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WO2014080699A1 - Multipole connector - Google Patents

Multipole connector Download PDF

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Publication number
WO2014080699A1
WO2014080699A1 PCT/JP2013/077084 JP2013077084W WO2014080699A1 WO 2014080699 A1 WO2014080699 A1 WO 2014080699A1 JP 2013077084 W JP2013077084 W JP 2013077084W WO 2014080699 A1 WO2014080699 A1 WO 2014080699A1
Authority
WO
WIPO (PCT)
Prior art keywords
substrate
axis direction
mounting
module
module substrate
Prior art date
Application number
PCT/JP2013/077084
Other languages
French (fr)
Japanese (ja)
Inventor
祐市 丸山
勲 江島
Original Assignee
株式会社村田製作所
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社村田製作所 filed Critical 株式会社村田製作所
Publication of WO2014080699A1 publication Critical patent/WO2014080699A1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/7005—Guiding, mounting, polarizing or locking means; Extractors
    • H01R12/7011—Locking or fixing a connector to a PCB
    • H01R12/7017—Snap means
    • H01R12/7029—Snap means not integral with the coupling device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/71—Coupling devices for rigid printing circuits or like structures
    • H01R12/712—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit
    • H01R12/716—Coupling device provided on the PCB
    • H01R12/718—Contact members provided on the PCB without an insulating housing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/71—Coupling devices for rigid printing circuits or like structures
    • H01R12/75—Coupling devices for rigid printing circuits or like structures connecting to cables except for flat or ribbon cables

Definitions

  • the present invention relates to a multipolar connector, and more particularly, to a multipolar connector that connects a module substrate on which various electronic components are mounted and a mounting substrate on which the module substrate is mounted.
  • FIG. 15 is a cross-sectional view of the multi-contact connector 500 described in Patent Document 1.
  • the multi-contact connector 500 includes a bottom member 512, a top member 513, and a spring member 526.
  • the bottom member 512 is provided on the mounting substrate 510.
  • the bottom member 512 has a plurality of contact members 516, and one end of the contact member 516 is connected to the circuit pattern 519 of the mounting substrate 510. Further, the other end of the contact member 516 is connected to one end of a contact member 522 provided on the top member 513.
  • the top member 513 includes a base 520, an intermediate member 521, and a contact member 522.
  • the base 520 is provided on the outer edge of the module substrate 511.
  • the contact member 522 is provided on the base 520 and has a U shape.
  • the contact member 522 connects the contact pad 524 on the module substrate 511 and the contact member 516 of the bottom member 512 by wrapping around from the front surface to the back surface of the module substrate 511. Thereby, the contact pads 524 of the module substrate 511 and the circuit pattern 519 of the mounting substrate 510 are electrically connected.
  • the intermediate member 521 is located between the contact member 522 and the spring member 526. Further, the spring member 526 fixes the module substrate 511 to the mounting substrate 510 via the intermediate member 521.
  • a metal is generally used for the material of the spring member 526 for fixing the module substrate 511 in order to provide a spring property.
  • a contact member 522 for electrically connecting the contact pads 524 of the module substrate 511 and the circuit pattern 519 of the mounting substrate 510 is provided on the outer edge of the module substrate 511. Therefore, when the module substrate 511 is fixed to the mounting substrate 510, if the contact member 522 and the spring member 526 come into contact with each other, the circuit may be short-circuited.
  • an intermediate member 521 is provided between the spring member 526 and the module substrate 511. That is, in the multi-contact connector 500, the intermediate member 521 is required to prevent a short circuit when the module substrate 511 is fixed to the mounting substrate 510.
  • an object of the present invention is to provide a multipolar connector that does not require an intermediate member for preventing a short circuit when a module substrate is fixed to a mounting substrate.
  • the multipolar connector according to the present invention is a multipolar connector provided on a mounting board, and has a first main surface and the other main surface, and a module having a plurality of mounting electrodes provided only on the other main surface.
  • the multipolar connector according to the present invention does not require an intermediate member for preventing a short circuit when the module substrate is fixed to the mounting substrate.
  • FIG. 1 is an external perspective view of a multipolar connector and a mounting board according to an embodiment of the present invention. It is a disassembled perspective view of the multipolar connector which concerns on one form of this invention. It is an external appearance perspective view of the other main surface side of the module board in the multipolar connector which concerns on one form of this invention. It is an external appearance perspective view of the housing in the multipolar connector concerning one form of the present invention. It is an external appearance perspective view of the bushing in the multipolar connector which concerns on one form of this invention. It is an appearance perspective view of a terminal in a multipolar connector concerning one form of the present invention. It is sectional drawing before the module board mounting
  • FIG. 1 is an external perspective view of a multipolar connector 10 and a mounting board 100 according to an embodiment of the present invention.
  • FIG. 2 is an exploded perspective view of the multipolar connector 10 according to one embodiment of the present invention.
  • FIG. 3 is an external perspective view of the other main surface of the module substrate 20 in the multipolar connector 10 according to one embodiment of the present invention.
  • FIG. 4 is an external perspective view of the housings 30 and 32 in the multipolar connector 10 according to one embodiment of the present invention.
  • FIG. 5 is an external perspective view of the bushings 40 and 42 in the multipolar connector 10 according to one embodiment of the present invention.
  • FIG. 6 is an external perspective view of terminals 50a to 50o and 52a to 52o in multipolar connector 10 according to one embodiment of the present invention.
  • FIG. 7 is a cross-sectional view of the multipolar connector 10 and the mounting board 100 according to an embodiment of the present invention before the module board 20 is mounted.
  • FIG. 8 is a cross-sectional view of the multipolar connector 10 and the mounting board 100 according to an embodiment of the present invention after the module board 20 is mounted.
  • a direction orthogonal to the main surface of the module substrate 20 is defined as a z-axis direction
  • directions along each side forming the outer edge of the module substrate 20 are defined as an x-axis direction and a y-axis direction.
  • the x-axis, y-axis, and z-axis are orthogonal to each other. Further, the x axis, the y axis, and the z axis in FIG. 4 correspond to the housing 30 and do not correspond to the housing 32. Furthermore, the x-axis, y-axis, and z-axis in FIG. 5 correspond to the bushing 40 and do not correspond to the bushing 42.
  • the multipolar connector 10 is provided on the surface on the positive direction side in the z-axis direction of the mounting substrate 100 as shown in FIG. As shown in FIG. 2, the multipolar connector 10 includes a module substrate 20, housings 30 and 32, bushings 40 and 42, and terminals (contact members) 50a to 50o and 52a to 52o.
  • the multipolar connector 10 has a substantially square shape when viewed in plan from the z-axis direction.
  • the module substrate 20 includes a module 22 and module electrodes 24a to 24o and 25a to 25o on the positive side surface (one main surface) in the z-axis direction. Further, as shown in FIG. 3, the module substrate 20 includes mounting electrodes 26a to 26o and 27a to 27o on the surface on the negative direction side (the other main surface) in the z-axis direction. Further, the module substrate 20 is a plate-like member and has a substantially square shape when viewed in plan from the z-axis direction. A via-hole conductor (not shown) that penetrates the module substrate 20 in the z-axis direction is provided in the module substrate 20.
  • the module electrodes 24a to 24o and 25a to 25o are electrically connected to the mounting electrodes 26a to 26o and 27a to 27o, respectively.
  • the surface on the positive direction side in the z-axis direction is referred to as the upper surface
  • the surface on the negative direction side in the z-axis direction is referred to as the lower surface.
  • the module 22 is provided on the upper surface of the substrate body in the module substrate 20 as shown in FIG. Further, the module 22 has a substantially square shape when viewed in plan from the z-axis direction.
  • the module 22 is connected to the cable 80 on the side surface on the negative direction side in the y-axis direction.
  • the module 22 is connected to module electrodes 24a to 24o and 25a to 25o described later on the lower surface thereof.
  • the module 22 is, for example, an integrated circuit that processes a signal sent from the cable 80.
  • the module electrodes 24a to 24o and 25a to 25o are provided on the upper surface of the substrate body in the module substrate 20, as shown in FIG.
  • the module electrodes 24a to 24o are provided so as to be arranged in this order from the negative direction side in the y-axis direction toward the positive direction side along the side on the negative direction side in the x-axis direction that forms the outer edge of the module substrate 20.
  • the module electrodes 25a to 25o are provided so as to be arranged in this order from the negative direction side in the y-axis direction to the positive direction side along the side on the positive direction side in the x-axis direction that forms the outer edge of the module substrate 20. ing.
  • the module electrodes 24a to 24o and the module electrodes 25a to 25o are arranged symmetrically with respect to a plane S1 that passes through the center of the module substrate 20 and is parallel to the y axis and the z axis.
  • Each of the module electrodes 24a to 24o and 25a to 25o has a rectangular shape having a long side in the x-axis direction when viewed from the z-axis direction.
  • Each of the module electrodes 24 a to 24 o and 25 a to 25 o is connected to the module 22.
  • each of the module electrodes 24a to 24o and 25a to 25o is connected to the mounting electrodes 26a to 26o and 27a to 27o via via-hole conductors that penetrate the substrate body of the module substrate 20 in the z-axis direction.
  • the mounting electrodes 26a to 26o and 27a to 27o are provided on the lower surface of the substrate body of the module substrate 20, as shown in FIG.
  • the mounting electrodes 26a to 26o are provided so as to be arranged in this order from the negative side in the y-axis direction to the positive side along the side on the negative side in the x-axis direction that forms the outer edge of the module substrate 20.
  • the mounting electrodes 27a to 27o are provided so as to be arranged in this order from the negative direction side in the y-axis direction to the positive direction side along the side on the positive direction side in the x-axis direction that forms the outer edge of the module substrate 20. ing.
  • the mounting electrodes 26a to 26o and 27a to 27o form the outer edge of the module substrate 20 and are provided along the positive and negative sides in the x-axis direction that are not adjacent to each other.
  • the mounting electrodes 26a to 26o and the mounting electrodes 27a to 27o are arranged symmetrically with respect to the plane S1.
  • Each of the mounting electrodes 26a to 26o and 27a to 27o has an elongated shape parallel to the x-axis direction, and gradually becomes thinner from the outer edge side of the module substrate 20 toward the inside.
  • Each of the mounting electrodes 26a to 26o and 27a to 27o is connected to the module electrodes 24a to 24o and 25a to 25o via via-hole conductors that penetrate the substrate body of the module substrate 20 in the z-axis direction.
  • the housing 30 is provided on the upper surface of the mounting substrate 100 so as to surround a part of the negative side in the x-axis direction and the positive and negative sides in the y-axis direction of the module substrate 20.
  • the housing 30 is a plate-like member produced by bending a single metal plate, and has a U-shape when viewed in plan from the z-axis direction, as shown in FIG. Further, the housing 30 is divided into three parts: a bridge part 30a and claw parts 30b and 30c.
  • the material of the housing 30 includes phosphor bronze for springs.
  • the bridge portion 30 a is provided along the side on the negative side in the x-axis direction that forms the outer edge of the module substrate 20. Moreover, the bridge
  • the claw portion 30b is formed by bending the end portion of the housing 30 on the negative direction side in the y-axis direction toward the positive direction side in the x-axis direction. Further, the claw portion 30 b is provided along the side on the negative direction side in the y-axis direction that forms the outer edge of the module substrate 20. However, the claw portion 30b is provided only in the vicinity of the end portion on the negative side in the x-axis direction on the side on the negative direction side in the y-axis direction that forms the outer edge of the module substrate 20.
  • the end on the positive direction side in the z-axis direction of the claw portion 30b is folded toward the negative direction side in the z-axis direction while drawing an arc on the positive direction side in the y-axis direction.
  • the folded portion of the claw portion 30b can be elastically deformed in the negative direction side in the y-axis direction.
  • the end portion on the negative direction side in the z-axis direction of the claw portion 30b is bent toward the negative direction side in the y-axis direction.
  • the claw portion 30 c is formed by bending the end portion of the housing 30 on the positive direction side in the y-axis direction toward the positive direction side in the x-axis direction. Further, the claw portion 30 c is provided along the side on the positive direction side in the y-axis direction that forms the outer edge of the module substrate 20. However, the claw portion 30 c is provided only in the vicinity of the end portion on the negative side in the x-axis direction on the positive side in the y-axis direction that forms the outer edge of the module substrate 20.
  • the end of the claw portion 30c on the positive side in the z-axis direction is folded toward the negative direction side in the z-axis direction while drawing an arc on the negative direction side in the y-axis direction.
  • the folded portion of the claw portion 30c can be elastically deformed in the positive direction side in the y-axis direction.
  • the end portion on the negative direction side in the z-axis direction of the claw portion 30c is bent toward the positive direction side in the y-axis direction.
  • the housing 32 is a plate-like member having the same shape as the housing 30, and is provided on the upper surface of the mounting substrate 100.
  • the housing 32 is disposed symmetrically with the housing 30 with respect to the plane S1. That is, the housing 32 is provided so as to surround a part of the module substrate 20 on both the positive side in the x-axis direction and the positive and negative sides in the y-axis direction.
  • the housing 32 and the housing 30 are the same shapes, description of the detailed shape of the housing 32 is abbreviate
  • the bushing 40 is surrounded by the housing 30 on the negative side in the x-axis direction and on both the positive and negative sides in the y-axis direction. Thereby, the bushing 40 is fixed to the upper surface of the mounting substrate 100. Further, as shown in FIG. 8, the bushing 40 is located between the module substrate 20 and the mounting substrate 100 in the z-axis direction. As shown in FIG. 5, the bushing 40 has a rectangular shape having a long side in the y-axis direction when viewed in plan from the z-axis direction. The shape of the bushing 40 is L-shaped when viewed in plan from the y-axis direction.
  • the bushing 40 is provided with a plurality of slits that penetrate the bushing 40 in the z-axis direction and are parallel to the x-axis direction. A plurality of holes (not shown) for holding terminals 50a to 50o described later are provided on the lower surface of the bushing 40.
  • a liquid crystal polymer is mentioned, for example. As described above, the bushing 40 determines the positions of the terminals 50a to 50o and holds the insulating properties of the terminals 50a to 50o.
  • the bushing 42 is surrounded by the housing 32 on both the positive side in the x-axis direction and the positive and negative sides in the y-axis direction. Thereby, the bushing 42 is fixed to the upper surface of the mounting substrate 100. Further, as shown in FIG. 8, the bushing 42 is located between the module substrate 20 and the mounting substrate 100 in the z-axis direction. That is, the bushing 42 is arranged symmetrically with respect to the bushing 40 and the plane S1. Since the bushing 42 is a member having the same shape as the bushing 40, a detailed description of the shape of the bushing 42 is omitted.
  • Terminals 50 a to 50 o and 52 a to 52 o are provided on the upper surface of the mounting substrate 100.
  • Each of the terminals 50a to 50o and 52a to 52o is a rod-shaped member as shown in FIG. Further, one end side of each of the terminals 50a to 50o and 52a to 52o is bent toward the positive direction side in the z-axis direction (from the other main surface side to the one main surface side). Further, a protrusion extending toward the positive side in the z-axis direction is provided on the other end side of each of the terminals 50a to 50o and 52a to 52o. Further, the other ends of the terminals 50a to 50o and 52a to 52o are connected to a circuit provided on the mounting substrate 100.
  • the terminals 50a to 50o and the terminals 52a to 52o are arranged symmetrically with respect to the plane S1.
  • the terminals 50a to 50o are arranged in this order from the negative direction side in the y-axis direction to the positive direction side.
  • One end of each of the terminals 50a to 50o is inserted into a slit provided in the bushing 40.
  • One end of the terminals 50a to 50o protrudes from the slit.
  • the protrusions provided on the terminals 50a to 50o are inserted into holes provided on the lower surface of the bushing 40, and the other ends of the terminals 50a to 50o are sandwiched between the bushing 40 and the mounting substrate 100. As a result, the terminals 50a to 50o are held by the bushing 40.
  • the terminals 52a to 52o are arranged in this order from the negative direction side in the y-axis direction to the positive direction side.
  • One end of each of the terminals 52a to 52o is inserted into a slit provided in the bushing 42.
  • One end of each of the terminals 52a to 52o protrudes from the slit.
  • the protrusions provided on the terminals 52a to 52o are inserted into the holes provided on the lower surface of the bushing 42, and the other ends of the terminals 50a to 50o are sandwiched between the bushing 42 and the mounting substrate 100. As a result, the terminals 52a to 52o are held by the bushing.
  • the module substrate 20 is surrounded by the housings 30 and 32 from the positive side in the z-axis direction to the negative side as shown in FIGS.
  • one end of each of the terminals 50a to 50o and 52a to 52o protruding from the slits of the bushings 40 and 42 comes into contact with the mounting electrodes 26a to 26o and 27a to 27o.
  • the module 22 on the module substrate 20 and the circuit provided on the mounting substrate 100 are electrically connected.
  • the module substrate 20 has the claws 30b, 30c, 32b, and 32c of the housings 30 and 32 holding the outer edge of the module substrate 20 from the positive direction side in the z-axis direction to the negative direction side (from one main surface to the mounting substrate). By attaching, it is fixed in the housings 30 and 32.
  • the housings 30 and 32, the bushings 40 and 42, the terminals 50a to 50o, 52a to 52o, and the mounting substrate 100 are prepared.
  • the terminals 50 a to 50 o are inserted into the slits of the bushing 40.
  • the terminals 52 a to 52 o are inserted into the slits of the bushing 42.
  • the bushing 40 in which the terminals 50a to 50o are inserted is fitted into the housing 30. Further, the bushing 42 into which the terminals 52a to 52o are inserted is fitted into the housing 32.
  • the bushing 40, the terminals 50a to 50o and the housing 30 are integrated, these are bonded and fixed to the mounting substrate 100 with solder. Soldering for bonding and fixing to the mounting substrate 100 is performed on the other ends of the terminals 50a to 50o and the claw portions 30b and 30c of the housing 30.
  • the bushing 42, the terminals 52a to 52o, and the housing 32 are also bonded and fixed to the mounting substrate 100 in the same manner as described above.
  • the module substrate 20 is inserted into a region surrounded by the housings 30 and 32.
  • the claw portions 30b, 30c, 32b, and 32c of the housings 30 and 32 press the module substrate 20 from the positive z-axis direction toward the negative direction, thereby fixing the module substrate 20 to the mounting substrate 100. .
  • an intermediate member for preventing a short circuit when the module substrate 20 is fixed to the mounting substrate 100 is not required.
  • the mounting electrode is provided only on the lower surface (the other main surface) of the module substrate 20, there is no contact member 522 that is used in the multicontact connector 500. .
  • the housings 30 and 32 made of metal (spring phosphor bronze) come into contact with the outer edge of the module substrate 20, there is no possibility of short-circuiting.
  • the multipolar connector 10 does not require an intermediate member for preventing a short circuit when the module substrate 20 is fixed to the mounting substrate 100.
  • module electrodes 24 a to 24 o and 25 a to 25 o provided on the upper surface of the module substrate 20 and mounting electrodes 26 a to 26 o and 27 a to 27 o provided on the lower surface of the module substrate 20 are provided.
  • the module substrate 20 is connected via a via-hole conductor that penetrates in the z-axis direction. As a result, the multipolar connector 10 does not require the contact member 522 used in the multi-contact connector 500.
  • the multi-pole connector 10 does not require the contact member 522 used in the multi-contact connector 500, the multi-contact connector 500 can be downsized.
  • the claws 30b, 30c, 32b, and 32c in the housings 30 and 32 press the module substrate 20 against the mounting substrate 100, and terminals 50a to 50o and 52a to be bent in a direction opposite to the force.
  • the contact between the mounting electrodes 26a to 26o and 27a to 27o and the terminals 50a to 50o and 52a to 52o is maintained using the spring force of 52o. Therefore, in the multipolar connector 10, it is not necessary to perform a joining operation such as soldering in order to keep the mounting electrodes 26a to 26o and 27a to 27o in contact with the terminals 50a to 50o and 52a to 52o.
  • FIG. 9 is an external perspective view of the multipolar connector 10-1.
  • FIG. 10 is an external perspective view of one main surface side of the module substrate 20-1 in the multipolar connector 10-1.
  • FIG. 11 is an external perspective view of the other main surface side of the module substrate 20-1 in the multipolar connector 10-1.
  • FIG. 12 is an external perspective view of the housing 30-1 in the multipolar connector 10-1.
  • FIG. 13 is an external perspective view of the bushing 40-1 in the multipolar connector 10-1.
  • FIG. 14 is an external perspective view of terminals 50-1a to 50-1z and 52-1a to 52-1z in the multipolar connector 10-1.
  • the main difference between the multipolar connector 10 and the multipolar connector 10-1 is the arrangement of mounting electrodes and the arrangement of terminals. It should be noted that the points that are not different between the multipolar connector 10 and the multipolar connector 10-1 are not described and are denoted by the same reference numerals as those of the multipolar connector 10.
  • the module substrate 20-1 in the multipolar connector 10-1 has a module 22-1 and a module electrode 24-1a on the surface (one main surface) on the positive side in the z-axis direction of the main body substrate. To 24-1z and 25-1a to 25-1z. Further, as shown in FIG. 11, the module substrate 20-1 has mounting electrodes 26-1a to 26-1z, 27-1a to 27-1a on the negative side surface (the other main surface) in the z-axis direction of the main body substrate. 27-1z. In the module substrate 20-1, a via-hole conductor (not shown) that penetrates the module substrate 20-1 in the z-axis direction is provided. As a result, the module electrodes 24-1a to 24-1z and 25-1a to 25-1z are electrically connected to the mounting electrodes 26-1a to 26-1z and 27-1a to 27-1z, respectively. Has been.
  • the module electrodes 24-1a to 24-1z and 25-1a to 25-1z are provided on the upper surface of the main body substrate of the module substrate 20-1, as shown in FIG.
  • the module electrodes 24-1a to 24-1m are arranged along the side on the negative side in the x-axis direction that forms the outer edge of the module substrate 20-1 from the negative direction side in the y-axis direction toward the positive direction side. They are arranged in order.
  • the module electrodes 24-1n to 24-1z extend from the negative side in the x-axis direction toward the positive side along the side on the positive side in the y-axis direction that forms the outer edge of the module substrate 20-1. They are arranged in order.
  • the module electrodes 25-1a to 25-1m extend from the negative side in the x-axis direction toward the positive side along the side on the negative side in the y-axis direction that forms the outer edge of the module substrate 20-1. They are arranged in order.
  • the module electrodes 25-1n to 25-1z extend from the negative side in the y-axis direction to the positive side along the side on the positive side in the x-axis direction that forms the outer edge of the module substrate 20-1. They are arranged in order.
  • the module electrodes 24-1a to 24-1z and 25-1a to 25-1z are connected to the module 22-1. Further, each of the module electrodes 24-1a to 24-1z and 25-1a to 25-1z is mounted on the mounting electrodes 26-1a to 26- via via-hole conductors that penetrate the module substrate 20-1 in the z-axis direction. 1z, 27-1a to 27-1z.
  • the mounting electrodes 26-1a to 26-1z and 27-1a to 27-1z are provided on the lower surface of the main body substrate of the module substrate 20-1, as shown in FIG.
  • the mounting electrodes 26-1a to 26-1m are arranged along the side on the negative direction side in the x-axis direction that forms the outer edge of the module substrate 20-1 from the negative direction side in the y-axis direction toward the positive direction side. They are arranged in order.
  • the mounting electrodes 26-1n to 26-1z are arranged in this order from the negative side in the x-axis direction to the positive side along the side on the positive side in the y-axis direction that forms the outer edge of the module substrate 20. It is provided as follows.
  • the mounting electrodes 27-1a to 27-1m are arranged in this order from the negative direction side in the x-axis direction toward the positive direction side along the side on the negative direction side in the y-axis direction that forms the outer edge of the module substrate 20. It is provided as follows.
  • the mounting electrodes 27-1n to 27-1z extend from the negative direction side in the y-axis direction toward the positive direction side along the side on the positive direction side in the x-axis direction that forms the outer edge of the module substrate 20-1. They are arranged in order. That is, the mounting electrodes 26-1a to 26z and 27-1a to 27-1z are provided along the four sides forming the outer edge of the module substrate 20-1.
  • the housing 30-1 is provided on the upper surface of the mounting substrate 100 on both the positive and negative sides of the module substrate 20-1 in the x-axis direction, the positive side in the y-axis direction, and the negative direction side in the y-axis direction. It is a plate-like member provided so as to surround a part. Further, as shown in FIG. 12, the housing 30-1 has four claw portions 30-1a to 30-1d.
  • the bushing 40-1 is surrounded by the housing 30-1 on the negative side in the x-axis direction and on both the positive and negative sides in the y-axis direction on the upper surface of the mounting substrate 100. As shown in FIG. 13, the shape of the bushing 40-1 is a square shape when viewed in plan from the z-axis direction. A plurality of grooves parallel to the z-axis direction are provided on the inner periphery of the bushing 40-1.
  • Terminals 50-1a to 50-1z and 52-1a to 52-1z correspond to the four mounting electrodes 26-1a to 26z and 27-1a to 27-1z that form the outer edge of the module substrate 20-1. It is provided parallel to the side.
  • Each of the terminals 50-1a to 50-1z and 52-1a to 52-1z is a rod-shaped member as shown in FIG. Also, after one end of each of the terminals 50-1a to 50-1z and 52-1a to 52-1z is bent vertically toward the positive side in the z-axis direction (from the other main surface side to the one main surface side), , The inclination is relaxed and the shape advances to the positive side in the z-axis direction.
  • the other ends of the terminals 50-1a to 50-1z and 52-1a to 52-1z are connected to a circuit provided on the mounting substrate 100. Further, the portions of the terminals 50-1a to 50-1z and 52-1a to 52-1z that are bent perpendicularly to the positive side in the z-axis direction are inserted into the grooves provided in the bushing 40-1. As a result, the terminals 50-1a to 50-1z and 52-1a to 52-1z are held by the bushing 40-1.
  • the multipolar connector 10-1 configured as described above has more contacts than the multipolar connector 10 because the electrodes are provided along all four sides of the module substrate.
  • the multipolar connector according to the present invention is not limited to the multipolar connector 10 and the multipolar connector 10-1 which is a modification thereof, and can be changed within the scope of the gist thereof.
  • the number of mounting electrodes may be changed.
  • the present invention is useful for a multipolar connector that connects a module board on which various electronic components are mounted and a mounting board on which the module board is mounted, and in particular, the module board is fixed to the mounting board. This is excellent in that an intermediate member for preventing a short circuit is not required.

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  • Coupling Device And Connection With Printed Circuit (AREA)

Abstract

The purpose of the present invention is to provide a multipole connector which does not require an intermediate member for preventing short-circuiting when affixing a module substrate to a mounting substrate. The multipole connector (10) is provided on a mounting substrate (100), and is equipped with a module substrate (20), a housing (30), and a contact member (50). Mounting electrodes (24, 25) are positioned on the other principal surface of the module substrate (20). The housing (30) presses the module substrate (20) onto the mounting substrate (100) from the first-principal-surface side. The contact member (50) is positioned on the mounting substrate (100), and contacts the mounting electrodes (24, 25).

Description

多極コネクタMulti-pole connector
　本発明は、多極コネクタに関し、特に、各種電子部品を搭載したモジュール基板と、該モジュール基板を搭載する実装用基板とを接続する多極コネクタに関する。 The present invention relates to a multipolar connector, and more particularly, to a multipolar connector that connects a module substrate on which various electronic components are mounted and a mounting substrate on which the module substrate is mounted.
　従来の多極コネクタに関する発明としては、例えば、特許文献１に記載の多接点コネクタが知られている。図１５は、特許文献１に記載の多接点コネクタ５００の断面図である。 For example, a multi-contact connector described in Patent Document 1 is known as an invention related to a conventional multi-pole connector. FIG. 15 is a cross-sectional view of the multi-contact connector 500 described in Patent Document 1.
　多接点コネクタ５００は、図１５に示すように、底部部材５１２、頂部部材５１３及びバネ部材５２６を備えている。底部部材５１２は、実装用基板５１０上に設けられている。 15, the multi-contact connector 500 includes a bottom member 512, a top member 513, and a spring member 526. The bottom member 512 is provided on the mounting substrate 510.
　底部部材５１２は、複数の接点部材５１６を有しており、この接点部材５１６の一端が、実装用基板５１０の回路パターン５１９と接続されている。また、接点部材５１６の他端は、頂部部材５１３に設けられた接触部材５２２の一端と接続されている。 The bottom member 512 has a plurality of contact members 516, and one end of the contact member 516 is connected to the circuit pattern 519 of the mounting substrate 510. Further, the other end of the contact member 516 is connected to one end of a contact member 522 provided on the top member 513.
　頂部部材５１３は、ベース５２０、中間部材５２１及び接触部材５２２により構成されている。ベース５２０は、モジュール基板５１１の外縁に設けられている。接触部材５２２は、ベース５２０に設けられ、Ｕ字型を成している。接触部材５２２は、モジュール基板５１１の表面から裏面に回り込むことによって、モジュール基板５１１上の接点パッド５２４と底部部材５１２の接点部材５１６とを接続している。これにより、モジュール基板５１１の接点パッド５２４と実装用基板５１０の回路パターン５１９とが電気的に接続されている。中間部材５２１は、接触部材５２２とバネ部材５２６との間に位置する。また、バネ部材５２６は、中間部材５２１を介して、モジュール基板５１１を実装用基板５１０に固定している。 The top member 513 includes a base 520, an intermediate member 521, and a contact member 522. The base 520 is provided on the outer edge of the module substrate 511. The contact member 522 is provided on the base 520 and has a U shape. The contact member 522 connects the contact pad 524 on the module substrate 511 and the contact member 516 of the bottom member 512 by wrapping around from the front surface to the back surface of the module substrate 511. Thereby, the contact pads 524 of the module substrate 511 and the circuit pattern 519 of the mounting substrate 510 are electrically connected. The intermediate member 521 is located between the contact member 522 and the spring member 526. Further, the spring member 526 fixes the module substrate 511 to the mounting substrate 510 via the intermediate member 521.
　ところで、モジュール基板５１１を固定するバネ部材５２６の材料には、バネ性を持たせるため、一般的に金属が用いられる。また、モジュール基板５１１の外縁には、モジュール基板５１１の接点パッド５２４と実装用基板５１０の回路パターン５１９とを電気的に接続するための接触部材５２２が設けられている。従って、モジュール基板５１１を実装用基板５１０に固定する際に、接触部材５２２とバネ部材５２６とが接触すると、回路がショートするおそれがある。これを防ぐため、多接点コネクタ５００では、バネ部材５２６とモジュール基板５１１との間に中間部材５２１が設けられている。つまり、多接点コネクタ５００では、モジュール基板５１１を実装用基板５１０に固定する際のショートを防ぐために中間部材５２１が必要だった。 Incidentally, a metal is generally used for the material of the spring member 526 for fixing the module substrate 511 in order to provide a spring property. Further, a contact member 522 for electrically connecting the contact pads 524 of the module substrate 511 and the circuit pattern 519 of the mounting substrate 510 is provided on the outer edge of the module substrate 511. Therefore, when the module substrate 511 is fixed to the mounting substrate 510, if the contact member 522 and the spring member 526 come into contact with each other, the circuit may be short-circuited. In order to prevent this, in the multi-contact connector 500, an intermediate member 521 is provided between the spring member 526 and the module substrate 511. That is, in the multi-contact connector 500, the intermediate member 521 is required to prevent a short circuit when the module substrate 511 is fixed to the mounting substrate 510.
特開昭６０－１５８５７８号公報JP-A-60-158578
　そこで、本発明の目的は、モジュール基板を実装用基板に固定する際のショートを防ぐための中間部材を必要としない多極コネクタを提供することである。 Therefore, an object of the present invention is to provide a multipolar connector that does not require an intermediate member for preventing a short circuit when a module substrate is fixed to a mounting substrate.
　本発明に係る多極コネクタは、実装用基板に設けられた多極コネクタであって、一方主面及び他方主面を有し、他方主面のみに設けられた複数の実装用電極を有するモジュール基板と、前記モジュール基板を前記一方主面側から実装用基板に押え付けることにより固定するハウジングと、前記実装用基板上に設けられ、前記複数の実装用電極と接触する複数の接点部材と、を備えていることを特徴とする。 The multipolar connector according to the present invention is a multipolar connector provided on a mounting board, and has a first main surface and the other main surface, and a module having a plurality of mounting electrodes provided only on the other main surface. A substrate, a housing for fixing the module substrate by pressing against the mounting substrate from the one main surface side, a plurality of contact members provided on the mounting substrate and in contact with the plurality of mounting electrodes; It is characterized by having.
　本発明に係る多極コネクタによれば、モジュール基板を実装用基板に固定する際のショートを防ぐための中間部材が不要である。 The multipolar connector according to the present invention does not require an intermediate member for preventing a short circuit when the module substrate is fixed to the mounting substrate.
本発明の一形態に係る多極コネクタ及び実装用基板の外観斜視図である。1 is an external perspective view of a multipolar connector and a mounting board according to an embodiment of the present invention. 本発明の一形態に係る多極コネクタの分解斜視図である。It is a disassembled perspective view of the multipolar connector which concerns on one form of this invention. 本発明の一形態に係る多極コネクタにおけるモジュール基板の他方主面側の外観斜視図である。It is an external appearance perspective view of the other main surface side of the module board in the multipolar connector which concerns on one form of this invention. 本発明の一形態に係る多極コネクタにおけるハウジングの外観斜視図である。It is an external appearance perspective view of the housing in the multipolar connector concerning one form of the present invention. 本発明の一形態に係る多極コネクタにおけるブッシングの外観斜視図である。It is an external appearance perspective view of the bushing in the multipolar connector which concerns on one form of this invention. 本発明の一形態に係る多極コネクタにおけるターミナルの外観斜視図である。It is an appearance perspective view of a terminal in a multipolar connector concerning one form of the present invention. 本発明の一形態に係る多極コネクタ及び実装用基板におけるモジュール基板装着前の断面図である。It is sectional drawing before the module board mounting | wearing in the multipolar connector and mounting board | substrate which concern on one form of this invention. 本発明の一形態に係る多極コネクタ及び実装用基板におけるモジュール基板装着後の断面図である。It is sectional drawing after the module board mounting | wearing in the multipolar connector which concerns on one form of this invention, and the board | substrate for mounting. 本発明の一形態に係る多極コネクタの変形例及び実装用基板の外観斜視図である。It is the external appearance perspective view of the modification of the multipolar connector which concerns on one form of this invention, and the mounting board | substrate. 本発明の一形態に係る多極コネクタの変形例におけるモジュール基板の一方主面側の外観斜視図である。It is an external appearance perspective view of the one main surface side of the module board | substrate in the modification of the multipolar connector which concerns on one form of this invention. 本発明の一形態に係る多極コネクタの変形例におけるモジュール基板の他方主面側の外観斜視図である。It is an external appearance perspective view of the other main surface side of the module board | substrate in the modification of the multipolar connector which concerns on one form of this invention. 本発明の一形態に係る多極コネクタの変形例におけるハウジングの外観斜視図である。It is an external appearance perspective view of the housing in the modification of the multipolar connector which concerns on one form of this invention. 本発明の一形態に係る多極コネクタの変形例におけるブッシングの外観斜視図である。It is an external appearance perspective view of the bushing in the modification of the multipolar connector which concerns on one form of this invention. 本発明の一形態に係る多極コネクタの変形例におけるターミナルの外観斜視図である。It is an external appearance perspective view of the terminal in the modification of the multipolar connector which concerns on one form of this invention. 特許文献１に記載の多接点コネクタの断面図である。1 is a cross-sectional view of a multi-contact connector described in Patent Document 1. FIG.
　以下に、本発明の一形態に係る多極コネクタ及びその製造方法について説明する。 Hereinafter, a multipolar connector and a manufacturing method thereof according to an embodiment of the present invention will be described.
（多極コネクタの構成）
　以下で、本発明の一形態に係る多極コネクタの構成について図面を参照しながら説明する。図１は、本発明の一形態に係る多極コネクタ１０及び実装用基板１００の外観斜視図である。図２は、本発明の一形態に係る多極コネクタ１０の分解斜視図である。図３は、本発明の一形態に係る多極コネクタ１０におけるモジュール基板２０の他方主面の外観斜視図である。図４は、本発明の一形態に係る多極コネクタ１０におけるハウジング３０，３２の外観斜視図である。図５は本発明の一形態に係る多極コネクタ１０におけるブッシング４０，４２の外観斜視図である。図６は、本発明の一形態に係る多極コネクタ１０におけるターミナル５０ａ～５０ｏ、５２ａ～５２ｏの外観斜視図である。図７は、本発明の一形態に係る多極コネクタ１０及び実装用基板１００におけるモジュール基板２０装着前の断面図である。図８は、本発明の一形態に係る多極コネクタ１０及び実装用基板１００におけるモジュール基板２０装着後の断面図である。以下で、モジュール基板２０の主面と直交する方向をｚ軸方向とし、モジュール基板２０の外縁を成す各辺に沿った方向を、ｘ軸方向及びｙ軸方向とする。なお、ｘ軸、ｙ軸及びｚ軸は互いに直交している。また、図４におけるｘ軸、ｙ軸及びｚ軸はハウジング３０に対応しており、ハウジング３２には対応していない。さらに、図５におけるｘ軸、ｙ軸及びｚ軸はブッシング４０に対応しており、ブッシング４２には対応していない。 (Configuration of multi-pole connector)
Hereinafter, a configuration of a multipolar connector according to an embodiment of the present invention will be described with reference to the drawings. FIG. 1 is an external perspective view of a multipolar connector 10 and a mounting board 100 according to an embodiment of the present invention. FIG. 2 is an exploded perspective view of the multipolar connector 10 according to one embodiment of the present invention. FIG. 3 is an external perspective view of the other main surface of the module substrate 20 in the multipolar connector 10 according to one embodiment of the present invention. FIG. 4 is an external perspective view of the housings 30 and 32 in the multipolar connector 10 according to one embodiment of the present invention. FIG. 5 is an external perspective view of the bushings 40 and 42 in the multipolar connector 10 according to one embodiment of the present invention. FIG. 6 is an external perspective view of terminals 50a to 50o and 52a to 52o in multipolar connector 10 according to one embodiment of the present invention. FIG. 7 is a cross-sectional view of the multipolar connector 10 and the mounting board 100 according to an embodiment of the present invention before the module board 20 is mounted. FIG. 8 is a cross-sectional view of the multipolar connector 10 and the mounting board 100 according to an embodiment of the present invention after the module board 20 is mounted. Hereinafter, a direction orthogonal to the main surface of the module substrate 20 is defined as a z-axis direction, and directions along each side forming the outer edge of the module substrate 20 are defined as an x-axis direction and a y-axis direction. Note that the x-axis, y-axis, and z-axis are orthogonal to each other. Further, the x axis, the y axis, and the z axis in FIG. 4 correspond to the housing 30 and do not correspond to the housing 32. Furthermore, the x-axis, y-axis, and z-axis in FIG. 5 correspond to the bushing 40 and do not correspond to the bushing 42.
　多極コネクタ１０は、図１に示すように、実装用基板１００のｚ軸方向の正方向側の面に設けられている。また、多極コネクタ１０は、図２に示すように、モジュール基板２０、ハウジング３０，３２、ブッシング４０，４２、ターミナル（接点部材）５０ａ～５０ｏ、５２ａ～５２ｏを備えている。また、多極コネクタ１０は、ｚ軸方向から平面視したときに、略正方形状を成している。 The multipolar connector 10 is provided on the surface on the positive direction side in the z-axis direction of the mounting substrate 100 as shown in FIG. As shown in FIG. 2, the multipolar connector 10 includes a module substrate 20, housings 30 and 32, bushings 40 and 42, and terminals (contact members) 50a to 50o and 52a to 52o. The multipolar connector 10 has a substantially square shape when viewed in plan from the z-axis direction.
　モジュール基板２０は、図２に示すように、ｚ軸方向の正方向側の面（一方主面）にモジュール２２及びモジュール用電極２４ａ～２４ｏ，２５ａ～２５ｏを備えている。さらに、モジュール基板２０は、図３に示すように、ｚ軸方向の負方向側の面（他方主面）に、実装用電極２６ａ～２６ｏ，２７ａ～２７ｏを備えている。また、モジュール基板２０は、板状の部材であり、ｚ軸方向から平面視したときに、略正方形状を成している。そして、モジュール基板２０内には、モジュール基板２０をｚ軸方向に貫くビアホール導体（図示しない）が設けられている。これにより、モジュール用電極２４ａ～２４ｏ，２５ａ～２５ｏのそれぞれと実装用電極２６ａ～２６ｏ，２７ａ～２７ｏのそれぞれとが電気的に接続されている。なお、以下で、ｚ軸方向の正方向側の面を上面とし、ｚ軸方向の負方向側の面を下面とする。 As shown in FIG. 2, the module substrate 20 includes a module 22 and module electrodes 24a to 24o and 25a to 25o on the positive side surface (one main surface) in the z-axis direction. Further, as shown in FIG. 3, the module substrate 20 includes mounting electrodes 26a to 26o and 27a to 27o on the surface on the negative direction side (the other main surface) in the z-axis direction. Further, the module substrate 20 is a plate-like member and has a substantially square shape when viewed in plan from the z-axis direction. A via-hole conductor (not shown) that penetrates the module substrate 20 in the z-axis direction is provided in the module substrate 20. Accordingly, the module electrodes 24a to 24o and 25a to 25o are electrically connected to the mounting electrodes 26a to 26o and 27a to 27o, respectively. Hereinafter, the surface on the positive direction side in the z-axis direction is referred to as the upper surface, and the surface on the negative direction side in the z-axis direction is referred to as the lower surface.
　モジュール２２は、図２に示すように、モジュール基板２０における基板本体の上面に設けられている。また、モジュール２２は、ｚ軸方向から平面視したときに、略正方形状を成している。モジュール２２は、ｙ軸方向の負方向側の側面において、ケーブル８０と接続されている。また、モジュール２２は、その下面において、後述するモジュール用電極２４ａ～２４ｏ，２５ａ～２５ｏと接続されている。なお、モジュール２２は、例えばケーブル８０から送られてくる信号を処理する集積回路などである。 The module 22 is provided on the upper surface of the substrate body in the module substrate 20 as shown in FIG. Further, the module 22 has a substantially square shape when viewed in plan from the z-axis direction. The module 22 is connected to the cable 80 on the side surface on the negative direction side in the y-axis direction. The module 22 is connected to module electrodes 24a to 24o and 25a to 25o described later on the lower surface thereof. The module 22 is, for example, an integrated circuit that processes a signal sent from the cable 80.
　モジュール用電極２４ａ～２４ｏ，２５ａ～２５ｏは、図２に示すように、モジュール基板２０における基板本体の上面に設けられている。モジュール用電極２４ａ～２４ｏは、モジュール基板２０の外縁を成すｘ軸方向の負方向側の辺に沿って、ｙ軸方向の負方向側から正方向側に向かって、この順に並ぶように設けられている。モジュール用電極２５ａ～２５ｏは、モジュール基板２０の外縁を成すｘ軸方向の正方向側の辺に沿って、ｙ軸方向の負方向側から正方向側に向かって、この順に並ぶように設けられている。従って、モジュール用電極２４ａ～２４ｏとモジュール用電極２５ａ～２５ｏとは、モジュール基板２０の中心を通り、ｙ軸及びｚ軸と平行な平面Ｓ１に関して、対称に配置されている。なお、モジュール用電極２４ａ～２４ｏ，２５ａ～２５ｏのそれぞれは、ｚ軸方向から見たとき、ｘ軸方向を長辺とする長方形状を成している。また、モジュール用電極２４ａ～２４ｏ，２５ａ～２５ｏのそれぞれは、モジュール２２と接続されている。さらに、モジュール用電極２４ａ～２４ｏ，２５ａ～２５ｏのそれぞれは、モジュール基板２０の基板本体をｚ軸方向に貫くビアホール導体を介して、実装用電極２６ａ～２６ｏ，２７ａ～２７ｏと接続されている。 The module electrodes 24a to 24o and 25a to 25o are provided on the upper surface of the substrate body in the module substrate 20, as shown in FIG. The module electrodes 24a to 24o are provided so as to be arranged in this order from the negative direction side in the y-axis direction toward the positive direction side along the side on the negative direction side in the x-axis direction that forms the outer edge of the module substrate 20. ing. The module electrodes 25a to 25o are provided so as to be arranged in this order from the negative direction side in the y-axis direction to the positive direction side along the side on the positive direction side in the x-axis direction that forms the outer edge of the module substrate 20. ing. Therefore, the module electrodes 24a to 24o and the module electrodes 25a to 25o are arranged symmetrically with respect to a plane S1 that passes through the center of the module substrate 20 and is parallel to the y axis and the z axis. Each of the module electrodes 24a to 24o and 25a to 25o has a rectangular shape having a long side in the x-axis direction when viewed from the z-axis direction. Each of the module electrodes 24 a to 24 o and 25 a to 25 o is connected to the module 22. Furthermore, each of the module electrodes 24a to 24o and 25a to 25o is connected to the mounting electrodes 26a to 26o and 27a to 27o via via-hole conductors that penetrate the substrate body of the module substrate 20 in the z-axis direction.
　実装用電極２６ａ～２６ｏ，２７ａ～２７ｏは、図３に示すように、モジュール基板２０の基板本体の下面に設けられている。実装用電極２６ａ～２６ｏは、モジュール基板２０の外縁を成すｘ軸方向の負方向側の辺に沿って、ｙ軸方向の負方向側から正方向側に向かって、この順に並ぶように設けられている。実装用電極２７ａ～２７ｏは、モジュール基板２０の外縁を成すｘ軸方向の正方向側の辺に沿って、ｙ軸方向の負方向側から正方向側に向かって、この順に並ぶように設けられている。つまり、実装用電極２６ａ～２６ｏ，２７ａ～２７ｏは、モジュール基板２０の外縁を成し、かつ、隣り合わないｘ軸方向の正負両側の辺に沿って設けられている。なお、実装用電極２６ａ～２６ｏと実装用電極２７ａ～２７ｏとは、平面Ｓ１に関して、対称に配置されている。実装用電極２６ａ～２６ｏ，２７ａ～２７ｏのそれぞれは、ｘ軸方向と平行な細長い形状を成し、モジュール基板２０の外縁側から内側に向かうに従って、徐々に細くなっている。また、実装用電極２６ａ～２６ｏ，２７ａ～２７ｏのそれぞれは、モジュール基板２０の基板本体をｚ軸方向に貫くビアホール導体を介して、モジュール用電極２４ａ～２４ｏ，２５ａ～２５ｏと接続されている。 The mounting electrodes 26a to 26o and 27a to 27o are provided on the lower surface of the substrate body of the module substrate 20, as shown in FIG. The mounting electrodes 26a to 26o are provided so as to be arranged in this order from the negative side in the y-axis direction to the positive side along the side on the negative side in the x-axis direction that forms the outer edge of the module substrate 20. ing. The mounting electrodes 27a to 27o are provided so as to be arranged in this order from the negative direction side in the y-axis direction to the positive direction side along the side on the positive direction side in the x-axis direction that forms the outer edge of the module substrate 20. ing. That is, the mounting electrodes 26a to 26o and 27a to 27o form the outer edge of the module substrate 20 and are provided along the positive and negative sides in the x-axis direction that are not adjacent to each other. The mounting electrodes 26a to 26o and the mounting electrodes 27a to 27o are arranged symmetrically with respect to the plane S1. Each of the mounting electrodes 26a to 26o and 27a to 27o has an elongated shape parallel to the x-axis direction, and gradually becomes thinner from the outer edge side of the module substrate 20 toward the inside. Each of the mounting electrodes 26a to 26o and 27a to 27o is connected to the module electrodes 24a to 24o and 25a to 25o via via-hole conductors that penetrate the substrate body of the module substrate 20 in the z-axis direction.
　ハウジング３０は、実装用基板１００の上面において、モジュール基板２０のｘ軸方向の負方向側及びｙ軸方向の正負両側の一部を囲むように設けられている。また、ハウジング３０は、１枚の金属板が折り曲げられて作製された板状部材であり、図４に示すように、ｚ軸方向から平面視したときに、コの字型の形状を成す。さらに、ハウジング３０は、ブリッジ部３０ａ、爪部３０ｂ，３０ｃの３つの部分に分けられる。なお、ハウジング３０の材料としては、バネ用リン青銅が挙げられる。 The housing 30 is provided on the upper surface of the mounting substrate 100 so as to surround a part of the negative side in the x-axis direction and the positive and negative sides in the y-axis direction of the module substrate 20. The housing 30 is a plate-like member produced by bending a single metal plate, and has a U-shape when viewed in plan from the z-axis direction, as shown in FIG. Further, the housing 30 is divided into three parts: a bridge part 30a and claw parts 30b and 30c. The material of the housing 30 includes phosphor bronze for springs.
　ブリッジ部３０ａは、モジュール基板２０の外縁を成すｘ軸方向の負方向側の辺に沿って設けられている。また、ブリッジ部３０ａは、図２に示すように、平面Ｓ１に平行な板状部材である。さらに、ブリッジ部３０ａにおけるｚ軸方向の負方向側は、図４に示すように、ｘ軸方向から平面視したときに、長方形状に切り抜かれている。 The bridge portion 30 a is provided along the side on the negative side in the x-axis direction that forms the outer edge of the module substrate 20. Moreover, the bridge | bridging part 30a is a plate-shaped member parallel to plane S1, as shown in FIG. Furthermore, the negative direction side in the z-axis direction of the bridge portion 30a is cut out in a rectangular shape when viewed in plan from the x-axis direction, as shown in FIG.
　爪部３０ｂは、図４に示すように、ハウジング３０のｙ軸方向の負方向側の端部が、ｘ軸方向の正方向側に折り曲げられることにより形成されている。また、爪部３０ｂは、モジュール基板２０の外縁を成すｙ軸方向の負方向側の辺に沿って設けられている。ただし、爪部３０ｂは、モジュール基板２０の外縁を成すｙ軸方向の負方向側の辺におけるｘ軸方向の負方向側の端部近傍にのみ設けられている。さらに、爪部３０ｂのｚ軸方向の正方向側の端部は、ｙ軸方向の正方向側に弧を描きつつ、ｚ軸方向の負方向側に向かって折り返されている。爪部３０ｂがこのような構造を有することによって、モジュール基板２０の取り付け時に、爪部３０ｂの当該折り返された部分がｙ軸方向の負方向側に弾性変形することができる。また、爪部３０ｂのｚ軸方向の負方向側の端部は、ｙ軸方向の負方向側に向かって折り曲げられている。 As shown in FIG. 4, the claw portion 30b is formed by bending the end portion of the housing 30 on the negative direction side in the y-axis direction toward the positive direction side in the x-axis direction. Further, the claw portion 30 b is provided along the side on the negative direction side in the y-axis direction that forms the outer edge of the module substrate 20. However, the claw portion 30b is provided only in the vicinity of the end portion on the negative side in the x-axis direction on the side on the negative direction side in the y-axis direction that forms the outer edge of the module substrate 20. Further, the end on the positive direction side in the z-axis direction of the claw portion 30b is folded toward the negative direction side in the z-axis direction while drawing an arc on the positive direction side in the y-axis direction. When the claw portion 30b has such a structure, when the module substrate 20 is attached, the folded portion of the claw portion 30b can be elastically deformed in the negative direction side in the y-axis direction. Further, the end portion on the negative direction side in the z-axis direction of the claw portion 30b is bent toward the negative direction side in the y-axis direction.
　爪部３０ｃは、図４に示すように、ハウジング３０のｙ軸方向の正方向側の端部が、ｘ軸方向の正方向側に折り曲げられることにより形成されている。また、爪部３０ｃは、モジュール基板２０の外縁を成すｙ軸方向の正方向側の辺に沿って設けられている。ただし、爪部３０ｃは、モジュール基板２０の外縁を成すｙ軸方向の正方向側の辺におけるｘ軸方向の負方向側の端部近傍にのみ設けられている。さらに、爪部３０ｃのｚ軸方向の正方向側の端部は、ｙ軸方向の負方向側に弧を描きつつ、ｚ軸方向の負方向側に向かって折り返されている。爪部３０ｃがこのような構造を有することによって、モジュール基板２０の取り付け時に、爪部３０ｃの当該折り返された部分がｙ軸方向の正方向側に弾性変形することができる。また、爪部３０ｃのｚ軸方向の負方向側の端部は、ｙ軸方向の正方向側に向かって折り曲げられている。 As shown in FIG. 4, the claw portion 30 c is formed by bending the end portion of the housing 30 on the positive direction side in the y-axis direction toward the positive direction side in the x-axis direction. Further, the claw portion 30 c is provided along the side on the positive direction side in the y-axis direction that forms the outer edge of the module substrate 20. However, the claw portion 30 c is provided only in the vicinity of the end portion on the negative side in the x-axis direction on the positive side in the y-axis direction that forms the outer edge of the module substrate 20. Furthermore, the end of the claw portion 30c on the positive side in the z-axis direction is folded toward the negative direction side in the z-axis direction while drawing an arc on the negative direction side in the y-axis direction. When the claw portion 30c has such a structure, when the module substrate 20 is attached, the folded portion of the claw portion 30c can be elastically deformed in the positive direction side in the y-axis direction. Further, the end portion on the negative direction side in the z-axis direction of the claw portion 30c is bent toward the positive direction side in the y-axis direction.
　ハウジング３２は、図２に示すように、ハウジング３０と同一形状の板状部材であり、実装用基板１００の上面に設けられている。また、ハウジング３２は、平面Ｓ１に関して、ハウジング３０と対称に配置されている。つまり、ハウジング３２は、モジュール基板２０のｘ軸方向の正方向側及びｙ軸方向の正負両側の一部を囲むように設けられている。なお、ハウジング３２とハウジング３０とは同一の形状であるため、ハウジング３２の詳細な形状の説明は省略する。 As shown in FIG. 2, the housing 32 is a plate-like member having the same shape as the housing 30, and is provided on the upper surface of the mounting substrate 100. The housing 32 is disposed symmetrically with the housing 30 with respect to the plane S1. That is, the housing 32 is provided so as to surround a part of the module substrate 20 on both the positive side in the x-axis direction and the positive and negative sides in the y-axis direction. In addition, since the housing 32 and the housing 30 are the same shapes, description of the detailed shape of the housing 32 is abbreviate | omitted.
　ブッシング４０は、図２に示すように、ｘ軸方向の負方向側及びｙ軸方向の正負両側をハウジング３０に囲まれている。これにより、ブッシング４０は、実装用基板１００の上面に固定される。また、ブッシング４０は、図８に示すように、ｚ軸方向において、モジュール基板２０と実装用基板１００との間に位置する。ブッシング４０の形状は、図５に示すように、ｚ軸方向から平面視したときに、ｙ軸方向を長辺とする長方形状を成している。また、ブッシング４０の形状は、ｙ軸方向から平面視したときに、Ｌ字型を成している。さらに、ブッシング４０には、ブッシング４０をｚ軸方向に貫通し、ｘ軸方向と平行な複数のスリットが設けられている。ブッシング４０の下面には、後述するターミナル５０ａ～５０ｏを保持するための複数の穴（図示しない）が設けられている。なお、ブッシング４０の材料としては、例えば液晶ポリマーが挙げられる。以上より、ブッシング４０は、各ターミナル５０ａ～５０ｏの位置を決めるとともに、各ターミナル５０ａ～５０ｏの絶縁性を保持する役割を担っている。 2, the bushing 40 is surrounded by the housing 30 on the negative side in the x-axis direction and on both the positive and negative sides in the y-axis direction. Thereby, the bushing 40 is fixed to the upper surface of the mounting substrate 100. Further, as shown in FIG. 8, the bushing 40 is located between the module substrate 20 and the mounting substrate 100 in the z-axis direction. As shown in FIG. 5, the bushing 40 has a rectangular shape having a long side in the y-axis direction when viewed in plan from the z-axis direction. The shape of the bushing 40 is L-shaped when viewed in plan from the y-axis direction. Further, the bushing 40 is provided with a plurality of slits that penetrate the bushing 40 in the z-axis direction and are parallel to the x-axis direction. A plurality of holes (not shown) for holding terminals 50a to 50o described later are provided on the lower surface of the bushing 40. In addition, as a material of the bushing 40, a liquid crystal polymer is mentioned, for example. As described above, the bushing 40 determines the positions of the terminals 50a to 50o and holds the insulating properties of the terminals 50a to 50o.
　ブッシング４２は、図２に示すように、ｘ軸方向の正方向側及びｙ軸方向の正負両側をハウジング３２に囲まれている。これにより、ブッシング４２は、実装用基板１００の上面に固定される。また、ブッシング４２は、図８に示すように、ｚ軸方向において、モジュール基板２０と実装用基板１００との間に位置する。つまり、ブッシング４２は、ブッシング４０と平面Ｓ１に関して対称に配置されている。なお、ブッシング４２は、ブッシング４０と同一形状の部材であるため、ブッシング４２の形状に関する詳細な説明は省略する。 2, the bushing 42 is surrounded by the housing 32 on both the positive side in the x-axis direction and the positive and negative sides in the y-axis direction. Thereby, the bushing 42 is fixed to the upper surface of the mounting substrate 100. Further, as shown in FIG. 8, the bushing 42 is located between the module substrate 20 and the mounting substrate 100 in the z-axis direction. That is, the bushing 42 is arranged symmetrically with respect to the bushing 40 and the plane S1. Since the bushing 42 is a member having the same shape as the bushing 40, a detailed description of the shape of the bushing 42 is omitted.
　ターミナル５０ａ～５０ｏ，５２ａ～５２ｏは、実装用基板１００の上面に設けられている。ターミナル５０ａ～５０ｏ，５２ａ～５２ｏそれぞれは、図６に示すように、棒状の部材である。また、ターミナル５０ａ～５０ｏ，５２ａ～５２ｏそれぞれの一端側は、ｚ軸方向の正方向側（他方主面側から一方主面側）に向かって折れ曲がっている。また、ターミナル５０ａ～５０ｏ，５２ａ～５２ｏそれぞれの他端側には、ｚ軸方向の正方向側に向かって伸びる突起が設けられている。さらに、ターミナル５０ａ～５０ｏ，５２ａ～５２ｏそれぞれの他端は、実装用基板１００に設けられた回路と接続されている。なお、ターミナル５０ａ～５０ｏとターミナル５２ａ～５２ｏとは、平面Ｓ１に関して、対称に配置されている。 Terminals 50 a to 50 o and 52 a to 52 o are provided on the upper surface of the mounting substrate 100. Each of the terminals 50a to 50o and 52a to 52o is a rod-shaped member as shown in FIG. Further, one end side of each of the terminals 50a to 50o and 52a to 52o is bent toward the positive direction side in the z-axis direction (from the other main surface side to the one main surface side). Further, a protrusion extending toward the positive side in the z-axis direction is provided on the other end side of each of the terminals 50a to 50o and 52a to 52o. Further, the other ends of the terminals 50a to 50o and 52a to 52o are connected to a circuit provided on the mounting substrate 100. The terminals 50a to 50o and the terminals 52a to 52o are arranged symmetrically with respect to the plane S1.
　ターミナル５０ａ～５０ｏは、図２に示すように、ｙ軸方向の負方向側から正方向側に向かって、この順に並ぶように設けられている。また、ターミナル５０ａ～５０ｏそれぞれの一端は、ブッシング４０に設けられたスリットに挿入される。ターミナル５０ａ～５０ｏの一端は、スリットから飛び出している。これと同時に、ターミナル５０ａ～５０ｏに設けられた突起が、ブッシング４０の下面に設けられた穴に挿入され、ターミナル５０ａ～５０ｏの他端が、ブッシング４０と実装用基板１００とに挟まれる。これにより、ターミナル５０ａ～５０ｏは、ブッシング４０に保持される。 As shown in FIG. 2, the terminals 50a to 50o are arranged in this order from the negative direction side in the y-axis direction to the positive direction side. One end of each of the terminals 50a to 50o is inserted into a slit provided in the bushing 40. One end of the terminals 50a to 50o protrudes from the slit. At the same time, the protrusions provided on the terminals 50a to 50o are inserted into holes provided on the lower surface of the bushing 40, and the other ends of the terminals 50a to 50o are sandwiched between the bushing 40 and the mounting substrate 100. As a result, the terminals 50a to 50o are held by the bushing 40.
　ターミナル５２ａ～５２ｏは、図２に示すように、ｙ軸方向の負方向側から正方向側に向かって、この順に並ぶように設けられている。また、ターミナル５２ａ～５２ｏそれぞれの一端は、ブッシング４２に設けられたスリットに挿入される。ターミナル５２ａ～５２ｏの一端は、スリットから飛び出している。これと同時に、ターミナル５２ａ～５２ｏに設けられた突起が、ブッシング４２の下面に設けられた穴に挿入され、ターミナル５０ａ～５０ｏの他端が、ブッシング４２と実装用基板１００とに挟まれる。これにより、ターミナル５２ａ～５２ｏは、ブッシング４２に保持される。 As shown in FIG. 2, the terminals 52a to 52o are arranged in this order from the negative direction side in the y-axis direction to the positive direction side. One end of each of the terminals 52a to 52o is inserted into a slit provided in the bushing 42. One end of each of the terminals 52a to 52o protrudes from the slit. At the same time, the protrusions provided on the terminals 52a to 52o are inserted into the holes provided on the lower surface of the bushing 42, and the other ends of the terminals 50a to 50o are sandwiched between the bushing 42 and the mounting substrate 100. As a result, the terminals 52a to 52o are held by the bushing.
　以上のように構成された多極コネクタ１０では、図７及び図８に示すように、ｚ軸方向の正方向側から負方向側に向かって、モジュール基板２０がハウジング３０，３２に囲まれた領域に挿入されると、ブッシング４０，４２のスリットから飛び出したターミナル５０ａ～５０ｏ，５２ａ～５２ｏそれぞれの一端が、実装用電極２６ａ～２６ｏ，２７ａ～２７ｏと接触する。その結果、モジュール基板２０上のモジュール２２と実装用基板１００に設けられた回路とが電気的に接続される。また、モジュール基板２０は、ハウジング３０，３２の爪部３０ｂ，３０ｃ，３２ｂ，３２ｃがモジュール基板２０の外縁をｚ軸方向の正方向側から負方向側（一方主面から実装用基板）に押え付けることにより、ハウジング３０，３２内に固定される。 In the multipolar connector 10 configured as described above, the module substrate 20 is surrounded by the housings 30 and 32 from the positive side in the z-axis direction to the negative side as shown in FIGS. When inserted into the region, one end of each of the terminals 50a to 50o and 52a to 52o protruding from the slits of the bushings 40 and 42 comes into contact with the mounting electrodes 26a to 26o and 27a to 27o. As a result, the module 22 on the module substrate 20 and the circuit provided on the mounting substrate 100 are electrically connected. Further, the module substrate 20 has the claws 30b, 30c, 32b, and 32c of the housings 30 and 32 holding the outer edge of the module substrate 20 from the positive direction side in the z-axis direction to the negative direction side (from one main surface to the mounting substrate). By attaching, it is fixed in the housings 30 and 32.
（多極コネクタの製造方法）
　まず、ハウジング３０，３２、ブッシング４０，４２、ターミナル５０ａ～５０ｏ、５２ａ～５２ｏ及び実装用基板１００を準備する。次に、ターミナル５０ａ～５０ｏをブッシング４０のスリットに挿入する。これと同様に、ターミナル５２ａ～５２ｏをブッシング４２のスリットに挿入する。 (Manufacturing method of multipolar connector)
First, the housings 30 and 32, the bushings 40 and 42, the terminals 50a to 50o, 52a to 52o, and the mounting substrate 100 are prepared. Next, the terminals 50 a to 50 o are inserted into the slits of the bushing 40. Similarly, the terminals 52 a to 52 o are inserted into the slits of the bushing 42.
　ターミナル５０ａ～５０ｏが挿入されたブッシング４０を、ハウジング３０に嵌め込む。さらに、ターミナル５２ａ～５２ｏが挿入されたブッシング４２をハウジング３２に嵌め込む。 The bushing 40 in which the terminals 50a to 50o are inserted is fitted into the housing 30. Further, the bushing 42 into which the terminals 52a to 52o are inserted is fitted into the housing 32.
　ブッシング４０、ターミナル５０ａ～５０ｏ及びハウジング３０が一体化した状態で、これらをはんだにより実装用基板１００に接着固定する。実装用基板１００に接着固定する際のはんだ付けは、ターミナル５０ａ～５０ｏそれぞれの他端及びハウジング３０の爪部３０ｂ，３０ｃに対して行われる。ブッシング４２、ターミナル５２ａ～５２ｏ及びハウジング３２についても、上記と同様に、実装用基板１００に接着固定する。 In a state where the bushing 40, the terminals 50a to 50o and the housing 30 are integrated, these are bonded and fixed to the mounting substrate 100 with solder. Soldering for bonding and fixing to the mounting substrate 100 is performed on the other ends of the terminals 50a to 50o and the claw portions 30b and 30c of the housing 30. The bushing 42, the terminals 52a to 52o, and the housing 32 are also bonded and fixed to the mounting substrate 100 in the same manner as described above.
　ブッシング４０，４２、ターミナル５０ａ～５０ｏ，５２ａ～５２ｏ及びハウジング３０，３２が実装用基板１００に固定された後に、モジュール基板２０をハウジング３０，３２で囲まれる領域に挿入する。このとき、ハウジング３０，３２の爪部３０ｂ，３０ｃ，３２ｂ，３２ｃがモジュール基板２０をｚ軸方向正方向側から負方向側に押し付けることにより、モジュール基板２０が、実装用基板１００に固定される。 After the bushings 40 and 42, the terminals 50a to 50o, 52a to 52o, and the housings 30 and 32 are fixed to the mounting substrate 100, the module substrate 20 is inserted into a region surrounded by the housings 30 and 32. At this time, the claw portions 30b, 30c, 32b, and 32c of the housings 30 and 32 press the module substrate 20 from the positive z-axis direction toward the negative direction, thereby fixing the module substrate 20 to the mounting substrate 100. .
（効果）
　以上のように構成された多極コネクタ１０によれば、モジュール基板２０を実装用基板１００に固定する際のショートを防ぐための中間部材を必要としない。具体的には、多極コネクタ１０では、モジュール基板２０の下面（他方主面）にのみ実装用電極が設けられているため、多接点コネクタ５００に用いられているような接触部材５２２が存在しない。これにより、金属製（バネ用リン青銅）のハウジング３０，３２が、モジュール基板２０の外縁と接触してもショートするおそれがない。結果として、多極コネクタ１０では、モジュール基板２０を実装用基板１００に固定する際のショートを防ぐための中間部材を必要としない。 (effect)
According to the multipolar connector 10 configured as described above, an intermediate member for preventing a short circuit when the module substrate 20 is fixed to the mounting substrate 100 is not required. Specifically, in the multipolar connector 10, since the mounting electrode is provided only on the lower surface (the other main surface) of the module substrate 20, there is no contact member 522 that is used in the multicontact connector 500. . Thereby, even if the housings 30 and 32 made of metal (spring phosphor bronze) come into contact with the outer edge of the module substrate 20, there is no possibility of short-circuiting. As a result, the multipolar connector 10 does not require an intermediate member for preventing a short circuit when the module substrate 20 is fixed to the mounting substrate 100.
　また、多極コネクタ１０では、モジュール基板２０の上面に設けられたモジュール用電極２４ａ～２４ｏ，２５ａ～２５ｏとモジュール基板２０の下面に設けられた実装用電極２６ａ～２６ｏ，２７ａ～２７ｏとが、モジュール基板２０をｚ軸方向に貫くビアホール導体を介して接続されている。これにより、多極コネクタ１０では、多接点コネクタ５００に用いられているような接触部材５２２を必要としない。 In the multipolar connector 10, module electrodes 24 a to 24 o and 25 a to 25 o provided on the upper surface of the module substrate 20 and mounting electrodes 26 a to 26 o and 27 a to 27 o provided on the lower surface of the module substrate 20 are provided. The module substrate 20 is connected via a via-hole conductor that penetrates in the z-axis direction. As a result, the multipolar connector 10 does not require the contact member 522 used in the multi-contact connector 500.
　さらに、多極コネクタ１０では、多接点コネクタ５００に用いられているような接触部材５２２を必要としないため、多接点コネクタ５００に対して小型化が可能である。 Furthermore, since the multi-pole connector 10 does not require the contact member 522 used in the multi-contact connector 500, the multi-contact connector 500 can be downsized.
　多極コネクタ１０では、ハウジング３０，３２における爪部３０ｂ，３０ｃ，３２ｂ，３２ｃがモジュール基板２０を実装用基板１００に押し付ける力と、この力と反対方向に折り曲げられたターミナル５０ａ～５０ｏ，５２ａ～５２ｏのバネ力を利用して、実装用電極２６ａ～２６ｏ，２７ａ～２７ｏとターミナル５０ａ～５０ｏ，５２ａ～５２ｏとの接触を保っている。従って、多極コネクタ１０では、実装用電極２６ａ～２６ｏ，２７ａ～２７ｏとターミナル５０ａ～５０ｏ，５２ａ～５２ｏとの接触を保つために、はんだ付け等の接合作業を行う必要がない。 In the multipolar connector 10, the claws 30b, 30c, 32b, and 32c in the housings 30 and 32 press the module substrate 20 against the mounting substrate 100, and terminals 50a to 50o and 52a to be bent in a direction opposite to the force. The contact between the mounting electrodes 26a to 26o and 27a to 27o and the terminals 50a to 50o and 52a to 52o is maintained using the spring force of 52o. Therefore, in the multipolar connector 10, it is not necessary to perform a joining operation such as soldering in order to keep the mounting electrodes 26a to 26o and 27a to 27o in contact with the terminals 50a to 50o and 52a to 52o.
（変形例）
　以下に、変形例に係る多極コネクタ１０－１について図面を参照しながら説明する。図９は、多極コネクタ１０－１の外観斜視図である。図１０は、多極コネクタ１０－１におけるモジュール基板２０－１の一方主面側の外観斜視図である。図１１は、多極コネクタ１０－１におけるモジュール基板２０－１の他方主面側の外観斜視図である。図１２は、多極コネクタ１０－１におけるハウジング３０－１の外観斜視図である。図１３は、多極コネクタ１０－１におけるブッシング４０－１の外観斜視図である。図１４は、多極コネクタ１０－１におけるターミナル５０－１ａ～５０－１ｚ，５２－１ａ～５２－１ｚの外観斜視図である。 (Modification)
Hereinafter, a multipolar connector 10-1 according to a modification will be described with reference to the drawings. FIG. 9 is an external perspective view of the multipolar connector 10-1. FIG. 10 is an external perspective view of one main surface side of the module substrate 20-1 in the multipolar connector 10-1. FIG. 11 is an external perspective view of the other main surface side of the module substrate 20-1 in the multipolar connector 10-1. FIG. 12 is an external perspective view of the housing 30-1 in the multipolar connector 10-1. FIG. 13 is an external perspective view of the bushing 40-1 in the multipolar connector 10-1. FIG. 14 is an external perspective view of terminals 50-1a to 50-1z and 52-1a to 52-1z in the multipolar connector 10-1.
　多極コネクタ１０と多極コネクタ１０－１との主な相違点は、実装用電極の配置及びターミナルの配置である。なお、多極コネクタ１０と多極コネクタ１０－１とで相違しない点については、説明を省略するとともに、多極コネクタ１０と同じ符号を付した。 The main difference between the multipolar connector 10 and the multipolar connector 10-1 is the arrangement of mounting electrodes and the arrangement of terminals. It should be noted that the points that are not different between the multipolar connector 10 and the multipolar connector 10-1 are not described and are denoted by the same reference numerals as those of the multipolar connector 10.
　多極コネクタ１０－１におけるモジュール基板２０－１は、図１０に示すように、本体基板のｚ軸方向の正方向側の面（一方主面）にモジュール２２－１及びモジュール用電極２４－１ａ～２４－１ｚ，２５－１ａ～２５－１ｚを備えている。さらに、モジュール基板２０－１は、図１１に示すように、本体基板のｚ軸方向の負方向側の面（他方主面）に、実装用電極２６－１ａ～２６－１ｚ，２７－１ａ～２７－１ｚを備えている。そして、モジュール基板２０－１内には、モジュール基板２０－１をｚ軸方向に貫くビアホール導体（図示しない）が設けられている。これにより、モジュール用電極２４－１ａ～２４－１ｚ，２５－１ａ～２５－１ｚのそれぞれと実装用電極２６－１ａ～２６－１ｚ，２７－１ａ～２７－１ｚのそれぞれとが電気的に接続されている。 As shown in FIG. 10, the module substrate 20-1 in the multipolar connector 10-1 has a module 22-1 and a module electrode 24-1a on the surface (one main surface) on the positive side in the z-axis direction of the main body substrate. To 24-1z and 25-1a to 25-1z. Further, as shown in FIG. 11, the module substrate 20-1 has mounting electrodes 26-1a to 26-1z, 27-1a to 27-1a on the negative side surface (the other main surface) in the z-axis direction of the main body substrate. 27-1z. In the module substrate 20-1, a via-hole conductor (not shown) that penetrates the module substrate 20-1 in the z-axis direction is provided. As a result, the module electrodes 24-1a to 24-1z and 25-1a to 25-1z are electrically connected to the mounting electrodes 26-1a to 26-1z and 27-1a to 27-1z, respectively. Has been.
　モジュール用電極２４－１ａ～２４－１ｚ，２５－１ａ～２５－１ｚは、図１０に示すように、モジュール基板２０－１の本体基板の上面に設けられている。モジュール用電極２４－１ａ～２４－１ｍは、モジュール基板２０－１の外縁を成すｘ軸方向の負方向側の辺に沿って、ｙ軸方向の負方向側から正方向側に向かって、この順に並ぶように設けられている。モジュール用電極２４－１ｎ～２４－１ｚは、モジュール基板２０－１の外縁を成すｙ軸方向の正方向側の辺に沿って、ｘ軸方向の負方向側から正方向側に向かって、この順に並ぶように設けられている。モジュール用電極２５－１ａ～２５－１ｍは、モジュール基板２０－１の外縁を成すｙ軸方向の負方向側の辺に沿って、ｘ軸方向の負方向側から正方向側に向かって、この順に並ぶように設けられている。モジュール用電極２５－１ｎ～２５－１ｚは、モジュール基板２０－１の外縁を成すｘ軸方向の正方向側の辺に沿って、ｙ軸方向の負方向側から正方向側に向かって、この順に並ぶように設けられている。 The module electrodes 24-1a to 24-1z and 25-1a to 25-1z are provided on the upper surface of the main body substrate of the module substrate 20-1, as shown in FIG. The module electrodes 24-1a to 24-1m are arranged along the side on the negative side in the x-axis direction that forms the outer edge of the module substrate 20-1 from the negative direction side in the y-axis direction toward the positive direction side. They are arranged in order. The module electrodes 24-1n to 24-1z extend from the negative side in the x-axis direction toward the positive side along the side on the positive side in the y-axis direction that forms the outer edge of the module substrate 20-1. They are arranged in order. The module electrodes 25-1a to 25-1m extend from the negative side in the x-axis direction toward the positive side along the side on the negative side in the y-axis direction that forms the outer edge of the module substrate 20-1. They are arranged in order. The module electrodes 25-1n to 25-1z extend from the negative side in the y-axis direction to the positive side along the side on the positive side in the x-axis direction that forms the outer edge of the module substrate 20-1. They are arranged in order.
　また、モジュール用電極２４－１ａ～２４－１ｚ，２５－１ａ～２５－１ｚのそれぞれは、モジュール２２－１と接続されている。さらに、モジュール用電極２４－１ａ～２４－１ｚ，２５－１ａ～２５－１ｚのそれぞれは、モジュール基板２０－１をｚ軸方向に貫くビアホール導体を介して、実装用電極２６－１ａ～２６－１ｚ，２７－１ａ～２７－１ｚと接続されている。 The module electrodes 24-1a to 24-1z and 25-1a to 25-1z are connected to the module 22-1. Further, each of the module electrodes 24-1a to 24-1z and 25-1a to 25-1z is mounted on the mounting electrodes 26-1a to 26- via via-hole conductors that penetrate the module substrate 20-1 in the z-axis direction. 1z, 27-1a to 27-1z.
　実装用電極２６－１ａ～２６－１ｚ，２７－１ａ～２７－１ｚは、図１１に示すように、モジュール基板２０－１の本体基板の下面に設けられている。実装用電極２６－１ａ～２６－１ｍは、モジュール基板２０－１の外縁を成すｘ軸方向の負方向側の辺に沿って、ｙ軸方向の負方向側から正方向側に向かって、この順に並ぶように設けられている。実装用電極２６－１ｎ～２６－１ｚは、モジュール基板２０の外縁を成すｙ軸方向の正方向側の辺に沿って、ｘ軸方向の負方向側から正方向側に向かって、この順に並ぶように設けられている。実装用電極２７－１ａ～２７－１ｍは、モジュール基板２０の外縁を成すｙ軸方向の負方向側の辺に沿って、ｘ軸方向の負方向側から正方向側に向かって、この順に並ぶように設けられている。実装用電極２７－１ｎ～２７－１ｚは、モジュール基板２０－１の外縁を成すｘ軸方向の正方向側の辺に沿って、ｙ軸方向の負方向側から正方向側に向かって、この順に並ぶように設けられている。つまり、実装用電極２６－１ａ～２６ｚ，２７－１ａ～２７－１ｚは、モジュール基板２０－１の外縁を成す４つの辺に沿って設けられている。 The mounting electrodes 26-1a to 26-1z and 27-1a to 27-1z are provided on the lower surface of the main body substrate of the module substrate 20-1, as shown in FIG. The mounting electrodes 26-1a to 26-1m are arranged along the side on the negative direction side in the x-axis direction that forms the outer edge of the module substrate 20-1 from the negative direction side in the y-axis direction toward the positive direction side. They are arranged in order. The mounting electrodes 26-1n to 26-1z are arranged in this order from the negative side in the x-axis direction to the positive side along the side on the positive side in the y-axis direction that forms the outer edge of the module substrate 20. It is provided as follows. The mounting electrodes 27-1a to 27-1m are arranged in this order from the negative direction side in the x-axis direction toward the positive direction side along the side on the negative direction side in the y-axis direction that forms the outer edge of the module substrate 20. It is provided as follows. The mounting electrodes 27-1n to 27-1z extend from the negative direction side in the y-axis direction toward the positive direction side along the side on the positive direction side in the x-axis direction that forms the outer edge of the module substrate 20-1. They are arranged in order. That is, the mounting electrodes 26-1a to 26z and 27-1a to 27-1z are provided along the four sides forming the outer edge of the module substrate 20-1.
　ハウジング３０－１は、図９に示すように、実装用基板１００の上面において、モジュール基板２０－１のｘ軸方向の正負両側、ｙ軸方向の正方向側及びｙ軸方向の負方向側の一部を囲むように設けられた板状の部材である。また、ハウジング３０－１は、図１２に示すように、４つの爪部３０－１ａ～３０－１ｄを有している。 As shown in FIG. 9, the housing 30-1 is provided on the upper surface of the mounting substrate 100 on both the positive and negative sides of the module substrate 20-1 in the x-axis direction, the positive side in the y-axis direction, and the negative direction side in the y-axis direction. It is a plate-like member provided so as to surround a part. Further, as shown in FIG. 12, the housing 30-1 has four claw portions 30-1a to 30-1d.
　ブッシング４０－１は、実装用基板１００の上面においてｘ軸方向の負方向側及びｙ軸方向の正負両側をハウジング３０－１に囲まれている。ブッシング４０－１の形状は、図１３に示すように、ｚ軸方向から平面視したときに、ロの字型の形状を成している。また、ブッシング４０－１の内周には、ｚ軸方向と平行な複数の溝が設けられている。 The bushing 40-1 is surrounded by the housing 30-1 on the negative side in the x-axis direction and on both the positive and negative sides in the y-axis direction on the upper surface of the mounting substrate 100. As shown in FIG. 13, the shape of the bushing 40-1 is a square shape when viewed in plan from the z-axis direction. A plurality of grooves parallel to the z-axis direction are provided on the inner periphery of the bushing 40-1.
　ターミナル５０－１ａ～５０－１ｚ，５２－１ａ～５２－１ｚは、実装用電極２６－１ａ～２６ｚ，２７－１ａ～２７－１ｚに対応して、モジュール基板２０－１の外縁を成す４つの辺と平行に設けられている。ターミナル５０－１ａ～５０－１ｚ，５２－１ａ～５２－１ｚのそれぞれは、図１４に示すように、棒状の部材である。また、ターミナル５０－１ａ～５０－１ｚ，５２－１ａ～５２－１ｚそれぞれの一端側は、ｚ軸方向の正方向側（他方主面側から一方主面側）に向かって垂直に折れ曲がった後、その傾きを緩めてｚ軸方向の正方向側に進行する形状を成している。さらに、ターミナル５０－１ａ～５０－１ｚ，５２－１ａ～５２－１ｚそれぞれの他端は、実装用基板１００に設けられた回路と接続されている。また、ターミナル５０－１ａ～５０－１ｚ，５２－１ａ～５２－１ｚにおけるｚ軸方向の正方向側に垂直に折れ曲がった部分が、ブッシング４０－１に設けられた溝に挿入される。これにより、ターミナル５０－１ａ～５０－１ｚ，５２－１ａ～５２－１ｚは、ブッシング４０－１に保持される。 Terminals 50-1a to 50-1z and 52-1a to 52-1z correspond to the four mounting electrodes 26-1a to 26z and 27-1a to 27-1z that form the outer edge of the module substrate 20-1. It is provided parallel to the side. Each of the terminals 50-1a to 50-1z and 52-1a to 52-1z is a rod-shaped member as shown in FIG. Also, after one end of each of the terminals 50-1a to 50-1z and 52-1a to 52-1z is bent vertically toward the positive side in the z-axis direction (from the other main surface side to the one main surface side), , The inclination is relaxed and the shape advances to the positive side in the z-axis direction. Further, the other ends of the terminals 50-1a to 50-1z and 52-1a to 52-1z are connected to a circuit provided on the mounting substrate 100. Further, the portions of the terminals 50-1a to 50-1z and 52-1a to 52-1z that are bent perpendicularly to the positive side in the z-axis direction are inserted into the grooves provided in the bushing 40-1. As a result, the terminals 50-1a to 50-1z and 52-1a to 52-1z are held by the bushing 40-1.
　以上のように構成された多極コネクタ１０－１では、モジュール基板の４つの辺全てに沿って電極を設けているため、多極コネクタ１０と比較して、多くの接点を有する。 The multipolar connector 10-1 configured as described above has more contacts than the multipolar connector 10 because the electrodes are provided along all four sides of the module substrate.
（その他の実施形態）
　本発明に係る多極コネクタは、多極コネクタ１０及びその変形例である多極コネクタ１０－１に限らず、その要旨の範囲内において変更可能である。例えば、実装用電極の数の変更をしてもよい。 (Other embodiments)
The multipolar connector according to the present invention is not limited to the multipolar connector 10 and the multipolar connector 10-1 which is a modification thereof, and can be changed within the scope of the gist thereof. For example, the number of mounting electrodes may be changed.
　以上のように、本発明は、各種電子部品を搭載したモジュール基板と、該モジュール基板を搭載する実装用基板とを接続する多極コネクタに有用であり、特に、モジュール基板を実装用基板に固定する際のショートを防ぐための中間部材を必要としない点において優れている。 As described above, the present invention is useful for a multipolar connector that connects a module board on which various electronic components are mounted and a mounting board on which the module board is mounted, and in particular, the module board is fixed to the mounting board. This is excellent in that an intermediate member for preventing a short circuit is not required.
１０、１０－１　多極コネクタ
２０、２０－１　モジュール基板
２６ａ～２６ｏ、２６－１ａ～２６－１ｚ、２７ａ～２７ｏ、２７－１ａ～２７－１ｚ　実装用電極
３０、３０－１　ハウジング
４０、４０－１　ブッシング
５０ａ～５０ｏ、５０－１ａ～５０－１ｚ、５２ａ～５２ｚ、５２－１～５２－１ｚ　ターミナル（接点部材） 10, 10-1 Multipolar connector 20, 20-1 Module boards 26a to 26o, 26-1a to 26-1z, 27a to 27o, 27-1a to 27-1z Mounting electrodes 30, 30-1 Housings 40, 40 -1 Bushing 50a to 50o, 50-1a to 50-1z, 52a to 52z, 52-1 to 52-1z Terminal (contact member)

Claims (5)

  1. 　実装用基板に設けられた多極コネクタであって、
    　一方主面及び他方主面を有し、他方主面のみに設けられた複数の実装用電極を有するモジュール基板と、
    　前記モジュール基板を前記一方主面側から実装用基板に押え付けることにより固定するハウジングと、
    　前記実装用基板上に設けられ、前記複数の実装用電極と接触する複数の接点部材と、
    　を備えていることを特徴とする多極コネクタ。     A multi-pole connector provided on a mounting board,
    A module substrate having one main surface and the other main surface, and having a plurality of mounting electrodes provided only on the other main surface;
    A housing for fixing the module substrate by pressing it against the mounting substrate from the one main surface side;
    A plurality of contact members provided on the mounting substrate and in contact with the plurality of mounting electrodes;
    A multi-pole connector characterized by comprising:
  2. 　前記モジュール基板は、前記他方主面と直交する方向から見たときに長方形状を成し、
    　前記複数の実装用電極は、前記モジュール基板の外縁を成し、かつ、隣り合わない２つの辺に沿って設けられていること、
    　を特徴とする請求項１に記載の多極コネクタ。     The module substrate has a rectangular shape when viewed from a direction orthogonal to the other main surface,
    The plurality of mounting electrodes form an outer edge of the module substrate and are provided along two sides that are not adjacent to each other.
    The multipolar connector according to claim 1.
  3. 　前記モジュール基板は、前記他方主面と直交する方向から見たときに長方形状を成し、
    　前記複数の実装用電極は、前記モジュール基板の外縁を成す４つの辺に沿って設けられていること、
    　を特徴とする請求項１に記載の多極コネクタ。     The module substrate has a rectangular shape when viewed from a direction orthogonal to the other main surface,
    The plurality of mounting electrodes are provided along four sides forming an outer edge of the module substrate;
    The multipolar connector according to claim 1.
  4. 　前記接点部材は、前記他方主面側から前記一方主面側に向かって折れ曲がり、
    　前記実装用電極は、前記接点部材が前記実装用基板から最も離れている位置において、該接点部材と接触すること、
    　を特徴とする請求項１乃至請求項３のいずれかに記載の多極コネクタ。     The contact member is bent from the other main surface side toward the one main surface side,
    The mounting electrode is in contact with the contact member at a position where the contact member is farthest from the mounting substrate;
    The multipolar connector according to any one of claims 1 to 3, wherein:
  5. 　前記複数の接点部材それぞれが挿入される複数のスリットが設けられ、かつ、前記モジュール基板と前記実装基板の間に位置するブッシング
    　を更に備えていること、
    　を特徴とする請求項１乃至請求項４のいずれかに記載の多極コネクタ。     A plurality of slits into which each of the plurality of contact members is inserted, and a bushing positioned between the module substrate and the mounting substrate;
    The multipolar connector according to any one of claims 1 to 4, wherein:
PCT/JP2013/077084 2012-11-22 2013-10-04 Multipole connector WO2014080699A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2012-256136 2012-11-22
JP2012256136 2012-11-22

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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60158578A (en) * 1983-12-27 1985-08-19 ノーザン・テレコム・リミテツド Multicontact connector
JPH06151016A (en) * 1992-11-12 1994-05-31 Sanyo Electric Co Ltd Connecting structure for hybrid integrated circuit
JPH08273784A (en) * 1995-03-31 1996-10-18 Enplas Corp Socket for electrical component
JP2004158323A (en) * 2002-11-07 2004-06-03 D D K Ltd Inter-substrate connecting connector

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60158578A (en) * 1983-12-27 1985-08-19 ノーザン・テレコム・リミテツド Multicontact connector
JPH06151016A (en) * 1992-11-12 1994-05-31 Sanyo Electric Co Ltd Connecting structure for hybrid integrated circuit
JPH08273784A (en) * 1995-03-31 1996-10-18 Enplas Corp Socket for electrical component
JP2004158323A (en) * 2002-11-07 2004-06-03 D D K Ltd Inter-substrate connecting connector

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