USD856945S1 - Fluid mover enclosure - Google Patents
Fluid mover enclosure Download PDFInfo
- Publication number
- USD856945S1 USD856945S1 US29/678,905 US201929678905F USD856945S US D856945 S1 USD856945 S1 US D856945S1 US 201929678905 F US201929678905 F US 201929678905F US D856945 S USD856945 S US D856945S
- Authority
- US
- United States
- Prior art keywords
- fluid mover
- enclosure
- mover enclosure
- view
- fluid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
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Description
The broken lines illustrate environment and form no part of the claimed design.
Claims (1)
- The ornamental design for a fluid mover enclosure, as shown and described.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US29/678,905 USD856945S1 (en) | 2019-01-31 | 2019-01-31 | Fluid mover enclosure |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US29/678,905 USD856945S1 (en) | 2019-01-31 | 2019-01-31 | Fluid mover enclosure |
Publications (1)
Publication Number | Publication Date |
---|---|
USD856945S1 true USD856945S1 (en) | 2019-08-20 |
Family
ID=67578643
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US29/678,905 Active USD856945S1 (en) | 2019-01-31 | 2019-01-31 | Fluid mover enclosure |
Country Status (1)
Country | Link |
---|---|
US (1) | USD856945S1 (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD873267S1 (en) * | 2018-01-02 | 2020-01-21 | Hewlett Packard Enterprise Development Lp | Enclosure |
USD896767S1 (en) | 2019-12-02 | 2020-09-22 | Advanced Thermal Solutions, Inc. | Fluid mover enclosure |
USD933617S1 (en) * | 2019-09-13 | 2021-10-19 | Marvell Asia Pte, Ltd. | Heat sink cover |
US11859915B1 (en) | 2019-01-31 | 2024-01-02 | Advanced Thermal Solutions, Inc. | Fluid mover enclosure |
Citations (27)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD249790S (en) | 1976-10-20 | 1978-10-03 | Hewlett-Packard Company | Casing for electronic components or the like |
US5158136A (en) * | 1991-11-12 | 1992-10-27 | At&T Laboratories | Pin fin heat sink including flow enhancement |
US6239986B1 (en) * | 1998-11-30 | 2001-05-29 | Koyo Electronics Industries Co., Ltd. | Housing body of electronic equipment |
US6305955B1 (en) * | 2000-05-23 | 2001-10-23 | Hon Hai Precision Ind. Co., Ltd. | Bracket having a recoverable door |
US6351394B1 (en) * | 1999-02-12 | 2002-02-26 | Tyco Electronics Corporation | Conductive frame for receiving an electronic module |
USD463383S1 (en) | 2001-06-21 | 2002-09-24 | Hon Hai Precision Ind. Co., Ltd. | GBIC cage |
USD478055S1 (en) * | 2002-08-08 | 2003-08-05 | Hon Hai Precision Ind. Co., Ltd. | Heat dissipating fin |
USD479828S1 (en) * | 2002-12-09 | 2003-09-23 | Xanoptix, Inc. | Inside-out heat sink |
USD479829S1 (en) * | 2002-12-09 | 2003-09-23 | Xanoptix Inc. | Inside-out heat sink |
US6628512B2 (en) * | 2001-04-30 | 2003-09-30 | Hewlett-Packard Development Company, L.P. | Computer enclosure having lockable access panels |
USD482008S1 (en) | 2003-01-09 | 2003-11-11 | Boston Acoustics, Inc. | Electronic crossover housing |
USD490382S1 (en) * | 2002-12-09 | 2004-05-25 | Xanoptix, Inc. | Inside-out heat sink |
USD496907S1 (en) * | 2002-10-17 | 2004-10-05 | Hon Hai Precision Ind. Co., Ltd. | Small form-factor pluggable transceiver cage |
USD512697S1 (en) | 2003-12-08 | 2005-12-13 | Extreme Networks | Housing for electronic device |
USD531965S1 (en) * | 2004-10-28 | 2006-11-14 | Mushkin, Inc. | Memory card heat sink |
USD536675S1 (en) | 2005-04-05 | 2007-02-13 | Pelco | Housing for electronic device |
USD543953S1 (en) * | 2003-09-02 | 2007-06-05 | Cubic Wafer, Inc. | Wing portion of a butterfly-style inside-out heat sink |
USD553170S1 (en) * | 2007-02-09 | 2007-10-16 | Amulaire Thermal Technology, Inc | Cold plate heat sink |
USD553656S1 (en) * | 2007-02-09 | 2007-10-23 | Amulaire Thermal Technology, Inc. | Cold plate heat sink |
USD605141S1 (en) * | 2008-10-17 | 2009-12-01 | Kenneth Allen Jones | Passive heat sink stand for electronic devices |
USD650339S1 (en) * | 2010-04-02 | 2011-12-13 | Foxsemicon Integrated Technology, Inc | Illumination device |
USD694703S1 (en) * | 2013-06-24 | 2013-12-03 | Kevin Faro | Battery in shape of block |
USD699690S1 (en) * | 2013-03-29 | 2014-02-18 | Silverstone Technology Co., Ltd. | Cooling fin |
USD797049S1 (en) * | 2016-04-27 | 2017-09-12 | Ideal Industries, Inc. | Housing with a heat sink for an electrical connector |
USD810022S1 (en) * | 2016-04-27 | 2018-02-13 | Ideal Industries, Inc. | Housing with a heat sink for an electrical connector |
USD812022S1 (en) * | 2015-09-12 | 2018-03-06 | Ebullient, Llc | Multi-chamber heat sink module |
USD822625S1 (en) * | 2016-04-26 | 2018-07-10 | Showa Denko K.K. | Fin for heat exchanger |
-
2019
- 2019-01-31 US US29/678,905 patent/USD856945S1/en active Active
Patent Citations (27)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD249790S (en) | 1976-10-20 | 1978-10-03 | Hewlett-Packard Company | Casing for electronic components or the like |
US5158136A (en) * | 1991-11-12 | 1992-10-27 | At&T Laboratories | Pin fin heat sink including flow enhancement |
US6239986B1 (en) * | 1998-11-30 | 2001-05-29 | Koyo Electronics Industries Co., Ltd. | Housing body of electronic equipment |
US6351394B1 (en) * | 1999-02-12 | 2002-02-26 | Tyco Electronics Corporation | Conductive frame for receiving an electronic module |
US6305955B1 (en) * | 2000-05-23 | 2001-10-23 | Hon Hai Precision Ind. Co., Ltd. | Bracket having a recoverable door |
US6628512B2 (en) * | 2001-04-30 | 2003-09-30 | Hewlett-Packard Development Company, L.P. | Computer enclosure having lockable access panels |
USD463383S1 (en) | 2001-06-21 | 2002-09-24 | Hon Hai Precision Ind. Co., Ltd. | GBIC cage |
USD478055S1 (en) * | 2002-08-08 | 2003-08-05 | Hon Hai Precision Ind. Co., Ltd. | Heat dissipating fin |
USD496907S1 (en) * | 2002-10-17 | 2004-10-05 | Hon Hai Precision Ind. Co., Ltd. | Small form-factor pluggable transceiver cage |
USD479829S1 (en) * | 2002-12-09 | 2003-09-23 | Xanoptix Inc. | Inside-out heat sink |
USD490382S1 (en) * | 2002-12-09 | 2004-05-25 | Xanoptix, Inc. | Inside-out heat sink |
USD479828S1 (en) * | 2002-12-09 | 2003-09-23 | Xanoptix, Inc. | Inside-out heat sink |
USD482008S1 (en) | 2003-01-09 | 2003-11-11 | Boston Acoustics, Inc. | Electronic crossover housing |
USD543953S1 (en) * | 2003-09-02 | 2007-06-05 | Cubic Wafer, Inc. | Wing portion of a butterfly-style inside-out heat sink |
USD512697S1 (en) | 2003-12-08 | 2005-12-13 | Extreme Networks | Housing for electronic device |
USD531965S1 (en) * | 2004-10-28 | 2006-11-14 | Mushkin, Inc. | Memory card heat sink |
USD536675S1 (en) | 2005-04-05 | 2007-02-13 | Pelco | Housing for electronic device |
USD553170S1 (en) * | 2007-02-09 | 2007-10-16 | Amulaire Thermal Technology, Inc | Cold plate heat sink |
USD553656S1 (en) * | 2007-02-09 | 2007-10-23 | Amulaire Thermal Technology, Inc. | Cold plate heat sink |
USD605141S1 (en) * | 2008-10-17 | 2009-12-01 | Kenneth Allen Jones | Passive heat sink stand for electronic devices |
USD650339S1 (en) * | 2010-04-02 | 2011-12-13 | Foxsemicon Integrated Technology, Inc | Illumination device |
USD699690S1 (en) * | 2013-03-29 | 2014-02-18 | Silverstone Technology Co., Ltd. | Cooling fin |
USD694703S1 (en) * | 2013-06-24 | 2013-12-03 | Kevin Faro | Battery in shape of block |
USD812022S1 (en) * | 2015-09-12 | 2018-03-06 | Ebullient, Llc | Multi-chamber heat sink module |
USD822625S1 (en) * | 2016-04-26 | 2018-07-10 | Showa Denko K.K. | Fin for heat exchanger |
USD797049S1 (en) * | 2016-04-27 | 2017-09-12 | Ideal Industries, Inc. | Housing with a heat sink for an electrical connector |
USD810022S1 (en) * | 2016-04-27 | 2018-02-13 | Ideal Industries, Inc. | Housing with a heat sink for an electrical connector |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD873267S1 (en) * | 2018-01-02 | 2020-01-21 | Hewlett Packard Enterprise Development Lp | Enclosure |
US11859915B1 (en) | 2019-01-31 | 2024-01-02 | Advanced Thermal Solutions, Inc. | Fluid mover enclosure |
USD933617S1 (en) * | 2019-09-13 | 2021-10-19 | Marvell Asia Pte, Ltd. | Heat sink cover |
USD1049064S1 (en) | 2019-09-13 | 2024-10-29 | Marvell Asia Pte Ltd | Heat sink cover |
USD896767S1 (en) | 2019-12-02 | 2020-09-22 | Advanced Thermal Solutions, Inc. | Fluid mover enclosure |
USD969760S1 (en) * | 2019-12-02 | 2022-11-15 | Advanced Thermal Solutions, Inc. | Fluid mover enclosure |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
FEPP | Fee payment procedure |
Free format text: ENTITY STATUS SET TO UNDISCOUNTED (ORIGINAL EVENT CODE: BIG.); ENTITY STATUS OF PATENT OWNER: SMALL ENTITY |
|
FEPP | Fee payment procedure |
Free format text: ENTITY STATUS SET TO SMALL (ORIGINAL EVENT CODE: SMAL); ENTITY STATUS OF PATENT OWNER: SMALL ENTITY |