WO1998051135A1 - Improvements in the manufacturing processes of service boxes and their parts - Google Patents
Improvements in the manufacturing processes of service boxes and their parts Download PDFInfo
- Publication number
- WO1998051135A1 WO1998051135A1 PCT/US1998/008169 US9808169W WO9851135A1 WO 1998051135 A1 WO1998051135 A1 WO 1998051135A1 US 9808169 W US9808169 W US 9808169W WO 9851135 A1 WO9851135 A1 WO 9851135A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- welding
- melting point
- circuit board
- alloy
- parts
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title description 8
- 238000003466 welding Methods 0.000 claims abstract description 48
- 238000002844 melting Methods 0.000 claims abstract description 18
- 230000008018 melting Effects 0.000 claims abstract description 16
- 238000000034 method Methods 0.000 claims abstract description 12
- 239000000463 material Substances 0.000 claims abstract description 9
- 229910045601 alloy Inorganic materials 0.000 claims description 15
- 239000000956 alloy Substances 0.000 claims description 15
- 229910020836 Sn-Ag Inorganic materials 0.000 claims description 6
- 229910020988 Sn—Ag Inorganic materials 0.000 claims description 6
- 229910020816 Sn Pb Inorganic materials 0.000 claims 1
- 229910020922 Sn-Pb Inorganic materials 0.000 claims 1
- 229910008783 Sn—Pb Inorganic materials 0.000 claims 1
- 229910001174 tin-lead alloy Inorganic materials 0.000 description 3
- 229910001316 Ag alloy Inorganic materials 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- QCEUXSAXTBNJGO-UHFFFAOYSA-N [Ag].[Sn] Chemical compound [Ag].[Sn] QCEUXSAXTBNJGO-UHFFFAOYSA-N 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- 230000005496 eutectics Effects 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 239000000356 contaminant Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000001351 cycling effect Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- LQBJWKCYZGMFEV-UHFFFAOYSA-N lead tin Chemical compound [Sn].[Pb] LQBJWKCYZGMFEV-UHFFFAOYSA-N 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 230000002940 repellent Effects 0.000 description 1
- 239000005871 repellent Substances 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 238000005050 thermomechanical fatigue Methods 0.000 description 1
- 239000002966 varnish Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
- H01R4/02—Soldered or welded connections
- H01R4/029—Welded connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
- H01R4/02—Soldered or welded connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3447—Lead-in-hole components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3463—Solder compositions in relation to features of the printed circuit board or the mounting process
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09372—Pads and lands
- H05K2201/094—Array of pads or lands differing from one another, e.g. in size, pitch or thickness; Using different connections on the pads
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10295—Metallic connector elements partly mounted in a hole of the PCB
- H05K2201/10303—Pin-in-hole mounted pins
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
- H05K3/4046—Through-connections; Vertical interconnect access [VIA] connections using auxiliary conductive elements, e.g. metallic spheres, eyelets, pieces of wire
Definitions
- this invention is a method that includes using welding alloys of different melting points for each face of the component in order to avoid re-melting during the second welding which is typically made with the alloy tin/lead having a melting point of 183° C.
- the present invention consists of improvements in the manufacturing processes of service boxes and their parts whose novel characteristics in manufacturing, shaping and design fulfill the role for which had been specifically designed with a maximum safety and efficiency.
- the role of the welding is capital since it insures the electrical union between two conductive materials thus avoiding high tension falls and keeping the electrical unions stable.
- the welding also has a role since it must support the components in order to guarantee the passage of power. That mechanical union must be resistant to vibration, temperature changes, humidity, corrosion and other environmental factors.
- Tl TS, 183° C ⁇ Tf ⁇ 200° C
- better physical properties be both free of lead and other contaminants, possess good weldability, have a suitable cost, and be adaptable to current manufacturing equipment.
- a binary tin and silver (Sn-Ag) based alloy has been selected which fulfills the above requirements.
- Figure 1 is a longitudinal section in elevation of a printed circuit according to the prior art.
- Figure 2 is a longitudinal section in elevation of a printed circuit according to this invention.
- the printed circuit (10) is formed as is known in the art of a dielectric substrate (11) which is coated on both faces with a conductive circuit (12) affected by the corresponding tracks obtained by any of the actually known systems.
- a conductive circuit (12) affected by the corresponding tracks obtained by any of the actually known systems.
- the methods for contacting the upper conductive layer (12) with the lower layer are insertion pins (13) which electrically connect the upper conductive layer (12) with the lower layer. Conventionally, welding the pins (13) in a wave welding machine results in the welding (14).
- the wave welding process according to this invention has been modified in such a way that in the first welding at the components face there preferably is employed an alloy with a melting point according to the characteristics of the new Sn-Ag alloy in order to perform later a second welding operation in the other face.
- the second welding operation preferably is carried out using wave welding with a tin-lead alloy with a melting point of 183° C.
- the preferred range for the melting point of the alloy used in the first weld is between about 183°C and 200°C.
- a second, subsequent weld 22 is performed using a tin-lead alloy having a melting point that is lower than that of the tin-silver alloy. Once the weld 22 is completed, both welds 20 and 22 have good characteristics; no superimposed weldings are formed.
- the invention has been described in all illustrative manner, and it is to be understood that the terminology which has been used is intended to be in the nature of words of description rather than of limitation.
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Manufacturing Of Electrical Connectors (AREA)
- Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
A method for welding electronic components (13) to a circuit board (10) having two conductive layers (12) includes the steps of inserting an electronic component (13) into a first surface of circuit board (10), welding the electronic component (13) to a first conductive face of the circuit board (10) using a first welding material (20), and subsequently welding the electronic component (13) to a second conductive face of the circuit board (10) using a second welding material (22) having a melting point lower than that of the first welding material (20).
Description
IMPROVEMENTS IN THE MANUFACTURING PROCESSES OF SERVICE BOXES AND THEIR PARTS
BACKGROUND OF THE INVENTION
In order to obtain an improvement in welding components to a printed circuit, especially for transverse components welded at both faces of a printed circuit, welding materials having different characteristics are used in each end of the components in such a way that one weld is not qualitatively affected by the other weld. More specifically, this invention is a method that includes using welding alloys of different melting points for each face of the component in order to avoid re-melting during the second welding which is typically made with the alloy tin/lead having a melting point of 183° C.
The present invention consists of improvements in the manufacturing processes of service boxes and their parts whose novel characteristics in manufacturing, shaping and design fulfill the role for which had been specifically designed with a maximum safety and efficiency.
In Spanish Patent No. 9 302 193 to the same Applicant, improvements in the manufacturing processes of service boxes and their parts was disclosed which relate to Spanish Patent No. 9 200 325 which disclosed improvements in the manufacturing processes of service boxes and their parts. These improvements consist of the use of special alloys in the welding operations of the type corresponding to the formula 95 Sn, 5 Sb, and 52 Sn, 45 Pb, 3 Sb, as well as to the application of a new substrate material formed with glass fibers in the outside surface and epoxy-paper on the inside surface, and finally a varnish or coating of a photo-sensitive bath, a water repellent, and corrosion resistant liquid.
The practice in the application of these improvements has introduced new technical factors and have led to the discovery of a little known phenomenon, which had as a consequence, the creation of a novel technical solution and an improvement in the manufacturing technologies of service
boxes and their parts, in which welding procedures are a very important part of same.
The role of the welding is capital since it insures the electrical union between two conductive materials thus avoiding high tension falls and keeping the electrical unions stable.
Mechanically speaking, the welding also has a role since it must support the components in order to guarantee the passage of power. That mechanical union must be resistant to vibration, temperature changes, humidity, corrosion and other environmental factors. Currently, the welding made by a wave bath using an alloy of tin-lead has the following characteristics: melting point 183° C, eutectic Tl = TS, and electrical conductivity 11.50% of copper.
In order to obtain an improvement in the welding, especially of transverse components welded at both faces of a printed circuit, welding processes of different characteristics are needed in each end of the components, in order that each welding is not qualitatively affected by the other.
SUMMARY OF THE INVENTION
In order to avoid the consequences, it has been found that using welding alloys with different melting points for each weld at each of the faces of the component avoids re-melting during the second welding. The second welding is carried out using ordinary tin-lead alloy which has a melting point of 183° C. At the same time, the new alloy must have a greater resistance to thermo-mechanical fatigue. The new welding alloy must meet the following requirements: eutectic
Tl = TS, 183° C < Tf < 200° C, better physical properties, be both free of lead and other contaminants, possess good weldability, have a suitable cost, and be adaptable to current manufacturing equipment.
Among all the commercially available alloys for wave welding, a binary tin and silver (Sn-Ag) based alloy has been selected which fulfills the above requirements.
Out of the tests performed with the above-mentioned improvements, an amelioration has been achieved which includes that the Sn-Ag welding does not re-melt during the second welding operations, the Sn-Ag welding has better mechanical properties giving better resistance to the ther mo- mechanical fatigue, and the higher melt temperature of the Sn-Ag welding gives a better thermal resistance against power cycling.
BRIEF DESCRIPTION OF THE DRAWINGS
Other details and characteristics of the present invention will be manifest through the reading of the description given hereinbelow, in which reference is made to the Figures attached to this description, where are depicted the above details. These details are given as an example, referring to a case of a possible practical embodiment, but is not limited to the details outlined therein. Therefore, this description must be considered from an illustrative point of view and with no limitations whatsoever. Figure 1 is a longitudinal section in elevation of a printed circuit according to the prior art; and
Figure 2 is a longitudinal section in elevation of a printed circuit according to this invention.
DETAILED DESCRIPTION
In one preferred embodiment of the present invention, as shown in
Figure 1, the printed circuit (10) is formed as is known in the art of a dielectric substrate (11) which is coated on both faces with a conductive circuit (12) affected by the corresponding tracks obtained by any of the actually known systems. Among the methods for contacting the upper conductive layer
(12) with the lower layer are insertion pins (13) which electrically connect the upper conductive layer (12) with the lower layer. Conventionally, welding the pins (13) in a wave welding machine results in the welding (14).
As discussed above, when welding one of the faces (12) there is formed a first welding that later when welding the pin (13) at the other face, re-melts a portion of what has been previously welded to form two superimposed weldings that are shown in the Figure and numbered as (14a) and (14b).
In order to avoid this disadvantage, the wave welding process according to this invention, has been modified in such a way that in the first welding at the components face there preferably is employed an alloy with a melting point according to the characteristics of the new Sn-Ag alloy in order to perform later a second welding operation in the other face. The second welding operation preferably is carried out using wave welding with a tin-lead alloy with a melting point of 183° C. With the above procedure and the use of two different alloys, the undesired effects in the above described welding operations are avoided. Figure 2 illustrates a completed weld done according to this invention. The first weld 20 is performed using a tin-silver alloy having a melting temperature that is greater than 183 °C. The preferred range for the melting point of the alloy used in the first weld is between about 183°C and 200°C. A second, subsequent weld 22 is performed using a tin-lead alloy having a melting point that is lower than that of the tin-silver alloy. Once the weld 22 is completed, both welds 20 and 22 have good characteristics; no superimposed weldings are formed. The invention has been described in all illustrative manner, and it is to be understood that the terminology which has been used is intended to be in the nature of words of description rather than of limitation.
Obviously, many modifications and variations of the present invention are possible in light of the above teachings. It is, therefore, to be understood that within the scope of the appended claims, the invention may be practiced, otherwise than as specifically described.
Claims
1. A method for welding electronic components to a circuit board having two conductive layers includes the steps of: inserting an electronic component into a first surface of the circuit board; welding the electronic component to a first conductive face of the circuit board using a first welding material having a first melting point; and subsequently welding the electronic component to a second conductive face of the circuit board using a second welding material having a second melting point that is lower than the first melting point.
2. The method according to claim 1 , wherein the first welding material is a Sn-Ag alloy.
3. The method according to claim 1 wherein the second welding material is an Sn-Pb alloy.
4. The method according to claim 1, wherein the first melting point is greater than 183┬░C.
5. The method according to claim 4, wherein the first melting point is in a range between approximately 183┬░C and 200┬░ C.
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP54813098A JP2001525987A (en) | 1997-05-09 | 1998-04-23 | Improvements in the manufacturing process of distribution boxes and their components |
| CA002286030A CA2286030A1 (en) | 1997-05-09 | 1998-04-23 | Improvements in the manufacturing processes of service boxes and their parts |
| US09/423,442 US6299055B1 (en) | 1997-05-09 | 1998-04-23 | Manufacturing processes of service boxes and their parts |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| ES9700994A ES2128989B1 (en) | 1992-01-29 | 1997-05-09 | IMPROVEMENTS INTRODUCED IN THE PATENT OF INVENTION N-9200325 BY IMPROVEMENTS IN THE PROCESSES OF MANUFACTURING OF SERVICE BOXES AND THEIR PARTS. |
| ESP9700994 | 1997-05-09 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| WO1998051135A1 true WO1998051135A1 (en) | 1998-11-12 |
Family
ID=8299230
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/US1998/008169 WO1998051135A1 (en) | 1997-05-09 | 1998-04-23 | Improvements in the manufacturing processes of service boxes and their parts |
Country Status (5)
| Country | Link |
|---|---|
| EP (1) | EP0877539A1 (en) |
| JP (1) | JP2001525987A (en) |
| KR (1) | KR20010012254A (en) |
| CA (1) | CA2286030A1 (en) |
| WO (1) | WO1998051135A1 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7575443B2 (en) | 2005-09-20 | 2009-08-18 | Continental Automotive Ag | Combined fastening and contacting system for electrical components on superimposed circuit boards |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6415182B1 (en) * | 2000-01-31 | 2002-07-02 | Cts Corporation | Hermetic ground pin assembly and method of making |
| DE102007062202B4 (en) | 2007-12-21 | 2021-06-10 | Vitesco Technologies GmbH | Description Process for contacting a rigid circuit board with a contact partner and an arrangement of rigid circuit board and contact partner |
| JP5130084B2 (en) * | 2008-03-07 | 2013-01-30 | 株式会社フジクラ | Coaxial cable connector and soldering method thereof |
| CN104600535B (en) * | 2015-01-26 | 2017-04-05 | 中国科学院等离子体物理研究所 | The vacuum pressure impregnation soldering process of superconductive cable and copper sleeve |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4515304A (en) * | 1982-09-27 | 1985-05-07 | Northern Telecom Limited | Mounting of electronic components on printed circuit boards |
| JPS647694A (en) * | 1987-06-30 | 1989-01-11 | Nippon Denki Home Electronics | Method and apparatus for connecting both surfaces of printed circuit board |
| US5129573A (en) * | 1991-10-25 | 1992-07-14 | Compaq Computer Corporation | Method for attaching through-hole devices to a circuit board using solder paste |
| JPH04245495A (en) * | 1991-01-30 | 1992-09-02 | Matsushita Electric Ind Co Ltd | Component mounting method of printed-electronic circuit board |
| JPH05259631A (en) * | 1992-03-16 | 1993-10-08 | Nippon Avionics Co Ltd | Surface mounting of printed wiring board |
| US5601227A (en) * | 1993-10-13 | 1997-02-11 | Mecanismos Auxiliares Industriales, S.A. M.A.I.S.A. | Process for the production of service boxes |
-
1998
- 1998-04-21 EP EP98500095A patent/EP0877539A1/en not_active Withdrawn
- 1998-04-23 KR KR1019997010205A patent/KR20010012254A/en not_active Application Discontinuation
- 1998-04-23 JP JP54813098A patent/JP2001525987A/en active Pending
- 1998-04-23 CA CA002286030A patent/CA2286030A1/en not_active Abandoned
- 1998-04-23 WO PCT/US1998/008169 patent/WO1998051135A1/en not_active Application Discontinuation
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4515304A (en) * | 1982-09-27 | 1985-05-07 | Northern Telecom Limited | Mounting of electronic components on printed circuit boards |
| JPS647694A (en) * | 1987-06-30 | 1989-01-11 | Nippon Denki Home Electronics | Method and apparatus for connecting both surfaces of printed circuit board |
| JPH04245495A (en) * | 1991-01-30 | 1992-09-02 | Matsushita Electric Ind Co Ltd | Component mounting method of printed-electronic circuit board |
| US5129573A (en) * | 1991-10-25 | 1992-07-14 | Compaq Computer Corporation | Method for attaching through-hole devices to a circuit board using solder paste |
| JPH05259631A (en) * | 1992-03-16 | 1993-10-08 | Nippon Avionics Co Ltd | Surface mounting of printed wiring board |
| US5601227A (en) * | 1993-10-13 | 1997-02-11 | Mecanismos Auxiliares Industriales, S.A. M.A.I.S.A. | Process for the production of service boxes |
Non-Patent Citations (5)
| Title |
|---|
| 30148: "Interconnection of metal films on opposite sides of a printed circuit board", RESEARCH DISCLOSURE., no. 301, May 1989 (1989-05-01), HAVANT GB, pages 334, XP000052498 * |
| J. H. VINCENT ET AL.: "Lead-free solders for electronic assembly", GEC JOURNAL OF RESEARCH (INCORPORATING MARCONI.REVIEW.), vol. 11, no. 2, 1994, GREAT BADDOW CHEMSFORD GB, pages 76 - 89, XP000454473 * |
| PATENT ABSTRACTS OF JAPAN vol. 13, no. 181 (E - 750) 27 April 1989 (1989-04-27) * |
| PATENT ABSTRACTS OF JAPAN vol. 17, no. 15 (E - 1305) 12 January 1993 (1993-01-12) * |
| PATENT ABSTRACTS OF JAPAN vol. 18, no. 22 (E - 1490) 13 January 1994 (1994-01-13) * |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7575443B2 (en) | 2005-09-20 | 2009-08-18 | Continental Automotive Ag | Combined fastening and contacting system for electrical components on superimposed circuit boards |
Also Published As
| Publication number | Publication date |
|---|---|
| EP0877539A1 (en) | 1998-11-11 |
| CA2286030A1 (en) | 1998-11-12 |
| JP2001525987A (en) | 2001-12-11 |
| KR20010012254A (en) | 2001-02-15 |
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