WO2014073072A1

WO2014073072A1 - Mirror device

Info

Publication number: WO2014073072A1
Application number: PCT/JP2012/078971
Authority: WO
Inventors: 吉田　綾子; 黒田　和男
Original assignee: パイオニア株式会社
Priority date: 2012-11-08
Filing date: 2012-11-08
Publication date: 2014-05-15

Abstract

A mirror device includes at least one organic EL element which is formed on a substrate and comprises organic layers, including a light emitting layer, layered between a transparent electrode and reflective electrode that face each other. The mirror device has a plurality of metal mirror surface parts that are disposed in a dispersed manner on the transparent electrodes. Each of the plurality of metal mirror surface parts has a surface area smaller than the surface area of the transparent metal electrode.

Description

Mirror device

The present invention relates to a mirror device having a light emitting function including an organic electroluminescence element.

An organic electroluminescent element is configured by, for example, sequentially laminating an organic layer including an anode, a light emitting layer, and a cathode on a transparent glass substrate. By injecting current into the organic layer through the anode and the cathode, the electroluminescence ( Hereinafter, the light-emitting element expresses EL). An organic EL element is a self-luminous surface-emitting device, and is used for a display device or a lighting device.

As a mirror device, there is an EL illumination built-in mirror in which an organic EL element is arranged in a frame shape around a mirror and an object such as a user's face can be projected on the mirror (see Patent Document 1).

In addition, an automobile sun visor assembly including an illuminated rearview mirror has been proposed (see Patent Document 2).

JP 2003-217868 A Japanese Patent No. 2625177

In the mirror with a built-in EL illumination described in Patent Document 1, since the light source such as the organic EL element is arranged in a frame around the mirror, the area of the mirror is reduced, and the part of the face that the user wants to see is accurately obtained. There is a disadvantage that it does not give lighting to the.

Furthermore, the sun visor assembly described in Patent Document 2 also has a problem in that uniform light emission is difficult because the illumination portions by the lamps are directly provided in front of both sides of the mirror surface.

The above mirror device has a drawback that the thickness of the entire mirror device is increased because the light emitting part is simply added before and after the mirror.

Therefore, in the present invention, an example of a problem is to provide a mirror device that has a light reflecting function and can suppress the increase in the thickness of the device and emit light to the front surface.

The mirror device of the present invention is a mirror device including an organic layer including a light-emitting layer that is laminated between a transparent electrode and a reflective electrode that are opposed to each other, and includes at least one organic EL element formed on a substrate. And
A plurality of metal mirror surface portions distributed on the translucent electrode;
Each of the plurality of metal mirror surface portions has an area smaller than the area of the translucent electrode.

1A and 1B are a front view and a partially enlarged front view in which a part of a mirror device of an organic EL panel according to Embodiment 1 of the present invention is cut away. FIG. 2 is a sectional view taken along the line CC in FIG. FIG. 3 is an enlarged cross-sectional view of a part of the mirror device of the organic EL panel according to the first embodiment. FIG. 4 is a schematic sectional view of a part of the organic EL panel showing the operation of the mirror device of the organic EL panel shown in FIG. FIG. 5 is a schematic sectional view of a part of a mirror device of an organic EL panel according to a modification of the first embodiment. FIG. 6 is a schematic sectional view of a part of a mirror device of an organic EL panel according to another modification of the first embodiment. FIG. 7 is a partial enlarged front view of a part of a mirror device of an organic EL panel according to another modification of the first embodiment. FIG. 8 is a partial enlarged front view of a part of a mirror device of an organic EL panel according to another modification of the first embodiment. FIG. 9 is a partial enlarged front view of a part of a mirror device of an organic EL panel according to another modification of the first embodiment. FIG. 10 is a partial enlarged front view of a part of a mirror device of an organic EL panel according to another modification of the first embodiment. FIG. 11 is a schematic sectional view of a part of the mirror device of the organic EL panel according to the second embodiment of the present invention. FIG. 12 is a schematic sectional view of a part of the mirror device of the organic EL panel according to the third embodiment of the present invention. FIG. 13 is a front view in which a part of the mirror device of the organic EL panel of Example 4 of the present invention is cut away. FIG. 14 is a schematic sectional view of a part of an organic EL panel according to Example 5 of the present invention. FIG. 15 is a schematic sectional view of a part of an organic EL panel according to Example 6 of the present invention. FIG. 16 is a schematic sectional view of a part of an organic EL panel according to a modification of the sixth embodiment of the present invention. FIG. 17 is a schematic sectional view and a partially enlarged sectional view of a part of an organic EL panel according to another modification of the sixth embodiment of the present invention. FIG. 18 is a schematic sectional view of a part of an organic EL panel according to Example 7 of the present invention.

Embodiments of the present invention will be described below with reference to the drawings.

FIG. 1 shows a configuration of a mirror device that is an organic EL panel OELD of Embodiment 1 of the present invention.

The organic EL panel OELD includes a plurality of organic EL elements OEL partitioned by banks BK on a light-transmitting flat substrate 1 such as glass or resin. The bank BK is made of a translucent dielectric material such as optical glass or optical resin. The organic EL element OEL has strip-shaped light emitting portions each extending in the y direction of the xy main surface of the substrate 1. The organic EL element OEL is a group of organic EL elements R, G, and B that emit light of different emission colors of red light emission R, green light emission G, and blue light emission B from the front surface 1 a of the translucent substrate 1. The organic EL elements R, G, and B are juxtaposed in parallel on the substrate 1. The organic EL elements OEL of RGB emission colors that emit red, green, and blue emission colors are arranged as a set in the x direction.

The organic EL panel OELD further includes a plurality of metal mirror surface portions MIR distributed and disposed between the substrate 1, the bank BK, and the organic EL element OEL so as to cover them. As shown in FIG. 1, the plurality of metal mirror surface portions MIR have a fine checkered pattern in which metal mirror surface portions MIR that are rectangular light reflection portions and gaps SP are alternately arranged in the x and y directions of the xy main surface. It is configured in a so-called matrix form. In FIG. 1, the metal mirror surface portions are indicated by hatching in an enlarged portion of the metal mirror surface portions MIR juxtaposed in a matrix form indicated by white arrows. The metal mirror surface portion MIR is in the organic layer 3 and at the same time is in contact with the flat translucent electrode 2.

Each of the plurality of metal mirror surface portions MIR has an area smaller than the area of each light emitting portion of the organic EL element OEL. Therefore, when the element is driven, light from the organic EL element OEL can be extracted from the gap SP between the metal mirror surface portions MIR shown in FIG.

Thus, each metal mirror surface portion MIR has the same shape and the same area, and a plurality of metal mirror surface portions MIR are arranged in a uniform distribution. Moreover, the shape and area of each metal mirror surface part MIR are not limited to the same as long as it has an area smaller than the area of a light emission part, and may differ. Here, each of the metal mirror surface portion MIR and the gap SP is configured to have an equal interval. Therefore, if one side width of the metal mirror surface portion MIR cannot be identified with the naked eye, for example, 0.05 mm or less, and the distance between the metal mirror surface portion MIR and the organic EL element OEL is set to a short interval of 0.05 mm or less, for example, the gap SP is generated during driving. It can be used as a mirror that emits light from the surface and emits light from the entire surface. Further, it can function as a single mirror when the element is not driven. Further, by adjusting the luminance of the organic EL element or for each color group, red, green, and blue light are mixed at an arbitrary ratio from the front surface of the substrate 1 serving as a light extraction surface, and a single color is obtained. Light that is recognized as an emission color is emitted. Although not shown, all the organic EL elements OEL are connected to the element driving unit.

As shown in FIG. 2, each of the organic EL elements OEL includes a translucent electrode 2, a plurality of metal mirror surface portions MIR, an organic layer 3 including a light emitting layer, and a reflective electrode on the back surface 1b of the substrate 1 between the banks BK. 4 is laminated. The strip-shaped translucent electrode 2 extends in parallel in the y direction between the banks BK on the substrate 1 for each organic EL element OEL. Although not shown, the translucent electrode 2 of the organic EL element OEL is connected to the element driving unit. For example, the substrate 1 on which the translucent electrode 2 is patterned is prepared, and the plurality of metal mirror surface portions MIR have a predetermined mask pattern in which the metal mirror surface portion MIR does not cause a short circuit between the adjacent translucent electrodes 2. It forms into a film on the pattern of the translucent electrode 2 by the vacuum evaporation method etc. which were used. The pattern in which a short circuit does not occur between the adjacent translucent electrodes 2 is a pattern on only the translucent electrode 2 in which the metal mirror surface portion MIR is not bridged between the translucent electrodes 2. Then, a forward tapered structure bank BK made of a translucent dielectric material is provided along the y direction between the side surfaces of the adjacent translucent electrodes 2 by photolithography or the like. Thereby, a plurality of metal mirror surface portions MIR distributed between the banks BK and the substrate 1 can be formed. Then, a predetermined organic layer 3 is formed on the translucent electrode 2 between the banks BK by an inkjet method or the like. Then, a reflective electrode material is formed on the organic layer 3 between the banks BK and the top surface of the banks BK by vapor deposition or the like. Therefore, the metal mirror surface portion MIR portion disposed between the organic layer 3 and the translucent electrode 2 is obtained.

Since the bank BK has a so-called forward taper structure in which the bank side surface is widened toward the translucent electrode 1, the reflective electrode 4 becomes a common electrode having the same potential across the plurality of organic EL elements OEL. The mirror device of the present embodiment is a so-called bottom emission type organic that takes out light generated in the organic layer 3 from the front surface 1 a of the substrate 1 by applying a voltage between the translucent electrode 2 and the reflective electrode 4. Functions as an EL panel.

As shown in FIG. 3, each organic layer 3 of the organic EL element OEL in the gap portion between the metal mirror surface portions MIR typically has the translucent electrode 2 as an anode and the reflective electrode 4 as a cathode. In this case, a hole injection layer 3a, a hole transport layer 3b, a light emitting layer 3c, an electron transport layer 3d, and an electron injection layer 3e are laminated in order from the anode to the cathode. In addition, in the laminated structure of the organic layer 3, it is also possible to laminate | stack components other than a board | substrate in reverse order. The organic layer 3 is not limited to these stacked structures, and may include at least a light emitting layer, for example, by adding a hole blocking layer (not shown) between the light emitting layer 3c and the electron transport layer 3d, or may be used in combination. A stacked structure including a charge transport layer may be employed. The organic layer 3 may be configured by omitting the hole transport layer 3b, the hole injection layer 3a, or the hole injection layer 3a and the electron transport layer 3d from the stacked structure. May be.

[Translucent electrode]
The anode translucent electrode 2 includes ITO (Indium-tin-oxide), ZnO, ZnO—Al ₂ O ₃ (so-called AZO), In ₂ O ₃ —ZnO (so-called IZO), SnO ₂ —Sb ₂ O. ₃ (so-called ATO), RuO ₂ or the like. Furthermore, for the translucent electrode 2, it is preferable to select a material having a transmittance of at least 10% at the emission wavelength obtained from the light emitting layer. The translucent electrode 2 usually has a single layer structure, but can also have a laminated structure with a metal thin film. As a material for the metal thin film, for example, an appropriate metal such as tin, magnesium, indium, calcium, aluminum, silver, or an alloy thereof is used. Specific examples include a magnesium-silver alloy, a magnesium-indium alloy, and an aluminum-lithium alloy. A silver thin film having a thickness of 20 nm of the metal thin film has a transmittance of 50%. An Al film having a thickness of 10 nm as a metal thin film has a transmittance of 50%. The 20 nm-thick MgAg alloy film as the metal thin film has a transmittance of 50%. In addition, when comprising a metal thin film, although depending also on material, a film forming method, and conditions, if the lower limit of the film thickness is 5 nm, electroconductivity can be ensured.

[Hole injection layer]
The hole injection layer 3a is preferably a layer containing an electron accepting compound (so-called hole transporting compound).

The hole transporting compound is preferably a compound having an ionization potential of 4.5 eV to 6.0 eV from the viewpoint of a charge injection barrier from the anode to the hole injection layer. Examples of the hole transporting compound include aromatic amine derivatives, phthalocyanine derivatives typified by phthalocyanine copper (so-called CuPc), porphyrin derivatives, oligothiophene derivatives, polythiophene derivatives, benzylphenyl derivatives, tertiary amines with fluorene groups. Examples include linked compounds, hydrazone derivatives, silazane derivatives, silanamine derivatives, phosphamine derivatives, quinacridone derivatives, polyaniline derivatives, polypyrrole derivatives, polyphenylene vinylene derivatives, polythienylene vinylene derivatives, polyquinoline derivatives, polyquinoxaline derivatives, and carbon. Here, the derivative includes, for example, an aromatic amine derivative, and includes an aromatic amine itself and a compound having an aromatic amine as a main skeleton. There may be.

As the hole transporting compound, a conductive polymer obtained by polymerizing 3,4-ethylenedioxythiophene, which is a polythiophene derivative, in high molecular weight polystyrene sulfonic acid (so-called PEDOT / PSS) is also preferable. Furthermore, the end of the polymer of PEDOT / PSS may be capped with methacrylate or the like.

[Hole transport layer]
The material of the hole transport layer 3b may be any material conventionally used as a constituent material of the hole transport layer. For example, the hole transport layer is exemplified as the hole transport compound used in the hole injection layer described above. Things. In addition, arylamine derivatives, fluorene derivatives, spiro derivatives, carbazole derivatives, pyridine derivatives, pyrazine derivatives, pyrimidine derivatives, triazine derivatives, quinoline derivatives, phenanthroline derivatives, phthalocyanine derivatives, porphyrin derivatives, silole derivatives, oligothiophene derivatives, condensed polycyclic aromatics Group derivatives, metal complexes and the like. In addition, for example, polyvinylcarbazole derivatives, polyarylamine derivatives, polyvinyltriphenylamine derivatives, polyfluorene derivatives, polyarylene derivatives, polyarylene ether sulfone derivatives containing tetraphenylbenzidine, polyarylene vinylene derivatives, polysiloxane derivatives, polythiophenes Derivatives, poly (p-phenylene vinylene) derivatives, and the like. These may be any of an alternating copolymer, a random polymer, a block polymer, or a graft copolymer. Further, it may be a polymer having a branched main chain and three or more terminal portions, or a so-called dendrimer.

[Light emitting layer]
The light emitting layer 3c may be a red, green and blue light emitting independent light emitting layer or a mixed light emitting layer thereof, a compound having a property of transporting holes (hole transporting compound), or A compound having an electron transporting property (electron transporting compound) can also be contained. An organic EL material may be used as a dopant material, and a hole transporting compound, an electron transporting compound, or the like may be appropriately used as a host material. There is no particular limitation on the organic EL material, and a substance that emits light at a desired emission wavelength and has good emission efficiency may be used.

Any known material can be applied as the organic EL material. For example, it may be a fluorescent material or a phosphorescent material, but it is preferable to use a phosphorescent material from the viewpoint of internal quantum efficiency. The light emitting layer may have a single layer structure or a multilayer structure made of a plurality of materials as desired. For example, a fluorescent material may be used for the blue light emitting layer, and a phosphorescent material may be used for the green and red light emitting layers. Further, a diffusion preventing layer can be provided between the light emitting layers.

Examples of fluorescent materials (blue fluorescent dyes) that emit blue light include naphthalene, perylene, pyrene, chrysene, anthracene, coumarin, p-bis (2-phenylethenyl) benzene, and derivatives thereof.

Examples of the fluorescent material (green fluorescent dye) that emits green light include aluminum complexes such as quinacridone derivatives, coumarin derivatives, and Alq3 (tris (8-hydroxy-quinoline) aluminum).

Examples of fluorescent materials that give yellow light emission (yellow fluorescent dyes) include rubrene and perimidone derivatives.

Examples of fluorescent materials that give red light emission (red fluorescent dyes) include DCM (4- (dicyanomethylene) -2-methyl-6- (p-dimethylaminostyryl) -4H-pyran) compounds, benzopyran derivatives, rhodamine derivatives, benzoates. Examples thereof include thioxanthene derivatives and azabenzothioxanthene.

The phosphorescent material is selected from, for example, the long-period periodic table (hereinafter referred to as the long-period periodic table when referring to “periodic table” unless otherwise specified). An organometallic complex containing a metal can be given. Preferred examples of the metal selected from Groups 7 to 11 of the periodic table include ruthenium, rhodium, palladium, silver, rhenium, osmium, iridium, platinum, and gold. As the ligand of the complex, a ligand in which a (hetero) aryl group such as a (hetero) arylpyridine ligand or a (hetero) arylpyrazole ligand and a pyridine, pyrazole, phenanthroline, or the like is connected is preferable. A pyridine ligand and a phenylpyrazole ligand are preferable. Here, (hetero) aryl represents an aryl group or a heteroaryl group.

Specific examples of phosphorescent materials include tris (2-phenylpyridine) iridium (so-called Ir (ppy) 3), tris (2-phenylpyridine) ruthenium, tris (2-phenylpyridine) palladium, and bis (2-phenyl). Pyridine) platinum, tris (2-phenylpyridine) osmium, tris (2-phenylpyridine) rhenium, octaethylplatinum porphyrin, octaphenylplatinum porphyrin, octaethyl palladium porphyrin, octaphenyl palladium porphyrin, and the like.

The light emitting layer may contain a hole transporting compound as a constituent material. Here, among the hole transporting compounds, examples of the low molecular weight hole transporting compound include various compounds exemplified as the hole transporting compound in the hole injection layer 3a described above, for example, diphenylnaphthyl. Aromatic diamines represented by diamines (so-called α-NPD), including two or more tertiary amines and having two or more condensed aromatic rings substituted with nitrogen atoms, or 4,4 ′, 4 ″- Aromatic amine compounds having a starburst structure such as tris (1-naphthylphenylamino) triphenylamine, aromatic amine compounds composed of tetramers of triphenylamine, and 2,2 ′, 7,7′-tetrakis And spiro compounds such as-(diphenylamino) -9,9'-spirobifluorene.

The light emitting layer may contain an electron transporting compound as a constituent material. Here, among the electron transporting compounds, examples of low molecular weight electron transporting compounds include 2,5-bis (1-naphthyl) -1,3,4-oxadiazole (so-called BND), 2 , 5-bis (6 ′-(2 ′, 2 ″ -bipyridyl))-1,1-dimethyl-3,4-diphenylsilole (so-called PyPySPyPy), bathophenanthroline (so-called BPhen), 2,9 -Dimethyl-4,7-diphenyl-1,10-phenanthroline (so-called BCP, bathocuproin), 2- (4-biphenylyl) -5- (p-tertiarybutylphenyl) -1,3,4-oxadiazole (So-called tBu-PBD) and 4,4′-bis (9H-carbazol-9-yl) biphenyl (so-called CBP).

[Electron transport layer]
The electron transport layer 3d is provided for the purpose of further improving the light emission efficiency of the organic EL element, and efficiently transports electrons injected from the cathode between the electrodes to which an electric field is applied in the direction of the light emitting layer. It is formed from an electron transporting compound capable of forming

As the electron transporting compound used for the electron transport layer, usually, the electron injection efficiency from the cathode or the electron injection layer 3e is high, and the injected electrons can be efficiently transported with high electron mobility. Use compounds. Examples of compounds that satisfy such conditions include metal complexes of Alq3 and 10-hydroxybenzo [h] quinoline, oxadiazole derivatives, distyrylbiphenyl derivatives, silole derivatives, 3-hydroxyflavone metal complexes, and 5-hydroxyflavones. Metal complex, benzoxazole metal complex, benzothiazole metal complex, trisbenzimidazolylbenzene, quinoxaline compound, phenanthroline derivative, 2-t-butyl-9,10-N, N′-dicyanoanthraquinonediimine, n-type hydrogenated amorphous Quality silicon carbide, n-type zinc sulfide, n-type zinc selenide and the like.

[Electron injection layer]
The electron injection layer 3e plays a role of efficiently injecting electrons injected from the cathode into the electron transport layer and the light emitting layer. For example, the electron injection layer 3e includes organic electron transport compounds represented by metal complexes such as nitrogen-containing heterocyclic compounds such as bathophenanthroline and aluminum complexes of 8-hydroxyquinoline. Further, the electron injection efficiency can be increased by doping the electron injection layer 3e of the organic electron transport compound with an electron donating material. Examples of the electron donating material include alkali metals such as sodium and cesium, alkaline earth metals such as barium and calcium, compounds thereof (CsF, Cs ₂ CO ₃ , Li ₂ O, LiF), sodium, Alkali metals such as potassium, cesium, lithium and rubidium are used.

As a method for forming each of the organic layers 3 described above, a dry coating method such as a sputtering method or a vacuum deposition method, or a wet coating method such as a screen printing, a spray method, an ink jet method, a spin coating method, a gravure printing, or a roll coater method. The law is known. For example, the hole injection layer, the hole transport layer, and the light emitting layer are uniformly formed by a wet coating method, and the electron transport layer and the electron injection layer are sequentially formed uniformly by a dry coating method. A film may be formed. Further, all the functional layers may be sequentially formed in a uniform film thickness by a wet coating method.

[Reflective electrode]
The material of the cathode reflective electrode 4 preferably includes a metal having a low work function in order to efficiently inject electrons, for example, a suitable metal such as tin, magnesium, indium, calcium, aluminum, silver, or the like. These alloys are used. Specific examples include low work function alloy electrodes such as magnesium-silver alloy, magnesium-indium alloy, and aluminum-lithium alloy. The reflective electrode 4 can be formed as a single layer film or a multilayer film on the organic layer 3 by sputtering or vacuum deposition. The thickness of the reflective electrode 4 is not limited as long as the reflective action of the reflective electrode 4 is maintained.

Next, the operation of the organic EL panel of the mirror device will be described with reference to FIG. When a driving voltage is applied to the light emitting layer 3c in the organic layer through the translucent electrode 2 and the reflective electrode 4, the light generated in the light emitting layer 3c passes through the translucent electrode 2 and is further reflected. After being reflected by the electrode 4, it passes through the translucent electrode 2 and about several tens of percent is taken out from the front surface of the translucent substrate 1. In other words, the light emitted from the light emitting layer 3c is transmitted through the translucent electrode 2 to the glass substrate 1 at a portion where the metal mirror surface portion MIR is not present, and the light L1 less than the critical angle of each interface is transmitted to the other reflective electrode 4 The light L <b> 2 that travels toward the light passes through the light emitting layer 3 c, travels through the translucent electrode 2 to the substrate 1 at a portion without the metal mirror surface portion MIR, and the light is emitted to the front space of the substrate 1. The light L3 that passes through the remaining critical angle and passes through the portion without the metal mirror surface portion MIR is totally reflected and travels toward the bank BK. The light L4 reflected by the remaining metal mirror surface portion MIR is also directed to the bank BK. Note that the light emitted from the end face of the light emitting layer 3c and the light L5 directed in the lateral direction also enter the bank BK, and are repeatedly reflected and attenuated, or pass through the translucent electrode 2 at the portion without the metal mirror surface portion MIR. To the front space of the substrate 1. On the other hand, part of the external light L6 entering from the front side space of the substrate 1 is reflected by the metal mirror surface portion MIR, and if the other portion passes through the portion without the metal mirror surface portion MIR, it is reflected by the reflective electrode 4 and emitted to the outside. Is done. Since the bank BK uses a translucent dielectric, light from adjacent elements leaks out during light emission.

In addition, since the metal mirror surface portion MIR has a normal element configuration, light is also emitted between the metal mirror surface portion MIR and the reflective electrode 4. For example, when the metal mirror surface portion MIR is thin, such as a film thickness of 20 nm, a certain amount of light is emitted. It has reflectivity and also has some degree of transmittance. Therefore, light is strengthened by the cavity effect between the metal mirror surface portion MIR and the reflective electrode 4, and light is output from the thin metal mirror surface portion MIR.

Hereinafter, the modified example of the first embodiment will be described mainly with respect to portions different from the first embodiment with reference to FIGS. Elements indicated by the same reference numerals as those in the first embodiment are the same, and thus description thereof is omitted.

FIG. 5 shows a modification of the same mirror device as the embodiment shown in FIG. 2 except that a plurality of metal mirror surface portions MIR are arranged between the substrate 1 and the translucent electrode 2. The metal mirror surface portion MIR has a pattern in which a short circuit does not occur between adjacent translucent electrodes 2, that is, the metal mirror surface portion MIR has a pattern only on the translucent electrode 2 that is not bridged between the translucent electrodes 2. Is formed. According to this, the mirror surface which has arrange | positioned all the some metal mirror surface part MIR on the same plane can be achieved.

FIG. 6 shows a modification of the same mirror device as the embodiment shown in FIG. 2 except that the metal bus line MBL is provided on the plurality of metal mirror surface portions MIR in the bank BK. In this case, on each end side of the translucent electrode 2 embedded in the bank BK, the metal mirror surface portion MIR and the metal bus line MBL electrically connected to the translucent electrode 2 extend along the y direction. It is formed by stretching. Thereby, a power supply current can be efficiently supplied to the translucent electrode 2.

FIG. 7 shows a modification of the mirror device identical to the embodiment shown in FIG. 1, except that each of the plurality of metal mirror surface portions MIR is separated and independently arranged in a so-called dot shape. In this case, since the area of the gap SP can be set larger than the area of the metal mirror surface portion MIR, the extraction efficiency of the emitted light is improved.

FIG. 8 shows a modification of the same mirror apparatus as that of the embodiment shown in FIG. 1 except that each of the plurality of metal mirror surface portions MIR is separated and independently arranged and the shape of the metal mirror surface portion MIR is circular. Various shapes can be adopted as the shape of the metal mirror surface portion MIR, regardless of the shape of the rectangle, polygon, circle, or ellipse. In this case, since the area of the gap SP can be set differently from the area of the metal mirror surface portion MIR, the degree of freedom in designing the ratio of the reflection amount of external light and the extraction efficiency of emitted light is improved.

In the above example in which the metal mirror surface portions MIR are arranged in a dot shape, a set of shapes in which a part of each dot is connected may be used.

FIG. 9 shows a modification of the same mirror device as that of the embodiment shown in FIG. 1 except that each of the plurality of metal mirror surface portions MIR has a strip shape extending in the y direction. Also in this case, since the area of the gap SP can be set differently from the area of the metal mirror surface portion MIR, the degree of freedom in designing the ratio of the amount of reflected external light and the efficiency of extracting emitted light is improved.

FIG. 10 shows a modification of the same mirror device as the modification shown in FIG. 8 except that each of the plurality of metal mirror surface portions MIR has a mesh shape extending in the xy direction. In this case, the area of the gap SP can be set by changing the area of the metal mirror surface portion MIR, but it is necessary to form a non-existing portion of the metal mirror surface portion for insulation between the adjacent translucent electrodes. is there.

According to the mirror device having the above configuration, it can be used as a mirror with illumination such as a hand mirror or a vanity mirror, and can also be used as a mirror and illumination to be attached to an advertising board or a pillar, a ceiling, etc. in order to widen the space in the store. .

Hereinafter, the difference between the second embodiment and the first embodiment will be mainly described with reference to FIG. Elements indicated by the same reference numerals as those in the first embodiment are the same, and thus description thereof is omitted.

As shown in FIG. 11, Example 2 has the same configuration as Example 1 except that an insulating film TR is provided between the organic layer 3 and the metal mirror surface portion MIR. In this case, since there is an insulating film TR, even if there is a metal mirror surface portion MIR, that portion does not emit light, so that power consumption can be reduced. In this case, as a matter of course, there is no risk of leakage. Further, although not shown, in the modification of the second embodiment, the insulating film TR may be provided between the translucent electrode 2 and the metal mirror surface portion MIR, and the same effect is obtained.

Hereinafter, with respect to the third embodiment, differences from the first embodiment will be mainly described with reference to FIG. Elements indicated by the same reference numerals as those in the first embodiment are the same, and thus description thereof is omitted.

As shown in FIG. 12, in Example 3, the light extraction concavo-convex structure SBP such as the water blast method or the fine sand blast method is used so as to cover the light emitting portion of the organic EL element OEL on the front surface 1a of the substrate 1. The uneven surface structure (not shown) has the same configuration as that of Example 1 except that the uneven surface structure (not shown) is dispersedly arranged except for the flat portion FP facing the metal mirror surface portion MIR. In this case, the output light extraction efficiency can be increased by the light extraction uneven structure SBP. The light extraction concavo-convex structure SBP is a rough surface or a light extraction film in which the air interface is randomly deformed in order to extract the guided light in the translucent substrate 1. The light that enters the translucent substrate 1 from the organic layer 3 is scattered by the concavo-convex structure SBP, a part thereof is directed to the air layer, and the rest is directed to the organic layer 3 side by changing the angle. Of the light traveling toward the organic layer 3 side, the light striking the metal mirror surface portion MIR is divided into light traveling toward the air layer and light totally reflected at the flat portion FP depending on the angle. The light traveling toward the concavo-convex structure SBP according to the angle changes in the concavo-convex structure SBP, and is divided into light traveling toward the air layer and reflected light.

Hereinafter, the differences between the first embodiment and the first embodiment will be mainly described with reference to FIG. Elements indicated by the same reference numerals as those in the first embodiment are the same, and thus description thereof is omitted.

As shown in FIG. 13, Example 4 has the same configuration as Example 1 except that a meaningful figure is shown by the metal mirror surface portion MIR. In this case, the plurality of metal mirror surface portions MIR are juxtaposed in a significant pattern distribution such as “ENTER”, for example. By making the size of the metal mirror surface portion MIR the same, setting the interval to a predetermined interval, and forming a meaningful figure as a whole, it is possible to display with high design by the mirror surface.

Hereinafter, the differences of the fifth embodiment from the first embodiment will be mainly described with reference to FIG. Elements indicated by the same reference numerals as those in the first embodiment are the same, and thus description thereof is omitted.

As shown in FIG. 14, Example 5 has the same configuration as Example 1 except that the thickness of adjacent metal mirror surface portions MIR is changed. In this case, the metal mirror surface portion MIR3 is formed to be thicker, the metal mirror surface portion MIR2 is thinner than the metal mirror surface portion MIR3, and the metal mirror surface portion MIR1 is thinner than the metal mirror surface portion MIR2. As described above, the metal mirror surface portions MIR are juxtaposed so that the film thicknesses of the plurality of metal mirror surface portions MIR are uniformly increased or decreased in accordance with the juxtaposition order. The light emission intensity (transmitted light) from the layer 3 increases accordingly, and a display with a high gradation design that changes from a mirror surface to light emission is also possible. In addition, with respect to one metal mirror surface portion MIR, a smooth emission intensity from the light emitting portion to the metal mirror surface portion MIR can be increased by gradually increasing the film thickness from the portion located at the contour of the shape toward the inside thereof. It becomes possible. Furthermore, by gradually reducing the thickness of the metal mirror surface portion MIR rather than gradually, a gradation display effect such as an inner side along the contour can be obtained.

Next, Example 6 will be described with reference to FIGS. 15 and 16. The elements denoted by the same reference numerals as those of the modification of the first embodiment (FIGS. 5 and 6) are the same, and thus the description thereof will be omitted, and the differences from the modification of the first embodiment will be mainly described.

As shown in FIGS. 15 and 16, in the case of an element including an organic layer 3 including a light emitting layer made of a light emitting material having an emission spectrum distribution of an emission peak wavelength (hereinafter referred to as λ), the metal mirror surface portion MIR on the substrate 1 Plasmon light emission can be performed by setting the period to λ.

Further, as a mirror device of a further modification, as shown in FIG. 17, a metal mirror surface portion MIR4 provided with unevenness of wavelength size on each substrate 1 side may be provided as a metal mirror surface portion.

Furthermore, although not shown, in any of the above-described mirror devices, a sealing member that covers and seals the light emitting portions of the plurality of organic EL elements formed on the back surface 1b of the substrate 1 is provided. . As the sealing member, a glass dish-shaped transparent sealing cap may be used. The transparent sealing cap is fixed to the periphery of the light-emitting part with an adhesive so as to cover the light-emitting part, and hermetically protects the light-emitting part. The inside of the transparent sealing cap may be sealed by filling with an inert gas or an inert liquid. Further, as the sealing member, a transparent resin such as polyparaxylylene, or a gas barrier sealing film composed of a multilayer of an inorganic film such as a silicon oxide film and an organic film can be used. Thus, it is preferable that the light-emitting portion of the organic EL element is configured not to contact moisture and oxygen in the atmosphere by the sealing member.

In the above-described embodiments, the translucent substrate 1 may be a quartz or glass plate, a metal plate or metal foil, a bent resin substrate, a plastic film or a sheet. In particular, a glass plate or a transparent plate made of a synthetic resin such as polyester, polymethacrylate, polycarbonate, or polysulfone is preferable. When using a synthetic resin substrate, it is necessary to pay attention to gas barrier properties. If the gas barrier property of the substrate is too small, the organic EL element may be deteriorated by the outside air that has passed through the substrate. Therefore, a method of securing a gas barrier property by providing a dense silicon oxide film or the like on at least one surface of the synthetic resin substrate is also a preferable method.

Further, in the above embodiment, a so-called bottom emission type organic EL panel in which the translucent electrode 2 is formed on the back surface of the translucent substrate 1 and the light generated in the organic layer 3 is extracted from the front surface 1a of the substrate 1 is used. As described above, in a further embodiment, a mirror device of a so-called top emission type organic EL panel can be configured.

Hereinafter, the top emission type Example 7 in which the film forming order of the translucent electrode and the reflective electrode is exchanged will be mainly described with respect to parts different from the Example 1 with reference to FIG. Elements indicated by the same reference numerals as those in the first embodiment are the same, and thus description thereof is omitted.

As shown in FIG. 18, Example 7 has the same configuration as Example 1 except that the reflective electrode 4 </ b> A, the organic layer 3, and the translucent electrode 2 are arranged in order from the substrate 1. As shown in FIG. 18, in each of the organic EL elements of the mirror device of the top emission type organic EL panel, the translucent electrode 2 extends along the xy direction on the organic layer 3 and the metal mirror surface portion MIR. A film is formed. The translucent electrode 2 functions as, for example, an anode common to the plurality of organic EL elements OEL. A plurality of metal mirror surface portions MIR each having an area smaller than the area of the translucent electrode is formed on the translucent electrode 2. The reflective electrode 4A is connected to a power source (not shown). In this example, by applying a voltage between the translucent electrode 2 and the reflective electrode 4A, most of the light generated in the organic layer 3 is extracted from the translucent electrode 2 side.

In the above embodiment, the organic layer is a light-emitting laminate, but the light-emitting laminate can also be formed by laminating inorganic material films.

In the above-described embodiment, an example in which a plurality of organic EL elements R, G, and B are juxtaposed is shown. However, the present invention is not limited to this, and a stacked structure or a mixture of light-emitting layers such as a tandem structure that includes a plurality of light-emitting layers. The same effect can be obtained even when a plurality of white light emitting organic EL elements using the light emitting layer are juxtaposed.

Furthermore, in the above embodiment, the metal mirror surface portions MIR are arranged uniformly, but although not shown, a plurality of metal mirror surface portions each having a sufficiently small area compared to the light emitting area made of the organic EL element are plural. The metal mirror surface portions may be randomly arranged as long as the metal mirror surface portions are visually observed so as to be uniformly disposed.

DESCRIPTION OF SYMBOLS 1 Substrate 2 Translucent electrode 3 Organic layer 3a Hole injection layer 3b Hole transport layer 3c Light emitting layer 3d Electron transport layer 3e Electron injection layer 4 Reflective electrode BK Bank MBL Bus line MIR Metal mirror part OEL Organic EL element

Claims

A mirror device including an organic layer including a light emitting layer, which is laminated between a light transmitting electrode and a reflective electrode facing each other, and including at least one organic EL element formed on a substrate,
A plurality of metal mirror surface portions distributed on the translucent electrode;
Each of the plurality of metal mirror surface portions has an area smaller than the area of the translucent electrode.
The mirror device according to claim 1, wherein the plurality of metal surface portions are uniformly distributed.
3. The mirror device according to claim 2, wherein each of the plurality of metal mirror surface portions has the same shape and the same area.
3. The mirror device according to claim 2, wherein the thicknesses of the plurality of metal mirror surface portions are juxtaposed so as to uniformly increase or decrease in accordance with the juxtaposition order.
The mirror device according to claim 3, wherein the plurality of metal mirror surface portions are juxtaposed in a matrix at regular intervals.
3. The mirror device according to claim 2, wherein each of the plurality of metal mirror surface portions has a strip shape, and the plurality of metal mirror surface portions are juxtaposed in a stripe shape at a constant interval.
3. The mirror device according to claim 2, wherein the substrate is a translucent substrate, and the translucent electrode is formed on the translucent substrate.
The mirror device according to claim 2, wherein the plurality of metal mirror surface portions are juxtaposed so that an interval between adjacent metal mirror surface portions is the same as a peak wavelength of light emitted from the light emitting layer.
A light-transmitting dielectric bank formed on the substrate and partitioning the organic EL element; and at least one metal mirror portion distributed between the light-transmitting dielectric bank and the substrate. The mirror device according to claim 2.
The mirror device according to claim 1, wherein the plurality of metal mirror surface portions are arranged with a significant pattern distribution.