WO2013175807A1

WO2013175807A1 - Method for laminating works and touch panel

Info

Publication number: WO2013175807A1
Application number: PCT/JP2013/051058
Authority: WO
Inventors: 加藤　晃; 金市森田; 鈴木　信二
Original assignee: ウシオ電機株式会社; 信越化学工業株式会社; 崇越電通股▲フン▼有限公司
Priority date: 2012-05-22
Filing date: 2013-01-21
Publication date: 2013-11-28
Also published as: JP2013242756A; JP5362072B2; CN104169084A; CN104169084B; TWI537781B; TW201409319A

Abstract

Provided are: a method for laminating works, ensuring excellent reworkability, non-discoloration, a relatively short treatment time, and a relatively low cost; and a touch panel produced by this method. According to the method, a cover glass (11) which has a hydrophilic surface is bonded to a silicone substrate (17a) which contains a silane coupling agent by: subjecting the lamination faces of the cover glass (11) and the substrate (17a) to ultraviolet irradiation; stacking the resulting works; and subjecting the obtained stack to pressing/heating to form a laminate. Further, the first ITO electrode (13) provided on a hard coat layer (14a) present on a PET film (14) having a hydrophobic surface is bonded to the silicone substrate (17a) which contains a silane coupling agent by: subjecting the surface of the ITO electrode (13) and the lamination face of the silicone substrate (17a) to ultraviolet irradiation; stacking the resulting works; and subjecting the obtained stack to pressing/heating to form a laminate. Similarly, a silicone substrate (17b) which contains a silane coupling agent is bonded to both the second ITO electrode (15) present on a glass substrate (16) and another hard coat layer (14a) present on the PET film (14) by: subjecting the surface of the second ITO electrode (15), the surface of the hard coat layer (14a) and the lamination faces of the substrate (17b) to ultraviolet irradiation; stacking the resulting works; and subjecting the obtained stack to pressing/heating to form a laminate.

Description

Work bonding method and touch panel

TECHNICAL FIELD The present invention relates to a work bonding method that can be used for manufacturing touch panels, organic EL (Organic Electro-Luminescence), organic semiconductors, solar battery panels, and the like, and touch panels manufactured by this method. . In more detail, for example, from a work and silicon having a hydrophobic surface such as a resin such as PET (Polyethylene terephthalate) with a hard coat layer provided on the surface. For example, a workpiece having a hydrophilic surface such as glass, a workpiece having a hydrophobic surface such as a resin having a hard coat layer on the surface, and the like. A transparent conductive film such as an ITO (Indium Tin Oxide) transparent electrode is applied to the surface of a member made of glass or the above resin, and a workpiece having a hydrophobic surface is made of silicon. More particularly, the present invention relates to a method for bonding workpieces to each other with a member interposed therebetween, and a touch panel manufactured by bonding these workpieces.

In recent years, attention has been paid to organic EL, organic semiconductors, solar cells, and the like, which are manufactured by bonding workpieces together. In addition, a touch panel is known as a product manufactured by bonding a work. A touch panel is capable of controlling on / off of a switch, data input, and the like by touching a display on which an image is displayed with a finger or a pen, and has been rapidly spread in recent years. For example, touch panels are widely used in gadgets such as mobile phones, mobile game machines, tablet terminals, car navigation devices, bank ATMs, ticket vending machines, and the like.

FIG. 18 shows a schematic diagram of a touch panel including a video display device and a touch sensor module. As an example, a projected capacitive touch panel is shown.
As shown in FIG. 18, the touch panel 100 includes an image display device 30 such as an LCD panel and a position input device 10 arranged on the upper portion thereof.
The position input device 10 processes the position input information from the touch sensor module 10a and the touch sensor module 10a for detecting the portion of the touch sensor surface that is touched with a finger, a pen, or the like. The touch panel control unit 10b controls the image display device 30 based on it.

The touch sensor module 10a is provided with a PET film 14 having a first transparent conductive film (for example, ITO electrode) pattern and a second transparent conductive film (for example, an ITO electrode) pattern. The glass substrate 16 is laminated, and the first ITO electrode 13, the PET film 14, the second ITO electrode 15, and the glass substrate 16 are laminated in this order from the top. A light-transmitting hard coat layer 14a is provided on both surfaces of the PET film 14 to prevent the PET film 14 from being damaged. That is, the first transparent conductive film pattern is provided on the hard coat layer 14 a on the PET film 14. The hard coat layer 14a is made of, for example, acrylate resin.

Further, a cover glass 11 is installed on the side of the PET film 14 on which the first ITO electrode 13 is applied. A black matrix 12 is formed on the periphery of the surface of the cover glass 11 on the side facing the surface of the PET film 14 on which the first ITO electrode 13 pattern is applied.
On the other hand, on the lower side of the glass substrate 16, there is a wiring layer 21 that is electrically connected to the first ITO electrode 13 and the second ITO electrode 15 and further electrically connected to the touch panel control unit 10b described later. Provided.
The wiring layer 21 is disposed on the lower side of the glass substrate 16 so as to be shielded by the black matrix 12 provided on the cover glass 11 when observed from the cover glass 11 side. That is, the wiring layer 21 is provided at a position that does not interfere with the image displayed on the touch panel.

The touch panel control unit 10 b includes a touch panel (TP) control IC unit 22 and an FPC (flexible printed circuit board) 23, and the touch panel control IC unit 22 is provided on the FPC 23. The FPC 23 has an annular structure in which an opening is provided in the central portion so as to be shielded by the black matrix 12 provided in the cover glass 11 when observed from the cover glass 11 side, and the touch panel control IC portion. 22 is provided in the upper part of this annular structure part. That is, the touch panel control unit 10b is provided at a position that does not interfere with an image displayed on the touch panel. As described above, the touch panel control unit 10b is electrically connected to the wiring layer 21 of the touch sensor module 10a, and is also electrically connected to the image display device 30.

The touch sensor module 10a and the touch panel control unit 10b described above are stacked on the image display device 30 including the image display panel 32 such as an LCD panel to constitute a touch panel. A polarizing film 31 is provided on the surface of the image display panel 32. In addition, as shown in FIG. 18, the touch panel laminated in order of the touch sensor module 10a, the touch panel control unit 10b, and the image display device 30 from the top is bonded with an ultraviolet curable adhesive 24 (UV Resin). . That is, the surface on which the wiring layer 21 of the glass substrate 16 of the touch sensor module 10a is provided, and the polarizing film on the surface of the touch panel control unit 10b and the image display device 30 are bonded by UV Resin. Note that a portion of the touch sensor module 10a where the wiring layer 21 of the glass substrate 16 is not provided, an opening portion of the touch panel control unit 10b, and the like are filled with UV Resin.

The touch panel detects position information such as a finger touching the cover glass 11 with the touch panel sensor module 10a, and based on a control signal from the touch panel control unit 10b that has received the position information, It controls the operation.
As shown in FIG. 18B, the first ITO electrode 13 is an electrode pattern in which a plurality of electrode pattern units extending in the Y direction are arranged in parallel in the X direction. That is, the first ITO electrode 13 is composed of a plurality of electrode pattern units.
On the other hand, as shown in FIG. 18C, the second ITO electrode 15 is an electrode pattern in which a plurality of electrode pattern units extending in the X direction are arranged in parallel in the Y direction. That is, the second ITO electrode 15 is composed of a plurality of electrode pattern units.
A high frequency voltage is applied to each electrode pattern unit by a power source (not shown). When the finger approaches the cover glass 11 of the touch panel, the electrode pattern unit is arranged near the finger in the finger and the first ITO electrode 13, and the finger and the second ITO electrode 15 are close to the finger. Capacitances (capacitors) are formed between the arranged electrode pattern units, and current flows in each unit. By detecting this current change, the position of the finger on the cover glass 11 is detected.

That is, as apparent from FIGS. 18B and 18C, the first ITO electrode 13 detects the position of the finger in the X direction, and the second ITO electrode 15 detects the position of the finger in the Y direction. As shown in FIG. 18 (d), the first ITO electrode 13 and the second ITO electrode 15 are arranged in a matrix in the XY two-dimensional direction, whereby the touch panel sensor module 10a is covered. The position of the finger in contact with the glass 11 in the XY two-dimensional direction is detected.
A signal related to the position of the finger in contact with the cover glass 11 detected by the touch panel sensor module 10a is transmitted to the touch panel control unit 10b.

Here, between the PET film 14 and the cover glass 11 in the touch panel sensor module 10a (between the surface of the PET film 14 on which the first ITO electrode 13 is applied and the lower surface of the cover glass 11). Or between the PET film 14 and the glass substrate 16 (the surface of the hard coat layer 14a opposite to the first ITO electrode 13 side of the PET film 14 and the second ITO electrode 15 of the glass substrate 16 are provided). If an air layer is interposed between the surface and the air surface, light is reflected at the interface due to the difference in refractive index at the interface between each surface and the air layer. Degradation occurs.

Therefore, in order to eliminate such an air layer, the air layer is replaced with a transparent material having a refractive index close to that of the cover glass 11, the PET film 14, and the glass substrate 16 in comparison with air, so that the touch panel display In order to suppress a decrease in brightness and a decrease in contrast.
Specifically, the lower surface of the cover glass 11 and the surface of the PET film 14 on the first ITO electrode 13 side are joined by the transparent adhesive member 19 having a refractive index as described above compared with air. The Further, the surface of the hard coat layer 14a opposite to the first ITO electrode 13 side of the PET film 14 and the surface of the glass substrate 16 on which the second ITO electrode 15 is provided are also bonded by the adhesive member as described above. Is done.

As the adhesive member, for example, an optical adhesive tape (Optically 使用 Clear Adhesive Tape: hereinafter referred to as OCA tape) using a highly transparent acrylic adhesive as exemplified in Patent Document 1 and Patent Document 2 is used. ) And a highly transparent curable resin (Optically Clear Resin: hereinafter referred to as OCR) as exemplified in Patent Literature 3 and Patent Literature 4.

JP-A-9-251159 JP 2011-74308 A JP 2009-48214 A JP 2010-257208 A Japanese Patent No. 3714338 JP 2006-187730 A International Publication No. 2008/087800 JP 2008-19348 A

As described above, using the OCA tape and OCR, the lower surface of the cover glass 11 is bonded to the first ITO electrode 13 side surface of the PET film 14, and the first ITO electrode 13 of the PET film 14 is bonded. By controlling the surface of the hard coat layer 14a opposite to the surface and the surface of the glass substrate 16 on which the second ITO electrode 15 is provided, it is possible to suppress a decrease in brightness and a decrease in contrast of the touch panel display. It becomes possible to do.
However, when the OCA tape or OCR is used, the following problems and problems need to be considered.

In the case of the OCA tape, the adhesive strength is strong, so the reworkability is poor. That is, since it is difficult to peel it off and use it again, high bonding accuracy is required when using the OCA tape.
Further, since the OCA tape is hard, when there is a step structure on the surface such as the surface on the first ITO electrode 13 side of the PET film 14 or the surface on which the second ITO electrode 15 of the glass substrate 16 is provided, Bubbles are likely to be mixed into the stepped portion when pasting.
Furthermore, as described above, the OCA tape has poor reworkability, and bubbles are likely to be mixed in the stepped portion of the surface, so that the pasting process is difficult. Therefore, it is difficult to use the OCA tape in the case of an object to be joined whose joining surface has a large area. In addition, the OCA tape is relatively expensive.

On the other hand, joining by OCR is performed as follows. That is, OCR is applied to at least one joint surface of two workpieces, the two workpieces are overlapped, and the OCR is cured by heating or ultraviolet (UV) irradiation, so that the two workpieces are combined. Join. Here, since OCR generally has a high viscosity, it is difficult to uniformly apply it to the joint surface. Therefore, for example, there may be a problem that the cover glass 11 bonding surface and the PET film 14 bonding surface are bonded in a non-parallel state.

Also, OCR has a low heat-resistant temperature, and in the case of ultraviolet (UV) curable OCR, it is necessary to consider the effect of the OCR temperature rise during UV irradiation. That is, if the distance between the UV light source 40 and the OCR bonding surface is too short, the OCR is heated to a temperature higher than the heat resistance temperature of the OCR. Therefore, the distance between the UV light source 40 and the OCR bonding surface needs to be increased to some extent. In this case, however, the UV intensity at the OCR bonding surface is also weakened. become longer.

Further, since the OCR is deformed during curing, the joined state of the two workpieces is not always desirable. For example, in the case where the cover glass 11 and the PET film 14 are bonded or the glass substrate 16 and the image display panel 32 are bonded, the distance between the cover glass 11 and the PET film 14 or the distance between the glass substrate 16 and the image display panel 32 is not sufficient. In some cases, the performance of the touch panel deteriorates.
Furthermore, even in the case of OCR, the temporal resistance is not always sufficient, and when a certain amount of time elapses after bonding, the OCR itself is colored, for example, becomes yellow. Therefore, in the case of the touch panel, the image looks discolored. OCR is also relatively expensive.

The present invention has been made in view of the above circumstances, and it is an object of the present invention to provide a reworkability that does not develop color even when used for a long time, has a relatively short processing time, is relatively inexpensive, It is to provide a work bonding method that can be easily joined even to a member with a large surface area. Also, such a bonding method is used to suppress a decrease in luminance and a decrease in contrast. It is to provide a touch panel.

The present invention relates to a work having a hydrophilic surface such as glass, a work having a hydrophobic surface such as a resin, a work having a hydrophobic surface by applying a transparent conductive film to the surface of the glass or resin, etc. When a work having a hydrophilic surface and a work having a hydrophobic surface are bonded together, or when a work having a hydrophobic surface is bonded to each other, the conventional OCA tape or The present invention provides a technique of using a member made of silicon instead of OCR and bonding them together. Furthermore, the present invention provides a technique for bonding a member made of the silicone to the second and third works having the hydrophobic surface.

As a specific example, a touch panel will be described. In the touch panel shown in FIG. 18, the lower surface (first work surface) of the cover glass 11 and the first ITO electrode 13 side surface (second work surface) of the PET film 14 are attached. The surface of the hard coat layer 14a (the surface of the first work) opposite to the first ITO electrode 13 side of the PET film 14 and the second ITO electrode 15 of the glass substrate 16 are provided. A member made of silicon is used in place of the conventional OCA tape or OCR when the two surfaces are bonded together (the surface of the second workpiece).

When the surface of a member made of silicon (hereinafter referred to as a silicon substrate) is irradiated with ultraviolet rays in the atmosphere, the surface is oxidized to become a hydrophilic surface, and a glass substrate or a resin substrate is stacked on the surface. It is known that both substrates are bonded together by pressurizing or heating a combined glass substrate or resin substrate and a silicon substrate irradiated with ultraviolet rays for a predetermined time.

For example, as described in Patent Document 5, when the silicon substrate is a polydimethylsiloxane (PDMS) substrate, the surface of the silicon (PDMS) substrate 17 is shown in FIG. Thus, the surface has an organosiloxy group (hydrophobic surface).
By irradiating the surface of the substrate 17 held in the atmosphere with ultraviolet rays having a wavelength of 220 nm or less (for example, ultraviolet rays having a central wavelength of 172 nm emitted from a xenon excimer lamp), active oxygen is generated on the substrate surface. When the active oxygen comes into contact with the substrate surface, the substrate surface is oxidized. That is, as shown in FIG. 2B, the methyl group related to the organosiloxy group is eliminated, and the active oxygen is bonded to the silicon atom to which the methyl group is bonded.

Since moisture exists in the atmosphere, the above-mentioned active oxygen and hydrogen are combined, and as shown in FIG. 2C, the substrate surface is in a state in which a hydroxy group (OH group) is bonded to a silicon atom. It becomes. By superimposing the hydrophilic surfaces of the glass substrate 16 on these surfaces and bringing them into close contact, hydrogen bonds are formed at the interface between the surface of the PDMS substrate 17 and the glass surface, as shown in FIG. Both substrates are bonded together.

Silicone is a relatively stable material, and unlike OCR, the silicon itself does not color even after a certain amount of time has elapsed after bonding. Therefore, even if it is used as a bonding material for each substrate of the touch panel display, the touch panel image is not affected by discoloration.
Since silicon is a relatively soft material, the surface of the hard coat layer 14a on the first ITO electrode 13 side of the PET film 14 and the surface of the glass substrate 16 on the first wiring layer 21 side are used. Even when there is a step structure on a rough surface, it is possible to easily suppress the mixing of bubbles into the step portion at the time of attachment. That is, it is possible to easily join even a member having a large joint surface.

In addition, as described above, bonding using a silicon substrate does not include a step of applying to the bonding surface like OCR, and is not bonding by a curing reaction like OCR. There is no problem of uniformity of coating or deformation during curing.

Since silicon has a higher heat resistance temperature than OCR, compared with the distance between the ultraviolet (UV) light source and OCR bonding surface during OCR curing, the UV light source and silicon substrate surface during silicon substrate surface treatment The distance can be reduced and the UV intensity at the silicon substrate surface is greater than the UV intensity at the OCR interface. That is, in the UV irradiation process on the silicon substrate, the UV utilization efficiency is higher than in the UV irradiation process on the OCR bonding surface.
Further, according to the experiments by the inventors, the UV irradiation process to the silicon substrate, the heating process and the pressurizing process of the bonded substrate such as the silicon substrate and the glass substrate, based on the time required for the UV curing reaction of the OCR. It was found that the time required for was shorter.
In general, a silicon substrate is less expensive than an OCA tape or OCR.

In the case of bonding using a silicon substrate, the bonding is not completed immediately after the glass substrate or the resin substrate and the silicon substrate irradiated with ultraviolet rays are overlapped. Bonding is completed by applying pressure or heating. Therefore, it is easy to separate the two substrates immediately after the overlapping. Therefore, for example, when the alignment between the glass substrate or the resin substrate and the silicon substrate irradiated with ultraviolet rays is insufficient, if they are just after being superposed, they are peeled off once, and then the ultraviolet rays are applied to the silicon substrate again. Irradiation makes it possible to perform the bonding process. That is, it is rich in reworkability compared with the OCA tape.

FIG. 1 shows a configuration example of a touch panel assembled using the bonding method of the present invention.
The basic configuration is the same as that shown in FIG. 18, and includes a position input device 10 including a touch sensor module 10a and a touch panel control unit 10b, and an image display device 30. A silicon substrate 17a in which a silane coupling agent is introduced is provided between the first ITO electrode 13 provided on the surface of the hard coat layer 14a of the PET film 14 and the cover glass 11. It is done. Further, a silicon substrate 17 b into which a silane coupling agent is introduced is provided between the hard coat layer 14 a of the PET film 14 and the second ITO electrode 15 provided on the surface of the glass substrate 16.

Here, as a result of experiments by the inventors, the following knowledge was obtained. That is, the surface of a normal silicon substrate was irradiated with ultraviolet rays (UV) to make the surface a hydrophilic surface, and the first ITO electrode 13 was applied to the hydrophilic surface and the surface of the silicon substrate. It was found that bonding was not possible even when the PET film 14 and the glass substrate 16 provided with the second ITO electrode 15 on the surface were superposed. Similarly, bonding is possible even when the hydrophilic surface of the silicon substrate obtained by UV irradiation and the surface of the hard coat layer 14a opposite to the first ITO electrode 13 side of the PET film 14 are overlapped. I found it impossible.

That is, the bonding surface of the silicon substrate which is a hydrophilic surface, the surface where the first ITO electrode 13 of the PET film 14 (which is a hydrophobic surface) is applied, and the first ITO electrode 13 of the PET film 14 It has been found that it is difficult to join the surface of the hard coat layer 14a opposite to the surface on which the second ITO electrode 15 is applied to the surface opposite to the surface on which the second ITO electrode 15 is applied.

The inventors diligently studied and used a silicon substrate into which a silane coupling agent was introduced instead of a normal silicon substrate, and irradiated the UV onto the surface of the silicon substrate into which the silane coupling agent was introduced. Then, the surface is a surface suitable for bonding, the surface suitable for bonding, the surface on which the first ITO electrode 13 of the PET film 14 which is a hydrophobic surface is applied, and the first ITO of the PET film 14 By superimposing the surface of the hard coat layer 14a opposite to the surface to which the electrode 13 is applied, or the surface to which the second ITO electrode 15 provided on the surface of the glass substrate 16 is applied. The present inventors have found that it is possible to bond a silicon substrate introduced with a silane coupling agent and these surfaces.

Further, by superimposing the surface of the cover glass 11 which is a hydrophilic surface and the surface suitable for bonding of the above-described silicon substrate into which the silane coupling agent has been introduced, UV irradiation on the normal silicon substrate is performed. It was found that the cover glass 11 can be bonded to the silicon substrate into which the silane coupling agent has been introduced in the same manner as when the hydrophilic surface and the surface of the cover glass 11 are overlapped. .

Here, the silicon substrate into which the silane coupling agent is introduced is a silicon substrate formed by introducing a silane coupling agent into an uncured silicone resin and then curing it. As the silane coupling agent, for example, an epoxy-based, acrylic-based, or methacryl-based silane coupling agent can be used to obtain a silicon substrate suitable for the bonding of the present invention.

By performing the surface modification of the

silicon substrates

17a and 17b into which the silane coupling agent is introduced, the surface-modified surface is a surface on which the first ITO electrode 13 of the PET film 14 is applied, A second ITO electrode 15 provided on the surface of the hard coat layer 14a opposite to the surface on which the first ITO electrode 13 of the PET film 14 is applied and on the surface of the glass substrate 16 is applied. It became possible to join to any of the surfaces. The mechanism is not clearly understood, but it is considered that the mechanism is as follows. Hereinafter, this possible mechanism will be described with reference to FIGS.
As an example, the surface of a silicon substrate 17a introduced with a silane coupling agent is modified by ultraviolet (UV) irradiation, and the surface is bonded to the surface of the PET film 14 on which the first ITO electrode 13 is applied. Consider the case. It is assumed that the silicon substrate 17a introduced with the silane coupling agent of FIG. 3A is bonded to the cover glass 11 in advance by the method shown in FIG.

FIG. 3A shows the state of the silane coupling agent present on the surface of the silicon substrate 17a introduced with the silane coupling agent.
Silane coupling agents have two types of functional groups with different reactivity in one molecule. In the silicon substrate into which the silane coupling agent is introduced, a part of the silane coupling agent is considered to be exposed on the surface of the above-described silicon substrate.
In FIG. 3A, a functional group represented by RO (O is oxygen) is a functional group chemically bonded to an inorganic material, and X is a functional group bonded to an organic material. Since the first ITO electrode 13 on the PET film 14 is an inorganic substance, it chemically bonds with the functional group RO.

As shown in FIG. 3B, an excimer lamp is applied to the surface of the silicon substrate 17a into which a silane coupling agent is introduced in the atmosphere containing moisture (H ₂ O) and carbon dioxide (CO ₂ ). Irradiate ultraviolet rays (UV) emitted from an ultraviolet (UV) light source 40 such as the above. By UV irradiation, the silane coupling agent partially exposed on the surface of the silicon substrate 17a introduced with the silane coupling agent is modified.
Specifically, (a) as a result of the decomposition reaction of the functional group X of the silane coupling agent partially exposed on the surface of the silicon substrate 17a, the chemical reaction of moisture in water and carbon dioxide by UV irradiation, The group (—COOH) is formed on a part of the surface of the silicon substrate 17a, or (b) the functional groups RO and X of the silane coupling agent are decomposed and separated, so that It is considered that the oxygen radical generated as a result of the chemical reaction of carbon reacts to form a hydroxy group (—OH) on a part of the surface of the silicon substrate 17a. In addition, (c) functional groups RO and X that have not been decomposed are considered to remain on the surface.

In summary, the surface of the silicon substrate 17a into which the silane coupling agent has been introduced has (a) a portion bonded to a carboxyl group (termination is an OH group), and (b) an OH group bonded by an oxidation reaction with oxygen radicals. And (c) the functional groups RO and X are considered to be mixed with the portions remaining without being decomposed or detached.

That is, by irradiating the surface of the silicon substrate 17a with the silane coupling agent introduced with ultraviolet rays (UV), some of the functional groups in the silane coupling agent partially exposed on the surface are decomposed and detached. To do. In this case, the terminal portion of the part where the functional group is decomposed / detached becomes an OH group, so that a part of the surface of the silicon substrate 17a into which the silane coupling agent has been introduced becomes a hydrophilic surface. It is considered to be. Further, as described above, the remaining functional group RO has a characteristic of chemically bonding with the inorganic material.

And as shown in FIG.4 (c), by the ultraviolet-ray (UV) irradiation process, the state where the part which is hydrophilic in the partial area | region and the part in which the functional group RO group which chemically reacts with an inorganic substance remains are mixed The surface of the silicon substrate 17a having the introduced silane coupling agent introduced thereon is modified by UV irradiation so that a part of the originally hydrophobic portion is modified into a region terminated with an OH group. By superimposing the surface on which the first ITO electrode 13 is applied, the hydrophilic portion on the surface of the silicon substrate 17a and the hydrophilicity on the surface on which the first ITO electrode 13 of the PET film 14 is applied. Hydrogen bonds are formed between the parts. On the other hand, a chemical bond is generated between the portion where the functional group RO remains on the surface of the silicon substrate 17a and the hydrophobic portion of the surface of the PET film 14 on which the first ITO electrode 13 is applied. Here, dehydration of the bonding surface occurs by heating the silicon substrate 17a into which the superimposed silane coupling agent is introduced and the surface of the PET film 14 on which the first ITO electrode 13 is applied. The silicon substrate 17a finally introduced with the silane coupling agent and the surface of the PET film 14 on which the first ITO electrode 13 is applied are the oxygen covalent bond and the surface of the silicon substrate 17a. It is considered that the functional group RO remaining on the surface and the hydrophobic portion of the surface of the PET film 14 on which the first ITO electrode 13 is applied are bonded by chemical bonding.

In FIGS. 3 and 4, the case where the surface of the silicon substrate 17a into which the silane coupling agent has been introduced and the surface of the PET film 14 on which the first ITO electrode 13 is applied is joined is considered. The surface of the hard coat layer 14a opposite to the surface of the PET film 14 on which the first ITO electrode 13 is applied instead of the surface of the PET film 14 on which the first ITO electrode 13 is applied; Or it is thought that joining is possible by the same mechanism also when joining the surface where the 2nd ITO electrode 15 of the glass substrate 16 is given.

Based on the above, the present invention solves the above problems as follows.
(1) A work surface having a hydrophobic surface, a member made of silicon into which a silane coupling agent has been introduced are irradiated with ultraviolet rays, and the surface of the workpiece irradiated with ultraviolet rays and the silicon The member made of is laminated so as to be in contact with the surface irradiated with ultraviolet light, and is pressed so that the contact surface of the member made of the laminated work and the silicon is pressurized or laminated work. By heating the member made of silicon and silicon, or by heating the member made of laminated work and silicon so as to pressurize the contact surface, the wafer having a hydrophobic surface is obtained. And bonding the silicon and the member made of silicon into which the silane coupling agent is introduced.
(2) One surface of the first work having a hydrophilic surface, one surface of the second work having a hydrophobic surface, and a silicon into which a silane coupling agent is introduced. The both surfaces of the member are irradiated with ultraviolet rays, and the first workpiece and the silicon member and the second workpiece are laminated so that the surfaces irradiated with the ultraviolet rays are in contact with each other. The first and second workpieces and silicon are heated or laminated to be pressurized, or the first and second workpieces and silicon are laminated. By heating the member while applying pressure so that the contact surface is pressurized, the silane coupling agent converts the first work having a hydrophilic surface and the second work having a hydrophobic surface. Bonding with the introduced silicon substrate interposed.
(3) One surface of the first work having a hydrophobic surface, one surface of the second work having a hydrophobic surface, and a silicone into which a silane coupling agent is introduced. The both surfaces of the member are irradiated with ultraviolet rays, and the first workpiece and the silicon member and the second workpiece are laminated so that the surfaces irradiated with the ultraviolet rays are in contact with each other. Pressing so that the contact surface is pressurized, or heating the laminated first and second workpieces and silicon members, or laminating the first and second workpieces and silicon The first workpiece having a hydrophobic surface and the second workpiece having a hydrophobic surface are heated to a silane cup by heating the member made of silicon while applying pressure so that the contact surface is pressurized. Bonding is performed with a silicon substrate having a ring agent introduced therebetween.
(4) In a touch sensor module having a substrate coated with a transparent conductive film and a touch panel provided with an image display device, a transparent conductive film whose surface is modified by ultraviolet irradiation is applied to the touch sensor module. And a substrate made of a silicon having a silane coupling agent introduced and modified on both sides by ultraviolet irradiation, and each of the substrate and the silicon made member irradiated with the ultraviolet rays. Are laminated with the surfaces facing each other.
(5) As the silane coupling agent of the above (1) to (4), an epoxy, acrylic or methacrylic silane coupling agent is used.

In the present invention, the following effects can be obtained.
(1) A work surface having a hydrophobic surface and a member made of silicon to which a silane coupling agent has been introduced, by irradiating ultraviolet light onto the member made of the work surface and the silicon. The surface irradiated with ultraviolet light can be made a surface suitable for bonding, and the workpiece having the hydrophobic surface and the member made of silicon into which the silane coupling agent has been introduced can be reliably bonded.
For this reason, it becomes possible to bond a member made of a resin such as PET having a hydrophobic surface, a work provided with a transparent conductive film, etc., and a silicone into which a silane coupling agent is introduced.
(2) One surface of a workpiece having a hydrophilic surface is irradiated with ultraviolet rays, one surface of a workpiece having a hydrophobic surface is irradiated with ultraviolet rays, and a silico coupling agent is introduced. Irradiation of ultraviolet rays on both sides of a member made of silicon, ultraviolet rays of a workpiece having a hydrophilic surface, a workpiece having a hydrophobic surface, and a member made of silicon into which a silane coupling agent is introduced Laminate so that the irradiated surfaces face each other, or irradiate one surface of a workpiece having a hydrophobic surface with ultraviolet rays, and apply ultraviolet rays to both surfaces of a silicon member into which a silane coupling agent is introduced. Are laminated so that the work piece having a hydrophobic surface and the silicon member into which the silane coupling agent is introduced and the ultraviolet light irradiation surface of the work piece having the hydrophobic surface are opposed to each other. By bonding, the following effects are achieved: Rukoto can.
(A) Since coloring after a long time does not occur in the silicone, coloring after a long time does not occur as in the case of pasting together by OCA tape or OCR.
For this reason, the influence of discoloration does not generate | occur | produce in the image of a touch panel by applying to manufacture of a touch panel.
(B) Even when a step structure such as a conductive thin film is present on the joint surface, the silicon deforms and adheres according to the step, so that bubbles can be prevented from being mixed into the step portion at the time of attachment. Easy.
(C) As in the case of bonding using OCR, it is possible to avoid problems such as difficulty in realizing coating uniformity and deformation at the time of curing, and since silicon has a higher heat resistant temperature than OCR, The ultraviolet light source and the irradiation surface of the silicon can be brought close to each other, and the light irradiation surface of the silicon can be modified efficiently.
(D) Generally, a member made of silicon is less expensive than an OCA tape or OCR, so that the manufacturing cost can be reduced.
(E) In the case of joining using a member made of silicon, the joining is not completed immediately even if the work and silicon members are overlapped, but is pressurized or heated for a predetermined time. To complete the joining. For this reason, it is easy to separate the work and the silicon immediately after the superposition. Therefore, when the alignment between the workpiece and the silicon member is insufficient, if they are just after being overlapped, they are peeled off once, and the silicon member is again irradiated with ultraviolet rays. It becomes possible to perform a joining process. That is, it is rich in reworkability compared with the OCA tape.
(F) Conventionally, a member made of silicon, which has been difficult to be bonded even by using a surface modification treatment by ultraviolet irradiation, and a surface of the conductive thin film substrate where the surface of the touch sensor module is hydrophobic Bonding becomes possible. For this reason, when the components of the touch sensor module are bonded together, instead of the conventional OCA tape or OCR, a component made of silicon is used to bond the components, and the touch sensor module is bonded. Can be configured.
(3) By using an epoxy, acrylic or methacrylic silane coupling agent as a silane coupling agent to be introduced into a member made of silicon, it is possible to join a workpiece having a hydrophobic surface. A member made of a suitable silicone can be obtained.

It is an example of composition of a touch panel assembled using the joining method of the present invention. It is a figure explaining joining of the PDMS board | substrate which the surface hydrophilic glass substrate and ultraviolet rays irradiated. FIG. 2 is a diagram (1) for explaining the joining of a surface of a PET film on which an ITO electrode is applied and a silicon substrate into which a silane coupling agent is introduced. FIG. 6 is a diagram (2) illustrating the bonding between the surface of the PET film on which the ITO electrode is applied and the silicon substrate into which the silane coupling agent has been introduced. It is a figure explaining the joining process (A-1) of the cover glass and the PET film on which the first transparent conductive film (ITO electrode) is applied. FIG. 1 is a diagram for explaining a bonding process (B-1) between a PET film having a first transparent conductive film (ITO) applied to the surface and a glass having a second transparent conductive film (ITO) applied to the surface; It is. FIG. 2 is a diagram for explaining a bonding process (B-1) between a PET film having a first transparent conductive film (ITO) applied to the surface and a glass having a second transparent conductive film (ITO) applied to the surface; It is. It is a figure explaining the joining process (A-2) of a cover glass and the PET film by which the 1st transparent conductive film (ITO) was given to the surface. FIG. 1 is a diagram for explaining a bonding step (B-2) between a PET film having a first transparent conductive film (ITO) applied to the surface and a glass having a second transparent conductive film (ITO) applied to the surface; It is. FIG. 2 is a diagram for explaining a bonding process (B-2) between a PET film having a first transparent conductive film (ITO) applied to the surface and a glass having a second transparent conductive film (ITO) applied to the surface; It is. It is a figure explaining the joining process (A-3) of the cover glass and the PET film on which the first transparent conductive film (ITO) is applied. It is a figure explaining the joining process (B-3) of the PET film by which the surface of the 1st transparent conductive film (ITO) was given, and the glass by which the 2nd transparent conductive film (ITO) was given by the surface. It is another example of a structure of the touch panel assembled using the joining method of the present invention. It is a figure explaining the joining process (C-1) with the 1st glass substrate by which the cover glass and the 1st transparent conductive film (ITO) were given to the surface. Bonding step (D-1) between the first glass substrate having the first transparent conductive film (ITO) applied to the surface and the second glass substrate having the second transparent conductive film (ITO) applied to the surface FIG. It is a figure explaining the joining process (C-2) of the cover glass and the 1st glass substrate by which the surface of the 1st transparent conductive film (ITO) was given. Bonding step (D-2) of the first glass substrate having the first transparent conductive film (ITO) applied to the surface and the second glass substrate having the second transparent conductive film (ITO) applied to the surface FIG. FIG. 3 is a schematic diagram of a touch panel including a video display device and a touch sensor module.

Hereinafter, although the case where a touch panel is manufactured is described as an example of the embodiment of the present invention, the present invention can be applied to the manufacture of the organic EL, organic semiconductor, solar cell and the like in addition to the touch panel.
(1) Embodiment 1
FIG. 1 is a diagram showing a first configuration example of the touch panel according to the present invention.
The basic configuration is the same as that shown in FIG. 18, and the touch panel 100 includes an image display device 30 such as an LCD panel and a position input device 10 disposed above the image display device 30.
The position input device 10 processes the position input information from the touch sensor module 10a and the touch sensor module 10a for detecting the portion of the touch sensor surface that is touched with a finger, a pen, or the like. The touch panel control unit 10b controls the image display device 30 based on it.

The touch sensor module 10a includes a PET film 14 provided with a first transparent conductive film (for example, ITO electrode) pattern shown in FIG. 18B and a second film shown in FIG. 18C. The glass substrate 16 is provided with a transparent conductive film (for example, ITO electrode) pattern, and the cover glass 11, the silicon substrate 17a, the first ITO electrode 13, and the PET film are arranged from the top. 14, the silicon substrate 17b, the second ITO electrode 15, and the glass substrate 16 are laminated in this order. A light-transmitting hard coat layer 14a is provided on both surfaces of the PET film 14 to prevent the PET film 14 from being damaged. As described above, the hard coat layer 14a is made of, for example, acrylate resin.

A black matrix 12 is formed on the periphery of the surface of the cover glass 11 on the side facing the surface of the PET film 14 on which the first ITO electrode 13 pattern is applied.
On the lower side of the glass substrate 16, a wiring layer 21 that is electrically connected to the first ITO electrode 13 and the second ITO electrode 15 and is also electrically connected to the touch panel control unit 10b is provided. The wiring layer 21 is disposed on the lower side of the glass substrate 16 so as to be shielded by the black matrix 12 provided on the cover glass 11 when observed from the cover glass 11 side.
As described above, the touch panel control unit 10 b includes the touch panel (TP) control IC unit 22 and the FPC (flexible printed circuit board) 23, and the touch panel control IC unit 22 is provided on the FPC 23. The FPC 23 has an annular structure in which an opening is provided in the central portion so as to be shielded by the black matrix 12 provided in the cover glass 11 when observed from the cover glass 11 side, and the touch panel control IC portion. 22 is provided in the upper part of this annular structure part.
The touch panel control unit 10b is electrically connected to the wiring layer 21 of the touch sensor module 10a, and is also electrically connected to the image display device 30.
The touch sensor module 10a and the touch panel control unit 10b described above are stacked on the image display device 30 to constitute a touch panel.

In the touch panel shown in FIG. 1, the substrate of the first transparent conductive film (for example, the first ITO electrode 13) in the touch sensor module 10a is the PET film 14, and the second transparent conductive film (for example, the first transparent conductive film) In this example, the glass substrate 16 is the second ITO electrode 15). In the configuration example of the touch panel shown in FIG. 1, the thickness of each substrate and each layer is exaggerated for ease of explanation, and the relative relationship between the actual thickness of each substrate and each layer is shown in FIG. It is different from what is shown.

In the following, the steps of bonding the workpieces for manufacturing the touch sensor module will be described.
[Step A-1] Joining Step of Cover Glass and PET Film with First Transparent Conductive Film (ITO Electrode) Surface This step is shown in FIG. This process shows a method for bonding a first work having a hydrophilic surface and a second work having a hydrophobic surface with a silicon substrate interposed therebetween, and has a hydrophilic surface. Cover glass 11 corresponds to the first work, and the first transparent conductive film (ITO) corresponds to the second work having a hydrophobic surface is the surface of the hard coat layer 14a. It is the PET film 14 applied to the.

(A) Bonding of the cover glass 11 and the silicon substrate 17a into which the silane coupling agent is introduced The lower surface and the hydrophobic surface of the cover glass 11 which is the first work having a hydrophilic surface Prior to bonding the surface of the first ITO electrode 13 side of the PET film 14 which is the second workpiece, first, the cover glass 11 and the silicon substrate 17a into which the silane coupling agent is introduced are firstly used. And joining.
As shown in FIG. 5 (a), the surface of a silicon substrate 17a introduced with a silane coupling agent is irradiated with UV light emitted from an ultraviolet (UV) light source 40 such as an excimer lamp. The region where the silane coupling agent is exposed on the surface of the substrate 17a is modified so that the hydrophilic region terminated with an OH group and the remaining region of the functional group RO are mixed. Further, the region where the silane coupling agent is not exposed on the surface of the silicon substrate 17a is oxidized to be modified into a hydrophilic region. Hereinafter, the silicon substrate surface thus modified is referred to as “silicon substrate surface suitable for bonding”.
Next, UV light emitted from an ultraviolet (UV) light source 40 such as an excimer lamp is irradiated on the joint surface of the cover glass 11.

Thereafter, the bonding surface of the cover glass 11 and the UV irradiation surface of the silicon substrate 17a introduced with the silane coupling agent are overlapped. The bonding strength is increased by appropriately pressing or heating the overlapped cover glass 11 and the silicon substrate 17a introduced with the silane coupling agent.

Since the cover glass 11 itself has a hydrophilic surface, it is not always necessary to irradiate UV light. However, by irradiating the joint surface of the cover glass 11 with UV light, the joint surface of the cover glass 11 is activated and impurities on the surface of the cover glass 11 are decomposed and removed, so that the cover glass is removed. 11 and the silicon substrate 17a into which the silane coupling agent is introduced are more reliably bonded.
Further, UV irradiation may be performed simultaneously on the surface of the silicon substrate 17a introduced with the silane coupling agent and the bonding surface of the cover glass 11.

(B) Bonding of Silicon Substrate 17a Bonded to Cover Glass 11 and PET Film 14 Next, as shown in FIG. 5 (b), the surface of the silicon substrate 17a introduced with a silane coupling agent A silicon substrate suitable for bonding the UV irradiation surface of the silicon substrate 17a in which a silane coupling agent is introduced by irradiating the substrate with UV light emitted from an ultraviolet (UV) light source 40 such as an excimer lamp. The surface.

On the other hand, in the PET film 14 in which the first ITO electrode 13 is applied to the surface of the hard coat layer 14a, ultraviolet light (UV) such as an excimer lamp is formed on the surface of the pattern of the first ITO electrode 13. ) UV light emitted from the light source 40 is irradiated to modify a part of the patterned surface of the first ITO electrode 13 of the PET film 14 into a region terminated with an OH group. Hereinafter, the surface thus modified is referred to as “transparent conductive film surface suitable for bonding”.

Thereafter, the UV-irradiated surface of the silicon substrate 17a into which the silane coupling agent has been introduced and the surface of the PET film 14 that has been subjected to the UV-irradiation-treated first ITO electrode 13 are overlaid, and an appropriate overlay is obtained. Further, the silicon substrate 17a and the PET film 14 are pressurized or heated, and the silicon substrate 17a into which the silane coupling agent is introduced (joined with the cover glass 11), the first substrate An ITO electrode 13 is bonded to a PET film 14 having a surface.

That is, the bonding method employed in this step (A-1) is as follows.
(1) The silicon substrate 17a introduced with a silane coupling agent is bonded to the lower surface of the cover glass 11, which is the first work having a hydrophilic surface. In the bonding method, the silicon substrate 17a is irradiated with ultraviolet rays so that the ultraviolet irradiation surface is a silicon substrate surface suitable for bonding, and the surface is laminated on the cover glass 11 to have a hydrophilic surface. The cover glass 11 which is one work and the silicon substrate 17a introduced with the silane coupling agent are bonded. As described above, the joint surface of the cover glass 11 may be irradiated with ultraviolet rays.
(2) The surface of the silicon substrate 17a introduced with the silane coupling agent joined to the cover glass 11, which is the first work having a hydrophilic surface, and the second work having a hydrophobic surface. A silicon substrate suitable for bonding the ultraviolet-irradiated surface of the silicon substrate 17a by irradiating the surface of the PET film 14 with the first transparent conductive film (ITO electrode 13) on the surface. The surface is modified so that the ultraviolet irradiation surface of the PET film 14 is a transparent conductive film surface suitable for bonding.
(3) Both ultraviolet irradiation surfaces are overlapped.
(4) From the top, a PET film 14 as a second work having a hydrophobic surface, a silicon substrate 17a having a silane coupling agent introduced therein, and a first work having a hydrophilic surface. Heating is performed while pressurizing the contact surfaces of the workpieces stacked in the order of the cover glass 11.
In (4) of this bonding method, only pressurization or heating may be used, but it is desirable to heat while applying pressure.

[Step B-1] Joining process between PET film with first transparent conductive film (ITO electrode) on the surface and glass with second transparent conductive film (ITO electrode) on the surface 6 and FIG. This process shows a method of bonding a first work having a hydrophobic surface and a second work having a hydrophobic surface through a silicon substrate into which a silane coupling agent has been introduced. The first work having a hydrophobic surface corresponds to the PET film 14 to which the cover glass 11 is bonded, and the second work having the hydrophobic surface corresponds to the second work. It is the glass substrate 16 with which the transparent conductive film (ITO electrode 15) was given to the surface.

(A) Bonding of the silicon substrate 17b into which the silane coupling agent has been introduced and the PET film 14 (already bonded to the cover glass 11) As shown in FIG. 6 (a), the silane coupling agent has been introduced. The surface of the silicon substrate 17b is irradiated with UV light emitted from an ultraviolet (UV) light source 40 such as an excimer lamp, so that the ultraviolet irradiation surface of the silicon substrate 17b is a silicon substrate surface suitable for bonding. .

Next, the cover glass 11 is bonded to the surface of the hard coat layer 14a on which the first ITO electrode 13 pattern has been applied via a silicon substrate 17a into which a silane coupling agent has been introduced. 6A, an excimer lamp or the like is provided on the surface of the hard coat layer 14a opposite to the surface on which the first ITO electrode 13 pattern is applied. Irradiation with UV light emitted from an ultraviolet (UV) light source 40 modifies a part of the surface of the hard coat layer 14a into a region terminated with an OH group. Hereinafter, the surface thus modified is referred to as “hard coat layer surface suitable for bonding”.
Thereafter, the UV-irradiated surface of the silicon substrate 17b into which the silane coupling agent has been introduced and the UV-irradiated surface of the PET film 14 are overlapped, and the PET film 14 and the silicon substrate 17b are appropriately pressurized. Or heating, the silicon substrate 17b into which the silane coupling agent has been introduced and the PET film 14 having the first ITO electrode 13 applied on the surface thereof are joined.

(B) Bonding of PET film 14 (already bonded to cover glass 11) and glass substrate 16 As shown in FIG. 7 (b), a silicon in which a silane coupling agent bonded to PET film 14 is introduced. The surface of the substrate 17b opposite to the bonding surface with the PET film 14 is irradiated with UV light emitted from an ultraviolet (UV) light source 40 such as an excimer lamp, so that the silicon is suitable for bonding. The substrate surface.
Next, for example, a second ITO electrode 15 having a pattern as shown in FIG. 18C is emitted from an ultraviolet (UV) light source 40 such as an excimer lamp to the surface of the glass substrate 16 provided on the surface. A portion of the surface of the glass substrate 16 on which the second ITO electrode 15 pattern is applied is modified to a region terminated with an OH group. Hereinafter, the surface modified in this way is referred to as a transparent conductive film surface suitable for bonding, similar to the case where the surface of the PET film 14 on which the first ITO electrode 13 pattern is applied is irradiated with UV.

Thereafter, the UV-irradiated surface of the silicon substrate 17b into which the silane coupling agent has been introduced and the UV-irradiated surface of the glass substrate 16 are superposed, and the glass substrate 16 and the silicon into which the silane coupling agent has been introduced as appropriate. The silicon substrate 17b is pressurized or heated to bond the silicon substrate 17b bonded to the PET film 14 and the glass substrate 16 having the second ITO electrode 15 applied to the surface thereof.
In addition, instead of the glass substrate 16 having the second ITO electrode 15 applied to the surface, a resin substrate (for example, a PET film 14) having the second ITO electrode 15 applied to the surface may be used. There is no change in the procedure of step 2.

That is, the bonding method in this step (B-1) is as follows.
(1) In the PET film 14 in which the surface of the silicon substrate 17b into which the silane coupling agent is introduced and the first glass having a hydrophobic surface and the cover glass 11 are joined, the PET film 14 The surface of the hard coat layer 14a to which the cover glass 11 is not bonded is irradiated with ultraviolet rays to change the ultraviolet irradiation surface of the silicon substrate 17b to a silicon substrate surface suitable for bonding. And the ultraviolet irradiation surface of the PET film 14 bonded to the cover glass 11 is used as a hard coat layer surface suitable for bonding.
(2) Both ultraviolet irradiation surfaces are overlapped.
(3) From above, the silicon substrate 17b into which the silane coupling agent has been introduced and the PET film 14 (cover glass 11 bonded) as the first work having a hydrophobic surface are superposed in this order. The workpiece is heated while being pressurized.
(4) The surface of the silicon substrate 17b introduced with the silane coupling agent bonded to the PET film 14 (which has been bonded to the cover glass 11), which is the first work having a hydrophobic surface, and hydrophobic The surface of the glass substrate 16 which is the second work having the surface is irradiated with ultraviolet rays to the surface of the glass substrate 16 on which the second transparent conductive film (ITO electrode 15) is applied. The ultraviolet irradiation surface is modified to a silicon substrate surface suitable for bonding, and the ultraviolet irradiation surface of the glass substrate 16 is made a transparent conductive film surface suitable for bonding.
(5) Superimpose both ultraviolet irradiation surfaces.
(6) From above, a PET film 14 (joined with the cover glass 11) as a first work having a hydrophobic surface, a silicon substrate 17b into which a silane coupling agent has been introduced, and a hydrophobic surface Heating is performed while pressurizing the contact surfaces of the workpieces stacked in the order of the glass substrate 16 as the second workpiece.
In (3) and (6) of this bonding method, only pressurization or heating may be used, but it is preferable to heat while applying pressure.

The touch sensor module in the touch panel shown in FIG. 1 is configured through [Step A-1] and [Step B-1] employing the bonding method of the present invention.
The touch sensor module 10a and the touch panel control unit 10b are stacked on the image display device 30 such as an LCD panel to constitute a touch panel. Here, the structure example of the touch panel control unit 10b and the bonding of the touch panel laminated in the order of the touch sensor module 10a, the touch panel control unit 10b, and the image display device 30 are the same as those in the related art, and therefore detailed here. Description is omitted.

In the first embodiment, a touch sensor module in a touch panel is constructed by the following method. That is, when bonding each component of the touch sensor module, a silicon (substrate) into which a silane coupling agent is introduced instead of the conventional OCA tape or OCR is used, and the silane coupling agent is introduced. The joint surface between the silicon (substrate) and each component is irradiated with ultraviolet rays.
In the substrate on which the conductive thin film (for example, ITO electrode) of the touch sensor module is provided, the surface on which the conductive thin film is provided is irradiated with ultraviolet rays.
Furthermore, when the surface on which the conductive thin film is not provided on the substrate on which the conductive thin film is provided is a hydrophobic surface, the surface is also irradiated with ultraviolet rays.

By constructing a touch sensor module by the bonding method of the present invention, the following advantages can be obtained.
That is, unlike the OCA tape and OCR, the silicone does not color after a long time, and the touch panel image, which is the final product, does not affect the color.
Even when a step structure such as a conductive thin film is present on the joint surface, the silicon deforms and adheres according to the step, so that it is easy to prevent air bubbles from being mixed into the stepped portion during bonding. It is. Further, it is possible to easily join a member having a large joint surface.

Further, since the bonding is not performed by a curing reaction such as OCR, problems such as difficulty in realizing coating uniformity in the coating process on the bonding surface peculiar to OCR and deformation during curing can be avoided. Further, since the heat resistant temperature is higher than that of OCR, the ultraviolet irradiation light source and the irradiation surface of the silicon substrate can be brought close to each other, and the light irradiation surface of the silicon substrate can be efficiently modified. On the other hand, when the ultraviolet curable OCR is used, the heat resistance of the OCR itself is low, so the ultraviolet curable OCR application surface and the ultraviolet irradiation light source 40 cannot be brought too close to each other. The intensity of ultraviolet rays becomes small, and the utilization efficiency of ultraviolet rays becomes small. As a result, the time required for the OCR curing reaction for bonding increases.
In general, a silicon substrate is less expensive than an OCA tape or OCR.

Furthermore, in the case of bonding using a silicon substrate into which a silane coupling agent has been introduced, the glass substrate or resin substrate and the silicon substrate into which the silane coupling agent to which ultraviolet rays have been applied are superimposed are immediately bonded. Rather than being completed, the bonding is completed by pressurizing or heating both substrates for a predetermined time. Therefore, it is easy to separate the two substrates immediately after the overlapping. Therefore, for example, when the alignment between the glass substrate or the resin substrate and the silicon substrate into which the silane coupling agent irradiated with ultraviolet rays is insufficient, if they are just after being overlapped, both are peeled off once, It is possible to perform the bonding process by irradiating the silicon substrate again with ultraviolet rays. That is, it is rich in reworkability compared with the OCA tape.

In particular, in the bonding method of the present invention, the conductive thin film of the silicon substrate and the conductive thin film substrate of the touch sensor module, which were conventionally difficult to bond even by using surface modification treatment by ultraviolet irradiation. Also for bonding to the surface and bonding of the silicon substrate to the conductive thin film substrate when the surface is hydrophobic, by using the silicon substrate into which the silane coupling agent has been introduced, the silicon substrate is used. Surface modification of the substrate by UV irradiation (surface state suitable for bonding), and surface modification of the conductive thin film surface and the hydrophobic surface of the substrate by UV irradiation (surface condition suitable for bonding) Therefore, the above-mentioned bonding can be performed.
That is, when bonding each component of the touch sensor module, a silicon (substrate) into which a silane coupling agent is introduced instead of the conventional OCA tape or OCR is used, and the silane coupling agent is introduced. The touch sensor module can be configured by irradiating ultraviolet rays onto the bonding surface between the silicon (substrate) and each component and bonding the components of the touch sensor module.

[Modification (1) of Embodiment 1]
In the first embodiment, an example in which the touch sensor module in the touch panel shown in FIG. 1 is configured through [Step A-1] and [Step B-1] employing the bonding method of the present invention is shown.

That is, in [Step A-1], the cover glass 11 is first bonded to the silicon substrate 17a into which the silane coupling agent has been introduced, and then the silane coupling agent bonded to the cover glass 11 is bonded. The cover glass 11 and the PET film 14 provided with the first transparent conductive film (ITO electrode 13) on the surface were joined in the order of joining the introduced silicon substrate 17a and the PET film 14.
In [Step B-1], first, the PET film 14 bonded to the cover glass 11 through the silicon substrate 17a introduced with the silane coupling agent constituted in [Step A-1] The silicon substrate 17b into which the silane coupling agent has been introduced is bonded to the silicon substrate 17b into which the silane coupling agent has been introduced, and then the cover glass 11 and the bonded PET film 14 have been introduced into the silicon substrate 17b into which the silane coupling agent has been introduced. And a glass substrate 16 having a surface on which a second ITO electrode 15 is applied, and a silicon substrate 17b in which a silane coupling agent bonded to the PET film 14 is introduced. Were joined to form a touch sensor module 10b.

However, the order of attaching the workpieces is not limited to the order shown in [Step A-1] and [Step B-1].
For example, in the above [Step A-1], the silicon substrate 17a into which the silane coupling agent is introduced and the PET film 14 are first joined, and then the PET film 14 and the joined silane coupling agent are introduced. Further, the cover glass 11 and the PET film 14 having the first transparent conductive film (ITO electrode) applied thereto may be bonded in the order of bonding the silicon substrate 17a and the cover glass 11. . (Hereinafter, such a step is referred to as [Step A-2].)

Similarly, in the above [Step B-1], first, the silicon substrate 17b into which the silane coupling agent has been introduced and the glass substrate 16 are bonded together, and then the glass substrate 16 and the bonded silane coupling agent are bonded. Silane coupling in which the cover glass 11 and the bonded PET film 14 and the glass substrate 16 are bonded in the order of bonding the introduced silicon substrate 17b, the cover glass 11 and the bonded PET film 14. The touch sensor module may be configured by joining the silicon substrate 17b into which the agent is introduced. (Hereinafter, such a step instead of step B-1 will be referred to as [step B-2].)

Hereinafter, the touch sensor module in the touch panel shown in FIG. 1 is constructed through [Step A-2] and [Step B-2] using the bonding method of the present invention with reference to FIGS. An example will be described.
[Step A-2] Joining Step of Cover Glass and PET Film with First Transparent Conductive Film (ITO Electrode) Surface This step is shown in FIG. This process shows a method for bonding a first work having a hydrophilic surface and a second work having a hydrophobic surface with a silicon substrate introduced with a silane coupling agent interposed therebetween. The cover glass 11 corresponds to the first work having a hydrophilic surface, and the first transparent conductive film (ITO electrode 13) corresponds to the second work having a hydrophobic surface. ) Is the PET film 14 applied to the surface of the hard coat layer 14a.

(A) Bonding of Silicone Substrate 17a Introduced with Silane Coupling Agent and PET Film 14 From an ultraviolet (UV) light source 40 such as an excimer lamp on the surface of silicon substrate 17a introduced with a silane coupling agent By irradiating the emitted UV light, the surface of the silicon substrate 17a into which the silane coupling agent has been introduced is made a silicon substrate surface suitable for bonding. As described above, the surface of the silicon substrate suitable for bonding means that the region where the silane coupling agent is exposed on the surface of the silicon substrate is the remaining of the hydrophilic region terminated with OH groups and the functional group RO. Silicon substrate surface that has been modified to have a mixed region, and the region where the silane coupling agent is not exposed on the surface of the silicon substrate has been modified to a hydrophilic region by oxidation Say that.

Further, for example, in the PET film 14 in which the first ITO electrode 13 having a pattern as shown in FIG. 18B is applied to the surface of the hard coat layer 14a, as shown in FIG. The surface of the hard coat layer 14a on which the first ITO electrode 13 pattern has been applied is irradiated with UV light emitted from an ultraviolet (UV) light source 40 such as an excimer lamp, and the above PET film. The surface of the hard coat layer 14a provided with the first ITO electrode 13 pattern at 14 is used as a transparent conductive film surface suitable for bonding. As described above, the surface of the transparent conductive film suitable for bonding is a part of the hydrophobic surface (the surface of the hard coat layer 14a) on which the transparent conductive film (the first ITO electrode 13 pattern) is applied. Refers to a surface that has been modified into a region terminated with an OH group.

Thereafter, the UV irradiation surface of the silicon substrate 17a into which the silane coupling agent has been introduced and the UV irradiation-treated surface of the PET film 14 are overlapped, and the silicon substrate 17a and the PET film 14 are appropriately pressurized. Or heating, the silicon substrate 17a into which the silane coupling agent is introduced and the PET film 14 having the first ITO electrode 13 applied on the surface thereof are joined.

(B) Joining of Silicone Substrate 17a Introduced with Silane Coupling Agent Joined to PET Film 14 and Cover Glass 11 Next, as shown in FIG. UV light emitted from an ultraviolet (UV) light source 40 such as an excimer lamp is irradiated on the surface of the silicon substrate 17a, into which the silane coupling agent has been introduced, on the side opposite to the bonding surface with the PET film 14. The UV irradiation surface of the silicon substrate 17a into which the silane coupling agent has been introduced is used as a silicon substrate surface suitable for bonding.
Further, UV light emitted from an ultraviolet (UV) light source 40 such as an excimer lamp is irradiated on the joint surface of the cover glass 11.

Thereafter, the UV-irradiated surface of the silicon substrate 17a to which the silane coupling agent joined to the PET film 14 is introduced and the joining surface of the cover glass 11 are overlaid, and the overlaid cover glass 11 and the above are appropriately combined. The bonding strength is increased by pressurizing or heating the silicon substrate 17a.

Since the cover glass 11 itself has a hydrophilic surface, it is not always necessary to irradiate UV light. However, by irradiating the joint surface of the cover glass 11 with UV light, the joint surface of the cover glass 11 is activated and impurities on the surface of the cover glass 11 are decomposed and removed, so that the cover glass is removed. 11 and the silicon substrate 17a into which the silane coupling agent is introduced are more reliably bonded.
Further, the UV irradiation may be performed simultaneously on the surface of the silicon substrate 17a introduced with the silane coupling agent bonded to the PET film 14 and the cover surface of the cover glass 11.

That is, the bonding method in this step (A-2) is as follows.
(1) For the first transparent conductive film (ITO electrode 13) of the PET film 14 which is the second work having the surface of the silicon substrate 17a into which the silane coupling agent is introduced and the hydrophobic surface By irradiating ultraviolet rays, the ultraviolet irradiation surface of the silicon substrate 17a is modified to a silicon substrate surface suitable for bonding, and the ultraviolet irradiation surface of the PET film 14 is used as a transparent conductive film surface suitable for bonding. .
(2) Both ultraviolet irradiation surfaces are overlapped.
(3) Pressurizing the contact surface of the work in which the PET film 14 as the second work having a hydrophobic surface and the silicon substrate 17a into which the silane coupling agent is introduced are superposed. While heating.
(4) Next, the surface of the silicon substrate 17a in which the silane coupling agent bonded to the PET film 14 which is the second work having a hydrophobic surface is introduced is irradiated with ultraviolet rays, and the ultraviolet irradiation surface is formed. A silicon substrate surface suitable for bonding is used. It should be noted that ultraviolet rays are also applied to the joint surface of the cover glass 11 which is the first work having a hydrophilic surface.
(5) Superimpose both ultraviolet irradiation surfaces.
(6) From the top, PET film 14, which is a second work having a hydrophobic surface, a silicon substrate 17a into which a silane coupling agent has been introduced, and a first work having a hydrophilic surface. Heating is performed while pressurizing the contact surfaces of the workpieces stacked in the order of the cover glass 11.
In (3) and (6) of this bonding method, only pressurization or heating may be used, but it is preferable to heat while applying pressure.

[Step B-2] Joining process of PET film having a first transparent conductive film (ITO electrode) applied to the surface and glass having a second transparent conductive film (ITO electrode) applied to the surface 9 and FIG. This process shows a method of bonding a first work having a hydrophobic surface and a second work having a hydrophobic surface through a silicon substrate, and has a hydrophobic surface. The first work corresponds to the PET film 14 to which the cover glass 11 is bonded, and the second work having a hydrophobic surface corresponds to the second transparent conductive film (ITO electrode). Is a glass substrate 16 provided on the surface.

(A) Bonding of Silicon Substrate 17b Introduced with Silane Coupling Agent and Glass Substrate 16 As shown in FIG. 9A, an excimer lamp is formed on the surface of the silicon substrate 17b introduced with the silane coupling agent. The surface of the silicon substrate 17b is made a silicon substrate surface suitable for bonding by irradiating UV light emitted from an ultraviolet (UV) light source 40 such as the above.

Further, for example, in the glass substrate 16 on the surface of which the second ITO electrode 15 having a pattern as shown in FIG. 18 (c) is applied, the surface on which the second ITO electrode 15 pattern is applied. A transparent conductive film surface suitable for bonding the surface of the glass substrate 16 on which the second ITO electrode 15 pattern has been applied by irradiating UV light emitted from an ultraviolet (UV) light source 40 such as an excimer lamp And As described above, the transparent conductive film surface suitable for bonding means that, as described above, a part of the surface of the glass substrate 16 to which the transparent conductive film (second ITO electrode 15 pattern) is applied is OH-based. This refers to a surface that has been modified into a region terminated by.

Thereafter, the UV-irradiated surface of the silicon substrate 17b into which the silane coupling agent is introduced and the UV-irradiated surface of the glass substrate 16 are overlapped, and the glass substrate 16 and the silicon substrate 17b are appropriately pressurized. The silicon substrate 17b into which the silane coupling agent has been introduced is bonded to the glass substrate 16 having the second ITO electrode 15 applied to the surface by heating or the like.

As shown in FIG. 10B, an excimer lamp or the like is formed on the surface of the silicon substrate 17b introduced with the silane coupling agent bonded to the glass substrate 16 on the side opposite to the bonding surface with the glass substrate 16. UV light emitted from an ultraviolet (UV) light source 40 is irradiated to make the UV irradiation surface of the silicon substrate 17b suitable for bonding.

Next, in the PET film 14 in which the cover glass 11 is bonded to the surface on which the first ITO electrode 13 pattern is applied via the silicon substrate 17a, as shown in FIG. The surface of the hard coat layer 14a opposite to the surface on which the first ITO electrode 13 pattern is applied is irradiated with UV light emitted from an ultraviolet (UV) light source 40 such as an excimer lamp. The surface of the hard coat layer 14a irradiated with UV light as described above is the hard coat layer surface suitable for bonding. As described above, the hard coat layer surface suitable for bonding means a surface in which a part of the surface of the hard coat layer 14a is modified into a region terminated with an OH group. .

Thereafter, the UV-irradiated surface of the silicon substrate 17b into which the silane coupling agent has been introduced and the UV-irradiated surface of the PET film 14 are overlapped, and the PET film 14 and the silicon substrate 17b are appropriately pressurized. Or heating the glass substrate 16 to bond the silicon substrate 17b introduced with the silane coupling agent and the PET film 14 having the first ITO electrode 13 applied to the surface thereof.

That is, the bonding method in this step (B-2) is as follows.
(1) The surface of the silicon substrate 17b into which the silane coupling agent has been introduced and the second transparent conductive film (ITO electrode 15) of the glass substrate 16 as the second work having a hydrophobic surface are formed on the surface. By irradiating the applied surface with ultraviolet rays, the ultraviolet irradiation surface of the silicon substrate 17b is modified to a silicon substrate surface suitable for bonding, and the ultraviolet irradiation surface of the glass substrate 16 is suitable for bonding. The surface of the transparent conductive film.
(2) Both ultraviolet irradiation surfaces are overlapped.
(3) While pressurizing the contact surface of the workpiece on which the silicon substrate 17b into which the silane coupling agent has been introduced and the glass substrate 16 as the second workpiece having a hydrophobic surface are superimposed, Heat.
(4) The surface of the silicon substrate 17b introduced with the silane coupling agent bonded to the glass substrate 16 as the second work having a hydrophobic surface, and the first work having the hydrophobic surface. The surface of the hard coat layer 14a opposite to the surface of the PET substrate on which the first transparent conductive film 13 (ITO electrode) is applied is irradiated with ultraviolet rays, so that the silicon substrate 17b The surface irradiated with ultraviolet light is modified to a silicon substrate surface suitable for bonding, and the surface irradiated with ultraviolet light of the PET film 14 is made a hard coat layer surface suitable for bonding.
(5) Superimpose both ultraviolet irradiation surfaces.
(6) From the top, a PET film 14 (cover glass 11 bonded) as a first work having a hydrophobic surface, a silicon substrate 17b introduced with a silane coupling agent, and having a hydrophobic surface Heating is performed while pressurizing the contact surfaces of the workpieces stacked in the order of the glass substrate 16 as the second workpiece.
In (3) and (6) of this bonding method, only pressurization or heating may be used, but it is preferable to heat while applying pressure.

[Modification (2) of Embodiment 1]
[Step A-1] and [Step B-1] in Embodiment 1 and [Step A-2] and [Step B-2] in Modification (1) of Embodiment 1 are performed in two works. It is configured by repeating pasting. However, you may comprise so that three workpieces may be bonded together in each process.

For example, in [Step A-1] and [Step A-2], the cover glass 11, the silicon substrate 17 a into which the silane coupling agent is introduced, and the PET film 14 may be bonded at a time. (Hereinafter, such a step is referred to as [Step A-3].)
Similarly, in the above [Step B-1] and [Step B-2], the cover glass 11, the joined PET film 14, the silicon substrate 17b introduced with the silane coupling agent, and the glass substrate 16 are once combined. (Hereinafter, such a step will be referred to as [Step B-3].)

Hereinafter, an example of configuring the touch sensor module in the touch panel shown in FIG. 1 through [Step A-3] and [Step B-3] using the bonding method of the present invention will be described with reference to FIGS. explain.

[Step A-3] Joining Step of Cover Glass and PET Film with First Transparent Conductive Film (ITO Electrode) Surface This step is shown in FIG. This process shows a method for bonding a first work having a hydrophilic surface and a second work having a hydrophobic surface with a silicon substrate introduced with a silane coupling agent interposed therebetween. The cover glass 11 corresponds to the first work having a hydrophilic surface, and the first transparent conductive film (ITO electrode 13) corresponds to the second work having a hydrophobic surface. ) Is the PET film 14 applied to the surface of the hard coat layer 14a.

As shown in FIG. 11, UV light emitted from an ultraviolet (UV) light source 40 such as an excimer lamp is applied to both surfaces of a silicon substrate 17a into which a silane coupling agent has been introduced to introduce the silane coupling agent. Both surfaces of the silicon substrate 17a thus formed are silicon substrate surfaces suitable for bonding.
Further, for example, in the PET film 14 in which the first ITO electrode 13 having a pattern as shown in FIG. 18B is applied to the surface of the hard coat layer 14a, as shown in FIG. The pattern of the first ITO electrode 13 is applied by irradiating the surface of the ITO electrode 13 with the UV light emitted from an ultraviolet (UV) light source 40 such as an excimer lamp. The surface is a transparent conductive film suitable for bonding.
Further, as shown in FIG. 11, the UV light emitted from an ultraviolet (UV) light source 40 such as an excimer lamp is applied to the joint surface of the cover glass 11.

Thereafter, the UV-irradiated bonding surface of the cover glass 11, one surface of the silicon substrate 17 a into which the silane coupling agent has been introduced, and the UV irradiation treatment of the silicon substrate 17 a. The other surface that has been subjected to UV irradiation treatment of the PET film 14 is superposed. The cover glass 11, the silicon substrate 17 a, and the PET film 14 are laminated in this order, and the cover glass 11 and the silane coupling agent are introduced by appropriately pressing or heating the work. The silicon substrate 17a thus formed and the PET film 14 having the first ITO electrode 13 applied on the surface thereof are bonded at a time.

Since the cover glass 11 itself has a hydrophilic surface, it is not always necessary to irradiate UV light. However, by irradiating the joint surface of the cover glass 11 with UV light, the joint surface of the cover glass 11 is activated and impurities on the surface of the cover glass 11 are decomposed and removed, so that the cover glass is removed. 11 and the silicon substrate 17a into which the silane coupling agent is introduced are more reliably bonded.
Further, the UV irradiation to the joint surface of the cover glass 11, both surfaces of the silicon substrate 17a, and the primer coat surface of the PET film 14 may be performed simultaneously or individually.

That is, the bonding method in this step (A-3) is as follows.
(1) A cover surface of a cover glass 11 as a first work having a hydrophilic surface, both surfaces of a silicon substrate 17a introduced with a silane coupling agent, and a second surface having a hydrophobic surface. The first transparent conductive film (ITO electrode 13) of the PET film 14 which is a work is irradiated with ultraviolet rays, and the ultraviolet irradiation surface of the silicon substrate 17a is placed on the surface of the silicon substrate suitable for bonding. The surface of the PET film 14 is irradiated with ultraviolet rays so that the surface is a transparent conductive film suitable for bonding. The ultraviolet irradiation surface of the cover glass is activated or impurities are decomposed and removed.
(2) Thereafter, the UV-irradiated bonding surface of the cover glass 11, one surface of the silicon substrate 17 a on which the silane coupling agent has been introduced, and the silicon substrate 17 a The other surface subjected to the UV irradiation treatment and the surface subjected to the UV irradiation treatment of the PET film 14 are overlapped.
(3) Then, the contact surface of each workpiece laminated in the order of the cover glass 11, the silicon substrate 17a into which the silane coupling agent has been introduced, and the PET film 14 is heated while being pressed, Join the workpieces at once.
In (4) of this bonding method, only pressurization or heating may be used, but it is desirable to heat while applying pressure.

[Step B-3] Joining process between PET film having first transparent conductive film (ITO electrode) applied to surface and glass having second transparent conductive film (ITO electrode) applied to the surface 12 shows. This process shows a method of bonding a first work having a hydrophobic surface and a second work having a hydrophobic surface through a silicon substrate into which a silane coupling agent has been introduced. The first work having a hydrophobic surface corresponds to the PET film 14 to which the cover glass 11 is bonded, and the second work having the hydrophobic surface corresponds to the second work. It is the glass substrate 16 with which the transparent conductive film (ITO electrode 15) was given to the surface.

As shown in FIG. 12, UV light emitted from an ultraviolet (UV) light source 40 such as an excimer lamp is irradiated on both surfaces of a silicon substrate 17b into which a silane coupling agent has been introduced. The surface is a silicon substrate surface suitable for bonding.
In addition, as shown in FIG. 12, in the PET film 14 to which the cover glass 11 is bonded through the silicon substrate 17a into which the silane coupling agent is introduced, the surface of the cover glass 11 to which the cover glass 11 is bonded. The surface of the opposite hard coat layer 14a is irradiated with UV light emitted from an ultraviolet (UV) light source 40 such as an excimer lamp, and the hard coat layer 14a irradiated with the above-described UV light is irradiated. The surface is a hard coat layer surface suitable for bonding.

Further, for example, in the glass substrate 16 on the surface of which the second ITO electrode 15 having a pattern as shown in FIG. 18C is applied, the pattern of the second ITO electrode 15 is changed as shown in FIG. UV light emitted from an ultraviolet (UV) light source 40 such as an excimer lamp is applied to the applied surface, and the surface on which the second ITO electrode 15 pattern of the glass substrate 16 is applied is joined. A suitable transparent conductive film surface is used.

Thereafter, the UV-irradiated surface of the PET film 14, one surface of the silicon substrate 17 b into which the silane coupling agent was introduced, and the above-mentioned silicon substrate 17 b were UV-irradiated. The other surface is superposed on the surface of the glass substrate 16 that has been subjected to the UV irradiation treatment.
Then, the work laminated in the order of the PET film 14 to which the cover glass 11 has been bonded, the silicon substrate 17b, and the glass substrate 16 is appropriately pressed or heated to cover the cover glass. The PET film 14 to which 11 has been bonded, the silicon substrate 17b into which the silane coupling agent has been introduced, and the glass substrate 16 having the second ITO electrode 15 applied on the surface thereof are bonded together.
As shown in FIG. 12, in the PET film 14 to which the cover glass 11 is bonded through the silicon substrate 17a into which the silane coupling agent has been introduced, the surface of the cover glass 11 to which the cover glass 11 is bonded is shown. The surface of the hard electrode layer 14a on the opposite side, both surfaces of the silicon substrate 17b, and the surface of the glass substrate 16 on which the second ITO electrode 15 is applied, the pattern of the ITO electrode 15 being applied. UV irradiation may be performed simultaneously or individually.

That is, the bonding method in this step (B-3) is as follows.
(1) A hard coat layer on the opposite side of the surface of the PET film 14 to which the cover glass 11 is bonded, which is the first work having a hydrophobic surface and to which the cover glass 11 is bonded 14a, the second transparent conductive film (ITO electrode 15) of the glass substrate 16 which is a second work having a hydrophobic surface, and both surfaces of the silicon substrate 17b into which the silane coupling agent is introduced. The surface applied to the surface is irradiated with ultraviolet rays to modify the ultraviolet irradiation surface of the PET film 14 into a hard coat layer surface suitable for bonding, and the ultraviolet irradiation surface of the silicon substrate 17b. Is modified to a silicon substrate surface suitable for bonding, and the ultraviolet irradiation surface of the glass substrate 16 is made a transparent conductive film surface suitable for bonding.
(2) Thereafter, the UV-irradiated surface of the PET film 14, one surface of the silicon substrate 17b into which the silane coupling agent has been introduced, and the UV irradiation of the silicon substrate 17b. The other processed surface and the primer coat surface of the glass substrate 16 that has been subjected to the UV irradiation processing are overlapped.
(3) Then, contact surfaces of the workpieces laminated in the order of the PET film 14 to which the cover glass 11 has been bonded, the silicon substrate 17b into which the silane coupling agent has been introduced, and the glass substrate 16 are added. Each workpiece is joined at one time by heating while pressing.
In (3) of the present bonding method, only pressurization or heating may be used, but it is desirable to heat while applying pressure.

[Embodiment 2]
In the first embodiment, in the configuration example of the touch panel shown in FIG. 1, the substrate of the first transparent conductive film (for example, ITO electrode 13) is the PET film 14, and the second transparent conductive film (for example, the ITO electrode). The bonding method of the present invention employed when assembling a touch sensor module in which the substrate 15) is the glass substrate 16 has been shown.
In the second embodiment, the joining method of the present invention employed when assembling the touch sensor module in the configuration example of the touch panel shown in FIG. 13 will be described.

As a substrate for a transparent conductive film, a glass substrate is superior in visibility and durability as compared with a film substrate. In other words, the glass substrate has higher light transmittance than the film substrate, can reduce the influence of light confusion and substrate distortion, and has less discoloration due to ultraviolet rays, etc. It is superior to this. In addition, the glass substrate is excellent in durability and water resistance in a wide temperature range, and has higher weather resistance than the film substrate. In a touch panel for mechanical equipment or a touch panel for outdoor use that requires high visibility and weather resistance, there is an increasing demand for using a glass substrate as a substrate for a transparent conductive film. The use of a glass substrate for any of the substrates has been studied. In addition, thinning of the glass substrate is being realized, and as with the film substrate, it has become possible to cope with the degree of freedom of shape and the thinning of the panel.

FIG. 13 shows the case where both the substrate of the first transparent conductive film (for example, ITO electrode 13) and the substrate of the second transparent conductive film (for example, ITO electrode 15) are

glass substrates

16a and 16b. The structural example of the touch panel assembled using the joining method is shown. Here, FIG. 13A shows a case where the first transparent conductive film 13 and the second transparent conductive film 15 face each other across the silicon substrate 17b into which the silane coupling agent is introduced.
13A, the touch sensor module 10a includes a cover glass 11, a silicon substrate 17a introduced with a silane coupling agent, a first glass substrate 16a, a first ITO electrode 13, and a silane. The silicon substrate 17b into which the coupling agent is introduced, the second ITO electrode 15, and the second glass substrate 16b are laminated in this order. Other configurations are the same as those in FIG.

FIG. 13B shows a case where only the second transparent conductive film 15 of the first transparent conductive film 13 and the second transparent conductive film 15 is in contact with the silicon substrate 17b into which the silane coupling agent is introduced. It is.
In FIG. 13B, the touch sensor module 10a includes a cover glass 11, a silicon substrate 17a into which a silane coupling agent is introduced, a first ITO electrode 13, a first glass substrate 16a, The silicon substrate 17b into which the silane coupling agent is introduced, the second ITO electrode 15, and the second glass substrate 16b are laminated in this order. Other configurations are the same as those in FIG.
In the configuration example of the touch panel shown in FIG. 13, the thickness of each substrate and each layer is exaggerated for easy explanation, and the relative relationship between the actual thickness of each substrate and each layer is shown in FIG. 13. It is different from what is shown.
First, the joining method of the present invention used when manufacturing the touch panel having the configuration example shown in FIG. 13A will be described with reference to FIGS.

[Step C-1] Joining Step of Cover Glass and First Glass Substrate with First Transparent Conductive Film (ITO Electrode) Surface This step is shown in FIG. This step is a bonding step between the cover glass 11 and the first glass substrate 16a having the first transparent conductive film (ITO electrode) applied on the surface. This step is a previous step prior to [Step 3] to which the bonding method of the present invention is applied.

(A) Bonding of Cover Glass 11 to Silicon Substrate 17a Introduced with Silane Coupling Agent As shown in FIG. 14 (a), an excimer is formed on the surface of the silicon substrate 17a introduced with the silane coupling agent. UV light emitted from an ultraviolet (UV) light source 40 such as a lamp is irradiated to make the surface of the silicon substrate 17a suitable for bonding.
Next, UV light emitted from an ultraviolet (UV) light source 40 such as an excimer lamp is irradiated on the joint surface of the cover glass 11.

Thereafter, the bonding surface of the cover glass 11 and the UV irradiation surface of the silicon substrate 17a into which the silane coupling agent has been introduced are overlapped. As appropriate, the bonding strength is increased by pressurizing or heating the overlaid cover glass 11 and the silicon substrate 17a.
Since the cover glass 11 itself has a hydrophilic surface, it is not always necessary to irradiate UV light. However, by irradiating the joint surface of the cover glass 11 with UV light, the joint surface of the cover glass 11 is activated and impurities on the surface of the cover glass 11 are decomposed and removed, so that the cover glass is removed. 11 and the silicon substrate 17a into which the silane coupling agent is introduced are more reliably bonded. Further, UV irradiation on the surface of the silicon substrate 17a and the joint surface of the cover glass 11 may be performed simultaneously.

(B) Bonding of Silicon Substrate 17a Introduced with Silane Coupling Agent Bonded to Cover Glass 11 and First Glass Substrate 16 Next, as shown in FIG. It is emitted from an ultraviolet (UV) light source 40 such as an excimer lamp on the surface of the silicon substrate 17a into which the silane coupling agent bonded to the glass 11 is introduced, on the side opposite to the bonding surface with the cover glass 11. The UV irradiation surface of the silicon substrate 17a is used as a silicon substrate surface suitable for bonding.
On the other hand, for example, the first ITO electrode 13 having a pattern as shown in FIG. 18B is formed on the surface of the first glass substrate 16a on the surface opposite to the surface on which the first ITO electrode 13 is applied. On the other hand, UV light emitted from an ultraviolet (UV) light source 40 such as an excimer lamp is irradiated.

Thereafter, the UV irradiation surface of the first glass substrate 16a and the UV irradiation surface of the silicon substrate 17a into which the silane coupling agent bonded to the cover glass 11 is introduced are overlapped. The bonding strength is increased by appropriately pressing or heating the overlapped cover glass 11 and the silicon substrate 17a introduced with the silane coupling agent.

As described above, the surface on the opposite side to the surface on which the first ITO electrode 13 is applied in the first glass substrate 16a (the bonding surface of the first glass substrate 16a) itself is a hydrophilic surface. It is not always necessary to irradiate UV light. However, by irradiating the bonding surface of the first glass substrate 16a with UV light, the bonding surface of the first glass substrate 16a is activated or impurities on the bonding surface of the first glass substrate 16a are decomposed. Since it is removed, the first glass substrate 16a and the silicon substrate 17a introduced with the silane coupling agent are more reliably bonded.
Further, UV irradiation may be simultaneously performed on the surface of the silicon substrate 17a and the bonding surface of the first glass substrate 16a.

[Step D-1] A first glass substrate having a first transparent conductive film (ITO electrode) applied on its surface and a second glass substrate having a second transparent conductive film (ITO electrode) provided on its surface; FIG. 15 shows this process. This process shows a method of bonding a first work having a hydrophobic surface and a second work having a hydrophobic surface through a silicon substrate into which a silane coupling agent has been introduced. The first work having a hydrophobic surface corresponds to the first work in which the cover glass 11 is bonded to one surface and the first ITO electrode 13 is applied to the other surface. The glass substrate 16a, which corresponds to the second work having a hydrophobic surface, is a second glass substrate 16b having a surface provided with a second transparent conductive film (ITO electrode).

(A) Bonding of the first glass substrate 16a (already bonded to the cover glass 11) and the silicon substrate 17b introduced with the silane coupling agent As shown in FIG. 15 (a), the silane coupling agent is A silicon substrate surface suitable for bonding the surface of the silicon substrate 17b by irradiating the surface of the introduced silicon substrate 17b with UV light emitted from an ultraviolet (UV) light source 40 such as an excimer lamp. And

Next, as shown in FIG. 15 (a), the first glass substrate in which the cover glass 11 is bonded to one surface in the previous step and the first ITO electrode 13 is applied to the other surface. In 16a, the surface of the first ITO electrode 13 on which the pattern is applied is irradiated with UV light emitted from an ultraviolet (UV) light source 40 such as an excimer lamp to thereby irradiate the first glass substrate 16a. The surface on which the first ITO electrode 13 pattern is applied is a transparent conductive film surface suitable for bonding.

Thereafter, the UV irradiation surface of the silicon substrate 17b into which the silane coupling agent has been introduced and the surface of the first glass substrate 16a that have been subjected to the UV irradiation treatment are overlapped, and the first glass substrate 16a and the above silicon are appropriately selected. The substrate 17b is pressurized or heated to cover the silicon substrate 17b into which the silane coupling agent is introduced and the cover glass 11 is bonded to one surface, and the first ITO electrode 13 is bonded to the other surface. Is bonded to the first glass substrate 16a.

(B) Joining of the first glass substrate 16a (already joined to the cover glass 11) and the second glass substrate 16b Next, as shown in FIG. 15 (b), the first glass substrate 16a is joined. UV light emitted from an ultraviolet (UV) light source 40 such as an excimer lamp on the surface of the silicon substrate 17b into which the silane coupling agent has been introduced, opposite to the bonding surface with the first glass substrate 16a. The UV irradiation surface of the silicon substrate 17b is used as a silicon substrate surface suitable for bonding.

On the other hand, for example, in the second glass substrate 16b having the second ITO electrode 15 having a pattern as shown in FIG. 18C, the surface on which the second ITO electrode pattern is applied. Is irradiated with UV light emitted from an ultraviolet (UV) light source 40 such as an excimer lamp, and the surface of the second glass substrate 16b on which the second ITO electrode 15 pattern is applied is suitable for bonding. The surface of the transparent conductive film.

Thereafter, the UV irradiation surface of the silicon substrate 17b introduced with the silane coupling agent bonded to the first glass substrate 16a and the surface irradiated with the UV irradiation of the second glass substrate 16b are overlapped, and the first The second glass substrate 16b and the first glass substrate 16a and the silicon substrate 17b already bonded are pressurized or heated to introduce the silane coupling agent bonded to the first glass substrate 16a. Further, the silicon substrate 17b and the second glass substrate 16b on the surface of which the second ITO electrode 15 is applied are bonded.

That is, the bonding method in this step (D-1) is as follows.
(1) The surface of the silicon substrate 17b into which the silane coupling agent has been introduced and the first glass substrate 16a (which has been bonded to the cover glass 11), which is the first work having a hydrophobic surface. The surface of the silicon substrate 17b is irradiated with ultraviolet rays to modify the ultraviolet irradiation surface of the silicon substrate 17b to a silicon substrate surface suitable for bonding. The ultraviolet-irradiated surface of the glass substrate 16a is a transparent conductive film surface suitable for bonding.
(2) Both ultraviolet irradiation surfaces are overlapped.
(3) From above, the silicon substrate 17b into which the silane coupling agent has been introduced and the first glass substrate 16a (cover glass 11 bonded) as the first work having a hydrophobic surface are stacked in this order. Heat while pressing the contact surface of each workpiece.
(4) a surface of a silicon substrate 17b introduced with a silane coupling agent bonded to a first glass substrate 16a (cover glass 11 bonded) which is a first work having a hydrophobic surface; The surface of the second glass substrate 16b, which is the second work having a hydrophobic surface, on which the second transparent conductive film (ITO electrode 15) is applied is irradiated with ultraviolet rays, so that the silicon The ultraviolet irradiation surface of the glass substrate 17b is modified to a silicon substrate surface suitable for bonding, and the ultraviolet irradiation surface of the second glass substrate 16b is made a transparent conductive film surface suitable for bonding.
(5) Superimpose both ultraviolet irradiation surfaces.
(6) From the top, a first glass substrate 16a (cover glass 11 bonded) as a first work having a hydrophobic surface, a silicon substrate 17b into which a silane coupling agent is introduced, hydrophobic Heating is performed while pressurizing the contact surfaces of the workpieces that are stacked in the order of the second glass substrate 16b, which is the second workpiece having the surface.
In (3) and (6) of this bonding method, only pressurization or heating may be used, but it is preferable to heat while applying pressure.

Next, the joining method of the present invention applied when manufacturing the touch panel having the configuration example shown in FIG. 13B will be described with reference to FIGS.
[Step C-2] Joining Step of Cover Glass and First Glass Substrate with First Transparent Conductive Film (ITO Electrode) Provided on the Surface This step is shown in FIG. This process shows a method of bonding a first work having a hydrophilic surface and a second work having a hydrophobic surface through a silicon substrate into which a silane coupling agent has been introduced. The cover glass 11 corresponds to the first work having a hydrophilic surface, and the first transparent conductive film (ITO electrode) corresponds to the second work having a hydrophobic surface. Is the first glass substrate 16a provided on the surface.

(A) The lower surface of the cover glass 11 as the first work and the second work as the second work, which join the cover glass 11 and the silicon substrate 17a into which the silane coupling agent is introduced. Prior to bonding the surface of the first glass substrate 16a to the first ITO electrode 13 side, first, the cover glass 11 and the silicon substrate 17a introduced with the silane coupling agent are bonded.
As shown in FIG. 16A, the surface of the silicon substrate 17a into which the silane coupling agent has been introduced is irradiated with UV light emitted from an ultraviolet (UV) light source 40 such as an excimer lamp. The surface of the substrate 17a is a silicon substrate surface suitable for bonding.
Next, UV light emitted from an ultraviolet (UV) light source 40 such as an excimer lamp is irradiated on the joint surface of the cover glass 11.

Thereafter, the bonding surface of the cover glass 11 and the UV irradiation surface of the silicon substrate 17a introduced with the silane coupling agent are overlapped. The bonding strength is increased by appropriately pressing or heating the overlapped cover glass 11 and the silicon substrate 17a.

Since the cover glass 11 itself has a hydrophilic surface, it is not always necessary to irradiate UV light. However, by irradiating the joint surface of the cover glass 11 with UV light, the joint surface of the cover glass 11 is activated and impurities on the surface of the cover glass 11 are decomposed and removed, so that the cover glass is removed. 11 and the silicon substrate 17a into which the silane coupling agent is introduced are more reliably bonded.
Further, UV irradiation may be performed simultaneously on the surface of the silicon substrate into which the silane coupling agent has been introduced and the cover surface of the cover glass 11.

(B) Bonding of Silicon Substrate 17a Introduced with Silane Coupling Agent Bonded to Cover Glass 11 and First Glass Substrate 16a Next, as shown in FIG. In the first glass substrate 16a provided with the first ITO electrode 13 having the pattern as shown in FIG. 18B, the excimer is applied to the surface provided with the first ITO electrode 13 pattern. By irradiating UV light emitted from an ultraviolet (UV) light source 40 such as a lamp, the UV irradiation surface of the first glass substrate 16a is made a transparent conductive film surface suitable for bonding.

On the other hand, an ultraviolet (UV) light source such as an excimer lamp is formed on the surface of the silicon substrate 17a into which the silane coupling agent joined to the cover glass 11 is introduced, on the side opposite to the joint surface with the cover glass 11. The UV light emitted from 40 is irradiated so that the UV irradiation surface of the silicon substrate 17a is a silicon substrate surface suitable for bonding.

Thereafter, the UV-irradiated surface of the silicon substrate 17a introduced with the silane coupling agent and the UV-irradiated surface of the first glass substrate 16a are overlaid, and the overlaid cover glass 11 and the above are appropriately combined. The silicon substrate 17a to which the silane coupling agent having the cover glass 11 bonded is introduced by pressing or heating the silicon substrate 17a and the first ITO electrode 13 are applied to the surface. The first glass substrate 16a is bonded.

That is, the bonding method employed in this step (C-2) is as follows.
(1) The silicon substrate 17a introduced with a silane coupling agent is bonded to the lower surface of the cover glass 11, which is the first work having a hydrophilic surface. In the bonding method, the silicon substrate 17a is irradiated with ultraviolet rays so that the ultraviolet-irradiated surface is a silicon substrate surface suitable for bonding, and the surface is laminated on the cover glass 11 to form a first work piece. The cover glass 11 and the silicon substrate 17a introduced with the silane coupling agent are joined. As described above, the joint surface of the cover glass 11 may be irradiated with ultraviolet rays.
(2) The surface of the silicon substrate 17a introduced with the silane coupling agent joined to the cover glass 11, which is the first work having a hydrophilic surface, and the second work having a hydrophobic surface. The surface of the first glass substrate 16a, which is the first glass substrate 16a, is irradiated with ultraviolet rays on the surface of the first transparent conductive film (ITO electrode 13), and the ultraviolet irradiation surface of the silicon substrate 17a is suitable for bonding. The surface of the first glass substrate 16a is modified to a transparent conductive film surface suitable for bonding.
(3) Both ultraviolet irradiation surfaces are overlapped.
(4) From the top, the cover glass 11 as the first work having a hydrophilic surface, the silicon substrate 17a into which the silane coupling agent is introduced, and the first glass as the second work Heating is performed while pressing the contact surfaces of the workpieces stacked in the order of the substrate 16a.
In (4) of this bonding method, only pressurization or heating may be used, but it is desirable to heat while applying pressure.

[Step D-2] A first glass substrate having a first transparent conductive film (ITO electrode) applied on its surface and a second glass substrate having a second transparent conductive film (ITO electrode) provided on its surface; FIG. 17 shows this process. Also in this step, a method of bonding a first work having a hydrophilic surface and a second work having a hydrophobic surface through a silicon substrate into which a silane coupling agent has been introduced is shown. The first work piece having a hydrophilic surface corresponds to the first glass substrate 16a in which the cover glass 11 is bonded to one surface on which the first ITO electrode 13 is applied. Corresponding to the second work having a hydrophobic surface is the second glass substrate 16b having a second transparent conductive film (ITO electrode) applied on the surface.

(A) Bonding of the first glass substrate 16a (already bonded to the cover glass 11) and the silicon substrate 17b into which the silane coupling agent has been introduced The first work as a first work having a hydrophilic surface The second glass substrate 16b, which is a second work having a surface opposite to the surface of the first ITO electrode 13 bonded to the cover glass 11 and a hydrophobic surface, of the glass substrate 16a of the second glass substrate 16a. Prior to bonding the ITO electrode 15 side surface, first, the first glass substrate 16a (already bonded to the cover glass 11) and the silicon substrate 17b introduced with a silane coupling agent are bonded. .

As shown in FIG. 17 (a), the surface of the silicon substrate 17b into which the silane coupling agent has been introduced is irradiated with UV light emitted from an ultraviolet (UV) light source 40 such as an excimer lamp. The UV irradiation surface of the substrate 17b is a silicon substrate surface suitable for bonding.
Next, as shown in FIG. 17A, an excimer lamp or the like is applied to the surface opposite to the first ITO electrode 13 side that has been bonded to the cover glass 11 of the first glass substrate 16a in the previous step. UV light emitted from the ultraviolet (UV) light source 40 is irradiated.

Thereafter, the UV irradiation surface of the silicon substrate 17b into which the silane coupling agent is introduced and the UV irradiation surface of the first glass substrate 16a are overlapped, and the first glass substrate 16a and the silicon substrate 17b are appropriately combined. The silicon substrate 17b in which the silane coupling agent is introduced and the first glass substrate 16a having the cover glass 11 bonded to one surface are bonded by pressurizing or heating the contact surface. To do.

(B) Bonding of First Glass Substrate 16a (Coupled with Cover Glass 11) and Second Glass Substrate 16b Next, as shown in FIG. 17B, the first glass substrate 16a is bonded. UV light emitted from an ultraviolet (UV) light source 40 such as an excimer lamp on the surface of the silicon substrate 17b into which the silane coupling agent has been introduced, opposite to the bonding surface with the first glass substrate 16a. The UV irradiation surface of the silicon substrate 17b is used as a silicon substrate surface suitable for bonding.

On the other hand, for example, the second ITO electrode 15 pattern is applied to the second glass substrate 16b having the second ITO electrode 15 having a pattern as shown in FIG. By irradiating the surface with UV light emitted from an ultraviolet (UV) light source 40 such as an excimer lamp, the surface of the second glass substrate 16b provided with the second ITO electrode 15 pattern is joined. A suitable transparent conductive film surface is used.

Thereafter, the UV irradiation surface of the silicon substrate 17b introduced with the silane coupling agent bonded to the first glass substrate 16a and the surface irradiated with the UV irradiation of the second glass substrate 16b are overlapped, and the first The silane coupling agent bonded to the first glass substrate 16a is introduced by pressurizing or heating the second glass substrate 16b and the silicon substrate 17b bonded to the first glass substrate 16a. Further, the silicon substrate 17b and the second glass substrate 16b on the surface of which the second ITO electrode 15 is applied are bonded.

That is, the bonding method in this step (D-2) is as follows.
(1) A first work having a hydrophilic surface, which is covered through a silicon substrate 17a in which a silane coupling agent is introduced on one surface on which the first ITO electrode 13 is applied. And irradiating the other surface of the first glass substrate 16a to which the glass 11 is bonded and the surface of the silicon substrate 17b into which the silane coupling agent has been introduced with ultraviolet rays of both works. A first glass substrate 16a, which is a first work having a hydrophilic surface, and the silicon substrate 17b are laminated so that the irradiation surface is in close contact with each other, thereby forming a first work having a hydrophilic surface. The first glass substrate 16a and the silicon substrate 17b into which the silane coupling agent is introduced are bonded.
(2) a surface of a silicon substrate 17b into which a silane coupling agent bonded to a first glass substrate 16a (cover glass 11 bonded) as a first work having a hydrophilic surface is introduced; The surface of the second glass substrate 16b, which is the second work having a hydrophobic surface, on which the second transparent conductive film (ITO electrode 15) is applied is irradiated with ultraviolet rays, so that the silicon- The ultraviolet irradiation surface of the glass substrate 17b is modified to a silicon substrate surface suitable for bonding, and the ultraviolet irradiation surface of the second glass substrate 16b is used as a transparent conductive film surface suitable for bonding.
(3) Both ultraviolet irradiation surfaces are overlapped.
(4) From above, a first glass substrate 16a (cover glass 11 bonded), which is a first work having a hydrophilic surface, a silicon substrate 17b into which a silane coupling agent is introduced, hydrophobic Heating is performed while pressurizing the contact surfaces of the workpieces that are stacked in the order of the second glass substrate 16b, which is the second workpiece having the surface.
In (4) of this bonding method, only pressurization or heating may be used, but it is desirable to heat while applying pressure.

The touch sensor module in the touch panel shown in FIG. 13A is configured through [Step C-1] and [Step D-1] employing the bonding method of the present invention.
Further, the touch sensor module in the touch panel shown in FIG. 13B is configured through [Step C-2] and [Step D-2] employing the bonding method of the present invention.

The touch sensor module 10a and the touch panel control unit 10b are stacked on the image display device 30 such as an LCD panel to constitute a touch panel. Here, the structure example of the touch panel control unit 10b and the bonding of the touch panel laminated in the order of the touch sensor module 10a, the touch panel control unit 10b, and the image display device 30 are the same as those in the related art, and therefore detailed here. Description is omitted.

In the second embodiment, a silicon (substrate) into which a silane coupling agent is introduced is used in place of the conventional OCA tape or OCR when the components of the touch sensor module are bonded. In addition, ultraviolet rays are irradiated to the bonding surface between the silicon (substrate) into which the silane coupling agent is introduced and each component (for example, a substrate provided with a conductive thin film such as an ITO electrode). Therefore, the same effect as in the first embodiment can be achieved.
In particular, since the touch sensor module constructed in the second embodiment uses only a glass substrate as the substrate of the transparent conductive film, a touch panel incorporating this touch sensor module has high visibility and weather resistance. Will have.

[Experimental example]
As described above, the bonding method of the present invention is suitable for bonding to the bonding surface between the first workpiece and the second workpiece in which the conductive film is applied to the bonding surface by ultraviolet irradiation. A first work and a second work are laminated with a silicon substrate having a silane coupling agent having a surface interposed therebetween, and the first and second works are laminated. -Heating and pressurizing the workpiece and bonding the first workpiece and the second workpiece together. In particular, in the bonding method of the present invention, bonding of a silicon substrate and a conductive thin film surface of a conductive thin film substrate, which could not be bonded even by using a surface modification treatment by ultraviolet irradiation, is conventionally performed. In addition, for the bonding of the silicon substrate to the conductive thin film substrate when the surface is hydrophobic, the above silicon substrate is irradiated by irradiating ultraviolet rays onto the silicon substrate into which the silane coupling agent has been introduced. A surface of the silicon substrate suitable for bonding is made to be a surface state of a silicon substrate suitable for bonding, and the surface of the conductive thin film substrate is irradiated with ultraviolet light to make the surface of the conductive thin film substrate suitable for bonding. Thus, the above-mentioned bonding can be performed.

Hereinafter, experimental examples in the case of bonding a silicon substrate into which a silane coupling agent has been introduced and a conductive thin film substrate to which a conductive thin film has been applied will be described.
(I) Preparation of a silicon substrate into which a silane coupling agent was introduced First, a silicon substrate into which a silane coupling agent was introduced was prepared. As described above, the silicon substrate into which the silane coupling agent was introduced was formed by introducing the silane coupling agent into an uncured silicone resin and then curing it.

As the uncured silicone resin, the following two resins were used.
(A-1) One-part silicone resin X-32-3095 (manufactured by Shin-Etsu Chemical)
(A-2) Two-part silicone resin SIM260 (manufactured by Shin-Etsu Chemical)
Here, the one-pack type silicone resin cures only the main agent by a curing reaction such as thermal curing. On the other hand, a two-component silicone resin is composed of a main agent and a curing agent, and these two components are mixed and then cured by a curing reaction such as thermosetting.

The following three silane coupling agents were used: (B-1) Isocyanate silane coupling agent KBE-9007 (manufactured by Shin-Etsu Chemical)
(B-2) Epoxy silane coupling agent KBE-403 (manufactured by Shin-Etsu Chemical)
(B-3) Aminoisocyanate silane coupling agent KBM-903 (manufactured by Shin-Etsu Chemical)
The structural formula of each silane coupling agent is shown below.

(I-1) Silicon Substrate Formation Using One-Part Silicone Resin (X-32-3095) and Silane Coupling Agent Silicone Substrate Using One-Part Silicone Resin and Silane Coupling Agent Substrate formation was performed by the following procedure.
First, a silane coupling agent was introduced to an uncured X-32-3095 solution at a concentration of 2% by weight, and then stirred for about 10 minutes.
Next, this mixed solution was transferred to a glass dish and allowed to stand at room temperature for 1 hour. In this step, bubbles generated during stirring are removed.
Next, the mixed solution after defoaming was heated at 80 ° C. for 4 hours to perform primary curing.
Thereafter, secondary curing was performed by heating at 150 ° C. for 0.5 hour. As will be described later, a cured silicon substrate was not necessarily obtained depending on the silane coupling agent, but the shape of the obtained silicon substrate was 50 mm in diameter and 3 mm in thickness.

(I-2) Silicon Substrate Formation Using Two-Component Silicone Resin (SIM260) and Silane Coupling Agent Silicon Substrate Formation Using Two-Component Silicone Resin and Silane Coupling Agent The procedure was as follows.
First, a silane coupling agent was introduced into a SIM260 solution composed of a main agent and a curing agent so as to have a 2% weight concentration with respect to the total amount of the SIM260 solution, and then stirred for about 10 minutes.
Next, this mixed solution was transferred to a glass dish and allowed to stand at room temperature for 16 hours. The two-component silicone resin is primarily cured by mixing the main agent and the curing agent. That is, this step performs defoaming and primary curing of bubbles generated during stirring.
Thereafter, secondary curing was performed by heating at 150 ° C. for 0.5 hour. As will be described later, although a cured silicon substrate was not necessarily obtained depending on the silane coupling agent, the shape of the obtained silicon substrate was 50 mm in diameter and 1 mm in thickness.
Table 1 shows the results when the above silicon substrate forming procedure was carried out using each silicone resin and each silane coupling agent.

As is clear from Table 1, when the isocyanate-based silane coupling agent KBE-9007 is used, the one-part silicone resin X-32-3095, the two-part silicone, None of the silicone resin of resin SIM260 cured. The mixed solutions of the uncured silicone resin and the silane coupling agent KBE-9007 were all cloudy. That is, for X-32-3095 and SIM260, the silane coupling agent KBE-9007 is considered to be a substance that inhibits curing.

In addition, when the epoxy silane coupling agent KBE-403 is used, either of the one-component silicone resin X-32-3095 and the two-component silicone resin SIM260 can be obtained through the above procedure. The resin was also cured. That is, a silicon substrate having a silane coupling agent introduced therein was obtained. The silicon substrate obtained here was transparent and hardly absorbed light, and was found to be suitable as an intervening substance for joining the components of the touch panel.

In addition, when the amino-based silane coupling agent KBM-903 is used, any one of the one-part silicone resin X-32-3095 and the two-part silicone resin SIM260 can be obtained through the above procedure. The silicone resin was also cured, and a silicon substrate having a silane coupling agent introduced therein was obtained. However, for the primary curing and secondary curing of the silicone resin X-32-3095, the foam generated during the stirring of the mixed solution of the silicone resin and the silane coupling agent is removed by the defoaming step. As a result of performing the heating step, foaming occurred in the silicon substrate. In addition, as a result of performing a heating step for secondary curing of the silicone resin SIM260, foaming occurred in the silicone substrate.
That is, since the silicon substrate obtained here has bubbles inside, when it is used as an intervening substance for joining the components of the touch panel, the visibility of the image is remarkably deteriorated.
As described above, it has been found that an epoxy-based silane coupling agent to be introduced into the silicone resin is desirable.

(II) Bonding experiment between a silicon substrate having a silane coupling agent introduced and a PET film having a conductive thin film on the surface Next, a silicon having a silane coupling agent prepared as described above was introduced. A bonding experiment was performed using two types of substrates. Specifically, KBE-403 was used as the silane coupling agent, and two types of silicon substrates formed using X-32-3095 and SIM260 were used as the silicone resin.

(II-1) When X-32-3095 is used as the silicone resin, the bonding surface of the X-32-3095 series silicon substrate into which the silane coupling agent KBE-403 has been introduced and the conductivity of the PET film The surface on which the conductive thin film was applied was irradiated with ultraviolet rays.
The ultraviolet light source used was an excimer lamp that emits vacuum ultraviolet rays (VUV) having a center wavelength of 172 nm. Irradiation conditions were an irradiance of 5 mW / cm ² on the irradiated surface and an irradiation time of 180 seconds.

After the VUV irradiation, the silicon substrate and the PET film are superposed so that the VUV irradiation surfaces of the X-32-3095 series silicon substrate and the PET film into which the silane coupling agent KBE-403 is introduced are in contact with each other. While applying a pressure of 0.25 Mpa to both, it heated so that both temperature might be set to 100 degreeC. The heating time was 30 seconds. Through the procedure described above, the X-32-3095 silicon substrate and the PET film into which the silane coupling agent KBE-403 was introduced were bonded.

(II-2) When SIM-260 is used as the silicone resin The bonding surface of the SIM-260 based silicon substrate into which the silane coupling agent KBE-403 has been introduced and the conductive thin film of the PET film are applied. The coated surface was irradiated with ultraviolet rays.
The ultraviolet light source used was an excimer lamp that emits vacuum ultraviolet rays (VUV) having a center wavelength of 172 nm. Irradiation conditions were an irradiance of 5 mW / cm ² on the irradiated surface and an irradiation time of 180 seconds.

After the VUV irradiation, the silicon substrate and the PET film are superimposed so that the VUV irradiation surfaces of the SIM-260 type silicon substrate and the PET film into which the silane coupling agent KBE-403 is introduced are in contact with each other. While applying a pressure of 0.25 Mpa, the both were heated to 100 ° C. The heating time was 30 seconds. By the above procedure, the SIM-260 based silicon substrate into which the silane coupling agent KBE-403 was introduced and the PET film were joined.

In other words, this experiment enables the pasting of a silicon substrate and a conductive thin film surface of a conductive thin film substrate, which could not be bonded even by using a surface modification treatment by ultraviolet irradiation. It has been found. Similarly, it is considered possible to bond the silicon substrate and the conductive thin film substrate when the surface is hydrophobic.

In the above experimental example, it was shown that a silicone member suitable for the bonding of the present invention can be obtained by introducing an epoxy silane coupling agent into a silicone member. As the silane coupling agent to be introduced into the member made of silicon, in addition to the epoxy type, the following silane coupling agents (B-4) and (B-5) may be used, or when the epoxy type silane coupling agent is used: Similarly, it has been confirmed that a member made of silicon suitable for the joining of the present invention can be obtained.
(B-4) Methacrylic silane coupling agent KBM-503 (manufactured by Shin-Etsu Chemical)
(B-5) Acrylic silane coupling agent KBM-503 (manufactured by Shin-Etsu Chemical)
The structural formula of the silane coupling agent is shown below.

The bonding method of the present invention can also be applied to a case where a touch sensor module having a configuration other than the touch sensor module having the configuration shown in FIGS. 1 and 13 is configured.
For example, in FIG. 13A, the first and

second glass substrates

16a and 16b to which the transparent conductive film is applied are applied to the first and second resin substrates made of the PET film 14 or the like. . In this case, [Step C-1] shown in FIG. 14 is replaced with [Step A-1] shown in FIG. The subsequent [Step D-1] can be applied as it is.

DESCRIPTION OF SYMBOLS 10 Position input device 10a Touch sensor module 10b Touch panel control part 11 Cover glass 12 Black matrix 13 1st ITO electrode (1st transparent conductive film)
14 PET film 14a Hard coat layer 15 Second ITO electrode (second transparent conductive film)
16, 16a, 16b Glass substrate 17 Silicon (PDMS)

substrate

17a, 17b Silicon (PDMS) substrate into which a silane coupling agent has been introduced 21 Wiring layer 22 Touch panel (TP) control IC section 23 FPC (flexible) Printed board)
30 Image display device 31 Polarizing film 32 Image display panel 40 Ultraviolet (UV) light source 100 Touch panel

Claims

A method of bonding a workpiece having a hydrophobic surface and a member made of silicone,
A silane coupling agent is introduced into the above-mentioned silicon member,
Irradiating the member made of the workpiece and the silicone with ultraviolet rays,
Lamination is performed so that the surface of the workpiece irradiated with ultraviolet light and the surface of the silicon member irradiated with ultraviolet light are in contact with each other.
Pressurization is performed so that the contact surface of the member made of the laminated work and silicon is pressurized, or the member made of the laminated work and silicon is heated, or the laminated work is made. A work bonding method characterized by heating a member made of silicon and silicon so that the contact surface is pressurized.
A method in which a first work having a hydrophilic surface and a second work having a hydrophobic surface are bonded together with a silicon member interposed therebetween,
A silane coupling agent is introduced into the above-mentioned silicon member,
Irradiating one surface of the first work, one surface of the second work, and both surfaces of the silicon member,
The first workpiece, the silicon member, and the second workpiece are laminated so that the surfaces irradiated with the ultraviolet rays are in contact with each other.
The first and second workpieces and silicon laminated are heated or laminated so that the contact surface is pressurized, or the laminated first and second workpieces and silicon members are heated. A work laminating method, wherein a member made of metal is heated while being pressed so that its contact surface is pressed.
A method in which a first workpiece having a hydrophobic surface and a second workpiece having a hydrophobic surface are bonded together with a silicon member interposed therebetween,
A silane coupling agent is introduced into the above-mentioned silicon member,
Irradiating one surface of the first work, one surface of the second work, and both surfaces of the above-mentioned silicon member,
The first workpiece, the silicon member, and the second workpiece are laminated so that the surfaces irradiated with the ultraviolet rays are in contact with each other.
Pressurizing so as to pressurize the contact surface, or heating the stacked workpiece, or heating the stacked workpiece while pressing so that the contact surface is pressed Work pasting method.
The said silane coupling agent is an epoxy-based, acrylic-based, or methacryl-based silane coupling agent, according to any one of claims 1, 2, and 3. How to paste together.
A touch panel comprising a touch sensor module having a substrate provided with a transparent conductive film, and an image display device,
The touch sensor module
A substrate on which a transparent conductive film modified by ultraviolet irradiation is applied; and a member made of silicon into which a silane coupling agent whose surface has been modified by ultraviolet irradiation is introduced. A touch panel, characterized in that the surfaces of the members made of ン are irradiated with the respective surfaces irradiated with the ultraviolet rays facing each other.
The touch panel according to claim 5, wherein the silane coupling agent is an epoxy-based, acrylic-based, or methacryl-based silane coupling agent.