WO2013172508A1 - Interface panel for display and method for manufacturing same - Google Patents

Abstract

The present invention relates to an interface panel for a display and a method for manufacturing same, and more particularly, to an interface panel for a display in which a cover glass and a transparent insulation substrate are integrally formed, and a method for manufacturing the interface panel. The interface panel comprises: a cover glass; a first transparent insulation substrate laminated on the cover glass; a second transparent insulation substrate laminated on the first transparent insulation substrate; a first electrode layer disposed in a first direction on the first transparent insulation substrate; and a second electrode layer disposed in a second direction on the second transparent insulating layer, wherein the first and second transparent insulation substrates include a curing resin.

Description

Display interface panel and its manufacturing method

The present invention relates to a display interface panel and a method of manufacturing the same, and more particularly, to an interface panel for a display and a method of manufacturing the integrated cover glass and a transparent insulating substrate.

The interface panel for a display includes a device attached to the front of the display to receive a user's touch input. The touch of the interface panel for displays is rapidly changing from a resistive resistive method to a capacitive method. This capacitance type is divided into a film type and a glass type. Conventional film and glass types are based on ITO.

The existing process consists of ITO film and OCA as the main materials of the interface panel for display. ITO consists of indium oxide (In ₂ O ₃ ) and tin oxide (SnO ₂ ). Indium is a group 13 of the periodic table, atomic number 49, atomic weight 114.82, and abundance of 0.1 ppm in the earth's crust. In the case of ITO film or glass, the laminated ITO layer has an amorphous structure. In order to crystallize this amorphous material, in addition, in order to have a low resistance value, the heat processing process is required at 135-155 degreeC at the temperature of 2 hours or less.

Conventional display interface panel is composed of two or more layers of ITO film and OCA, etc. Due to this, there are many problems in the productivity of the product, such as heat treatment facilities, heat treatment time due to the heat treatment process of ITO. In addition, many additional costs were involved for patterning for ITO, including etching equipment, etching time and drying.

In particular, in the case of the conventional capacitive display interface panel, there are many problems such as etching problems of the ITO layer and appearance quality problems such as etching conditions, cleaning and drying resulting therefrom. In addition, there is a problem in that defects occur due to appearance quality problems due to remaining bubbles generated during the bonding process between the lens and the ITO.

On the other hand, as a recent technology trend, a method of using silver nanowires, a method of using carbon nanotubes, a conductive polymer, or the like is used instead of a transparent conductive film.

However, the micropattern implementation method developed so far has a limitation in the early application due to the expensive transparent conductive film as a raw material, the complicated implementation method, and the lack of practicality for mass production. In addition, such a technique has to be etched again after coating, and thus, there are problems such as an increase in manufacturing cost and a problem of manufacturing process conditions related to complexity and visibility.

The present invention has been made to solve the problems of the prior art as described above, it is an object of the present invention to provide an interface panel for a display and a method of manufacturing the cover glass and transparent insulating substrate is integrated.

Another object of the present invention is to provide an interface panel for a display and a method of manufacturing the same, which can improve transmittance and visibility, simplify the manufacturing process, and reduce manufacturing cost.

Still another object of the present invention is to reduce the line width and line distance of the metal wiring formed in the bezel portion of the display interface panel, thereby substantially extending the effective display area of the display interface panel, thereby making it more versatile. It is to provide an interface panel for display that can implement functions and contribute to product competitiveness.

Still another object of the present invention is to provide an interface panel for a display that can reduce manufacturing costs and implement optical characteristics equivalent to or higher than those of the related art by not using expensive ITO.

It is still another object of the present invention to provide a method for manufacturing an interface panel for a display that can simplify a manufacturing process by omitting a conventional pattern forming process such as lithography.

To this end, the present invention is a cover glass; A first transparent insulating substrate laminated on the cover glass; A second transparent insulating substrate laminated on the first transparent insulating substrate; A first electrode layer formed on the first transparent insulating substrate along a first direction; And a second electrode layer formed on the second transparent insulating substrate along a second direction, wherein the first transparent insulating substrate and the second transparent insulating substrate include a curable resin.

Here, the method may further include a third transparent insulating substrate laminated on the second transparent insulating substrate.

The first electrode layer is embossed or engraved in the direction of the first transparent insulating substrate at an interface between the first transparent insulating substrate and the second transparent insulating substrate, and the second electrode layer is formed of the second transparent insulating substrate and the first transparent insulating substrate. 3 may be embossed or engraved in the direction of the second transparent insulating substrate at the interface of the transparent insulating substrate.

The first to third transparent insulating substrates may be made of an ultraviolet curable resin or a thermosetting resin.

The first to third transparent insulating base material may include any one selected from the group consisting of olefin, epoxy, acrylic, urethane and silicone resins.

The first electrode layer and the second electrode layer may each be formed in a stripe pattern.

The cross-section of the stripe pattern may be formed in any one of a triangle, a quadrangle, a semicircle, and a trapezoid.

The stripe pattern may have a width of 10 μm or less.

Any one of the stripe patterns of the first electrode layer and one of the stripe patterns of the second electrode layer may be electrically connected.

The first electrode layer and the second electrode layer may include conductive particles and a binder to fix the conductive particles.

The conductive particles may be made of any one or two or more selected from the group consisting of nickel, palladium, silver, copper, gold, tin, platinum, aluminum, indium oxide, carbon nanotubes, graphene, conductive polymers, and cobalt. .

It is preferable that the binder has a small refractive index difference from the second to fourth transparent insulating substrates. For example, the refractive index difference may be made of a material within 0.5, preferably within 0.05, more preferably within 0.005.

A bezel portion may be formed at an edge of the cover glass to define an effective display area.

On the other hand, the present invention, (a) preparing a cover glass; (b) stacking a first transparent insulating substrate having a plurality of first trenches spaced apart from each other along a first direction on the cover glass; (c) filling a first conductive layer in the plurality of first trenches to form a first electrode layer on the first transparent insulating substrate; (d) stacking a second transparent insulating substrate having a plurality of second trenches spaced apart from each other along a second direction on the first transparent insulating substrate; And (e) filling the conductive material in the plurality of second trenches to form a second electrode layer on the second transparent insulating substrate.

Here, after the step (e), (f) may further comprise the step of laminating a third transparent insulating substrate on the second transparent insulating substrate.

The first to third transparent insulating substrate may be made of a curable resin.

In the step (b), after filling the cover glass with the upper part of the mold having the uneven pattern formed on the bottom surface, filling the resin material of the curable resin, curing the resin material, and the first And a step of detaching the resin material attached to the first transparent insulating substrate and cured from the transparent insulating substrate and the mold.

Steps (c) and (e) may include preparing a conductive paste including conductive particles and a binder as a conductive material, and applying the conductive material to the plurality of first trenches or the plurality of second trenches, respectively. Filling, and curing the conductive material may include.

In the step (d), the process of filling the resin material of the curable resin after covering the upper part of the mold having the uneven pattern formed on the bottom surface with the first transparent insulating base attached to the cover glass, the resin material And curing the cover glass, the first transparent insulating substrate, and curing the resin material attached to the first transparent insulating substrate from the mold.

The first electrode layer may be formed on an interface between the first transparent insulating substrate and the second transparent insulating substrate, and the second electrode layer may be formed on an interface between the second transparent insulating substrate and the third transparent insulating substrate.

The uneven pattern may be formed through lithography or metal processing.

According to the present invention, the cover glass and the transparent insulating substrate are bonded to each other, and the electrode is directly patterned on the transparent insulating substrate to prevent the generation of bubbles or the like that may occur in the adhesive layer during the bonding of the conventional cover glass and ITO. This can reduce defects, simplify the process, and reduce manufacturing costs. In addition, according to the present invention, it is possible to reduce the line width and the line distance of the metal wiring formed in the bezel portion of the display interface panel, thereby substantially extending the effective display area of the display interface panel, thereby making it more versatile. Functions can be implemented, which contributes to product competitiveness. And according to the present invention, by not using expensive ITO, not only can reduce the manufacturing cost, but also can implement the same or more optical characteristics than the conventional, and by omitting the conventional pattern forming process, such as lithography The manufacturing process can be simplified.

1 is a cross-sectional view showing an interface panel for a display according to an embodiment of the present invention.

2 is a process flowchart showing a manufacturing method of an interface panel for a display according to an exemplary embodiment of the present invention.

3 to 10 is a process chart showing the manufacturing method of the display interface panel according to an embodiment of the present invention in the order of process.

Hereinafter, a display interface panel and a method of manufacturing the same according to an embodiment of the present invention will be described in detail with reference to the accompanying drawings.

In addition, in describing the present invention, when it is determined that a detailed description of a related known function or configuration may unnecessarily obscure the subject matter of the present invention, the detailed description thereof will be omitted.

Referring to FIG. 1, the display interface panel 100 according to an exemplary embodiment of the present disclosure may be, for example, a touch screen panel attached to a front surface of a display to receive a user's touch input. The display interface panel 100 includes a cover glass 110, a first transparent insulating substrate 120, a second transparent insulating substrate 130, a first electrode layer 150, and a second electrode layer 160.

The cover glass 110 is a substrate that is disposed on the front surface of the display interface panel 100 to protect the display interface panel 100 and transmits light at the same time, and preferably has high transparency and heat resistance. In terms of transparency of the cover glass 110, the visible light transmittance is preferably 80% or more, and in terms of heat resistance, the glass transition temperature is preferably 50 ° C or more. The first transparent insulating base 120 is bonded to the bottom surface (drawing reference) of the cover glass 110, and the bonding method thereof will be described in detail in the following method of manufacturing an interface panel for a display. Meanwhile, a bezel part 111 may be formed on the edge of the cover glass 110 by a black coating on the cover glass 110 to define an effective display area of the display interface panel 100.

The first transparent insulating substrate 120 is directly bonded to the bottom surface of the cover glass 110 to be integrated with the cover glass 110. In addition, a first electrode layer 150 is formed on the first transparent insulating substrate 120. In addition, the second transparent insulating base 130 is laminated or integrally bonded to the bottom surface of the first transparent insulating base 120.

In an embodiment of the present invention, the first transparent insulating substrate 120 includes a curable resin. For example, the first transparent insulating substrate 120 may include an ultraviolet curable resin or a thermosetting resin. Specifically, the first transparent insulating substrate 120 may include any one selected from the group consisting of olefin, epoxy, acrylic, urethane, and silicone resins. The first transparent insulating base 120 is formed by filling a mold with a resin material, which will be described in detail in the following method for manufacturing an interface panel for a display.

The second transparent insulating substrate 130 is continuously laminated on the bottom surface of the first transparent insulating substrate 120 in a manner of filling and curing the resin in a mold including the first transparent insulating substrate 120 as a cover. The second electrode layer 160 is formed on the second transparent insulating base 130. The second transparent insulating substrate 130, like the first transparent insulating substrate 120, includes a curable resin. For example, the second transparent insulating substrate 130 may include an ultraviolet curable resin or a thermosetting resin. Specifically, the second transparent insulating base 130 may include any one selected from the group consisting of olefin, epoxy, acrylic, urethane, and silicone resins.

Meanwhile, the third transparent insulating base 140 is laminated or bonded to the lower surface of the second transparent insulating base 130 to form the first transparent insulating base 120, the first electrode layer 150, and the second transparent insulating base 130. ) And the second electrode layer 160 may serve as an over coat layer.

The first electrode layer 150 may be formed along a first direction, for example, in a horizontal direction, on a lower surface (drawing reference) of the first transparent insulating substrate 120. In this case, the first electrode layer 150 may be formed in an intaglio or embossed shape on the bottom surface of the first transparent insulating substrate 120. In this case, when the first electrode layer 150 is formed in an embossed shape, since the manufacturing method involves a complicated process such as an etching process or a photolithography process, the first electrode layer may be simply formed by a simpler imprinting method. More preferably, 150 is formed in an intaglio shape. Accordingly, in an embodiment of the present invention, the first electrode layer 150 is embossed in an inner direction of the first transparent insulating substrate 120 at the interface between the first transparent insulating substrate 120 and the second transparent insulating substrate 130. Or intaglio.

Although not shown, the planar structure of the first electrode layer 150 formed on the bottom surface of the first transparent insulating substrate 120 may form a stripe pattern. In this case, the cross section of the stripe pattern may be formed in any one of a triangle, a quadrangle, a semicircle, and a trapezoid, and may be formed in various shapes.

Here, the width of the unit pattern among the stripe patterns constituting the first electrode layer 150 is preferably formed to be about 5㎛ or less. If the width of the pattern is greater than 5 μm, the width of the pattern formed in the effective display area of the display interface panel 100 is exposed to the outside, so that the visibility may be lowered, and thus, the overall transmittance is also reduced. The quality of the display interface panel 100 may be reduced as a whole. Preferably, the width of the unit pattern is 0.01 to 10㎛.

Meanwhile, the first electrode layer 150 may include conductive particles and a binder for fixing the conductive particles. At this time, the conductive particles may be used a conductive metal, an alloy of the metal, a conductive polymer, carbon particles and the like, but is not limited thereto. In embodiments, the conductive particles may be any one or a combination of two or more selected from the group consisting of nickel, palladium, silver, copper, gold, tin, platinum, aluminum, indium oxide, carbon nanotubes, graphene, conductive polymers, and cobalt. Can be done.

In order to secure the same or more transmittance as compared to a display interface panel using ITO as a transparent electrode, the binder is most preferably made of a material having index matching with the first transparent insulating substrate 120. Preferably, a material having a refractive index difference of about 0.5 or less, preferably 0.05 or less, and more preferably 0.005 or less with the first transparent insulating substrate 120 is used as a lane. As described above, the method of forming the first electrode layer 150 formed using the conductive particles and the polymer will be described in detail in the following method of manufacturing the interface panel for a display.

When the display interface panel 100 according to an embodiment of the present invention is applied as a touch panel, the second electrode layer 160 generates an electrical signal for contact from the outside together with the first electrode layer 150. do. In this case, one of the first electrode layer 150 and the second electrode layer 160 detects the X-axis input coordinates, and the other detects the Y-axis input coordinates.

The second electrode layer 160 may be formed in a second direction, for example, a vertical direction, on the bottom surface (based on the drawing) of the second transparent insulating substrate 130. Accordingly, the second electrode layer 160 and the first electrode layer 150 may be formed orthogonal to each other on a plane. However, the first electrode layer 150 and the second electrode layer 160 may be formed to have various angles according to a design purpose. In an embodiment of the present invention, the first electrode layer 150 and the second electrode layer 160 may be formed. The arrangement form is not particularly limited. The first electrode layer 150 and the second electrode layer 160 disposed as described above are disposed in a state of being insulated from each other by the second transparent insulating base 130.

Similar to the first electrode layer 150, the second electrode layer 160 may be formed in an intaglio or embossed form. In order to simplify the manufacturing process and reduce manufacturing cost, and to compact and slim the display device, the second electrode layer 160 may be formed in an intaglio. Do. Accordingly, in the embodiment of the present invention, the second electrode layer 160 is engraved in the inner direction of the second transparent insulating substrate 130 at the interface between the second transparent insulating substrate 130 and the third transparent insulating substrate 140. Is formed.

In addition, like the first electrode layer 150, the second electrode layer 160 may be formed in a stripe pattern, and a cross section thereof may be selected from various figures including triangles, quadrangles, semicircles, and trapezoids. At this time, the cross-sectional shape of each of the unit patterns among the stripe patterns of the second electrode layer 160 need not be the same, and may be formed differently from the pattern of the first electrode layer 150. However, the width of the unit pattern among the stripe patterns constituting the second electrode layer 160 is preferably formed to be about 10 μm or less, for example, 0.01 to 9.5 μm, for the reasons described above.

Meanwhile, the second electrode layer 160 may be formed of the same material as the first electrode layer 150. That is, the second electrode layer 160 may include conductive particles and a binder for fixing the conductive particles. In this case, the conductive particles may be a conductive metal, an alloy of the metal, a conductive polymer, carbon particles, etc., for example, nickel, palladium, silver, copper, gold, tin, platinum, aluminum, indium oxide, carbon nanotubes , Graphene, the conductive polymer and cobalt may be made of any one or a combination of two or more selected from the group consisting of. Similarly, it is preferable that the binder also has a material having a refractive index difference of about 0.5 or less, preferably 0.05 or less, and more preferably 0.005 or less with the second transparent insulating substrate 130.

Although not shown, the first electrode layer 150 and the second electrode layer 160 are insulated by the second transparent insulating base 130, and any one of the stripe patterns of the first electrode layer 150 is, for example, the most. The outermost pattern and the outermost pattern of the second electrode layer 160 may be electrically connected to each other. As such, the electrically connected patterns become patterns of portions covered by the bezel part 111 when the display interface panel 100 according to an exemplary embodiment of the present invention is used as a touch panel. It is used as a metal wiring of the panel 100 and is connected to a circuit portion such as an FPCB to serve to transmit an electrical signal generated by contact from the outside to the circuit portion.

Hereinafter, a manufacturing method of an interface panel for a display according to an embodiment of the present invention will be described.

Referring to FIG. 2, the method of manufacturing an interface panel for a display according to an exemplary embodiment of the present invention may include preparing a cover glass (S1), stacking a first transparent insulating substrate (S2), forming a first electrode layer (S3), A second transparent insulating substrate stacking step (S4), and a second electrode layer forming step (S5).

First, the cover glass preparation step S1 is a step of preparing the cover glass 110 that is disposed on the front surface of the display interface panel 100 to protect the display interface panel 100 and transmits light at the same time. Here, in this step (S1), it is preferable to prepare a cover glass 110 having high transparency and heat resistance. In addition, it is preferable to prepare a cover glass 110 having a visible light transmittance of 80% or more and a glass transition temperature of 50 ° C or more.

Next, referring to FIGS. 3 and 4, in the stacking of the first transparent insulating substrate S2, the first transparent insulating substrate 120 having the plurality of first trenches 121 spaced apart from each other along the first direction is formed. The step of laminating on the lower surface of the cover glass 110. In this step (S2), the upper surface of the mold 50 having the uneven pattern 51 formed on the bottom surface is covered with the cover glass 110, and the resin material 125 made of the curable resin is filled. At this time, the uneven pattern 51 of the mold 50 may be formed in various forms through a known lithography method or metal processing. In addition, the resin material 101 to be used may include an ultraviolet curable resin or a thermosetting resin. Specifically, the resin material 101 may include any one selected from the group consisting of olefin, epoxy, acrylic, urethane, and silicone resins. At this time, when using a thermosetting resin there is a disadvantage that takes a long time of curing, it is preferable to use an ultraviolet curable resin as the resin (101). As such, when the resin material 125 is cured and then the resin material 125 bonded to the cover glass 110 is removed from the mold 50 as shown in FIG. 4, the mold 50 of the mold 50 is removed. The first trench 121 is formed on the bottom surface of the first transparent insulating substrate 120 by the uneven pattern 51. The first trench 121 provides a filling space of the conductive material constituting the first electrode layer 150. The first trench 121 serves to control the shape of the first electrode layer 150. Since the first electrode layer 150 according to the embodiment of the present invention is formed in a stripe pattern, the first trench 121 must be formed in a stripe pattern, and the shape of the first trench 121 is uneven in the mold 50. Determined by the pattern 51. In this case, the line width and the line distance of the uneven pattern 51 forming the metal wires disposed on the bezel part 111 can also be easily adjusted. As a result, the effective display area can be extended than before.

Next, referring to FIG. 5, in the first electrode layer forming step S3, a conductive material is filled in the plurality of first trenches 121 to form the first electrode layer 150 on the bottom surface of the first transparent insulating substrate 120. Forming a step. In this step S3, first, a conductive paste containing conductive particles and a binder is prepared as a conductive material. Here, the conductive particles may be any one or two or more selected from the group consisting of nickel, palladium, silver, copper, gold, tin, platinum, aluminum, indium oxide, carbon nanotubes, graphene, conductive polymers, and cobalt. In addition, it is preferable to select and use a material having a refractive index difference of about 0.5 or less, preferably 0.05 or less, and more preferably 0.005 or less, as the binder. Next, as illustrated, the prepared conductive material is filled in the plurality of first trenches 121. For example, after applying a conductive material to the lower surface of the first transparent insulating substrate 120 on which the first trench 121 is formed using a doctor blade, the first transparent insulating substrate 120 other than the first trench 121 may be formed. If the conductive material applied to the lower surface is scraped off or removed by a separate means, the conductive material may be filled in only the inside of the first trench 121. Through such a method, the surface of the conductive material filled in the first trench 121 may be simultaneously planarized. As another example, a conductive material may be filled only in the first trench 121 from the beginning using an injection means such as a nozzle. Subsequently, when the conductive material is cured by applying heat using a heating apparatus such as a hot plate or an oven, the first electrode layer 150 having a stripe pattern is formed on the lower surface of the first transparent insulating substrate 120.

Next, referring to FIGS. 6 and 7, in the stacking of the second transparent insulating substrate S4, the second transparent insulating substrate 130 having the plurality of second trenches 131 spaced apart from each other along the second direction may be formed. The step of laminating on the lower surface of the first transparent insulating substrate 120. In this step (S4), after covering the upper portion of the mold 50, the concave-convex pattern 51 is formed on the bottom surface with a laminate in which the cover glass 110 and the first transparent insulating substrate 120 are integrally laminated. The resin material 125 made of the curable resin is filled. In this case, the resin material 125 is the same as the resin material 125 used when the first transparent insulating base 120 is formed. In addition, the uneven pattern 51 of the mold 50 may be formed in various forms through a known lithography method or metal processing, and the mold 50 used in this step S4 may have a first transparent insulating base material stacking step ( The mold 50 and the uneven pattern 51 used in S2) may have different shapes. As described above, when the resin material 125 is cured and then the resin material 125 bonded to the laminate is removed from the mold 50 as it is cured, as shown in FIG. 7, the irregularities of the mold 50 are uneven. The second trench 131 is formed on the bottom surface of the second transparent insulating base material 131 by the pattern 51.

Next, referring to FIG. 8, in the forming of the second electrode layer 160 (S5), the conductive material is filled in the plurality of second trenches 131 to fill the second transparent insulating substrate 130 with the second electrode layer 160. ) To form. This step S5 is performed in the same process as the first electrode layer forming step S3. That is, in this step S5, first, a conductive paste containing conductive particles and a binder is prepared as a conductive material. Here, the conductive particles may be any one or two or more selected from the group consisting of nickel, palladium, silver, copper, gold, tin, platinum, aluminum, indium oxide, carbon nanotubes, graphene, conductive polymers, and cobalt. As the binder, it is preferable to select and use a material having a refractive index difference of about 0.5 or less, preferably 0.05 or less, and more preferably 0.005 or less. Next, as illustrated, the prepared conductive material is filled in the plurality of second trenches 131. Subsequently, when the conductive material is cured by applying heat using a heating device such as a hot plate or an oven, the stripe pattern may be formed on the lower surface of the second transparent insulating base 130 to intersect or cross the stripe pattern of the first electrode layer 150. The second electrode layer 160 is formed.

9 and 10, the third transparent insulating substrate stacking step S6 is a step of stacking the third transparent insulating substrate 140 on the bottom surface of the second transparent insulating substrate 130. In the step S6, the upper surface of the mold 50 having a flat bottom surface is covered with the integrated stack of the cover glass 110, the first transparent insulating substrate 120, and the second transparent insulating substrate 130, and then the inside thereof. The resin material 125 is filled and cured. In this case, the resin material 125 is the same as the resin material used for forming the first transparent insulating substrate 120 and the second transparent insulating substrate 130. Next, when the resin material 125 attached to the laminate is separated from the mold 50, the third transparent insulating base 140 serving as an overcoat layer is formed on the lower surface of the second transparent insulating base 130. Laminated integrally.

Through the above process, the first electrode layer 150 is formed on the interface between the first transparent insulating substrate 120 and the second transparent insulating substrate 130, the second electrode layer 160 is the second transparent insulating substrate 130. ) And the third transparent insulating base 140.

When the stacking of the third transparent insulating substrate 140 is completed on the bottom surface of the second transparent insulating substrate 130 through the third transparent insulating substrate stacking step S6, the integrated display interface panel according to the embodiment of the present invention. The manufacture of 100 is complete.

As described above, although the present invention has been described with reference to the limited embodiments and the drawings, the present invention is not limited to the above embodiments, and those skilled in the art to which the present invention pertains various modifications and variations from such descriptions. This is possible.

Therefore, the scope of the present invention should not be limited to the described embodiments, but should be determined by not only the claims below but also equivalents to the claims.

Claims (21)

1. Cover glass;

   A first transparent insulating substrate laminated on the cover glass;

   A second transparent insulating substrate laminated on the first transparent insulating substrate;

   A first electrode layer formed on the first transparent insulating substrate along a first direction; And

   A second electrode layer formed on the second transparent insulating substrate along a second direction;

   Including,

   And the first transparent insulating base material and the second transparent insulating base material comprise curable resin.
2. The method of claim 1,

   The interface panel for a display further comprising a third transparent insulating substrate laminated on the second transparent insulating substrate.
3. The method of claim 2,

   The first electrode layer is embossed or engraved in the direction of the first transparent insulating substrate at the interface between the first transparent insulating substrate and the second transparent insulating substrate,

   And the second electrode layer is embossed or engraved in a direction toward the second transparent insulating substrate at an interface between the second transparent insulating substrate and the third transparent insulating substrate.
4. The method of claim 3,

   The first to the third transparent insulating base material is a display interface panel made of ultraviolet curable resin or thermosetting resin.
5. The method of claim 4, wherein

   The first to the third transparent insulating base material is an interface panel for a display including any one selected from the group consisting of olefins, epoxy, acrylic, urethane and silicone resin.
6. The method of claim 1,

   And the first electrode layer and the second electrode layer are each formed in a stripe pattern.
7. The method of claim 6,

   The cross section of the stripe pattern is a display panel formed in any one of a triangle, a quadrangle, a semi-circle and a trapezoid.
8. The method of claim 7, wherein

   The display panel having a width of the stripe pattern is formed 10㎛ or less.
9. The method of claim 8,

   Any one of the stripe pattern of the first electrode layer and any one of the stripe pattern of the second electrode layer is electrically connected.
10. The method according to any one of claims 1 to 9,

    The first electrode layer and the second electrode layer is a display panel including a conductive particle and a binder for fixing the conductive particles.
11. The method of claim 10,

    The conductive particles are made of any one or two or more selected from the group consisting of nickel, palladium, silver, copper, gold, tin, platinum, aluminum, indium oxide, carbon nanotubes, graphene, conductive polymers and cobalt. Interface panel.
12. The method of claim 11,

    The binder is a display interface panel made of a material having a refractive index difference of 0.5 or less from the second to fourth transparent insulating substrates.
13. The method of claim 1,

    And a bezel portion defining an effective display area on an edge of the cover glass.
14. (a) preparing a cover glass;

    (b) stacking a first transparent insulating substrate having a plurality of first trenches spaced apart from each other along a first direction on the cover glass;

    (c) filling a first conductive layer in the plurality of first trenches to form a first electrode layer on the first transparent insulating substrate;

    (d) stacking a second transparent insulating substrate having a plurality of second trenches spaced apart from each other along a second direction on the first transparent insulating substrate; And

    (e) filling the conductive material in the plurality of second trenches to form a second electrode layer on the second transparent insulating substrate;

    Method of manufacturing a display interface panel comprising a.
15. The method of claim 14,

    And (f) laminating a third transparent insulating substrate on the second transparent insulating substrate after the step (e).
16. The method of claim 15,

    The first to the third transparent insulating base material is a manufacturing method of the interface panel for a display made of a curable resin.
17. The method according to claim 15 or 16,

    In step (b),

    Covering the upper part of the mold having the uneven pattern formed on the bottom surface with the cover glass, and then filling the resin material of the curable resin;

    Curing the resin material, and

    Separating the resin material attached to the first transparent insulating substrate and the first transparent insulating substrate and cured from the mold;

    Method of manufacturing an interface panel for a display comprising a.
18. The method of claim 17,

    Step (c) and step (e) are each,

    Preparing a conductive paste containing conductive particles and a binder as a conductive material,

    Filling the conductive material into the plurality of first trenches or the plurality of second trenches, and

    Curing the conductive material,

    Method of manufacturing an interface panel for a display comprising a.
19. The method of claim 17,

    In step (d),

    Covering the upper part of the mold having the uneven pattern formed on the bottom surface with the first transparent insulating base attached to the cover glass, and then filling a resin material of the curable resin;

    Curing the resin material, and

    Separating the resin material attached to the cover glass, the first transparent insulating substrate, and the first transparent insulating substrate from the mold,

    Method of manufacturing an interface panel for a display comprising a.
20. The method of claim 15,

    The first electrode layer is formed on an interface between the first transparent insulating substrate and the second transparent insulating substrate, and the second electrode layer is formed on an interface between the second transparent insulating substrate and the third transparent insulating substrate. Method of manufacturing the panel.
21. The method of claim 17,

    The uneven pattern is a manufacturing method of the interface panel for a display formed through lithography or metal processing.

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