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WO2008142975A1 - ダイシング装置およびダイシング方法 - Google Patents

ダイシング装置およびダイシング方法 Download PDF

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Publication number
WO2008142975A1
WO2008142975A1 PCT/JP2008/058335 JP2008058335W WO2008142975A1 WO 2008142975 A1 WO2008142975 A1 WO 2008142975A1 JP 2008058335 W JP2008058335 W JP 2008058335W WO 2008142975 A1 WO2008142975 A1 WO 2008142975A1
Authority
WO
WIPO (PCT)
Prior art keywords
dicing
light
irradiated
tape
emitting
Prior art date
Application number
PCT/JP2008/058335
Other languages
English (en)
French (fr)
Inventor
Yusuke Arai
Original Assignee
Tokyo Seimitsu Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Seimitsu Co., Ltd. filed Critical Tokyo Seimitsu Co., Ltd.
Priority to JP2009515130A priority Critical patent/JPWO2008142975A1/ja
Publication of WO2008142975A1 publication Critical patent/WO2008142975A1/ja

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67115—Apparatus for thermal treatment mainly by radiation

Landscapes

  • Engineering & Computer Science (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Dicing (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

　ＵＶ光を発する複数のＬＥＤライト（４２）を備えるＵＶ照射装置（４０，４０Ａ，４０Ｂ）を用いて、紫外線硬化型粘着剤が表面に塗布されたＵＶテープ（Ｔ）にＵＶ光を照射することにより、ＵＶテープ（Ｔ）の剥離を行う。
PCT/JP2008/058335 2007-05-18 2008-05-01 ダイシング装置およびダイシング方法 WO2008142975A1 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2009515130A JPWO2008142975A1 (ja) 2007-05-18 2008-05-01 ダイシング装置およびダイシング方法

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007133088 2007-05-18
JP2007-133088 2007-05-18

Publications (1)

Publication Number Publication Date
WO2008142975A1 true WO2008142975A1 (ja) 2008-11-27

Family

ID=40031690

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/058335 WO2008142975A1 (ja) 2007-05-18 2008-05-01 ダイシング装置およびダイシング方法

Country Status (3)

Country Link
JP (1) JPWO2008142975A1 (ja)
TW (1) TW200910434A (ja)
WO (1) WO2008142975A1 (ja)

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010171076A (ja) * 2009-01-20 2010-08-05 Lintec Corp 光照射装置及び光照射方法
JP2010171077A (ja) * 2009-01-20 2010-08-05 Lintec Corp 光照射装置及び光照射方法
CN101901745A (zh) * 2009-05-26 2010-12-01 日东电工株式会社 紫外线照射装置
JP2014042076A (ja) * 2013-11-21 2014-03-06 Lintec Corp 光照射装置及び光照射方法
JP2014154606A (ja) * 2013-02-05 2014-08-25 Disco Abrasive Syst Ltd 紫外線照射装置
JP2014232887A (ja) * 2014-08-28 2014-12-11 リンテック株式会社 光照射装置及び光照射方法
JP2015173233A (ja) * 2014-03-12 2015-10-01 株式会社ディスコ ウエーハ処理装置及びウエーハの処理方法
JP2016213353A (ja) * 2015-05-11 2016-12-15 株式会社ディスコ チャックテーブル
JP2021034409A (ja) * 2019-08-15 2021-03-01 株式会社ディスコ 紫外線照射装置及び環状凸部除去装置
WO2023108449A1 (zh) * 2021-12-15 2023-06-22 厦门市芯颖显示科技有限公司 寻址转移设备和寻址转移方法
JP7630262B2 (ja) 2020-11-25 2025-02-17 株式会社ディスコ 紫外線照射装置

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62189112A (ja) * 1986-02-17 1987-08-18 ウシオ電機株式会社 粘着シ−ト処理装置
JPH0582452A (ja) * 1991-09-24 1993-04-02 Toshiba Corp 光応用基板処理装置
JPH0745556A (ja) * 1993-07-26 1995-02-14 Disco Abrasive Syst Ltd ダイシング装置
JP2002299286A (ja) * 2001-04-02 2002-10-11 Tokyo Seimitsu Co Ltd Ｕｖ照射装置付ダイシング装置
JP2003203887A (ja) * 2002-01-10 2003-07-18 Disco Abrasive Syst Ltd 切削装置
JP2005293826A (ja) * 2004-03-08 2005-10-20 Kitano:Kk 光ディスクの紫外線照射装置及び光ディスクへの紫外線照射方法
WO2006009152A1 (ja) * 2004-07-22 2006-01-26 Lintec Corporation 紫外線照射装置
JP2007142327A (ja) * 2005-11-22 2007-06-07 Disco Abrasive Syst Ltd 半導体ウェハの加工装置
JP2007329300A (ja) * 2006-06-08 2007-12-20 Disco Abrasive Syst Ltd 紫外線照射装置および紫外線照射装置を備えた切削機

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62189112A (ja) * 1986-02-17 1987-08-18 ウシオ電機株式会社 粘着シ−ト処理装置
JPH0582452A (ja) * 1991-09-24 1993-04-02 Toshiba Corp 光応用基板処理装置
JPH0745556A (ja) * 1993-07-26 1995-02-14 Disco Abrasive Syst Ltd ダイシング装置
JP2002299286A (ja) * 2001-04-02 2002-10-11 Tokyo Seimitsu Co Ltd Ｕｖ照射装置付ダイシング装置
JP2003203887A (ja) * 2002-01-10 2003-07-18 Disco Abrasive Syst Ltd 切削装置
JP2005293826A (ja) * 2004-03-08 2005-10-20 Kitano:Kk 光ディスクの紫外線照射装置及び光ディスクへの紫外線照射方法
WO2006009152A1 (ja) * 2004-07-22 2006-01-26 Lintec Corporation 紫外線照射装置
JP2007142327A (ja) * 2005-11-22 2007-06-07 Disco Abrasive Syst Ltd 半導体ウェハの加工装置
JP2007329300A (ja) * 2006-06-08 2007-12-20 Disco Abrasive Syst Ltd 紫外線照射装置および紫外線照射装置を備えた切削機

Cited By (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010171076A (ja) * 2009-01-20 2010-08-05 Lintec Corp 光照射装置及び光照射方法
JP2010171077A (ja) * 2009-01-20 2010-08-05 Lintec Corp 光照射装置及び光照射方法
TWI498953B (zh) * 2009-05-26 2015-09-01 Nitto Denko Corp 紫外線照射裝置
KR20100127714A (ko) * 2009-05-26 2010-12-06 닛토덴코 가부시키가이샤 자외선 조사 장치
JP2010278066A (ja) * 2009-05-26 2010-12-09 Nitto Denko Corp 紫外線照射装置
KR101720335B1 (ko) * 2009-05-26 2017-03-27 닛토덴코 가부시키가이샤 자외선 조사 장치
CN101901745A (zh) * 2009-05-26 2010-12-01 日东电工株式会社 紫外线照射装置
JP2014154606A (ja) * 2013-02-05 2014-08-25 Disco Abrasive Syst Ltd 紫外線照射装置
JP2014042076A (ja) * 2013-11-21 2014-03-06 Lintec Corp 光照射装置及び光照射方法
JP2015173233A (ja) * 2014-03-12 2015-10-01 株式会社ディスコ ウエーハ処理装置及びウエーハの処理方法
JP2014232887A (ja) * 2014-08-28 2014-12-11 リンテック株式会社 光照射装置及び光照射方法
JP2016213353A (ja) * 2015-05-11 2016-12-15 株式会社ディスコ チャックテーブル
JP2021034409A (ja) * 2019-08-15 2021-03-01 株式会社ディスコ 紫外線照射装置及び環状凸部除去装置
JP7356289B2 (ja) 2019-08-15 2023-10-04 株式会社ディスコ 紫外線照射装置及び環状凸部除去装置
JP7630262B2 (ja) 2020-11-25 2025-02-17 株式会社ディスコ 紫外線照射装置
WO2023108449A1 (zh) * 2021-12-15 2023-06-22 厦门市芯颖显示科技有限公司 寻址转移设备和寻址转移方法

Also Published As

Publication number Publication date
JPWO2008142975A1 (ja) 2010-08-05
TW200910434A (en) 2009-03-01

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