WO2010079688A1

WO2010079688A1 - Glass laminate and manufacturing method therefor

Info

Publication number: WO2010079688A1
Application number: PCT/JP2009/071379
Authority: WO
Inventors: 聡近藤; 智之清水
Original assignee: 旭硝子株式会社
Priority date: 2009-01-09
Filing date: 2009-12-24
Publication date: 2010-07-15
Also published as: CN102271908A; TW201033000A; JPWO2010079688A1; KR20110102439A

Abstract

Disclosed is a glass laminate, which comprises a thin sheet glass substrate having a first main surface and a second main surface, a support glass substrate having a first main surface and a second main surface, and an easily releasable resin layer, wherein the thin sheet glass substrate and the support glass substrate are laminated with the resin layer interposed therebetween so that the first main layer of the thin sheet glass substrate and the first main layer of the support glass substrate are tightly adhered with the resin layer affixed thereto, and wherein the thin sheet glass substrate is laminated so that at least part of the circumference of the first main surface of the thin sheet glass substrate protrudes from the circumference of the first main surface of the support glass substrate.

Description

Glass laminate and method for producing the same

The present invention relates to a glass laminate including a glass substrate used for a liquid crystal display device, an organic EL display device and the like, and a method for producing the same.

In the field of liquid crystal display devices (LCD), organic EL display devices (OLED), especially portable display devices such as mobile phones and digital cameras, weight reduction and thinning of display devices are important issues.
In order to cope with this problem, it is desired to further reduce the thickness of the glass substrate used in the display device. As a method for reducing the thickness of the glass substrate, generally, before or after the display device member is formed on the surface of the glass substrate, the glass substrate is etched using hydrofluoric acid or the like, and further if necessary. A method of thinning by physical polishing is performed.

However, if the thickness of the glass substrate is reduced by performing an etching process or the like before forming the display device member on the surface of the glass substrate, the strength of the glass substrate is lowered and the amount of deflection is increased. Therefore, there arises a problem that it is difficult to process the existing display device member production line.
In addition, if the glass substrate is thinned by performing an etching process after forming the display device member on the surface of the glass substrate, the fineness formed on the surface of the glass substrate in the process of forming the display device member on the surface of the glass substrate. There arises a problem in that a simple flaw appears, that is, a problem that etch pits occur.

Therefore, for the purpose of solving such problems, a thin glass substrate (hereinafter also referred to as “thin glass substrate”) is bonded to another supporting glass substrate to form a glass laminate, and in that state, A method of performing a predetermined process for manufacturing a display device and then separating the thin glass substrate and the supporting glass substrate has been proposed.

For example, Patent Document 1 discloses a thin glass laminate obtained by laminating a thin glass substrate and a supporting glass substrate, and the thin glass substrate and the supporting glass substrate are easily peelable and non-adhesive. The thin glass laminated body characterized by being laminated | stacked through the silicone resin layer which has is described.

International Publication No. 2007/018028 Pamphlet

In Patent Document 1, it is described that the relative size relationship between the thin glass substrate and the supporting glass substrate is preferably the same size as or larger than the thin glass substrate. In other words, Patent Document 1 shows that the outer periphery of the first main surface of the thin glass substrate enters the inner peripheral side of the outer periphery of the first main surface of the support glass substrate. In this configuration, when the thin glass substrate is introduced into the step of peeling from the supporting glass substrate, the following problems are assumed. When the peeling blade is inserted into the boundary between the thin glass substrate and the resin layer, the peeling blade is not inserted into the boundary but inserted into the resin layer. For this reason, the resin layer is partially destroyed by the peeling blade, and a problem that a part of the destroyed resin layer remains attached to the thin glass substrate occurs.

FIG. 5 and FIG. 6 are enlarged cross-sectional views showing end portions of a conventional glass laminate. 5 shows the outer periphery of the first main surface 53a of the supporting glass substrate 53 and the first main surface 52a of the thin glass substrate 52 when the glass laminate 50 is viewed from the second main surface 52b side of the thin glass substrate 52. It is an expanded sectional view near the edge part of the glass laminated body 50 of the form which the outer periphery overlaps substantially. That is, the thin glass substrate 52 and the supporting glass substrate 53 have the same size. 6 shows that the outer periphery of the first main surface 63a of the support glass substrate 63 is the first main surface of the thin glass substrate 62 when the glass laminate 60 is viewed from the second main surface 62b side of the thin glass substrate 62. It is an expanded sectional view of the edge part vicinity of the glass laminated body 60 of the form which protrudes outside from the outer periphery of the surface 62a. That is, the supporting glass substrate 63 is larger than the thin glass substrate 62.

When the

thin glass substrates

52 and 62 are put into the process of peeling from the supporting glass substrates 53 and 63 in the form of the

glass laminates

50 and 60 in FIGS. 5 and 6, the tip of the peeling blade 15 is the first of the thin glass substrates. Instead of being inserted at the boundary between the main surfaces 52a, 62a and the resin layers 54, 64, it is inserted so as to bite into the resin layers 54, 64. For this reason, the peeling blade 15 breaks the resin layers 54 and 64 and is peeled from the supporting glass substrates 53 and 63 while a part of the resin layer remains on the first main surfaces 52a and 62a of the thin glass substrate.

In addition, it is conceivable to provide a recessed portion at the end of the supporting glass substrate to facilitate peeling of the thin glass substrate. However, a process for providing the recessed portion in the supporting glass substrate is required, and the glass laminate production time Will cause an extra problem.

The present inventor has intensively studied in order to solve the above problems, and has completed the present invention.
That is, the present invention relates to the following (1) to (8).

(1) A thin glass substrate having a first main surface and a second main surface, a supporting glass substrate having a first main surface and a second main surface, and an easily peelable resin layer, A glass laminate in which the thin glass substrate and the support glass substrate are laminated via the resin layer so that the first main surface and the resin layer fixed to the first main surface of the support glass substrate are in close contact with each other. Body,
A glass laminate in which the thin glass substrate is laminated such that at least a part of the outer periphery of the first main surface of the thin glass substrate protrudes from the outer periphery of the first main surface of the support glass substrate.
(2) The first main surface of the thin glass substrate and the first main surface of the support glass substrate have a rectangular shape, and the longitudinal and / or horizontal lengths of the first main surface of the thin glass substrate The glass laminate according to (1), wherein the length is longer than each of the vertical and / or horizontal lengths of the first main surface of the support glass substrate.
(3) The vertical and / or horizontal lengths of the first main surface of the thin glass substrate are 0.2 mm longer than the vertical and / or horizontal lengths of the first main surface of the supporting glass substrate. To 20 mm longer, the glass laminate according to (1) or (2).
(4) The entire outer periphery of the first main surface of the thin glass substrate protrudes outward from the outer periphery of the first main surface of the support glass substrate, according to any one of (1) to (3) Glass laminate.
(5) The glass laminate according to any one of (1) to (4), wherein the resin forming the resin layer is at least one selected from an acrylic resin, a polyolefin resin, a polyurethane resin, and a silicone resin.
(6) The glass laminate according to any one of (1) to (5), wherein the resin layer has a thickness of 5 to 50 μm.
(7) The glass laminate according to any one of (1) to (6), wherein a difference in linear expansion coefficient between the thin glass substrate and the supporting glass substrate is 150 × 10 ⁻⁷ / ° C. or less.
(8) The method for producing a glass laminate according to any one of (1) to (7), wherein a resin layer is formed and fixed on the first main surface of the supporting glass substrate. The manufacturing method of a glass laminated body including a layer formation process and the contact | adherence process of closely_contact | adhering the said resin layer fixed on the 1st main surface of the said supporting glass substrate to the 1st main surface of the said thin glass substrate.

Furthermore, the present inventor has completed the following invention relating to the following display device panel and display device formed using the glass laminate or the manufacturing method of the present invention.
(9) A panel for a display device with a support, comprising a display device member on a second main surface of the thin glass substrate in the glass laminate according to any one of (1) to (7).
(10) A display device panel formed using the support-equipped display device panel according to (9).
(11) A display device having the display device panel according to (10).
(12) The method for producing a glass laminate according to (8), and a step of forming a display device member on the second main surface of the thin glass substrate in the obtained glass laminate. Manufacturing method of panel for display device.
(13) The method for manufacturing a display device panel with a support according to (12) above, and the thin glass substrate and the support glass substrate in the obtained display device panel with a support, The manufacturing method of the panel for display apparatuses including the peeling process which peels from the location which protrudes from this support glass substrate as a starting point.
(14) A method for manufacturing a display device panel according to (13), and a method for manufacturing a display device, including a step of obtaining a display device using the obtained display device panel.

The glass laminate obtained by the present invention does not require special processing on the supporting glass substrate, and in the step of peeling the thin glass substrate from the supporting glass substrate, the thin glass glass adhered without destroying the resin layer The substrate and the resin layer can be peeled easily and in a short time.
Furthermore, according to the manufacturing method of the glass laminated body of this invention, generation | occurrence | production of the glass defect by foreign materials, such as a bubble mixed between glass substrates and dust, and generation | occurrence | production of an etch pit can be suppressed.
Moreover, the panel for display apparatuses with a support containing such a glass laminated body can be provided. In addition, it is possible to provide a display device panel and a display device that are formed using such a support-equipped display device panel.
Furthermore, a display device panel with a support, a display device panel, and a method for manufacturing the display device can be provided.

FIG. 1 is a schematic front view showing an embodiment of the glass laminate of the present invention. FIG. 2 is a schematic cross-sectional view showing a cross section AA ′ of FIG. FIG. 3 is a schematic cross-sectional view showing an end of an embodiment of the glass laminate of the present invention. 4 (a), (b) and (c) are schematic front views showing another embodiment of the glass laminate of the present invention. FIG. 5 is a schematic cross-sectional view showing an end of an embodiment of a conventional glass laminate. FIG. 6 is a schematic cross-sectional view showing an end portion of an embodiment of a conventional glass laminate.

実施 An embodiment of the glass laminate of the present invention will be described with reference to the drawings.

FIG. 1 is a schematic front view showing an embodiment of a glass laminate of the present invention (hereinafter also simply referred to as “laminate”), and FIG. 2 is a cross-sectional view along AA ′ (schematic cross-sectional view) of FIG. is there.

The laminated body 10 of this embodiment has the thin glass substrate 12, the support glass substrate 13, and the resin layer 14, and is laminated | stacked so that the resin layer 14 may be pinched | interposed with both glass substrates.
As shown in FIG. 1, when viewed from the front, the laminate 10 of the present embodiment has a thin glass substrate 12, a resin layer 14, and a supporting glass substrate 13 each having a rectangular shape, and the first main body of the thin glass substrate 12. At least a part of the outer periphery of the surface 12 a is positioned so as to protrude outward in the main surface direction from the outer periphery of the first main surface 13 a of the support glass substrate 13.

The resin layer 14 is fixed to the first main surface 13 a of the supporting glass substrate 13 and is in close contact with the first main surface 12 a of the thin glass substrate 12. Further, the resin layer 14 is easily peelable from the first main surface 12 a of the thin glass substrate 12. Here, of the two main surfaces of the thin glass substrate 12, the main surface on the support glass substrate 13 side (resin layer 14 side) is the first main surface 12a, and the opposite main surface is the second main surface. It is the surface 12b. Of the two main surfaces of the supporting glass substrate 13, the main surface of the thin glass substrate 12 (the side where the resin layer 14 is present) is the first main surface 13a, and the main surface on the opposite side is the second main surface. This is the main surface 13b.

FIG. 3 shows a laminate according to this embodiment in which a part of the outer periphery of the first main surface 12 a of the thin glass substrate 12 protrudes outward from a part of the outer periphery of the first main surface 13 a of the support glass substrate 13. FIG. In this case, the tip of the peeling blade 15 is abutted against the first main surface 12a of the thin glass substrate 12 so as not to damage the first main surface 12a toward the boundary between the thin glass substrate 12 and the resin layer 14. You can slide on. By sliding the peeling blade 15, the tip of the peeling blade 15 is inserted at the boundary between the thin glass substrate 12 and the resin layer 14 without destroying the resin layer 14, and the thin glass substrate 12 is supported by the supporting glass substrate 13. It becomes possible to peel from.

Next, each of the thin glass substrate, the supporting glass substrate, and the resin layer included in the laminate of the present embodiment will be described.

The thin glass substrate in the present invention will be described.
The thickness, shape, size, physical properties (thermal shrinkage, surface shape, chemical resistance, etc.), composition, etc. of the thin glass substrate are not particularly limited. For example, a glass substrate for a display device such as a conventional LCD or OLED It may be the same.

The thickness of the thin glass substrate is not particularly limited, but is preferably less than 0.7 mm, more preferably 0.5 mm or less, and further preferably 0.4 mm or less. Further, it is preferably 0.05 mm or more, more preferably 0.07 mm or more, and further preferably 0.1 mm or more.

The shape of the thin glass substrate is not limited, but is preferably rectangular. Here, the rectangle is substantially a rectangle and includes a shape in which the corners of the peripheral part are cut off (corner cut).

Although the size of the thin glass substrate is not limited, for example, in the case of a rectangle, it may be 100 to 2000 mm × 100 to 2000 mm, and preferably 500 to 1000 mm × 500 to 1000 mm.

Even if it is such a preferable thickness and preferable size, the laminated body of this embodiment can peel a thin glass substrate and a support glass substrate easily.
Properties of the thin glass substrate such as heat shrinkage, surface shape, chemical resistance and the like are not particularly limited, and vary depending on the type of display device to be manufactured.
However, it is preferable that the thermal contraction rate of the thin glass substrate is small. Specifically, it is preferable to use a material having a linear expansion coefficient of 150 × 10 ⁻⁷ / ° C. or less, which is an index of heat shrinkage, more preferably 100 × 10 ⁻⁷ / ° C. or less, and 45 × 10 10. More preferably, it is ⁻⁷ / ° C. or lower. The reason is that it is difficult to make a high-definition display device when the thermal contraction rate is large. The linear expansion coefficient of the thin glass substrate is preferably 0 / ° C. or higher.

In addition, in this invention, a linear expansion coefficient means a thing prescribed | regulated to JISR3102 (1995).

The composition of the thin glass substrate may be the same as, for example, conventionally known glass containing alkali metal oxide or non-alkali glass. Among these, alkali-free glass is preferable because of its low thermal shrinkage rate.

Next, the supporting glass substrate in the present invention will be described.
The supporting glass substrate supports the thin glass substrate through the resin layer and reinforces the strength of the thin glass substrate.

The thickness, shape, physical properties (heat shrinkage rate, surface shape, chemical resistance, etc.), composition, etc. of the supporting glass substrate are not particularly limited.

The thickness of the supporting glass substrate is not particularly limited, but it is necessary that the thickness of the laminated body of the present embodiment be a thickness that can be processed in the current manufacturing process of a member for a display device.
For example, the thickness is preferably 0.1 to 1.1 mm, more preferably 0.3 to 0.8 mm, and still more preferably 0.4 to 0.7 mm.
For example, when the current manufacturing process is designed to process a substrate having a thickness of 0.5 mm, and the thickness of the thin glass substrate is 0.1 mm, the thickness of the supporting glass substrate and the resin layer The sum with the thickness is 0.4 mm. The current production line is most commonly designed to process a glass substrate having a thickness of 0.7 mm. For example, if the thickness of a thin glass substrate is 0.4 mm, the supporting glass The sum of the thickness of the substrate and the thickness of the resin layer is 0.3 mm.

The thickness of the supporting glass substrate is preferably thicker than that of the thin glass substrate.

The shape of the supporting glass substrate is not limited, but is preferably rectangular. However, the rectangle here is substantially a substantially rectangular shape, and includes a shape in which the corners of the peripheral portion are cut off (corner cut).

The size of the supporting glass substrate in the present invention is not limited, but is preferably smaller than the thin glass substrate. That is, it is preferable that the vertical and / or horizontal lengths of the first main surface of the supporting glass substrate are shorter than the vertical and / or horizontal lengths of the first main surface of the thin glass substrate. Here, the vertical is the short side direction of the thin glass substrate in FIG. 1 and the direction of the arrow Xa, and the horizontal is the long side direction of the thin glass substrate and the direction of the arrow Xb in FIG. It means that there is. The range of the difference between the vertical length and / or the horizontal length between the thin glass substrate and the supporting glass substrate is preferably 0.2 mm or more and 20 mm or less. It is preferable that the difference in length is 0.2 mm or more and 20 mm or less because in the step of peeling the thin glass substrate from the supporting glass substrate, the resin layer can be prevented from being broken by the cutting blade. Furthermore, the protruding portion of the thin glass substrate is preferable because it is difficult to bend and break. The difference in length is more preferably 2 mm or more and 15 mm or less.

In addition, the number of portions where a part of the outer periphery of the first main surface of the thin glass substrate protrudes outside the outer periphery of the first main surface of the supporting glass substrate is not particularly limited. For example, FIGS. 4A to 4C are schematic front views of other embodiments of the laminate of the present invention. In these drawings, for easy understanding, only the first main surface of the thin glass substrate and the first main surface of the supporting glass substrate are shown.

4A, two of the four sides of the first main surface 42a of the thin glass substrate protrude outward from the outer periphery of the first main surface 43a of the support glass substrate. In the embodiment in FIG. 4B, three sides out of the four sides of the first main surface 42a of the thin glass substrate protrude outward from the outer periphery of the first main surface 43a of the support glass substrate. In the embodiment in FIG. 4C, all four sides of the first main surface 42a of the thin glass substrate protrude outward from the outer periphery of the first main surface 43a of the support glass substrate. Among these embodiments shown in FIGS. 4A to 4C, the embodiment shown in FIG. 4C is preferable. The reason is as follows. In the process of peeling the thin glass substrate from the support glass substrate, check the thin glass glass protruding direction of the laminated body so that the insertion direction of the peeling blade and the thin glass substrate protruding direction of the laminated body face each other and put into the process Work is required. If all the outer periphery of the 1st main surface of a thin glass substrate protrudes outside rather than the outer periphery of the 1st main surface of a support glass substrate like embodiment of FIG.4 (c), the thin glass protrusion direction of a laminated body This is preferable because the work of confirming the above becomes unnecessary.

The linear expansion coefficient of the supporting glass substrate may be substantially the same as or different from the linear expansion coefficient of the thin glass substrate. Substantially the same is preferable in that the thin glass substrate or the supporting glass substrate is less likely to warp when the laminate of this embodiment is heat-treated.
The difference in coefficient of linear expansion between the thin glass substrate and the supporting glass substrate is preferably 150 × 10 ⁻⁷ / ° C. or less, more preferably 100 × 10 ⁻⁷ / ° C. or less, and 50 × 10 ⁻⁷ / ° C. More preferably, it is not higher than ° C.

The composition of the supporting glass substrate may be the same as, for example, glass containing an alkali metal oxide or non-alkali glass. Among these, alkali-free glass is preferable because of its low thermal shrinkage rate.

Next, the resin layer in the present invention will be described.
In the laminate of this embodiment, the resin layer is fixed to the first main surface of the support glass substrate. And although the resin layer is closely_contact | adhered with the 1st main surface of the said thin glass substrate, it can peel easily. That is, the resin layer has easy peelability from the thin glass substrate.
In the laminate of this embodiment, the resin layer and the thin glass substrate are not attached by the adhesive force that the adhesive has, but are attached by the force caused by van der Waals force between solid molecules, that is, the adhesive force. ing.

The thickness of the resin layer is not particularly limited. It is preferably 5 to 50 μm, more preferably 5 to 30 μm, and even more preferably 7 to 20 μm. This is because when the thickness of the resin layer is in such a range, the thin glass substrate and the resin layer are sufficiently adhered. Moreover, even if bubbles or foreign substances are present, it is possible to suppress the occurrence of distortion defects in the thin glass substrate. On the other hand, if the resin layer is too thick, it takes time and materials to form the resin layer, which is not economical.

In addition, the resin layer may consist of two or more layers. In this case, “the thickness of the resin layer” means the total thickness of all the resin layers.
Moreover, when a resin layer consists of two or more layers, the kind of resin which forms each layer may differ.

The resin layer preferably has a surface tension of 30 mN / m or less, more preferably 25 mN / m or less, and even more preferably 22 mN / m or less. This is because such surface tension can be more easily peeled off from the thin glass substrate, and at the same time, the close contact with the thin glass substrate becomes sufficient. The resin layer preferably has a surface tension of 15 mN / m or more.

The glass transition point of the resin layer is preferably lower than room temperature (about 25 ° C.) or made of a material having no glass transition point. This is because it becomes a non-adhesive resin layer, is more easily peelable, can be more easily peeled off from the thin glass substrate, and at the same time is sufficiently adhered to the thin glass substrate.

The resin layer preferably has heat resistance. For example, when the display device member is formed on the second main surface of the thin glass substrate, the laminate of this embodiment can be subjected to heat treatment.

Also, if the elastic modulus of the resin layer is too high, the adhesion with the thin glass substrate tends to be lowered. Moreover, when an elastic modulus is too low, easy peelability will become low.

The type of resin that forms the resin layer is not particularly limited. For example, acrylic resin, polyolefin resin, polyurethane resin, and silicone resin can be mentioned. Several types of resins can be mixed and used. Of these, silicone resins are preferred. This is because the silicone resin is excellent in heat resistance and easy to peel from a thin glass substrate. Moreover, it is because it is easy to fix to a support glass substrate by the condensation reaction with the silanol group of the support glass substrate surface. It is also preferable that the silicone resin layer is not easily deteriorated even if it is treated at about 300 to 400 ° C. for about 1 hour, for example.

The resin layer is preferably made of silicone for release paper among silicone resins, and is preferably a cured product thereof. The silicone for release paper is mainly composed of silicone containing linear dimethylpolysiloxane in the molecule. The resin layer formed by curing the composition containing the main agent and the crosslinking agent on the surface (first main surface) of the supporting glass substrate using a catalyst, a photopolymerization initiator, etc. has excellent easy peelability. Since it has, it is preferable. Moreover, since the flexibility is high, even if foreign matters such as bubbles and dust are mixed between the thin glass substrate and the resin layer, the occurrence of distortion defects of the thin glass substrate can be suppressed.

Such release paper silicones are classified into condensation reaction type silicones, addition reaction type silicones, ultraviolet ray curable silicones, and electron beam curable silicones depending on the curing mechanism, and any of them can be used. Among these, addition reaction type silicone is preferable. This is because the curing reaction is easy, the degree of easy peeling is good when the resin layer is formed, and the heat resistance is also high.

Moreover, the silicone for release paper is classified into a solvent type, an emulsion type, and a solventless type, and any type can be used. Among these, a solventless type is preferable. This is because productivity, safety, and environmental characteristics are excellent. Further, since a solvent that causes foaming is not included at the time of curing when forming the resin layer, that is, at the time of heat curing, ultraviolet curing, or electron beam curing, bubbles are unlikely to remain in the resin layer.

Further, as the release paper silicone, specifically, commercially available product names or model numbers are KNS-320A, KS-847 (both manufactured by Shin-Etsu Silicone), TPR6700 (GE Toshiba Silicone), vinyl silicone “8500”. (Arakawa Chemical Industries, Ltd.) and methylhydrogenpolysiloxane "12031" (Arakawa Chemical Industries, Ltd.), vinyl silicone "11364" (Arakawa Chemical Industries, Ltd.) and methylhydrogenpolysiloxane " 12031 "(made by Arakawa Chemical Co., Ltd.), vinyl silicone" 11365 "(made by Arakawa Chemical Co., Ltd.) and methylhydrogenpolysiloxane" 12031 "(made by Arakawa Chemical Co., Ltd.), etc. It is done.
KNS-320A, KS-847, and TPR6700 are silicones that contain a main agent and a crosslinking agent in advance.

Further, it is preferable that the silicone resin forming the resin layer has a property that the components in the silicone resin layer are difficult to migrate to the thin glass substrate, that is, low silicone migration.

A panel for a display device with a support can be obtained by forming a display device member on the second main surface of the thin glass substrate in the laminate of this embodiment.
Display device members include various circuits such as a light emitting layer, a protective layer, a color filter, a liquid crystal, and a transparent electrode made of indium tin oxide (ITO) on a surface of a glass substrate for a display device such as a conventional LCD or OLED. Means a pattern.

Also, a display device can be obtained from such a display device panel. Examples of the display device include an LCD and an OLED. Examples of LCD include TN type, STN type, FE type, TFT type, and MIM type.

Next, an example of the manufacturing method of the laminated body of this embodiment is demonstrated.
Although the manufacturing method of the laminated body of this embodiment is not particularly limited, a resin layer forming step of forming and fixing an easily peelable resin layer on the first main surface of the support glass substrate, and a process for forming the thin glass substrate. It is preferable that it is a manufacturing method of a glass laminated body including the contact | adherence process of closely_contact | adhering the said resin layer fixed on the 1st main surface of the said support glass substrate to 1 main surface. Hereinafter, such a manufacturing method is also referred to as “the manufacturing method of the present embodiment”.

The manufacturing method of the thin glass substrate and the supporting glass substrate itself used in the manufacturing method of the present embodiment is not particularly limited. For example, it can be produced by a conventionally known method. For example, it can be obtained by melting a conventionally known glass raw material to form a molten glass and then forming it into a plate shape by a float method, a fusion method, a down draw method, a slot down method, a redraw method or the like.

The resin layer formation process in the manufacturing method of this embodiment is demonstrated.
The method for forming the resin layer on the surface (first main surface) of the supporting glass substrate is not particularly limited. For example, a method of adhering a film-like resin to the surface of a supporting glass substrate can be mentioned. Specifically, in order to give a high adhesive force to the surface of the film, a method of performing surface modification treatment (priming treatment) on the surface of the supporting glass substrate and adhering to the first main surface of the supporting glass substrate can be mentioned. . For example, chemical methods such as silane coupling agents to improve adhesion (primer treatment), physical methods to increase surface active groups such as flame (flame) treatment, and surfaces such as sandblast treatment Examples of such a mechanical processing method increase the catch by increasing the roughness of the material.

Further, for example, a method of coating a resin composition that becomes a resin layer on the first main surface of the supporting glass substrate by a known method may be mentioned. Known methods include spray coating, die coating, spin coating, dip coating, roll coating, bar coating, screen printing, and gravure coating. From such a method, it can select suitably according to a kind to a resin composition.

When the resin composition is coated on the first main surface of the supporting glass substrate, the coating amount is preferably 1 to 100 g / m ² , and more preferably 5 to 20 g / m ² .

For example, when forming a resin layer from an addition reaction type silicone, a resin composition containing a silicone (main agent) containing a linear dimethylpolysiloxane in the molecule, a crosslinking agent and a catalyst is used for the known spray coating method or the like. It is coated on a supporting glass substrate by the method, and then cured by heating. The heating and curing conditions vary depending on the blending amount of the catalyst. For example, when 2 parts by weight of a platinum-based catalyst is blended with respect to 100 parts by weight of the total amount of the main agent and the cross-linking agent, The reaction is preferably carried out at 100 ° C to 200 ° C. In this case, the reaction time is 5 to 60 minutes, preferably 10 to 30 minutes. In order to obtain a silicone resin layer having low silicone migration, it is preferable to proceed the curing reaction as much as possible so that an unreacted silicone component does not remain in the silicone resin layer. It is preferable that the reaction temperature and the reaction time are as described above because no unreacted silicone component remains in the silicone resin layer. If the reaction time is too long or the reaction temperature is too high, the oxidative decomposition of the silicone resin occurs at the same time, and a low molecular weight silicone component is produced, which may increase the silicone transferability. It is preferable to allow the curing reaction to proceed as much as possible so that an unreacted silicone component does not remain in the silicone resin layer in order to improve the peelability after the heat treatment.

For example, when the resin layer is manufactured using release paper silicone, the release paper silicone coated on the support glass substrate is heat-cured to form a silicone resin layer, and then the support glass substrate is bonded in the adhesion step. A thin glass substrate is laminated on the silicone resin forming surface. By curing the release paper silicone with heat, the cured silicone resin is chemically bonded to the supporting glass substrate. Further, the silicone resin layer is bonded to the supporting glass substrate by the anchor effect. By these actions, the silicone resin layer is firmly fixed to the supporting glass substrate.

The adhesion process will be described.
The adhesion process is a process in which the resin layer fixed on the first main surface of the supporting glass substrate is adhered to the first main surface of the thin glass substrate. The thin glass substrate and the resin layer are brought into close contact with the resin layer by a force caused by van der Waals force between the adjacent solid molecules that are very close to each other, that is, an adhesive force. In this case, the support glass substrate, the thin glass substrate, and the resin layer can be held in a laminated state.

The method for laminating the thin glass substrate on the surface of the resin layer fixed to the supporting glass substrate is not particularly limited. For example, it can implement using a well-known method. For example, after laminating a thin glass substrate on the surface of the resin layer under a normal pressure environment, a method of pressure bonding the resin layer and the thin glass substrate using a roll or a press can be mentioned. It is preferable because the resin layer and the thin glass substrate are more closely adhered by pressure bonding with a roll or a press. In addition, it is preferable because bubbles mixed between the resin layer and the thin glass substrate are relatively easily removed by pressure bonding with a roll or a press. When pressure bonding is performed by a vacuum laminating method or a vacuum pressing method, it is more preferable because suppression of bubble mixing and securing of good adhesion are more preferably performed. By press-bonding under vacuum, even if minute bubbles remain, there is an advantage that the bubbles do not grow by heating and are less likely to cause distortion defects of the thin glass substrate.

In the adhesion step, when the thin glass substrate is laminated on the surface of the resin layer of the supporting glass substrate, it is preferable that the surface of the thin glass substrate is sufficiently washed and laminated in a clean environment. Even if a foreign substance enters between the resin layer and the thin glass substrate, the resin layer is deformed, so the flatness of the surface of the thin glass substrate is not affected. However, the higher the cleanness, the better the flatness. Therefore, it is preferable.

The glass laminate of this embodiment can be produced by the production method of this embodiment.

According to the manufacturing method of the glass laminate of the present embodiment, the manufacturing method further includes a step of forming a member for a display device on the second main surface of the thin glass substrate in the obtained glass laminate of the present embodiment. A panel for a display device with a support can be produced.
Here, the display device member is not particularly limited. For example, an array or a color filter included in the LCD can be mentioned. Further, for example, a transparent electrode, a hole injection layer, a hole transport layer, a light emitting layer, and an electron transport layer included in the OLED can be given.

A method for forming such a display device member is not particularly limited, and may be the same as a conventionally known method.
For example, when manufacturing a TFT-LCD as a display device, a step of forming an array on a conventionally known glass substrate, a step of forming a color filter, a glass substrate on which an array is formed, and a glass substrate on which a color filter is formed May be the same as various steps such as a step of bonding together through a sealing material or the like (array / color filter bonding step). More specifically, examples of the process performed in these steps include pure water cleaning, drying, film formation, resist solution application, exposure, development, etching, and resist removal. Furthermore, as a process performed after implementing an array * color filter bonding process, there exist a liquid crystal injection process and a liquid crystal injection port sealing process, and the process implemented by these processes is mentioned.
Taking the case of manufacturing an OLED as an example, as a process for forming an organic EL structure on the second main surface of a thin glass substrate, a process of forming a transparent electrode, a hole injection layer, a hole transport layer, Various processes such as a process for depositing a light emitting layer / electron transport layer and the like, a sealing process, and the like are performed. Specifically, for example, a film forming process, a vapor deposition process, and an adhesion of a sealing plate are performed. Processing and the like.

In this way, a display panel with a support can be manufactured.

Moreover, after obtaining such a panel for a display device with a support, the thin glass substrate and the support glass substrate in the obtained panel for a display device with a support are further peeled (peeling step). A panel for a display device can be obtained.

The display device panel can be manufactured, for example, by peeling the thin glass substrate and the support glass substrate in the support-equipped display device panel obtained by the manufacturing method of the present embodiment as described above. it can. The method for peeling is not particularly limited. Specifically, for example, the peeling blade is applied to the first main surface of the thin glass substrate that protrudes outside the outer periphery of the first main surface of the support glass substrate. Next, the cutting blade is slid on the first main surface of the thin glass substrate toward the boundary between the thin glass substrate and the resin layer. Then, a peeling blade can be inserted into the boundary to give a trigger for peeling, and then a mixed fluid of water and compressed air is sprayed onto the boundary to peel the thin glass substrate. Preferably, it is installed on a surface plate so that the supporting glass substrate of the display device-equipped panel is on the upper side and the panel side is on the lower side. Thereafter, the panel-side substrate is vacuum-sucked on the surface plate (if the supporting glass substrates are laminated on both surfaces, the steps are sequentially performed). In this state, the peeling blade is abutted against the first main surface of the thin glass substrate, and the first main surface of the thin glass substrate is slid toward the boundary between the thin glass substrate and the resin layer, and is peeled to the boundary. Insert the tool. Thereafter, a mixed fluid of water and compressed air is sprayed on the boundary between the thin glass substrate and the resin layer, and the end portion of the supporting glass substrate is pulled vertically upward. Then, an air layer is formed at the boundary between the resin layer and the thin glass substrate, the air layer spreads over the entire boundary, and the supporting glass substrate can be easily peeled off (the thin plate on the front side and the back side of the display device). If a supporting glass substrate is laminated on both of the glass substrates, repeat this operation one side at a time).

Furthermore, a display device can be manufactured by a manufacturing method including a step of obtaining a display device using the obtained display device panel.
Here, the operation in the step of obtaining the display device is not particularly limited, and for example, the display device can be produced by a conventionally known method.

Example 1
First, a supporting glass substrate (Asahi Glass Co., Ltd., AN100) having a length of 715 mm, a width of 595 mm, a plate thickness of 0.4 mm, and a linear expansion coefficient of 38 × 10 ⁻⁷ / ° C. is prepared. Cleaned.

Next, a mixture of 100 parts by mass of solvent-free addition reaction type release paper silicone and 2 parts by mass of platinum-based catalyst is screen-printed on the first main surface of the supporting glass substrate in a size of 714 mm in length and 594 mm in width. The coating was carried out with a machine (coating amount 30 g / m ² ). And it heat-hardened in air | atmosphere for 30 minutes at 180 degreeC, and obtained the 20-micrometer-thick silicone resin layer.

Next, the first main surface (later contacted with a silicone resin layer) of a thin glass substrate (Asahi Glass Co., Ltd., AN100) having a length of 720 mm, a width of 600 mm, a plate thickness of 0.3 mm, and a linear expansion coefficient of 38 × 10 ⁻⁷ / ° C. The side surface) was cleaned with pure water and UV. Then, the surface of the silicone resin layer on the first main surface of the supporting glass substrate and the first main surface of the thin glass substrate are bonded together at room temperature by a vacuum press so that the centers of gravity of both the substrates overlap, Body A (laminated body A of the present invention) was obtained.

In such a glass laminate A according to Example 1, the thin glass substrate and the supporting glass substrate were in close contact with the silicone resin layer without generating bubbles, and had no convex defects and good smoothness. .

(Example 2)
Example 2 was the same as Example 1, but a thin glass substrate with a thinner plate thickness was used.
First, a supporting glass substrate (Asahi Glass Co., Ltd., AN100) having a length of 718 mm, a width of 598 mm, a thickness of 0.6 mm, and a linear expansion coefficient of 38 × 10 ⁻⁷ / ° C. was cleaned with pure water and UV to clean the surface. .

Next, as the resin for forming the resin layer, linear polyorganosiloxane having vinyl groups at both ends and methyl hydrogen polysiloxane having hydrosilyl groups in the molecule were used. And this is mixed with a platinum-type catalyst, a mixture is prepared, and it coats with a die coat apparatus with a size of 715 mm in length and 595 mm in width on the first main surface of the supporting glass substrate (coating amount 20 g / m ^2). ), And cured by heating in the air at 180 ° C. for 30 minutes to form a silicone resin layer having a thickness of 20 μm. Here, the mixing ratio of the linear polyorganosiloxane and the methylhydrogen polysiloxane was adjusted so that the molar ratio of hydrosilyl group to vinyl group was 1/1. The platinum-based catalyst was added in an amount of 5 parts by mass with respect to a total of 100 parts by mass of the linear polyorganosiloxane and methyl hydrogen polysiloxane.
Next, as a thin glass substrate, a glass substrate (AN100 manufactured by Asahi Glass Co., Ltd.) having a length of 720 mm, a width of 600 mm, a thickness of 0.1 mm, and a linear expansion coefficient of 38 × 10 ⁻⁷ / ° C. is used. The surface of the silicone resin layer on the main surface and the thin glass substrate were bonded to each other so that the centers of gravity of the two substrates overlap each other at room temperature by vacuum pressing to obtain a laminated glass laminate B (laminate B of the present invention).

In such a glass laminate B according to Example 2, the thin glass substrate and the supporting glass substrate were in close contact with the silicone resin layer without generating bubbles, and had no convex defects and good smoothness. .

(Example 3)
In this example, an LCD is manufactured using the glass laminate B obtained in Example 2.
Two glass laminates B are prepared, and one is subjected to an array forming process to form an array on the second main surface of the thin glass substrate. The remaining one sheet is subjected to a color filter forming process to form a color filter on the second main surface of the thin glass substrate.

After the glass laminate on which the array is formed and the glass laminate on which the color filter is formed are bonded together via a sealing material, a stainless steel cutting blade having a thickness of 0.25 mm is attached to the first support glass substrate. It abuts against the first main surface of the thin glass substrate protruding outward from the outer periphery of the main surface. Next, the first cutting surface of the thin glass substrate is slid toward the boundary between the thin glass substrate and the resin layer, and a peeling blade is inserted into the boundary. Thereafter, a mixed fluid of compressed air and water is sprayed toward the boundary, and each supporting glass substrate is peeled off. There is no scratch on the resin layer fixed on the support glass substrate after peeling, and no resin remains on the thin glass substrate.

Subsequently, the glass substrate from which the supporting glass substrate has been peeled is cut and divided into 168 cells of 51 mm in length and 38 mm in width, and then a liquid crystal injection step and an injection port sealing step are performed to form a liquid crystal cell. A step of attaching a polarizing plate to the formed liquid crystal cell is performed, and then a module formation step is performed to obtain an LCD. The LCD obtained in this way does not have a problem in characteristics.

Example 4
In this example, an LCD is manufactured using the glass laminate A obtained in Example 1.
Two glass laminates A are prepared, and one is subjected to an array forming process to form an array on the second main surface of the thin glass substrate. The remaining one sheet is subjected to a color filter forming process to form a color filter on the second main surface of the thin glass substrate.

After the glass laminate on which the array is formed and the glass laminate on which the color filter is formed are bonded together via a sealing material, a stainless steel cutting blade having a thickness of 0.25 mm is attached to the first support glass substrate. It abuts against the first main surface of the thin glass substrate protruding outward from the outer periphery of the main surface. Next, the first main surface of the thin glass substrate is slid toward the boundary between the thin glass substrate and the resin layer, and a peeling blade is inserted into the boundary. Then, after spraying the mixed fluid of water and compressed air toward the said boundary, each support glass substrate is peeled. There is no scratch on the resin layer fixed on the support glass substrate after peeling, and no resin remains on the thin glass substrate.

Subsequently, the thickness of each thin glass substrate is set to 0.15 mm by a chemical etching process. Etch pits that cause optical problems are not observed on the surface of the thin glass substrate after the chemical etching treatment.

Thereafter, the glass substrate from which the supporting glass substrate has been peeled is cut and divided into 168 cells of 51 mm in length and 38 mm in width, and then a liquid crystal injection step and an injection port sealing step are performed to form a liquid crystal cell. A step of attaching a polarizing plate to the formed liquid crystal cell is performed, and then a module formation step is performed to obtain an LCD. The LCD obtained in this way does not have a problem in characteristics.

(Example 5)
In this example, an OLED is manufactured using the glass laminate B obtained in Example 2.
Laminated glass substrate for the process of forming a transparent electrode, a process of forming an auxiliary electrode, a process of depositing a hole injection layer, a hole transport layer, a light emitting layer, an electron transport layer, etc., and a process of sealing them An organic EL structure is formed on the second main surface.

A stainless steel cutting blade having a thickness of 0.25 mm is abutted against the first main surface of the thin glass substrate protruding outward from the outer periphery of the first main surface of the supporting glass substrate. Next, the peeling blade is slid on the first main surface of the thin glass substrate toward the boundary between the thin glass substrate and the resin layer of the laminate, and is inserted into the boundary. Thereafter, a mixed fluid of compressed air and water is sprayed toward the boundary, and each supporting glass substrate is peeled off. There is no scratch on the resin layer fixed on the support glass substrate after peeling, and no resin remains on the thin glass substrate.

Subsequently, the thin glass substrate is cut using a laser cutter or a scribe-break method, and divided into 288 cells of 41 mm length × 30 mm width, and then the glass substrate on which the organic EL structure is formed and the counter substrate are separated. Assemble and perform module formation process to create OLED. The OLED obtained in this way does not have a problem in characteristics.

(Comparative Example 1)
The laminated body in this example was the same as Example 1 except that the vertical and horizontal sizes of the supporting glass substrate were changed to the same size as the thin glass substrate, that is, 720 mm long and 600 mm wide. In the obtained glass laminate C according to Comparative Example 1, the glass substrate was in close contact with the silicone resin layer without generating bubbles, there was no convex defect, and the smoothness was good.

Subsequently, two glass laminates C are prepared, and one is subjected to an array forming process to form an array on the second main surface of the thin glass substrate. The remaining one sheet is subjected to a color filter forming process to form a color filter on the second main surface of the thin glass substrate.

After the laminate having the array formed thereon and the laminate having the color filter formed thereon are bonded together via a sealing material, a stainless steel cutting blade having a thickness of 0.25 mm is applied to the first main surface of the thin glass substrate. Strike. Next, the first main surface of the thin glass substrate is slid toward the boundary between the thin glass substrate and the resin layer, and a peeling blade is inserted into the boundary. Then, after spraying the mixed fluid of water and compressed air toward the said boundary, each support glass substrate is peeled. The resin layer fixed on the supporting glass substrate after peeling is scratched by the cutting blade, and a part of the resin remains on the first main surface of the thin glass substrate. Therefore, in the display device manufacturing process, an extra step of scraping off a part of the resin adhering to the first main surface of the thin glass substrate with a razor or the like is necessary.

Although the invention has been described in detail and with reference to specific embodiments, it will be apparent to those skilled in the art that various changes and modifications can be made without departing from the spirit and scope of the invention.
This application is based on Japanese Patent Application No. 2009-003405 filed on Jan. 9, 2009, the contents of which are incorporated herein by reference.

薄 The thin glass substrate obtained by the present invention can be used as a glass substrate for various display devices.

10, 50, 60

Glass laminate

12, 52, 62 Thin glass substrate 12a, 42a, 52a, 62a First main surface 12b, 52b, 62b of thin glass substrate Second

main surface

13, 53, 63 of thin glass substrate Glass substrate 13a, 43a First main surface 13b of supporting glass substrate Second main surface of supporting

glass substrate

14, 54, 64 Resin layer 15 Cutting blade Xa Longitudinal arrow Xb Horizontal arrow

Claims

A thin glass substrate having a first main surface and a second main surface, a supporting glass substrate having a first main surface and a second main surface, and a resin layer having easy peelability, the first main surface of the thin glass substrate A glass laminate in which the thin glass substrate and the supporting glass substrate are laminated via the resin layer so that the surface and the resin layer fixed to the first main surface of the supporting glass substrate are in close contact with each other. And
A glass laminate in which the thin glass substrate is laminated such that at least a part of the outer periphery of the first main surface of the thin glass substrate protrudes from the outer periphery of the first main surface of the support glass substrate.
The first main surface of the thin glass substrate and the first main surface of the support glass substrate have a rectangular shape, and the lengths of the first main surface of the thin glass substrate and / or the horizontal length thereof, The glass laminated body of Claim 1 longer than each length of the 1st main surface of the said support glass substrate and / or each horizontal.
The vertical and / or horizontal lengths of the first main surface of the thin glass substrate are 0.2 mm to 20 mm longer than the vertical and / or horizontal lengths of the first main surface of the supporting glass substrate. The glass laminated body of Claim 1 or 2.
The glass laminate according to any one of claims 1 to 3, wherein the entire outer periphery of the first main surface of the thin glass substrate protrudes outward from the outer periphery of the first main surface of the supporting glass substrate.
The glass laminate according to claim 1, wherein the resin forming the resin layer is at least one selected from an acrylic resin, a polyolefin resin, a polyurethane resin, and a silicone resin.
The glass laminate according to claim 1, wherein the resin layer has a thickness of 5 to 50 μm.
The glass laminate according to any one of claims 1 to 6, wherein a difference in linear expansion coefficient between the thin glass substrate and the supporting glass substrate is 150 × 10 -7 / ° C or less.
The method for producing a glass laminate according to any one of claims 1 to 7, wherein a resin layer forming step of forming and fixing an easily peelable resin layer on the first main surface of the supporting glass substrate; The manufacturing method of a glass laminated body including the contact | adherence process of closely_contact | adhering the said resin layer fixed on the 1st main surface of the said support glass substrate to the 1st main surface of a thin glass substrate.