WO2006090751A1 - Flame retardant resin composition - Google Patents

Abstract

Disclosed is a resin composition improved in flame retardance and electrical characteristics. Specifically disclosed is a flame retardant resin composition which is improved in electrical characteristics and composed of a base resin, a halogen flame retardant (namely, a bromine-containing flame retardant such as a brominated polybenzyl (meth)acrylate resin or brominated styrene resin), an organic phosphinic acid (such as dialkylphosphinic acid, alkylenephosphinic acid or cycloalkylenephosphinic acid) or a salt thereof (such as a metal salt or a salt with a nitrogen-containing compound having an amino group), and a flame retardant assistant which are different from the base resin (namely, an antimony-containing compound such as an antimony oxide or an antimonate, a fluorine-containing resin, a silicon-containing compound, an aromatic resin and/or a phosphorus-containing compound except for (fused) aminotriazine phosphates). This resin composition may further contain an olefin resin and an electrical characteristics improver assistant. Per 100 parts by weight of the base resin, there may be contained 3-30 parts by weight of a halogen flame retardant, 1-30 parts by weight of an organic phosphinic acid or a salt thereof, and 0.1-30 parts by weight of a flame retardant assistant.

Description

 Specification

 Flame retardant resin composition

 Technical field

 The present invention relates to a resin composition excellent in flame retardancy and a molded article formed from the flame retardant resin composition.

 Background art

 [0002] Among thermoplastic resins, polyester-based resins such as polybutylene terephthalate (PBT) and polyamide-based resins have excellent mechanical properties, electrical properties, weather resistance, water resistance, and chemical resistance. Due to its solvent resistance, it is used in various applications such as electric / electronic parts, mechanical mechanism parts, and automobile parts. On the other hand, the thermoplastic resin is required to be flame retardant for safety as well as improved mechanical properties as the application field expands. In general, there is known a method of flame retardant by adding a halogen-based flame retardant, a non-halogen-based flame retardant such as a phosphorus compound, a nitrogen-containing compound, etc. to a thermoplastic resin. The halogen-based flame retardant can flame-retardant the resin with a small amount of flame retardant compared with the non-halogen-based flame retardant, and can maintain the moldability of the resin.

On the other hand, Japanese Patent Application Laid-Open No. 10-114854 (Patent Document 1) and Japanese Patent Application Laid-Open No. 10-273589

 (Patent Document 2) describes a composition containing a polyester resin, a polyamide resin, a halogenated flame retardant, etc., and an effective amount of pyro-Z polyphosphate for improving electrical properties (such as comparative tracking index). A flame retardant resin molding composition having improved electrical properties containing a salt is disclosed. However, even when a halogenated flame retardant and pyro Z polyphosphate are used in combination, the effect of improving the comparative tracking index is insufficient, and it is difficult to achieve both flame retardancy and electrical characteristics.

 Patent Document 1: Japanese Patent Laid-Open No. 10-114854 (Claim 1 and Examples)

 Patent Document 2: Japanese Patent Laid-Open No. 10-273589 (Claim 1 and Example)

 Disclosure of the invention

 Problems to be solved by the invention

Accordingly, the object of the present invention is to provide excellent flame retardancy even when the proportion of the flame retardant is small. An object of the present invention is to provide a flame retardant resin composition capable of improving electrical characteristics and a molded product thereof.

 [0005] Another object of the present invention is to provide a flame retardant resin composition having further improved electrical properties such as tracking resistance and a molded product thereof.

 Means for solving the problem

 [0006] As a result of intensive studies to achieve the above-mentioned problems, the present inventor has found that when a halogen-based flame retardant, an organic phosphinic acid or a salt thereof, and a flame retardant aid are combined, the flame retardant of the base resin even in a small amount. As a result, the present invention has been completed.

 That is, the flame retardant resin composition of the present invention comprises a base resin, a halogen-based flame retardant, an organic phosphinic acid or a salt thereof, and a flame retardant aid, and has electrical characteristics. Has been improved. The halogen-based flame retardant includes bromine-containing acrylic resin, bromine-containing styrene resin, bromine-containing polycarbonate resin, bromine-containing epoxy compound (including bromine-containing phenolic resin), bromine-containing phosphate ester Even bromine atom-containing flame retardants such as bromine-containing triazine compounds, bromine-containing isocyanuric acid compounds, brominated polyarylether compounds, brominated aromatic imide compounds, brominated biaryl compounds Good. The organic phosphinic acid may be a compound represented by the following formula (1).

[0008] [Chemical 1]

(In the formula, R ¹ and R ² are the same or different and each represents an optionally substituted hydrocarbon group. R ¹ and R ² are bonded to each other to form a ring with the adjacent phosphorus atom. The salt of organic phosphinic acid may be a salt of organic phosphinic acid and at least one selected from a nitrogen-containing compound having a metal and an amino group. The flame retardant aid is, for example, an antimony-containing compound, a fluorine-containing resin, a key-containing compound, an aromatic resin, or a phosphorus-containing compound excluding a (condensed) aminotriazine phosphate. Also good. In addition, when the flame retardant aid is a rosin-like flame retardant, different types of components from the base resin can be used. [0009] The proportion of each component with respect to 100 parts by weight of the base resin is about 3 to 30 parts by weight of the halogen-based flame retardant, about 1 to 30 parts by weight of the organic phosphinic acid or a salt thereof, It may be about 1 to 30 parts by weight. It may contain 5 to 500 parts by weight of organic phosphinic acid or a salt thereof and 0.1 to 200 parts by weight of a flame retardant aid with respect to 100 parts by weight of the halogen flame retardant.

 [0010] The resin composition further comprises an olefin-based resin (α-C olefin- (meth) acrylate).

 2-3

 Stealth copolymer etc.) may be contained. The greave composition may further contain an electrical property improving aid and the like. The electrical property improving aids include metal oxides, metal sulfides, (hydrous) metal silicates, (hydrous) metal borate, (hydrous) metal stannates, metal hydrogen phosphates, aminotriazines. It may be at least one selected from a compound, pyrophosphate, polyphosphate, polymetaphosphate, and polyphosphate amide.

[0011] The ratio of the organic phosphinic acid or a salt thereof may be 10 to 300 parts by weight with respect to 100 parts by weight of the halogen-based flame retardant. Alternatively, it may be 1 to 150 parts by weight with respect to 100 parts by weight as a total with the salt.

 [0012] The resin composition may further contain at least one selected from an antioxidant, a stabilizer, a lubricant and a filler.

 [0013] The resin composition may have a comparative tracking index based on IEC112 of 300 V or more (particularly 350 V or more). In addition, the resin composition has (a) G) a flame retardance according to UL94 flammability test of V-1 or higher when measured with a specimen thickness of 1.6 mm, and (ii) IE C112 (B) G) Specimen thickness 1. When measured at 6 mm, the flame retardancy according to UL94 flammability test is V-0 or more. And (ii) a resin composition having a comparative tracking index of 350 V or higher in accordance with IEC12, and (c) G) difficulty in complying with UL 94 flammability test when measured at a test piece thickness of 0.8 mm. Also included is a resin composition having a flammability of V-0 or higher and (ii) a comparative tracking index according to IEC 112 of 300 V or higher.

[0014] The present invention also includes a molded article formed of the above-mentioned rosin composition. Articles include electric and Z or electronic parts, home appliance parts, office automation (OA) equipment parts, machinery It may be at least one selected from mechanical parts and automobile parts. The invention's effect

 [0015] In the present invention, since a halogen-based flame retardant, an organic phosphinic acid or a salt thereof, and a flame retardant aid are combined, even if the amount of these components used is small, only the flame retardant properties of the resin are obtained. The electrical characteristics (such as comparative tracking index) can be improved. Further, a flame retardant resin composition containing an olefin-based resin can further improve electrical characteristics such as tracking resistance.

 Detailed Description of the Invention

 [0016] The flame retardant resin composition of the present invention comprises a base resin, a halogen-based flame retardant, an organic phosphinic acid or a salt thereof, and a flame retardant aid. Such a resin composition also has improved electrical properties (such as tracking resistance expressed by a comparative tracking index) that are not only flame retardant.

 [0017] (Base oil)

 The base resin is not particularly limited, and examples thereof include various thermoplastic resins and thermosetting resins. The thermoplastic resin constituting the base resin includes polyester-based resin, polyamide-based resin, polycarbonate-based resin, polyphenylene-oxide resin, polyphenylene sulfide-based resin, acrylic resin, styrene And other types of resin and vinyl resin.

 [0018] (Polyester resin)

 The polyester-based resin is a homopolyester or copolyester obtained by polycondensation of a dicarboxylic acid component and a diol component, polycondensation of oxycarboxylic acid or rataton, or polycondensation of these components. Preferred polyester-based resins generally include saturated polyester-based resins, particularly aromatic saturated polyester-based resins.

 [0019] Examples of the dicarboxylic acid component include aliphatic dicarboxylic acids (for example, C dicarboxylic acids such as succinic acid, daltaric acid, adipic acid, hexadecanedicarboxylic acid, and dimer acid).

 4-40 acids, preferably dicarboxylic acids), cycloaliphatic dicarboxylic acids (eg hexahydrophthalate)

 4- 14

 Dicarboxylic acids such as formic acid, hexahydroterephthalic acid, and hymic acid), aromatic di

 8-12

Carboxylic acids [C Dicarboxylic acids such as arene dicarboxylic acids (phthalic acid, isophthalic acid Acid, terephthalic acid, 2,6 naphthalene dicarboxylic acid, etc.), bis-phenol dicarboxylic acid (4,4 '—biphenyl dicarboxylic acid, diphenyl ether— 4, 4 ′ —dicarboxylic acid, diphenylalkanedicarboxylic acid (4,4'-diphenylmethane dicarboxylic acid, etc.), 4,4'-diphenyl ketone dicarboxylic acid, etc.], or derivatives thereof (for example, lower alkyl esters, aryl esters, acid anhydrides, etc.) Possible derivatives). These dicarboxylic acid components may be used alone or in combination of two or more. If necessary, use polyvalent carboxylic acids such as trimellitic acid and pyromellitic acid together.

 [0020] Preferably, the dicarboxylic acid component includes aromatic dicarboxylic acids such as terephthalic acid, isophthalic acid, and naphthalenedicarboxylic acid.

 [0021] Examples of the diol component include aliphatic diols [eg, alkylene glycol (eg, ethylene glycol, trimethylene glycol, propylene glycol, 1,4 butane diol, 1,3 butane diol, neopentyl glycol, hexane Diols (DC alkylene glycol, preferably C alkylene glycol), polyalkylene

2—12 2—10

 Glycols (eg glycols having a plurality of oxy C alkylene units, eg jet

 2-4

 Lenglycol, dipropylene glycol, ditetramethylene glycol, triethylene glycol, tripropylene glycol, polytetramethylene glycol, etc.)], alicyclic diols [eg 1,4-cyclohexanediol, cycloalkane dial force Diols (such as 1,4-cyclohexanedimethanol and other C cycloalkane di C alkanols),

 5-6 1-2

 Hydrogenated bisphenol A, etc.]. In addition, hydroquinone, resorcinol, biphenol, bisphenols or their C alkylene oxides

 2-3

 Even if aromatic diols such as xylylene alcohol are used in combination with bis (4 hydroxyphenol) propane, 2,2bis (4- (2hydroxyethoxy) phenol) propane or brominated derivatives thereof) Yo ヽ. These diol components may be used alone or in combination of two or more. Furthermore, if necessary, a polyol such as glycerin, trimethylolpropane, trimethylolethane, pentaerythritol may be used in combination.

[0022] Preferred diol components include C alkylene glycol (ethylene glycol, trimer

 2-6

Linear alkyls such as tylene glycol, propylene glycol, and 1,4 butanediol Render alcohol), polyalkylene glycol having an oxyalkylene unit with a repeat number of about 2 to 4 [including poly (oxy-c alkylene) unit such as diethylene glycol]

 2-4

 Glycol], 1,4-cyclohexanedimethanol and the like.

[0023] Examples of the oxycarboxylic acid include oxybenzoic acid (p-hydroxybenzoic acid, m-hydroxybenzoic acid, etc.), oxynaphthoic acid (2-hydroxy-6-naphthoic acid, etc.), 4 carboxy ^ -hydroxybiphenyl, hydroxy Examples include phenol acetic acid, glycolic acid, D1, L1 or DZL lactic acid, oxycarboxylic acid such as oxycaproic acid or derivatives thereof.

[0024] The ratataton includes C ratataton such as propiolatataton, butyrolatathon, valerolatataton, force prolatataton (for example, _ε -force prolatataton, etc.).

 3-12

 [0025] Preferred polyester-based resins include cycloalkanedialkylene arylate (1,4-cyclohexanedimethylene terephthalate unit and the like) and ananolene arylate (anoleylene terephthalate and / or alkylene naphthalate unit, for example, , C alkylene tele

 2-4

 Phthalate units, c alkylene naphthalate units, etc.)

 2-4

 Homopolyester or copolyester [for example, poly 1,4-cyclohexanedimethylene terephthalate (PCT), poly Alkylene terephthalates (eg poly C alkylene terephthalates such as polyethylene terephthalate (PET), polypropylene terephthalate (PPT), polybutylene terephthalate (PBT)), polyalkylene naphthalates (eg polyethylene

 2-4

 Polyethylene such as tylene naphthalate, polypropylene naphthalate, polybutylene naphthalate, etc.

C homoalkylene naphthalate); cycloalkane dialkylene te

2-4

A copolyester containing at least one unit selected from phthalate, alkylene terephthalate and alkylene naphthalate as a main component (for example, 50% by weight or more). Polyester terephthalate containing a polybutylene terephthalate unit containing a butylene terephthalate unit as a main component (for example, polybutylene terephthalate, polybutylene terephthalate copolyester) or a polypropylene terephthalate containing a propylene terephthalate unit as a main component -Based resin (for example, polypropylene terephthalate, polypropylene terephthalate copolyester) and ethylene terephthalate Polyethylene terephthalate-based resin containing a polymer unit as a main component (for example, polyethylene terephthalate, polyethylene terephthalate copolyester). These polyester-based resin can be used alone or in combination of two or more.

 [0026] Further, in the copolyester, the copolymerizable monomer may be a C alkylene diary.

 2-6

 Cole (such as ethylene glycol, propylene glycol, linear alkylene glycol such as 1,4 butanediol), polyalkylene glycol having oxyalkylene units with 2 to 4 repeats (diethylene glycol, polytetramethylene glycol, etc.) Dalicol containing poly (oxy-C alkylene) units), C aliphatic dicals

 2-4 4-12

 Boronic acid (succinic acid, dartaric acid, adipic acid, sebacic acid, etc.), alicyclic diol (1, 4-cyclohexanedimethanol, etc.), aromatic diol [C bisphenols

 2-3 Carbohydrate with xylene oxide, such as 2,2bis (4 (2-hydroxyethoxy) phenol) bread, aromatic dicarboxylic acid [asymmetric aromatic dicarboxylic acid (phthalic acid, isophthalic acid) , 5-sulfoisophthalic acid monosodium salt, etc.), diphenyldicarboxylic acid, etc.], oxycarboxylic acids (oxybenzoic acid, oxynaphthoic acid, 4-carboxy-hydroxybiphenyl, etc.) and the like. The polyester resin may be not only linear but also branched or crosslinked as long as it does not impair melt moldability and the like. The polyester-based resin may be a liquid crystal polyester. In addition, polyester-based resins include amino group-containing monomers (for example, 3- or 4-aminophenol, 3- or 4-aminobenzoic acid, tetramethylenediamine, hexamethylenediamine). , Nonamethylene diamine, m-xylylene diamine, etc.) (liquid crystal) polyesteramide resin.

 [0027] The polyester-based resin can be produced by conventional methods such as transesterification and direct esterification.

 [0028] The intrinsic viscosity of the polyester-based resin may be, for example, about 0.4 to 2.0, preferably about 0.5 to 1.8, and more preferably about 0.6 to 1.5. .

[0029] (Polyamide resin)

 Polyamide includes polyamide derived from diamine and dicarboxylic acid; aminocarboxylic acid

, A polyamide obtained by using diamine and / or dicarboxylic acid in combination as required; And, optionally, polyamides derived from the combination of diamine and z or dicarboxylic acid. Polyamide includes copolyamide. Diamine, dicarboxylic acid, aminocarboxylic acid, and ratatam can be used alone or in combination of two or more.

[0030] Examples of diamine include C, such as tetramethylene diamine and hexamethylene diamine.

 3- Aliphatic diamine, bis (4-aminocyclohexyl) methane, bis (4-amino-3-methyl)

Ten

 And cycloaliphatic) diamines such as alicyclic diamines (having substituents such as alkyl groups, and bis (amino C cycloalkyl) C alkanes). If necessary

 5-8 1-4

 For example, aromatic diamines such as phenylenediamine and metaxylylenediamine may be used in combination.

[0031] Examples of the dicarboxylic acid include C aliphatic dicarboxylic acids such as adipic acid, suberic acid, sebacic acid, and dodecanedioic acid (C alkanedicarboxylic acid, etc.);

4-20 6-16

 Acid (dimer acid); cyclohexane-1,4-dicarboxylic acid cyclohexane-1,3-dicarboxylic acid and other alicyclic dicarboxylic acids; phthalic acid, phthalic anhydride, isophthalic acid terephthalic acid, naphthalene Examples thereof include aromatic dicarboxylic acids such as carboxylic acids.

[0032] Examples of the aminocarboxylic acid include C aminocarboxylic acids such as aminoaminobutanoic acid, aminononanoic acid, and aminoundecanoic acid. As ratata, for example, force prolatata

 4-20

 C ratatam such as tom and dodecaractam.

 4-20

 [0033] The polyamide-based resin includes aliphatic polyamides such as polyamide 46, polyamide 6, polyamide 66, polyamide 610, polyamide 612, polyamide 11 and polyamide 12; bis (aminocyclohexyl) C alkanes, etc. Fats such as alicyclic diamine and C-alkanedicarboxylic acid

1-3 8-14

 Alicyclic polyamides obtained from aliphatic dicarboxylic acids; obtained from aromatic dicarboxylic acids (eg, terephthalic acid and Z or isophthalic acid) and aliphatic diamines (eg, hexamethylenediamine, nonamethylenediamine) And polyamides obtained from aromatic and aliphatic dicarboxylic acids (for example, terephthalic acid and adipic acid) and aliphatic diamines (for example, hexaethylenediamine). Polyamide resin can be used alone or in combination of two or more.

[0034] Non-aromatic or aliphatic polyamides among these polyamide-based resins (polyamide 46, polyamide, 6, positive amide, 66, positive amide, 610, positive amide, 612, positive amide, 11, positive amide, 12, etc.) , Semi-aromatic polyamide (polyamide MXD6, polyamide 9T, etc.), semi-aromatic copolymer polyamide, (polyamide, 6T / 6, polyamide, 6Τ / 66, polyamide, 6Τ / 11, polyamide, 6Τ / 12, polya ^ 6l / 6, Polyamide, 61/66, Polyamide, 6Τ / 6Ι, Polyamide, 6T / 6l / 6, Polyamide, 6Τ / 61/66, Polyamide, 66/61/6, Polya 66 / 6I / 11, Polyamide, 66 / 61/12, polyamide, 66/61/610, positive amide, 66/61/612, positive amide, 6T / M5T, etc.)

 [0035] (Polycarbonate resin)

 Polycarbonate-based resins include polymers obtained by reacting dihydroxy compounds (such as alicyclic diols and bisphenol compounds) with carbonate esters such as phosgene or diphenol carbonate. Bisphenol compounds include bis (4-hydroxyphenol) methane, bis (hydroxylaryl) C alkanes such as 2,2bis (4hydroxyphenol) propane (bisphenol A); 1, 1 Bis (4-hydroxyphenol) cyclo

 1-10

 Hexane and other bis (hydroxyaryl) C cycloalkanes; 4, 4 '—dihydroxy

 4-10

 4,4'-dihydroxydiphenyl sulfone; 4,4'-dihydroxy diphenylsulfide; 4,4'-dihydroxydiphenyl ketone and the like.

 [0036] Preferred polycarbonate-based resin includes bisphenol A type polycarbonate. Polycarbonate resin can be used alone or in combination of two or more.

 [0037] (Polyphenol-Renoxide resin)

 The polyphenylene oxide resin (polyphenylene ether resin) includes homopolymers and copolymers. Homopolymers include poly (2,6 dimethyl-1,4-phenolene) oxide, poly (2,5 dimethyl-1,1,4-phenylene) oxide, poly (2,5-deethyl-1,4 Poly (molybdenum or tri-C alkyl-phenol) such as phe-len) oxide

 1-6

 Dilen) oxide, poly (mono or di-C aryl fluorene) oxide, poly (mono-C)

 6-20 1- Alkyl mono-mono-c-aryl-phenol-oxide) and the like.

 6 6-20

[0038] The copolymer of polyphenylene oxide includes a copolymer having two or more types of monomer units of the homopolymer (for example, 2, 6 dimethyl-1, 4 phenylene oxide units and 2, 3, 6 trimethyl). 1, 4 Random copolymers with phenol-oxide units), benzene formaldehyde resin (formaldehyde condensation such as phenol resin) Product) and alkylbenzene formaldehyde resin, and alkylphenol-modified benzeneformaldehyde resin block obtained by reacting alkylphenol such as talesol, and polyphenol-oxide block as the main structure. Modified grafts in which a modified poly (ethylene oxide) copolymer, poly (phenylene oxide) or a copolymer thereof is grafted with a styrenic polymer and Z or an unsaturated carboxylic acid or anhydride (such as (meth) acrylic acid or maleic anhydride). A copolymer etc. are mentioned. Polyphenylene oxide resin can be used alone or in combination of two or more.

[0039] (Polypherene-sulfide-based fat)

 Polyphenylene sulfide resins (polyphenol-lentioether resins) include homopolymers and copolymers having a polyphenylene sulfide skeleton (Ar—S), where Ar represents a phenol group. A polymer is included. Examples of the phenylene group (-Ar-) include p-, m-, and o-phenylene groups, and substituted phenylene groups (for example, C alkyl groups).

 1-6

Alkyl phenylene group having a substituent or aryl phenylene group having a substituent such as a phenyl group), Ar— A ¹ — Ar— [wherein Ar is a phenylene group, A ¹ is a direct bond (Or a single bond), 0, CO, or SO]. Polyphere-Rensulfide series

 2

 The fat may be a homopolymer using the same repeating unit or a copolymer containing different types of repeating units among the phenol-sulfide groups composed of such a phenolic group. .

[0040] The homopolymer is preferably a substantially linear polymer having a p-phenylene sulfide group as a repeating unit. Copolymers can be used in combination of two or more different types of the above-mentioned ferrosulfide groups. Copolymers, p Hue - the Rensurufuido group as the main repeating unit, m- Hue - combination comprising a Rensurufuido group preferably tool p-phenylene Rensurufuido based on 60 mole% substantially (preferably 70 mol _^0/0) containing more It may be an overlying copolymer.

[0041] Polyphenylene sulfide-based resin may be a polymer obtained by acid-crosslinking or heat-crosslinking a relatively low molecular weight linear polymer, and is obtained by condensation polymerization from a monomer mainly composed of a bifunctional monomer. It may be a substantially linear polymer. Polyphenylene sulfide resins are polymerized by combining monomers having three or more functional groups. Also included is a branched or cross-linked polyphenylene sulfide resin and a resin composition in which this resin is blended with the linear polymer.

 [0042] Polyphenylene sulfide, polybiphenylene sulfide (PBPS), polyphenylene sulfide ketone (PPSK), polybiphenyl sulfide sulfone (PPSS), and the like can be used as the polyphenylene sulfide-based resin. Polyphenylene sulfide resin can be used alone or in combination of two or more.

[0043] The number average molecular weight of the polyphenol-sulfide-based greaves is, for example, 300 to 30 X

Preferably, it is about 400 to 10 X 10 ⁴ .

 [0044] (Acrylic resin)

 Examples of acrylic resin include (meth) acrylates such as (meth) acrylic acid, (meth) acrylic acid C alkyl esters such as methyl (meth) acrylate, and hydroxyethyl (meth) acrylate.

 1-10

 Epoxy such as hydroxy c alkyl ester, glycidyl (meth) acrylate

 1-10

 Single or copolymer of (meth) acrylic monomers such as (meth) acrylate, (meth) acrylamide, (meth) acrylonitrile, etc., or other copolymers with (meth) acrylic monomers Copolymers with possible monomers are included. Preferable acrylic resin includes poly (meth) acrylate methyl, (meth) acrylic acid-styrene copolymer, methyl (meth) acrylate-styrene copolymer, and the like. These acrylic resin can be used alone or in combination of two or more.

 [0045] (Styrenic resin)

 Examples of the styrenic resin include, for example, styrene monomers (for example, styrene, butrurene, etc.) or copolymers; styrene monomers and vinyl monomers [for example, (meth) acrylic Monomers (for example, (meth) acrylonitrile, (meth) acrylic acid ester, (meth) acrylic acid, etc.), maleic anhydride, etc. (X, β monoolefinic unsaturated carboxylic acid or acid anhydride or ester thereof Etc.); styrene-based graft copolymers, styrene-based block copolymers, and the like.

[0046] Preferable! / As styrene-based resins, polystyrene (GPPS), styrene-methyl methacrylate copolymer, styrene (meth) acrylic acid copolymer, styrene acrylonitrile copolymer (AS resin) , Rubber component (polybutadiene, acrylic rubber, styrene-butadiene copolymer) Graft copolymer obtained by polymerizing a styrene monomer and, if necessary, a copolymerizable monomer (acrylo-tolyl, methyl methacrylate, etc.) onto a combined rubber (EPDM, EVA, etc.) [impact-resistant polystyrene (HIPS) , ABS resin, MBS resin, etc.], copolymers composed of polystyrene blocks and gen or olefin blocks [for example, styrene butadiene styrene ( _S

BS) block copolymer, styrene isoprene block copolymer, styrene isoprene styrene (SIS) block copolymer, hydrogenated styrene butadiene styrene (SE BS) block copolymer, hydrogenated styrene isoprene styrene (SEPS) block copolymer Coalescence, epoxidized SBS, epoxidized SIS, etc.]. These styrene-based resins can be used alone or in combination of two or more.

 [0047] (Vinyl resin)

 Bull-type sallows include: Bull-type monomers (for example, butyl esters such as butyl acetate; chlorine-containing butyl monomers (for example, salt-type butyl); fluorine-containing bulle monomers; vinyl ketones Butyl ethers; butyl amines such as N belcarbazole, etc.)) or homopolymers thereof, or copolymers with other copolymerizable monomers. Derivatives of the above-described bur-based rosins (for example, polybulal alcohols such as polybulal alcohol, polybul formal, and polybulutyl, and ethylene acetate bur copolymer) can also be used. These bull-type rosins can be used alone or in combination of two or more.

 [0048] (Other greaves)

 Other types of resin include polyacetal resin (polyacetal homopolymer or copolymer), ketone resin, polysulfone resin (for example, polysulfone, poly (ether sulfone), poly (4,4 'bisphenol ether sulfone, etc.) ); Polyetherketone resin (polyetherketone, poly (etheretherketone), etc.); Polyetherimide; Thermoplastic polyurethane resin; Thermoplastic polyimide; Polyoxybenzylene; Thermoplastic elastomer, etc. Examples of the thermosetting resin include phenol resin, amino resin, thermosetting polyester resin, epoxy resin, silicone resin, bull ester resin, polyurethane resin, and the like. Is mentioned.

[0049] These rosins or polymer compounds may be used alone or in combination of two or more. Yes.

 [0050] Preferably, the base resin may be a liquid crystal polyester, but a thermoplastic resin such as a polyester-based resin, a polyacetal-based resin, a styrene-based resin, a polyamide-based resin, or a polyphenyleneoxide-based resin. Examples of the resin include polyester-based resin (PBT-based resin, PPT-based resin, PET-based resin), and polyamide-based resin.

 [0051] The base resin may be an alloy composed of a plurality of resins. Among the above-mentioned base resins, for example, polycarbonate-based resins, polyphenylene oxide-based resins, and polyphenylene sulfide-based resins include other resins (for example, polyester-based resins and Z or polyamide-based resins). Use it as an alloy in combination with.

[0052] The number average molecular weight of the base resin is not particularly limited and is appropriately selected according to the type and use of the resin, for example, 5 10 ³ to 200 10 ⁴ , preferably 1 10 ^{4 to} 150 10 ^4. More preferably, a range force of about 1 × 10 ⁴ to: LOO × 10 ⁴ can be selected. When the base resin is a polyester-based resin, the number average molecular weight is, for example, 5 X 10 ³ to: LOO X 10 ⁴ , preferably 1 10 ⁴ to 70 10 ⁴ , more preferably 1.2 X 10 ^It may be about ⁴ to 30 × 10 ⁴ .

 [0053] (Halogen flame retardant)

 Organic and halogenated compounds can be used as the flame retardants and logogens. Organic halides usually contain at least one halogen atom selected from chlorine, bromine and iodine nuclear power.

[0054] Examples of the halogen-based flame retardant include bromination of halogen-containing acrylic resin [halogenated polybenzyl (meth) acrylate resin, for example, poly (pentabromobenzyl (meth) acrylate)) Halogenated benzyl (meth) acrylates such as polybenzyl (meth) acrylate and poly (pentachlorobenzyl (meth) acrylate) or copolymers, etc.], halogen-containing styrene-based resins [Norogeny polystyrene ( Halogenated styrene resins such as brominated polystyrene and chlorinated polystyrene, halogenated styrene monomers alone or copolymers, etc.]], halogen-containing polycarbonate resins (brominated polycarbonate) , Halogenated polycarbonate such as chlorinated polycarbonate), C Gen-containing Epokishii 匕合 product (brominated epoxy 榭脂, Harogeni spoon epoxy 榭脂 such chlorinated epoxy 榭 fats; Harogeni spoon phenoxy such as brominated phenoxy 榭脂 ), Halogen-containing phosphate esters [e.g., tris (promoethyl) phosphate, tris (mono or dibromopropyl) phosphate, tris (mono or dibubutate mobutinole) phosphate, tris (mono to tribromoneopentyl) phosphate, Bromine-containing phosphate esters such as bis (tribromoneopentyl) phenol phosphate, tris (mono to tribromophenol) phosphate], halogen-containing triazine compounds (eg bromine-containing triazine compounds such as tris (tripromophenoxy) triazine) , Halogen-containing isocyanuric acid compounds [for example, tris (2,3-dibromopropyl) isocyanurate, tris (bromine-containing isocyanuric acid compounds such as 2, 3 to], halogenated polyarylethers Together [For example, bis (norogenated aryl) ethers such as octa to deca-buck modular ethers, octa to decachlorodiether ethers (eg bis (norogenated phenol) ethers); brominated polyphenylene ethers Halogen-containing polyphenylene-oxide resins, etc.], halogenated aromatic imide compounds (for example, brominated aromatic imide compounds such as ethylene bis-fluorinated phthalimide) (for example, bisimide compounds). Etc.], halogenated bis-aryl compounds [eg, bis such as brominated diphenyl (no, rogenated C aryl); bis such as brominated diphenyl methane (norogenated C aryl) C

6-10 6-10 1 Alkane; Halogenated bisphenols such as brominated bisphenol A or derivatives thereof

-Four

(Brominated polyesters obtained by polymerizing ethylene oxide adducts of halogenated bisphenols), halogenated alicyclic hydrocarbons (bridged saturated or unsaturated halogenated cycloaliphatic hydrocarbons such as And halogenated polycycloalkadiene such as dodecachloropentacyclotadeca 7, 15-gen). Halogen flame retardants can be used alone or in combination of two or more.

As halogenated flame retardants, compounds containing chlorine atoms and Z or bromine atoms are preferred, especially brominated organic bromides (bromine-containing acrylic resins, bromine-containing styrene resins, bromine-containing polycarbonate-based resins). Oil, bromine-containing epoxy compound (bromine-containing epoxy resin such as brominated epoxy resin, bromine-containing epoxy resin such as brominated phenoxy resin), bromine-containing phosphate ester, bromine-containing triazine compound , Bromine-containing isocyanuric acid compounds, brominated polyarylether compounds (Otta bromodiphenol) -Bromine atom-containing flame retardants such as bis (brominated aryl) etheric compounds such as ruether), brominated aromatic imide compounds, brominated bisaryl compounds, etc.] are preferred!

[0056] Among these bromine atom-containing flame retardants, in particular, brominated polybenzyl (meth) acrylate resins, alkylene brominated phthalimides, brominated styrene resins and brominated styrene monomers alone Or copolymer (brominated polystyrene, etc.) force At least one selected is preferred. Further, at least one selected from brominated bisphenol A type epoxy resin, brominated bisphenol A type phenoxy resin and brominated bisphenol A type polycarbonate resin is also preferable.

 [0057] (Organic phosphinic acid or salt thereof)

 Organic phosphinic acid or a salt thereof (hereinafter sometimes simply referred to as an organic phosphinic acid compound) includes phosphinic acid or a bisphosphinic acid condensed with phosphinic acid and an organic group (an optionally substituted hydrocarbon). Group substituted phosphinic acid, polyvalent phosphinic acid (polyvalent phosphinic acid in which multiple phosphinic acids are linked by a polyvalent organic group), or a salt thereof (metal, boron, ammonia and A salt with at least one salt-forming component selected from basic nitrogen-containing compounds (metal salts, boron salts (eg, boroli compound), ammonium salts, amino group-containing nitrogen-containing compounds) Etc.) can be used. The organic phosphinic acid compound can improve the electrical characteristics of the resin even when a halogen-based flame retardant is used. Therefore, organic phosphinic acid compounds appear to function as electrical property improvers.

 Of the organic phosphinic acids, compounds represented by the above formula (1), polyvalent phosphinic acids (such as bisphosphinic acid) and the like are preferred.

In the above formula (1), examples of the hydrocarbon group represented by R ¹ and R ² include an aliphatic hydrocarbon group [an alkyl group (straight chain such as methyl, ethyl, t-butyl group or the like; Straight chain such as branched C alkyl group), alkenyl group (bulle, aryl, isopropyl group, etc.)

1 -20

 Chain or branched chain c alkenyl group, etc.)], alicyclic hydrocarbon group [cycloalkyl

 2-20

 Group (C cycloalkyl group such as cyclohexyl group)], aromatic hydrocarbon

 5- 10

Group [aryl group (C aryl group such as phenyl group), aralkyl group (benzyl group, etc.) C aryl-c alkyl group, etc.)] and the like.

 6-10 1-4

[0060] The ring formed by combining R ¹ and R ² together with the adjacent phosphorus atom is a heterocycle having the phosphorus atom as a hetero atom constituting the ring (phosphorus atom-containing heterocycle), A 4- to 20-membered heterocycle, preferably a 5- to 16-membered heterocycle is mentioned. The phosphorus atom-containing heterocycle may be a bicyclo ring. The phosphorus atom-containing heterocycle may have an unsaturated group (alkylene group, alkylene group, etc.) and Z or a substituent in the ring.

 [0061] Examples of the substituent of the hydrocarbon group and the phosphorus atom-containing heterocycle include a halogen atom (fluorine, chlorine, bromine, iodine atom, etc.), an alkyl group (methyl, ethyl, t-butyl group, etc.) Straight-chain or branched C alkyl group, etc.)

 1-6

 Chain or branched c alkenyl group, etc.), cycloalkyl group exemplified above, examples mentioned above

 2-6

 Aralkyl group, the above exemplified aralkyl group, hydroxyl group, alkoxy group (straight chain or branched chain c alkoxy group such as methoxy and ethoxy group), carboxyl group,

 14

 Sil group (such as c-acyl group such as acetyl group), alkoxycarbonyl group (such as methoxy group)

 2-6

 C alkoxy-carbonyl group such as sulfonyl group), amino group, N-substituted amino group

 1-4

 (Alkylamino group such as methylamino group and dimethylamino group), nitro group, cyano group, oxo group (= o) and the like. The hydrocarbon and phosphorus atom-containing heterocycle may have one of the above-described substituents, or may have a plurality of the same or different substituents.

[0062] The organic phosphinic acid (1) includes, for example, compounds of the following formulas (la) and (lb).

 [0063] [Chemical 2]

 (1a) (1b)

(In the formula, rings Z ¹ and Z ² are the same or different and each represents a 4- to 10-membered ring containing a phosphorus atom as a constituent atom of the ring, and may have the substituent. R ¹ and R ² are Same as above)

Note that the ring Z and the bicyclo ring composed of the ring Z ¹ and the ring Z ² are represented by the formula (1). , R ¹ and R ² correspond to the ring formed with the adjacent phosphorus atom (phosphorus atom-containing heterocycle).

[0064] The number of members of rings Z ¹ and Z ² may be preferably 4 to 8 members, more preferably about 5 to 6 members. In the heterocycles Z ¹ and Z ² , the heterocycle may have 1 to 2 carbon-carbon unsaturated bonds.

[0065] In the above formula (la), R ¹ and R ² may have a substituent (hydroxyl group, carboxyl group, alkoxy group, etc.)! / C alkyl group, etc.)

 1-16

 That's right.

 [0066] Metals forming the organic phosphinates include Group 1 metals (alkali metals) (such as cadmium, sodium, etc.), Group 2 metals (alkaline earth metals) (magnesium, calcium) in the periodic table. , Barium, etc.), periodic table group 4 metals (titanium, zirconium, etc.), transition metals (periodic table group 7 metals such as mangan; periodic table group 8 metals such as iron; periodic table group 9 such as cobalt Metal; periodic table group 10 metal such as nickel; periodic table group 11 metal such as copper), periodic table group 12 metal such as zinc, and periodic group 13 metal such as aluminum. These metals can be used alone or in combination of two or more. Among these metals, at least one selected from Group 1 metal, Group 2 metal, Group 4 metal, Group 8 metal, Group 12 metal and Group 13 metal of the periodic table, in particular, periodic table 2 Group metals and Z or Periodic Group 13 metals are preferred. The metal salt may be a hydrate salt such as a hydrate magnesium salt, a hydrate calcium salt, a hydrate aluminum salt, a hydrate zinc salt, and the like. The metal salt also includes a salt in which a metal is partially oxidized (eg, a titanium salt, a zirconyl salt, etc.).

[0067] Further, as the basic nitrogen-containing compound that forms a salt, for example, a nitrogen-containing compound having an amino group [aminotriazine compound (melamine, guanamine, benzoguanamine and Z or condensate thereof ( Melamine condensates such as melam, melem, melon etc.)), guanidine compounds (eg guanidine etc.)], urea compounds (eg urea), etc. The basic nitrogen-containing compounds can be used alone or in combination of two or more. Of these nitrogen-containing compounds, aminotriazine compounds (melamine, melamine condensate, etc.) are particularly preferable. [0068] These salt-forming components may be used alone or in combination of two or more. Organic phosphinic acid salts also include double salts of organic phosphinic acid and a plurality of salt-forming components, for example, melamine 'melam memel double salt, melamine' melam 'melem' melon double salt, and the like.

 [0069] Specific examples of the organic phosphinic acid compound include organic phosphinic acid represented by the above formula (la) or a salt thereof, for example, an alkylphosphinic acid which may have a substituent [dialkylphosphinic acids (di-C Alkylphosphinic acid), for example, dimethylphosphinic acid,

 1-10

Tylethylphosphinic acid, jetylphosphinic acid, ethyl ( _n- , iso- or t-) butyphosphinic acid, di-n-propylphosphinic acid, diisopropylphosphinic acid, di-n-butylphosphinic acid, diisobutylphosphinic acid, Dialkylphosphinic acids such as di-t-butylphosphinic acid, dipentylphosphinic acid, dioctylphosphinic acid; (hydroxymethyl) methylphosphinic acid, (hydroxyethyl) methylphosphinic acid, bis (hydroxymethyl) phosphinic acid, bis (hydroxy Ethyl) Hydroxyl group-containing dialkylphosphinic acid such as phosphinic acid; Carboxyl group-containing dialkylphosphinic acid such as (2-carboxyethyl) methylphosphinic acid; Alkoxy group-containing dialkylphosphine such as (methoxymethyl) methylphosphinic acid I like phosphate], § reel phosphinic acid [Hue - C, such as Le phosphinic acid

 6-aryl phosphinic acid; di-C phosphinic acid such as diphenyl phosphinic acid

10 6-10

 , Alkylaryl phosphinic acid (C alkyl such as methylphenylphosphinic acid)

 1-4

— C aryl-phosphinic acid, etc., and salts of these organic phosphinic acids (dimethyl)

6-10

Phosphinic acid Ca salt, Methylethylphosphinic acid Ca salt, Jetylphosphinic acid Ca salt, Di (n- or iso-) propylphosphinic acid Ca salt, Di (n-, iso- or t-one) butylphosphinic acid Ca salt , Ethyl (n- or iso-) propylphosphinic acid Ca salt, ethyl (n-, iso- or t-) butylphosphinic acid Ca salt, di (n-, iso- or t-) butylphosphinic acid Ca salt, dipentyl Phosphinic acid Ca salt, Dioctylphosphinic acid Ca salt, (2-Carboxyethyl) methylphosphinic acid Ca salt and alkaline earth metal salts such as Mg salt corresponding to these calcium salts; Dimethylphosphinic acid A1 salt, Methyl Ethylphosphinic acid A1 salt, Jetylphosphinic acid A1 salt, Di (n- or isomono) propylphosphinic acid A1 salt, Di (n-, isomono or t1) butylphosphinic acid A1 salt, Ethyl (n Or iso I) propyl phosphinic acid A1 salt, Echiru (n-, iso one or t-) butyl phosphinic acid A1 salt, dipentyl phosphine Al salt, Dioctylphosphinic acid Al salt, Aluminum salt such as (2-carboxyethyl) methylphosphinic acid A 1 salt; Dimethylphosphinic acid Ti salt, Methylethylphosphinic acid Ti salt, Jetylphosphinic acid Ti salt Di (n- or iso-) propylphosphinic acid Ti salt, di (n-, iso- or t-one) butylphosphinic acid Ti salt, ethyl (n- or iso-) propyl phosphinic acid Ti salt, ethyl ( n-, iso- or t- 1) butylphosphinic acid Ti salt, dipentylphosphinic acid Ti salt, dioctylphosphinic acid Ti salt, (2-carboxyethyl) methylphosphinic acid Ti salt and titanyl corresponding to these salts Titanium salts such as salts; dimethylphosphinic acid Zn salt, jetylphosphinic acid Zn salt, methylethylphosphinic acid Zn salt, di (n- or iso-) propylphosphinic acid Zn salt, di (n-, Iso- or t-) butylphosphinic acid Zn salt, ethyl (n- or iso-) propyl phosphinic acid Zn salt, ethyl (n-, iso- or t-) butyphosphinic acid Zn salt, dipentylphosphinic acid Zn salt, Dioctylphosphinic acid Zn salt, zinc salt such as (2-carboxyethyl) methylphosphinic acid Zn salt; dimethylphosphine acid melamine salt, methylethylphosphinic acid melamine salt, diethylphosphinic acid melamine salt, di (n- Or iso- 1) propylphosphinic acid melamine salt, di (n-, iso- or t-) butyl phosphinic acid melamine salt, ethyl (n- or iso- 1) propylphosphinic acid melamine salt, ethyl (n-, iso-I) Or t-) butylphosphinic acid melamine salt, dipentylphosphinic acid melamine salt, dioctylphosphinic acid melamine salt, (2-carboxyethyl) methylphospho Melamine salts of sphinic acid and salts with aminotriazine compounds such as melamine 'melam' melem double salt corresponding to these melamine salts).

 Further, specific examples of the organic phosphinic acid compound include organic phosphinic acid represented by the above formula (lb) or a salt thereof, such as 1-hydroxy 1H-phosphorane 1-oxide, 2-force ruboxy mono 1-hydroxy. 1H-phosphorane 1-oxide having a substituent such as! / ヽ, alkylene phosphinic acid (C alkylene phosphinic acid etc.);

 3-8

It may have a substituent such as sphoran 1-oxide, alkalkene phosphinic acid (C alkellene phosphinic acid, etc.); 1, 3 cyclobutylene phosphinic acid, 1, 3 cyclo

3-8

Cycloanolene phosphinic acids such as pentylene phosphinic acid, 1, 4 cyclooctylene phosphinic acid, 1, 5 cyclo octylene phosphinic acid (C cyclo ano ylene phosphine)

 4-10

Acids); or salts thereof (alkali of 1-hydroxy-1H-phosphorane 1-oxide) Earth metal salts (Ca salts, Mg salts, etc.), A1 salts, Ti salts, titanyl salts, metal salts such as Zn salts; melamine salts, aminotriazine salts such as melamine 'melam' melem double salt, etc.) It is done.

[0071] Further, among the preferred U and organic phosphinic acid compounds, specific examples of the polyvalent phosphinic acid include a plurality of phosphinic acids (or organic phosphinic acids) linked by polyvalent organic groups. Phosphinic acid, f, for example, anolecan bisphosphinic acid [ethanone 1,2-bis (phosphinic acid), etc. C-anolecan bis (phosphinic acid), etc.], anolecan bis (anolequinolephosphinic acid)

1-10

 [Ethanol-1, 2-bis (methinolephosphinic acid) and other C-anole bisbis (C-anolequinolejo

 1-10 1 -6 succinic acid), etc.], or salts thereof. Salts include ethane-1,2-bisphosphinic acid Ca salt, ethane-1,2-bis (methylphosphinic acid) Ca salt, Mg salt, A1 salt, Zn salt, Ti salt, or tital salt, etc. Metal salts of ethane-1,2-bisphosphinic acid melamine, ethane-1,2-bis (methylphosphinic acid) melamine salt, melam salt, melem salt, melamine. Examples include salts with compounds.

 [0072] Specific examples of the organic phosphinic acid salt include, for example, JP-A-55-5979, JP-A-8-73720, JP-A-9-278784, JP-A-11-236392, and JP2001. — 2686, JP 2004-238378, JP 2004-269526, JP 2004-269884, JP 2004-346325, JP 2001-513784, JP 2001— No. 525327, Special Table 2001-525328, Special Table 200 1-525329, Special Table 2001-540224, US Patent No. 4180495, US Patent No. 4208321, US Patent No. 4208322 The compounds described in the description, US Pat. No. 6,290,044 and US Pat. No. 6,630,374 are listed.

 [0073] (Flame retardant aid)

Flame retardant aids include aromatic resins [phenolic resins, ar phosphorus resins, polyphenoloxide resins, aromatic epoxy resins (bisphenol A type epoxy resins, novolac type epoxy resins). Oil), phenoxy resin (bisphenol A type phenoxy resin, etc.), polyphenylene sulfide resin, polycarbonate resin, polyarylate resin, aromatic polyamide resin, liquid crystalline Aromatic polyester resin, liquid crystalline aromatic polyesteramide resin, etc.], antimony-containing compound, molybdenum-containing compound (Such as acid and molybdenum), tungsten-containing compounds (such as acid and tungsten), bismuth-containing compounds (such as bismuth oxide), tin-containing compounds (such as tin oxide), iron-containing compounds (such as iron oxide) , Copper-containing compounds (such as copper oxide), phosphorus-containing compounds [phosphorus-containing compounds excluding (condensed) aminotriazine salts such as phosphate esters, condensed phosphate esters, phosphoric acid Esteramide (phosphoramide, etc.), condensed phosphate ester amide, phospho-tolyl compound [for example, (crosslinked) phenoxyphosphazene, (crosslinked) triloxyphosphazene, (crosslinked) xylyloxyphosphazene, (crosslinked) tolluo Non-crosslinked or crosslinked allyloxyphosphazenes such as xylphenoxyphosphazenes, (crosslinked) xylyloxyphenoxyphosphazenes], organic Organic compounds such as phonic acid compounds or organic phosphonous acid compounds (eg, organic (phosphorous) phosphonic acid esters, organic (phosphorous) phosphonic acid aminotriazine salts, organic (phosphorous) phosphonic acid metal salts, etc.); red phosphorus, phosphoric acid Boron, inorganic compounds such as (phosphite) metal phosphates, hypophosphite metal salts, etc.], key-containing compounds [(poly) organosiloxane, layered key salts, etc.], Examples thereof include sulfonic acid compounds, metal salts of perfluoroalkanesulfonic acid, sulfamic acid compounds or salts thereof, and fluorine-containing resins. These flame retardant aids can be used alone or in combination of two or more. In addition, as the flame retardant aid, a component different from the base resin is usually used. In particular, the flame retardant aid is a resinous flame retardant aid (aromatic resin, for example, aromatic polyester resin, aromatic polyamide resin, polycarbonate resin, polyphenylene oxide resin, polyphenylene sulfide resin, etc. ), A different type of resin from the base resin is used.

Among these flame retardant aids, in particular, antimony-containing compounds, aromatic resins [phenolic resins, polyphenolic oxide resins, aromatic epoxy resins, phenoxy resins, and polyphenylene sulfide resins. Fat, polycarbonate-based resin, polyarylate resin, aromatic polyamide resin (polyamide resin in which all constituent monomer components are aromatic monomers, for example, aromatic dicarboxylic acid component and aromatic resin Polyamide with diamine component, etc.) or liquid crystalline V ヽ aromatic polyester resin (polyester resin in which all constituent monomer components are aromatic monomers, for example, aromatic dicarboxylic acid and Polyesters with aromatic diols) and liquid crystalline, aromatic polyester amides (all of the constituent monomer components are Polyesteramide resin, which is an aromatic monomer, etc.)] and phosphorus-containing compounds (phosphorus-containing compounds excluding (condensed) phosphoric acid aminotriazine salts) are used. Is preferred. When the antimony-containing compound is used, the flame retardancy can be further improved, and when the fluorine-containing resin and / or the keyer-containing compound is used, dripping can be effectively prevented. As the monomer component such as aromatic dicarboxylic acid, aromatic diamine, and aromatic diol, each component exemplified in the section of the base resin can be used.

[0075] Antimony-containing compounds include, for example, acid-antimony [anti-trimonic acid (Sb

 2

O), antimony pentoxide (xNaO-SbO-yH2O (x = 0 ~: L, y = 0 ~ 4), etc.)

3 2 2 5 2

 Etc.], antimonate [metal antimonate (for example, alkali metal such as sodium antimonate, alkaline earth metal such as magnesium antimonate), ammonium antimonate, etc.) . These antimony-containing compounds can be used alone or in combination of two or more. Of the antimony-containing compounds, acid diantimones and alkali metal salts of antimonic acid are preferred.

[0076] Further, the antimony-containing compound may be surface-treated with a surface treating agent such as an epoxy compound, a silane compound, an isocyanate compound and Z or a titanate compound, if necessary.

 [0077] The average particle size of the antimony-containing compound may be, for example, about 0.02 to 5 μm, and preferably about 0.1 to 3111.

 [0078] The fluorine-containing resin may be a fluorine-containing monomer or a copolymer, such as a fluorine-containing monomer (tetrafluoroethylene, black trifluoroethylene, vinylidene fluoride). Monomers or copolymers of xafluoropropylene, perfluoroalkyl butyl ether, etc., and the above fluorine-containing monomers and other copolymerizable monomers (olefinic monomers such as ethylene and propylene) And copolymers with acrylic monomers such as (meth) acrylate).

[0079] Specific examples of such fluorine-containing resins include homopolymers such as polytetrafluoroethylene, polychlorotrifluoroethylene, polyvinylidene fluoride; tetrafluoroethylene-hexafluoro Fluoropropylene copolymer, tetrafluoroethylene perfluoroalkyl butyl ether copolymer, ethylene-tetrafluoroethylene copolymer And a copolymer such as an ethylene-black trifluoroethylene copolymer. Fluorine-containing resin can be used alone or in combination of two or more.

 The average particle size of the fluorine-containing coagulate that may be used in the form of particles is, for example, about 10 to 5000 μm, preferably about 100 to 1000 μm, and more preferably 100 to 700 μm. It may be about μm.

[0081] Examples of the compound containing kaen include montmorillonite, sabonite, noiderite, hectorite, smectite layered silicates such as fluorine hectorite, Li-type fluorine theolite, Na-type fluorine theolite, Li-type Examples include swellable synthetic fluorine mica, vermiculite, rhosite, and leucite, such as tetracaine fluorine mica and Na-type tetracathenium fluorine mica. In addition, the layered silicates include modified layered silicates in which organic cation such as quaternary ammonium quaternary phosphonium is intercalated between layers, epoxy group, amino group, carboxyl group, acid Also included are modified layered silicates to which reactive functional groups such as anhydride groups and oxazoline groups have been added (such as layered silicates treated with a silane coupling agent having a reactive functional group). In addition, as other compounds containing silicon, (poly) organosiloxanes, for example, polyorganosiloxanes such as polydimethylsiloxane and polymethylphenylsiloxane (such as organosiloxane homopolymers or copolymers), etc. Can be mentioned. Of these (poly) organosiloxanes, organosiloxanes with viscosities of 1 X 10 ^{_3 to} 5 X 10 ^_2 m ² s ^_1 (25 ° C) are preferred. These key compound-containing compounds can be used alone or in combination of two or more.

[0082] Examples of phosphorus-containing compounds include phosphorus-containing compounds other than (condensed) phosphate aminotriazine salts, such as phosphate esters or condensed phosphate esters [eg, resorcinol bis (diphenyl phosphate), , Idoquinone bis (diphenyl phosphate), biphenol-norebis (diphenyl phosphate), bisphenol A (diphenyl phosphate), resorcinol bis (di-1,2 xylyl phosphate), hydroquinone bis (di-1,6,6) Xylyl phosphate), biphenylenobis (di-1,6 xylinole phosphate), bisphenol no A bis (di 2, 6-xylinole phosphate), pentaerythritol diphenol-nore phosphate, pentaerythritol di 2,6 xylyl phosphate 2, 6, 7 Trioxa 1-phosphabic mouth [2. 2. 2] Octane-4 methanol 1-oxide and US Pat. No. 4,154,775 And phosphoric acid ester compounds described in US Pat. No. 4,801,625, etc.], phosphoric acid ester amides or condensed phosphoric acid ester amides [for example, 1,4-piperazine dilute trough ether phosphate, 1, 4-piperazinediyltetra-2,6-xylylphosphate, N, N, bis (neopentylene dioxyphosphie) piperazine, and JP-A-10-175985 and JP-A-2001-139823 Phosphoric acid ester amides (phosphoramide, etc.) and the like described in JP-A-2001-354689], phospho-tolyl compounds [for example, phenoxyphosphazene, triloxyphosphazene, xyloxyphosphazene, phenoxytriluro Cyclic and / or chain aryloxyphosphazenes such as xylphosphazene and phenoxysilylphosphazene (non-crosslinked aryloxy) Phosphazenes), cross-linked products thereof (for example, bridged aryloxyphosphazenes such as phenoxyphosphazenes cross-linked with bisphenol residues), and W099Z19383, WO00Z9518, WO02Z98886, and WO04Z24844 Phosphazene compounds, etc.], organic (sub) phosphonic acid compounds [for example, organic (sub) phosphonic acid esters, organic (sub) phosphonic acid metal salts (for example, Li, Na, K, etc.) Alkaline metal salts; Alkaline earth metal salts such as Mg, Ca and Sr; Group 3 metal salts of periodic table such as Ce; Group 4 metal salts such as Ti and Zr; Group 7 metal salts such as Mn; Fe Group 8 metal salts such as Zn; Group 12 metal salts such as Zn; Group 13 metal salts such as A1; Group 14 metal salts such as Sn and Ge; Group 15 metal salts such as Sb and Bi Metal salt), basic nitrogen compound salt of organic (sub) phosphonic acid [melamine salt, guana Salts, aminotriazine salts such as melamine, benzoguanamine salts and Z or condensate salts thereof (such as melamine condensate salts such as melam salt, melem salt, melon salt), and inorganic phosphorus compounds [eg red phosphorus; phosphorus Salts (including double salts) of acids (phosphoric acid, phosphorous acid, hypophosphorous acid, etc.) and alkaline earth metals or Group 13 metals, such as metal phosphates (calcium phosphate, aluminum phosphate) , Phosphoric acid 'aluminum phosphite double salt, etc.), metal phosphite (phosphorus calcium, aluminum phosphite, etc.), metal hypophosphite (calcium hypophosphite, aluminum hypophosphite, etc.); Boron phosphate, etc.]. Phosphorus-containing compounds can be used alone or in combination of two or more.

Of these phosphorus-containing compounds, organic (phosphorous) phosphonic acid compounds are particularly preferred! Specific examples of organic (sub) phosphonic acid compounds include, for example, methylphosphonic acid, ethylphosphonic acid Acid, n-propylphosphonic acid, isopropylphosphonic acid, n-butylphosphonic acid, isobutylphosphonic acid, pentylphosphonic acid, octylphosphonic acid, hydroxyalkylphosphonic acid (hydroxymethylphosphonic acid, hydroxyethylphosphonic acid, hydroxypropionolephosphonic acid) Acid), anolecoxynorequinolephosphonic acid (methoxymethinorephosphonic acid, etoxy-chetinorephosphonic acid, etc.), canolexoxynoquinophosphonic acid (canoleboxymethinorephosphonic acid, 2- Carboxyethyl phosphonic acid, methyl phosphonous acid, ethyl phosphonous acid, n-propyl phosphonous acid, isopropyl phosphonous acid, n-butyl phosphonous acid, isobutyl phosphonous acid, pentyl phosphonous acid, octyl nitrous acid Has substituents such as phosphonic acid Te, even I, alkyl (sub) phosphonate (C alkyl (sub) such as phosphoric acid);

 1-16

Aryl (phosphorous) phosphonic acid (such as C aryl (phosphorous) phosphonic acid) which may have substituents such as phenol phosphonic acid, tolyl phosphonic acid, and phenyl phosphonous acid;

 6-10

 1-hydroxyethylidene 1 with a substituent such as 2-diphosphonic acid, hydroxyethanediphosphonic acid! /, May! /, Alkylenediphosphonic acid (C alkylene diphosphonic acid etc.);

 2-6

 , 1-diphosphonic acid and other substituents, alkylidene diphosphonic acid (C

 1-4 phenolidene diphosphonic acid, etc .; 1, 4 phenylene diphosphonic acid, 1, 4 phenolic diary Phosphoric acid and other arylene (phosphorous) phosphonic acids (C arylene (phosphorous) phosphonic acid

 6-12

Etc .; have substituents (such as hydroxyl groups) such as nitrilotris (methylphosphonic acid)! / ヽ, nitrilotris (alkylphosphonic acid) [nitrilotris (C alkylphosphonic acid)

 1-4

Etc.]; have a substituent such as oxydimethylphosphonic acid (such as a hydroxyl group)! /

V, oxydi (alkylphosphonic acid) [oxydi (C alkylphosphonic acid), etc.];

 14

 -Polymeric phosphonic acids such as phosphonic acid and polyallylphosphonic acid; esters of these organic (phosphorous) phosphonic acids [methylphosphonic acid monomethyl ester, 2-carboxyethyl phosphonate, triethyl carboxymethylphosphonate, carboxyethylphospho It may have a substituent such as triethyl acid, and may be a mono- or polyalkyl ester of alkyl (sub) phosphonic acid (C alkyl (sub) phosphonic acid mono- or di-C alkyl ester).

 1-16 1-16

Such as stealth); pentaerythritol ester of methylphosphonic acid, 2-ethyl-2-hydroxymethyl-1,3-propanediol ester of methylphosphonic acid, hydroxyethyl poly (oxetyl) phosphonic acid ester, etc. (Sub-) phosphonic acid and polyhydric alcohol ester]; these organic (sub-) phosphonic acid salts [methyl (sub) phosphonic acid Ca salt, ethyl (sub-) phosphonic acid Ca salt, n-propyl (sub-) phosphite] Phosphonic acid Ca salt, Isopropyl (phosphorous) phosphonic acid Ca salt, n-Butyl (phosphorous) phosphonic acid Ca salt, Isobutyl (sulfurous) phosphonic acid Ca salt, t-Butyl (sulfurous) phosphonic acid Ca salt, pentyl (sulfurous) phosphate Alkyl (sub) phosphonic acid Ca salts such as acid Ca salts, octyl (sub) phosphonic acid Ca salts, alkyl (sub) phosphonic acid Mg salts corresponding to these alkyl (sub) phosphonic acid Ca salts, 1 hydroxy group Chileden-1, 1, -diphosphonic acid Ca salt, nitrilotris (methylphosphonic acid) Ca salt, nitrilotris (methylphosphonic acid) Mg salt and other alkaline earth metal salts; Titanium salts such as killed (phosphorous) phosphonic acid Ti salt, 1-hydroxyethylidene- 1, 1-diphosphonic acid Ti salt, nitrilotris (methylphosphonic acid) Ti salt and tital salt corresponding to these Ti salts ( (Including titanyl salt); Alkyl (sulpho) phosphonic acid A1 salt, ethane-1,2-diphosphonic acid A1 salt, carboxymethylphosphonic acid A1 salt, 2-carboxyl Aluminum salt such as tilphosphonic acid A1 salt, methylphosphonic acid monomethyl ester A1 salt, 1-hydroxyethylidene 1,1-diphosphonic acid A1 salt, nitrilotris (methylphosphonic acid) A1 salt; Alkyl (phosphorous) phosphonic acid zinc salt corresponding to acid Ca salt, 1-hydroxystilidene-1,1-diphosphonic acid Zn salt, nitrilotris (methylphosphonic acid) Zn salt Zinc salts of the above; alkyl (sub) phosphonic acid melamine salts corresponding to the above alkyl (sub) phosphonic acid Ca salts, melam salts, melem salts, melon salts, melamine 'melam' melem double salts corresponding to these melamine salts Aminotriazine compounds such as melamine 'melam' melem 'melon double salt, 1-hydroxyethylidene 1-1-diphosphonic acid mono-tetramelamine salt, nitrilotris (methylphosphonic acid) mono-hexameramine salt (Such as a salt with melamine or a condensate thereof). Of these organic (sub) phosphonic acid compounds, organic (sub) phosphonate is particularly preferable.

Examples of organic (sub) phosphonic acid compounds include, for example, JP-A-48-57988, JP-A-55-5979, JP-A-56-84750, JP-A-63-22866. Japanese Laid-Open Patent Publication Nos. 1-226891, 2-180875, 4-234893, 7-224078, 7-247112, 8-59679 JP-A-8-245659, JP-A-9-272759, JP-A 2000-63843, JP-A 2001-2688, JP-A 2001-64438, JP-A 2001-64 521 Publication, JP 2001-98161, JP 2001-98273, JP 2001-106919, WO00Z11108, WO01Z57134, US 3789091, US 3849368, The compounds described in US Pat. No. 4,390,477 can also be used.

 [0085] These organic (sub) phosphate compounds can be used alone or in combination of two or more.

 [0086] (Olefin oil)

 The resin composition of the present invention may further contain an olefin-based resin. When an olefin resin is used, the electrical properties (eg, tracking resistance) of the resin composition can be further improved.

 [0087] Examples of olefin-based resins include olefin-based monomers [ethylene-propylene, 1-butene, 3-methyl-1-pentene, 4-methyl-1-butene, 1-hexene, 1-octene and other a-olefins ( In particular, a—C olefin); cyclic olefins {eg

 2- 10

 Cycloalkenes such as lobene, cyclopentene, cyclohexene (C cycloalkene

 3- 10

 C) cycloalkynes such as cyclopentine and cyclohexyne; bridged cyclic olefins

 3-10

 (Polycycloalkenes such as norbornene and tetradicyclododecene, dicycloalkadienes such as dicyclopentadiene); or derivatives thereof (alkyl substituted, alkylidene substituted, alkoxy substituted, acyl substituted, carboxy Etc.] alone or as a copolymer, the olefin-based monomer or polymer, and a copolymerizable monomer [bull-based monomer, for example, (meth) acrylic acid or a salt thereof Acrylic monomers such as (metal salts), (meth) acrylic acid esters (such as (meth) acrylic acid alkyl esters, (meth) acrylic acid glycidyl esters); organic acid bull ester monomers such as butyl acetate Α, β unsaturated, such as fumaric acid, (anhydrous) maleic acid, (anhydrous) itaconic acid, (anhydrous) citraconic acid, (anhydrous) nadic acid Carboxylic acid monomer; (meth) vinyl cyanide monomers such as acrylonitrile, etc.], copolymers (random copolymers, block copolymers, such as graphs preparative copolymer) and the like.

[0088] Specific examples of the olefin fin resin include, for example, an α-olefin resin [for example, poly A—C olefins such as ethylene, polypropylene and propylene ethylene copolymers

 2-3 homo- or copolymer; ethylene (meth) acrylic acid copolymer, propylene (meth) acrylic acid copolymer, ethylene (meth) acrylic acid metal salt copolymer, ethylene (meth) alkyl Rylic acid ester copolymers (Ethylene mono (meth) acrylate copolymers such as ethylene ethyl acrylate copolymer; Ethylene (meth) glycidyl acrylate copolymers; Ethylene (meth) glycidyl acrylate (meth) Α-C olefins and copolymers of copolymerizable monomers, such as alkyl acrylate copolymers], acid-modified olefins

 2-3

 Fatty acid [for example, olefin-based homopolymers or copolymers of a, j8-unsaturated carboxylic acid ((meth) acrylic acid, maleic acid, fumaric acid, itaconic acid, citraconic acid, nadic acid, etc.) and Z Or acid-modified olefin-modified resins modified with acid anhydrides thereof], cyclic olefin-based resins (for example, homopolymers of cyclic olefins, a-C olefin-cyclic olefins)

 2-10

 Copolymer) and the like. Olefin-based resin can be used alone or in combination of two or more.

 [0089] Among these olefin-based resins, poly α-C olefin (especially polyethylene,

 2-3

 (Propylene, propylene-ethylene block copolymer), Hiichi C olefin 1 (meth) ak

 2-3

Rylic acid ester copolymer [eg _α- C olefin- (meth) acrylic acid C

 2-3 1-4 Kill copolymer (especially ethylene ethyl acrylate copolymer), α-C olefin

 2-3

 -(Meth) acrylic acid glycidyl copolymer (especially ethylene- (meth) acrylic acid glycidyl copolymer), C-olefins- (meth) acrylic acid glycidyl- (meth) acrylic acid C

 2-3 1-alkyl copolymer (especially ethylene-glycidyl acrylate)-(meth) acrylic acid

Four

 Preferred are acid-modified polyolefins (such as acid-modified poly-C olefins such as maleic anhydride-modified polypropylene).

 2-3

[0090] The number average molecular weight of the olefin fin resin is not particularly limited, and is, for example, about 300-20 X 10 ⁵ , preferably about 500 to 10 X 10 ⁴ .

 [0091] (Electrical property improvement aid)

If necessary, the flame retardant rosin composition of the present invention may further contain an additive (electrical property improvement aid) for improving electrical properties, such as a nitrogen-containing compound [aminotriazine compound (melamine; guanamine; melam). , Melamine condensates such as melem), aminotriazine compounds (Organic acids or inorganic acid salts of the above aminotriazine compounds, eg, cyanurates such as melamine cyanurate), phosphorus-containing compounds [(poly) phosphates (salts with basic nitrogen-containing compounds) , Metal salts, etc.), organophosphates, polyphosphate amides, etc.], compounds containing kaites [caate (eg, talc, kaolin, aluminum silicate), hydrated talcite, zeolite, etc.], inorganic metal compounds [ Metal salts, metal oxides (magnesium oxide, iron oxide, titanium oxide, zinc oxide, etc.) of inorganic acids (inorganic acids other than phosphoric acid and caustic acid, such as carbonic acid, boric acid, stannic acid, tungstic acid, sulfuric acid, etc.) Alumina), metal hydroxide (such as aluminum hydroxide, magnesium hydroxide, zirconium hydroxide, alumina hydrate (boehmite)), metal sulfide (sulfur oxide) , 硫I匕 molybdenum may contain such 硫I匕 tungsten, etc.), etc.]. These electrical property improving aids may be used alone or in combination of two or more. In addition, as the electrical property improving aid, a compound different from the organic phosphinic acid or its salt and the flame retardant aid is usually used.

 Among the electrical property improving aids, the phosphorus-containing compounds include (poly) phosphates [ammonium salts such as ammonium polyphosphate; polyphosphoric acid (including pyrophosphoric acid) and aminotriazine compounds (Melamine polyphosphate; salt of polyphosphate and melamine condensate, for example, melam polyphosphate, melem polyphosphate, melon polyphosphate, melamine polyphosphate 'melam' melem double salt, melamine polyphosphate 'melam' melem 'Melon double salt, melamine polymetaphosphate, melamine polymetaphosphate' melam. Melem double salt, etc .; Metal salt of phosphoric acid or polyphosphoric acid (including pyrophosphoric acid) (hydrogen phosphate metal salt such as calcium hydrogen phosphate (alkali Earth metal salts); (poly) aluminum phosphates (poly) phosphate metal salts such as aluminum phosphate salts; aluminum pyrophosphates, pyrophosphate phosphates Metal phosphates such as metal double salts), organic phosphates (aliphatic organic phosphates, such as alkyl phosphates such as trimethyl phosphate), polyphosphates ((poly) phosphate and And a polymer compound obtained by calcining and condensing Z or an organic phosphoric acid and a cyanamide derivative in the presence of urea and Z or urea phosphate. Also

The metals constituting the inorganic metal compound include alkali metals (K, Na, etc.), alkaline earth metals (Mg, Ca, Ba, etc.), transition metals (Fe, Co, etc.), periodic table group 12 Examples include metals (such as Zn). Among inorganic metal compounds, the metal salts of inorganic acids include carbonates (such as alkaline earth metal salts such as calcium carbonate), borates (anhydrous or hydrous boric acid Lead, anhydrous or hydrous calcium borate (hydrous metal borate, etc.), stannate (no water or hydrous zinc stannate (hydrous) metal stannate, etc.), tungstate (tandastenic acid) Zinc), sulfates (calcium sulfate, barium sulfate, etc.).

 [0093] Among the electrical property improving aids, metal oxides, metal sulfides, (hydrous) metal silicate, (hydrous) metal borate, (hydrous) metal stannate, metal hydrogen phosphate, pyrroline Preferred are at least one selected from acid salts, polyphosphates, polymetaphosphates and polyphosphate amides. In particular, titanium oxide, zinc sulfide, talc, kaolin, (hydrous) zinc borate, (hydrous) calcium borate, (hydrous) zinc stannate, calcium hydrogen phosphate, melamine cyanurate, melamine polyphosphate, melam polyphosphate, Melem polyphosphate, melon polyphosphate, melamine polyphosphate 'melam' melem double salt, melamine polyphosphate 'melam' melem double salt, melamine polymetaphosphate and melamine polymetaphosphate · melam · melem double salt at least one selected Is preferred.

 [0094] (Ratio of each component)

 The ratio of the flame retardant and the rogen flame retardant is, for example, about 3 to 30 parts by weight, preferably about 5 to 25 parts by weight, and more preferably about 7 to 20 parts by weight with respect to 100 parts by weight of the base resin.

 [0095] The ratio of the organic phosphinic acid compound is, for example, 1 to 100 parts by weight of the base resin.

 30 parts by weight, preferably 3 to 28 parts by weight, more preferably about 5 to 25 parts by weight. The proportion of the organic phosphinic acid compound is, for example, 5 to 500 parts by weight, preferably 10 to 300 parts by weight, and more preferably 20 to 280 parts by weight with respect to 100 parts by weight of the halogen flame retardant. It may be a degree.

 [0096] The ratio of the flame retardant aid is, for example, about 0.1 to 30 parts by weight, preferably about 0.5 to 20 parts by weight, more preferably about 1 to 15 parts by weight with respect to 100 parts by weight of the base resin It is. The ratio of the flame retardant aid is, for example, 0.1 to 200 parts by weight, preferably 0.2 to 150 parts by weight, and more preferably 0.5 to 120 parts per 100 parts by weight of the halogen flame retardant. It may be about a part. The ratio (weight ratio) between the organic phosphinic acid or its salt and the flame retardant aid is the organic phosphinic acid or its salt Z flame retardant aid = 10Z90 ~ 99.9 / 0.1, preferably 20Z80 ~ 99Zl More preferably, it may be about 25Ζ75 to 97Ζ3.

[0097] The proportion of the olefin-based resin may be, for example, 0 to 30 parts by weight, preferably 1 to 20 parts by weight, and more preferably about 2 to 15 parts by weight with respect to 100 parts by weight of the base resin. Good. Ma In addition, the proportion of olefin-based rosin is, for example, 0 to 300 parts by weight (for example, 0.5 to 200 parts by weight), preferably 1 to 150 parts by weight, more preferably 100 parts by weight of the halogen flame retardant. Alternatively, it may be about 5 to 120 parts by weight. Further, the proportion of olefin fin resin is, for example, 1 to 150 parts by weight, preferably 5 to L00 parts by weight with respect to 100 parts by weight of the total amount of the halogen flame retardant and the organic phosphinic acid or salt thereof. The amount is preferably about 10 to 90 parts by weight.

 [0098] The ratio of the electrical property improving aid is, for example, 0 to 30 parts by weight, preferably 1 to 20 parts by weight, and more preferably 1.5 to 15 parts by weight with respect to 100 parts by weight of the base resin. For example, it may be about 2 to 15 parts by weight. The proportion of the electrical property improving aid is, for example, 0 to 300 parts by weight, preferably 0.5 to 200 parts by weight, and more preferably about 1 to 150 parts by weight with respect to 100 parts by weight of the halogen flame retardant. Even so.

 [0099] In the present invention, the flame-retardant resin composition further comprises other additives, such as other flame retardants (nitrogen-based, phosphorus-based flame retardants, etc.), acid-fouling inhibitors (phenolic acid salts). Antioxidants, amine-based antioxidants, hydroquinone-based antioxidants, quinoline-based antioxidants, thio-based antioxidants, phosphorus-based antioxidants, etc.), stabilizers (ultraviolet absorbers, weather resistance (light) stabilizers), Heat stabilizer, processing stabilizer, phosphorus stabilizer, reactive stabilizer, etc.), antistatic agent, lubricant, mold release agent, crystallization nucleating agent, plasticizer, colorant (dye, pigment, etc.), lubricant In addition, an anti-dripping agent, a filler (a fibrous inorganic filler such as glass fiber or carbon fiber, or a non-fibrous inorganic filler such as glass flake) may be contained. These other additives can be used alone or in combination of two or more.

 [0100] Among the additives, the greave composition is an antioxidant, a stabilizer (in particular, a phosphorus stabilizer).

, Reactive stabilizers), lubricants and fillers. Moreover, you may use a filler at least among the said additives.

 [0101] The proportion of the filler in the flame retardant resin composition is, for example, 0 to: LOO parts by weight, preferably 0.5 to 80 parts by weight, more preferably 100 parts by weight of the base resin. It may be about 1 to 70 parts by weight.

[0102] Among the above-mentioned antioxidants, phenolic antioxidants include hindered phenols such as 1,6-hexanediol bis [3- (3,5 di-tert-butyl-4-hydroxyphenol. C-alkanediol bis [3— (3,5-ge branch)]

 2-10

 C alkyl-4-hydroxyphenyl) propionate]; triethylene glycol-bi

3-6

 Di- or trioxy C alkylene diol bis [3— (3,5-di-branched C alkyl) such as bis [3- (3-tert-butyl-5-methyl-4-hydroxyphenol) propionate]

 2-4 3-6 ru 4-hydroxyphenol) propionate]; glycerol tris [3- (3,5-di-tert-butyl-4-hydroxyphenol) propionate]

 3-8

 [3— (3,5-Di-branched C alkyl-4-hydroxyphenol) propionate];

 3-6

 C-alkylene tetraol tetrakis [3— (3,5-dimonobranched C] such as enterythritol tetrakis [3— (3,5-di-tert-butyl-4-hydroxyphenol) pionate]

 4-8 3 alkyl-4-hydroxyphenyl) propionate]; n-octadecyl [3— (3,5—

-6

 C-alkyl [3— such as di-tert-butyl-4-hydroxyphenyl) propionate]

 10-35

 (3,5-di-branched C alkyl-4-hydroxyphenyl) propionate]; N

 3-6, N, N, 1C Hexamethylenebis (3,5-di-tert-butyl-4-hydroxyhydrocinnamamide) and other N, N, 1C alkylenebis (3,5-dibranched C alkyl-4— Hydroxy hydride

 2-10 3-6

 Mouth cinnamamide) is preferred.

[0103] Amine-based antioxidants include hindered amines such as tri- or tetra-C alkyl.

 1-3 Piperidine or its derivatives (4, 1, 2, 6, 6-tetramethylpiperidine etc. optionally substituted with methoxy, benzoyloxy, phenoxy, etc.), bis (tri, tetra or penta) C alkylpiperidine) C alkanedicarboxylate [eg bis (2, 2

1-3 2-20

 , 6, 6-Tetramethyl-4-piperidyl) oxalate, malonate corresponding to oxalate, adipate, sebacate, terephthalate, etc .; bis (1, 2, 2, 6, 6 pentamethyl —4 piperidyl) sebacate], 1, 2 Bis (2, 2, 6, 6-tetramethyl-4-piberidyloxy) ethane, phen-naphthylamine, N, N '— Di-Fu-Lue 1, 4 Phenol-diamine, N-F-Lu N' — Cyclohexyl , 4 Felendiamine, etc. are included.

[0104] Hydroquinone antioxidants include, for example, 2,5-di-butylhydroquinone, and quinoline antioxidants include, for example, 6 ethoxy-1,2,2,4 trimethyl 1,2 —Includes dihydroquinoline. In addition, Zio antioxidants include, for example, dilauric acid. Ruthiodipropionate, distearyl thiodipropionate and the like are included.

 [0105] Examples of phosphorus stabilizers (or phosphoric acid inhibitors) include phosphite stabilizers (trialkyl phosphites, trisalkyl aryl phosphites, tris (branched alkylphenol) phosphites, (Branched alkylphenol) phenol phosphate, bis (alkylaryl) pentaerythritol diphosphite, etc.), triphenyl phosphate stabilizers, diphosphonite stabilizers, and the like.

 [0106] Examples of reactive stabilizers include epoxy reactive stabilizers (glycidyl ether compounds, epoxy group-containing acrylic polymers, etc.), oxazoline reactive stabilizers (1, 3 phenol-bis ( 2-oxazoline), 1,4 phenol-bis (2-oxazoline), and the like, and carpositimide-based reactive stabilizers (polyarylcarposimide, polyalkylarylamide) and the like.

[0107] These anti-oxidation agents and Z or stabilizers can be used alone or in combination of two or more. The proportion of the antioxidation agent is 0.01 to 10 parts by weight, preferably 0.05 to 8 parts by weight, more preferably 0.1 to 5 parts by weight, based on 100 parts by weight of the base resin (A). It can be selected from a range of about 1 part. Also, the proportion of the stabilizer can be selected from the same range as the proportion of the anti-oxidation agent.

[0108] Among the additives, the lubricant includes a long-chain fatty acid or a derivative thereof [monovalent saturated or unsaturated fatty acid (strength puric acid, lauric acid, myristic acid, pentadecylic acid, palmitic acid, stearin C saturated fatty acids such as acids, arachidic acid, behenic acid and montanic acid

 10-34

 ), Divalent saturated or unsaturated fatty acids (such as oleic acid, linoleic acid, linolenic acid, arachidonic acid, ergic acid, etc. c unsaturated fatty acids), and their fatty acid esters and fats

 10-34

 Acid amide, etc.], polyalkylene glycol [C alkylene glycol (ethylene glycol)

 2-6

, Propylene glycol, tetramethylene glycol, etc.) or copolymers, or derivatives thereof, silicone compounds [dialkyl siloxanes (dimethyl siloxane, etc.), alkylaryl siloxanes (phenol methyl siloxane, etc.) ), Diorganosiloxanes (diphenylsiloxane, etc.), or their homopolymers or copolymers (polyorganosiloxane), modified polyorganosiloxanes. Sun etc.], Waxes [Natural paraffin, synthetic paraffin, micro wax, polyolefin wax such as polyethylene wax, polypropylene wax, etc.

 2-4

 And olefin copolymer waxes such as ethylene copolymer wax). A lubricant can be used individually or in combination of 2 or more types.

 [0109] The ratio of the lubricant is, for example, 0.01 to 20 parts by weight, preferably 0.01 to 15 parts by weight, and more preferably 0.01 to 10 parts by weight with respect to 100 parts by weight of the base resin (A). Part (for example, 0.1 to 10 parts by weight).

 [0110] The flame-retardant resin composition of the present invention comprises a base resin that may be a powder mixture or a molten mixture, a halogen-based flame retardant, an organic phosphinic acid or a salt thereof, and a flame retardant. It can be prepared by mixing the auxiliary agent with other components (olefin-based resin, electrical property improving auxiliary agent, additive, etc.) as required. The present invention also includes a molded article formed from the flame retardant resin composition (for example, a resin composition (molded article) formed by solidifying the molten mixture).

 [0111] The flame-retardant resin composition and the molded product (molded product) are prepared, for example, by (1) mixing each component, kneading and extruding with a uniaxial or biaxial extruder, and then forming a pellet. (2)-A method of preparing pellets (master batches) having different compositions, mixing (diluting) the pellets in a predetermined amount and using them for molding, and (3) molding. It is possible to adopt a method in which one or more of each component is directly charged into the machine and molded. In addition, all or a part of the components other than the base resin may be mixed in advance, and may be mixed with the base resin, or may be directly mixed with the base resin without previously mixing the components other than the base resin. Good. In addition, the order of addition of components other than the base resin is not particularly limited, and a part of the components other than the base resin may be added at one time or mixed to the base resin. Later, the remaining components may be added (if necessary, divided into multiple portions).

 [0112] The molded product can be produced by melt-kneading the flame-retardant resin composition by a conventional method and molding the mixture by a conventional method such as extrusion molding, injection molding, or compression molding.

[0113] The flame-retardant resin composition (and molded product) of the present invention can achieve both flame retardancy and electrical characteristics, despite containing a halogen-based flame retardant. The resin composition and molded product of the present invention has a flame retardancy according to UL94 flammability test when measured at a test piece thickness of 1.6 mm. 1 or more, preferably V-0 or more. The resin composition and molded article of the present invention have a comparative tracking index (CTI) in accordance with IE C112 (UL746A) of 300 V or more (for example, about 300 to about LOOOV), preferably 350 V or more (for example, 400 About 500V), more preferably 500V or more (for example, about 500-800V).

 [0114] The present invention includes (a) a flame retardant resin composition (and molded product) having flame retardancy in accordance with UL94 of V-1 or higher and a comparative tracking index of 500 V or higher. (B) a flame retardant resin composition (and molded product) having a flame retardancy in accordance with UL94 of V-0 or higher and a comparative tracking index of 350 V or higher, and (c) a test piece Also included are flame retardant resin compositions (and molded products) that have a flame resistance according to UL94 of V-0 or higher when measured at a thickness of 0.8 mm and the comparative tracking index is 300 V or higher. .

 [0115] Further, the resin molded product (molded product) of the present invention is excellent in safety against electrical fire inside the device, safety against fire of the molded product itself, mechanical characteristics, electrical characteristics, etc. Electronic parts (coil bobbins, connectors, relays, disk drive chassis, transformers, electromagnetic switches, switch parts, outlet parts, sockets, plugs, capacitors, various cases, resistors, resistors, metal terminals or conductors Etc.), household appliance parts (eg, housings for general household appliances, parts related to computers or their peripherals, lighting parts, telephone or facsimile equipment related parts, air conditioner parts, home audiovisual equipment) Parts for TVs, digital versatile disc players, video decks, etc.], office automation (OA) equipment parts (compartor-related parts, acoustic parts, lighting parts, telegraph or telephone equipment-related parts, facsimile parts, copier parts, air conditioning parts, optical equipment parts, etc.), mechanical mechanism parts (various This is useful for gears, various bearings, motor parts, etc.) and automotive parts (automotive ignition device parts, automotive connectors, various automotive electrical parts, etc.).

 Industrial applicability

[0116] The flame retardant resin composition (and molded product) of the present invention is excellent in flame retardancy and electrical properties, and is used in various applications such as electrical and electronic parts, home appliance parts, office automation and A. ) It can be suitably used for equipment parts, mechanical mechanism parts, automobile parts and the like.

Example [0117] Hereinafter, the present invention will be described in more detail based on examples, but the present invention is not limited to these examples.

[0118] The flame retardancy and electrical properties (comparative tracking index) of the resin composition were evaluated by the following tests.

[0119] [Flammability test]

 In accordance with UL94, the flammability was evaluated at a test piece thickness of 1.6 mmt or 0.8 mmt.

[0120] [Comparison Tracking Index (CTI)]

 Based on IEC112, the comparative tracking index (CTI) [unit: V] was evaluated using solution A.

 [0121] Further, the base resin (A), halogen-based flame retardant (B), organic phosphinic acid or salt thereof (C), flame retardant auxiliary (D), and olefin-based resin used in Examples and Comparative Examples. (E), electrical property improvement aid (F), filler (G), antioxidant (H), stabilizer (I), lubricant CO are as follows.

[0122] 1. Base fat (Α)

 (A-1): Polybutylene terephthalate [Intrinsic viscosity = 0.85]

 (Α-2): Polyethylene terephthalate [Intrinsic viscosity = 0.75]

 (Α-3): Polypropylene terephthalate [Intrinsic viscosity = 0.85]

 (Α-4): Polyamide 66

 2.Halogen flame retardant (Β)

 (B-1): Poly (pentabromobenzyl atallylate) [FR1025, manufactured by Bromchemfarist Corporation]

 (B-2): Brominated polystyrene [Paiguchi Check 68 PB, manufactured by Hueguchi Chemicals] (B-3): Ethylenebistetrabromophthalimide [SYTEX BT-93, Albemarle]

 (B-4): Brominated epoxy resin [SRT5000, Sakamoto Pharmaceutical Co., Ltd.]

 (B-5): Brominated polycarbonate resin [Fiaguard FG-7500, manufactured by Teijin Chemicals Ltd.]

 3.Organic phosphinic acid or its salt (C)

(C-1): Methylethylphosphinic acid aluminum salt (C-2): Methylethylphosphinic acid calcium salt

 (C 3): Aluminum dimethylphosphinate

 (C-4): 1 Hydroxy 1H Phosphorane 1 1-oxide aluminum salt (C-5): Dimethylphosphinic acid melamine salt

 (C-6): (2 Carboxyethyl) methylphosphinic acid aluminum salt

 (C-7): Aluminum salt of jetylphosphinic acid.

[0123] 4. Flame retardant aid (D)

 (i) Antimony-containing compound D1

 (D1 1): Antimony trioxide

 (D1-2): Antimony pentoxide

 (D1-3): Sodium antimonate

 (ii) Fluorine-containing resin D2

 (D2-1): Polytetrafluoroethylene

 (iii) C-containing compound D3

 (D3-1): Swellable synthetic fluorinated mica [ME-100, manufactured by Coop Chemical Co., Ltd.] (D3-2): Montmorillonite

(D3-3): Polydimethylsiloxane [7500 cSt (7.5 × 10 ^_3 m ² s ^_1 )].

[0124] (iv) Phosphorus-containing compound (D4)

 (D4-1): Ethylphosphonic acid aluminum salt

 (D4 2): Ethyl phosphonous acid aluminum salt

 (D4-3): Resorcinol bis (di-1, 6 xylyl phosphate)

 (D4-4): Cyclic phenoxyphosphazene (mixture of trimer and tetramer)

 (D4-5): 1, 4 Piperazine diyl tetraphenyl phosphate

 (D4-6): nitrilotris (methylphosphonic acid) calcium salt

 (V) Aromatic resin (D5)

(D5-1): Polycarbonate resin [Panlite L1225, manufactured by Teijin Chemicals Ltd.] (D5-2): Bisphenol-A type epoxy resin [Epicoat 1004K, manufactured by Yuka Shell Epoxy Co., Ltd.] 5. Olefin-based resin (E)

 (E-1): Ethylene monoethyl acrylate copolymer [NUC-6570, manufactured by Nippon Car Co., Ltd.]

 (E-2): Ethylene-glycidyl methacrylate copolymer [Bond First E, manufactured by Sumitomo Chemical Co., Ltd.]

 6. Electric property improvement aid (F)

 (F— 1): Titanium oxide

 (F-2): Melamine polyphosphate [Melapur200, manufactured by DSM]

 (F-3): Zinc sulfide

 (F—4): Talc

 (F—5): Hydrous zinc borate [Fire Brake ZB, manufactured by US Borax]

 (F-6): Melamine cyanurate

 7.Filler (G)

 (G-1): Glass fiber (chopped strand with a diameter of 13 μm and a length of 3 mm)

 (G-2): Glass fiber (chopped strand with a diameter of 10 μm and a length of 3 mm)

 8.Antioxidant (H)

 (H-1): Pentaerythritol tetrakis [3— (3,5-Di-tert-butyl-1-hydroxyphenyl) propionate] [Irganoxl010, manufactured by Chinoku 'Specialty' Chemicals Co., Ltd.]

 9. Stabilizer (I)

 (i) Phosphorus stabilizer II

 (II-1): Tetrakis (2, 4-di-tert-butylphenyl) 1, 4, 4-biphenyl dirange phosphate [Sand Stub P-EPQ, manufactured by Sand Corp.]

 (11-2): Bis (2,6-di-tert-butyl-4-methylphenyl) pentaerythritol diphosphite [ADK STAB PEP36, manufactured by Adeka Gas Co., Ltd.]

 (II 1 3): Monocalcium phosphate

 (ii) Reactive stabilizer 12

(12-1): Bisphenol-A diglycidyl ether [Epicoat 828, oily shell Poxy Co., Ltd.]

 10.Lubricant (J)

 α-ΐ): Polyethylene wax [Sunwax, Sanyo Chemical Co., Ltd.]

 Q-2): Montanic acid ester [LUZA WAX— Sakai, Toyo Petrolite Co., Ltd.] Examples 1 to 20 and Comparative Examples 1 to 3

 The above components were mixed in the proportions (parts by weight) shown in Tables 1 and 2, and kneaded and extruded with an extruder to prepare a pellet-shaped rosin composition. Using the obtained pellets, test moldings were produced by injection molding and evaluated for flammability (1.6 mmt) and tracking resistance (comparative tracking index). The results are shown in Tables 1 and 2.

[table 1]

table 1

 Example

 1 2 3 4 5 6 7 8 9 10 11 12 Base resin A A-1 A-1 A-1 A-1 A-1 A-1 A-1 A-1 A-1 A-1 A-1 A- 1 Weight part 100 100 100 100 100 100 100 100 100 100 100 100 Halogen flame retardant B B-1 B-1 B-1 B-1 B-1 B-1 B-2 B-1 B-1 B-1 B-2 B-1 Part by weight 12 12 12 12 12 12 12 12 12 12 20 12 Organic;!; Sulphinic acid or its salt C C-1 C-1 C-1 C-1 C-1 C-1 C- 1 C-1 C-1 C- 2 C-3 C-4 Weight part 10 10 10 10 10 10 10 10 10 10 10 10

 D1 -1 D1 -1 D1-1 D1-1 D1-1 D1-1 D1 -1 D1 -1 D1-2 D1 -3 D1-1

10 10 10 10 10 10 10 10 10 10 10 Flame retardant aid D D2-1 D2-1 D2-1 D2-1 D2-1 D2-1 D2-1 D2-1 Weight part 1. 0 1. 0 1. 0 1. 0 1. 0 1. 0 1. 0 1. 0

 D3-1 D3-1 D3-2 D3-3

 2. 0 2. 0 2. 0 2. 0 Olefin resin E E-1 E-1 E-1 E-1 E-1 E-1 E-1 E-1 Weight part 10 10 10 10 10 10 10 10 Electric property improvement aid F F-1 F-2 F-1 F-3 F-4 F-5

 Weight part 2. 0 5. 0 2. 0 2. 0 5. 0 5. 0

 Filler G G-1 G-1 G-1 G-1 G-1 G-1 G-1 G-1 G-1 G-1 G-1 G-1 Weight 60 60 60 60 60 60 60 60 60 60 60 60

U L 9 4 Combustion test V-0 V- 1 V-0 V-0 V-0 V-0 V-0 V-0 V-0 V-0 V-0 V-0

CT 1 (V) 400 450 550 450 450>600>600>600>600>600>600> 600

Murorium ¾iiit 2124〜

Table 2

The above ingredients were mixed in the proportions (parts by weight) shown in Table 3, and kneaded and extruded by an extruder to give pellets [01

Room ¾¾ϋit 33416〜

Table 4

The above components were mixed in the proportions (parts by weight) shown in Table 5, and kneaded and extruded with an extruder to prepare a pellet-shaped rosin composition. Using the obtained pellets, test molded articles were produced by injection molding, and flammability (1.6 mmt) and tracking resistance (comparative tracking index) were evaluated. The results are shown in Table 5.

[Table 5]

Example Comparative Example a

 CD o

 1 i 1 G

 I 1 1 * * O

 1-7-o

 Resin base A Sue

 Parts by weight

Ding ^m o * 7 "

 1

 <Single flame retardant r ° o

B B D C ¹⁰ 1 1 D

 o Two 1.

 o> Weight

 Organic acid salt or its salt O T ^ °° ™ — o

 1 c c ^ 1 Ύ ° c c «— Ding

 Parts by weight 1

 o Two>

 o

1 o Ding 1. o Ding ^ = Ding ^ 1 Ding °° 1.1 Flame Retardant D Λ Weight part

 οο * 7 "

 1 o-cho 1, 1 T-cho o

 cn Dc ° 1 1. 1

o ^{1 5} é o 2 o> Talented Resin E Fi

 1 o 1 Dc ^ 1 Dc Weight part i 1 1 in

 . 1 o

 Tempering electrotrophic F-1

 1 part by weight

 o 1-

 Packing material

 r G 1 1 LO c_> 1 ^ ^ 1 ώ 2 o — ί

 Parts by weight

 Antioxidant H

 o 1 chome o 1 1 chome 1

 Heavy weight

 Stabilizer 1

 c => Ding C ° 1. Ding Weight e Cing n "~ 1 [^ 1 m é o Lubricant"

Weight part Ding 1 o Ding ¹⁰ I 1 <£> 1 Ding ^ Combustion test CD

 9 U L 4 t

<1

 C3 ― e <=>>

> 卜 o

Example 42 51 and comparative example 7 13

The above components were mixed in the proportions (parts by weight) shown in Table 6 and Table 7, and kneaded and extruded with an extruder to prepare a pellet-shaped resin composition. Using the obtained pellets, test by injection molding. An experimental molded product was prepared and evaluated for flammability (0.8 mmt) and tracking resistance (comparative tracking index). The results are shown in Tables 6 and 7.

 Example

[Table 6]

 Resin base A Sue

 Parts by weight

 <1 o-based agent burner B halo 1

 1 1 1 1 '1

 Parts by weight

 Organic acid salt or soun c

 ^ l

 1 <r> ^ oo Weight part 1

 i Ding ^ o ο -c CD 1 1 1 é 1.

 d Flame retardant aid D

 1 o ^ 1 c

 1, in d 2 parts by weight

1 1 ^ 1

 Aged tree greffin 1. Ε Fi 1 Ύ ° ^ é o two> parts by weight

 Tempering electric agent F

T-1 ¹⁰

. 1 1 Τ parts by weight of Ding ^M a

 1-

> Filler G

 Parts by weight

 1 o 1 Ding «1 1 ο Preventing oxidants! Ding ezie 1. Weight part

 Stabilizer 1

 O o

 o T-1 o

 1 1 1 c °

 o 1, o 2 o Test firing L 9 U 4

1 o T-1

 1 1 1 1, Ding "

 <1. 1

CO É two ci o T-. 1 1 1 1

 "1 1,

 o 1

-> oo Τ 1 c ¹⁰ 1 1 1 1 o ye 1 I.

Tsu> m 瞷

〇 〇 Table 7

 0131

Claims

The scope of the claims

 [1] A flame retardant resin composition having improved electrical characteristics, comprising a base resin, a halogen-based flame retardant, an organic phosphinic acid or a salt thereof, and a flame retardant aid.

 [2] The base resin is a polyester resin, a polyamide resin, a polycarbonate resin, a polyolefin-polyoxide resin, a polyphenylene sulfide resin, an acrylic resin, a styrene resin, and 2. The resin composition according to claim 1, wherein the resin composition is at least one kind of thermoplastic resin selected from Bull system resin.

 [3] Base grease power 1,4-cyclohexanedimethylene terephthalate, C alkylenete

 2-4

 At least one unit selected from phthalate and c alkylene naphthalate

 2-4

 2. The resin composition according to claim 1, which is a homo- or copolyester.

 [4] Halogen flame retardant is bromine-containing acrylic resin, bromine-containing styrene resin, bromine-containing polycarbonate resin, bromine-containing epoxy compound, bromine-containing phosphate ester, bromine-containing triazine compound, bromine-containing 2. The resin composition according to claim 1, which is at least one bromine atom-containing flame retardant selected from an isocyanuric acid compound, a brominated polyarylether compound, a brominated aromatic imide compound and a brominated bisaryl compound.

 [5] Roger and flame retardant power Brominated polybenzyl (meth) acrylate resin, alkylene fluorinated phthalimide, brominated styrene resin and brominated styrene monomer alone or copolymer power 2. The resin composition according to claim 1, which is at least one selected.

 [6] The halogen flame retardant is at least one selected from brominated bisphenol A type epoxy resin, brominated bisphenol A type phenoxy resin and brominated bisphenol A type polycarbonate resin. 1. The rosin composition according to 1.

 [7] The resin composition according to claim 1, wherein the organic phosphinic acid is a compound represented by the following formula (1).

 [Chemical 1]

(In the formula, R ¹ and R ² are the same or different and each represents an optionally substituted hydrocarbon group. R ¹ and R ² are bonded to each other to form a ring with the adjacent phosphorus atom. May be)

8. The resin composition according to claim 1, wherein the salt of the organic phosphinic acid is a salt of the organic phosphinic acid and at least one selected from a nitrogen-containing compound having a metal and an amino group.

 [9] The organic phosphinic acid has a substituent, may be a dialkylphosphinic acid, has a substituent, may have an alkylenephosphinic acid, and has a substituent! / Cycloalkylene phosphinic acid power is at least one selected, and organic phosphinic acid salt power organic phosphinic acid, periodic table Group 1 metal, Group 2 metal, Group 4 metal, Group 8 metal, Group 8 metal, 2. The resin composition according to claim 1, wherein the resin composition is a salt with at least one selected from Group 12 metals, Group 13 metals, and aminotriazine compounds.

 [10] The flame retardant aid also has a selected phosphorus-containing compound strength, excluding antimony-containing compounds, fluorine-containing resins, silicon-containing compounds, aromatic resins, and (condensed) aminotriazine phosphates. 2. The greaves composition according to claim 1, which is composed of at least one kind.

 [11] The flame retardant aid is at least one selected from the group consisting of antimony oxide, antimonate, (poly) organosiloxane, layered silicate, and fluorine-containing monomer. The rosin composition as described.

 [12] Flame retardant aids include phenolic resin, poly-phenoxide resin, aromatic epoxy resin, phenoxy resin, polyphenylene sulfide resin, polycarbonate resin, polyarylate resin, aromatic 2. The resin composition according to claim 1, wherein the resin composition is at least one selected from polyamide resin, aromatic polyester resin that may be liquid crystalline, and aromatic polyesteramide resin that may be liquid crystalline.

 [13] Flame retardant aids include phosphate esters, condensed phosphate esters, phosphate ester amides, condensed phosphate ester amides, non-crosslinked allyloxyphosphazenes, crosslinked allyloxyphosphazenes, organic ) A phosphonate, an organic (phosphorous) phosphonic acid aminotriazine salt, an organic (phosphorous) phosphonic acid metal salt, a (phosphorous) metal phosphate and a hypophosphite metal salt. 1. The rosin composition according to 1.

[14] The proportion of the halogen-based flame retardant is 3 to 30 parts by weight with respect to 100 parts by weight of the base resin, and the proportion of the organic phosphinic acid or a salt thereof is 1 to 30 parts by weight. The rate is 0. The rosin composition according to claim 1, wherein the composition is 1 to 30 parts by weight.

[15] The ratio of organic phosphinic acid or a salt thereof to 5 parts by weight of 100 parts by weight of rogue-based and flame retardants

 2. The resin composition according to claim 1, wherein the composition is 500 parts by weight and the proportion of the flame retardant aid is 0.1 to 200 parts by weight.

 16. The resin composition according to claim 1, further comprising an olefin-based resin.

 [17] The olefin-based resin is an a-C olefin- (meth) acrylate copolymer.

 2-3

 The rosin composition according to claim 16.

[18] The ratio of the organic phosphinic acid or salt thereof is 10 to 300 parts by weight with respect to 100 parts by weight of the halogen-based flame retardant, and the ratio of olefin fin resin is between the halogen-based flame retardant and the organic phosphinic acid or its The rosin composition according to claim 16, which is 1 to 150 parts by weight based on 100 parts by weight of the total amount with the salt.

 [19] The resin composition according to claim 1, further comprising an electrical property improving aid.

 [20] Electrical property improving aids include metal oxides, metal sulfides, (hydrous) metal silicates, (hydrous) metal phosphates, (hydrous) metal stannates, metal hydrogen phosphates, amino acids 20. The resin composition according to claim 19, which is at least one selected from a triazine compound, pyrophosphate, polyphosphate, polymetaphosphate, and polyphosphate amide.

 [21] Electric property improving aids include titanium oxide, zinc sulfide, talc, kaolin, (hydrous) zinc borate, (hydrous) calcium borate, (hydrous) zinc stannate, calcium hydrogen phosphate, melamine cyanurate, Melamine polyphosphate, Melam polyphosphate, Melem polyphosphate, Melon polyphosphate, Melamine polyphosphate 'Melam' Melem double salt, Melamine polyphosphate 'Melam' Melem 'Melon double salt, Melamine polymetaphosphate and Melamine polymetaphosphate' Melam ' 20. The resin composition according to claim 19, wherein the melem double salt power is at least one selected.

 [22] The resin composition according to claim 1, further comprising at least one selected from an antioxidant, a stabilizer, a lubricant, and a filler.

 [23] The resin composition according to claim 1, wherein the comparative tracking index according to IEC112 is 350 V or more.

[24] (0 Test piece thickness: When measured at 1.6 mm, the flame resistance according to UL94 flammability test is V-1 or higher, and the comparative tracking index according to G0IEC112 is 500 V or higher. The rosin composition according to claim 1.

[25] (0 Specimen thickness 1.6 mm When measured at 6 mm, the flame retardancy conforms to UL94 flammability test.

The resin composition according to claim 1, which is V-0 or more and (ii) a comparative tracking index according to IEC 112 is 350 V or more.

[26] (0 Test piece thickness When measured at 0.8 mm, the flame retardancy conforms to UL94 flammability test.

The resin composition according to claim 1, which is V-0 or more and (ii) a comparative tracking index based on IEC 112 is 300 V or more.

[27] A molded article formed from the resin composition according to claim 1.

 28. The molded article according to claim 27, wherein the molded article is at least one selected from electrical or electronic parts, home appliance parts, office automation equipment parts, mechanical mechanism parts, and automobile parts.