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WO2012081573A1 - 銅合金及び銅合金の製造方法 - Google Patents

銅合金及び銅合金の製造方法 Download PDF

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WO2012081573A1
WO2012081573A1 PCT/JP2011/078786 JP2011078786W WO2012081573A1 WO 2012081573 A1 WO2012081573 A1 WO 2012081573A1 JP 2011078786 W JP2011078786 W JP 2011078786W WO 2012081573 A1 WO2012081573 A1 WO 2012081573A1
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Prior art keywords
mass
copper alloy
phase
strength copper
strength
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PCT/JP2011/078786
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English (en)
French (fr)
Japanese (ja)
Inventor
石田　清仁
貝沼　亮介
郁雄 大沼
大森　俊洋
宮本　隆史
佐藤　宏樹
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国立大学法人東北大学
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Application filed by 国立大学法人東北大学 filed Critical 国立大学法人東北大学
Priority to EP11848127.4A priority Critical patent/EP2653574B1/en
Priority to KR1020137015270A priority patent/KR101576715B1/ko
Priority to US13/993,642 priority patent/US20130333812A1/en
Priority to CN201180059926.2A priority patent/CN103328665B/zh
Priority to JP2012548789A priority patent/JP5743165B2/ja
Publication of WO2012081573A1 publication Critical patent/WO2012081573A1/ja

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    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/02—Alloys based on copper with tin as the next major constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/01—Alloys based on copper with aluminium as the next major constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/04—Alloys based on copper with zinc as the next major constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/05—Alloys based on copper with manganese as the next major constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/06—Alloys based on copper with nickel or cobalt as the next major constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
    • H01B1/026—Alloys based on copper

Definitions

  • the present invention relates to a high-strength, high-conductivity copper alloy applied to lead frames, connectors, terminal materials, etc. for electrical and electronic equipment, and a copper alloy manufacturing method for manufacturing this copper alloy.
  • age-hardening copper alloys are made by subjecting a supersaturated solid solution that has undergone solution treatment to fine precipitation of fine particles to improve strength properties such as proof stress or spring limit values and reduce the amount of solid solution elements. It is a copper alloy that contributes to the improvement of the rate. Therefore, age-hardening type copper such as Cu—Ni—Si based alloy (Corson) and beryllium copper are examples of materials that satisfy increasingly demanding requirements for weight reduction of electronic devices and parts and higher strength of materials. An alloy is used.
  • Ni is 1.0 to 5.0 mass%
  • Si is 0.2 to 1.0 mass%
  • Zn is 1.0 to 5.0 mass%
  • Sn is 0.1 to 0 mass%.
  • a copper alloy material containing 0.5 mass%, P 0.003 to 0.3 mass%, and the balance being Cu and inevitable impurities, 1.3 to 1.7 times the intended final plate thickness A first cold rolling step in which the material is cold-rolled to a thickness of 1 mm, the first cold-rolled material is heated to 700 to 900 ° C., and then cooled to 300 ° C. or lower at a temperature drop rate of 25 ° C. or more per minute.
  • Heat treatment step a second cold rolling step in which the material after the first heat treatment is cold-rolled to the final plate thickness, and the material after the second cold-rolling is heated to 400 to 500 ° C. for 30 minutes to 10 minutes.
  • Second heat treatment step for holding time, and heating the material after the second heat treatment at 400 to 550 ° C. for 10 seconds to 3 minutes while applying tension in the longitudinal direction Copper alloy material for lifting is disclosed.
  • the manufacturing process becomes complicated, and it is difficult to reduce the manufacturing cost.
  • Patent Document 2 contains Ni: 1.0 to 4.5% by mass, Si: 0.50 to 1.2% by mass, Cr: 0.0030 to 0.3% by mass (provided that Ni and The weight ratio of Si is 3 ⁇ Ni / Si ⁇ 5.5)), a copper alloy composed of the remainder Cu and inevitable impurities, and the size dispersed in the material is 0.1 ⁇ m or more and 5 ⁇ m or less
  • a Cr—Si compound a copper alloy for electronic materials is described in which the atomic concentration ratio of Cr to Si in the dispersed particles is 1 to 5 and the dispersion density is 1 ⁇ 10 6 pieces / mm 2 or less. Yes.
  • Patent Document 7 includes Ni1 to 3 mass% and Ti 0.2 to 1.4 mass%, and the ratio of mass percentage of Ni and Ti (Ni / Ti) is 2.2 to 4.7, and Mg and A copper alloy containing 0.02 to 0.3 mass% and Zn 0.1 to 5 mass% in combination with one or both of Zr, with the balance being Cu and inevitable impurities, and a metal consisting of Ni, Ti, and Mg
  • a copper alloy for electrical and electronic equipment which is ⁇ 10 13 pieces / mm 2 .
  • the present invention has been made in view of the above-mentioned problems, and the problem is to provide a copper alloy having excellent workability even with high strength and a method for producing such a copper alloy. Is to provide. Moreover, it is providing the copper alloy which can control the characteristic which is excellent in workability even if it is these high intensity
  • the inventors have studied to obtain a high-strength copper alloy.
  • Ni 3 Al is contained in the matrix phase of the FCC structure.
  • L1 2 structure be of gamma 'phase finely precipitated was found to be effective. Furthermore, it was found that the strength was further increased by adding Si.
  • the copper alloy of the present invention contains Ni: 3.0 to 29.5% by mass, Al: 0.5 to 7.0% by mass, Si: 0.1 to 1.5% by mass, with the balance being A copper alloy having an FCC structure composed of Cu and inevitable impurities, wherein a ⁇ ′ phase of Ni 3 Al containing Si and having an L1 2 structure is precipitated with an average particle diameter of 100 nm or less in the parent phase of the copper alloy. It is characterized by.
  • the copper alloy of the present invention further includes Ni: 3.0 to 14.0% by mass, Al: 0.5 to 4.0% by mass, Si: 0.1 to 1.5% by mass, In addition, the electrical conductivity is 8.5 IACS% or more.
  • the copper alloy of the present invention is further characterized by having a cold workability of 10 to 95%.
  • the copper alloy of the present invention further includes Ni: 9.5 to 29.5 mass%, Al: 1.5 to 7.0 mass%, Si: 0.1 to 1.5 mass%, And Vickers hardness is 220 Hv or more, It is characterized by the above-mentioned.
  • the copper alloy of the present invention further includes, as an additive element, one or more elements selected from the group consisting of Co, Ti, Sn, Cr, Fe, Zr, Mg, and Zn in a total amount of 0.01. It is characterized by containing ⁇ 5.0% by mass. Further, the copper alloy of the present invention further contains, as an additive element, 0.001 to 0.5 mass% in total of one or more elements selected from the group consisting of C, P and B.
  • the method for producing a high-strength copper alloy according to the present invention is as follows. After hot-melting and cold-working as a unit, heat treatment is performed at 700 to 1020 ° C. for 0.1 to 10 hours, and thereafter Aging at 400 to 650 ° C. for 0.1 to 48 hours.
  • the method for producing a high-strength copper alloy of the present invention is further characterized by performing cold working with a working rate of 10 to 95% before or after the aging treatment.
  • the lower side is a photograph of a transmission electron microscope showing the state of the precipitate.
  • the copper alloy of the present invention contains Ni: 3.0-29.5 mass%, Al: 0.5-7.0 mass%, Si: 0.1-1.5 mass%, with the balance being Cu and a copper alloy of the FCC structure comprising a inevitable impurities, wherein the copper mother phase of the alloy, the average particle size of at 100nm or less, gamma 'phase of the L1 2 structure Ni 3 Al containing Si is precipitated Yes.
  • the L1 2 structure may then be confirmed in the array structure of the electron beam diffraction image.
  • FIG. 1 is a transmission electron microscope photograph showing the crystal structure LI 2 of the precipitate by electron diffraction on the upper side and the state of the precipitate on the lower side.
  • This photograph shows a composition of Ni: 12.3 mass% -Al: 1.0 mass% -Si: 0.3 mass% -Cu, solution treatment: 900 ° C. for 10 minutes—cold working 30% — Aging treatment is performed at 500 ° C. for 6 hours.
  • electron diffraction is intended for a regular phase having a diffractive surface 110. That is, the ⁇ ′ phase is an intermetallic compound, and has an ordered FCC structure in which atoms located at corners are Al and Si, and atoms located at the face center are Ni.
  • gamma 'phase of the L1 2 structure are finely precipitated in the lower photograph of Fig.
  • the copper alloy of the present invention is a copper alloy having an FCC structure.
  • the FCC structure is a structure in which metal elements are stacked most closely, and is suitable as a matrix alloy having high strength and high conductivity. Therefore, copper having an FCC structure is excellent in workability and can easily be produced in a desired shape.
  • the copper alloy of the present invention contains Ni: 3.0 to 29.5 mass%, Al: 0.5 to 7.0 mass%, Si: 0.1 to 1.5 mass%, and has high strength.
  • Ni and Al precipitate a Ni 3 Al intermetallic compound in the parent phase Cu to form a ⁇ ′ phase. Furthermore, since Al and Si together with Ni form an Ni 3 (Al, Si) intermetallic compound, both Al and Si need to be combined with this system in an amount, and Ni 3 Al, rather than a single system of Ni 3 Si, 1 single Ni 3 (Al, Si) while mixing in a corner of the FCC structure in L1 2 type and forms an intermetallic compound.
  • Gamma 'phase having an L1 2 structure in the copper alloy of the present invention is an intermetallic compound, atom Al and Si which is located in the corner, the atoms located in the face-centered are FCC structure that is ordered is Ni .
  • L1 2 structure gamma 'phase belongs to GCP (Geometrically close packing) phase, ductile due to its close-packed structure, a microstructure for further high consistency gamma'
  • GCP Geometrically close packing
  • ductile due to its close-packed structure
  • a tough copper alloy with high workability can be obtained by having a ⁇ + ⁇ ′ structure in which phases are precipitated.
  • This ⁇ ′ phase is spherical and precipitates finely in a ⁇ phase mainly composed of copper as a parent phase.
  • the ⁇ ′ phase is spherical, a tough and highly workable copper alloy can be obtained without stress concentration at the interface between the ⁇ ′ phase and the ⁇ phase. Further, the strength can be further improved by controlling the average particle size of the ⁇ ′ phase to be small. By reducing the average particle size of the ⁇ ′ phase, the pinning sites of dislocations that move are increased, and high tensile strength can be obtained. Furthermore, the ⁇ ′ phase is an intermetallic compound, and has high hardness and high tensile strength. Therefore, by preventing the dislocation from moving in the ⁇ ′ phase, it is possible to contribute to the hardness and tensile strength of the copper alloy.
  • the conductivity decreases as the concentration of the solute element that dissolves in copper increases.
  • the electrical conductivity is precipitated at a low temperature to precipitate the ⁇ ′ phase. Since the concentration of the solute element decreases, the precipitation of the ⁇ ′ phase also contributes to the improvement of conductivity. Note that the conductivity of the ⁇ ′ phase is lower than that of pure Cu, so that the movement of electrons is reduced by the proportion of the volume occupied by the ⁇ ′ phase. High conductivity can be maintained by setting the area fraction.
  • the second phase has a large contribution to mechanical properties such as hardness and tensile strength without greatly impairing ductility such as cold workability, and has the effect of improving conductivity.
  • the ⁇ 'phase is suitable.
  • the area fraction of the ⁇ ′ phase is preferably 5 to 40%. This area fraction can be obtained by comparing the areas of the respective metallographic structures of a cross-section with a copper alloy. In general, the area fraction and the volume fraction have the same volume if the two cut-off areas are the same when the two solids are cut by a plane parallel to a certain plane according to the Cavalieri principle. Therefore, this area fraction can be regarded as a volume fraction.
  • the area fraction can be measured with a metal microscope, an electron microscope (SEM, TEM), EPMA (X-ray analyzer) or the like.
  • the average particle size of the ⁇ ′ phase is preferably 100 nm or less. A smaller value is more preferable, but it is difficult to control the practical precipitation size to be finer than 1 nm because of coarsening by heat treatment, and sufficient strength can be obtained if it is 1 nm or more and 100 nm or less.
  • the average particle diameter of the ⁇ ′ phase can be obtained by measuring the diameters of a plurality of ⁇ ′ phases by image analysis based on observation of the structure with an electron microscope and averaging them.
  • intermetallic compounds such as Ni 2 (Al, Si), NiAl, and Ni 5 Si 2 other than the ⁇ ′ phase of the Ni 3 Al intermetallic compound are precipitated by the added Ni, Al, and Si.
  • Ni 2 (Al, Si) is less precipitated than Ni 3 (Al, Si), and has little influence on the mechanical properties and electrical properties of the copper alloy.
  • a ⁇ -phase intermetallic compound represented by NiAl is deposited. This ⁇ phase has a B2 structure of BCC ordered structure, but the composition range to be precipitated is narrow, and even if precipitated, the amount is smaller than that of Ni 3 (Al, Si), and the mechanical properties and electrical properties of the copper alloy The effect on properties is small.
  • an intermetallic compound of Ni 5 Si 2 may be precipitated.
  • This Ni 5 Si 2 is also less precipitated than Ni 3 (Al, Si), and has little influence on the mechanical properties and electrical properties of the copper alloy.
  • a large number of these intermetallic compounds other than the ⁇ ′ phase of Ni 3 (Al, Si) are precipitated, which gives the mechanical properties and electrical properties of the copper alloy, but Ni 3 (Al, Si) or more. It does not affect.
  • the copper alloy of the present invention is formed after all these precipitates are combined.
  • the ⁇ ′ phase becomes an intermetallic compound of Ni 3 (Al, Si), and is excellent in strength and electrical conductivity as compared with Ni 3 Al alone.
  • the copper alloy of the present invention has a composition range including Ni: 3.0 to 14.0% by mass, Al: 0.5 to 4.0% by mass, and Si: 0.1 to 1.5% by mass.
  • the conductivity is 8.5 IACS% or more.
  • the conductivity can be made 8.5 IACS% or more.
  • it is applied as a copper alloy having high conductivity to lead frames, connectors, terminal materials and the like of electronic devices.
  • the copper alloy of the present invention can have a cold workability of 10 to 95% by making the ⁇ ′ phase of 100 nm or less within this composition range.
  • Cold workability is defined as the maximum reduction rate of thickness that can be rolled without cracking without annealing in the case of rolling performed at a temperature of 20 ° C., and in the case of wire drawing, elongation without cracking without annealing.
  • the maximum area reduction rate that can be drawn is defined. Since the workability of the Ni 3 (Al, Si) intermetallic compound in the ⁇ ′ phase is lower than that of pure Cu, the processing rate is increased by an amount corresponding to the volume ratio occupied by the Ni 3 (Al, Si) intermetallic compound. I can't make it bigger.
  • the cold workability can be made 10 to 95% while maintaining high electrical conductivity. If the cold workability is less than 10%, there is a problem that a material having a target shape cannot be produced. If the cold workability exceeds 95%, there is a problem that the burden on the equipment is large. Therefore, the cold workability is preferably in the range of 10 to 95%, more preferably 20 to 90%. By setting the cold workability to 10 to 95%, it is applied as a copper alloy having high strength to lead frames, connectors, terminal materials and the like of electronic devices.
  • high conductivity and high cold workability can be obtained by setting the volume fraction in which the ⁇ ′ phase precipitates in the range of the region A to 5 to 20%.
  • a conductivity of approximately 10 to 25 IACS% can be obtained, and a cold workability of 10 to 95% can be obtained. At most, wear can be reduced. Therefore, it can be applied to a lead frame, a connector, a terminal material, etc., such as an electronic device, as a copper alloy having high conductivity and high cold workability.
  • the copper alloy of the present invention includes Ni: 9.5 to 29.5 mass%, Al: 1.5 to 7.0 mass%, Si: 0.1 to 1.5 mass%, and Vickers hardness is in the range of 220 to 450 Hv.
  • Vickers hardness can be increased by increasing the volume and area occupied by the ⁇ ′ phase by adding a high amount of Ni.
  • the volume fraction at which the ⁇ ′ phase precipitates is set to 20 to 40%, it is possible to contribute to the strength represented by Vickers hardness against copper.
  • the average particle diameter of the ⁇ ′ phase is preferably 100 nm or less as described above.
  • the copper alloy of the present invention can obtain a conductivity of approximately 7 to 15 IACS% in this composition range, it has a high Vickers hardness, so that it can be used in lead frames and connectors for electronic devices and the like. Even when applied to terminal materials, etc., there is little wear, durability is good, and it can withstand long-term use.
  • the copper alloy of the present invention can have a high strength expressed by Vickers hardness by setting the volume fraction in which the ⁇ ′ phase is precipitated to 25 to 40% within the range of the region B. This is due to the fact that the ⁇ 'phase is an intermetallic compound and the altitude is very high.
  • the present invention can be widely applied to lead frames, connectors, terminal materials, etc. for electronic devices.
  • the copper alloy of the present invention further includes, as an additive element, one or more elements selected from the group consisting of Co, Ti, Sn, Cr, Fe, Zr, Mg, and Zn in a total amount of 0.01. Up to 5.0% by weight can be included.
  • Co, Ti, Cr and Zr contribute to improving the strength in order to stabilize the ⁇ 'phase and promote precipitation, and also contribute to improving the conductivity because of the effect of reducing the concentration of solute elements in Cu.
  • Sn, Mg, and Zn are effective in improving the stress relaxation resistance, and contribute to improving the strength because they are dissolved in Cu.
  • Fe is effective in making crystal grains fine by dispersing fine grains of Fe in Cu, and contributes to improvement in strength and heat resistance.
  • the addition amount of the additive element is such that the selected one or more additive elements contain a total amount of 0.01 to 5.0 mass%.
  • the selected one or two or more additive elements are less than 0.01% by mass in total, there is a problem that the copper alloy does not contribute to improvement in conductivity and strength.
  • the total amount of additive elements exceeds 5.0% by mass, it contributes to improvement in electrical conductivity and strength, but electrical properties such as electrical conductivity and mechanical properties such as Vickers hardness are within an appropriate range. There is a problem that it becomes impossible to control.
  • the copper alloy of the present invention may further contain 0.001 to 0.5% by mass in total of one or more elements selected from the group consisting of C, P and B as additive elements.
  • C is considered to be effective in making crystal grains finer and contributes to the improvement of strength.
  • P is used as a deoxidizer and has the effect of reducing the concentration of Cu impurities, contributing to an improvement in conductivity.
  • B has an effect of suppressing crystal grain growth, it is effective to improve the strength by miniaturization. Heat resistance can be improved.
  • the added amount is such that the selected one or more added elements contain 0.001 to 0.5 mass% in total.
  • the total amount of additive elements is less than 0.001% by mass, there is a problem in that the copper alloy does not contribute to improvement of conductivity and strength.
  • the total amount of additive elements exceeds 0.5 mass%, it contributes to improvement of electrical conductivity and strength, but electrical properties such as electrical conductivity and mechanical properties such as Vickers hardness are within an appropriate range. There is a problem that it becomes impossible to control.
  • thermoforming a copper alloy of the present invention after integrally melt-mixing and casting, hot working such as hot forging, and cold rolling such as cold rolling and cold drawing as necessary. Formed into shapes such as plate, wire, and tube by processing. Next, heat treatment is performed at 700 to 1020 ° C. for 0.1 to 10 hours, followed by aging treatment at 400 to 650 ° C. for 0.1 to 48 hours.
  • the method for producing a copper alloy of the present invention comprises: (a) Ni: 3.0-29.5 mass%, Al: 0.5-7.0 mass%, Si: 0.1-1.5 mass%, and Cu And a step of forming a copper alloy material as an ingot by hot-melting and mixing, and (b) forming the copper alloy material at a temperature of 700 ° C. to 1020 ° C. And (c) a copper alloy material after the solution treatment at a temperature range of 400 ° C. to 650 ° C. for 0.1 to 48 hours. And an aging treatment for heating in the range.
  • the melt mixing uses, for example, a deoxidizer such as calcium boride, or a bubbling process using argon gas or nitrogen gas, or a vacuum vessel.
  • the melting may be performed in a vacuum.
  • the melting method is not particularly limited, and may be heated to a temperature equal to or higher than the melting point of the copper alloy raw material using a known apparatus such as a high-frequency melting furnace.
  • the copper alloy material is heat-treated at a temperature range of 700 to 1020 ° C. for 0.1 to 10 hours. This achieves a solid solution in which the added alloy elements are uniformly homogenized without segregation in the Cu matrix.
  • the heating method is not particularly limited and may be performed according to a known method.
  • the copper alloy material is aged at 400 to 650 ° C. for 0.1 to 48 hours. If it is less than 400 ° C. and / or less than 0.1 hour, the ⁇ ′ phase cannot be precipitated. If the temperature exceeds 650 ° C. and / or exceeds 48 hours, the ⁇ ′ phase grows, and the average particle size exceeds 100 nm, resulting in a problem that desired conductivity and processing rate cannot be obtained. Therefore, in order to obtain a desired conductivity and hardness, such an aging treatment is an essential requirement.
  • the method for producing a high-strength copper alloy of the present invention is further characterized by performing cold working of 10 to 95% before or after the aging treatment.
  • the method for producing a high-strength copper alloy of the present invention includes, in addition to the above-described production steps, further (d) a step of cold-working the copper alloy material by 10 to 95% before or after the aging treatment Is provided.
  • the average particle size of the ⁇ ′ phase can be made 100 nm or less, the temperature of the aging treatment can be lowered, and the time can be shortened.
  • the method of cold working is not particularly limited, and may be performed by a known method such as rolling with a roller. Further, by cold working the copper alloy material after the aging treatment, dislocations, stacking faults, and the like can be introduced and work hardened, so that the strength can be increased. At this time, the processing rate is in the range of 10 to 95%. When the processing rate is less than 10%, the introduction of defects is small, and the above processing effect cannot be obtained sufficiently.
  • low temperature aging may be performed in the range of 100 to 400 ° C. in order to impart springiness.
  • the method of low temperature aging is not particularly limited and can be performed according to a known method. Since such a copper alloy obtained by the production method, the 'while suppressing coarsening of phase, a sufficient amount of fine gamma' gamma the L1 2 structure precipitated in the copper alloy can be precipitated phase, Electrical characteristics such as electrical conductivity, cold workability, and mechanical characteristics such as Vickers hardness can be easily controlled.
  • Copper alloy No. 1 to 57 Within the range of the copper alloy of the present invention, the copper alloy materials having the compositions of Examples 1 to 57 were put together in a high-frequency induction melting furnace, melted and melt-mixed. This was used as a casting ingot (as-cast).
  • the heat treatment conditions are typical production conditions: hot rolling (900 ° C., reduction rate 90%) — solution treatment (900 ° C., 10 minutes) —cold rolling (20 ° C., reduction rate 30%) — aging precipitation treatment (500 ° C., 18 hours).
  • hot rolling 900 ° C., reduction rate 90%
  • solution treatment 900 ° C., 10 minutes
  • cold rolling 20 ° C., reduction rate 30%
  • aging precipitation treatment 500 ° C., 18 hours.
  • the electrical conductivity, workability, and Vickers hardness in each composition at this time are shown.
  • Table 4 shows the electrical conductivity and Vickers hardness under the respective production conditions in Table 3 using copper alloys having compositions of 16 to 23. (Results of conductivity and Vickers hardness under manufacturing conditions) As can be seen from Table 4, the electrical conductivity was 8.5 IACS% or more and the Vickers hardness was 220 Hv or more except for heat treatment conditions 1, 5, 12, and 13.
  • Copper alloy No. 58-70 Copper alloy No. 58-70
  • an additive element was added.
  • the copper alloy materials having the compositions of Examples 58 to 70 were put together in a high frequency induction melting furnace, melted and melt mixed. This was used as a casting ingot (as-cast).
  • the heat treatment conditions are typical production conditions: hot rolling (900 ° C., reduction rate 90%) — solution treatment (900 ° C., 10 minutes) —cold rolling (20 ° C., reduction rate 30%) — aging precipitation treatment (500 ° C., 18 hours).
  • hot rolling 900 ° C., reduction rate 90%
  • solution treatment 900 ° C., 10 minutes
  • cold rolling 20 ° C., reduction rate 30%
  • aging precipitation treatment 500 ° C., 18 hours.
  • the electrical conductivity and Vickers hardness in each composition at this time are shown.
  • the electrical conductivity is 8.5 IACS% in all the heat processing conditions that require aging treatment other than the heat processing conditions 1, 5, 12, and 13.
  • the Vickers hardness was 220 Hv or more.
  • the heat treatment conditions are typical production conditions: hot rolling (900 ° C., reduction rate 90%) — solution treatment (900 ° C., 10 minutes) —cold rolling (20 ° C., reduction rate 30%) — aging precipitation treatment (500 ° C., 18 hours).
  • the electrical conductivity and Vickers hardness in each composition at this time are shown.
  • the electrical conductivity is 8.5 IACS% in all of the heat treatment conditions that require the aging treatment other than the heat treatment conditions 1, 5, 12, and 13. That's it.
  • the Vickers hardness was 220 Hv or more.
  • the heat treatment conditions are typical production conditions: hot rolling (900 ° C., reduction rate 90%) — solution treatment (900 ° C., 10 minutes) —cold rolling (20 ° C., reduction rate 30%) — aging precipitation treatment (500 ° C., 18 hours).
  • the electrical conductivity and Vickers hardness in each composition at this time are shown.
  • the electrical conductivity is 8.5 IACS% in all the heat treatment conditions that require aging treatment other than the heat treatment conditions 1, 5, 12, and 13. With the above, the Vickers hardness was 220 Hv or more. (Conductivity and Vickers hardness results)
  • the heat treatment conditions are typical production conditions: hot rolling (900 ° C., reduction rate 90%) — solution treatment (900 ° C., 10 minutes) —cold rolling (20 ° C., reduction rate 30%) — aging precipitation treatment (500 ° C., 18 hours).
  • the electrical conductivity and Vickers hardness in each composition at this time are shown.
  • the electrical conductivity is 8.5 IACS% in all the heat treatment conditions that require aging treatment other than the heat treatment conditions 1, 5, 12, and 13. With the above, the Vickers hardness was 220 Hv or more. (Conductivity and Vickers hardness results)
  • the heat treatment conditions are typical production conditions: hot rolling (900 ° C., reduction rate 90%) — solution treatment (900 ° C., 10 minutes) —cold rolling (20 ° C., reduction rate 30%) — aging precipitation treatment (500 ° C., 18 hours).
  • the electrical conductivity and Vickers hardness in each composition at this time are shown. As can be seen from Table 14, in the manufacturing conditions of the manufacturing method of the present invention, the electrical conductivity is 8.5 IACS% in all the thermal processing conditions that require aging treatment other than the thermal processing conditions 1, 5, 12, and 13. With the above, the Vickers hardness was 220 Hv or more. (Conductivity and Vickers hardness results)
  • the heat treatment conditions are typical production conditions: hot rolling (900 ° C., reduction rate 90%) — solution treatment (900 ° C., 10 minutes) —cold rolling (20 ° C., reduction rate 30%) — aging precipitation treatment (500 ° C., 18 hours).
  • the electrical conductivity and Vickers hardness in each composition at this time are shown.
  • the electrical conductivity is 8.5 IACS% in all of the heat treatment processing conditions that require the aging treatment other than the heat treatment processing conditions 1, 5, 12, and 13. With the above, the Vickers hardness was 220 Hv or more. (Conductivity and Vickers hardness results)
  • the heat treatment conditions are typical production conditions: hot rolling (900 ° C., reduction rate 90%) — solution treatment (900 ° C., 10 minutes) —cold rolling (20 ° C., reduction rate 30%) — aging precipitation treatment (500 ° C., 18 hours).
  • the electrical conductivity and Vickers hardness in each composition at this time are shown.
  • the electrical conductivity is 8.5 IACS% in all of the heat treatment conditions that require aging treatment other than the heat treatment conditions 1, 5, 12, and 13. With the above, the Vickers hardness was 220 Hv or more. (Conductivity and Vickers hardness results)
  • the heat treatment conditions are typical production conditions: hot rolling (900 ° C., reduction rate 90%) — solution treatment (900 ° C., 10 minutes) —cold rolling (20 ° C., reduction rate 30%) — aging precipitation treatment (500 ° C., 18 hours).
  • the electrical conductivity and Vickers hardness in each composition at this time are shown. As can be seen from Table 20, in the manufacturing conditions of the manufacturing method of the present invention, the electrical conductivity is 8.5 IACS% in all the heat treatment conditions that require aging treatment other than the heat treatment conditions 1, 5, 12, and 13. With the above, the Vickers hardness was 220 Hv or more. (Conductivity and Vickers hardness results)
  • the heat treatment conditions are typical production conditions: hot rolling (900 ° C., reduction rate 90%) — solution treatment (900 ° C., 10 minutes) —cold rolling (20 ° C., reduction rate 30%) — aging precipitation treatment (500 ° C., 18 hours).
  • the electrical conductivity and Vickers hardness in each composition at this time are shown.
  • the electrical conductivity is 8.5 IACS% in all the heat treatment conditions that require aging treatment other than the heat treatment conditions 1, 5, 12, and 13. With the above, the Vickers hardness was 220 Hv or more. (Conductivity and Vickers hardness results)
  • the heat treatment conditions are typical production conditions: hot rolling (900 ° C., reduction rate 90%) — solution treatment (900 ° C., 10 minutes) —cold rolling (20 ° C., reduction rate 30%) — aging precipitation treatment (500 ° C., 18 hours).
  • the electrical conductivity and Vickers hardness in each composition at this time are shown.
  • the electrical conductivity is 8.5 IACS% in all the heat processing conditions that require the aging treatment other than the heat processing conditions 1, 5, 12, and 13. With the above, the Vickers hardness was 220 Hv or more. (Conductivity and Vickers hardness results)
  • the heat treatment conditions are typical production conditions: hot rolling (900 ° C., reduction rate 90%) — solution treatment (900 ° C., 10 minutes) —cold rolling (20 ° C., reduction rate 30%) — aging precipitation treatment (500 ° C., 18 hours).
  • the electrical conductivity and Vickers hardness in each composition at this time are shown.
  • the electrical conductivity is 8.5 IACS% in all the heat processing conditions that require aging treatment other than the heat processing conditions 1, 5, 12, and 13. With the above, the Vickers hardness was 220 Hv or more. (Conductivity and Vickers hardness results)
  • the copper alloy of the present invention a predetermined composition, and a copper alloy obtained by a predetermined production process, while suppressing coarsening of the gamma 'phase of the L1 2 structure precipitated in the copper alloy, sufficient Since it was possible to precipitate an amount of fine ⁇ ′ phase, it was found that electrical characteristics such as electrical conductivity, cold workability, and mechanical characteristics such as Vickers hardness can be easily controlled.

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EP11848127.4A EP2653574B1 (en) 2010-12-13 2011-12-13 Copper alloy and method for producing copper alloy
KR1020137015270A KR101576715B1 (ko) 2010-12-13 2011-12-13 구리 합금 및 구리 합금의 제조 방법
US13/993,642 US20130333812A1 (en) 2010-12-13 2011-12-13 Copper alloy and process for producing copper alloy
CN201180059926.2A CN103328665B (zh) 2010-12-13 2011-12-13 铜合金及铜合金的制造方法
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WO2020066371A1 (ja) 2018-09-27 2020-04-02 Ｄｏｗａメタルテック株式会社 Ｃｕ－Ｎｉ－Ａｌ系銅合金板材およびその製造方法並びに導電ばね部材
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JP7534883B2 (ja) 2020-07-29 2024-08-15 Ｄｏｗａメタルテック株式会社 Ｃｕ－Ｎｉ－Ａｌ系銅合金板材、その製造方法および導電ばね部材

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JP5711764B2 (ja) * 2010-12-13 2015-05-07 日本精線株式会社 銅合金線及び銅合金ばね
WO2015146981A1 (ja) * 2014-03-25 2015-10-01 古河電気工業株式会社 銅合金板材、コネクタ、および銅合金板材の製造方法
JP5916964B2 (ja) * 2014-03-25 2016-05-11 古河電気工業株式会社 銅合金板材、コネクタ、および銅合金板材の製造方法
JP2019002042A (ja) * 2017-06-14 2019-01-10 Ｄｏｗａメタルテック株式会社 Ｃｕ−Ｎｉ−Ａｌ系銅合金板材および製造方法並びに導電ばね部材
JP7202121B2 (ja) 2018-09-27 2023-01-11 Ｄｏｗａメタルテック株式会社 Ｃｕ－Ｎｉ－Ａｌ系銅合金板材およびその製造方法並びに導電ばね部材
WO2020066371A1 (ja) 2018-09-27 2020-04-02 Ｄｏｗａメタルテック株式会社 Ｃｕ－Ｎｉ－Ａｌ系銅合金板材およびその製造方法並びに導電ばね部材
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JP2020079436A (ja) * 2018-11-13 2020-05-28 Ｄｏｗａメタルテック株式会社 高ヤング率Ｃｕ−Ｎｉ−Ａｌ系銅合金板材およびその製造方法並びに導電ばね部材
JP7181768B2 (ja) 2018-11-13 2022-12-01 Ｄｏｗａメタルテック株式会社 高ヤング率Ｃｕ－Ｎｉ－Ａｌ系銅合金板材およびその製造方法並びに導電ばね部材
JP7534883B2 (ja) 2020-07-29 2024-08-15 Ｄｏｗａメタルテック株式会社 Ｃｕ－Ｎｉ－Ａｌ系銅合金板材、その製造方法および導電ばね部材

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EP2653574A1 (en) 2013-10-23
US20130333812A1 (en) 2013-12-19
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