JP2010182137A - Touch panel and method for manufacturing the same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a touch panel and a method for manufacturing the same, inexpensively and stably reducing a width of an area where signal wiring lines are formed. <P>SOLUTION: In the touch panel, a transparent substrate 13 is injection molded, grooves 22 each having a narrow width HW can be stably formed in the frame area H at narrow intervals K with high accuracy, and the signal wiring lines 16 can be formed in the grooves 22. As shown in Fig.12, a signal wiring line 16A having a width W and a thickness T is formed in a substrate 10B in a conventional art, while the width HW of the signal wiring line 16 and the interval K between the signal wiring lines 16 can be reduced in the touch panel. As a result, the width of the frame area H where the plurality of signal wiring lines 16 are formed can be reduced. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a touch panel and a method for manufacturing a touch panel.

  Conventionally, a touch panel has been manufactured by superposing several kinds of various films to which a transparent electrode film, a protective film, and an optical film are added. The film is manufactured by a roll-to-roll manufacturing method.

  FIG. 31 is a conceptual diagram of a method for manufacturing the capacitive touch panel 100. In this method, first, by selectively removing the transparent electrode film 102 formed on the surface of the film 101, a pair of transparent electrodes 103a and 103b disposed opposite to each other on the capacitive touch panel 100 are obtained. Form. Next, signal wirings 104a and 104b connected to the respective transparent electrodes 103a and 103b are printed. And the adhesive sheet 105 is affixed on the area | region including the one transparent electrode 103b on the film 101, and its circumference | surroundings. Next, the transparent electrodes 103a and 103b are cut out from the film 101 and the area including the periphery, and these are bonded together. As a result, a capacitive touch panel in which N × M capacitive elements are arranged vertically and horizontally in the display portion is obtained. Here, N and M are the number of vertical and horizontal electrodes (number of signal wires).

  FIG. 32 is a conceptual diagram of a method for manufacturing a resistive film type touch panel 200. In this method, first, the transparent electrode film 102 on the surface of the film 101 is selectively removed, thereby forming electrode films 109 a and 109 b that are arranged to face each other on the resistive touch panel 200. Next, the extraction electrodes 110a and 110b connected to the electrode films 109a and 109b are printed. Then, after printing on the electrode film 109a of the dot spacer 111 for preventing a short circuit and forming the insulating resist 112 covering a part of the extraction electrode 110b, the film 101 is punched to manufacture the films 115 and 116. . Thereafter, the two films 115 and 116 are bonded together via the spacer material 117. Thereby, the resistive touch panel 200 is completed. (For example, refer to Patent Document 1).

Japanese Patent No. 4139091 (FIGS. 1 and 2)

  However, in the above-described technology, the capacitive touch panel 100 requires two films 106 and 107, and these films 106 and 107 need to be bonded with high accuracy.

  In the case of the resistive touch panel 200, the number of signal wires is 4 to 5 as shown in FIG. On the other hand, in the case of the capacitive touch panel 100, each of the films 106 and 107 requires N and M signal wirings 104a and 104b, respectively, as shown in FIG. In this case, it is desirable to increase the number of divisions of the transparent electrodes 103a and 103b in order to improve the resolution, and as a result, the number of signal wirings 104a and 104b tends to increase. As shown in FIG. 33, for example, when N = 6 and M = 10, 16 signal wires are required. In addition, a GND for shielding may be required.

  As described above, the capacitive touch panel has a larger number of signal wirings than the resistive touch panel, which results in an increase in the area other than the display area of the touch panel 100.

  In FIG. 34, a region H between the frame surrounding the display region of the touch panel and the outer shape of the touch panel is generally called a frame region. In the capacitive touch panel 100, the size of the frame area is larger than that of the resistive touch panel 200 for the above reason. Therefore, a method for reducing the frame size has been studied.

  In order to reduce the frame area, it is necessary to make the width h1 of the signal wiring 104a and the interval h2 between the signal wirings 104a as small as possible. The signal wiring 104a is generally formed by screen printing or the like, but it is difficult to reduce the width of the signal wiring due to limitations in print quality, restrictions on the adhesion of the signal wiring printing portion, wiring resistance, and the like. 34, the width h3 is the distance between the transparent electrode 103a and the signal wiring 104a, and the width h4 is the distance between the outer shape of the film 106 and the signal wiring 104a.

  After the signal wiring 104a is formed, the outer shape of the film 106 is removed by the cutting blade 118 as shown in FIG. 35. To prevent signal wiring damage due to deformation of the film 106 when the outer shape is removed, the wiring portion and the outer shape are removed. A certain margin is required for the part, and this margin increases the frame size.

  In addition, it is necessary to consider the misalignment shown in FIG. 36 when the two films 106 and 107 are bonded, and this misalignment amount can also be a factor for increasing the frame size.

  On the other hand, as shown in FIG. 32, the conventional resistive film type touch panel 200 is composed of two flat films 115 and 116 and a spacer material 117 having a predetermined thickness and width only at the outer peripheral portion for a minimum unit. However, it is difficult to reduce the width of the spacer material 117. The spacer material 117 is formed by punching an adhesive sheet into a frame shape by punching or the like, but the main factor is that it becomes difficult to maintain the shape as the width becomes narrower.

  Further, when forming the extraction electrode 110 from the transparent electrode 109 on the outer periphery of the films 115 and 116, it is necessary to perform positioning in each process in order to ensure the positional accuracy with respect to the outer shape of the films 115 and 116. For this reason, a margin in consideration of the accumulated position variation of each process is required.

  In addition, the signal wiring is generally formed by screen printing or the like, but it is difficult to narrow the signal wiring width due to limitations in print quality, restrictions on the adhesion and wiring resistance of the printed wiring portion, and the like.

  The resistive film type touch panel 200 is finally combined with the adhesive force of the spacer material 117 by superimposing the two films 115 and 116 and the spacer material 117 with a predetermined positional accuracy. For this reason, the margin which considered the variation of the shape dimension of each member at this time and the positioning variation is needed.

  As described above, it is difficult to reduce the width of the outer peripheral portion with respect to the display portion in the conventional resistive film type touch panel. On the other hand, as shown in FIG. 37, the demand for a narrow frame area 121 around the display area 120 is high. For example, in order to realize the width H of the frame area of 1 mm or less, improvement studies of each process and each member are underway, but it is difficult to stably realize this at a low cost.

  In view of the circumstances as described above, an object of the present invention is to provide a touch panel and a touch panel manufacturing method capable of stably and inexpensively reducing the width of a region where signal wiring is formed.

  In order to achieve the above object, a touch panel according to the present invention includes a first transparent substrate, a first wiring, and a first transparent electrode. The first transparent substrate is formed by injection molding and has a first groove on a first surface. The first wiring is provided in the first groove. The first transparent electrode is provided on the first surface of the first transparent substrate and connected to the first wiring.

  In the present invention, since the first groove is formed by injection molding on the first surface of the first transparent substrate, the narrow first groove can be formed accurately and stably. The width of the region in which one wiring is formed can be reduced inexpensively and stably.

  The first transparent substrate has a first display region provided with the first transparent electrode, and a first wiring region around the first display region, and the first groove is It may be formed in the first wiring region.

  Thereby, the width | variety of the 1st wiring formed in the 1st wiring area | region of a touchscreen can be narrowed, and the width | variety of a 1st wiring area | region can be narrowed. This is particularly effective when a plurality of first wirings are arranged.

  The first transparent substrate further includes a second groove on a second surface opposite to the first surface, and the touch panel includes the second wiring provided in the second groove. A second transparent electrode provided on the second surface of the first transparent substrate and connected to the second wiring may be further provided.

  Thereby, a narrow 1st wiring and 2nd wiring can be formed in both surfaces of a 1st transparent substrate. That is, the touch panel can be manufactured with a single first transparent substrate.

  The first groove is formed by a plurality of first protrusions protruding from the first surface, and the second groove is formed by a plurality of second protrusions protruding from the second surface. It may be formed. Thereby, a narrow groove | channel can be formed between adjacent convex parts, and wiring can be arrange | positioned in this groove | channel.

  A second transparent substrate formed by injection molding and having a third groove on the third surface, wherein the second transparent substrate is provided with the second transparent electrode. An area and a second wiring area around the second display area, and a groove forming surface of at least one of the first transparent substrate and the second transparent substrate has the groove forming surface. The first transparent substrate and the second transparent substrate protrude from the transparent electrode forming surface in the display area so that the first transparent electrode and the second transparent electrode face each other with a gap therebetween. The first wiring area and the second wiring area may be coupled to each other.

  As a result, the first transparent electrode and the second transparent electrode face each other with a gap therebetween, so that a resistive film type touch panel can be configured. For example, when the user does not touch the first transparent substrate or the second transparent substrate, the first transparent electrode and the second transparent electrode do not contact, but the user does not touch the first transparent substrate or the second transparent substrate. When the transparent substrate is touched, the first transparent electrode and the second transparent electrode come into contact with each other, and the resistance values of the first transparent electrode and the second transparent electrode change. This change in resistance value can be detected externally via the first wiring or the second wiring.

  The first groove is formed by a plurality of first protrusions protruding from the first surface, and the third groove is formed by a plurality of third protrusions protruding from the third surface. It may be formed. Thereby, a narrow groove | channel is arrange | positioned between adjacent convex parts.

  The touch panel manufacturing method according to the present invention includes injection-molding a first transparent substrate having a first groove on a first surface. A first transparent electrode is formed in a region different from the first groove on the first surface of the first transparent substrate. By providing the first wiring in the first groove, the first transparent electrode and the first wiring are connected.

  In the present invention, since the first groove is formed by injection molding on the first surface of the first transparent substrate, the narrow first groove can be formed with high accuracy and stability. The width of the region where the wiring is formed can be reduced at low cost and stably.

  During the injection molding, the first groove may be formed in a first wiring region around the first display region where the first transparent electrode of the first transparent substrate is provided.

  During the injection molding, a second groove is formed on the second surface opposite to the first surface of the first transparent substrate, the second wiring is provided in the second groove, A second transparent electrode may be provided on the second surface of the first transparent substrate so as to be connected to the second wiring.

  At the time of injection molding, a plurality of first protrusions protruding from the first surface are formed to form the first groove, and a plurality of second protrusions protruding from the second surface. The second groove may be formed by forming.

  By forming the second groove on the second wiring region around the second display region on which the second transparent electrode of the second transparent substrate is provided by injection molding, the surface on which the second transparent electrode is formed. The first transparent substrate is formed in the first wiring region and the second wiring region so that the first transparent electrode and the second transparent electrode face each other with a gap therebetween. And the second transparent substrate may be combined.

  At the time of injection molding of the first transparent substrate, the first groove is formed by forming a plurality of first protrusions protruding from the first surface, and the injection molding of the second transparent substrate. Sometimes, the third groove may be formed by forming a plurality of second protrusions protruding from the third surface.

  As described above, according to the present invention, the width of the region where the signal wiring of the touch panel is formed can be reduced inexpensively and stably.

It is a top view which shows the outline of the electronic device which concerns on one Embodiment of this invention. It is a side view of the electronic device shown in FIG. It is the top view, side view, and bottom view of the transparent substrate of the touch panel of an electronic device. It is A-A 'sectional drawing of the transparent substrate of the touch panel shown in FIG. It is a flowchart which shows the manufacturing process of the electronic device shown in FIG. It is a figure explaining the injection molding process (ST501) of the transparent base material of a touch panel. It is a figure explaining the process (ST502) which forms a transparent electrode film in a transparent substrate. It is a figure for demonstrating the process (ST503) which divides | segments a transparent electrode film. It is a figure explaining the process (ST504) which forms a signal wiring in the groove | channel of a transparent base material. It is a figure explaining the detail of the process of forming the signal wiring shown in FIG. It is explanatory drawing of a decoration process (ST505)-FPC connection process (ST508). It is a figure for demonstrating the shape of the frame area | region of a transparent substrate. It is a figure explaining the formation process of the transparent electrode film of the 1st modification. It is sectional drawing of the frame area | region of the transparent substrate of a 2nd modification. It is a figure explaining the process of forming the signal wiring of the 3rd modification. It is a figure explaining the process of forming the signal wiring of the 4th modification. It is a top view which shows the outline of the electronic device which concerns on the 2nd Embodiment of this invention. It is a side view of the electronic device shown in FIG. It is the top view of a 1st transparent substrate of the touchscreen of an electronic device, and a longitudinal cross-sectional view. FIG. 20 is a B-B ′ cross-sectional view of the first transparent substrate shown in FIG. 19. It is the top view of a 2nd transparent substrate of the touchscreen of an electronic device, and a longitudinal cross-sectional view. It is a flowchart which shows the manufacturing process of the electronic device shown in FIG. It is a figure explaining the process (ST2201) which manufactures a 1st transparent base material. It is a figure explaining the process (ST2202) which forms a transparent electrode film. It is a figure explaining the process (ST2203) of forming signal wiring. It is explanatory drawing of the joining process (ST2207) of the 1st and 2nd transparent substrate. It is a figure for demonstrating the shape of the frame area | region of a 1st transparent substrate. It is a figure explaining the formation process of the transparent electrode film of the 5th modification. It is a figure which shows alignment of the board | substrate which comprises the touchscreen of a 6th modification. It is sectional drawing which shows the structure of the touchscreen of the 7th modification. It is a figure for demonstrating the manufacturing process of the conventional electrostatic capacitance type touch panel. It is a figure for demonstrating the manufacturing process of the conventional resistive film type touch panel. It is a figure for demonstrating the number of wiring of the capacitive touch panel shown in FIG. It is a figure which shows the frame area | region of the electrostatic capacitance type touch panel shown in FIG. It is a figure explaining the cutting-out process of the film shown in FIG. It is a figure explaining the shift | offset | difference of bonding of the two films shown in FIG. It is a figure for demonstrating the size of the frame area of a required touch panel.

Hereinafter, embodiments of the present invention will be described with reference to the drawings.
<First Embodiment>
[Configuration of electronic equipment]
FIG. 1 is a plan view schematically showing an electronic apparatus according to an embodiment of the present invention, and FIG. 2 is a side view of the electronic apparatus shown in FIG.
The electronic device 1 includes a capacitive touch panel 2 and a flexible circuit board (FPC: Flexible Printed Circuits) 3 connected to the touch panel 2. As shown in FIG. 2, the touch panel 2 and the flexible circuit board 3 are connected via an anisotropic conductive film (Anisotropic Conductive Film) or an anisotropic conductive paste (Anisotropic Conductive Paste) 6. Specifically, the terminal 4 formed on the other surface side of the substrate 10 is connected to the anisotropic conductive film 6 provided on the one surface side of the substrate 10 through the through hole 5.

  As shown in FIG. 2, the touch panel 2 includes a substrate 10, a protective coat layer 11 formed on one surface side of the substrate 10, and a protective coat layer 12 formed on the other surface side of the substrate 10. The both sides of the substrate 10 are protected by protective coating layers 11 and 12.

[Configuration of Substrate 10]
FIG. 3 is a plan view, a side view, and a bottom view of the substrate 10 of the touch panel 2.
The substrate 10 includes a substantially rectangular transparent substrate 13 formed by injection molding as will be described later. The transparent substrate 13 is a base material of the substrate 10. As a material of the transparent substrate 13, for example, polycarbonate (PC) acrylic (PMMA), polypropylene (PP), polyethylene terephthalate (PET), and other resins can be used. A plurality of rectangular transparent electrodes 15 arranged in the longitudinal direction of the substrate 10 are formed on the surface 13 </ b> A side of the transparent substrate 13. A rectangular frame-shaped frame region H as a wiring region is formed in the vicinity of the periphery of the region where the transparent electrodes 15 are arranged. A plurality of signal wires 16 and terminals 17 are formed in the frame region H. The signal wiring 16 is connected to the transparent electrode 15 and to the terminal 17.

  On the other surface 13 </ b> B side of the transparent substrate 13, a plurality of rectangular transparent electrodes 19 are arranged in a direction perpendicular to the longitudinal direction of the substrate 10. A rectangular frame-shaped frame region H is formed near the periphery of the region where the transparent electrodes 19 are arranged. In the frame region H, a plurality of signal wires 20 and terminals 4 are formed. The signal wiring 20 is connected to the transparent electrode 19 and to the terminal 4. The plurality of transparent electrodes 15 and the transparent electrode 19 form a plurality of capacitive elements.

4 is a cross-sectional view taken along the line AA ′ of the substrate 10 of the touch panel 2 shown in FIG.
A plurality of concave grooves 22 formed by injection molding are formed on one surface 13A of the transparent substrate 13. The groove 22 is recessed with respect to the one surface 13 </ b> A of the substrate 10. A signal wiring 16 is formed in each groove 22. The signal wiring 16 formed on the innermost side among the plurality of signal wirings 16 is connected to the transparent electrode 15. The other signal wirings 16 are similarly connected to other transparent electrodes 15 not shown in FIG.

  The signal wiring 16 has a width HW and a thickness HT. Specifically, the width HW and the thickness HT are substantially the same length. More specifically, the signal wire 16 has a width TW of 0.05 mm and a thickness HT of 0.05 mm. The width HW and the thickness HT do not have to be the same, and the width and thickness of the signal wiring 16 can be changed as appropriate, and may be made narrower or thicker. The bottom surface and both side surfaces of the signal wiring 16 are in close contact with the concave surfaces (three surfaces P, Q, R) of the concave groove 22. An interval between adjacent grooves 22 is an interval K.

[Method for Manufacturing Electronic Device 1]
Next, a method for manufacturing the electronic device 1 will be described with reference to the drawings.
FIG. 5 is a flowchart showing manufacturing steps of the electronic device 1 shown in FIG. 6 is a diagram illustrating an injection molding process (ST501) of the transparent substrate 13 of the touch panel 2, FIG. 7 is a diagram illustrating a process of forming a transparent electrode film (ST502) on the transparent substrate 13, and FIG. 8 is a transparent electrode. FIG. 9 is a diagram for explaining a step (ST504) of forming the signal wiring 16 in the groove 22 of the transparent substrate 13, and FIG. 10 is a diagram for explaining the step of forming the signal wiring 16 shown in FIG. The figure explaining the detail of the process to perform, FIG. 11 is explanatory drawing of a decoration process (ST505)-FPC connection process (ST508).

  First, as shown in FIG. 6, the transparent substrate 13 is manufactured using an injection mold 25. At this time, the groove 22 in which the signal wiring 16 is formed later and the groove 23 in which the terminal 17 is formed later are simultaneously formed on one surface 13A of the transparent substrate 13, and the signal wiring 20 is formed later on the other surface 13B. A groove (not shown) and a groove (not shown) in which the terminal 4 is formed later are formed simultaneously (ST501). A groove (not shown) in which the signal wiring 20 is formed and a groove (not shown) in which the terminal 4 is formed are grooves having a concave cross section formed at positions corresponding to the signal wiring 20 and the terminal 4, respectively.

  Here, the injection molding (method) is a manufacturing method in which an injection pressure is applied to a plastic resin heated to a softening temperature to fill the injection mold 25, and the shape of the injection mold 25 is accurately transferred. it can.

  In the cooling process after injection molding, primary shrinkage of the plastic resin occurs. It is important to design the injection mold 25 in anticipation of the primary shrinkage during the primary shrinkage. For example, when the primary shrinkage is about 0.5%, the size of the injection mold 25 is 1 / 0.995≈1.005 times the target product size.

  Next, as shown in FIG. 7, using the sputtering apparatus 26, the transparent electrode film 15A is formed in a predetermined region of the transparent substrate 13 substantially corresponding to the display region through the mask 27 (ST502). The transparent electrode film 15A is formed of, for example, a compound of indium oxide and tin oxide (ITO: Indium Tin Oxide) or a compound of indium oxide and zinc oxide. In addition, the formation method of this transparent electrode film 15A is not specifically limited, For example, you may use vacuum processes, such as a vapor deposition method, or may apply | coat. Moreover, instead of ITO described above, a conductive polymer such as ponianiline, vitron (PEDOT), polypyrrole, polythiophene, or polyisothianaphthene may be applied.

  Next, as shown in FIG. 8, a predetermined region of the transparent electrode film 15A is removed by irradiating the transparent electrode film 15A with laser light. Thereby, the transparent electrode film 15A is separated to form a plurality of transparent electrodes 15 (ST503).

  Next, as shown in FIG. 9, by using the stamper 30, the ink that becomes the signal wiring 16 and the terminal 17 is transferred into the groove 22 and the groove 23 of the transparent substrate 13. After that, a predetermined ink curing process is performed. Specifically, the ink curing process is a curing process in accordance with ink curing conditions such as ink heating and ultraviolet irradiation. As a result, the signal wiring 16 is formed in the groove 22, and the terminal 17 is formed in the groove 23 (ST504). At this time, the signal wiring 16 is connected to the transparent electrode 15 and the terminal 17, respectively.

  More specifically, as shown in FIG. 10, the ink 33 is transferred to the groove 22 after the ink 33 is transferred to the convex stamper 30. The transferred ink 33 is leveled in the groove 22 and filled in the groove 22. The filled ink 33 spreads in close contact with the concave surface of the groove 22. In addition, when the electrode penetration of the transparent substrate 13 is required, the hole (through hole 5) formed beforehand is filled with an electrode paste, and this is hardened.

  Next, as shown in FIG. 11, the region corresponding to the frame region H of the substrate 10 is decorated with, for example, black ink 31 (ST505). In addition, a decorating process (ST505) is performed as needed. In this decoration process (ST505), for example, a general printing technique such as screen printing, flexographic printing, gravure printing, film transfer, or the like can be selected.

  Subsequently, the protective coat layer 12 is further formed on the one surface 13A of the transparent substrate 13 (ST506). Thereby, the one surface 13A side of the transparent substrate 13 is covered with the protective coating layer 12. The protective coating layers 11 and 12 are layers for optical characteristics (reflection reduction and glare reduction), scratch protection, and antifouling, and the protective coating layers 11 and 12 may be a single layer or a multilayer and have required characteristics. It is provided together.

  Next, similarly to the one surface 13A side of the transparent substrate 13, the transparent electrode 19, the signal wiring 20, the terminal 4 and the protective coat layer 11 are formed on the other surface 13B side of the transparent substrate 13 (ST507). In addition, the formation process (ST506, ST507) of the protective coat layers 11 and 12 is performed as necessary.

  And the touch panel 2 and the flexible circuit board 3 are connected via the anisotropic conductive film 6 grade | etc.,. Thereby, the electronic device 1 is manufactured (ST508).

[Action etc.]
As described above, according to the present embodiment, since the transparent substrate 13 is injection-molded, the narrow groove 22 having the narrow width HW is accurately and stably formed in the frame region H at the narrow interval K, and the signal wiring 16 is formed in the groove 22. Can be formed. That is, as shown in FIG. 12, the signal wiring 16A having the width W and the thickness T is conventionally formed on the substrate 10B, whereas in the present embodiment, the width HW of the signal wiring 16 and the signal wiring 16 are formed. The interval K can be reduced. As a result, the width of the frame region H where the plurality of signal wirings 16 are formed can be reduced.

  For example, when the signal wiring 16 has a width HW = 0.05 mm, and the signal wiring 16 has an interval K = 0.05 mm, and five signal wirings 16 (total of 10 on both sides of the frame) are formed in the frame region H, the signal wiring The width of the frame area H required for 16 is 0.05 × 5 + 0.05 × 4 = 0.45 mm. In principle, it is possible to form a thinner signal wiring.

  In addition, as shown in FIG. 12, when the signal wiring 16A is formed on one surface of the substrate 10B by a printing method as in the prior art, if the width W of the signal wiring 16A is reduced, the thickness T of the signal wiring 16A is also reduced. There was a problem that the resistance of the wiring 16A increased. On the other hand, in the present embodiment, since the ink is filled in the groove 22 formed in advance, the thickness HT (height) with respect to the width HW of the signal wiring 16 can be increased. A low-resistance signal wiring 16 can be realized. In the case of conventional printing, T / W << 1. On the other hand, in the present embodiment, as shown in FIG. 12, it is possible to make the thickness HT≈the width HW.

  When the signal wiring 16A is formed by the conventional printing method, there is a concern that if the width W of the signal wiring 16A is narrowed, the contact area with the substrate 10B is reduced and the adhesion strength is lowered, and the adhesion strength of the signal wiring 16A is lowered. . In the present embodiment, the signal wiring 16 is provided in close contact with the concave surface (three surfaces P, Q, R) of the groove 22. Thereby, the adhesive force of the signal wiring 16 to the transparent substrate 13 can be improved.

  Conventionally, as shown in FIG. 31, the touch panel 100 is manufactured by bonding two films 106 and 107 together. However, in this embodiment, the transparent electrode 15, the signal wiring 16 and the terminal 17 shown in FIG. 3 are formed on one surface 13A of one transparent substrate 13, and the transparent electrode 19, the signal wiring 20 and the terminal are formed on the other surface 13B. There is no need for bonding. For this reason, the number of manufacturing steps can be reduced, and the touch panel 2 can be thinned.

  FIG. 13 is a diagram for explaining a process of forming the transparent electrode film 15A of the first modification. In addition, after this modification, the same code | symbol is attached | subjected to the structural member similar to the said 1st Embodiment, the description is abbreviate | omitted and it demonstrates centering on a different location.

  In the first embodiment, as shown in FIG. 7, an example in which the transparent electrode film 15A is formed on the one surface 13A of the transparent substrate 13 has been described. On the other hand, in the present modification, a base film 35 is formed on one surface 13A of the transparent substrate 13 instead of forming the transparent electrode film 15A on the one surface 13A of the transparent substrate 13 as compared with the first embodiment. The difference is that the transparent electrode film 15A is formed on the base film 35 via the metal mask 36. As a result, a non-film forming portion 37 in which the transparent electrode film 15 </ b> A is not formed is formed in the base film 35 at a position covered with the metal mask 36.

  As described above, according to this modification, the base film 35 is formed on the one surface 13A of the transparent substrate 13, and the transparent electrode film 15A is formed on the base film 35. Therefore, the adhesion of the transparent electrode film 15A is increased. be able to.

FIG. 14 is a cross-sectional view of the frame region of the transparent substrate of the second modification.
In the first embodiment, as shown in FIG. 4, a plurality of concave grooves 22 recessed from one surface 13 </ b> A are formed in the frame region H of the substrate 10 by injection molding, and the signal wirings 16 are filled in the grooves 22. An example that has been shown. On the other hand, in the present modification, a plurality of convex portions 41 are formed by injection molding so as to protrude in a direction perpendicular to the one surface 13A ′ of the transparent substrate 13 ′. A concave groove 22 ′ is formed between the adjacent convex portions 41. Signal grooves 16A are filled in these grooves 22 ′. The convex portion 41 is located between the signal wirings 16A. The innermost signal wiring 16 </ b> A among the plurality of signal wirings 16 </ b> A is connected to the transparent electrode 15. The other signal wirings 16A are also connected to other transparent electrodes 15 not shown in FIG.

  Thus, according to this modification, since the plurality of convex portions 41 are formed in the region corresponding to the frame region H of the one surface 13A ′ of the transparent substrate 13 ′ by injection molding, the width of the groove 22 ′. HW and the width K ′ of the convex portion 41 can be reduced. Therefore, the frame area H (the width thereof) can be narrowed. Further, since the height HT of the convex portion 41 can be increased, the signal wiring 16A is brought into close contact with the three surfaces of the groove 22 ′ formed by the convex portion 41, thereby improving the adhesive strength of the signal wiring 16A. be able to. Further, the cross-sectional area of the signal wiring 16A can be increased, and the resistance of the signal wiring 16A can be reduced.

FIG. 15 is a diagram illustrating a process of forming the signal wiring 16 of the third modification.
In the first embodiment, the example in which the signal wiring 16 is formed by the stamper 30 has been described. On the other hand, in this modified example, instead of the stamper 30, the ink droplet 51 is introduced into the groove 22 by the inkjet 50, and then the ink is filled into the groove 22 by leveling. Thereby, the signal wiring 16 etc. can be formed in the groove | channel 22 similarly to the said 1st Embodiment.

FIG. 16 is a diagram illustrating a process of forming the signal wiring 16 of the fourth modified example.
In the first embodiment, the example in which the signal wiring 16 is formed by the stamper 30 has been described. On the other hand, in this modified example, instead of the stamper 30, the ink 52 is dropped into the groove 23 where the terminal 17 is formed by the dispenser 55, and the ink 52 is filled into the groove 22 by capillary force. As a result, the terminal 17 can be formed in the groove 23, and the signal wiring 16 can be formed in the groove 22.

  As for the ink supply method shown in FIGS. 9, 15 and 16, it is preferable to select an optimum method according to the viscosity of the ink to be used. Specifically, screen printing, flexographic printing, gravure printing, offset printing, and the like are applicable. After the ink transfer / filling is completed, a curing process is performed in accordance with the ink curing conditions such as heating and ultraviolet irradiation. Further, when it is necessary to penetrate the transparent substrate 13, an electrode paste is filled in a hole (through hole) formed in advance and cured.

<Second Embodiment>
FIG. 17 is a plan view schematically showing an electronic apparatus according to the second embodiment of the present invention, and FIG. 18 is a side view of the electronic apparatus shown in FIG.
[Configuration of electronic equipment]
The electronic device 60 of this embodiment includes a resistive film type touch panel 61 and a flexible circuit board 3 connected to the touch panel 61. A terminal 70 to be described later of the touch panel 61 is connected to an anisotropic conductive film 6A such as ACF through a through hole, and the anisotropic conductive film 6A is connected to a wiring or the like (not shown) of the flexible circuit board 3.

  The touch panel 61 includes a first substrate 62, a second substrate 63, and an adhesive 64 that connects the substrates 62 and 63 to each other.

FIG. 19 is a plan view and vertical and horizontal cross-sectional views of the first substrate 62 of the touch panel 61.
The first substrate 62 includes a rectangular first transparent substrate 58 formed by injection molding. The first transparent substrate 58 is a base material of the first substrate 62. In the central region of the first transparent substrate 58, a substantially rectangular transparent electrode film 65 made of, for example, ITO or the like is formed. The central area of the first transparent substrate 58 substantially corresponds to the display area. A pair of signal wirings 66 connected to the transparent electrode film 65 is formed in a frame region H as a wiring region around the transparent electrode film 65 on one surface 58A of the first transparent substrate 58. The signal wiring 66 is connected to a pair of side edges in the longitudinal direction of the transparent electrode film 65, and is led to the one surface 58 </ b> A side of the first transparent substrate 58 and connected to the terminal 67.

  The thickness TH1 of the first transparent substrate 58 is thinner than the thickness TH2 of the frame region H. That is, as shown in FIG. 19, the first transparent substrate 58 includes a rectangular frame-shaped thick portion 58C at a position corresponding to the rectangular frame-shaped frame region H. That is, the formation surface F1 of the groove 22B in the frame region H of the first transparent substrate 58 protrudes from the formation surface F2 of the transparent electrode film 65 in the display region.

FIG. 20 is a cross-sectional view taken along the line BB ′ of the first substrate 62 shown in FIG.
A concave groove 22 </ b> B is formed at a position corresponding to the frame region H of the one surface 58 </ b> A of the first transparent substrate 58. In the groove 22B, the signal wiring 66 is filled, and the edge portion of the transparent electrode film 65 is extended and disposed. The signal wiring 66 and the transparent electrode film 65 are connected in the groove 22B. The signal wiring 66 has a width HW and a thickness HT. Specifically, the width HW is 0.05 mm and the thickness HT is 0.05 mm. The width HW and the thickness HT are substantially the same length. Note that the width HW and the thickness HT need not be the same. In this embodiment as well, a plurality of convex portions (not shown) protruding from the one surface 58A are formed on the one surface 58A of the first transparent substrate 58 by injection molding, whereby a concave shape is formed between these convex portions. May be formed, and the signal wiring 66 may be disposed in the concave portion.

FIG. 21 is a plan view and vertical and horizontal sectional view of the second substrate 63 of the touch panel 61.
The second substrate 63 includes a rectangular second transparent substrate 59 formed by injection molding. A substantially rectangular transparent electrode film 68 made of, for example, ITO or the like is formed in the central region of the second transparent substrate 59. The region where the transparent electrode film 68 is formed substantially corresponds to the display region. A signal wiring 69 is formed in a frame region H around the transparent electrode film 68 on one surface 59A of the second transparent substrate 59. The signal wiring 69 is connected to a pair of edges of the transparent electrode film 68 parallel to the direction orthogonal to the longitudinal direction of the transparent electrode film 68. The signal wiring 69 is routed on the one surface 59 </ b> A side of the second transparent substrate 59 and connected to the terminal 70. The signal wiring 69 is disposed in a groove formed on one surface 59A of the second transparent substrate 59 by injection molding.

  The thickness TH3 of the second transparent substrate 59 is thinner than the thickness TH4 of the frame region H. That is, as shown in FIG. 21, the second transparent substrate 59 includes a rectangular frame-shaped thick portion 59 </ b> C at a position corresponding to the rectangular frame-shaped frame region H. That is, the formation surface F3 of the frame region H of the second transparent substrate 59 protrudes from the formation surface F4 of the transparent electrode film 68 in the display region. The first transparent substrate 58 and the second transparent substrate 59 are bonded so that the transparent electrode film 65 and the transparent electrode film 68 face each other with a gap therebetween.

[Method for Manufacturing Electronic Device 60]
Next, a method for manufacturing the electronic device 60 according to the second embodiment will be described with reference to the drawings.

  FIG. 22 is a flowchart showing manufacturing steps of the electronic device 60 shown in FIG. 23 is a diagram for explaining the step (ST2201) for manufacturing the first transparent substrate 58, FIG. 24 is a diagram for explaining the step (ST2202) for forming the transparent electrode film 65, and FIG. FIG. 26 is a diagram for explaining the step (ST2207) for joining the first and second substrates 62 and 63. FIG.

  First, as shown in FIG. 23, a first transparent substrate 58 is formed using an injection mold 25A. At this time, the thick portion 58C is formed on the peripheral portion of the first substrate 62, the groove 71 in which the signal wiring 66 is later formed on one surface 58A of the first transparent substrate 58, and the terminal 67 later. A groove 72 is formed (ST2201).

  Next, as shown in FIG. 24, the transparent electrode film 65 is selectively formed in a predetermined region substantially corresponding to the display region through the mask 27 using the sputtering apparatus 26 (ST2202). The transparent electrode film 65 is, for example, ITO (Indium Tin Oxide). At this time, the transparent electrode film 65 enters the groove 71.

  Next, as shown in FIG. 25, the stamper 30 </ b> A is used to transfer the ink to be the signal wiring 66 and the terminal 67 into the groove 71 and the groove 72 of the first transparent substrate 58. The ink is filled in, and then a predetermined ink curing process is performed. Thereby, the signal wiring 66 is formed in the groove 71, and the terminal 67 is formed in the groove 72 (ST2203). At this time, the signal wiring 66 is connected to the transparent electrode film 65 and the terminal 67, respectively.

  Next, similarly to the first transparent substrate 58, the second transparent substrate in which the groove filled with the signal wiring 69 shown in FIG. 21, the groove filled with the terminal 70, and the thick portion 59C are formed by injection molding. 59 is formed (ST2204).

  Subsequently, the transparent electrode film 68 is formed on the second transparent substrate 59 in the same manner as the first substrate 62 (ST2205).

  Next, similarly to the first substrate 62, the signal wiring 69 and the terminal 70 are formed on the one surface 59A side of the second transparent substrate 59 (ST2206). At this time, the signal wiring 69 is connected to the terminal 70 and to the transparent electrode film 68.

  Subsequently, as shown in FIG. 26, the first substrate 62 and the second substrate 63 are bonded under a predetermined pressure bonding condition via an adhesive 64, and a predetermined curing process of the adhesive 64 is performed. Thus, the first substrate 62 and the second substrate 63 are integrated (ST2207). Thereby, the touch panel 61 is manufactured.

  And the touch panel 61 and the flexible circuit board 3 are connected through the anisotropic conductive film 6, for example. Thereby, the electronic device 60 is manufactured (ST2208).

[Action etc.]
As described above, according to the present embodiment, since the first transparent substrate 58 is injection-molded, the groove 22B having a narrow width HW can be accurately and stably formed in the frame region H. For this reason, the signal wiring 66 having a narrow width HW can be formed in the groove 22B. That is, as shown in FIG. 27, the width HW of the signal wiring 66 can be made narrower than in the prior art. As a result, the width of the frame region (width) H in which the signal wiring 66 is formed can be reduced.

  Further, the distance between the inner surface of the first substrate 62 and the inner surface of the second substrate 63 is the difference between the thickness TH3 of the display area of the first substrate 62 and the thickness TH4 of the thick portion 58C. This is determined by the sum of the difference between the thickness TH3 of the display area of the second substrate 63 and the thickness TH4 of the thick portion 59C. The accuracy of the sum of these differences = (TH4-TH3) + (TH4-TH3) depends on the molding accuracy of injection molding. In the present embodiment, the accuracy of the thicknesses TH3 and TH4 of the first transparent substrate 58 and the second transparent substrate 59 can be improved by injection molding. Therefore, the accuracy of the distance between the formation surface F2 of the transparent electrode film 65 of the first substrate 62 and the formation surface F4 of the transparent electrode film 68 of the second substrate 63 can be stabilized. Note that the thicknesses TH3 and TH4 of the first substrate 62 and the second substrate 63 can be changed as appropriate.

  As shown in FIG. 27, when the signal wiring 16A is formed on one surface of the substrate 10B by a printing method as in the prior art, if the width W of the signal wiring 16A is narrowed, the thickness T of the signal wiring 16A is also reduced. There was a problem that the resistance of the wiring 16A increased. On the other hand, in this embodiment, since a method of filling ink into the groove 22B formed in advance is employed, it is possible to increase the thickness HT (height) of the signal wiring 66 with respect to the width HW. As a result, a thin and low resistance signal wiring 66 can be realized. In the case of conventional printing, T / W << 1. On the other hand, in the present embodiment, as shown in FIG. 27, it is possible to make the thickness HT≈the width HW.

  When the signal wiring 16A is formed by the conventional printing method, there is a concern that if the width W of the signal wiring 16A is narrowed, the contact area with the substrate 10B is reduced and the adhesion strength is lowered, and the adhesion strength of the signal wiring 16A is lowered. . In the present embodiment, the signal wiring 66 is provided in close contact with the concave surface (three surfaces P, Q, R) of the groove 22B. Thereby, the adhesive force of the signal wiring 66 to the first transparent substrate 58 can be improved. The second transparent substrate 59 has the same effect as the first transparent substrate 58.

  Conventionally, as shown in FIG. 32, a spacer material 117 has been required to integrate the two films 115 and 116. Since the spacer material 117 is a thin film, its shape cannot be easily maintained if the width is narrowed. For this reason, it is difficult to reduce the width of the spacer material 117. However, in the second embodiment, since the first substrate 62 and the second substrate 63 include the thick portions 58C and 59C, respectively, the spacer material 117 is not necessary. What is necessary is just to integrate the 1st board | substrate 62 and the 2nd board | substrate 63 through the adhesive agent 64. FIG. For this reason, the width of the thick portions 58C and 59C located at the outer peripheral edge portions of the first substrate 62 and the second substrate 63 can be reduced, and as a result, the width of the frame region H can be reduced.

  Conventionally, as shown in FIG. 32, it was necessary to bond three parts of the films 115 and 116 and the spacer material 117. In the present embodiment, the first substrate 62 and the second substrate 63 These two parts may be connected via the adhesive 64. That is, the number of components required for manufacturing the touch panel 61 can be reduced. As a result, it is possible to reduce the influence of the positional accuracy variation of each component, and the frame region H can be further narrowed, and the bonding process can be simplified.

FIG. 28 is a diagram for explaining a process for forming a transparent electrode film according to a fifth modification.
In the first embodiment, as shown in FIG. 7, an example in which the transparent electrode film 15A is formed on the one surface 13A of the transparent substrate 13 has been described. On the other hand, in this modification, instead of forming the transparent electrode film 15A on the one surface 13A of the transparent substrate 13, the base film 35A is formed on the one surface 58E of the transparent substrate 58D, as compared with the first embodiment. The difference is that the transparent electrode film 65 is formed on the base film 35A via the mask 36A. The base film 35A is formed over the entire surface 58E of the transparent substrate 58D. On the base film 35A, the transparent substrate 58D is formed from a thin part to a part of the thick part. In the base film 35A, a non-film forming portion 37A where the transparent electrode film 65 is not formed is formed at a position covered with the mask 36A.

  Thus, according to this modification, the base film 35A is formed on the one surface 58E of the transparent substrate 58D, and the transparent electrode film 65 is formed on the base film 35A. For this reason, the adhesive force of the transparent electrode film 65 can be increased.

  The present invention is not limited to the above-described embodiments and modifications, and it is needless to say that various updates can be added without departing from the gist of the present invention.

  For example, in the first embodiment, as shown in FIG. 8, by irradiating the transparent electrode film 15A with laser light, a predetermined region of the transparent electrode film 15A is removed, and the transparent electrode film 15A is separated, The example which forms the some transparent electrode 15 was shown. However, the present invention is not limited to this. For example, the transparent electrode film 15A may be separated by etching or the like.

FIG. 29 is a diagram showing an alignment process of a substrate constituting the touch panel of the sixth modified example.
In the second embodiment, as shown in FIG. 26, the thick portion 58C of the first substrate 62 and the thick portion 59C of the second substrate 63 are aligned and connected by the adhesive 64. showed that. However, the present modification is different in that it includes means for guiding the first substrate 80 and the second substrate 81 to predetermined positions when the first substrate 80 and the second substrate 81 are aligned. .

  Specifically, as shown in FIG. 29, the first substrate 80 includes a thick portion 80C at the outer peripheral edge portion, and the second substrate 81 includes a thick portion 81C at the outer peripheral edge portion. The thick portion 80C of the first substrate 80 includes an alignment convex portion 83 on the surface facing the thick portion 81C during alignment. The alignment convex portion 83 is formed to project toward the thick portion 81C. The thick portion 81C of the second substrate 81 is formed with an alignment concave portion 84 into which the alignment convex portion 83 is fitted during alignment.

  The alignment convex portion 83 of the thick portion 80C of the first substrate 80 is accurately formed simultaneously with the thick portion 80C by injection molding. Further, the concave portion 84 for alignment of the thick portion 81C of the second substrate 81 is formed with high precision simultaneously with the thick portion 81C and the like by injection molding.

  As described above, according to the present modification, when the first substrate 80 and the second substrate 81 are aligned, the alignment convex portion 83 of the first substrate 80 is replaced with the second substrate 81. Can be fitted and aligned in the concave portion 84 for alignment.

  Further, it is possible to form the alignment convex portion 83 simultaneously with the thick portion 80C and the like by injection molding, and similarly form the alignment concave portion 84 simultaneously with the thick portion 81C and the like by injection molding. Therefore, the alignment convex part 83 may be formed simultaneously with the injection molding process of the first substrate 80, or the alignment concave part 84 may be formed simultaneously with the injection molding process of the second substrate 81. it can.

  In this modification, an example in which one alignment convex portion 83 is formed on the first substrate 80 and one alignment concave portion 84 is formed on the second substrate 81 is shown. However, the shape, the formation position, and the number of the alignment convex portion 83 and the alignment concave portion 84 are not limited to this as long as the shapes fit with each other at the time of alignment. In addition, after the first substrate 80 and the second substrate 81 are aligned, the first substrate 80 and the second substrate 81 can be joined by, for example, ultrasonic welding or thermocompression bonding. .

FIG. 30 is a cross-sectional view showing the configuration of the touch panel of the seventh modified example.
In the second embodiment, as shown in FIG. 26, the first substrate 62 having a rectangular frame-shaped thick portion 58C at the outer peripheral edge and the rectangular frame-shaped thick portion 59C at the outer peripheral edge. The example which joined the 2nd board | substrate 63 provided with the adhesive agent 64 was shown. However, in this modification, a flat transparent substrate or transparent film in which a thick portion is not formed on the outer peripheral edge is used for one of the first substrate 62 and the second substrate 63. Is different. In this modification, for example, as shown in FIG. 30, a flat substrate (or film) 62 ′ and secondly the substrate 63 are joined by an adhesive (not shown). That is, the outer peripheral edge portion of the substrate (or film) 62 ′ and the thick portion 59 </ b> C of the second substrate 63 are joined by an adhesive or the like (not shown).

  As described above, in the present modification, the thickness of the thick portion 59C of the second substrate 63 formed by injection molding can be accurately manufactured, as in the second embodiment. Therefore, a touch panel having a thickness different from that of the second embodiment can be manufactured with high accuracy.

H Frame area 1, 60 Electronic device 2, 61 Touch panel 10 Substrate 13, 58D Transparent substrate 13A, 58A, 59A One side 13B Other side 15, 19 Transparent electrode 16, 20, 66, 69 Signal wiring 22, 22 ′, 22B, 23 , 71 Grooves 25, 25A Injection mold 35A ... Base film 41 Convex part 58 First transparent substrate 58C, 59C, 80C, 81C Thick part 59 Second transparent base material 62, 80 First substrate 63, 81 Second substrate 83 Convex part for alignment 84 Concave part for alignment F1 to F4 Forming surface

Claims (12)

A first transparent substrate formed by injection molding and having a first groove on a first surface;
A first wiring provided in the first groove;
A touch panel comprising: a first transparent electrode provided on the first surface of the first transparent substrate and connected to the first wiring. The touch panel according to claim 1,
The first transparent substrate has a first display area provided with the first transparent electrode, and a first wiring area around the first display area,
The first groove is formed in the first wiring region. The touch panel according to claim 2,
The first transparent substrate further includes a second groove on a second surface opposite to the first surface,
The touch panel
The second wiring provided in the second groove;
A touch panel further comprising: a second transparent electrode provided on the second surface of the first transparent substrate and connected to the second wiring. The touch panel according to claim 3,
The first groove is formed by a plurality of first protrusions protruding from the first surface, and the second groove is formed by a plurality of second protrusions protruding from the second surface. Formed touch panel. The touch panel according to claim 2,
A second transparent substrate formed by injection molding and having a third groove on the third surface;
The second transparent substrate has a second display area provided with the second transparent electrode, and a second wiring area around the second display area,
The groove forming surface of at least one of the wiring regions of the first transparent substrate and the second transparent substrate protrudes from the transparent electrode forming surface of the display region,
The first transparent substrate and the second transparent substrate are formed such that the first transparent electrode and the second transparent electrode face each other with a gap therebetween. Touch panel combined in the wiring area. The touch panel according to claim 5,
The first groove is formed by a plurality of first protrusions protruding from the first surface, and the third groove is formed by a plurality of third protrusions protruding from the third surface. Formed touch panel. Injection-molding a first transparent substrate having a first groove on a first surface;
Forming a first transparent electrode in a region different from the first groove on the first surface of the first transparent substrate;
A method for manufacturing a touch panel, wherein the first transparent electrode and the first wiring are connected by providing a first wiring in the first groove. It is a manufacturing method of the touch panel according to claim 7,
A method for manufacturing a touch panel, wherein the first groove is formed in a first wiring region around a first display region provided with the first transparent electrode of the first transparent substrate during the injection molding. It is a manufacturing method of the touch panel according to claim 8,
During the injection molding, a second groove is formed on the second surface opposite to the first surface of the first transparent substrate,
Providing the second wiring in the second groove;
A method for manufacturing a touch panel, wherein a second transparent electrode is provided on the second surface of the first transparent substrate so as to be connected to the second wiring. It is a manufacturing method of the touch panel according to claim 9,
At the time of the injection molding, the first grooves are formed by forming the plurality of first protrusions protruding from the first surface, and the plurality of second protrusions protruding from the second surface A method for manufacturing a touch panel, in which the second groove is formed by forming. It is a manufacturing method of the touch panel according to claim 8,
By forming the second transparent electrode on the second transparent electrode, the third groove forming surface of the second wiring region around the second display region on which the second transparent electrode of the second transparent substrate is provided is formed as the second transparent electrode forming surface. Formed to protrude from the
The first transparent substrate and the second transparent substrate in the first wiring region and the second wiring region such that the first transparent electrode and the second transparent electrode face each other with a gap therebetween. A method for manufacturing a touch panel. It is a manufacturing method of the touch panel according to claim 11,
At the time of injection molding of the first transparent substrate, the first groove is formed by forming a plurality of first protrusions protruding from the first surface, and the injection molding of the second transparent substrate. Sometimes, the third groove is formed by forming a plurality of second protrusions protruding from the third surface. A method of manufacturing a touch panel.

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