WO2016051914A1 - 光硬化性樹脂組成物 - Google Patents
光硬化性樹脂組成物 Download PDFInfo
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- WO2016051914A1 WO2016051914A1 PCT/JP2015/069957 JP2015069957W WO2016051914A1 WO 2016051914 A1 WO2016051914 A1 WO 2016051914A1 JP 2015069957 W JP2015069957 W JP 2015069957W WO 2016051914 A1 WO2016051914 A1 WO 2016051914A1
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- Prior art keywords
- component
- resin composition
- photocurable resin
- meth
- acrylate
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- 239000011342 resin composition Substances 0.000 title claims abstract description 64
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 claims abstract description 87
- -1 tertiary amine compound Chemical class 0.000 claims abstract description 64
- 150000001875 compounds Chemical class 0.000 claims abstract description 16
- 239000003999 initiator Substances 0.000 claims abstract description 6
- 150000003512 tertiary amines Chemical group 0.000 claims abstract description 5
- 239000000463 material Substances 0.000 claims description 13
- 239000003505 polymerization initiator Substances 0.000 claims description 13
- KWOLFJPFCHCOCG-UHFFFAOYSA-N Acetophenone Chemical compound CC(=O)C1=CC=CC=C1 KWOLFJPFCHCOCG-UHFFFAOYSA-N 0.000 claims description 10
- 239000000853 adhesive Substances 0.000 claims description 9
- 230000001070 adhesive effect Effects 0.000 claims description 9
- 239000003795 chemical substances by application Substances 0.000 claims description 9
- 239000000178 monomer Substances 0.000 claims description 9
- 229920005989 resin Polymers 0.000 claims description 9
- 239000011347 resin Substances 0.000 claims description 9
- 238000005266 casting Methods 0.000 claims description 8
- 150000003839 salts Chemical class 0.000 claims description 8
- 239000011248 coating agent Substances 0.000 claims description 7
- 238000000576 coating method Methods 0.000 claims description 7
- ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical compound CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 claims description 6
- PAMIQIKDUOTOBW-UHFFFAOYSA-N 1-methylpiperidine Chemical compound CN1CCCCC1 PAMIQIKDUOTOBW-UHFFFAOYSA-N 0.000 claims description 4
- XLPJNCYCZORXHG-UHFFFAOYSA-N 1-morpholin-4-ylprop-2-en-1-one Chemical compound C=CC(=O)N1CCOCC1 XLPJNCYCZORXHG-UHFFFAOYSA-N 0.000 claims description 4
- JLTDJTHDQAWBAV-UHFFFAOYSA-N N,N-dimethylaniline Chemical compound CN(C)C1=CC=CC=C1 JLTDJTHDQAWBAV-UHFFFAOYSA-N 0.000 claims description 4
- GSEJCLTVZPLZKY-UHFFFAOYSA-N Triethanolamine Chemical compound OCCN(CCO)CCO GSEJCLTVZPLZKY-UHFFFAOYSA-N 0.000 claims description 4
- 125000005410 aryl sulfonium group Chemical group 0.000 claims description 4
- CRVGTESFCCXCTH-UHFFFAOYSA-N methyl diethanolamine Chemical compound OCCN(C)CCO CRVGTESFCCXCTH-UHFFFAOYSA-N 0.000 claims description 4
- GETQZCLCWQTVFV-UHFFFAOYSA-N trimethylamine Chemical compound CN(C)C GETQZCLCWQTVFV-UHFFFAOYSA-N 0.000 claims description 4
- OJPDDQSCZGTACX-UHFFFAOYSA-N 2-[n-(2-hydroxyethyl)anilino]ethanol Chemical compound OCCN(CCO)C1=CC=CC=C1 OJPDDQSCZGTACX-UHFFFAOYSA-N 0.000 claims description 3
- SLINHMUFWFWBMU-UHFFFAOYSA-N Triisopropanolamine Chemical compound CC(O)CN(CC(C)O)CC(C)O SLINHMUFWFWBMU-UHFFFAOYSA-N 0.000 claims description 3
- 239000000203 mixture Substances 0.000 claims description 3
- 125000006203 morpholinoethyl group Chemical group [H]C([H])(*)C([H])([H])N1C([H])([H])C([H])([H])OC([H])([H])C1([H])[H] 0.000 claims description 3
- 238000004382 potting Methods 0.000 claims description 3
- 238000007789 sealing Methods 0.000 claims description 3
- JKNCOURZONDCGV-UHFFFAOYSA-N 2-(dimethylamino)ethyl 2-methylprop-2-enoate Chemical compound CN(C)CCOC(=O)C(C)=C JKNCOURZONDCGV-UHFFFAOYSA-N 0.000 claims description 2
- OZICRFXCUVKDRG-UHFFFAOYSA-N 2-[2-hydroxyethyl(propyl)amino]ethanol Chemical compound CCCN(CCO)CCO OZICRFXCUVKDRG-UHFFFAOYSA-N 0.000 claims description 2
- GVNHOISKXMSMPX-UHFFFAOYSA-N 2-[butyl(2-hydroxyethyl)amino]ethanol Chemical compound CCCCN(CCO)CCO GVNHOISKXMSMPX-UHFFFAOYSA-N 0.000 claims description 2
- JUVSRZCUMWZBFK-UHFFFAOYSA-N 2-[n-(2-hydroxyethyl)-4-methylanilino]ethanol Chemical compound CC1=CC=C(N(CCO)CCO)C=C1 JUVSRZCUMWZBFK-UHFFFAOYSA-N 0.000 claims description 2
- SJIXRGNQPBQWMK-UHFFFAOYSA-N DEAEMA Natural products CCN(CC)CCOC(=O)C(C)=C SJIXRGNQPBQWMK-UHFFFAOYSA-N 0.000 claims description 2
- SVYKKECYCPFKGB-UHFFFAOYSA-N N,N-dimethylcyclohexylamine Chemical compound CN(C)C1CCCCC1 SVYKKECYCPFKGB-UHFFFAOYSA-N 0.000 claims description 2
- AKNUHUCEWALCOI-UHFFFAOYSA-N N-ethyldiethanolamine Chemical compound OCCN(CC)CCO AKNUHUCEWALCOI-UHFFFAOYSA-N 0.000 claims description 2
- REUQOSNMSWLNPD-UHFFFAOYSA-N [2-(diethylamino)phenyl]-phenylmethanone Chemical compound CCN(CC)C1=CC=CC=C1C(=O)C1=CC=CC=C1 REUQOSNMSWLNPD-UHFFFAOYSA-N 0.000 claims description 2
- RVWADWOERKNWRY-UHFFFAOYSA-N [2-(dimethylamino)phenyl]-phenylmethanone Chemical compound CN(C)C1=CC=CC=C1C(=O)C1=CC=CC=C1 RVWADWOERKNWRY-UHFFFAOYSA-N 0.000 claims description 2
- XXBDWLFCJWSEKW-UHFFFAOYSA-N dimethylbenzylamine Chemical compound CN(C)CC1=CC=CC=C1 XXBDWLFCJWSEKW-UHFFFAOYSA-N 0.000 claims description 2
- GYVGXEWAOAAJEU-UHFFFAOYSA-N n,n,4-trimethylaniline Chemical compound CN(C)C1=CC=C(C)C=C1 GYVGXEWAOAAJEU-UHFFFAOYSA-N 0.000 claims description 2
- IMFACGCPASFAPR-UHFFFAOYSA-N tributylamine Chemical compound CCCCN(CCCC)CCCC IMFACGCPASFAPR-UHFFFAOYSA-N 0.000 claims description 2
- BFIAIMMAHAIVFT-UHFFFAOYSA-N 1-[bis(2-hydroxybutyl)amino]butan-2-ol Chemical compound CCC(O)CN(CC(O)CC)CC(O)CC BFIAIMMAHAIVFT-UHFFFAOYSA-N 0.000 claims 1
- UMLWXYJZDNNBTD-UHFFFAOYSA-N alpha-dimethylaminoacetophenone Natural products CN(C)CC(=O)C1=CC=CC=C1 UMLWXYJZDNNBTD-UHFFFAOYSA-N 0.000 claims 1
- 238000003860 storage Methods 0.000 abstract description 21
- 239000000047 product Substances 0.000 description 30
- 239000002253 acid Substances 0.000 description 13
- 239000000126 substance Substances 0.000 description 11
- 150000001450 anions Chemical class 0.000 description 10
- 125000004432 carbon atom Chemical group C* 0.000 description 9
- 238000002156 mixing Methods 0.000 description 9
- 150000003254 radicals Chemical class 0.000 description 9
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 8
- 239000000843 powder Substances 0.000 description 8
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 7
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 6
- 239000007983 Tris buffer Substances 0.000 description 6
- 125000000217 alkyl group Chemical group 0.000 description 6
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 5
- 239000005062 Polybutadiene Substances 0.000 description 5
- 230000000052 comparative effect Effects 0.000 description 5
- 238000011156 evaluation Methods 0.000 description 5
- ZFSLODLOARCGLH-UHFFFAOYSA-N isocyanuric acid Chemical compound OC1=NC(O)=NC(O)=N1 ZFSLODLOARCGLH-UHFFFAOYSA-N 0.000 description 5
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 5
- 229910052753 mercury Inorganic materials 0.000 description 5
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 4
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 description 4
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 4
- 230000001588 bifunctional effect Effects 0.000 description 4
- 239000006229 carbon black Substances 0.000 description 4
- VFHVQBAGLAREND-UHFFFAOYSA-N diphenylphosphoryl-(2,4,6-trimethylphenyl)methanone Chemical compound CC1=CC(C)=CC(C)=C1C(=O)P(=O)(C=1C=CC=CC=1)C1=CC=CC=C1 VFHVQBAGLAREND-UHFFFAOYSA-N 0.000 description 4
- 239000000945 filler Substances 0.000 description 4
- 229910021485 fumed silica Inorganic materials 0.000 description 4
- 125000002768 hydroxyalkyl group Chemical group 0.000 description 4
- WXZMFSXDPGVJKK-UHFFFAOYSA-N pentaerythritol Chemical class OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 description 4
- 239000011734 sodium Substances 0.000 description 4
- 229910052708 sodium Inorganic materials 0.000 description 4
- 239000003381 stabilizer Substances 0.000 description 4
- 125000001424 substituent group Chemical group 0.000 description 4
- AZQWKYJCGOJGHM-UHFFFAOYSA-N 1,4-benzoquinone Chemical compound O=C1C=CC(=O)C=C1 AZQWKYJCGOJGHM-UHFFFAOYSA-N 0.000 description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 3
- RRHGJUQNOFWUDK-UHFFFAOYSA-N Isoprene Chemical compound CC(=C)C=C RRHGJUQNOFWUDK-UHFFFAOYSA-N 0.000 description 3
- MUBZPKHOEPUJKR-UHFFFAOYSA-N Oxalic acid Chemical compound OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 description 3
- ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 description 3
- 239000002318 adhesion promoter Substances 0.000 description 3
- 239000003963 antioxidant agent Substances 0.000 description 3
- 235000006708 antioxidants Nutrition 0.000 description 3
- 125000004386 diacrylate group Chemical group 0.000 description 3
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 229910052731 fluorine Inorganic materials 0.000 description 3
- 125000001153 fluoro group Chemical group F* 0.000 description 3
- NWVVVBRKAWDGAB-UHFFFAOYSA-N p-methoxyphenol Chemical compound COC1=CC=C(O)C=C1 NWVVVBRKAWDGAB-UHFFFAOYSA-N 0.000 description 3
- NFHFRUOZVGFOOS-UHFFFAOYSA-N palladium;triphenylphosphane Chemical compound [Pd].C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 NFHFRUOZVGFOOS-UHFFFAOYSA-N 0.000 description 3
- 239000000049 pigment Substances 0.000 description 3
- 229920006295 polythiol Polymers 0.000 description 3
- 239000011591 potassium Substances 0.000 description 3
- 229910052700 potassium Inorganic materials 0.000 description 3
- 238000012360 testing method Methods 0.000 description 3
- 238000002834 transmittance Methods 0.000 description 3
- DTGKSKDOIYIVQL-WEDXCCLWSA-N (+)-borneol Chemical group C1C[C@@]2(C)[C@@H](O)C[C@@H]1C2(C)C DTGKSKDOIYIVQL-WEDXCCLWSA-N 0.000 description 2
- XAAILNNJDMIMON-UHFFFAOYSA-N 2'-anilino-6'-(dibutylamino)-3'-methylspiro[2-benzofuran-3,9'-xanthene]-1-one Chemical compound C=1C(N(CCCC)CCCC)=CC=C(C2(C3=CC=CC=C3C(=O)O2)C2=C3)C=1OC2=CC(C)=C3NC1=CC=CC=C1 XAAILNNJDMIMON-UHFFFAOYSA-N 0.000 description 2
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 2
- TXBCBTDQIULDIA-UHFFFAOYSA-N 2-[[3-hydroxy-2,2-bis(hydroxymethyl)propoxy]methyl]-2-(hydroxymethyl)propane-1,3-diol Chemical compound OCC(CO)(CO)COCC(CO)(CO)CO TXBCBTDQIULDIA-UHFFFAOYSA-N 0.000 description 2
- CDAWCLOXVUBKRW-UHFFFAOYSA-N 2-aminophenol Chemical compound NC1=CC=CC=C1O CDAWCLOXVUBKRW-UHFFFAOYSA-N 0.000 description 2
- VJKZIQFVKMUTID-UHFFFAOYSA-N 2-diazonio-5-sulfonaphthalen-1-olate Chemical compound N#[N+]C1=CC=C2C(S(=O)(=O)O)=CC=CC2=C1[O-] VJKZIQFVKMUTID-UHFFFAOYSA-N 0.000 description 2
- XMLYCEVDHLAQEL-UHFFFAOYSA-N 2-hydroxy-2-methyl-1-phenylpropan-1-one Chemical compound CC(C)(O)C(=O)C1=CC=CC=C1 XMLYCEVDHLAQEL-UHFFFAOYSA-N 0.000 description 2
- 125000000954 2-hydroxyethyl group Chemical group [H]C([*])([H])C([H])([H])O[H] 0.000 description 2
- OBGBGHKYJAOXRR-UHFFFAOYSA-N 2-methoxy-1,4-naphthoquinone Chemical compound C1=CC=C2C(=O)C(OC)=CC(=O)C2=C1 OBGBGHKYJAOXRR-UHFFFAOYSA-N 0.000 description 2
- RIWRBSMFKVOJMN-UHFFFAOYSA-N 2-methyl-1-phenylpropan-2-ol Chemical compound CC(C)(O)CC1=CC=CC=C1 RIWRBSMFKVOJMN-UHFFFAOYSA-N 0.000 description 2
- SXIFAEWFOJETOA-UHFFFAOYSA-N 4-hydroxy-butyl Chemical group [CH2]CCCO SXIFAEWFOJETOA-UHFFFAOYSA-N 0.000 description 2
- 229910002012 Aerosil® Inorganic materials 0.000 description 2
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- 238000006845 Michael addition reaction Methods 0.000 description 2
- 208000034189 Sclerosis Diseases 0.000 description 2
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 description 2
- JOBBTVPTPXRUBP-UHFFFAOYSA-N [3-(3-sulfanylpropanoyloxy)-2,2-bis(3-sulfanylpropanoyloxymethyl)propyl] 3-sulfanylpropanoate Chemical compound SCCC(=O)OCC(COC(=O)CCS)(COC(=O)CCS)COC(=O)CCS JOBBTVPTPXRUBP-UHFFFAOYSA-N 0.000 description 2
- QLBRROYTTDFLDX-UHFFFAOYSA-N [3-(aminomethyl)cyclohexyl]methanamine Chemical compound NCC1CCCC(CN)C1 QLBRROYTTDFLDX-UHFFFAOYSA-N 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 2
- YRKCREAYFQTBPV-UHFFFAOYSA-N acetylacetone Chemical compound CC(=O)CC(C)=O YRKCREAYFQTBPV-UHFFFAOYSA-N 0.000 description 2
- 125000005073 adamantyl group Chemical group C12(CC3CC(CC(C1)C3)C2)* 0.000 description 2
- MWPLVEDNUUSJAV-UHFFFAOYSA-N anthracene Chemical compound C1=CC=CC2=CC3=CC=CC=C3C=C21 MWPLVEDNUUSJAV-UHFFFAOYSA-N 0.000 description 2
- 230000003078 antioxidant effect Effects 0.000 description 2
- ISAOCJYIOMOJEB-UHFFFAOYSA-N benzoin Chemical compound C=1C=CC=CC=1C(O)C(=O)C1=CC=CC=C1 ISAOCJYIOMOJEB-UHFFFAOYSA-N 0.000 description 2
- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 description 2
- 229910052799 carbon Inorganic materials 0.000 description 2
- YCIMNLLNPGFGHC-UHFFFAOYSA-N catechol Chemical compound OC1=CC=CC=C1O YCIMNLLNPGFGHC-UHFFFAOYSA-N 0.000 description 2
- 238000013329 compounding Methods 0.000 description 2
- 125000000113 cyclohexyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 description 2
- 238000011161 development Methods 0.000 description 2
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- 238000001879 gelation Methods 0.000 description 2
- 235000011187 glycerol Nutrition 0.000 description 2
- FFUAGWLWBBFQJT-UHFFFAOYSA-N hexamethyldisilazane Chemical compound C[Si](C)(C)N[Si](C)(C)C FFUAGWLWBBFQJT-UHFFFAOYSA-N 0.000 description 2
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- 238000000034 method Methods 0.000 description 2
- 150000002989 phenols Chemical class 0.000 description 2
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 2
- 230000000704 physical effect Effects 0.000 description 2
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- 238000002360 preparation method Methods 0.000 description 2
- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 description 2
- BBEAQIROQSPTKN-UHFFFAOYSA-N pyrene Chemical compound C1=CC=C2C=CC3=CC=CC4=CC=C1C2=C43 BBEAQIROQSPTKN-UHFFFAOYSA-N 0.000 description 2
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- YRHRIQCWCFGUEQ-UHFFFAOYSA-N thioxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=CC=CC=C3SC2=C1 YRHRIQCWCFGUEQ-UHFFFAOYSA-N 0.000 description 2
- CNHDIAIOKMXOLK-UHFFFAOYSA-N toluquinol Chemical compound CC1=CC(O)=CC=C1O CNHDIAIOKMXOLK-UHFFFAOYSA-N 0.000 description 2
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- FJJFSGLWPPEQNH-UHFFFAOYSA-N (1,3,6-trioxo-8-propan-2-ylthiochromeno[2,3-e]isoindol-2-yl) butane-1-sulfonate Chemical compound C(C)(C)C=1C=CC=2SC=3C4=C(C=CC3C(C2C1)=O)C(N(C4=O)OS(=O)(=O)CCCC)=O FJJFSGLWPPEQNH-UHFFFAOYSA-N 0.000 description 1
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- WACNXHCZHTVBJM-UHFFFAOYSA-N 1,2,3,4,5-pentafluorobenzene Chemical compound FC1=CC(F)=C(F)C(F)=C1F WACNXHCZHTVBJM-UHFFFAOYSA-N 0.000 description 1
- KETQAJRQOHHATG-UHFFFAOYSA-N 1,2-naphthoquinone Chemical compound C1=CC=C2C(=O)C(=O)C=CC2=C1 KETQAJRQOHHATG-UHFFFAOYSA-N 0.000 description 1
- VNQNXQYZMPJLQX-UHFFFAOYSA-N 1,3,5-tris[(3,5-ditert-butyl-4-hydroxyphenyl)methyl]-1,3,5-triazinane-2,4,6-trione Chemical compound CC(C)(C)C1=C(O)C(C(C)(C)C)=CC(CN2C(N(CC=3C=C(C(O)=C(C=3)C(C)(C)C)C(C)(C)C)C(=O)N(CC=3C=C(C(O)=C(C=3)C(C)(C)C)C(C)(C)C)C2=O)=O)=C1 VNQNXQYZMPJLQX-UHFFFAOYSA-N 0.000 description 1
- XYXJKPCGSGVSBO-UHFFFAOYSA-N 1,3,5-tris[(4-tert-butyl-3-hydroxy-2,6-dimethylphenyl)methyl]-1,3,5-triazinane-2,4,6-trione Chemical compound CC1=CC(C(C)(C)C)=C(O)C(C)=C1CN1C(=O)N(CC=2C(=C(O)C(=CC=2C)C(C)(C)C)C)C(=O)N(CC=2C(=C(O)C(=CC=2C)C(C)(C)C)C)C1=O XYXJKPCGSGVSBO-UHFFFAOYSA-N 0.000 description 1
- ALVZNPYWJMLXKV-UHFFFAOYSA-N 1,9-Nonanediol Chemical compound OCCCCCCCCCO ALVZNPYWJMLXKV-UHFFFAOYSA-N 0.000 description 1
- YUTHQCGFZNYPIG-UHFFFAOYSA-N 1-[2-(2-methylprop-2-enoyloxy)ethyl]cyclohexane-1,2-dicarboxylic acid Chemical compound CC(=C)C(=O)OCCC1(C(O)=O)CCCCC1C(O)=O YUTHQCGFZNYPIG-UHFFFAOYSA-N 0.000 description 1
- IXQHENIFTAMAPT-UHFFFAOYSA-N 1-[2-(3-sulfanylbutoxy)ethyl]-1,3,5-triazinane-2,4,6-trione Chemical compound SC(CCOCCN1C(NC(NC1=O)=O)=O)C IXQHENIFTAMAPT-UHFFFAOYSA-N 0.000 description 1
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- NLYAJNPCOHFWQQ-UHFFFAOYSA-N kaolin Chemical compound O.O.O=[Al]O[Si](=O)O[Si](=O)O[Al]=O NLYAJNPCOHFWQQ-UHFFFAOYSA-N 0.000 description 1
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- 239000002904 solvent Substances 0.000 description 1
- 125000004079 stearyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
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- ISIJQEHRDSCQIU-UHFFFAOYSA-N tert-butyl 2,7-diazaspiro[4.5]decane-7-carboxylate Chemical compound C1N(C(=O)OC(C)(C)C)CCCC11CNCC1 ISIJQEHRDSCQIU-UHFFFAOYSA-N 0.000 description 1
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- 238000010998 test method Methods 0.000 description 1
- LVEOKSIILWWVEO-UHFFFAOYSA-N tetradecyl 3-(3-oxo-3-tetradecoxypropyl)sulfanylpropanoate Chemical compound CCCCCCCCCCCCCCOC(=O)CCSCCC(=O)OCCCCCCCCCCCCCC LVEOKSIILWWVEO-UHFFFAOYSA-N 0.000 description 1
- GQIUQDDJKHLHTB-UHFFFAOYSA-N trichloro(ethenyl)silane Chemical compound Cl[Si](Cl)(Cl)C=C GQIUQDDJKHLHTB-UHFFFAOYSA-N 0.000 description 1
- ZIBGPFATKBEMQZ-UHFFFAOYSA-N triethylene glycol Chemical compound OCCOCCOCCO ZIBGPFATKBEMQZ-UHFFFAOYSA-N 0.000 description 1
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- HQYALQRYBUJWDH-UHFFFAOYSA-N trimethoxy(propyl)silane Chemical compound CCC[Si](OC)(OC)OC HQYALQRYBUJWDH-UHFFFAOYSA-N 0.000 description 1
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 1
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Classifications
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- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
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- C08F220/1811—C10or C11-(Meth)acrylate, e.g. isodecyl (meth)acrylate, isobornyl (meth)acrylate or 2-naphthyl (meth)acrylate
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- C08K5/42—Sulfonic acids; Derivatives thereof
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- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
- G03F7/105—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having substances, e.g. indicators, for forming visible images
Definitions
- the present invention relates to a photocurable resin composition having excellent film thickness curability and a cured product having high concealability and excellent storage stability.
- a photo-curable resin composition having high concealability has been used as a coating material for a flexible wiring board (see JP 2013-194156 A) and a casting material for a replica of a prototype model (see JP 11-060962 A). It is frequently used for black stripes of lenticular lenses (see Japanese Patent Application Laid-Open No. 2013-082924), adhesives for assembly of electronic devices (see Japanese Patent Application Laid-Open No. 2014-025021), and the like.
- a typical method for imparting concealability to a photocurable resin composition is to add carbon black as a pigment. Although concealment is obtained, most of the active energy rays such as ultraviolet rays are carbon. Since it is absorbed by black, there is a problem that poor curability occurs when the concentration of the pigment is too high.
- Japanese Patent Application Laid-Open No. 11-060962 discloses a photosensitivity for casting containing a photo radical polymerization initiator, a leuco dye characterized by being colored with an acid, a photo acid generator, and an ethylenically unsaturated compound. It is disclosed that the cured resin has excellent thick film curability while the cured product is black. This utilizes the fact that “radical species generated by light irradiation” is faster than the generation rate of “acid generated by light irradiation”. That is, before blackening with an acid, light is transmitted to a deep portion and cured.
- One embodiment of the present invention is a photocurable resin composition containing components (A) to (E); (A) component: leuco dye (B) component: photoacid generator (C) component: radical polymerizable compound (excluding (meth) acrylate having a tertiary amine skeleton) (D) component: radical photopolymerization initiator (E) component: tertiary amine compound.
- One embodiment of the present invention is a photocurable resin composition containing components (A) to (E); (A) component: leuco dye (B) component: photoacid generator (C) component: radical polymerizable compound (excluding (meth) acrylate having a tertiary amine skeleton) (D) component: radical photopolymerization initiator (E) component: tertiary amine compound.
- the photocurable resin can have excellent storage stability.
- X to Y indicating a range means “X or more and Y or less”, “weight” and “mass”, “wt%” and “mass%”, and “part by weight” and “part by mass”. Is treated as a synonym. Unless otherwise specified, operations and physical properties are measured under conditions of room temperature (20 to 25 ° C.) / Relative humidity 40 to 50%. “(Meth) acrylate” means “acrylate” or “methacrylate”.
- the leuco dye which is the component (A) of the present invention is a compound that develops color when contacted with an acid, and can impart concealability to the cured product.
- the leuco dye can be colored black, blue, green, red, etc. depending on the type, but a leuco dye that can produce a black color is preferred from the viewpoint of excellent concealability.
- the leuco dye capable of obtaining a black color is not particularly limited, but examples thereof include 3-dibutylamino-6-methyl-7-anilinofluorane and 3-dipropylamino-6-methyl.
- Examples include dinofluorane, 3- (4-diethylamino-2-ethoxyphenyl) -3- (1-ethyl-2-methylindol-3-yl) -4-azaphthalide, and the like.
- 3-dibutylamino-6-methyl-7-anilinofluorane, 3-diethylamino-6-methyl-7 are preferred from the viewpoints of concealment of the cured product and thick film curability of the photocurable resin composition.
- -Anilinofluorane is preferred.
- (A) component of this invention S-205, BLACK305, ETAC, BLACK100, NIR BLACK78 (made by Yamada Chemical Co., Ltd.), ODB, ODB-2, ODB-4, ODB -250, Black-XV (manufactured by Yamamoto Kasei Co., Ltd.) and the like.
- a preferred blending amount of the component (A) of the present invention is in the range of 0.01 to 20 parts by mass, preferably 0.05 to 10 parts by mass with respect to 100 parts by mass of the component (C) described later. More preferably, it is 0.5 to 5 parts by mass.
- cured material can have high concealability as it is 0.01 mass part or more.
- the photocurable resin composition can have excellent thick film curability.
- the photoacid generator as the component (B) of the present invention is a compound that generates an acid such as Lewis acid or Bronsted acid by irradiation with active energy rays. It becomes possible to color the leuco dye as the component (A) by the acid generated by the component (B). Moreover, it is preferable that it is a photo-acid generator which has absorption in a wavelength range of 365 nm or more from a viewpoint that the concealability and the thick film sclerosis
- the component (B) can be roughly classified into an onium salt photoacid generator and a nonionic photoacid generator.
- the onium salt that can be used in the present invention is not particularly limited.
- hexafluoroantimonate anion, tetrafluoroborate anion, hexafluorophosphate anion, [PR 6 ] ⁇ (wherein R is independently a fluorine atom or carbon
- An anion represented by [BR 4 ] ⁇ (wherein R is a fluorinated alkyl group having 1 to 12 atoms, wherein at least one R is a fluorinated alkyl group having 1 to 12 carbon atoms).
- SbR 6] - (wherein, R is a each independently a fluorine atom or a fluorinated alkyl group having 1 to 12 carbon atoms And at least one R is a fluorinated alkyl group having 1 to 12 carbon atoms.) Having a counter anion such as an anion, hexachloroantimonate anion, trifluoromethanesulfonate ion, or fluorosulfonate ion Examples thereof include aryliodonium salts, arylsulfonium salts, and aryldiazonium salts.
- hexafluoroantimonate anion, tetrafluoroborate anion, hexafluorophosphate anion, and [PR 6 ] ⁇ are represented from the viewpoint of concealment of the cured product and thick film curability of the photocurable resin composition.
- An arylsulfonium salt having a counter anion of any one of an anion, an anion represented by [BR 4 ] — , and an anion represented by [SbR 6 ] — is preferred, and a tetrafluoroborate anion is preferred from the viewpoint of less burden on the environment.
- a hexafluorophosphate anion, an anion represented by [PR 6 ] — , or an anion represented by [BR 4 ] — is more preferred, and arylsulfonium salts having a counter anion are more preferable.
- Sulfonium-hexafluoro Such as Sufeto salts.
- onium salt photoacid generators include, for example, IRGACURE250, IRGACURE270 (manufactured by BASF), WPI-113, WPI-116, WPI-169, WPI-170, WPI-124, WPAG-638, WPAG -469, WPAG-370, WPAG-367, WPAG-336 (Wako Pure Chemical Industries, Ltd.), B2380, B2381, C1390, D2238, D2248, D2253, I0591, T1608, T1609, T2041, T2042 (Tokyo Chemical Industry Co., Ltd.) AT-6992, At-6976 (manufactured by ACETO), CPI-100, CPI-100P, CPI101A, CPI-200K, CPI-210S (manufactured by San Apro), SP-056, SP-066, SP - 30, SP-140, SP-150, SP-170, SP-171, SP-172 (manufactured by ADEKA Corporation), CD
- nonionic photoacid generator examples include phenacyl sulfone photoacid generator, o-nitrobenzyl ester photoacid generator, iminosulfonate photoacid generator, and sulfonate ester of N-hydroxyimide.
- examples thereof include, but are not limited to, photo acid generators. These can be used alone or in combination of two or more.
- nonionic photoacid generator examples include sulfonyldiazomethane, oxime sulfonate, imide sulfonate, 2-nitrobenzyl sulfonate, disulfone, pyrogallol sulfonate, p-nitrobenzyl-9,10-dimethoxyanthracene-2-sulfonate N-sulfonyl-phenylsulfonamide, trifluoromethanesulfonic acid-1,8-naphthalimide, nonafluorobutanesulfonic acid-1,8-naphthalimide, perfluorooctanesulfonic acid-1,8-naphthalimide, pentafluorobenzene Sulfonic acid-1,8-naphthalimide, nonafluorobutanesulfonic acid-1,3,6-trioxo-3,6-dihydro-1H-11-thia-azacyclopentanthracen-2-
- nonionic photoacid generators include WPAG-145, WPAG-149, WPAG-170, WPAG-199 (manufactured by Wako Pure Chemical Industries, Ltd.), D2963, F0362, M1209, M1245 (Tokyo Chemical Industry). Co., Ltd.), SP-082, SP-103, SP-601, SP-606 (ADEKA Co., Ltd.), SIN-11 (Sanpo Chemical Research Co., Ltd.), NT-1TF (San Apro Co., Ltd.), etc. Is mentioned.
- a preferred blending amount of the component (B) of the present invention is in the range of 0.01 to 20 parts by mass, more preferably 0.01 to 10 parts by mass with respect to 100 parts by mass of the component (C) described later. More preferably, it is 0.3 to 10 parts by mass.
- the component (B) is 0.01 part by mass or more, the effect of coloring the leuco dye that is the component (A) is increased, so that the cured product can have high concealability.
- cured material can have sufficient heat resistance as (B) component is 20 mass parts or less.
- the component (B) is preferably 0.1 to 20 parts by mass with respect to 1 part by mass of the component (A).
- a compound having an ethylenically unsaturated group which is usually used in adhesives and paints can be used.
- a (meth) acryloyl group can be used.
- examples thereof include compounds.
- the component (C) for example, monofunctional, bifunctional, trifunctional and polyfunctional monomers and oligomers can be used. These can be used alone or as a mixture of two or more.
- the component (C) contains an oligomer and a monomer, that is, an oligomer and a monofunctional, bifunctional, trifunctional and multifunctional monomer. It is preferable that at least one is included.
- (meth) acrylate having a tertiary amine skeleton is treated as the component (E) described later.
- Examples of the monofunctional monomer include acrylic acid, ethyl (meth) acrylate, n-butyl (meth) acrylate, tert-butyl (meth) acrylate, isobutyl methacrylate, 2-ethylhexyl (meth) acrylate, and isodecyl (meth).
- cyclohexyl (meth) acrylate, dicyclopentanyl (meth) acrylate, dicyclopentenyl (meth) acrylate, dicyclo Pentenyloxy (meth) acrylate, isobornyl (meth) acrylate, adamantyl (meth) acrylate, benzyl (meth) acrylate, phenyl (meth) acrylate, phenoxyethyl (meth) acrylate, 2-hydroxyethyl (meth) acrylate, 2-hydroxy Propyl (meth) acrylate, 4-hydroxybutyl (meth) acrylate and the like are preferable.
- bifunctional monomer examples include ethylene glycol di (meth) acrylate, diethylene glycol di (meth) acrylate, triethylene glycol di (meth) acrylate, tetraethylene glycol dimethacrylate, 1,6-hexanediol di ( (Meth) acrylate, 1,9-nonanediol di (meth) acrylate, glycerin di (meth) acrylate, neopentyl glycol di (meth) acrylate, stearic acid-modified pentaerythritol di (meth) acrylate, dicyclopentenyl diacrylate, di (Meth) acryloyl isocyanurate, alkylene oxide modified bisphenol di (meth) acrylate, dimethylol-tricyclodecane diacrylate and the like.
- trifunctional monomer examples include trimethylolpropane tri (meth) acrylate, pentaerythritol tri (meth) acrylate, tris (acryloyloxyethyl) isocyanurate, and the like.
- polyfunctional monomer examples include ditrimethylolpropane tetra (meth) acrylate, pentaerythritol tetra (meth) acrylate, dipentaerythritol monohydroxypenta (meth) acrylate, alkyl-modified dipentaerythritol pentaacrylate, and dipentaerythritol hexa.
- These monofunctional, bifunctional, trifunctional and polyfunctional monomers can be used alone or as a mixture of two or more.
- oligomer examples include urethane (meth) acrylate having a polybutadiene skeleton, urethane (meth) acrylate having a hydrogenated polybutadiene skeleton, urethane (meth) acrylate having a polycarbonate skeleton, urethane (meth) acrylate having a polyether skeleton, and urethane having a polyester skeleton.
- the radical photopolymerization initiator that is the component (D) used in the present invention is not limited as long as it is a compound that generates radicals when irradiated with active energy rays. Moreover, it is preferable that it is a radical photopolymerization initiator which has absorption in a wavelength range of 365 nm or more from a viewpoint that the concealability of hardened
- Examples of the component (D) include acetophenone photoradical polymerization initiators, benzoin photoradical polymerization initiators, benzophenone photoradical polymerization initiators, thioxanthone photoradical polymerization initiators, and acylphosphine oxide photoradicals.
- Examples include polymerization initiators, titanocene-based photoradical polymerization initiators, and among them, acetophenone-based photoradical polymerization initiators and acyls from the viewpoint of excellent thick film curability and concealment of cured products. It is preferable to include at least one phosphine oxide-based photoradical polymerization initiator. Moreover, these may be used independently and 2 or more types may be used together.
- Examples of the acetophenone photoradical polymerization initiator include diethoxyacetophenone, 2-hydroxy-2-methyl-1-phenyl-propan-1-one, benzyldimethyl ketal, 4- (2-hydroxyethoxy) phenyl- ( 2-hydroxy-2-propyl) ketone, 1-hydroxy-cyclohexyl-phenyl-ketone, 2-methyl-2-morpholino (4-thiomethylphenyl) propan-1-one, 2-benzyl-2-dimethylamino-1 Examples include-(4-morpholinophenyl) butanone and 2-hydroxy-2-methyl-1- [4- (1-methylvinyl) phenyl] propanone oligomer, but are not limited thereto.
- acetophenone photoradical polymerization initiators examples include IRGACURE 184, DAROCUR 1173, IRGACURE 2959, IRGACURE 127 (manufactured by BASF), ESACURE KIP-150 (manufactured by Lamberti s.pa.), and the like. .
- acyl phosphine oxide photo radical polymerization initiator examples include bis (2,4,6-trimethylbenzoyl) -phenyl-phosphine oxide, 2,4,6-trimethylbenzoyl-diphenyl-phosphine oxide, and the like. This is not the case.
- acylphosphine oxide-based photoradical polymerization initiators examples include LUCIRIN TPO, IRGACURE 819, IRGACURE 819DW (manufactured by BASF).
- the compounding amount of the component (D) of the present invention is preferably 0.1 to 15 parts by mass and more preferably 1 to 10 parts by mass with respect to 100 parts by mass of the component (C).
- the component (D) is 0.1 part by mass or more, the thick film curability of the photocurable resin composition by active energy rays can be improved, and when it is 15 parts by mass or less, the photocurability is obtained.
- the storage stability of the resin composition can be improved.
- the tertiary amine compound which is the component (E) of the present invention is a photocurable resin composition having both excellent storage stability and thick film curability by combining with the components (A) to (D) of the present invention. Can be provided.
- the component (E) is preferably a compound having only a tertiary amino group that does not contain a primary or secondary amino group, from the viewpoint of the storage stability of the photocurable resin composition.
- the reason why the thick film curability of the photocurable resin composition is improved by the component (E) is not clear, but the color development of the leuco dye by the acid can be delayed by the component (E), It is presumed that the light can be transmitted to
- the reason why the storage stability of the photocurable resin composition is improved by the component (E) is not clear, but if it is a primary or secondary amine compound, a Michael addition reaction occurs between the component (C) and the component (C). Therefore, it is considered that the storage stability of the photocurable resin composition is inferior.
- it is (E) component of this invention since (C) component and Michael addition reaction do not arise, it is estimated that the storage stability of a photocurable resin composition improves.
- the technical scope of the present invention is not limited by the above reasoning.
- the component (E) is not particularly limited.
- the component (E) is at least one of the above substituents.
- a tertiary amine compound one of which is a linear or branched hydroxyalkyl group having 1 to 8 carbon atoms; acryloylmorpholine, morpholinoethyl (meth) acrylate, dimethylaminoethyl (meth) acrylate, diethylaminoethyl (meth) acrylate , N, N-dimethylaminoethyl (meth) acrylate and N, N-dimethylaminopropyl (meth) acrylate are preferable.
- the (E) component is a straight chain having at least one substituent having 1 to 8 carbon atoms. It is more preferable to include at least one tertiary amine compound that is a linear or branched hydroxyalkyl group.
- the blending amount of the component (E) of the present invention is preferably 0.01 to 200 parts by weight, more preferably 0.05 to 150 parts by weight, and 0.1 to 100 parts by weight with respect to 100 parts by weight of the component (C). Part is especially good.
- the blending amount of the component (E) is 0.01 parts by mass or more, the thick film curability of the photocurable resin composition by active energy rays can be improved, and when it is 200 parts by mass or less, the cured product. The concealment property can be improved.
- component (E) contains at least one tertiary amine compound in which at least one of the substituents is a linear or branched hydroxyalkyl group having 1 to 8 carbon atoms
- the amount of component (E) may be reduced, and is 0.01 to 20 parts by weight, preferably 0.05 to 15 parts by weight, more preferably 100 parts by weight of component (C). 0.1 to 10 parts by mass.
- the compounding quantity of (E) component and (B) component is said (E) component to 0.1 mass with respect to 100 mass parts of (C) component from a viewpoint that high concealability and thick film sclerosis
- various elastomers such as styrene copolymers, polythiol compounds, sensitizers, fillers, storage stabilizers, antioxidants, light stabilizers, storage stabilizers, as long as the object of the present invention is not impaired.
- Additives such as heavy metal deactivators, adhesion promoters, plasticizers, antifoaming agents, pigments, rust inhibitors, leveling agents, dispersants, rheology modifiers, flame retardants, and surfactants can be used. .
- a polythiol compound may be added for the purpose of improving photocurability.
- examples of polythiol compounds include trimethylolpropane tris (3-mercaptopropionate), pentaerythritol tetrakis (3-mercaptopropionate), trimethylolpropane tris (3-mercaptobutyrate), trimethylolethane tris (3-mercapto).
- a sensitizer may be added to the present invention for the purpose of improving photocurability.
- the sensitizer include anthracene, pyrene, perylene, xanthone, thioxanthone, eosin, ketocoumarin, coumarin, and isobenzofuran.
- a filler that does not inhibit the thick film curability and storage stability of the photocurable resin composition may be added.
- Specific examples include organic powders, inorganic powders, metallic powders, and the like.
- the inorganic powder filler examples include glass, fumed silica, alumina, mica, ceramics, silicone rubber powder, calcium carbonate, aluminum nitride, carbon powder, kaolin clay, dry clay mineral, and dry diatomaceous earth.
- the blending amount of the inorganic powder is preferably 0.1 to 100 parts by mass with respect to 100 parts by mass of the component (A). When it is 0.1 part by mass or more, improvement effects such as elastic modulus and fluidity of the cured product are obtained, and when it is 100 parts by mass or less, the photocurable resin composition is excellent in fluidity and workability is improved. To do.
- the fumed silica can be blended for the purpose of adjusting the viscosity of the photocurable resin composition or improving the mechanical strength of the cured product.
- fumed silica surface-treated with dimethylsilane, trimethylsilane, alkylsilane, methacryloxysilane, organochlorosilane, polydimethylsiloxane, hexamethyldisilazane, or the like is used.
- Examples of commercially available fumed silica include Aerosil (registered trademark) R972, R972V, R972CF, R974, R976, R976S, R9200, RX50, NAX50, NX90, RX200, RX300, R812, R812S, R8200, RY50, NY50, RY200S, RY200, RY300, R104, R106, R202, R805, R816, T805, R711, RM50, R7200 (manufactured by Nippon Aerosil Co., Ltd.) and the like.
- the organic powder filler examples include polyethylene, polypropylene, nylon, crosslinked acrylic, crosslinked polystyrene, polyester, polyvinyl alcohol, polyvinyl butyral, and polycarbonate.
- the blending amount of the organic powder is preferably 0.1 to 100 parts by mass with respect to 100 parts by mass of the component (A). When it is 0.1 part by mass or more, improvement effects such as elastic modulus and fluidity of the cured product are obtained, and when it is 100 parts by mass or less, the photocurable resin composition is excellent in fluidity and workability is improved. To do.
- a storage stabilizer may be added to the present invention.
- a radical absorbent such as benzoquinone, hydroquinone, hydroquinone monomethyl ether, a metal chelating agent such as ethylenediaminetetraacetic acid or its 2-sodium salt, oxalic acid, acetylacetone, o-aminophenol, and the like are added.
- a metal chelating agent such as ethylenediaminetetraacetic acid or its 2-sodium salt, oxalic acid, acetylacetone, o-aminophenol, and the like are added.
- An antioxidant may be added to the present invention.
- the antioxidant include ⁇ -naphthoquinone, 2-methoxy-1,4-naphthoquinone, methyl hydroquinone, hydroquinone, hydroquinone monomethyl ether, mono-tert-butyl hydroquinone, 2,5-di-tert-butyl hydroquinone, quinone compounds such as p-benzoquinone, 2,5-diphenyl-p-benzoquinone, 2,5-di-tert-butyl-p-benzoquinone; phenothiazine, 2,2-methylene-bis (4-methyl-6-tert) -Butylphenol), catechol, tert-butylcatechol, 2-butyl-4-hydroxyanisole, 2,6-di-tert-butyl-p-cresol, 2-tert-butyl-6- (3-tert-butyl-2 -Hydroxy-5-methylbenzyl) -4-
- An adhesion promoter may be added to the present invention.
- the adhesion promoter ⁇ -chloropropyltrimethoxysilane, vinyltrimethoxysilane, vinyltrichlorosilane, vinyltriethoxysilane, vinyl-tris ( ⁇ -methoxyethoxy) silane, ⁇ - (3,4-epoxycyclohexyl) Examples include ethyltrimethoxysilane, ⁇ -glycidoxypropyltrimethoxysilane, ⁇ -mercaptopropyltrimethoxysilane, and ⁇ -ureidopropyltriethoxysilane.
- the amount of the adhesion-imparting agent is preferably 0.05 to 30 parts by mass, more preferably 0.2 to 10 parts by mass with respect to 100 parts by mass of the component (C).
- the photocurable resin composition of the present invention can be produced by a known method. For example, it can be produced by blending predetermined amounts of the components (A) to (E) and mixing at a temperature of 10 to 70 ° C. for 0.1 to 5 hours using a mixing means such as a mixer. it can.
- the light source for curing the photocurable resin composition of the present invention by irradiating with light such as ultraviolet rays and visible light is not particularly limited, and examples thereof include a low pressure mercury lamp, a medium pressure mercury lamp, a high pressure mercury lamp, an ultrahigh pressure mercury lamp, Examples thereof include a black light lamp, a microwave excitation mercury lamp, a metal halide lamp, a sodium lamp, a halogen lamp, a xenon lamp, an LED, a fluorescent lamp, sunlight, and an electron beam irradiation device.
- the dose of light irradiation, from the viewpoint of the properties of the cured product is preferably at 10 kJ / m 2 or more, more preferably 20 kJ / m 2 or more. From the viewpoint of productivity, the upper limit of the irradiation amount of the light irradiation is preferably 1000 kJ / m 2 or less.
- the photocurable resin composition of the present invention develops color when the leuco dye as component (A) is in contact with an acid, and the cured product obtained by curing the photocurable resin composition is black, blue, It can develop colors such as green and red.
- the cured product is preferably black from the viewpoint of excellent concealability.
- the photocurable resin composition of the present invention is suitably used include casting resins, sealing agents, sealing materials, potting agents, adhesives, coating materials, lining materials, inks, and the like.
- the photo-curable resin composition of the present invention has excellent storage stability, high concealability of the cured product, and excellent thick film curability. It is preferably used for an agent, an adhesive or a coating material.
- the photocurable resin composition of this invention is a liquid at 25 degreeC.
- Particularly preferred uses of the photocurable resin composition of the present invention include coating materials for flexible wiring boards, casting resins, lens black stripes, image display devices, optical members, CMOS sensors, housings and lenses, etc.
- an adhesive for assembly for example, an adhesive for assembly.
- test methods used in the examples and comparative examples are as follows.
- ⁇ Appearance confirmation of cured product Create a test piece with a smooth surface so that the thickness of the photocurable resin composition is 0.5 mm, and irradiate with UV light using an LED irradiator (wavelength 365 nm) under the condition of 100 mW / cm 2 ⁇ 120 seconds, A cured product was obtained. The appearance of the cured product was visually confirmed, and the results are summarized in Table 1.
- the photocurable resin composition was put in a metal tube having a depth of 5 mm, and irradiated with ultraviolet rays under a condition of 100 mW / cm 2 ⁇ 120 seconds using an LED irradiator (wavelength 365 nm) to be photocured to obtain a cured product. Then, the uncured portion was removed with a solvent, and the cured portion was measured with calipers to calculate the thick film curability.
- Table 1 The results are summarized in Table 1.
- Examples 1 to 7 are photocurable resin compositions containing a tertiary amine compound as component (E), have excellent film thickness curability, and have high cured properties. And has excellent storage stability.
- Comparative Example 1 is a photocurable resin composition not containing the component (E) of the present invention, and it can be seen that the thick film curability is inferior to Examples 1-7.
- Comparative Examples 2 and 3 are photocurable resin compositions containing e′1 and e′2 components that are not the (E) component of the present invention, but are soluble in the (C) component of the present invention. I could not.
- Comparative Examples 4 to 7 are photocurable resin compositions containing any one of primary and secondary amine compounds e′3 to 6 which are not the component (E) of the present invention. Since gelation was confirmed at the time of manufacturing the product, the result was poor storage stability.
- Comparative Example 8 is a photocurable resin composition containing carbon black that is not the component (A) of the present invention.
- the photocurable resin composition is caused by the fact that carbon black absorbs ultraviolet rays. As a result, the thick film curability was extremely poor.
- a test piece with a smooth surface was prepared from each of the curable resin compositions of Examples 1 to 7 so as to have a thickness of 150 ⁇ m, and irradiated with ultraviolet rays under conditions of 100 mW / cm 2 ⁇ 120 seconds to obtain a cured product.
- the transmittance of the cured product was measured with a spectrophotometer UV-2450 (manufactured by Shimadzu Corporation) (not shown in Table 1).
- the transmittance at a wavelength of 550 nm was 3% or less, and excellent concealability was confirmed.
- the photo-curable resin composition of the present invention is excellent in storage stability and has high concealment and thick film curability, and therefore is suitably used for various adhesive applications. Specifically, it is extremely effective as a coating material, a casting resin, a sealing agent, a sealing material, a potting agent, an adhesive, a coating material, a lining material, an adhesive, ink, and the like, and can be applied to a wide range of fields.
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Abstract
Description
(A)成分:ロイコ染料
(B)成分:光酸発生剤
(C)成分:ラジカル重合性化合物(3級アミン骨格を有する(メタ)アクリレートを除く)
(D)成分:光ラジカル重合開始剤
(E)成分:3級アミン化合物。
(A)成分:ロイコ染料
(B)成分:光酸発生剤
(C)成分:ラジカル重合性化合物(3級アミン骨格を有する(メタ)アクリレートを除く)
(D)成分:光ラジカル重合開始剤
(E)成分:3級アミン化合物。
本発明の(A)成分であるロイコ染料は、酸との接触により発色する化合物であり、硬化物に隠蔽性を与えることができる。また、ロイコ染料は、種類によって黒色、青色、緑色、赤色などに発色させることができるが、隠蔽性が優れるという観点から、黒色の発色が得られるロイコ染料が好ましい。
本発明の(B)成分である光酸発生剤は、活性エネルギー線の照射によりルイス酸やブレンステッド酸などの酸を発生する化合物である。前記(B)成分により発生した酸により前記(A)成分であるロイコ染料を発色させることが可能となる。また、隠蔽性および光硬化性樹脂組成物の厚膜硬化性を両立できるという観点から、365nm以上の波長領域に吸収を持つ光酸発生剤であることが好ましい。また、前記(B)成分としては、オニウム塩系光酸発生剤と非イオン性光酸発生剤とに大別できる。
本発明の(C)成分であるラジカル重合性化合物は、接着剤および塗料などに通常使用されているエチレン性不飽和基を有する化合物を使用することができ、具体的には(メタ)アクリロイル基含有化合物などが挙げられる。前記(C)成分としては、例えば、単官能性、二官能性、三官能性および多官能性のモノマーならびにオリゴマーなどを使用することができる。これらは単独でまたは二種以上の混合物として用いることができる。中でも光硬化性および硬化物の物性が優れるという観点から、前記(C)成分は、オリゴマーとモノマーとを含む、すなわちオリゴマーと単官能性、二官能性、三官能性および多官能性のモノマーの少なくとも1つとを含むことが好ましい。なお、本発明において3級アミン骨格を有する(メタ)アクリレートは、後述する(E)成分として扱うものとする。
本発明に用いられる(D)成分である光ラジカル重合開始剤は、活性エネルギー線を照射することにより、ラジカルが発生する化合物であれば限定されるものではない。また、硬化物の隠蔽性および光硬化性樹脂組成物の厚膜硬化性を両立できるという観点から、365nm以上の波長領域に吸収を持つ光ラジカル重合開始剤であることが好ましい。また、(D)成分としては、例えば、アセトフェノン系光ラジカル重合開始剤、ベンゾイン系光ラジカル重合開始剤、ベンゾフェノン系光ラジカル重合開始剤、チオキサントン系光ラジカル重合開始剤、アシルフォスフィンオキサイド系光ラジカル重合開始剤、チタノセン系光ラジカル重合開始剤などが挙げられ、この中でも光硬化性樹脂組成物の厚膜硬化性および硬化物の隠蔽性に優れるという観点から、アセトフェノン系光ラジカル重合開始剤およびアシルフォスフィンオキサイド系光ラジカル重合開始剤の少なくとも1つを含むことが好ましい。また、これらは単独で用いられてもよく、2種以上が併用されてもよい。
本発明の(E)成分である3級アミン化合物は、本発明の(A)~(D)成分と組み合わせにより、優れた貯蔵安定性および厚膜硬化性を両立した光硬化性樹脂組成物を提供できる。前記(E)成分は、光硬化性樹脂組成物の貯蔵安定性の観点から、1級または2級アミノ基を含まない、3級アミノ基のみを有する化合物が好ましい。また、前記(E)成分により光硬化性樹脂組成物の厚膜硬化性が向上する理由は定かではないが、(E)成分により酸によるロイコ染料の発色を遅らせることができ、膜形成時に深部まで光を透過させることができることに起因すると推測される。また、(E)成分により光硬化性樹脂組成物の貯蔵安定性が向上する理由は定かではないが、1級または2級アミン化合物であると(C)成分との間でマイケル付加反応が生じることから光硬化性樹脂組成物の貯蔵安定性が劣るものと考えられる。なお、本発明の(E)成分であれば(C)成分とマイケル付加反応が生じないので、光硬化性樹脂組成物の貯蔵安定性が向上するものと推測される。ただし、本発明の技術的範囲が、上記推論によって限定されるものではない。
各成分を表1に示す質量部で採取し、常温(25℃)にてプラネタリーミキサーで60分混合し、光硬化性樹脂組成物を調製した。なお詳細な調製量は表1に従い、数値は全て質量部で表記する。
a1:3-ジブチルアミノ-6-メチル-7-アニリノフルオラン(ODB-2、山本化成株式会社製)
a2:3-ジエチルアミノ-6-メチル-7-アニリノフルオラン(ODB、山本化成株式会社製)
<(A)成分の比較成分>
a’1:カーボンブラック(SRBブラック T-04、御国色素株式会社製)
<(B)成分>
b1:トリアリールスルホニウム-ヘキサフルオロホスフェート塩(CPI-100P、サンアプロ株式会社製)
<(C)成分>
c1:ウレタン(メタ)アクリレート(UV-3000B、日本合成化学工業株式会社製)
c2:イソシアヌル酸EO変性ジおよびトリアクリレート(M-313、東亞合成社製)
c3:ジメチロール-トリシクロデカンジアクリレート(DCP-A、共栄社化学株式会社製)
c4:イソボルニルアクリレート(ライトアクリレートIBX-A、共栄社化学株式会社製)
<(D)成分>
d1:2-ヒドロキシ-2-メチル-1-フェニル-プロパン-1-オン(DAROCUR1173、BASF社製)
d2:2,4,6-トリメチルベンゾイル-ジフェニル-フォスフィンオキサイド(LUCIRIN TPO、BASF社製)
<(E)成分>
e1:アクリロイルモルホリン(ACMO、KJケミカルズ株式会社製)
e2:トリイソプロパノールアミン(東京化成工業株式会社社製)
e3:トリエタノールアミン(東京化成工業株式会社社製)
e4:N-フェニルジエタノールアミン(東京化成工業株式会社社製)
<(E)成分の比較成分>
e’1:N-メチロールアクリルアミド
e’2:メタクリルアミド
e’3:1,3-ビスアミノメチルシクロヘキサン(1,3-BAC、三菱ガス化学株式会社製)
e’4:3,3’-ジエチル-4,4’-ジアミノジフェニルメタン(KAYAHARD A-A、日本化薬株式会社製)
e’5:ポリオキシプロピレンジアミン(ジェファーミン D-230)
e’6:メタキシレンジアミン(MXDA、三菱瓦斯化学株式会社製)。
光硬化性樹脂組成物を厚みが0.5mmになるように表面が平滑な試験片を作成し、LED照射機(波長365nm)を用いて100mW/cm2×120秒の条件で紫外線照射し、硬化物を得た。その硬化物の外観を目視で確認し、その結果を表1にまとめた。
硬化性樹脂組成物を厚みが0.5mmになるように表面が平滑な試験片を作成し、LED照射機(波長365nm)を用いて100mW/cm2×120秒の条件で紫外線照射し硬化物を得た。黒点を記した紙の上に、得られた硬化物を置き、黒点を目視で確認し、下記の基準に基づき評価した。その結果を表1にまとめた。
○:黒点の輪郭が不明瞭であり、隠蔽性が確認できた場合
×:黒点の輪郭がはっきりと、確認された場合。
光硬化性樹脂組成物を深さ5mmの金属筒に入れ、LED照射機(波長365nm)を用いて100mW/cm2×120秒の条件で紫外線照射し、光硬化させ硬化物を得た。そして、未硬化部分を溶剤で除去し、硬化部分をノギスで測定することにより、厚膜硬化性を算出した。その結果を表1にまとめた。
硬化性樹脂組成物5gを25℃室内で遮光容器中に入れて1ヶ月間密閉保存し、その後、下記の基準に基づき、目視で評価した。その結果を表1にまとめた。
○:液状のままであり、貯蔵安定性は良好であった
×:ゲル化が確認された。
実施例1~7の各硬化性樹脂組成物を厚みが150μmになるように表面が平滑な試験片を作成し、100mW/cm2×120秒の条件で紫外線照射し、硬化物を得た。この硬化物の透過率を分光光度計UV-2450(島津製作所製)にて測定した(表1には記載せず)。実施例1~7の各硬化性樹脂組成物の硬化物の評価結果は、すべて、550nmの波長の透過率が3%以下であり、優れた隠蔽性が確認された。
Claims (10)
- (A)~(E)成分を含有する光硬化性樹脂組成物;
(A)成分:ロイコ染料
(B)成分:光酸発生剤
(C)成分:ラジカル重合性化合物(但し、3級アミン骨格を有する(メタ)アクリレートを除く)
(D)成分:光ラジカル重合開始剤
(E)成分:3級アミン化合物。 - 前記(E)成分が、N-フェニルジエタノールアミン、N-メチルジエタノールアミン、p-メチルフェニルジエタノールアミン、N-エチルジエタノールアミン、N-プロピルジエタノールアミン、N-ブチルジエタノールアミン、トリエタノールアミン、トリブタノールアミン、トリイソプロパノールアミン、N-メチル-ジエタノールアミン、N-メチル-ジメタノールアミン、トリメチルアミン、トリエチルアミン、トリブチルアミン、N,N-ジメチル-p-トルイジン、N,N-ジメチル-アニリン、N,N-(ジメチルアミノ)エチル-メタクリレート、N,N-ジメチルアミノアセトフェノン、N,N-ジメチルアミノベンゾフェノン、N,N-ジエチルアミノベンゾフェノン、N-メチルピペリジン、N-エチルピペリジン、N,N-ジメチルベンジルアミン、N,N-ジメチルシクロヘキシルアミン、アクリロイルモルホリン、モルホリノエチル(メタ)アクリレート、N,N-ジメチルアミノエチル(メタ)アクリレート、N,N-ジエチルアミノエチル(メタ)アクリレート、N,N-ジメチルアミノエチル(メタ)アクリレート、N,N-ジメチルアミノプロピル(メタ)アクリレートからなる群から選択される少なくとも1種である、請求項1に記載の光硬化性樹脂組成物。
- 前記(C)成分100質量部に対して、前記(E)成分を0.01~200質量部含有する、請求項1または2に記載の光硬化性樹脂組成物。
- 前記(C)成分100質量部に対して、前記(E)成分を0.01~100質量部および(B)成分を0.01~10質量部含有する、請求項1~3のいずれか1項に記載の光硬化性樹脂組成物。
- 前記(C)成分が、オリゴマーとモノマーとを含む、請求項1~4のいずれか1項に記載の光硬化性樹脂組成物。
- 前記(D)成分が、アセトフェノン系光ラジカル重合開始剤およびアシルフォスフィンオキサイド系光ラジカル重合開始剤の少なくとも1つを含む、を請求項1~5のいずれか1項に記載の光硬化性樹脂組成物。
- 前記(B)成分が、オニウム塩系光酸発生剤である、請求項1~6のいずれか1項に記載の光硬化性樹脂組成物。
- 前記(B)成分が、アリールスルホニウム塩である、請求項1~7のいずれか1項に記載の光硬化性樹脂組成物。
- 硬化物が黒色であることを特徴とする請求項1~8のいずれか1項に記載の光硬化性樹脂組成物。
- 注型用樹脂、シール剤、ポッティング剤、接着剤または被覆材用光硬化性樹脂組成物である、請求項1~9のいずれか1項に記載の光硬化性樹脂組成物。
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- 2015-07-10 WO PCT/JP2015/069957 patent/WO2016051914A1/ja active Application Filing
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- 2015-07-10 JP JP2016551598A patent/JP6586958B2/ja active Active
- 2015-07-10 KR KR1020177007391A patent/KR102311319B1/ko active IP Right Grant
- 2015-07-10 US US15/513,578 patent/US10240026B2/en active Active
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Cited By (14)
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JPWO2016117631A1 (ja) * | 2015-01-21 | 2017-11-02 | 株式会社スリーボンド | 光硬化性組成物 |
WO2016117631A1 (ja) * | 2015-01-21 | 2016-07-28 | 株式会社スリーボンド | 光硬化性組成物 |
US10294310B2 (en) | 2015-01-21 | 2019-05-21 | Three Bond Co., Ltd. | Photocurable composition |
JP2019196493A (ja) * | 2015-04-02 | 2019-11-14 | 山本化成株式会社 | 活性線硬化型接着剤用液状樹脂組成物 |
JP2016196541A (ja) * | 2015-04-02 | 2016-11-24 | 山本化成株式会社 | 活性線硬化型接着剤用液状樹脂組成物 |
KR20200042876A (ko) * | 2017-08-18 | 2020-04-24 | 세키스이가가쿠 고교가부시키가이샤 | 습기 경화형 수지 조성물, 전자 부품용 접착제, 및, 표시 소자용 접착제 |
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JPWO2019035411A1 (ja) * | 2017-08-18 | 2020-07-27 | 積水化学工業株式会社 | 湿気硬化型樹脂組成物、電子部品用接着剤、及び、表示素子用接着剤 |
JP7088838B2 (ja) | 2017-08-18 | 2022-06-21 | 積水化学工業株式会社 | 湿気硬化型樹脂組成物、電子部品用接着剤、及び、表示素子用接着剤 |
KR102598369B1 (ko) | 2017-08-18 | 2023-11-03 | 세키스이가가쿠 고교가부시키가이샤 | 습기 경화형 수지 조성물, 전자 부품용 접착제, 및, 표시 소자용 접착제 |
JP2020152887A (ja) * | 2019-03-15 | 2020-09-24 | 日東電工株式会社 | 粘着シート、粘着シートの製造方法、中間積層体の製造方法および中間積層体 |
JP7241648B2 (ja) | 2019-03-15 | 2023-03-17 | 日東電工株式会社 | 光学デバイス用粘着シート、光学デバイス用粘着シートの製造方法、中間積層体の製造方法および中間積層体 |
WO2022054637A1 (ja) * | 2020-09-10 | 2022-03-17 | 日東電工株式会社 | 粘着シート貼付品の製造方法 |
JP7343728B1 (ja) * | 2023-06-07 | 2023-09-12 | デクセリアルズ株式会社 | 光硬化型接着組成物、硬化物、接続構造体及び接続構造体の製造方法 |
Also Published As
Publication number | Publication date |
---|---|
US10240026B2 (en) | 2019-03-26 |
JP6586958B2 (ja) | 2019-10-09 |
KR20170065507A (ko) | 2017-06-13 |
KR102311319B1 (ko) | 2021-10-08 |
JPWO2016051914A1 (ja) | 2017-09-21 |
CN106715477B (zh) | 2018-10-12 |
US20170283584A1 (en) | 2017-10-05 |
EP3202794A4 (en) | 2018-05-30 |
TW201612221A (en) | 2016-04-01 |
TWI648321B (zh) | 2019-01-21 |
CN106715477A (zh) | 2017-05-24 |
EP3202794A1 (en) | 2017-08-09 |
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