/分で昇温し、130℃で90分保持して硬化させることにより硬化樹脂板を得た。
上述の<硬化樹脂板の作製>にて得られた厚み2mmの硬化樹脂板を、試験片(長さ60mm×幅8mm)に加工し、500Nロードセルを備えたINSTRON 4465測定機を用い、温度23℃、湿度50%RHの環境下、3点曲げ治具(圧子R=3.2mm、サポートR=3.2mm)を用い、サポート間距離(L)と試験片の厚み(d)の比L/d=16の条件で試験片を曲げ、弾性率および最大荷重時の歪および破断歪を得た。結果を表1に示す。
上述の<エポキシ樹脂組成物の調製>にて得られた、エポキシ樹脂組成物を60℃に加温し、フィルムコーターで離型紙に塗布して樹脂フィルムを作製した。前記樹脂フィルムの厚みは、後述するように前記樹脂フィルムを2枚用いてプリプレグを作製した場合に、前記プリプレグの樹脂含有率が28質量%となるよう設定した。
上述の<コンポジット(繊維強化プラスチック)パネル作製方法>にて得られた繊維強化プラスチックパネルを、試験片の長手方向に対して補強繊維が0°または90゜に配向するように試験片を下記の大きさに加工し、インストロン社製の万能試験機を用い、温度23℃、湿度50%RHの環境下、3点曲げ治具(圧子R=5mm、サポートR=3.2mm)を用い、サポート間距離(L)と試験片の厚み(d)の比L/dを下記の条件で、クロスヘッドスピード(分速)=(L2×0.01)/(6×d)の条件で試験片を曲げ、0°及び90°における曲げ強度、弾性率及び破断歪を得た。0°曲げ特性はVf60%となるよう換算した。結果を表1に示す。
90°曲げ特性評価用:長さ60mm×幅12.7mm、L/d=16
上記の手順でエポキシ樹脂組成物を調製し、これを用いて樹脂の曲げ弾性率、樹脂の曲げ破断歪みを上記の方法で測定した。樹脂組成および測定(評価)結果を表2に示す。
Claims (20)
- さらに、下記成分(B)を含む、請求項1記載のエポキシ樹脂組成物。
成分(B)25℃で固形である成分(A)以外のエポキシ樹脂 - 前記エポキシ樹脂組成物に含まれるエポキシ樹脂の合計量100質量部に対する前記成分(A)の含有量が1質量部以上80質量部以下である、請求項1又は2に記載のエポキシ樹脂組成物。
- 前記成分(B)が、軟化点または融点が50℃以上の固形エポキシ樹脂である、請求項2又は3に記載のエポキシ樹脂組成物。
- 前記成分(B)が、ビスフェノールA型エポキシ樹脂、ビスフェノールF型エポキシ樹脂、ビスフェノールS型エポキシ樹脂、オキサゾリドン環型エポキシ樹脂及び脂環式エポキシ樹脂からなる群から選ばれる少なくとも1種のエポキシ樹脂である、請求項2~4のいずれか一項に記載のエポキシ樹脂組成物。
- 前記脂環式エポキシ樹脂として、2,2-ビス(ヒドロキシメチル)-1-ブタノールの1,2-エポキシ-4-(2-オキシラニル)シクロヘキサン付加物を含有する、請求項6に記載のエポキシ樹脂組成物。
- 前記エポキシ樹脂組成物に含まれるエポキシ樹脂の合計量100質量部に対する前記成分(B)の含有量が5質量部以上60質量部以下である、請求項2~7のいずれか一項に記載のエポキシ樹脂組成物。
- 前記成分(C)が、2官能以上のエポキシ樹脂である、請求項1~8のいずれか一項に記載のエポキシ樹脂組成物。
- 前記成分(C)が、ビスフェノール型エポキシ樹脂である、請求項9に記載のエポキシ樹脂組成物。
- 前記エポキシ樹脂組成物に含まれるエポキシ樹脂の合計量100質量部に対する前記成分(C)の含有量が20質量部以上99質量部以下である、請求項1~10のいずれか一項に記載のエポキシ樹脂組成物。
- 前記成分(D)がジシアンジアミドである、請求項1~11のいずれか一項に記載のエポキシ樹脂組成物。
- さらに、成分(E)として、ウレア系硬化助剤を含む、請求項1~12のいずれか一項に記載のエポキシ樹脂組成物。
- 前記エポキシ樹脂組成物中に含まれるエポキシ樹脂の総量100質量部に対して、熱可塑性樹脂を0.1質量部以上10質量部以下含有する、請求項1~13のいずれか一項に記載のエポキシ樹脂組成物。
- 前記熱可塑性樹脂が、フェノキシ樹脂、ポリビニルアセタール樹脂、ポリ(メチルメタクリレート)/ポリ(ブチルアクリレート)/ポリ(メチルメタクリレート)のトリブロック共重合体、ポリ(スチレン)/ポリ(ブタジエン)/ポリ(メタクリル酸メチル)のトリブロック共重合体からなる群から選ばれる少なくとも1種である、請求項14に記載のエポキシ樹脂組成物。
- 請求項1~15のいずれか一項に記載のエポキシ樹脂組成物からなるフィルム。
- 請求項1~15のいずれか一項に記載のエポキシ樹脂組成物が強化繊維基材に含浸されたプリプレグ。
- 請求項1~15のいずれか一項に記載のエポキシ樹脂組成物の硬化物と強化繊維からなる繊維強化プラスチック。
- 管状である請求項18に記載の繊維強化プラスチック。
- エポキシ樹脂及び硬化剤を含有し、かつ下記(1)~(4)を満たすエポキシ樹脂組成物。
(1)前記エポキシ樹脂組成物の硬化物の曲げ弾性率が3.3GPa以上
(2)前記エポキシ樹脂組成物の硬化物の曲げ破断歪が9%以上
(3)前記エポキシ樹脂組成物の硬化物と、連続繊維である炭素繊維が一方向に引き揃えられた強化繊維基材からなる繊維強化プラスチックの、90°曲げ強度が150MPa以上
(4)上記(3)に記載の繊維強化プラスチックの、90°曲げ破断歪が1.8%以上
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Cited By (5)
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WO2018117214A1 (ja) * | 2016-12-21 | 2018-06-28 | 三菱ケミカル株式会社 | 硬化性樹脂組成物、並びにこれを用いたフィルム、成形品、プリプレグ及び繊維強化プラスチック |
WO2019087877A1 (ja) | 2017-11-02 | 2019-05-09 | 日鉄ケミカル&マテリアル株式会社 | エポキシ樹脂組成物及びその硬化物 |
EP3628701A1 (en) | 2018-09-28 | 2020-04-01 | NIPPON STEEL Chemical & Material Co., Ltd. | Prepreg and molding product thereof |
EP3766926A4 (en) * | 2018-03-20 | 2022-01-26 | Toray Industries, Inc. | Prepreg and fiber-reinforced composite material |
US11427707B2 (en) * | 2017-09-29 | 2022-08-30 | Nippon Steel Chemical & Material Co., Ltd. | Curable epoxy resin composition and fiber-reinforced composite material using same |
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US11603442B2 (en) | 2018-12-04 | 2023-03-14 | Suncorona Oda Co., Ltd. | Fiber-reinforced thermoplastic resin sheet, molded body of fiber-reinforced thermoplastic resin sheet, and manufacturing method of fiber-reinforced thermoplastic resin sheet |
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JPWO2016104314A1 (ja) | 2017-04-27 |
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CN107001586B (zh) | 2020-12-01 |
KR20170085573A (ko) | 2017-07-24 |
CN107001586A (zh) | 2017-08-01 |
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US20170369700A1 (en) | 2017-12-28 |
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