WO2011090004A1

WO2011090004A1 - Method for manufacturing laminate, and laminate

Info

Publication number: WO2011090004A1
Application number: PCT/JP2011/050680
Authority: WO
Inventors: 聡近藤
Original assignee: 旭硝子株式会社
Priority date: 2010-01-25
Filing date: 2011-01-17
Publication date: 2011-07-28
Also published as: KR101538835B1; KR20120123375A; JPWO2011090004A1; JP5716678B2; CN102725143B; TWI508863B; TW201132503A; CN102725143A

Abstract

Disclosed is a method for manufacturing a laminate, which includes a step wherein a resin layer is disposed between a device board and a supporting board, the resin layer is peelably adhered on the first main surface of the device board, a laminate block fixed on the supporting board is cut into a predetermined size, and at least a laminate block outer circumferential surface part in the circumferential direction is planarized.

Description

LAMINATE MANUFACTURING METHOD AND LAMINATE

The present invention relates to a laminate manufacturing method and a laminate.

In recent years, devices (electronic devices) such as solar cells (PV), liquid crystal panels (LCD), and organic EL panels (OLED) have been made thinner and lighter, and substrates used for these devices (hereinafter referred to as “devices”). Substrate ") is becoming thinner. When the strength of the device substrate is insufficient due to the thin plate, the handling property of the device substrate is deteriorated in the device manufacturing process.

Therefore, conventionally, a method in which a device member is formed on a device substrate thicker than the final thickness and then the device substrate is thinned by a chemical etching process has been widely adopted. However, in this method, for example, when the thickness of one device substrate is reduced from 0.7 mm to 0.2 mm or 0.1 mm, most of the original device substrate material is scraped off with an etching solution. Therefore, it is not preferable from the viewpoint of productivity and use efficiency of raw materials.

Further, in the method of thinning a device substrate by the above chemical etching process, when a fine scratch exists on the surface of the device substrate, a fine depression (etch pit) is formed from the scratch as a starting point by the etching process. There was a case where it became a defect.

Recently, in order to cope with the above-described problem, a laminate in which a resin layer fixed on a support plate is detachably adhered to a first main surface of a device substrate is prepared, and a second main device substrate of the laminate is prepared. There has been proposed a method of peeling a support plate with a resin layer from a device substrate after forming a device member on the surface (see, for example, Patent Document 1).

International Publication No. 07/018028 Pamphlet

However, in the conventional laminate described above, a concave groove may be formed on the outer peripheral surface of the laminate. For example, when the device substrate or the support plate is chamfered, or when the resin layer is obtained by applying a liquid resin composition to the support plate and heat-curing, the outer peripheral surface of the device substrate or the support plate Further, since the outer peripheral surface of the resin layer is rounded, a concave groove is formed on the outer peripheral surface of the laminate.

The device manufacturing process includes a process of forming a pattern such as wiring or element formation by subjecting the conductive film formed on the surface of the device substrate to a process such as sandblasting or etching. Before this pattern formation step, there is an application step of applying a coating solution such as a resist solution to the surface of the conductive film in order to protect a part of the surface of the conductive film.

In the coating process of the device manufacturing process, the coating liquid easily enters the concave groove due to the capillary phenomenon and accumulates easily. The coating liquid accumulated in the groove is not easily removed even by washing, and a residue is likely to remain after drying. Since this residue becomes a dust generation source in the heat treatment process in the device manufacturing process, the dust generation contaminates the inside of the heat treatment process and reduces the yield of devices that are products.

The present invention has been made in view of the above problems, and a main object of the present invention is to provide a laminate manufacturing method and a laminate capable of suppressing dust generation in a device manufacturing process.

In order to solve the above-mentioned object, the method for producing a laminate of the present invention includes:
A resin layer is interposed between the device substrate and the support plate, the resin layer is detachably adhered to the first main surface of the device substrate, and the laminate block fixed on the support plate has a predetermined size. And at least a part in the circumferential direction of the outer peripheral surface of the laminate block is planarized.

Furthermore, it is preferable that the manufacturing method of the laminated body of this invention includes the process of chamfering the corner | angular part of the planarized part of the outer peripheral surface of the said laminated body block.
Moreover, it is preferable that the planarized part of the outer peripheral surface of the resin layer is substantially parallel to the thickness direction of the resin layer.
Moreover, it is preferable that the device substrate is a glass substrate manufactured by a float process, and includes a step of polishing the second main surface of the device substrate after chamfering the corner portion.

The device substrate is preferably a glass substrate having a thickness of 0.03 mm or more and less than 0.8 mm.
The resin layer preferably includes at least one selected from the group consisting of an acrylic resin layer, a polyolefin resin layer, a polyurethane resin layer, and a silicone resin layer.
The resin layer preferably has a thickness of 5 to 50 μm.

The laminate of the present invention is
A resin layer is interposed between the device substrate and the support plate, the resin layer is detachably adhered to the first main surface of the device substrate, and the laminate block fixed on the support plate has a predetermined size. And at least a part in the circumferential direction of the outer peripheral surface of the laminate block is planarized.

According to the present invention, it is possible to provide a laminate manufacturing method and a laminate that can suppress dust generation in the device manufacturing process.

FIG. 1 is a process diagram of a method for manufacturing a laminate according to the first embodiment of the present invention. FIG. 2 is a partial side view of the laminate block before planarization according to the first embodiment of the present invention. FIG. 3 is a partial side view of the laminate block after planarization according to the first embodiment of the present invention. FIG. 4 is an explanatory diagram (1) of the chamfering method according to the first embodiment of the present invention. FIG. 5 is an explanatory diagram (2) of the chamfering method according to the first embodiment of the present invention. FIG. 6 is an explanatory diagram (3) of the chamfering method according to the first embodiment of the present invention. FIG. 7 is a partial side view of the laminated body block after chamfering according to the first embodiment of the present invention. FIG. 8 is a partial side view of the laminated block after polishing in the first embodiment of the present invention. FIG. 9 is a process diagram of a device manufacturing method according to the first embodiment of the present invention. FIG. 10 is a process diagram of the LCD manufacturing method according to the first embodiment of the present invention. FIG. 11 is a process diagram of the method for manufacturing an OLED in the first embodiment of the present invention. FIG. 12 is a partial side view of the laminate block before planarization according to the second embodiment of the present invention. FIG. 13: is a partial side view of the laminated body block before planarization in 3rd Embodiment of this invention.

Hereinafter, embodiments for carrying out the present invention will be described with reference to the drawings. In the drawings, the same components are denoted by the same reference numerals and description thereof is omitted.

(First embodiment)
FIG. 1 is a process diagram of a method for manufacturing a laminate according to the first embodiment of the present invention. As shown in FIG. 1, in the method for manufacturing a laminate, a resin layer is interposed between a device substrate and a support plate, and the resin layer is detachably adhered to the first main surface of the device substrate and supported. There is a step (step S11) of cutting the laminated body block fixed on the plate into a predetermined size and planarizing at least a part of the outer circumferential surface of the laminated body block in the circumferential direction.

The layered product after planarization is used for manufacturing a device as will be described in detail later. The support plate with a resin layer in the laminate after planarization is used until the middle of the device manufacturing process (until the device substrate and the resin layer are peeled off by the peeling operation). After the device substrate and the resin layer are peeled off, the support plate with the resin layer is removed from the device manufacturing process and does not become a member constituting the device. The support plate with a resin layer peeled from the device substrate can be reused in the production process of the laminate. That is, a new device substrate can be laminated on the resin layer of the support plate with a resin layer to obtain a new laminate block.

First, the laminate block before planarization will be described, then the laminate block after planarization will be described, and finally the device manufacturing process will be described.

FIG. 2 is a partial side view of the laminate block before planarization in the first embodiment of the present invention. As shown in FIG. 2, the laminate block 10 before planarization has a resin layer 13 interposed between a device substrate 11 and a support plate 12. The resin layer 13 is detachably adhered to the first main surface 111 of the device substrate 11 and is fixed on the support plate 12.

(Device substrate)
The device substrate 11 has a device member formed on the second main surface 112 to constitute a device. Here, the device member refers to a member constituting at least a part of the device (electronic apparatus). Specific examples include a thin film transistor (TFT) and a color filter (CF). Examples of the device include a solar cell (PV), a liquid crystal panel (LCD), and an organic EL panel (OLED). The device member is formed on the second main surface 112 of the device substrate 11 after the outer peripheral surface of the multilayer block 10 is planarized.

The type of the device substrate 11 may be a general one, for example, a glass substrate, a resin substrate, or a metal substrate such as a SUS substrate. Among these, a glass substrate is preferable. This is because the glass substrate is excellent in chemical resistance and moisture permeability resistance and has a low heat shrinkage rate. As an index of the heat shrinkage rate, a linear expansion coefficient defined in JIS R 3102-1995 is used.

If the linear expansion coefficient of the device substrate 11 is large, the device manufacturing process often involves heat treatment, and various inconveniences are likely to occur. For example, when a TFT is formed on the device substrate 11, if the device substrate 11 on which the TFT is formed is cooled under heating, the TFT may be excessively misaligned due to thermal contraction of the device substrate 11.

The glass substrate is obtained by melting a glass raw material and molding the molten glass into a plate shape. Such a molding method may be a general one, and for example, a float method, a fusion method, a slot down draw method, a full call method, a rubber method, or the like is used. In addition, a glass substrate having a particularly small thickness can be obtained by heating a glass once formed into a plate shape to a moldable temperature and stretching it by means of stretching or the like to make it thin (redraw method).

The glass of the glass substrate is not particularly limited, but non-alkali glass, borosilicate glass, soda lime glass, high silica glass, and other oxide-based glass mainly containing silicon oxide are preferable. As the oxide-based glass, a glass having a silicon oxide content of 40 to 90% by mass in terms of oxide is preferable.

As the glass of the glass substrate, glass suitable for the type of device and its manufacturing process is preferably adopted. For example, a glass substrate for a liquid crystal panel is preferably made of glass (non-alkali glass) that does not substantially contain an alkali metal component because elution of the alkali metal component easily affects the liquid crystal. Thus, the glass of the glass substrate is appropriately selected based on the type of device to be applied and its manufacturing process.

The thickness of the device substrate is not particularly limited, but is usually less than 0.8 mm, preferably 0.3 mm or less, and more preferably 0.15 mm or less. Moreover, it is preferable that it is 0.03 mm or more. In particular, when the device substrate is a glass substrate, it is usually less than 0.8 mm, preferably 0.3 mm or less, more preferably 0.15 mm or less, from the viewpoint of reducing the thickness and / or weight of the glass substrate. is there. In the case of 0.8 mm or more, the demand for reducing the thickness and / or weight of the glass substrate cannot be satisfied. In the case of 0.3 mm or less, it is possible to give good flexibility to the glass substrate. In the case of 0.15 mm or less, the glass substrate can be wound into a roll. Further, the thickness of the glass substrate is preferably 0.03 mm or more for reasons such as easy manufacture of the glass substrate and easy handling of the glass substrate.

The resin type of the resin substrate is not particularly limited. Transparent resins include polyethylene terephthalate resin, polycarbonate resin, transparent fluororesin, transparent polyimide resin, polyethersulfone resin, polyethylene naphthalate resin, polyacrylic resin, cycloolefin resin, silicone resin, silicone-based organic-inorganic hybrid resin, organic Examples thereof include polymer / bionanofiber hybrid resins. Examples of the opaque resin include polyimide resin, fluorine resin, polyamide resin, polyaramid resin, polyether ether ketone resin, polyether ketone resin, and various liquid crystal polymer resins. The resin substrate may have a functional layer such as a protective layer formed on the surface.

(Support plate)
The support plate 12 supports and reinforces the device substrate 11 and prevents the device substrate 11 from being deformed, scratched or damaged in the device manufacturing process. When the device substrate 11 having a thickness smaller than that of the conventional device is used, the laminated body block 10 having the same thickness as that of the conventional device substrate is adapted to the device substrate having the conventional thickness in the device manufacturing process. One of the purposes of using the support plate 12 is to make the manufacturing technology and manufacturing equipment usable.

The thickness of the support plate 12 may be thicker or thinner than the device substrate 11. Preferably, the thickness of the support plate 12 is selected based on the thickness of the device substrate 11, the thickness of the resin layer 13, and the thickness of the laminated body block 10. For example, when the current device manufacturing process is designed to process a substrate having a thickness of 0.5 mm, and the sum of the thickness of the device substrate 11 and the thickness of the resin layer 13 is 0.1 mm, The thickness of the support plate 12 is 0.4 mm. When the support plate 12 is a glass plate, the thickness of the glass plate is preferably 0.08 mm or more because it is easy to handle and difficult to break.

The type of the support plate 12 may be a general one, for example, a glass plate, a resin plate, a metal plate, or the like. When the device manufacturing process involves heat treatment, the support plate 12 is preferably formed of a material having a small difference in linear expansion coefficient from the device substrate 11, and more preferably formed of the same material as the device substrate 11. .

The difference in average linear expansion coefficient between the device substrate 11 and the support plate 12 at 25 to 300 ° C. (hereinafter simply referred to as “average linear expansion coefficient”) is preferably 700 × 10 ⁻⁷ / ° C. or less, more preferably It is 500 × 10 ⁻⁷ / ° C. or less, more preferably 300 × 10 ⁻⁷ / ° C. or less. If the difference is too large, the laminate block 10 may be warped severely or the device substrate 11 and the support plate 12 may be peeled off during heating and cooling in the device manufacturing process. When the material of the device substrate 11 and the material of the support plate 12 are the same, there is no possibility of causing such a problem.

(Resin layer)
The resin layer 13 is fixed on the support plate 12 and is in close contact with the first main surface 111 of the device substrate 11 in a peelable manner. The resin layer 13 prevents the positional deviation of the device substrate 11 until the peeling operation is performed, and easily peels from the device substrate 11 by the peeling operation, and prevents the device substrate 11 and the like from being damaged by the peeling operation.

The surface of the resin layer 13 is attached to the first main surface 111 of the device substrate 11 by a force resulting from van der Waals force between solid molecules, not the adhesive force that a general adhesive has. Is preferred. It is because it can peel easily. In this invention, the property which can peel this resin layer surface easily is called peelability.

On the other hand, the bonding force of the resin layer 13 to the surface of the support plate 12 is relatively higher than the bonding force of the resin layer 13 to the first main surface 111 of the device substrate 11. In the present invention, bonding of the surface of the resin layer 13 to the surface of the device substrate 11 is referred to as adhesion, and bonding to the surface of the support plate 32 is referred to as fixing.

The thickness of the resin layer 13 is not particularly limited, but is preferably 5 to 50 μm, more preferably 5 to 30 μm, and even more preferably 7 to 20 μm. This is because when the thickness of the resin layer 13 is within such a range, the resin layer 13 and the device substrate 11 are sufficiently adhered. In addition, even if bubbles or foreign substances are present between the resin layer 13 and the device substrate 11, it is possible to suppress the occurrence of distortion defects in the device substrate 11. In addition, if the thickness of the resin layer 13 is too thick, it takes time and materials to form the resin layer 13 and is not economical.

In addition, the resin layer 13 may consist of two or more layers. In this case, “the thickness of the resin layer” means the total thickness of all the resin layers.

Moreover, when the resin layer 13 consists of two or more layers, the kind of resin forming each layer may be different.

The surface tension of the resin layer 13 is preferably 30 mN / m or less, more preferably 25 mN / m or less, and further preferably 22 mN / m or less. Moreover, it is preferable that it is 15 mN / m or more. If the surface tension is in such a range, it can be more easily peeled off from the device substrate 11, and at the same time, the contact with the device substrate 11 is sufficient.

Measure surface tension as follows. First, the contact angle of each liquid at 20 ° C. is measured using a plurality of liquids whose surface tension is known with respect to the resin layer 13. Next, the surface tension and contact angle (cos θ) of each liquid are plotted and linear approximation is performed, and the surface tension value at which cos θ = 1 is extrapolated to obtain the critical surface tension of the resin layer 13. This critical surface tension is defined as the surface tension of the resin layer 13.

The resin layer 13 is preferably made of a material having a glass transition point lower than room temperature (about 25 ° C.) or having no glass transition point. This is because it becomes a non-adhesive resin layer and can be more easily peeled off from the device substrate 11, and at the same time, the contact with the device substrate 11 becomes sufficient.

Moreover, since the resin layer 13 is often heat-treated in the device manufacturing process, it is preferable to have heat resistance.

Further, if the elastic modulus of the resin layer 13 is too high, the adhesion with the device substrate 11 tends to be low. On the other hand, if the elastic modulus of the resin layer 13 is too low, the peelability tends to be low.

The type of resin forming the resin layer 13 is not particularly limited. For example, acrylic resin, polyolefin resin, polyurethane resin, and silicone resin can be used. These resins can be used alone, or several kinds of resins can be mixed and used. Of these, silicone resins are preferred. This is because the silicone resin is excellent in heat resistance and peelability. Moreover, when the support plate 12 is a glass plate, it is easy to fix to the support plate 12 by a condensation reaction with the silanol groups on the surface. The silicone resin layer is also preferable in that the peelability does not substantially deteriorate even when it is treated at, for example, about 300 to 400 ° C. for about 1 hour.

The resin layer 13 is preferably made of a silicone resin (cured product) used for release paper among silicone resins. A resin layer 13 formed by curing a curable resin composition to be a silicone resin for release paper on the surface of the support plate 12 is preferable because it has excellent peelability. In addition, since the flexibility is high, even if foreign matter such as bubbles or dust is mixed between the resin layer 13 and the device substrate 11, it is possible to suppress the occurrence of the distortion defect of the device substrate 11.

The curable silicone that becomes the silicone resin for release paper is classified into a condensation reaction type silicone, an addition reaction type silicone, an ultraviolet curable type silicone, and an electron beam curable type silicone depending on its curing mechanism. Can do. Among these, addition reaction type silicone is preferable. This is because the curing reaction is easy and the degree of peelability is good when the resin layer 13 is formed, and the heat resistance is also high.

The addition reaction type silicone is a curable resin obtained from a combination of an organoalkenylpolysiloxane having an unsaturated group such as a vinyl group, an organohydrogenpolysiloxane having a hydrogen atom bonded to a silicon atom, and a catalyst such as a platinum-based catalyst. The composition is a silicone resin that is cured at room temperature or by heating.

Further, the curable silicone used as the silicone resin for the release paper is classified into a solvent type, an emulsion type and a solventless type, and any type can be used. Among these, a solventless type is preferable. This is because productivity, safety, and environmental characteristics are excellent. In addition, it does not contain a solvent that causes foaming at the time of curing when forming the resin layer 13, that is, at the time of heat curing, ultraviolet curing, or electron beam curing.

Further, as the curable silicone used as the silicone resin for release paper, specifically, commercially available product names or model numbers are KNS-320A, KS-847 (both manufactured by Shin-Etsu Silicone), TPR6700 (manufactured by GE Toshiba Silicone). ), A combination of vinyl silicone “8500” (Arakawa Chemical Industries, Ltd.) and methylhydrogenpolysiloxane “12031” (Arakawa Chemical Industries, Ltd.), vinyl silicone “11364” (Arakawa Chemical Industries, Ltd.) Combination with methyl hydrogen polysiloxane “12031” (Arakawa Chemical Industries, Ltd.), vinyl silicone “11365” (Arakawa Chemical Industries, Ltd.) and methyl hydrogen polysiloxane “12031” (Arakawa Chemical Industries, Ltd.) And the like.

KNS-320A, KS-847, and TPR6700 are curable silicones that contain a main agent and a crosslinking agent in advance.

Further, it is preferable that the silicone resin forming the resin layer 13 has a property that the components in the silicone resin layer are difficult to migrate to the device substrate 11, that is, low silicone migration.

(Fixing method)
Although the method of fixing the resin layer 13 on the support plate 12 is not particularly limited, for example, a method of fixing a film-like resin on the surface of the support plate 12 can be mentioned. Specifically, in order to impart a high fixing force (high peel strength) to the surface of the film on the surface of the support plate 12, the surface of the support plate 12 is subjected to a surface modification treatment (priming treatment), and the support plate 12 The method of fixing on top is mentioned. For example, chemical methods (primer treatment) that improve the fixing force chemically such as silane coupling agents, physical methods that increase surface active groups such as flame (flame) treatment, surface treatments such as sandblast treatment Examples thereof include a mechanical processing method for increasing the catch by increasing the roughness.

Further, for example, a method of coating the support plate 12 with a curable resin composition that becomes the resin layer 13 may be mentioned. Examples of the coating method include spray coating, die coating, spin coating, dip coating, roll coating, bar coating, screen printing, and gravure coating. From such a method, it can select suitably according to a kind to a resin composition.

When the curable resin composition to be the resin layer 13 is coated on the support plate 12, the coating amount is preferably 1 to 100 g / m ² and more preferably 5 to 20 g / m ^2. preferable.

For example, when the resin layer 13 is formed from a curable resin composition of addition reaction type silicone, a curable resin composition composed of a mixture of an alkenyl polysiloxane, an organohydrogenpolysiloxane, and a catalyst is used for the spray coating method described above. It coats on the support plate 12 by a well-known method, and is hardened by heating after that. The heat curing conditions vary depending on the blending amount of the catalyst. For example, when 2 parts by weight of a platinum-based catalyst is blended with respect to 100 parts by weight of the total amount of alkenylpolysiloxane and organohydrogenpolysiloxane, 50 in the atmosphere. The reaction is carried out at a temperature of from ° C to 250 ° C, preferably 100 ° C to 200 ° C. In this case, the reaction time is 5 to 60 minutes, preferably 10 to 30 minutes. In order to obtain a silicone resin layer having low silicone migration, it is preferable to proceed the curing reaction as much as possible so that an unreacted silicone component does not remain in the silicone resin layer. The reaction temperature and reaction time as described above are preferable because almost no unreacted silicone component remains in the silicone resin layer. If the reaction time is too long or the reaction temperature is too high, the oxidative decomposition of the silicone resin occurs at the same time, and a low molecular weight silicone component is produced, which may increase the silicone transferability. It is preferable to allow the curing reaction to proceed as much as possible so that an unreacted silicone component does not remain in the silicone resin layer in order to improve the peelability after the heat treatment.

For example, when the resin layer 13 is manufactured using a curable resin composition that becomes a silicone resin for release paper, the curable resin composition coated on the support plate 12 is heated and cured to form a silicone resin layer. To do. By thermally curing the curable resin composition, the silicone resin is chemically bonded to the support plate 12 during the curing reaction. Further, the silicone resin layer is bonded to the support plate 12 by the anchor effect. By these actions, the silicone resin layer is firmly fixed to the support plate 12.

(Adhesion method)
The method of sticking the resin layer 13 formed on the support to the device substrate 11 so as to be peelable may be a known method. For example, after laminating | stacking the device board | substrate 11 on the peelable surface of the resin layer 13 in a normal pressure environment, the method of crimping | bonding the resin layer 13 and the device board | substrate 11 using a roll or a press is mentioned. It is preferable because the resin layer 13 and the device substrate 11 are more closely adhered by pressure bonding with a roll or a press. Further, it is preferable because bubbles mixed between the resin layer 13 and the device substrate 11 are removed relatively easily by pressure bonding with a roll or a press.

When the resin layer 13 formed on the support and the device substrate 11 are pressure-bonded by a vacuum laminating method or a vacuum press method, it is more preferable because suppression of air bubbles and securing of good adhesion are more preferably performed. By press-bonding under vacuum, even if minute bubbles remain, there is an advantage that the bubbles do not grow by heating and are less likely to cause a distortion defect of the device substrate 11.

When the resin layer 13 is detachably adhered to the device substrate 11, it is preferable that the surfaces of the resin layer 13 and the device substrate 11 that are in contact with each other are sufficiently washed and laminated in a clean environment. Even if a foreign substance is mixed between the resin layer 13 and the device substrate 11, the resin layer 13 is deformed and thus does not affect the flatness of the surface of the device substrate 11. Is preferable because it becomes favorable.

In addition, there is no restriction | limiting in the order of the process of fixing the resin layer 13 on the support plate 12, and the process of closely_contact | adhering the resin layer 13 on the device board | substrate 11, and may be substantially simultaneous, for example.

(Cutting the laminated body block)
A groove 15 may be formed on the outer peripheral surface 14 of the laminate block 10 obtained in this way. For example, as shown in FIG. 2, the device substrate 11 and the support plate 12 are chamfered, or the resin layer 13 is obtained by applying a liquid resin composition to the support plate 12 and heat-curing it. In some cases, since the outer peripheral surfaces of the device substrate 11, the support plate 12, and the resin layer 13 are rounded, the concave grooves 15 are formed in the outer peripheral surface 14 of the multilayer block 10.

In the present embodiment, as shown in FIG. 1, in the method for manufacturing a laminate, the laminate block is cut into a predetermined dimension, and at least a part in the circumferential direction of the outer peripheral surface of the laminate block is planarized (step S <b> 11). Have More specifically, the laminate block is cut into a predetermined size, and at least a part in the circumferential direction of the laminate block (preferably, the entire circumference in the circumferential direction) is removed, and at least the circumferential direction of the outer circumference of the laminate block. A part (preferably the entire circumference in the circumferential direction) is planarized.

The method of cutting the laminated body block 10 may be a general method. For example, a method of cutting with a blade, a method of fusing with a high energy beam such as a laser, a scribe line is formed on the principal surface of at least one of the device substrate and the support plate using a blade or a laser, and the scribe line And a method of cleaving along the line. These cutting methods are used alone or in combination. Thus, cutting includes fusing and cleaving.

The cutting method is appropriately selected according to the type and thickness of the device substrate 11, the support plate 12, and the resin layer 13. For example, when the device substrate 11 or the support plate 12 is made of glass, a method in which a scribe line is formed on the main surface of the glass, and then the laminate block 10 is bent and deformed along the scribe line is preferable. Moreover, when the device substrate 11 and the support plate 12 are made of glass, there is a method in which scribe lines are formed on the main surfaces of both glasses, and then the laminate block 10 is bent and deformed along both scribe lines. Is preferred. When cleaving, the thickness of the resin layer 13 is preferably 50 μm or less. If the resin layer 13 is too thick, it becomes difficult to cleave.

The cutting direction may be a direction from the device substrate 11 toward the support plate 12 or a direction from the support plate 12 toward the device substrate 11. Further, the cutting direction may be one direction or both directions. Furthermore, the cutting direction is preferably substantially parallel to the thickness direction of the laminate block (that is, the thickness direction of the resin layer). This is because the exposed area of the resin layer 13 can be reduced and deterioration of the resin layer 13 due to heat treatment in the device manufacturing process can be suppressed.

FIG. 3 is a partial side view of the laminate block after the outer peripheral surface is planarized in the first embodiment of the present invention. The laminate block 10A in FIG. 3 is obtained by cutting the laminate block 10 along the line AA ′ in FIG. The device substrate 11A, the support plate 12A, and the resin layer 13A after planarization correspond to the device substrate 11, the support plate 12, and the resin layer 13 before planarization, respectively.

The laminated block 10A after planarization has a resin layer 13A interposed between a device substrate 11A and a support plate 12A. The resin layer 13A is detachably adhered to the first main surface 111A of the device substrate 11A and is fixed on the support plate 12A. A device member is formed on the second main surface 112A of the device substrate 11A, as will be described in detail later.

As shown in FIG. 3, the outer peripheral surface 14 </ b> A of the laminated body block 10 </ b> A after planarization is a flat surface, and the concave groove 15 (see FIG. 2) is removed.

By the way, when such a concave groove 15 exists, in the device manufacturing process, a coating solution such as a resist solution enters due to a capillary phenomenon and tends to accumulate. The coating liquid accumulated in the concave groove 15 is not easily removed by washing, and a residue is likely to remain after drying. Since this residue becomes a dust generation source in the heat treatment process in the device manufacturing process, the dust generation contaminates the inside of the heat treatment process and reduces the yield of devices that are products.

In this embodiment, since the concave groove 15 is removed, it is difficult for the coating liquid residue to accumulate in the device manufacturing process. Therefore, dust generation can be suppressed in the heat treatment step, and a decrease in the yield of devices that are products can be suppressed.

(Chamfer of laminated block)
As shown in FIG. 1, the manufacturing method of a laminated body may further have the process (step S12) which chamfers the corner | angular part of the planarized part of the outer peripheral surface of a laminated body block. Chamfering can improve impact resistance and safety.

By the way, if the corners of the laminate block are chamfered before the outer peripheral surface of the laminate block is flattened, if there are concave grooves on the outer peripheral surface of the laminate block, the end of the device substrate or the end of the support plate May be bent and damaged.

In the present embodiment, since the corners of the laminate block are chamfered after the outer peripheral surface of the laminate block is planarized, the concave grooves are removed in advance. For this reason, it can suppress that the edge part of a device board | substrate and the edge part of a support plate are bent and damaged at the time of chamfering.

The chamfering method may be a general method. For example, a method using a chamfering machine such as a grinder can be mentioned. The type of chamfering may be chamfering that processes the

corners

110 and 120 after planarization as shown in FIG. 4, or the

corners

110 and 120 after planarization as shown in FIG. 5. R may be a chamfered surface that is processed into an arcuate surface, or may be a chamfered surface that is processed into a combination of a flat surface and an arcuate surface as shown in FIG. There is no particular limitation. Moreover, the chamfering which cuts a resin layer may be sufficient and the chamfering which does not cut a resin layer may be sufficient.

The chamfer dimension is appropriately selected according to the type and thickness of the device substrate, support plate, and resin layer. In the case of R chamfering, the curvature radius R1 on the device substrate side and the curvature radius R2 on the support plate side may be the same or different. When processing the corner into a flat surface, the chamfering angle θ1 on the device substrate side and the chamfering angle θ2 on the support plate side may be the same or different.

After chamfering, the planarized portion of the outer peripheral surface of the resin layer is preferably substantially parallel to the thickness direction of the resin layer. Thereby, the exposed area of the resin layer can be reduced.

If the exposed area of the resin layer is large, the resin layer tends to deteriorate due to heat treatment in the device manufacturing process.

In this embodiment, since the exposed area of the resin layer can be reduced, deterioration of the resin layer can be suppressed in the device manufacturing process.

FIG. 7 is a partial side view of the laminate block after chamfering according to the first embodiment of the present invention. In FIG. 7, the shape of the laminated body block before chamfering is shown by a dotted line. The laminated body block 10B in FIG. 7 is obtained by rounding both corners of the cut surface of the laminated body block 10A in FIG. The device substrate 11B, the support plate 12B, and the resin layer 13B after chamfering correspond to the device substrate 11A, the support plate 12A, and the resin layer 13A before chamfering, respectively.

The laminated block 10B after chamfering is such that a resin layer 13B is interposed between the device substrate 11B and the support plate 12B. The resin layer 13B is detachably adhered to the first main surface 111B of the device substrate 11B and is fixed on the support plate 12B.

The laminated block 10B after chamfering is excellent in impact resistance and safety because the outer peripheral surface 14B is rounded as shown in FIG.

As shown in FIG. 7, the laminated body block 10B after chamfering has an outer peripheral surface 134B of the resin layer 13B that is substantially parallel to the thickness direction of the resin layer 13B (the direction of arrow A in FIG. 7). The exposed area of the layer 13B is small. For this reason, it can suppress that resin layer 13B deteriorates by the heat processing in the manufacturing process of a device.

(Polishing the laminated block)
As shown in FIG. 1, when the device substrate is a glass substrate manufactured by a float process, the laminated body is manufactured by polishing the second main surface of the device substrate after chamfering (that is, after planarization). You may further have a process (step S13). Here, the glass substrate manufactured by the float process includes a glass substrate that is further reduced in thickness by stretching the glass substrate manufactured by the float process by the redraw method.

The float method is a method in which molten glass flows out onto molten tin in a float bath and flows in the downstream direction to form a strip-shaped glass. A glass substrate is manufactured by cutting a strip-shaped glass, but minute irregularities and undulations are generated on the surface of the glass substrate.

By the polishing in the polishing step, minute irregularities and undulations on the glass substrate surface can be removed, and the flatness of the surface on which the device member is formed can be improved. Therefore, the reliability of the device which is a product can be improved. This effect is remarkable when the thickness of the glass substrate is 0.03 to 0.3 mm. This is because a glass substrate having a thickness of 0.03 to 0.3 mm is difficult to polish by itself, and it is difficult to polish it in advance before forming a laminate block.

By the way, when polishing the second main surface of the device substrate before flattening, if there is a concave groove on the outer peripheral surface of the laminated body block, the abrasive will not enter the concave groove, or the device substrate may be bent and damaged. There are things to do. Even after planarization, sharp corners of the device substrate are likely to be damaged when the second main surface of the device substrate is polished before chamfering.

In this embodiment, since the second main surface of the device substrate is polished after chamfering (that is, after planarization), the corners of the device substrate are chamfered in advance and the concave grooves are removed in advance. . For this reason, at the time of grinding | polishing, it can suppress that the abrasive | polishing agent adheres to a ditch | groove, or a device substrate is damaged.

The polishing method may be a general method. For example, a polishing method using abrasive grains such as cerium oxide can be given.

The polishing allowance is appropriately set according to the thickness of the device substrate and the device to be used, and is, for example, 0.05 to 10 μm.

FIG. 8 is a partial side view of the laminated body block after polishing in the first embodiment of the present invention. In FIG. 8, the shape of the laminate block before polishing is indicated by a dotted line. The laminated body block 10C in FIG. 8 is obtained by polishing the second main surface 112B of the device substrate 11B of the laminated body block 10B in FIG. The device substrate 11C after polishing corresponds to the device substrate 11B before polishing.

The laminated block 10C after polishing has a resin layer 13B interposed between the device substrate 11C and the support plate 12B. The resin layer 13B is detachably adhered to the first main surface 111C of the device substrate 11C and is fixed on the support plate 12B.

The laminated block 10C after polishing has higher flatness and cleanliness of the second main surface 112C on which the device member is formed, compared to the laminated block 10B before polishing.

(Device manufacturing method)
FIG. 9 is a process diagram showing a device manufacturing method according to the first embodiment of the present invention.

The device manufacturing method includes a step (step S61) of forming a device member using a coating liquid on the second main surface of the device substrate of the planarized laminate block (laminate), the device substrate and the resin. And a step of separating the layer (step S62). Here, the laminated body block (laminated body) after planarization naturally includes a laminated body block (laminated body) after chamfering and a laminated body block (laminated body) after polishing.

The device member is a member that is formed on the second main surface of the device substrate and constitutes at least a part of the device. The device member is not all of the members finally formed on the second main surface of the device substrate (hereinafter referred to as “all members”) but part of all the members (hereinafter referred to as “partial members”). May be. This is because the device substrate with partial members peeled from the resin layer can be used as a device substrate with all members in the subsequent steps. Thereafter, a device is manufactured using the device substrate with all members. Further, other device members may be formed on the peeled surface (first main surface) of the device substrate with all members peeled from the resin layer. Moreover, a device can be manufactured by assembling a device using the laminate with all members, and then peeling the support plate with a resin layer from the laminate with all members. Furthermore, a device can be manufactured by assembling a device using two laminates with all members, and then peeling the two support plates with resin layers from the laminate with all members.

The method for peeling the device substrate and the resin layer may be a known method. For example, a peeling blade is inserted between the device substrate and the resin layer, and then a fluid in which compressed air and water are mixed is sprayed on the insertion position of the peeling blade. In this state, one main surface of the laminate is held flat, and the other main surface is sequentially bent and deformed from the vicinity of the insertion position. In this way, the device substrate and the resin layer can be peeled off.

FIG. 10 is a process diagram of the LCD manufacturing method according to the first embodiment of the present invention. In this embodiment, a method for manufacturing a TFT-LCD will be described. However, the present invention may be applied to a method for manufacturing an STN-LCD, and there is no limitation on the type or method of the liquid crystal panel.

The TFT-LCD manufacturing method uses a resist solution on the second main surface of the planarized device block (laminate) device substrate by a general film-forming method such as a CVD method or a sputtering method. A step of forming a thin film transistor (TFT) by patterning a metal film and a metal oxide film to be formed (step S71), and the second main surface of the device substrate of another planarized laminated body block (laminated body) On top, a step of forming a color filter (CF) using a resist solution for pattern formation (step S72), a step of laminating a device substrate with TFT and a device substrate with CF (step S73), and both devices And a step of peeling the substrate and the resin layer (step S74). The order of the TFT formation process (step S71) and the CF formation process (step S72) is not limited, and may be substantially simultaneous. Further, the peeling process (step S74) may be before the lamination process (step S73), or may be in the middle of the TFT forming process or the CF forming process.

In the TFT formation process and the CF formation process, a TFT or CF is formed on the second main surface of the device substrate using a well-known photolithography technique, etching technique, or the like. At this time, a resist solution is used as a coating solution for pattern formation.

In addition, you may wash | clean the 2nd main surface of a device board | substrate as needed before forming TFT and CF. As a cleaning method, known dry cleaning or wet cleaning can be used.

In the laminating process, a liquid crystal material is injected and laminated between the laminated body with TFT and the laminated body with CF. Examples of the method for injecting the liquid crystal material include a reduced pressure injection method and a drop injection method.

In the reduced pressure injection method, for example, first, both laminates are bonded using a sealing material and a spacer material so that the surface on which the TFT is present and the surface on which the CF is present are opposed to each other. Next, the two support plates with a resin layer are peeled from both laminates. Thereafter, the bonded two device substrates are cut into a plurality of cells. After making the inside of each cut cell into a reduced-pressure atmosphere, a liquid crystal material is injected into each cell from the injection hole to seal the injection hole. Subsequently, a polarizing plate is attached to each cell, a backlight or the like is incorporated, and a liquid crystal panel is manufactured.

In this embodiment, the two support plates with a resin layer are peeled from both laminates, and then the bonded two device substrates are cut into a plurality of cells. However, the present invention is not limited to this. For example, the support plate with a resin layer may be peeled from each laminate before the two laminates are bonded together using a sealing material and a pacer material.

In the dropping injection method, for example, first, a liquid crystal material is dropped on one of both laminates, and both laminates are bonded to each other using a sealing material and a spacer material. Are stacked so that they face each other. Next, the two support plates with a resin layer are peeled from both laminates. Thereafter, both stacked device substrates are cut into a plurality of cells. Subsequently, a polarizing plate is attached to each cell, a backlight or the like is incorporated, and a liquid crystal panel is manufactured.

In addition to the above steps, the method for producing a liquid crystal panel may further include a step (Step S75) of thinning the glass substrate by chemical etching after peeling the support plate with a resin layer from the glass substrate which is a device substrate. Good. Since the 1st main surface of the glass substrate was protected by the support plate, even if it etched, an etch pit does not generate | occur | produce easily.

In the example shown in FIG. 10, one laminated body is used for manufacturing each of the device substrate with TFT and the device substrate with CF. However, the present invention is not limited to this. For example, the laminate may be used for manufacturing only one of the device substrate with TFT and the device substrate with CF.

FIG. 11 is a process diagram of a method for manufacturing an organic EL panel (OLED) in the first embodiment of the present invention.

The organic EL panel manufacturing method includes a step of forming an organic EL element on the second main surface of the planarized device substrate using a resist solution for pattern formation (step S81), and an organic EL element. It includes a step of stacking the counter substrate on top (step S82) and a step of peeling the device substrate and the resin layer (step S83). Note that the peeling step (step S83) may be before the stacking step (step S82), or may be in the middle of the organic EL element forming step (step S81).

In the organic EL element forming step, the organic EL element is formed on the second main surface of the device substrate using a known photolithography technique, vapor deposition technique, or the like. At this time, a resist solution is applied as a pattern forming coating solution onto the second main surface of the device substrate. An organic EL element consists of a transparent electrode layer, a positive hole transport layer, a light emitting layer, an electron carrying layer etc., for example.

In addition, you may wash | clean the 2nd main surface of a device board | substrate as needed before forming an organic EL element. As the cleaning method, for example, dry cleaning or wet cleaning can be used.

In the lamination step, for example, first, the support plate with the resin layer is peeled from the device substrate with the organic EL element. Thereafter, the device substrate with an organic EL element is cut into a plurality of cells. Subsequently, each cell and the counter substrate are bonded together so that the organic EL element and the counter substrate are in contact with each other. In this way, an organic EL display is manufactured.

The display panel such as LCD and OLED manufactured in this way is not particularly limited in its application, but is suitably used for portable electronic devices such as mobile phones, PDAs, digital cameras, and game machines.

(Second Embodiment)
The second embodiment relates to a laminate block before planarization.

FIG. 12 is a partial side view of the laminate block before planarization in the second embodiment of the present invention. As shown in FIG. 12, the laminate block 20 before planarization has a resin layer 23 interposed between a device substrate 21 and a support plate 22. The resin layer 23 is detachably adhered to the first main surface 211 of the device substrate 21 and is fixed on the support plate 22.

The support plate 22 is larger than the resin layer 23, and the resin layer 23 is larger than the device substrate 21. In such a case, as shown in FIG. 12, if the device substrate 21 is chamfered, the outer peripheral surface of the device substrate 21 is rounded, so that the concave groove 25 is formed on the outer peripheral surface 24 of the laminate block 20. Will be formed.

Also in this case, by cutting the laminate block 20 along the line AA ′ in FIG. 12, the outer peripheral surface 24 of the laminate block 20 can be planarized, and the concave groove 25 can be removed. .

By the way, when the laminated body block 20 is cut along the line BB ′ or CC ′ in FIG. 12, the outer peripheral surface 24 of the laminated body block 20 cannot be planarized, so that the groove 25 remains. To do.

In such a case, the residue of the coating liquid tends to remain in the device manufacturing process due to the remaining concave grooves 25. Since this residue becomes a dust generation source in the heat treatment process in the device manufacturing process, the dust generation contaminates the inside of the heat treatment process and reduces the yield of devices that are products.

In the present embodiment, since the concave groove 25 can be removed, dust generation can be suppressed in the device manufacturing process, and a decrease in the yield of devices that are products can be suppressed.

(Third embodiment)
FIG. 13: is a partial side view of the laminated body block before planarization in 3rd Embodiment of this invention. As shown in FIG. 13, the laminate block 30 before planarization has a resin layer 33 interposed between a device substrate 31 and a support plate 32. The resin layer 33 is detachably adhered to the first main surface 311 of the device substrate 31 and is fixed on the support plate 32.

The resin layer 33 is smaller than the device substrate 31 and the support plate 32. For this reason, as shown in FIG. 13, a concave groove 35 is formed on the outer peripheral surface 34 of the laminate block 30.

Also in this case, by cutting the laminate block 30 along the line AA ′ in FIG. 13, the outer peripheral surface 34 of the laminate block 30 can be planarized, and the concave groove 35 can be removed. .

By the way, when the laminated body block 30 is cut along the line BB ′ or CC ′ in FIG. 13, the outer peripheral surface 34 of the laminated body block 30 cannot be planarized. Part or all remains.

In such a case, the residue of the coating liquid tends to remain in the device manufacturing process due to the remaining part or all of the concave groove 35. Since this residue becomes a dust generation source in the heat treatment process in the device manufacturing process, the dust generation contaminates the inside of the heat treatment process and reduces the yield of devices that are products.

In this embodiment, since the concave groove 35 can be removed, dust generation can be suppressed in the device manufacturing process, and a decrease in the yield of the device as a product can be suppressed.

Hereinafter, the present invention will be specifically described with reference to examples and the like, but the present invention is not limited to these examples.

Example 1
A glass plate (manufactured by Asahi Glass Co., Ltd., AN100, alkali-free glass) having a length of 370 mm, a width of 320 mm, and a thickness of 0.6 mm obtained by a float process was used as the support plate. The average linear expansion coefficient of this glass plate was 38 × 10 ⁻⁷ / ° C.

This glass plate was cleaned with pure water and UV to clean the surface of the glass plate. Thereafter, a mixture of 100 parts by mass of solvent-free addition-reactive silicone (Shin-Etsu Silicone Co., KNS-320A) and 5 parts by mass of a platinum catalyst (Shin-Etsu Silicone Co., Ltd., CAT-PL-56) is applied to the surface of the glass plate. Coating was performed by a spin coater (coating amount 20 g / m ² ).

The above solvent-free addition reaction type silicone is a linear organoalkenylpolysiloxane (main agent) having a vinyl group and a methyl group bonded to a silicon atom, and a linear chain having a hydrogen atom and a methyl group bonded to a silicon atom. It contains an organohydrogenpolysiloxane (crosslinking agent).

The mixture coated on the glass plate was heat-cured at 180 ° C. for 10 minutes in the air to form a resin layer of 366 mm length × 316 mm width on the glass plate and fixed.

On the other hand, a resin substrate made of polyethersulfone and having a length of 370 mm × width of 320 mm × thickness of 0.1 mm (Sumilite FS-5300, manufactured by Sumitomo Bakelite Co., Ltd.) was used as the device substrate. The average linear expansion coefficient of this resin substrate was 540 × 10 ⁻⁷ / ° C.

The resin substrate was cleaned with pure water and UV to clean the surface of the resin substrate. Then, after aligning a resin substrate and a glass plate, the resin layer fixed on the glass plate was stuck to the 1st main surface of the resin substrate using the vacuum press apparatus at room temperature.

Thus, a laminate block substantially identical to the laminate block shown in FIG. 2 was obtained. The obtained laminated body block was cut | disconnected in the thickness direction, and the outer peripheral part of the laminated body block was removed by width 10mm over the circumferential direction perimeter. Specifically, while cutting the resin substrate and the resin layer in the thickness direction using a cutter knife, and forming a scribe line on the main surface of the glass plate using a glass cutter, the laminate block is bent and deformed. Cleaving along the scribe line, the outer peripheral portion of the laminate block was removed over the entire circumference.

In this state, the outer peripheral surfaces of the resin substrate, the glass plate, and the resin layer were aligned over the entire circumferential direction, and the outer peripheral surface of the laminate block was planarized over the entire circumferential direction. Moreover, the ditch | groove was not looked at by the outer peripheral surface of the laminated body block.

Then, the planarized laminate block was dipped in a CF black matrix resist solution (manufactured by Asahi Glass Co., Ltd., PMA-ST), and then washed with propylene glycol monomethyl ether acetate (resist solution main solvent). Thereafter, the laminate was dried in a hot air oven at 120 ° C. for 30 minutes, and the outer peripheral surface of the laminate was observed with a microscope. As a result, no resist solution residue was found.

(Example 2)
In Example 2, the same as Example 1 except that a glass plate (Asahi Glass Co., Ltd., AN100, non-alkali glass) having a length of 370 mm × width of 320 mm × thickness of 0.4 mm obtained by the float method was used as the support plate. Then, a resin layer was formed on the glass plate and fixed.

In Example 2, Example 1 was used except that a glass substrate (manufactured by Asahi Glass Co., Ltd., AN100, alkali-free glass) having a length of 370 mm × width of 320 mm × thickness of 0.3 mm obtained by the float process was used as the device substrate. In the same manner as described above, the resin layer fixed on the glass plate was adhered to the first main surface of the glass substrate.

Thus, a laminate block substantially identical to the laminate block shown in FIG. 2 was obtained. The obtained laminated body block was cut | disconnected in the thickness direction, and the outer peripheral part of the laminated body block was removed by width 10mm over the circumferential direction perimeter. Specifically, a scribe line is formed on the second main surface of the glass substrate using a glass cutter, and a scribe line is formed on the main surface of the glass plate using the glass cutter, and then the laminate block is bent and deformed. The laminate was cleaved along the scribe line, and the outer peripheral portion of the laminate block was removed over the entire circumference.

In this state, the outer peripheral surfaces of the glass substrate, the glass plate, and the resin layer were aligned over the entire circumferential direction, and the outer peripheral surface of the laminate block was flattened over the entire circumferential direction. Moreover, the ditch | groove was not looked at by the outer peripheral surface of the laminated body block.

The corner of the outer peripheral surface of this laminate block was chamfered over the entire circumference in the circumferential direction using a grindstone. The chamfer dimension was a curvature radius R = 0.4 (unit: mm).

Next, in the same manner as in Example 1, the chamfered laminate block was dipped in a resist solution, washed and dried, and the outer peripheral surface of the laminate was observed with a microscope. As a result, no resist solution residue was observed.

(Comparative Example 1)
In Comparative Example 1, the laminate block before cutting obtained in the same manner as in Example 2 was immersed in a resist solution, washed and dried in the same manner as in Example 1, and then the outer periphery of the laminate was examined with a microscope. The surface was observed. As a result, a resist solution residue was observed.

Although the present invention has been described in detail and with reference to specific embodiments, it will be apparent to those skilled in the art that various changes and modifications can be made without departing from the spirit and scope of the invention.
This application is based on Japanese Patent Application 2010-012785 filed on January 25, 2010, the contents of which are incorporated herein by reference.

DESCRIPTION OF SYMBOLS 10 Laminated body block 11 Device board | substrate 111 1st main surface 112 2nd main surface 12 Support plate 13 Resin layer 14 Outer peripheral surface 15 Concave groove

Claims

A resin layer is interposed between the device substrate and the support plate, the resin layer is detachably adhered to the first main surface of the device substrate, and the laminate block fixed on the support plate has a predetermined size. The manufacturing method of a laminated body including the process of cut | disconnecting and flattening at least one circumferential direction part of the outer peripheral surface of the said laminated body block.
Furthermore, the manufacturing method of the laminated body of Claim 1 including the process of chamfering the corner | angular part of the planarized part of the outer peripheral surface of the said laminated body block.
The method for producing a laminate according to claim 1 or 2, wherein the planarized portion of the outer peripheral surface of the resin layer is substantially parallel to the thickness direction of the resin layer.
The device substrate is a glass substrate manufactured by a float process,
The manufacturing method of the laminated body of Claim 2 or 3 including the process of grind | polishing the 2nd main surface of the said device substrate after chamfering the said corner | angular part.
The method for producing a laminated body according to any one of claims 1 to 4, wherein the device substrate is a glass substrate having a thickness of 0.03 mm or more and less than 0.8 mm.
The method for producing a laminate according to any one of claims 1 to 5, wherein the resin layer includes at least one selected from the group consisting of an acrylic resin, a polyolefin resin, a polyurethane resin, and a silicone resin.
The method for producing a laminate according to any one of claims 1 to 6, wherein the resin layer has a thickness of 5 to 50 µm.
A resin layer is interposed between the device substrate and the support plate, the resin layer is detachably adhered to the first main surface of the device substrate, and the laminate block fixed on the support plate has a predetermined size. A laminate in which at least a part of the outer peripheral surface of the laminate block is planarized.