WO2002007227A1 - Light-receiving device and photodetector comprising light-receiving device - Google Patents
Light-receiving device and photodetector comprising light-receiving device Download PDFInfo
- Publication number
- WO2002007227A1 WO2002007227A1 PCT/JP2001/005963 JP0105963W WO0207227A1 WO 2002007227 A1 WO2002007227 A1 WO 2002007227A1 JP 0105963 W JP0105963 W JP 0105963W WO 0207227 A1 WO0207227 A1 WO 0207227A1
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- WIPO (PCT)
- Prior art keywords
- light
- demultiplexed
- photodetector
- intensity
- receiving element
- Prior art date
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- 230000003287 optical effect Effects 0.000 claims abstract description 49
- 230000005484 gravity Effects 0.000 claims abstract description 29
- 239000000758 substrate Substances 0.000 claims abstract description 11
- 229910000530 Gallium indium arsenide Inorganic materials 0.000 claims abstract description 5
- 239000004065 semiconductor Substances 0.000 claims description 22
- 150000001875 compounds Chemical class 0.000 claims description 7
- 238000001514 detection method Methods 0.000 claims description 7
- 229910001218 Gallium arsenide Inorganic materials 0.000 claims description 3
- 229910000980 Aluminium gallium arsenide Inorganic materials 0.000 claims description 2
- 229910000673 Indium arsenide Inorganic materials 0.000 claims description 2
- RPQDHPTXJYYUPQ-UHFFFAOYSA-N indium arsenide Chemical compound [In]#[As] RPQDHPTXJYYUPQ-UHFFFAOYSA-N 0.000 claims description 2
- 238000004891 communication Methods 0.000 abstract description 9
- 239000010410 layer Substances 0.000 description 15
- 238000010586 diagram Methods 0.000 description 9
- 238000001228 spectrum Methods 0.000 description 7
- 239000000835 fiber Substances 0.000 description 6
- 230000035945 sensitivity Effects 0.000 description 5
- 239000000463 material Substances 0.000 description 4
- 238000012544 monitoring process Methods 0.000 description 4
- 238000005259 measurement Methods 0.000 description 2
- PLXMOAALOJOTIY-FPTXNFDTSA-N Aesculin Natural products OC[C@@H]1[C@@H](O)[C@H](O)[C@@H](O)[C@H](O)[C@H]1Oc2cc3C=CC(=O)Oc3cc2O PLXMOAALOJOTIY-FPTXNFDTSA-N 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
- 239000013306 transparent fiber Substances 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/12—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof structurally associated with, e.g. formed in or on a common substrate with, one or more electric light sources, e.g. electroluminescent light sources, and electrically or optically coupled thereto
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J9/00—Measuring optical phase difference; Determining degree of coherence; Measuring optical wavelength
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J1/00—Photometry, e.g. photographic exposure meter
- G01J1/42—Photometry, e.g. photographic exposure meter using electric radiation detectors
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J3/00—Spectrometry; Spectrophotometry; Monochromators; Measuring colours
- G01J3/28—Investigating the spectrum
- G01J3/2803—Investigating the spectrum using photoelectric array detector
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J3/00—Spectrometry; Spectrophotometry; Monochromators; Measuring colours
- G01J3/28—Investigating the spectrum
- G01J3/30—Measuring the intensity of spectral lines directly on the spectrum itself
- G01J3/36—Investigating two or more bands of a spectrum by separate detectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/02016—Circuit arrangements of general character for the devices
- H01L31/02019—Circuit arrangements of general character for the devices for devices characterised by at least one potential jump barrier or surface barrier
- H01L31/02024—Position sensitive and lateral effect photodetectors; Quadrant photodiodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/0248—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies
- H01L31/0256—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by the material
- H01L31/0264—Inorganic materials
- H01L31/0304—Inorganic materials including, apart from doping materials or other impurities, only AIIIBV compounds
- H01L31/03046—Inorganic materials including, apart from doping materials or other impurities, only AIIIBV compounds including ternary or quaternary compounds, e.g. GaAlAs, InGaAs, InGaAsP
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/08—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof in which radiation controls flow of current through the device, e.g. photoresistors
- H01L31/10—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof in which radiation controls flow of current through the device, e.g. photoresistors characterised by potential barriers, e.g. phototransistors
- H01L31/101—Devices sensitive to infrared, visible or ultraviolet radiation
- H01L31/102—Devices sensitive to infrared, visible or ultraviolet radiation characterised by only one potential barrier
- H01L31/105—Devices sensitive to infrared, visible or ultraviolet radiation characterised by only one potential barrier the potential barrier being of the PIN type
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/544—Solar cells from Group III-V materials
Definitions
- the present invention provides a light-receiving element that can continuously detect light intensity and the position of the center of gravity of a spectrum in a long wavelength band (for example, a 1.3 to 5.55 m band) used in the optical communication field.
- the present invention also relates to a photodetector using such a light receiving element, and further to an optical demultiplexer using the photodetector. Background technology
- the light condensed by a condenser lens is reflected by a mirror, the reflected light is demultiplexed by a diffraction grating, and the demultiplexed light is detected by a photodetector.
- An instrument is known (for example, a polychrome overnight photometric system sold by Shimadzu Corporation, model number PSS—100).
- the photodetector used in the optical demultiplexer is a light receiving element array, and is used as a spectrum monitor of the wavelength.
- the spectrum of one wavelength is divided by a plurality of (for example, five) light receiving elements, and the position of the center of gravity of the light intensity is monitored. Determined by pitch.
- the position of the center of gravity of the light intensity refers to the position of the center of gravity of the spectrum distribution because the signal light of each wavelength has a spectrum distribution.
- the surface of a high-resistance Si substrate i-layer
- a P-type resistance layer is provided
- an n-type layer is provided on the back surface
- an opposing electrode is provided on the p-type resistance layer.
- the conventional semiconductor position detector uses the Si substrate as described above.
- semiconductor position detectors using Si substrates have poor sensitivity in the long wavelength band for optical communication. Therefore, when a conventional semiconductor position detector is used as the light receiving element of the optical demultiplexer, it is difficult to detect the position of the center of gravity of the light intensity for light in a long wavelength band. Disclosure of the invention
- An object of the present invention is to provide a light receiving element used for a photodetector of an optical demultiplexer, which can easily detect the position of the center of gravity of light intensity in a long wavelength band for optical communication. It is here.
- Another object of the present invention is to provide a photodetector of an optical demultiplexer using such a light receiving element.
- Still another object of the present invention is to provide an optical demultiplexer using such a photodetector, which has improved resolution.
- a III-V group having good sensitivity in a long wavelength band.
- a semiconductor position detector made of a semiconductor compound material is used.
- a first aspect of the present invention is a light-receiving element, comprising: a layer made of a group III-V compound semiconductor; a first conductivity type resistive layer provided on a surface of the layer; A second conductivity type substrate opposite to the first conductivity type provided on the back surface; and a few opposed faces provided on the resistance layer. And a pair of electrodes.
- a second aspect of the present invention is a photodetector for detecting the intensity of each demultiplexed light demultiplexed from a signal light in which a plurality of wavelengths are multiplexed and the position of its center of gravity.
- An array of one or more light receiving elements can be used.
- a third aspect of the present invention is an optical demultiplexer that demultiplexes a signal light that has been wavelength-division multiplexed and transmitted, the optical means for demultiplexing the signal light, and the demultiplexed light demultiplexed by the optical means.
- a photodetector for receiving light For this photodetector, a photodetector configured by arranging the aforementioned light receiving elements is used.
- FIG. 1A is a plan view showing one embodiment of the light receiving element of the present invention for monitoring one wavelength.
- FIG. 1B is a cross-sectional view taken along the line XY of FIG. 1A.
- FIG. 2 is a diagram showing a configuration of a circuit for performing position measurement using an output current from a light receiving element.
- FIG. 3 is a diagram showing a time-division driving type photodetector.
- FIG. 4 is a diagram illustrating a photodetector that detects the intensity of the demultiplexed light and the position of the center of gravity thereof.
- FIG. 5 is a plan view of the photodetector shown in FIG.
- FIG. 6 is a diagram illustrating another example of the photodetector that detects the intensity of the demultiplexed light and the position of the center of gravity.
- FIG. 7 is a diagram showing one embodiment of the optical demultiplexer of the present invention.
- FIG. 8 is a diagram for explaining the configuration for detecting the center of gravity of the light intensity of each of the k wavelengths of the C band and the k 2 wavelengths of the L band.
- FIG. 4 is a diagram showing an example in which the same number of light receiving elements are integrated in two rows on a semiconductor chip. BEST MODE FOR CARRYING OUT THE INVENTION
- FIG. 1A and 1B show a light-receiving element 8 for monitoring one wavelength, which is an embodiment of the light-receiving element of the present invention.
- 1A is a plan view
- FIG. 1B is a cross-sectional view taken along the line XY of FIG. 1A.
- an InGaAs layer (i-layer) 12 and a p-type InP layer 14 are laminated on an n-type InP substrate 10.
- Electrodes 16 a and 16 3 ⁇ 4 are formed on both ends of the surface of the p-type layer 14, and electrodes (not shown) are formed on the back surface of the n-type substrate 10.
- the basic operation of the light receiving element 8 will be described. Supodzu bets light incident on the surface of the light receiving element is photoelectrically converted, so flows toward the surface of the p-type layer 1 4 to electrodes 1 6 a, 1 6 b photocurrent, current corresponding to the distance electrode output from the 1 6 a, 1 6 b. Photocurrent I generated at the incident position of the light is split so as inversely proportional to the resistance value to each of the electrodes 1 6 a, 1 6 b. The distance between the electrodes 1 6 a, 1 6 b to L ab, the distance to the entrance position of the light from the electrode 1 6 a a L a.
- the electrode 1 6 a, 1 current from 6 b I a, I b is expressed by the following equation.
- I a IX (L ab -L a ) / L ab (1)
- I n having high sensitivity in a long wavelength band for optical communication is used. Since a GaAs-based material is used, high-sensitivity position detection is possible even in a long wavelength band, where the sensitivity of the conventional Si-based system is insufficient.
- InGaAs-based materials include III-V compound semiconductors such as GaAs, AlGaAs, InAs, InGaAsP, and the like. Can also be used. In the infrared region, Ge can also be used. Further, since the sum of the currents I a and I b becomes photocurrent I, the intensity of the incident light from the optical current I can be monitored.
- Figure 2 shows a block diagram of a circuit which performs position measurement using a ⁇ Ka current I a and I b from the electrode 1 6 a, 1 6 b of the light receiving element 8.
- adder 3 After amplifying the output current I a and I b in preamp 1, 2, adder 3, performs addition and subtraction by the subtracter 4, divided by the divider 5 (I a - I b) / (I a + I When b ) is obtained, the light incident position can be measured from equation (4).
- FIG. 2 is shown a method of detecting in (4), (3) and this for obtaining the division I a / I b by equation Ru can light incidence position also measuring child.
- FIG. 3 shows a photodetector 20 for monitoring such demultiplexed N wavelengths i, ⁇ 2 ,..., ⁇ ⁇ .
- the structure of the photodetector 20 is basically the same as the structure of the light receiving element 8 shown in FIG. 1, but the light receiving section is configured to be large in order to receive all the demultiplexed light. It has been.
- a signal light containing ⁇ time-divided wavelengths is split into ⁇ pieces by a diffraction grating 22. People i, human 2 wavelengths respectively, ..., demultiplexed light of e N is incident on the photodetector 2 0.
- the photodetector 20 Since the demultiplexed light is incident on the photodetector 20 in a time-division manner, the photodetector is driven by dividing the time into N pieces according to the timing of the incidence of the demultiplexed light. In this way, the respective light intensity centroids of the N demultiplexed lights are Can be detected. In addition, the intensities of the N demultiplexed lights can be detected from the respective photocurrents as described in FIG.
- FIG. 4 shows the photodetector 30 for monitoring the demultiplexed N wavelengths, person 2 ,..., ⁇ ⁇ .
- This photodetector 30 is composed of ⁇ ⁇ light receiving elements, D 2 ,..., D N arranged one-dimensionally.
- Each light receiving element is the light receiving element described in FIG.
- FIG. 5 shows a plan view of the photodetector 30.
- Each light receiving element, the electrode 1 6 a, 1 6 b are arranged side by side in the arrangement direction.
- the signal light including N wavelengths is split into N light beams by the diffraction grating 22 and is incident on the N light receiving elements, respectively.
- the position of the center of gravity can be detected.
- the intensity of each of the N pieces of demultiplexed light is detected from the photocurrent of each light receiving element as described in FIG.
- a signal light in which N wavelengths are multiplexed is demultiplexed into N light by a diffraction grating or the like.
- a photodetector that detects the intensity of each demultiplexed light and the position of its center of gravity will be described.
- FIG. 6 is a diagram for explaining this photodetector.
- the signal light is split into two by a half mirror 40, and one signal light is split into N by a diffraction grating 42, and the position of the center of gravity of each light intensity is shown in Fig. 5.
- Detection is performed by the first photodetector 30 described.
- the other separated signal light is split into N beams by the diffraction grating 44, and is divided into N photo diodes ⁇ ⁇ ⁇ , PD 2 ,..., PD N arranged at each focal position.
- the second light detector 46 detects the intensities of the N branched lights.
- the second light detector 46 is more than the first light detector 30. Since the light receiving part can be made small, noise can be reduced and it is suitable for detecting the intensity of weak incident light.
- Fig. 7 shows an optical communication system of the wavelength division multiplexing transmission system, in which the wavelength division multiplexed light is demultiplexed for each wavelength at the receiving side, and the light intensity of each demultiplexed light and the position of its center of gravity are detected.
- the available optical splitters are shown.
- This optical demultiplexer is composed of one input fiber 50, a collimator lens 52, a diffraction grating 54, and a photodetector 56. Assembled using tubular members.
- the input fiber 50 is fixed to the fiber fixing window 60 on the end face of the transparent fiber mounting tube 58 by a fiber connecting portion 62.
- the lens 52 is fixed to the end of the intermediate tube 64.
- the diffraction grating 54 is fixed to a diffraction grating fixing window 68 on the end face of the diffraction grating mounting tube 66.
- a fiber mounting tube 58 and a diffraction grating mounting tube 66 are provided at both ends of the intermediate tube 64 so as to be movable in the optical axis direction and rotate around the optical axis. Activate alignment is possible as much as possible.
- the light from the input fiber 50 is demultiplexed by the diffraction grating 54 through the collimator lens 52 and then collimated again.
- the light converged through the lens 52 is detected by the photodetector 56.
- the photodetector 56 can detect the position of the light intensity center of gravity of the demultiplexed light and the incident intensity of the demultiplexed light. Like a detector, the light that has been wavelength-division multiplexed is split into two by a half mirror, the position of the light intensity center of gravity is determined by the first photodetector 30, and A configuration for detecting light intensity can also be used.
- Example 6 the light that has been wavelength-division multiplexed is split into two by a half mirror, the position of the light intensity center of gravity is determined by the first photodetector 30, and A configuration for detecting light intensity can also be used.
- light wavelength is multiplexed ki pieces of C-band (ki is an integer of 1 or more) the wavelength of the two k of L-band (k 2 is an integer of 1 or more) Is divided into ki band C and k node L 2 by the diffraction grating 70, and the first photodetector composed of ki band light receiving elements for the C band (Not shown) and a second photodetector (not shown) consisting of k band receiving elements for the L band, the light intensity centroid position of each of the (kt + ks) demultiplexed lights is determined. To detect.
- the first photodetector for the C band and the second photodetector for the L band are provided on separate semiconductor chips, it is difficult to match the relative positions and parallelism between the semiconductor chips with high accuracy Therefore, it is preferable to integrate them on a single semiconductor chip.
- the demultiplexed light of the C-band and L-band can be condensed into two adjacent rows. it can.
- the first and second photodetectors arranged in two rows are installed at the focusing position.
- the light in the C band enters the diffraction grating at an angle closer to the normal direction of the diffraction grating than the light in the L band.
- the number of light receiving elements to be installed on one semiconductor chip is k!
- the number is not limited to two and k 2 for L band, and the same number may be provided in two rows. For example, place the ki-number of light receiving elements in two rows during ki ⁇ k 2, when two ⁇ k is disposed k 2 pieces of light receiving elements in two rows, the light receiving element of x 2 columns or k 2 X 2 rows of light receiving elements are formed on one semiconductor chip.
- FIG. 9 shows an example in which the same number of light receiving elements 8 are integrated in two rows on one semiconductor chip 72.
- the photodetector having such a configuration can be used for the optical demultiplexer shown in FIG. Industrial applicability
- the light receiving element is made of a III-V compound semiconductor material having high sensitivity in a long wavelength band, it can be used for a long wavelength band spectrum used in the optical communication field.
- the intensity and its center of gravity can be detected continuously. Therefore, the resolution can be improved as compared with the conventional light receiving element.
- a photodetector using such a light receiving element can be realized, and further, by using such a light detector. Therefore, an optical demultiplexer having excellent resolution can be realized.
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- Spectroscopy & Molecular Physics (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
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- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
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- Inorganic Chemistry (AREA)
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Abstract
Description
Claims
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP01947946A EP1233459A1 (en) | 2000-07-18 | 2001-07-10 | Light-receiving device and photodetector comprising light-receiving device |
CA002385084A CA2385084A1 (en) | 2000-07-18 | 2001-07-10 | Light-receiving element and photodetector using the same |
KR1020027003462A KR20020037050A (en) | 2000-07-18 | 2001-07-10 | Light-receiving device and photodetector comprising light-receiving device |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2000216894A JP2002033507A (en) | 2000-07-18 | 2000-07-18 | Photodetector and optical demultiplexer |
JP2000-216894 | 2000-07-18 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
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US10/959,960 Division US7372124B2 (en) | 2000-07-18 | 2004-10-06 | Light-receiving element and photodetector using the same |
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WO2002007227A1 true WO2002007227A1 (en) | 2002-01-24 |
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PCT/JP2001/005963 WO2002007227A1 (en) | 2000-07-18 | 2001-07-10 | Light-receiving device and photodetector comprising light-receiving device |
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US (2) | US20020149014A1 (en) |
EP (1) | EP1233459A1 (en) |
JP (1) | JP2002033507A (en) |
KR (1) | KR20020037050A (en) |
CN (1) | CN1383581A (en) |
CA (1) | CA2385084A1 (en) |
TW (1) | TW503587B (en) |
WO (1) | WO2002007227A1 (en) |
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GB201102478D0 (en) | 2011-02-11 | 2011-03-30 | Isdi Ltd | Radiation detector and method |
GB201302543D0 (en) * | 2013-02-13 | 2013-03-27 | Isdi Ltd | Detector and method |
GB2525625B (en) | 2014-04-29 | 2017-05-31 | Isdi Ltd | Device and method |
TWI550836B (en) * | 2014-05-06 | 2016-09-21 | 友達光電股份有限公司 | Photo detector and fabricating method thereof |
CA3072769A1 (en) | 2017-08-11 | 2019-02-14 | Optipulse Inc. | Laser grid structures for wireless high speed data transfers |
US10374705B2 (en) | 2017-09-06 | 2019-08-06 | Optipulse Inc. | Method and apparatus for alignment of a line-of-sight communications link |
WO2019162889A1 (en) * | 2018-02-22 | 2019-08-29 | 8 Rivers Capital, Llc | System for multi-channel, diverged-beam optical wireless communication |
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FR2706079B1 (en) * | 1993-06-02 | 1995-07-21 | France Telecom | Integrated laser-modulator monolithic component with quantum multi-well structure. |
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TW400440B (en) | 1998-03-11 | 2000-08-01 | Nippon Sheet Glass Co Ltd | Optical demultiplexer and method for assembling same |
US6334014B1 (en) * | 1998-11-02 | 2001-12-25 | Canon Kabushiki Kaisha | Optical fiber apparatus provided with demultiplexing/multiplexing unit on fiber's end portion, optical detecting apparatus provided with demultiplexing/multiplexing unit on its light receiving surface, and optical transmission system using the same |
-
2000
- 2000-07-18 JP JP2000216894A patent/JP2002033507A/en not_active Withdrawn
-
2001
- 2001-07-10 EP EP01947946A patent/EP1233459A1/en not_active Withdrawn
- 2001-07-10 US US10/088,275 patent/US20020149014A1/en not_active Abandoned
- 2001-07-10 CA CA002385084A patent/CA2385084A1/en not_active Abandoned
- 2001-07-10 KR KR1020027003462A patent/KR20020037050A/en not_active Application Discontinuation
- 2001-07-10 CN CN01801906A patent/CN1383581A/en active Pending
- 2001-07-10 WO PCT/JP2001/005963 patent/WO2002007227A1/en not_active Application Discontinuation
- 2001-07-17 TW TW090117418A patent/TW503587B/en active
-
2004
- 2004-10-06 US US10/959,960 patent/US7372124B2/en not_active Expired - Fee Related
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JPS54113384A (en) * | 1978-02-24 | 1979-09-04 | Hitachi Ltd | Multi-wave spectroscopic photometer |
JPS61120906A (en) * | 1984-11-19 | 1986-06-09 | Canon Inc | Position detecting element |
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JPH03146833A (en) * | 1989-11-01 | 1991-06-21 | Hitachi Ltd | Multi-wavelength spectroscope |
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Also Published As
Publication number | Publication date |
---|---|
TW503587B (en) | 2002-09-21 |
EP1233459A1 (en) | 2002-08-21 |
CA2385084A1 (en) | 2002-01-24 |
KR20020037050A (en) | 2002-05-17 |
CN1383581A (en) | 2002-12-04 |
US7372124B2 (en) | 2008-05-13 |
JP2002033507A (en) | 2002-01-31 |
US20020149014A1 (en) | 2002-10-17 |
US20050058454A1 (en) | 2005-03-17 |
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