WO2008007787A1

WO2008007787A1 - Method of bonding resins by light irradiation and process for producing resin article

Info

Publication number: WO2008007787A1
Application number: PCT/JP2007/064023
Authority: WO
Inventors: Hiroyuki Sugimura; Kyung-Hwang Lee; Yoshinao Taniguchi; Yoshihiro Taguchi
Original assignee: Kyoto University; Alps Electric Co., Ltd.
Priority date: 2006-07-13
Filing date: 2007-07-13
Publication date: 2008-01-17
Also published as: CN101495582A; JP4919474B2; JP2008019348A; CN101495582B

Abstract

A bonding method by which a resin can be bonded to another resin at a lower temperature than in thermal fusion bonding with satisfactory productivity. The method of resin bonding, which is for bonding a first resin to a second resin, comprises a step (I) in which those surfaces of the first and second resins which are bonding surfaces are irradiated with ultraviolet and a step (II) in which the resins are heated while keeping the irradiated surfaces in contact with each other to thereby bond the first resin to the second resin, with those surfaces used as bonding surfaces. This bonding method can be applied, for example, to a process for producing a resin article comprising two or more parts which each has a resinous area and which have been bonded to each other at the resinous areas, and to a process for producing a microchip comprising a pair of resin substrates bonded to each other face-to-face, at least one of the resin substrates having a fine channel formed therein.

Description

Specification

Method for bonding resin by light irradiation and method for producing resin article

Technical field

TECHNICAL FIELD [0001] The present invention relates to a method for adhering a resin by irradiation with light (ultraviolet light), and a method for producing a resin article such as a microchip using the method.

Background art

[0002] As a method for adhering a resin, adhesion by heat fusion or adhesion by application of an organic solvent or an adhesive is generally used. Bonding by thermal fusion is usually performed at a temperature above the glass transition point of the resin.

On the other hand, a microchip that typically has a structure in which a pair of substrates are bonded to face each other and has a fine flow path formed on the surface of at least one of the substrates has attracted attention. The microphone mouth chip is also called a microfluidic device.

[0004] In a microchip, a chip suitable for various applications can be configured by providing regions having various functions such as a reaction region in which a reagent is arranged in a flow path also called a microchannel. Typical applications for microchips include gene analysis, clinical diagnosis, drug screening, chemistry, biochemistry, pharmacy, medicine, veterinary analysis, compound synthesis, and environmental measurements. . When microchips are used for these applications, for example, (1) the amount of samples and reagents required for prayer can be reduced compared to the case of using a conventional analyzer suitable for similar applications. (2) The analysis time can be shortened. (3) Since the chip can be disposable, it is possible to obtain effects such as improvement of safety and measurement accuracy in the medical field.

Conventionally, a glass substrate has been mainly used for a microchip because it can be easily manufactured and optically detected. However, microchips such as glass substrates are damaged by impacts from the outside and immediately become a problem in terms of weight during transportation and disposal. Therefore, development of a microchip using a resin substrate, which is lightweight but difficult to break and cheaper than a glass substrate, is underway.

[0006] In a microchip using a resin substrate, an adhesion method between the resin substrates is important. [0007] For adhesion between the resin substrates, a general resin adhesion method, for example, heat fusion, can be applied. However, since bonding by heat fusion is usually performed at a temperature higher than the glass transition point of the resin, the substrate may be deformed during bonding, and the function as a microchip may be lost. In addition, since the influence of the deformation of the substrate becomes more conspicuous when the width of the flow path is narrowed or when the flow path pattern is complicated, it is difficult to increase the functionality of the microchip by bonding by heat fusion. is there.

[0008] Deformation of the resin substrate can be suppressed by adhesion at a lower temperature. As such an adhesion method, JP 2005-80569 A (Document 1) discloses that a substrate having a fine channel on the surface is coated with an organic solvent on a portion without a channel, and then the substrate and a flat surface are bonded. A method for joining microchips is disclosed, in which a substrate having a plurality of layers is fused by overlapping.

[0009] Japanese Unexamined Patent Application Publication No. 2005-257283 (Document 2) describes a production of a microchip in which a polydimethylsiloxane (PDMS) substrate is bonded to a resin substrate (facing substrate) made of a material other than PDMS. A method is disclosed. In this manufacturing method, after preparing a PDMS substrate having a fine channel formed on the surface and a facing substrate having an oxide silicon film formed on the surface, the bonding surface of both substrates is modified. Then, the substrates are bonded to each other through the silicon oxide film. Examples of the modification treatment of the bonding surface include oxygen plasma treatment, more specifically, oxygen plasma treatment in which excimer ultraviolet light is irradiated in an oxygen atmosphere (for example, literature)

2 paragraph number [0017]).

[0010] Further, although not directly related to the manufacturing method of the microchip, Japanese Unexamined Patent Application Publication No. 2005-171164 (Reference 3) and Japanese Unexamined Patent Application Publication No. 2004-43662 (Reference 4) disclose the surface of olefin-based resin. The surface is activated by irradiating light (in Reference 3, the surface-modifying resin having photopolymerizability is used in combination), and the hot-melt adhesive or UV-curing type is applied to the activated surface. A method is disclosed in which a resin composition such as resin is applied and the resin is bonded via the composition.

[0011] In the method of Document 1, when an organic solvent enters the flow path, erosion and denaturation of the resin constituting the substrate occur, which may cause the flow path to be blocked and the characteristics of the microchip to deteriorate. Therefore, the organic solvent is applied so as to avoid the flow path. However, this organic solvent application process not only reduces the productivity of microchips, but also improves functionality. For the purpose of manufacturing a microchip with a narrowed flow path width or a complicated flow path pattern, it is difficult to respond depending on the degree of narrowing and complexity.

[0012] The method of Document 2 does not use an organic solvent and an adhesive, and therefore, unlike the method of Document 1, blockage of the flow path and deterioration of the characteristics of the microchip are less likely to occur. However, the method of Document 2 is a method used for bonding to a PDMS substrate that is a silicone resin containing a Si—O bond and having a strong affinity with an oxide silicon film. Bonding between substrates is not possible.

[0013] In the methods of References 3 and 4, it is necessary to apply the resin composition to the surface of the substrate, and blockage of the flow path occurs. Therefore, it is difficult to directly apply the method to the microchip manufacturing method. . Similar to Reference 1, the force that can be applied to the resin composition so as to avoid the flow path As described above, such an application process is a factor that reduces the productivity of the microchip, If the channel width is narrowed, it is difficult to cope with the complexity of the channel pattern. Disclosure of the invention

[0014] As described above, at the time of manufacturing the microchip, adhesion by thermal fusion without applying the organic solvent and the resin composition that causes the productivity of the chip to be reduced and also causes the blockage of the flow path and the like. A resin bonding method that can bond the resin substrates to each other at a low temperature is desired. In addition, such an adhesion method is expected to be applied to a variety of methods for manufacturing a resinous product, not just a microchip.

[0015] Therefore, the present invention is not limited to the bonding between the resin substrates at the time of manufacturing the microchip (that is, not limited to the manufacturing method of the microchip), and the temperature is lower than the bonding by thermal fusion! An object of the present invention is to provide an adhesion method capable of adhering resin and resin with high productivity.

[0016] The resin bonding method (first bonding method) of the present invention is a resin bonding method for bonding the first resin and the second resin, and is (I) an adhesive surface. Irradiating the surfaces of the first and second resin with ultraviolet light; and (II) raising the temperature in a state where the surfaces after the irradiation are in contact with each other, thereby using the surfaces as adhesive surfaces. Adhering the first resin and the second resin.

[0017] The resin bonding method of the present invention (second bonding method) viewed from a viewpoint different from the first bonding method is a resin that bonds the first resin and the second resin. (I) Adhesive surface A step of irradiating the surfaces of the first and second resin with ultraviolet light; (ii) a step of surface-treating the surface after the irradiation with a silane coupling agent; and (iii) a step after the treatment. A step of bonding the first and second resins with the surface as an adhesive surface by raising the temperature in a state where the surfaces are in contact with each other.

[0018] The bonding method of the present invention can be applied to a method for manufacturing a resin article having a portion where a resin and a resin are bonded. That is, the method for producing a resin article according to the present invention is a method for producing a resin article comprising two or more parts having a resin part, wherein the two or more articles are bonded to each other in the resin part. In this method, the resin parts are bonded together by the bonding method of the present invention.

[0019] The method for producing a resin article of the present invention can be applied to a method for producing various resin articles, for example, microchips. That is, the microchip manufacturing method of the present invention is a microchip manufacturing method including a pair of resin substrates bonded to each other so as to face each other, and having a flow path formed in at least one of the resin substrates. Then, the resin substrates are bonded to each other by the bonding method of the present invention.

[0020] According to the bonding method of the present invention, the resin and the resin can be bonded with high productivity at a temperature lower than the bonding by thermal fusion.

[0021] In the second bonding method, the surface treatment of the surfaces of the first and second resin with the silane coupling agent. In this surface treatment, the surfaces of the first and second resins. A silane coupling agent layer (typically a monomolecular layer) having a thickness of about several nm is formed. On the other hand, when the adhesive or the resin composition shown in References 3 and 4 is applied to the surface of the resin, a resin layer having a thickness of at least several meters is formed on the surface of the resin. Will be. On the other hand, in a resin substrate used for a microchip, a channel having a width of several / zm is usually formed on the surface thereof. For this reason, when the resin to be bonded is a resin substrate used for the microchip, the flow path is blocked unless an adhesive or a resin composition is applied so as to avoid the flow path. On the other hand, in the surface treatment in the second bonding method, the thickness of the silane coupling agent layer formed by the treatment is very small with respect to the size of the flow path. Even if it is not performed, blockage of the channel is unlikely to occur. For this reason, even with the second bonding method, the above-mentioned resin substrates are bonded to each other at a lower temperature than the bonding by thermal fusion. Adhesive with good productivity.

[0022] When such an adhesion method is applied to a method for producing a resin article, that is, the method for producing a resin article of the present invention, various effects can be obtained depending on the type of the article.

[0023] When the bonding method of the present invention is applied to a microchip manufacturing method, that is, in the microchip manufacturing method of the present invention, a pair of resin substrates each having a flow path formed at least on one side are heat-sealed. Since the bonding can be performed at a temperature lower than the bonding by, the deformation of the resin substrate during bonding can be suppressed. In addition, since it is not necessary to apply an organic solvent and a resin composition to the adhesive surface of the substrate, it is possible to make the manufacturing method excellent in productivity, and it is possible to suppress blockage of the flow path and deterioration of the characteristics of the microchip during the manufacturing In addition, if the channel width is narrowed, it becomes easier to cope with the complexity of the channel pattern.

Brief Description of Drawings

FIG. 1A is a process chart schematically showing an example of the bonding method of the present invention.

FIG. 1B is a process diagram schematically showing an example of the bonding method of the present invention.

FIG. 2 is a schematic diagram showing an example of the bonding method of the present invention.

FIG. 3A is a process diagram schematically showing an example of the bonding method of the present invention.

FIG. 3B is a process chart schematically showing an example of the bonding method of the present invention.

FIG. 3C is a process diagram schematically showing an example of the bonding method of the present invention.

FIG. 4 is a schematic view showing an example of a method for producing a microchip according to the present invention. BEST MODE FOR CARRYING OUT THE INVENTION

[0025] The first bonding method of the present invention will be described.

[0026] In the first bonding method, as shown in FIG. 1A, the surfaces 3a and 3b of the first and second resins 1 and 2 to be bonded surfaces are irradiated with ultraviolet light 4 (step (1 )). Next, as shown in FIG. 1B, the surfaces 3a and 3b after ultraviolet light irradiation are heated in a state where they are in contact with each other, so that the surfaces 3a and 3b are used as adhesive surfaces, and the first resin 1 and the first resin 1 Bond 2 of 2 with grease (process (Π)).

[0027] The reason why the first and second resins are bonded by the steps (1) and (II) is not clear. The following principle can be considered: First and second When ultraviolet light is irradiated on the surface of each of the resin, the surface energy (irradiated surface) of the surface irradiated with ultraviolet light in each resin increases (activated) before irradiation with ultraviolet light. Hydroxyl, carbonyl, cal A functional group such as a boxyl group is generated. Here, when the temperature of the irradiated surfaces of the first and second resins is brought into contact with each other, some bond via the functional group is formed between the irradiated surfaces of the first and second resins. It is considered that the first and second resins are bonded with the irradiated surface as the bonding surface.

[0028] Irradiation with ultraviolet light in the step (I) may be performed based on a general method. In FIG. 1A, the force that simultaneously irradiates the first resin 1 with the ultraviolet light 4 and the second resin 2 with the ultraviolet light 4 is applied to each resin separately. May be.

[0029] The wavelength of the ultraviolet light to be irradiated is not particularly limited. For example, if it is 300 nm or less, 200 nm or less is preferable in order to more reliably adhere the resin. Note that ultraviolet rays having a wavelength of 200 nm or less are generally called vacuum ultraviolet rays.

[0030] The light source of the ultraviolet light can be selected without any particular limitation. For example, a mercury lamp, a xenon lamp

Use an excimer laser or excimer lamp.

[0031] The atmosphere to be irradiated with ultraviolet light is preferably an oxygen-containing atmosphere such as air.

When the surfaces of the first and second resin are irradiated with ultraviolet light, the irradiated surface of each resin may be oxidized to generate a functional group containing an oxygen atom.

[0032] During irradiation with ultraviolet light, the shape of the irradiated surface may be controlled by a technique such as masking.

[0033] The temperature increase in step (II) may be performed by increasing the temperature of the entire first and second resins, or only in the vicinity of the irradiated surface in the first and second resins. May be.

[0034] The means for raising the temperature is not particularly limited, and a heater, a heating furnace or the like may be selected as appropriate!

[0035] The temperature of the temperature rise may be, for example, less than the glass transition point of the first and second resins, as long as the first resin and the second resin are not thermally fused. . The specific temperature of the temperature rise may be appropriately set according to the types of the first and second resins. For example, the first and second resins may be cycloolefin polymers (Japan) described later in the examples. ZEONEX33 OR manufactured by ZEON: glass transition point 123 ° C), 80 ° C to 120 ° C may be used! /.

[0036] In the first bonding method, in the step (II), as shown in FIG.

The irradiation surface may be heated while applying a force 5 in a direction in which the (surface 3a) and the irradiation surface (surface 3b) of the second resin 2 are in close contact with each other. It is usually difficult to make the surface of greaves completely flat For example, since the surface of the resin substrate generally has a warp or the like, the first resin and the second resin are heated by increasing the temperature while applying a force in the above direction. Can be bonded more reliably.

[0037] The magnitude of the force applied in the above direction should be appropriately set according to the shapes of the first and second resins, particularly the shape of the adhesive surface of each of the resins.

[0038] In the first bonding method, at least one resin selected from the first and second resins may be optically transparent. In the first bonding method, the first and second resins can be bonded without using an organic solvent and a resin composition, so that the at least one resin is optically transparent. Even in this case, it is possible to suppress a decrease in optical transparency of the resin due to adhesion. Note that the optically transparent resin is generally an amorphous resin.

[0039] In the first bonding method, the first and second resins are resins having a bond between at least one element of which carbon, oxygen and nitrogen forces are also selected and carbon in the main chain. Also good. As described above, in the method of Document 2, one substrate is a polydimethylsiloxane (PDMS) substrate that has a main chain that also has Si—O bonding strength and has a strong and affinity for an acidic silicon film. There is a need. On the other hand, according to the first bonding method, at least one element selected from carbon, oxygen, and nitrogen force can be bonded to the resin having a bond between carbon and the main chain. Adhesion between rosins that have a binding force is also possible.

[0040] In the first bonding method, the first and second resins may be other than silicone resins. As described above, in the method of Document 2, one substrate needs to be a PDMS substrate that is a kind of silicone resin. On the other hand, according to the first bonding method, it is possible to bond the non-silicone resins together.

[0041] In the first bonding method, at least one resin selected from the first and second resins may be at least one selected from a cycloolefin polymer and a polycarbonate. In particular, cycloolefin polymers were difficult to adhere to each other due to their molecular structure, such as an adhesive having low adhesion to cycloolefin polymers or other resins. According to the first bonding method, such a cycloolefin polymer can be bonded.

[0042] The specific structure of the cycloolefin polymer is not particularly limited. For example, it is a polymer of a bicyclic cycloolefin (bicyclic cycloolefin polymer) such as norbornenes. May be. Bicyclic cycloolefin polymers are generally amorphous polymers and have excellent properties such as optical transparency, low birefringence, high heat resistance, and low hygroscopicity. It is widely used for applications.

[0043] In the first bonding method, the first and second resins may be the same. That is, according to the first bonding method, the cycloolefin polymers can be bonded to each other.

[0044] The second bonding method of the present invention will be described.

[0045] In the second bonding method, as shown in Fig. 3A, the surfaces 3a and 3b of the first and second resins 1 and 2 to be bonded surfaces are irradiated with ultraviolet light 4 (step (i )). Next, as shown in FIG. 3B, the surfaces 3a and 3b after the ultraviolet light irradiation are each surface-treated with a silane coupling agent (step (ii)). Next, as shown in FIG. 3C, the surfaces 3a and 3b after the surface treatment are heated in a state where they are in contact with each other, so that the surfaces 3a and 3b are used as adhesive surfaces, and the first and second resins 1 and 2 Adhesive with rosin 2 (step (iii)). Reference numeral 6 in FIG. 3B denotes the silane coupling agent layer 6 formed on the surfaces 3a and 3b by the surface treatment.

[0046] In the second bonding method, the irradiated surfaces of the first and second resins after the ultraviolet irradiation are surface-treated with a silane coupling agent. A silane coupling agent is usually used to more firmly adhere organic substances such as a coating film to the surface of an inorganic substance containing a key such as glass. The present inventors have found that a silane coupling agent can be used in combination with ultraviolet irradiation even in the case of bonding a resin and a resin.

[0047] Irradiation with ultraviolet rays in step (i) may be performed in the same manner as in step (I) of the first bonding method.

[0048] The surface treatment in the step (ii) is performed by applying a silane coupling agent, which may be performed by applying a solution containing a silane coupling agent to the irradiation surfaces of the first and second resins after the ultraviolet irradiation. The application method of the solution that contains it should be based on general methods. If necessary, use a method such as masking to provide a portion on the irradiated surface where the silane coupling agent is applied and a portion where it is not applied!

[0049] It is sufficient that the first silane coupling agent applied to the first resin and the second silane coupling agent applied to the second resin have a structure capable of being bonded to each other. For example, the silane coupling agent may have functional groups that can be bonded to each other at the terminal. [0050] Specifically, in step (ii), the first resin surface is treated with a silane coupling agent (aminosilane) having an amino group at the terminal, and the second resin surface is irradiated. May be surface-treated with a silane coupling agent having a functional group capable of bonding to an amino group at the terminal. Examples of the bondable functional group include at least one selected from an epoxy group, a carboxyl group, and an aldehyde group.

[0051] Step (m) may be performed in the same manner as step (II) of the first bonding method.

[0052] The types of the first and second resins in the second bonding method may be the same as those in the first bonding method. For example, at least one resin selected from the first and second resins May be optically transparent. In the second bonding method, the first and second resins can be bonded without using an organic solvent and a resin composition, and formed on the irradiated surfaces of the first and second resins. Since the silane coupling agent layer to be formed is very thin, it is possible to suppress a decrease in optical transparency of the resin due to adhesion.

[0053] Also, for example, the first and second resins in the second bonding method are resins having a bond between at least one element selected from carbon, oxygen and nitrogen and carbon in the main chain. Alternatively, the first and second resin in the second bonding method may be a resin other than silicone resin. In the second bonding method, the same grease can be bonded as in the first bonding method.

[0054] In the method for producing a resin article according to the present invention, the resin parts of two or more parts included in the article are bonded to each other by the first bonding method or the second bonding method according to the present invention. Just do it.

[0055] Specifically, by irradiating the surfaces of the first and second resin portions serving as adhesive surfaces with ultraviolet light and raising the temperature in a state where the irradiated surfaces are in contact with each other, The first resin part and the second resin part are bonded using the surface as an adhesive surface (first bonding method). Alternatively, the surfaces of the first and second resin portions to be bonded surfaces are irradiated with ultraviolet light, the irradiated surfaces are surface-treated with a silane coupling agent, and the treated surfaces are mutually bonded. By raising the temperature in a state of being in contact with the surface, the first and second resin portions are bonded using the surface as an adhesive surface (second bonding method).

[0056] There are no particular limitations on the type of the part having the resin part included in the resin article. In addition, The type of rosin constituting the fat portion may be the same as that of the first and second rosins described above. Specifically, it may be at least one selected from a cycloolefin polymer and polycarbonate. Good.

[0057] When the resin article is a microchip in the method for manufacturing a resin article of the present invention, that is, in the method for manufacturing a microchip of the present invention, at least one of the fine channels shown in FIG. The pair of resin substrates (the first resin substrate 11 and the second resin substrate 12) formed with the above are bonded by the first bonding method or the second bonding method of the present invention. Good. In the example shown in FIG. 4, the flow path 13 is formed in the first resin substrate 11, the surface 14 of the first resin substrate 11 where the flow path 13 is formed, and the second resin substrate 11. A microchip 16 having a flow path 13 is formed by bonding the surface 15 of the fat substrate 12.

[0058] Specifically, the surfaces of the first and second resin substrates that are to be bonded surfaces are irradiated with ultraviolet light, and the first and second resin substrates are opposed to each other while the first and second resin substrates are opposed to each other. By heating the surfaces in contact with each other, the first resin substrate and the second resin substrate are bonded using the surface as an adhesive surface (first bonding method). Alternatively, the surfaces of the first and second resin substrates to be bonded surfaces are irradiated with ultraviolet light, and the surface after the irradiation is surface-treated with a silane coupling agent, and the first and second resin substrates are subjected to surface treatment. The first resin substrate and the second resin substrate are bonded to each other using the surface as a bonding surface by raising the temperature in a state where the surfaces after the treatment are in contact with each other. (Second bonding method

) o

[0059] The shape, size, and the like of the resin substrate are not particularly limited as long as the flow path is formed on at least one of the substrates. As shown in FIG. 4, the flow path may be formed on the adhesive surface (irradiation surface) of the resin substrate.

In the microchip manufacturing method of the present invention, when a channel is formed on the irradiation surface of the resin substrate, the channel may be irradiated with ultraviolet light. As will be described later in Examples, the hydrophilicity of the flow path wall surface can be increased by irradiation with ultraviolet light depending on the type of the resin constituting the substrate. A general method such as masking can be used to determine whether or not the flow path is irradiated with ultraviolet light.

[0061] In the method for producing a microchip of the present invention, since the organic solvent and the resin composition do not remain on the adhesive surface of the resin substrate, a microchip having excellent optical characteristics can be produced. For example, even when optical detection is performed for the purpose of the chip, optical correction performed at the time of detection can be reduced.

[0062] In the microchip manufacturing method of the present invention using the second bonding method, when a flow path is formed on the irradiation surface of the resin substrate, the flow path is connected to the silane coupling agent along with the irradiation surface. May be surface treated. Depending on the type of the resin or silane coupling agent constituting the substrate, the surface of the channel can be modified to make the channel functional. Although it depends on the type of resin constituting the substrate, aminosilane is generally easily modified by modifying the flow path surface.

[0063] As the resin article to which the production method of the present invention can be applied, in addition to the microchip, optical parts such as a resin lens can be considered.

[0064] Conventionally, it has been difficult to manufacture an optical component such as a resin lens by bonding the resin components together. Bonding by heat fusion causes distortion in the manufactured resin lens and reduces its optical properties. In addition, in the case of adhesion using an organic solvent-resin composition, these coated materials remain on the adhesion surface and the optical characteristics are deteriorated.

On the other hand, in the method for producing a resin article of the present invention, the resin components constituting the resin lens can be bonded to each other at a temperature lower than that by heat fusion, and an organic solvent and a resin are bonded to the bonding surface. Since the composition does not remain, it is possible to suppress a decrease in optical characteristics of the manufactured lens. In addition, by combining two or more grease parts, it is possible to manufacture optical parts having complicated shapes that were difficult to manufacture.

Example

Hereinafter, the present invention will be described in more detail with reference to examples. The present invention is not limited to the following examples.

[0067] (Example 1)

On each surface of a pair of resin substrates (70mm X 20mm, thickness 2mm) made of cycloolefin polymer (ZEONEX330R manufactured by Nippon Zeon Co., Ltd., glass transition point 123 ° C), Xe excimer lamp (UER20 manufactured by Ushio) — Irradiated with ultraviolet light (wavelength 172 nm) by 172A). Irradiation with ultraviolet light was performed in the atmosphere, the distance between the lamp and the substrate surface was 5 mm, the irradiation intensity was 10 mW / cm ² , and the irradiation time was 10 minutes. The irradiation surface of ultraviolet light is one main surface of each substrate Overall.

[0068] The X-ray induced photoelectron spectroscopy (XPS) measurement of the substrate surface (irradiation surface) before and after irradiation with ultraviolet light was performed. After irradiation, the oxygen in the Ols spectrum was compared with that before irradiation with ultraviolet light. The increase in the force signal is remarkable, the signal from carbon in the Cls spectrum decreases, and a new carbon force signal in the state of bonding with oxygen (near 290 eV in terms of binding energy) can be seen. Wow. From this result, it was considered that many functional groups containing oxygen (carboxyl group, aldehyde group, hydroxyl group, etc.) were formed on the substrate surface by irradiation with ultraviolet light.

[0069] In addition to the above XPS measurement, the contact angle of water droplets on the substrate surface before and after irradiation with ultraviolet light was measured with an automatic contact angle meter (DM500, manufactured by Kyowa Interface Science Co., Ltd.). It was found that the hydrophilicity of the substrate surface was increased by irradiation with ultraviolet light.

[0070] Next, the substrates after the ultraviolet light irradiation are opposed to each other so that the respective irradiation surfaces are in contact with each other, and the force is applied at a pressure of 0.7 MPa in a direction in which the respective irradiation surfaces are in close contact with each other. While

The whole was heated to 100 ° C. and held there for 1 hour.

[0071] Next, after the temperature of the whole was lowered to room temperature, the above force was removed and it was confirmed whether the substrates were adhered to each other. The substrates were firmly adhered to each other, and both were pulled without breaking. I couldn't peel it off.

[0072] In addition, when a resin substrate made of a cycloolefin polymer different from the above (ZEONEX480R manufactured by Nippon Zeon Co., Ltd .: glass transition point 138 ° C) is used, and polycarbonate (manufactured by Bayer Co., Ltd .: glass) Even when a resin substrate having a transition point (210 ° C.) force was used, similar results were obtained.

[0073] Similar results were obtained when the irradiation time of ultraviolet light was 5 minutes.

[Example 2]

In the same manner as in Example 1, the surface of each of the pair of resin substrates having the cycloolefin polymer force used in Example 1 was irradiated with ultraviolet light.

[0075] Next, N- (2 aminoethyl) 3 aminopropyltrimethoxysilane (a kind of aminosilane) is used as a silane coupling agent on the irradiated surface of one resin substrate (resin substrate A). A EAPS) was applied. Separately, 3-glycidoxy monopropyltrimethoxysilane (GPS) having an epoxy group at the terminal was applied to the irradiated surface of the other resin substrate (resin substrate B). The structural formulas of AEAPS and GPS are shown in the following formulas (1) and (2).

[0076] [Chemical 1]

H ₂ N

[0077] [Chemical 2]

[0078] The resin substrates A and B surface-treated with the silane coupling agent in this way are applied to the respective irradiated surfaces.

(Surface treatment surfaces) facing each other and raising the entire surface to 100 ° C while holding the force at a pressure of 0.7 MPa in the direction in which each irradiation surface adheres to each other, It was kept for 1 hour.

[0079] Next, after the temperature of the whole was lowered to room temperature, the above force was released and it was confirmed whether the substrates were bonded to each other. The substrates were bonded to each other, and both were peeled off without breaking. I couldn't do it.

[0080] When a resin substrate made of a cycloolefin polymer (ZEONEX480R manufactured by Nippon Zeon Co., Ltd.) different from the above is used, and when a resin substrate made of the polycarbonate used in Example 1 is used. Similar results were obtained.

[0081] The present invention can be applied to other embodiments without departing from the intent and essential characteristics thereof. The embodiments disclosed in this specification are illustrative in all respects and are not limited thereto. The scope of the present invention is shown not by the above description but by the appended claims, and all modifications that are equivalent in meaning and scope to the claims are included therein. Be turned.

Industrial applicability

ADVANTAGE OF THE INVENTION According to this invention, the adhesion | attachment method which can adhere | attach resin and resin with high productivity in the temperature lower than the adhesion | attachment by heat sealing | fusion can be provided. The bonding method of the present invention can be applied to various methods for manufacturing a resin article, for example, a microchip manufacturing method.

Claims

The scope of the claims

[I] A method for adhering a first resin and a second resin,

(I) a step of irradiating ultraviolet light onto the surfaces of the first and second resin that are to be bonded surfaces;

(II) The step of bonding the first and second resins using the surface as an adhesive surface by raising the temperature in a state where the surfaces after the irradiation are in contact with each other. A method for adhering rosin.

[2] The resin according to claim 1, wherein the temperature of the temperature increase in the step (II) is a temperature at which the first resin and the second resin are not thermally fused together. Bonding method.

[3] The method of adhering a resin according to claim 1, wherein the temperature of the temperature increase in the step (II) is less than the glass transition point of the first and second resins.

[4] In the step (II),

2. The method for adhering a resin according to claim 1, wherein the temperature of the surface is increased while applying a force in a direction in which the surfaces of the first and second resins are in close contact with each other.

5. The method for adhering a resin according to claim 1, wherein at least one resin selected from the first and second resins is optically transparent.

6. The method for adhering a resin according to claim 1, wherein the first and second resins have a bond between at least one element selected from carbon, oxygen and nitrogen force and carbon in the main chain.

7. The resin bonding method according to claim 1, wherein the at least one resin selected from the first and second resins is at least one selected from a cycloolefin polymer and a polycarbonate.

8. The method of adhering a resin according to claim 1, wherein at least one resin selected from the first and second resins is a bicyclic cyclohexylene polymer.

[9] The method of adhering a resin according to claim 1, wherein the types of the first and second resin are the same

10. The method for adhering a resin according to claim 1, wherein the ultraviolet light is vacuum ultraviolet light.

[II] The resin bonding method according to claim 1, wherein the ultraviolet light source is a mercury lamp, a xenon lamp, an excimer laser, or an excimer lamp.

[12] A method for adhering a resin to bond a first resin and a second resin, (i) irradiating ultraviolet light onto the surfaces of the first and second resin to be bonded surfaces;

(ii) a step of surface-treating the surface after the irradiation with a silane coupling agent;

(iii) adhering the first and second resins using the surface as an adhesive surface by raising the temperature in a state where the treated surfaces are in contact with each other.接着 How to bond the resin.

[13] In the step (ii),

Surface treating the surface of the first resin with a silane coupling agent having an amino group at the end;

13. The method for adhering a resin according to claim 12, wherein the surface of the second resin is treated with a silane coupling agent having a functional group capable of binding to the amino group at a terminal.

14. The resin bonding method according to claim 13, wherein the functional group is at least one selected from an epoxy group, a carboxyl group, and an aldehyde group.

[15] including two or more parts having a grease part,

A method of manufacturing a resin article in which the two or more parts are bonded to each other in the resin part,

A method for producing a resin article, wherein the resin parts are bonded together by the resin bonding method according to claim 1.

16. The method for producing a resin article according to claim 15, wherein the resin part has at least one force selected from a cycloolefin polymer and a polycarbonate.

[17] including two or more parts having a resin part,

A method for producing a resin product, wherein the resin parts are bonded together by the resin bonding method according to claim 12.

18. The method for producing a resin article according to claim 17, wherein the resin part has at least one force selected from a cycloolefin polymer and a polycarbonate.

[19] includes a pair of resin substrates bonded to each other so as to face each other,

Production of a microchip in which a fine channel is formed in at least one of the resin substrates. Manufacturing method,

A method for producing a microchip, wherein the resin substrates are bonded together by the resin bonding method according to claim 1.

20. The method for manufacturing a microchip according to claim 19, wherein the flow path is formed on an adhesive surface of the resin substrate.

[21] includes a pair of resin substrates bonded to each other so as to face each other,

A method of manufacturing a microchip in which a fine channel is formed in at least one of the resin substrates,

A method for manufacturing a microphone mouth chip, wherein the resin substrates are bonded to each other by the resin bonding method according to claim 12.

22. The method for manufacturing a microchip according to claim 21, wherein the flow path is formed on an adhesive surface of the resin substrate.